TL712CDRG4 [TI]
COMPARATOR, 5000uV OFFSET-MAX, 25ns RESPONSE TIME, PDSO8, GREEN, PLASTIC, MS-012AA, SOIC-8;
| 型号： | TL712CDRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | COMPARATOR, 5000uV OFFSET-MAX, 25ns RESPONSE TIME, PDSO8, GREEN, PLASTIC, MS-012AA, SOIC-8 放大器 光电二极管 |
| 文件： | 总16页 (文件大小：937K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁ ꢂꢃ ꢄ
ꢅꢆ ꢇꢇ ꢈꢉ ꢈꢊꢀ ꢆꢋ ꢁ ꢌꢍ ꢎꢏꢋ ꢉꢋꢀꢍ ꢉ
SLCS002D − JUNE 1983 − REVISED AUGUST 2003
D, P, PS, OR PW PACKAGE
(TOP VIEW)
D
D
D
D
D
D
D
Operates From a Single 5-V Supply
0-V to 5.5-V Common-Mode Input Voltage
Range
NC
IN−
IN+
OE
V
CC
1
2
3
4
8
7
6
5
Self-Biased Inputs
OUT−
OUT+
GND
Complementary 3-State Outputs
Enable Capability
Hysteresis . . . 5 mV Typ
Response Times . . . 25 ns Typ
NC−No internal connection
description/ordering information
The TL712 is a high-speed comparator fabricated with bipolar Schottky process technology. The circuit has
differential analog inputs and complementary 3-state TTL-compatible logic outputs with symmetrical switching
characteristics. When the output enable (OE) is low, both outputs are in the high-impedance state. This device
operates from a single 5-V supply and is useful as a disk memory read-chain data comparator.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP (P)
Tube of 50
TL712CP
TL712CP
Tube of 75
TL712CD
SOIC (D)
SOP (PS)
TL712C
T712
Reel of 2500
Reel of 2000
Tube of 150
Reel of 2000
TL712CDR
TL712CPSR
TL712CPW
TL712CPWR
0°C to 70°C
TSSOP (PW)
T712
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
symbol (positive logic)
4
2
3
OE
7
6
IN−
IN+
OUT−
OUT+
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂ ꢃꢄ
ꢅ ꢆꢇ ꢇ ꢈꢉ ꢈꢊ ꢀ ꢆ ꢋꢁ ꢌꢍ ꢎꢏꢋꢉ ꢋꢀꢍ ꢉ
SLCS002D − JUNE 1983 − REVISED AUGUST 2003
schematics of inputs and outputs
EQUIVALENT OF EACH
DIFFERENTIAL INPUT
EQUIVALENT OF EACH ENABLE INPUT
TYPICAL OF ALL OUTPUTS
V
V
CC
CC
V
CC
85 Ω
Nom
8.3 kΩ
Nom
960 Ω
Nom
4 kΩ
Nom
OE
Input
960 Ω
Nom
Output
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
CC
Differential input voltage, V (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 V
ID
Input voltage, V , any differential input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 V
I
Output enable voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Low-level output current, I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
OL
Package thermal impedance, θ (see Notes 3 and 4): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
JA
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W
PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
J
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated in the “recommended operating conditions” section of
this specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the network ground.
2. Differential voltage values are at IN+ with respect to IN−.
3. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
J
JA
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
4. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁ ꢂꢃ ꢄ
ꢅꢆ ꢇꢇ ꢈꢉ ꢈꢊꢀ ꢆꢋ ꢁ ꢌꢍ ꢎꢏꢋ ꢉꢋꢀꢍ ꢉ
SLCS002D − JUNE 1983 − REVISED AUGUST 2003
recommended operating conditions
MIN NOM
MAX
5.25
5.5
−1
UNIT
V
V
V
Supply voltage
4.75
0
5
CC
Common-mode input voltage
High-level output current
Low-level output current
Operating free-air temperature
V
IC
I
mA
mA
°C
OH
OL
I
16
T
A
0
70
electrical characteristics at V
= 5 V, T = 25°C
A
CC
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
mV
mV
V
†
V
V
V
V
Threshold voltage (V
T+
and V
)
V
= 0 to 5 V
−100
100
T
T−
ICR
Hysteresis (V
− V
)
5
3.5
0.4
hys
OH
OL
T+ T−
High-level output voltage
Low-level output voltage
Off-state output current
Enable current
V
ID
V
ID
V
O
= 100 mV,
I
I
= −1 mA
= 16 mA
2.7
OH
= − 100 mV,
= 2.4 V
0.5
−20
100
20
V
OL
I
I
I
I
µA
µA
µA
µA
kΩ
Ω
OZ
V = 5.5 V
I
I
High-level enable current
Low-level enable current
Differential input resistance
Output resistance
V
= 2.7 V
= 0.4 V
IH
IL
IH
IL
V
−360
r
r
4
i
100
−85
20
o
I
I
Short-circuit output current
Supply current
−15
mA
mA
OS
V
ID
= 0,
No load
17
CC
†
The algebraic convention, where the more-negative limit is designated as minimum, is used in this data sheet for input threshold voltage levels
only.
switching characteristics, V
= 5 V, T = 25°C
A
CC
PARAMETER
TEST CONDITIONS
TYP
25
UNIT
ns
t
t
Propagation delay time, low-to-high-level output
Propagation delay time, high-to-low-level output
PLH
PHL
TTL load, See Note 5 and Figure 1
25
ns
NOTE 5: The response time specified is for a 100-mV input step with 5-mV overdrive (105 mV total) and is the interval between the input step
function and the instant when the output crosses 2.5 V.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂ ꢃꢄ
ꢅ ꢆꢇ ꢇ ꢈꢉ ꢈꢊ ꢀ ꢆ ꢋꢁ ꢌꢍ ꢎꢏꢋꢉ ꢋꢀꢍ ꢉ
SLCS002D − JUNE 1983 − REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
5 V
2 kΩ
Output
NOTE A: All diodes are 1N4148 or equivalent.
Figure 1. TTL Output Load Circuit
TYPICAL CHARACTERISTICS
OUTPUT RESPONSE FOR VARIOUS
INPUT OVERDRIVE VOLTAGES
OUTPUT RESPONSE FOR VARIOUS
INPUT OVERDRIVE VOLTAGES
V
= 5 V
V
= 5 V
CC
TTL Load
= 25°C
CC
TTL Load
T = 25°C
A
T
A
100 mV + Overdrive
100 mV + Overdrive
5
4
3
2
1
0
5
4
3
2
1
0
100 mV
50 mV
20 mV
100 mV
50 mV
20 mV
5 mV
5 mV
0
5
10 15 20 25 30 35 40
t − Time − ns
0
5
10 15 20 25 30 35 40
t − Time − ns
Figure 2
Figure 3
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁ ꢂꢃ ꢄ
ꢅꢆ ꢇꢇ ꢈꢉ ꢈꢊꢀ ꢆꢋ ꢁ ꢌꢍ ꢎꢏꢋ ꢉꢋꢀꢍ ꢉ
SLCS002D − JUNE 1983 − REVISED AUGUST 2003
TYPICAL CHARACTERISTICS
COMMON-MODE
PULSE RESPONSE
4
3
2
1
0
V
T
A
= 5 V
CC
= 25°C
50 Ω
V
O
50 Ω
1.7
1.65
1.6
V
IC
1.55
1.5
0
20 40 60 80 100 120 140 160
t − Time − ns
Figure 4
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2013
PACKAGING INFORMATION
Orderable Device
TL712CD
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
D
8
8
8
8
8
8
8
8
8
8
8
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
TL712C
TL712CDE4
TL712CDG4
TL712CDR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
75
75
Green (RoHS
& no Sb/Br)
TL712C
TL712C
TL712C
TL712C
TL712C
TL712CP
TL712CP
T712
Green (RoHS
& no Sb/Br)
D
2500
2500
2500
50
Green (RoHS
& no Sb/Br)
TL712CDRE4
TL712CDRG4
TL712CP
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
P
Pb-Free
(RoHS)
TL712CPE4
TL712CPSR
TL712CPSRE4
TL712CPSRG4
TL712CPWE4
P
50
Pb-Free
(RoHS)
PS
PS
PS
PW
2000
2000
2000
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
T712
SO
Green (RoHS
& no Sb/Br)
T712
TSSOP
TBD
T712
TL712CPWG4
TL712CPWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
8
8
TBD
Call TI
Call TI
0 to 70
0 to 70
T712
T712
2000
2000
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL712CPWRE4
TL712CPWRG4
ACTIVE
ACTIVE
TSSOP
TSSOP
PW
PW
8
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
T712
T712
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2013
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TL712CDR
TL712CPSR
TL712CPWR
SOIC
SO
D
8
8
8
2500
2000
2000
330.0
330.0
330.0
12.4
16.4
12.4
6.4
8.2
7.0
5.2
6.6
3.6
2.1
2.5
1.6
8.0
12.0
8.0
12.0
16.0
12.0
Q1
Q1
Q1
PS
PW
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TL712CDR
TL712CPSR
TL712CPWR
SOIC
SO
D
8
8
8
2500
2000
2000
340.5
367.0
367.0
338.1
367.0
367.0
20.6
38.0
35.0
PS
PW
TSSOP
Pack Materials-Page 2
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