TLV2451CDBVR_技术文档

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SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

D

Supply Current . . . 23 µA/Channel

Operational Amplifier

Gain-Bandwidth Product . . . 220 kHz

Output Drive Capability . . . 10 mA

Input Offset Voltage . . . 20 µV (typ)

−

+

V

Range . . . 2.7 V to 6 V

DD

Power Supply Rejection Ratio . . . 106 dB

Ultralow-Power Shutdown Mode

I

. . . 16 nA/ch

DD

D

Rail-To-Rail Input/Output (RRIO)

D

Ultrasmall Packaging

− 5 or 6 Pin SOT-23 (TLV2450/1)

− 8 or 10 Pin MSOP (TLV2452/3)

description

The TLV245x is a family of rail-to-rail input/output operational amplifiers that sets a new performance point for

supply current and ac performance. These devices consume a mere 23 µA/channel while offering 220 kHz of

gain-bandwidth product, much higher than competitive devices with similar supply current levels. Along with

increased ac performance, the amplifier provides high output drive capability, solving a major shortcoming of

older micropower rail-to-rail input/output operational amplifiers. The TLV245x can swing to within 250 mV of

each supply rail while driving a 2.5-mA load. Both the inputs and outputs swing rail-to-rail for increased dynamic

range in low-voltage applications. This performance makes the TLV245x family ideal for portable medical

equipment, patient monitoring systems, and data acquisition circuits.

FAMILY PACKAGE TABLE

PACKAGE TYPES

SOIC SOT-23 TSSOP MSOP

NUMBER OF

CHANNELS

UNIVERSAL

EVM BOARD

DEVICE

TLV2450

SHUTDOWN

PDIP

8

1

2

4

8

6

—

14

16

—

8

Yes

—

TLV2451

TLV2452

TLV2453

TLV2454

TLV2455

8

5

Refer to the EVM

Selection Guide

(Lit# SLOU060)

8

—

14

16

14

16

10

—

Yes

—

Yes

†

A SELECTION OF SINGLE-SUPPLY OPERATIONAL AMPLIFIER PRODUCTS

V

BW

(MHz)

SLEW RATE

I

(per channel)

(µA)

DD

DEVICE

RAIL-TO-RAIL

(V)

(V/µs)

TLV245X

TLV247X

TLV246X

TLV277X

2.7 − 6.0

2.5 − 6.0

0.22

2.8

6.4

5.1

0.11

1.5

23

600

550

1000

I/O

O

1.6

10.5

†

All specifications measured at 5 V.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

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Copyright  1998−2005, Texas Instruments Incorporated

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1

WWW.TI.COM

^{POST OFFICE BOX 1443}• HOUSTON, TEXAS 77251−1443

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SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

description (continued)

Three members of the family (TLV2450/3/5) offer a shutdown terminal for conserving battery life in portable

applications. During shutdown, the outputs are placed in a high-impedance state and the amplifier consumes

only 16 nA/channel. The family is fully specified at 3 V and 5 V across an expanded industrial temperature range

(−40°C to 125°C). The singles and duals are available in the SOT23 and MSOP packages, while the quads are

available in TSSOP. The TLV2450 offers an amplifier with shutdown functionality all in a 6-pin SOT23 package,

making it perfect for high density circuits.

TLV2450 and TLV2451 AVAILABLE OPTIONS

PACKAGED DEVICES

SOT-23

(DBV)

T

A

SMALL OUTLINE

PLASTIC DIP

(P)

†

(D)

SYMBOL

TLV2450CD

TLV2451CD

TLV2450CDBV

TLV2451CDBV

VAQC

VARC

TLV2450CP

TLV2451CP

0°C to 70°C

TLV2450ID

TLV2451ID

TLV2450IDBV

TLV2451IDBV

VAQI

VARI

TLV2450IP

TLV2451IP

−40°C to 125°C

TLV2450AID

TLV2451AID

—

TLV2450AIP

TLV2451AIP

†

This package is available taped and reeled. To order this packaging option, add an R suffix to the part

number (e.g., TLV2450CDR).

TLV2452 and TLV2453 AVAILABLE OPTIONS

PACKAGED DEVICES

SMALL

PLASTIC

DIP

PLASTIC

DIP

MSOP

‡

T

A

OUTLINE

†

‡

SYMBOL

†

(DGK)

SYMBOL

(DGS)

(D)

(N)

(P)

TLV2452CD

TLV2453CD

TLV2452CDGK

—

xxTIABI

—

xxTIABK

—

TLV2452CP

—

0°C to 70°C

TLV2453CDGS

TLV2453CN

TLV2452ID

TLV2453ID

TLV2452IDGK

—

xxTIABJ

—

xxTIABL

—

TLV2452IP

—

TLV2453IDGS

TLV2453IN

−40°C to 125°C

TLV2452AID

TLV2453AID

—

TLV2452AIP

—

TLV2453AIN

†

‡

This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2452CDR).

xx represents the device date code.

TLV2454 and TLV2455 AVAILABLE OPTIONS

PACKAGED DEVICES

T

A

SMALL OUTLINE

PLASTIC DIP

(N)

TSSOP

(PW)

†

(D)

TLV2454CD

TLV2455CD

TLV2454CN

TLV2455CN

TLV2454CPW

TLV2455CPW

0°C to 70°C

TLV2454ID

TLV2455ID

TLV2454IN

TLV2455IN

TLV2454IPW

TLV2455IPW

−40°C to 125°C

TLV2454AID

TLV2455AID

TLV2454AIN

TLV2455AIN

TLV2454AIPW

TLV2455AIPW

†

This package is available taped and reeled. To order this packaging option, add an

R suffix to the part number (e.g., TLV2454CDR).

NOTE: For the most current package and ordering information, see the Package Option Addendum located at the

end of this data sheet, or refer to our web site at www.ti.com.

2

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SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

(1)

TLV245x PACKAGE PINOUTS

TLV2450

D OR P PACKAGE

(TOP VIEW)

TLV2451

DBV PACKAGE

(TOP VIEW)

TLV2450

DBV PACKAGE

(TOP VIEW)

1

2

3

5

V

DD+

V

OUT

GND

OUT

GND

1

2

6

5

NC

IN−

SHDN

DD+

1

2

3

4

8

7

6

5

V

+

DD

SHDN

IN−

IN+

OUT

NC

GND

4

IN−

IN+

3

4

TLV2452

D, DGK, OR P PACKAGE

(TOP VIEW)

TLV2451

D OR P PACKAGE

(TOP VIEW)

TLV2453

DGS PACKAGE

(TOP VIEW)

1OUT

1IN−

1IN+

GND

V

+

DD

1

2

3

4

8

7

6

5

NC

IN−

NC

1

2

3

4

8

7

6

5

1

1OUT

1IN−

1IN+

GND

1SHDN

V

2OUT

2IN−

2IN+

2SHDN

+

DD

10

2OUT

2IN−

2IN+

V

+

2

3

4

5

DD

9

8

7

6

IN+

OUT

NC

GND

TLV2453

D OR N PACKAGE

TLV2454

D, N, OR PW PACKAGE

TLV2455

D, N, OR PW PACKAGE

(TOP VIEW)

1OUT

V

+

1

2

3

4

5

6

7

14

13

12

11

10

9

1OUT

1IN−

1IN+

4OUT

4IN−

DD

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

1

2

3

4

5

6

7

14

13

12

11

10

9

1OUT

1IN−

1IN+

4OUT

4IN−

4IN+

GND

3IN+

3IN−

3OUT

1IN−

1IN+

2OUT

2IN−

2IN+

NC

4IN+

GND

NC

V

+

GND

V

+

DD

2IN+

2IN−

3IN+

2IN+

2IN−

1SHDN

NC

2SHDN

NC

3IN−

8

2OUT

3OUT

3/4SHDN

8

2OUT

1/2SHDN

NC − No internal connection

(1) SOT−23 may or may not be indicated

TYPICAL PIN 1 INDICATORS

Pin 1

Printed or

Molded Dot

Pin 1

Stripe

Bevel Edges

Molded ”U” Shape

3

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^{POST OFFICE BOX 1443}• HOUSTON, TEXAS 77251−1443

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ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒꢓ ꢔ ꢕꢋ ꢎ ꢁꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀ ꢙꢐ ꢘꢀ ꢗꢘ ꢀ

ꢑ

µ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

†

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage, V

Differential input voltage, V

(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V

DD

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

V

ID

DD

Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table

Operating free-air temperature range, T : C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C

A

I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 125°C

Maximum junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C

J

Storage temperature range, T

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C

stg

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE: All voltage values, except differential voltages, are with respect to GND.

DISSIPATION RATING TABLE

θ

T ≤ 25°C

A

POWER RATING

JC

JA

PACKAGE

(°C/W)

D (8)

38.3

176

710 mW

D (14)

D (16)

26.9

25.7

55

122.3

114.7

324.1

294.3

259.9

1022 mW

1090 mW

385 mW

425 mW

481 mW

DBV (5)

DBV (6)

DGK (8)

55

54.2

DGS (10)

N (14, 16)

P (8)

54.1

32

257.7

78

485 mW

1600 mW

1200 mW

720 mW

774 mW

41

104

PW (14)

PW (16)

29.3

28.7

173.6

161.4

recommended operating conditions

MIN

2.7

1.35

0

MAX

UNIT

Single supply

6

3

Supply voltage, V

DD

V

Split supply

Common-mode input voltage range, V

ICR

V

DD

70

C-suffix

I-suffix

0

Operating free-air temperature, T

°C

A

−40

2

125

V

IH

IL

V

‡

V

= 5V

= 3V

0.8

0.5

Shutdown on/off voltage level

DD

V

DD

‡

Relative to voltage on the GND terminal of the device.

4

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ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒ ꢓꢔ ꢕꢋꢎ ꢁ ꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀꢙ ꢐ ꢘ ꢀꢗ ꢘꢀ

ꢑ

µ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

electrical characteristics at specified free-air temperature, V

= 3 V (unless otherwise noted)

DD

†

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

1500

2000

1000

1300

T

A

UNIT

25°C

Full range

25°C

300

TLV245x

V

IO

Input offset voltage

µV

300

TLV245xA

Full range

Temperature coefficient of input

offset voltage

V

=

1.5 V

V

R

= 0,

= 50 Ω

DD

O

S

α

0.3

µV/°C

nA

V

VIO

= 0,

IC

25°C

Full range

25°C

4.5

5.5

5

I

IO

Input offset current

0.9

2.95

0.09

12

I

IB

Input bias current

Full range

25°C

7

2.85

2.83

V

High-level output voltage

Low-level output voltage

V

= 1.5 V,

I

= −500 µA

= 500 µA

OH

OL

IC

OH

Full range

25°C

0.16

0.2

V

IC

OL

Full range

25°C

4

3

2

1

Sourcing

Sinking

Full range

25°C

I

Short-circuit output current

Output current

mA

OS

7

Full range

25°C

V

= 0.5 V from rail

= 1 V,

O(PP)

4

O

25°C

96

91

110

Large-signal differential voltage

amplification

A

VD

V

dB

Ω

R

= 10 kΩ

L

Full range

25°C

9

10

r

Differential input resistance

i(d)

Common-mode input

capacitance

C

f = 10 kHz

f = 10 kHz,

25°C

4.5

pF

IC

z

Closed-loop output impedance

A

= 10

25°C

80

Ω

o

V

70

66

76

74

88

84

dB

V

R

= 0 to 3 V,

= 50 Ω

IC

S

CMRR

Common-mode rejection ratio

TLV245xC

Full range

25°C

89

106

23

V

= 2.7 V to 6 V,

V

IC

= V

/2,

DD

No load

Full range

25°C

Supply voltage rejection ratio

k

dB

SVR

(∆V

DD

/∆V )

IO

V

= 3 V to 5 V,

V

IC

= V

DD

No load

DD

Full range

25°C

35

40

45

65

70

80

TLV245xC

TLV245xI

Full range

25°C

I

Supply current (per channel)

V

= 1.5 V, No load

O

µA

DD

12

Supply current in shutdown

mode (TLV2450, TLV2453,

TLV2455) (per channel)

TLV245xC

TLV245xI

Full range

SHDN = −V

DD

nA

DD(SHDN)

†

Full range is 0°C to 70°C for C suffix and −40°C to 125°C for I suffix.

5

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ꢀ ꢁꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢀ ꢁꢂꢃ ꢄꢅ ꢈ ꢇ ꢀꢁꢂ ꢃ ꢄꢅ ꢃ ꢇ ꢀꢁꢂ ꢃ ꢄꢅ ꢉ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢅ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢊ ꢋ

ꢌ

ꢋ

ꢍ

ꢎ

ꢁ

ꢏ

ꢐ

ꢌ

ꢐꢗ ꢚ ꢕꢋꢀ ꢎ ꢐꢖ ꢋ ꢁ ꢋꢍ ꢗꢁ ꢎ ꢌꢎ ꢚ ꢕꢛ ꢜ ꢎ ꢀꢓ ꢛ ꢓꢘꢀ ꢝꢐ ꢜ ꢖ

ꢃ

ꢉ

ꢑ µ

ꢋ

ꢃ

ꢆ

ꢑ

ꢒ

ꢓ

ꢔ

ꢕ

ꢋ

ꢎ

ꢁ

ꢑ

ꢀ

ꢐ

ꢑ

ꢕ

ꢋ

ꢎ

ꢁ

ꢎ

ꢖ

ꢗ

ꢘ

ꢀ

ꢙ

ꢐ

ꢘ

ꢀ

ꢗ

ꢘ

ꢀ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

operating characteristics at specified free-air temperature, V

= 3 V (unless otherwise noted)

DD

†

PARAMETER

TEST CONDITIONS

MIN

0.05

0.02

TYP

MAX

UNIT

T

A

25°C

Full range

25°C

0.11

V

R

= 0.8 V,

O(PP)

= 10 kΩ

C

= 150 pF,

L

SR

Slew rate at unity gain

V/µs

L

f = 100 Hz

f = 1 kHz

49

51

nV/√Hz

pA/√Hz

V

I

Equivalent input noise voltage

Equivalent input noise current

n

25°C

3.5

n

A

= 1

0.04%

0.3%

1.5%

59

V

R

= 1.5 V,

O(PP)

= 10 kΩ,

A

V

= 10

= 100

THD + N Total harmonic distortion plus noise

25°C

L

f = 1 kHz

A

V

t

Amplifier turnon time

Amplifier turnoff time

Gain-bandwidth product

25°C

µs

ns

(on)

A

V

= 5,

R

= OPEN,

L

Measured at 50% point

836

(off)

200

kHz

f = 10 kHz,

R

= 10 kΩ

L

V

= 2 V,

(STEP)PP

0.1%

26

31

26

31

A

= −1,

V

C

R

= 10 pF,

= 10 kΩ

L

0.01%

0.1%

t

s

Settling time

25°C

µs

V

(STEP)PP

A

= −1,

V

C

R

= 56 pF,

= 10 kΩ

L

0.01%

φ

m

Phase margin

Gain margin

25°C

56°

R

= 10 kΩ,

C

= 1000 pF

L

7

dB

= 1000 pF

†

Full range is 0°C to 70°C for C suffix and −40°C to 125°C for I suffix.

6

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ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢀꢁꢂꢃ ꢄ ꢅ ꢈ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢃ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢉ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢅ ꢇ ꢀꢁꢂ ꢃꢄ ꢅꢊ ꢋ

ꢍ

ꢌ

ꢋ

ꢎ

ꢁ

ꢏ

ꢐ

ꢌ

ꢐ ꢗꢚꢕ ꢋꢀ ꢎꢐ ꢖꢋꢁ ꢋꢍ ꢗꢁ ꢎꢌ ꢎꢚ ꢕꢛ ꢜ ꢎꢀ ꢓ ꢛꢓꢘ ꢀꢝ ꢐ ꢜꢖ

ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒ ꢓꢔ ꢕꢋꢎ ꢁ ꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀꢙ ꢐ ꢘ ꢀꢗ ꢘꢀ

ꢑµ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

electrical characteristics at specified free-air temperature, V

= 5 V (unless otherwise noted)

DD

†

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

1500

2000

1000

1300

T

A

UNIT

25°C

Full range

25°C

300

TLV245x

V

IO

Input offset voltage

µV

300

TLV245xA

Full range

Temperature coefficient of input

offset voltage

V

=

2.5 V

V

R

= 0,

= 50 Ω

DD

O

S

α

0.3

µV/°C

nA

V

VIO

= 0,

IC

25°C

Full range

25°C

4.5

5.5

5

I

IO

Input offset current

0.5

4.97

0.07

32

I

IB

Input bias current

Full range

25°C

7

4.87

4.85

V

High-level output voltage

Low-level output voltage

V

= 2.5 V,

I

= −500 µA

= 500 µA

OH

OL

IC

OH

Full range

25°C

0.15

0.16

V

IC

OL

Full range

25°C

20

18

12

10

Sourcing

Sinking

Full range

25°C

I

Short-circuit output current

Output current

mA

OS

18

Full range

25°C

V

= 0.5 V from rail

= 3 V,

O(PP)

10

mA

dB

O

25°C

96

91

103

Large-signal differential voltage

amplification

A

VD

V

R

= 10 kΩ

L

Full range

25°C

9

10

r

Differential input resistance

Ω

pF

Ω

i(d)

C

Common-mode input capacitance

Closed-loop output impedance

f = 10 kHz

f = 10 kHz,

25°C

4.5

45

80

IC

z

A

V

= 10

25°C

o

25°C

70

68

76

74

88

84

V

R

= 0 to 5 V,

= 50 Ω

IC

CMRR

Common-mode rejection ratio

dB

TLV245xC

Full range

25°C

S

89

106

23

V

= 2.7 V to 6 V,

V

= V

/2,

DD

IC

DD

No load

Full range

25°C

Supply voltage rejection ratio

k

dB

SVR

(∆V

DD

/∆V )

IO

V

= 3 V to 5 V,

V

IC

= V

DD

No load

DD

Full range

25°C

42

44

46

70

80

TLV245xC

TLV245xI

Full range

25°C

I

Supply current (per channel)

V

= 2.5 V, No load

µA

DD

O

16

Supply current in shutdown mode

(TLV2450, TLV2453, TLV2455) (per

channel)

TLV245xC

TLV245xI

Full range

SHDN = −V

DD

nA

DD(SHDN)

†

Full range is 0°C to 70°C for C suffix and −40°C to 125°C for I suffix.

7

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ꢀ ꢁꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢀ ꢁꢂꢃ ꢄꢅ ꢈ ꢇ ꢀꢁꢂ ꢃ ꢄꢅ ꢃ ꢇ ꢀꢁꢂ ꢃ ꢄꢅ ꢉ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢅ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢊ ꢋ

ꢌ

ꢋ

ꢍ

ꢎ

ꢁ

ꢏ

ꢐ

ꢌ

ꢐꢗ ꢚ ꢕꢋꢀ ꢎ ꢐꢖ ꢋ ꢁ ꢋꢍ ꢗꢁ ꢎ ꢌꢎ ꢚ ꢕꢛ ꢜ ꢎ ꢀꢓ ꢛ ꢓꢘꢀ ꢝꢐ ꢜ ꢖ

ꢃ

ꢉ

ꢑ µ

ꢋ

ꢃ

ꢆ

ꢑ

ꢒ

ꢓ

ꢔ

ꢕ

ꢋ

ꢎ

ꢁ

ꢑ

ꢀ

ꢐ

ꢑ

ꢕ

ꢋ

ꢎ

ꢁ

ꢎ

ꢖ

ꢗ

ꢘ

ꢀ

ꢙ

ꢐ

ꢘ

ꢀ

ꢗ

ꢘ

ꢀ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

operating characteristics at specified free-air temperature, V

= 5 V (unless otherwise noted)

DD

†

PARAMETER

TEST CONDITIONS

MIN

0.05

0.02

TYP

MAX

UNIT

T

A

25°C

Full range

25°C

0.11

V

R

= 2 V,

O(PP)

= 10 kΩ

C

= 150 pF,

L

SR

Slew rate at unity gain

V/µs

L

f = 100 Hz

f = 1 kHz

49

52

nV/√Hz

pA/√Hz

V

I

Equivalent input noise voltage

Equivalent input noise current

n

25°C

3.5

n

A

= 1

0.02%

0.18%

0.9%

59

V

R

= 3 V,

O(PP)

= 10 kΩ,

A

V

= 10

= 100

THD + N Total harmonic distortion plus noise

25°C

L

f = 1 kHz

A

V

t

Amplifier turnon time

Amplifier turnoff time

Gain-bandwidth product

25°C

µs

ns

(on)

A

V

= 5,

R

= OPEN,

L

Measured at 50% point

836

(off)

220

kHz

f = 10 kHz,

R

= 10 kΩ

L

V

= 2 V,

(STEP)PP

0.1%

24

30

25

30

A

= −1,

V

C

R

= 10 pF,

= 10 kΩ

L

0.01%

0.1%

t

s

Settling time

25°C

µs

V

(STEP)PP

A

= −1,

V

C

R

= 56 pF,

= 10 kΩ

L

0.01%

φ

m

Phase margin

Gain margin

25°C

56°

R

= 10 kΩ,

C

= 1000 pF

L

7

dB

= 1000 pF

†

Full range is 0°C to 70°C for C suffix and −40°C to 125°C for I suffix.

8

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ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢀꢁꢂꢃ ꢄ ꢅ ꢈ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢃ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢉ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢅ ꢇ ꢀꢁꢂ ꢃꢄ ꢅꢊ ꢋ

ꢍ

ꢌꢋ

ꢎ

ꢁꢏ

ꢐ

ꢌ

ꢐ ꢗꢚꢕ ꢋꢀ ꢎꢐ ꢖꢋꢁ ꢋꢍ ꢗꢁ ꢎꢌ ꢎꢚ ꢕꢛ ꢜ ꢎꢀ ꢓ ꢛꢓꢘ ꢀꢝ ꢐ ꢜꢖ

ꢃ

ꢉ

ꢑ

µ

ꢋ

ꢃ

ꢆ

ꢑ

ꢒ

ꢓ

ꢔ

ꢕ

ꢋ

ꢎ

ꢁ

ꢑ

ꢀ

ꢐ

ꢑ

ꢕ

ꢋ

ꢎ

ꢁ

ꢎ

ꢖ

ꢗ

ꢘ

ꢀ

ꢙ

ꢐ

ꢘ

ꢀ

ꢗ

ꢘ

ꢀ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

Table of Graphs

FIGURE

V

Input offset voltage

Input offset current

vs Common-mode input voltage

1, 2

IO

vs Common-mode input voltage

vs Free-air temperature

3, 4

7, 8

I

IO

IB

vs Common-mode input voltage

vs Free-air temperature

5, 6

7, 8

I

Input bias current

A

Differential voltage amplification

Phase

vs Frequency

9, 10

11, 13

12, 14

15, 16

17

VD

vs Frequency

V

Low-level output voltage

High-level output voltage

Output impedance

vs Low-level output current

vs High-level output current

vs Frequency

OL

OH

o

Z

CMRR

PSRR

Common-mode rejection ratio

Power supply rejection ratio

Supply current

vs Frequency

18

I

vs Supply voltage

vs Free-air temperature

vs Frequency

19

DD

Supply current

20

DD

V

n

Equivalent input noise voltage

Total harmonic distortion plus noise

Phase margin

21

THD + N

vs Frequency

22, 23

24

φ

m

vs Load capacitance

vs Supply voltage

Gain-bandwidth product

25

vs Supply voltage

vs Free-air temperature

26

27

SR

Slew rate

V

Maximum peak-to-peak output voltage

Crosstalk

vs Frequency

vs Time

28

29, 30

31, 33

32, 34

35

O(PP)

Small-signal follower pulse response

Large-signal follower pulse response

Shutdown on supply current

Shutdown off supply current

Shutdown supply current

Shutdown pulse

vs Time

36

vs Free-air temperature

vs Time

37

38 − 41

42, 43

44, 45

46

vs Time

Shutdown off pulse response

Shutdown on pulse response

Shutdown reverse isolation

Shutdown forward isolation

vs Time

vs Frequency

47

9

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^{POST OFFICE BOX 1443}• HOUSTON, TEXAS 77251−1443

ꢀ

ꢁ

ꢂ

ꢃ

ꢄ

ꢅ

ꢆ

ꢇ

ꢀ

ꢁ

ꢂ

ꢃ

ꢄ

ꢅ

ꢈ

ꢇ

ꢀ

ꢁ

ꢂ

ꢃ

ꢄ

ꢅ

ꢃ

ꢇ

ꢀ

ꢁ

ꢂ

ꢃ

ꢄ

ꢅ

ꢉ

ꢇ

ꢀ

ꢁ

ꢂ

ꢃ

ꢄ

ꢅ

ꢄ

ꢇ

ꢀ

ꢁ

ꢂ

ꢃ

ꢄ

ꢅ

ꢇ

ꢀ

ꢁ

ꢂ

ꢃ

ꢄ

ꢅ

ꢊ

ꢋ

ꢌ

ꢋ

ꢍ

ꢎ

ꢁ

ꢏ

ꢐ

ꢌ

ꢐꢗ ꢚ ꢕꢋꢀ ꢎ ꢐꢖ ꢋ ꢁ ꢋꢍ ꢗꢁ ꢎ ꢌꢎ ꢚ ꢕꢛ ꢜ ꢎ ꢀꢓ ꢛ ꢓꢘꢀ ꢝꢐ ꢜ ꢖ

ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒꢓ ꢔ ꢕꢋ ꢎ ꢁꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀ ꢙꢐ ꢘꢀ ꢗꢘ ꢀ

ꢑ µ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

INPUT OFFSET VOLTAGE

vs

COMMON-MODE INPUT VOLTAGE

vs

COMMON-MODE INPUT VOLTAGE

200

150

100

50

100

80

V

T

A

= 3 V

DD

= 25°C

V

= 5 V

DD

T = 25°C

A

60

40

20

0

−20

−40

−50

−100

−150

−200

−60

−80

−100

−0.5

0

0.5

1

1.5

2

2.5

3

3.5

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5 5.5

V

IC

− Common-Mode Input Voltage − V

V

IC

− Common-Mode Input Voltage − V

Figure 1

Figure 2

INPUT OFFSET CURRENT

vs

COMMON-MODE INPUT VOLTAGE

INPUT OFFSET CURRENT

vs

COMMON-MODE INPUT VOLTAGE

60

40

20

0

20

10

V

T

A

= 3 V

= 25°C

DD

V

T

A

= 5 V

= 25°C

DD

0

−10

−20

−30

−40

−20

−40

−60

−50

−60

0

0.5

1

0

0.5

1

1.5

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

V

IC

− Common-Mode Input Voltage − V

V

IC

− Common-Mode Input Voltage − V

Figure 3

Figure 4

10

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ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢀꢁꢂꢃ ꢄ ꢅ ꢈ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢃ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢉ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢅ ꢇ ꢀꢁꢂ ꢃꢄ ꢅꢊ ꢋ

ꢍ

ꢌ

ꢋ

ꢎ

ꢁꢏ

ꢐ

ꢌ

ꢐ ꢗꢚꢕ ꢋꢀ ꢎꢐ ꢖꢋꢁ ꢋꢍ ꢗꢁ ꢎꢌ ꢎꢚ ꢕꢛ ꢜ ꢎꢀ ꢓ ꢛꢓꢘ ꢀꢝ ꢐ ꢜꢖ

ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒ ꢓꢔ ꢕꢋꢎ ꢁ ꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀꢙ ꢐ ꢘ ꢀꢗ ꢘꢀ

ꢑµ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

INPUT BIAS CURRENT

vs

COMMON-MODE INPUT VOLTAGE

INPUT BIAS CURRENT

vs

COMMON-MODE INPUT VOLTAGE

3

2

V

T

= 5 V

DD

= 25°C

V

T

A

= 3 V

= 25°C

DD

A

2

1

0

−1

−2

−3

−4

−3

−4

−0.5

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5 5.5

−0.5

0

0.5

1

1.5

2

2.5

3

3.5

V

− Common-Mode Input Voltage − V

IC

V

− Common-Mode Input Voltage − V

IC

Figure 5

Figure 6

INPUT OFFSET CURRENT

AND INPUT BIAS CURRENT

vs

INPUT OFFSET CURRENT

AND INPUT BIAS CURRENT

vs

FREE-AIR TEMPERATURE

1.5

1.4

1.3

1.2

1.1

1

0.9

0.8

0.7

V

= 3 V

DD

V

= 5 V

DD

I

IB

0.6

0.5

0.4

I

IB

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.3

0.2

I

IO

I

IO

0.1

0

0.1

0

−0.1

−55 −35 −15

5

25

45 65

85 105 125

−55 −35 −15

5

25

45 65

85 105 125

T

A

− Free-Air Temperature − °C

T

A

− Free-Air Temperature − °C

Figure 7

Figure 8

11

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ꢀ ꢁꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢀ ꢁꢂꢃ ꢄꢅ ꢈ ꢇ ꢀꢁꢂ ꢃ ꢄꢅ ꢃ ꢇ ꢀꢁꢂ ꢃ ꢄꢅ ꢉ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢅ ꢇ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢊ ꢋ

ꢌ

ꢋ

ꢍ

ꢎ

ꢁ

ꢏ

ꢐ

ꢌ

ꢐꢗ ꢚ ꢕꢋꢀ ꢎ ꢐꢖ ꢋ ꢁ ꢋꢍ ꢗꢁ ꢎ ꢌꢎ ꢚ ꢕꢛ ꢜ ꢎ ꢀꢓ ꢛ ꢓꢘꢀ ꢝꢐ ꢜ ꢖ

ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒꢓ ꢔ ꢕꢋ ꢎ ꢁꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀ ꢙꢐ ꢘꢀ ꢗꢘ ꢀ

ꢑ µ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

DIFFERENTIAL VOLTAGE AMPLIFICATION AND PHASE

vs

FREQUENCY

120

V

T

A

= 3 V

= 25°C

DD

90

60

120

60

Gain

30

0

−60

−120

Phase

−30

−60

−180

100

1k

10k

100k

1M

f − Frequency − Hz

Figure 9

DIFFERENTIAL VOLTAGE AMPLIFICATION AND PHASE

vs

FREQUENCY

120

V

T

A

=

5 V

DC

DD

= 25°C

90

60

120

60

Gain

30

0

−60

−120

Phase

−30

−60

−180

100

1k

10k

100k

1M

f − Frequency − Hz

Figure 10

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ꢍ

ꢌꢋ

ꢎ

ꢁꢏ

ꢐ

ꢌ

ꢐ ꢗꢚꢕ ꢋꢀ ꢎꢐ ꢖꢋꢁ ꢋꢍ ꢗꢁ ꢎꢌ ꢎꢚ ꢕꢛ ꢜ ꢎꢀ ꢓ ꢛꢓꢘ ꢀꢝ ꢐ ꢜꢖ

ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒ ꢓꢔ ꢕꢋꢎ ꢁ ꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀꢙ ꢐ ꢘ ꢀꢗ ꢘꢀ

ꢑµ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

LOW-LEVEL OUTPUT VOLTAGE

vs

HIGH-LEVEL OUTPUT VOLTAGE

vs

LOW-LEVEL OUTPUT CURRENT

HIGH-LEVEL OUTPUT CURRENT

3

2.5

2

3

2.5

2

V

DD

= 3 V

V

= 3 V

DD

T

= −40°C

A

T

= 25°C

A

T

= 25°C

A

1.5

1

1.5

1

T

= 85°C

A

T

= 85°C

A

T

A

= 125°C

T

A

= −40°C

T

A

= 125°C

0.5

0

0.5

0

1

2

3

4

5

6

7

8

9

10

0

2.5

OH

5

7.5

10

12.5

15

I

− Low-Level Output Current − mA

I

− High-Level Output Current − mA

OL

Figure 11

Figure 12

LOW-LEVEL OUTPUT VOLTAGE

vs

LOW-LEVEL OUTPUT CURRENT

HIGH-LEVEL OUTPUT VOLTAGE

vs

HIGH-LEVEL OUTPUT CURRENT

5

V

= 5 V

V

= 5 V

DD

4.5

4

4.5

T

A

= −40°C

4

3.5

3

T

A

= 25°C

3.5

3

T

= 85°C

A

2.5

T

= 125°C

T = 85°C

A

2.5

2

A

T

A

= 125°C

2

1.5

1

T

= 25°C

A

1.5

T

A

= −40°C

1

0.5

0

0.5

0

5

10

15

20

25

0

5

I

10

15

20

25

30

35

40

− High-Level Output Current − mA

I

− Low-Level Output Current − mA

OH

OL

Figure 13

Figure 14

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ꢌ

ꢋ

ꢍ

ꢎ

ꢁ

ꢏ

ꢐ

ꢌ

ꢐꢗ ꢚ ꢕꢋꢀ ꢎ ꢐꢖ ꢋ ꢁ ꢋꢍ ꢗꢁ ꢎ ꢌꢎ ꢚ ꢕꢛ ꢜ ꢎ ꢀꢓ ꢛ ꢓꢘꢀ ꢝꢐ ꢜ ꢖ

ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒꢓ ꢔ ꢕꢋ ꢎ ꢁꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀ ꢙꢐ ꢘꢀ ꢗꢘ ꢀ

ꢑ µ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

OUTPUT IMPEDANCE

vs

FREQUENCY

10k

1k

V

T

A

= 5 V

= 25°C

DD

V

T

A

= 3 V

DD

= 25°C

1k

100

10

A

V

= 100

A

V

= 100

100

10

1

A

= 10

V

A

V

= 1

A

= 10

V

A

= 1

V

0.1

1

100

1k

10k

100k

1M

100

1k

10k

100k

1M

f − Frequency − Hz

Figure 15

Figure 16

COMMON-MODE REJECTION RATIO

vs

FREQUENCY

120

100

V

T

A

= 3 V or 5 V

= 25°C

DD

80

60

40

20

0

10

100

1k

10k

100k

1M

f − Frequency − Hz

Figure 17

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ꢍ

ꢌꢋ

ꢎ

ꢁꢏ

ꢐ

ꢌ

ꢐ ꢗꢚꢕ ꢋꢀ ꢎꢐ ꢖꢋꢁ ꢋꢍ ꢗꢁ ꢎꢌ ꢎꢚ ꢕꢛ ꢜ ꢎꢀ ꢓ ꢛꢓꢘ ꢀꢝ ꢐ ꢜꢖ

ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒ ꢓꢔ ꢕꢋꢎ ꢁ ꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀꢙ ꢐ ꢘ ꢀꢗ ꢘꢀ

ꢑµ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

POWER SUPPLY REJECTION RATIO

SUPPLY CURRENT

vs

SUPPLY VOLTAGE

vs

FREQUENCY

100

90

40

35

30

25

A

= 1

V

T

A

= 3 V or 5 V

SHDN = V

Per Channel

DD

= 25°C

DD

T

= 125°C

= 85°C

A

80

T

A

70

60

50

40

30

20

PSRR +

T

A

= 25°C

T

A

= −40°C

20

15

10

PSRR −

10

0

5

0

10

100

1k

10k

100k

1M

2.5

3

3.5

4

4.5

5

5.5

f − Frequency − Hz

V

− Supply Voltage − V

DD

Figure 18

Figure 19

SUPPLY CURRENT

vs

FREE-AIR TEMPERATURE

EQUIVALENT INPUT NOISE VOLTAGE

vs

FREQUENCY

30

25

20

100

V

DD

= 5 V

V

DD

= 3 V

15

10

5

10

V = V

DD

/2

I

V

T

A

= 3 V or 5 V

DD

= 25°C

SHDN = V

DD

per channel

0

1

10

−55 −35 −15

5

25 45

65

85 105 125

100

1k

10k

100k

T

A

− Free-Air Temperature − °C

f − Frequency − Hz

Figure 20

Figure 21

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ꢌ

ꢋ

ꢍ

ꢎ

ꢁ

ꢏ

ꢐ

ꢌ

ꢐꢗ ꢚ ꢕꢋꢀ ꢎ ꢐꢖ ꢋ ꢁ ꢋꢍ ꢗꢁ ꢎ ꢌꢎ ꢚ ꢕꢛ ꢜ ꢎ ꢀꢓ ꢛ ꢓꢘꢀ ꢝꢐ ꢜ ꢖ

ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒꢓ ꢔ ꢕꢋ ꢎ ꢁꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀ ꢙꢐ ꢘꢀ ꢗꢘ ꢀ

ꢑ µ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

TOTAL HARMONIC DISTORTION PLUS NOISE

vs

FREQUENCY

100%

10%

1%

100%

V

R

= 3 V

DD

O(PP)

= 10 kΩ

V

R

= 5 V

DD

O(PP)

= 10 kΩ

= 1.5 V

= 3 V

L

10%

1%

T

A

= 25°C

T

A

= 25°C

A

V

= 10

A

V

= 100

A

V

= 100

0.1%

A

V

= 1

A

V

= 10

0.01%

0.010%

0.001%

A

V

= 1

0.001%

10

100

1k

10k

100k

10

100

1k

10k

100k

f − Frequency − MHz

f − Frequency − Hz

Figure 22

Figure 23

PHASE MARGIN

vs

LOAD CAPACITANCE

GAIN-BANDWIDTH PRODUCT

vs

SUPPLY VOLTAGE

°

100

90

280

270

260

f = 1 kHz

R

= 500Ω

NULL

R

T

= 10 kΩ

= 25°C

L

80

A

R

= 200Ω

°

250

240

230

NULL

70

60

R

= 100Ω

NULL

°

50

40

R

= 50Ω

NULL

220

210

°

30

20

R

= 10Ω

NULL

200

190

180

V

R

T

A

= 5 V

= 10 kΩ

= 25°C

DD

L

R

= 0Ω

NULL

°

10

0

100

1k

10k

100k

2.5

3

3.5

4

4.5

5

5.5

C

− Load Capacitance − pF

L

V

DD

− Supply Voltage − V

Figure 24

Figure 25

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ꢍ

ꢌꢋ

ꢎ

ꢁꢏ

ꢐ

ꢌ

ꢐ ꢗꢚꢕ ꢋꢀ ꢎꢐ ꢖꢋꢁ ꢋꢍ ꢗꢁ ꢎꢌ ꢎꢚ ꢕꢛ ꢜ ꢎꢀ ꢓ ꢛꢓꢘ ꢀꢝ ꢐ ꢜꢖ

ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒ ꢓꢔ ꢕꢋꢎ ꢁ ꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀꢙ ꢐ ꢘ ꢀꢗ ꢘꢀ

ꢑµ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

SLEW RATE

vs

SLEW RATE

vs

SUPPLY VOLTAGE

FREE-AIR TEMPERATURE

0.12

0.11

0.1

0.16

0.14

0.12

0.1

f = 10 kHz

R

C

A

= 10 kΩ

T

= 25°C

= 10 kΩ

= 160 pF

= 1

L

V

A

= 160 pF

R

C

A

V

L

= 1

V

= 5 V

DD

V

DD

= 3 V

0.08

0.06

0.09

2.5

3

3.5

4

4.5

5

−40 −20

0

20

40 60

80 100 120 140

V

DD

− Supply Voltage − V

T

A

− Free-Air Temperature − °C

Figure 26

Figure 27

MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE

vs

FREQUENCY

5

4.5

4

V

= 5 V

O(PP)

3.5

3

V

= 3 V

O(PP)

2.5

2

1.5

1

THD + N < 5%

A

R

= 5

= 20 kΩ

= 25°C

V

L

T

A

0.5

0

100

1k

10k

100k

f − Frequency − Hz

Figure 28

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ꢌ

ꢋ

ꢍ

ꢎ

ꢁ

ꢏ

ꢐ

ꢌ

ꢐꢗ ꢚ ꢕꢋꢀ ꢎ ꢐꢖ ꢋ ꢁ ꢋꢍ ꢗꢁ ꢎ ꢌꢎ ꢚ ꢕꢛ ꢜ ꢎ ꢀꢓ ꢛ ꢓꢘꢀ ꢝꢐ ꢜ ꢖ

ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒꢓ ꢔ ꢕꢋ ꢎ ꢁꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀ ꢙꢐ ꢘꢀ ꢗꢘ ꢀ

ꢑ µ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

CROSSTALK

vs

CROSSTALK

vs

FREQUENCY

−20

−30

−40

−50

−60

−70

−80

−90

−20

V

= 3 V

V

= 5 V

DD

= 1

DD

A = 1

V

L

A

−30

−40

−50

−60

−70

−80

−90

V

R

= 10 kΩ

R = 10 kΩ

All Channels

L

All Channels

−100

−110

−100

−110

10

100

1k

10k

100k

10

100

1k

10k

100k

f − Frequency − Hz

Figure 29

f − Frequency − Hz

Figure 30

SMALL-SIGNAL FOLLOWER PULSE RESPONSE

vs

TIME

0.3

0.15

0.1

0.25

0.2

0.15

0.1

0.05

0

V

I

0.05

0

−0.05

−0.1

−0.15

V

O

−0.2

V

R

C

= 3 V

= 10 kΩ

= 160 pF

= 1

DD

−0.25

L

−0.3

−0.35

−0.4

A

V

A

−0.05

−0.1

T

= 25°C

f = 45 kHz

−2

0

2

4

6

8

10 12 14

16

t − Time − µs

Figure 31

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ꢍ

ꢌꢋ

ꢎ

ꢁꢏ

ꢐ

ꢌ

ꢐ ꢗꢚꢕ ꢋꢀ ꢎꢐ ꢖꢋꢁ ꢋꢍ ꢗꢁ ꢎꢌ ꢎꢚ ꢕꢛ ꢜ ꢎꢀ ꢓ ꢛꢓꢘ ꢀꢝ ꢐ ꢜꢖ

ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒ ꢓꢔ ꢕꢋꢎ ꢁ ꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀꢙ ꢐ ꢘ ꢀꢗ ꢘꢀ

ꢑµ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

LARGE-SIGNAL FOLLOWER PULSE RESPONSE

vs

TIME

5

4

2

1

V

= 3 V

DD

= 1

A

V

R

C

= 10 kΩ

= 160 pF

L

3

2

0

f = 10 kHz

T

A

= 25°C

V

I

−1

1

0

−2

−3

−4

−5

V

O

−1

−2

−20

0

20

40

60

80

100

t − Time − µs

Figure 32

SMALL-SIGNAL FOLLOWER PULSE RESPONSE

vs

TIME

80

240

40

0

200

160

V

I

−40

−80

120

80

V

= 5 V

DD

= 1

A

V

R

C

= 10 kΩ

= 160 pF

= 25°C

L

−120

−160

40

0

T

A

V

O

−200

−240

−40

−80

−5

0

5

10

15

20

t − Time − µs

Figure 33

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ꢌ

ꢋ

ꢍ

ꢎ

ꢁ

ꢏ

ꢐ

ꢌ

ꢐꢗ ꢚ ꢕꢋꢀ ꢎ ꢐꢖ ꢋ ꢁ ꢋꢍ ꢗꢁ ꢎ ꢌꢎ ꢚ ꢕꢛ ꢜ ꢎ ꢀꢓ ꢛ ꢓꢘꢀ ꢝꢐ ꢜ ꢖ

ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒꢓ ꢔ ꢕꢋ ꢎ ꢁꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀ ꢙꢐ ꢘꢀ ꢗꢘ ꢀ

ꢑ µ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

LARGE-SIGNAL FOLLOWER PULSE RESPONSE

vs

TIME

10

2

1

V

R

C

= 5 V

= 10 kΩ

= 160 pF

= 1

DD

L

V

I

8

6

0

A

V

A

T

= 25°C

−1

f = 10 kHz

−2

−3

−4

−5

4

2

0

V

O

−6

−7

−8

−9

−2

−4

−10

90 100

80

−10

0

10 20 30 40 50 60 70

t − Time − µs

Figure 34

SHUTDOWN ON SUPPLY CURRENT

vs

TIME

10

180

Shutdown Control Signal

5

160

140

120

100

0

−5

−10

−15

80

60

40

20

−20

−25

Supply Current − I

DD

−30

−35

−40

0

−20

−4

−2

0

2

4

6

8

10

t − Time − µS

Figure 35

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ꢍ

ꢌꢋ

ꢎ

ꢁꢏ

ꢐ

ꢌ

ꢐ ꢗꢚꢕ ꢋꢀ ꢎꢐ ꢖꢋꢁ ꢋꢍ ꢗꢁ ꢎꢌ ꢎꢚ ꢕꢛ ꢜ ꢎꢀ ꢓ ꢛꢓꢘ ꢀꢝ ꢐ ꢜꢖ

ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒ ꢓꢔ ꢕꢋꢎ ꢁ ꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀꢙ ꢐ ꢘ ꢀꢗ ꢘꢀ

ꢑµ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

SHUTDOWN OFF SUPPLY CURRENT

vs

TIME

10

5

50

40

Shutdown Control Signal

0

30

20

10

−5

−10

Supply Current − I

DD

−15

−20

0

−10

−20 −10

0

10 20 30 40 50 60 70 80

t − Time − µS

Figure 36

SHUTDOWN SUPPLY CURRENT

vs

FREE-AIR TEMPERATURE

1.6

Shutdown Mode

A

R

= 1

= Open

V

L

1.4

1.2

1

V = V /2 V

I DD

V

DD

= 5 V

0.8

0.6

0.4

V

DD

= 3 V

0.2

0

−55 −35 −15

5

25

45

65

85 105 125

T

A

− Free-Air Temperature − °C

Figure 37

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ꢏ

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ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒꢓ ꢔ ꢕꢋ ꢎ ꢁꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀ ꢙꢐ ꢘꢀ ꢗꢘ ꢀ

ꢑ µ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

SHUTDOWN SUPPLY CURRENT AND SHUTDOWN PULSE

vs

TIME

5

V

= 3 V

DD

= 1

4

SD Pulse

A

V

V = 1.5 V

3

2

1

0

I

R

C

= 10 kΩ

= 160 pF and 10 pF

= 25°C

L

T

A

30

25

I

DD(SD)

20

15

10

5

0

−5 −3 −1

1

3

5

7

9

11 13 15

t − Time − µs

Figure 38

SHUTDOWN SUPPLY CURRENT AND SHUTDOWN PULSE

vs

TIME

5

4

3

V

= 3 V

DD

= 1

2

1

0

A

V

V = 1.5 V

I

SD Pulse

R

C

= 10 kΩ

= 160 pF and 10 pF

= 25°C

L

T

A

30

25

20

15

10

5

I

DD(SD)

0

−100

−50

0

50

100

150

200

t − Time − µs

Figure 39

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ꢑµ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

SHUTDOWN SUPPLY CURRENT AND SHUTDOWN PULSE

vs

TIME

5

V

= 5 V

DD

= 1

4

3

2

1

0

A

V

V = 2.5 V

I

R

C

= 10 kΩ

= 160 pF and 10 pF

= 25°C

L

SD Pulse

T

A

25

20

15

10

5

0

I

DD(SD)

−100

−50

0

50

100

150

200

t − Time − µs

Figure 40

SHUTDOWN SUPPLY CURRENT AND SHUTDOWN PULSE

vs

TIME

5

V

= 5 V

DD

= 1

SD Pulse

4

3

2

1

0

A

V

V = 2.5 V

I

R

C

= 10 kΩ

= 160 pF and 10 pF

= 25°C

L

T

A

30

I

DD(SD)

25

20

15

10

5

0

−10

−5

0

5

10

15

t − Time − µs

Figure 41

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ꢌ

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ꢍ

ꢎ

ꢁ

ꢏ

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ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒꢓ ꢔ ꢕꢋ ꢎ ꢁꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀ ꢙꢐ ꢘꢀ ꢗꢘ ꢀ

ꢑ µ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

SHUTDOWN OFF PULSE RESPONSE

vs

TIME

vs

TIME

4

3

2

1

6

5

4

3

2

1

SD Pulse

V

= 3 V

DD

= 1

A

V

V = 2.5 V

I

V

Channel 1

R

C

= 10 kΩ

= 160 pF and 8 pF

= 25°C

O

L

T

A

V

A

V

I

R

C

T

A

= 5 V

DD

= 1

V = 4 V

0

V

O

Channel 1

= 10 kΩ

= 160 pF and 8 pF

= 25°C

L

0

−1

−10 10

−1

−20

30

50

70

90

110 130 150

0

20

40

60

80

100 120 140

t − Time − µs

Figure 42

Figure 43

SHUTDOWN ON PULSE RESPONSE

vs

TIME

4

3

2

1

6

5

4

3

2

1

V

= 3 V

V

= 5 V

DD

= 1

DD

A = 1

V

SD Pulse

A

V

SD Pulse

V = 2.5 V

V = 4 V

I

R

= 10 kΩ

= 25°C

R

= 10 kΩ

T = 25°C

A

L

T

A

C = 160 pF

L

C

= 160 pF

L

C

= 8 pF

L

C

= 8 pF

L

0

−1

−2

−1

0

1

2

3

4

5

6

−2

0

2

4

6

8

10

12

t − Time − µs

Figure 44

Figure 45

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ꢑµ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

TYPICAL CHARACTERISTICS

SHUTDOWN REVERSE ISOLATION

SHUTDOWN FORWARD ISOLATION

vs

FREQUENCY

140

120

100

80

140

120

100

V

= 3 V and 5 V

V

= 3 V and 5 V

DD

= 0.1, 1.5, 2.5 V

I(PP)

R

C

T

= 10 kΩ

= 28 pF

= 25°C

R

C

T

= 10 kΩ

= 28 pF

= 25°C

L

A

80

60

40

20

0

20

0

10

100

1 k

10k

100k

1M

10M

10

100

1k

10k

100k

1M

f − Frequency − Hz

Figure 47

Figure 46

PARAMETER MEASUREMENT INFORMATION

R

_

+

null

R

L

C

L

Figure 48

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ꢐꢗ ꢚ ꢕꢋꢀ ꢎ ꢐꢖ ꢋ ꢁ ꢋꢍ ꢗꢁ ꢎ ꢌꢎ ꢚ ꢕꢛ ꢜ ꢎ ꢀꢓ ꢛ ꢓꢘꢀ ꢝꢐ ꢜ ꢖ

ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒꢓ ꢔ ꢕꢋ ꢎ ꢁꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀ ꢙꢐ ꢘꢀ ꢗꢘ ꢀ

ꢑ µ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

APPLICATION INFORMATION

shutdown function

Three members of the TLV245x family (TLV2450/3/5) have a shutdown terminal for conserving battery life in

portable applications. When the shutdown terminal is pulled to the voltage level on the GND terminal of the

device, the supply current is reduced to 16 nA/channel, the amplifier is disabled, and the outputs are placed in

a high impedance mode. To enable the amplifier, the shutdown terminal must be pulled high. The shutdown

terminal should never be left floating. The shutdown terminal threshold is always referenced to the GND terminal

of the device. Therefore, when operating the device with split supply voltages (e.g. 2.5 V), the shutdown

terminal needs to be pulled to V − (not system ground) to disable the operational amplifier.

DD

The amplifier’s output with a shutdown pulse is shown in Figures 42, 43, 44, and 45. The amplifier is powered

with a single 5-V supply and configured as a noninverting configuration with a gain of 5. The amplifier turnon

and turnoff times are measured from the 50% point of the shutdown pulse to the 50% point of the output

waveform. The times for the single, dual, and quad are listed in the data tables.

Figures 46 and 47 show the amplifier’s forward and reverse isolation in shutdown. The operational amplifier is

powered by 1.35-V supplies and configured as a voltage follower (A = 1). The isolation performance is plotted

V

across frequency using 0.1-V , 1.5-V , and 2.5-V input signals. During normal operation, the amplifier

PP

would not be able to handle a 2.5-V

input signal with a supply voltage of 1.35 V since it exceeds the

). However, this curve illustrates that the amplifier remains in shutdown

PP

ICR

common-mode input voltage range (V

even under a worst case scenario.

driving a capacitive load

When the amplifier is configured in this manner, capacitive loading directly on the output will decrease the

device’s phase margin leading to high frequency ringing or oscillations. Therefore, for capacitive loads of greater

than 10 pF, it is recommended that a resistor be placed in series (R

) with the output of the amplifier, as

NULL

shown in Figure 49. A minimum value of 20 Ω should work well for most applications.

R

F

R

G

R

NULL

−

+

Input

Output

LOAD

C

Figure 49. Driving a Capacitive Load

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ꢃ

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ꢑµ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

APPLICATION INFORMATION

offset voltage

The output offset voltage, (V ) is the sum of the input offset voltage (V ) and both input bias currents (I ) times

OO

IO

IB

the corresponding gains. The following schematic and formula can be used to calculate the output offset

voltage:

R

F

I

R

IB−

F

_"ǒ_I

Ǔ

_"ǒ_I

Ǔ

IB*

R

V

+ V 1 ) ǒ Ǔ

R 1 ) ǒ Ǔ

R

ǒ Ǔ ǒ Ǔ

G

OO

IO

IB)

S

F

R

G

+

−

+

V

I

V

O

R

S

I

IB+

Figure 50. Output Offset Voltage Model

general configurations

When receiving low-level signals, limiting the bandwidth of the incoming signals into the system is often

required. The simplest way to accomplish this is to place an RC filter at the noninverting terminal of the amplifier

(see Figure 51).

R

F

G

V

R

O

F

1

ǒ

Ǔ

+

ǒ

1 )

Ǔ

V

1 ) sR1C1

I

G

−

V

O

+

1

V

I

f

+

–3dB

R1

2pR1C1

C1

Figure 51. Single-Pole Low-Pass Filter

If even more attenuation is needed, a multiple pole filter is required. The Sallen-Key filter can be used for this

task. For best results, the amplifier should have a bandwidth that is 8 to 10 times the filter frequency bandwidth.

Failure to do this can result in phase shift of the amplifier.

C1

R1 = R2 = R

C1 = C2 = C

Q = Peaking Factor

(Butterworth Q = 0.707)

+

_

V

I

1

R1

R2

f

+

–3dB

2pRC

C2

R

F

1

R

=

G

R

F

2 −

)

R

(

Q

G

Figure 52. 2-Pole Low-Pass Sallen-Key Filter

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ꢑ µ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

APPLICATION INFORMATION

general power dissipation considerations

For a given θ , the maximum power dissipation is shown in Figure 53 and is calculated by the following formula:

JA

T

–T

MAX

A

P

+

ǒ Ǔ

D

q

JA

Where:

P

= Maximum power dissipation of TLV245x IC (watts)

= Absolute maximum junction temperature (150°C)

= Free-ambient air temperature (°C)

D

T

MAX

T

A

θ

= θ + θ

JA

JC CA

θ

= Thermal coefficient from junction to case

JC

= Thermal coefficient from case to ambient air (°C/W)

CA

MAXIMUM POWER DISSIPATION

vs

FREE-AIR TEMPERATURE

2

T

= 150°C

PDIP Package

J

Low-K Test PCB

1.75

θ

= 104°C/W

JA

1.5

1.25

1

MSOP Package

Low-K Test PCB

SOIC Package

Low-K Test PCB

θ

= 260°C/W

JA

θ

= 176°C/W

JA

0.75

0.5

SOT-23 Package

Low-K Test PCB

0.25

0

θ

= 324°C/W

JA

−55−40 −25 −10

5

20 35 50 65 80 95 110 125

T

A

− Free-Air Temperature − °C

NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.

Figure 53. Maximum Power Dissipation vs Free-Air Temperature

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ꢍ

ꢌꢋ

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ꢐ

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ꢃ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒ ꢓꢔ ꢕꢋꢎ ꢁ ꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀꢙ ꢐ ꢘ ꢀꢗ ꢘꢀ

ꢑµ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

APPLICATION INFORMATION

macromodel information

Macromodel information provided was derived using Microsim Parts, the model generation software used

with Microsim PSpice. The Boyle macromodel (see Note 1) and subcircuit in Figure 54 are generated using

the TLV245x typical electrical and operating characteristics at T = 25°C. Using this information, output

A

simulations of the following key parameters can be generated to a tolerance of 20% (in most cases):

D

Maximum positive output voltage swing

Maximum negative output voltage swing

Slew rate

D

Unity-gain frequency

Common-mode rejection ratio

Phase margin

Quiescent power dissipation

Input bias current

DC output resistance

AC output resistance

Short-circuit output current limit

Open-loop voltage amplification

NOTE 1: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, “Macromodeling of Integrated Circuit Operational Amplifiers,” IEEE Journal

of Solid-State Circuits, SC-9, 353 (1974).

PSpice and Parts are trademarks of MicroSim Corporation.

29

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ꢀ

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ꢁ

ꢃ

ꢂ

ꢃ

ꢑ µ

ꢄ

ꢅ

ꢈ

ꢇ

ꢀ

ꢁ

ꢂ

ꢃ

ꢄ

ꢅ

ꢃ

ꢇ

ꢀ

ꢁ

ꢂ

ꢃ

ꢄ

ꢅ

ꢉ

ꢇ

ꢀ

ꢁ

ꢂ

ꢃ

ꢄ

ꢅ

ꢉ ꢋ ꢃ ꢃ ꢆ ꢑꢒꢓ ꢔ ꢕꢋ ꢎ ꢁꢑꢀꢐ ꢑꢕꢋꢎ ꢁ ꢎꢖ ꢗꢘꢀ ꢙꢐ ꢘꢀ ꢗꢘ ꢀ

ꢄ

ꢇ

ꢀ

ꢁ

ꢂ

ꢃ

ꢄ

ꢅ

ꢇ

ꢀ

ꢁꢂ

ꢃ

ꢄ

ꢅ

ꢊ

ꢋ

ꢌ

ꢋ

ꢌ

ꢐꢗ ꢚ ꢕꢋꢀ ꢎ ꢐꢖ ꢋ ꢁ ꢋꢍ ꢗꢁ ꢎ ꢌꢎ ꢚ ꢕꢛ ꢜ ꢎ ꢀꢓ ꢛ ꢓꢘꢀ ꢝꢐ ꢜ ꢖ

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

APPLICATION INFORMATION

3

99

egnd

V

DD+

+

ree

ro2

cee

fb

rp

rc1

11

rc2

12

−

c1

7

+

1

2

c2

vlim

−

8

IN+

IN−

+

−

r2

9

6

vc

+

q1

q2

vb

ga

−

ro1

gcm

ioff

53

dp

14

13

OUT

re1

re2

dlp

dln

5

91

90

92

10

+

hlim

−

+

−

iee

dc

vlp

vln

GND

+

−

+ 54

4

de

ve

* AMP_TLV2450−X operational amplifier ”macromodel” subcircuit

IEE

HLIM

Q1

10

90

11

12

6

4

dc

938.61E−9

* created using Parts release 8.0 on 10/12/98 at 11:06

0

vlim 1K

13 qx1

14 qx2

100.00E3

65.557E3

10.367E3

213.08E6

10

* Parts is a MicroSim product.

*

2

Q2

1

* connections:

noninverting input

| inverting input

R2

9

*

RC1

RC2

RE1

RE2

REE

RO1

RO2

RP

3

11

12

10

99

5

| | positive power supply

| | | negative power supply

| | | | output

3

13

14

10

8

| | | | |

.subckt AMP_TLV2450−X 1 2 3 4 5

*

7

99

4

10

C1

11

6

12

7

99

53

5

91

90

3

0

99

354.48E−15

3

147.06

dc 0

C2

7.5000E−12

VB

9

0

CEE

DC

10

5

42.237E−15

VC

3

53

4

dc .82

dy

VE

54

7

dc .82

DE

54

90

92

4

99

7

dy

VLIM

VLP

VLN

8

dc 0

DLP

DLN

DP

EGND

FB

dx

91

0

dc 38

dx

92

dc 38

dx

.model

.model dy

dx

D(Is=800.00E−18)

poly(2) (3,0) (4,0) 0 .5 .5

poly(5) vb vc ve vlp vln 0

D(Is=800.00E−18 Rs=1m Cjo=10p)

.model qx1 NPN(Is=800.00E−18 Bf=843.08)

.model qx2 NPN(Is=800.0000E−18 Bf=843.08)

.ends

+ 207.31E6 −1E3 1E3 210E6 −210E6

GA

GCM

6

0

6

11

10

12 15.254E−6

99 48.237E−12

Figure 54. Boyle Macromodel and Subcircuit

30

WWW.TI.COM

^{POST OFFICE BOX 1443}• HOUSTON, TEXAS 77251−1443

PACKAGE OPTION ADDENDUM

www.ti.com

14-Jan-2005

PACKAGING INFORMATION

Orderable Device

TLV2450AID

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

SOIC

D

8

6

8

6

8

5

8

75

2500

50

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2450AIDR

TLV2450AIP

SOIC

PDIP

D

P

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-NA-NA-NA

TLV2450CD

SOIC

D

75

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2450CDBVR

TLV2450CDBVRG4

TLV2450CDBVT

TLV2450CDR

TLV2450CP

SOT-23

SOIC

DBV

D

3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

PDIP

P

50

Pb-Free

(RoHS)

CU NIPDAU Level-NA-NA-NA

TLV2450ID

SOIC

D

75

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2450IDBVR

TLV2450IDBVRG4

TLV2450IDBVT

TLV2450IDR

SOT-23

SOIC

DBV

D

3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2450IP

PDIP

P

50

Pb-Free

(RoHS)

CU NIPDAU Level-NA-NA-NA

TLV2451AID

SOIC

D

75

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2451AIDR

TLV2451AIP

SOIC

D

2500

50

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

PDIP

P

Pb-Free

(RoHS)

CU NIPDAU Level-NA-NA-NA

TLV2451CD

SOIC

D

75

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2451CDBVR

TLV2451CDBVRG4

TLV2451CDBVT

TLV2451CDR

TLV2451CP

SOT-23

SOIC

DBV

D

3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

PDIP

P

50

Pb-Free

(RoHS)

CU NIPDAU Level-NA-NA-NA

TLV2451ID

SOIC

D

75

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

14-Jan-2005

Orderable Device

TLV2451IDBVR

TLV2451IDBVRG4

TLV2451IDBVT

TLV2451IDR

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

SOT-23

DBV

5

8

3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOT-23

SOIC

PDIP

DBV

D

3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2451IP

P

50

Pb-Free

(RoHS)

CU NIPDAU Level-NA-NA-NA

TLV2452AID

SOIC

PDIP

D

75

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2452AIDR

TLV2452AIP

D

2500

50

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

P

Pb-Free

(RoHS)

CU NIPDAU Level-NA-NA-NA

TLV2452CD

SOIC

D

75

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2452CDGK

TLV2452CDGKR

TLV2452CDR

ACTIVE

MSOP

SOIC

DGK

D

8

80

None

CU SNPB

Level-1-220C-UNLIM

2500

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2452CP

TLV2452ID

ACTIVE

PDIP

SOIC

P

D

8

50

75

Pb-Free

(RoHS)

CU NIPDAU Level-NA-NA-NA

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2452IDGK

TLV2452IDGKR

TLV2452IDR

ACTIVE

MSOP

SOIC

DGK

D

8

80

None

CU SNPB

Level-1-220C-UNLIM

2500

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2452IP

TLV2453AID

TLV2453AIDR

TLV2453AIN

TLV2453CD

ACTIVE

PDIP

SOIC

PDIP

SOIC

P

D

N

D

8

50

Pb-Free

(RoHS)

CU NIPDAU Level-NA-NA-NA

14

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

2500

25

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-NA-NA-NA

50

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2453CDGS

TLV2453CDGSR

TLV2453CDR

ACTIVE

MSOP

SOIC

DGS

D

10

14

80

None

CU SNPB

Level-1-220C-UNLIM

2500

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2453CN

TLV2453ID

ACTIVE

PDIP

SOIC

N

D

14

25

50

Pb-Free

(RoHS)

CU NIPDAU Level-NA-NA-NA

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2453IDGS

ACTIVE

MSOP

DGS

10

80

None

CU SNPB

Level-1-220C-UNLIM

TLV2453IDGSR

2500

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

14-Jan-2005

Orderable Device

TLV2453IDR

TLV2453IN

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

SOIC

D

14

2500

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

PDIP

SOIC

PDIP

N

D

N

25

Pb-Free

(RoHS)

CU NIPDAU Level-NA-NA-NA

TLV2454AID

TLV2454AIDR

TLV2454AIN

50

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

2500

25

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

Pb-Free

(RoHS)

CU NIPD

Level-NA-NA-NA

TLV2454AIPW

TLV2454AIPWR

TLV2454CD

ACTIVE

TSSOP

SOIC

PW

D

14

90

2000

50

None

CU NIPDAU Level-1-220C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2454CDR

TLV2454CN

ACTIVE

SOIC

PDIP

D

N

14

2500

25

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

Pb-Free

(RoHS)

CU NIPD

Level-NA-NA-NA

TLV2454CPW

TLV2454CPWR

TLV2454ID

ACTIVE

TSSOP

SOIC

PW

D

14

90

2000

50

None

Call TI

CU NIPDAU Level-1-220C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2454IDR

TLV2454IN

ACTIVE

SOIC

PDIP

D

N

14

2500

25

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

Pb-Free

(RoHS)

CU NIPD

Level-NA-NA-NA

TLV2454IPW

TLV2454IPWR

TLV2455AID

ACTIVE

TSSOP

SOIC

PW

D

14

16

90

2000

40

None

CU NIPDAU Level-1-220C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2455AIDR

TLV2455AIN

ACTIVE

SOIC

PDIP

D

N

16

2500

25

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-NA-NA-NA

TLV2455AIPW

TLV2455AIPWR

TLV2455CD

ACTIVE

TSSOP

SOIC

PW

D

16

90

2000

40

None

CU NIPDAU Level-1-220C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2455CDR

TLV2455CN

ACTIVE

SOIC

PDIP

D

N

16

2500

25

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-NA-NA-NA

TLV2455CPW

TLV2455CPWR

TLV2455ID

ACTIVE

TSSOP

SOIC

PW

D

16

90

2000

40

None

CU NIPDAU Level-1-220C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV2455IDR

TLV2455IN

ACTIVE

SOIC

PDIP

D

N

16

2500

25

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1YEAR/

Level-1-220C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-NA-NA-NA

Addendum-Page 3

PACKAGE OPTION ADDENDUM

www.ti.com

14-Jan-2005

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

TLV2455IPW

ACTIVE

TSSOP

PW

16

90

None

CU NIPDAU Level-1-220C-UNLIM

TLV2455IPWR

PW

2000

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 4

MECHANICAL DATA

MPDI001A – JANUARY 1995 – REVISED JUNE 1999

P (R-PDIP-T8)

PLASTIC DUAL-IN-LINE

0.400 (10,60)

0.355 (9,02)

8

5

0.260 (6,60)

0.240 (6,10)

1

4

0.070 (1,78) MAX

0.325 (8,26)

0.300 (7,62)

0.020 (0,51) MIN

0.015 (0,38)

Gage Plane

0.200 (5,08) MAX

Seating Plane

0.010 (0,25) NOM

0.125 (3,18) MIN

0.100 (2,54)

0.021 (0,53)

0.430 (10,92)

MAX

0.010 (0,25)

M

0.015 (0,38)

4040082/D 05/98

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Falls within JEDEC MS-001

For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

M

0,10

0,65

14

8

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

1

7

0°–8°

A

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

8

14

16

20

24

28

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

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TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,

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amplifier.ti.com

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dsp.ti.com

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www.ti.com/broadband

www.ti.com/digitalcontrol

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Logic

interface.ti.com

logic.ti.com

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power.ti.com

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Security

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microcontroller.ti.com

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Video & Imaging

Wireless

www.ti.com/wireless

Mailing Address:

Texas Instruments

Post Office Box 655303 Dallas, Texas 75265


型号：	TLV2451CDBVR
厂家：	TEXAS INSTRUMENTS
描述：	FAMILY OF 23-UA 220-KHZ RAIL TO RAIL INPUT/ OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN 系列23 -UA 220 kHz的轨至轨输入/输出运算放大器，带有关断运算放大器放大器电路光电二极管输出元件输入元件 CD PC
文件：	总45页 (文件大小：1050K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TLV2451CDBVR [TI]

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