TLV5616CDRG4 [TI]
2.7-V TO 5.5-V LOW POWER 12-BIT DIGITAL-TO-ANALOG CONVERTERS WITH POWER DOWN; 2.7 V至5.5 V低功耗12位数字 - 模拟与电源降压转换器型号: | TLV5616CDRG4 |
厂家: | TEXAS INSTRUMENTS |
描述: | 2.7-V TO 5.5-V LOW POWER 12-BIT DIGITAL-TO-ANALOG CONVERTERS WITH POWER DOWN |
文件: | 总28页 (文件大小:845K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
D
D
12-Bit Voltage Output DAC
D
Voltage Output Range . . . 2 Times the
Reference Input Voltage
Programmable Settling Time vs Power
Consumption
D
Monotonic Over Temperature
Available in MSOP Package
3 µs in Fast Mode
9 µs in Slow Mode
D
D
Ultra Low Power Consumption:
900 µW Typ in Slow Mode at 3 V
2.1 mW Typ in Fast Mode at 3 V
applications
D
D
D
D
D
Digital Servo Control Loops
Digital Offset and Gain Adjustment
Industrial Process Control
D
D
Differential Nonlinearity . . . <0.5 LSB Typ
Compatible With TMS320 and SPI Serial
Ports
Machine and Motion Control Devices
Mass Storage Devices
D
Power-Down Mode (10 nA)
D
Buffered High-Impedance Reference Input
D, DGK, OR P PACKAGE
(TOP VIEW)
description
The TLV5616 is
a 12-bit voltage output
digital-to-analog converter (DAC) with a flexible
4-wire serial interface. The 4-wire serial interface
allows glueless interface to TMS320, SPI, QSPI,
and Microwire serial ports. The TLV5616 is
programmed with a 16-bit serial string containing
4 control and 12 data bits. Developed for a wide
range of supply voltages, the TLV5616 can
operate from 2.7 V to 5.5 V.
DIN
SCLK
CS
V
DD
OUT
1
2
3
4
8
7
6
5
REFIN
AGND
FS
The resistor string output voltage is buffered by a x2 gain rail-to-rail output buffer. The buffer features a Class AB
output stage to improve stability and reduce settling time. The settling time of the DAC is programmable to allow
the designer to optimize speed versus power dissipation. The settling time is chosen by the control bits within
the 16-bit serial input string. A high-impedance buffer is integrated on the REFIN terminal to reduce the need
for a low source impedance drive to the terminal.
Implemented with a CMOS process, the TLV5616 is designed for single supply operation from 2.7 V to 5.5 V.
The device is available in an 8-terminal SOIC package. The TLV5616C is characterized for operation from 0°C
to 70°C. The TLV5616I is characterized for operation from −40°C to 85°C.
AVAILABLE OPTIONS
PACKAGE
†
T
A
SMALL OUTLINE
(D)
MSOP
(DGK)
PLASTIC DIP
(P)
0°C to 70°C
TLV5616CD
TLV5616ID
TLV5616CDGK
TLV5616IDGK
TLV5616CP
TLV5616IP
−40°C to 85°C
†
Available in tape and reel as the TLV5616CDR and the TLV5616IDR
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2002−2004, Texas Instruments Incorporated
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1
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SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
functional block diagram
_
6
+
REFIN
DIN
14
12
Serial Input
Register
1
12-Bit
Data
Latch
12
7
x2
OUT
2
3
4
SCLK
CS
Update
16 Cycle
Timer
FS
2
Power-On
Reset
Speed/Power-Down
Logic
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
NO.
AGND
CS
5
3
1
4
7
6
2
8
Analog ground
I
I
Chip select. Digital input used to enable and disable inputs, active low.
Serial digital data input
DIN
FS
I
Frame sync. Digital input used for 4-wire serial interfaces such as the TMS320 DSP interface.
OUT
REFIN
SCLK
O
I
DAC analog output
Reference analog input voltage
Serial digital clock input
Positive power supply
I
V
DD
2
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SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage (V
to AGND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
DD
Reference input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.3 V to V
Digital input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.3 V to V
+ 0.3 V
+ 0.3 V
DD
DD
Operating free-air temperature range, T : TLV5616C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
A
TLV5616I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
recommended operating conditions
MIN NOM
MAX
5.5
UNIT
V
V
V
= 5 V
= 3 V
4.5
2.7
2
5
3
DD
Supply voltage, V
DD
3.3
V
DD
DV
DV
DV
DV
= 2.7 V
V
DD
DD
DD
DD
High-level digital input voltage, V
IH
= 5.5 V
= 2.7 V
= 5.5 V
2.4
V
0.6
1
V
Low-level digital input voltage, V
IL
V
Reference voltage, V to REFIN terminal
ref
V
V
= 5 V (see Note 1)
= 3 V (see Note 1)
AGND 2.048
AGND 1.024
V
V
−1.5
V
DD
DD
Reference voltage, V to REFIN terminal
ref
−1.5
V
DD
DD
Load resistance, R
2
10
kΩ
pF
MHz
°C
°C
L
Load capacitance, C
100
L
Clock frequency, f
20
70
85
CLK
TLV5616C
TLV5616I
0
−40
Operating free-air temperature, T
A
NOTE 1: Due to the x2 output buffer, a reference input voltage ≥ V
DD/2
causes clipping of the transfer function.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
power supply
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
= 5 V, VREF = 2.048 V,
DD
Fast
0.9
1.35
mA
No load,
All inputs = AGND or V
DAC latch = 0x800
,
,
DD
Slow
Fast
0.4
0.7
0.6
1.1
mA
mA
I
Power supply current
DD
V
= 3 V, VREF = 1.024 V
DD
No load,
All inputs = AGND or V
DAC latch = 0x800
DD
Slow
0.3
10
0.45
mA
nA
Power down supply current (see Figure 12)
Zero scale See Note 2
−80
−80
2
PSRR
Power supply rejection ratio
dB
V
Full scale
See Note 3
Power on threshold voltage, POR
NOTES: 2. Power supply rejection ratio at zero scale is measured by varying V
and is given by:
and is given by:
DD
PSRR = 20 log [(E (V max) − E (V min))/V max]
ZS DD ZS DD DD
3. Power supply rejection ratio at full scale is measured by varying V
DD
PSRR = 20 log [(E (V max) − E (V min))/V max]
G
DD
G
DD
DD
3
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SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
static DAC specifications R = 10 kΩ, C = 100 pF
L
L
PARAMETER
TEST CONDITIONS
MIN
TYP
12
MAX
12
4
UNIT
bits
Resolution
INL
Integral nonlinearity
See Note 4
1.9
0.5
LSB
DNL
Differential nonlinearity
See Note 5
See Note 6
See Note 7
1
LSB
E
ZS
Zero-scale error (offset error at zero scale)
Zero-scale-error temperature coefficient
10
mV
10
ppm/°C
% of
FS
voltage
E
G
Gain error
See Note 8
0.6
Gain-error temperature coefficient
See Note 9
10
ppm/°C
NOTES: 4. The relative accuracy or integral nonlinearity (INL) sometimes referred to as linearity error, is the maximum deviation of the output
from the line between zero and full scale excluding the effects of zero code and full-scale errors. Tested from code 10 to code 4095.
5. The differential nonlinearity (DNL) sometimes referred to as differential error, is the difference between the measured and ideal 1
LSB amplitude change of any two adjacent codes. Monotonic means the output voltage changes in the same direction (or remains
constant) as a change in the digital input code. Tested from code 10 to code 4095.
6. Zero-scale error is the deviation from zero voltage output when the digital input code is zero.
6
7. Zero-scale-error temperature coefficient is given by: E
TC = [E
(T
) − E
(T
)]/V × 10 /(T
ref max
− T ).
min
ZS
ZS max
ZS min
8. Gain error is the deviation from the ideal output (2V − 1 LSB) with an output load of 10 kΩ excluding the effects of the zero-error.
ref
G
6
9. Gain temperature coefficient is given by: E TC = [E (T
) − E (T
)]/V × 10 /(T
− T ).
G
max
G
min
ref
max
min
output specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
O
Voltage output range
R
R
= 10 kΩ
0
AV −0.1
DD
V
L
L
% of FS
voltage
Output load regulation accuracy
= 2 kΩ, vs 10 kΩ
0.1
0.25
reference input (REF)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
V
I
Input voltage range
Input resistance
0
V
−1.5
DD
R
C
10
5
MΩ
pF
I
I
Input capacitance
Slow
Fast
525
1.3
kHz
MHz
Reference input bandwidth
Reference feed through
REFIN = 0.2 V + 1.024 V dc
pp
REFIN = 1 V at 1 kHz + 1.024 V dc
pp
(see Note 10)
−75
dB
NOTE 10: Reference feedthrough is measured at the DAC output with an input code = 0x000.
digital inputs
PARAMETER
High-level digital input current
Low-level digital input current
Input capacitance
TEST CONDITIONS
MIN
TYP
MAX
UNIT
µA
I
I
V = V
DD
1
1
IH
I
V = 0 V
I
µA
IL
C
3
pF
I
4
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SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
operating characteristics over recommended operating free-air temperature range (unless
otherwise noted)
analog output dynamic performance
PARAMETER
TEST CONDITIONS
MIN
TYP
3
MAX
5.5
UNIT
C
= 100 pF,
Fast
Slow
Fast
Slow
Fast
Slow
R
= 10 kΩ,
L
L
t
t
Output settling time, full scale
µs
s(FS)
See Note 11
9
20
C
= 100 pF,
1
µs
µs
R
= 10 kΩ,
L
L
Output settling time, code to code
Slew rate
s(CC)
See Note 12
2
3.6
0.9
10
74
66
−68
70
R
= 10 kΩ,
See Note 13
C
= 100 pF,
L
L
SR
V/µs
Glitch energy
Code transition from 0x7FF to 0x800
nV−s
dB
S/N
Signal to noise
fs = 400 KSPS fout = 1.1 kHz,
S/(N+D) Signal to noise + distortion
dB
R
= 10 kΩ,
BW = 20 kHz
C = 100 pF,
L
L
THD
Total harmonic distortion
dB
Spurious free dynamic range
dB
NOTES: 11. Settling time is the time for the output signal to remain within 0.5 LSB of the final measured value for a digital input code change
of 0x080 to 0x3FF or 0x3FF to 0x080. Not tested, ensured by design.
12. Settling time is the time for the output signal to remain within 0.5 LSB of the final measured value for a digital input code change
of one count. Code change from 0x1FF to 0x200. Not tested, ensured by design.
13. Slew rate determines the time it takes for a change of the DAC output from 10% to 90% full-scale voltage.
digital input timing requirements
MIN NOM
MAX
UNIT
ns
t
t
Setup time, CS low before FS↓
10
8
su(CS−FS)
Setup time, FS low before first negative SCLK edge
ns
su(FS−CK)
Setup time, sixteenth negative edge after FS low on which bit D0 is sampled before rising
edge of FS
t
10
ns
su(C16−FS)
su(C16−CS)
Setup time, sixteenth positive SCLK edge (first positive after D0 is sampled) before CS rising
edge. If FS is used instead of the sixteenth positive edge to update the DAC, then the setup
time is between the FS rising edge and CS rising edge.
t
10
ns
t
t
t
Pulse duration, SCLK high
25
25
8
ns
ns
ns
wH
Pulse duration, SCLK low
wL
Setup time, data ready before SCLK falling edge
su(D)
t
Hold time, data held valid after SCLK falling edge
Pulse duration, FS high
5
ns
ns
h(D)
t
20
wH(FS)
5
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SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
PARAMETER MEASUREMENT INFORMATION
t
t
wH
wL
SCLK
DIN
1
2
3
4
5
15
16
t
t
su(D)
h(D)
D14
D15
D13
D12
D1
D0
t
su(FS-CK)
t
su(C16-CS)
t
su(CS-FS)
CS
FS
t
wH(FS)
t
su(C16-FS)
Figure 1. Timing Diagram
6
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SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE
OUTPUT VOLTAGE
vs
vs
LOAD CURRENT
LOAD CURRENT
2.004
2.002
2
4.01
3 V Slow Mode, SOURCE
3 V Fast Mode, SOURCE
V
= 3 V,
= 1 V,
V
V
ref
Full Scale
= 5 V,
= 2 V,
DD
DD
V
ref
5 V Slow Mode, SOURCE
5 V Fast Mode, SOURCE
4.005
Full Scale
4
3.995
3.99
1.998
1.996
1.994
1.992
1.990
3.985
3.98
3.975
0
0.01 0.02 0.05 0.1 0.2 0.5
Load Current − mA
1
2
4
0
0.02 0.04 0.1 0.2 0.4
1
2
4
Load Current − mA
Figure 2
Figure 3
OUTPUT VOLTAGE
vs
OUTPUT VOLTAGE
vs
LOAD CURRENT
LOAD CURRENT
0.2
0.35
0.3
V
= 3 V,
= 1 V,
DD
V
= 5 V,
= 2 V,
DD
0.18
V
ref
V
ref
Zero Code
Zero Code
0.16
0.14
0.12
0.1
0.25
0.2
3 V Slow Mode, SINK
5 V Slow Mode, SINK
0.15
0.08
0.06
5 V Fast Mode, SINK
3 V Fast Mode, SINK
0.1
0.05
0
0.04
0.02
0
0
0.01 0.02 0.05 0.1 0.2 0.5
Load Current − mA
1
2
0
0.02 0.04 0.1 0.2 0.4
1
2
4
Load Current − mA
Figure 4
Figure 5
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SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
FREE-AIR TEMPERATURE
1
1
V
V
= 3 V,
= 1 V,
V
V
= 5 V,
= 2 V,
DD
ref
DD
ref
Full Scale
Full Scale
Fast Mode
0.8
0.8
Fast Mode
0.6
0.4
0.2
0.6
0.4
0.2
Slow Mode
Slow Mode
25 40
−55 −40 −25
0
70
85 125
−55 −40 −25
0
25 40
70
85 125
T
A
− Free-Air Temperature − C°
T
A
− Free-Air Temperature − C°
Figure 6
Figure 7
TOTAL HARMONIC DISTORTION
TOTAL HARMONIC DISTORTION
vs
vs
FREQUENCY
FREQUENCY
0
0
V
= 1 V dc + 1 V p/p Sinewave,
ref
V
= 1 V dc + 1 V p/p Sinewave,
ref
−10
Output Full Scale
−10
Output Full Scale
−20
−30
−20
−30
−−40
−−40
−50
−60
−50
−60
Fast Mode
Slow Mode
−70
−80
−70
−80
0
5
10
20
30
50
100
0
5
10
20
30
50
100
f − Frequency − kHz
f − Frequency − kHz
Figure 8
Figure 9
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SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
TYPICAL CHARACTERISTICS
TOTAL HARMONIC DISTORTION AND NOISE
TOTAL HARMONIC DISTORTION AND NOISE
vs
vs
FREQUENCY
FREQUENCY
0
0
V
= 1 V dc + 1 V p/p Sinewave,
V
= 1 V dc + 1 V p/p Sinewave,
ref
Output Full Scale
ref
Output Full Scale
−10
−10
−20
−30
−20
−30
−−40
−−40
−50
−60
−50
−60
Fast Mode
Slow Mode
−70
−80
−70
−80
0
5
10
20
30
50
100
0
5
10
20
30
50
100
f − Frequency − kHz
f − Frequency − kHz
Figure 10
Figure 11
SUPPLY CURRENT
vs
TIME (WHEN ENTERING POWER-DOWN MODE)
900
800
700
600
500
400
300
200
100
0
0
100 200 300 400 500 600 700 800 900 1000
T − Time − ns
Figure 12
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ꢆ ꢍꢖ ꢂꢐꢑ ꢀ ꢐꢑ ꢗ ꢎ ꢈ ꢀꢘ ꢏ ꢍꢎ ꢐꢑ ꢓꢍ ꢎ ꢖ
SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
TYPICAL CHARACTERISTICS
INTEGRAL NONLINEARITY ERROR
2
1.5
1
0.5
0
−0.5
−1
−1.5
−2
−2.5
−3
−3.5
2048
2304 2560 2816 3072 3328 3584 3840
0
256 515 768 1024 1280 1536 1792
Digital Code
Figure 13
DIFFERENTIAL NONLINEARITY ERROR
0.3
0.25
0.2
0.15
0.1
0.05
0
−0.05
−0.1
−0.15
−0.2
−0.25
−0.3
−0.35
−0.4
−0.45
−0.5
0
256 512 768 1024 1280 1536 1792 2048 2304 2560 2816 3072 3328 3584 3840
Digital Code
Figure 14
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SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
APPLICATION INFORMATION
general function
The TLV5616 is a 12-bit single supply DAC based on a resistor string architecture. The device consists of a serial
interface, speed and power-down control logic, a reference input buffer, a resistor string, and a rail-to-rail output
buffer.
The output voltage (full scale determined by external reference) is given by:
CODE
2 REF
[V]
n
2
n−1
where REF is the reference voltage and CODE is the digital input value within the range of 0 to 2 , where
10
n = 12 (bits). The 16-bit data word, consisting of control bits and the new DAC value, is illustrated in the data
format section. A power-on reset initially resets the internal latches to a defined state (all bits zero).
serial interface
Explanation of data transfer: First, the device has to be enabled with CS set to low. Then, a falling edge of FS
starts shifting the data bit-per-bit (starting with the MSB) to the internal register on the falling edges of SCLK.
After 16 bits have been transferred or FS rises, the content of the shift register is moved to the DAC latch which
updates the voltage output to the new level.
The serial interface of the TLV5616 can be used in two basic modes:
D
D
Four wire (with chip select)
Three wire (without chip select)
Using chip select (four wire mode), it is possible to have more than one device connected to the serial port of
the data source (DSP or microcontroller). The interface is compatible with the TMS320 family. Figure 15 shows
an example with two TLV5616s connected directly to a TMS320 DSP.
TLV5616
TLV5616
CS FS DIN SCLK
CS FS DIN SCLK
TMS320
DSP
XF0
XF1
FSX
DX
CLKX
Figure 15. TMS320 Interface
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SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
APPLICATION INFORMATION
serial interface (continued)
If there is no need to have more than one device on the serial bus, then CS can be tied low. Figure 16 shows
an example of how to connect the TLV5616 to a TMS320, SPI, or Microwire port using only three pins.
TMS320
DSP
TLV5616
SPI
TLV5616
Microwire
TLV5616
FSX
FS
SS
FS
I/O
FS
DIN
DIN
DIN
DX
MOSI
SCLK
SO
SK
CLKX
SCLK
CS
SCLK
CS
SCLK
CS
Figure 16. Three-Wire Interface
Notes on SPI and Microwire: Before the controller starts the data transfer, the software has to generate a falling
edge on the I/O pin connected to FS. If the word width is 8 bits (SPI and Microwire), two write operations must
be performed to program the TLV5616. After the write operation(s), the DAC output is updated automatically
on the next positive clock edge following the sixteenth falling clock edge.
serial clock frequency and update rate
The maximum serial clock frequency is given by:
1
f
+
+ 20 MHz
SCLKmax
t
) t
wH(min)
wL(min)
The maximum update rate is:
1
f
+
+ 1.25 MHz
UPDATEmax
16 ǒt
Ǔ
) t
wH(min)
wL(min)
The maximum update rate is a theoretical value for the serial interface, since the settling time of the TLV5616
has to be considered also.
data format
The 16-bit data word for the TLV5616 consists of two parts:
D
D
Control bits
(D15 . . . D12)
(D11 . . . D0)
New DAC value
D15
X
D14
D13
D12
X
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
SPD
PWR
New DAC value (12 bits)
X: don’t care
SPD: Speed control bit.
1 → fast mode
0 → slow mode
PWR: Power control bit. 1 → power down
0 → normal operation
In power-down mode, all amplifiers within the TLV5616 are disabled.
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SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
APPLICATION INFORMATION
TLV5616 interfaced to TMS320C203 DSP
hardware interfacing
Figure 17 shows an example how to connect the TLV5616 to a TMS320C203 DSP. The serial interface of the
TLV5616 is ideally suited to this configuration, using a maximum of four wires to make the necessary
connections. In applications where only one synchronous serial peripheral is used, the interface can be
simplified even further by pulling CS low all the time as shown in the figure.
TMS320C203
TLV5616
V
DD
FS
DX
FS
DIN
SCLK
OUT
REFIN
CLKX
REF
R
LOAD
CS AGND
Figure 17. TLV5616 to DSP Interface
software
No setup procedure is needed to access the TLV5616. The output voltage can be set using just a single
command.
out
data_addr, SDTR
where data_addr points to an address location holding the control bits and the 12 data bits providing the output
voltage data. SDTR is the address of the transmit FIFO of the synchronous serial port.
The following code shows how to use the timer of the TMS320C203 as a time base to generate a voltage ramp
with the TLV5616.
A timer interrupt is generated every 205 µs. The corresponding interrupt service routine increments the output
code (stored at 0x0064) for the DAC, adds the DAC control bits to the four most significant bits, and writes the
new code to the TLV5616. The resulting period of the saw waveform is:
π = 4096 × 205 E-6 s = 0.84 s
;***************************************************************************************
;* Title
;* Version : 1.0
;* DSP
: Ramp generation with TLV5616
*
*
*
: TI TMS320C203
;* (1998) Texas Instruments Incorporated
*
;***************************************************************************************
;−−−−−−−−−−− I/O and memory mapped regs −−−−−−−−−−−−
.include ”regs.asm”
;−−−−−−−−−−− vectors −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
.ps
b
b
0h
start
INT1
b
b
INT23
TIM_ISR
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SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
APPLICATION INFORMATION
;***************************************************************************************
;* Main Program
;***************************************************************************************
.ps
1000h
.entry
start:
; disable interrupts
setc
splk
splk
INTM
#0ffffh, IFR
#0004h, IMR
; disable maskable interrupts
; set up the timer to interrupt ever 205uS
splk
splk
out
#0000h, 60h
#00FFh, 61h
61h, PRD
out
60h, TIM
splk
out
#0c2fh, 62h
62h, TCR
; Configure SSP to use internal clock, internal frame sync and burst mode
splk
out
splk
out
#0CC0Eh, 63h
63h, SSPCR
#0CC3Eh, 63h
63h, SSPCR
splk
#0000h, 64h ; set initial DAC value
; enable interrupts
clrc
INTM
; enable maskable interrupts
;wait for interrupt
; loop forever!
next:
idle
b
next
; all else fails stop here
done: done
b
;hang there
;***************************************************************************************
;* Interrupt Service Routines
;***************************************************************************************
INT1:
ret
;do nothing and return
INT23:
TIM_ISR:
ret
;do nothing and return
lacl
add
and
sacl
or
sacl
out
64h
#1h
#0FFFh
64h
#4000h
65h
; restore counter value to ACC
; increment DAC value
; mask 4 MSBs
; store 12 bit counter value
; set DAC control bits
; store DAC value
65h, SDTR
; send data
clrc
ret
intm
; re-enable interrupts
.END
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SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
APPLICATION INFORMATION
TLV5616 interfaced to MCS51 microcontroller
hardware interfacing
Figure 18 shows an example of how to connect the TLV5616 to an MCS51 compatible microcontroller. The
serial DAC input data and external control signals are sent via I/O port 3 of the controller. The serial data is sent
on the RxD line, with the serial clock output on the TxD line. P3.4 and P3.5 are configured as outputs to provide
the chip select and frame sync signals for the TLV5616.
MCS51 Controller
TLV5616
V
DD
RxD
TxD
SDIN
SCLK
CS
P3.4
P3.5
FS
OUT
REFIN
REF
R
LOAD
AGND
Figure 18. TLV5616 to MCS51 Controller Interface
software
The example program puts out a sine wave on the OUT pin.
The on-chip timer is used to generate interrupts at a fixed frequency. The related interrupt service routine fetches
and writes the next sample to the DAC. The samples are stored in a lookup table, which describes one full period
of a sine wave.
The serial port of the controller is used in mode 0, which transmits 8 bits of data on RxD, accompanied by a
synchronous clock on TxD. Two writes concatenated together are required to write a complete word to the
TLV5616. The CS and FS signals are provided in the required fashion through control of I/O port 3, which has
bit addressable outputs.
;***************************************************************************************
;* Title
;* Version : 1.0
;* MCU : INTEL MCS51
;* (1998) Texas Instruments Incorporated
;***************************************************************************************
: Ramp generation with TLV5616
*
*
*
*
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
; Program function declaration
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
NAME
GENSINE
MAIN
ISR
SEGMENT
SEGMENT
CODE
CODE
CODE
DATA
IDATA
SINTBL SEGMENT
VAR1
STACK SEGMENT
SEGMENT
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
; Code start at address 0, jump to start
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
CSEG AT
0
MCS is a registered trademark of Intel Corporation
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SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
APPLICATION INFORMATION
LJMP
start
; Execution starts at address 0 on power−up.
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
; Code in the timer0 interrupt vector
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
CSEG AT 0BH
LJMP
timer0isr ; Jump vector for timer 0 interrupt is 000Bh
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
; Define program variables
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
RSEG
VAR1
rolling_ptr: DS 1
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
; Interrupt service routine for timer 0 interrupts
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
RSEG
ISR
timer0isr:
PUSH
PUSH
PSW
ACC
CLR
CLR
T0
; set CSB low
; set FS low
T1
; The signal to be output on the dac is a sine function. One cycle of a sine wave is
; held in a table @ sinevals as 32 samples of msb, lsb pairs (64 bytes). The pointer,
; rolling_ptr, rolls round the table of samples incrementing by 2 bytes (1 sample) on
; each interrupt (at the end of this routine).
MOV
MOV
DPTR,#sinevals ; set DPTR to the start of the table of sine signal values
A,rolling_ptr ; ACC loaded with the pointer into the sine table
MOVC
ORL
MOV
A,@A+DPTR
A, #00H
SBUF,A
; get msb from the table
; set control bits
; send out msb of data word
MOVA,rolling_ptr; move rolling pointer in to ACC
INC
MOVC
A
; increment ACC holding the rolling pointer
; which is the lsb of this sample, now in ACC
A,@A+DPTR
MSB_TX:
JNB
TI, MSB_TX
TI
SBUF,A
; wait for transmit to complete
; clear for new transmit
; and send out the lsb
CLR
MOV
LSB_TX:
JNB
TI, LSB_TX
T1
TI
; wait for lsb transmit to complete
; set FS = 1
; clear for new transmit
SETB
CLR
MOV
INC
INC
ANL
MOV
A,rolling_ptr
; load ACC with rolling pointer
A
; increment the ACC twice, to get next sample
A
A,#03FH
; wrap back round to 0 if >64
; move value held in ACC back to the rolling pointer
rolling_ptr,A
SETB
T0
; CSB high
POP
POP
ACC
PSW
RETI
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
; Set up stack
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
16
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ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢆꢇ ꢀꢁꢂ ꢃꢄ ꢅꢄ ꢈ
ꢉ ꢊꢋ ꢌꢂ ꢀ ꢍ ꢃ ꢊꢃ ꢌꢂ ꢁ ꢍ ꢎ ꢏꢍ ꢎ ꢐꢑ ꢅ ꢉ ꢌꢒꢈ ꢀ ꢓꢈ ꢔꢈ ꢀꢕꢁ ꢌꢀꢍ ꢌꢕ ꢖ ꢕꢁ ꢍꢔ
ꢆꢍ ꢖꢂꢐ ꢑꢀ ꢐꢑꢗ ꢎ ꢈꢀ ꢘ ꢏꢍ ꢎ ꢐ ꢑ ꢓ ꢍꢎ ꢖ
SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
APPLICATION INFORMATION
RSEG
DS
STACK
10h
; 16 Byte Stack!
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
; Main Program
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
RSEG
MAIN
start:
MOV
SP,#STACK−1 ; first set Stack Pointer
A
CLR
MOV
MOV
MOV
SCON,A
; set serial port 0 to mode 0
TMOD,#02H
TH0,#0C8H
; set timer 0 to mode 2 − auto−reload
; set TH0 for 16.67 kHs interrupts
SETB
SETB
T1
T0
; set FS = 1
; set CSB = 1
SETB
SETB
ET0
EA
; enable timer 0 interrupts
; enable all interrupts
MOV
SETB
rolling_ptr,A
TR0
; set rolling pointer to 0
; start timer 0
always:
SJMP
always
; while(1) !
RET
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
; Table of 32 sine wave samples used as DAC data
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−
RSEG
sinevals:
DW
SINTBL
01000H
0903EH
05097H
0305CH
0B086H
070CAH
0F0E0H
0F06EH
0F039H
0F06EH
0F0E0H
070CAH
0B086H
0305CH
05097H
0903EH
01000H
06021H
0A0E8H
0C063H
040F9H
080B5H
0009FH
00051H
00026H
00051H
0009FH
080B5H
040F9H
0C063H
0A0E8H
06021H
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
END
17
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ꢀ ꢁꢂ ꢃ ꢄꢅ ꢄ ꢆꢇ ꢀ ꢁꢂꢃ ꢄꢅ ꢄ ꢈ
ꢉꢊ ꢋꢌꢂ ꢀꢍ ꢃ ꢊ ꢃꢌꢂ ꢁ ꢍꢎ ꢏ ꢍꢎ ꢐꢑ ꢅ ꢉ ꢌꢒꢈ ꢀ ꢓꢈ ꢔꢈ ꢀꢕꢁ ꢌꢀꢍ ꢌꢕꢖꢕꢁ ꢍ ꢔ
ꢆ ꢍꢖ ꢂꢐꢑ ꢀ ꢐꢑ ꢗ ꢎ ꢈ ꢀꢘ ꢏ ꢍꢎ ꢐꢑ ꢓꢍ ꢎ ꢖ
SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
APPLICATION INFORMATION
linearity, offset, and gain error using single ended supplies
When an amplifier is operated from a single supply, the voltage offset can still be either positive or negative. With
a positive offset, the output voltage changes on the first code change. With a negative offset, the output voltage
may not change with the first code, depending on the magnitude of the offset voltage.
The output amplifier attempts to drive the output to a negative voltage. However, because the most negative
supply rail is ground, the output cannot drive below ground and clamps the output at 0 V.
The output voltage then remains at zero until the input code value produces a sufficient positive output voltage
to overcome the negative offset voltage, resulting in the transfer function shown in Figure 19.
Output
Voltage
0 V
DAC Code
Negative
Offset
Figure 19. Effect of Negative Offset (Single Supply)
This offset error, not the linearity error, produces this breakpoint. The transfer function would have followed the
dotted line if the output buffer could drive below the ground rail.
For a DAC, linearity is measured between zero-input code (all inputs 0) and full-scale code (all inputs 1) after
offset and full scale are adjusted out or accounted for in some way. However, single supply operation does not
allow for adjustment when the offset is negative due to the breakpoint in the transfer function. So the linearity
is measured between full-scale code and the lowest code that produces a positive output voltage.
power-supply bypassing and ground management
Printed-circuit boards that use separate analog and digital ground planes offer the best system performance.
Wire-wrap boards do not perform well and should not be used. The two ground planes should be connected
together at the low-impedance power-supply source. The best ground connection may be achieved by
connecting the DAC AGND terminal to the system analog ground plane, making sure that analog ground
currents are well managed and there are negligible voltage drops across the ground plane.
A 0.1-µF ceramic-capacitor bypass should be connected between V and AGND and mounted with short leads
DD
as close as possible to the device. Use of ferrite beads may further isolate the system analog supply from the
digital power supply.
Figure 20 shows the ground plane layout and bypassing technique.
Analog Ground Plane
1
2
3
4
8
7
6
5
0.1 µF
Figure 20. Power-Supply Bypassing
18
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ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢆꢇ ꢀꢁꢂ ꢃꢄ ꢅꢄ ꢈ
ꢉ ꢊꢋ ꢌꢂ ꢀ ꢍ ꢃ ꢊꢃ ꢌꢂ ꢁ ꢍ ꢎ ꢏꢍ ꢎ ꢐꢑ ꢅ ꢉ ꢌꢒꢈ ꢀ ꢓꢈ ꢔꢈ ꢀꢕꢁ ꢌꢀꢍ ꢌꢕ ꢖ ꢕꢁ ꢍꢔ
ꢆꢍ ꢖꢂꢐ ꢑꢀ ꢐꢑꢗ ꢎ ꢈꢀ ꢘ ꢏꢍ ꢎ ꢐ ꢑ ꢓ ꢍꢎ ꢖ
SLAS152D − DECEMBER 1997 − REVISED APRIL 2004
APPLICATION INFORMATION
definitions of specifications and terminology
integral nonlinearity (INL)
The relative accuracy or integral nonlinearity (INL), sometimes referred to as linearity error, is the maximum
deviation of the output from the line between zero and full scale excluding the effects of zero code and full-scale
errors.
differential nonlinearity (DNL)
The differential nonlinearity (DNL), sometimes referred to as differential error, is the difference between the
measured and ideal 1 LSB amplitude change of any two adjacent codes. Monotonic means the output voltage
changes in the same direction (or remains constant) as a change in the digital input code.
zero-scale error (E
)
ZS
Zero-scale error is defined as the deviation of the output from 0 V at a digital input value of 0.
gain error (E )
G
Gain error is the error in slope of the DAC transfer function.
signal-to-noise ratio + distortion (S/N+D)
S/N+D is the ratio of the rms value of the output signal to the rms sum of all other spectral components below
the Nyquist frequency, including harmonics but excluding dc. The value for S/N+D is expressed in decibels.
spurious free dynamic range (SFDR)
SFDR is the difference between the rms value of the output signal and the rms value of the largest spurious
signal within a specified bandwidth. The value for SFDR is expressed in decibels.
total harmonic distortion (THD)
THD is the ratio of the rms sum of the first six harmonic components to the rms value of the fundamental signal
and is expressed in decibels.
19
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PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TLV5616CD
TLV5616CDG4
TLV5616CDGK
TLV5616CDGKG4
TLV5616CDR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
D
8
8
8
8
8
8
75
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAUAGLevel-1-260C-UNLIM
CU NIPDAUAGLevel-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
VSSOP
VSSOP
SOIC
DGK
DGK
D
80
Green (RoHS
& no Sb/Br)
80
Green (RoHS
& no Sb/Br)
2500
2500
Green (RoHS
& no Sb/Br)
TLV5616CDRG4
SOIC
D
Green (RoHS
& no Sb/Br)
TLV5616CP
TLV5616CPE4
TLV5616ID
ACTIVE
ACTIVE
ACTIVE
PDIP
PDIP
SOIC
P
P
D
8
8
8
50
50
75
Pb-Free (RoHS)
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
TLV5616IDG4
TLV5616IDGK
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
D
8
8
8
8
8
8
8
75
80
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAUAGLevel-1-260C-UNLIM
CU NIPDAUAGLevel-1-260C-UNLIM
CU NIPDAUAGLevel-1-260C-UNLIM
CU NIPDAUAGLevel-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
DGK
DGK
DGK
DGK
D
Green (RoHS
& no Sb/Br)
TLV5616IDGKG4
TLV5616IDGKR
TLV5616IDGKRG4
TLV5616IDR
80
Green (RoHS
& no Sb/Br)
2500
2500
2500
2500
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TLV5616IDRG4
SOIC
D
Green (RoHS
& no Sb/Br)
TLV5616IP
ACTIVE
ACTIVE
PDIP
PDIP
P
P
8
8
50
50
Pb-Free (RoHS)
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
TLV5616IPE4
(1) The marketing status values are defined as follows:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2012
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLV5616CDR
TLV5616IDGKR
TLV5616IDR
SOIC
VSSOP
SOIC
D
DGK
D
8
8
8
2500
2500
2500
330.0
330.0
330.0
12.4
12.4
12.4
6.4
5.3
6.4
5.2
3.4
5.2
2.1
1.4
2.1
8.0
8.0
8.0
12.0
12.0
12.0
Q1
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TLV5616CDR
TLV5616IDGKR
TLV5616IDR
SOIC
VSSOP
SOIC
D
DGK
D
8
8
8
2500
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
Pack Materials-Page 2
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changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
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