TMP122 [TI]
2C Accurate Digital Temperature Sensor with SPI Interface; 2C精确的数字温度传感器，具有SPI接口
| 型号： | TMP122 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 2C Accurate Digital Temperature Sensor with SPI Interface |
| 文件： | 总10页 (文件大小：129K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TMP125
SBOS323 − DECEMBER 2004
2°C Accurate Digital Temperature Sensor
with SPI Interface
FD EATURES
DESCRIPTION
DIGITAL OUTPUT: SPI-Compatible Interface
The TMP125 is an SPI-compatible temperature sensor
available in the tiny SOT23-6 package. Requiring no
external components, the TMP125 is capable of
measuring temperatures within 2°C of accuracy over a
temperature range of −25°C to +85°C and 2.5°C of
accuracy over −40°C to +125°C. Low supply current, and
a supply range from 2.7V to 5.5V, make the TMP125 an
excellent candidate for low-power applications.
D
D
RESOLUTION: 10-Bit, 0.25°C
ACCURACY:
2.0°C (max) from −25°C to +85°C
2.5°C (max) from −40°C to +125°C
D
D
D
D
LOW QUIESCENT CURRENT: 50µA (max)
WIDE SUPPLY RANGE: 2.7V to 5.5V
TINY SOT23-6 PACKAGE
The TMP125 is ideal for extended thermal measurement
in a variety of communication, computer, consumer,
OPERATION FROM −40°C to +125°C
environmental,
applications.
industrial,
and
instrumentation
AD PPLICATIONS
BASE STATION EQUIPMENT
D
COMPUTER PERIPHERAL THERMAL
PROTECTION
Temperature
Diode
Temp.
Sensor
D
D
D
D
NOTEBOOK COMPUTERS
DATA ACQUISITION SYSTEMS
TELECOM EQUIPMENT
OFFICE MACHINES
Control
Logic
GND
1
2
3
SO
6
5
4
∆Σ
A/D
Converter
Serial
Interface
SI
CS
TMP125 RELATED PRODUCTS
FEATURES
Config.
and Temp.
Register
PRODUCT
TMP100/101
TMP75/175
TMP121/123
TMP122/124
V+
OSC
SCK
2°C Digital Temp Sensors with Two-Wire Interface
1.5°C Digital Temp Sensors with Two-Wire Interface
1.5°C Digital Temp Sensors with SPI
TMP125
1.5°C Programmable Digital Temp Sensors with SPI
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI is a registered trademark of Motorola. All other trademarks are the property of their respective owners.
ꢀꢁ ꢂ ꢃꢄ ꢅ ꢆꢇ ꢂꢈ ꢃ ꢉꢆꢉ ꢊꢋ ꢌꢍ ꢎ ꢏꢐ ꢑꢊꢍꢋ ꢊꢒ ꢓꢔ ꢎ ꢎ ꢕꢋꢑ ꢐꢒ ꢍꢌ ꢖꢔꢗ ꢘꢊꢓ ꢐꢑꢊ ꢍꢋ ꢙꢐ ꢑꢕꢚ ꢀꢎ ꢍꢙꢔ ꢓꢑꢒ
ꢓ ꢍꢋ ꢌꢍꢎ ꢏ ꢑꢍ ꢒ ꢖꢕ ꢓ ꢊ ꢌꢊ ꢓ ꢐ ꢑꢊ ꢍꢋꢒ ꢖ ꢕꢎ ꢑꢛꢕ ꢑꢕ ꢎ ꢏꢒ ꢍꢌ ꢆꢕꢜ ꢐꢒ ꢇꢋꢒ ꢑꢎ ꢔꢏ ꢕꢋꢑ ꢒ ꢒꢑ ꢐꢋꢙ ꢐꢎ ꢙ ꢝ ꢐꢎ ꢎ ꢐ ꢋꢑꢞꢚ
ꢀꢎ ꢍ ꢙꢔꢓ ꢑ ꢊꢍ ꢋ ꢖꢎ ꢍ ꢓ ꢕ ꢒ ꢒ ꢊꢋ ꢟ ꢙꢍ ꢕ ꢒ ꢋꢍꢑ ꢋꢕ ꢓꢕ ꢒꢒ ꢐꢎ ꢊꢘ ꢞ ꢊꢋꢓ ꢘꢔꢙ ꢕ ꢑꢕ ꢒꢑꢊ ꢋꢟ ꢍꢌ ꢐꢘ ꢘ ꢖꢐ ꢎ ꢐꢏ ꢕꢑꢕ ꢎ ꢒꢚ
Copyright 2004, Texas Instruments Incorporated
www.ti.com
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SBOS323 − DECEMBER 2004
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
(1)
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7V
handledwith appropriate precautions. Failure to observe
(2)
proper handling and installation procedures can cause damage.
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3V to +7V
Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
(3)
Output Short Circuit
. . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Operating Temperature Range . . . . . . . . . . . . . . . −55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . . . . . −60°C to +150°C
Junction Temperature (T max) . . . . . . . . . . . . . . . . . . . . . . +150°C
J
Lead Temperature (soldering) . . . . . . . . . . . . . . . . . . . . . . . . +300°C
ESD Rating (Human Body Model) . . . . . . . . . . . . . . . . . . . . 4000V
(Charged Device Model) . . . . . . . . . . . . . . . . . 1000V
(1)
Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2)
(3)
Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.5V beyond the supply
rails should be current limited to 10mA or less.
Short-circuit to ground.
(1)
ORDERING INFORMATION
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
TMP125
SOT23-6
DBV
T125
(1)
For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
PIN CONFIGURATION
Top View
TMP125
1
2
3
GND
SI
6
5
4
SO
CS
V+
SCK
SOT23−6
NOTE: Pin 1 is determined by orienting
the package marking as shown.
2
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SBOS323 − DECEMBER 2004
ELECTRICAL CHARACTERISTICS
At T = −40°C to +125°C and V = +2.7V to 5.5V, unless otherwise noted.
A
S
TMP125
TYP
PARAMETER
CONDITIONS
MIN
MAX
UNIT
TEMPERATURE INPUT
Range
−40
+125
2.0
°C
°C
Accuracy (temperature error)
−25°C to +85°C
−40°C to +125°C
0.5
1.0
10
2.5
°C
Resolution
Bits
LSB
Temperature Measurement Noise
DIGITAL INPUT/OUTPUT
Input Logic Levels:
0.1
V
V
0.7(V+)
(V+)−0.4
2.7
V
V
IH
0.3(V+)
1
IL
Input Current, SI, SCK, CS
Output Logic Levels:
I
0V = V = V+
IN
µA
IN
V
V
SO
SO
I
= 3mA
0.4
V
OL
SINK
I
= 2mA
V
OH
SOURCE
Input Capacitance, SI, SCK, CS
Conversion Time
2.5
60
pF
ms
ms
10-Bit
Update Rate
120
POWER SUPPLY
Operating Range
5.5
50
60
1
V
Quiescent Current, at T = 25°C
I
Serial Bus Inactive
36
µA
µA
µA
µA
A
Q
over Temperature
Shutdown Current
over Temperature
TEMPERATURE RANGE
Specified Range
−40°C to +125°C
0.1
1
−40
−55
−60
+125
+125
+150
°C
°C
Operating Range
Storage Range
°C
Thermal Resistance
q
JA
SOT23-6 Surface-Mount
200
°C/W
3
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SBOS323 − DECEMBER 2004
TYPICAL CHARACTERISTICS
At T = −40°C to +125°C and V = +2.7V to 5.5V, unless otherwise noted.
A
S
CONVERSION TIME vs TEMPERATURE
VS = 5.5V
QUIESCENT CURRENT vs TEMPERATURE
80
75
70
65
60
55
50
45
40
45
40
35
30
25
20
VS = 5.5V
Active Conversion
Serial Bus Inactive
5 Typical Units Shown
−
−
−
15
−
−
−
55
35
5
25
45
65
85
105 125
55
35
15
5
25
45
65
85
105 125
_
_
Temperature ( C)
Temperature ( C)
TEMPERATURE ACCURACY vs TEMPERATURE
2.0
1.5
1.0
0.5
0.0
0.5
1.0
1.5
2.0
−
−
−
−
−
−
−
15
55
35
5
25
45
65
85
105 125
_
Temperature ( C)
4
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SBOS323 − DECEMBER 2004
the shift register and clocked out at SO on the falling SCK
edge. The 16-bit data word is clocked out sign bit first,
followed by the MSB. Any portion of the 16-bit word can be
read before raising CS. However, all 16 bits must be
clocked to allow shutdown of the TMP125. The TMP125
typically requires 60ms to complete a conversion, with
results updated every 120ms.
APPLICATIONS
The TMP125 10-bit, read-only digital temperature sensor
is optimal for thermal management and thermal protection
applications. The TMP125 is specified for a temperature
range of −40°C to +125°C, with operation extending down
to −55°C. It is specified for a supply voltage range of 2.7V
to 5.5V, and also features a hardware shutdown to provide
power savings. Quiescent current is reduced to 1µA during
analog shutdown.
The TMP125 will go into idle mode for 60ms, requiring only
20µA of current. A new conversion begins every 120ms.
Figure 2 describes the conversion timing for the TMP125.
The TMP125 communicates through a serial interface that
is SPI-compatible. Temperature is converted to a 10-bit
data word with 0.25°C resolution. The TMP125 is optimal
for low power applications, with a 120ms conversion
period for reduced power consumption.
TEMPERATURE REGISTER
The Temperature Register of the TMP125 is a 16-bit,
read-only register that stores the output of the most recent
conversion. However, temperature is represented by only
10-bits, which are in signed two’s complement format. The
first bit of the Temperature Register, D15, is a leading zero.
Bits D14 and D5 are used to indicate temperature. Bits D4
to D0 are the same as D5. (See Table 1.) Data format for
temperature is summaraized in Table 2. When calculating
the signed two’s complement temperature value, be sure
to use only the 10 data bits.
The sensing device of the TMP125 is the chip itself.
Thermal paths run through the package leads as well as
the plastic package, and the lower thermal resistance of
metal causes the leads to provide the primary thermal
path.
The TMP125 requires no external components for
operation, though a 0.1µF supply bypass capacitor is
recommended. Figure 1 shows typical connection for the
TMP125.
Following power-up or reset, the Temperature Register will
read 0°C until the first conversion is complete.
D15
D14
D13
D12
D11
D10
D9
D8
0
T9
T8
T7
T6
T5
T4
T3
D7
D6
D5
D4
D3
D2
D1
D0
V+
T2
T1
T0
T0
T0
T0
T0
T0
Table 1. Temperature Register
µ
0.1 F
TEMPERATURE
DIGITAL OUTPUT
D14...D5
3
TMP125
1
(°C)
2
5
SCK
SO
SI
4
6
+127
+125
+100
+75
01 1111 1100
01 1111 0100
01 1001 0000
01 0010 1100
00 1100 1000
00 0110 0100
00 0010 1000
00 0000 0001
00 0000 0000
11 1111 1111
11 1001 1100
11 0011 1000
11 0010 0100
CS
+50
+25
+10
+0.25
0
Figure 1. Typical Connections for the TMP125
COMMUNICATING WITH THE TMP125
The TMP125 continuously converts temperatures to
digital data. Temperature data is read by pulling CS low.
Once CS is pulled low, temperature data from the last
completed conversion prior to dropping CS is latched into
−0.25
−25
−50
−55
Table 2. Temperature Data Format
5
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SBOS323 − DECEMBER 2004
Timing Diagrams
The TMP125 is SPI-compatible. Figure 3 describes the
output data of the TMP125. Figure 4, Figure 5, and
Figure 6 describe the various timing requirements, with
parameters defined in Table 3.
0.5s
0.25s
µ
50 A (active)
PARAMETER
MIN
100
20
MAX UNITS
µ
20 A (idle)
SCK Period
t
t
t
t
t
t
t
ns
ns
1
2
3
4
5
6
7
Data In to Rising Edge SCK Setup Time
SCK Falling Edge to Output Data Delay
SCK Rising Edge to Input Data Hold Time
CS to Rising Edge SCK Set-Up Time
CS to Output Data Delay
30
ns
ns
ns
ns
ns
20
40
30
30
CS Rising Edge to Output High Impedance
Figure 2. Conversion Time and Period
Table 3. Timing Description
CS
SCK
Leading
Zero
T9
T8
T7
T6
T5
T4
T3
T2
T1
T0
T0
T0
T0
T0
T0
SO
SI
Don’t
Care
Don’t
Care
Power
Down
Figure 3. Data READ
SCK
SCK
t2
t2
t4
t4
CS
SO
CS
SO
Figure 4. Input Data Timing Diagram
6
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SBOS323 − DECEMBER 2004
SCK
t5
t1
t3
CS
SO
t6
Figure 5. Output Data Timing Diagram
SCK
SCK
CS
CS
SI
t7
t7
SI
Figure 6. High Impedance Output Timing Diagram
7
PACKAGE OPTION ADDENDUM
www.ti.com
11-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TMP125AIDBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TMP125AIDBVRG4
TMP125AIDBVT
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
6
6
3000
None
Call TI
Call TI
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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