TLV3491 [TI]

1.8V, Nanopower, PUSH-PULL OUTPUT COMPARATOR;
TLV3491
型号: TLV3491
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

1.8V, Nanopower, PUSH-PULL OUTPUT COMPARATOR

输出元件
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TLV3491  
TLV3492  
TLV3494  
TLV3491  
TLV3492  
®
T
L
V
3
4
9
4
TLV3494  
SBOS262D – DECEMBER 2002 – REVISED APRIL 2005  
1.8V, Nanopower,  
PUSH-PULL OUTPUT COMPARATOR  
DESCRIPTION  
FEATURES  
The TLV349x family of push-pull output comparators fea-  
tures a fast 6µs response time and < 1.2µA (max) nanopower  
capability, allowing operation from 1.8V – 5.5V. Input com-  
mon-mode range beyond supply rails make the TLV349x an  
ideal choice for low-voltage applications.  
VERY LOW SUPPLY CURRENT: 0.8µA (typ)  
INPUT COMMON-MODE RANGE 200mV  
BEYOND SUPPLY RAILS  
SUPPLY VOLTAGE: +1.8V to +5.5V  
HIGH SPEED: 6µs  
Micro-sized packages provide options for portable and space-  
restricted applications. The single (TLV3491) is available  
in SOT23-5 and SO-8. The dual (TLV3492) comes in  
SOT23-8 and SO-8. The quad (TLV3494) is available in  
TSSOP-14 and SO-14.  
PUSH-PULL CMOS OUTPUT STAGE  
SMALL PACKAGES:  
SOT23-5 (Single)  
SOT23-8 (Dual)  
The TLV349x is excellent for power-sensitive, low-voltage  
(2-cell) applications.  
APPLICATIONS  
PORTABLE MEDICAL EQUIPMENT  
WIRELESS SECURITY SYSTEMS  
REMOTE CONTROL SYSTEMS  
HANDHELD INSTRUMENTS  
TLV349x RELATED PRODUCTS  
PRODUCT  
FEATURES  
TLV370x  
560nA, 2.5V to 16V, Push-Pull CMOS Output Stage  
Comparator  
TLV340x  
550nA, 2.5V to 16V, Open Drain Output Stage Comparator  
ULTRA-LOW POWER SYSTEMS  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
Copyright © 2002-2005, Texas Instruments Incorporated  
www.ti.com  
ABSOLUTE MAXIMUM RATINGS(1)  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
Supply Voltage ................................................................................. +5.5V  
Signal Input Terminals, Voltage(2) .................. (V–) – 0.5V to (V+) + 0.5V  
Current(2) .................................................. ±10mA  
This integrated circuit can be damaged by ESD. Texas  
Instruments recommends that all integrated circuits be handled  
with appropriate precautions. Failure to observe proper han-  
dling and installation procedures can cause damage.  
Output Short-Circuit(3) .............................................................. Continuous  
Operating Temperature ..................................................40°C to +125°C  
Storage Temperature .....................................................65°C to +150°C  
Junction Temperature .................................................................... +150°C  
Lead Temperature (soldering, 10s) ............................................... +300°C  
ESD Rating (Human Body Model) .................................................. 3000V  
ESD damage can range from subtle performance degrada-  
tion to complete device failure. Precision integrated circuits  
may be more susceptible to damage because very small  
parametric changes could cause the device not to meet its  
published specifications.  
NOTE: (1) Stresses above these ratings may cause permanent damage.  
Exposure to absolute maximum conditions for extended periods may de-  
grade device reliability. These are stress ratings only, and functional opera-  
tion of the device at these or any other conditions beyond those specified is  
not implied. (2) Input terminals are diode-clamped to the power-supply rails.  
Input signals that can swing more than 0.5V beyond the supply rails should  
be current limited to 10mA or less. (3) Short-circuit to ground, one amplifier  
per package.  
PACKAGE/ORDERING INFORMATION(1)  
SPECIFIED  
PACKAGE  
DESIGNATOR  
TEMPERATURE  
RANGE  
PACKAGE  
MARKING  
ORDERING  
NUMBER  
TRANSPORT  
MEDIA, QUANTITY  
PRODUCT  
PACKAGE-LEAD  
TLV3491  
SOT23-5  
DBV  
–40°C to +125°C  
VBNI  
TLV3491AIDBVT  
TLV3491AIDBVR  
Tube, 250  
"
"
"
"
"
Tape and Reel, 3000  
TLV3491  
SO-8  
D
–40°C to +125°C  
TLV3491  
TLV3491AID  
Tube, 100  
"
"
"
"
"
TLV3491AIDR  
Tube, 2500  
TLV3492  
SOT23-8  
DCN  
–40°C to +125°C  
VBO1  
TLV3492AIDCNT  
TLV3492AIDCNR  
Tube, 250  
"
"
"
"
"
Tape and Reel, 3000  
TLV3492  
SO-8  
D
–40°C to +125°C  
TLV3492  
TLV3492AID  
Tube, 100  
"
"
"
"
"
TLV3492AIDR  
Tape and Reel, 2500  
TLV3494  
TSSOP-14  
PW  
–40°C to +125°C  
TLV3494  
TLV3494AIPWT  
TLV3494AIPWR  
Tape and Reel, 94  
"
"
"
"
"
Tape and Reel, 2500  
TLV3494  
SO-14  
D
–40°C to +125°C  
TLV3494  
TLV3494AID  
Tape and Reel, 58  
"
"
"
"
"
TLV3494AIDR  
Tape and Reel, 2500  
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at  
www.ti.com.  
PIN CONFIGURATIONS  
Top View  
Out  
V–  
1
2
3
5
4
V+  
Out A  
In A  
+In A  
V+  
1
2
3
4
5
6
7
14 Out D  
13 In D  
12 +In D  
11 V–  
Out A  
In A  
+In A  
V–  
1
2
3
4
8
7
6
5
V+  
+In  
In  
Out B  
In B  
+In B  
SOT23-5  
TLV3494  
+In B  
In B  
Out B  
10 +In C  
NC(1)  
In  
1
2
3
4
8
7
6
5
NC(1)  
V+  
SOT23-8  
SO-8  
9
8
In C  
TLV3491  
Out C  
+In  
Output  
NC(1)  
TSSOP-14  
SO-14  
V–  
SO-8  
NOTES: (1) NC means no internal connection.  
TLV3491, 3492, 3494  
2
www.ti.com  
SBOS262D  
ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V  
Boldface limits apply over the specified temperature range, TA = 40°C to +125°C.  
At TA = +25°C, and VS = +1.8V to +5.5V, unless otherwise noted.  
TLV3491, TLV3492, TLV3494  
PARAMETER  
CONDITION  
MIN  
TYP  
MAX  
UNITS  
OFFSET VOLTAGE  
Input Offset Voltage  
vs Temperature  
VOS  
VCM = 0V, IO = 0V  
TA = 40°C to +125°C  
±3  
±12  
350  
±15  
mV  
µV/°C  
µV/V  
dVOS/dT  
PSRR  
vs Power Supply  
V
S = 1.8V to 5.5V  
1000  
INPUT BIAS CURRENT  
Input Bias Current  
Input Offset Current  
IB  
IOS  
VCM = VCC/2  
VCM = VCC/2  
±1  
±1  
±10  
±10  
pA  
pA  
INPUT VOLTAGE RANGE  
Common-Mode Voltage Range  
Common-Mode Rejection Ratio  
VCM  
CMRR  
(V) 0.2V  
(V+) + 0.2V  
V
dB  
dB  
V
V
CM = 0.2V to (V+) 1.5V  
CM = 0.2V to (V+) + 0.2V  
60  
54  
74  
62  
INPUT CAPACITANCE  
Common-Mode  
Differential  
2
4
pF  
pF  
SWITCHING CHARACTERISTICS  
Propagation Delay Time, Low-to-High  
f = 10kHz, VSTEP = 1V  
Input Overdrive = 10mV  
Input Overdrive = 100mV  
Input Overdrive = 10mV  
Input Overdrive = 100mV  
CL = 10pF  
t(PLH)  
t(PHL)  
12  
6
13.5  
6.5  
100  
100  
µs  
µs  
µs  
µs  
ns  
ns  
Propagation Delay Time, High-to-Low  
Rise Time  
Fall Time  
tR  
tF  
CL = 10pF  
OUTPUT  
VS = 5V  
Voltage Output High from Rail  
Voltage Output Low from Rail  
Short-Circuit Current  
VOH  
VOL  
ISC  
IOUT = 5mA  
IOUT = 5mA  
90  
160  
200  
200  
mV  
mV  
See Typical Characteristics  
POWER SUPPLY  
Specified Voltage  
Operating Voltage Range  
Quiescent Current(1)  
VS  
IQ  
1.8  
1.8  
5.5  
5.5  
1.2  
V
V
µA  
VO = 5V, VO = High  
0.85  
TEMPERATURE RANGE  
Specified Range  
Operating Range  
Storage Range  
40  
40  
65  
+125  
+125  
+150  
°C  
°C  
°C  
Thermal Resistance, θJA  
SOT23-5, SOT23-8  
SO-8  
200  
150  
100  
°C/W  
°C/W  
°C/W  
SO-14, TSSOP-14  
NOTE: (1) IQ per channel.  
TLV3491, 3492, 3494  
SBOS262D  
3
www.ti.com  
TYPICAL CHARACTERISTICS  
At TA = +25°C, VS = +1.8V to +5.5V, and Input Overdrive = 100mV, unless otherwise noted.  
QUIESCENT CURRENT  
vs OUTPUT SWITCHING FREQUENCY  
QUIESCENT CURRENT vs TEMPERATURE  
12  
1.00  
0.95  
0.90  
0.85  
0.80  
0.75  
0.70  
0.65  
0.60  
VDD = 3V  
VS = 5V  
10  
8
VDD = 5V  
VDD = 1.8V  
6
4
VS = 3V  
2
VS = 1.8V  
10k  
0
1
10  
100  
1k  
100k  
125  
12  
50  
1.5  
0
25  
0
25  
50  
75  
100  
125  
5.5  
12  
Output Transition Frequency (Hz)  
Temperature (°C)  
SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE  
INPUT BIAS CURRENT vs TEMPERATURE  
140  
120  
100  
80  
45  
40  
35  
30  
25  
20  
15  
10  
5
Sink  
60  
Source  
40  
20  
0
0
5  
2
2.5  
3
3.5  
4
4.5  
5
50  
25  
0
25  
50  
75  
100  
Supply Voltage (V)  
Temperature (°C)  
OUTPUT LOW vs OUTPUT CURRENT  
OUTPUT HIGH vs OUTPUT CURRENT  
VDD = 3V  
0.25  
0.2  
0.15  
0.1  
0.05  
0
0.25  
0.2  
0.15  
0.1  
0.05  
0
VDD = 1.8V  
VDD = 1.8V  
VDD = 3V  
V
DD = 5V  
VDD = 5V  
2
4
6
8
10  
0
2
4
6
8
10  
Output Current (mA)  
Output Current (mA)  
TLV3491, 3492, 3494  
4
www.ti.com  
SBOS262D  
TYPICAL CHARACTERISTICS (Cont.)  
At TA = +25°C, VS = +1.8V to +5.5V, and Input Overdrive = 100mV, unless otherwise noted.  
PROPAGATION DELAY (tPHL) vs CAPACITIVE LOAD  
PROPAGATION DELAY (tPLH) vs CAPACITIVE LOAD  
80  
80  
70  
60  
50  
40  
30  
20  
10  
0
70  
60  
50  
40  
30  
20  
10  
0
VDD = 3V  
VDD = 5V  
VDD = 5V  
VDD = 3V  
VDD = 1.8V  
VDD = 1.8V  
0.01  
0.1  
1
10  
100  
1k  
0.01  
0.1  
1
10  
100  
1k  
Capacitive Load (nF)  
Capacitive Load (nF)  
PROPAGATION DELAY (tPHL) vs INPUT OVERDRIVE  
PROPAGATION DELAY (tPLH) vs INPUT OVERDRIVE  
20  
18  
16  
14  
12  
10  
8
20  
18  
16  
14  
12  
10  
8
VDD = 5V  
VDD = 1.8V  
VDD = 3V  
VDD = 3V  
VDD = 1.8V  
6
6
VDD = 5V  
4
4
0
10  
20  
30  
40  
50 60  
70  
80  
90 100  
0
10  
20  
30  
40  
50 60  
70  
80  
90 100  
Input Overdrive (mV)  
Input Overdrive (mV)  
PROPAGATION DELAY (tPHL) vs TEMPERATURE  
PROPAGATION DELAY (tPLH) vs TEMPERATURE  
8.0  
7.5  
7.0  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
8.0  
7.5  
7.0  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
VDD = 1.8V  
VDD = 3V  
VDD = 1.8V  
VDD = 3V  
VDD = 5V  
VDD = 5V  
50  
25  
0
25  
50  
75  
100  
125  
50  
25  
0
25  
50  
75  
100  
125  
Temperature (°C)  
Temperature (°C)  
TLV3491, 3492, 3494  
SBOS262D  
5
www.ti.com  
TYPICAL CHARACTERISTICS (Cont.)  
At TA = +25°C, VS = +1.8V to +5.5V, and Input Overdrive = 100mV, unless otherwise noted.  
PROPAGATION DELAY (tPLH  
)
PROPAGATION DELAY (tPHL)  
VDD = ±2.5V  
VDD = ±2.5V  
VIN+  
VIN–  
VIN–  
VIN+  
VOUT  
VOUT  
2µs/div  
2µs/div  
PROPAGATION DELAY (tPHL  
)
PROPAGATION DELAY (tPLH  
)
VIN+  
VDD = ±0.9V  
VDD = ±0.9V  
VIN–  
VIN–  
VIN+  
VOUT  
VOUT  
2µs/div  
2µs/div  
TLV3491, 3492, 3494  
6
www.ti.com  
SBOS262D  
SETTING REFERENCE VOLTAGE  
APPLICATIONS INFORMATION  
It is important to use a stable reference when setting the  
transition point for the TLV349x. The REF1004 provides a  
1.25V reference voltage with low drift and only 8µA of  
quiescent current.  
The TLV349x family of comparators features rail-to-rail input  
and output on supply voltages as low as 1.8V. The push-pull  
output stage is optimal for reduced power budget applica-  
tions and features no shoot-through current. Low supply  
voltages, common-mode input range beyond supply rails,  
and a typical supply current of 0.8µA make the TLV349x  
family an excellent candidate for battery-powered applica-  
tions with single-cell operation.  
EXTERNAL HYSTERESIS  
Comparator inputs have no noise immunity within the range  
of specified offset voltage (±15mV). For noisy input signals,  
the comparator output may display multiple switching as  
input signals move through the switching threshold. The  
typical comparator threshold of the TLV349x is ±15mV. To  
prevent multiple switching within the comparator threshold of  
the TLV349x, external hysteresis may be added by connect-  
ing a small amount of feedback to the positive input. Figure  
2 shows a typical topology used to introduce hysteresis,  
described by the equation:  
BOARD LAYOUT  
Figure 1 shows the typical connections for the TLV349x. To  
minimize supply noise, power supplies should be capaci-  
tively decoupled by a 0.01µF ceramic capacitor in parallel  
with a 10µF electrolytic capacitor. Comparators are very  
sensitive to input noise. Proper grounding (use of ground  
plane) will help maintain specified performance of the TLV349x  
family.  
V+ × R1  
VHYST  
=
R1 + R2  
VHYST will set the value of the transition voltage required to  
switch the comparator output by increasing the threshold  
region, thereby reducing sensitivity to noise.  
V+  
0.01µF  
10µF  
VIN  
TLV349x  
VOUT  
V+  
VREF  
VHYST = 0.38V  
5.0V  
VIN  
TLV349x  
VOUT  
R2  
560kΩ  
FIGURE 1. Basic Connections of the TLV349x.  
R1  
39kΩ  
VREF  
FIGURE 2. Adding Hysteresis to the TLV349x.  
TLV3491, 3492, 3494  
SBOS262D  
7
www.ti.com  
a simple resistor divider. These resistor values should be  
relatively high to reduce the current consumption of the  
circuit. The positive input is an RC circuit that provides a  
power-up delay. When power is applied, the output of the  
comparator is low, holding the processor in the reset condi-  
tion. Only after allowing time for the supply voltage to  
stabilize does the positive input of the comparator become  
higher than the negative input, resulting in a high output state  
and releasing the processor for operation. The stabilization  
time required for the supply voltage is adjustable by the  
selection of the RC component values. Use of a lower-valued  
resistor in this portion of the circuit will not increase current  
consumption because no current flows through the RC circuit  
after the supply has stabilized. The reset delay time needed  
depends on the power-up characteristics of the system  
power supply. R1 and C1 are selected to allow enough time  
for the power supply to stabilize. D1 provides rapid reset if  
power is lost. In this example, the R1 C1 time constant is  
10ms.  
APPLICATIONS  
RELAXATION OSCILLATOR  
The TLV349x can be configured as a relaxation oscillator to  
provide a simple and inexpensive clock output (see Figure  
3.) The capacitor is charged at a rate of 0.69RC. It also  
discharges at a rate of 0.69RC. Therefore, the period is  
1.38RC. R1 may be a different value than R2.  
VC  
2/3 (V+)  
1/3 (V+)  
t
T1 T2  
V+  
V+  
C
R1  
1MΩ  
1000pF  
VOUT  
V+  
t
R2  
1MΩ  
R2  
1MΩ  
F = 724Hz  
V+  
R1  
R2  
1MΩ  
1MΩ  
MSP430  
C1  
10nF  
RESET  
TLV349x  
R2  
FIGURE 3. TLV349x Configured as a Relaxation Oscillator.  
2MΩ  
POWER-ON RESET  
R3  
2MΩ  
The reset circuit shown in Figure 4 provides a time delayed  
release of reset to the MSP430 microcontroller. Operation of  
the circuit is based on a stabilization time constant of the  
supply voltage, rather than on a predetermined voltage  
value. The negative input is a reference voltage created by  
FIGURE 4. The TLV349x Configured as a Reset Circuit for  
the MSP430.  
TLV3491, 3492, 3494  
8
www.ti.com  
SBOS262D  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
PACKAGING INFORMATION  
Orderable Device  
TLV3491AID  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
ACTIVE  
SOIC  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOIC  
D
8
5
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
TLV  
3491  
TLV3491AIDBVR  
TLV3491AIDBVRG4  
TLV3491AIDBVT  
TLV3491AIDBVTG4  
TLV3491AIDG4  
TLV3491AIDR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DBV  
DBV  
DBV  
DBV  
D
3000  
3000  
250  
Green (RoHS  
& no Sb/Br)  
VBNI  
VBNI  
VBNI  
VBNI  
5
Green (RoHS  
& no Sb/Br)  
5
Green (RoHS  
& no Sb/Br)  
5
250  
Green (RoHS  
& no Sb/Br)  
8
75  
Green (RoHS  
& no Sb/Br)  
TLV  
3491  
SOIC  
D
8
2500  
75  
Green (RoHS  
& no Sb/Br)  
TLV  
3491  
TLV3492AID  
SOIC  
D
8
Green (RoHS  
& no Sb/Br)  
TLV  
3492  
TLV3492AIDCNR  
TLV3492AIDCNRG4  
TLV3492AIDCNT  
TLV3492AIDCNTG4  
TLV3492AIDR  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOIC  
DCN  
DCN  
DCN  
DCN  
D
8
3000  
3000  
250  
Green (RoHS  
& no Sb/Br)  
VBO1  
VBO1  
VBO1  
VBO1  
8
Green (RoHS  
& no Sb/Br)  
8
Green (RoHS  
& no Sb/Br)  
8
250  
Green (RoHS  
& no Sb/Br)  
8
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
TLV  
3492  
TLV3492AIDRG4  
TLV3494AID  
SOIC  
D
8
Green (RoHS  
& no Sb/Br)  
TLV  
3492  
SOIC  
D
14  
14  
14  
Green (RoHS  
& no Sb/Br)  
TLV3494  
TLV3494AIPWR  
TLV3494AIPWT  
TSSOP  
TSSOP  
PW  
PW  
2500  
250  
Green (RoHS  
& no Sb/Br)  
TLV  
3494  
Green (RoHS  
& no Sb/Br)  
TLV  
3494  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
31-Dec-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TLV3491AIDBVR  
TLV3491AIDBVT  
TLV3491AIDR  
SOT-23  
SOT-23  
SOIC  
DBV  
DBV  
D
5
5
3000  
250  
178.0  
178.0  
330.0  
180.0  
180.0  
330.0  
330.0  
180.0  
9.0  
9.0  
3.3  
3.3  
6.4  
3.2  
3.2  
6.4  
6.9  
6.9  
3.2  
3.2  
5.2  
3.1  
3.1  
5.2  
5.6  
5.6  
1.4  
1.4  
4.0  
4.0  
8.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q1  
Q3  
Q3  
Q1  
Q1  
Q1  
8
2500  
3000  
250  
12.4  
8.4  
2.1  
12.0  
8.0  
TLV3492AIDCNR  
TLV3492AIDCNT  
TLV3492AIDR  
SOT-23  
SOT-23  
SOIC  
DCN  
DCN  
D
8
1.39  
1.39  
2.1  
8
8.4  
8.0  
8
2500  
2500  
250  
12.4  
12.4  
12.4  
12.0  
12.0  
12.0  
TLV3494AIPWR  
TLV3494AIPWT  
TSSOP  
TSSOP  
PW  
PW  
14  
14  
1.6  
1.6  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
31-Dec-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TLV3491AIDBVR  
TLV3491AIDBVT  
TLV3491AIDR  
SOT-23  
SOT-23  
SOIC  
DBV  
DBV  
D
5
5
3000  
250  
180.0  
180.0  
367.0  
210.0  
210.0  
367.0  
367.0  
210.0  
180.0  
180.0  
367.0  
185.0  
185.0  
367.0  
367.0  
185.0  
18.0  
18.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
8
2500  
3000  
250  
TLV3492AIDCNR  
TLV3492AIDCNT  
TLV3492AIDR  
SOT-23  
SOT-23  
SOIC  
DCN  
DCN  
D
8
8
8
2500  
2500  
250  
TLV3494AIPWR  
TLV3494AIPWT  
TSSOP  
TSSOP  
PW  
PW  
14  
14  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
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supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
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non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
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Applications  
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www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
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