TLV4112-DIE [TI]

具有关断功能的高输出驱动运算放大器;


型号：	TLV4112-DIE
厂家：	TEXAS INSTRUMENTS
描述：	具有关断功能的高输出驱动运算放大器放大器驱动运算放大器
文件：	总6页 (文件大小：251K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TLV4112-DIE

www.ti.com.cn

ZHCSAG2 –NOVEMBER 2012

具有关断的高输出驱动运算放大器

特性

•

高输出驱动

轨到轨输出

通用运算放大器评估模块 (EVM)

说明

TLV4112 单电源运算放大器在 5V 时提供超过 300mA 的输出电流。这使得标准引脚放大器可被用作高电流缓冲器

或用于线圈驱动器应用。

TLV4112 为放大器提供传送高电流电平所需的出色热阻抗。

ORDERING INFORMATION⁽¹⁾

PACKAGE

DESIGNATOR

PRODUCT

PACKAGE

ORDERABLE PART NUMBER

PACKAGE QUANTITY

TLV4112TDA1

TLV4112TDA2

400

TLV4112

Bare die in waffle pack⁽²⁾

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality

Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room

temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not

warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

English Data Sheet: SGLS411

TLV4112-DIE

ZHCSAG2 –NOVEMBER 2012

www.ti.com.cn

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

BARE DIE INFORMATION

BACKSIDE

POTENTIAL

BOND PAD

METALLIZATION COMPOSITION

BOND PAD

THICKNESS

DIE THICKNESS

BACKSIDE FINISH

10.5 mils.

Silicon with backgrind

Floating

AlCuTiw

1540 nm

TLV4112-DIE

www.ti.com.cn

ZHCSAG2 –NOVEMBER 2012

Table 1. Bond Pad Coordinates in Microns

DESCRIPTION

PAD NUMBER

X MIN

234.75

676.5

Y MIN

121.75

141.25

279.25

1048.25

1063

X MAX

Y MAX

221.75

241.25

356.25

1148.25

1140

1OUT

1IN-

334.75

776.5

1IN+

GND

N/C

892.25

1175.25

1197.25

1175.25

891.75

539.5

992.25

1275.25

1274.25

1275.25

991.75

639.5

2IN+

2IN-

2OUT

N/C

318.25

121.75

395.25

221.75

198.75

VDD

N/C

1048.25

933.25

1148.25

1010.25

PACKAGE OPTION ADDENDUM

www.ti.com

26-May-2021

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

TLV4112TDA1

TLV4112TDA2

ACTIVE

400

RoHS & Green

Call TI

N / A for Pkg Type

0 to 0

Call TI

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

26-May-2021

Addendum-Page 2

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