TLC2252TDA1 [TI]
高级 LinCMOS 轨到轨超低功耗运算放大器 | TD | 0 | 0 to 0;
| 型号： | TLC2252TDA1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 高级 LinCMOS 轨到轨超低功耗运算放大器 | TD | 0 | 0 to 0 放大器 运算放大器 |
| 文件： | 总6页 (文件大小：337K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLC2252-DIE
www.ti.com.cn
ZHCSAN9 –JANUARY 2013
高级 LinCMOS™ 轨到轨极低功耗运算放大器
1
特性
2
•
•
•
•
输出摆幅包括两个电源轨
•
•
•
•
极低功耗
低噪声
共模输入电压范围包括负电源轨
低输入偏移电压
低输入偏置电流
技术规格针对单电源及分离电源操作全面拟订
包含宏观模型
说明
TLC2252 是一款由德州仪器 (TI) 生产的双通道和四通道运算放大器。 此器件针对单电源或分离电源应用中增加的
动态范围表现出了轨到轨输出性能。 微功耗运行使得此器件成为电池供电类应用的理想选择。 与之前 CMOS 放大
器相比，噪声性能已经大大提升。
表现出高输入阻抗和低噪声的 TLC2252 放大器在针对高阻抗源的小信号调节方面表现出色，例如压电传感器。 由
于微功耗耗散级别，这个器件在手持监控和遥感应用中运转良好。 此外，单电源或分离电源的轨到轨输出特性使得
此器件成为与模数转换器 (ADC) 对接时的理想选择。
ORDERING INFORMATION(1)
PACKAGE
DESIGNATOR
PRODUCT
PACKAGE
ORDERABLE PART NUMBER
PACKAGE QUANTITY
TLC2252TDA1
TLC2252TDA2
400
10
TLC2252
TD
Bare die in waffle pack(2)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
LinCMOS is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
English Data Sheet: SLOS819
TLC2252-DIE
ZHCSAN9 –JANUARY 2013
www.ti.com.cn
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
DIE THICKNESS
BACKSIDE FINISH
10.5 mils.
Silicon with backgrind
Floating
AlCuTiW
1540 nm
2
Copyright © 2013, Texas Instruments Incorporated
TLC2252-DIE
www.ti.com.cn
ZHCSAN9 –JANUARY 2013
Table 1. Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
74.65
278.7
596.15
727.35
865.5
854.05
865.75
873
Y MIN
54
X MAX
159.65
363.7
Y MAX
139
1OUT
1IN–
1
2
63.95
45
148.95
120
N/C
3
671.15
802.35
940.5
N/C
4
45
120
N/C
5
45
120
1IN+
6
203
939.05
950.75
958
288
VDD–/GND
2IN+
7
541.5
988.7
1311
1315
1315
1315
1298.5
1309.8
626.5
1073.7
1396
1390
1390
1390
1383.5
1394.8
8
2IN–
9
854.05
729.45
598.25
460.1
308.7
46.8
939.05
804.45
673.25
535.1
N/C
10
11
12
13
14
N/C
N/C
2OUT
VDD+
393.7
131.8
Copyright © 2013, Texas Instruments Incorporated
3
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TLC2252TDA1
TLC2252TDA2
ACTIVE
ACTIVE
0
0
221
10
RoHS & Green
RoHS & Green
Call TI
N / A for Pkg Type
N / A for Pkg Type
0 to 0
0 to 0
Samples
Samples
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2023
Addendum-Page 2
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