TLV1543IDB [TI]
3.3V 10 BIT ANALOG TO DIGITAL CONVERTERS WITH SERIAL CONTROL AND 11 ANALOG INPUTS; 3.3V 10位模拟带串行控制和11个模拟输入数字转换器型号: | TLV1543IDB |
厂家: | TEXAS INSTRUMENTS |
描述: | 3.3V 10 BIT ANALOG TO DIGITAL CONVERTERS WITH SERIAL CONTROL AND 11 ANALOG INPUTS |
文件: | 总26页 (文件大小:607K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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ꢆ ꢋꢆ ꢌꢂ ꢃ ꢍ ꢌꢎꢉ ꢀ ꢏꢐꢏ ꢁꢑ ꢒ ꢌꢀꢑ ꢌꢓꢉꢒ ꢉ ꢀꢏꢁ ꢇꢑ ꢐ ꢂꢔ ꢕꢀ ꢔꢕ ꢖ
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SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
DB, DW, FK, J, OR N PACKAGE
(TOP VIEW)
D
D
D
D
D
D
D
D
D
D
3.3-V Supply Operation
10-Bit-Resolution A/D Converter
11 Analog Input Channels
Three Built-In Self-Test Modes
Inherent Sample and Hold
Total Unadjusted Error . . . 1 LSB Max
On-Chip System Clock
A0
A1
V
CC
EOC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
A2
I/O CLOCK
ADDRESS
DATA OUT
A3
A4
A5
15 CS
End-of-Conversion (EOC) Output
Pin Compatible With TLC1543
CMOS Technology
14
13
12
11
A6
REF+
REF−
A10
A7
A8
GND
A9
description
FN PACKAGE
(TOP VIEW)
The TLV1543C, TLV1543I, and TLV1543M are
CMOS 10-bit, switched-capacitor, successive-
approximation, analog-to-digital converters.
These devices have three inputs and a 3-state
output [chip select (CS), input-output clock (I/O
CLOCK), address input (ADDRESS), and data
output (DATA OUT)] that provide a direct 4-wire
interface to the serial port of a host processor. The
devices allow high-speed data transfers from the
host.
3
2
1
20 19
18
I/O CLOCK
A3
A4
A5
A6
A7
4
5
6
7
8
ADDRESS
DATA OUT
CS
17
16
15
14
REF+
9 10 11 12 13
In addition to a high-speed A/D converter and
versatile control capability, these devices have an
on-chip 14-channel multiplexer that can select
any one of 11 analog inputs or any one of three
internal self-test voltages. The sample-and-hold
function is automatic. At the end of A/D conversion, the end-of-conversion (EOC) output goes high to indicate
that conversion is complete. The converter incorporated in the devices features differential high-impedance
reference inputs that facilitate ratiometric conversion, scaling, and isolation of analog circuitry from logic and
supply noise. A switched-capacitor design allows low-error conversion over the full operating free-air
temperature range.
The TLV1543C is characterized for operation from 0°C to 70°C. The TLV1543I is characterized for industrial
temperature range of −40°C to 85°C. The TLV1543M is characterized for operation over the full military
temperature range of −55°C to 125°C.
AVAILABLE OPTIONS
PACKAGE
SMALL
OUTLINE
(DB)
SMALL
OUTLINE
(DW)
PLASTIC CHIP
CARRIER
(FN)
T
A
CHIP CARRIER
(FK)
CERAMIC DIP
(J)
PLASTIC DIP
(N)
0°C to 70°C
−40°C to 85°C
−55°C to 125°C
TLV1543CDB
TLV1543IDB
—
TLV1543CDW
—
—
—
—
TLV1543CN
TLV1543CFN
—
—
—
—
—
—
TLV1543MFK
TLV1543MJ
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2000 − 2004, Texas Instruments Incorporated
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1
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ꢆꢋ ꢆꢌꢂ ꢃ ꢍꢌ ꢎꢉ ꢀ ꢏ ꢐ ꢏꢁ ꢑꢒ ꢌꢀꢑ ꢌꢓꢉ ꢒ ꢉꢀꢏꢁ ꢇꢑ ꢐꢂꢔ ꢕꢀ ꢔꢕꢖ
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SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
functional block diagram
REF+
14
REF−
13
10-Bit
Analog-to-Digital
Converter
1
A0
A1
Sample and
Hold
2
3
4
5
6
7
8
9
(switched capacitors)
A2
A3
A4
A5
A6
A7
A8
A9
10
14-Channel
Analog
Multiplexer
10
Output
Data
Register
10-to-1 Data
Selector and
Driver
16
DATA
OUT
11
12
4
Input Address
Register
A10
4
3
System Clock,
Control Logic,
and I/O
Self-Test
Reference
19
EOC
Counters
17
ADDRESS
18
15
I/O CLOCK
CS
typical equivalent inputs
INPUT CIRCUIT IMPEDANCE DURING SAMPLING MODE
INPUT CIRCUIT IMPEDANCE DURING HOLD MODE
1 kΩ TYP
A0−A10
A0−A10
C = 60 pF MAX
i
(equivalent input
capacitance)
5 MΩ TYP
2
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ꢆ ꢋꢆ ꢌꢂ ꢃ ꢍ ꢌꢎꢉ ꢀ ꢏꢐꢏ ꢁꢑ ꢒ ꢌꢀꢑ ꢌꢓꢉꢒ ꢉ ꢀꢏꢁ ꢇꢑ ꢐ ꢂꢔ ꢕꢀ ꢔꢕ ꢖ
ꢗ ꢉꢀ ꢘ ꢖꢔ ꢕꢉꢏ ꢁ ꢇꢑ ꢐꢀ ꢕꢑ ꢁ ꢏꢐꢓ ꢃꢃ ꢏꢐꢏ ꢁꢑ ꢒ ꢉ ꢐꢙ ꢚ ꢀꢖ
SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
NO.
ADDRESS
17
I
Serial address. A 4-bit serial address selects the desired analog input or test voltage that is to be converted
next. The address data is presented with the MSB first and is shifted in on the first four rising edges of I/O
CLOCK. After the four address bits have been read into the address register, ADDRESS is ignored for the
remainder of the current conversion period.
A0−A10
CS
1−9, 11,
12
I
I
Analog signal. The 11 analog inputs are applied to A0−A10 and are internally multiplexed. The driving source
impedance should be less than or equal to 1 kΩ.
15
Chip select. A high-to-low transition on CS resets the internal counters and controls and enables DATA OUT,
ADDRESS, and I/O CLOCK within a maximum of a setup time plus two falling edges of the internal system
clock. A low-to-high transition disables ADDRESS and I/O CLOCK within a setup time plus two falling edges
of the internal system clock.
DATA OUT
16
O
The 3-state serial output for the A/D conversion result. DATA OUT is in the high-impedance state when CS
is high and active when CS is low. With a valid chip select, DATA OUT is removed from the high-impedance
state and is driven to the logic level corresponding to the MSB value of the previous conversion result. The
next falling edge of I/O CLOCK drives DATA OUT to the logic level corresponding to the next most significant
bit, and the remaining bits are shifted out in order with the LSB appearing on the ninth falling edge of I/O
CLOCK. On the tenth falling edge of I/O CLOCK, DATA OUT is driven to a low logic level so that serial
interface data transfers of more than ten clocks produce zeroes as the unused LSBs.
EOC
19
10
18
O
I
End of conversion. EOC goes from a high- to a low- logic level on the trailing edge of the tenth I/O CLOCK
and remains low until the conversion is complete and data are ready for transfer.
GND
The ground return terminal for the internal circuitry. Unless otherwise noted, all voltage measurements are
with respect to GND.
I/O CLOCK
I
Input/output clock. I/O CLOCK receives the serial I/O CLOCK input and performs the following four functions:
1) It clocks the four input address bits into the address register on the first four rising edges of I/O
CLOCK with the multiplex address available after the fourth rising edge.
2) On the fourth falling edge of I/O CLOCK, the analog input voltage on the selected multiplex input begins
charging the capacitor array and continues to do so until the tenth falling edge of I/O CLOCK.
3) It shifts the nine remaining bits of the previous conversion data out on DATA OUT.
4) It transfers control of the conversion to the internal state controller on the falling edge of the tenth clock.
REF+
REF−
14
I
The upper reference voltage value (nominally V ) is applied to REF+. The maximum input voltage range
CC
is determined by the difference between the voltage applied to REF+ and the voltage applied to the REF−
terminal.
13
20
I
I
The lower reference voltage value (nominally ground) is applied to REF−.
Positive supply voltage
V
CC
detailed description
With chip select (CS) inactive (high), the ADDRESS and I/O CLOCK inputs are initially disabled and DATA OUT
is in the high-impedance state. When the serial interface takes CS active (low), the conversion sequence begins
with the enabling of I/O CLOCK and ADDRESS and the removal of DATA OUT from the high-impedance state.
The host then provides the 4-bit channel address to ADDRESS and the I/O CLOCK sequence to I/O CLOCK.
During this transfer, the host serial interface also receives the previous conversion result from DATA OUT. I/O
CLOCK receives an input sequence that is between 10 and 16 clocks long from the host. The first four I/O clocks
load the address register with the 4-bit address on ADDRESS selecting the desired analog channel and the next
six clocks providing the control timing for sampling the analog input.
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ꢆꢋ ꢆꢌꢂ ꢃ ꢍꢌ ꢎꢉ ꢀ ꢏ ꢐ ꢏꢁ ꢑꢒ ꢌꢀꢑ ꢌꢓꢉ ꢒ ꢉꢀꢏꢁ ꢇꢑ ꢐꢂꢔ ꢕꢀ ꢔꢕꢖ
ꢗꢉ ꢀ ꢘ ꢖꢔ ꢕꢉ ꢏ ꢁ ꢇꢑ ꢐꢀ ꢕꢑ ꢁ ꢏꢐ ꢓ ꢃ ꢃ ꢏꢐ ꢏꢁ ꢑ ꢒ ꢉꢐ ꢙꢚꢀ ꢖ
SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
detailed description (continued)
There are six basic serial interface timing modes that can be used with the device. These modes are determined
by the speed of I/O CLOCK and the operation of CS as shown in Table 1. These modes are (1) a fast mode with
a 10-clock transfer and CS inactive (high) between conversion cycles, (2) a fast mode with a 10-clock transfer
and CS active (low) continuously, (3) a fast mode with an 11- to 16-clock transfer and CS inactive (high) between
conversion cycles, (4) a fast mode with a 16-bit transfer and CS active (low) continuously, (5) a slow mode with
an 11- to 16-clock transfer and CS inactive (high) between conversion cycles, and (6) a slow mode with a
16-clock transfer and CS active (low) continuously.
The MSB of the previous conversion appears on DATA OUT on the falling edge of CS in mode 1, mode 3, and
mode 5, on the rising edge of EOC in mode 2 and mode 4, and following the 16th clock falling edge in mode 6.
The remaining nine bits are shifted out on the next nine falling edges of I/O CLOCK. Ten bits of data are
transmitted to the host through DATA OUT. The number of serial clock pulses used also depends on the mode
of operation, but a minimum of ten clock pulses is required for conversion to begin. On the 10th clock falling
edge, the EOC output goes low and returns to the high logic level when conversion is complete and the result
can be read by the host. On the 10th clock falling edge, the internal logic takes DATA OUT low to ensure that
the remaining bit values are zero if the I/O CLOCK transfer is more than ten clocks long.
Table 1 lists the operational modes with respect to the state of CS, the number of I/O serial transfer clocks that
can be used, and the timing edge on which the MSB of the previous conversion appears at the output.
Table 1. Mode Operation
NO. OF
I/O CLOCKS
TIMING
DIAGRAM
†
MODES
MSB AT DATA OUT
CS
Mode 1 High between conversion cycles
Mode 2 Low continuously
10
10
CS falling edge
EOC rising edge
CS falling edge
EOC rising edge
CS falling edge
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Figure 14
Fast Modes
‡
‡
Mode 3 High between conversion cycles
Mode 4 Low continuously
11 to 16
‡
16
11 to 16
Mode 5 High between conversion cycles
Mode 6 Low continuously
Slow Modes
‡
16
16th clock falling edge
†
‡
These edges also initiate serial-interface communication.
No more than 16 clocks should be used.
fast modes
The device is in a fast mode when the serial I/O CLOCK data transfer is completed before the conversion is
completed. With a 10-clock serial transfer, the device can only run in a fast mode since a conversion does not
begin until the falling edge of the 10th I/O CLOCK.
mode 1: fast mode, CS inactive (high) between conversion cycles, 10-clock transfer
In this mode, CS is inactive (high) between serial I/O CLOCK transfers and each transfer is ten clocks long. The
falling edge of CS begins the sequence by removing DATA OUT from the high-impedance state. The rising edge
of CS ends the sequence by returning DATA OUT to the high-impedance state within the specified delay time.
Also, the rising edge of CS disables the I/O CLOCK and ADDRESS terminals within a setup time plus two falling
edges of the internal system clock.
mode 2: fast mode, CS active (low) continuously, 10-clock transfer
In this mode, CS is active (low) between serial I/O CLOCK transfers and each transfer is ten clocks long. After
the initial conversion cycle, CS is held active (low) for subsequent conversions; the rising edge of EOC then
begins each sequence by removing DATA OUT from the low logic level, allowing the MSB of the previous
conversion to appear immediately on this output.
4
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SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
mode 3: fast mode, CS inactive (high) between conversion cycles, 11- to 16-clock transfer
In this mode, CS is inactive (high) between serial I/O CLOCK transfers and each transfer can be 11 to 16 clocks
long. The falling edge of CS begins the sequence by removing DATA OUT from the high-impedance state. The
rising edge of CS ends the sequence by returning DATA OUT to the high-impedance state within the specified
delay time. Also, the rising edge of CS disables the I/O CLOCK and ADDRESS terminals within a setup time
plus two falling edges of the internal system clock.
mode 4: fast mode, CS active (low) continuously, 16-clock transfer
In this mode, CS is active (low) between serial I/O CLOCK transfers and each transfer must be exactly 16 clocks
long. After the initial conversion cycle, CS is held active (low) for subsequent conversions; the rising edge of
EOC then begins each sequence by removing DATA OUT from the low logic level, allowing the MSB of the
previous conversion to appear immediately on this output.
slow modes
In a slow mode, the conversion is completed before the serial I/O CLOCK data transfer is completed. A slow
mode requires a minimum 11-clock transfer into I/O CLOCK, and the rising edge of the eleventh clock must
occur before the conversion period is complete; otherwise, the device loses synchronization with the host serial
interface, and CS has to be toggled to initialize the system. The eleventh rising edge of the I/O CLOCK must
occur within 9.5 µs after the tenth I/O clock falling edge.
mode 5: slow mode, CS inactive (high) between conversion cycles, 11- to 16-clock transfer
In this mode, CS is inactive (high) between serial I/O CLOCK transfers and each transfer can be 11 to 16 clocks
long. The falling edge of CS begins the sequence by removing DATA OUT from the high-impedance state. The
rising edge of CS ends the sequence by returning DATA OUT to the high-impedance state within the specified
delay time. Also, the rising edge of CS disables the I/O CLOCK and ADDRESS terminals within a setup time
plus two falling edges of the internal system clock.
mode 6: slow mode, CS active (low) continuously, 16-clock transfer
In this mode, CS is active (low) between serial I/O CLOCK transfers and each transfer must be exactly 16 clocks
long. After the initial conversion cycle, CS is held active (low) for subsequent conversions. The falling edge of
the sixteenth I/O CLOCK then begins each sequence by removing DATA OUT from the low state, allowing the
MSB of the previous conversion to appear immediately at DATA OUT. The device is then ready for the next
16-clock transfer initiated by the serial interface.
address bits
The 4-bit analog channel-select address for the next conversion cycle is presented to the ADDRESS terminal
(MSB first) and is clocked into the address register on the first four leading edges of I/O CLOCK. This address
selects one of 14 inputs (11 analog inputs or 3 internal test inputs).
analog inputs and test modes
The 11 analog inputs and the 3 internal test inputs are selected by the 14-channel multiplexer according to the
input address as shown in Tables 2 and 3. The input multiplexer is a break-before-make type to reduce
input-to-input noise injection resulting from channel switching.
Sampling of the analog input starts on the falling edge of the fourth I/O CLOCK, and sampling continues for six
I/O CLOCK periods. The sample is held on the falling edge of the tenth I/O CLOCK. The three test inputs are
applied to the multiplexer, sampled, and converted in the same manner as the external analog inputs.
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SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
Table 2. Analog-Channel-Select Address
VALUE SHIFTED INTO
ANALOG INPUT
ADDRESS INPUT
SELECTED
BINARY
0000
0001
0010
0011
0100
0101
0110
0111
HEX
0
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
1
2
3
4
5
6
7
1000
1001
1010
8
9
A
Table 3. Test-Mode-Select Address
VALUE SHIFTED INTO
ADDRESS INPUT
INTERNAL SELF-TEST
VOLTAGE SELECTED
‡
OUTPUT RESULT (HEX)
†
BINARY
HEX
V
– V
ref)
ref–
1011
B
200
2
V
1100
1101
C
D
000
3FF
ref−
V
ref+
†
‡
V
is the voltage applied to the REF+ input, and V
is the voltage applied to the REF−
ref+
input.
ref−
The output results shown are the ideal values and vary with the reference stability and with
internal offsets.
converter and analog input
The CMOS threshold detector in the successive-approximation conversion system determines each bit by
examining the charge on a series of binary-weighted capacitors (see Figure 1). In the first phase of the
conversion process, the analog input is sampled by closing the S switch and all S switches simultaneously.
C
T
This action charges all the capacitors to the input voltage.
In the next phase of the conversion process, all S and S switches are opened and the threshold detector
T
C
begins identifying bits by identifying the charge (voltage) on each capacitor relative to the reference (REF−)
voltage. In the switching sequence, ten capacitors are examined separately until all ten bits are identified and
the charge-convert sequence is repeated. In the first step of the conversion phase, the threshold detector looks
at the first capacitor (weight = 512). Node 512 of this capacitor is switched to the REF+ voltage, and the
equivalent nodes of all the other capacitors on the ladder are switched to REF−. If the voltage at the summing
node is greater than the trip point of the threshold detector (approximately one-half the V
voltage), a bit 0 is
CC
placed in the output register and the 512-weight capacitor is switched to REF−. If the voltage at the summing
node is less than the trip point of the threshold detector, a bit 1 is placed in the register and the 512-weight
capacitor remains connected to REF+ through the remainder of the successive-approximation process. The
process is repeated for the 256-weight capacitor, the 128-weight capacitor, and so forth down the line until all
bits are counted.
With each step of the successive-approximation process, the initial charge is redistributed among the
capacitors. The conversion process relies on charge redistribution to count and weigh the bits from MSB to LSB.
6
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ꢆ ꢋꢆ ꢌꢂ ꢃ ꢍ ꢌꢎꢉ ꢀ ꢏꢐꢏ ꢁꢑ ꢒ ꢌꢀꢑ ꢌꢓꢉꢒ ꢉ ꢀꢏꢁ ꢇꢑ ꢐ ꢂꢔ ꢕꢀ ꢔꢕ ꢖ
ꢗ
ꢉ
ꢀ
ꢘ
ꢖ
ꢔ
ꢕ
ꢉ
ꢏ
ꢁ
ꢇ
ꢑ
ꢐ
ꢀ
ꢕ
ꢑ
ꢁ
ꢏ
ꢐ
ꢓ
ꢃꢃ
ꢏ
ꢐ
ꢏ
ꢁ
ꢑ
ꢒ
ꢉ
ꢐ
ꢙ
ꢚ
ꢀ
ꢖ
SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
converter and analog input (continued)
S
C
Threshold
Detector
To Output
Latches
512
Node 512
256
128
16
8
4
2
1
1
REF+
REF+
REF+
REF+
REF+
REF+
REF+
REF−
REF−
REF−
REF−
REF−
REF−
REF−
T
REF−
REF−
T
S
S
S
S
S
S
S
S
S
T
T
T
T
T
T
T
V
I
Figure 1. Simplified Model of the Successive-Approximation System
chip-select operation
The trailing edge of CS starts all modes of operation, and CS can abort a conversion sequence in any mode.
A high-to-low transition on CS within the specified time during an ongoing cycle aborts the cycle, and the device
returns to the initial state (the contents of the output data register remain at the previous conversion result).
Exercise care to prevent CS from being taken low close to completion of conversion because the output data
can be corrupted.
reference voltage inputs
There are two reference inputs used with these devices: REF+ and REF−. These voltage values establish the
upper and lower limits of the analog input to produce a full-scale and zero-scale reading respectively. The values
of REF+, REF−, and the analog input should not exceed the positive supply or be lower than GND consistent
with the specified absolute maximum ratings. The digital output is at full scale when the input signal is equal
to or higher than REF+ and at zero when the input signal is equal to or lower than REF−.
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
(see Note 1): TLV1543C/TLV1543I . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V
TLV1543M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6 V
CC
Input voltage range, V (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V
+ 0.3 V
+ 0.3 V
+ 0.1 V
I
CC
CC
CC
Output voltage range, V
Positive reference voltage, V
Negative reference voltage, V
Peak input current (any input), I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V
O
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
ref+
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.1 V
ref−
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
(p-p)
Peak total input current (all inputs), I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
p
Operating free-air temperature range, T : TLV1543C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
A
TLV1543I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
TLV1543M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from the case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to digital ground with REF− and GND wired together (unless otherwise noted).
7
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ꢗꢉ ꢀ ꢘ ꢖꢔ ꢕꢉ ꢏ ꢁ ꢇꢑ ꢐꢀ ꢕꢑ ꢁ ꢏꢐ ꢓ ꢃ ꢃ ꢏꢐ ꢏꢁ ꢑ ꢒ ꢉꢐ ꢙꢚꢀ ꢖ
SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
recommended operating conditions
MIN NOM
MAX
5.5
UNIT
V
TLV1543C/TLV1543I
TLV1543M
3
3
3.3
3.3
Supply voltage, V
CC
3.6
V
Positive reference voltage, V
ref+
(see Note 2)
(see Note 2)
− V (see Note 2)
V
V
V
CC
0
Negative reference voltage, V
ref−
V
Differential reference voltage, V
ref+
2.5
0
V +0.2
CC
V
ref−
CC
Analog input voltage (see Note 2)
V
CC
V
TLV1543C/TLV1543I
TLV1543M
V
= 3 V to 5.5 V
= 3 V to 3.6 V
= 3 V to 5.5 V
= 3 V to 3.6 V
2
V
CC
CC
CC
CC
High-level control input voltage, V
IH
V
V
V
2
V
TLV1543C/TLV1543I
TLV1543M
0.6
0.8
V
Low-level control input voltage, V
IL
V
Setup time, address bits at data input before I/O CLOCK↑, t
su(A)
(see Figure 4)
100
0
ns
ns
ns
µs
Hold time, address bits after I/O CLOCK↑, t
(see Figure 4)
h(A)
Hold time, CS low after last I/O CLOCK↓, t
0
h(CS)
Setup time, CS low before clocking in first address bit, t
su(CS)
(see Note 3)
1.425
0
TLV1543C/TLV1543I
TLV1543M
1.1
2.1
Clock frequency at I/O CLOCK (see Note 4)
MHz
0
Pulse duration, I/O CLOCK high, t
190
190
ns
ns
µs
µs
w(H_I/O)
Pulse duration, I/O CLOCK low, t
w(L_I/O)
Transition time, I/O CLOCK, t
t(I/O)
Transition time, ADDRESS and CS, t
(see Note 5)
t(CS)
1
10
70
TLV1543C/TLV1543I
TLV1543M
0
Operating free-air temperature, T
°C
A
−55
125
NOTES: 2. Analog input voltages greater than that applied to REF+ convert as all ones (1111111111), while input voltages less than that applied
to REF− convert as all zeros (0000000000).
3. To minimize errors caused by noise at CS, the internal circuitry waits for a setup time plus two falling edges of the internal system
clock after CS↓ before responding to control input signals. No attempt should be made to clock in an address until the minimum CS
setup time has elapsed.
4. For 11- to 16-bit transfers, after the tenth I/O CLOCK falling edge (≤ 2 V), at least one I/O clock rising edge (≥ 2 V) must occur within
9.5 µs.
5. This is the time required for the clock input signal to fall from V min to V max or to rise from V max to V min. In the vicinity of
IH
IL
IL
IH
normal room temperature, the devices function with input clock transition time as slow as 1 µs for remote data-acquisition
applications where the sensor and the A/D converter are placed several feet away from the controlling microprocessor.
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ꢗ ꢉꢀ ꢘ ꢖꢔ ꢕꢉꢏ ꢁ ꢇꢑ ꢐꢀ ꢕꢑ ꢁ ꢏꢐꢓ ꢃꢃ ꢏꢐꢏ ꢁꢑ ꢒ ꢉ ꢐꢙ ꢚ ꢀꢖ
SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
electrical characteristics over recommended operating free-air temperature range,
V
V
= V
= V
= 3 V to 5.5 V, I/O CLOCK frequency = 1.1 MHz for the TLV1543C, and TLV1543I
= 3 V to 3.6 V, I/O CLOCK frequency = 2.1 MHz for the TLV1543M (unless otherwise
CC
CC
ref+
ref+
noted)
†
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
V
V
V
V
V
V
V
V
V
V
= 3 V,
I
I
I
I
I
I
I
I
= −1.6 mA
= 20 µA
2.4
CC
CC
CC
CC
CC
CC
CC
CC
OH
OH
OH
OH
OL
OL
OL
OL
TLV1543C/TLV1543I
TLV1543M
= 3 V to 5.5 V,
= 3 V,
V
V
−0.1
V
CC
2.4
−0.1
V
OH
High-level output voltage
Low-level output voltage
= −1.6 mA
= 20 µA
V
= 3 V to 3.6 V,
= 3 V,
V
CC
= 1.6 mA
= 20 µA
0.4
0.1
V
TLV1543C/TLV1543I
TLV1543M
= 3 V to 5.5 V,
= 3 V,
V
V
OL
= 1.6 mA
= 20 µA
0.4
V
= 3 V to 3.6 V,
0.1
V
= V
CC
,
CS at V
10
O
O
CC
CC
I
Off-state (high-impedance-state) output current
µA
OZ
= 0,
CS at V
−10
2.5
I
I
I
High-level input current
Low-level input current
Operating supply current
V = V
CC
0.005
−0.005
0.8
µA
µA
IH
I
V = 0
I
−2.5
2.5
IL
CS at 0 V
mA
CC
Selected channel at V
Unselected channel at 0 V
,
CC
1
Selected channel leakage current
µA
Selected channel at 0 V,
Unselected channel at V
CC
−1
Maximum static analog reference current into REF+
V
ref+
= V
CC
,
V
ref−
= GND
10
60
60
60
60
µA
TLV1543C/TLV1543I
TLV1543M
7
7
5
5
Input capacitance, Analog
inputs
pF
C
i
TLV1543C/TLV1543I
TLV1543M
Input capacitance, Control
inputs
pF
†
All typical values are at V
CC
= 5 V, T = 25°C.
A
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ꢆꢋ ꢆꢌꢂ ꢃ ꢍꢌ ꢎꢉ ꢀ ꢏ ꢐ ꢏꢁ ꢑꢒ ꢌꢀꢑ ꢌꢓꢉ ꢒ ꢉꢀꢏꢁ ꢇꢑ ꢐꢂꢔ ꢕꢀ ꢔꢕꢖ
ꢗꢉ ꢀ ꢘ ꢖꢔ ꢕꢉ ꢏ ꢁ ꢇꢑ ꢐꢀ ꢕꢑ ꢁ ꢏꢐ ꢓ ꢃ ꢃ ꢏꢐ ꢏꢁ ꢑ ꢒ ꢉꢐ ꢙꢚꢀ ꢖ
SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
operating characteristics over recommended operating free-air temperature range,
V
V
= V
= V
= 3 V to 5.5 V, I/O CLOCK frequency = 1.1 MHz for the TLV1543C, and TLV1543I
= 3 V to 3.6 V, I/O CLOCK frequency = 2.1 MHz for the TLV1543M
CC
CC
ref+
ref+
†
PARAMETER
Linearity error (see Note 6)
Zero error (see Note 7)
TEST CONDITIONS
MIN TYP
MAX
UNIT
LSB
LSB
LSB
LSB
1
1
1
1
Full-scale error (see Note 7)
Total unadjusted error (see Note 8)
ADDRESS = 1011
ADDRESS = 1100
ADDRESS = 1101
See Figures 9−14
512
0
Self-test output code (see Table 3 and Note 9)
Conversion time
1023
t
t
21
µs
µs
c(1)
21
See Figures 9−14
and Note 10
+10 I/O
CLOCK
periods
Total cycle time (access, sample, and conversion)
c(2)
I/O
CLOCK
periods
See Figures 9−14
and Note 10
t
Channel acquisition time (sample)
6
(acq)
t
t
t
t
t
t
t
t
t
t
Valid time, DATA OUT remains valid after I/O CLOCK↓
Delay time, I/O CLOCK↓ to DATA OUT valid
Delay time, tenth I/O CLOCK↓ to EOC↓
Delay time, EOC↑ to DATA OUT (MSB)
Enable time, CS↓ to DATA OUT (MSB driven)
Disable time, CS↑ to DATA OUT (high impedance)
Rise time, EOC
See Figure 6
See Figure 6
See Figure 7
See Figure 8
See Figure 3
See Figure 3
See Figure 8
See Figure 7
See Figure 6
See Figure 6
10
ns
ns
ns
ns
µs
ns
ns
ns
ns
ns
v
240
240
100
1.3
d(I/O-DATA)
d(I/O-EOC)
70
d(EOC-DATA)
, t
PZH PZL
, t
150
300
300
300
300
PHZ PLZ
r(EOC)
f(EOC)
r(bus)
f(bus)
Fall time, EOC
Rise time, data bus
Fall time, data bus
Delay time, tenth I/O CLOCK↓ to CS↓ to abort conversion
(see Note 11)
t
9
µs
d(I/O-CS)
†
All typical values are at T = 25°C.
A
NOTES: 6. Linearity error is the maximum deviation from the best straight line through the A/D transfer characteristics.
7. Zero-scale error is the difference between 0000000000 and the converted output for zero input voltage; full-scale error is the
difference between 1111111111 and the converted output for full-scale input voltage.
8. Total unadjusted error comprises linearity, zero-scale, and full-scale errors.
9. Both the input address and the output codes are expressed in positive logic.
10. I/O CLOCK period = 1/(I/O CLOCK frequency) (see Figure 6).
11. Any transitions of CS are recognized as valid only if the level is maintained for a setup time plus two falling edges of the internal clock
(1.425 µs) after the transition.
10
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SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
PARAMETER MEASUREMENT INFORMATION
Test Point
V
CC
Test Point
V
CC
R
= 2.18 kΩ
R
= 2.18 kΩ
L
L
EOC
DATA OUT
12 kΩ
12 kΩ
C
= 50 pF
C = 100 pF
L
L
Figure 2. Load Circuits
Address
Valid
2 V
2 V
CS
ADDRESS
V
IL
V
IL
t
, t
PZH PZL
t
t
, t
h(A)
PHZ PLZ
t
su(A)
2.4 V
0.4 V
90%
10%
I/O CLOCK
DATA
OUT
V
IL
Figure 3. DATA OUT to Hi-Z Voltage Waveforms
Figure 4. ADDRESS Setup Voltage Waveforms
2 V
CS
V
IL
t
su(CS)
t
h(CS)
I/O CLOCK
First
Clock
Last
Clock
V
IL
V
IL
Figure 5. CS and I/O CLOCK Voltage Waveforms
11
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ꢆꢋ ꢆꢌꢂ ꢃ ꢍꢌ ꢎꢉ ꢀ ꢏ ꢐ ꢏꢁ ꢑꢒ ꢌꢀꢑ ꢌꢓꢉ ꢒ ꢉꢀꢏꢁ ꢇꢑ ꢐꢂꢔ ꢕꢀ ꢔꢕꢖ
ꢗꢉ ꢀ ꢘ ꢖꢔ ꢕꢉ ꢏ ꢁ ꢇꢑ ꢐꢀ ꢕꢑ ꢁ ꢏꢐ ꢓ ꢃ ꢃ ꢏꢐ ꢏꢁ ꢑ ꢒ ꢉꢐ ꢙꢚꢀ ꢖ
SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
PARAMETER MEASUREMENT INFORMATION
t
t(I/O)
t
t(I/O)
2 V
2 V
I/O CLOCK
V
IL
V
IL
V
IL
I/O CLOCK Period
t
d(I/O-DATA)
t
v
2.4 V
0.4 V
2.4 V
0.4 V
DATA OUT
t
, t
r(bus) f(bus)
Figure 6. DATA OUT and I/O CLOCK Voltage Waveforms
I/O CLOCK
10th
V
IL
Clock
t
d(I/O-EOC)
2.4 V
EOC
0.4 V
t
f(EOC)
Figure 7. I/O CLOCK and EOC Voltage Waveforms
t
r(EOC)
EOC
2.4 V
0.4 V
t
d(EOC-DATA)
2.4 V
0.4 V
DATA OUT
Valid MSB
Figure 8. EOC and DATA OUT Voltage Waveforms
12
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ꢆ ꢋꢆ ꢌꢂ ꢃ ꢍ ꢌꢎꢉ ꢀ ꢏꢐꢏ ꢁꢑ ꢒ ꢌꢀꢑ ꢌꢓꢉꢒ ꢉ ꢀꢏꢁ ꢇꢑ ꢐ ꢂꢔ ꢕꢀ ꢔꢕ ꢖ
ꢗ
ꢉ
ꢀ
ꢘ
ꢖ
ꢔ
ꢕ
ꢉ
ꢏ
ꢁ
ꢇ
ꢑ
ꢐ
ꢀ
ꢕ
ꢑ
ꢁ
ꢏ
ꢐ
ꢓ
ꢃꢃ
ꢏ
ꢐ
ꢏ
ꢁ
ꢑ
ꢒ
ꢉ
ꢐ
ꢙ
ꢚ
ꢀ
ꢖ
SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
CS
(see Note A)
I/O
CLOCK
1
2
3
4
5
6
7
8
9
10
1
Access Cycle B
Sample Cycle B
Hi-Z State
DATA
OUT
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
B9
Previous Conversion Data
MSB
LSB
ADDRESS
EOC
B3
MSB
B2
B1
B0
LSB
C3
Shift in New Multiplexer Address,
Simultaneously Shift Out Previous
Conversion Value
A/D Conversion
Interval
Initialize
Initialize
NOTE A: To minimize errors caused by noise at CS, the internal circuitry waits for a setup time plus two falling edges of the internal system clock
after CS↓ before responding to control input signals. No attempt should be made to clock in an address until the minimum CS setup
time has elapsed.
Figure 9. Timing for 10-Clock Transfer Using CS
Must be High on Power Up
CS
(see Note A)
I/O
CLOCK
1
2
3
4
5
6
7
8
9
10
1
Access Cycle B
Sample Cycle B
DATA
OUT
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
B9
Low Level
Previous Conversion Data
MSB
LSB
ADDRESS
EOC
B3
MSB
B2
B1
B0
LSB
C3
Shift in New Multiplexer Address,
Simultaneously Shift Out Previous
Conversion Value
A/D Conversion
Interval
Initialize
Initialize
NOTE A: To minimize errors caused by noise at CS, the internal circuitry waits for a setup time plus two falling edges of the internal system clock
after CS↓ before responding to control input signals. No attempt should be made to clock in an address until the minimum CS setup
time has elapsed.
Figure 10. Timing for 10-Clock Transfer Not Using CS
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ꢀ ꢁꢂ ꢃ ꢄꢅ ꢆ ꢇꢈ ꢀ ꢁꢂꢃ ꢄꢅ ꢆ ꢉ ꢈ ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢊ
ꢆꢋ ꢆꢌꢂ ꢃ ꢍꢌ ꢎꢉ ꢀ ꢏ ꢐ ꢏꢁ ꢑꢒ ꢌꢀꢑ ꢌꢓꢉ ꢒ ꢉꢀꢏꢁ ꢇꢑ ꢐꢂꢔ ꢕꢀ ꢔꢕꢖ
ꢗ
ꢉ
ꢀ
ꢘ
ꢖ
ꢔ
ꢕꢉ
ꢏ
ꢁ
ꢇ
ꢑ
ꢐ
ꢀ
ꢕ
ꢑ
ꢁ
ꢏ
ꢐ
ꢓ
ꢃ ꢃ
ꢏ
ꢐ
ꢏ
ꢁ
ꢑ
ꢒ
ꢉ
ꢐ
ꢙ
ꢚ
ꢀ
ꢖ
SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
See Note B
CS
(see Note A)
I/O
CLOCK
1
2
3
4
5
6
7
8
9
10
11
16
1
Access Cycle B
Sample Cycle B
Low
Level
Hi-Z
DATA
OUT
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
B9
Previous Conversion Data
MSB
LSB
ADDRESS
EOC
B3
MSB
B2
B1
B0
LSB
C3
Shift in New Multiplexer Address,
Simultaneously Shift Out Previous
Conversion Value
A/D Conversion
Interval
Initialize
Initialize
NOTES: A. To minimize errors caused by noise at CS, the internal circuitry waits for a set up time plus two falling edges of the internal system
clock after CS↓ before responding to control input signals. No attempt should be made to clock in an address until the minimum CS
setup time has elapsed.
B. A low-to-high transition of CS disables ADDRESS and the I/O CLOCK within a maximum of a setup time plus two falling edges of
the internal system clock.
Figure 11. Timing for 11- to 16-Clock Transfer Using CS (Serial Transfer Interval Shorter Than Conversion)
Must be High on Power Up
CS
(see Note A)
I/O
CLOCK
1
2
3
4
5
6
7
8
9
10
14
15
16
1
Access Cycle B
Sample Cycle B
See Note B
DATA
OUT
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
B9
Low Level
Previous Conversion Data
MSB
LSB
ADDRESS
EOC
B3
MSB
B2
B1
B0
LSB
C3
Shift in New Multiplexer Address,
Simultaneously Shift Out Previous
Conversion Value
A/D Conversion
Interval
Initialize
NOTES: A. The first I/O CLOCK must occur after the rising edge of EOC.
Initialize
B. A low-to-high transition of CS disables ADDRESS and the I/O CLOCK within a maximum of a setup time plus two falling edges of
the internal system clock.
Figure 12. Timing for 16-Clock Transfer Not Using CS (Serial Transfer Interval Shorter Than Conversion)
14
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ꢀ ꢁꢂꢃ ꢄ ꢅ ꢆ ꢇꢈ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢆ ꢉꢈ ꢀꢁꢂ ꢃꢄ ꢅꢆ ꢊ
ꢆ ꢋꢆ ꢌꢂ ꢃ ꢍ ꢌꢎꢉ ꢀ ꢏꢐꢏ ꢁꢑ ꢒ ꢌꢀꢑ ꢌꢓꢉꢒ ꢉ ꢀꢏꢁ ꢇꢑ ꢐ ꢂꢔ ꢕꢀ ꢔꢕ ꢖ
ꢗ
ꢉ
ꢀ
ꢘ
ꢖ
ꢔ
ꢕ
ꢉ
ꢏ
ꢁ
ꢇ
ꢑ
ꢐ
ꢀ
ꢕ
ꢑ
ꢁ
ꢏ
ꢐ
ꢓ
ꢃꢃ
ꢏ
ꢐ
ꢏ
ꢁ
ꢑ
ꢒ
ꢉ
ꢐ
ꢙ
ꢚ
ꢀ
ꢖ
SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
CS
(see Note A)
I/O
CLOCK
1
2
3
4
5
6
7
8
9
10
11
16
1
Access Cycle B
Sample Cycle B
See Note B
Hi-Z State
DATA
OUT
Low
Level
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
B9
Previous Conversion Data
MSB
LSB
ADDRESS
EOC
B3
MSB
B2
B1
B0
LSB
C3
Shift in New Multiplexer Address,
Simultaneously Shift Out Previous
Conversion Value
A/D Conversion
Interval
Initialize
Initialize
NOTES: A. To minimize errors caused by noise at CS, the internal circuitry waits for a set up time plus two falling edges of the internal system
clock after CS↓ before responding to control input signals. No attempt should be made to clock in an address until the minimum
chip CS setup time has elapsed.
B. The eleventh rising edge of the I/O CLOCK sequence must occur before the conversion is complete to prevent losing serial
interface synchronization.
Figure 13. Timing for 11- to 16-Clock Transfer Using CS (Serial Transfer Interval Longer Than Conversion)
Must be High on Power Up
CS
(see Note A)
I/O
CLOCK
1
2
3
4
5
6
7
8
9
10
14
15
16
1
Access Cycle B
Sample Cycle B
See Note A
Low Level
See Note B
DATA
OUT
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
B9
Previous Conversion Data
MSB
LSB
ADDRESS
EOC
B3
MSB
B2
B1
B0
LSB
C3
Shift in New Multiplexer Address,
Simultaneously Shift Out Previous
Conversion Value
A/D Conversion
Interval
Initialize
NOTES: A. The eleventh rising edge of the I/O CLOCK sequence must occur before the conversion is complete to prevent losing serial
interface synchronization.
B. The I/O CLOCK sequence is exactly 16 clock pulses long.
Figure 14. Timing for 16-Clock Transfer Not Using CS (Serial Transfer Interval Longer Than Conversion)
15
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ꢀ ꢁꢂ ꢃ ꢄꢅ ꢆ ꢇꢈ ꢀ ꢁꢂꢃ ꢄꢅ ꢆ ꢉ ꢈ ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢊ
ꢆꢋ ꢆꢌꢂ ꢃ ꢍꢌ ꢎꢉ ꢀ ꢏ ꢐ ꢏꢁ ꢑꢒ ꢌꢀꢑ ꢌꢓꢉ ꢒ ꢉꢀꢏꢁ ꢇꢑ ꢐꢂꢔ ꢕꢀ ꢔꢕꢖ
ꢗꢉ ꢀ ꢘ ꢖꢔ ꢕꢉ ꢏ ꢁ ꢇꢑ ꢐꢀ ꢕꢑ ꢁ ꢏꢐ ꢓ ꢃ ꢃ ꢏꢐ ꢏꢁ ꢑ ꢒ ꢉꢐ ꢙꢚꢀ ꢖ
SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
APPLICATION INFORMATION
1023
1022
1021
1111111111
1111111110
1111111101
See Notes A and B
V
FS
V
FT
= V − 1/2 LSB
FS
513
512
1000000001
1000000000
V
ZT
= V + 1/2 LSB
ZS
511
0111111111
V
ZS
2
1
0
0000000010
0000000001
0000000000
0
0.0048 0.0096
2.4528 2.4576 2.4624
V − Analog Input Voltage − V
4.9056
4.9104 4.9152
I
NOTES: A. This curve is based on the assumption that V
and V
have been adjusted so that the voltage at the transition from digital
0 to 1 (V ) is 0.0024 V and the transition to full scale (V ) is 4.908 V. 1 LSB = 4.8 mV.
ref+
ref−
FT
ZT
B. The full-scale value (V ) is the step whose nominal midstep value has the highest absolute value. The zero-scale value (V
)
ZS
FS
is the step whose nominal midstep value equals zero.
Figure 15. Ideal Conversion Characteristics
TLV1543
15
18
17
1
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
CS
2
I/O CLOCK
ADDRESS
3
Control
Circuit
4
Processor
5
16
19
DATA OUT
EOC
6
Analog
Inputs
7
8
9
14
13
3-V DC Regulated
REF+
REF−
11
12
GND
10
To Source
Ground
Figure 16. Serial Interface
16
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ꢀ ꢁꢂꢃ ꢄ ꢅ ꢆ ꢇꢈ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢆ ꢉꢈ ꢀꢁꢂ ꢃꢄ ꢅꢆ ꢊ
ꢆ ꢋꢆ ꢌꢂ ꢃ ꢍ ꢌꢎꢉ ꢀ ꢏꢐꢏ ꢁꢑ ꢒ ꢌꢀꢑ ꢌꢓꢉꢒ ꢉ ꢀꢏꢁ ꢇꢑ ꢐ ꢂꢔ ꢕꢀ ꢔꢕ ꢖ
ꢗ ꢉꢀ ꢘ ꢖꢔ ꢕꢉꢏ ꢁ ꢇꢑ ꢐꢀ ꢕꢑ ꢁ ꢏꢐꢓ ꢃꢃ ꢏꢐꢏ ꢁꢑ ꢒ ꢉ ꢐꢙ ꢚ ꢀꢖ
SLAS072E − DECEMBER 1992 − REVISED JANUARY 2004
APPLICATION INFORMATION
simplified analog input analysis
Using the equivalent circuit in Figure 17, the time required to charge the analog input capacitance from 0 to V
within 1/2 LSB can be derived as follows:
S
The capacitance charging voltage is given by
−t /R C
c
t i
(1)
V = V 1−e
(
)
C
S
Where:
R = R + r
i
t
s
The final voltage to 1/2 LSB is given by
V (1/2 LSB) = V − (V /2048)
(2)
C
S
S
Equating equation 1 to equation 2 and solving for time t gives
c
−t /R C
c
t i
V −(V /2048) = V 1−e
(3)
(4)
(
)
S
S
S
and
t (1/2 LSB) = R × C × ln(2048)
c
t
i
Therefore, with the values given the time for the analog input signal to settle is
t (1/2 LSB) = (R + 1 kΩ) × 60 pF × ln(2048)
(5)
c
s
This time must be less than the converter sample time shown in the timing diagrams.
†
Driving Source
TLV1543
R
r
i
s
V
I
V
S
V
C
1 kΩ MAX
C
i
60 pF MAX
V
V
= Input Voltage at A0−A10
= External Driving Source Voltage
I
S
s
R = Source Resistance
r
= Input Resistance
i
C = Input Capacitance
i
†
Driving source requirements:
• Noise and distortion for the source must be equivalent to the
resolution of the converter.
• R must be real at the input frequency.
s
Figure 17. Equivalent Input Circuit Including the Driving Source
17
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
Drawing
5962-9689401Q2A
5962-9689401QRA
TLV1543CDB
OBSOLETE
OBSOLETE
ACTIVE
FK
20
20
20
20
20
20
None
None
None
None
None
Call TI
Call TI
Call TI
Call TI
J
SSOP
SSOP
SSOP
SOIC
DB
70
CU NIPDAU Level-1-220C-UNLIM
Call TI Call TI
TLV1543CDBLE
TLV1543CDBR
TLV1543CDW
OBSOLETE
ACTIVE
DB
DB
2000
25
CU NIPDAU Level-1-220C-UNLIM
ACTIVE
DW
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1YEAR/
Level-1-220C-UNLIM
TLV1543CDWR
ACTIVE
SOIC
DW
20
2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1YEAR/
Level-1-220C-UNLIM
TLV1543CFN
TLV1543CFNR
TLV1543CN
ACTIVE
ACTIVE
ACTIVE
PLCC
PLCC
PDIP
FN
FN
N
20
20
20
46
1000
20
None
None
Call TI
Call TI
Call TI
Call TI
Pb-Free
(RoHS)
CU NIPDAU Level-NA-NA-NA
TLV1543CNE4
TLV1543IDB
ACTIVE
ACTIVE
PDIP
N
20
20
20
70
None
Call TI Call TI
SSOP
DB
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLV1543IDBLE
TLV1543IDBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
20
20
None
Call TI
Call TI
2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
TLV1543MFKB
TLV1543MJ
OBSOLETE
OBSOLETE
OBSOLETE
LCCC
CDIP
CDIP
FK
J
20
20
20
None
None
None
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
TLV1543MJB
J
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Mar-2005
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPLC004A – OCTOBER 1994
FN (S-PQCC-J**)
PLASTIC J-LEADED CHIP CARRIER
20 PIN SHOWN
Seating Plane
0.004 (0,10)
0.180 (4,57) MAX
0.120 (3,05)
D
0.090 (2,29)
D1
0.020 (0,51) MIN
3
1
19
0.032 (0,81)
0.026 (0,66)
4
18
D2/E2
D2/E2
E
E1
8
14
0.021 (0,53)
0.013 (0,33)
0.050 (1,27)
9
13
0.007 (0,18)
M
0.008 (0,20) NOM
D/E
D1/E1
D2/E2
NO. OF
PINS
**
MIN
0.385 (9,78)
MAX
MIN
MAX
MIN
MAX
0.395 (10,03)
0.350 (8,89)
0.356 (9,04)
0.141 (3,58)
0.191 (4,85)
0.291 (7,39)
0.341 (8,66)
0.169 (4,29)
0.219 (5,56)
0.319 (8,10)
0.369 (9,37)
20
28
44
52
68
84
0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58)
0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66)
0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20)
0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91)
1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45)
4040005/B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
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Copyright 2005, Texas Instruments Incorporated
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