TLC69611 [TI]

具有 60mA 16 通道集成电流阱的 Mini-LED 局部调光背光驱动器;


型号：	TLC69611
厂家：	TEXAS INSTRUMENTS
描述：	具有 60mA 16 通道集成电流阱的 Mini-LED 局部调光背光驱动器驱动驱动器
文件：	总11页 (文件大小：1622K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TLC69601, TLC69611, TLC69651, TLC69661

ZHCSS04 –APRIL 2023

TLC696x1 16 通道、局部调光背光LED 驱动器

1 特性

2 应用

• 工作电压V_CC范围：3V 至5.5V

• 16 个高精度恒定电流阱：

• LCD 局部调光背光：

– 电视

– 监视器

– 笔记本电脑

– 平板电脑

– 最大输出电流/电压：

• 30mA/20V：TLC69601

• 60mA/20V：TLC69611

• 30mA/50V：TLC69651

• 60mA/50V：TLC69661

– 器件间误差：±2%（典型值）

– 通道间误差：±2%（典型值）

• 灵活的调光控制：

3 说明

是一款 16 通道恒定电流阱驱动器。每个器件都集成了

16 个具有 SRAM（用于存储亮度）的恒定电流阱。该

器件在菊花链拓扑中通过两线制串行接口相互连接，支

持多达 1024 个器件，可用于 16,000 个局部调光区

域。

– 全局8 位最大电流(MC) 设置

– 亮度分辨率：高达15 位

– PWM/混合控制模式

为了优化系统效率，该器件配备了自适应余量电压控制

方案，以直接控制直流/直流。为了简化系统布局，只

需将串行链中最后一个器件的 FB 引脚连接到直流/直

流。该器件还集成了超低亮度更新延迟、插黑和 VRR

特性，以提高显示质量。

• 高速菊花链接口：

– I/O 电压兼容：1.8 V/3.3 V

– 数据传输速率：高达20MHz

• 高系统效率：

– 自适应余量电压控制(AHVC)

– 超低器件功耗：

• 待机模式：I_CC≤200μA

• 正常模式：I_CC≤3.5mA

• EMI 增强：

– 可编程接口驱动能力

– 集成四相相移方案

• 显示质量改进：

TLC696x1 有三个错误标志：用于诊断的 LED 开路检

测 (LOD)、LED 短路检测 (LSD) 和热关断检测

(TSD)。该器件实现了两个回读选项（包括 UART/INT

和SOUT/CLK_O），可通过寄存器进行编程。

器件信息

封装⁽¹⁾

器件型号

封装尺寸（标称值）

1.58 mm × 2.43 mm

4mm x 4mm

DSBGA (24)

WQFN (24)

TLC696x1

– 超低亮度更新延迟

– 可编程插黑

– 无闪烁的可变刷新率(VRR)

• 诊断：

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

– 每个区域的LED 开路/短路检测

– 器件热关断检测

– 报告界面选项：

• UART 和中断引脚(INT)

• 两线制输出：CLK_O 和SOUT

VLED

C_VLED

OUT7

LED

DC-DC

OUT0

GND

OUT15

GND

OUT0

GND

OUT15

GND

CLK_I

SIN

VCC SOUT CLK_O

CLK_I

SIN

VCC SOUT CLK_O

VCC

简化原理图

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLVSHB7

TLC69601, TLC69611, TLC69651, TLC69661

ZHCSS04 –APRIL 2023

www.ti.com.cn

Table of Contents

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 1

4 Revision History.............................................................. 2

5 Device and Documentation Support..............................3

5.1 接收文档更新通知....................................................... 3

5.2 支持资源......................................................................3

5.3 Trademarks.................................................................3

5.4 静电放电警告.............................................................. 3

5.5 术语表......................................................................... 3

6 Mechanical, Packaging, and Orderable Information....4

4 Revision History

注：以前版本的页码可能与当前版本的页码不同

DATE

REVISION

NOTES

April 2023

Initial Release

Submit Document Feedback

Product Folder Links: TLC69601 TLC69611 TLC69651 TLC69661

English Data Sheet: SLVSHB7

TLC69601, TLC69611, TLC69651, TLC69661

www.ti.com.cn

ZHCSS04 –APRIL 2023

5 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,

generate code, and develop solutions are listed below.

5.1 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新进行注册，即可每周接收产品信息更

改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

5.2 支持资源

TI E2E^™支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解

答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅

TI 的《使用条款》。

5.3 Trademarks

TI E2E^™is a trademark of Texas Instruments.

所有商标均为其各自所有者的财产。

5.4 静电放电警告

静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理

和安装程序，可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参

数更改都可能会导致器件与其发布的规格不相符。

5.5 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

Submit Document Feedback

Product Folder Links: TLC69601 TLC69611 TLC69651 TLC69661

English Data Sheet: SLVSHB7

TLC69601, TLC69611, TLC69651, TLC69661

ZHCSS04 –APRIL 2023

www.ti.com.cn

6 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Submit Document Feedback

Product Folder Links: TLC69601 TLC69611 TLC69651 TLC69661

English Data Sheet: SLVSHB7

PACKAGE OPTION ADDENDUM

www.ti.com

17-May-2023

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

TLC69601RTWR

TLC69601YBHR

TLC69611RTWR

TLC69651RTWR

TLC69661RTWR

ACTIVE

WQFN

DSBGA

WQFN

RTW

YBH

RTW

3000 RoHS & Green

NIPDAU

Level-1-260C-UNLIM

-40 to 85

69601

Samples

SNAGCU

NIPDAU

TLC69601

69611

69651

69661

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

17-May-2023

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

GENERIC PACKAGE VIEW

RTW 24

4 x 4, 0.5 mm pitch

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4224801/A

www.ti.com

PACKAGE OUTLINE

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK-NO LEAD

RTW0024B

4.15

3.85

4.15

3.85

PIN 1 INDEX AREA

0.8 MAX

SEATING PLANE

0.08 C

0.05

0.00

(0.2) TYP

2X 2.5

EXPOSED

THERMAL PAD

20X 0.5

SYMM

2.5

2.45±0.1

0.3

24X

0.18

0.5

PIN 1 ID

(OPTIONAL)

0.1

C A B

SYMM

0.05

24X

0.3

4219135/B 11/2016

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

www.ti.com

EXAMPLE BOARD LAYOUT

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK-NO LEAD

RTW0024B

(

2.45)

SYMM

24X (0.6)

24X (0.24)

(0.97)

SYMM

(3.8)

20X (0.5)

(R0.05)

TYP

(Ø0.2) TYP

VIA

(0.97)

(3.8)

LAND PATTERN EXAMPLE

SCALE: 20X

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

SOLDER MASK

OPENING

METAL

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

NON SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

4219135/B 11/2016

NOTES: (continued)

3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).

www.ti.com

EXAMPLE STENCIL DESIGN

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK-NO LEAD

RTW0024B

4X( 1.08)

(0.64) TYP

(R0.05) TYP

24X (0.6)

(0.64)

TYP

24X (0.24)

SYMM

(3.8)

20X (0.5)

METAL

TYP

SYMM

(3.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD 25:

78% PRINTED COVERAGE BY AREA UNDER PACKAGE

SCALE: 20X

4219135/B 11/2016

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

重要声明和免责声明

TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，

不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担

保。

这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。

这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。

您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成

本、损失和债务，TI 对此概不负责。

TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改

TI 针对 TI 产品发布的适用的担保或担保免责声明。

TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

TLC69611 [TI]

相关型号：

TLC69611RTWR

TLC69612

TLC69612RTWR

TLC69614

TLC69614RTWR

TLC69618

TLC69618RTWR

TLC69650

TLC69650RTWR

TLC69651

TLC69651RTWR

TLC69652