TL598CJ [TI]
SWITCHING CONTROLLER, 300kHz SWITCHING FREQ-MAX, CDIP16;
| 型号： | TL598CJ |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | SWITCHING CONTROLLER, 300kHz SWITCHING FREQ-MAX, CDIP16 CD 开关 |
| 文件： | 总17页 (文件大小：586K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁ ꢂꢃ ꢄ
ꢅꢆꢁ ꢇ ꢈꢉꢊ ꢋꢌꢀ ꢍꢉꢎ ꢏ ꢌꢆꢁ ꢐꢀ ꢋꢏ ꢑ ꢒꢏ ꢑꢀ ꢓꢏ ꢁ ꢒ ꢋꢓ ꢒꢆ ꢋ ꢀꢇ
ꢔ
SLVS053D − FEBRUARY 1988 − REVISED NOVEMBER 2003
D OR N PACKAGE
(TOP VIEW)
D
D
Complete PWM Power-Control Function
Totem-Pole Outputs for 200-mA Sink or
Source Current
ERROR
AMP 2
ERROR
AMP 1
1IN+
1IN−
2IN+
2IN−
REF
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
D
D
D
D
Output Control Selects Parallel or
Push-Pull Operation
FEEDBACK
DTC
OUTPUT CTRL
Internal Circuitry Prohibits Double Pulse at
Either Output
CT
V
CC
RT
V
C
Variable Dead-Time Provides Control Over
Total Range
SIGNAL GND
OUT1
POWER GND
OUT2
Internal Regulator Provides a Stable 5-V
Reference Supply, Trimmed to 1%
Tolerance
D
D
D
On-Board Output Current-Limiting
Protection
Undervoltage Lockout for Low-V
CC
Conditions
Separate Power and Signal Grounds
description/ordering information
The TL598 incorporates all the functions required in the construction of pulse-width-modulated (PWM)
controlled systems on a single chip. Designed primarily for power-supply control, the TL598 provides the
systems engineer with the flexibility to tailor the power-supply control circuits to a specific application.
The TL598 contains two error amplifiers, an internal oscillator (externally adjustable), a dead-time control (DTC)
comparator, a pulse-steering flip-flop, a 5-V precision reference, undervoltage lockout control, and output
control circuits. Two totem-pole outputs provide exceptional rise- and fall-time performance for power FET
control. The outputs share a common source supply and common power ground terminals, which allow system
designers to eliminate errors caused by high current-induced voltage drops and common-mode noise.
The error amplifier has a common-mode voltage range of 0 V to V
− 2 V. The DTC comparator has a fixed
CC
offset that prevents overlap of the outputs during push-pull operation. A synchronous multiple supply operation
can be achieved by connecting RT to the reference output and providing a sawtooth input to CT.
The TL598 device provides an output control function to select either push-pull or parallel operation. Circuit
architecture prevents either output from being pulsed twice during push-pull operation. The output frequency
1
ǒ
Ǔ. For single-ended applications:
for push-pull applications is one-half the oscillator frequency fO +
2 RT CT
1
fO +
.
RT CT
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP (N)
SOIC (D)
Tube of 25
Tube of 40
Reel of 2500
TL598CN
TL598CN
0°C to 70°C
TL598CD
TL598C
TL598CDR
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ꢅꢓ ꢏ ꢌꢆ ꢒ ꢀꢋ ꢏ ꢑ ꢌ ꢐꢀꢐ ꢕꢖ ꢗ ꢘꢙ ꢚ ꢛꢜ ꢕꢘꢖ ꢕꢝ ꢞꢟ ꢙ ꢙ ꢠꢖꢜ ꢛꢝ ꢘꢗ ꢡꢟꢢ ꢣꢕꢞ ꢛꢜ ꢕꢘꢖ ꢤꢛ ꢜꢠ ꢥ
ꢅꢙ ꢘ ꢤꢟꢞ ꢜ ꢝ ꢞ ꢘꢖ ꢗꢘ ꢙ ꢚ ꢜ ꢘ ꢝ ꢡꢠ ꢞ ꢕꢗ ꢕꢞꢛ ꢜꢕ ꢘꢖꢝ ꢡꢠ ꢙ ꢜꢦ ꢠ ꢜꢠ ꢙ ꢚꢝ ꢘꢗ ꢀꢠꢧ ꢛꢝ ꢋꢖꢝ ꢜꢙ ꢟꢚ ꢠꢖꢜ ꢝ
ꢝ ꢜ ꢛ ꢖꢤ ꢛ ꢙꢤ ꢨ ꢛ ꢙꢙ ꢛ ꢖ ꢜꢩꢥ ꢅꢙ ꢘ ꢤꢟꢞ ꢜꢕꢘꢖ ꢡꢙ ꢘꢞ ꢠꢝ ꢝꢕ ꢖꢪ ꢤꢘꢠ ꢝ ꢖꢘꢜ ꢖꢠ ꢞꢠ ꢝꢝ ꢛꢙ ꢕꢣ ꢩ ꢕꢖꢞ ꢣꢟꢤ ꢠ
ꢜ ꢠ ꢝ ꢜꢕ ꢖꢪ ꢘꢗ ꢛ ꢣꢣ ꢡꢛ ꢙ ꢛ ꢚ ꢠ ꢜ ꢠ ꢙ ꢝ ꢥ
Copyright 2003, Texas Instruments Incorporated
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂ ꢃꢄ
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ꢔ
SLVS053D − FEBRUARY 1988 − REVISED NOVEMBER 2003
FUNCTION TABLE
INPUT/OUTPUT
CTRL
OUTPUT FUNCTION
V = GND
Single-ended or parallel output
Normal push-pull operation
I
V = REF
I
functional block diagram
OUTPUT CTRL
(see Function Table)
13
6
RT
CT
11
8
Oscillator
5
1D
V
C
DTC
Comparator
≈0.1 V
OUT1
4
C1
DTC
Error Amplifier
PWM
Comparator
1
2
1IN+
1IN−
+
−
1
9
OUT2
Error Amplifier
+
Pulse-Steering
Flip-Flop
16
15
3
2IN+
2IN−
10
12
POWER
GND
V
CC
2
−
FEEDBACK
Undervoltage
Lockout Control
Reference
Regulator
14
7
REF
SIGNAL
GND
0.7 mA
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 V
CC
Amplifier input voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
+ 0.3 V
I
CC
Collector voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 V
Output current (each output), sink or source, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 mA
O
Package thermal impedance, θ (see Notes 2 and 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
JA
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the signal ground terminal.
2. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
J
JA
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can impact reliability.
D
J
A
JA
J
3. The package thermal impedance is calculated in accordance with JESD 51-7.
2
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ꢔ
SLVS053D − FEBRUARY 1988 − REVISED NOVEMBER 2003
recommended operating conditions
MIN
7
MAX
UNIT
V
V
V
Supply voltage
40
CC
I
Amplifier input voltage
Collector voltage
0
V
−2
40
V
CC
I
I
V
O
Output current (each output), sink or source
Current into feedback terminal
Timing capacitor
200
0.3
10
mA
mA
µF
kΩ
kHz
°C
IL
C
R
0.00047
T
T
Timing resistor
1.8
1
500
300
70
f
Oscillator frequency
osc
T
A
Operating free-air temperature
0
electrical characteristics over recommended operating free-air temperature range, V
(unless otherwise noted)
= 15 V
CC
reference section (see Note 4)
‡
†
MIN TYP
MAX
PARAMETER
UNIT
TEST CONDITIONS
T
= 25°C
4.95
4.9
5
5.05
5.1
25
A
Output voltage (REF)
I
= 1 mA
V
O
T
= full range
= 25°C
A
A
Input regulation
V
= 7 V to 40 V
T
2
1
mV
CC
T
A
= 25°C
15
Output regulation
I
O
= 1 mA to 10 mA
mV
T
A
= full range
50
Output voltage change with temperature
∆T = MIN to MAX
2
10 mV/V
mA
A
§
Short-circuit output current
REF = 0 V
−10
−48
†
‡
§
Full range is 0°C to 70°C.
All typical values, except for parameter changes with temperature, are at T = 25°C.
Duration of the short circuit should not exceed one second.
A
NOTE 4: Pulse-testing techniques that maintain the junction temperature as close to the ambient temperature as possible must be used.
oscillator section, C = 0.001 µF, R = 12 kΩ (see Figure 1) (see Note 4)
T
T
‡
†
MIN TYP
MAX
PARAMETER
UNIT
kHz
TEST CONDITIONS
Frequency
100
100
1
¶
Standard deviation of frequency
All values of V , C , R , T constant
Hz/kHz
CC
T
T
A
Frequency change with voltage
V
CC
= 7 V to 40 V,
T
A
= 25°C
10 Hz/kHz
120
80
∆T = full range
70
50
A
#
Frequency change with temperature
Hz/kHz
∆T = full range,
A
C
= 0.01 µF
T
†
‡
¶
Full range is 0°C to 70°C.
All typical values, except for parameter changes with temperature, are at T = 25°C.
Standard deviation is a measure of the statistical distribution about the mean, as derived from the formula:
A
N
2
ȍ
(x * X)
n
Ǹ
n+1
s +
N * 1
#
Effects of temperature on external R and C are not taken into account.
T
T
NOTE 4. Pulse-testing techniques that maintain the junction temperature as close to the ambient temperature as possible must be used.
3
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ꢀ ꢁ ꢂ ꢃꢄ
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ꢔ
SLVS053D − FEBRUARY 1988 − REVISED NOVEMBER 2003
electrical characteristics over recommended operating free-air temperature range, V
(unless otherwise noted) (continued)
= 15 V
CC
error amplifier section (see Note 4)
†
PARAMETER
Input offset voltage
TEST CONDITIONS
MIN TYP
MAX
10
UNIT
mV
nA
FEEDBACK = 2.5 V
FEEDBACK = 2.5 V
FEEDBACK = 2.5 V
2
Input offset current
Input bias current
25
250
1
0.2
µA
0 to
Common-mode input voltage range
V
CC
= 7 V to 40 V
V
V
−2
CC
Open-loop voltage amplification
Unity-gain bandwidth
∆V (FEEDBACK) = 3 V,
V
(FEEDBACK) = 0.5 V to 3.5 V
70
95
800
80
dB
kHz
dB
O
O
Common-mode rejection ratio
Output sink current (FEEDBACK)
V
= 40 V,
∆V = 6.5 V,
IC
T
= 25°C
65
CC
FEEDBACK = 0.5 V
A
0.3
−2
0.7
mA
mA
Output source current (FEEDBACK) FEEDBACK = 3.5 V
Phase margin at unity gain
Supply-voltage rejection ratio
FEEDBACK = 0.5 V to 3.5 V,
FEEDBACK = 2.5 V, ∆V
R
R
= 2 kΩ
= 2 kΩ
65°
L
L
= 33 V,
100
dB
CC
†
All typical values, except for parameter changes with temperature, are at T = 25°C.
A
NOTE 4. Pulse-testing techniques that maintain the junction temperature as close to the ambient temperature as possible must be used.
electrical characteristics over recommended operating free-air temperature range, V
(unless otherwise noted)
= 15 V
CC
undervoltage lockout section (see Note 4)
‡
MIN
MAX
PARAMETER
UNIT
TEST CONDITIONS
T
= 25°C
4
3.5
100
50
6
A
Threshold voltage
V
∆T = full range
6.9
A
T
A
= 25°C
§
mV
Hysteresis
T
A
= full range
‡
§
Full range is 0°C to 70°C.
Hysteresis is the difference between the positive-going input threshold voltage and the negative-going input threshold voltage.
NOTE 4. Pulse-testing techniques must be used that maintain the junction temperature as close to the ambient temperature as possible.
output section (see Note 4)
PARAMETER
TEST CONDITIONS
MIN
12
MAX
UNIT
I
O
I
O
I
O
I
O
= −200 mA
= −20 mA
= 200 mA
= 20 mA
V
V
= 15 V,
= 15 V
CC
C
High-level output voltage
Low-level output voltage
Output-control input current
V
13
2
0.4
3.5
100
V
V
= 15 V,
= 15 V
CC
C
V
mA
V = V
ref
V = 0.4 V
I
I
µA
NOTE 4. Pulse-testing techniques must be used that maintain the junction temperature as close to the ambient temperature as possible.
4
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ꢀꢁ ꢂꢃ ꢄ
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ꢔ
SLVS053D − FEBRUARY 1988 − REVISED NOVEMBER 2003
electrical characteristics over recommended operating free-air temperature range, V
(unless otherwise noted) (continued)
= 15 V
CC
dead-time control section (see Figure 1) (see Note 4)
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
UNIT
Input bias current (DTC)
V = 0 to 5.25 V
I
−2
−10
µA
Maximum duty cycle, each output
DTC = 0 V
0.45
0
Zero duty cycle
3
3.3
Input threshold voltage (DTC)
V
Maximum duty cycle
†
All typical values, except for parameter changes with temperature, are at T = 25°C.
A
NOTE 4. Pulse-testing techniques must be used that maintain the junction temperature as close to the ambient temperature as possible.
pwm comparator section (see Note 4)
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
UNIT
V
Input threshold voltage (FEEDBACK)
Input sink current (FEEDBACK)
DTC = 0 V
3.75
0.7
4.5
V
= 0.5 V
0.3
mA
(FEEDBACK)
†
All typical values, except for parameter changes with temperature, are at T = 25°C.
A
NOTE Pulse-testing techniques must be used that maintain the junction temperature as close to the ambient temperature as possible.
total device (see Figure 1) (see Note 4)
†
PARAMETER
Standby supply current
Average supply current
TEST CONDITIONS
MIN TYP
MAX
21
UNIT
RT = V
,
V
= 15 V
= 40 V
15
20
15
ref
CC
mA
mA
All other inputs and outputs open
V
26
CC
DTC = 2 V
†
All typical values, except for parameter changes with temperature, are at T = 25°C.
A
NOTE 4. Pulse-testing techniques must be used that maintain the junction temperature as close to the ambient temperature as possible.
switching characteristics, T = 25°C (see Note 4)
A
PARAMETER
Output-voltage rise time
Output-voltage fall time
TEST CONDITIONS
MIN
TYP
60
MAX
150
75
UNIT
CL = 1500 pF,
See Figure 2
VC = 15 V, VCC = 15 V,
ns
35
NOTE 4. Pulse-testing techniques must be used that maintain the junction temperature as close to the ambient temperature as possible.
5
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ꢔ
SLVS053D − FEBRUARY 1988 − REVISED NOVEMBER 2003
PARAMETER MEASUREMENT INFORMATION
Output
15 V
V
C
12
V
CC
ERROR ERROR
AMP 1 AMP 2
1
2
16
15
IN+
IN−
IN+
IN−
50 kΩ
3
4
FEEDBACK
Test
Inputs
POWER GND
14
13
11
8
DTC
CT
REF
5
6
OUTPUT CTRL
OUTPUT CONFIGURATION
RT
15 V
V
C
0.001 µF
OUTPUT 1
OUTPUT 2
OUT1
OUT2
−
+
12 kΩ
9
V
I
7
SIGNAL GND
FEEDBACK
10
POWER GND
−
+
REF
MAIN DEVICE TEST CIRCUIT
ERROR-AMPLIFIER TEST CIRCUIT
Figure 1. Test Circuits
V
C
90%
90%
Output
10%
10%
0 V
C
= 1500 pF
L
t
r
t
f
POWER GND
OUTPUT CONFIGURATION
OUTPUT-VOLTAGE WAVEFORM
Figure 2. Switching Output Configuration and Voltage Waveform
6
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ꢔ
SLVS053D − FEBRUARY 1988 − REVISED NOVEMBER 2003
TYPICAL CHARACTERISTICS
OSCILLATOR FREQUENCY AND
†
FREQUENCY VARIATION
vs
AMPLIFIER VOLTAGE AMPLIFICATION
vs
TIMING RESISTANCE
FREQUENCY
80
100 k
40 k
V
CC
= 15 V
V
= 15 V
CC
∆V = 3 V
O
−2%
T
A
= 25°C
0.001 µF
10 k
4 k
−1%
60
40
0.01 µF
0%
1 k
0.1 µF
400
†
Df = 1%
100
40
20
0
C
= 1 µF
T
10
1 k
10 k
100 k
1 M
1 k
4 k
10 k
40 k 100 k
400 k 1 M
f − Frequency − Hz
R
− Timing Resistance − Ω
T
†
Frequency variation (∆f) is the change in predicted oscillator
frequency that occurs over the full temperature range.
Figure 4
Figure 3
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
SOIC
Drawing
5962-9166801QEA
TL598CD
OBSOLETE
ACTIVE
J
16
16
TBD
Call TI
Call TI
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL598CDE4
TL598CDG4
TL598CDR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
D
D
D
D
D
N
N
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL598CDRE4
TL598CDRG4
TL598CN
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL598CNE4
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL598MFKB
TL598MJB
TL598QD
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
LCCC
CDIP
SOIC
SOIC
PDIP
FK
J
20
16
16
16
16
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
D
D
N
TL598QDR
TL598QN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2007
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TL598CDR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC 16
SPQ
Length (mm) Width (mm) Height (mm)
333.2 345.9 28.6
TL598CDR
D
2500
Pack Materials-Page 2
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