TL331-Q1_13 [TI]
SINGLE DIFFERENTIAL COMPARATOR;
| 型号： | TL331-Q1_13 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | SINGLE DIFFERENTIAL COMPARATOR |
| 文件： | 总10页 (文件大小：355K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TL331-Q1
www.ti.com
SLVS969A –OCTOBER 2009–REVISED JULY 2010
SINGLE DIFFERENTIAL COMPARATOR
Check for Samples: TL331-Q1
1
FEATURES
DBV PACKAGE
(TOP VIEW)
•
•
•
•
Qualified for Automotive Applications
Single Supply or Dual Supplies
1
2
3
5
4
IN−
VCC−/GND
IN+
VCC
Wide Range of Supply Voltage: 2 V to 36 V
Low Supply-Current Drain Independent of
Supply Voltage: 0.4 mA Typ
OUT
•
•
•
Low Input Bias Current: 25 nA Typ
Low Input Offset Voltage: 2 mV Typ
Common-Mode Input Voltage Range Includes
Ground
•
Differential Input Voltage Range Equal to
Maximum-Rated Supply Voltage: ±36 V
•
•
Low Output Saturation Voltage
Output Compatible With TTL, MOS, and CMOS
DESCRIPTION/ORDERING INFORMATION
This device consists of a single voltage comparator that is designed to operate from a single power supply over a
wide range of voltages. Operation from dual supplies also is possible if the difference between the two supplies
is 2 V to 36 V and VCC is at least 1.5 V more positive than the input common-mode voltage. Current drain is
independent of the supply voltage. The output can be connected to other open-collector outputs to achieve
wired-AND relationships.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
Reel of 3000
Reel of 3000
ORDERABLE PART NUMBER
TOP-SIDE MARKING
TQ1U
T1RU
–40°C to 85°C
–40°C to 125°C
SOT-23 – DBV
SOT-23 – DBV
TL331IDBVRQ1
TL331QDBVRQ1
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TL331-Q1
SLVS969A –OCTOBER 2009–REVISED JULY 2010
www.ti.com
LOGIC DIAGRAM
SCHEMATIC
IN+
IN−
OUT
V
CC
80-µA
Current Regulator
80 µA
10 µA
60 µA
10 µA
COMPONENT COUNT
Epi-FET
1
Diodes
2
Resistors
Transistors
1
20
IN+
IN−
OUT
GND
Note: Current values shown are nominal.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VCC
VID
VI
Supply voltage(2)
36 V
±36 V
Differential input voltage(3)
Input voltage range (either input)
Output voltage
–0.3 V to 36 V
36 V
VO
IO
Output current
20 mA
Duration of output short-circuit to ground(4)
Package thermal impedance(5) (6)
Operating virtual junction temperature
Storage temperature range
Unlimited
206°C/W
150°C
qJA
TJ
Tstg
–65°C to 150°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to the network ground.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/qJA. Operating at the absolute maximum TJ of 150°C can impact reliability.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
2
Submit Documentation Feedback
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TL331-Q1
TL331-Q1
www.ti.com
SLVS969A –OCTOBER 2009–REVISED JULY 2010
ELECTRICAL CHARACTERISTICS
at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
TA
MIN
TYP
MAX UNIT
25°C
2
5
VCC = 5 V to 30 V, VO = 1.4 V,
VIC = VIC(min)
VIO
IIO
IIB
Input offset voltage
mV
9
–40°C to 125°C
25°C
5
50
nA
Input offset current
Input bias current
VO = 1.4 V
VO = 1.4 V
–40°C to 125°C
25°C
250
–25
–250
nA
–40°C to 125°C
–400
0 to
VCC – 1.5
25°C
–40°C to 125°C
25°C
Common-mode input voltage
range(2)
VICR
V
0 to
VCC – 1.5
Large-signal differential voltage
amplification
VCC = 15 V, VO = 1.4 V to 11.4 V,
AVD
IOH
50
200
0.1
V/mV
RL ≥ 15 kΩ to VCC
VOH = 5 V, VID = 1 V
VOH = 30 V, VID = 1 V
25°C
–40°C to 125°C
25°C
50
1
nA
High-level output current
Low-level output voltage
mA
150
0.4
400
700
VOL
IOL = 4 mA, VID = –1 V
mV
–40°C to 125°C
25°C
IOL
ICC
Low-level output current
Supply current
VOL = 1.5 V, VID = 1 V
6
mA
mA
RL = ∞, VCC = 5 V
25°C
0.7
(1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified.
(2) The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the
common-mode voltage range is VCC+ – 1.5 V, but either or both inputs can go to 30 V without damage.
SWITCHING CHARACTERISTICS
VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
TYP
1.3
UNIT
100-mV input step with 5-mV overdrive
TTL-level input step
Response time RL connected to 5 V through 5.1 kΩ, CL = 15 pF(1) (2)
ms
0.3
(1) CL includes probe and jig capacitance.
(2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
Copyright © 2009–2010, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TL331-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Nov-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TL331IDBVRQ1
TL331QDBVRQ1
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
3000
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TL331-Q1 :
Catalog: TL331
•
NOTE: Qualified Version Definitions:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Nov-2010
Catalog - TI's standard catalog product
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TL331IDBVRQ1
TL331QDBVRQ1
SOT-23
SOT-23
DBV
DBV
5
5
3000
3000
179.0
179.0
8.4
8.4
3.2
3.2
3.2
3.2
1.4
1.4
4.0
4.0
8.0
8.0
Q3
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TL331IDBVRQ1
TL331QDBVRQ1
SOT-23
SOT-23
DBV
DBV
5
5
3000
3000
203.0
203.0
203.0
203.0
35.0
35.0
Pack Materials-Page 2
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