TMP235A2DBZR [TI]
10mV/C、1C 模拟温度传感器 | DBZ | 3 | -40 to 150;
| 型号： | TMP235A2DBZR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 10mV/C、1C 模拟温度传感器 | DBZ | 3 | -40 to 150 温度传感 传感器 温度传感器 |
| 文件： | 总26页 (文件大小：1065K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TMP235, TMP236
ZHCSH80E –SEPTEMBER 2017–REVISED MAY 2019
TMP23x 低功耗高精度模拟输出温度传感器
1 特性
•
•
工厂自动化和控制
测试和测量
1
•
•
具有成本效益的热敏电阻替代产品
在宽温度范围内具有高精度：
3 说明
–
±2.5°C（最大值）：–40°C 至 +150°C
TMP23x 器件是一系列精密 CMOS 集成电路线性模拟
温度传感器，其输出电压与温度成正比，工程师可以将
其用于多种模拟温度检测 应用。这些温度传感器比市
面上同类引脚兼容器件的精确度更高，在 0°C 至
+70°C 温度范围内 ±0.5°C 的典型精度。该系列器件的
精度经提高后，可适用于众多模拟温度检测 应用。
TMP235 器件在 –40°C 至 +150°C 完全温度范围和
2.3V 至 5.5V 电源电压范围内提供 10mV/°C 正斜率输
出。具有更高增益的 TMP236 传感器在 –10°C 至
+125°C 温度范围和 3.1V 至 5.5V 电源电压范围内提供
19.5mV/°C 正斜率输出。
(TMP235)
–
±2.5°C（最大值）：–10°C 至 +125°C
(TMP236)
•
•
•
提供两种精度级别型号：
–
–
A2 级：±0.5°C（典型值）
A4 级：±1°C（典型值）
正斜率传感器增益，失调电压（典型值）：
–
–
10mV/°C，0°C 下 500mV (TMP235)
19.5mV/°C，0°C 下 400mV (TMP236)
宽工作电源电压范围：
–
–
2.3V 至 5.5V (TMP235)
3.1V 至 5.5V (TMP236)
9μA 典型静态电流和 800µs 典型加电时间可实现有效
的功率循环架构，以最大限度地降低电池供电设备的功
率损耗。AB 类输出驱动器提供强大的 500µA 最高输
出，可驱动高达 1000pF 的电容负载，并可直接连接到
模数转换器采样保持输入端。凭借出色的精确度和强大
的线性输出驱动器，TMP23x 模拟输出温度传感器是
具有成本效益的无源热敏电阻替代方案。
•
•
•
•
输出短路保护
低功耗：9μA（典型值）
输出强大，可驱动高达 1000pF 的负载
提供的封装选项：
–
–
–
5 引脚 SC70 (DCK) 表面贴装
3 引脚 SOT-23 (DBZ) 表面贴装
封装尺寸兼容符合行业标准的 LMT8x-Q1 和
LM20 温度传感器
器件信息(1)
器件型号
TMP235，
TMP236
封装
SC70 (5)
SOT-23 (3)
封装尺寸（标称值）
2.00mm × 1.25mm
2.92mm × 1.30mm
2 应用
•
•
•
电网基础设施
(1) 如需了解所有可用封装，请参阅产品说明书末尾的可订购产品
附录。
无线和电信基础设施
汽车信息娱乐系统
功能方框图
输出电压与环境温度间的关系
3
VDD
2.5
2
Thermal Diodes
1.5
1
VOUT
0.5
TMP235
TMP236
0
-50
GND
-25
0
25
50
75
100
125 150
TA (èC)
D003
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SBOS857
TMP235, TMP236
ZHCSH80E –SEPTEMBER 2017–REVISED MAY 2019
www.ti.com.cn
目录
7.4 Device Functional Modes........................................ 10
Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Application .................................................. 11
Power Supply Recommendations...................... 12
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 6
Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 8
8
9
10 Layout................................................................... 12
10.1 Layout Guidelines ................................................. 12
10.2 Layout Examples................................................... 12
11 器件和文档支持 ..................................................... 13
11.1 相关链接................................................................ 13
11.2 接收文档更新通知 ................................................. 13
11.3 社区资源................................................................ 13
11.4 商标....................................................................... 13
11.5 静电放电警告......................................................... 13
11.6 Glossary................................................................ 13
12 机械、封装和可订购信息....................................... 13
7
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision D (August 2018) to Revision E
Page
•
•
Changed recommended operating temperature range from: –50°C to 150°C to: –40°C to 150°C ....................................... 4
Changed power supply bypassing recommendations on how to avoid noise effect on the device output .......................... 12
Changes from Revision C (August 2018) to Revision D
Page
•
将 DBZ (SOT-23) 封装状态从预览更改为生产数据 ................................................................................................................ 1
Changes from Revision B (February 2018) to Revision C
Page
•
•
•
添加了 DBZ (SOT-23) 预览封装 ............................................................................................................................................ 1
Added TMP236 test conditions to the operating current parameters..................................................................................... 5
Added SOT-23 and SC70 package test conditions to the Accuracy Level 2 (A2) limits in the 0℃ to 70℃ range ................ 5
Changes from Revision A (December 2017) to Revision B
Page
•
•
•
•
已更改 将典型精度规格参考值从 ±1°C 和 ±2°C 更改为 ±0.5°C 和 ±1°C................................................................................ 1
Deleted erroneous AOQL footnote......................................................................................................................................... 5
Changed specification limits indicated in 图 1........................................................................................................................ 6
Added Device Functional Modes section ............................................................................................................................ 10
Changes from Original (September 2017) to Revision A
Page
•
已更改 将文档状态从“预告信息”更改成了“生产数据” .............................................................................................................. 1
2
Copyright © 2017–2019, Texas Instruments Incorporated
TMP235, TMP236
www.ti.com.cn
ZHCSH80E –SEPTEMBER 2017–REVISED MAY 2019
5 Pin Configuration and Functions
DBZ Package
3-Pin SOT-23
Top View
DCK Package
5-Pin SC70
Top View
1
NC
GND
VOUT
1
2
3
5
NC
VDD
3
GND
2
4
VDD
VOUT
Not to scale
Not to scale
NC- no internal connection
Pin Functions
PIN
NAME
TYPE
DESCRIPTION
SOT-23
SC70
GND
NC
3
—
—
2
2
5
1
3
4
Ground
Power supply ground.
—
—
O
I
No internal connection. This pin may be left floating or connected to GND.
No internal connection. This pin may be left floating or connected to GND.
Outputs voltage proportional to temperature
NC
VOUT
VDD
1
Positive supply input
Copyright © 2017–2019, Texas Instruments Incorporated
3
TMP235, TMP236
ZHCSH80E –SEPTEMBER 2017–REVISED MAY 2019
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply voltage, VDD
Output voltage, VOUT
Output current
+6
V
–0.3 (VDD + 0.3)
–30
+30
+200
+150
+150
mA
°C
Latch-up current, each pin
Junction temperature (TJ)
–200
Storage temperature (Tstg
)
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Theseare stress ratings
only, which do not imply functional operation of the device at these or anyother conditions beyond those indicated under Recommended
OperatingConditions. Exposure to absolute-maximum-rated conditions for extended periods mayaffect device reliability.
6.2 ESD Ratings
VALUE
±4000
±1000
UNIT
(1)
Human-body model (HBM) per JESD22-A114
Charged-device model (CDM), per JEDEC specification JESD22-C101
V(ESD)
Electrostatic discharge
V
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
2.3
NOM
MAX UNIT
Input voltage (TMP235)
Input voltage (TMP236)
Operating free-air temperature
5.5
V
5.5
VDD
TA
3.1
–40
150
°C
6.4 Thermal Information
TMP235
(1)(2)
THERMAL METRIC
DCK (SC70)
DBZ (SOT-23)
UNIT
PINS
275
84
PINS
167
90
RθJA
RθJC(top)
RθJB
ΨJT
Junction-to-ambient thermal resistance(3)(4)
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
56
146
35
Junction-to-top characterization parameter
Junction-to-board characterization parameter
1.2
55
ΨJB
146
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) For information on self-heating and thermal response time see Layout Guidelines section.
(3) The junction to ambient thermal resistance (RθJA ) under natural convection is obtained in a simulation on a JEDEC-standard, High-K
board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are
included in the PCB, per JESD 51-5.
(4) Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.
4
Copyright © 2017–2019, Texas Instruments Incorporated
TMP235, TMP236
www.ti.com.cn
ZHCSH80E –SEPTEMBER 2017–REVISED MAY 2019
6.5 Electrical Characteristics
TMP235: VDD = 2.3 V to 5.5 V, GND = Ground, TA = –40°C to +125°C and no load (unless otherwise noted)
TMP236: VDD = 3.1 V to 5.5 V, GND = Ground, TA = –10°C to +125°C and no load (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY
TA = 25℃, VDD = 2.3 V, TMP235
TA = 25℃, VDD = 3.1 V, TMP236
TA = –40℃ to +125℃, TMP235
TA = –10℃ to +125℃, TMP236
TA = 150℃, TMP235
9
10
IDD
Operating current
14.5
15
µA
17
Δ℃/
ΔVDD
Line regulation
–0.1
0.02
0.1
℃/V
SENSOR ACCURACY
TA = 25°C
±0.5
±0.5
±0.5
±0.5
±0.5
±0.5
±1
TA = 0°C to 70°C (SC70 Package)
TA = 0°C to +70°C (SOT-23 Package)
TA = –40°C to +125°C (TMP235A2)
TA = –10°C to +125°C (TMP236A2)
TA = –40°C to +150°C (TMP235A2)
TA = 25°C
–1
–1.2
–2
+1
+1.2
+2
–2
+2
(1)
TACY
Temperature accuracy
–2
+2
℃
TA = 0°C to 70°C
–2
–4
–4
–5
±1
+2
+4
+4
+5
Accuracy
Level 4
(A4)
TA = –40°C to +125°C (TMP235A4)
TA = –10°C to +125°C (TMP236A4)
TA = –40°C to +150°C (TMP235A4)
±1
±1
±1
SENSOR OUTPUT
TMP235
500
400
10
V0℃
Output voltage offset at 0 °C
mV
TMP236
TMP235
TC
Temperature coefficient (sensor gain)
mV/℃
TMP236
19.5
±0.5
VONL
IOUT
Output nonlinearity(1)
Output current
TA = 0 °C to 70 °C, no load
℃
500
μA
IOUT = 100 μA, f = 100 Hz
IOUT = 100 μA, f = 500 Hz
20
50
ZOUT
Output impedance
Ω
Ω
TA = 0°C to 70°C, IOUT = 100 μA,
ΔVOUT / ΔIOUT
Output load regulation
1
tON
Turn on time
Time to reach accuracy within ±0.5°C
800
μs
pF
s
CLOAD
tRES
Typical load capacitance
1000
Thermal response to 63%
SC70
30°C (Air) to +125°C (Fluid Bath)
1.3
(1) Accuracy is defined as the error between the measured and reference output voltages, tabulated in the TMP235 Transfer
Tableand TMP236 Transfer Table at the specified conditions of supply voltage and temperature (expressed in °C). Accuracy limits
include line regulation within the specified conditions. Accuracy limits do not include load regulation; they assume no DC load.
版权 © 2017–2019, Texas Instruments Incorporated
5
TMP235, TMP236
ZHCSH80E –SEPTEMBER 2017–REVISED MAY 2019
www.ti.com.cn
6.6 Typical Characteristics
at TA = 25°C, (unless otherwise noted)
6
6
4
Average
Avg ê3s
Limits
Average
Avg ê3s
Limits
4
2
0
2
0
-2
-4
-6
-2
-4
-6
-50
-25
0
25
50
75
100
125
150
-50
-25
0
25
50
75
100
125
150
TA (èC)
TA (èC)
D001
D002
TMP235: VDD = 2.3 to 5.5 V, IOUT = 0 µA, CLOAD = 1000 pF
TMP235: VDD = 2.3 to 5.5 V, IOUT = 0 µA, CLOAD = 1000 pF
图 1. Accuracy vs. TA Temperature (A2 Accuracy Level)
图 2. Accuracy vs. TA Temperature (A4 Accuracy Level)
3
0.1
2.5
2
0.05
0
1.5
1
-0.05
0.5
TMP235
TMP236
VDD = 2.3 V
VDD = 5.5 V
0
-50
-0.1
-50
-25
0
25
50
75
100
125 150
-25
0
25
50
75
100
125
150
TA (èC)
TA (èC)
D003
D004
IOUT = 0 µA, CLOAD = 1000 pF
TMP235: IOUT = from 0 µA to 100 µA, CLOAD = 1000 pF
图 3. Output Voltage vs. Ambient Temperature
图 4. Changes in Accuracy vs. Ambient Temperature (Due to
Load)
14
3.5
IOUT = 500 mA
IOUT = 400 uA
IOUT = 300 uA
IOUT = 200 uA
IOUT = 100 uA
3
12
10
8
2.5
2
1.5
1
0.5
0
VDD = 2.3 V
6
-50
-25
0
25
50
75
100
125
150
-50
-25
0
25
50
TA (èC)
75
100
125
150
TA (èC)
D005
D006
TMP235: IOUT = 0 µA, CLOAD = 1000 pF
TMP235: VDD = 2.3 V, CLOAD = 1000 pF
图 5. Supply Current vs. Temperature
图 6. Load Regulation vs. Ambient Temperature
版权 © 2017–2019, Texas Instruments Incorporated
6
TMP235, TMP236
www.ti.com.cn
ZHCSH80E –SEPTEMBER 2017–REVISED MAY 2019
Typical Characteristics (接下页)
at TA = 25°C, (unless otherwise noted)
0.1
1
0.8
0.6
0.4
0.2
0
TMP235
0.05
0
-0.05
-0.1
-50
-25
0
25
50
TA (èC)
75
100
125
150
0
0.5
1
1.5
2
2.5
VDD (V)
3
3.5
4
4.5
5
5.5
D007
D008
TMP235: VDD = 2.3 to 5.5 V, IOUT = 0 µA, CLOAD = 1000 pF
TMP235: TA = 25°C
图 8. Output Voltage vs. Power Supply
图 7. Line Regulation (Δ°C / ΔVDD) vs. Ambient Temperature
3
2
1.5
1
2.5
2
1.5
1
0.5
0
0.5
-0.5
-0.25
0
-0.25
0
0.25
0.5
0.75
1
1.25
1.5
0
0.25 0.5 0.75 1
Time (ms)
1.25 1.5 1.75
2
Time (ms)
D009
D010
TMP235: TA = 25°C
图 9. Output vs. Settling Time to Step VDD
TMP235: TA = 25°C, VDD Ramp Rate = 5 V/ms
图 10. Output vs. Settling Time to Ramp VDD
150
1000
100
10
125
100
75
50
25
0
SC70 Package
12 14 16
1
-2
0
2
4
6
Time (ms)
8
10
1
10
100 1000
Frequency (Hz)
10000
100000
D011
D012
TMP235: 1 × 1 (inches) PCB, Air 26°C to Fluid Bath 123°C
TMP235: TA = 25°C, VDD = 5 V, IOUT = 100 µA
图 11. Thermal Response (Air-to-Fluid Bath)
图 12. Output Impedance vs. Frequency
版权 © 2017–2019, Texas Instruments Incorporated
7
TMP235, TMP236
ZHCSH80E –SEPTEMBER 2017–REVISED MAY 2019
www.ti.com.cn
7 Detailed Description
7.1 Overview
The TMP23x devices are a family of linear analog temperature sensors with an output voltage proportional to
temperature. These temperature sensors have an accuracy from 0°C to 70°C of ±1.25°C (TMP23xA2) and ±2°C
(TMP23xA4). The TMP235 device provides a positive slope output of 10 mV/°C over the full –40°C to +150°C
temperature range and a supply range from 2.3 V to 5.5 V. The higher gain TMP236 sensor provides a positive
slope output of 19.5 mV/°C from –10°C to +125°C and a supply range from 3.1 V to 5.5 V. A class-AB output
driver provides a maximum output of 500 µA to drive capacitive loads up to 1000 pF.
7.2 Functional Block Diagram
VDD
Thermal Diodes
VOUT
GND
7.3 Feature Description
As shown in 图 3, the TMP23x devices are linear. A small VOUT gain shift, however, is present at temperatures
above 100°C. When small shifts are expected, a piecewise linear function provides the best accuracy and is
used for the device accuracy specifications (see Specifications). Typical output voltages of the TMP23x devices
across the full operating temperature range are listed in 表 3 and 表 4. The ideal linear columns represent the
ideal linear VOUT output response with respect to temperature, while the piecewise linear columns indicate the
small voltage shift at elevated temperatures.
The piecewise linear function uses three temperature ranges listed in 表 1 and 表 2. In equation form, the voltage
output VOUT of the TMP23x is calculated by 公式 1:
VOUT = (TA – TINFL) × TC + VOFFS
where
•
•
•
•
•
VOUT is the TMP23x voltage output for a given temperature
TA is the ambient temperature in °C
TINFL is the temperature inflection point for a piecewise segment in °C
TC is the TMP23x temperature coefficient or gain
VOFFS is the TMP23x voltage offset
(1)
Therefore, the TA temperature for a given VOUT voltage output within a piecewise voltage range (VRANGE) is
calculated in 公式 2. For applications where the accuracy enhancement above 100°C is not required, use the first
row of 表 1 and 表 2 for all voltages.
TA = (VOUT – VOFFS ) / TC + TINFL
(2)
表 1. TMP235 Piecewise Linear Function Summary
TA RANGE
VRANGE (mV)
TINFL (°C)
TC (mV/°C)
VOFFS (mV)
(°C)
–40 to +100
100 to 125
125 to 150
< 1500
1500 to 1752.5
> 1752.5
0
10
500
1500
100
125
10.1
10.6
1752.5
8
版权 © 2017–2019, Texas Instruments Incorporated
TMP235, TMP236
www.ti.com.cn
ZHCSH80E –SEPTEMBER 2017–REVISED MAY 2019
表 2. TMP236 Piecewise Linear Function Summary
TA RANGE
(°C)
VRANGE (mV)
TINFL (°C)
TC (mV/°C)
VOFFS (mV)
–40 to +100
100 to 125
125 to 150
≤ 2350
> 2350
—
0
19.5
19.7
—
400
2350
—
100
—
表 3. TMP235 Transfer Table
VOUT (mV)
IDEAL LINEAR VALUES
VOUT (mV)
PIECEWISE LINEAR VALUES
TEMPERATURE (°C)
–40
–35
–30
–25
–20
–15
–10
–5
100
150
100
150
200
200
250
250
300
300
350
350
400
400
450
450
0
500
500
5
550
550
10
600
600
15
650
650
20
700
700
25
750
750
30
800
800
35
850
850
40
900
900
45
950
950
50
1000
1050
1100
1150
1200
1250
1300
1350
1400
1450
1500
1550
1600
1650
1700
1750
1800
1850
1900
1950
2000
1000
1050
1100
1150
1200
1250
1300
1350
1400
1450
1500
1550.5
1601
1651.5
1702
1752.5
1805.5
1858.5
1911.5
1964.5
2017.5
55
60
65
70
75
80
85
90
95
100
105
110
115
120
125
130
135
140
145
150
版权 © 2017–2019, Texas Instruments Incorporated
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TMP235, TMP236
ZHCSH80E –SEPTEMBER 2017–REVISED MAY 2019
www.ti.com.cn
表 4. TMP236 Transfer Table
VOUT (mV)
IDEAL LINEAR VALUES
VOUT (mV)
PIECEWISE LINEAR VALUES
TEMPERATURE (°C)
–40
–35
–30
–25
–20
–15
–10
–5
—
—
—
—
—
—
—
—
—
—
—
—
205
303
400
498
595
693
790
888
985
1083
1180
1278
1375
1473
1570
1668
1765
1863
1960
2058
2155
2253
2350
2448
2545
2643
2740
2838
—
205
303
0
400
5
498
10
595
15
693
20
790
25
888
30
985
35
1083
1180
1278
1375
1473
1570
1668
1765
1863
1960
2058
2155
2253
2350
2448.5
2547
2645.4
2743.9
2842.4
—
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
125
130
135
140
145
150
—
—
—
—
—
—
—
—
7.4 Device Functional Modes
The singular functional mode of the TMP23x is an analog output directly proportional to temperature.
10
Copyright © 2017–2019, Texas Instruments Incorporated
TMP235, TMP236
www.ti.com.cn
ZHCSH80E –SEPTEMBER 2017–REVISED MAY 2019
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The features of the TMP235 make the series of devices designed for various general temperature-sensing
applications. The TMP235 and TMP236 devices can operate down to a 2.3-V and a 3.1-V supply with 9-µA
power consumption, respectively. As a result, the series is designed for battery-powered applications. The
TMP23x series is mounted in two surface mount technology packages (SC70 and SOT-23.)
8.2 Typical Application
8.2.1 Connection to an ADC
Simplified Input Circuit of
SAR Analog-to-Digital Converter
Reset
2.3 V to 5.5 V
Input
Pin
Sample
R
MUX
R
SS
TI Device
RFILTER
V
DD
OUT
GND
C
BP
C
C
MUX
FILTER
C
SAMPLE
Figure 13. Suggested Connections to an ADC Input Stage
8.2.1.1 Design Requirements
See Figure 13 for suggested connections to an ADC input stage. Most CMOS-based ADCs have a sampled data
comparator input structure. When the ADC charges the sampling capacitor (CSAMPLE), the capacitor requires
instantaneous charge from the output of the analog source temperature sensor, such as the TMP23x. Therefore,
the output impedance of the temperature sensor can affect ADC performance. In most cases, adding an external
capacitor (CFILTER) mitigates design challenges. The TMP23x is specified and characterized with a 1000-pF
maximum capacitive load (CLOAD). Figure 13 shows CLOAD as the sum of CFILTER + CMUX + CSAMPLE. TI
recommends maximizing the CFILTER value while allowing for the maximum specified ADC input capacitance
(CMUX + CSAMPLE) to limit the total CLOAD at 1000 pF. In most cases, a 680-pF CFILTER provides a reasonable
allowance for ADC input capacitance to minimize ADC sampling error and reduce noise coupling. An optional
series resistor (RFILTER) and CFILTER provides additional low-pass filtering to reject system level noise. TI
recommends placing RFILTER and CFILTER as close as possible to the ADC input for optimal performance.
8.2.1.2 Detailed Design Procedure
Depending on the input characteristics of the ADC, an external CFILTER may be required. The value of CFILTER
depends on the size of the sampling capacitor (CSAMPLE) and the sampling frequency while observing a maximum
CLOAD of 1000 pF. The capacitor requirements can vary because the input stages of all ADCs are not identical.
Figure 13 shows a general ADC application as an example only.
Copyright © 2017–2019, Texas Instruments Incorporated
11
TMP235, TMP236
ZHCSH80E –SEPTEMBER 2017–REVISED MAY 2019
www.ti.com.cn
Typical Application (continued)
8.2.1.3 Application Curve
3
2.5
2
1.5
1
0.5
TMP235
TMP236
0
-50
-25
0
25
50
75
100
125
150
TA (èC)
D003
Figure 14. Output Voltage vs. Ambient
9 Power Supply Recommendations
The low supply current and supply range of the TMP23x allow the device to be easily powered from many
sources.
Power supply bypassing is strongly recommended. In noisy environments, TI recommends to add a filter with
0.1-μF capacitor and 100-Ω resistor between external supply and VDD to limit the power supply noise. Larger
capacitances may be required and are dependent on the noise of the power supply.
10 Layout
10.1 Layout Guidelines
The layout of the TMP23x series is simple. If a power supply bypass capacitor is used, the capacitor must be
connected as Layout Examples shows.
10.2 Layout Examples
VIA to ground plane
VIA to power plane
GND
GND
OUT
GND
VDD
0.1 µF
Figure 15. Recommended Layout: SC70 Package
12
版权 © 2017–2019, Texas Instruments Incorporated
TMP235, TMP236
www.ti.com.cn
ZHCSH80E –SEPTEMBER 2017–REVISED MAY 2019
11 器件和文档支持
11.1 相关链接
下表列出了快速访问链接。类别包括技术文档、支持和社区资源、工具和软件，以及立即订购快速访问。
表 5. 相关链接
器件
产品文件夹
单击此处
单击此处
立即订购
单击此处
单击此处
技术文档
单击此处
单击此处
工具与软件
单击此处
单击此处
支持和社区
单击此处
单击此处
TMP235
TMP236
11.2 接收文档更新通知
要接收文档更新通知，请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册，即可每周接收产
品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.3 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
版权 © 2017–2019, Texas Instruments Incorporated
13
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TMP235A2DBZR
TMP235A2DBZT
TMP235A2DCKR
TMP235A2DCKT
TMP235A4DBZR
TMP235A4DBZT
TMP235A4DCKR
TMP235A4DCKT
TMP236A2DBZR
TMP236A2DBZT
TMP236A2DCKR
TMP236A2DCKT
TMP236A4DBZR
TMP236A4DBZT
TMP236A4DCKR
TMP236A4DCKT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SC70
DBZ
DBZ
DCK
DCK
DBZ
DBZ
DCK
DCK
DBZ
DBZ
DCK
DCK
DBZ
DBZ
DCK
DCK
3
3
5
5
3
3
5
5
3
3
5
5
3
3
5
5
3000 RoHS & Green
250 RoHS & Green
NIPDAUAG | SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-10 to 125
-10 to 125
-10 to 125
-10 to 125
-10 to 125
-10 to 125
-10 to 125
-10 to 125
2352
2352
19L
NIPDAUAG | SN
3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
3000 RoHS & Green
250 RoHS & Green
SC70
19L
SOT-23
SOT-23
SC70
NIPDAUAG | SN
NIPDAUAG | SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
2354
2354
19M
19M
2362
2362
1BS
1BS
2364
2364
1BT
3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
3000 RoHS & Green
250 RoHS & Green
SC70
SOT-23
SOT-23
SC70
NIPDAUAG | SN
NIPDAUAG | SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
3000 RoHS & Green
250 RoHS & Green
SC70
SOT-23
SOT-23
SC70
NIPDAUAG | SN
NIPDAUAG | SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM
SC70
1BT
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMP235A2DBZR
TMP235A2DBZT
TMP235A2DCKR
TMP235A2DCKR
TMP235A2DCKT
TMP235A2DCKT
TMP235A4DBZR
TMP235A4DBZT
TMP235A4DCKR
TMP235A4DCKR
TMP235A4DCKT
TMP235A4DCKT
TMP236A2DBZR
TMP236A2DBZT
TMP236A2DCKR
TMP236A2DCKR
SOT-23
SOT-23
SC70
DBZ
DBZ
DCK
DCK
DCK
DCK
DBZ
DBZ
DCK
DCK
DCK
DCK
DBZ
DBZ
DCK
DCK
3
3
5
5
5
5
3
3
5
5
5
5
3
3
5
5
3000
250
180.0
180.0
178.0
180.0
178.0
180.0
180.0
180.0
180.0
178.0
178.0
180.0
180.0
180.0
178.0
180.0
8.4
8.4
9.0
8.4
9.0
8.4
8.4
8.4
8.4
9.0
9.0
8.4
8.4
8.4
9.0
8.4
3.2
3.2
2.85
2.85
2.5
1.3
1.3
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
3000
3000
250
2.4
1.2
SC70
2.47
2.4
2.3
1.25
1.2
SC70
2.5
SC70
250
2.47
3.2
2.3
1.25
1.3
SOT-23
SOT-23
SC70
3000
250
2.85
2.85
2.3
3.2
1.3
3000
3000
250
2.47
2.4
1.25
1.2
SC70
2.5
SC70
2.4
2.5
1.2
SC70
250
2.47
3.2
2.3
1.25
1.3
SOT-23
SOT-23
SC70
3000
250
2.85
2.85
2.5
3.2
1.3
3000
3000
2.4
1.2
SC70
2.47
2.3
1.25
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2023
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMP236A2DCKT
TMP236A2DCKT
TMP236A4DBZR
TMP236A4DBZT
TMP236A4DCKR
TMP236A4DCKR
TMP236A4DCKT
TMP236A4DCKT
SC70
SC70
DCK
DCK
DBZ
DBZ
DCK
DCK
DCK
DCK
5
5
3
3
5
5
5
5
250
250
178.0
180.0
180.0
180.0
180.0
178.0
180.0
178.0
9.0
8.4
8.4
8.4
8.4
9.0
8.4
9.0
2.4
2.47
3.2
2.5
2.3
1.2
1.25
1.3
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
SOT-23
SOT-23
SC70
3000
250
2.85
2.85
2.3
3.2
1.3
3000
3000
250
2.47
2.4
1.25
1.2
SC70
2.5
SC70
2.47
2.4
2.3
1.25
1.2
SC70
250
2.5
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMP235A2DBZR
TMP235A2DBZT
TMP235A2DCKR
TMP235A2DCKR
TMP235A2DCKT
TMP235A2DCKT
TMP235A4DBZR
TMP235A4DBZT
TMP235A4DCKR
TMP235A4DCKR
TMP235A4DCKT
TMP235A4DCKT
TMP236A2DBZR
TMP236A2DBZT
TMP236A2DCKR
TMP236A2DCKR
TMP236A2DCKT
TMP236A2DCKT
SOT-23
SOT-23
SC70
DBZ
DBZ
DCK
DCK
DCK
DCK
DBZ
DBZ
DCK
DCK
DCK
DCK
DBZ
DBZ
DCK
DCK
DCK
DCK
3
3
5
5
5
5
3
3
5
5
5
5
3
3
5
5
5
5
3000
250
210.0
210.0
180.0
183.0
180.0
183.0
210.0
210.0
183.0
180.0
180.0
183.0
210.0
210.0
180.0
183.0
180.0
183.0
185.0
185.0
180.0
183.0
180.0
183.0
185.0
185.0
183.0
180.0
180.0
183.0
185.0
185.0
180.0
183.0
180.0
183.0
35.0
35.0
18.0
20.0
18.0
20.0
35.0
35.0
20.0
18.0
18.0
20.0
35.0
35.0
18.0
20.0
18.0
20.0
3000
3000
250
SC70
SC70
SC70
250
SOT-23
SOT-23
SC70
3000
250
3000
3000
250
SC70
SC70
SC70
250
SOT-23
SOT-23
SC70
3000
250
3000
3000
250
SC70
SC70
SC70
250
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2023
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMP236A4DBZR
TMP236A4DBZT
TMP236A4DCKR
TMP236A4DCKR
TMP236A4DCKT
TMP236A4DCKT
SOT-23
SOT-23
SC70
DBZ
DBZ
DCK
DCK
DCK
DCK
3
3
5
5
5
5
3000
250
210.0
210.0
183.0
180.0
183.0
180.0
185.0
185.0
183.0
180.0
183.0
180.0
35.0
35.0
20.0
18.0
20.0
18.0
3000
3000
250
SC70
SC70
SC70
250
Pack Materials-Page 4
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.12 MAX
1.4
1.2
B
A
0.1 C
PIN 1
INDEX AREA
1
0.95
(0.125)
3.04
2.80
1.9
3
(0.15)
NOTE 4
2
0.5
0.3
3X
0.10
0.01
(0.95)
TYP
0.2
C A B
0.25
GAGE PLANE
0.20
0.08
TYP
0.6
0.2
TYP
SEATING PLANE
0 -8 TYP
4214838/D 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
4. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214838/D 03/2023
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/D 03/2023
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
DCK0005A
SOT - 1.1 max height
S
C
A
L
E
5
.
6
0
0
SMALL OUTLINE TRANSISTOR
C
2.4
1.8
0.1 C
1.4
1.1
B
1.1 MAX
A
PIN 1
INDEX AREA
1
2
5
NOTE 4
(0.15)
(0.1)
2X 0.65
1.3
2.15
1.85
1.3
4
3
0.33
5X
0.23
0.1
0.0
(0.9)
TYP
0.1
C A B
0.15
0.22
0.08
GAGE PLANE
TYP
0.46
0.26
8
0
TYP
TYP
SEATING PLANE
4214834/C 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-203.
4. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DCK0005A
SOT - 1.1 max height
SMALL OUTLINE TRANSISTOR
PKG
5X (0.95)
1
5
5X (0.4)
SYMM
(1.3)
2
3
2X (0.65)
4
(R0.05) TYP
(2.2)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:18X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214834/C 03/2023
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DCK0005A
SOT - 1.1 max height
SMALL OUTLINE TRANSISTOR
PKG
5X (0.95)
1
5
5X (0.4)
SYMM
(1.3)
2
3
2X(0.65)
4
(R0.05) TYP
(2.2)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:18X
4214834/C 03/2023
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
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