TLC34058-110MHFG [TI]

256 x 24 COLOR PALETTE; 256× 24的调色板
TLC34058-110MHFG
型号: TLC34058-110MHFG
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

256 x 24 COLOR PALETTE
256× 24的调色板

文件: 总21页 (文件大小:442K)
中文:  中文翻译
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TLC34058-110M  
24 COLOR PALETTE  
256  
×
SGLS075 – JANUARY 1994  
LinEPIC 1-µm CMOS Process  
125-MHz Pipelined Architecture  
Available Clock Rate . . . 110 MHz  
Direct Interface to SMJ340xx Graphics  
Processors  
Standard Microprocessor Unit (MPU)  
Palette Interface  
Dual-Port Color RAM  
Multiplexed-TTL Pixel Ports  
256 Words x 24 Bits  
Triple Digital-to-Analog Converters (DACs)  
Dual-Port Overlay Registers . . . 4 × 24 Bits  
5-V Power Supply  
Bit-Plane Read and Blink Masks  
EIA RS-343-A Compatible Outputs  
Functionally Interchangeable With  
Brooktree Bt458  
description  
The TLC34058-110M color-palette integrated circuit is specifically developed for high-resolution color graphics  
in such applications as CAE/CAD/CAM, image processing, and video reconstruction. The architecture provides  
for the display of 1280 × 1024 bit-mapped color graphics (up to eight bits per pixel resolution) with two bits of  
overlay information. The TLC34058-110M has a 256-word × 24-bit RAM used as a lookup table with three 8-bit  
video D/A converters.  
On-chip features such as high-speed pixel clock logic minimize costly ECL interface. Multiple pixel ports and  
internal multiplexing provide TTL-compatible interface (up to 32 MHz) to the frame buffer while maintaining  
sophisticated color graphic data rates (up to 135 MHz). Programmable blink rates, bit plane masking and  
blinking, color overlay capability, and a dual-port palette RAM are other key features. The TLC34058-110M  
generates red, green, and blue signals compatible with EIA RS-343-A and can drive 75-coaxial cables  
terminated at each end without external buffering.  
AVAILABLE OPTIONS  
PACKAGE  
DAC  
T
A
SPEED  
84-PIN  
84-PIN  
RESOLUTION  
CERAMIC GRID ARRAY  
QUAD FLAT PACKAGE  
55°C to 125°C 110 MHz  
8 Bits  
TLC34058-110MGA  
TLC34058-110MHFG  
LinEPIC is a trademark of Texas Instruments Incorporated.  
Brooktree is a registered trademark of Brooktree Corporation.  
Copyright 1994, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TLC34058-110M  
256 24 COLOR PALETTE  
×
SGLS075 – JANUARY 1994  
HFG PACKAGE  
(TOP VIEW)  
21 20 19 18 17 16 15 14 13 12 11 10 9  
8
7
6
5
4
3 2 1  
D0  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
84 P2B  
83 P2C  
82 P2D  
81 P2E  
80 P3A  
79 P3B  
D1  
D2  
D3  
D4  
D5  
D6  
78  
77  
76  
75  
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
64  
P3C  
P3D  
P3E  
GND  
D7  
CE  
GND  
GND  
V
V
DD  
DD  
V
DD  
C0  
C1  
CLK  
CLK  
LD  
R/W  
V
BLK  
SYNC  
P4A  
P4B  
P4C  
P4D  
DD  
IOR  
IOG  
IOB  
FS ADJ  
COMP  
43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TLC34058-110M  
24 COLOR PALETTE  
256  
×
SGLS075 – JANUARY 1994  
84-pin GA package pin assignments  
SIGNAL  
BLK  
PIN NO.  
L9  
SIGNAL  
Port 5  
P5A  
PIN NO.  
SIGNAL  
PIN NO.  
Power, Reference and  
MPU Interface  
SYNC  
LD  
M10  
M9  
K11  
L12  
K12  
J11  
J12  
P5B  
V
DD  
V
DD  
V
DD  
V
DD  
V
DD  
V
DD  
C12  
C11  
A9  
CLK  
L8  
P5C  
CLK  
M8  
P5D  
P5E  
L7  
Port 0  
P0A  
P0B  
P0C  
P0D  
P0E  
Port 1  
P1A  
P1B  
P1C  
P1D  
P1E  
Port 2  
P2A  
P2B  
P2C  
P2D  
P2E  
Port 3  
P3A  
P3B  
P3C  
P3D  
P3E  
Port 4  
P4A  
P4B  
P4C  
P4D  
P4E  
Port 6  
P6A  
M7  
A7  
G1  
G2  
H1  
H2  
J
H11  
H12  
G12  
G11  
F12  
P6B  
GND  
GND  
GND  
GND  
GND  
COMP  
FS ADJ  
REF  
CE  
B12  
B11  
M6  
B6  
P6C  
P6D  
P6E  
Port 7  
P7A  
A6  
J2  
K1  
L1  
K2  
L2  
F11  
E12  
E11  
D12  
D11  
A12  
B10  
C10  
A5  
P7B  
P7C  
P7D  
P7E  
R/W  
C1  
B8  
Overlay Select 0  
OL0A  
OL0B  
OL0C  
OL0D  
OL0E  
Overlay Select 1  
OL1A  
OL1B  
OL1C  
OL1D  
OL1E  
DAC Current Outputs  
IOG  
A8  
K3  
M1  
L3  
A1  
C2  
B1  
C1  
D2  
C0  
B7  
Data Bus  
D0  
C3  
B2  
B3  
A2  
A3  
B4  
A4  
B5  
M2  
M3  
D1  
D2  
D3  
L4  
M4  
L5  
D1  
E2  
E1  
F1  
F2  
D4  
D5  
D6  
M5  
L6  
D7  
M11  
L10  
L11  
A10  
A11  
B9  
IOB  
IOR  
K10  
M12  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TLC34058-110M  
256 24 COLOR PALETTE  
×
SGLS075 – JANUARY 1994  
functional block diagram  
REF  
FS ADJ  
CLK  
CLK  
Reference  
Amplifier  
COMP  
IOR  
Load  
Control  
Multiplex  
Control  
Blink  
Control  
LD  
8-Bit  
D/A  
Converter  
40  
10  
40  
10  
40  
10  
8
2
8
8
2
P0P7  
(AE)  
256 Words  
8
8
× 24 Bits  
Palette  
RAM  
Input  
Latch  
Latch  
MUX  
Read Blink  
Mask Mask  
8-Bit  
D/A  
Converter  
OL0OL1  
(AE)  
IOG  
IOB  
4 × 24  
Overlay  
Palette  
SYNC  
BLK  
8-Bit  
D/A  
Converter  
Registers  
CE  
To  
R/W  
C0  
Bus  
Control  
Control  
Functions  
C1  
To  
8
8
8
Address  
Control  
Functions  
Address  
Register  
D0D7  
Red  
Value  
Green  
Value  
Blue  
Value  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TLC34058-110M  
24 COLOR PALETTE  
256  
×
SGLS075 – JANUARY 1994  
Terminal Functions  
TERMINAL  
NAME  
BLK  
I/O  
DESCRIPTION  
NO.  
69  
I
Compositeblank control input. This TTL-compatible blanking input is stored in the input latch on the rising edge  
of LD. When low, BLK drives the DAC outputs to the blanking level as shown in Table 6. This causes the P0P7  
(AE) and OL0OL1 (AE) inputs to be ignored. When high, BLK allows the device to perform in the standard  
manner.  
C0, C1  
CE  
34, 35  
30  
I
I
Commandcontrolinputs. C0andC1specifythetypeofwriteorreadoperation(seeTables1, 2, 3, and4). These  
TTL-compatible inputs are latched on the falling edge of CE.  
Chip-enable input. This TTL-compatible input control allows data to be stored and enables data to be written  
or read (see Figure 1). When low, CE enables data to be written or read. When high, CE allows data to be  
internally latched on the rising edge during write operations. Care should be taken to avoid transients on this  
input.  
CLK  
72  
I
Clockinput. CLKprovidesthepixelclockrate. CLKandCLKinputsaredesignedtobedrivenbyECLlogicusing  
a 5-V single supply.  
71  
42  
I
I
Clock input. CLK is the complement of CLK and also provides the pixel clock rate.  
CLK  
COMP  
Compensation input. COMP is used to compensate the internal reference amplifier (see the video generation  
section). A 0.1-µF ceramic capacitor is connected between this terminal and V  
DD  
possible supply voltage rejection ratio is attained by connecting the capacitor to V  
(see Figure 4). The highest  
rather than to GND.  
DD  
D0D7  
FS ADJ  
2229  
41  
I
I
Data input bus. This TTL-compatible bus transfers data into or out of the device. The data bus is an 8-bit  
bidirectional bus where D0 is the least significant bit.  
Full-scale adjust control input. A resistor R  
(see Figure 4), which is connected between this terminal and  
GND, controls the magnitude of the full-scale video signal. The proportional current and voltage relationships  
set  
in Figure 3 are maintained independently of the full-scale output current. The relationships between R  
the IOR, IOG, and IOB full-scale output currents are:  
and  
set  
R
() = 11294 × V (V) / IOG(mA)  
set ref  
IOR, IOB (mA) = 8067 × V (V) / R ()  
ref set  
GND  
31, 32,  
44, 46,  
75  
Ground. All GND terminals must be connected together.  
IOR, IOG  
IOB  
38, 39,  
40  
O
I
Current outputs red, green, and blue. High-impedance red, green, and blue video analog current outputs can  
directly drive a 75-cable coaxial terminated at each end (see Figure 4).  
70  
LD  
Load-control input. This TTL-compatible load control (LD) input latches the P0P7 (AE), OL0OL1 (AE),  
BLK, and SYNC inputs on its rising edge. The LD strobe occurs at 1/4 or 1/5 the clock rate and may be phased  
independently of CLK and CLK. The LD duty cycle limits are specified in the timing requirements table.  
OL0AOL1A  
OL0BOL1B  
OL0COL1C  
OL0DOL1D  
OL0EOL1E  
1221  
l
Overlay selection inputs. These TTL-compatible inputs for the palette-overlay registers are stored in the input  
latch on the rising edge of LD. These inputs (up to 2 bits per pixel) along with bit CR6 of the command register  
(refer to the command register section and Table 5) specify whether the color information is selected from the  
palette RAM or the overlay registers. If the color information is selected from the overlay registers, the  
OL0OL1(AE)inputsaddressaparticularoverlayregister.TheOL0OL1(AD)orOL0OL1(AE)inputs  
are simultaneously input to the device (see the description of bit CR7 in the command register section). The  
OL0OL1 (A) inputs are processed first, then the OL0OL1 (B) inputs, and so on. When obtaining the color  
information from the overlay registers, the P0P7 (A – E) inputs are ignored. Unused inputs should be  
connected to GND.  
P0A P7A  
P0BP7B  
P0CP7C  
P0DP7D  
P0EP7E  
1–11,  
4867,  
7684  
l
Addressinputs.TheseTTL-compatibleinputsforthepaletteRAMarestoredintheinputlatchontherisingedge  
of LD. These address inputs (up to 8 bits per pixel) select one of 256 24-bit words in the palette RAM, which  
is subsequently input to the red, green, and blue D/A converters as three 8-bit or 4-bit bytes. Four or five  
addresses are simultaneously input to the P0P7 (AD) or P0P7 (AE) ports, respectively (see the  
description of bit CR7 in the command register section). The word addressed by P0AP7A is first sent to the  
DACs, then the word addressed by P0BP7B, and so on. Unused inputs should be connected to GND.  
REF  
43  
I
Reference voltage input. Voltage of 1.235 V is supplied at this input. An external voltage reference circuit,  
shown in Figure 4, is suggested. Generating the reference voltage with a resistor network is not recommended  
since low-frequency power supply noise directly couples into the DAC output signals. This input must be  
decoupled by connecting a 0.1-µF ceramic capacitor between V and GND.  
ref  
Terminal numbers shown are for the HFG package only. For the GA package terminal assignments, see page 3.  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TLC34058-110M  
256 24 COLOR PALETTE  
×
SGLS075 – JANUARY 1994  
Terminal Functions (Continued)  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
R/W  
NO.  
36  
I
Read/write input. This TTL-compatible control input is latched on the falling edge of CE (see Figure 1). When  
low, R/W writes data to the device. Data is internally latched on the rising edge of CE. When high, R/W reads  
data from the device.  
68  
I
Composite sync control input. This TTL-compatible SYNC input is stored in the input latch on the rising edge  
of LD. When low, SYNC turns off a 40 IRE current source on the IOG output (see Figure 3). This input does  
not override any control data input (see Table 6). It should be brought low during the blanking interval only (see  
Figure 3). When high, SYNC allows the device to perform in the standard manner.  
SYNC  
V
DD  
33, 37,  
45, 47,  
73, 74  
Supply voltage. All V  
terminals must be connected together.  
DD  
Terminal numbers shown are for the HFG package only. For the GA package terminal assignments, see page 3.  
absolute maximum ratings over operating free-air temperature (unless otherwise noted)  
Supply voltage, V  
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V  
DD  
Voltage range on any digital input (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 V to V  
Analog output short-circuit current to any power supply or common, I  
Operating free-air temperature range, T  
+ 0.5 V  
DD  
. . . . . . . . . . . . . . . . . . . . . . unlimited  
OS  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55°C to 125°C  
A
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C  
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and  
functional operation of the device at these or any other conditions beyond those indicated in the recommended operating conditions section of  
this specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTE 1: All voltage values are with respect to GND.  
recommended operating conditions  
MIN  
NOM  
MAX  
UNIT  
V
Supply voltage, V  
4.5  
5
5.5  
DD  
CLK, CLK  
V
–1  
V
V
V
+0.5  
V
DD  
DD  
DD  
DD  
High-level Input voltage, V  
IH  
Other inputs  
CLK, CLK  
2
0.5  
0.5  
1.2  
+0.5  
1.6  
0.8  
V
V
Low-level Input voltage, V  
IL  
Other inputs  
V
Reference voltage, V  
ref  
1.235  
37.5  
523  
1.26  
V
Output load resistance, R  
L
FS ADJ resistor, R  
set  
Operating free-air temperature, T  
55  
125  
°C  
A
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TLC34058-110M  
24 COLOR PALETTE  
256  
×
SGLS075 – JANUARY 1994  
electrical characteristics over recommended ranges of supply voltage and operating free-air  
temperature, R = 523 , V = 1.235 V (unless otherwise noted)  
set  
ref  
PARAMETER  
TEST CONDITIONS  
MIN TYP  
MAX  
UNIT  
µA  
I
Input reference current  
10  
0.5  
ref  
f = 1 kHZ,  
See Figure 4  
C8 = 0.1 µF,  
%
k
Supply voltage rejection ratio  
SVR  
%V  
DD  
V
V
= 5 V,  
T
= 20°C  
195  
DD  
A
I
I
I
Supply current  
mA  
DD  
= 5.5 V,  
T
A
= 55°C  
550  
10  
DD  
CLK, CLK  
V = V  
I
µA  
µA  
µA  
µA  
pF  
pF  
V
CC  
High-level input current  
Low-level input current  
IH  
IL  
Other inputs  
CLK, CLK  
V = 2.4 V  
I
10  
V = 0 V  
I
10  
10  
20*  
20*  
Other inputs  
V = 0.8 V  
I
C
C
Input capacitance, digital  
f = 1 MHz,  
f = 1 MHz,  
V
V
= 1 V  
= 1 V  
4
4
i
I(PP)  
Input capacitance, CLK, CLK  
High-level output voltage, D0D7  
Low-level output voltage, D0D7  
High-impedance-state output current  
Output impedance  
i(CLK)  
OH  
OL  
I(PP)  
V
V
I
I
= 800 µA  
2.4  
OH  
= 6.4 mA  
0.4  
10  
V
OL  
I
µA  
kΩ  
pF  
OZ  
z
50  
13  
o
C
Output capacitance (f = 1 MHz, I = 0)  
20*  
o
O
* On products compliant to MIL-STD-883, Class B, this parameter is not production tested.  
All typical values are at T = 25°C.  
A
timing requirements over recommended ranges of supply voltage and operating free-air  
temperature, R = 523 , V = 1.235 V (see Note 2)  
set  
ref  
MIN  
MAX  
110  
UNIT  
MHz  
MHz  
ns  
Clock frequency  
LD frequency  
27.5  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
Setup time, R/W, C0, C1 high before CE↓  
Setup time, write data before CE↑  
Setup time, pixel and control  
Hold time, R/W, C0, C1 high after CE↓  
Hold time, write data after CE↑  
Hold time, pixel and control  
Pulse duration, CE low  
0
35  
3
su1  
su2  
su3  
h1  
ns  
ns  
15  
3
ns  
ns  
h2  
2
ns  
h3  
50  
25  
4
ns  
w1  
w2  
w3  
w4  
w5  
w6  
c1  
Pulse duration, CE high  
ns  
Pulse duration, CLK high  
Pulse duration, CLK low  
ns  
4
ns  
Pulse duration, LD high  
15  
15  
9.09  
36.36  
ns  
Pulse duration, LD low  
ns  
Clock cycle time  
ns  
LD cycle time  
ns  
c2  
See Figures 1 and 2.  
NOTE 2: TTL input signals are 0 to 3 V with less than 3 ns rise/fall times between 10% and 90% levels. ECL input signals are V  
1.8 V to  
DD  
V
0.8 V with less than 2 ns rise/fall times between 20% and 80% levels. For input and output signals, timing reference points are  
DD  
at the 50% signal level. Analog output loads are less than 10 pF. D0D7 output loads are less than 40 pF.  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TLC34058-110M  
256 24 COLOR PALETTE  
×
SGLS075 – JANUARY 1994  
operating characteristics over recommended ranges of supply voltage and operating free-air  
temperature, R  
= 523 , V = 1.235 V (unless otherwise noted)  
set  
ref  
analog outputs  
PARAMETER  
MIN TYP  
MAX  
±1  
UNIT  
LSB  
LSB  
E
E
Integral linearity error (each DAC)  
Differential linearity error  
Gray-scale error  
L
±1  
D
±5%  
20.4  
18.5  
1.9  
White level relative to blank  
White level relative to black  
Black level relative to blank  
Blank level on IOR, IOB  
Blank level on IOG  
17.69 19.05  
16.74 17.62  
mA  
0.95  
10  
6.29  
10  
1.44  
5
I
O
Output current  
50  
µA  
mA  
µA  
µA  
7.6  
5
8.96  
50  
Sync level on IOG  
LSB size  
69.1  
2%  
DAC to DAC matching  
Output compliance voltage  
5%  
1.2  
–1  
V
All typical values are at T = 25°C.  
A
switching characteristics over recommended ranges of supply voltage and operating free-air  
temperature, R  
= 523 , V = 1.235 V (see Note 2)  
set  
ref  
PARAMETER  
MIN  
TYP  
MAX  
UNIT  
ns  
t
t
t
t
t
t
CE low to data bus enabled  
10  
en1  
en2  
dis  
d
CE low to data valid  
75  
15  
ns  
CE high to data bus disabled  
ns  
Analog output delay time (see Note 3)  
Analog output transition time (see Note 4)  
Analog output settling time (see Note 5)  
Glitch impulse (see Note 6)  
10  
2
ns  
ns  
t
9
ns  
s
50  
0
pV-s  
Analog output skew  
Pipeline delay  
ns  
2
clock  
cycles  
6
10  
NOTES: 2. TTL input signals are 0 to 3 V with less than 3 ns rise/fall times between 10% and 90% levels. ECL input signals are V  
1.8 V  
DD  
0.8 V with less than 2 ns rise/fall times between 20% and 80% levels. For input and output signals, timing reference points  
to V  
DD  
are at the 50% signal level. Analog output loads are less than 10 pF. D0D7 output loads are less than 40 pF.  
3. Measured from 50% point of rising clock edge to 50% point of full-scale transition  
4. Measured between 10% and 90% of full-scale transition  
5. Measured from 50% point of full-scale transition to output settling within ± 1  
6. Glitch impulse includes clock and data feedthrough. The 3-dB test bandwidth is twice the clock rate.  
8
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TLC34058-110M  
24 COLOR PALETTE  
256  
×
SGLS075 – JANUARY 1994  
PARAMETER MEASUREMENT INFORMATION  
t
h1  
t
su1  
R/W, C0, C1  
CE  
t
w1  
50%  
50%  
50%  
t
w2  
t
en2  
t
dis  
t
en1  
D0D7 (read)  
D0D7 (write)  
t
su2  
t
h2  
Figure 1. Read/Write Timing Waveform  
t
c2  
t
t
w6  
w5  
LD  
50%  
50%  
Data  
50%  
P0 P7 (AB),  
50%  
50%  
OL0OL1 (AB),  
SYNC, BLK  
t
d
t
s
90%  
t
su3  
t
h3  
50%  
10%  
IOR, IOG, IOB  
t
t
t
c1  
t
w3  
CLK  
50%  
50%  
50%  
t
w4  
Figure 2. Video Input/Output Timing Waveform  
9
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TLC34058-110M  
256 24 COLOR PALETTE  
×
SGLS075 – JANUARY 1994  
PARAMETER MEASUREMENT INFORMATION  
RED/BLUE  
GREEN  
mA V  
mA  
V
White Level  
19.05 0.714 26.67 1.000  
92.5 IRE  
Black Level  
Blank Level  
1.44 0.054 9.05 0.340  
0.00 0.000 7.62 0.286  
7.5 IRE  
40 IRE  
Sync Level  
0.00  
0.00  
NOTE: The IRE (Institute of Radio Engineers – now IEEE) scale is used for defining the relative voltage levels of the sync, white, black, and blank  
levelsinamonitorcircuit. Thereferencewhitelevelissetat100IREunits. TheblankinglevelissetatφIREunits. OneIREunitisequivalent  
to 1/100 of the difference between the reference white level and the blanking level.  
Figure 3. Composite Video Output Waveforms  
COMP  
C8  
L1  
V
DD  
5 V (V  
)
DD  
C5C7  
C9  
C2C4  
R4  
C1  
REF  
C10  
TLC34058  
Z1  
GND  
GND  
R
R1  
R2  
R3  
set  
FS ADJ  
IOR  
To  
Video  
Connector  
IOG  
IOB  
LOCATION  
DESCRIPTION  
0.1-µF ceramic capacitor  
VENDOR PART NUMBER  
C1C4, C8, C9  
Erie RPE112Z5U104M50V  
C5C7  
C10  
0.01-µF ceramic chip capacitor AVX 12102T903QA1018  
33-µF tantalum capacitor  
ferrite bead  
Mallory CSR13-K336KM  
Fair-Rite 2743001111  
Dale CMF-55C  
L1  
R1, R2, R3  
R4  
75-1% metal film resistor  
1000-1% metal film resistor  
523-1% metal film resistor  
1.2-V diode  
Dale CMF-55C  
R
set  
Z1  
Dale CMF-55C  
National Semiconductor  
LM385Z-1.2  
NOTE: The above listed vendor numbers are listed only as a guide. Substitution of devices with  
similar characteristics does not degrade the performance of the TLC34058.  
Figure 4. Circuit Diagram  
10  
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TLC34058-110M  
24 COLOR PALETTE  
256  
×
SGLS075 – JANUARY 1994  
PARAMETER MEASUREMENT INFORMATION  
5 V  
220 Ω  
5 V  
CLK  
CLK  
330 Ω  
5 V  
220 Ω  
Monitor  
Products  
970E  
CLK  
LDA  
CLK  
Clock  
Generator  
330 Ω  
TLC34058  
LD  
5 V  
0.1 µF  
1 kΩ  
V
ref  
REF  
Figure 5. Generating the Clock, Load, and Voltage-Reference Signals  
V
DD  
G0G7  
15 PF  
C (stray + load)  
BLK  
R
L
SYNC  
(IOG only)  
Figure 6. Equivalent Circuit of the Current Output (IOG)  
11  
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×
SGLS075 – JANUARY 1994  
APPLICATION INFORMATION  
device ground plane  
Use of a four-layer PC board is recommended. All the ground pins, voltage reference circuitry, power supply  
bypass circuitry, analog output signals, and digital signals as well as any output amplifiers should have a  
common ground plane.  
device analog power plane (APP)  
Thedeviceplusassociatedanalogcircuitryshouldhaveaseparateanalogpowerplane(APP)forV .TheAPP  
DD  
powers the device, voltage reference circuitry, and any output amplifiers. It is connected to the overall PCB  
power plane (V ) at a single point through a ferrite bead, which should be within three inches of the device.  
DD  
This connection is shown in Figure 4.  
PCB power plane and PCB ground plane  
The PCB power plane powers the digital circuitry. The PCB power plane and PCB ground planes should not  
overlay the APP unless the plane-to-plane noise is common mode.  
supply decoupling  
Bypass capacitors should have the shortest possible lead lengths to reduce lead inductance. For best results,  
connect a parallel combination of 0.1-µF ceramic and 0.01-µF chip capacitors from each V  
to GND. If chip  
DD  
capacitors are not feasible, radial-lead ceramic capacitors may be substituted. These capacitors should be  
located as close to the device as possible.  
The performance of the internal power supply noise-rejection circuitry decreases with noise frequency. If a  
switching power supply is used for V , close attention must be paid to reducing power supply noise. To reduce  
DD  
such noise, power the APP with a three-terminal voltage regulator.  
digital interconnect  
Isolate the digital inputs from the analog outputs and other analog circuitry as much as possible. Shielding the  
digital inputs reduces noise on the power and ground lines. Minimize the lengths of clock and data lines to  
prevent high-frequency clock and data information from inducing noise into the analog part of the video system.  
Active termination resistors for the digital inputs should be connected to the PCB power plane, not the APP.  
Ensure that these digital inputs do not overlay the device ground plane.  
analog signal interconnect  
Minimizing the lead lengths between groups of V  
and GND minimizes inductive ringing. To minimize noise  
DD  
pickup due to reflections and impedance mismatch, locate the device as close to the output connectors as  
possible. The external voltage reference should also be as close to the device as possible to minimize noise  
pickup. To maximize high-frequency supply voltage rejection, overlay the video output signals to the device  
ground plane and not the APP.  
Each analog output has a 75-load resistor connected to GND for maximum performance. To minimize  
reflections, the resistor connections between current output and ground should be as close to the device as  
possible.  
12  
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256  
×
SGLS075 – JANUARY 1994  
APPLICATION INFORMATION  
clock interfacing  
To facilitate the generation of high-frequency clock signals, CLK and CLK are designed to accept differential  
signals that can be generated with 5-V (single-supply) ECL logic. Due to noise margins of the CMOS process,  
CLK and CLK must be differential signals. Connecting a single-ended clock signal to CLK and connecting CLK  
to GND does not work. CLK and CLK require termination resistors (220 to V and 330 to GND) that should  
DD  
be as close to the device as possible.  
LD is typically generated by dividing the clock frequency by four (4:1 multiplexing) or five (5:1 multiplexing) and  
translating the resulting signal to TTL levels. Since no phase relationship between the LD and CLK signals is  
required, any propagation delay in LD caused by the divider circuitry does not affect device performance.  
The pixel, overlay, sync, and blank data are latched on the rising edge of LD. LD may also be used as the shift  
clock for the video DRAMs. In short, LD provides the fundamental timing for the video system.  
The Bt438 clock generator (from Brooktree) is recommended for generating the CLK, CLK, LD, and REF  
signals. It supports both 4:1 and 5:1 multiplexing. Alternately, the Bt438 can interface the device to a TTL clock.  
Figure 5 illustrates the interconnection between the Bt438 and the device.  
13  
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TLC34058-110M  
256 24 COLOR PALETTE  
×
SGLS075 – JANUARY 1994  
PRINCIPLES OF OPERATION  
microprocessor-unit (MPU) interface  
As shown in the functional block diagram, the MPU has direct access to the internal control registers and color  
overlay palettes via a standard MPU interface. Since the palette-RAM and overlay registers have dual ports,  
they can be updated without affecting the display refresh process. One port is allocated for updating or reading  
data and the other for display.  
palette-RAM write or read  
The palette-RAM location is addressed by the internal 8-bit address register (ADDR0ADDR7). The MPU can  
either write to or read from this register. The register eliminates the need for external address multiplexers.  
ADDR0ADDR7 are updated via D0D7. To address the red, green, and blue part of a particular RAM location,  
the internal address register is provided with two additional bits, ADDRa and ADDRb. These address bits count  
modulo 3 and are reset to 0 when the MPU accesses the internal-address register.  
After writing to or reading from the internal-address register, the MPU executes three write or read cycles (red,  
green, and blue). The register ADDRab is incremented after each of these cycles so that the red, green, and  
blue information is addressed from the correct part of the particular RAM location. During the blue write cycle,  
the red, green, and blue color information is adjoined to form a 24-bit word, which is then written to the particular  
RAM location. After the blue write/read cycle, the internal address register bits ADDR0ADDR7 are  
incremented to access the next RAM location. For an entire palette-RAM write or read, the bits ADDR0ADDR7  
are reset to 00 after accessing the FF (256) palette-RAM location.  
Two additional control bits, C0 and C1, are used to differentiate the palette-RAM read/write function from other  
operations that utilize the internal-address register. C0 and C1 are respectively set high and low for writing to  
or reading from the palette RAM. Table 1 summarizes this differentiation, along with other internal-  
address-register operations. C0 and C1 are each set low for writing to or reading from the internal-address  
register.  
14  
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256  
×
SGLS075 – JANUARY 1994  
PRINCIPLES OF OPERATION  
Table 1. Writing to or Reading From Palette RAM  
R/W C1 C0 ADDRb  
ADDRa  
FUNCTION  
L
L
L
L
L
L
L
H
H
X
L
L
X
L
Write ADDR0–ADDR7: D0D7 ADDR0ADDR7; 0 ADDRa,b  
Write red color: D0D7 RREG; increment ADDRa,b  
Write green color: D0D7 GREG; increment ADDRa,b  
H
Write blue color: D0D7 BREG; increment ADDRa,b; increment ADDR0ADDR7; write  
paletteRAM  
L
L
H
H
L
H
H
H
H
L
L
L
L
L
H
H
H
X
L
X
L
Read ADDR0ADDR7: ADDR0ADDR7 D0D7; 0 ADDRa,b  
Read red color: R0R7 D0D7; increment ADDRa,b  
L
H
L
Read green color: G0G7 D0D7; increment ADDRa,b  
H
Read blue color: B0B7 D0D7; increment ADDRa,b; increment ADDR0ADDR7  
X = irrelevant  
overlay-register write/read  
With a few exceptions, the overlay-register operation is identical to the palette-RAM write/read operation (refer  
to the palette-RAM write/read section). Upon writing to or reading from the internal-address register, the  
additional-address register ADDRab is automatically reset to 0. ADDRab counts modulo 3 as the red, green,  
and blue information is written to or read from a particular overlay register. The four overlay registers are  
addressed with internal-address-register values 0003. After writing/reading blue information, the  
internal-address register bits ADDR0ADDR7 are incremented to the next overlay location. After accessing  
overlay register value 03, the internal address register does not reset to 00 but is advanced to 04.  
For writing to or reading from the internal-address register, C0 and C1 are set low. When accessing the overlay  
registers, C0 and C1 are set high. Refer to Table 2 for a quick reference.  
Table 2. Writing to or Reading From Overlay Registers  
R/W  
C1  
L
C0  
L
ADDRb  
ADDRa  
FUNCTION  
Write ADDR0ADDR7: D0D7 ADDR0–7; 0 ADDRa,b  
Write red color: D0D7 RREG; increment ADDRa,b  
Write green color: D0D7 GREG; increment ADDRa,b  
L
L
L
X
L
L
X
L
H
H
H
H
H
Write blue color: D0D7 BREG; increment ADDRa,b; increment ADDR0ADDR7; write  
overlay register  
L
H
H
H
L
H
H
H
H
L
H
H
H
L
H
H
H
X
L
X
L
Read ADDR0ADDR7: ADDR0ADDR7 D0D7; 0 ADDRa,b  
Read red color: R0R7 D0D7; increment ADDRa,b  
L
H
L
Read green color: G0G7 D0D7; increment ADDRa,b  
H
Read blue color: B0B7 D0D7; increment ADDRa,b; increment ADDR0ADDR7  
X = irrelevant  
15  
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TLC34058-110M  
256 24 COLOR PALETTE  
×
SGLS075 – JANUARY 1994  
PRINCIPLES OF OPERATION  
control-register write/read  
The four control registers are addressed with internal-address-register values 0407. On writing to or reading  
from the internal-address register, the additional address bits ADDRab are automatically reset to 0. To facilitate  
read-modify-write operations, the internal-address register does not increment after writing to or reading from  
the control registers. All control registers may be accessed at any time. When accessing the control registers,  
C0 and C1 are respectively set low and high. Refer to Table 3 for a quick reference.  
Table 3. Writing to or Reading From Control Registers  
R/W  
C1  
L
C0  
L
ADDRba  
ADDRab  
FUNCTION  
L
X
L
X
L
X
L
X
L
Write ADDR0ADDR7: D0D7 ADDR0ADDR7; 0 ADDRa,b  
Write control register: D0D7 control register  
L
H
L
L
H
L
Read ADDR0ADDR7: ADDR0ADDR7 D0D7; 0 ADDRa,b  
Read control register: control register D0D7  
H
H
L
X = irrelevant  
summary of internal-address-register operations  
Table4providesasummaryofoperationsthatusetheinternal-addressregister. Figure1presentstheread/write  
timing for the device. If an invalid address is loaded into the internal-address register, the device ignores  
subsequent data from the MPU during a write operation and sends incorrect data to the MPU during a read  
operation.  
Table 4. Internal-Address-Register Operations  
INTERNAL-ADDRESS-  
REGISTER VALUE  
(ADDR0ADDR7) (HEX)  
ADDRab  
(COUNTS  
MODULO 3)  
C1  
C0  
MPU ACCESS  
COLOR  
00  
01  
11  
Red value  
Green value  
Blue value  
Red value  
Green value  
Blue value  
00FF  
0003  
L
H
Color-palette RAM  
00  
01  
110  
H
H
Over color 0 to 3  
04  
05  
06  
07  
H
H
H
H
L
L
L
L
Read-mask register  
Blink-mask register  
Command register  
Test register  
interruption of display-refresh pixel data (via simultaneous pixel-data retrieval and MPU write)  
If the MPU is writing to a particular palette-RAM location or overlay register (during the blue cycle) and the  
display-refresh process is accessing pixel data from the same RAM location or overlay register, one or more  
pixels on the display screen may be disturbed. If the MPU write data is valid during the complete chip-enable  
period, a maximum of one pixel is disturbed.  
16  
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TLC34058-110M  
24 COLOR PALETTE  
256  
×
SGLS075 – JANUARY 1994  
PRINCIPLES OF OPERATION  
frame-buffer interface and timing  
An internal latch and multiplexer enables the frame buffer to send the pixel data to the device at TTL rates. On  
the rising edges of LD, information for four or five consecutive pixels is latched into the device. This information  
includes the palette-RAM address (up to 8 bits), the overlay-register address (up to 2 bits), and the sync and  
blank information for each of the four or five consecutive pixels. The timing diagram for this pixel-data input  
transfer is shown in Figure 2, along with the video output waveforms (IOR, IOG, and IOB). With this architecture,  
the sync and blank timing can only be recognized with four- or five-pixel resolution.  
The display-refresh process follows the first-in first-out format. Color data is output from the device in the same  
order in which palette RAM and overlay addresses are input. This process continues until all four or five pixels  
have been output, at which point the cycle repeats.  
The overlay timing can be controlled by the pixel timing; however, this approach requires that the frame buffer  
emit additional bit planes to control the overlay selection on a pixel basis. Alternately, the overlay timing can be  
controlled by external-character or cursor-generation timing (see the color selection section).  
No phase relationship between the LD and CLK signals is required (see Figure 2). Therefore, the LD signal can  
bederivedbyexternallydividingtheCLKsignalbyfourorfive. AnypropagationdelayinLDcausedbythedivider  
circuitry does not render the device nonfunctional. Regardless of the phase relationship between LD and CLK,  
the pixel, overlay, sync, and blank data are latched on the rising edge of LD.  
The device has an internal load signal (not brought out to a pin) that is synchronous to CLK and follows LD by  
at least one and not more than four clock cycles. This internal load signal transfers the LD-latched data into a  
second set of latches, which are then internally multiplexed at the pixel clock or CLK signal frequency.  
For 4:1 or 5:1 multiplexing, a rising edge of LD should occur every four or five clock cycles. Otherwise, the  
internal load signal generation circuitry cannot lock onto or synchronize with LD.  
color selection  
The read mask, blink mask, and command registers process eight bits of color information (P0P7) and two  
bits of overlay information (OL0OL1) for each pixel every clock cycle. Control registers allow individual bit  
planes to be enabled/disabled for display and/or blinked at one of four blink rates and duty cycles (see the  
command register section, bits CR4CR5).  
By monitoring the BLK input to determine vertical retrace intervals, the device ensures that a color change due  
to blinking occurs only during the nonactive display time. A color change does not occur in the middle of the  
screen. A vertical retrace is sensed when BLK is low for at least 256 LD cycles. The color information is then  
selected from the palette RAM or overlay registers in accordance with the processed input pixel data.  
Table 5 presents the effect of the processed input pixel data upon color selection. P0 is the least significant bit  
(LSB) of the color-palette RAM. When CR6 is high and both OL1 and OL0 are low, color information resides in  
the color-palette RAM. When CR6 is low or either of the overlay inputs is high, the overlay registers provide the  
DAC inputs.  
17  
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TLC34058-110M  
256 24 COLOR PALETTE  
×
SGLS075 – JANUARY 1994  
PRINCIPLES OF OPERATION  
Table 5. Input Pixel Data Versus Color Selection  
COMMAND-  
REGISTER  
BIT  
OVERLAY-  
SELECT  
INPUT  
COLOR  
ADDRESS  
(HEX)  
COLOR  
INFORMATION  
CR6  
OL1  
OL0  
P7P0  
00  
01  
H
L
L
Color palette entry 00  
Color palette entry 01  
H
L
L
H
L
L
L
H
H
L
L
H
L
H
FF  
XX  
XX  
XX  
XX  
Color palette entry FF  
Overlay register 0  
Overlay register 1  
Overlay register 2  
Overlay register 3  
L
X
X
X
X = irrelevant  
video generation  
The TLC34058 presents eight bits of red, green, and blue information from either the palette RAM or overlay  
registers to the three 8-bit DACs during every clock cycle. The DAC outputs produce currents that correlate to  
their respective color input data. These output currents are translated to voltage levels that drive the color CRT  
monitor. The SYNC and BLK signals adjust the DAC analog output currents to generate specific output levels  
that are required in video applications. Table 6 shows the effect of SYNC andBLKupontheDACoutputcurrents.  
Figure 3 presents the overall composite video output waveforms. Only the green output (IOG) contains sync  
information.  
TheDACarchitectureensuresmonotonicityandreducedswitchingtransientsbyusingidenticalcurrentsources  
and routing their outputs to the DAC current output or GND. Utilizing identical current sources eliminates the  
need for precision component ratios within the DAC ladder circuitry. An on-chip operational amplifier stabilizes  
the DAC full-scale output current over temperature and power supply variations.  
Table 6. Effects of SYNC and BLK Upon DAC Output Currents (see Note 7)  
IOG  
(mA)  
IOR, IOB  
(mA)  
DAC  
INPUTS  
DESCRIPTION  
SYNC  
BLK  
White  
Data  
26.67  
data + 9.05  
data + 1.44  
9.05  
19.05  
H
H
L
H
H
H
H
H
L
FF  
data  
data  
00  
data + 1.44  
Data w/o SYNC  
Black  
data + 1.44  
1.44  
1.44  
0
H
L
Black w/o SYNC  
Black  
1.44  
00  
7.62  
H
L
xx  
SYNC  
0
0
L
xx  
NOTE 7: The data in this table is measured with full-scale IOG current = 26.67 mA, R  
= 523 ,  
set  
V
ref  
= 1.235 V.  
command register  
The MPU can write to or read from the command register at any time. The command register is not initialized.  
CR0 corresponds to the D0 data bus line. Refer to Table 7 for a quick reference.  
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×
SGLS075 – JANUARY 1994  
PRINCIPLES OF OPERATION  
Table 7. Command Register  
COMMAND-  
REGISTER  
BIT  
COMMAND-REGISTER  
BIT FUNCTION  
COMMAND-REGISTER BIT DESCRIPTION  
CR7  
Multiplex-select bit  
This bit selects either 4:1 or 5:1 multiplexing for the palette RAM and overlay-register address,  
low: selects 4:1 multiplexing SYNC, and BLK inputs. If 4:1 multiplexing is selected, the device ignores the E palette RAM and  
high: selects 5:1 multiplexing overlay-register-address inputs. These inputs should be connected to GND, and the LD signal  
frequency should be 1/4 of the clock frequency. If 5:1 is specified, all of the palette RAM and  
overlay-register-address inputs are used and the LD signal should be 1/5 of the clock frequency.  
CR6  
RAM-enable bit  
low: use overlay register 0  
high: use palette RAM  
When the overlay select bits (OL0 and OL1) are both low, this bit causes the DACs color  
information to be selected from overlay register 0 or the palette RAM.  
CR5, CR4  
Blink-rate-select bits  
These two bits select the blink-rate cycle time and duty cycle. The on and off numbers specify  
the blink-rate cycle time as the number of vertical periods. The numbers in parentheses specify  
the duty cycle in (on/off) percent.  
00: 16 on, 48 off (25/75)  
01: 16 on, 16 off (50/50)  
10: 32 on, 32 off (50/50)  
CR3  
CR2  
CR1  
CR0  
OL1 blink-enable bit  
low: disable blinking  
high: enable blinking  
If this bit is a high, the OL1 (AE) inputs toggle between a logic 0 and their input value at the  
selected blink rate before latching the incoming pixel data. Simultaneously, command-register  
CR1 must be set high. If the CR2 bit is low, the OL0 (AE) inputs are unaffected.  
OL0 blink-enable bit  
low: disable blinking  
high: enable blinking  
If this bit is high, the OL0 (AE) inputs toggle between a logic 0 and their input value at the  
selected blink rate before latching the incoming pixel data. Simultaneously, command-register  
CR0 must be set high. If the CR2 bit is low, the OL0 (AE) inputs are unaffected.  
OL1 display-enable bit  
low: disable  
high: enable  
If this bit is low, the OL1 (AE) inputs are forced to a logic 0 before latching the incoming pixel  
data. If the CR1 bit is high, the OL1 (AE) inputs are affected.  
OL0 display-enable bit  
low: disable  
If this bit is low, the OL0 (AE) inputs are forced to a logic 0 before latching the incoming pixel  
data. If the CR0 bit is high, the OL0 (AE) inputs are affected.  
high: enable  
read-mask register  
The read-mask register is used to enable (high) or disable (low) the eight bit planes (P0P7) within the  
palette-RAM addresses. The enabling or disabling is accomplished by logic ANDing the read-mask register with  
the palette-RAM address before addressing the palette RAM. Read-mask register bit 0 corresponds to data-bus  
line D0. The MPU can write to or read from this register at any time. This register is not initialized.  
blink-mask register  
The blink-mask register is used to enable (high) or disable (low) the blinking of bit planes within the palette-RAM  
addresses. For example, if blink-mask register bit n is set high, the true Pn value addresses the palette RAM  
during the on portion of the blink cycle. During the off part of the blink cycle, the Pn value is replaced with a 0  
before the palette RAM is addressed. The blink-rate cycle time and duty cycle is specified by command-register  
bits CR4 and CR5. If blink-mask-register bit n is set low, the true Pn value always addresses the palette RAM.  
Blink-mask-register bit 0 corresponds to data-bus line D0. This register is not initialized.  
19  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TLC34058-110M  
256 24 COLOR PALETTE  
×
SGLS075 – JANUARY 1994  
PRINCIPLES OF OPERATION  
test register  
The test register allows the MPU to read the inputs to the DAC for diagnostic purposes. The MPU can write to  
or read from this register at any time. This register is not initialized. Only the four least significant bits can be  
written to, while all eight bits can be read. Test-register bit 0 corresponds to data-bus line D0. A function  
description of this register is presented in Table 8.  
Table 8. Functional Description of Test Register  
TR3TR0  
0100  
D4D7  
FUNCTION  
4 MSBs of blue data input  
4 MSBs of green data input  
4 MSBs of red data input  
4 LSBs of blue data input  
4 LSBs of green data input  
4 LSBs of red data input  
0010  
MPU read or write D0D3  
0001  
1100  
1010  
MPU read D0D7  
1001  
To read the DAC inputs, the MPU must first load the test register four least significant bits. One of the test register  
bits, b0 (red DAC), b1 (green DAC), or b2 (blue DAC), must be set high and the other two bits low. This process  
determines whether the inputs to the red, green, or blue DAC are read. The test register bit b3 must be set high  
for reading the four most significant DAC inputs or low for reading the four least significant inputs. The MPU then  
readsthetestregisterwhilethetestregister’sfourleastsignificantbitscontainthepreviouslywritteninformation.  
Either the device clock must be slowed down to the MPU cycle time or the same pixel and overlay data must  
be continuously presented to the device during the entire MPU read cycle.  
Printed in U.S.A.  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SGLS075  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
IMPORTANT NOTICE  
Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor  
product or service without notice, and advises its customers to obtain the latest version of relevant information  
to verify, before placing orders, that the information being relied on is current.  
TI warrants performance of its semiconductor products and related software to the specifications applicable at  
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are  
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each  
device is not necessarily performed, except those mandated by government requirements.  
Certain applications using semiconductor products may involve potential risks of death, personal injury, or  
severe property or environmental damage (“Critical Applications”).  
TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED  
TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS.  
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI  
products in such applications requires the written approval of an appropriate TI officer. Questions concerning  
potential risk applications should be directed to TI through a local SC sales office.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards should be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance, customer product design, software performance, or  
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either  
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property  
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Copyright 1996, Texas Instruments Incorporated  

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