TMAG6180-Q1 [TI]
Automotive high-precision analog AMR angle sensor with 360° angle range;
| 型号： | TMAG6180-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Automotive high-precision analog AMR angle sensor with 360° angle range |
| 文件： | 总36页 (文件大小：1829K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TMAG6180-Q1
ZHCSQR5 –MARCH 2023
TMAG6180-Q1 汽车类高精度模拟AMR 360° 角度传感器
1 特性
3 说明
• 符合面向汽车应用的AEC-Q100 标准：
– 温度等级0：–40°C 至150°C
• 高精度高速AMR 角度传感器
TMAG6180-Q1 是一款基于异性磁阻 (AMR) 技术的高
精度角度传感器。该器件集成信号调节放大器，并提供
与所施加平面磁场的方向相关的差分正弦和余弦模拟输
出。该器件还在 X 轴和 Y 轴上具有两个独立的霍尔传
感器输出，可用于将传感器的角度范围扩展到360°。
– 角度误差：0.1°（典型值）
– 角度误差：0.6°（整个温度范围内的最大值）
– < 2µs 的超低延迟支持高达100krpm
– 360° 角度范围
TMAG6180-Q1 具有宽工作磁场，可极大地降低角度
精度对传感器和磁体之间气隙位置的依赖性。该器件在
正弦和余弦输出上具有超低延迟，可大大减少延迟相关
角度误差，非常适合高达 100krpm 转子位置检测等高
速应用。
• 在整个温度范围内无需校准
• 以功能安全合规型为目标：
– 专为功能安全应用开发
– 在发布量产版本时将会提供有助于使系统设计符
合ISO 26262 ASIL B 标准的文档
• 宽工作磁场范围20mT - 1T
• 温度补偿正弦和余弦差分模拟输出
• 支持差分端或单端应用
该器件集成了两个用于正交检测的开漏霍尔传感器输出
Q0 和 Q1，可将 AMR 传感器的范围从 180° 扩展到
360°。TMAG6180-Q1 支持绝对位置检测应用的单端
或差分模式。
• 快速启动时间：< 40µs
TMAG6180-Q1 提供广泛的诊断功能，可满足严格的
功能安全汽车和工业要求。该器件可在 -40°C 至
+150°C 的宽环境温度范围内保持稳定一致的性能，同
时具有超小的热漂移和寿命误差。
• 使用霍尔传感器的集成象限检测
– 将AMR 角度范围扩展至360°
– 可用于速度和方向
– 开漏数字输出
• 电源电压范围：2.7V 至5.5V
封装信息
封装尺寸（标称值）
器件型号
封装
2 应用
TMAG6180-Q1
VSSOP (8)
3.00mm × 3.00mm
• 电动助力转向
• 转向角传感器
• BLDC/PMSM 转子位置检测
• 电动自行车
• 雨刮器模块
• 传动器
Supply Voltage
2.7 to 5.5V
TMAG6180
VCC
Q0
Q1
0.1µF
• 伺服驱动器位置传感器
• 牵引电机
SIN_P
µController
SIN_N
COS_P
COS_N
TMAG6180
GND
应用方框图
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLYS037
TMAG6180-Q1
ZHCSQR5 –MARCH 2023
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Table of Contents
7.4 Device Functional Modes..........................................19
8 Application and Implementation..................................20
8.1 Application Information............................................. 20
8.2 Typical Application.................................................... 21
8.3 Power Supply Recommendations.............................27
8.4 Layout....................................................................... 27
9 Device and Documentation Support............................28
9.1 接收文档更新通知..................................................... 28
9.2 支持资源....................................................................28
9.3 Trademarks...............................................................28
9.4 静电放电警告............................................................ 28
9.5 术语表....................................................................... 28
10 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................4
6.5 Electrical Characteristics.............................................5
6.6 Magnetic Characteristics.............................................5
7 Detailed Description........................................................7
7.1 Overview.....................................................................7
7.2 Functional Block Diagram...........................................7
7.3 Feature Description.....................................................8
Information.................................................................... 28
10.1 Package Option Addendum....................................31
10.2 Tape and Reel Information......................................32
4 Revision History
DATE
REVISION
NOTES
March 2023
*
Initial release
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5 Pin Configuration and Functions
COS_P
GND
1
2
3
4
8
7
6
5
SIN_P
VCC
SIN_N
Q1
COS_N
Q0
Not to scale
图5-1. DGK Package 8-Pin VSSOP Top View
表5-1. Pin Functions
PIN
TYPE(1)
DESCRIPTION
NO.
NAME
1
COS_P
O
G
O
O
O
O
P
Differential cosine output (positive)
Ground reference
2
3
4
5
6
7
8
GND
COS_N
Q0
Differential cosine output (negative)
Quadrature 0 digital output (open drain)
Quadrature 1 digital output (open drain)
Differential sine output (negative)
Power supply
Q1
SIN_N
VCC
SIN_P
O
Differential sine output (positive)
(1) I = input, O = output, I/O = input and output, G = ground, P = power
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–10
–0.3
MAX
7
UNIT
V
VCC
IOUT
VOUT
BMAX
TJ
Main supply voltage
Output current (SIN_P, SIN_N, COS_P, COS_N, Q1, Q0)
Output voltage (SIN_P, SIN_N, COS_P, COS_N, Q1 ,Q0)
Magnetic flux density
10
7
mA
V
1
T
Junction temperature
170
150
°C
°C
–40
–65
Tstg
Storage temperature
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If
briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not
sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,
performance, and shorten the device lifetime.
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per AEC Q100-002(1)
±2000
HBM ESD classification level 2
V(ESD) Electrostatic discharge
V
Charged device model (CDM), per All pins
AEC Q100-011
CDM ESD classification level C4B
±500
±750
Corner pins (1, 4, 5, and 8)
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
2.7
NOM
MAX
UNIT
V
VCC
TA
CL
IL
Main supply voltage
5.5
150
10
Operating free air temperature
C
–40
0.1
Capacitive load on SIN_P, SIN_N, COS_P, COS_N
Current load on SIN_P, SIN_N, COS_P, COS_N
nF
mA
1
–1
6.4 Thermal Information
TMAG6180-Q1
DGK (VSSOP)
8 PINS
166.8
THERMAL METRIC(1)
UNIT
RθJA
RθJC(top)
RθJB
ΨJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
57.8
88.7
Junction-to-top characterization parameter
Junction-to-board characterization parameter
7.0
87.1
ΨJB
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
AMR Output Parameters
Single-ended output voltage peak to
peak
Vout
TA = 25°C
55
60
± 0.3
± 2
65 %VCC
%
Amplitude asynchronism ratio (Vpk
Cos/ Vpk Vsin)
k
Differential offset of SIN/COS outputs
at room
Voffset_room
Voffset_tc
B = 30 mT, TA = 25°C, VCC = 3.3 V
B = 30 mT, VCC = 3.3 V
mV
Temperature coefficient of differential
offset voltage
± 0.05
mV/ °C
VCM
Common-mode output voltage
Output referred noise (differential)
Series output resistance
50
0.5
55
%VCC
mVrms
Ω
VNOISE
Rout
B= 30 mT, Cload = 100 pF
Update rate of the automatic gain
control
tagc_update
1
s
DC Power
VVCC_UV
VVCC_OV
IACT
Undervoltage threshold at VCC
Overvoltage threshold at VCC
Active mode current from VCC
2.45
5.9
2.65
6.2
10
V
V
6.5
mA
To achieve 90% of output voltages
after VCC has reached final value
(Cload =100 pF)
ton_startup
Power-on time during Startup
38
45
µs
µs
Power-on time after SLEEPB goes
high
To achieve 90% of output voltages
after SLEEPB > VIH (Cload =100 pF)
ton_sleep
Digital I/O
VOL_Q
Low level output voltage
I =1 mA on Q0, Q1 pins
0
0.4
V
Hall sensor outputs
Change in BOP or BRP to change in
output
tpd
Propagation delay time per channel
10
µs
6.6 Magnetic Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Angular Performance
Angular error linearity across
temperature on continuous calibration
(gain / offset) (differential ended)
B=30 mT, VCC= 5V, Magnetic field
Rotation Speed = 1000 rpm
deg
0.4
ANGERR_DYN_DE
0.1
0.1
Angular error linearity across
temperature on continuous calibration
(gain / offset) (single ended)
B=30 mT, VCC= 5V, Magnetic field
Rotation Speed = 1000 rpm
deg
0.5
ANGERR_DYN_SE
Angular error linearity across
temperature after room temp
calibration (of offset / gain mismatch) alignment
(single ended)
B = 30 mT, VCC = 5V, Ideal magnet
ANGERR_RTCAL_SE
0.2
0.2
0.8
0.7
deg
deg
Angular error linearity across
temperature after room temp
calibration (of offset / gain mismatch) alignment
(differential ended)
B = 30 mT, VCC = 5V, Ideal magnet
ANGERR_RTCAL_DE
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MAX UNIT
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
Angular error linearity across
ANGERR_NOCAL_SE temperature with no calibration of
gain / offset (single ended)
B = 30 mT, VCC = 5V, Ideal magnet
alignment
0.6
1
deg
deg
Angular error linearity across
ANGERR_NOCAL_DE temperature with no calibration of
gain / offset (differential ended)
B = 30 mT, VCC = 5V, Ideal magnet
alignment
0.4
0.8
ANGLT_DRIFT
ANGHYST
Angle error lifetime drift
Angle hysteresis error
Orthogonolity Error
B = 30 mT
B = 30 mT
B = 30 mT
0.05
0.01
0.01
deg
deg
deg
ANGOE_ERR
Angular RMS (1-sigma) noise in
degrees
ANGNOISE
B = 30 mT, Cload = 100 pF
0.01
deg
tdel_amr
Propagation Delay time
3-dB Bandwidth
Cload = 100pF
Cload = 100pF
1.6
µs
BW3dB_amr
100
KHz
Magnetic Field Rotation Speed =
10000 rpm, Cload = 100pF
Phase error
0.15
deg
φerr
Hall sensor characteristics
BOP(X),BOP(Y)
BRP(X),BRP(Y)
BOP - BRP
BSYM_OP
Magnetic field operating point
3
–3
6
mT
mT
mT
mT
mT
mT
mT
Magnetic field release point
Magnetic hysteresis
Operating point symmetry
Operating point symmetry
Release point symmetry
Release point symmetry
±0.1
0
Bop(x) –Bop(y)
Bop(x) –Bop(y)
Brp(x) –Brp(y)
Brp(x) –Brp(y)
BSYM_OP
BSYM_RP
±0.1
0
BSYM_RP
Change in BOP or BRP to change in
output
tPD_HALL
Propagation delay time per channel
10
μs
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7 Detailed Description
7.1 Overview
The TMAG6180-Q1 is a high-precision angle sensor based on the AMR sensor technology vertically integrated
on top of the integrated amplifiers on silicon. The differential output sine and cosine signals from the AMR sensor
are proportional to the angle of the applied magnetic field. They are internally signal conditioned, temperature
compensated, and driven by differential output amplifiers with the ability to drive large capacitive loads. The
output voltages of the AMR sensor are ratiometric to the supply voltage to ensure the external ADC can use the
supply voltage as a reference.
TMAG6180-Q1 integrates X and Y Hall sensors to provide quadrature outputs on pins Q0 and Q1, respectively.
The Hall effect sensors are chopper stabilized, signal conditioned, and multiplexed to provide two digital latched
outputs. These outputs can be used to extend the angle sensing range of the AMR sensor from 180 degrees to
360 degrees.
The TMAG6180-Q1 contains the following functional and building blocks:
• The Power Management and Oscillators block contains internal regulators, biasing circuitry, a low-frequency,
wake-up oscillator and a high-frequency, wake-up oscillator, overvoltage detection circuitry, and undervoltage
detection circuitry
• The AMR sensor contains two Wheatstone bridges made of magnetic resistive sensors, each sensing one of
the components of the applied magnetic field, the sine and the cosine components.
• The AMR sensing path contains the signal conditioning amplifiers, offset compensation, automatic gain
control circuitry and the output drivers.
• The Quadrature Detection Path contains the X and Y Hall sensors, related biasing circuitry, signal
conditioning, logic comparators and digital logic to drive the Q1 and Q0 outputs
• The Internal memory block supports the factory-programmed values
• The diagnostic blocks support background diagnostic checks of the internal circuitry
7.2 Functional Block Diagram
Power
Management
Diagnostics
Clocks
Memory
COS_P
COS_N
Low pass Filter
(optional)
VCC
GND
Output
Driver
Analog
Front End
0.1µF
(minimum)
Low pass Filter
(optional)
Offset
compensation
Automatic Gain
Control
AMR Sensor
SIN_P
SIN_N
Low pass Filter
(optional)
Output
Driver
Analog
Front End
Low pass Filter
(optional)
Q0
Q1
Driver
Driver
Digital
Logic
Amp
MUX
X – Hall Sensor
Y – Hall Sensor
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7.3 Feature Description
7.3.1 Magnetic Flux Direction
The TMAG6180-Q1 is sensitive to the magnetic field component in X and Y directions. The X and Y fields are in-
plane with the package. The device will generate sine and cosine outputs from the AMR based on the reference
position (0o). See 图7-1.
By
(Sin)
Bin
Φ
0o
Bx
(Cos)
图7-1. Direction of Sensitivity
7.3.2 Sensors Location and Placement tolerances
图 7-2 shows the location of the AMR sensor and X, Y Hall elements and their placement tolerances inside the
TMAG6180-Q1.
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Top View
1.5 mm
AMR
sensor
0.93 mm
1.5 mm
centered
±25 µm
X
Y
Hall
sensors
Side View
0.38 mm
图7-2. Location of AMR sensor and Hall Elements
The center of the AMR and Hall sensors lie in the center of the package. 图 7-3 shows the tolerances of the die
rotation within the package . This causes a reference angle error (Φ) of ± 3o .
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Top View
Die
(typical placement)
Φ
Rotated Die
(Placement error)
图7-3. Die rotation tolerances in the package
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7.3.3 Magnetic Response
The AMR sensor has two components that are sensitive to the in-plane magnetic field X and Y axes parallel to
the chip surface. 节 7.3.3 shows the AMR sensor with the differential sine and cosine outputs SIN_P, SIN_N,
COS_P and COS_N. The outputs have an electrical range of 180 degrees. If the mechanical angle between the
sensor reference and the direction of the magnetic field is θ, then the AMR outputs correspond to cosine 2θ
and sine 2θ respectively. For every 360° rotation of the external magnetic field, the AMR outputs provide two
periods, at 180° sensing range for each period. Hence, for a dipole magnet rotating at speed of f, the electrical
output from the AMR sensor outputs can be at twice the frequency at 2f. Use 方程式 1 to calculate the angle of
the magnetic field is calculated using an arctangent2 function.
Vsin
arctan2
Vcos
θ =
(1)
2
where
• Vsin is the differential sine output
• Vcos is the differential cosine output
The AMR sensor is sensitive only to the direction of the magnetic field and has a wide operating magnetic field
range. The voltage levels of the AMR outputs are independent of the absolute flux density as long as the
magnetic flux density is above the minimum recommended operating fields.
Voltage (V)
VCC
Diagnostic Band
90% VCC
Vsin_p (max)
By (sin)
90o
Vout
SIN_P
COS_P
SIN_N
COS_N
θ
0o
VCM (VCC / 2
)
Bx (cos)
Vsin_p (min)
10% VCC
Diagnostic Band
180
Magnetic field angle (in degrees)
90
0
270
360
图7-4. AMR Sensor Outputs Magnetic Response
The two integrated Hall sensors X and Y that are sensitive to the in-plane X and Y axes similar to the AMR
sensor. 图 7-4 response shows both the Hall outputs reacting to the input field by going low when the field is
higher than operating point (BOP) and going high when the field is lower than returning point (BRP).
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Hall sensor output (VQ)
VQ (H)
BHYS
VQ (L)
B
South
North
BRP
BOP
图7-5. Hall Sensor Magnetic Response
For a rotating input magnetic field, with the X and Y components of BSIN and BCOS respectively, 图7-6 shows the
response of the AMR and Hall sensors. The integrated X and Y Hall sensors provide digital outputs (Q0 and Q1,
respectively). See the 节 7.2. The Hall sensors have a 360° compared to the 180° angle range of the AMR
sensors. By utilizing the digital outputs of the Hall sensors, the angle range of the AMR sensor can be extended
to 360°.
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Input Magnetic Field
(mT)
BSIN
BCOS
BOP
BRP
Time(s)
(V)
VSIN_P – VSIN_N
AMR outputs
VCOS_P – VCOS_N
Differential
output voltage
Time(s)
(V)
Y Hall output
Q1
Time(s)
X Hall output
Q0
Time(s)
图7-6. Magnetic Response of AMR and Hall sensors
7.3.4 Parameters Definition
7.3.4.1 AMR Output Parameters
The single-ended output signals SIN_P, SIN_N, COS_P and COS_N as shown in 图 7-4. They are ratiometric to
the supply voltage (VCC). The common-mode voltage (VCM) of the individual signals is half of the supply voltage
(VCC /2). For single-ended signals, VOUT is defined as the difference between the maximum and minimum output
voltage for a rotating magnetic field. Use 方程式2 to calculate VOUT_SIN_P
.
V
= V
− V
SIN_P min
(2)
OUT_SIN_P
SIN_P max
where
• VSIN_P (min) is the minimum output voltage across the full magnetic angle range
• VSIN_P (max) is the maximum output voltage across the full magnetic angle range
Typically, VOUT is around 60% of the supply voltage (VCC). The diagnostic band indicates that the output signals
are outside normal operating range and indicates a presence of fault.
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Voltage
VCC
Vcos_diff(max)
Vsin_diff(max)
Acos_diff
SIN_P – SIN_N
COS_P – COS_N
Voff_cos
0
Voff_sin
Asin_diff
Vcos_diff(min)
Vsin_diff(min)
- VCC
0
90
270
360
180
Magnetic field angle (in degrees)
图7-7. AMR Differential Ended Output Signals
The differential sine and cosine output signals shown in 图 7-7 are generated from the corresponding sine and
cosine single-ended outputs. Use 方程式3 and 方程式4 to calculate the differential voltages.
V
V
= V
− V
SIN_N
(3)
(4)
sin_diff
cos_diff
SIN_P
= V
− V
COS_N
COS_P
The offset of the differential signals is the average of the maximum and minimum voltages of the sine or cosine
signals. Use 方程式5 and 方程式6 to calculate the offsets for the sine and cosine signals.
V
+ V
2
sin_diff max
sin_diff min
V
V
=
=
(5)
(6)
offset_sin
offset_cos
V
+ V
2
cos_diff max
cos_diff min
For single-ended signals, the offset is the common-mode voltage (VCM).
Use 方程式7 to calculate the differential offset for sine and cosine channels at any given temperature, TA.
o
V
= V
* 1 + V
* T − 25 C
(7)
offset
offset, room
offset_TC
A
where
• VOffset_TCis the temperature drift coefficient of the offset
• VOffset_roomis the room temperature offset
Use 方程式8 and 方程式9 to calculate the amplitudes of the differential signals.
V
− V
sin_diff max
sin_diff min
A
=
(8)
sin_diff
2
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V
− V
cos_diff max
cos_diff min
A
=
(9)
cos_diff
2
Use 方程式10 to calculate the amplitude for single-ended signals.
V
− V
sin_p max
sin_p min
A
=
(10)
sin_p
2
Amplitude asynchronism refers to the amplitude mismatch error between sine and cosine channels. Use 方程式
11 to calculate the amplitude mismatch error.
A
cos_diff
k = 1 −
(11)
A
sin_diff
The sine and cosine output signals are typically out-of-phase by 90 degrees, but if an internal phase error occurs
owing to sensor and other on chip circuitry non-idealities, the sine and cosine outputs from the sensor can be
different than the ideal 90 degrees. This error is referred to as the orthogonality error. This error is defined as the
angle error between the zero crossing of the cosine output and maximum value of the sine outputs.
The hysteresis error ( ANGhyst) refers to the largest angle error difference between a clockwise rotation and a
counter-clockwise rotation.
For the AMR sensor, the orthogonality error and the hysteresis errors are negligible.
7.3.4.2 Transient Parameters
Propagation delay (tdel_amr) is defined as the time taken for signal to propagate from magnetic input change to
the sine and cosine AMR outputs. The bandwidth limitation of the internal signal conditioning amplifiers causes a
phase shift on the applied magnetic field. The propagation delay increases based on the speed of the rotating
field and it is specified at the maximum speed of the recommended magnetic field. 图7-8shows an input rotating
magnetic field and the response of the AMR outputs. The propagation delay leads in the signal path leads to a
phase error.
Angle of input
magnetic field (in deg)
tdel_amr
360o
φerr
Input magnetic angle
Measured magnetic angle
0o
Time(s)
(V)
SIN_P – SIN_N (ideal)
COS_P – COS_N (ideal)
SIN_P – SIN_N (measured)
COS_P – COS_N (measured)
AMR outputs
Differential
output voltage
Time(s)
图7-8. AMR Output Propagation Delay and Phase Error
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The phase error (φerr) refers to the angle error between the input magnetic field and output of the sensor. This
error increases with the speed of the rotating magnetic field and the propagation delay of the AMR sensor.
Typically this error can be compensated to the first order if the speed of the rotating magnetic field is known.
7.3.4.2.1 Power-On Time
The power-on time during startup (Ton_startup) is defined as the time it takes for the AMR outputs to reach to 90%
of their final value (under a constant magnetic field) after the VCC reaches VCC(min). 图 7-9 shows the power-on
time of the device during a VCC ramp.
VCC
VCC (MIN)
TON_STARTUP
time
SIN, COS outputs
90% VOUT_final
Invalid
time
图7-9. Power-On Time During Startup
7.3.4.3 Angle Accuracy Parameters
The overall angle error represents the relative angular error. 节 7.3.4.3 shows the deviation from the reference
line after zero angle definition..
180o
Ideal output
Measured Angle
(in degrees)
ANGERR
Measured data
0
180o
Magnetic Angle (in degrees)
图7-10. Angle Error
The uncalibrated angular error (ANGERR_NOCAL_DE) is defined as the maximum deviation from an ideal angle
without any offset and amplitude mismatch calibration for the VSIN and VCOS differential signals. For single-
ended signals, the uncalibrated angular error is denoted by ANGERR_NOCAL_SE
.
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The single point calibration angular error (ANGERR_RTCAL_DE) is defined as the maximum deviation from an ideal
angle after the offset calibration is applied to the VSIN and VCOS differential signals at room temperature
(25°C). For single-ended signals, the uncalibrated angular error is denoted by ANGERR_RTCAL_SE
.
The dynamic angular error (ANGERR_DYN) is defined as the maximum deviation from an ideal angle with the
continuous offset and gain calibration applied to the VSIN and VCOS differential signals. The error is measured
at 1 krpm and includes the phase error owing to the propagation delay of the AMR outputs.
7.3.4.4 Hall Sensor Parameters
The Hall sensors X and Y have factory-calibrated operating (BOP) and release points (BRP). The operating and
release points shown in 图7-4 give the magnetic hysteresis for each Hall sensor.
Use 方程式12 and 方程式13 to calculate the symmetry point for each axis.
B
= B
+ B
RP X
(12)
(13)
SYM X
OP X
where
• BOP (X) and BOP (X) represent the operating and release points for X Hall sensor
B
= B
+ B
OP Y RP Y
SYM Y
where
• BOP (Y) , BOP (Y) represent the operating and release points for Y Hall sensor
Use 方程式14 to calculate the operating point symmetry.
B
= B
− B
OP Y
(14)
(15)
SYM_OP
OP X
Use 方程式15 to calculate the release point symmetry.
B
= B
− B
SYM_RP
RP X RP Y
7.3.5 Automatic Gain Control (AGC)
To reduce the drift of the AMR sensor outputs across temperature, the TMAG6180-Q1 features an automatic
gain control circuitry where the device changes the gain of the output drivers to keep the final output within an
appropriate voltage range on SIN_P, SIN_N, COS_P and COS_N. The AGC block uses the square root of the
sum of the squared amplitudes of the two channels to sense amplitude of output signals and set gain selection.
This means that the AGC block will set the gain for sine and cosine channels such that the peak-to-peak
amplitude of single-ended voltages, VOUT is within the range listed in Specifications. The AGC block changes the
gain of both the sine and cosine channels simultaneously.
If the outputs are out of the normal operating range, the AGC block changes the gain of the sine and cosine
channels by a step size of ±1% VCC at an interval of tagc_update , typically around 1 second, as defined in
Specifications. 图 7-11 shows the differential AMR outputs for a continuously rotating input field. The shaded
area represents the ' No AGC Control ' band that represents ±5% of VCC and it is centered at 60% of VCC. Notice
that the AGC loop reduces the gain of the sine and cosine channels and updates the amplitude of the sine and
cosine signals when drift outside of the shaded region at a step size of 1% VCC. If the outputs remain within the
shaded region, then no action is taken by the AGC control loop.
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Angle of input
magnetic field (in deg)
360o
0o
Time (s)
AMR output Voltage (V)
tagc_update
± 5% Vcc
V = 1% Vcc
60% Vcc
No AGC control
Time (s)
0
No AGC control
-60% Vcc
± 5% Vcc
SIN_P – SIN_N
COS_P – COS_N
图7-11. Timing Diagram Showing the Operation of Automatic Gain Control
7.3.6 Safety and Diagnostics
The TMAG6180-Q1 supports several device and system level diagnostics features to detect, monitor, and report
failures during the device operation.
In the event of a failure, the TMAG6180-Q1 is placed in a FAULT state, where the outputs from the AMR sensors
are placed in a high-impedance state. As shown in Application and Implementation section, users can added
pullup or pulldown resistors on SIN_P, SIN_N, COS_P, COS_N pins at the termination site (that is the
microcontroller). The resistors are generally pulled up to supply voltage or pulled down to ground such that the
ADC code on MCU is out of expected range. This will signal fault to the microcontroller.
In the fault state, the digital outputs Q0 and Q1 are not driven internally by the device.
The TMAG6180-Q1 performs the following device and system level checks:
7.3.6.1 Device Level Checks
• AMR signal path checks
– AMR sensor bias check
– AMR output signals common-mode check
– Automatic gain control loop check
• Hall sensor signal path checks
– Hall sensor bias and resistance check
– Hall sensor comparator check
• Power management and supporting circuitry checks
– Internal LDO undervoltage check
– Internal clocks integrity check
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• Internal memory integrity check (or a cyclic redundancy check–CRC)
7.3.6.2 System Level Checks
• VCC undervoltage and overvoltage check
• Pin level opens and short checks
7.4 Device Functional Modes
7.4.1 Operating Modes
The TMAG6180-Q1 has primarily one mode of operation when all the conditions in the Recommended Operating
Conditions are met. When the part detects an internal fault, the device switches into a fault mode (safe state). 图
7-12 shows the state transition for TMAG6180.
VCC > VCC(min)
Fault goes away
Active mode
Safe State
Fault detected
图7-12. TMAG6180-Q1State Transition Diagram
7.4.1.1 Active Mode
The device starts powering up after the VCC supply crosses the minimum threshold as specified in the
Recommended Operating Conditions section, the TMAG6180-Q1 enters the active mode, in which the SIN_P,
SIN_N, COS_P and COS_N outputs actively provide the angle of the applied magnetic field. The average
current consumption during the active conversion is IACT
.
7.4.1.2 Fault Mode
The TMAG6180-Q1 supports extensive fault diagnostics as detailed in the Diagnostics section. When a fault is
detected, the part enters the fault mode. In this mode, the AMR outputs and the Q0 and Q1 Hall outputs are
placed in a high-impedance state.
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8 Application and Implementation
备注
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
8.1.1 Power Supply as the Reference for External ADC
The AMR output signals of the TMAG6180-Q1 are ratiometric to the supply voltage, VCC. This enables the
external ADC to use the TMAG6180-Q1 supply voltage as a reference and eliminate the errors that might arise if
a separate reference voltage is used. This also enables to optimize the external ADC input range. TI therefore
recommends to use the supply voltage (VCC) as the reference for the external ADCs. To ensure the noise on the
power supply is minimized, TI recommends using a 0.1-µF bypass capacitor.
8.1.2 AMR Output Dependence on Airgap Distance
The AMR sensor is only sensitive to the direction of the applied magnetic field along the X-Y plane parallel to the
chip surface. The applied magnetic field from a rotating magnet might vary based on the airgap distance
between the TMAG6180-Q1 and the magnet.
As long the absolute field magnetic field is above the minimum field listed in Recommended Operating
Conditions, the angle accuracy from the AMR outputs are independent of the value of the applied magnetic field.
8.1.3 Calibration of Sensor Errors
The TMAG6180-Q1 is factory-calibrated for best angular accuracy. Some of the electrical errors from the sensor
that impact the angle accuracy can be calibrated out for achieving the best performance. 图 8-1 shows the
impact of the different sensor error parameters such as offset, amplitude mismatch and orthogonality error on
the angle accuracy.
By
By
By
Bx
Bx
Bx
(c)
(a)
(b)
图8-1. Angle Accuracy Impact Owing to Sensor Electrical Errors (a) Offset Error (b) Amplitude Mismatch
Error (c) Orthogonality Error
Based on the parameters defined in 节7.3.4.1, use 方程式16 to calculate the angle from the AMR sensors.
A
A
sin 2θ + V
sin
offset_sin
arctan2
cos 2θ + V
cos
offset_cos
θ =
(16)
2
where
• Voffset_sin and Voffset_cos are the differential offsets of the sine and cosine outputs
• Asin and Acos are the differential amplitude of the sine and cosine outputs
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The impact of the angle accuracy owing to the orthogonality error and the hysteresis errors is negligible for the
TMAG6180-Q1 and can be ignored.
To calibrate the offset and amplitude mismatch errors, the magnetic field rotates over the entire range and the
sine and cosine outputs are sampled continuously to obtain the minimum and maximum values of the outputs.
Users can calculate the average of the minimum and maximum values of the respective outputs across the full
angle range to find the offset error of the sine and cosine outputs. Use 方程式 17 and 方程式 18 to calculate the
offset correction parameters for sine and cosine.
V
+ V
2
sin max
sin min
V
V
=
=
(17)
(18)
os_ sin_cal
os_ cos_cal
V
+ V
2
cos max
cos min
Users can calculate the difference of the minimum and maximum values of the respective outputs across the full
angle range to find the amplitude of the sine and cosine outputs. Use 方程式 19 to calculate the amplitude
correction parameters for sine and cosine.
V
V
− V
− V
sin max
sin min
cos min
A
= 1 −
(19)
corr
cos max
8.1.3.1 Offset error calibration
8.1.3.2 Amplitude mismatch calibration
8.2 Typical Application
The TMAG6180-Q1 AMR angle sensor can be used in either in single-ended output mode or differential output
mode. The TMAG6180-Q1 has the drive capability to either drive differential or single-ended SAR or Sigma
Delta ADCs. Typically, an external microcontroller processes the AMR output signals to extract the angular
position.
The differential-ended output mode is helpful to eliminate any common mode disturbances in the system. 图 8-2
shows a typical application circuit where the differential output signals SIN_P, SIN_N, COS_P and COS_N are
all connected to the four single-ended ADCs in the external microcontroller. If differential ADCs are available,
then they are typically recommended. The load capacitors and resistors must match each other to typically
achieve high accuracy. During sleep mode or when a fault is detected, the outputs are placed in high-impedance
state. To ensure that external microcontroller can detect this case, TI recommends using pulldown or pullup
resistors.
The TMAG6180-Q1 can drive capacitive loads up to 10 nF directly on the AMR output pins and, for a cable with
capacitances of 100 pF/m, the device can drive up to 100-m capacitive loads. With the ability to source and sink
currents up to 1 mA, the device can drive resistive loads.
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Supply Voltage
2.7 to 5.5V
(1)
(1)
Rpu
Rpu
µController
GPIO1
TMAG6180
VCC
Q0
Q1
GPIO2
0.1µF
Low pass Filter (3)
Low pass Filter (3)
Low pass Filter (3)
Low pass Filter (3)
SIN_P
ADC1
ADC2
SIN_N
ADC3
COS_P
GND
ADC4
COS_N
(2)
(2)
(2)
(2)
Rpu
Rpu
Rpu
Rpu
(1) 50K < Rpd < 500K (can be left floating if unused)
(2) 5K < Rpu < 1M (can be left floating if unused)
(3) Optional RC filter to reduce noise.
Filter time constant must be lesser than on speed of rotation
图8-2. Application Diagram for TMAG6180-Q1 in Differential-Ended Output Mode
If the number of ADC ports in the micro-controller are limited, or if the number of wires from the sensor to the
microcontroller must be kept to a minimum, TI recommends using the single-ended output mode. 图8-3 shows a
typical application circuit where only the positive output channels (SIN_P and COS_P) are connected to single-
ended ADCs. The unused output signals (SIN_N and COS_N) can be either left floating or connected to ground
through a high resistance. In single-ended output mode, the dynamic range (SNR) and noise immunity is
typically reduced compared to the differential output mode. To reduce noise on the outputs and for filtering EMC
disturbances, an external low-pass filter such as a first order RC network can be used. The bandwidth of the
external filter must be designed based on the rotation speed of the magnetic field to be detected. TI
recommends adding pullup or pulldown resistors to ground on the single-ended outputs (SIN_P and COS_P) to
ensure that their outputs are defined when the outputs are in high-impedance state. The supply voltage of the
sensor is used as the reference for the ADCs in the microcontroller.
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Supply Voltage
2.7 to 5.5V
(1)
(1)
Rpu
Rpu
µController
TMAG6180
VCC
Q0
GPIO1
GPIO2
ADC1
Q1
0.1µF
Low pass Filter (3)
SIN_P
(4)
SIN_N
ADC2
COS_P
Low pass Filter (3)
GND
(4)
COS_N
(2)
(2)
Rpu
Rpu
(1) 50K < Rpd < 500K (can be left floating if unused)
(2) 5K < Rpu < 1M (can be left floating if unused)
(3) Optional RC filter to reduce noise.
Filter time constant must be lesser than on speed of rotation
(4) Can be left floating or connected to ground through R > 100 K
图8-3. Application Diagram for TMAG6180-Q1 in Single-Ended Output Mode
8.2.1 Design Requirements
图8-4 shows the center of the magnet aligned with the center of the sensor in a typical on-axis application.
图8-4. On axis measurement setup for TMAG6180-Q1
Use the parameters listed in 表8-1 for this design example
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表8-1. Design Parameters
DESIGN PARAMETERS
ON-AXIS MEASUREMENT
VCC
5 V
Cylinder: 4.7625-mm diameter, 12.7-mm thick, neodymium N52, Br =
1480
Magnet
Output mode
Differential-ended
8,000 RPM
<1°
Maximum speed of the motor
Desired Angle error across temperature
Magnet to sensor placement
End of shaft
8.2.2 Detailed Design Procedure
For accurate angle measurement, the center of the magnet is aligned to the center of the sensor with acceptable
tolerances. Follow these steps to ensure that the sensor is calibrated for best accuracy:
• Reference angle calibration - Set the reference angle based on the magnet alignment to the sensor. This
error can be saved in the microcontroller for runtime absolute position calculation. This error is also known as
Angle offset in a system.
• Electrical offset calibration - See Calibration of Sensor Errors for the offset calibration procedure. If the sensor
cannot be rotated across the full range, then the electrical offsets cannot be calibrated.
• Amplitude mismatch calibration - See Calibration of Sensor Errors for the amplitude mismatch calibration
procedure. If the sensor cannot be rotated across the full range, then the amplitude mismatch cannot be
calibrated.
• To extend the angle range from the AMR sensor to 360 degrees, see Extending the Angle Range to 360
Degrees
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8.2.2.1 Extending the Angle Range to 360 Degrees
Input Magnetic
Field (BIN) (mT)
BSIN
BCOS
BOP
BRP
Angle (deg)
(V)
VSIN_P – VSIN_N
AMR outputs
VCOS_P – VCOS_N
Differential
output voltage
Angle (deg)
(V)
Y Hall output
Q1
Angle (deg)
X Hall output
Q0
Angle (deg)
Angle (deg)
Q1_Q0
11
00
10
01
0
360
90
270
180
Magnetic field angle (AbsAngle)
(in degrees)
图8-5. Magnetic Response for a 360° Input Field
图 8-5 shows the response of the differential-ended AMR output signals and the Hall outputs (Q1, Q0) for a 360°
input magnetic field (BIN).
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An example code for extending the angle range from 180 degrees to 360 degrees using the Q0, Q1 outputs is
given below ;
MeasuredAngle = arctan2(SIN, COS)/2 ; //0-180° angle range , Multiply by 180/Pi if
the angle is returned in radians
MeasuredAngle = 90 - MeasuredAngle // If arctan2 function returns from -90deg to
90deg angle range, then use this to convert to 0-180° angle range
if (MeasuredAngle is between 45°–135°) then
(
if (Q1_Q0 is 00b or 10b) then //around 90°
AbsAngle = MeasuredAngle ;
else //Q1_Q0 is 11b or 01b, around 270°
AbsAngle = MeasuredAngle + 180°;
)
else //MeasuredAngle is 0°–45° or 135°-180°
(
if (Q1_Q0 is 00b or 01b) then //around 0°
(
if (MeasuredAngle ≥ 135°) then
AbsAngle = MeasuredAngle + 180°;
else
//MeasuredAngle is 0-45°
AbsAngle = MeasuredAngle;
)
else
//2Digital is 10b or 11b, around 180°
(
if (MeasuredAngle ≥ 135°) then
AbsAngle = MeasuredAngle;
else
//MeasuredAngle is 0-45°)
AbsAngle = MeasuredAngle + 180°;
)
)
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8.3 Power Supply Recommendations
A decoupling capacitor close to the device must be used to provide local energy with minimal inductance. TI
recommends using a ceramic capacitor with a value of at least 0.1 µF.
8.4 Layout
8.4.1 Layout Guidelines
Magnetic fields pass through most nonferromagnetic materials with no significant disturbance. Embedding
magnetic sensors within plastic or aluminum enclosures and sensing magnets on the outside is common
practice. Magnetic fields also easily pass through most printed circuit boards (PCBs), which makes placing the
magnet on the opposite side of the PCB possible.
8.4.2 Layout Example
COS_P
GND
SIN_P
0.1uF (min)
VCC
SIN_N
COS_N
Q0
Q1
图8-6. Layout Example With TMAG6180-Q1
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9 Device and Documentation Support
9.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
9.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
9.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
9.4 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
9.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
10 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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10.1 Package Option Addendum
Packaging Information
Device
Orderable
Device
Package
Type
Package
Drawing
Package
Qty
Eco
Lead/Ball MSL Peak Op Temp
Status(1)
Pins
Marking(4)
Plan(2)
Finish(6)
Temp(3)
(°C)
(5)
PTMAG61 ACTIVE
80A0DGK
VSSOP
DGK
8
2500
Call TI
Call TI
Call TI
-40 to 150
RQ1
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using
this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please
check www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS
requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where
designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the
die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free
(RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based
flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will
appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device
Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line.
Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis
on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other
limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold
by TI to Customer on an annual basis.
Copyright © 2023 Texas Instruments Incorporated
Submit Document Feedback
31
Product Folder Links: TMAG6180-Q1
English Data Sheet: SLYS037
TMAG6180-Q1
ZHCSQR5 –MARCH 2023
www.ti.com.cn
10.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
PTMAG6180A0DGKRQ1
VSSOP
DGK
8
2500
330
12.4
5.3
3.4
1.4
8
12
Q1
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SLYS037
32
Submit Document Feedback
Product Folder Links: TMAG6180-Q1
TMAG6180-Q1
ZHCSQR5 –MARCH 2023
www.ti.com.cn
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
PTMAG6180A0DGKRQ1
Package Type
Package Drawing Pins
DGK
SPQ
Length (mm) Width (mm)
366 364
Height (mm)
VSSOP
8
2500
50
Copyright © 2023 Texas Instruments Incorporated
Submit Document Feedback
33
Product Folder Links: TMAG6180-Q1
English Data Sheet: SLYS037
PACKAGE OPTION ADDENDUM
www.ti.com
2-Apr-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
PTMAG6180A0DGKRQ1
ACTIVE
VSSOP
DGK
8
2500
TBD
Call TI
Call TI
-40 to 150
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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