TMAG5124D1CEDBZRQ1 [TI]
TMAG5124-Q1 Automotive 2-Wire, High-Precision, Hall-Effect Switch Sensor;
| 型号： | TMAG5124D1CEDBZRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | TMAG5124-Q1 Automotive 2-Wire, High-Precision, Hall-Effect Switch Sensor |
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| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TMAG5124-Q1
SLYS033 – NOVEMBER 2021
TMAG5124-Q1 Automotive 2-Wire, High-Precision, Hall-Effect Switch Sensor
1 Features
3 Description
•
AEC-Q100 qualified with the following results:
– Device temperature grade 0: –40°C to 150°C
ambient operating temperature range
Hall effect switch with 2-wire interface
Low-level current output options:
– TMAG5124A/B/C/D-Q1: 3.5 mA
– TMAG5124E/F/G/H-Q1: 6 mA
Magnetic sensitivity:
– TMAG5124A/E-Q1: 4 mT (typical)
– TMAG5124B/F-Q1: 6 mT (typical)
– TMAG5124C/G-Q1: 10 mT (typical)
– TMAG5124D/H-Q1: 15 mT (typical)
Fast sensing bandwidth: 40 kHz
Supports wide voltage range
The TMAG5124-Q1 device is a high-precision Hall
effect sensor that offers a 2-wire interface designed
for automotive designs.
•
•
The TMAG5124-Q1 integrates a current source that
switches between two levels depending on the value
of the magnetic field applied to the part. While
the high value is fixed, the low value can be
selected from two ranges. This type of interface
enables robust communication between sensor and
controller, allow long distance transmissions, helps
detect disconnections, and limits the number of wires
to two.
•
•
•
The device is available in a 3-pin SOT-23 package.
While 3 pins are available on the package, the device
only requires the VCC and GND pin to operate. The
current can be measured from either of those 2 pins,
creating either a high-side or low-side configuration.
– Operating VCC range: 2.7 V to 38 V
– No external regulator required
Protection features:
– Supports load dump up to 40 V
– Reverse polarity protection
•
•
Different product variants enable selection of different
levels of magnetic sensitivity to match application
specific requirements.
SOT-23 package option
2 Applications
The wide operating voltage range and reverse polarity
protection of the TMAG5124-Q1 is designed for a
variety of automotive applications.
•
•
•
•
•
•
•
Seat position & comfort module
Door handle module
Wiper module
Trunk module
Roof motor module
Brake system
Device Information
PART NUMBER
PACKAGE(1)
BODY SIZE (NOM)
TMAG5124-Q1
SOT-23 (3)
2.92 mm × 1.30 mm
Electrical power steering (EPS)
(1) For all available packages, see the package option
addendum at the end of the data sheet.
ICC
BHYS
ICC (H)
0.1 ꢀF
Vcc
ECU
GND
TMAG5124
VCC
ICC (L)
Wire
B
N
S
GND
BRP
BOP
TEST
0 mT
Distance
Output State
Typical Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMAG5124-Q1
SLYS033 – NOVEMBER 2021
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Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison.........................................................3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings........................................ 4
7.2 ESD Ratings............................................................... 4
7.3 Recommended Operating Conditions.........................4
7.4 Thermal Information....................................................4
7.5 Electrical Characteristics.............................................5
7.6 Magnetic Characteristics.............................................5
7.7 Typical Characteristics................................................6
8 Detailed Description......................................................11
8.1 Overview................................................................... 11
8.2 Functional Block Diagram......................................... 11
8.3 Feature Description...................................................11
8.4 Device Functional Modes..........................................16
9 Application and Implementation..................................17
9.1 Application Information............................................. 17
9.2 Typical Applications.................................................. 17
10 Power Supply Recommendations..............................20
10.1 Power Derating....................................................... 20
11 Layout...........................................................................21
11.1 Layout Guidelines................................................... 21
11.2 Layout Example...................................................... 21
12 Device and Documentation Support..........................22
12.1 Documentation Support.......................................... 22
12.2 Receiving Notification of Documentation Updates..22
12.3 Support Resources................................................. 22
12.4 Trademarks.............................................................22
12.5 Electrostatic Discharge Caution..............................22
12.6 Glossary..................................................................22
13 Mechanical, Packaging, and Orderable
Information.................................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE
REVISION
NOTES
November 2021
*
Initial Release
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5 Device Comparison
Table 5-1. Device Comparison
DEVICE
DEVICE OPTION
THRESHOLD LEVEL (BOP)
LOW-CURRENT LEVEL
A1
4 mT
B1
C1
D1
E1
F1
G1
H1
6 mT
10 mT
15 mT
4 mT
3.5 mA
TMAG5124-Q1
6 mT
6 mA
10 mT
15 mT
6 Pin Configuration and Functions
VCC
1
2
3
GND
TEST
Not to scale
Figure 6-1. DBZ Package 3-Pin SOT-23 Top View
Table 6-1. Pin Functions
PIN
NAME
TYPE
DESCRIPTION
NO.
Power supply of 2.7 V to 38 V. Connect a ceramic capacitor with a value of at least 0.01 µF
between VCC and ground.
1
VCC
Power supply
2
3
TEST
GND
—
Must be connected to pin 3.
Ground reference.
Ground
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
V
VCC
Power supply voltage
–20
40
Magnetic Flux Density, BMAX
Unlimited
T
TJ
Junction temperature
170
150
°C
°C
Storage temperature, Tstg
–65
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated
under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per AEC Q100-002(1)
HBM ESD classification level 2
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per AEC Q100-011
CDM ESD Classification level C4A
±500
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
2.7
MAX
UNIT
V
VCC
TA
Power supply voltage
Ambient temperature
38
–40
150
°C
7.4 Thermal Information
TMAG5124
THERMAL METRIC(1)
DBV (SOT-23)
UNIT
3 PINS
198.5
88.9
28
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
ΨJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
4
ΨJB
27.7
—
RθJC(bot)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY
ICC(L1)
ICC(L2)
ICC(H)
IRCC
Low-level supply current option 1
Low-level supply current option 2
High-level supply current
Reverse supply current
VCC = 2.7 V to 38 V, TA = – 40°C to 150°C
VCC = 2.7 V to 38 V, TA = – 40°C to 150°C
VCC = 2.7 V to 38 V, TA = – 40°C to 150°C
VRCC = –20 V
2
4.8
3.5
6
5
7.8
mA
10.5
14.5
18
–100
µA
µs
tON
Power-on-time
62.5
OUTPUT
VCC = 12V, ICC(L) to ICC(H), ICC(H) to ICC(L),
CBYP = 0.01µF
dI/dt
tPD
Supply Current Slew Rate
Propagation delay time
10
mA/µs
µs
Change in B field to change in output
12.5
FREQUENCY RESPONSE
fCHOP
fBW
Chopping frequency
Signal bandwidth
320
40
kHz
7.6 Magnetic Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
TMAG5124A, TMAG5124E
BOP
BRP
Magnetic field operating point
3
1
4
2
2
5
Magnetic field release point
VCC = 2.7 V to 38 V, TA = – 40°C to 150°C
VCC = 2.7 V to 38 V, TA = – 40°C to 150°C
VCC = 2.7 V to 38 V, TA = – 40°C to 150°C
VCC = 2.7 V to 38 V, TA = – 40°C to 150°C
3
mT
mT
mT
mT
BHYS
Magnetic hysteresis BOP - BRP
0.6
3.4
TMAG5124B, TMAG5124F
BOP
BRP
Magnetic field operating point
5
3
6
4
2
7
5
Magnetic field release point
BHYS
Magnetic hysteresis BOP - BRP
0.6
3.4
TMAG5124C, TMAG5124G
BOP
BRP
Magnetic field operating point
8.8
6.8
0.6
10
8
11
9.4
3.4
Magnetic field release point
BHYS
Magnetic hysteresis BOP - BRP
2
TMAG5124D, TMAG5124H
BOP
BRP
Magnetic field operating point
13.6
11.4
0.6
15
13
2
16.1
14.2
3.4
Magnetic field release point
BHYS
Magnetic hysteresis BOP - BRP
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7.7 Typical Characteristics
7.7.1 TMAG5124A and TMAG5124E
6
5
4
3
2
6
5
4
3
2
VCC = 3V
VCC = 6V
VCC = 12V
TA = -40°C
TA = 25°C
TA = 125°C
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
3
3
3
5
7
Supply Voltage (V)
9
11
12
Figure 7-1. BOP vs. Temperature
Figure 7-2. BOP vs. VCC
5
4
3
2
1
5
4
3
2
1
VCC = 3V
VCC = 6V
VCC = 12V
TA = -40°C
TA = 25°C
TA = 125°C
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
5
7
Supply Voltage (V)
9
11
12
Figure 7-3. BRP vs. Temperature
Figure 7-4. BRP vs. VCC
4
3
2
1
0
4
3
2
1
0
VCC = 3V
VCC = 6V
VCC = 12V
TA = -40°C
TA = 25°C
TA = 125°C
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
5
7
Supply Voltage (V)
9
11
12
Figure 7-5. Hysteresis vs. Temperature
Figure 7-6. Hysteresis vs. VCC
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7.7.2 TMAG5124B and TMAG5124F
8
8
7
6
5
4
VCC = 3V
VCC = 6V
VCC = 12V
TA = -40°C
TA = 25°C
TA = 125°C
7
6
5
4
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
3
3
3
5
7
Supply Voltage (V)
9
11
12
Figure 7-7. BOP vs. Temperature
Figure 7-8. BOP vs. VCC
6
5
4
3
2
6
5
4
3
2
VCC = 3V
VCC = 6V
VCC = 12V
TA = -40°C
TA = 25°C
TA = 125°C
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
5
7
Supply Voltage (V)
9
11
12
Figure 7-9. BRP vs. Temperature
Figure 7-10. BRP vs. VCC
4
3
2
1
0
4
3
2
1
0
VCC = 3V
VCC = 6V
VCC = 12V
TA = -40°C
TA = 25°C
TA = 125°C
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
5
7
Supply Voltage (V)
9
11
12
Figure 7-11. Hysteresis vs. Temperature
Figure 7-12. Hysteresis vs. VCC
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7.7.3 TMAG5124C and TMAG5124G
12
12
11
10
9
VCC = 3V
VCC = 6V
VCC = 12V
TA = -40°C
TA = 25°C
TA = 125°C
11
10
9
8
8
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
3
5
7
Supply Voltage (V)
9
11
12
Figure 7-13. BOP vs. Temperature
Figure 7-14. BOP vs. VCC
10
10
9
VCC = 3V
VCC = 6V
VCC = 12V
TA = -40°C
TA = 25°C
TA = 125°C
9
8
7
6
8
7
6
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
3
5
7
Supply Voltage (V)
9
11
12
Figure 7-15. BRP vs. Temperature
Figure 7-16. BRP vs. VCC
4
3
2
1
0
4
3
2
1
0
VCC = 3V
VCC = 6V
VCC = 12V
TA = -40°C
TA = 25°C
TA = 125°C
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
3
5
7
Supply Voltage (V)
9
11
12
Figure 7-17. Hysteresis vs. Temperature
Figure 7-18. Hysteresis vs. VCC
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7.7.4 TMAG5124D and TMAG5124H
17
16
15
14
13
17
TA = -40°C
TA = 25°C
TA = 125°C
VCC = 3V
VCC = 6V
VCC = 12V
16
15
14
13
3
5
7
Supply Voltage (V)
9
11
12
-40
-10
20
50
Ambient Temperature (°C)
80
110 125
Figure 7-20. BOP vs. VCC
Figure 7-19. BOP vs. Temperature
15
15
14
13
12
11
VCC = 3V
VCC = 6V
VCC = 12V
TA = -40°C
TA = 25°C
TA = 125°C
14
13
12
11
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
3
5
7
Supply Voltage (V)
9
11
12
Figure 7-21. BRP vs. Temperature
Figure 7-22. BRP vs. VCC
4
4
3
2
1
0
VCC = 3V
VCC = 6V
VCC = 12V
TA = -40°C
TA = 25°C
TA = 125°C
3
2
1
0
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
3
5
7
Supply Voltage (V)
9
11
12
Figure 7-23. Hysteresis vs. Temperature
Figure 7-24. Hysteresis vs. VCC
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7.7.5 Current Output Level
7.7.5.1 Low-Level Current Output for TMAG5124A/B/C/D
5
5
4
3
2
1
VCC = 3V
VCC = 6V
VCC = 12V
TA = -40°C
TA = 25°C
TA = 125°C
4
3
2
1
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
3
5
7
Supply Voltage (V)
9
11
12
Figure 7-25. ICC(L1) vs. Temperature
Figure 7-26. ICC(L1) vs. VCC
7.7.5.2 Low-Level Current Output for TMAG5124E/F/G/H
8
8
7
6
5
4
VCC = 3V
VCC = 6V
VCC = 12V
TA = -40°C
TA = 25°C
TA = 125°C
7
6
5
4
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
3
5
7
Supply Voltage (V)
9
11
12
Figure 7-27. ICC(L2) vs. Temperature
Figure 7-28. ICC(L2) vs. VCC
7.7.5.3 High-Level Current Output for Every Version
17
17
16
15
14
13
TA = -40°C
TA = 25°C
TA = 125C
VCC = 3V
VCC = 12V
VCC = 24V
16
15
14
13
-40
-10
20
Ambient Temperature (°C)
50
80
110 125
3
5
7
Supply Voltage (V)
9
11
12
Figure 7-29. ICC(H) vs. Temperature
Figure 7-30. ICC(H) vs. VCC
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8 Detailed Description
8.1 Overview
The TMAG5124-Q1 is a magnetic sensor with a current interface, also called 2-wire interface, that indicates
when the magnetic field threshold has been reached. A specific current level is generated depending on its
status. All versions have a high-current level of 14.5 mA. Version A to D have a low-current level of 3.5 mA while
version E to H have a low-current level of 6 mA.
The field polarity is defined as follows: a south pole near the marked side of the package has a positive magnetic
field. A north pole near the marked side of the package has a negative magnetic field.
The unipolar south configuration allows the hall sensor to only respond to a south pole. A strong magnetic field
of south polarity will cause the device to go into a low-current level (operate point, BOP), and a weaker magnetic
field will cause the device to go into a high-current level (release point, BRP). Hysteresis is included in between
the operate and release points, so magnetic field noise will not trip the device level accidentally.
The device does not have an output, therefore the magnitude of device supply current will indicate if the
magnetic field exceeds the threshold or not. A resistor can be placed before the VCC pin or after the GND pin
to transform the current into a voltage that can be read by a microcontroller. See Application and Implementation
for more information.
8.2 Functional Block Diagram
VCC
Chopper
stabilization
Threshold
selection
Current
configuration
LDO
Output
control
Z
Amp
∫
GND
Figure 8-1. Block Diagram
8.3 Feature Description
8.3.1 Field Direction Definition
Figure 8-2 shows that the TMAG5124-Q1 is sensitive to a south pole near the marked side of the package.
SOT-23 (DBZ)
B > 0 mT
N
S
Figure 8-2. Field Direction Definition
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8.3.2 Device Output
When the device is powered on and no magnetic field is applied, the output stays at ICC(H). If the magnetic field
increases above the BOP value, then the output turns to ICC(L). The output will remain at this value until the
magnetic field decreases to a field value smaller than the BRP threshold.
The ICC(H) for all TMAG5124x versions is between 12 mA to 17 mA. The ICC(L) option for the TMAG5124D
versions is ICC(L1), which is typically 3.5 mA, while The ICC(L) for the TMAG5124H versions is ICC(L2) and is
typically 6 mA.
ICC
BHYS
ICC (H)
ICC (L)
B
BRP
BOP
0 mT
Figure 8-3. Unipolar Functionality
8.3.3 Protection Circuits
The TMAG5124-Q1 device is protected against load dump and reverse polarity conditions.
8.3.3.1 Load Dump Protection
The TMAG5124-Q1 device operates at DC VCC conditions up to 38 V nominally, and can additionally withstand
VCC = 40 V. No current-limiting series resistor is required for this protection.
8.3.3.2 Reverse Polarity Protection
The TMAG5124-Q1 device is protected in the event that the VCC pin and the GND pin are reversed (up to –20
V).
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8.3.4 Power-On Time
Figure 8-4 shows the behavior of the device after the VCC voltage is applied and when the field is below the BOP
threshold. When the minimum value for VCC is reached, the TMAG5124-Q1 will take time tON to power up and
then time td to update the output to a high level.
Figure 8-5 shows the behavior of the device after the VCC voltage is applied and when the field is above the BOP
threshold. When the minimum value for VCC is reached, the TMAG5124-Q1 will take time tON to power up and
then time td to update the output to a high level.
The output value during tON is unknown in both cases. The output value during td will be set at high.
Supply (V)
Supply (V)
VCC
VCC
2.7V
0V
2.7V
0V
t (s)
t (s)
t (s)
t (s)
t (s)
t (s)
B (mT)
B (mT)
BOP
BRP
BOP
BRP
Output (V)
Output (V)
ICC(H)
ICC(H)
ICC(L)
ICC(L)
tON
tPD
tON
tPD
Figure 8-4. Power-On Time When B < BOP
Supply (V)
VCC
2.7V
0V
t (s)
B (mT)
BOP
BRP
t (s)
Output (V)
ICC(H)
ICC(L)
t (s)
tON
tPD
Figure 8-5. Power-On Time When B > BOP
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8.3.5 Hall Element Location
The sensing element inside the device is at the center of the package when viewed from the top. Figure 8-6
shows the position of the sensor inside the package.
0.55
0.65
1.55
1.67
0.73
0.57
Figure 8-6. Hall Element Location
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8.3.6 Propagation Delay
The TMAG5124-Q1 samples the Hall element at a nominal sampling interval of 12.5 µs to detect the presence of
a magnetic south pole. Between each sampling interval, the device calculates the average magnetic field applied
to the device. If this average value crosses the BOP or BRP threshold, the device changes the corresponding
level as defined in Figure 8-3. The hall sensor + magnet system is by nature asynchronous, therefore the
propagation delay (td) will vary depending on when the magnetic field goes above the BOP value. Figure 8-7
shows that the output delay also depends on when the magnetic field goes above the BOP value.
The first graph in Figure 8-7 shows the typical case. The magnetic field goes above the BOP value at the moment
the output is updated. The part will only require one sampling period of 12.5 µs to update the output.
The second graph in Figure 8-7 shows a magnetic field going above the BOP value just before half of the
sampling period. This is the best-case scenario where the output is updated in just half of the sampling period.
Finally, the third graph in Figure 8-7 shows the worst-case scenario where the magnetic field goes above the
BOP value just after half of the sampling period. At the next output update, the device will still see the magnetic
field under the BOP threshold and will require a whole new sampling period to update the output.
Magnetic Field
B7
Magnetic Field
B7
Magnetic Field
B7
B6
B6
B6
B5
B5
B5
BOP
B4
BOP
B4
BOP
B4
B3
B2
B1
B3
B2
B1
B3
B2
B1
t1
t2
t3
t4
t5
t6
t7
t8
t1
t2
t3
t4
t5
t6
t7
t8
t1
t2
t3
t4
t5
t6
t7
t8
Time
Time
Time
Output
Output
Output
ICC (H)
ICC (H)
ICC (H)
tdMin
tdTyp
tdMax
ICC (L)
ICC (L)
ICC (L)
Time
Time
Time
Figure 8-7. Field Sampling Timing
Figure 8-8 shows the TMAG5124-Q1 propagation delay analysis when a magnetic south pole is applied.
The Hall element of the TMAG5124-Q1 experiences an increasing magnetic field as a magnetic south pole
approaches the device, as well as a decreasing magnetic field as a magnetic south pole moves away. At time t1,
the magnetic field goes above the BOP threshold. The output will then start to move after the propagation delay
(td). This time will vary depending on when the sampling period is, as shown in Figure 8-7. At t2, the output start
pulling to the low current value. At t3, the output is completely pulled down to the lower current value. The same
process happens on the other way when the magnetic value is going under the BRP threshold.
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Magnetic Field
BOP
BRP
Time
Output
ICC (H)
ICC (L)
t1
t2 t3
t4
t5 t6
Time
td
td
tF
tR
Figure 8-8. Propagation Delay
8.3.7 Chopper Stabilization
The Basic Hall-effect sensor consists of four terminals where a current is injected through two opposite terminals
and a voltage is measured through the other opposite terminals. The voltage measured is proportional to the
current injected and the magnetic field measured. By knowing the current inject, the device can then know the
magnetic field strength. The problem is that the voltage generated is small in amplitude while the offset voltage
generated is more significant. To create a precise sensor, the offset voltage must be minimized.
Chopper stabilization is one way to significantly minimize this offset. It is achieved by "spinning" the sensor
and sequentially applying the bias current and measuring the voltage for each pair of terminals. This means
that a measurement is completed once the spinning cycle is completed. The full cycle is completed after four
measurements. The output of the sensor is connected to an amplifier and an integrator that will accumulate and
filter out a voltage proportional to the magnetic field present. Finally, a comparator will switch the output if the
voltage reaches either the BOP or BRP threshold (depending on which state the output voltage was previously
in).
The frequency of each individual measurement is referred as the Chopping frequency, or fCHOP. The total
conversion time is referred as the Propagation delay time, tPD, and is basically equal to 4/fCHOP. Finally, the
Signal bandwidth, fBW, represents the maximum value of the magnetic field frequency, and is equal to (fCHOP/4)/2
as defined by the sampling theorem.
8.4 Device Functional Modes
The device operates in only one mode when operated within the Recommended Operating Conditions.
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
The TMAG5124 is typically used in magnetic-field sensing applications to detect the proximity of a magnet. The
magnet is often attached to a movable component in the system.
The TMAG5124 is a Hall sensor that uses current as the signal of interest. Unlike voltage signals, current
signals are much more robust for common problems voltages face in electrical systems, such as voltage source
fluctuations and source impedance. A major factor that often leads to the choice of a current signal device is
immunity to loop impedance, meaning the signal is capable of being transmitted long distances with ease. To
accomplish this, the device requires a termination resistor at the end of the path for interfacing the reconstructed
voltage to an input, such as a comparator. Also, diagnostic tools are easily implemented, as disconnects in the
loop are easily detected due to a lack of signal.
9.2 Typical Applications
9.2.1 High-Side and Low-Side Typical Application Diagrams
C1
0.1 …F
Vcc
ECU
VSENSE
GND
VCC
TMAG5124
TEST
GND
Figure 9-1. Typical High-Side Sensing Diagram
C1
0.1 …F
Vcc
ECU
VSENSE
GND
TMAG5124
VCC
RSENSE
220ꢀ
GND
TEST
Figure 9-2. Typical Low-Side Sensing Diagram
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9.2.1.1 Design Requirements
For this design example, use the parameters listed in Table 9-1.
Table 9-1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
12 V
VCC
TMAG5124 Device
TMAG5124A1
1-cm Cube NdFeB (N45)
3 cm
Magnet
Minimum magnet distance
Magnetic flux density at closest distance
Magnetic flux density when magnet moves away
5.0 mT
Close to 0 mT
9.2.1.2 Detailed Design Procedure
When designing a digital-switch magnetic sensing system, three variables should always be considered: the
magnet, sensing distance, and threshold of the sensor.
The TMAG5124 device has a detection threshold specified by parameter BOP, which is the amount of magnetic
flux required to pass through the Hall sensor mounted inside the TMAG5124. To reliably activate the sensor,
the magnet must apply a flux greater than the maximum specified BOP. In such a system, the sensor typically
detects the magnet before it has moved to the closest position, but designing to the maximum parameter
ensures robust turn-on for all possible values of BOP. When the magnet moves away from the sensor, it must
apply less than the minimum specified BRP to reliably release the sensor.
Magnets are made from various ferromagnetic materials that have tradeoffs in cost, drift with temperature,
absolute maximum temperature ratings, remanence or residual induction (Br), and coercivity (Hc). The Br and the
dimensions of a magnet determine the magnetic flux density (B) it produces in 3-dimensional space. For simple
magnet shapes, such as rectangular blocks and cylinders, there are simple equations that solve B at a given
distance centered with the magnet.
Thickness
Thickness
Width
Distance
Distance
Diameter
S
N
Length
S
N
B
B
Figure 9-3. Rectangular Block and Cylinder Magnets
Use Equation 1 for the rectangular block shown in Figure 9-3:
≈
∆
’
÷
≈
∆
’
÷
≈
’
:
B =
Br
WL
WL
arctan∆
÷ - arctan
∆
∆
«
÷
÷
◊
∆
∆
«
÷
÷
◊
∆
÷
2D 4D2 + W2 + L2
2
p
2 D + T 4 D + T + W2 + L2
«
◊
(
)
(
)
(1)
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Use Equation 2 for the cylinder shown in Figure 9-3:
≈
∆
’
÷
:
B =
Br
2
D + T
2
D
-
∆
∆
«
÷
÷
◊
2
2
0.5C + D + T
0.5C + D2
(
)
(
)
(
)
(2)
where
•
•
•
•
•
W is width.
L is length.
T is thickness (the direction of magnetization).
D is distance.
C is diameter.
The Hall Effect Switch Magnetic Field Calculator is an online tool that uses these formulas available here:
http://www.ti.com/product/tmag5124.
All magnetic materials generally have a lower Br at higher temperatures. Systems should have margin to
account for this, as well as for mechanical tolerances.
For the TMAG5124A1, the maximum BOP is 5 mT. When choosing a 1-cm cube NdFeB N45 magnet, Equation 1
shows that this point occurs at 3 cm. This means that the magnet will activate the sensor if the design places the
magnet within 3 cm from the sensor during a "turn-on" event. If the magnet is pulled away from the device, the
magnetic field will go below the minimum BRP point and the device will return to its initial state.
9.2.1.3 Application Curve
60
55
50
45
40
35
30
25
20
15
10
5
0
1
1.5
2
2.5
3
Distance (cm)
3.5
4
4.5
5
D017
Figure 9-4. Magnetic Profile of a 1-cm Cube NdFeB Magnet
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10 Power Supply Recommendations
The TMAG5124-Q1 is powered from a DC power supply of 2.7 V to 38 V. A decoupling capacitor close to the
device must be used to provide local energy with minimal inductance. TI recommends using a ceramic capacitor
with a value of at least 0.01 µF.
10.1 Power Derating
The device is specified from –40°C to 150°C for a voltage rating of 2.7 V to 38 V. The part drains at its maximum
current of 17 mA, therefore the maximum voltage that can be applied to the device will depend on what
maximum ambient temperature is acceptable for the application. The curve in Figure 10-1 shows the maximum
acceptable power supply voltage versus the maximum acceptable ambient temperature.
Use Equation 3, Equation 4, and Equation 5 to populate the data shown in Figure 10-1:
TJ = TA + DT
(3)
where
•
•
•
TJ is the junction temperature.
TA is the ambient temperature.
ΔT is the difference between the junction temperature and the ambient temperature.
DT = PD ìRqJA
(4)
(5)
where
•
•
PD is the power dissipated by the part.
RθJA is the junction to ambient thermal resistance.
PD = VCCìICC
where
•
•
VCC is the voltage supply of the device.
ICC is the current consumption of the device.
Combining these equations gives Equation 6, which can be used to determine the maximum voltage the part can
handle in regards of the ambient temperature.
TJ max - TA
ICC max ìRqJA
VCC max
=
(6)
For example, if an application must work under an ambient temperature maximum of 100°C, and the TJ max, RθJA
and ICC max are the same values defined in the data sheet, then the maximum voltage allowed for this application
is calculated in Equation 7:
170èC -120èC
17 mA ì198.5èC / W
VCC max
=
= 14.82 V
(7)
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40
35
30
25
20
15
10
5
20
40
60
80
100
120
140
160
Ambient Temperature (°C)
Figure 10-1. Power Derating Curve
11 Layout
11.1 Layout Guidelines
The bypass capacitor should be placed near the TMAG5124-Q1 to reduce noise. The TEST pin must be
connected directly to the GND pin. It is good practice to connect the pins under the package to reduce the
connection length.
Generally, using PCB copper planes underneath the TMAG5124-Q1 device has no effect on magnetic flux and
does not interfere with device performance. This is because copper is not a ferromagnetic material. However, if
nearby system components contain iron or nickel, they may redirect magnetic flux in unpredictable ways.
11.2 Layout Example
VCC
GND
TEST
Figure 11-1. TMAG5124-Q1 Layout Example
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12 Device and Documentation Support
12.1 Documentation Support
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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11-Nov-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TMAG5124A1CEDBZRQ1
TMAG5124B1CEDBZRQ1
TMAG5124C1CEDBZRQ1
TMAG5124D1CEDBZRQ1
TMAG5124E1CEDBZRQ1
TMAG5124F1CEDBZRQ1
TMAG5124G1CEDBZRQ1
TMAG5124H1CEDBZRQ1
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3
3
3
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
SN
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
4A1Z
4B1Z
4C1Z
4D1Z
4E1Z
4F1Z
4G1Z
4H1Z
SN
SN
SN
SN
SN
SN
SN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2021
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMAG5124-Q1 :
Catalog : TMAG5124
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
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12-Nov-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMAG5124A1CEDBZRQ1 SOT-23
TMAG5124B1CEDBZRQ1 SOT-23
TMAG5124C1CEDBZRQ1 SOT-23
TMAG5124D1CEDBZRQ1 SOT-23
TMAG5124E1CEDBZRQ1 SOT-23
TMAG5124F1CEDBZRQ1 SOT-23
TMAG5124G1CEDBZRQ1 SOT-23
TMAG5124H1CEDBZRQ1 SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3
3
3
3000
3000
3000
3000
3000
3000
3000
3000
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
3.15
3.15
3.15
3.15
3.15
3.15
3.15
3.15
2.77
2.77
2.77
2.77
2.77
2.77
2.77
2.77
1.22
1.22
1.22
1.22
1.22
1.22
1.22
1.22
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Nov-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMAG5124A1CEDBZRQ1
TMAG5124B1CEDBZRQ1
TMAG5124C1CEDBZRQ1
TMAG5124D1CEDBZRQ1
TMAG5124E1CEDBZRQ1
TMAG5124F1CEDBZRQ1
TMAG5124G1CEDBZRQ1
TMAG5124H1CEDBZRQ1
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3
3
3
3000
3000
3000
3000
3000
3000
3000
3000
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
18.0
18.0
18.0
18.0
18.0
18.0
18.0
18.0
Pack Materials-Page 2
4203227/C
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.12 MAX
1.4
1.2
B
A
0.1 C
PIN 1
INDEX AREA
1
0.95
3.04
2.80
1.9
3
2
0.5
0.3
3X
0.10
0.01
(0.95)
TYP
0.2
C A B
0.25
GAGE PLANE
0.20
0.08
TYP
0.6
0.2
TYP
SEATING PLANE
0 -8 TYP
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
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EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214838/C 04/2017
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
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TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
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Copyright © 2021, Texas Instruments Incorporated
相关型号：
TMAG5124D1CQDBZR
TMAG5124 2-Wire, High-Precision, Hall-Effect Switch SensorWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
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