TL720M05QPWPRQ1 [TI]
具有反向电压保护功能的汽车类 450mA、电池供电运行 (42V)、低压降稳压器 | PWP | 20 | -40 to 125;
| 型号： | TL720M05QPWPRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有反向电压保护功能的汽车类 450mA、电池供电运行 (42V)、低压降稳压器 | PWP | 20 | -40 to 125 电池 光电二极管 输出元件 稳压器 调节器 |
| 文件： | 总14页 (文件大小：343K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TL720M05-Q1
www.ti.com
SGLS380D –SEPTEMBER 2008–REVISED JULY 2012
LOW-DROPOUT VOLTAGE REGULATOR
Check for Samples: TL720M05-Q1
1
FEATURES
•
•
•
•
Qualified for Automotive Applications
•
•
•
Short-Circuit Protection
Output Voltage of 5 V ± 2%
Very Low Current Consumption
Very Low Dropout Voltage
Reverse-Polarity Protection
ESD Protection >6 kV
KTT (TO-263) PACKAGE
(TOP VIEW)
KVU (TO-252) PACKAGE
(TOP VIEW)
OUT
GND
IN
OUT
GND
IN
DESCRIPTION
The TL720M devices are monolithic integrated low-dropout voltage regulators offered in 3-pin TO packages. An
input voltage up to 45 V is regulated to VOUT of 5 V with 2% tolerance. The devices can drive loads up to 450 mA
and are short-circuit proof. At overtemperature, the TL720M devices are turned off by the incorporated
temperature protection.
The input capacitor (CIN) compensates for line fluctuation. Using a resistor of approximately 1 Ω in series with CIN
dampens the oscillation of input inductivity and input capacitance. The output capacitor (COUT) stabilizes the
regulation circuit. Stability is specified at COUT ≥ 22 μF and ESR ≤ 5 Ω, within the operating temperature range.
The control amplifier compares a reference voltage to a voltage that is proportional to the output voltage and
drives the base of the series transistor via a buffer. Saturation control as a function of the load current prevents
any oversaturation of the power element. The device also incorporates a number of internal circuits for protection
against:
•
•
•
Overload
Overtemperature
Reverse polarity
ORDERING INFORMATION(1)
ORDERABLE
PART NUMBER
TA
VO NOM
PACKAGE(2)
TOP-SIDE MARKING
TO-252 (DPAK) – KVU
T0-263 – KTT
Reel of 2500
Reel of 500
TL720M05QKVURQ1
TL720M05QKTTRQ1
720M05Q
–40°C to 125°C
5 V
T720M05Q
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
TERMINAL FUNCTIONS
NO.
1
NAME
IN
DESCRIPTION
Input voltage. Connect to ground as close to device as possible, through a ceramic capacitor.
Ground. Internally connected to heatsink
2
GND
OUT
3
Output. Connect to ground with ≥22-μF capacitor, ESR < 5 Ω at 10 kHz.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2012, Texas Instruments Incorporated
TL720M05-Q1
SGLS380D –SEPTEMBER 2008–REVISED JULY 2012
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
Temperature
Sensor
Saturation
Control and
Protection
Circuit
OUT
IN
Bandgap
Reference
GND
2
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Copyright © 2008–2012, Texas Instruments Incorporated
TL720M05-Q1
www.ti.com
SGLS380D –SEPTEMBER 2008–REVISED JULY 2012
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–42
–1
MAX
45
UNIT
V
VI
Input voltage range(2)
Output voltage range
VO
40
V
KTT package
KVU package
26.9
38.6
150
150
θJA
Package thermal impedance, junction to free air(3) (4)
°C/W
TJ
Operating virtual-junction temperature range
Storage temperature range
–40
–65
°C
°C
Tstg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
5.5
MAX
42
UNIT
V
VI
Input voltage
TA
TJ
Operating free-air temperature
Operating virtual-junction temperature
–40
–40
125
150
°C
°C
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range, VI = 13.5 V, TJ = −40°C to 150°C (unless otherwise noted)
(see Figure 1)
PARAMETER
TEST CONDITIONS
MIN
4.9
TYP
5.0
5.0
700
100
100
5
MAX
5.1
5.1
950
220
220
10
UNIT
V
IO = 5 mA to 400 mA, VI = 6 V to 28 V
IO = 5 mA to 200 mA, VI = 6 V to 40 V
VO
IO
Output voltage
4.9
Output current limit
450
mA
μA
TJ = 25°C
IO = 1 mA
TJ ≤ 85°C
Current consumption
Iq = II − IO
IQ
IO = 250 mA
mA
IO = 400 mA
12
22
VDO
Dropout voltage(1)
Load regulation
IO = 300 mA, Vdo = VI − VO
IO = 5 mA to 400 mA
ΔVI = 8 to 32 V, IO = 5 mA
fr = 100 Hz, Vr = 0.5 Vpp
250
15
500
30
mV
mV
mV
dB
Line regulation
–15
5
15
PSRR
Power-supply ripple rejection
60
DVO
DT
Temperature output-voltage drift
0.5
mV/K
(1) Measured when the output voltage VO has dropped 100 mV from the nominal value obtained at VI = 13.5 V
Copyright © 2008–2012, Texas Instruments Incorporated
Submit Documentation Feedback
3
TL720M05-Q1
SGLS380D –SEPTEMBER 2008–REVISED JULY 2012
www.ti.com
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE
vs
OUTPUT VOLTAGE
vs
JUNCTION TEMPERATURE
JUNCTION TEMPERATURE
5.2
5.1
5
5.2
5.1
5
VI = 28 V
VI = 6 V
4.9
4.8
4.7
4.6
4.9
4.8
4.7
4.6
-45 -25 -5 15 35 55 75 95 115 135 155
-45 -25 -5 15 35 55 75 95 115 135 155
TJ – Junction Temperature – °C
TJ – Junction Temperature – °C
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
vs
INPUT VOLTAGE
JUNCTION TEMPERATURE
12
11
10
9
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
8
7
6
5
4
3
2
1
0
0
1
2
3
4
5
6
7
8
9
10
-45 -25 -5 15 35 55 75 95 115 135 155
VI – Input Voltage – V
TJ – Junction Temperature – °C
4
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Copyright © 2008–2012, Texas Instruments Incorporated
TL720M05-Q1
www.ti.com
SGLS380D –SEPTEMBER 2008–REVISED JULY 2012
TYPICAL CHARACTERISTICS (continued)
CURRENT CONSUMPTION
CURRENT CONSUMPTION
vs
vs
OUTPUT CURRENT
OUTPUT CURRENT
3.5
3
12
11
10
9
VI = 13.5 V
VI = 13.5 V
2.5
2
8
7
6
1.5
1
5
4
3
2
0.5
0
1
0
0
50
100 150 200 250 300 350 400
IO – Output Current – mA
0
25
50
75
100 125 150 175 200
IO – Output Current – mA
DROPOUT VOLTAGE
vs
POWER-SUPPLY RIPPLE REJECTION
vs
OUTPUT CURRENT
FREQUENCY
800
700
600
500
400
300
200
100
0
100
90
80
70
60
50
40
30
20
10
0
TJ = 25°C
VIN = 13.5 V
Load = 1 mA
COUT = 22 µF
0
50 100 150 200 250 300 350 400 450 500
IO – Output Current – mA
10
100
1k
10k
100k
Frequency – Hz
Copyright © 2008–2012, Texas Instruments Incorporated
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5
TL720M05-Q1
SGLS380D –SEPTEMBER 2008–REVISED JULY 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
POWER-SUPPLY RIPPLE REJECTION
POWER-SUPPLY RIPPLE REJECTION
vs
vs
FREQUENCY
FREQUENCY
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN = 13.5 V
VIN = 13.5 V
Load = 200 mA
COUT = 22 µF
Load = 400 mA
COUT = 22 µF
10
100
1k
10k
100k
10
100
1k
10k
100k
Frequency – Hz
Frequency – Hz
6
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Copyright © 2008–2012, Texas Instruments Incorporated
TL720M05-Q1
www.ti.com
SGLS380D –SEPTEMBER 2008–REVISED JULY 2012
PARAMETER MEASUREMENT INFORMATION
IO
I
I
OUT
IN
CI1
1000 µF
CI2
COUT
22 µF
100 nF
GND
IGND
VI
VO
Figure 1. Test Circuit
Copyright © 2008–2012, Texas Instruments Incorporated
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7
TL720M05-Q1
SGLS380D –SEPTEMBER 2008–REVISED JULY 2012
www.ti.com
REVISION HISTORY
Changes from Revision C (February, 2012) to Revision D
Page
•
Removed power-on and undervoltage reset bullet in Features. ........................................................................................... 1
8
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Copyright © 2008–2012, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
2-Jul-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TL720M05QKTTRQ1
TL720M05QKVURQ1
ACTIVE
ACTIVE
DDPAK/
TO-263
KTT
KVU
3
3
500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-245C-168 HR
Level-3-260C-168 HR
PFM
2500
Green (RoHS
& no Sb/Br)
CU SN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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