TLV1112IKCS [TI]

1.2V FIXED POSITIVE LDO REGULATOR, 1.4V DROPOUT, PSFM3, PLASTIC, TO-220, 3 PIN;
TLV1112IKCS
型号: TLV1112IKCS
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

1.2V FIXED POSITIVE LDO REGULATOR, 1.4V DROPOUT, PSFM3, PLASTIC, TO-220, 3 PIN

局域网 输出元件 调节器
文件: 总12页 (文件大小:315K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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ꢃ ꢅꢄ ꢆꢂꢇ ꢈ ꢅꢉ ꢆꢊ ꢁ ꢋꢌꢆꢍꢎꢋ ꢏ ꢋꢐꢀ ꢂꢋ ꢁꢀꢊꢑ ꢒ ꢎꢒꢑ ꢐ ꢁꢊꢀꢋ ꢎ  
SLVS562A – DECEMBER 2004 – REVISED FEBRUARY 2005  
D
D
D
Output Current of Up to 800 mA  
Operates Down to 1.1-V Dropout  
D
D
0.2% Line Regulation Maximum  
0.5% Load Regulation Maximum  
Specified Dropout Voltage at Multiple  
Current Levels  
KTP (PowerFLEXE) PACKAGE  
KCS (TO-220) PACKAGE  
(TOP VIEW)  
(TOP VIEW)  
INPUT  
OUTPUT  
GND  
INPUT  
OUTPUT  
GND  
DCY (SOT-223) PACKAGE  
(TOP VIEW)  
KTT (TO-263) PACKAGE  
(TOP VIEW)  
INPUT  
INPUT  
OUTPUT  
OUTPUT  
GND  
GND  
description/ordering information  
The TLV1112 is a low-dropout voltage regulator, designed to provide up to 800 mA of output current at 1.2 V  
(typ). All internal circuitry is designed to operate down to 1.1-V input-to-output differential. Dropout voltage is  
specified at a maximum of 1.3 V at 800 mA, decreasing at lower load currents.  
ORDERING INFORMATION  
V
O
TYP  
(V)  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
PACKAGE  
PowerFLEX (KTP)  
J
Reel of 2000  
TLV1112IKTPR  
TLV1112IDCY  
TLV1112IDCYR  
TLV1112IKCS  
TLV1112IKTT  
Tube of 80  
Reel of 2500  
Tube of 50  
Tube of 50  
Reel of 1000  
Reel of 2000  
Tube of 80  
Reel of 2500  
Tube of 50  
Tube of 50  
Reel of 1000  
SOT-223 (DCY)  
TO-220 (KCS)  
40°C to 125°C  
1.2 V  
TO-263 (KTT)  
TLV1112IKTTR  
TLV1112CKTPR  
TLV1112CDCY  
TLV1112CDCYR  
TLV1112CKCS  
TLV1112CKTT  
TLV1112CKTTR  
PowerFLEX (KTP)  
SOT-223 (DCY)  
TO-220 (KCS)  
0°C to 125°C  
1.2 V  
TO-263 (KTT)  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerFLEX is a trademark of Texas Instruments.  
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ꢡꢞ ꢟ ꢕ ꢥꢖ ꢠꢣ ꢛ ꢟ ꢞ ꢘꢗ ꢡꢞ ꢤ ꢞ ꢦꢘ ꢠꢚꢞ ꢖꢜꢅ ꢓ ꢣꢛ ꢙꢛ ꢝꢜ ꢞꢙ ꢕꢟ ꢜꢕ ꢝ ꢡꢛ ꢜꢛ ꢛꢖ ꢡ ꢘꢜ ꢣꢞꢙ  
ꢟ ꢠꢞ ꢝ ꢕ ꢗꢕ ꢝ ꢛ ꢜ ꢕꢘ ꢖꢟ ꢛ ꢙ ꢞ ꢡꢞ ꢟ ꢕ ꢥꢖ ꢥꢘꢛ ꢦꢟ ꢅ ꢀꢞꢧ ꢛꢟ ꢔꢖꢟ ꢜꢙ ꢢꢚ ꢞꢖꢜ ꢟ ꢙ ꢞꢟ ꢞꢙ ꢤ ꢞꢟ ꢜꢣ ꢞ ꢙ ꢕꢥꢣ ꢜ ꢜꢘ  
ꢝ ꢣꢛ ꢖ ꢥꢞ ꢘꢙ ꢡꢕ ꢟ ꢝ ꢘꢖ ꢜꢕ ꢖꢢꢞ ꢜ ꢣꢞ ꢟ ꢞ ꢠꢙ ꢘꢡ ꢢꢝꢜ ꢟ ꢨ ꢕꢜꢣ ꢘꢢꢜ ꢖꢘꢜ ꢕꢝꢞ ꢅ  
Copyright 2005, Texas Instruments Incorporated  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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SLVS562A – DECEMBER 2004 – REVISED FEBRUARY 2005  
description/ordering information (continued)  
The low-profile surface-mount KTP package allows the device to be used in applications where space is limited.  
The TLV1112 requires a minimum of 10 mF of output capacitance for stability. Output capacitors of this size or  
larger normally are included in most regulator designs.  
Unlike pnp-type regulators, where up to 10% of the output current is wasted as quiescent current, the quiescent  
current of the TLV1112 flows into the load, increasing efficiency.  
The TLV1112C is characterized for operation over the virtual junction temperature range of 0°C to 125°C. The  
TLV1112I is characterized for operation over the virtual junction temperature range of 40°C to 125°C.  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Continuous input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 V  
Package thermal impedance, θ (see Notes 1 and 2): DCY package . . . . . . . . . . . . . . . . . . . . . . . . . 49°C/W  
JA  
(see Notes 1 and 3): KCS package . . . . . . . . . . . . . . . . . . . . . . . . . 25°C/W  
(see Notes 1 and 2): KTP package . . . . . . . . . . . . . . . . . . . . . . . . . 28°C/W  
(see Notes 1 and 2): KTT package . . . . . . . . . . . . . . . . . . . . . . . . TBD°C/W  
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C  
J
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable  
J
JA  
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.  
D
J
A
JA  
J
2. The package thermal impedance is calculated in accordance with JESD 51-5.  
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
recommended operating conditions  
MIN  
MAX  
15  
UNIT  
V
V
IN  
Input voltage  
2.7  
I
Output current  
800  
125  
125  
mA  
OUT  
TLV1112I  
40  
0
T
Operating virtual junction temperature range  
°C  
J
TLV1112C  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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SLVS562A – DECEMBER 2004 – REVISED FEBRUARY 2005  
electrical characteristics, T = 0°C to 125°C, all typical values are at T = 25°C  
J
J
(unless otherwise noted)  
TLV1112C  
TYP  
1.2  
PARAMETER  
TEST CONDITIONS  
UNIT  
MIN  
1.17  
1.14  
MAX  
1.23  
1.26  
0.2  
V
− V  
OUT  
= 2 V, I = 10 mA, T = 25°C  
IN  
OUT  
J
Output voltage, V  
V
OUT  
10 mA I  
OUT  
800 mA, 1.4 V V − V  
IN OUT  
10 V  
1.2  
Line regulation  
Load regulation  
I
= 10 mA, 1.5 V − V  
IN OUT  
13.8 V  
= 3 V  
0.035  
0.1  
%
%
OUT  
10 mA I  
800 mA, V − V  
IN OUT  
0.5  
OUT  
I
I
I
= 100 mA  
= 500 mA  
= 800 mA  
1.1  
1.2  
OUT  
OUT  
OUT  
1.15  
1.2  
1.25  
1.3  
Dropout voltage (see Note 4)  
V
Current limit  
V
− V  
OUT  
= 5 V , T = 25°C  
0.8  
60  
1.2  
1.5  
A
mA  
%/W  
dB  
mA  
%
IN  
IN  
J
Quiescent current  
Thermal regulation  
Ripple rejection  
V
15 V  
5
10  
30 ms pulse, T = 25°C  
0.01  
75  
0.1  
A
V
V
− V  
OUT  
= 3 V, V  
ripple  
= 1 V , f = 120 Hz  
pp  
IN  
Minimum load current  
Temperature stability  
Long-term stability  
= 15 V  
1.7  
5
IN  
T = 0°C to 125°C  
J
0.5  
1000 hrs, No load, T = 125°C  
0.3  
%
A
Output noise voltage (% of V  
)
f = 10 Hz to 100 kHz  
0.003  
%
OUT  
All characteristics are measured with a 10-µF capacitor across the input and a 10-µF capacitor across the output. Pulse testing techniques are  
used to maintain the junction temperature as close to the ambient temperature as possible.  
Current limit test specified under recommended operating conditions  
NOTE 4: Dropout is defined as the input-to-output differential at which V  
drops 100 mV below the value of V , measured at  
OUT  
OUT  
V
IN  
= V + 1.5 V.  
OUT(nom)  
electrical characteristics, T = −40°C to 125°C, all typical values are at T = 25°C  
J
J
(unless otherwise noted)  
TLV1112I  
TYP  
1.2  
PARAMETER  
TEST CONDITIONS  
UNIT  
MIN  
MAX  
1.23  
1.26  
0.3  
V
− V  
OUT  
= 2 V, I = 10 mA, T = 25°C  
1.17  
1.14  
IN  
OUT  
J
Output voltage, V  
V
OUT  
10 mA I  
OUT  
800 mA, 1.4 V V − V  
IN OUT  
10 V  
1.2  
Line regulation  
Load regulation  
I
= 10 mA, 1.5 V − V  
IN OUT  
13.8 V  
= 3 V  
0.035  
0.2  
%
%
OUT  
10 mA I  
800 mA, V − V  
IN OUT  
0.5  
OUT  
I
I
I
= 100 mA  
= 500 mA  
= 800 mA  
1.1  
1.3  
OUT  
OUT  
OUT  
1.15  
1.2  
1.35  
1.4  
Dropout voltage (see Note 4)  
V
Current limit  
V
− V  
OUT  
= 5 V , T = 25°C  
0.8  
60  
1.2  
1.5  
A
mA  
%/W  
dB  
mA  
%
IN  
IN  
J
Quiescent current  
Thermal regulation  
Ripple rejection  
V
15 V  
5
15  
30 ms pulse, T = 25°C  
0.01  
75  
0.1  
A
V
− V  
OUT  
= 3 V, V  
ripple  
= 1 V , f = 120 Hz  
pp  
IN  
IN  
Minimum load current  
Temperature stability  
Long-term stability  
V
= 15 V  
1.7  
5
T = −40°C to 125°C  
0.5  
J
1000 hrs, No load, T = 125°C  
0.3  
%
A
Output noise voltage (% of V  
)
f = 10 Hz to 100 kHz  
0.003  
%
OUT  
All characteristics are measured with a 10-µF capacitor across the input and a 10-µF capacitor across the output. Pulse-testing techniques are  
used to maintain the junction temperature as close to the ambient temperature as possible.  
Current limit test specified under recommended operating conditions  
NOTE 4: Dropout is defined as the input-to-output differential at which V  
drops 100 mV below the value of V , measured at  
OUT  
OUT  
V
IN  
= V + 1.5 V.  
OUT(nom)  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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SLVS562A – DECEMBER 2004 – REVISED FEBRUARY 2005  
TYPICAL CHARACTERISTICS  
Figure 1. Short-Circuit Current vs (V − V )  
I
O
Figure 2. Load Regulation vs Temperature  
Figure 4. Ripple Rejection vs Current  
Figure 6. GND Pin Current vs Temperature  
Figure 3. Ripple Rejection vs Frequency  
Figure 5. Temperature Stability  
4
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SLVS562A – DECEMBER 2004 – REVISED FEBRUARY 2005  
TYPICAL CHARACTERISTICS  
Figure 7. Load-Transient Response  
Figure 8. Line-Transient Response  
5
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SLVS562A – DECEMBER 2004 – REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
1N4002 (See Note C)  
TLV1112  
INPUT  
OUTPUT  
GND  
V
O
V
I
10 µF  
(see Note B)  
100 µF  
(see Note A)  
NOTES: A. Output capacitor selection is critical for regulator stability. The recommended minimum is 10-µF tantalum or 50-µF aluminum  
electrolytic, with either one having an ESR between the range of 0.3 to 22 . Larger C  
values benefit the regulator by  
OUT  
improving transient response and loop stability.  
B.  
C
is recommended if TLV1112 is not located near the power-supply filter.  
IN  
C. An external diode is recommended to protect the regulator if the input instantaneously is shorted to GND.  
Figure 9. Typical Application Circuit  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
17-Feb-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
SOT-223  
SOT-223  
TO-220  
PFM  
Drawing  
TLV1112IDCY  
TLV1112IDCYR  
TLV1112IKCS  
TLV1112IKTPR  
TLV1112IKTT  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
DCY  
4
4
3
2
3
80  
2500  
50  
None  
None  
None  
None  
None  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
DCY  
KCS  
KTP  
3000  
50  
DDPAK/  
TO-263  
KTT  
TLV1112IKTTR  
PREVIEW  
DDPAK/  
TO-263  
KTT  
3
1000  
None  
Call TI  
Call TI  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional  
product content details.  
None: Not yet available Lead (Pb-Free).  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,  
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MPDS094A – APRIL 2001 – REVISED JUNE 2002  
DCY (R-PDSO-G4)  
PLASTIC SMALL-OUTLINE  
6,70 (0.264)  
6,30 (0.248)  
3,10 (0.122)  
2,90 (0.114)  
4
0,10 (0.004)  
M
3,70 (0.146)  
3,30 (0.130)  
7,30 (0.287)  
6,70 (0.264)  
Gauge Plane  
1
2
3
0,25 (0.010)  
0,84 (0.033)  
0,66 (0.026)  
0°–10°  
2,30 (0.091)  
0,10 (0.004)  
M
4,60 (0.181)  
0,75 (0.030) MIN  
1,70 (0.067)  
1,50 (0.059)  
1,80 (0.071) MAX  
0,35 (0.014)  
0,23 (0.009)  
Seating Plane  
0,08 (0.003)  
0,10 (0.0040)  
0,02 (0.0008)  
4202506/B 06/2002  
NOTES: A. All linear dimensions are in millimeters (inches).  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion.  
D. Falls within JEDEC TO-261 Variation AA.  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MPSF001F – JANUARY 1996 – REVISED JANUARY 2002  
KTP (R-PSFM-G2)  
PowerFLEX PLASTIC FLANGE-MOUNT PACKAGE  
0.080 (2,03)  
0.070 (1,78)  
0.243 (6,17)  
0.233 (5,91)  
0.228 (5,79)  
0.218 (5,54)  
0.050 (1,27)  
0.040 (1,02)  
0.130 (3,30) NOM  
0.010 (0,25) NOM  
Thermal Tab  
(See Note C)  
0.215 (5,46)  
0.287 (7,29)  
0.277 (7,03)  
NOM  
0.247 (6,27)  
0.237 (6,02)  
0.381 (9,68)  
0.371 (9,42)  
0.100 (2,54)  
0.090 (2,29)  
0.032 (0,81) MAX  
Seating Plane  
0.004 (0,10)  
0.090 (2,29)  
0.180 (4,57)  
0.005 (0,13)  
0.001 (0,02)  
0.031 (0,79)  
0.025 (0,63)  
0.010 (0,25)  
M
0.047 (1,19)  
0.037 (0,94)  
0.010 (0,25) NOM  
Gage Plane  
0.010 (0,25)  
2°ā6°  
4073388/M 01/02  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. The center lead is in electrical contact with the thermal tab.  
D. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15).  
E. Falls within JEDEC TO-252 variation AC.  
PowerFLEX is a trademark of Texas Instruments.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
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