TL4242-Q1 [TI]
ADJUSTABLE LED DRIVER;
| 型号： | TL4242-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | ADJUSTABLE LED DRIVER 驱动 |
| 文件： | 总21页 (文件大小：986K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TL4242-Q1
www.ti.com
SLVS732E –JULY 2010–REVISED JULY 2013
ADJUSTABLE LED DRIVER
Check for Samples: TL4242-Q1
1
FEATURES
•
•
Short-Circuit Proof
Reverse-Polarity Proof
•
•
Qualified for Automotive Applications
AEC-Q100 Test Guidance With the Following
Results:
KTT (SFM) PACKAGE
(TOP VIEW)
DRJ (QFN) PACKAGE
(TOP VIEW)
–
Device Temperature Grade 2: –40°C to
105°C Ambient Operating Temperature
Range for QFN package
1
2
3
4
8
7
6
5
PWM
ST
I
Exposed
Thermal
Pad
NC
Q
D
–
Device Temperature Grade 1: –40°C to
125°C Ambient Operating Temperature
Range for SFM package
GND
REF
1
2
3
4
5
6
7
–
–
Device HBM ESD Classification Level H1C
Device CDM ESD Classification Level C3B
NC – No internal connection
•
Adjustable Constant Current
up to 500 mA (±5%)
I
ST REF
Q
PWM GND
D
•
•
•
•
Wide Input-Voltage Range up to 42 V
Low Dropout Voltage
Open-Load Detection
Overtemperature Protection
DESCRIPTION
The TL4242-Q1 is an integrated adjustable constant-current source, driving loads up to 500 mA. One can adjust
the output current level through an external resistor. The device design is for supplying high-power LEDs (for
example, OSRAM Dragon LA W57B) under the severe conditions of automotive applications, resulting in
constant brightness and extended LED lifetime. The device comes in the DRJ (QFN) package. Protection circuits
prevent damage to the device in case of overload, short circuit, reverse polarity, and overheat. The device
provides the connected LEDs protection against reverse polarity as well as excess voltages up to 45 V.
The integrated PWM input of the TL4242-Q1 permits LED brightness regulation by pulse-width modulation
(PWM). The high input impedance of the PWM input, allows operating the LED driver as a protected high-side
switch.
An external shunt resistor in the ground path of the connected LEDs senses the LED current. A regulation loop
holds the voltage drop at the shunt resistor at a constant level of 177 mV (typical). The selection of the shunt
resistance, RREF, sets the constant-current level. Calculate the typical output current using the equation:
VREF
=
IQ,typ
RREF
where VREF is the reference voltage (typically 177 mV) (see Reference Electrical Characteristics). The equation
applies for RREF = 0.39 Ω to 10 Ω.
The output current is shown as a function of the reference resistance in . With the PWM input, One can regulate
the LED brightness through the duty cycle. Also, PWM = L sets the TL4242-Q1 in sleep mode, resulting in a very
low current consumption of < 1 μA (typical). The high impedance of the PWM input (see ) permits the use of the
PWM pin as an enable input.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TL4242-Q1
SLVS732E –JULY 2010–REVISED JULY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
TA
ORDERABLE PART NUMBER(2)
TOP-SIDE MARKING
4242T
–40°C to 105°C
–40°C to 125°C
TL4242TDRJRQ1
TL4242QKTTRQ1
TL4242Q
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
PIN FUNCTIONS
NO.
NAME
DESCRIPTION
DRJ
KTT
Status delay. To set status reaction delay, connect to GND with a capacitor. For no delay, leave
open.
D
5
6
GND
NC
PWM
Q
3
7
1
6
4
2
8
4
N/A
2
Ground
No internal connection
Pulse-width modulation input. If not used, connect to I.
Output
7
REF
ST
5
Reference input. Connect to a shunt resistor.
3
Status output. Open-collector output. Connect to an external pullup resistor (RPULLUP ≥ 4.7 kΩ).
Input. Connect directly to GND as close as possible to the device with a 100-nF ceramic capacitor.
I
1
Thermal
pad
–
–
Solder the thermal pad directly to the PCB. Connect to ground or leave floating
Figure 1. FUNCTIONAL BLOCK DIAGRAM
8
1
6
I
Q
Bias Supply
PWM
+
−
Bandgap
Reference
4
REF
Comparator
2
ST
Status
Delay
3
5
GND
D
2
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SLVS732E –JULY 2010–REVISED JULY 2013
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–42
–0.3
–40
–1
MAX UNIT
VCC
Supply voltage range(2)
Input voltage range
45
7
V
V
D
VI
PWM
REF
Q
40
16
41
40
±1
V
V
–1
V
VO
Output voltage range
Output current range
ST
–0.3
V
PWM
REF
ST
mA
mA
mA
°C
°C
IO
±2
±5
TJ
Virtual-junction temperature range
Storage temperature range
–40
–55
150
150
Tstg
Human-body model (HBM) AEC-Q100 Classification Level
H1C
1500
200
ESD
Electrostatic discharge rating
Machine model (MM) AEC-Q100 Classification Level M3
V
Charged-device model (CDM) AEC-Q100 Classification
Level C3B
1000
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal.
THERMAL INFORMATION
TL4242-Q1
THERMAL METRIC(1)
UNIT
DRJ (8 PINS)
KTT (7 PINS)
θJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
39
31.6
34.7
8.2
θJCtop
θJB
31.5
15.5
0.3
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.7
ψJB
15.6
1.8
8.2
θJCbot
0.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
42
UNIT
V
VCC
VST
Supply voltage
4.5
Status (ST) output voltage
16
V
VPWM PWM voltage
0
0
40
V
CD
Status delay (D) capacitance
2.2
10
μF
Ω
RREF Reference (REF) resistor
0
TA
TA
Operating free-air temperature, QFN
Operating free-air temperature, SFM
–40
–40
105
125
°C
°C
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SLVS732E –JULY 2010–REVISED JULY 2013
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OVERALL DEVICE ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range, VI = 13.5 V, RREF = 0.47 Ω, VPWM,H, TA = –40°C to 105°C (QFN),
TA = –40°C to 125°C (SFM), all voltages with respect to ground (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VQ = 6.6 V
PWM = L, TJ < 85°C
MIN
TYP
12
MAX UNIT
IqL
Supply current
Supply current, off mode
22
2
mA
IqOFF
0.1
μA
OUTPUT ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range, VI = 13.5 V, RREF = 0.47 Ω, VPWM,H, TA = –40°C to 105°C (QFN),
TA = –40°C to 125°C (SFM), all voltages with respect to ground (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VQ – VREF (1) = 6.6 V
MIN
357
168
431
357
TYP
376
177
454
376
600
0.35
MAX UNIT
395
VQ – VREF = 6.6 V, RREF = 1 Ω
VQ – VREF = 6.6 V, RREF = 0.39 Ω
VQ – VREF = 5.4 V to 7.8 V, VI = 9 V to 16 V
RREF = 0 Ω
185
mA
476
IQ
Output current
395
mA
IQmax
Vdr
Output current limit
Drop voltage
IQ = 300 mA
0.7
V
(1) VQ – VREF equals the forward voltage sum of the connected LEDs (see ).
PWM INPUT ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range, VI = 13.5 V, RREF = 0.47 Ω, VPWM,H, TA = –40°C to 105°C (QFN),
TA = -40°C to 125°C (SFM), all voltages with respect to ground (unless otherwise noted)
PARAMETER
High-level PWM voltage
Low-level PWM voltage
High-level PWM input current
Low-level PWM input current
Delay time, turnon
TEST CONDITIONS
MIN
TYP
MAX UNIT
VPWM,H
VPWM,L
IPWM,H
2.6
V
0.7
500
1
V
VPWM = 5 V
220
μA
μA
μs
μs
IPWM,L
VPWM = 0 V
–1
0
tPWM,ON
tPWM,OFF
70% of IQnom, see Figure 8
30% of IQnom, see Figure 8
15
15
40
40
Delay time, turnoff
0
REFERENCE (REF) ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range, VI = 13.5 V, RREF = 0.47 Ω, VPWM,H, TA = –40°C to 105°C (QFN),
TA = –40°C to 125°C (SFM), all voltages with respect to ground (unless otherwise noted)
PARAMETER
Reference voltage
TEST CONDITIONS
RREF = 0.39 Ω to 1 Ω
MIN
168
–1
TYP
177
0.1
MAX UNIT
VREF
IREF
185
1
mV
Reference input current
VREF = 180 mV
μA
4
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SLVS732E –JULY 2010–REVISED JULY 2013
STATUS OUTPUT (ST) ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range, VI = 13.5 V, RREF = 0.47 Ω, VPWM,H, TA = –40°C to 105°C (QFN),
TA = –40°C to 125°C (SFM), all voltages with respect to ground (unless otherwise noted)
PARAMETER
Lower status-switching threshold
Upper status-switching threshold
Low-level status voltage
TEST CONDITIONS
MIN
TYP
25
MAX UNIT
VIQL
VIQH
VSTL
ISTLK
ST = L
ST = H
15
mV
30
40
0.4
5
mV
V
IST = 1.5 mA
VST = 5 V
Leakage current
μA
STATUS DELAY (D) ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range, VI = 13.5 V, RREF = 0.47 Ω, VPWM,H, TA = –40°C to 105°C (QFN),
TA = –40°C to 125°C (SFM), all voltages with respect to ground (unless otherwise noted)
PARAMETER
Delay time, status reaction
Delay time, status release
TEST CONDITIONS
CD = 47 nF, ST H→L
MIN
TYP
10
MAX UNIT
tSTHL
tSTLH
6
14
20
ms
CD = 47 nF, ST L→H
10
μs
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TYPICAL CHARACTERISTICS
OUTPUT CURRENT
versus
EXTERNAL RESISTANCE
OUTPUT CURRENT
versus
SUPPLY VOLTAGE
700
600
500
400
300
200
100
0
450
400
350
300
250
200
150
100
50
0
œ50
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25
0
5
10
15
20
25
30
35
40
External Reference (ꢀ)
Supply Voltage (V)
C001
C002
Figure 2.
Figure 3.
REFERENCE VOLTAGE
versus
JUNCTION TEMPERATURE
PWM PIN INPUT CURRENT
versus
PWM VOLTAGE
178.5
178.0
177.5
177.0
176.5
176.0
175.5
60
50
40
30
20
10
0
œ10
œ40 œ20
0
20
40
60
80
100 120 140
0
10
20
30
40
Virtual Junction Temperature ( C)
PWM Voltage (V)
C003
C004
Figure 4.
Figure 5.
6
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SLVS732E –JULY 2010–REVISED JULY 2013
TYPICAL CHARACTERISTICS (continued)
ST PIN VOLTAGE
versus
ST PIN PULLDOWN CURENT
250
200
150
100
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Pulldown Current (mA)
C005
Figure 6.
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APPLICATION INFORMATION
Figure 7 shows a typical application with the TL4242-Q1 LED driver. A supply current adjusted by the RREF
resistor drives the three LEDs, preventing brightness variations due to forward voltage spread of the LEDs. An
appropriate duty cycle applied to the PWM pin can compensate through software for the luminosity spread
arising from the LED production process. Therefore, it is not necessary to select LEDs for forward voltage or
luminosity classes. The minimum supply voltage calculates as the sum of the LED forward voltages, the TL4242-
Q1 drop voltage (maximum 0.7 V at an LED current of 300 mA), and the maximum voltage drop at the shunt
resistor RREF of 185 mV.
I
RO
SI
V
BAT
Microcontroller
Q
10 µF
10 kW
RADJ GND
D
100 nF
PWM
ST
I
Q
TL4242-Q1
REF
LED
Dragon
GND
D
47 nF
0.47 W
R
REF
0.25 W
Figure 7. Application Circuit
The status output of the LED driver (ST) detects an open-load condition, enabling supervision of correct LED
operation. A voltage drop at the shunt resistor (RREF) below 25 mV (typical) detects an LED failure. In this case,
the status output pin (ST) goes low after a delay time adjustable by an optional capacitor connected to pin D.
Figure 8 shows the functionality and timing of ST and PWM. One can adjust the status delay through the
capacitor connected to pin D. Delay time scales linearly with the capacitance, CD:
CD
47 nF
CD
tSTHL,typ
+
10 ms
10 ms
tSTLH,typ
+
47 nF
8
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SLVS732E –JULY 2010–REVISED JULY 2013
Open
Load
Open
Load
VPWM
VPWM,H
VPWM,L
IQ
t
tPWM,ON
tPWM,OFF
IQ,nom
70%
30%
t
VD
tSTHL
VLD
t
VST
t
Figure 8. Function and Timing Diagram
Stoplight and Taillight Application
For many automobiles, the same set of LEDs illuminates both taillights and stoplights. Thus, the LEDs must
operate at two different brightness levels, full brightness for the stoplight and 10% to 25% brightness for the
taillight. The easiest way to achieve the different brightness is dimming by pulse-width modulation (PWM), which
holds the color spectrum of the LED over its whole brightness range. The maximum current that passes through
the LED is programmable by sense resistor RREF
.
Obtain the maximum current, IQmax, that passes through the LEDs by the following expression:
VREF
IQmax =
RREF
For example, if RREF equals 1 Ω, as VREF is a fixed value range from 168 mV to 185 mV, IQmax should be 168 mA
to 185 mA.
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TL4242-Q1
PWM
Q
STOP
TAIL
REF
LED
Dragon
Vin
TLC555-Q1
VDD OUT
RREF
Figure 9. Stoplight and Taillight Application Circuit
Figure 9 shows the application circuit of the stoplight and taillight including an automotive-qualified timer,
TLC555-Q1, the duty cycle of which is programmable by two external resistors. One can see that driving the
STOP signal high pulls the PWM pin constantly high, creating 100% duty cycle. Thus the LEDs operate at full
brightness. When the TAIL signal is high, the LEDs operate at 25% brightness because the TLC555-Q1 timer is
programmed at a fixed duty cycle of 25%.
Thermal Information
This device operates a thermal shutdown (TSD) circuit as a protection from overheating. For continuous normal
operation, the junction temperature should not exceed the thermal-shutdown trip point. If the junction temperature
exceeds the thermal-shutdown trip point, the output turns off. When the junction temperature falls below the
thermal-shutdown trip point, the output turns on again.
Calculate the power dissipated by the device according to the following formula:
P = (VI - VO )´IO + VI ´IQ
In the formula, VI represents the input voltage of the device, VO stands for the output voltage, and IO means the
output current of LED and IQ is the quiescent current dissipated by the device. The very small value of IQ
sometimes allows one to neglect it.
After determining the power dissipated by the device, calculate the junction temperature from the ambient
temperature and the device thermal impedance.
TJ = TA + qJA ´ P
PCB Design Guideline
In order to prevent thermal shutdown, TJ must be less than 150ºC. If the input voltage is very high, the power
dissipation might be large. Currently there is the KTT (DDPAK) package which has good thermal impedance, but
at the same time, the PCB layout is also very important. Good PCB design can optimize heat transfer, which is
absolutely essential for the long-term reliability of the device.
•
Maximize the copper coverage on the PCB to increase the thermal conductivity of the board, because the
major heat-flow path from the package to the ambient is through the copper on the PCB. Maximjum copper is
extremely important when there are not any heat sinks attached to the PCB on the other side of the package.
•
•
Add as many thermal vias as possible directly under the package ground pad to optimize the thermal
conductivity of the board.
All thermal vias should be either plated shut or plugged and capped on both sides of the board to prevent
solder voids. To ensure reliability and performance, the solder coverage should be at least 85 percent.
10
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SLVS732E –JULY 2010–REVISED JULY 2013
REVISION HISTORY
Changes from Revision D (May 2013) to Revision E
Page
•
Added new graph to Typical Characteristics ........................................................................................................................ 6
Changes from Revision C (October 2012) to Revision D
Page
•
Changed minimum storage temperature to –55ºC ............................................................................................................... 3
Changes from Revision B (September 2012) to Revision C
Page
•
•
•
Added Stoplight and Taillight Application section ................................................................................................................. 9
Added Thermal Information section .................................................................................................................................... 10
Added PCB Desogm Guideling section .............................................................................................................................. 10
Changes from Revision A (August, 2012) to Revision B
Page
•
•
Removed package column in ordering information table. .................................................................................................... 2
Manually appended mechanical data, thermal pad data, and package option addendum .................................................. 8
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Jun-2013
PACKAGING INFORMATION
Orderable Device
TL4242QKTTRQ1
TL4242TDRJRQ1
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
DDPAK/
TO-263
KTT
7
8
500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-245C-168 HR
TL4242Q
4242T
ACTIVE
SON
DRJ
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Jun-2013
OTHER QUALIFIED VERSIONS OF TL4242-Q1 :
Catalog: TL4242
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jun-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TL4242QKTTRQ1
TL4242TDRJRQ1
DDPAK/
TO-263
KTT
DRJ
7
8
500
330.0
24.4
10.6
15.8
4.9
16.0
24.0
Q2
SON
1000
180.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jun-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TL4242QKTTRQ1
TL4242TDRJRQ1
DDPAK/TO-263
SON
KTT
DRJ
7
8
500
340.0
210.0
340.0
185.0
38.0
35.0
1000
Pack Materials-Page 2
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