TLC976C [TI]

10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR; 10位, 20 MSPS ,区CCD信号处理器
TLC976C
型号: TLC976C
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR
10位, 20 MSPS ,区CCD信号处理器

CD
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TLC976C  
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR  
SLAS193 – OCTOBER 1998  
DGG PACKAGE  
(TOP VIEW)  
Correlated Double Sampling (CDS), AGC  
and High Speed 10-Bit ADC in a Single  
Package  
SHV  
GND1  
SHR  
1
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
5-V Analog Power Supply and 3.3-V Digital  
Power Supply  
VCC1  
2
BLK-PULSE  
OFFSET  
VCC3  
CLP2  
3
Power Down Mode  
DATA-IN  
PIN  
4
5
56-Pin TSSOP (DGG) Package with  
Multichip Module Assembly for Isolation  
DRIVE-OUT  
GND3  
AGCGAIN  
OBCLP  
AGCCLP  
SH-PULSE  
GND2  
6
7
CDS-STBY  
VRB-OUT  
VRT-OUT  
A-SUB  
8
CDS/AGC  
9
AGC Gain Range of 5 dB to 39 dB  
Black Level Clamp Circuit  
10  
11  
VCC2  
Direct Connection to ADC Input  
Voltage Reference for ADC  
D-SUB 12  
DVSS 13  
D0 14  
45 A-SUB  
44 DVDD  
43 AVSS  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
D1  
D2  
AVSS  
VIN  
Analog-to-Digital Converter  
10-Bit Resolution  
D3  
D-SUB  
AVSS  
VRB-IN  
VRB-IN  
VRT-IN  
VRT-IN  
AVSS  
AVDD  
AVDD  
AD-STBY  
OE  
Maximum Conversion Rate . . . 20 MSPS  
(MIN)  
D4  
DVSS  
DVDD  
D5  
Differential Nonlinearity . . . 0.75 LSB (TYP)  
Analog Input Voltage Range of 2 Vp-p  
3.3 V CMOS Digital Interface  
D6  
D7  
D8  
Applications  
D9  
PC Camera  
RESET  
DVSS  
AVDD  
Digital Camera  
Camcorder  
CLK  
CCD Scanner  
description  
The TLC976 is a multichip module (MCM) subsystem designed for interfacing Charge-Coupled Device (CCD)  
in camcorder and digital camera systems. The TLC976 includes correlated double sampler (CDS), automatic  
gain control (AGC), black level clamp circuit, 10 bit, 20 MSPS analog-to-digital converter (ADC), and internal  
reference voltage generator for ADC.  
The CDS/AGC can be connected directly to the ADC input or a separate signal can be connected directly to  
the ADC input. A power-down mode is provided.  
Assembled using the MCM process, the TLC976 provides isolation between the noisy digital domain and the  
noise sensitive analog signals. The CDS/PGA, black level clamps are on one die and the ADC is on a separate  
die. The separate dies significantly reduce the substrate noise to the analog section.  
The TLC976 comes in a 56-pin TSSOP package with 0,50 mm pin pitch. This is about 25% smaller than using  
two separate 32-pin quad flat packs (QFP).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1998, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC976C  
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR  
SLAS193 – OCTOBER 1998  
functional block diagram  
SHR SHV  
AGCGAIN AGCCLP OBCLP  
AGCCLP  
SH-PULSE  
SH  
SH  
PIN  
LPF  
SH  
AGC  
BLK  
BLK-PULSE  
VRB-OUT  
SH  
DATA-IN  
VRB  
VRT  
CLP1  
VRT-OUT  
CLP2  
CLP2  
CDS-STBY  
OFFSET  
DRV  
DRIVE-OUT  
RESET  
Auto  
Calibration  
Circuit  
Upper  
Data  
Latch  
Upper  
Sampling  
Comparators  
D9  
D8  
D7  
D6  
D5  
Upper  
Data  
Latch  
S&H  
VIN  
+
DAC  
Lower  
Data  
Latch  
Lower  
Sampling  
Comparators  
D4  
D3  
D2  
D1  
D0  
Lower  
Data  
Latch  
VRT-IN  
Reference  
Voltage  
VRB-IN  
AD-STBY  
OE  
Clock  
Generator  
CLK  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC976C  
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR  
SLAS193 – OCTOBER 1998  
Terminal Functions  
TERMINAL  
NAME  
AD-STBY  
I/O  
DESCRIPTION  
NO.  
31  
I
ADC standby mode  
L level in operation  
H level in standby mode  
AGCCLP  
AGCGAIN  
A-SUB  
49  
51  
I
I
AGC clamp capacitor (connect 0.1 µF to GND)  
AGC gain control  
11, 45  
28, 32, 33  
Analog GND  
AVDD  
ADC analog power supply  
Analog GND for ADC  
AVSS  
34, 39, 42,  
43  
BLK-PULSE  
CDS-STBY  
3
8
I
I
DRIVE-OUT terminal is clamped to 1.66 V internally when BLK-PULSE = L.  
CDS/AGC standby mode control  
L level in operation  
H level in standby mode  
CLK  
29  
54  
I
I
CLK input for ADC  
CLP2  
D0–D9  
CCD signal clamp control input  
14–18,  
21–25  
O
Digital data output, D0 (pin 14): LSB, D9 (pin 25): MSB  
DATA-IN  
DRIVE-OUT  
D-SUB  
DVDD  
53  
I
CCD signal input  
6
O
CDS/AGC output  
12, 40  
Analog GND  
20, 44  
ADC digital power supply  
Digital GND for ADC  
DVSS  
13, 19, 27  
GND1  
2
I
CDS/AGC analog GND  
CDS/AGC analog GND  
GND for CDS output circuit  
Control input for clamping optical black level after AGC  
ADC output enable  
GND2  
47  
7
GND3  
OBCLP  
OE  
50  
30  
I
I
L level in operation  
H level in Hi-Z  
OFFSET  
4
I
CDS/AGC output offset control:  
DC voltage at OFFSET pin  
DRIVE-OUT offset  
450 mV  
0 V  
0.5 V  
3 V  
280 mV  
550 mV  
PIN  
52  
26  
I
I
I
I
I
CCD signal input  
RESET  
SHV  
Reset for calibration circuit. Restart of startup calibration.  
CCD signal level sample clock input  
Sample and hold pulse input  
1
SH-PULSE  
SHR  
48  
56  
CCD reset level sample clock input  
CDS/AGC analog power supply  
CDS/AGC analog power supply  
CDS/AGC analog power supply  
ADC analog signal input  
VCC1  
55  
VCC2  
46  
VCC3  
5
VIN  
41  
I
O
I
VRB-OUT  
VRB-IN  
VRT-OUT  
VRT-IN  
9
ADC bottom reference voltage output (1.5 V typ)  
Connect to VRB-OUT  
37, 38  
10  
O
I
ADC top reference voltage output (3.5 V typ)  
Connect to VRT-OUT  
35, 36  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC976C  
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR  
SLAS193 – OCTOBER 1998  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Analog supply voltage, VCC1, VCC2, VCC3, AVDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . 0.4 V to 7 V  
Digital supply voltage, DVDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.4 V to 7 V  
Analog input voltage range, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.4 V to AVCC1, 2,3 + 0.5 V  
I
Continuous total power dissipation (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1344 mW  
Storage temperature range, T  
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . 260°C  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. All voltages are with respect to GND.  
2. For operation above 25°C free-air temperature, derate linearly at the rate of 10.75 mW/°C.  
recommended operating conditions  
MIN NOM  
MAX  
5.25  
3.6  
UNIT  
V
Analog supply voltage, VCC1, VCC2, VCC3, AVDD  
ADC digital output supply voltage, DVDD  
Difference, AGND to DGND  
4.75  
3
5
3.3  
V
–100  
2
100  
mV  
V
High-level input voltage  
Low-level input voltage  
0.8  
70  
V
ADC analog input voltage full scale range  
2
25  
25  
0
V
High level  
ADC CLK pulse width  
ns  
Low level  
Operating temperature  
°C  
electrical characteristics over recommended operating junction temperature range,  
AVCC = VCC13 = 4.75 V, DVDD = 3.3 V, VRT = 3.5 V, VRB = 1.5 V, Fs = 20 MSPS, T = 25°C (unless  
A
otherwise noted)  
total device  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
AGCGAIN = 0 V,  
STBY = 0 V  
VRT = VRB = Open,  
CDS/AGC supply current  
30  
38  
mA  
Digital supply  
Analog supply  
3
32  
6
35  
11  
ADC supply current  
NTSC ramp input  
mA  
CDS/AGC standby current  
ADC standby current  
CDS-STBY = High  
AD-STBY = HIGH,  
5.6  
mA  
mA  
CDS STBY = HIGH,  
0.5  
1
(VIN = VRT-IN = VRB-IN = Hi-Z)  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC976C  
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR  
SLAS193 – OCTOBER 1998  
electrical characteristics over recommended operating junction temperature range,  
AVCC = VCC13 = 4.75 V, DVDD = 3.3 V, VRT = 3.5 V, VRB = 1.5 V, Fs = 20 MSPS, T = 25°C (unless  
A
otherwise noted) (continued)  
CDS input/AGC  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
V
Input signal clamp voltage  
2.7  
High input  
Low input  
Minimum  
Maximum  
VIN = 3 V  
VIN = 0 V  
1
–1  
7
A
Input current for SHR, SHV, CLP2  
AGC gain  
µA  
AGCGAIN = 0 V  
AGCGAIN = 3 V  
5
dB  
34  
37  
39  
1
High-level input current, OBCLP, BLK pulse  
Low-level input current, OBCLP, BLK pulse  
CDS input clock frequency  
µA  
µA  
–1  
20  
MHz  
driver output  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
V
High  
Low  
OFFSET = 3 V  
OFFSET = 0 V  
0.55  
0.65  
Output offset voltage  
0.35 0.45  
V
Internal black level  
1.36  
1.66  
2
1.96  
V
Nominal signal voltage at DRIVE-OUT  
Vp-p  
reference voltage  
PARAMETER  
VRT output voltage  
VRB output voltage  
TEST CONDITIONS  
300 , AVDD = VCC13 = 4.75 V  
MIN  
3.47  
1.45  
TYP  
3.50  
1.50  
MAX  
3.53  
1.55  
UNIT  
V
V
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC976C  
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR  
SLAS193 – OCTOBER 1998  
electrical characteristics over recommended operating junction temperature range,  
AVCC = VCC1–3 = 4.75 V, DVDD = 3.3 V, VRT = 3.5 V, VRB = 1.5 V, Fs = 20 MSPS, T = 25°C (unless  
A
otherwise noted) (continued)  
A/D converter  
PARAMETER  
Integral non-linearity  
TEST CONDITIONS  
Fs = 20 MSPS, VIN = 1.8 V – 3.8 V  
MIN  
TYP  
MAX  
UNIT  
LSB  
LSB  
pF  
±1.5  
±2.5  
Differential non-linearity  
Analog input capacitance  
Reference voltage output current  
Reference voltage output impedance  
Zero scale offset error  
±0.75 ±1.25  
10  
6.5  
300  
20  
mA  
(VRT IN – VRB IN)  
mV  
mV  
µA  
Full scale offset error  
20  
High-level input current  
DVDD = MAX,  
DVDD = MAX,  
OE = GND,  
V
V
= DVDD  
= 0 V  
10  
IH  
Low-level input current  
10  
µA  
IL  
DVDD = MIN,  
High-level output current  
Low-level output current  
3
5
mA  
mA  
V
= DVDD – 0.5 V  
OH  
OE = GND,  
OL  
DVDD = MIN,  
V
= 0.4 V  
VDD–  
0.7V  
High-level output voltage  
DVDD = 3 V – 5.25 V,  
I
I
= 2 mA  
= 1 mA  
V
V
OH  
Low-level output voltage  
DVDD = 3 V – 5.25 V,  
OE = DVDD,  
0.8  
1
OL  
DVDD = MAX,  
High-level output leakage current  
µA  
V
OH  
= DVDD  
OE = DVDD,  
OL  
DVDD = MIN,  
Low-level output leakage current  
1
µA  
V
= 0 V  
DVDD–DGND  
VRT–VRB  
2.5  
1
Automatic starting calibration voltage  
V
A/D converter operating characteristics  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Sampling rate  
V
= 1.8 V – 3.8 V,  
Fin = 1 kHz ramp  
0.5  
20 MSPS  
MHz  
IN  
Analog input bandwidth (3 dB)  
Data output, propagation delay  
Differential gain  
10  
C
= 20 pF  
15  
ns  
L
1%  
0.3  
5
NTSC 40 IRE mod ramp, FS = 14.3 MSPS  
Differential phase  
Degree  
ns  
Sampling delay time  
Signal to noise ratio  
Fin = 1 MHz  
55  
dB  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC976C  
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR  
SLAS193 – OCTOBER 1998  
TYPICAL CHARACTERISTICS  
AGCGAIN  
vs  
VOLTAGE  
45  
40  
35  
30  
25  
20  
15  
10  
5
0
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7  
AGCGAIN – V  
3
Figure 1. AGC Characteristics  
OUTPUT OFFSET VOLTAGE  
vs  
OFFSET CONTROL VOLTAGE  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
–0.1  
–0.2  
–0.3  
–0.4  
–0.5  
0
0.5  
1
1.5  
2
2.5  
3
Control Voltage at OFFSET Pin (V)  
Figure 2. OFFSET IN Terminal Input/Output Characteristics  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC976C  
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR  
SLAS193 – OCTOBER 1998  
TYPICAL OPERATION  
Optical Black  
Dummy Black/Blanking Period  
Pixel Period  
Signal Period  
CCD Reset Feedthrough  
CCD Reset Level  
CCD Signal Level  
CCD Input  
SHR Input  
SHV Input  
2 µs  
(typ)  
CLP2 Input  
1.66 V  
Optical Black Level  
Black Level  
(Internal)  
AGC Output  
SH-Pulse  
(Input)  
OBCLP Input  
1.66 V  
(Internal) BLK  
10 µs  
(typ)  
BLK-PULSE  
(Input)  
1.66 V  
DRIVE-OUT  
(Output)  
Figure 3. CCD Input Mode Timing Diagram  
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC976C  
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR  
SLAS193 – OCTOBER 1998  
APPLICATION INFORMATION  
AV  
DD  
0.1 µF  
1
2
56  
55  
GND1  
V
CC1  
3
4
5
6
7
8
9
54  
53  
52  
51  
50  
49  
V
CC3  
0.1 µF  
GND3  
48  
47  
46  
0.1 µF  
10  
11  
GND2  
A-SUB  
D-SUB  
V
CC2  
12  
13  
45  
44  
A-SUB  
DV  
SS  
DV  
DD  
14  
15  
16  
17  
18  
43  
42  
41  
40  
39  
AGND  
AV  
AV  
SS  
SS  
D-SUB  
AV  
SS  
19  
20  
21  
22  
23  
24  
38  
37  
36  
35  
34  
33  
DV  
DV  
SS  
DD  
0.1 µF  
AV  
SS  
DD  
DD  
0.1 µF  
AV  
AV  
25  
26  
27  
28  
32  
31  
30  
29  
DV  
AV  
SS  
DD  
DGND  
DV  
DD  
NOTE A: A-SUB and D-SUB should be connected to Analog GND.  
Figure 4. Typical Connection Diagram  
Table 1. Standby, Output Enable  
PIN  
8
PIN NAME  
CDS-STBY  
AD-STBY  
OE  
FUNCTION  
Standby mode for CDS/AGC  
Standby mode for AD converter  
AD output  
OPERATION  
STAND-BY OR DISABLE  
L
L
L
H
H
H
31  
30  
9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC976C  
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR  
SLAS193 – OCTOBER 1998  
APPLICATION INFORMATION  
0.1 µF  
AGCCLP  
OBCLP  
SHR  
SH  
SHV  
SH  
AGCGAIN  
AGCCLP  
CCD-IN  
1 µF  
1 µF  
SH-PULSE  
PIN  
LPF  
SH  
AGC  
DATA-IN  
BLK-PULSE  
VRB-OUT  
BLK  
SH  
CLP1  
VRB  
VRT  
VRT-OUT  
CLP2  
CLP2  
CDS-STBY  
DRV  
OFFSET-IN  
DRIVE-OUT  
RESET  
Auto  
Calibration  
Circuit  
Upper  
Data  
Latch  
D9  
D8  
D7  
D6  
D5  
Upper  
Data  
Latch  
Upper  
Sampling  
Comparators  
(see  
Note A)  
S&H  
VIN  
DAC  
+
(see Note A)  
D4  
D3  
D2  
D1  
D0  
Lower  
Sampling  
Comparators  
Lower  
Data  
Latch  
Lower  
Data  
Latch  
VRT-IN  
VRB-IN  
Reference  
Voltage  
AD-STBY  
OE  
Clock  
Generator  
CLK  
NOTE A: The 0.1 µF capacitors are necessary when you need to protect the noise.  
Figure 5. Typical Application  
10  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC976C  
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR  
SLAS193 – OCTOBER 1998  
PRINCIPLES OF OPERATION  
CDS/AGC signal processor  
The output from the CCD sensor is first fed to a correlated double sampler (CDS). The CCD signal is sampled  
and held during both the reset reference interval and the video signal interval. By subtracting two resulting  
voltage levels, the CDS removes low frequency noise from the output of the CCD sensor. Two sample/hold  
control pulses (SHR and SHV) are required to perform the CDS function.  
The CCD output is capacitively coupled to the TLC976. The AC coupling capacitor is clamped to establish  
proper dc bias during the dummy pixel interval by the CLP2 input. The bias at the input to the TLC976 is set  
to 2.7 V at V  
= 4.75 V. Normally, the CLP2 is applied at the sensor’s line rate.  
CC  
The signal is sent to AGC after the CDS function is complete. The AGC gain can be adjusted from 5 dB to 39  
dB by applying variable dc voltage from 0 V to 3 V at the AGCGAIN terminal.  
A low-pass filter is installed at the AGC output to improve signal-to-noise ratio. After its output settles, it is  
sampled and held by the SH-PULSE input for digitization. The SH-PULSE should synchronize with the ADC  
clock.  
The basic black level reference is established by clamping the AGC output to 1.66 V internally by the OBCLP  
input during the optical black pixel period. A capacitor of 0.1 µF should be connected to the AGCCLP pin.  
To prevent the black level from falling below the basic black level (1.66 V) during the blanking period, the AGC  
outputleveliskeptat1.66VbytheBLKPULSEinput. ItisrecommendedthattheBLKPULSEbekeptlowduring  
the entire blanking period.  
The DRV block drives the ADC and adjusts the signal offset at the DRIVE OUT output. The offset can be  
adjusted from –450 mV to 550 mV by applying control voltage on the OFFSET pin.  
The VRT (3.5 V) and VRB (1.5 V) outputs provide voltage references for the ADC. They should be connected  
to the VRT-IN and VRB-IN input pins externally.  
analog-to-digital converter (ADC)  
The A/DC in the TLC976 performs high-speed analog-to-digital conversion with 10-bit resolution using  
semi-flash technique. The latency of the data output valid is 2.5 clocks.  
Table 2. ADC Output Code  
DIGITAL OUTPUT CODE  
INPUT VOLTAGE  
STEPS  
MSB  
LSB  
VRT  
0
1111111111  
511  
1000000000  
512  
0111111111  
VRB  
1023  
0000000000  
11  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC976C  
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR  
SLAS193 – OCTOBER 1998  
PRINCIPLES OF OPERATION  
t
t
wl  
wh  
CLOCK  
N+2  
N+3  
N+4  
N
N+1  
INPUT SIGNAL  
DATA OUTPUT  
N–3  
N–2  
N–1  
N
N+1  
t
pd  
Figure 6. ADC Operation Sequence  
12  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC976C  
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR  
SLAS193 – OCTOBER 1998  
PRINCIPLES OF OPERATION  
ADC internal calibration  
start-up calibration at power up  
After power is turned on, the start-up calibration starts under the following conditions:  
1. The voltage between VRT and VRB is over 1 V when the voltage between AVDD and AVSS is over 2.5 V.  
2. The voltage between DVDD and DVSS is over 2.5 V.  
3. The RESET terminal (pin 26) is high.  
4. The AD-STBY terminal (pin 31) is low.  
The calibration sequence starts after condition 2 is met (see Figure 7). The following equation calculates the  
time required for the start-up calibration after the above conditions are met.  
Start-up calibration time = main clock pulse period × 16 × 16384  
For example, if the main clock frequency is 15 MHz, the time required for startup calibration is 17.5 ms.  
Reset = HIGH, AD-STBY = LOW  
5 V  
AV  
DD  
VRT  
DV  
DD  
2.5 V  
1 V  
VRB  
CALIBRATION START  
Figure 7. Start-Up Calibration  
13  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC976C  
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR  
SLAS193 – OCTOBER 1998  
PRINCIPLES OF OPERATION  
start-up calibration using RESET terminal  
If start-up characteristics are not stable, the start-up calibration can be performed using the AD-STBY terminal  
(pin 31) or the RESET terminal (pin 26). Start-up calibration can be initiated properly by connecting RC  
components to the RESET pin as shown in Figure 8. The RC components delay the start-up until the supply  
voltage stablizes.  
AV  
DD  
M
AV  
DD  
RESET  
VRT  
R
RESET  
26  
C
VRB  
AV  
SS  
(t)  
Figure 8. Start-Up Calibration Using RESET Terminal  
14  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC976C  
10-BIT, 20 MSPS, AREA CCD SIGNAL PROCESSOR  
SLAS193 – OCTOBER 1998  
MECHANICAL DATA  
DGG (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PIN SHOWN  
0,27  
0,17  
M
0,08  
0,50  
48  
25  
6,20  
6,00  
8,30  
7,90  
0,15 NOM  
Gage Plane  
0,25  
1
24  
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
48  
56  
64  
DIM  
A MAX  
12,60  
12,40  
14,10  
13,90  
17,10  
16,90  
A MIN  
4040078/F 12/97  
NOTES: B. All linear dimensions are in millimeters.  
C. This drawing is subject to change without notice.  
D. Body dimensions do not include mold protrusion not to exceed 0,15.  
E. Falls within JEDEC MO-153  
15  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
30-Mar-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TLC976CDGG  
OBSOLETE TSSOP  
OBSOLETE TSSOP  
DGG  
56  
56  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
TLC976CDGGR  
DGG  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
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and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
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dsp.ti.com  
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logic.ti.com  
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power.ti.com  
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Security  
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Copyright 2005, Texas Instruments Incorporated  

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