TMAG5123D1CEDBZRQ1 [TI]
TMAG5123-Q1 Automotive In-Plane, High-Precision, Hall-Effect Switch Sensor;
| 型号： | TMAG5123D1CEDBZRQ1 |
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TEXAS INSTRUMENTS |
| 描述： | TMAG5123-Q1 Automotive In-Plane, High-Precision, Hall-Effect Switch Sensor |
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TMAG5123-Q1
SLYS032 – OCTOBER 2020
TMAG5123-Q1 Automotive In-Plane, High-Precision, Hall-Effect Switch Sensor
1 Features
3 Description
•
AEC-Q100 qualified for automotive applications:
– Temperature grade 0: –40°C To +150°C, TA
In-plane, omnipolar Hall-effect switch sensor
High magnetic sensitivity:
– TMAG5123B-Q1: 4 mT (typical)
– TMAG5123C-Q1: 7 mT (typical)
– TMAG5123D-Q1: 10 mT (typical)
Supports a wide voltage range
– 2.7-V to 38-V operating VCC range
– No external regulator required
Wide operating temperature range
– Ambient operating temperature range: –40 °C
to +150 °C
Continuous conversion
Open-drain output
SOT-23 package option
Protection features
– Supports up to 40-V load dump
– Reverse battery protection to –20-V
– Output short-circuit protection
– Output current limitation
The TMAG5123-Q1 is a chopper-stabilized omnipolar,
active-low Hall-effect switch sensor. The TMAG5123-
Q1 integrates an in-plane sensor enabling the sensing
of horizontal fields. Available in the SOT-23 package,
the TMAG5123-Q1 allows measuring magnetic fields
that are parallel to the surface of the printed circuit
board (PCB) to ease mechanical placement.
•
•
•
•
Different sensitivity levels are available to match the
specific requirement of the application. When the
applied magnetic flux density value exceeds the BOP
threshold in absolute magnetic field values, the open-
drain output produces a low-state voltage. The output
remains low until the applied field decreases to less
than the BRP threshold also in absolute terms.
•
•
•
•
The TMAG5123-Q1 2.7-V to 38-V operating voltage
range and reverse polarity protection of up to –20-V
for the device is designed for a wide range of
industrial and automotive applications.
Device Information
PART NUMBER
PACKAGE(1)
BODY SIZE (NOM)
TMAG5123-Q1
SOT-23 (3)
2.92 mm × 1.30 mm
2 Applications
(1) For all available packages, see the package option
addendum at the end of the data sheet.
•
•
•
•
•
Gear shift
Interior lighting
Door lock
Door handle
Sunroof/Trunk closure
In-Plane Sensor
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change
without notice.
TMAG5123-Q1
SLYS032 – OCTOBER 2020
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Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison Table...............................................3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings ....................................... 4
7.2 ESD Ratings .............................................................. 4
7.3 Recommended Operating Conditions ........................4
7.4 Thermal Information ...................................................4
7.5 Electrical Characteristics ............................................5
7.6 Magnetic Characteristics ............................................5
8 Detailed Description........................................................6
8.1 Overview.....................................................................6
8.2 Functional Block Diagram...........................................6
8.3 Feature Description.....................................................6
8.4 Device Functional Modes..........................................11
9 Application and Implementation..................................12
9.1 Application Information............................................. 12
9.2 Typical Applications.................................................. 12
10 Power Supply Recommendations..............................16
11 Layout...........................................................................16
11.1 Layout Guidelines................................................... 16
11.2 Layout Example...................................................... 16
12 Device and Documentation Support..........................17
12.1 Receiving Notification of Documentation Updates..17
12.2 Support Resources................................................. 17
12.3 Trademarks.............................................................17
12.4 Electrostatic Discharge Caution..............................17
12.5 Glossary..................................................................17
13 Mechanical, Packaging, and Orderable
Information.................................................................... 17
4 Revision History
DATE
REVISION
NOTES
October 2020
*
Initial Release
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5 Device Comparison Table
DEVICE
DEVICE OPTION
Threshold level (BOP)
B
C
D
4mT
7mT
TMAG5123-Q1
10mT
6 Pin Configuration and Functions
VCC
1
3
GND
OUT
2
Not to scale
Figure 6-1. DBZ Package 3-Pin SOT-23 Top View
Table 6-1. Pin Functions
PIN
NAME
TYPE
DESCRIPTION
NO.
2.7-V to 38-V power supply. Connect a ceramic capacitor with a value of at least 0.01 µF
(minimum) between VCC and ground.
1
VCC
Power supply
2
3
OUT
GND
Output
Hall sensor open-drain output. The open drain requires a pull-up resistor
Ground reference.
Ground
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
V
Power Supply
VCC
–20
40
Voltage
Magnetic Flux Density,BMAX
Unlimited
T
Junction
Junction temperature, TJ
temperature, TJ
175
150
°C
°C
Storage temperature, Tstg
–65
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per AEC Q100-002(1)
HBM ESD Classification Level 2
±2000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per AEC Q100-011
CDM ESD Classification Level C4A
±500
(1) AECQ 100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
2.7
0
MAX
UNIT
V
VCC
VO
Power supply voltage
Output pin voltage
38
38
V
ISINK
TA
Output pin current sink
Ambient temperature
0
20
mA
°C
–40
150
7.4 Thermal Information
TMAG5123
DBZ (SOT-23)
3 PINS
197.7
THERMAL METRIC(1)
UNIT
RθJA
RθJC(top)
RθJB
ΨJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
87.1
27.4
Junction-to-top characterization parameter
Junction-to-board characterization parameter
3.7
ΨJB
27.1
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
-100
0
TYP
MAX
UNIT
POWER SUPPLY
ICC
Operating supply current
Operating supply current
Reverse-battery current
Power-on-time
VCC = 2.7V to 38V, TA = 25°C
VCC = 2.7V to 38V, TA = – 40°C to 150°C
VCC = -20V
3.5
3.5
mA
mA
µA
µs
ICC
5.4
IRCC
tON
62.5
POS
OUTPUT
VOL
IOH
Power-on-state
VCC>VCCmin, t<tON
High
Low-level output voltage
Output leakage current
Output Current
IOL=5mA
VCC=5V
0.5
1
V
0.1
µA
mA
mA
µs
IOut
ISC
20
Output short-circuit current
Output rise time
65
0.2
0.2
50
100
tR
RL=1kΩ, CL=50pF, VCC = 12 V
RL=1kΩ, CL=50pF, VCC = 12 V
Change in B field to change in output
tF
Output fall time
µs
tPD
Propagation delay time
µs
FREQUENCY RESPONSE
fCHOP
fBW
Chopping frequency
Signal bandwidth
320
10
kHz
kHz
7.6 Magnetic Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
TMAG5123B
BOP
BRP
Magnetic field operating point
Magnetic field release point
Magnetic hysteresis BOP - BRP
±2.5
±0.5
±0.5
±4
±2
±2
±5.5
±4
mT
mT
mT
VCC = 2.7V to 38V, TA = – 40°C to 150°C
VCC = 2.7V to 38V, TA = – 40°C to 150°C
VCC = 2.7V to 38V, TA = – 40°C to 150°C
BHYS
±3
TMAG5123C
BOP
BRP
Magnetic field operating point
±5.5
±3.5
±0.5
±7
±5
±2
±9
±7
±3
mT
mT
mT
Magnetic field release point
BHYS
Magnetic hysteresis BOP - BRP
TMAG5123D
BOP
BRP
Magnetic field operating point
±8.5
±6.5
±0.5
±10
±8
±12.5
±10
±3
mT
mT
mT
Magnetic field release point
BHYS
Magnetic hysteresis BOP - BRP
±2
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8 Detailed Description
8.1 Overview
The TMAG5123-Q1 device is a chopper-stabilized Hall sensor with a digital omnipolar switch output for magnetic
sensing applications. The TMAG5123-Q1 device can be powered with a supply voltage range between 2.7-V
and 38 V, and can withstand –20-V reverse battery conditions continuously. Note that the TMAG5123-Q1 device
will not operate when approximately –20-V to 2.7-V is applied to the VCC pin (with respect to GND). In addition,
the device can withstand voltages up to 40 V for transient durations.
While most of the Hall-effect sensors switch their output in the presence of a vertical field, the TMAG5123-Q1
will switch the output in the presence of a horizontal field. The TMAG5123-Q1 is then an in-plane or vertical
sensor, sensitive to a vertical or parallel magnetic fields.
The omnipolar configuration allows the Hall sensor to respond to either a south or north pole. A strong magnetic
field of either polarity will cause the output to pull low (operate point, BOP), and a weaker magnetic field will
cause the output to release (release point, BRP). Hysteresis is included in between the operate and release
points, so magnetic field noise will not trip the output accidentally.
An external pullup resistor is required on the OUT pin. The OUT pin can be pulled up to VCC, or to a different
voltage supply. This allows for easier interfacing with controller circuits.
8.2 Functional Block Diagram
VCC
Chopper
stabilization
Threshold
selection
LDO
OUT
Output
control
X
Amp
∫
GND
Figure 8-1. Block Diagram
8.3 Feature Description
8.3.1 Field Direction Definition
The TMAG5123-Q1 is sensitive to both south and north poles in the same plane as the die as shown Figure 8-2.
Figure 8-2. Field Direction Definition
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8.3.2 Device Output
The TMAG5123-Q1 is featured with an open drain output. In order to generate a two state output, a pull-up
resistor needs to be added.
Once the device is powered and with no magnetic field applied to it, the output stays at Vout(H). As an omnipolar
sensor the output will go down to Vout(L) when the field increase beyond the BOP threshold either with a north
or a south magnetic field. When the field decrease below the BRP threshold, either with a north or a south
magnetic field, the output will go up to Vout(H)
Vout
BHYS
BHYS
Vout(H)
Vout(L)
B
BOP
BRP
BRP
BOP
North
South
0 mT
Figure 8-3. Unipolar Functionality
8.3.3 Protection Circuits
The TMAG5123-Q1 device is protected against load dump and reverse-supply conditions
8.3.3.1 Load Dump Protection
The TMAG5123-Q1 device operates at DC VCC conditions up to 38-V nominally, and can additionally withstand
VCC = 40-V. No current-limiting series resistor is required for this protection.
8.3.3.2 Reverse Supply Protection
The TMAG5123-Q1 device is protected in the event that the VCC pin and the GND pin are reversed (up to –20-
V).
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8.3.4 Hall Element Location
The sensing element inside the device is in the center of both packages when viewed from the top. Figure 8-4
shows the tolerances and side-view dimensions.
0.55
0.65
1.71
1.83
0.73
0.57
Figure 8-4. Hall Element Location
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8.3.5 Power-On Time
Figure 8-5 shows the behavior of the device after the VCC voltage is applied and when the field is below the BOP
threshold. Once the minimum value for VCC is reached, the TMAG5123-Q1 will take time tON to power up and
then time tPD to update the output to a level High.
Figure 8-6 shows the behavior of the device after the VCC voltage is applied and when the field is above the BOP
threshold. Once the minimum value for VCC is reached, the TMAG5123-Q1 will take time tON to power up and
then time tPD to update the output to a level High
In both case the output value during tON is unknown. The output value during tPD will be set at high.
Supply (V)
Supply (V)
VCC
VCC
2.7V
0V
2.7V
0V
t (s)
t (s)
t (s)
t (s)
t (s)
t (s)
B (mT)
B (mT)
BOP
BRP
BOP
BRP
Output (V)
Output (V)
VCC
VCC
0V
0V
tON
tPD
tON
tPD
Figure 8-5. Power-On time when B<BOP
Supply (V)
VCC
2.7V
0V
t (s)
B (mT)
BOP
BRP
t (s)
Output (V)
VCC
0V
t (s)
tON
tPD
Figure 8-6. Power-On time when B>BOP
8.3.6 Propagation Delay
The TMAG5123-Q1 samples the Hall element at a nominal sampling interval of tPD to detect the presence of a
magnetic south or north pole. Between each sampling interval, the device calculates the average magnetic field
applied to the device. If this average value crosses the B OP or B RP threshold, the device changes the
corresponding level as defined in Figure 8-3. The Hall sensor + magnet system is by nature asynchronous,
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therefore the propagation delay (tPD) will vary depending on when the magnetic field goes above the BOP value.
As shown in Figure 8-7, the output delay also depends on when the magnetic field goes above the BOP value.
The first graph in Figure 8-7 shows the typical case. The magnetic field goes above the BOP value at the moment
the output is updated. The part will only require one sampling period of tPD to update the output.
The second graph in Figure 8-7 shows a magnetic field going above the B OP value just before half of the
sampling period. This is the best-case scenario where the output is updated in just half of the sampling period.
Finally, the third graph in Figure 8-7 shows the worst-case scenario where the magnetic field goes above the B
value just after half of the sampling period. At the next output update, the device will still see the magnetic
OP
field under the BOP threshold and will require a whole new sampling period to update the output.
Magnetic Field
B7
Magnetic Field
B7
Magnetic Field
B7
B6
B6
B6
B5
B5
B5
BOP
B4
BOP
B4
BOP
B4
B3
B2
B1
B3
B2
B1
B3
B2
B1
t1
t2
t3
t4
t5
t6
t7
t8
t1
t2
t3
t4
t5
t6
t7
t8
t1
t2
t3
t4
t5
t6
t7
t8
Time
Time
Time
Output
Output
Output
VCC
VCC
VCC
tPDMin
tPDTyp
tPDMax
0V
0V
0V
Time
Time
Time
Figure 8-7. Field Sampling Timing
Figure 8-8 shows TMAG5123-Q1 propagation delay analysis when a magnetic south or north pole is applied.
The Hall element of the TMAG5123-Q1 experiences an increasing magnetic field as a magnetic south or north
pole approaches the device, as well as a decreasing magnetic field as a magnetic south or north pole moves
away. At time t1, the magnetic field goes above the BOP threshold. The output will then start to move after the
propagation delay (tPD). This time will vary depending on when the sampling period is, as shown in Figure 8-7. At
t2, the output start pulling the output voltage Low. At t3, the output is completely pulled down. The same process
happens on the other way when the magnetic value is going under the BRP threshold.
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Magnetic Field
BOP
BRP
Time
Output
VCC
0V
t1
t2 t3
t4
t5 t6
Time
tPD
tPD
tF
tR
Figure 8-8. Propagation Delay
8.3.7 Chopper Stabilization
The Basic Hall-effect sensor consists of four terminals where a current is injected through two opposite terminals
and a voltage is measured through the other opposite terminals. The voltage measured is proportional to the
current injected and the magnetic field measured. By knowing the current inject, the device can then know the
magnetic field strength. The problem is that the voltage generated is small in amplitude while the offset voltage
generated is more significant. To create a precise sensor, the offset voltage must be minimized.
Chopper stabilization is one way to significantly minimize this offset. It is achieved by "spinning" the sensor and
sequentially applying the bias current and measuring the voltage for each pair of terminals. This means that a
measurement is completed once the spinning cycle is completed. The full cycle is completed after sixteen
measurements. The output of the sensor is connected to an amplifier and an integrator that will accumulate and
filter out a voltage proportional to the magnetic field present. Finally, a comparator will switch the output if the
voltage reaches either the BOP or BRP threshold (depending on which state the output voltage was previously
in).
The frequency of each individual measurement is referred as the Chopping frequency, or f CHOP. The total
conversion time is referred as the Propagation delay time, tPD, and is basically equal to 16/fCHOP. Finally, the
Signal bandwidth, f BW, represents the maximum value of the magnetic field frequency, and is equal to (f
CHOP/16)/2 as defined by the sampling theorem.
8.4 Device Functional Modes
The device operates in only one mode when operated within the Recommended Operating Conditions.
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.
9.1 Application Information
The TMAG5123-Q1 is typically used in magnetic-field sensing applications to detect the proximity of a magnet
that is in the "in-plane" axis from the sensor. The magnet is often attached to a movable component in the
system.
The TMAG5123-Q1 is a Hall sensor that implements a Hall sensing element that senses parallel to the package
of the part rather than through the z-axis of the device. This eases constraints in system design where a parallel
magnetic field is needed to be detected, but normal industry packages, such as TO-92 are undesirable due to
space constraints.
9.2 Typical Applications
9.2.1 In-Plane Typical Application Diagrams
Figure 9-1. Typical In-Plane Sensing Diagram
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9.2.1.1 Design Requirements
For this design example, use the parameters listed in one of the 3 tables below depending on wich version of the
device is used.
Table 9-1. Design Parameters for TMAG5123B-Q1
DESIGN PARAMETER
EXAMPLE VALUE
Vcc
12V
TMAG5123-Q1 Device
TMAG5123B-Q1
1-cm Cube NdFeB (N45)
3.05 cm
Magnet
Minimum Magnet Distance
Magnetic Flux Density at closest distance
Magnetic flux density when magnet moves away
4.5 mT
Close to 0 mT
Table 9-2. Design Parameters for TMAG5123C-Q1
DESIGN PARAMETER
EXAMPLE VALUE
Vcc
12V
TMAG5123C-Q1
1-cm Cube NdFeB (N45)
2.43 cm
TMAG5123-Q1 Device
Magnet
Minimum Magnet Distance
Magnetic Flux Density at closest distance
Magnetic flux density when magnet moves away
8mT
Close to 0 mT
Table 9-3. Design Parameters for TMAG5123D-Q1
DESIGN PARAMETER
EXAMPLE VALUE
Vcc
12V
TMAG5123D-Q1
1-cm Cube NdFeB (N45)
2.14 cm
TMAG5123-Q1 Device
Magnet
Minimum Magnet Distance
Magnetic Flux Density at closest distance
Magnetic flux density when magnet moves away
11mT
Close to 0 mT
9.2.1.2 Detailed Design Procedure
When designing a digital-switch magnetic sensing system, three variables should always be considered: the
magnet, sensing distance, and threshold of the sensor.
The TMAG5123-Q1 device has a detection threshold specified by parameter B OP, which is the amount of
magnetic flux required to pass through the Hall sensor mounted inside the TMAG5123-Q1. To reliably activate
the sensor, the magnet must apply a flux greater than the maximum specified BOP. In such a system, the sensor
typically detects the magnet before it has moved to the closest position, but designing to the maximum
parameter ensures robust turn-on for all possible values of BOP. When the magnet moves away from the sensor,
it must apply less than the minimum specified BRP to reliably release the sensor.
Magnets are made from various ferromagnetic materials that have tradeoffs in cost, drift with temperature,
absolute maximum temperature ratings, remanence or residual induction (Br), and coercivity (Hc). The Br and the
dimensions of a magnet determine the magnetic flux density (B) it produces in 3-dimensional space. For simple
magnet shapes, such as rectangular blocks and cylinders, there are simple equations that solve B at a given
distance centered with the magnet.
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Thickness
Thickness
Width
Distance
Distance
Diameter
S
N
Length
S
N
B
B
Figure 9-2. Rectangular Block and Cylinder Magnets
Use Equation 1 for the rectangular block shown in Figure 9-2:
≈
∆
’
÷
≈
∆
’
÷
≈
’
:
B =
Br
WL
WL
arctan∆
÷ - arctan
∆
∆
«
÷
÷
◊
∆
∆
«
÷
÷
◊
∆
÷
2D 4D2 + W2 + L2
2
p
2 D + T 4 D + T + W2 + L2
«
◊
(
)
(
)
(1)
(2)
Use Equation 2 for the cylinder shown in Figure 9-2:
≈
∆
’
÷
:
B =
Br
2
D + T
2
D
-
∆
∆
«
÷
÷
◊
2
2
0.5C + D + T
0.5C + D2
(
)
(
)
(
)
where
•
•
•
•
•
W is width.
L is length.
T is thickness (the direction of magnetization).
D is distance.
C is diameter.
An online tool, the Hall Effect Switch Magnetic Field Calculator, that uses these formulas is located at http://
www.ti.com/product/tmag5123-Q1.
All magnetic materials generally have a lower B r at higher temperatures. Systems should have margin to
account for this, as well as for mechanical tolerances.
For the TMAG5123B-Q1, the maximum BOP is 4.5 mT. Choosing a 1-cm cube NdFeB N45 magnet, Equation 1
shows that this point occurs at 3.05 cm. This means that, provided the design places the magnet within 3.05 cm
from the sensor during a "turn-on" event, the magnet will activate the sensor. The removal of the magnet away
from the device will ensure a crossing of the minimum BRP point and will return the device to its initial state.
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9.2.1.3 Application Curve
60
55
50
45
40
35
30
25
20
15
10
5
0
1
1.5
2
2.5
3
Distance (cm)
3.5
4
4.5
5
D017
Figure 9-3. Magnetic Profile of a 1-cm Cube NdFeB Magnet
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10 Power Supply Recommendations
The TMAG5123-Q1 is powered from 2.7-V to 38-V DC power supplies. A decoupling capacitor close to the
device must be used to provide local energy with minimal inductance. TI recommends using a ceramic capacitor
with a value of at least 0.01 µF.
11 Layout
11.1 Layout Guidelines
The bypass capacitor should be placed near the TMAG5123-Q1 to reduce noise.
Generally, using PCB copper planes underneath the TMAG5123-Q1 device has no effect on magnetic flux, and
does not interfere with device performance. This is because copper is not a ferromagnetic material. However, If
nearby system components contain iron or nickel, they may redirect magnetic flux in unpredictable ways.
11.2 Layout Example
VCC
GND
OUT
Figure 11-1. TMAG5123-Q1 Layout Example
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12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.12 MAX
1.4
1.2
B
A
0.1 C
PIN 1
INDEX AREA
1
0.95
3.04
2.80
1.9
3
2
0.5
0.3
3X
0.10
0.01
(0.95)
TYP
0.2
C A B
0.25
GAGE PLANE
0.20
0.08
TYP
0.6
0.2
TYP
SEATING PLANE
0 -8 TYP
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
www.ti.com
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EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214838/C 04/2017
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
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EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
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PACKAGE OPTION ADDENDUM
www.ti.com
4-Nov-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
PTMAG5123B1CEDBZQ1
PTMAG5123C1CEDBZQ1
PTMAG5123D1CEDBZQ1
TMAG5123B1CEDBZRQ1
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3000
3000
3000
3000
TBD
TBD
TBD
Call TI
Call TI
Call TI
-40 to 150
-40 to 150
-40 to 150
-40 to 150
Call TI
Call TI
SN
ACTIVE
Call TI
PREVIEW
Green (RoHS
& no Sb/Br)
Level-3-260C-168 HR
23BQ
23CQ
23DQ
TMAG5123C1CEDBZRQ1
TMAG5123D1CEDBZRQ1
PREVIEW
PREVIEW
SOT-23
SOT-23
DBZ
DBZ
3
3
3000
3000
Green (RoHS
& no Sb/Br)
SN
SN
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 150
-40 to 150
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Nov-2020
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
4203227/C
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.12 MAX
1.4
1.2
B
A
0.1 C
PIN 1
INDEX AREA
1
0.95
3.04
2.80
1.9
3
2
0.5
0.3
3X
0.10
0.01
(0.95)
TYP
0.2
C A B
0.25
GAGE PLANE
0.20
0.08
TYP
0.6
0.2
TYP
SEATING PLANE
0 -8 TYP
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214838/C 04/2017
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
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