TLV1391IDBVRG4 [TI]
COMPARATOR, 9000uV OFFSET-MAX, 700ns RESPONSE TIME, PDSO5, GREEN, PLASTIC, SOT-23, 5 PIN;型号: | TLV1391IDBVRG4 |
厂家: | TEXAS INSTRUMENTS |
描述: | COMPARATOR, 9000uV OFFSET-MAX, 700ns RESPONSE TIME, PDSO5, GREEN, PLASTIC, SOT-23, 5 PIN 放大器 光电二极管 |
文件: | 总13页 (文件大小:758K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
DBV PACKAGE
(TOP VIEW)
D
D
Low-Voltage and Single-Supply Operation
= 2 V to 7 V
V
CC
Common-Mode Voltage Range Includes
Ground
1
IN−
VCC−/GND
IN+
VCC+
OUT
5
4
2
3
D
Fast Response Time . . . 0.7 µs Typ
Low Supply Current . . . 80 µA Typ and
150 µA Max
D
D
Fully Specified at 3-V and 5-V Supply
Voltages
description/ordering informaton
The TLV1391 is a differential comparator built using a Texas Instruments low-voltage, high-speed bipolar
process. These devices have been developed specifically for low-voltage, single-supply applications. Their
enhanced performance makes them excellent replacements for the LM393 in the improved 3-V and 5-V system
designs.
The TLV1391, with its typical supply current of only 80 µA, is ideal for low-power systems. Response time also
has been improved to 0.7 µs.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
‡
Reel of 3000
TLV1391CDBVR
TLV1391CDBVT
TLV1391IDBVR
TLV1391IDBVT
−0°C to 70°C
−40°C to 85°C
SOT-23-5 (DBV)
Y3D_
Reel of 250
Reel of 3000
Reel of 250
SOT-23-5 (DBV)
Y3E_
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
The actual top-side marking has one additional character that designates the wafer fab/assembly site.
symbol (each comparator)
IN+
IN−
OUT
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2007, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
equivalent schematic
V
CC
IN+
IN−
GND
OUT
COMPONENT COUNT
Transistors
Resistors
Diodes
26
1
4
Epi-FET
1
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
CC
Differential input voltage, V (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
ID
Input voltage range, V (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V
I
CC
Output voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
O
Output current, I (each output) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
O
Duration of short-circuit current to GND (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited
Package thermal impedance, θ (see Note 4 and 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206°C/W
JA
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the network GND.
2. Differential voltages are at the noninverting input with respect to the inverting input.
3. Short circuits from the outputs to V can cause excessive heating and eventual destruction of the chip.
CC
4. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
J
JA
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can impact reliability.
D
J
A
JA
J
5. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN
2
MAX
7
UNIT
V
T
Supply voltage
V
CC
TLV1391C
TLV1391I
0
70
Operating free-air temperature
°C
A
−40
85
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
electrical characteristics, VCC = 3 V
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
T
A
25°C
1.5
5
9
V
IO
Input offset voltage
V
O
= 1.4 V,
V
IC
= V (min)
mV
ICR
Full range
0 to
−1.5
0 to
−1.2
25°C
V
CC
V
CC
V
V
Common-mode input voltage range
V
ICR
0 to
Full range
V
−2
CC
Low-level output voltage
Input offset current
V
V
= −1 V,
= 1.4 V
I
= 500 µA
Full range
25°C
120
5
300
50
mV
nA
OL
ID
OL
I
I
IO
O
Full range
25°C
150
−40
0.1
−250
−400
Input bias current
V
O
= 1.4 V
nA
IB
Full range
25°C
V
ID
V
ID
V
ID
= 1 V,
= 1 V,
= −1 V,
V
= 3 V
OH
I
I
High-level output current
Low-level output current
nA
OH
V
= 5 V
Full range
25°C
100
OH
OL
V
= 1.5 V
500
µA
OL
25°C
80
80
125
150
125
150
I
High-level supply current
Low-level supply current
V
= V
µA
µA
CC(H)
CC(L)
O
O
OH
Full range
25°C
I
V
= V
OL
Full range
switching characteristics, VCC = 3 V, CL = 15 pF†, TA = 25°C
PARAMETER
TEST CONDITIONS
TYP
0.7
UNIT
100-mV input step with 5-mV overdrive,
R = 5.1 kΩ
L
Response time
µs
†
C includes the probe and jig capacitance.
L
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
electrical characteristics, VCC = 5 V
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
T
A
25°C
1.5
5
9
V
IO
Input offset voltage
V
O
= 1.4 V,
V
IC
= V (min)
mV
ICR
Full range
0 to
−1.5
0 to
−1.2
25°C
V
CC
V
CC
V
V
Common-mode input voltage range
V
ICR
0 to
Full range
V
−2
CC
Low-level output voltage
Input offset current
V
V
= −1 V,
= 1.4 V
I
= 500 µA
Full range
25°C
120
5
300
50
mV
nA
OL
ID
OL
I
I
IO
O
Full range
25°C
150
−40
0.1
−250
−400
Input bias current
V
O
= 1.4 V
nA
IB
Full range
25°C
V
ID
V
ID
V
ID
= 1 V,
= 1 V,
= −1 V,
V
= 3 V
OH
I
I
High-level output current
Low-level output current
nA
OH
V
= 5 V
Full range
25°C
100
OH
OL
V
= 1.5 V
600
µA
OL
25°C
100
100
150
175
150
175
I
High-level supply current
Low-level supply current
V
= V
µA
µA
CC(H)
CC(L)
O
O
OH
Full range
25°C
I
V
= V
OL
Full range
switching characteristics, VCC = 5 V, CL = 15 pF†, TA = 25°C
PARAMETER
TEST CONDITIONS
100-mV input step with 5-mV overdrive,
TTL-level input step,
TYP
UNIT
R = 5.1 kΩ
0.65
0.18
L
Response time
µs
R = 5.1 kΩ
L
†
C includes the probe and jig capacitance.
L
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
TYPICAL CHARACTERISTICS
LOW-TO HIGH-LEVEL OUTPUT
RESPONSE FOR VARIOUS INPUT OVERDRIVES
HIGH-TO LOW-LEVEL OUTPUT
RESPONSE FOR VARIOUS INPUT OVERDRIVES
4.5
4.5
3
1.5
0
3
40 mV
20 mV
10 mV
5 mV
40 mV
20 mV
10 mV
5 mV
1.5
2 mV
2 mV
0
100
0
100
0
V
T
= 3 V
= 25° C
CC
V
T
= 3 V
= 25° C
CC
A
A
0
0.5
1
1.5
2
2.5
0
0.2
0.4
0.6
0.8
Low-to High-Level Output Response Time − µs
High-to Low-Level Output Response Time − µs
Figure 1
Figure 2
LOW-TO HIGH-LEVEL OUTPUT
HIGH-TO LOW-LEVEL OUTPUT
RESPONSE FOR VARIOUS INPUT OVERDRIVES
RESPONSE FOR VARIOUS INPUT OVERDRIVES
7.5
7.5
5
2.5
0
5
2.5
0
40 mV
20 mV
10 mV
5 mV
40 mV
20 mV
10 mV
5 mV
2 mV
2 mV
100
0
100
0
V
T
A
= 5 V
= 25° C
CC
V
T
A
= 5 V
CC
= 25° C
0
0.5
1
1.5
2
2.5
0
0.2
0.4
0.6
0.8
Low-to High-Level Output Response Time − µs
High-to Low-Level Output Response Time − µs
Figure 3
Figure 4
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
TLV1391CDBV
OBSOLETE
ACTIVE
SOT-23
SOT-23
DBV
5
5
TBD
Call TI
Call TI
0 to 70
0 to 70
TLV1391CDBVR
DBV
3000
3000
3000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(Y3D5 ~ Y3D6 ~
Y3DG)
TLV1391CDBVRE4
TLV1391CDBVRG4
TLV1391CDBVT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
(Y3D5 ~ Y3D6 ~
Y3DG)
Green (RoHS
& no Sb/Br)
(Y3D5 ~ Y3D6 ~
Y3DG)
Green (RoHS
& no Sb/Br)
(Y3D5 ~ Y3DB ~
Y3DG)
TLV1391CDBVTE4
TLV1391CDBVTG4
250
Green (RoHS
& no Sb/Br)
(Y3D5 ~ Y3DB ~
Y3DG)
250
Green (RoHS
& no Sb/Br)
(Y3D5 ~ Y3DB ~
Y3DG)
TLV1391IDBV
OBSOLETE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
TBD
Call TI
Call TI
-40 to 85
-40 to 85
TLV1391IDBVR
3000
3000
3000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(Y3E5 ~ Y3E6 ~
Y3EB)
TLV1391IDBVRE4
TLV1391IDBVRG4
TLV1391IDBVT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
(Y3E5 ~ Y3E6 ~
Y3EB)
Green (RoHS
& no Sb/Br)
(Y3E5 ~ Y3E6 ~
Y3EB)
Green (RoHS
& no Sb/Br)
(Y3E5 ~ Y3EB)
(Y3E5 ~ Y3EB)
(Y3E5 ~ Y3EB)
TLV1391IDBVTE4
TLV1391IDBVTG4
250
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLV1391CDBVR
TLV1391CDBVT
TLV1391IDBVR
TLV1391IDBVT
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
5
5
5
5
3000
250
178.0
178.0
180.0
179.0
9.0
9.0
8.4
8.4
3.23
3.23
3.23
3.2
3.17
3.17
3.17
3.2
1.37
1.37
1.37
1.4
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
3000
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Sep-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TLV1391CDBVR
TLV1391CDBVT
TLV1391IDBVR
TLV1391IDBVT
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
5
5
5
5
3000
250
180.0
180.0
202.0
203.0
180.0
180.0
201.0
203.0
18.0
18.0
28.0
35.0
3000
250
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明