TMP300-Q1 [TI]
1.8V, Resistor-Programmable TEMPERATURE SWITCH and ANALOG OUT TEMPERATURE SENSOR in SC70;
| 型号： | TMP300-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 1.8V, Resistor-Programmable TEMPERATURE SWITCH and ANALOG OUT TEMPERATURE SENSOR in SC70 |
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| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TMP300B-Q1
www.ti.com
SBOS586 –DECEMBER 2011
1.8V, Resistor-Programmable
TEMPERATURE SWITCH and
ANALOG OUT TEMPERATURE SENSOR in SC70
Check for Samples: TMP300B-Q1
1
FEATURES
DESCRIPTION
The
TMP300B-Q1
is
a
low-power,
2
•
•
•
•
•
•
•
•
•
ACCURACY: ±1°C (typical at +25°C)
PROGRAMMABLE TRIP POINT
PROGRAMMABLE HYSTERESIS: 5°C/10°C
OPEN-DRAIN OUTPUTS
resistor-programmable, digital output temperature
switch. It allows a threshold point to be set by adding
an external resistor. Two levels of hysteresis are
available. The TMP300B-Q1 has a VTEMP analog
output that can be used as a testing point or in
temperature-compensation loops.
LOW-POWER: 110μA (max)
WIDE VOLTAGE RANGE: +1.8V to +18V
OPERATION: –40°C to +150°C
ANALOG OUT: 10mV/°C
With a supply voltage as low as 1.8V and low current
consumption, the TMP300B-Q1 is ideal for
power-sensitive systems.
SC70-6 PACKAGE
Available in two micropackages that have proven
thermal characteristics, this part gives a complete and
simple solution for users who need simple and
reliable thermal management.
APPLICATIONS
•
QUALIFIED FOR for AUTOMOTIVE
APPLICATIONS
•
•
•
•
POWER-SUPPLY SYSTEMS
DC-DC MODULES
THERMAL MONITORING
ELECTRONIC PROTECTION SYSTEMS
V+
RPULL-UP
Proportional
3mA
to TA
TMP300B-Q1
VTEMP
OUT
V+
TSET
GND
OUT
1
2
3
6
5
4
TSET
VTEMP
HYSTSET
210kW(1)
RSET
SC70-6
TMP300
HYSTSET
NOTE: (1) Thinfilm resistor with approximately 10% accuracy;
however, this accuracy error is trimmed out at the factory.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
TMP300B-Q1
SBOS586 –DECEMBER 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
ORDERABLE P/N
TA
PACKAGE
TOP SIDE SYMBOL
TMP300BQDCKRQ1 or
TMP300B-Q1
-40°C to 125°C
SC70 - DCK | Reel of 3000
SBG
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
VALUE
+18
UNIT
V
Supply Voltage
V+
ISC
Signal Input Terminals, Voltage(2)
Signal Input Terminals, Current(2)
Output Short-Circuit(3)
Open-Drain Output
–0.5 to (V+) + 0.5
±10
V
mA
Continuous
(V+) + 0.5
–40 to +150
–55 to +150
+150
V
°C
°C
°C
V
Operating Temperature
Storage Temperature
TA
TA
TJ
Junction Temperature
Human Body Model (HBM)
4000
ESD Rating
Charged Device Model (CDM)
Machine Model (MM)
1000
V
200
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should
be current limited to 10mA or less.
(3) Short-circuit to ground.
2
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TMP300B-Q1
TMP300B-Q1
www.ti.com
SBOS586 –DECEMBER 2011
ELECTRICAL CHARACTERISTICS
At VS = 3.3V and TA = –40°C to +125°C, unless otherwise noted.
TMP300B-Q1
TYP
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
TEMPERATURE MEASUREMENT
VS = 2.35V to 18V
VS = 1.8V to 2.35V
–40
–40
+125
°C
°C
Measurement Range
100 ×
(VS – 0.95)
TRIP POINT
Total Accuracy
TA = –40°C to +125°C
TC is in °C
±2
±6
°C
RSET Equation
RSET = 10 (50 + TC)/3
kΩ
HYSTERESIS SET INPUT
(1)
LOW Threshold
0.4
V
V
(1)
HIGH Threshold
VS – 0.4
HYSTSET = GND
HYSTSET = VS
5
°C
°C
Threshold Hysteresis
10
DIGITAL OUTPUT
Logic Family
CMOS
(1)
Open-Drain Leakage Current
OUT = VS
10
0.3
±5
μA
Logic Levels
VOL
VS = 1.8V to 18V, ISINK = 5mA
V
ANALOG OUTPUT
Accuracy
±2
10
°C
mV/°C
mV
Temperature Sensitivity
(1)
Output Voltage
TA = +25°C
720
750
210
780
VTEMP Pin Output Resistance
kΩ
POWER SUPPLY
VS = 1.8V to 18V,
TA = –40°C to +125°C
Quiescent Current(2)
IQ
110
μA
TEMPERATURE RANGE
VS = 2.35V to 18V
VS = 1.8V to 2.35V
VS = 2.35V to 18V
VS = 1.8V to 2.35V
–40
–40
–40
–50
+125
°C
°C
°C
°C
Specified Range
Operating Range
TA
100 ×
(VS – 0.95)
+150
TA
100 ×
(VS – 0.95)
Thermal Resistance
SC70
θJA
250
180
°C/W
°C/W
SOT23-6
(1) Specified by design. Not production tested.
(2) See Figure 1 for typical quiescent current.
Copyright © 2011, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TMP300B-Q1
TMP300B-Q1
SBOS586 –DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS
At VS = 5V, unless otherwise noted.
QUIESCENT CURRENT OVER TEMPERATURE AND
SUPPLY
RSET SHIFT DUE TO RSET TOLERANCE
95
85
75
65
55
45
2.0
1.5
TERROR + 1%
1.0
VS = 18V
0.5
TERROR + 0.1%
0
VS = 3.3V
TERROR - 0.1%
-0.5
-1.0
-1.5
-2.0
VS = 1.8V
TERROR - 1%
-40 -25
0
25
50
75
100
125
125
125
-40 -25
0
25
50
75 100
125
Temperature (°C)
Temperature (°C)
Figure 1.
Figure 2.
RSET vs TEMPERATURE
TYPICAL TRIP ERROR
700
600
500
400
300
200
100
0
4.0
3.0
2.0
1.0
0
-1.0
-2.0
-3.0
-4.0
-40 -25
0
25
50
75
100
-40 -25
0
25
50
75
100
125
Temperature (°C)
Temperature (°C)
Figure 3.
Figure 4.
TYPICAL ANALOG OUTPUT ERROR
ANALOG PSR OVER TEMPERATURE
0.10
0.08
0.06
0.04
0.02
0
3.0
2.5
2.0
TMAX is +85°C for VS = 1.8V to 3.3V
1.5
1.0
0.5
0
3.3V to 18V
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
-0.02
-0.04
-0.06
-0.08
-0.10
-40 -25
0
25
50
75
100
-40 -25
0
25
50
75
100
125
Temperature (°C)
Temperature (°C)
Figure 5.
Figure 6.
4
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TMP300B-Q1
TMP300B-Q1
www.ti.com
SBOS586 –DECEMBER 2011
TYPICAL CHARACTERISTICS (continued)
At VS = 5V, unless otherwise noted.
TRIP PSR OVER TEMPERATURE
0.10
0.08
0.06
0.04
0.02
3.3V to 18V
0
-0.02
-0.04
TMAX is +85°C for VS = 1.8V to 3.3V
-0.06
-0.08
-0.10
-40 -25
0
25
50
75
100
125
Temperature (°C)
Figure 7.
Copyright © 2011, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TMP300B-Q1
TMP300B-Q1
SBOS586 –DECEMBER 2011
www.ti.com
APPLICATIONS INFORMATION
To set the TMP300B-Q1 to trip at a preset value,
calculate the RSET resistor value according to
Equation 1 or Equation 2:
The TMP300B-Q1 is a thermal sensor designed for
over-temperature protection circuits in electronic
systems. The TMP300B-Q1 uses a set resistor to
program the trip temperature of the digital output. An
additional high-impedance (210kΩ) analog voltage
output provides the temperature reading.
(TSET ´ 0.01 + 0.5)
RSET
=
-6
3e
(1)
Where TSET is in °C; or
10(50 + TSET
)
CALCULATING RSET
RSET in kW =
3
The set resistor (RSET) provides a threshold voltage
for the comparator input. The TMP300B-Q1 trips
when the VTEMP pin exceeds the TSET voltage. The
value of the set resistor is determined by the analog
output function and the 3μA internal bias current.
(2)
Where TSET is in °C.
USING VTEMP TO TRIP THE DIGITAL OUTPUT
The analog voltage output can also serve as a
voltage input that forces a trip of the digital output to
simulate a thermal event. This simulation facilitates
easy system design and test of thermal safety
circuits, as shown in Figure 8.
V+
Proportional
to TA
3mA
VTEMP
TSET
Voltage source
to test trip point.
OUT
Open-Drain Control
RINT
210kW
RSET
TMP300
HYSTSET
Figure 8. Applying Voltage to Trip Digital Output
6
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TMP300B-Q1
TMP300B-Q1
www.ti.com
SBOS586 –DECEMBER 2011
ANALOG TEMPERATURE OUTPUT
USING A DAC TO SET THE TRIP POINT
The analog out or VTEMP pin is high-impedance
(210kΩ). Avoid loading this pin to prevent degrading
the analog out value or trip point. Buffer the output of
this pin when using it for direct thermal measurement.
Figure 9 shows buffering of the analog output signal.
The trip point is easily converted by changing the
digital-to-analog converter (DAC) code. This
technique can be useful for control loops where a
large thermal mass is being brought up to the set
temperature and the OUT pin is used to control the
heating element. The analog output can be monitored
in a control algorithm that adjusts the set temperature
to prevent overshoot. Trip set voltage error versus
temperature is shown in Figure 10, which shows error
in °C of the comparator input over temperature. An
alternative method of setting the trip point by using a
DAC is shown in Figure 11.
Analog Out
OPA335
V+
1.00
0.75
0.50
0.25
0
Proportional
to TA
3mA
VTEMP
TSET
OUT
210kW
-0.25
-0.50
-0.75
-1.00
TMP300
HYSTSET
-50
-25
0
25
50
75
100
125
Figure 9. Buffering the Analog Output Signal
Temperature (°C)
Figure 10. Trip Set Voltage Error vs Temperature
V+
Proportional
3mA
to TA
VTEMP
Voltage source
OUT
Open-Drain Control
to test trip point.
TSET
210kW
DAC8560
TMP300
HYSTSET
Figure 11. DAC Generates the Voltage-Driving TSET Pin
Copyright © 2011, Texas Instruments Incorporated
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7
Product Folder Link(s): TMP300B-Q1
TMP300B-Q1
SBOS586 –DECEMBER 2011
www.ti.com
HYSTERESIS
Bypass capacitors should be used on the supplies as
well as on the RSET and analog out (VTEMP) pins when
in noisy environments, as shown in Figure 14. These
capacitors reduce premature triggering of the
comparator.
The hysteresis pin has two settings. Grounding
HYSTSET results in 5°C of hysteresis. Connecting it to
VS results in 10°C of hysteresis. Hysteresis error
variation over temperature is shown in Figure 12 and
Figure 13.
5
4
3
2
5
4
3
Maximum
2
1
Maximum
1
0
0
-1
Minimum
Average
-1
-2
-3
-4
-5
Minimum
Average
-2
-3
-4
-5
-50
-25
0
25
50
75
100
125
Temperature (°C)
-50
-25
0
25
50
75
100
125
Temperature (°C)
Figure 13. 10°C Hysteresis Error vs Temperature
Figure 12. 5°C Hysteresis Error vs Temperature
V+
Proportional
3mA
to TA
VTEMP
OUT
Open-Drain Control
TSET
CBYPASS
210kW
CBYPASS
RSET
TMP300
HYSTSET
Figure 14. Bypass Capacitors Prevent Early Comparator Toggling Due to Circuit Board Noise
8
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TMP300B-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
30-Dec-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TMP300BQDCKRQ1
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMP300-Q1 :
Catalog: TMP300
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Dec-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMP300BQDCKRQ1
SC70
DCK
6
3000
179.0
8.4
2.2
2.5
1.2
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Dec-2011
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SC70 DCK
SPQ
Length (mm) Width (mm) Height (mm)
203.0 203.0 35.0
TMP300BQDCKRQ1
6
3000
Pack Materials-Page 2
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