TLV2762CDRG4 [TI]
DUAL OP-AMP, 6800uV OFFSET-MAX, 0.5MHz BAND WIDTH, PDSO8, GREEN, PLASTIC, SOIC-8;型号: | TLV2762CDRG4 |
厂家: | TEXAS INSTRUMENTS |
描述: | DUAL OP-AMP, 6800uV OFFSET-MAX, 0.5MHz BAND WIDTH, PDSO8, GREEN, PLASTIC, SOIC-8 放大器 光电二极管 |
文件: | 总44页 (文件大小:1678K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765
FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
Operational Amplifier
D
D
Low Supply Voltage . . . 1.8 V to 3.6 V
Very Low Supply Current . . . 20 μA (per
channel)
−
D
Ultralow Power Shut-Down Mode
+
− I
= 10 nA/Channel
DD(SHDN)
D
CMOS Rail-to-Rail Input/Output
Input Common-Mode Voltage
D
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
Range . . . −0.2 V to V + 0.2 V
DD
D
D
D
D
Input Offset Voltage . . . 550 μV
Wide Bandwidth . . . 500 kHz
Slew Rate . . . 0.20 V/μs
Specified Temperature Range:
0°C to 70°C . . . Commercial Grade
−40°C to 85°C . . . Industrial Grade
Ultrasmall Packaging
5 or 6 Pin SOT-23 (TLV2760/1)
8 or 10 Pin MSOP (TLV2762/3)
20
18
16
14
12
A = 1
V
IC
V
T
= V
DD/2
= 25° C
A
10
8
6
4
D
D
2
0
Universal Op-Amp EVM
0
0.6
1.2
1.8
2.4
3
3.6
V
− Supply Voltage − V
DD
description
The TLV276x single supply operational amplifiers provide 500 kHz bandwidth from only 20 μA while operating
down to 1.8 V over the industrial temperature range. The maximum recommended supply voltage is 3.6 V, which
allows the devices to be operated from ("1.8 V supplies down to "0.9 V) two AA or AAA cells. The devices
have been characterized at 1.8 V (end of life of 2 AA(A) cells) and at 2.4 V (nominal voltage of 2 NiCd/NiMH
cells). The TLV276x have rail-to-rail input and output capability which is a necessity at 1.8 V.
The low supply current is coupled with extremely low input bias currents enabling them to be used with
mega-ohm resistors. Low shutdown current of only 10 nA make these devices ideal for low frequency
measurement applications desiring long active battery life.
All members are available in PDIP and SOIC with the singles in the small SOT-23 package, duals in the MSOP,
and quads in the TSSOP package.
SELECTION OF SINGLE SUPPLY AMPLIFIER PRODUCTS
V
(V)
V
I
/Ch
(μA)
I
GBW
(MHz)
SR
(V/μs)
Vn,1kHz
(nV/√Hz)
I
O
SHUT-
DOWN
RAIL-TO-
RAIL
DD
IO
DD
IB
DEVICE
(μV)
600
450
550
20
(pA)
100
1
(mA)
0.2
0.4
5
TLV224x
TLV2211
2.5 − 12
2.7 − 10
1.8 − 3.6
2.7 − 6
1
0.0055
0.065
0.5
0.002
0.025
0.23
0.11
1.6
NA
21
95
49
11
—
—
Y
I/O
O
13
TLV276x
20
3
I/O
I/O
I/O
I/O
TLV245x(A)
TLV246x(A)
TLV278x(A)
23
500
1300
2.5
0.22
6.4
2.5
25
Y
2.7 − 6
150
250
550
650
Y
1.8 − 3.6
8
5
18
10
Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2000−2013, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765
FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
(1)
TLV2760 and TLV2761 AVAILABLE OPTIONS
PACKAGED DEVICES
V
max
IO
SOT-23
T
A
SMALL OUTLINE
PLASTIC DIP
(P)
AT 25°C
†
‡
(D)
(DBV)
SYMBOL
TLV2760CD
TLV2761CD
—
—
—
—
—
—
0°C to 70°C
3500 μV
3500 μV
TLV2760ID
TLV2761ID
TLV2760IDBV
TLV2761IDBV
VANI
VAXI
TLV2760IP
TLV2761IP
−40°C to 85°C
†
‡
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2760CDR).
This package is only available taped and reeled. For standard quantities (3,000 pieces per reel), add an R suffix (i.e., TLV2760CDBVR). For
smaller quantities (250 pieces per mini-reel), add a T suffix to the part number (e.g. TLV2760CDBVT).
(1)
TLV2762 and TLV2763 AVAILABLE OPTIONS
PACKAGED DEVICES
V
max
SMALL
PLASTIC
DIP
PLASTIC
DIP
IO
MSOP
SYMBOL
T
A
AT 25°C
OUTLINE
†
†
†
DGK
DGS
SYMBOL
(D)
(N)
(P)
TLV2762CD
TLV2763CD
—
—
AJO
—
—
—
—
—
—
—
—
0°C to 70°C
3500 μV
3500 μV
TLV2762CDGK
TLV2762ID
TLV2763ID
TLV2762IDGK
—
xxTIAJP
—
—
—
xxTIAJR
—
TLV2762IP
—
−40°C to 85°C
TLV2763IDGS
TLV2763IN
†
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2762CDR).
(1)
TLV2764 and TLV2765 AVAILABLE OPTIONS
PACKAGED DEVICES
V
max
IO
T
A
SMALL OUTLINE
PLASTIC DIP
(N)
TSSOP
(PW)
AT 25°C
3500 μV
3500 μV
†
†
(D)
TLV2764CD
TLV2765CD
—
—
—
—
0°C to 70°C
TLV2764ID
TLV2765ID
TLV2764IN
TLV2765IN
TLV2764IPW
TLV2765IPW
−40°C to 85°C
†
This package is available taped and reeled. To order this packaging option, add an R suffix to the part
number (e.g., TLV2764CDR).
1. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website
at www.ti.com.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765
FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
TLV276x PACKAGE PINOUTS
TLV2760
D OR P PACKAGE
(TOP VIEW)
TLV2761
DBV PACKAGE
(TOP VIEW)
TLV2760
DBV PACKAGE
(TOP VIEW)
1
2
3
1
2
3
5
6
5
4
VDD
VDD
OUT
GND
IN+
OUT
GND
IN+
NC
IN−
IN+
SHDN
VDD
OUT
NC
1
2
3
4
8
7
6
5
SHDN
IN−
GND
4
IN−
TLV2761
D OR P PACKAGE
(TOP VIEW)
TLV2763
DGS PACKAGE
(TOP VIEW)
TLV2762
D, DGK, OR P PACKAGE
(TOP VIEW)
1
1OUT
1IN−
1IN+
GND
1SHDN
VDD
NC
IN−
IN+
NC
1
2
3
4
8
7
6
5
10
1OUT
1IN−
1IN+
GND
VDD
1
2
3
4
8
7
6
5
2
3
4
5
2OUT
2IN−
2IN+
9
8
7
6
VDD
OUT
NC
2OUT
2IN−
2IN+
GND
2SHDN
TLV2764
TLV2763
TLV2765
D, N, OR PW PACKAGE
D OR N PACKAGE
D, N, OR PW PACKAGE
(TOP VIEW)
(TOP VIEW)
(TOP VIEW)
1OUT
1IN−
1IN+
VDD
2IN+
4OUT
4IN−
4IN+
GND
3IN+
3IN−
3OUT
3/4SHDN
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1OUT
1IN−
1IN+
GND
NC
VDD
1
2
3
4
5
6
7
14
13
12
11
10
9
1
2
3
4
5
6
7
14
13
12
11
10
9
1OUT
1IN−
1IN+
VDD
2IN+
2IN−
2OUT
4OUT
4IN−
4IN+
GND
3IN+
3IN−
3OUT
2OUT
2IN−
2IN+
NC
2SHDN
NC
2IN−
2OUT
1/2SHDN
1SHDN
NC
8
8
NC − No internal connection
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765
FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 V
DD
Differential input voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
V
DD
ID
Input current range, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA
I
Output current range, I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA
O
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range, T : C-suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
A
I-suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Maximum junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Storage temperature range, T
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values, except differential voltages, are with respect to GND
DISSIPATION RATING TABLE
Θ
Θ
T
≤ 25°C
T = 85°C
A
POWER RATING
JC
JA
A
PACKAGE
POWER RATING
°
°
( C/W)
( C/W)
D (8)
38.3
176
710 mW
369 mW
D (14)
D (16)
26.9
25.7
55
122
114
324
294
260
1022 mW
1090 mW
385 mW
425 mW
481 mW
531 mW
567 mW
201 mW
221 mW
250 mW
DBV (5)
DBV (6)
DGK(8)
55
54.2
DGS(10)
N (14,16)
P
54.1
32
258
78
485 mW
1600 mW
1200 mW
720 mW
774 mW
252 mW
833 mW
625 mW
374 mW
403 mW
41
104
174
161
PW (14)
PW (16)
29.3
28.7
recommended operating conditions
MIN
1.8
0.8
−0.2
0
MAX
3.6
UNIT
Single supply
Supply voltage, V
V
V
DD
Split supply
1.8
Common-mode input voltage range, V
V
+0.2
70
ICR
DD
C-suffix
I-suffix
Operating free-air temperature, T
°C
A
−40
85
V
V
< 2.7 V
0.75 V
DD
DD
V
IH
V
IL
= 2.7 to 3.6 V
2
Shutdown on/off voltage level (see Note 2)
NOTE 2: Relative to GND
V
DD
0.6
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765
FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
electrical characteristics at recommended operating conditions, VDD = 1.8 V, 2.4 V (unless
otherwise noted)
dc performance
†
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
3500
6800
T
A
UNIT
V
V
= V /2,
25°C
550
IC
DD
V
Input offset voltage
Offset voltage drift
TLV276x
μV
μV/°C
dB
= V /2,
IO
O
DD
Full range
R = 300 kΩ,
L
α
VIO
9
R
= 50 Ω
S
25°C
Full range
25°C
50
48
53
50
70
V
DD
V
DD
V
DD
V
DD
= 1.8 V
72
76
dB
dB
V
ICR
= 0 V to V
,
DD
= 2.4 V
R
= 50 Ω
Full range
S
CMRR Common-mode rejection ratio
25°C
Full range
25°C
55
55
63
60
20
18
28
23
45
37
= 3.6 V
dB
dB
82
V
ICR
= 1.2 V to V
,
DD
= 2.4 V, 3.6 V
R
= 50 Ω
Full range
25°C
S
60
V
DD
V
DD
V
DD
= 1.8 V
= 2.4 V
= 3.6 V
Full range
25°C
V/mV
V/mV
78
Large-signal differential voltage
amplification
R = 10 kΩ,
L
V
A
VD
= V /2
O(PP) DD
Full range
25°C
120
Full range
†
Full range is 0°C to 70°C for the C-suffix and −40°C to 85°C for the I-suffix. If not specified, full range is −40°C to 85°C.
input characteristics
†
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
15
T
A
UNIT
25°C
Full range
Full range
25°C
3
TLV276xC
TLV276xI
100
200
15
I
I
Input offset current
pA
IO
V
V
= V /2,
DD
= V /2,
IC
O
DD
R = 300 kΩ,
3
L
R
= 50 Ω
S
TLV276xC
TLV276xI
Full range
Full range
25°C
100
200
Input bias current
pA
IB
r
Differential input resistance
1000
10
GΩ
i(d)
c
Common-mode input capacitance
f = 16 kHz
25°C
pF
i(c)
†
Full range is 0°C to 70°C for the C-suffix and −40°C to 85°C for the I-suffix. If not specified, full range is −40°C to 85°C.
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765
FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
electrical characteristics at recommended operating conditions, VDD = 1.8 V, 2.4 V (unless
otherwise noted) (continued)
output characteristics
†
PARAMETER
TEST CONDITIONS
MIN
1.77
1.76
2.38
2.37
3.58
3.57
1.725
1.7
TYP
MAX
T
A
UNIT
25°C
Full range
25°C
1.79
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
= 1.8V
= 2.4V
= 3.6V
= 1.8V
= 2.4V
= 3.6V
2.39
3.59
1.75
2.35
3.55
10
V
= V /2,
= −100 μA
IC
DD
I
OH
Full range
25°C
Full range
25°C
V
OH
High-level output voltage
V
Full range
25°C
2.325
2.3
V
IC
= V /2,
= −500 μA
DD
I
OH
Full range
25°C
3.525
3.5
Full range
25°C
20
30
V
V
= V /2,
I
= 100 μA
= 500 μA
IC
DD
OL
Full range
25°C
V
OL
Low-level output voltage
Output current
mV
mA
mA
50
75
= V /2,
I
OL
IC
DD
Full range
100
Positive rail
Negative rail
Positive rail
Negative rail
Sourcing
4.8
7.2
7.3
10.2
7
V
V
= 1.8 V,
= 0.5 V from
DD
25°C
25°C
25°C
25°C
O
I
I
O
V
V
= 2.4 V,
= 0.5 V from
DD
O
V
DD
= 1.8 V
Sinking
10
Short-circuit output current
OS
Sourcing
15
V
DD
= 2.4 V
Sinking
19
†
Full range is 0°C to 70°C for the C-suffix and −40°C to 85°C for the I-suffix. If not specified, full range is −40°C to 85°C.
power supply, V = 1.8 V, 2.4 V, 3.6 V (unless otherwise noted)
DD
†
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
28
T
A
UNIT
25°C
Full range
25°C
20
I
Supply current (per channel)
V
= V /2,
μA
DD
O
DD
SHDN = V
DD
30
65
63
65
63
65
63
85
85
85
V
V
= 1.8 V to 2.4 V,
= V /2
DD
IC
DD
Full range
25°C
Supply voltage rejection ratio
V
= 2.4 V to 3.6 V,
DD
= V /2
k
No load
dB
SVR
(ΔV
/ΔV )
IO
V
IC
DD
DD
Full range
25°C
V
V
= 1.8 V to 3.6 V,
= V /2
DD
IC
DD
Full range
†
Full range is 0°C to 70°C for the C-suffix and −40°C to 85°C for the I-suffix. If not specified, full range is −40°C to 85°C.
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765
FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
electrical characteristics at recommended operating conditions, VDD = 1.8 V, 2.4 V (unless
otherwise noted) (continued)
dynamic performance
†
PARAMETER
TEST CONDITIONS
MIN
TYP
500
MAX
T
A
UNIT
UGBW Unity gain bandwidth
25°C
25°C
kHz
R = 300 kΩ,
C = 10 pF
L
L
0.11
0.09
0.11
0.09
0.11
0.09
0.08
0.07
0.10
0.09
0.10
0.09
0.20
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
= 1.8 V
= 2.4 V
= 3.6 V
= 1.8 V
= 2.4 V
= 3.6 V
Full range
25°C
V/μs
V/μs
V/μs
V/μs
0.22
0.23
0.15
0.18
0.22
Positive slew rate at
unity gain
V
= 1 V, R = 300 kΩ,
O(PP) L
SR+
C = 50 pF,
L
Full range
25°C
Full range
25°C
Full range
25°C
Negative slew rate at
unity gain
V
= 1 V, R = 300 kΩ,
O(PP) L
SR−
C = 50 pF,
L
Full range
25°C
Full range
25°C
φ
m
Phase margin
Gain margin
63
20
°
R = 300 kΩ,
L
C = 100 pF
L
25°C
dB
0.1%
6.4
13.7
6
V
= 1.8 V, V
= 1 V,
DD
(STEP)PP
A = −1, C = 10 pF, R = 300 kΩ
V
L
L
0.01%
0.1%
t
s
Settling time
25°C
μs
V
DD
= 2.4 V,
V
= 1 V,
(STEP)PP
A = −1, C = 10 pF, R = 300 kΩ
V
L
L
0.01%
13.9
†
Full range is 0°C to 70°C for the C-suffix and −40°C to 85°C for the I-suffix. If not specified, full range is −40°C to 85°C.
noise/distortion
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
T
A
A = 1
0.08%
0.10%
0.27%
0.06%
0.08%
0.24%
95
V
V
= 1.8 V,
V
DD
O(PP)
= V /2 V,
DD
A = 10
V
25°C
25°C
R = 300 kΩ,
f = 1 kHz
L
A = 100
V
THD + N Total harmonic distortion plus noise
A = 1
V
V
V
= 2.4 V,
DD
= V /2 V,
O(PP)
DD
A = 10
V
R = 300 kΩ,
L
A = 100
V
f = 1 kHz
f = 1 kHz
f = 10 kHz
25°C
25°C
25°C
nV/√Hz
fA/√Hz
V
I
Equivalent input noise voltage
Equivalent input noise current
n
75
f = 1 kHz
0.8
n
shutdown characteristics
†
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
50
UNIT
T
A
25°C
Full range
25°C
10
Supply current, all channels in shutdown mode
(TLV2760, TLV2763, TLV2765) (per channel)
SHDN = 0 V
I
nA
DD(SHDN)
400
t
t
Amplifier turnon time (see Note 3)
Amplifier turnoff time (see Note 3)
R = 300 kΩ
L
5
μs
μs
(on)
R = 300 kΩ
L
25°C
0.8
(off)
†
Full range is 0°C to 70°C for the C-suffix and −40°C to 85°C for the I-suffix. If not specified, full range is −40°C to 85°C.
NOTE 3: Disable time and enable time are defined as the interval between application of the logic signal to SHDN and the point at which the supply
current has reached half its final value.
7
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TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765
FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
1, 2
3
V
Input offset voltage
vs Common-mode input voltage
vs Frequency
IO
CMRR
Common-mode rejection ratio
High-level output voltage
Low-level output voltage
Maximum peak-to-peak output voltage
Supply current
V
V
V
vs High-level output current
vs Low-level output current
vs Frequency
4, 6
5, 7
8
OH
OL
O(PP)
I
I
vs Supply voltage
vs Free-air temperature
vs Frequency
9
DD
DD
Supply current
10
PSRR
Power supply rejection ratio
Differential voltage amplification & phase
11
A
VD
vs Frequency
12
vs Temperature
vs Supply voltage
vs Supply voltage
vs Free-air temperature
vs Load capacitance
vs Frequency
13
Gain-bandwidth product
Slew rate
14
15
SR
16, 17
18
φ
m
Phase margin
V
n
Equivalent input noise voltage
Supply current and output voltage
Voltage-follower large-signal pulse response
Voltage-follower small-signal pulse response
Inverting large-signal response
Inverting small-signal response
Crosstalk
19
vs Time
20
vs Time
21
vs Time
22
vs Time
23
vs Time
24
vs Frequency
25
Shutdown forward & reverse isolation
Shutdown supply current
vs Frequency
26
I
I
I
I
vs Supply voltage
vs Free-air temperature
vs Shutdown pin voltage
vs Time
27
DD(SHDN)
DD(SHDN)
DD(SHDN)
DD(SHDN)
Shutdown supply current
28
Shutdown pin leakage current
Shutdown supply current/output voltage
29
30
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FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
TYPICAL CHARACTERISTICS
INPUT OFFSET VOLTAGE
vs
INPUT OFFSET VOLTAGE
vs
COMMON-MODE REJECTION RATIO
vs
COMMON-MODE INPUT VOLTAGE
COMMON-MODE INPUT VOLTAGE
FREQUENCY
300
140
350
V
=1.8 V
V
=2.4 V
DD
DD
130
120
110
100
300
250
200
T =25° C
A
T =25 °C
A
250
200
150
100
50
V
= 2.4 V
DD
90
80
70
60
50
40
30
20
10
0
150
100
50
0
V
= 1.8 V
DD
−50
0
−100
−50
−0.2
−0.2
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8 2
0.2
0.6
1
1.4 1.8
2.2 2.6
1
10
100
1k
10k
100k 1M
V
− Common-Mode Input Voltage − V
V
− Common-Mode Input Voltage − V
f − Frequency − Hz
ICR
ICR
Figure 2
Figure 1
Figure 3
HIGH-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
LOW-LEVEL OUTPUT CURRENT
HIGH-LEVEL OUTPUT CURRENT
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2.4
1.8
V
= 2.4 V
V
=1.8 V
DD
DD
V
=1.8 V
DD
2.1
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.8
1.5
1.2
0.9
T =85°C
A
T =85°C
A
T =70°C
A
T =70°C
A
T =85°C
A
T =25°C
A
T =70°C
A
T =0°C
A
T =25°C
A
T =−40°C
A
T =0°C
A
T =−40°C
A
T =25°C
A
0.6
0.3
T =0°C
A
T =−40°C
A
0
0
2
4
6
8
10 12 14 16 18 20
0
1
2
3
4
5
6
7
8
9 10 11 12
0
1
2
3
4
5
6
7
8
I
− Low-Level Output Current − mA
I
− High-Level Output Current − mA
I
− High-Level Output Current − mA
OL
OH
OH
Figure 5
Figure 4
Figure 6
MAXIMUM PEAK-TO-PEAK
OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
FREQUENCY
2.4
2.1
1.8
2.8
2.6
V
= 2.4 V
DD
2.4
2.2
V
= 2.4 V
O(PP)
T =85°C
A
2.0
T = 70°C
A
1.5
1.2
1.8
1.6
1.4
1.2
T =25°C
A
V
= 1.8 V
T =0°C
O(PP)
A
T =−40°C
A
0.9
0.6
1.0
0.8
0.6
0.4
0.2
A
= −10
V
L
L
R =300 kΩ
0.3
0.0
C
= 10 pF
T
= 25° C
A
0
2.5
5
7.5 10 12.5 15 17.5 20 22.5 25
10
100
1k
10k
100k
1M
I
− Low-Level Output Current − mA
OL
f − Frequency − Hz
Figure 8
Figure 7
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TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765
FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
POWER SUPPLY REJECTION RATIO
SUPPLY CURRENT
vs
vs
FREE-AIR TEMPERATURE
FREQUENCY
SUPPLY VOLTAGE
20
18
16
14
12
24
22
20
100
80
V
=2.4 V
A = 1
IC
DD
V
V
= V
DD/2
T =25°C
A
T
= 85°C
A
V
= 3.6 V
DD
60
40
T
= 25°C
A
V
= 2.4 V
DD
18
T
= 0°C
10
8
A
V
= 1.8 V
16
14
DD
T
A
= −40°C
A
20
6
T
= 70°C
4
0
12
2
−20
0
10
−40
0
0.6
1.2
1.8
2.4
3
3.6
10
100
1k
10k
100k
1M
−15
10
35
60
85
T
− Free-Air Temperature − °C
V
− Supply Voltage − V
f − Frequency − Hz
A
DD
Figure 9
Figure 10
Figure 11
DIFFERENTIAL VOLTAGE GAIN AND PHASE
GAIN BANDWIDTH PRODUCT
vs
vs
FREQUENCY
TEMPERATURE
180
150
120
90
100
80
700
R
C
= 300 kΩ
= 10 pF
L
L
V
= 2.4 V
DD
600
500
400
300
200
f = 10 kHz
60
Phase
60
30
40
20
0
V
= 1.8 V
DD
−30
−60
Gain
V
= 1.8 V & 2.4 V
DD
0
−90
R = 300 kΩ
L
−120
C
T
A
= 10 pF
= 25° C
L
100
0
−20
−150
−180
−40
−40 −25 −10
5
20 35 50 65 80 85
10
100
1k
10k
100k
1M
f − Frequency − Hz
T
− Temperature − °C
A
Figure 13
Figure 12
GAIN-BANDWIDTH PRODUCT
SLEW RATE
vs
vs
SUPPLY VOLTAGE
SUPPLY VOLTAGE
560
540
0.36
0.32
R
C
= 300 kΩ
= 10 pF
L
L
f = 10 kHz
Ta = 25°C
0.28
0.24
520
500
480
460
SR+
0.20
0.16
SR−
A
R
C
= 1
V
= 300 kΩ
=50 pF
= 25° C
0.12
0.08
L
L
440
420
400
T
A
0.04
0.00
1 1.2 1.4 1.61.8 2 2.2 2.42.62.8 3 3.2 3.4 3.6
− Supply Voltage − V
1.8
2
2.2 2.4 2.6 2.8
V
DD
3
3.2 3.4 3.6
V
− Supply Voltage − V
DD
Figure 14
Figure 15
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765
FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
TYPICAL CHARACTERISTICS
SLEW RATE
vs
SLEW RATE
vs
PHASE MARGIN
vs
FREE-AIR TEMPERATURE
FREE-AIR TEMPERATURE
LOAD CAPACITANCE
0.32
0.28
0.32
0.28
90
80
Rnull=0 Ω
SR+
SR+
70
60
0.24
0.20
0.24
0.20
0.16
SR−
Rnull=100 Ω
SR−
50
40
30
0.16
0.12
0.12
0.08
0.04
0.00
V
A
= 1.8 V
= 1
DD
V
A
= 2.4 V
DD
V
L
L
= 1
V
0.08
V
= 2.4 V
= 300 kΩ
= Open Loop
= 25°C
DD
L
V
R = 300 kΩ
R =300 kΩ
C =50 pF
V
L
20
10
0
R
C
V
= 50 pF
= V /2
L
A
T
0.04
0.00
IC
DD
= V /2
DD
IC
A
−40 −25 −10
5
20 35 50 65 8085
−40
−15
10
35
60
85
10
100
1k
T
− Free-Air Temperature − °C
A
T
− Free-Air Temperature − °C
C
− Load Capacitance − pF
L
A
Figure 16
Figure 17
Figure 18
SUPPLY CURRENT AND OUTPUT VOLTAGE
vs
EQUIVALENT INPUT NOISE VOLTAGE
vs
TIME
FREQUENCY
20
500
15
T
= 25°C
A
450
400
350
300
250
200
150
100
50
I
DD
10
5
V
= 2.4 V
DD
0
2
1.5
1
V
= 3.6 V
= 1
DD
V
O
0
A
V
V
R
C
= V /2
IN
DD
0.5
0
= 300 kΩ
= 10 pF
= 25°C
L
L
V
= 1.8 V
100
DD
T
A
−0.5
0
1
2
3
4
5
10
1k
10k
100k
t − Time − μs
f − Frequency − Hz
Figure 19
Figure 20
VOLTAGE-FOLLOWER SMALL-SIGNAL PULSE RESPONSE
vs
VOLTAGE-FOLLOWER LARGE-SIGNAL PULSE RESPONSE
vs
TIME
TIME
1.26
2.5
1.24
2
1.22
1.20
1.18
1.16
1.14
V
I
1.5
V
I
V
A
R
= 2.4 V
=1
= 300 kΩ
= 10 pF
= 25°C
DD
1
V
L
L
0.5
C
T
1.26
1.24
1.22
1.20
1.18
1.16
1.14
2.5
0
A
2
V
= 2.4 V
= 1
= 300 kΩ
= 10 pF
= 25°C
DD
V
V
O
O
1.5
A
V
R
C
T
A
L
L
1
0.5
0
0
1
2
3
4
5
6
7
8
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
t − Time − μs
t − Time − μs
Figure 21
Figure 22
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TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765
FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
TYPICAL CHARACTERISTICS
INVERTING SMALL-SIGNAL PULSE RESPONSE
INVERTING LARGE-SIGNAL RESPONSE
vs
vs
TIME
TIME
1.28
1.24
1.20
2.5
2
1.5
V
I
V
I
1
1.16
1.12
0.5
V
R
C
= 2.4 V
DD
= 300 kΩ
= 10 pF
= 1
1.28
1.24
1.20
L
L
0
2.5
V
= 2.4 V
= 1
= 300 kΩ
= 10 pF
= 25°C
DD
A
V
2
A
V
R
C
T
A
L
L
T
A
= 25°C
1.5
V
V
5
1
O
O
1.16
1.12
0.5
0
0
10 15 20 25 30 35 40 45
0
10 20 30 40 50 60 70 80 90
t − Time − μs
t − Time − μs
Figure 23
Figure 24
SHUTDOWN FORWARD AND
REVERSE ISOLATION
vs
CROSSTALK
vs
FREQUENCY
FREQUENCY
0
100
90
80
70
60
50
40
V
= 1.8 V & 2.4 V
V = V /2
DD
I
V
DD
−20
Forward and Reverse Isolation
A
= 1
R = 300 kΩ
L
T
= 25°C
−40
−60
A
All Channels
Crosstalk in Shutdown
−80
V
= 1.8 & 2.4 V
DD
V = V /2
I
DD
30
20
10
0
−100
−120
−140
R
= 300 kΩ
L
C = 10 pF
L
A
V
= +1
T
A
= 25°C
Crosstalk/No Shutdown
1k 10k
10
100
1k
10k
100k
1M
10
100
100k
f − Frequency − Hz
f − Frequency − Hz
Figure 25
Figure 26
SHUTDOWN PIN LEAKAGE CURRENT
vs
SHUTDOWN SUPPLY CURRENT
SHUTDOWN SUPPLY CURRENT
vs
vs
SHUTDOWN PIN VOLTAGE
SUPPLY VOLTAGE
FREE-AIR TEMPERATURE
.12
.10
.08
.06
.04
.02
0
20
.014
.012
V
T
= 3.6 V
= 85°C
SHDN = 0 V
V
= 1.8, 2.4, 3.6 V
DD
DD
15
V
A
= V /2
= 1
SHDN = 0V
A
IN
DD
V
= V /2
DD
V
IN
A
V
= 1
10
5
.010
.008
.006
.004
T
A
= 25°C
0
T
A
= 0°C
−5
T
A
= −40°C
−10
−15
.002
0
0
0.4 0.8 1.2 1.6
2
2.4 2.8 3.2 3.6
−40 −25 −10
5
20 35 50 65 80 85
0
0.4 0.8 1.2 1.6
2
2.4 2.8 3.2 3.6
V
− Supply Voltage − V
T
− Free-Air Temperature − °C
Shutdown Pin Voltage − V
DD
A
Figure 27
Figure 28
Figure 29
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TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765
FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
TYPICAL CHARACTERISTICS
SHUTDOWN SUPPLY CURRENT / OUTPUT VOLTAGE
vs
TIME
3.0
2.5
2.0
1.5
SHDN
1.0
0.5
0.0
−0.5
1.5
1.3
1.0
0.8
0.5
0.3
0.0
V
O
V
= 2.4 V
−0.3
DD
A = 1
V
18
16
14
12
10
8
R = 300 kΩ
C = 10 pF
L
L
V
IC
= V /2
DD
T
A
= 25° C
6
I
DD(SHDN = 0)
4
2
0
−2
20
40
60
80
100
120
140
160
t − Time − μs
Figure 30
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FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
APPLICATION INFORMATION
driving a capacitive load
When the amplifier is configured in this manner, capacitive loading directly on the output will decrease the
device’s phase margin leading to high frequency ringing or oscillations. Therefore, for capacitive loads of greater
than 10 pF, it is recommended that a resistor be placed in series (R
) with the output of the amplifier, as
NULL
shown in Figure 31. A minimum value of 20 Ω should work well for most applications.
R
F
R
G
R
NULL
−
Input
Output
+
C
LOAD
V
DD
/2
Figure 31. Driving a Capacitive Load
offset voltage
The output offset voltage, (V ) is the sum of the input offset voltage (V ) and both input bias currents (I ) times
OO
IO
IB
the corresponding gains. The following schematic and formula can be used to calculate the output offset
voltage:
R
F
I
IB−
R
G
+
−
V
I
V
O
+
R
S
I
IB+
R
R
F
F
V
+ V
1 ) ǒ Ǔ " I
R
1 ) ǒ Ǔ " I
R
ǒ Ǔ ǒ Ǔ
OO
IO
IB)
S
IB–
F
R
R
G
G
Figure 32. Output Offset Voltage Model
general configurations
When receiving low-level signals, limiting the bandwidth of the incoming signals into the system is often
required. The simplest way to accomplish this is to place an RC filter at the noninverting terminal of the amplifier
(see Figure 33).
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FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
APPLICATION INFORMATION
general configurations (continued)
R
R
F
G
V
DD
/2
−
V
1
O
+
V
I
R1
C1
f
+
–3dB
2pR1C1
V
R
O
F
1
ǒ
1 ) 2pfR1C1Ǔ
+
ǒ
1 )
Ǔ
V
R
I
G
Figure 33. Single-Pole Low-Pass Filter
If even more attenuation is needed, a multiple pole filter is required. The Sallen-Key filter can be used for this
task. For best results, the amplifier should have a bandwidth that is 8 to 10 times the filter frequency bandwidth.
Failure to do this can result in phase shift of the amplifier.
C1
R1 = R2 = R
C1 = C2 = C
Q = Peaking Factor
(Butterworth Q = 0.707)
+
_
V
I
1
R1
R2
f
+
–3dB
2pRC
C2
R
F
R
=
G
1
Q
R
F
2 −
)
(
R
G
V
DD
/2
Figure 34. 2-Pole Low-Pass Sallen-Key Filter
circuit layout considerations
To achieve the levels of high performance of the TLV276x, follow proper printed-circuit board design techniques.
A general set of guidelines is given in the following.
D
Ground planes—It is highly recommended that a ground plane be used on the board to provide all
components with a low inductive ground connection. However, in the areas of the amplifier inputs and
output, the ground plane can be removed to minimize the stray capacitance.
D
Proper power supply decoupling—Use a 6.8-μF tantalum capacitor in parallel with a 0.1-μF ceramic
capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers
depending on the application, but a 0.1-μF ceramic capacitor should always be used on the supply terminal
of every amplifier. In addition, the 0.1-μF capacitor should be placed as close as possible to the supply
terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less
effective. The designer should strive for distances of less than 0.1 inches between the device power
terminals and the ceramic capacitors.
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APPLICATION INFORMATION
circuit layout considerations (continued)
D
Sockets—Sockets can be used but are not recommended. The additional lead inductance in the socket pins
will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board
is the best implementation.
D
Short trace runs/compact part placements—Optimum high performance is achieved when stray series
inductance has been minimized. To realize this, the circuit layout should be made as compact as possible,
thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of
the amplifier. Its length should be kept as short as possible. This will help to minimize stray capacitance at
the input of the amplifier.
D
Surface-mount passive components—Using surface-mount passive components is recommended for high
performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of
surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small
size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray
inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be
kept as short as possible.
shutdown function
Three members of the TLV276x family (TLV2760/3/5) have a shutdown terminal for conserving battery life in
portable applications. When the shutdown terminal is pulled low, the supply current is reduced to 10 nA/channel,
the amplifier is disabled, and the outputs are placed in a high impedance mode. To enable the amplifier, the
shutdown terminal must be pulled high. The shutdown terminal should never be left floating. If the shutdown
feature is not desired, directly tie the shutdown terminal to the positive rail. The shutdown terminal threshold
is always referenced to the GND terminal of the device. Therefore, when operating the device with split supply
voltages (e.g. 1.8 V), the shutdown terminal needs to be pulled to the negative rail, not the system ground,
to disable the operational amplifier.
The amplifier is powered with a single 2.4-V supply and configured as a noninverting configuration with a unity
gain. Turnon and turnoff times are defined as the interval between application of the logic signal to the shutdown
pin and the point at which the supply current has reached half its final value. The times for the single, dual, and
quad are listed in the data tables.
general power dissipation considerations
For a given θ , the maximum power dissipation is shown in Figure 35 and is calculated by the following formula:
JA
T
* T
MAX
A
P
+
ǒ Ǔ
D
q
JA
Where:
P
T
= Maximum power dissipation of TLV276x IC (watts)
= Absolute maximum junction temperature (150°C)
= Free-ambient air temperature (°C)
= θ + θ
D
MAX
T
A
θ
JA
JC
CA
θ
θ
= Thermal coefficient from junction to case
JC
= Thermal coefficient from case to ambient air (°C/W)
CA
16
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765
FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
APPLICATION INFORMATION
general power dissipation considerations (continued)
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
2
1.75
1.5
T
= 150°C
J
PDIP Package
Low-K Test PCB
θ
JA
= 104°C/W
MSOP Package
Low-K Test PCB
SOIC Package
Low-K Test PCB
θ
JA
= 260°C/W
1.25
1
θ
JA
= 176°C/W
0.75
0.5
SOT-23 Package
Low-K Test PCB
0.25
0
θ
JA
= 324°C/W
−55−40 −25 −10
5
20 35 50 65 80 95 110 125
T
A
− Free-Air Temperature − °C
NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.
Figure 35. Maximum Power Dissipation vs Free-Air Temperature
17
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765
FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
APPLICATION INFORMATION
macromodel information
Macromodel information provided was derived using Microsim Parts™ Release 9.1, the model generation
software used with Microsim PSpice™. The Boyle macromodel (see Note 4) and subcircuit in Figure 36 are
generated using TLV276x typical electrical and operating characteristics at T = 25°C. Using this information,
A
output simulations of the following key parameters can be generated to a tolerance of 20% (in most cases):
D
D
D
D
D
D
Maximum positive output voltage swing
Maximum negative output voltage swing
Slew rate
Quiescent power dissipation
Input bias current
D
D
D
D
D
D
Unity-gain frequency
Common-mode rejection ratio
Phase margin
DC output resistance
AC output resistance
Short-circuit output current limit
Open-loop voltage amplification
NOTE 4: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, “Macromodeling of Integrated Circuit Operational Amplifiers,” IEEE Journal
of Solid-State Circuits, SC-9, 353 (1974).
3
99
V
DD
+
egnd
rd1
11
rd2
12
rss
ro2
css
fb
rp
−
c1
7
+
c2
vlim
1
2
+
r2
9
6
IN+
−
8
vc
D
S
D
S
+
−
vb
ga
G
G
−
IN−
ro1
gcm
ioff
53
OUT
dp
5
dlp
dln
91
90
92
10
+
hlim
−
+
iss
dc
vlp
vln
−
−
+
GND
−
+ 54
4
de
ve
*DEVICE=amp_tlv276x_highVdd,OPAMP,NJF,INT
ga
6
0
11 12 16.272E−6
10 99 6.8698E−9
dc 1.3371E−6
vlim 1K
* amp_tlv_276x_highVdd operational amplifier ”macromodel”
gcm
iss
0
6
* subcircuit updated using Model Editor release 9.1 on 05/15/00
* at 14:40 Model Editor is an OrCAD product.
*
10
90
11
12
6
4
hlim
j1
0
2
10 jx1
* connections:
non-inverting input
| inverting input
J2
1
10 jx2
*
*
*
*
*
r2
9
100.00E3
61.456E3
61.456E3
10
| | positive power supply
| | | negative power supply
| | | | output
rd1
rd2
ro1
ro2
rp
3
11
12
5
3
8
| | | | |
7
99
4
10
.subckt amp_tlv276x_highVdd 1 2 3 4 5
*
3
150.51E3
149.58E6
dc 0
rss
vb
10
9
99
0
c1
11
6
12 457.48E−15
c2
7
5.0000E−12
vc
3
53
4
dc .78905
dc .78905
dc 0
css
dc
10
5
99 1.1431E−12
ve
54
7
53 dy
vlim
vlp
vln
.model
8
de
54
90
92
4
99
7
5
dy
91
0
0
dc 14.200
dc 14.200
dlp
dln
dp
91 dx
90 dx
92
dx
D(Is=800.00E−18)
3
0
dx
.model dy
.model jx1
.model jx2
.ends
D(Is=800.00E−18 Rs=1m Cjo=10p)
egnd
fb
poly(2) (3,0) (4,0) 0 .5 .5
NJF(Is=500.00E−15 Beta=198.03E−6 Vto=−1)
NJF(Is=500.00E−15 Beta=198.03E−6 Vto=−1)
99 poly(5) vb vc ve vlp vln 0
176.02E6 −1E3 1E3 180E6
−180E6
Figure 36. Boyle Macromodel and Subcircuit
PSpice and Parts are trademarks of MicroSim Corporation.
18
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Revision History
DATE
REV
PAGE
SECTION
2nd Available Options Table
DESCRIPTION
8/2013
F
2
Added TLVZ762CDGK and AJO to Available Options Table.
:
NOTE Page numbers for previous revisions may differ from page numbers in the current version.
PACKAGE OPTION ADDENDUM
www.ti.com
30-Aug-2013
PACKAGING INFORMATION
Orderable Device
TLV2760ID
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
SOIC
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
D
8
6
6
6
6
8
8
8
8
8
8
5
5
5
5
8
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
T2760I
TLV2760IDBVR
TLV2760IDBVRG4
TLV2760IDBVT
TLV2760IDBVTG4
TLV2760IDG4
TLV2760IP
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
DBV
DBV
DBV
D
3000
3000
250
250
75
Green (RoHS
& no Sb/Br)
VANI
Green (RoHS
& no Sb/Br)
VANI
Green (RoHS
& no Sb/Br)
VANI
Green (RoHS
& no Sb/Br)
VANI
Green (RoHS
& no Sb/Br)
T2760I
T2760I
T2760I
T2761C
T2761C
T2761I
VAXI
PDIP
P
50
Pb-Free
(RoHS)
TLV2760IPE4
TLV2761CD
PDIP
P
50
Pb-Free
(RoHS)
N / A for Pkg Type
SOIC
D
75
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
TLV2761CDG4
TLV2761ID
SOIC
D
75
Green (RoHS
& no Sb/Br)
0 to 70
SOIC
D
75
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
TLV2761IDBVR
TLV2761IDBVRG4
TLV2761IDBVT
TLV2761IDBVTG4
TLV2761IDG4
TLV2761IP
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
DBV
DBV
DBV
DBV
D
3000
3000
250
250
75
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
VAXI
Green (RoHS
& no Sb/Br)
VAXI
Green (RoHS
& no Sb/Br)
VAXI
Green (RoHS
& no Sb/Br)
T2761I
T2761I
PDIP
P
50
Pb-Free
(RoHS)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
30-Aug-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
TLV2761IPE4
TLV2762CD
ACTIVE
PDIP
SOIC
P
8
8
50
Pb-Free
(RoHS)
CU NIPDAU
CU NIPDAU
CU NIPDAU
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
T2761I
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
75
75
Green (RoHS
& no Sb/Br)
2762C
2762C
AJO
TLV2762CDG4
TLV2762CDGK
TLV2762CDGKR
TLV2762CDR
TLV2762CDRG4
TLV2762ID
SOIC
8
Green (RoHS
& no Sb/Br)
0 to 70
VSSOP
VSSOP
SOIC
DGK
DGK
D
8
80
Green (RoHS CU NIPDAUAG Level-1-260C-UNLIM
& no Sb/Br)
0 to 70
8
2500
2500
2500
75
Green (RoHS CU NIPDAUAG Level-1-260C-UNLIM
& no Sb/Br)
0 to 70
AJO
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
2762C
2762C
2762I
2762I
AJP
SOIC
D
8
Green (RoHS
& no Sb/Br)
0 to 70
SOIC
D
8
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
0 to 70
TLV2762IDG4
TLV2762IDGK
TLV2762IDGKG4
TLV2762IDGKR
TLV2762IDGKRG4
TLV2762IDR
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
DGK
DGK
DGK
DGK
D
8
80
Green (RoHS
& no Sb/Br)
8
80
Green (RoHS
& no Sb/Br)
AJP
8
2500
2500
2500
2500
2500
2500
80
Green (RoHS
& no Sb/Br)
AJP
8
Green (RoHS
& no Sb/Br)
AJP
8
Green (RoHS
& no Sb/Br)
2762I
2762I
TLV2763C
TLV2763C
AJR
TLV2762IDRG4
TLV2763CDR
TLV2763CDRG4
TLV2763IDGS
SOIC
D
8
Green (RoHS
& no Sb/Br)
SOIC
D
14
14
10
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
0 to 70
VSSOP
DGS
Green (RoHS
& no Sb/Br)
-40 to 85
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
30-Aug-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
TLV2763IDGSG4
TLV2763IDGSR
ACTIVE
VSSOP
VSSOP
VSSOP
DGS
10
10
10
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
AJR
AJR
AJR
ACTIVE
ACTIVE
DGS
DGS
2500
2500
Green (RoHS
& no Sb/Br)
-40 to 85
TLV2763IDGSRG4
Green (RoHS
& no Sb/Br)
-40 to 85
TLV2763IDRG4
TLV2764CD
OBSOLETE
ACTIVE
SOIC
SOIC
D
D
14
14
TBD
Call TI
Call TI
-40 to 85
0 to 70
TLV2763I
50
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV2764C
TLV2764CDG4
TLV2764CDR
TLV2764CDRG4
TLV2764ID
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
D
14
14
14
14
14
14
14
14
14
14
14
14
14
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
0 to 70
0 to 70
TLV2764C
TLV2764C
TLV2764C
TLV2764I
TLV2764I
TLV2764I
TLV2764I
TLV2764I
TLV2764I
2764I
2500
2500
50
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
0 to 70
SOIC
D
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
TLV2764IDG4
TLV2764IDR
SOIC
D
50
Green (RoHS
& no Sb/Br)
SOIC
D
2500
2500
25
Green (RoHS
& no Sb/Br)
TLV2764IDRG4
TLV2764IN
SOIC
D
Green (RoHS
& no Sb/Br)
PDIP
N
Pb-Free
(RoHS)
TLV2764INE4
TLV2764IPW
TLV2764IPWG4
TLV2764IPWR
TLV2764IPWRG4
PDIP
N
25
Pb-Free
(RoHS)
N / A for Pkg Type
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
90
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
90
Green (RoHS
& no Sb/Br)
2764I
2000
2000
Green (RoHS
& no Sb/Br)
2764I
Green (RoHS
& no Sb/Br)
2764I
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
30-Aug-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
TLV2765CD
TLV2765CDG4
TLV2765CDR
TLV2765CDRG4
TLV2765ID
ACTIVE
SOIC
SOIC
D
16
16
16
16
16
16
16
16
16
16
16
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
TLV2765C
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
40
2500
2500
40
Green (RoHS
& no Sb/Br)
0 to 70
TLV2765C
TLV2765C
TLV2765C
TLV2765I
TLV2765I
TLV2765I
TLV2765I
2765I
SOIC
Green (RoHS
& no Sb/Br)
0 to 70
SOIC
D
Green (RoHS
& no Sb/Br)
0 to 70
SOIC
D
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
TLV2765IDG4
TLV2765IDR
SOIC
D
40
Green (RoHS
& no Sb/Br)
SOIC
D
2500
2500
90
Green (RoHS
& no Sb/Br)
TLV2765IDRG4
TLV2765IPW
SOIC
D
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
Green (RoHS
& no Sb/Br)
TLV2765IPWG4
TLV2765IPWR
TLV2765IPWRG4
90
Green (RoHS
& no Sb/Br)
2765I
2000
2000
Green (RoHS
& no Sb/Br)
2765I
Green (RoHS
& no Sb/Br)
2765I
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
30-Aug-2013
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Aug-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLV2760IDBVR
TLV2760IDBVT
TLV2761IDBVR
TLV2761IDBVT
TLV2762CDGKR
TLV2762CDR
TLV2762IDGKR
TLV2762IDGKR
TLV2762IDR
SOT-23
SOT-23
SOT-23
SOT-23
VSSOP
SOIC
DBV
DBV
DBV
DBV
DGK
D
6
6
3000
250
180.0
180.0
180.0
180.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
9.0
3.15
3.15
3.15
3.15
5.3
6.4
5.3
5.3
6.4
6.5
5.3
5.3
6.5
6.5
6.9
6.5
6.5
6.9
3.2
3.2
3.2
3.2
3.4
5.2
3.4
3.4
5.2
9.0
3.4
3.4
9.0
9.0
5.6
10.3
10.3
5.6
1.4
1.4
1.4
1.4
1.4
2.1
1.4
1.4
2.1
2.1
1.4
1.4
2.1
2.1
1.6
2.1
2.1
1.6
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
9.0
8.0
5
3000
250
9.0
8.0
5
9.0
8.0
8
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2500
2500
2000
12.4
12.4
12.4
12.4
12.4
16.4
12.4
12.4
16.4
16.4
12.4
16.4
16.4
12.4
12.0
12.0
12.0
12.0
12.0
16.0
12.0
12.0
16.0
16.0
12.0
16.0
16.0
12.0
8
VSSOP
VSSOP
SOIC
DGK
DGK
D
8
8
8
TLV2763CDR
TLV2763IDGSR
TLV2763IDGSR
TLV2764CDR
TLV2764IDR
SOIC
D
14
10
10
14
14
14
16
16
16
VSSOP
VSSOP
SOIC
DGS
DGS
D
SOIC
D
TLV2764IPWR
TLV2765CDR
TLV2765IDR
TSSOP
SOIC
PW
D
SOIC
D
TLV2765IPWR
TSSOP
PW
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Aug-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TLV2760IDBVR
TLV2760IDBVT
TLV2761IDBVR
TLV2761IDBVT
TLV2762CDGKR
TLV2762CDR
TLV2762IDGKR
TLV2762IDGKR
TLV2762IDR
SOT-23
SOT-23
SOT-23
SOT-23
VSSOP
SOIC
DBV
DBV
DBV
DBV
DGK
D
6
6
3000
250
182.0
182.0
182.0
182.0
364.0
340.5
364.0
358.0
340.5
367.0
358.0
366.0
333.2
333.2
367.0
333.2
333.2
367.0
182.0
182.0
182.0
182.0
364.0
338.1
364.0
335.0
338.1
367.0
335.0
364.0
345.9
345.9
367.0
345.9
345.9
367.0
20.0
20.0
20.0
20.0
27.0
20.6
27.0
35.0
20.6
38.0
35.0
50.0
28.6
28.6
35.0
28.6
28.6
35.0
5
3000
250
5
8
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2500
2500
2000
8
VSSOP
VSSOP
SOIC
DGK
DGK
D
8
8
8
TLV2763CDR
TLV2763IDGSR
TLV2763IDGSR
TLV2764CDR
TLV2764IDR
SOIC
D
14
10
10
14
14
14
16
16
16
VSSOP
VSSOP
SOIC
DGS
DGS
D
SOIC
D
TLV2764IPWR
TLV2765CDR
TLV2765IDR
TSSOP
SOIC
PW
D
SOIC
D
TLV2765IPWR
TSSOP
PW
Pack Materials-Page 2
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