TMP303FDRLT [TI]
出厂时经过编程的温度窗口比较器 | DRL | 6 | -40 to 125;
| 型号： | TMP303FDRLT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 出厂时经过编程的温度窗口比较器 | DRL | 6 | -40 to 125 光电二极管 信号电路 比较器 模拟IC |
| 文件： | 总15页 (文件大小：656K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TMP303A
TMP303B
SOT563
www.ti.com
SBOS486B –JULY 2009–REVISED JANUARY 2011
Easy-to-Use, Low-Power, 1°C, Low-Supply
TEMPERATURE RANGE MONITOR in MicroPackage
Check for Samples: TMP303A, TMP303B
1
FEATURES
DESCRIPTION
2
•
•
•
LOW POWER: 5mA (max)
The TMP303A and TMP303B are temperature range
monitors that offer design flexibility through an extra
small footprint (SOT563), low power (5mA max) and
low supply voltage capability (as low as 1.4V).
SOT563 PACKAGE: 1,6 x 1,6 x 0,6 mm
TRIP POINT ACCURACY: ±0.2°C from –40°C to
+125°C
These devices require no additional components for
operation; each can function independent of
microprocessors or microcontrollers.
•
•
•
PUSH-PULL OUTPUT
SELECTABLE HYSTERESIS: 1/2/5/10°C
SUPPLY VOLTAGE RANGE: 1.4V to 3.6V
Trip points are preprogrammed at the factory. For
applications that require different values, contact your
local TI representative.
APPLICATIONS
•
•
•
•
•
•
•
•
CELL PHONE HANDSETS
PORTABLE MEDIA PLAYERS
CONSUMER ELECTRONICS
SERVERS
POWER-SUPPLY SYSTEMS
DC-DC MODULES
The OUT pin is a push-pull, active-high output. When
the measured temperature is beyond the trip point
range of 0°C to +60°C (TMP303A), and the Set
Output High (SOH) pin is low, the OUT pin is high.
The SOH pin is an input pin with an internal pulldown
resistor. When the SOH pin is forced high, the OUT
pin goes high regardless of the measured
temperature.
THERMAL MONITORING
ELECTRONIC PROTECTION SYSTEMS
TMP303A/B HYSTERESIS SETTINGS
DRL PACKAGE
SOT563
(Top View)
HYSTSET1
GND
GND
VS
HYSTSET0
GND
VS
HYSTERESIS (°C)
1
2
HYSTSET0
GND
1
2
3
6
5
4
HYSTSET1
VS
GND
VS
5
VS
10
OUT
SOH
DEVICE SUMMARY
DEVICE
TMP303A
TMP303B
TRIP POINTS (°C)
TL = 0, TH = +60(1)
TL = 0, TH = +55(1)
(1) Contact TI representative for other trip points.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2011, Texas Instruments Incorporated
TMP303A
TMP303B
SBOS486B –JULY 2009–REVISED JANUARY 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE INFORMATION(1)
PRODUCT
TMP303A
TMP303B
PACKAGE
PACKAGE DESIGNATOR
PACKAGE MARKING
OCO
SOT563
DRL
QWM
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
TMP303A, TMP303B
UNIT
V
Supply Voltage, VS – GND
Input Pins, Voltage
+3.6
–0.5 to VS +0.5
–0.5 to VS +0.5
8
SOH, HYSTSET1, HYSTSET0
V
Output Pin, Voltage
Output Pin, Current
OUT
OUT
V
mA
°C
°C
°C
V
Operating Temperature Range
Storage Temperature Range
Junction Temperature (TJ max)
–55 to +130
–60 to +150
+150
Human Body Model (HBM)
2000
ESD Rating
Charged Device Model (CDM)
Machine Model (MM)
1000
V
200
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
2
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Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TMP303A TMP303B
TMP303A
TMP303B
www.ti.com
SBOS486B –JULY 2009–REVISED JANUARY 2011
ELECTRICAL CHARACTERISTICS
At TA = –40°C to +125°C and VS = 1.4V to 3.6V, unless otherwise noted.
TMP303A, TMP303B(1)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
TEMPERATURE MEASUREMENT
TL, TH Trip Point Accuracy(2)
TA = +55°C to +60°C, VS = 3.3V
TA = 60°C, VS = 1.4V to 3.6V
±0.2
±0.2
±0.1
±1
°C
°C
±1.5
vs. Supply
Hysteresis
°C/V
See Hysteresis Settings table on front
page
1
10
°C
HYSTERESIS SET INPUT
Input Logic Levels:
VIH
0.7 × VS
–0.5
3.6
V
V
VIL
0.3 × VS
Input Current:
IIN
0 < VIN < 3.6V
1
mA
kΩ
SOH INPUT
Pulldown Resistor Value
Input Logic Levels:
VIH
80
100
36
120
0.7 × VS
–0.5
3.6
V
V
VIL
0.3 × VS
Input Current
OUTPUT
VIN = 3.6V
mA
Output Logic Levels
VOH
VS > 2V, IOH = 0.5mA
VS < 2V, IOH = 0.5mA
VS > 2V, IOL = 1mA
VS < 2V, IOL = 1mA
VS – 0.4
VS
VS
V
V
V
V
VS – 0.2 × (VS)
VOL
0
0
0.4
0.2 × VS
POWER SUPPLY
Specified Supply Voltage
Range
VS
1.4
20
3.6
V
Power-up Start-up Time
Quiescent Current
VS > 1.4V
28
3.5
4
35
5
ms
mA
mA
IQ
TA = –55°C to +60°C
TA = –40°C to +125°C
8
TEMPERATURE RANGE
Specified Range
–40
–55
+125
+130
°C
°C
Operating Range
Thermal Resistance, DRL
qJA
JEDEC Low-K Board
260
°C/W
(1) 100% of all units are production tested at TA = +25°C. Over temperature specifications are specified by design.
(2) TL, TH are device-specific. For example, TMP303A TL = 0°C, TH = 60°C; TMP303B TL = 0°C, TH = 55°C
Copyright © 2009–2011, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TMP303A TMP303B
TMP303A
TMP303B
SBOS486B –JULY 2009–REVISED JANUARY 2011
www.ti.com
TYPICAL CHARACTERISTICS
At VS = +3.3V and TA = +25°C, unless otherwise noted.
TRIP ACCURACY ERROR vs
TEMPERATURE
QUIESCENT CURRENT vs
TEMPERATURE
1.0
0.8
10
9
8
7
6
5
4
3
2
1
0
30 Units
0.6
VS = 3.6V
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
VS = 1.4V
VS = 3.3V
-10
0
10
20
30
40
50
60
70
-60 -40 -20
0
20
40
60
80 100 120 140
Temperature (°C)
Temperature (°C)
Figure 1.
Figure 2.
TEMPERATURE STEP RESPONSE IN PERFLUORINATED
FLUID
THERMAL STEP RESPONSE IN AIR AT +100°C vs
TIME
AT +100°C vs TIME
120
100
90
80
70
60
50
40
30
20
10
0
100
80
60
40
20
0
0
5
10
15
20
25
30
0
20
40
60
80 100 120 140 160 180 200
Time (s)
Time (s)
Figure 3.
Figure 4.
TRIP THRESHOLD ACCURACY
POWER-UP AND POWER-DOWN TRANSIENT RESPONSE
40
35
30
25
20
15
10
5
OUT
VS
0
Time (8ms/div)
Accuracy (°C)
Figure 5.
Figure 6.
4
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Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TMP303A TMP303B
TMP303A
TMP303B
www.ti.com
SBOS486B –JULY 2009–REVISED JANUARY 2011
TYPICAL CHARACTERISTICS (continued)
At VS = +3.3V and TA = +25°C, unless otherwise noted.
OUTPUT LOGIC LEVEL LOW vs
TEMPERATURE
POWER-UP, TRIP, AND POWER-DOWN RESPONSE
300
250
200
150
100
50
VS = 1.4V
IOL = 2mA
OUT
VS
0
-75 -50 -25
0
25
50
75
100 125 150
Time (10ms/div)
Temperature (°C)
Figure 7.
Figure 8.
OUTPUT LOGIC LEVEL HIGH vs
TEMPERATURE
300
250
200
150
100
50
VS = 1.4V
IOH = 1mA
0
-75 -50 -25
0
25
50
75
100 125 150
Temperature (°C)
Figure 9.
Copyright © 2009–2011, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TMP303A TMP303B
TMP303A
TMP303B
SBOS486B –JULY 2009–REVISED JANUARY 2011
www.ti.com
APPLICATION INFORMATION
The TMP303A temperature trip window resides within
the range of 0°C to 60°C. The TMP303B temperature
trip window resides within the range of 0°C to 55°C.
When either of these trip thresholds is crossed, the
output (OUT) changes state from low to high. OUT
does not return to its original low state until the
temperature crosses the hysteresis threshold and
returns within the range of the 0°C to 60°C (or 0°C to
55°C) window.
The TMP303A and TMP303B are temperature
switches used in battery-powered applications that
require accurate monitoring of
a very specific
temperature range of 0°C to +60°C (TMP303A) or
0°C to +55°C (TMP303B). This functionality is
accomplished through the preset trip window and two
hysteresis bits, HYSTSET0 and HYSTSET1. The preset
trip window temperature thresholds are configured at
the factory; for other trip points, contact a TI
representative. Table 1 summarizes the bit setting
versus hysteresis temperature window.
As an example, if the TMP303A is configured with a
10°C hysteresis window (that is, HYSTSET0
HYSTSET1 = VS), the output does not return to its low
state until the temperature either crosses (TL
=
Table 1. Bit Setting vs Hysteresis Window
+
hysteresis) = 10°C or (TH – hysteresis) = 50°C. The
Set Output High (SOH) pin is intended to add test
functionality to verify the connectivity of the output
(OUT) pin to the system controller or other
temperature response system. The SOH pin is
internally pulled down to ground with a 100kΩ
resistor. If the SOH pin is grounded or left floating, it
has no effect on the behavior of the TMP303A. If the
SOH pin is pulled high, the TMP303A immediately
forces the output high, regardless of temperature. It is
very important to note that this response occurs even
if the temperature falls within the 0°C to 60°C
temperature window. Figure 11 illustrates this design
in graphical form.
HYSTSET1
GND
GND
VS
HYSTSET0
GND
VS
HYSTERESIS
1°C
2°C
GND
VS
5°C
VS
10°C
Configuring the TMP303A/B
The TMP303A/B contains an active high, push-pull
output stage and does not require a pull-up resistor to
VS for proper operation. Figure 10 shows a block
diagram of the TMP303A/B.
1.4V to 3.6V
VS
TH = 60°C
50°C
Measured
Temperature
DS
Temperature
Sensor
ADC
10°C
5°C
TL = 0°C
OUT
HYSTSET0
HYSTSET1
Hysteresis
Logic
Trip Point
Logic
100kW
Changes hysteresis
from 10°C to 5°C
HYSTSET1
HYSTSET0
SOH
GND
SOH
Figure 10. TMP303A/B Block Diagram
Forces OUT pin high
regardless of temperature
Power-supply bypassing is strongly recommended;
use a 0.1µF capacitor placed as close as possible to
the supply pin.
OUT
Time
Figure 11. TMP303A Output Transfer Curves with
Hysteresis Change from 10°C to 5°C and SOH
Functionality
6
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Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TMP303A TMP303B
TMP303A
TMP303B
www.ti.com
SBOS486B –JULY 2009–REVISED JANUARY 2011
TMP303A/B Power Up and Timing
The tolerance of the thermal response time is largely
a result of the differences in conversion time, which
varies between 20ms and 35ms; likewise, this
conversion does not take place after a power cycle
until the supply voltage has reached a level of at least
1.4V. This sequence is illustrated in Figure 12.
At device power-up, the TMP303A/B exerts OUT =
high, and typically requires 26ms to return to a low
state only if the temperature falls within the hysteresis
window set by HYSTSET0 and HYSTSET1
.
60°C
60°C
50°C
50°C
3.3V
3.3V
Temperature
Temperature
VS
VS
1.4V
1.4V
0°C
0°C
0
50
100
0
50
100
OUT = High
At Power-on
OUT = High
After Conversion
OUT = High
At Power-on
1
1
Conversion
Time
Dt = 35ms (max)
Conversion
Time
Dt = 35ms (max)
HYSTSET0 = High
HYSTSET1 = High
SOH = Low
HYSTSET0 = High
HYSTSET1 = High
SOH = Low
OUT = Low
After Conversion
0
0
0
50
100
0
50
100
Time (ms)
Time (ms)
(a)
(b)
Figure 12. TMP303A Start-Up Delay vs. Output Voltage (HYSTSET0 = HYSTSET1 = VS)
Copyright © 2009–2011, Texas Instruments Incorporated
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Product Folder Link(s): TMP303A TMP303B
TMP303A
TMP303B
SBOS486B –JULY 2009–REVISED JANUARY 2011
www.ti.com
After the TMP303A/B powers up, all successive
thermal response results for the device are achieved
in a time frame of 0.985s to 1s. This period is the
minimum time frame required for the push-pull output
(OUT) to change its state from high to low (or
vice-versa) while the device is active.
A maximum low output voltage is defined as a
voltage level equivalent to (0.2 × VS); likewise, a
minimum high output voltage is defined as (0.8 × VS).
The timing associated with start-up time and
conversion is shown in Figure 13.
70
60
50
40
30
20
10
0
0.01
0.1
1.0
10
Time (sec)
1
0
0.01
0.1
1.0
10
Time (sec)
Figure 13. TMP303A Start-Up and Conversion Timing (HYSTSET0 = HYSTSET1 = VS)
8
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Copyright © 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): TMP303A TMP303B
TMP303A
TMP303B
www.ti.com
SBOS486B –JULY 2009–REVISED JANUARY 2011
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (September 2009) to Revision B
Page
•
Added TMP303B device to data sheet ................................................................................................................................. 1
Copyright © 2009–2011, Texas Instruments Incorporated
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Product Folder Link(s): TMP303A TMP303B
PACKAGE OPTION ADDENDUM
www.ti.com
27-Jan-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TMP303ADRLR
TMP303ADRLT
TMP303BDRLR
TMP303BDRLT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT
SOT
SOT
SOT
DRL
DRL
DRL
DRL
6
6
6
6
4000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Add to cart
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Add to cart
Add to cart
Add to cart
4000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMP303ADRLR
TMP303ADRLR
TMP303ADRLT
TMP303ADRLT
TMP303BDRLR
TMP303BDRLR
TMP303BDRLT
TMP303BDRLT
SOT
SOT
SOT
SOT
SOT
SOT
SOT
SOT
DRL
DRL
DRL
DRL
DRL
DRL
DRL
DRL
6
6
6
6
6
6
6
6
4000
4000
250
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
8.4
9.5
8.4
9.5
8.4
9.5
8.4
9.5
1.98
1.78
1.98
1.78
1.98
1.78
1.98
1.78
1.78
1.78
1.78
1.78
1.78
1.78
1.78
1.78
0.69
0.69
0.69
0.69
0.69
0.69
0.69
0.69
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q2
Q3
Q2
Q3
Q2
Q3
Q2
250
4000
4000
250
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMP303ADRLR
TMP303ADRLR
TMP303ADRLT
TMP303ADRLT
TMP303BDRLR
TMP303BDRLR
TMP303BDRLT
TMP303BDRLT
SOT
SOT
SOT
SOT
SOT
SOT
SOT
SOT
DRL
DRL
DRL
DRL
DRL
DRL
DRL
DRL
6
6
6
6
6
6
6
6
4000
4000
250
202.0
180.0
202.0
180.0
202.0
180.0
202.0
180.0
201.0
180.0
201.0
180.0
201.0
180.0
201.0
180.0
28.0
30.0
28.0
30.0
28.0
30.0
28.0
30.0
250
4000
4000
250
250
Pack Materials-Page 2
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
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Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
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Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Medical
Logic
Security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense www.ti.com/space-avionics-defense
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
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