TLV2371-DIE [TI]

TLV2371-DIE Rail-to-Rail Input/Output Operational Amplifier with Shutdown;


型号：	TLV2371-DIE
厂家：	TEXAS INSTRUMENTS
描述：	TLV2371-DIE Rail-to-Rail Input/Output Operational Amplifier with Shutdown
文件：	总5页 (文件大小：70K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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TLV2371-DIE

SLOS872 –MARCH 2014

TLV2371-DIE Rail-to-Rail Input/Output Operational Amplifier with Shutdown

1 Features

2 Description

The TLV2371-DIE single supply operational amplifier

provides rail-to-rail input and output capability. The

TLV2371-DIE takes the minimum operating supply

voltage down. The maximum recommended supply

voltage is 16 V, which allows the devices to be

operated from (±8 V supplies down to ±1.35 V) a

variety of rechargeable cells.

•

Rail-To-Rail Input/Output

Wide Bandwidth

•

High Slew Rate

Supply Voltage Range

Supply Current

Low Power Shutdown Mode

Input Noise Voltage

Input Bias Current

The CMOS inputs enable use in high-impedance

sensor interfaces, with the lower voltage operation

making an ideal alternative for the TLV2371-DIE in

battery-powered applications. The rail-to-rail input

stage further increases its versatility.

Ordering Information⁽¹⁾

PACKAGE

PRODUCT

PACKAGE

ORDERABLE PART NUMBER

PACKAGE QUANTITY

DESIGNATOR

TLV2371TDA1

TLV2371TDA2

360

TLV2371

Bare die in waffle pack⁽²⁾

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality

Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room

temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not

warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

TLV2371-DIE

SLOS872 –MARCH 2014

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

3 Bare Die Information

BACKSIDE

POTENTIAL

BOND PAD

METALLIZATION COMPOSITION

BOND PAD

THICKNESS

DIE THICKNESS

BACKSIDE FINISH

Silicon with backgrind

10.5 mils.

Floating

AlCu

1500 nm

Bond Pad Coordinates in Microns

DESCRIPTION

PAD NUMBER

X MIN

Y MIN

511.25

X MAX

109.5

389.5

823.5

455.5

Y MAX

596.25

112

OUT

VDD

N/C

IN-

24.5

304.5

738.5

370.5

26.75

511.25

111.75

596.25

IN+

GND

Submit Documentation Feedback

PACKAGE OPTION ADDENDUM

www.ti.com

1-Apr-2014

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(6)

(3)

(4/5)

TLV2371TDA1

TLV2371TDA2

ACTIVE

360

TBD

Call TI

N / A for Pkg Type

25 Only

ACTIVE

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

⁽⁶⁾Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

1-Apr-2014

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

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TLV2371-DIE [TI]

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