TLV2621 [TI]
FAMILY OF LOW-POWER WIDE BANDWIDTH SINGLE SUPPLY OPERATIONAL AMPLIFIERS WITH SHUTDOWN; 系列低功耗高带宽单电源运算放大器，带有关断的
| 型号： | TLV2621 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | FAMILY OF LOW-POWER WIDE BANDWIDTH SINGLE SUPPLY OPERATIONAL AMPLIFIERS WITH SHUTDOWN |
| 文件： | 总25页 (文件大小：1091K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLV2620, TLV2621
TLV2622, TLV2623
TLV2624, TLV2625
www.ti.com
SLOS251D–DECEMBER 2000–REVISED JANUARY 2005
FAMILY OF LOW-POWER WIDE BANDWIDTH SINGLE SUPPLY
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
FEATURES
Operational Amplifier
•
•
•
•
•
•
•
CMOS Rail-To-Rail Output
VICR Includes Positive Rail
Wide Bandwidth . . . 11 MHz
Slew Rate . . . 10 V/µs
+
−
Supply Current . . . 800 µA/Channel
Input Noise Voltage . . . 27 nV/√Hz
DIFFERENTIAL VOLTAGE AMPLIFICATION AND PHASE
vs
Ultralow Power-Down Mode:
IDD(SHDN) = 4 µA/Channel
FREQUENCY
120
V
= 2.7 V and 5 V
DD
R = 2 kΩ
•
•
Supply Voltage Range . . . 2.7 V to 5.5 V
110
100
90
80
70
60
50
40
30
20
10
0
L
C
T
= 10 pF
= 25° C
L
Specified Temperature Range:
-40°C to 125°C . . . Industrial Grade
A
180
150
120
•
•
Ultrasmall Packaging:
5 or 6 Pin SOT-23 (TLV2620/1)
8 or 10 Pin MSOP (TLV2622/3)
Phase
90
60
30
Universal Opamp EVM (See SLOU060 for More
Information)
0
Gain
−30
−60
−90
−10
10
100
1k
10k 100k 1M 10M
f − Frequency − Hz
DESCRIPTION
The TLV262x single supply operational amplifiers provide rail-to-rail output with an input range that includes the
positive rail. The TLV262x takes the minimum operating supply voltage down to 2.7 V over the extended
industrial temperature range (-40°C to 125°C) while adding the rail-to-rail output swing feature. The TLV262x
also provides 11-MHz bandwidth from only 800 µA of supply current. The maximum recommended supply
voltage is 5.5 V, which, when coupled with a 2.7-V minimum, allows the devices to be operated from lithium ion
cells. The combination of wide bandwidth, low noise, and low distortion makes it ideal for high speed and high
resolution data converter applications. The positive input range allows it to directly interface to positive rail
referred systems. All members are available in PDIP and SOIC with the singles in the small SOT-23 package,
duals in the MSOP, and quads in the TSSOP package.
The 2.7-V operation makes it compatible with Li-Ion powered systems and the operating supply voltage range of
many micro-power micro-controllers available today including TI's MSP430.
AMPLIFIER SELECTION TABLE
VDD
[V]
IDD/ch
[µA]
VIO
[µV]
IIB
[pA]
VICR
[V]
GBW
[MHz]
SLEW RATE
[V/µs]
Vn, 1 kHz
[nV/√Hz]
IO
[mA]
SHUT-
DOWN
DEVICE
TLV262x 2.7-5.5
TLV263x 2.7-5.5
TLV278x 1.8-3.6
750
750
250
250
250
60
1
1
1 V to VDD + 0.2
GND to VDD - 0.8
-0.2 to VDD + 0.2
0.5 to VDD - 0.8
GND to VDD - 1
11
10
8
10
9
27
27
9
28
28
10
55
55
Y
Y
Y
Y
Y
650
2.5
1.5
3
5
TLC07x
TLC08x
4.5 - 16
4.5 - 16
1900
1900
10
10
19
19
7
60
8.5
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2005, Texas Instruments Incorporated
TLV2620, TLV2621
TLV2622, TLV2623
TLV2624, TLV2625
www.ti.com
SLOS251D–DECEMBER 2000–REVISED JANUARY 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
TLV2620 AND TLV2621 AVAILABLE OPTIONS(1)
PACKAGED DEVICES
VIOmax AT
TA
SOT-23
SMALL OUTLINE
(D)(2)
25°C
PLASTIC DIP (P)
(DBV)(3)
SYMBOL
TLV2620ID
TLV2621ID
TLV2620IDBV
TLV2621IDBV
VBAI
VBBI
TLV2620IP
TLV2621IP
-40°C to 125°C
3500 µV
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2620IDR).
(3) The SOT23 package devices are only available taped and reeled. The R Suffix denotes quantities (3,000 pieces per reel). For smaller
quantities (250 pieces per mini-reel), add a T suffix to the part number (e.g. TLV2620IDBVT).
TLV2622 AND TLV2623 AVAILABLE OPTIONS(1)
PACKAGED DEVICES
VIOmax AT
SMALL
OUTLINE(2)
(D)
MSOP
SYMBOL
PLASTIC
DIP
TA
PLASTIC
DIP (N)
25°C
(DGK)(2)
(DGS)(2)
SYMBOL
(P)
TLV2622ID
TLV2623ID
TLV2622IDGK
—
xxTIAKM
—
—
—
xxTIALC
—
TLV2622IP
—
-40°C to 125°C
3500 µV
TLV2623IDGS
TLV2623IN
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2622IDR).
TLV2624 AND TLV2625 AVAILABLE OPTIONS(1)
PACKAGED DEVICES
VIOmax
AT 25°C
TA
SMALL OUTLINE
(D)(2)
PLASTIC DIP
(N)
TSSOP
(PW)
TLV2624ID
TLV2625ID
TLV2624IN
TLV2625IN
TLV2624IPW
TLV2625IPW
-40°C to 125°C
3500 µV
(1) For the most current package and ordering information, see the Package Option Addendum at the
end of this document, or see the TI website at www.ti.com.
(2) This package is available taped and reeled. To order this packaging option, add an R suffix to the
part number (e.g., TLV2624IDR).
2
TLV2620, TLV2621
TLV2622, TLV2623
TLV2624, TLV2625
www.ti.com
SLOS251D–DECEMBER 2000–REVISED JANUARY 2005
TLV262X PACKAGE PINOUTS(1)
TLV2620
D OR P PACKAGE
(TOP VIEW)
TLV2620
DBV PACKAGE
(TOP VIEW)
TLV2621
DBV PACKAGE
(TOP VIEW)
1
2
3
1
2
3
6
5
4
V
5
V
DD
OUT
GND
OUT
GND
NC
IN−
IN+
SHDN
1
2
3
4
8
7
6
5
DD
V
DD
SHDN
IN−
OUT
NC
GND
4
IN−
IN+
IN+
TLV2623
DGS PACKAGE
(TOP VIEW)
TLV2621
D OR P PACKAGE
(TOP VIEW)
TLV2622
D, DGK, OR P PACKAGE
(TOP VIEW)
1
1OUT
1IN−
1IN+
GND
1SHDN
V
2OUT
2IN−
2IN+
2SHDN
10
DD
NC
IN−
IN+
NC
1
2
3
4
8
7
6
5
1OUT
1IN−
1IN+
GND
V
DD
1
2
3
4
8
7
6
5
2
9
V
DD
2OUT
2IN−
2IN+
3
8
4
OUT
NC
7
GND
5
6
TLV2624
TLV2625
TLV2623
D, N, OR PW PACKAGE
D, N, OR PW PACKAGE
D OR N PACKAGE
(TOP VIEW)
(TOP VIEW)
(TOP VIEW)
1OUT
1IN−
1IN+
4OUT
4IN−
4IN+
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
14
13
12
11
10
9
1OUT
1IN−
1IN+
GND
NC
V
1OUT
1IN−
1IN+
1
2
3
4
5
6
7
14
13
12
11
10
9
4OUT
4IN−
4IN+
GND
3IN+
3IN−
3OUT
DD
2OUT
2IN−
2IN+
NC
V
DD
GND
3IN+
V
DD
2IN+
2IN−
2IN+
2IN−
3IN−
1SHDN
NC
2SHDN
NC
2OUT
1/2SHDN
3OUT
3/4SHDN
8
8
2OUT
NC − No internal connection
1/2SHDN Pin (8) controls amplifiers 1 and 2.
3/4SHDN Pin (9) controls amplifiers 3 and 4.
(1) SOT-23 may or may not be indicated.
TYPICAL PIN 1 INDICATORS
Pin 1
Pin 1
Pin 1
Pin 1
Molded ”U” Shape
Printed or
Molded Dot
Stripe
Bevel Edges
NOTE:
If there is not a Pin 1 indicator, turn device to enable reading the symbol from left to
right. Pin 1 is at the lower left corner of the device.
3
TLV2620, TLV2621
TLV2622, TLV2623
TLV2624, TLV2625
www.ti.com
SLOS251D–DECEMBER 2000–REVISED JANUARY 2005
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
(2)
VDD
VID
VI
Supply voltage
6 V
±VDD
Differential input voltage
(2)
Input voltage range
+1 to VDD + 0.2 V
± 10 mA
II
Input current (any input)
IO
Output current
±40 mA
Continuous total power dissipation
Operating free-air temperature range: I-suffix
Maximum junction temperature
See Dissipation Rating Table
-40°C to 125°C
150°C
TA
TJ
Tstg
Storage temperature range
-65°C to 150°C
260°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to GND.
DISSIPATION RATING TABLE
θJC
(°C/W)
38.3
θJA
(°C/W)
176
T
A ≤ 25°C
TA = 125°C
POWER RATING
PACKAGE
POWER RATING
D (8)
D (14)
710 mW
142 mW
204.4 mW
218 mW
77.1 mW
85 mW
26.9
25.7
55
122.3
114.7
324.1
294.3
259.9
259.7
78
1022 mW
1090 mW
385 mW
D (16)
DBV (5)
DBV (6)
DGK (8)
DGS (10)
N (14, 16)
P (8)
55
425 mW
54.2
54.1
32
481 mW
96.1 mW
97 mW
485 mW
1600 mW
1200 mW
720 mW
320.5 mW
240.4 mW
144 mW
154.9 mW
41
104
PW (14)
PW (16)
29.3
28.7
173.6
161.4
774 mW
RECOMMENDED OPERATING CONDITIONS
MIN
2.7
MAX UNIT
Single supply
Split supply
5.5
V
VDD
Supply voltage
±1.35
1
±2.75
VICR
TA
Common-mode input voltage range
Operating free-air temperature
VDD+0.2
V
I-suffix
VIL
-40
125
0.4
°C
Shutdown on/off voltage level(1)
V
VIH
2
(1) Relative to GND.
4
TLV2620, TLV2621
TLV2622, TLV2623
TLV2624, TLV2625
www.ti.com
SLOS251D–DECEMBER 2000–REVISED JANUARY 2005
ELECTRICAL CHARACTERISTICS
at specified free-air temperature, VDD = 2.7 V, 5 V (unless otherwise noted)
(1)
PARAMETER
DC PERFORMANCE
TEST CONDITIONS
TA
MIN
TYP MAX
UNIT
25°C
250 3500
4500
VIO
Input offset voltage
µV
VIC = VDD/2, VO = VDD/2,
Full range
RS = 50 Ω
Temperature coefficient of
input offset voltage
αVIO
25°C
3
µV/°C
25°C
Full range
25°C
77
63
78
75
90
82
95
90
98
VDD = 2.7 V
VDD = 5 V
VIC = 1 to VDD
RS = 50 Ω
,
CMRR
Common-mode rejection ratio
dB
dB
99
100
100
Full range
25°C
VDD = 2.7 V, RL = 2 kΩ,
VO(PP) = 1.7 V
Full range
25°C
Large-signal differential voltage
amplification
AVD
VDD = 5 V, RL = 2 kΩ,
VO(PP) = 4 V
Full range
INPUT CHARACTERISTICS
25°C
Full Range
25°C
2
2
50
100
50
IIO
Input offset current
VIC = VDD/2, VO = VDD/2,
RS = 50Ω
pA
IIB
Input bias current
Full Range
25°C
200
ri(d)
Differential input resistance
100
8
GΩ
Common-mode input
capacitance
Ci(c)
f = 1 kHz
25°C
pF
OUTPUT CHARACTERISTICS
25°C
Full range
25°C
2.6
2.55
4.95
4.9
2.67
4.98
2.43
4.8
VDD = 2.7 V
VDD = 5 V
VDD = 2.7 V
VDD = 5 V
VDD = 2.7 V
VDD = 5 V
VDD = 2.7 V
VDD = 5 V
VIC = VDD/2,
IOH = -1 mA
Full range
25°C
VOH
High-level output voltage
V
2.3
Full range
25°C
2.2
VIC = VDD/2,
IOH = -10 mA
4.7
Full range
25°C
4.6
0.03
0.025
0.26
0.2
0.1
0.15
0.05
0.1
Full range
25°C
VIC = VDD/2,
IOL = 1 mA
Full range
25°C
VOL
Low-level output voltage
V
0.4
Full range
25°C
0.45
0.25
0.35
VIC = VDD/2,
IOL = 10 mA
Full range
Sourcing
Sinking
14
19
28
28
50
95
50
95
VDD = 2.7 V,
VO = 0.5 V from rail
IO
Output current
25°C
25°C
mA
mA
Sourcing
Sinking
VDD = 5 V,
VO = 0.5 V from rail
VDD = 2.7 V
VDD = 5 V
VDD = 2.7 V
VDD = 5 V
Sourcing
Sinking
IOS
Short-circuit output current
(1) Full range is -40°C to 125°C for the I-suffix.
5
TLV2620, TLV2621
TLV2622, TLV2623
TLV2624, TLV2625
www.ti.com
SLOS251D–DECEMBER 2000–REVISED JANUARY 2005
ELECTRICAL CHARACTERISTICS (continued)
at specified free-air temperature, VDD = 2.7 V, 5 V (unless otherwise noted)
(1)
PARAMETER
POWER SUPPLY
TEST CONDITIONS
TA
MIN
TYP MAX
UNIT
25°C
Full range
25°C
800 1000
1300
IDD
Supply current (per channel)
VO = VDD/2,
SHDN = VDD
No load
µA
80
75
75
70
98
VDD = 2.7 V to 3.3 V,
VIC = VDD/2
Full range
25°C
Supply voltage rejection ratio
PSRR
dB
(∆VDD/∆VIO
)
90
VDD = 2.7 V to 5 V,
VIC = VDD/2
Full range
DYNAMIC PERFORMANCE
UGBW
Unity gain bandwidth
RL = 2 kΩ, CL = 10 pF
25°C
25°C
11
MHz
V/µs
3.5
2.7
5.4
3.4
2.7
2.3
4.5
3.2
4.5
VDD = 2.7 V,
VO(PP) = 1.7 V
Full range
25°C
SR+
Positive slew rate at unity gain RL = 2 kΩ, CL = 50 pF
Negative slew rate at unity gain RL = 2 kΩ, CL = 50 pF
7
5
6
VDD = 5 V,
VO(PP) = 3.5 V
Full range
25°C
VDD = 2.7 V,
VO(PP) = 1.7 V
Full range
25°C
SR-
V/µs
dB
VDD = 5 V,
VO(PP) = 3.5 V
Full range
φm
Phase margin
63°
RL = 2 kΩ, CL = 10 pF
Gain margin
25°C
8
NOISE/DISTORTION PERFORMANCE
AV = 1
0.002%
Total harmonic distortion plus
VO(PP) = VDD/2,
RL = 2 kΩ, f = 10 kHz
THD + N
noise
AV = 10
AV = 100
0.019%
0.095%
53
25°C
f = 1 kHz
f = 10 kHz
f = 1 kHz
Vn
In
Equivalent input noise voltage
Equivalent input noise current
nV/√Hz
fA/√Hz
27
0.9
SHUTDOWN CHARACTERISTICS
Supply current, per channel in
IDD(SHDN) shutdown mode (TLV2620,
TLV2623, TLV2625)
25°C
4
11
13
SHDN = 0.4 V
µA
Full range
VDD = 2.7 V
VDD = 5 V
4.5
1.5
t(on)
t(off)
Amplifier turnon time(2)
Amplifier turnoff time(2)
RL = 2 kΩ
RL = 2 kΩ
µs
ns
25°C
200
(2) Disable time and enable time are defined as the interval between application of the logic signal to SHDN and the point at which the
supply current has reached half its final value.
6
TLV2620, TLV2621
TLV2622, TLV2623
TLV2624, TLV2625
www.ti.com
SLOS251D–DECEMBER 2000–REVISED JANUARY 2005
TYPICAL CHARACTERISTICS
TABLE OF GRAPHS
FIGURE
1, 2
3
VIO
Input offset voltage
vs Common-mode input voltage
vs Frequency
CMRR
VOH
VOL
Common-mode rejection ratio
High-level output voltage
Low-level output voltage
Supply current
vs High-level output current
vs Low-level output current
vs Supply voltage
4, 6
5, 7
8
IDD
IDD
Supply current
vs Free-air temperature
vs Frequency
9
PSRR
AVD
Power supply rejection ratio
Differential voltage amplification & phase
Gain-bandwidth product
10
vs Frequency
11
vs Free-air temperature
vs Supply voltage
12
13
SR
Slew rate
vs Free-air temperature
vs Load capacitance
vs Frequency
14, 15
16
φm
Phase margin
Vn
Equivalent input noise voltage
Voltage-follower large-signal pulse response
Voltage-follower small-signal pulse response
Crosstalk
17
18
19
vs Frequency
20
IDD(SHDN)
IDD(SHDN)
IDD(SHDN)
Shutdown supply current
vs Free-air temperature
vs Supply voltage
vs Time
21
Shutdown supply current
22
Shutdown supply current/output voltage
23
INPUT OFFSET VOLTAGE
vs
COMMON-MODE INPUT VOLTAGE
INPUT OFFSET VOLTAGE
COMMON-MODE REJECTION RATIO
vs
vs
COMMON-MODE INPUT VOLTAGE
FREQUENCY
500
450
400
350
300
250
200
150
100
50
500
450
400
350
300
250
200
150
100
50
120
110
100
90
80
70
60
50
40
30
20
10
0
V
T
= 5 V
V
T
= 2.7 V
V
T
= 2.7 V and 5 V
= 25° C
DD
= 25° C
DD
= 25° C
DD
A
A
A
0
0
−50
−100
−50
−100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
10
100
1k
10k
100k
1M
f − Frequency − Hz
V
− Common-Mode Input Voltage − V
V
− Common-Mode Input Voltage − V
ICR
ICR
Figure 1.
Figure 2.
Figure 3.
7
TLV2620, TLV2621
TLV2622, TLV2623
TLV2624, TLV2625
www.ti.com
SLOS251D–DECEMBER 2000–REVISED JANUARY 2005
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
2.7
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0.0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
V
= 2.7 V
V
= 2.7 V
V
= 5 V
DD
DD
DD
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0.0
T
= 125°C
= 70°C
A
T
A
T
A
= 125°C
T
A
= 70°C
T
= 125°C
= 70°C
A
T
T
25°C
A =
= 0°C
T
A
A
T
T
25°C
A =
= 0°C
T
A
= −40°C
A
T
A
= −40°C
T
T
25°C
A =
= 0°C
A
T
= −40°C
A
0
5
10 15 20 25 30 35 40 45
0
5
10 15 20 25 30 35 40 45
0
10 20 30 40 50 60 70 80 90 100
I
− Low-Level Output Current − mA
I
− High-Level Output Current − mA
OL
I
− High-Level Output Current − mA
OH
OH
Figure 4.
Figure 5.
Figure 6.
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
1000
900
800
700
600
500
400
300
200
100
0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1100
1000
900
800
700
600
500
400
300
200
100
0
V
= 5 V
DD
T
= 125°C
A
V
= 5 V
DD
T
A
= 70°C
T
= 125°C
A
T
A
= 25°C
T
= 70°C
A
V
= 2.7 V
DD
T
25°C
A =
= 0°C
T
A
= 0°C
T
A
T
= −40°C
T
A
= −40°C
A
A = 1
V
A = 1
V
IC
V
= V /2
V
= V /2
IC
DD
DD
−40−25−10
5
20 35 50 65 80 95 110 125
0
10 20 30 40 50 60 70 80 90 100
0
1
2
3
4
5
6
I
− Low-Level Output Current − mA
OL
T
A
− Free-Air Temperature − °C
V
− Supply Voltage − V
DD
Figure 7.
Figure 8.
Figure 9.
DIFFERENTIAL VOLTAGE
AMPLIFICATION AND PHASE
vs
POWER SUPPLY REJECTION RATIO
GAIN-BANDWIDTH PRODUCT
vs
FREE-AIR TEMPERATURE
vs
FREQUENCY
FREQUENCY
100
90
80
70
60
50
40
30
20
10
0
120
12
11
10
9
V
= 2.7 V and 5 V
DD
R = 2 kΩ
V
= 5 V
DD
PSSR
+
V
T
A
= 2.7 V and 5 V
DD
= 25° C
110
100
90
80
70
60
50
40
30
20
10
0
L
C
= 10 pF
= 25° C
L
V
= 2.7 V
DD
T
A
PSSR−
180
150
120
8
Phase
7
90
60
30
6
5
4
0
3
Gain
−30
R
L
= 2 kΩ
= 10 pF
−60
−90
2
C
L
−10
10
1
f = 10 kHz
100
1k
10k 100k 1M
10M
0
f − Frequency − Hz
10
100
1k
10k
100k
1M
10M
−40−25−10
5
20 35 50 65 80 95 110 125
f − Frequency − Hz
T
A
− Free-Air Temperature − °C
Figure 10.
Figure 11.
Figure 12.
8
TLV2620, TLV2621
TLV2622, TLV2623
TLV2624, TLV2625
www.ti.com
SLOS251D–DECEMBER 2000–REVISED JANUARY 2005
SLEW RATE
vs
SUPPLY VOLTAGE
SLEW RATE
vs
FREE-AIR TEMPERATURE
SLEW RATE
vs
FREE-AIR TEMPERATURE
15
14
13
12
11
10
9
8
7
6
5
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
12
SR+
11
10
9
SR+
SR+
SR−
8
SR−
SR−
7
6
5
4
4
3
2
1
3
V
A
V
= 2.7 V
DD
= 1
V
A
V
= 5 V
DD
= 1
V
= 1 V to 4.5 V
(step)
A
= 1
V
2
V
T
= 1 V to 2 V
(step)
= 25° C
V
1
= 1 V to 2.2 V
(step)
A
0
0
−40−25−10
5
20 35 50 65 80 95 110 125
−40−25−10
5
20 35 50 65 80 95 110 125
2.7 3.0 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7 6.0
T
A
− Free-Air Temperature − °C
T
A
− Free-Air Temperature − °C
V
− Supply Voltage − V
DD
Figure 13.
Figure 14.
Figure 15.
EQUIVALENT INPUT NOISE
PHASE MARGIN
VOLTAGE
vs
vs
LOAD CAPACITANCE
FREQUENCY
70
65
60
55
50
45
40
35
30
25
500
450
400
350
300
250
200
150
100
50
V
T
A
= 2.7 V and 5 V
Rnull = 100 Ω
DD
= 25° C
Rnull = 20 Ω
Rnull = 0 Ω
20
V
= 2.7 V and 5 V
= 2 kΩ
= 1
DD
15
10
5
R
L
A
T
V
A
= 25°C
0
10
100
300
0
10
100
1k
10k
100k
C
L
− Load Capacitance − pF
f − Frequency − Hz
Figure 16.
Figure 17.
VOLTAGE-FOLLOWER LARGE-SIGNAL
PULSE RESPONSE
VOLTAGE-FOLLOWER SMALL-SIGNAL
PULSE RESPONSE
5
4
3
2
1
2.60
2.55
2.50
2.45
2.40
2.60
2.55
5
4
3
2
1
0
V
V
R
C
= 5 V
DD
2.50
2.45
= 100 mV
= 2 kΩ
= 10 pF
= 1
IC
V
IC
V
IC
L
L
A
V
2.40
T
A
= 25°C
0
V
V
V
R
C
= 5 V
DD
O
= 3.5 V
= 2 kΩ
= 10 pF
= 1
IC
L
L
V
O
A
V
T
A
= 25°C
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
0.0 0.2 0.4 0.6 0.8 1.0 1.2
t − Time − µs
t − Time − µs
Figure 18.
Figure 19.
9
TLV2620, TLV2621
TLV2622, TLV2623
TLV2624, TLV2625
www.ti.com
SLOS251D–DECEMBER 2000–REVISED JANUARY 2005
CROSSTALK
vs
FREQUENCY
SHUTDOWN SUPPLY CURRENT
vs
SHUTDOWN SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
SUPPLY VOLTAGE
0
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
V
= 2.7 V and 5 V
= 2 kΩ
= 10 pF
= 1
= V /2
O(PP) DD
= 25°C
Shutdown = 0
V
Shutdown = 0
V
A = 1
V
DD
−20
−40
R
C
A
L
L
A
V
= 1
V
= V /2
DD
V = V /2
IC DD
V
IC
V
V
= 5 V
DD
T
= 70°C
25°C
A
T
A
−60
All Channels
T
A =
−80
T
A
= 0°C
V
= 3.6 V
DD
Shutdown Crosstalk
−100
−120
−140
T
A
= −40°C
V
= 2.7 V
DD
T
A
= 125°C
Crosstalk
1k
10
100
10k
100k
−40−25−10
5
20 35 50 65 80 95 110 125
0
0 1 2 3 4 5 6
f − Frequency − Hz
T
− Free-Air Temperature − °C
V
− Supply Voltage − V
DD
A
Figure 20.
Figure 21.
Figure 22.
SHUTDOWN SUPPLY CURRENT/OUTPUT VOLTAGE
vs
TIME
5.0
4.0
3.0
2.0
SD
1.0
0.0
V
DD
= 5 V
A = 1
2.5
2.0
1.5
V
R = 2 kΩ
L
C = 10 pF
L
V
O
V
IC
= V /2
DD
1.0
0.5
0.0
T = 25° C
A
0.0
0.5
I
DD(SD)
1.0
1.5
2.0
0
1
2
3
4
5
6
7
8
9
t − Time − µs
Figure 23.
10
PACKAGE OPTION ADDENDUM
www.ti.com
7-May-2007
PACKAGING INFORMATION
Orderable Device
TLV2620IDBVR
TLV2620IDBVRG4
TLV2620IDBVT
TLV2620IDBVTG4
TLV2620IDR
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOIC
DBV
DBV
DBV
D
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLV2620IDRG4
TLV2621ID
SOIC
D
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLV2621IDBVR
TLV2621IDBVRG4
TLV2621IDBVT
TLV2621IDBVTG4
TLV2621IDG4
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
DBV
DBV
DBV
DBV
D
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLV2621IDR
SOIC
D
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLV2621IDRG4
TLV2622ID
SOIC
D
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLV2622IDG4
SOIC
D
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLV2622IDGK
TLV2622IDGKG4
TLV2622IDGKR
TLV2622IDGKRG4
TLV2622IDR
MSOP
MSOP
MSOP
MSOP
SOIC
DGK
DGK
DGK
DGK
D
8
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLV2622IDRG4
TLV2623IDGS
TLV2623IDGSG4
TLV2623IDGSR
SOIC
D
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MSOP
MSOP
MSOP
DGS
DGS
DGS
10
10
10
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
7-May-2007
Orderable Device
TLV2623IDGSRG4
TLV2623IDR
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
MSOP
DGS
10
14
14
14
14
14
14
14
14
14
14
16
16
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
D
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLV2623IDRG4
TLV2624ID
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLV2624IDG4
TLV2624IDR
SOIC
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLV2624IDRG4
TLV2624IPW
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
PW
D
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLV2624IPWG4
TLV2624IPWR
TLV2624IPWRG4
TLV2625IDR
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLV2625IDRG4
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLV2625INE4
TLV2625IPWR
OBSOLETE
ACTIVE
PDIP
N
16
16
TBD
Call TI
Call TI
TSSOP
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLV2625IPWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
7-May-2007
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Nov-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
180
180
330
180
180
330
330
330
330
330
330
330
330
330
330
(mm)
9
TLV2620IDBVR
TLV2620IDBVT
TLV2620IDR
DBV
DBV
D
6
6
SITE 40
SITE 40
SITE 27
SITE 40
SITE 40
SITE 27
SITE 35
SITE 27
SITE 35
SITE 27
SITE 27
SITE 41
SITE 41
SITE 27
SITE 41
3.15
3.15
6.4
3.2
3.2
5.2
3.2
3.2
5.2
3.4
5.2
3.4
9.0
9.0
5.6
5.6
10.3
5.6
1.4
1.4
2.1
1.4
1.4
2.1
1.4
2.1
1.4
2.1
2.1
1.6
1.6
2.1
1.6
4
4
8
4
4
8
8
8
8
8
8
8
8
8
8
8
Q3
Q3
Q1
Q3
Q3
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
9
8
8
12
9
12
8
TLV2621IDBVR
TLV2621IDBVT
TLV2621IDR
DBV
DBV
D
5
3.15
3.15
6.4
5
9
8
8
12
12
12
12
16
16
12
12
16
12
12
12
12
12
16
16
12
12
16
12
TLV2622IDGKR
TLV2622IDR
DGK
D
8
5.3
8
6.4
TLV2623IDGSR
TLV2623IDR
DGS
D
10
14
14
14
14
16
16
5.3
6.5
TLV2624IDR
D
6.5
TLV2624IPWR
TLV2624IPWRG4
TLV2625IDR
PW
PW
D
7.0
7.0
6.5
TLV2625IPWR
PW
7.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Nov-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
TLV2620IDBVR
TLV2620IDBVT
TLV2620IDR
DBV
DBV
D
6
6
SITE 40
SITE 40
SITE 27
SITE 40
SITE 40
SITE 27
SITE 35
SITE 27
SITE 35
SITE 27
SITE 27
SITE 41
SITE 41
SITE 27
SITE 41
182.0
182.0
342.9
182.0
182.0
342.9
358.0
342.9
358.0
342.9
342.9
346.0
346.0
342.9
346.0
182.0
182.0
336.6
182.0
182.0
336.6
335.0
336.6
335.0
336.6
336.6
346.0
346.0
336.6
346.0
20.0
20.0
8
20.64
20.0
TLV2621IDBVR
TLV2621IDBVT
TLV2621IDR
DBV
DBV
D
5
5
20.0
8
20.64
35.0
TLV2622IDGKR
TLV2622IDR
DGK
D
8
8
20.64
35.0
TLV2623IDGSR
TLV2623IDR
DGS
D
10
14
14
14
14
16
16
28.58
28.58
29.0
TLV2624IDR
D
TLV2624IPWR
TLV2624IPWRG4
TLV2625IDR
PW
PW
D
29.0
28.58
29.0
TLV2625IPWR
PW
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
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