TLV2354IPWRG4 [TI]

Quad Low Voltage LinCMOS(TM) Differential Comparator 14-TSSOP -40 to 85;
TLV2354IPWRG4
型号: TLV2354IPWRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Quad Low Voltage LinCMOS(TM) Differential Comparator 14-TSSOP -40 to 85

放大器 光电二极管
文件: 总19页 (文件大小:780K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TLV2354, TLV2354Y  
LinCMOS QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS  
SLCS012C – MAY 1992 – REVISED AUGUST 2000  
Wide Range of Supply Voltages  
2 V to 8 V  
Fast Response Time . . . 200 ns Typ for  
TTL-Level Input Step  
Fully Characterized at 3 V and 5 V  
Extremely Low Input Bias Current  
5 pA Typ  
Very-Low Supply-Current Drain  
240 µA Typ at 3 V  
Output Compatible With TTL, MOS, and  
CMOS  
Common-Mode Input Voltage Range  
Includes Ground  
Built-In ESD Protection  
12  
High Input Impedance . . . 10 Typ  
description  
symbol (each comparator)  
The TLV2354 consists of four independent,  
low-power comparators specifically designed for  
single power-supply applications and operateS  
with power-supply rails as low as 2 V. When  
powered from a 3-V supply, the typical supply  
current is only 240 µA.  
IN+  
OUT  
IN–  
The TLV2354 is designed using the Texas Instruments LinCMOS technology and, therefore, features an  
12  
extremely high input impedance (typically greater than 10 ), which allows direct interfacing with  
high-impedance sources. The outputs are N-channel open-drain configurations that require an external pullup  
resistor to provide a positive output voltage swing, and they can be connected to achieve positive-logic  
wired-ANDrelationships. TheTLV2354Iisfullycharacterizedforoperationfrom40°Cto85°C. TheTLV2354M  
is fully characterized for operation from – 55°C to 125°C.  
The TLV2354 has internal electrostatic-discharge (ESD)-protection circuits and has been classified with a  
1000-V ESD rating using human body model testing. However, care should be exercised in handling this device  
as exposure to ESD may result in degradation of the device parametric performance.  
AVAILABLE OPTIONS  
PACKAGED DEVICES  
CHIP  
V
max  
CHIP  
CARRIER  
(FK)  
CERAMIC  
DIP  
PLASTIC  
DIP  
CERAMIC  
FLATPACK  
(W)  
IO  
SMALL  
T
A
FORM  
(Y)  
TSSOP  
(PW)  
at 25°C  
OUTLINE  
(J)  
(N)  
(D)  
40°C to  
85°C  
5 mV  
5 mV  
TLV2354ID  
TLV2354IN  
TLV2354IPW  
TLV2354Y  
55°C to  
125°C  
TLV2354MFK  
TLV2354MJ  
TLV2354MW  
The D package is available taped and reeled. Add the suffix R to the device type (e.g., TLV2352IDR).  
The PW packages are only available left-ended taped and reeled (e.g., TLV2354IPW).  
These devices have limited built-in protection. The leads should be shorted together or the device placed in conductive foam during  
storage or handling to prevent electrostatic damage to the MOS gates.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
LINCMOS is a trademark of Texas Instruments.  
Copyright 2000, Texas Instruments Incorporated  
On products compliant to MIL-PRF-38535, all parameters are tested  
unless otherwise noted. On all other products, production  
processing does not necessarily include testing of all parameters.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV2354, TLV2354Y  
LinCMOS QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS  
SLCS012C – MAY 1992 – REVISED AUGUST 2000  
TLV2354I  
D OR N PACKAGE  
(TOP VIEW)  
TLV2354I  
PW PACKAGE  
(TOP VIEW)  
1OUT  
2OUT  
1OUT  
2OUT  
3OUT  
4OUT  
3OUT  
4OUT  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
V
V
+
V
/GND  
V
/GND  
DD+  
DD  
DD–  
DD–  
2IN–  
2IN+  
1IN–  
1IN+  
2IN–  
2IN+  
1IN–  
1IN+  
4IN+  
4IN–  
3IN+  
3IN–  
4IN+  
4IN–  
3IN+  
3IN–  
8
8
TLV2354M  
J OR W PACKAGE  
(TOP VIEW)  
TLV2354AM, TLV2354M  
FK PACKAGE  
(TOP VIEW)  
1OUT  
2OUT  
3OUT  
4OUT  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
V
+
V
/GND  
DD  
DD–  
3
2
1
20 19  
18  
V
/GND  
V
4
5
6
7
8
DD–  
DD+  
NC  
2IN–  
2IN+  
1IN–  
1IN+  
4IN+  
4IN–  
3IN+  
3IN–  
NC  
17  
16  
15  
14  
4IN+  
NC  
2IN–  
NC  
8
4IN–  
2IN+  
9 10 11 12 13  
NC – No internal connection  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV2254, TLV2254Y  
LinCMOS QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS  
SLCS012C – MAY 1992 – REVISED AUGUST 2000  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV2354, TLV2354Y  
LinCMOS QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS  
SLCS012C – MAY 1992 – REVISED AUGUST 2000  
TLV2354Y chip information  
This chip, when properly assembled, displays characteristics similar to the TLV2354. Thermal compression or  
ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with  
conductive epoxy or a gold-silicon preform.  
BONDING PAD ASSIGNMENTS  
V
DD  
(3)  
(7)  
(6)  
(13)  
(12)  
IN+  
IN–  
+
(10)  
(9)  
(11)  
(1)  
OUT  
(5)  
(4)  
+
IN+  
IN–  
(2)  
OUT  
(14)  
(1)  
(9)  
(8)  
(8)  
(7)  
IN+  
IN–  
+
(14)  
65  
OUT  
(11)  
(10)  
+
IN+  
IN–  
(13)  
OUT  
(12)  
GND  
(6)  
(5)  
(4)  
(3)  
(2)  
CHIP THICKNESS: 15 MILS TYPICAL  
90  
BONDING PADS: 4 × 4 MILS MINIMUM  
T max = 150°C  
J
TOLERANCES ARE ±10%.  
ALL DIMENSIONS ARE IN MILS.  
PIN (11) INTERNALLY CONNECTED  
TO BACKSIDE OF CHIP.  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV2354, TLV2354Y  
LinCMOS QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS  
SLCS012C – MAY 1992 – REVISED AUGUST 2000  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage, V  
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V  
DD  
Differential input voltage, V (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±8 V  
Input voltage range, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 to 8 V  
ID  
I
Output voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V  
O
Input current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±5 mA  
I
Output current, I  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA  
O
Duration of output short-circuit current to GND (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . unlimited  
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table  
Operating free-air temperature range, T : TLV2354I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C to 85°C  
A
TLV2354M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55°C to 125°C  
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D, N, or PW package . . . . . . . . . . . . 260°C  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: FK, J, or W package . . . . . . . . . . . . 300°C  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. All voltage values, except differential voltages, are with respect to network ground.  
2. Differential voltages are at the noninverting input terminal with respect to the inverting input terminal.  
3. Short circuits from outputs to V  
can cause excessive heating and eventual device destruction.  
DD  
DISSIPATION RATING TABLE  
T
25°C  
DERATING  
FACTOR  
T
= 85°C  
T = 125°C  
A
POWER RATING  
A
A
PACKAGE  
POWER RATING  
POWER RATING  
D
FK  
J
N
PW  
W
950 mW  
1375 mW  
1375 mW  
1150 mW  
700 mW  
700 mW  
7.6 mW/°C  
11.0 mW/°C  
11.0 mW/°C  
9.2 mW/°C  
5.6 mW/°C  
5.5 mW/°C  
494 mW  
715 mW  
715 mW  
598 mW  
364 mW  
370 mW  
275 mW  
275 mW  
150 mW  
recommended operating conditions  
MIN  
MAX  
8
UNIT  
Supply voltage, V  
DD  
2
0
V
V
V
= 3 V  
= 5 V  
1.75  
3.75  
85  
DD  
Common-mode input voltage, V  
V
IC  
0
DD  
TLV2354I  
40  
55  
Operating free-air temperature, T  
°C  
A
TLV2354M  
125  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV2354, TLV2354Y  
LinCMOS QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS  
SLCS012C – MAY 1992 – REVISED AUGUST 2000  
electrical characteristics at specified free-air temperature  
TLV2354I  
PARAMETER  
TEST CONDITIONS  
V
= 3 V  
DD  
TYP  
V
= 5 V  
DD  
TYP  
UNIT  
T
A
MIN  
MAX MIN  
MAX  
25°C  
Full range  
25°C  
1
1
5
5
7
1
1
5
5
7
V
Input offset voltage  
Input offset current  
Input bias current  
V
IC  
= V  
min,  
ICR  
See Note 4  
mV  
IO  
pA  
nA  
pA  
nA  
I
IO  
85°C  
1
1
2
25°C  
I
IB  
85°C  
2
25°C  
0 to 2  
0 to 4  
Common-mode input  
voltage range  
V
ICR  
V
0 to  
1.75  
0 to  
3.75  
Full range  
25°C  
Full range  
25°C  
0.1  
0.1  
nA  
High-level output  
current  
I
V
ID  
= 1 V  
OH  
1
300  
600  
1
400  
700  
µA  
115  
150  
Low-level output  
voltage  
V
V
ID  
V
ID  
V
ID  
= 1 V,  
= 1 V,  
= 1 V,  
I
= 2 mA  
mA  
mA  
µA  
OL  
OL  
Full range  
Low-level output  
current  
I
I
V
= 1.5 V  
25°C  
6
16  
6
16  
OL  
OL  
25°C  
240  
500  
700  
290  
600  
800  
Supply current  
No load  
DD  
Full range  
All characteristics are measured with zero common-mode input voltage unless otherwise noted.  
Full range is 40°C to 85°C. IMPORTANT: See Parameter Measurement Information.  
NOTE 4: The offset voltage limits given are the maximum values required to drive the output above 4 V with V  
= 5 V, 2 V with V  
DD  
= 3 V, or  
DD  
below 400 mV with a 10-kresistor between the output and V . They can be verified by applying the limit value to the input and  
DD  
checking for the appropriate output state.  
switching characteristics, V  
= 3 V, T = 25°C  
A
DD  
TLV2354I  
TYP  
PARAMETER  
TEST CONDITIONS  
UNIT  
MIN  
MAX  
§
= 15 pF ,  
R
= 5.1 k,  
C
L
L
Response time  
100-mV input step with 5-mV overdrive  
640  
ns  
See Note 5  
§
C
includes probe and jig capacitance.  
L
NOTE 5: The response time specified is the interval between the input step function and the instant when the output crosses V = 1 V with  
O
V
DD  
= 3 V or when the output crosses V = 1.4 with V  
= 5 V.  
DD  
O
switching characteristics, V  
= 5 V, T = 25°C  
A
DD  
TLV2354I  
TYP  
PARAMETER  
TEST CONDITIONS  
UNIT  
MIN  
MAX  
§
= 15 pF ,  
100-mV input step with 5-mV overdrive  
TTL-level input step  
650  
R
= 5.1 k,  
C
L
L
Response time  
ns  
See Note 5  
200  
§
C
includes probe and jig capacitance.  
L
NOTE 5: The response time specified is the interval between the input step function and the instant when the output crosses V = 1 V with  
O
V
DD  
= 3 V or when the output crosses V = 1.4 with V  
= 5 V.  
O
DD  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV2354, TLV2354Y  
LinCMOS QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS  
SLCS012C – MAY 1992 – REVISED AUGUST 2000  
electrical characteristics at specified free-air temperature  
TLV2354M  
PARAMETER  
TEST CONDITIONS  
V
= 3 V  
V
= 5 V  
UNIT  
T
A
DD  
TYP  
DD  
TYP  
MIN  
MAX MIN  
MAX  
5
25°C  
Full range  
25°C  
1
1
5
5
1
1
5
V
IO  
Input offset voltage  
Input offset current  
Input bias current  
V
IC  
= V  
min,  
ICR  
See Note 4  
mV  
10  
10  
pA  
nA  
pA  
nA  
I
IO  
125°C  
25°C  
10  
10  
20  
I
IB  
125°C  
25°C  
20  
0 to 2  
0 to 4  
Common-mode input  
voltage range  
V
ICR  
V
0 to  
1.75  
0 to  
3.75  
Full range  
25°C  
Full range  
25°C  
0.1  
0.1  
nA  
High-level output  
current  
I
V
ID  
= 1 V  
OH  
1
300  
600  
1
400  
700  
µA  
115  
150  
Low-level output  
voltage  
V
V
ID  
V
ID  
V
ID  
= 1 V,  
= 1 V,  
= 1 V,  
I
= 2 mA  
mA  
mA  
µA  
OL  
OL  
Full range  
Low-level output  
current  
I
I
V
= 1.5 V  
25°C  
6
16  
6
16  
OL  
OL  
25°C  
240  
500  
700  
290  
600  
800  
Supply current  
No load  
DD  
Full range  
All characteristics are measured with zero common-mode input voltage unless otherwise noted.  
Full range is 55°C to 125°C. IMPORTANT: See Parameter Measurement Information.  
NOTE 4: The offset voltage limits given are the maximum values required to drive the output above 4 V with V  
= 5 V, 2 V with V  
DD  
= 3 V, or  
DD  
below 400 mV with a 10-kresistor between the output and V . They can be verified by applying the limit value to the input and  
DD  
checking for the appropriate output state.  
switching characteristics, V  
= 3 V, T = 25°C  
A
DD  
TLV2354M  
MIN TYP  
PARAMETER  
TEST CONDITIONS  
UNIT  
MAX  
§
= 100 pF ,  
R
= 5.1 k,  
C
L
L
Response time  
100-mV input step with 5-mV overdrive  
1400  
ns  
See Note 5  
§
C
includes probe and jig capacitance.  
L
NOTE 5: The response time specified is the interval between the input step function and the instant when the output crosses V = 1 V with  
O
V
DD  
= 3 V or when the output crosses V = 1.4 with V  
= 5 V.  
DD  
O
switching characteristics, V  
= 5 V, T = 25°C  
A
DD  
TLV2354M  
MIN TYP  
PARAMETER  
TEST CONDITIONS  
UNIT  
MAX  
1300  
900  
§
= 100 pF ,  
100-mV input step with 5-mV overdrive  
TTL-level input step  
R
= 5.1 k,  
C
L
L
Response time  
ns  
See Note 5  
§
C
includes probe and jig capacitance.  
L
NOTE 5: The response time specified is the interval between the input step function and the instant when the output crosses V = 1 V with  
O
V
DD  
= 3 V or when the output crosses V = 1.4 with V  
= 5 V.  
O
DD  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV2354, TLV2354Y  
LinCMOS QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS  
SLCS012C – MAY 1992 – REVISED AUGUST 2000  
electrical characteristics at specified free-air temperature, T = 25°C  
A
TLV2354Y  
PARAMETER  
TEST CONDITIONS  
V
= 3 V  
DD  
TYP  
V
= 5 V  
DD  
TYP  
UNIT  
MIN  
MAX MIN  
MAX  
V
Input offset voltage  
V
= V min, See Note 4  
ICR  
1
1
5
5
1
1
5
5
mV  
pA  
pA  
V
IO  
IC  
I
I
Input offset current  
IO  
Input bias current  
IB  
V
ICR  
Common-mode input voltage range  
High-level output current  
Low-level output voltage  
Low-level output current  
Supply current  
0 to 2  
0 to 4  
I
V
ID  
V
ID  
V
ID  
V
ID  
= 1 V  
0.1  
115  
16  
0.1  
150  
16  
nA  
mV  
mA  
µA  
OH  
V
OL  
= 1 V,  
= 1 V,  
= 1 V,  
I
= 2 mA  
300  
6
400  
600  
OL  
I
I
V
= 1.5 V  
6
OL  
OL  
No load  
240  
500  
290  
DD  
All characteristics are measured with zero common-mode input voltage unless otherwise noted.  
NOTE 4: The offset voltage limits given are the maximum values required to drive the output above 4 V with V  
= 5 V, 2 V with V  
DD  
= 3 V, or  
DD  
below 400 mV with a 10-kresistor between the output and V . They can be verified by applying the limit value to the input and  
DD  
checking for the appropriate output state.  
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV2354, TLV2354Y  
LinCMOS QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS  
SLCS012C – MAY 1992 – REVISED AUGUST 2000  
TYPICAL CHARACTERISTICS  
LOW-LEVEL OUTPUT VOLTAGE  
vs  
LOW-LEVEL OUTPUT CURRENT  
SUPPLY CURRENT  
vs  
FREE-AIR TEMPERATURE  
1100  
990  
880  
770  
660  
550  
440  
330  
380  
360  
340  
320  
300  
280  
260  
V
T
= 3 V  
= 25°C  
No Load  
DD  
A
V
= 5 V  
DD  
V
DD  
= 3 V  
240  
220  
200  
180  
220  
110  
0
0
2
4
6
8
10  
12  
14  
16  
– 75 – 50 –25  
0
25  
50  
75  
100 125  
I
– Low-Level Output Current – mA  
T
A
– Free-Air Temperature – °C  
OL  
Figure 1  
Figure 2  
COMMON-MODE INPUT VOLTAGE RANGE  
OUTPUT FALL TIME  
vs  
vs  
FREE-AIR TEMPERATURE  
CAPACITIVE LOAD  
3
2.5  
2
50  
45  
40  
35  
30  
25  
20  
15  
V
DD  
= 3 V  
V
= 3 V  
DD  
Overdrive = 10 mV  
Positive Limit  
R
T
A
= 5.1 k(pullup to V  
= 25°C  
)
DD  
L
1.5  
1
0.5  
0
Negative Limit  
10  
5
– 0.5  
0
– 1  
0
10 20 30 40 50 60 70 80 90 100  
– 75 – 50 – 25  
0
25  
50  
75 100 125  
C
– Capacitive Load – pF  
T
A
– Free-Air Temperature – °C  
L
Figure 3  
Figure 4  
9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV2354, TLV2354Y  
LinCMOS QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS  
SLCS012C – MAY 1992 – REVISED AUGUST 2000  
TYPICAL CHARACTERISTICS  
HIGH-TO-LOW-LEVEL OUTPUT  
PROPAGATION DELAY  
HIGH-TO-LOW-LEVEL OUTPUT  
PROPAGATION DELAY  
FOR VARIOUS OVERDRIVE VOLTAGES  
FOR VARIOUS CAPACITIVE LOADS  
V
C
R
= 3 V  
= 15 pF  
= 5.1 k(pullup to V  
= 25°C  
V
= 3 V  
DD  
L
L
DD  
Overdrive = 10 mV  
)
R = 5.1 k(pullup to V  
T = 25°C  
A
)
DD  
L
DD  
T
A
3
0
3
0
C
= 100 pF  
L
20 mV  
5 mV  
C = 15 pF  
L
10 mV  
C
= 50 pF  
L
100  
0
100  
0
0
100 200 300 400 500 600 700 800 900 1000  
– High-to-Low-Level Output  
0
100 200 300 400 500 600 700 800 900 1000  
– High-to-Low-Level Output  
t
t
PHL  
PHL  
Propagation Delay Time – ns  
Propagation Delay Time – ns  
Figure 5  
Figure 6  
LOW-TO-HIGH-LEVEL OUTPUT  
PROPAGATION DELAY  
LOW-TO-HIGH-LEVEL OUTPUT  
PROPAGATION DELAY  
FOR VARIOUS CAPACITIVE LOADS  
FOR VARIOUS OVERDRIVE VOLTAGES  
V
= 3 V  
V
= 3 V  
= 15 pF  
= 5.1 k(pullup to V  
= 25°C  
DD  
DD  
L
L
Overdrive = 10 mV  
C
R
T
R
T
= 5.1 k(pullup to V  
= 25°C  
)
DD  
)
L
DD  
C
= 50 pF  
L
A
A
3
0
3
0
20 mV  
C
= 15 pF  
L
5 mV  
10 mV  
C
= 100 pF  
L
100  
0
100  
0
0
100 200 300 400 500 600 700 800 900 1000  
– Low-to-High-Level Output  
0
100 200 300 400 500 600 700 800 900 1000  
– Low-to-High-Level Output  
t
t
PLH  
PLH  
Propagation Delay Time – ns  
Propagation Delay Time – ns  
Figure 7  
Figure 8  
10  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV2354, TLV2354Y  
LinCMOS QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS  
SLCS012C – MAY 1992 – REVISED AUGUST 2000  
PARAMETER MEASUREMENT INFORMATION  
The digital output stage of the TLV2354 can be damaged if it is held in the linear region of the transfer curve.  
Conventional operational amplifier/comparator testing incorporates the use of a servo loop that is designed to force  
the device output to a level within this linear region. Since the servo-loop method of testing cannot be used, the  
following alternatives for measuring parameters such as input offset voltage, common-mode rejection, etc., are  
offered.  
To verify that the input offset voltage falls within the limits specified, the limit value is applied to the input as shown  
in Figure 9(a). With the noninverting input positive with respect to the inverting input, the output should be high. With  
the input polarity reversed, the output should be low.  
A similar test can be made to verify the input offset voltage at the common-mode extremes. The supply voltages can  
be slewed as shown in Figure 9(b) for the V  
accuracy.  
test rather than changing the input voltages to provide greater  
ICR  
5 V  
1 V  
5.1 kΩ  
5.1 kΩ  
+
+
Applied V  
Limit  
Applied V  
Limit  
IO  
IO  
V
O
V
O
– 4 V  
(a) V WITH V = 0  
IO IC  
(b) V WITH V = 4 V  
IO IC  
Figure 9. Method for Verifying That Input Offset Voltage Is Within Specified Limits  
A close approximation of the input offset voltage can be obtained by using a binary search method to vary the  
differential input voltage while monitoring the output state. When the applied input voltage differential is equal but  
opposite in polarity to the input offset voltage, the output changes states.  
11  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV2354, TLV2354Y  
LinCMOS QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS  
SLCS012C – MAY 1992 – REVISED AUGUST 2000  
PARAMETER MEASUREMENT INFORMATION  
Figure 10 illustrates a practical circuit for direct dc measurement of input offset voltage that does not bias the  
comparator in the linear region. The circuit consists of a switching-mode servo loop in which U1a generates a  
triangular waveform of approximately 20-mV amplitude. U1b acts as a buffer, with C2 and R4 removing any residual  
dc offset. The signal is then applied to the inverting input of the comparator under test while the noninverting input  
is driven by the output of the integrator formed by U1c through the voltage divider formed by R9 and R10. The loop  
reaches a stable operating point when the output of the comparator under test has a duty cycle of exactly 50%, which  
can only occur when the incoming triangle wave is sliced symmetrically or when the voltage at the noninverting input  
exactly equals the input offset voltage.  
Voltage dividers R9 and R10 provide a step up of the input offset voltage by a factor of 100 to make measurement  
easier. The values of R5, R8, R9, and R10 can significantly influence the accuracy of the reading; therefore, it is  
suggested that their tolerance level be 1% or lower.  
Measuring the extremely low values of input current requires isolation from all other sources of leakage current and  
compensation for the leakage of the test socket and board. With a good picoammeter, the socket and board leakage  
can be measured with no device in the socket. Subsequently, this open-socket leakage value can be subtracted from  
the measurement obtained with a device in the socket to obtain the actual input current of the device.  
V
DD  
C3  
0.68 µF  
R5  
1.8 kΩ, 1%  
U1b 1/4  
TLV2354  
C2  
1 µF  
U1c 1/4  
Buffer  
+
TLV2354  
R6  
5.1 kΩ  
+
DUT  
+
R7  
1 MΩ  
R4  
47 kΩ  
V
IO  
(×100)  
Integrator  
R1  
240 kΩ  
R8  
1.8 kΩ, 1%  
U1a 1/4  
TLV2354  
C4  
0.1 µF  
+
C1  
0.1 µF  
Triangle  
R9  
10 kΩ, 1%  
Generator  
R10  
100 Ω, 1%  
R2  
10 kΩ  
R3  
100 Ω  
Figure 10. Circuit for Input Offset Voltage Measurement  
12  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLV2354, TLV2354Y  
LinCMOS QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS  
SLCS012C – MAY 1992 – REVISED AUGUST 2000  
PARAMETER MEASUREMENT INFORMATION  
Propagationdelaytimeisdefinedastheintervalbetweentheapplicationofaninputstepfunctionandtheinstantwhen  
the output crosses V = 1 V with V  
= 3 V or when the output crosses V = 1.4 V with V  
= 5 V. Propagation delay  
O
DD  
O
DD  
time, low-to-high-level output, is measured from the leading edge of the input pulse, while propagation delay time,  
high-to-low-level output, is measured from the trailing edge of the input pulse. Propagation-delay-time measurement  
at low input signal levels can be greatly affected by the input offset voltage. The offset voltage should be balanced  
by the adjustment at the inverting input (as shown in Figure 11) so that the circuit is just at the transition point. Then  
a low signal, for example a 105-mV or 5-mV overdrive, causes the output to change state.  
V
DD  
Pulse  
Generator  
1 µF  
5.1 kΩ  
50 Ω  
+
DUT  
+ 1 V  
Input Offset Voltage  
Compensation  
Adjustment  
C
10 Ω  
10 Turn  
L
(see Note A)  
1 kΩ  
– 1 V  
0.1 µF  
TEST CIRCUIT  
Overdrive  
Overdrive  
Input  
100 mV  
Input  
100 mV  
90%  
90%  
Low- to High-  
Level Output  
High- to Low-  
Level Output  
V
= 1 V With V  
or  
= 1.4 V With V  
= 3 V  
DD  
O
V
O
= 5 V  
DD  
10%  
10%  
t
t
r
f
t
t
PHL  
PLH  
VOLTAGE WAVEFORMS  
NOTE A: C includes probe and jig capacitance.  
L
Figure 11. Propagation Delay, Rise, and Fall Times Test Circuit and Voltage Waveforms  
13  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
5962-9688201Q2A  
ACTIVE  
LCCC  
FK  
20  
1
TBD  
POST-PLATE  
N / A for Pkg Type  
-55 to 125  
5962-  
9688201Q2A  
TLV2354  
MFKB  
5962-9688201QCA  
5962-9688201QDA  
ACTIVE  
ACTIVE  
CDIP  
CFP  
J
14  
14  
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
5962-9688201QC  
A
TLV2354MJB  
W
5962-9688201QD  
A
TLV2354MWB  
TLV2354ID  
TLV2354IDG4  
TLV2354IDR  
TLV2354IDRG4  
TLV2354IN  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
50  
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
TLV2354I  
TLV2354I  
TLV2354I  
TLV2354I  
TLV2354IN  
TLV2354IN  
TY2354  
Green (RoHS  
& no Sb/Br)  
SOIC  
D
2500  
2500  
25  
Green (RoHS  
& no Sb/Br)  
SOIC  
D
Green (RoHS  
& no Sb/Br)  
PDIP  
N
Pb-Free  
(RoHS)  
TLV2354INE4  
TLV2354IPW  
TLV2354IPWG4  
PDIP  
N
25  
Pb-Free  
(RoHS)  
N / A for Pkg Type  
TSSOP  
TSSOP  
PW  
PW  
90  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
90  
Green (RoHS  
& no Sb/Br)  
TY2354  
TLV2354IPWLE  
TLV2354IPWR  
OBSOLETE  
ACTIVE  
TSSOP  
TSSOP  
PW  
PW  
14  
14  
TBD  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
2000  
2000  
1
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
TY2354  
TY2354  
TLV2354IPWRG4  
TLV2354MFKB  
ACTIVE  
ACTIVE  
TSSOP  
LCCC  
PW  
FK  
14  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
N / A for Pkg Type  
-40 to 85  
TBD  
POST-PLATE  
-55 to 125  
5962-  
9688201Q2A  
TLV2354  
MFKB  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
TLV2354MJB  
TLV2354MWB  
ACTIVE  
CDIP  
CFP  
J
14  
14  
1
TBD  
A42  
A42  
N / A for Pkg Type  
-55 to 125  
5962-9688201QC  
A
TLV2354MJB  
ACTIVE  
W
1
TBD  
N / A for Pkg Type  
-55 to 125  
5962-9688201QD  
A
TLV2354MWB  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
OTHER QUALIFIED VERSIONS OF TLV2354, TLV2354M :  
Catalog: TLV2354  
Military: TLV2354M  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Military - QML certified for Military and Defense Applications  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Jan-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TLV2354IDR  
SOIC  
D
14  
14  
2500  
2000  
330.0  
330.0  
16.4  
12.4  
6.5  
6.9  
9.0  
5.6  
2.1  
1.6  
8.0  
8.0  
16.0  
12.0  
Q1  
Q1  
TLV2354IPWR  
TSSOP  
PW  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Jan-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TLV2354IDR  
SOIC  
D
14  
14  
2500  
2000  
367.0  
367.0  
367.0  
367.0  
38.0  
35.0  
TLV2354IPWR  
TSSOP  
PW  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
Medical  
Logic  
Security  
www.ti.com/security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense  
Video and Imaging  
www.ti.com/space-avionics-defense  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/omap  
OMAP Applications Processors  
Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
www.ti.com/wirelessconnectivity  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2013, Texas Instruments Incorporated  

相关型号:

TLV2354M

LinCMOS™ 四路低电压差分比较器
TI

TLV2354MFK

LinCMOSE QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS
TI

TLV2354MFKB

LinCMOS™ 四路低电压差分比较器 | FK | 20 | -55 to 125
TI

TLV2354MJ

LinCMOSE QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS
TI

TLV2354MJB

LinCMOS™ Quad Low-Voltage Differential Comparator 14-CDIP -55 to 125
TI

TLV2354MW

LinCMOSE QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS
TI

TLV2354MWB

LinCMOS™ 四路低电压差分比较器 | W | 14 | -55 to 125
TI

TLV2354Y

LinCMOSE QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS
TI

TLV2361

HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
TI

TLV2361CDBV

HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
TI

TLV2361CDBVR

HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
TI

TLV2361CDBVRE4

HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS
TI