TMP468AIRGTT [TI]
±0.75⁰C 高精度多通道远程和本地温度传感器 | RGT | 16 | -40 to 125;
| 型号： | TMP468AIRGTT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | ±0.75⁰C 高精度多通道远程和本地温度传感器 | RGT | 16 | -40 to 125 温度传感 传感器 温度传感器 |
| 文件： | 总49页 (文件大小：1949K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TMP468
ZHCSFP4B –NOVEMBER 2016–REVISED JUNE 2017
TMP468 9 通道（8 条远程通道和 1 条本地通道）高精度温度传感器
1 特性
的前两个句子
1
•
8 通道 远程二极管温度传感器精度：±0.75°C（最
大值）
3 说明
TMP468器件是一款使用双线制 SMBus 或 I2C 兼容接
口的多区域高精度低功耗温度传感器。除了本地温度
外，还可以同时监控多达八个连接远程二极管的温度区
域。聚合系统中的温度测量可通过缩小保护频带提升性
能，并且可以降低电路板复杂程度。典型用例为监测服
务器和电信设备等复杂系统中不同处理器（如 MCU、
GPU 和 FPGA）的温度。该 器件 将诸如串联电阻抵
消、可编程非理想性因子、可编程偏移和可编程温度限
值等高级特性完美结合，提供了一套精度和抗扰度更高
且稳健耐用的温度监控解决方案。
•
•
本地和远程二极管精度：±0.75°C（最大值）
适用于 DSBGA 封装的本地温度传感器精度：±
0.35°C（最大值）
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温度分辨率：0.0625°C
电源和逻辑电压范围：1.7V 至 3.6V
67µA 工作电流（1SPS，所有通道激活）
0.3µA 关断电流
远程二极管：串联电阻抵消、
η 因子校正、偏移校正和二极管故障检测
寄存器锁定功能可保护关键寄存器
兼容 I2C 或 SMBus™的双线制接口，支持引脚可
编程地址
•
•
八个远程通道（以及本地通道）均可独立编程，设定两
个在测量位置的相应温度超出对应值时触发的阈值。此
外，还可通过可编程迟滞设置避免阈值持续切换。
•
16 凸点 DSBGA 和 16 引脚 VQFN 封装
2 应用
TMP468 器件可提供高测量精度 (0.75°C) 和测量分辨
率 (0.0625°C)。该器件还支持低电压轨（1.7V 至
3.6V）和通用双线制接口，采用高空间利用率的小型
封装（3mm × 3mm 或 1.6mm × 1.6mm），可在计算
系统中轻松集成。远程结支持 –55°C 至 +150°C 的温
度范围。
•
微控制器 (MCU)、图形处理器 (GPU)、专用集成电
路 (ASIC)、现场可编程门阵列 (FPGA)、数字信号
处理器 (DSP) 和中央处理器 (CPU) 温度监控
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电信设备
服务器和个人计算机
云以太网交换机
器件信息(1)
安全数据中心
器件型号
TMP468
封装
DSBGA (16)
VQFN (16)
封装尺寸（标称值）
1.60mm x 1.60mm
3.00mm x 3.00mm
高度集成的医疗系统
精密仪表和测试设备
发光二极管 (LED) 照明温度控制
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
典型应用电路原理图
Remote
Zone 4
Remote
Zone 3
Remote
Remote
Zone 2
Zone 1
1.7 V to 3.6 V
CBYPASS
RS1 RS2
RS1 RS2
RS1 RS2
CDIFF
RS1 RS2
CDIFF
RSCL RSDA RT2 RT
D3
V+
CDIFF
CDIFF
2-Wire Interface
SMBus / I2
A1
D4
C4
C3
D1+
D2+
D3+
D4+
D-
C
TMP468 SCL
SDA
B1
C1
D1
A3
A2
B2
C2
D2
Compatible
Controller
THERM2
D5+
Overtemperature
Shutdown
B3
B4
D6+
D7+
D8+
THERM
Local
ADD
Zone 9
CDIFF
CDIFF
RS1 RS2
CDIFF
CDIFF
GND
A4
RS1 RS2
RS1 RS2
RS1 RS2
Remote
Zone 5
Remote
Zone 6
Remote
Zone 7
Remote
Zone 8
Copyright
© 2016, Texas Instruments Incorporated
有关远程二极管建议，请参阅Design Requirements部分。
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SBOS762
TMP468
ZHCSFP4B –NOVEMBER 2016–REVISED JUNE 2017
www.ti.com.cn
目录
7.4 Device Functional Modes........................................ 13
7.5 Programming........................................................... 13
7.6 Register Maps......................................................... 19
Application and Implementation ........................ 29
8.1 Application Information............................................ 29
8.2 Typical Application .................................................. 30
Power Supply Recommendations...................... 33
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Two-Wire Timing Requirements ............................... 7
6.7 Typical Characteristics.............................................. 8
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 11
8
9
10 Layout................................................................... 34
10.1 Layout Guidelines ................................................. 34
10.2 Layout Example .................................................... 35
11 器件和文档支持 ..................................................... 37
11.1 接收文档更新通知 ................................................. 37
11.2 社区资源................................................................ 37
11.3 商标....................................................................... 37
11.4 静电放电警告......................................................... 37
11.5 Glossary................................................................ 37
12 机械、封装和可订购信息....................................... 37
7
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision A (March 2017) to Revision B
Page
•
更新的封装信息..................................................................................................................................................................... 37
Changes from Original (November 2016) to Revision A
Page
•
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•
•
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已添加 16 引脚 VQFN 封装版本（整个数据表中）。............................................................................................................. 1
已删除 说明 （续） 部分并将文本移到说明部分..................................................................................................................... 1
已添加 VQFN 封装和封装尺寸信息至器件信息表................................................................................................................... 1
已添加 版权声明至典型应用原理图......................................................................................................................................... 1
Added RGT (VQFN) pinout diagram in the Pin Configuration and Functions section .......................................................... 4
Added remote junction temperature parameter and values to Recommended Operating Conditions table ......................... 5
Changed formatting of Thermal Information table note ......................................................................................................... 5
Changed TMP468 Thermal Information table package from "RGT (QFN)" to "RGT (VQFN)" .............................................. 5
Updated formatting of Two-Wire Timing Requirements table ............................................................................................... 7
Changed Timing Requirements table note parameter from tVD;DATA to tVD;DAT ........................................................................ 7
已添加 2017 copyright to Functional Block Diagram ........................................................................................................... 10
已更改 table headers in Continuous Conversion Times table ............................................................................................. 26
已添加 2017 copyright to Typical Application schematic in Application Information section................................................ 30
已更改 η-factor setting from 1.003674 to 1.0067 in Figure 23 table note in Typical Application section............................. 30
已更改 conversion rate from 16 conversions/second to 1 conversion/second in the Detailed Design Procedure section .. 32
已更改 units of 公式 7 from "µs" to "µA"............................................................................................................................... 32
2
Copyright © 2016–2017, Texas Instruments Incorporated
TMP468
www.ti.com.cn
ZHCSFP4B –NOVEMBER 2016–REVISED JUNE 2017
5 Pin Configuration and Functions
TMP468 YFF Package
16-Pin DSBGA
Bottom View
V+
(D3)
D4+
(D1)
D8+
(D2)
SCL
(D4)
THERM2
(C3)
SDA
(C4)
D3+
(C1)
D7+
(C2)
D6+
(B2)
D2+
(B1)
THERM
(B3)
ADD
(B4)
D1+
(A1)
D5+
(A2)
D-
(A3)
GND
(A4)
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
ADD
B4
Digital input
Analog input
Address select. Connect to GND, V+, SDA, or SCL.
Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An
unused channel must be connected to D–.
D1+
D2+
D3+
D4+
D5+
D6+
D7+
D8+
A1
B1
C1
D1
A2
B2
C2
D2
Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An
unused channel must be connected to D–.
Analog input
Analog input
Analog input
Analog input
Analog input
Analog input
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An
unused channel must be connected to D–.
Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An
unused channel must be connected to D–.
Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An
unused channel must be connected to D–.
Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An
unused channel must be connected to D–.
Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An
unused channel must be connected to D–.
Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An
unused channel must be connected to D–.
D–
A3
A4
Analog input
Ground
Negative connection to remote temperature sensors. Common for 8 remote channels.
Supply ground connection
GND
Serial clock line for I2C- or SMBus compatible two-wire interface.
Requires a pullup resistor to a voltage between 1.7 V and 3.6 V (not necessarily V+) if driven by an
open-drain output.
SCL
D4
C4
B3
Digital input
Serial data line for I2C or SMBus compatible two-wire interface. Open-drain; requires a pullup resistor
to a voltage between 1.7 V and 3.6 V, not necessarily V+.
Bidirectional digital
input/output
SDA
Thermal shutdown or fan-control pin.
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not necessarily
V+. If this pin is not used it may be left open or grounded.
THERM
Digital output
Second THERM output.
THERM2
V+
C3
D3
Digital output
Power supply
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not necessarily
V+. If this pin is not used it may be left open or grounded.
Positive supply voltage, 1.7 V to 3.6 V; requires 0.1-µF bypass capacitor to ground.
Copyright © 2016–2017, Texas Instruments Incorporated
3
TMP468
ZHCSFP4B –NOVEMBER 2016–REVISED JUNE 2017
www.ti.com.cn
TMP468 RGT Package
16-Pin VQFN
Top View
D6+
D5+
D4+
D3+
1
2
3
4
12
SDA
11
THERM2
THERM
ADD
Thermal
Pad
10
9
Not to scale
NC - No internal connection
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
ADD
9
Digital input
Analog input
Address select. Connect to GND, V+, SDA, or SCL.
Positive connection to remote temperature sensors. A total of 8 remote channels are
supported. An unused channel must be connected to D–.
D1+
D2+
D3+
D4+
D5+
D6+
D7+
D8+
6
5
Positive connection to remote temperature sensors. A total of 8 remote channels are
supported. An unused channel must be connected to D–.
Analog input
Analog input
Analog input
Analog input
Analog input
Analog input
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are
supported. An unused channel must be connected to D–.
4
Positive connection to remote temperature sensors. A total of 8 remote channels are
supported. An unused channel must be connected to D–.
3
Positive connection to remote temperature sensors. A total of 8 remote channels are
supported. An unused channel must be connected to D–.
2
Positive connection to remote temperature sensors. A total of 8 remote channels are
supported. An unused channel must be connected to D–.
1
Positive connection to remote temperature sensors. A total of 8 remote channels are
supported. An unused channel must be connected to D–.
16
15
Positive connection to remote temperature sensors. A total of 8 remote channels are
supported. An unused channel must be connected to D–.
D–
7
8
Analog input
Ground
Negative connection to remote temperature sensors. Common for 8 remote channels.
Supply ground connection
GND
Serial clock line for I2C or SMBus-compatible two-wire interface.
Requires a pullup resistor to a voltage between 1.7 V and 3.6 V (not necessarily V+) if driven
by an open-drain output.
SCL
13
12
10
Digital input
Serial data line for I2C- or SMBus-compatible two-wire interface. Open-drain; requires a pullup
resistor to a voltage between 1.7 V and 3.6 V, not necessarily V+.
Bidirectional digital
input/output
SDA
Thermal shutdown or fan-control pin.
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not
necessarily V+. If this pin is not used it may be left open or grounded.
THERM
Digital output
Second THERM output.
THERM2
V+
11
14
Digital output
Power supply
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not
necessarily V+. If this pin is not used it may be left open or grounded.
Positive supply voltage, 1.7 V to 3.6 V; requires 0.1-µF bypass capacitor to ground.
4
Copyright © 2016–2017, Texas Instruments Incorporated
TMP468
www.ti.com.cn
ZHCSFP4B –NOVEMBER 2016–REVISED JUNE 2017
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
MAX
UNIT
Power supply
Input voltage
V+
6
6
V
THERM, THERM2, SDA, SCL, and ADD only
((V+) + 0.3)
and ≤ 6
D1+ through D8+
–0.3
V
D– only
–0.3
–25
–10
–55
0.3
SDA sink
All other pins
Input current
mA
10
Operating temperature
150
150
150
°C
°C
°C
Junction temperature (TJ, maximum)
Storage temperature, Tstg
–60
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
±2000
±750
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged device model (CDM), JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
1.7
NOM
MAX
3.6
UNIT
V
V+
TA
TD
Supply voltage
Operating free-air temperature
Remote junction temperature
–40
–55
125
150
°C
°C
6.4 Thermal Information
TMP468
THERMAL METRIC(1)
RGT (VQFN)
YFF (DSBGA)
UNIT
16 PINS
16 PINS
76
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
46
43
17
0.8
5
°C/W
°C/W
°C/W
°C/W
°C/W
0.7
13
Junction-to-top characterization parameter
Junction-to-board characterization parameter
0.4
ψJB
13
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Copyright © 2016–2017, Texas Instruments Incorporated
5
TMP468
ZHCSFP4B –NOVEMBER 2016–REVISED JUNE 2017
www.ti.com.cn
6.5 Electrical Characteristics
at TA = –40°C to +125°C and V+ = 1.7 V to 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TEMPERATURE MEASUREMENT
TA = 20°C to 30°C, V+ = 1.7 V to 2 V (DSBGA)
TA = –40°C to 125°C, V+ = 1.7 V to 2 V (DSBGA)
TA = –40°C to 100°C, V+ = 1.7 V to 3.6 V (VQFN)
TA = –40°C to 125°C, V+ = 1.7 V to 3.6 V
(DSBGA):
–0.35
–0.75
–1
±0.125
±0.125
±0.5
0.35
0.75
1
°C
°C
°C
TLOCAL
Local temperature sensor accuracy
TA = –10°C to 50°C, TD = –55°C to 150°C
V+ = 1.7 V to 3.6 V
–0.75
±0.125
0.75
(VQFN):
TREMOTE Remote temperature sensor accuracy
Local temperature error supply sensitivity
°C
TA = –10°C to 85°C, TD = –55°C to 150°C
V+ = 1.7 V to 3.6 V
TA = –40°C to 125°C, TD = –55°C to 150°C
V+ = 1.7 V to 3.6 V
–1
±0.5
1
V+ = 1.7 V to 3.6 V
–0.15
–0.25
±0.05
±0.1
0.15
0.25
°C/V
°C/V
Remote temperature error supply sensitivity V+ = 1.7 V to 3.6 V
Temperature resolution
(local and remote)
0.0625
°C
ADC conversion time
ADC resolution
One-shot mode, per channel (local or remote)
16
13
17
ms
Bits
High
120
45
Remote sensor
source current
Medium
Low
Remote transistor ideality factor
SERIAL INTERFACE (SCL, SDA)
Series resistance 1 kΩ (maximum)
µA
7.5
η
1.008
VIH
VIL
High-level input voltage
Low-level input voltage
Hysteresis
0.7 × (V+)
V
V
0.3 × (V+)
200
mV
mA
V
SDA output-low sink current
20
–1
IO = –20 mA, V+ ≥ 2 V
IO = –15 mA, V+ < 2 V
0 V ≤ VIN ≤ 3.6 V
0.15
0.4
0.2 × V+
1
VOL
Low-level output voltage
V
Serial bus input leakage current
Serial bus input capacitance
μA
pF
4
DIGITAL INPUTS (ADD)
VIH
VIL
High-level input voltage
0.7 × (V+)
–0.3
V
V
Low-level input voltage
Input leakage current
Input capacitance
0.3 × (V+)
1
0 V ≤ VIN ≤ 3.6 V
–1
μA
pF
4
DIGITAL OUTPUTS (THERM, THERM2)
Output-low sink current
VOL = 0.4 V
IO = –6 mA
VO = V+
6
mA
V
VOL
IOH
Low-level output voltage
0.15
0.4
1
High-level output leakage current
μA
POWER SUPPLY
V+ Specified supply voltage range
1.7
3.6
375
600
21
V
Active conversion, local sensor
Active conversion, remote sensors
Standby mode (between conversions)
Shutdown mode, serial bus inactive
Shutdown mode, serial bus active, fS = 400 kHz
Shutdown mode, serial bus active, fS = 2.56 MHz
Rising edge
240
400
15
µA
IQ
Quiescent current
0.3
120
300
1.5
1.2
0.2
4
µA
µA
1.65
1.35
POR
POH
Power-on-reset threshold
Power-on-reset hysteresis
V
V
Falling edge
1
6
Copyright © 2016–2017, Texas Instruments Incorporated
TMP468
www.ti.com.cn
ZHCSFP4B –NOVEMBER 2016–REVISED JUNE 2017
6.6 Two-Wire Timing Requirements
at TA = –40°C to +125°C and V+ = 1.7 V to 3.6 V (unless otherwise noted)
The master and the slave have the same V+ value. Values are based on statistical analysis of samples tested during initial
release.
MIN
MAX
UNIT
Fast mode
0.001
0.001
1300
160
600
160
600
160
600
160
0
0.4
fSCL
SCL operating frequency
MHz
High-speed mode
Fast mode
2.56
Bus free time between stop and start
condition
tBUF
ns
ns
High-speed mode
Fast mode
Hold time after repeated start condition.
After this period, the first clock is generated.
tHD;STA
tSU;STA
tSU;STO
tHD;DAT
tVD;DAT
tSU;DAT
tLOW
High-speed mode
Fast mode
Repeated start condition setup time
Stop condition setup time
Data hold time when SDA
Data valid time(2)
ns
High-speed mode
Fast mode
ns
High-speed mode
Fast mode
(1)ns
ns
High-speed mode
Fast mode
0
130
900
—
0
High-speed mode
Fast mode
—
100
20
Data setup time
ns
High-speed mode
Fast mode
1300
250
600
60
SCL clock low period
SCL clock high period
Data fall time
ns
High-speed mode
Fast mode
tHIGH
ns
High-speed mode
Fast mode
20 × (V+ / 5.5)
300
100
300
40
tF – SDA
tF, tR – SCL
tR
ns
High-speed mode
Fast mode
Clock fall and rise time
Rise time for SCL ≤ 100 kHz
Serial bus timeout
ns
High-speed mode
Fast mode
1000
ns
High-speed mode
Fast mode
15
15
20
20
ms
High-speed mode
(1) The maximum tHD;DAT can be 0.9 µs for fast mode, and is less than the maximum tVD;DAT by a transition time.
(2) tVD;DAT = time for data signal from SCL LOW to SDA output (HIGH to LOW, depending on which is worse).
tr
t(LOW)
tf
VIH
VIL
SCL
SDA
t(HIGH)
t(SU:STA)
t(SU:STO)
t(HD:STA)
t(HD:DAT)
t(SU:DAT)
t(BUF)
VIH
VIL
P
S
S
P
Figure 1. Two-Wire Timing Diagram
版权 © 2016–2017, Texas Instruments Incorporated
7
TMP468
ZHCSFP4B –NOVEMBER 2016–REVISED JUNE 2017
www.ti.com.cn
6.7 Typical Characteristics
at TA = 25°C and V+ = 3.6 V (unless otherwise noted)
1.5
1
1.5
Max Limit
Max Limit
Average + 3s
1
Average + 3s
0.5
0
0.5
Typical Units
0
Typical Units
-0.5
-1
-0.5
-1
Average - 3s
Min Limit
Average - 3s
Min Limit
-20
-1.5
-40
-1.5
-40
0
20
40
60
80
100
120
-20
0
20
40
60
80
100
120
Ambient Temperature (èC)
Ambient Temperature (èC)
D001
Typical behavior of 75 VQFN devices over temperature at V+ =
1.8 V
Typical behavior of 95 DSBGA devices over temperature at V+ =
1.8 V
图 3. Local Temperature Error vs Ambient Temperature
图 2. Local Temperature Error vs Ambient Temperature
1.5
1.5
Average + 3s
Max Limit
Max Limit
Average + 3s
1
1
0.5
0
0.5
Typical Units
Typical Units
0
-0.5
-1
-0.5
-1
Min Limit
-25
Average - 3s
75 100
Average - 3s
Min Limit
0
-1.5
-50
-1.5
0
25
50
125
-50
-25
25
50
75
100
125
Device Junction Temperature (èC)
Device Junction Temperature (°C)
D003
Typical behavior of 75 VQFN devices over temperature at V+ =
1.8 V with the remote diode junction at 150°C.
Typical behavior of 30 DSBGA devices over temperature at V+ =
1.8 V with the remote diode junction at 150°C.
图 5. Remote Temperature Error vs Device Junction
图 4. Remote Temperature Error vs Device Junction
Temperature
Temperature
1
40
D+ to V+
D+ to GND
0.8
30
20
Average + 3s
0.6
0.4
0.2
0
Max Limit
10
0
Typical Units
-0.2
-0.4
-0.6
-0.8
-1
-10
-20
-30
-40
Min Limit
Average - 3s
1
10
100
-40
-20
0
20
40
60
80
100
120
Leakage Resistance (MW)
Device Junction Temperature (°C)
Typical behavior of 30 devices over temperature with V+ from 1.8
V to 3.6 V
图 7. Remote Temperature Error vs Leakage Resistance
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图 6. Remote Temperature Error Power Supply Sensitivity vs
Device Junction Temperature
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Typical Characteristics (接下页)
at TA = 25°C and V+ = 3.6 V (unless otherwise noted)
0.5
0
-5
V+ = 1.8 V
V+ = 3.6 V
0.4
0.3
0.2
0.1
0
-10
-15
-20
-25
-30
-35
-40
-0.1
-0.2
-0.3
-0.4
-0.5
0
500 1000 1500 2000 2500 3000 3500 4000 4500
0
2
4
6
8
10
12
14
16
18
20
Series Resistance (W)
Differential Capacitance (nF)
No physical capacitance during measurement
No physical series resistance on D+, D– pins during measurement
图 8. Remote Temperature Error vs Series Resistance
图 9. Remote Temperature Error vs
Differential Capacitance
400
800
V+ = 1.8 V
V+ = 3.6 V
V+ = 1.8 V
V+ = 3.6 V
360
700
600
500
400
300
200
100
0
320
280
240
200
160
120
80
40
0
0.05 0.1
1
10
100
1k
10k
100k
1M
10M
Conversion Rate (Hz)
Frequency (Hz)
16 samples per second (default mode)
图 10. Quiescent Current vs Conversion Rate °
图 11. Shutdown Quiescent Current
vs SCL Clock Frequency
400
390
380
370
360
350
340
330
320
310
300
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1.5
2
2.5
3
3.5
4
1.5
2
2.5
3
3.5
4
V+ Voltage (V)
V+ Voltage (V)
图 12. Quiescent Current vs Supply Voltage
图 13. Shutdown Quiescent Current vs Supply Voltage
(at Default Conversion Rate of 16 Conversions Per Second)
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7 Detailed Description
7.1 Overview
The TMP468 device is a digital temperature sensor that combines a local temperature measurement channel
and eight remote-junction temperature measurement channels in VQFN-16 or DSBGA-16 packages. The device
has a two-wire-interface that is compatible with I2C or SMBus interfaces and includes four pin-programmable bus
address options. The TMP468 is specified over a local device temperature range from –40°C to +125°C. The
TMP468 device also contains multiple registers for programming and holding configuration settings, temperature
limits, and temperature measurement results. The TMP468 pinout includes THERM and THERM2 outputs that
signal overtemperature events based on the settings of temperature limit registers.
7.2 Functional Block Diagram
V+
ADD
SCL
Serial
Interface
Register
Bank
SDA
THERM
Oscillator
Local
Thermal
BJT
V+
Control
Logic
6 × I
16 × I
I
THERM2
D1+
D2+
D3+
D4+
D5+
D6+
D7+
D8+
MUX
Voltage
Reference
MUX
ADC
D-
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GND
10
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7.3 Feature Description
7.3.1 Temperature Measurement Data
The local and remote temperature sensors have a resolution of 13 bits (0.0625°C). Temperature data that result
from conversions within the default measurement range are represented in binary form, as shown in the
Standard Binary column of 表 1. Negative numbers are represented in two's-complement format. The resolution
of the temperature registers extends to 255.9375°C and down to –256°C, but the actual device is limited to
ranges as specified in the Electrical Characteristics table to meet the accuracy specifications. The TMP468
device is specified for ambient temperatures ranging from –40°C to +125°C; parameters in the Absolute
Maximum Ratings table must be observed to prevent damage to the device.
表 1. Temperature Data Format (Local and Remote Temperature)
LOCAL OR REMOTE TEMPERATURE REGISTER VALUE
(0.0625°C RESOLUTION)
STANDARD BINARY(1)
TEMPERATURE
(°C)
BINARY
HEX
E0 00
E7 00
F3 80
FF F0
FF F8
00 00
00 08
00 10
00 18
00 20
00 28
00 30
00 38
00 40
00 48
00 50
00 58
00 60
00 68
00 70
00 78
00 80
02 80
05 00
0C 80
19 00
25 80
32 00
3E 80
3F 80
4B 00
57 80
5F 80
–64
–50
1110 0000 0000 0000
1110 0111 0000 0000
1111 0011 1000 0000
1111 1111 1111 0000
1111 1111 1111 1000
0000 0000 0000 0000
0000 0000 0000 1000
0000 0000 0001 0000
0000 0000 0001 1000
0000 0000 0010 0000
0000 0000 0010 1000
0000 0000 0011 0000
0000 0000 0011 1000
0000 0000 0100 0000
0000 0000 0100 1000
0000 0000 0101 0000
0000 0000 0101 1000
0000 0000 0110 0000
0000 0000 0110 1000
0000 0000 0111 0000
0000 0000 0111 1000
0000 0000 1000 0000
0000 0010 1000 0000
0000 0101 0000 0000
0000 1100 1000 0000
0001 1001 0000 0000
0010 0101 1000 0000
0011 0010 0000 0000
0011 1110 1000 0000
0011 1111 1000 0000
0100 1011 0000 0000
0101 0111 1000 0000
0101 1111 1000 0000
–25
–0.1250
–0.0625
0
0.0625
0.1250
0.1875
0.2500
0.3125
0.3750
0.4375
0.5000
0.5625
0.6250
0.6875
0.7500
0.8125
0.8750
0.9375
1
5
10
25
50
75
100
125
127
150
175
191
(1) Resolution is 0.0625°C per count. Negative numbers are represented in two's-complement format.
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Both local and remote temperature data use two bytes for data storage with a two's-complement format for
negative numbers. The high byte stores the temperature with 2°C resolution. The second or low byte stores the
decimal fraction value of the temperature and allows a higher measurement resolution, as shown in 表 1. The
measurement resolution for both the local and the remote channels is 0.0625°C.
7.3.2 Series Resistance Cancellation
Series resistance cancellation automatically eliminates the temperature error caused by the resistance of the
routing to the remote transistor or by the resistors of the optional external low-pass filter. A total up to 1-kΩ series
resistance can be cancelled by the TMP468 device, which eliminates the need for additional characterization and
temperature offset correction. See 图 8 for details on the effects of series resistance on sensed remote
temperature error.
7.3.3 Differential Input Capacitance
The TMP468 device tolerates differential input capacitance of up to 1000 pF with minimal change in temperature
error. The effect of capacitance on the sensed remote temperature error is illustrated in 图 9.
7.3.4 Sensor Fault
The TMP468 device can sense a fault at the D+ resulting from an incorrect diode connection. The TMP468
device can also sense an open circuit. Short-circuit conditions return a value of –256°C. The detection circuitry
consists of a voltage comparator that trips when the voltage at D+ exceeds (V+) – 0.3 V (typical). The
comparator output is continuously checked during a conversion. If a fault is detected, then the RxOP bit in the
Remote Channel Status register is set to 1.
When not using the remote sensor with the TMP468 device, the corresponding D+ and D– inputs must be
connected together to prevent meaningless fault warnings.
7.3.5 THERM Functions
Operation of the THERM (pin B3) and THERM2 (pin C3) interrupt pins are shown in 图 14.
The hysteresis value is stored in the THERM Hysteresis register and applies to both the THERM and THERM2
interrupts.
Temperature Conversion Complete
150
140
130
120
THERM Limit
110
100
THERM Limit - Hysteresis
90
THERM2 Limit
80
70
THERM2 Limit - Hysteresis
Measured
Temperature
60
50
Time
THERM2
THERM
图 14. THERM and THERM2 Interrupt Operation
12
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ZHCSFP4B –NOVEMBER 2016–REVISED JUNE 2017
7.4 Device Functional Modes
7.4.1 Shutdown Mode (SD)
The TMP468 shutdown mode enables the user to save maximum power by shutting down all device circuitry
other than the serial interface, and reducing current consumption to typically less than 0.3 μA; see 图 13.
Shutdown mode is enabled when the shutdown bit (SD, bit 5) of the Configuration Register is HIGH; the device
shuts down immediately once the current conversion is complete. When the SD bit is LOW, the device maintains
a continuous-conversion state.
7.5 Programming
7.5.1 Serial Interface
The TMP468 device operates only as a slave device on the two-wire bus (I2C or SMBus). Connections to either
bus are made using the open-drain I/O lines, SDA, and SCL. The SDA and SCL pins feature integrated spike
suppression filters and Schmitt triggers to minimize the effects of input spikes and bus noise. The TMP468
device supports the transmission protocol for fast (1 kHz to 400 kHz) and high-speed (1 kHz to 2.56 MHz)
modes. All data bytes are transmitted MSB first.
While the TMP468 device is unpowered bus traffic on SDA and SCL may continue without any adverse effects to
the communication or to the TMP468 device itself. As the TMP468 device is powering up, the device does not
load the bus, and as a result the bus traffic may continue undisturbed.
7.5.1.1 Bus Overview
The TMP468 device is compatible with the I2C or SMBus interface. In I2C or SMBus protocol, the device that
initiates the transfer is called a master, and the devices controlled by the master are slaves. The bus must be
controlled by a master device that generates the serial clock (SCL), controls the bus access, and generates the
start and stop conditions.
To address a specific device, a start condition is initiated. A start condition is indicated by pulling the data line
(SDA) from a high-to-low logic level when SCL is high. All slaves on the bus shift in the slave address byte, with
the last bit indicating whether a read or write operation is intended. During the ninth clock pulse, the addressed
slave responds to the master by generating an acknowledge (ACK) bit and pulling SDA low.
Data transfer is then initiated and sent over eight clock pulses followed by an acknowledge bit (ACK). During
data transfer, SDA must remain stable when SCL is high. A change in SDA when SCL is high is interpreted as a
control signal. The TMP468 device has a word register structure (16-bit wide), with data writes always requiring
two bytes. Data transfer occurs during the ACK at the end of the second byte.
After all data are transferred, the master generates a stop condition. A stop condition is indicated by pulling SDA
from low to high when SCL is high.
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Programming (接下页)
7.5.1.2 Bus Definitions
The TMP468 device has a two-wire interface that is compatible with the I2C or SMBus interface. 图 15 through 图
20 illustrate the timing for various operations on the TMP468 device. The bus definitions are as follows:
Bus Idle:
Both SDA and SCL lines remain high.
Start Data Transfer: A change in the state of the SDA line (from high to low) when the SCL line is high defines
a start condition. Each data transfer initiates with a start condition.
Stop Data Transfer: A change in the state of the SDA line (from low to high) when the SCL line is high defines
a stop condition. Each data transfer terminates with a repeated start or stop condition.
Data Transfer: The number of data bytes transferred between a start and stop condition is not limited and is
determined by the master device. The receiver acknowledges the data transfer.
Acknowledge: Each receiving device, when addressed, is obliged to generate an acknowledge bit. A device
that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way
that the SDA line is stable low during the high period of the acknowledge clock pulse. Take setup
and hold times into account. On a master receive, data transfer termination can be signaled by the
master generating a not-acknowledge on the last byte that is transmitted by the slave.
1
9
1
9
SCL
SDA
1
0
0
1
0
A1 A0 R/W
P7 P6 P5 P4 P3 P2 P1 P0
ACK
by
Device
ACK
by
Device
Stop
by
Master
Start by
Master
Frame 1
Frame 2
Serial Bus Address
Byte from Master
Pointer Byte
from Master
图 15. Two-Wire Timing Diagram for Write Pointer Byte
1
1
9
1
9
SCL
SDA
0
0
1
A1 A0 R/W
P7 P6 P5 P4 P3 P2 P1 P0
0
ACK
by
Device
ACK
by
Device
Start by
Master
Frame 1
Serial Bus Address Byte
from Master
Frame 2
Pointer Byte from Master
1
9
1
9
SCL
(continued)
SDA
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
(continued)
ACK
by
ACK
by
Stop
by
Device
Device Master
Frame 3
Frame 4
Word MSB from Master
Word LSB from Master
图 16. Two-Wire Timing Diagram for Write Pointer Byte and Value Word
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Programming (接下页)
1
1
9
1
9
SCL
SDA
0
0
1
0
A1 A0 R/W
P7 P6 P5 P4 P3 P2 P1 P0
ACK
by
Device
ACK
by
Device
Start by
Master
Frame 1
Frame 2
Serial Bus Address
Byte from Master
Pointer Byte
from Master
1
1
9
1
9
SCL
(continued)
SDA
(continued)
0
0
1
0
A1 A0
D15 D14 D13 D12 D11 D10 D9 D8
R/W
Repeat
Start by
Master
ACK
by
Device
NACK Stop
by
Master Master
by
Frame 3
Frame 4
Data Byte 1 from
Device
Serial Bus Address
Byte from Master
(1) The master must leave SDA high to terminate a single-byte read operation.
图 17. Two-Wire Timing Diagram for Pointer Set Followed by a Repeat Start and Single-Byte Read Format
1
9
1
9
SCL
SDA
1
0
0
1
0
A1 A0 R/W
P7 P6 P5 P4 P3 P2 P1 P0
ACK
by
Device
ACK
by
Device
Start by
Master
Frame 1
Frame 2
Serial Bus Address
Byte from Master
Pointer Byte
from Master
1
1
9
1
9
1
9
SCL
(continued)
SDA
(continued)
0
0
1
0
A1 A0
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
R/W
Repeat
Start by
Master
ACK
by
Device
ACK
by
Master
NACK Stop
by
Master Master
by
Frame 3
Frame 4
Data Byte 1 from
Device
Frame 5
Data Byte 2 from
Device
Serial Bus Address
Byte from Master
图 18. Two-Wire Timing Diagram for Pointer Byte Set Followed by a Repeat Start and Word (Two-Byte)
Read
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Programming (接下页)
1
9
1
9
SCL
SDA
80h Block Read Auto Increment Pointer
1
0
0
1
0
A1 A0 R/W
ACK
by
ACK
by
Device
Start by
Master
Frame 1
Frame 2
Pointer Byte from
Master
Device
Serial Bus Address
Byte from Master
1
1
9
1
9
1
9
SCL
(continued)
SDA
(continued)
0
0
1
0
A1 A0
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
R/W
Repeat
Start by
Master
ACK
by
Device
ACK
by
Master
ACK
by
Master
Frame 3
Serial Bus Address
Byte from Master
Frame 4
Word 1 MSB from
Device
Frame 5
Word 1 LSB from
Device
1
9
1
9
SCL
(continued)
SDA
(continued)
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
ACK
by
NACK Stop
by by
Master Master
Frame (2N + 2)
Word N MSB from
Device
Frame (2N + 3)
Word N LSB from
Device
Master
图 19. Two-Wire Timing Diagram for Pointer Byte Set Followed by a Repeat Start and Multiple-Word (N-
Word) Read
1
1
9
1
9
1
9
SCL
SDA
0
0
1
0
A1 A0
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
R/W
ACK
by
Device
ACK
by
Master
ACK
by
Master
Start by
Master
Frame 3
Serial Bus Address
Byte from Master
Frame 4
Word 1 MSB from
Device
Frame 5
Word 1 LSB from
Device
1
9
1
9
SCL
(continued)
SDA
(continued)
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
ACK
by
NACK Stop
by by
Master Master
Frame (2N + 2)
Word N MSB from
Device
Frame (2N + 3)
Word N LSB from
Device
Master
图 20. Two-Wire Timing Diagram for Multiple-Word (N-Word) Read Without a Pointer Byte Set
16
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Programming (接下页)
7.5.1.3 Serial Bus Address
To communicate with the TMP468 device, the master must first address slave devices using a slave address
byte. The slave address byte consists of seven address bits and a direction bit indicating the intent of executing a
read or write operation. The TMP468 device allows up to four devices to be addressed on a single bus. The
assigned device address depends on the ADD pin connection as described in 表 2.
表 2. TMP468 Slave Address Options
SLAVE ADDRESS
ADD PIN CONNECTION
BINARY
1001000
1001001
1001010
1001011
HEX
48
GND
V+
49
SDA
SCL
4A
4B
7.5.1.4 Read and Write Operations
Accessing a particular register on the TMP468 device is accomplished by writing the appropriate value to the
pointer register. The value for the pointer register is the first byte transferred after the slave address byte with the
R/W bit low. Every write operation to the TMP468 device requires a value for the pointer register (see 图 16).
The TMP468 registers can be accessed with block or single register reads. Block reads are only supported for
pointer values 80h to 88h. Registers at 80h through 88h mirror the Remote and Local Temperature registers (00h
to 08h). Pointer values 00h to 08h are for single register reads.
7.5.1.4.1 Single Register Reads
When reading from the TMP468 device, the last value stored in the pointer register by a write operation is used
to determine which register is read by a read operation. To change which register is read for a read operation, a
new value must be written to the pointer register. This transaction is accomplished by issuing a slave address
byte with the R/W bit low, followed by the pointer register byte; no additional data are required. The master can
then generate a start condition and send the slave address byte with the R/W bit high to initiate the read
command; see 图 17 through 图 19 for details of this sequence.
If repeated reads from the same register are desired, continually sending the pointer register bytes is not
necessary because the TMP468 device retains the pointer register value until the value is changed by the next
write operation. The register bytes are sent by the MSB first, followed by the LSB. If only one byte is read (MSB),
a consecutive read of TMP468 device results in the MSB being transmitted first. The LSB can only be accessed
through two-byte reads.
The master terminates a read operation by issuing a not-acknowledge (NACK) command at the end of the last
byte to be read or transmitting a stop condition. For a single-byte operation, the master must leave the SDA line
high during the acknowledge time of the first byte that is read from the slave.
The TMP468 register structure has a word (two-byte) length, so every write transaction must have an even
number of bytes (MSB and LSB) following the pointer register value (see 图 16). Data transfers occur during the
ACK at the end of the second byte or LSB. If the transaction does not finish, signaled by the ACK at the end of
the second byte, then the data is ignored and not loaded into the TMP468 register. Read transactions do not
have the same restrictions and may be terminated at the end of the last MSB.
7.5.1.4.2 Block Register Reads
The TMP468 supports block mode reads at address 80h through 88h for temperature results alone. Setting the
pointer register to 80h signals to the TMP468 device that a block of more than two bytes must be transmitted
before a stop is issued. In this mode, the TMP468 device auto increments the internal pointer. After the 18 bytes
of temperature data are transmitted, the internal pointer resets to 80h. If the transmission is terminated before
register 88h is read, the pointer increments so a consecutive read (without a pointer set) can access the next
register.
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7.5.1.5 Timeout Function
The TMP468 device resets the serial interface if either SCL or SDA are held low for 17.5 ms (typical) between a
start and stop condition. If the TMP468 device is holding the bus low, the device releases the bus and waits for a
start condition. To avoid activating the timeout function, maintain a communication speed of at least 1 kHz for the
SCL operating frequency.
7.5.1.6 High-Speed Mode
For the two-wire bus to operate at frequencies above 1 MHz, the master device must issue a high-speed mode
(HS-mode) master code (0000 1xxx) as the first byte after a start condition to switch the bus to high-speed
operation. The TMP468 device does not acknowledge the master code byte, but switches the input filters on
SDA and SCL and the output filter on SDA to operate in HS-mode, allowing transfers up to 2.56 MHz. After the
HS-mode master code is issued, the master transmits a two-wire slave address to initiate a data transfer
operation. The bus continues to operate in HS-mode until a stop condition occurs on the bus. Upon receiving the
stop condition, the TMP468 device switches the input and output filters back to fast mode.
7.5.2 TMP468 Register Reset
The TMP468 registers can be software reset by setting bit 15 of the Software Reset register (20h) to 1. This
software reset restores the power-on-reset state to all TMP468 registers and aborts any conversion in progress.
7.5.3 Lock Register
All of the configuration and limit registers may be locked for writes (making the registers write-protected), which
decreases the chance of software runaway from issuing false changes to these registers. The Lock column in 表
3 identifies which registers may be locked. Lock mode does not effect read operations. To activate the lock
mode, Lock Register C4h must be set to 0x5CA6. The lock only remains active while the TMP468 device is
powered up. Because the TMP468 device does not contain nonvolatile memory, the settings of the configuration
and limit registers are lost once a power cycle occurs regardless if the registers are locked or unlocked.
In lock mode, the TMP468 device ignores a write operation to configuration and limit registers except for Lock
Register C4h. The TMP468 device does not acknowledge the data bytes during a write operation to a locked
register. To unlock the TMP468 registers, write 0xEB19 to register C4h. The TMP468 device powers up in locked
mode, so the registers must be unlocked before the registers accept writes of new data.
18
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7.6 Register Maps
表 3. TMP468 Register Map
PTR
(HEX)
00
POR
(HEX)
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
N/A
LOCK
(Y/N)
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
TMP468 FUNCTIONAL REGISTER - BIT DESCRIPTION
REGISTER DESCRIPTION
15
14
LT11
RT11
RT11
RT11
RT11
RT11
RT11
RT11
RT11
0
13
LT10
RT10
RT10
RT10
RT10
RT10
RT10
RT10
RT10
0
12
LT9
11
LT8
10
LT7
9
LT6
8
LT5
7
6
5
4
3
2
0(1)
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
LT12
LT4
RT4
RT4
RT4
RT4
RT4
RT4
RT4
RT4
0
LT3
RT3
RT3
RT3
RT3
RT3
RT3
RT3
RT3
0
LT2
RT2
RT2
RT2
RT2
RT2
RT2
RT2
RT2
0
LT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
0
LT0
RT0
RT0
RT0
RT0
RT0
RT0
RT0
RT0
0
Local Temperature
Remote Temperature 1
Remote Temperature 2
Remote Temperature 3
Remote Temperature 4
Remote Temperature 5
Remote Temperature 6
Remote Temperature 7
Remote Temperature 8
Software Reset Register
THERM Status
01
RT12
RT12
RT12
RT12
RT12
RT12
RT12
RT12
RST
RT9
RT9
RT9
RT9
RT9
RT9
RT9
RT9
0
RT8
RT8
RT8
RT8
RT8
RT8
RT8
RT8
0
RT7
RT7
RT7
RT7
RT7
RT7
RT7
RT7
0
RT6
RT6
RT6
RT6
RT6
RT6
RT6
RT6
0
RT5
RT5
RT5
RT5
RT5
RT5
RT5
RT5
0
02
0
03
0
04
0
05
0
06
0
07
0
08
0
20
0
21
R8TH
R8TH2
R8OPN
R7TH
R7TH2
R7OPN
R6TH
R6TH2
R6OPN
R5TH
R5TH2
R5OPN
R4TH
R4TH2
R4OPN
R3TH
R3TH2
R3OPN
R2TH
R2TH2
R2OPN
R1TH
R1TH2
R1OPN
LTH
LTH2
0
0
0
0
0
0
22
N/A
0
0
0
0
0
THERM2 Status
23
N/A
0
0
0
0
0
Remote Channel OPEN Status
Configuration Register (Enables,
OneShot, ShutDown, ConvRate,
BUSY)
30
0F9C
Y
REN8
REN7
REN6
REN5
REN4
REN3
REN2
REN1
LEN
OS
SD
CR2
CR1
CR0
BUSY
0
38
39
3A
40
0080
7FC0
7FC0
0000
Y
Y
Y
Y
0
HYS11
HYS10
HYS9
HYS8
HYS7
HYS6
HYS5
HYS4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
THERM Hysteresis
LTH1_12 LTH1_11 LTH1_10 LTH1_09 LTH1_08 LTH1_07 LTH1_06 LTH1_05 LTH1_04 LTH1_03
0
0
0
0
0
0
Local Temperature THERM Limit
Local Temperature THERM2 Limit
Remote Temperature 1 Offset
LTH2_12 LTH2_11 LTH2_10 LTH2_09 LTH2_08 LTH2_07 LTH2_06 LTH2_05 LTH2_04 LTH2_03
ROS12
RNC7
ROS12(2)
RNC6
ROS10
RNC5
ROS9
RNC4
ROS8
RNC3
ROS7
RNC2
ROS6
RNC1
ROS5
RNC0
ROS4
0
ROS3
0
ROS2
ROS1
ROS0
Remote Temperature 1 η-Factor
41
0000
Y
0
0
0
0
0
0
Correction
42
43
48
7FC0
7FC0
0000
Y
Y
Y
RTH1_12 RTH1_11 RTH1_10 RTH1_09 RTH1_08 RTH1_07 RTH1_06 RTH1_05 RTH1_04 RTH1_03
RTH2_12 RTH2_11 RTH2_10 RTH2_09 RTH2_08 RTH2_07 RTH2_06 RTH2_05 RTH2_04 RTH2_03
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Remote Temperature 1 THERM Limit
Remote Temperature 1 THERM2 Limit
Remote Temperature 2 Offset
ROS12
RNC7
ROS12
RNC6
ROS10
RNC5
ROS9
RNC4
ROS8
RNC3
ROS7
RNC2
ROS6
RNC1
ROS5
RNC0
ROS4
0
ROS3
0
ROS2
ROS1
ROS0
Remote Temperature 2 η-Factor
49
0000
Y
0
0
0
0
0
0
Correction
4A
4B
50
7FC0
7FC0
0000
Y
Y
Y
RTH1_12 RTH1_11 RTH1_10 RTH1_09 RTH1_08 RTH1_07 RTH1_06 RTH1_05 RTH1_04 RTH1_03
RTH2_12 RTH2_11 RTH2_10 RTH2_09 RTH2_08 RTH2_07 RTH2_06 RTH2_05 RTH2_04 RTH2_03
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Remote Temperature 2 THERM Limit
Remote Temperature 2 THERM2 Limit
Remote Temperature 3 Offset
ROS12
RNC7
ROS12
RNC6
ROS10
RNC5
ROS9
RNC4
ROS8
RNC3
ROS7
RNC2
ROS6
RNC1
ROS5
RNC0
ROS4
0
ROS3
0
ROS2
ROS1
ROS0
Remote Temperature 3 η-Factor
51
0000
Y
0
0
0
0
0
0
Correction
52
53
58
7FC0
7FC0
0000
Y
Y
Y
RTH1_12 RTH1_11 RTH1_10 RTH1_09 RTH1_08 RTH1_07 RTH1_06 RTH1_05 RTH1_04 RTH1_03
RTH2_12 RTH2_11 RTH2_10 RTH2_09 RTH2_08 RTH2_07 RTH2_06 RTH2_05 RTH2_04 RTH2_03
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Remote Temperature 3 THERM Limit
Remote Temperature 3 THERM2 limit
Remote temperature 4 Offset
ROS12
RNC7
ROS12
RNC6
ROS10
RNC5
ROS9
RNC4
ROS8
RNC3
ROS7
RNC2
ROS6
RNC1
ROS5
RNC0
ROS4
0
ROS3
0
ROS2
ROS1
ROS0
Remote Temperature 4 η-Factor
59
0000
Y
0
0
0
0
0
0
Correction
(1) Register bits highlighted in purple are reserved for future use and always report 0; writes to these bits are ignored.
(2) Register bits highlighted in green show sign extended values.
版权 © 2016–2017, Texas Instruments Incorporated
19
TMP468
ZHCSFP4B –NOVEMBER 2016–REVISED JUNE 2017
www.ti.com.cn
Register Maps (接下页)
表 3. TMP468 Register Map (接下页)
PTR
(HEX)
5A
POR
(HEX)
7FC0
7FC0
0000
LOCK
TMP468 FUNCTIONAL REGISTER - BIT DESCRIPTION
REGISTER DESCRIPTION
(Y/N)
15
14
13
12
11
10
9
8
7
6
5
4
3
2
0
0
0
1
0
0
0
0
0
0
0
Y
Y
Y
RTH1_12 RTH1_11 RTH1_10 RTH1_09 RTH1_08 RTH1_07 RTH1_06 RTH1_05 RTH1_04 RTH1_03
RTH2_12 RTH2_11 RTH2_10 RTH2_09 RTH2_08 RTH2_07 RTH2_06 RTH2_05 RTH2_04 RTH2_03
0
0
0
0
0
0
Remote Temperature 4 THERM Limit
Remote Temperature 4 THERM2 Limit
Remote Temperature 5 Offset
5B
60
ROS12
RNC7
ROS12
RNC6
ROS10
RNC5
ROS9
RNC4
ROS8
RNC3
ROS7
RNC2
ROS6
RNC1
ROS5
RNC0
ROS4
0
ROS3
0
ROS2
ROS1
ROS0
Remote Temperature 5 η-Factor
61
0000
Y
0
0
0
0
0
0
Correction
62
63
68
7FC0
7FC0
0000
Y
Y
Y
RTH1_12 RTH1_11 RTH1_10 RTH1_09 RTH1_08 RTH1_07 RTH1_06 RTH1_05 RTH1_04 RTH1_03
RTH2_12 RTH2_11 RTH2_10 RTH2_09 RTH2_08 RTH2_07 RTH2_06 RTH2_05 RTH2_04 RTH2_03
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Remote Temperature 5 THERM Limit
Remote Temperature 5 THERM2 Limit
Remote Temperature 6 Offset
ROS12
RNC7
ROS12
RNC6
ROS10
RNC5
ROS9
RNC4
ROS8
RNC3
ROS7
RNC2
ROS6
RNC1
ROS5
RNC0
ROS4
0
ROS3
0
ROS2
ROS1
ROS0
Remote Temperature 6 η-Factor
69
0000
Y
0
0
0
0
0
0
Correction
6A
6B
70
7FC0
7FC0
0000
Y
Y
Y
RTH1_12 RTH1_11 RTH1_10 RTH1_09 RTH1_08 RTH1_07 RTH1_06 RTH1_05 RTH1_04 RTH1_03
RTH2_12 RTH2_11 RTH2_10 RTH2_09 RTH2_08 RTH2_07 RTH2_06 RTH2_05 RTH2_04 RTH2_03
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Remote Temperature 6 THERM Limit
Remote Temperature 6 THERM2 Limit
Remote Temperature 7 Offset
ROS12
RNC7
ROS12
RNC6
ROS10
RNC5
ROS9
RNC4
ROS8
RNC3
ROS7
RNC2
ROS6
RNC1
ROS5
RNC0
ROS4
0
ROS3
0
ROS2
ROS1
ROS0
Remote Temperature 7 η-Factor
71
0000
Y
0
0
0
0
0
0
Correction
72
73
78
7FC0
7FC0
0000
Y
Y
Y
RTH1_12 RTH1_11 RTH1_10 RTH1_09 RTH1_08 RTH1_07 RTH1_06 RTH1_05 RTH1_04 RTH1_03
RTH2_12 RTH2_11 RTH2_10 RTH2_09 RTH2_08 RTH2_07 RTH2_06 RTH2_05 RTH2_04 RTH2_03
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Remote Temperature 7 THERM Limit
Remote Temperature 7 THERM2 Limit
Remote Temperature 8 Offset
ROS12
RNC7
ROS12
RNC6
ROS10
RNC5
ROS9
RNC4
ROS8
RNC3
ROS7
RNC2
ROS6
RNC1
ROS5
RNC0
ROS4
0
ROS3
0
ROS2
ROS1
ROS0
Remote Temperature 8 η-Factor
79
0000
Y
0
0
0
0
0
0
Correction
7A
7B
7FC0
7FC0
Y
Y
RTH1_12 RTH1_11 RTH1_10 RTH1_09 RTH1_08 RTH1_07 RTH1_06 RTH1_05 RTH1_04 RTH1_03
RTH2_12 RTH2_11 RTH2_10 RTH2_09 RTH2_08 RTH2_07 RTH2_06 RTH2_05 RTH2_04 RTH2_03
0
0
0
0
0
0
0
0
0
0
0
0
Remote Temperature 8 THERM Limit
Remote Temperature 8 THERM2 Limit
Local Temperature (Block Read
Range - Auto Increment Pointer
Register)
80
81
82
83
84
85
86
0000
0000
0000
0000
0000
0000
0000
N/A
N/A
N/A
N/A
N/A
N/A
N/A
LT12
RT12
RT12
RT12
RT12
RT12
RT12
LT11
RT11
RT11
RT11
RT11
RT11
RT11
LT10
RT10
RT10
RT10
RT10
RT10
RT10
LT9
RT9
RT9
RT9
RT9
RT9
RT9
LT8
RT8
RT8
RT8
RT8
RT8
RT8
LT7
RT7
RT7
RT7
RT7
RT7
RT7
LT6
RT6
RT6
RT6
RT6
RT6
RT6
LT5
RT5
RT5
RT5
RT5
RT5
RT5
LT4
RT4
RT4
RT4
RT4
RT4
RT4
LT3
RT3
RT3
RT3
RT3
RT3
RT3
LT2
RT2
RT2
RT2
RT2
RT2
RT2
LT1
RT1
RT1
RT1
RT1
RT1
RT1
LT0
RT0
RT0
RT0
RT0
RT0
RT0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Remote Temperature 1 (Block Read
Range - Auto Increment Pointer
Register)
Remote Temperature 2 (Block Read
Range - Auto Increment Pointer
Register)
Remote Temperature 3 (Block Read
Range - Auto Increment Pointer
Register)
Remote Temperature 4 (Block Read
Range - Auto Increment Pointer
Register)
Remote Temperature 5 (Block Read
Range - Auto Increment Pointer
Register)
Remote Temperature 6 (Block Read
Range - Auto Increment Pointer
Register)
20
版权 © 2016–2017, Texas Instruments Incorporated
TMP468
www.ti.com.cn
ZHCSFP4B –NOVEMBER 2016–REVISED JUNE 2017
Register Maps (接下页)
表 3. TMP468 Register Map (接下页)
PTR
POR
LOCK
(Y/N)
TMP468 FUNCTIONAL REGISTER - BIT DESCRIPTION
REGISTER DESCRIPTION
(HEX)
(HEX)
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Remote Temperature 7 (Block Read
Range - Auto Increment Pointer
Register)
87
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
RT2
RT1
RT0
0
0
0
Remote Temperature 8 (Block Read
Range - Auto Increment Pointer
Register)
88
0000
8000
N/A
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
RT2
RT1
RT0
0
0
0
Write 0x5CA6 to lock registers and 0xEB19 to unlock registers
Read back: locked 0x8000; unlocked 0x0000
Lock Register. This locks the registers
after initialization.
C4
FE
FF
5449
0468
N/A
N/A
0
0
1
0
0
0
1
0
0
0
1
1
0
0
0
0
0
0
1
1
0
1
0
0
1
1
0
0
0
0
1
0
Manufacturers Identification Register
Device Identification/Revision Register
版权 © 2016–2017, Texas Instruments Incorporated
21
TMP468
ZHCSFP4B –NOVEMBER 2016–REVISED JUNE 2017
www.ti.com.cn
7.6.1 Register Information
The TMP468 device contains multiple registers for holding configuration information, temperature measurement
results, and status information. These registers are described in 图 21 and 表 3.
7.6.1.1 Pointer Register
shows the internal register structure of the TMP468 device. The 8-bit pointer register addresses a given data
register. The pointer register identifies which of the data registers must respond to a read or write command on
the two-wire bus. This register is set with every write command. A write command must be issued to set the
proper value in the pointer register before executing a read command. 表 3 describes the pointer register and the
internal structure of the TMP468 registers. The power-on-reset (POR) value of the pointer register is 00h (0000
0000b). 表 3 lists a summary of the pointer values for the different registers. Writing data to unassigned pointer
values are ignored and does not affect the operation of the device. Reading an unassigned register returns
undefined data and is ACKed.
Pointer Register
2
Local Temp
Local THERM Limit
Local THERM2 Limit
Remote 5 Offset
Remote 5 h -factor
Remote 5 THERM
Remote 5 THERM2
2
2
2
2
2
2
Remote Temp 1
Remote Temp 2
Remote Temp 3
Remote Temp 4
Remote Temp 5
Remote Temp 6
Remote Temp 7
Remote Temp 8
SDA
SCL
Remote 1 Offset
Remote 1 h -factor
Remote 1 THERM
Remote 1 THERM2
Remote 6 Offset
Remote 6 h -factor
Remote 6 THERM
Remote 6 THERM2
Remote 2 Offset
Remote 2 h -factor
Remote 2 THERM
Remote 2 THERM2
2
2
Serial
Remote 7 Offset
Remote 7 h -factor
Remote 7 THERM
Remote 7 THERM2
Interface
THERM Status
THERM2 Status
Remote Open Status
Remote 3 Offset
Remote 3 h -factor
Remote 3 THERM
Remote 3 THERM2
Manufacturer ID
Device ID
Remote 8 Offset
Remote 8 h -factor
Remote 8 THERM
Remote 8 THERM2
Configuration
Software Reset
Lock Initialization
Remote 4 Offset
Remote 4 h -factor
Remote 4 THERM
Remote 4 THERM2
THERM Hysterisis
图 21. TMP468 Internal Register Structure
7.6.1.2 Local and Remote Temperature Value Registers
The TMP468 device has multiple 16-bit registers that hold 13-bit temperature measurement results. The 13 bits
of the local temperature sensor result are stored in register 00h. The 13 bits of the eight remote temperature
sensor results are stored in registers 01h through 08h. The four assigned LSBs of both the local (LT3:LT0) and
remote (RT3:RT0) sensors indicate the temperature value after the decimal point (for example, if the temperature
result is 10.0625°C, then the high byte is 0000 0101 and the low byte is 0000 1000). These registers are read-
only and are updated by the ADC each time a temperature measurement is complete. Asynchronous reads are
supported, so a read operation can occur at any time and results in valid conversion results being transmitted
once the first conversion is complete after power up for the channel being accessed. If after power up a read is
initiated before a conversion is complete, the read operation results in all zeros (0x0000).
7.6.1.3 Software Reset Register
The Software Reset Register allows the user to reset the TMP468 registers through software by setting the reset
bit (RST, bit 15) to 1. The power-on-reset value for this register is 0x0000. Resets are ignored when the device is
in lock mode, so writing a 1 to the RST bit does not reset any registers.
22
版权 © 2016–2017, Texas Instruments Incorporated
TMP468
www.ti.com.cn
ZHCSFP4B –NOVEMBER 2016–REVISED JUNE 2017
表 4. Software Reset Register Format
STATUS REGISTER (READ = 20h, WRITE = 20h, POR = 0x0000)
BIT NUMBER
BIT NAME
FUNCTION
15
RST
0
1 software reset device; writing a value of 0 is ignored
Reserved for future use; always reports 0
14-0
7.6.1.4 THERM Status Register
The THERM Status register reports the state of the THERM limit comparators for local and eight remote
temperatures. 表 5 lists the status register bits. The THERM Status register is read-only and is read by accessing
pointer address 21h.
表 5. THERM Status Register Format
THERM STATUS REGISTER (READ = 21h, WRITE = N/A)
BIT NUMBER
BIT NAME
R8TH
R7TH
R6TH
R5TH
R4TH
R3TH
R2TH
R1TH
LTH
FUNCTION
1 when Remote 8 exceeds the THERM limit
1 when Remote 7 exceeds the THERM limit
1 when Remote 6 exceeds the THERM limit
1 when Remote 5 exceeds the THERM limit
1 when Remote 4 exceeds the THERM limit
1 when Remote 3 exceeds the THERM limit
1 when Remote 2 exceeds the THERM limit
1 when Remote 1 exceeds the THERM limit
1 when Local sensor exceeds the THERM limit
Reserved for future use; always reports 0.
15
14
13
12
11
10
9
8
7
6:0
0
The R8TH:R1TH and LTH flags are set when the corresponding temperature exceeds the respective
programmed THERM limit (39h, 42h, 4Ah, 52h, 5Ah, 62h, 6Ah, 72h, 7Ah). These flags are reset automatically
when the temperature returns below the THERM limit minus the value set in the THERM Hysteresis register
(38h). The THERM output goes low in the case of overtemperature on either the local or remote channels, and
goes high as soon as the measurements are less than the THERM limit minus the value set in the THERM
Hysteresis register. The THERM Hysteresis register (38h) allows hysteresis to be added so that the flag resets
and the output goes high when the temperature returns to or goes below the limit value minus the hysteresis
value.
版权 © 2016–2017, Texas Instruments Incorporated
23
TMP468
ZHCSFP4B –NOVEMBER 2016–REVISED JUNE 2017
www.ti.com.cn
7.6.1.5 THERM2 Status Register
The THERM2 Status register reports the state of the THERM2 limit comparators for local and remote 1-8
temperatures. 表 6 lists the status register bits. The THERM2 Status register is read-only and is read by
accessing pointer address 22h.
表 6. THERM2 Status Register Format
THERM2 STATUS REGISTER (READ = 22h, WRITE = N/A)
BIT NUMBER
BIT NAME
R8TH2
R7TH2
R6TH2
R5TH2
R4TH2
R3TH2
R2TH2
R1TH2
LTH2
FUNCTION
1 when Remote 8 exceeds the THERM2 limit
1 when Remote 7 exceeds the THERM2 limit
1 when Remote 6 exceeds the THERM2 limit
1 when Remote 5 exceeds the THERM2 limit
1 when Remote 4 exceeds the THERM2 limit
1 when Remote 3 exceeds the THERM2 limit
1 when Remote 2 exceeds the THERM2 limit
1 when Remote 1 exceeds the THERM2 limit
1 when Local Sensor exceeds the THERM2 limit
Reserved for future use; always reports 0.
15
14
13
12
11
10
9
8
7
6:0
0
The R8TH2:R1TH2 and LTH2 flags are set when the corresponding temperature exceeds the respective
programmed THERM2 limit (3Ah, 43h, 4Bh, 53h, 5Bh, 63h, 6Bh, 73h, 7Bh). These flags are reset automatically
when the temperature returns below the THERM2 limit minus the value set in the THERM Hysteresis register
(38h). The THERM2 output goes low in the case of overtemperature on either the local or remote channels, and
goes high as soon as the measurements are less than the THERM2 limit minus the value set in the THERM
Hysteresis register. The THERM Hysteresis register (38h) allows hysteresis to be added so that the flag resets
and the output goes high when the temperature returns to or goes below the limit value minus the hysteresis
value.
7.6.1.6 Remote Channel Open Status Register
The Remote Channel Open Status register reports the state of the connection of remote channels one through
eight. 表 7 lists the status register bits. The Remote Channel Open Status register is read-only and is read by
accessing pointer address 23h.
表 7. Remote Channel Open Status Register Format
REMOTE CHANNEL OPEN STATUS REGISTER (READ = 23h, WRITE = N/A)
BIT NUMBER
BIT NAME
R8OPEN
R7OPEN
R6OPEN
R5OPEN
R4OPEN
R3OPEN
R2OPEN
R1OPEN
0
FUNCTION
1 when Remote 8 channel is an open circuit
1 when Remote 7 channel is an open circuit
1 when Remote 6 channel is an open circuit
1 when Remote 5 channel is an open circuit
1 when Remote 4 channel is an open circuit
1 when Remote 3 channel is an open circuit
1 when Remote 2 channel is an open circuit
1 when Remote 1 channel is an open circuit
Reserved for future use; always reports 0.
15
14
13
12
11
10
9
8
7:0
The R8OPEN:R1OPEN bits indicate an open-circuit condition on remote sensors eight through one, respectively.
The setting of these flags does not directly affect the state of the THERM or THERM2 output pins. Indirectly, the
temperature reading(s) may be erroneous and exceed the respective THERM and THERM2 limits, activating the
THERM or THERM2 output pins.
24
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7.6.1.7 Configuration Register
The Configuration Register sets the conversion rate, starts one-shot conversion of all enabled channels, enables
conversion the temperature channels, controls the shutdown mode and reports when a conversion is in process.
The Configuration Register is set by writing to pointer address 30h, and is read from pointer address 30h. 表 8
summarizes the bits of the Configuration Register.
表 8. Configuration Register Bit Descriptions
CONFIGURATION REGISTER (READ = 30h, WRITE = 30h, POR = 0x0F9C)
BIT NUMBER
NAME
FUNCTION
POWER-ON-RESET VALUE
1 = enable respective remote
channel 8 through 1 conversions
15:8
REN8:REN1
1111 1111
1 = enable local channel
conversion
7
LEN
1
1 = start one-shot conversion on
enabled channels
6
5
OS
SD
0
0
1 = enables device shutdown
Conversion rate control bits;
control conversion rates for all
enabled channels from 16
seconds to continuous
conversion
4:2
CR2:CR0
111
1 when the ADC is converting
(read-only bit ignores writes)
1
0
BUSY
0
0
Reserved
—
The Remote Enable eight through one (REN8:REN1, bits 15:8) bits enable conversions on the respective remote
channels. The Local Enable (LEN, bit 7) bit enables conversions of the local temperature channel. If all LEN and
REN are set to 1 (default), this enables the ADC to convert the local and all remote temperatures. If the LEN is
set to 0, the local temperature conversion is skipped. Similarly if a REN is set to 0, that remote temperature
conversion channel is skipped. The TMP468 device steps through each enabled channel in a round-robin fashion
in the following order: LOC, REM1, REM2, REM8, LOC, REM1, and so on. All local and remote temperatures are
converted by the internal ADC by default after power up. The configuration register LEN and REN bits can be
configured to save power by reducing the total ADC conversion time for applications that do not require all of the
eight remote and local temperature information. Note writing all zeros to REN8:REN1 and LEN has the same
effect as SD = 1 and OS = 0.
The shutdown bit (SD, bit 5) enables or disables the temperature-measurement circuitry. If SD = 0 (default), the
TMP468 device converts continuously at the rate set in the conversion rate register. When SD is set to 1, the
TMP468 device immediately stops the conversion in progress and instantly enters shutdown mode. When SD is
set to 0 again, the TMP468 device resumes continuous conversions starting with the local temperature.
The BUSY bit = 1 if the ADC is making a conversion. This bit is set to 0 if the ADC is not converting.
After the TMP468 device is in shutdown mode, writing a 1 to the one-shot (OS, bit 6) bit starts a single ADC
conversion of all the enabled temperature channels. This write operation starts one conversion and comparison
cycle on either the eight remote and one local sensor or any combination of sensors, depending on the LEN and
REN values in the Configuration Register (read address 30h). The TMP468 device returns to shutdown mode
when the cycle is complete. 表 9 details the interaction of the SD, OS, LEN, and REN bits.
表 9. Conversion Modes
WRITE
REN[8:1], LEN
All 0
READ
REN[8:1], LEN
All 0
FUNCTION
OS SD
OS SD
—
—
0
—
0
0
0
0
1
1
0
1
1
Shutdown
Continuous conversion
Shutdown
At least 1 enabled
At least 1 enabled
At least 1 enabled
Written value
Written value
Written value
1
1
1
One-shot conversion
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The conversion rate bits control the rate that the conversions occur (CR2:CR0, bits 4:2). The value of CR2:CR0
bits controls the idle time between conversions but not the conversion time itself, which allows the TMP468
device power dissipation to be balanced with the update rate of the temperature register. 表 10 describes the
mapping for CR2:CR0 to the conversion rate or temperature register update rate.
表 10. Conversion Rate
CR2:CR0
000
DECIMAL VALUE
FREQUENCY (Hz)
TIME (s)
0
1
2
3
4
5
6
0.0625
0.125
0.25
0.5
1
16
8
001
010
4
011
2
100
1
101
2
0.5
0.25
110
4
Continuous conversion; depends on number of enabled channels; see 表
111
7
11 (default).
表 11. Continuous Conversion Times
CONVERSION TIME (ms)
NUMBER OF REMOTE CHANNELS ENABLED
LOCAL DISABLED
LOCAL ENABLED
0
1
2
3
4
5
6
7
8
0
15.5
31.3
15.8
31.6
47.4
63.2
79
47.1
62.9
78.7
94.5
94.8
110.6
126.4
110.3
126.1
141.9
The remaining bits of the configuration register are reserved and must always be set to 0. The POR value for this
register is 0x0F9C.
7.6.1.8 η-Factor Correction Register
The TMP468 device allows for a different η-factor value to be used for converting remote channel measurements
to temperature for each temperature channel. There are eight η-Factor Correction registers assigned: one to
each of the remote input channels (addresses 41h, 49h, 51h, 59h, 61h, 69h, 71h and 79h). Each remote channel
uses sequential current excitation to extract a differential VBE voltage measurement to determine the temperature
of the remote transistor. 公式 1 shows this voltage and temperature.
≈
∆
’
÷
I2
I
hkT
q
VBE2 - VBE1
=
In
« 1 ◊
(1)
The value η in 公式 1 is a characteristic of the particular transistor used for the remote channel. The POR value
for the TMP468 device is η = 1.008. The value in the η-Factor Correction register can be used to adjust the
effective η-factor, according to 公式 2 and 公式 3.
≈
∆
«
’
÷
◊
1.008 ì 2088
2088 + NADJUST
ꢀeff
=
(2)
(3)
≈
∆
«
’
÷
◊
1.008 ì 2088
NADJUST
=
- 2088
ꢀeff
26
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The η-factor correction value must be stored in a two's-complement format, which yields an effective data range
from –128 to +127. The POR value for each register is 0000h, which does not affect register values unless a
different value is written to the register. The resolution of the η-factor register changes linearly as the code
changes and has a range from 0.0004292 to 0.0005476, with an average of 0.0004848.
表 12. η-Factor Range
NADJUST ONLY BITS 15 TO 8 IN THE REGISTER ARE SHOWN
η
BINARY
HEX
7F
0A
08
DECIMAL
0111 1111
0000 1010
0000 1000
0000 0110
0000 0100
0000 0010
0000 0001
0000 0000
1111 1111
1111 1110
1111 1100
1111 1010
1111 1000
1111 0110
1000 0000
127
10
8
0.950205
1.003195
1.004153
1.005112
1.006073
1.007035
1.007517
1.008
06
6
04
4
02
2
01
1
00
0
FF
FE
FC
FA
F8
F6
80
–1
–2
–4
–6
–8
–10
–128
1.008483
1.008966
1.009935
1.010905
1.011877
1.012851
1.073829
7.6.1.9 Remote Temperature Offset Register
The offset registers allow the TMP468 device to store any system offset compensation value that may result from
precision calibration. The value in these registers is added to the remote temperature results upon every
conversion. Each of the eight temperature channels have an independent assigned offset register (addresses
40h, 48h, 50h, 58h, 60h, 68h, 70h, and 78h). Combined with the independent η-factor corrections, this function
allows for very accurate system calibration over the entire temperature range for each remote channel. The
format of these registers is the same as the temperature value registers with a range from +127.9375 to –128.
Take care to program this register with sign extension, as values above +127.9375 and below –128 are not
supported.
7.6.1.10 THERM Hysteresis Register
The THERM Hysteresis register (address 38h) sets the value of the hysteresis used by the temperature
comparison logic. All temperature reading comparisons have a common hysteresis. Hysteresis prevents
oscillations from occurring on the THERM and THERM2 outputs as the measured temperature approaches the
comparator threshold (see the THERM Functions section). The resolution of the THERM Hysteresis register is
1°C and ranges from 0°C to 255°C.
7.6.1.11 Local and Remote THERM and THERM2 Limit Registers
Each of the eight remote and the local temperature channels has associated independent THERM and THERM2
Limit registers. There are nine THERM registers (addresses 39h, 42h, 4Ah, 52h, 5Ah, 62h, 6Ah, 72h, and 7Ah)
and nine THERM2 registers (addresses 39h, 43h, 4Bh, 53h, 5Bh, 63h, 6Bh, 73h, and 7Bh), 18 registers in total.
The resolution of these registers is 0.5°C and ranges from +255.5°C to –255°C. See the THERM Functions
section for more information.
Setting a THERM limit to 255.5°C disables the THERM limit comparison for that particular channel and disables
the limit flag from being set in the THERM Status register. This prevents the associated channel from activating
the THERM output. THERM2 limits, status, and outputs function similarly.
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7.6.1.12 Block Read - Auto Increment Pointer
Block reads can be initiated by setting the pointer register to 80h to 87h. The temperature results are mirrored at
pointer addresses 80h to 88h; temperature results for all the channels can be read with one read transaction.
Setting the pointer register to any address from 80h to 88h signals to the TMP468 device that a block of more
than two bytes must be transmitted before a design stop is issued. In block read mode, the TMP468 device auto
increments the pointer address. After 88h, the pointer resets to 80h. The master must NACK the last byte read
so the TMP468 device can discontinue driving the bus, which allows the master to initiate a stop. In this mode,
the pointer continuously loops in the address range from 80h to 88h, so the register may be easily read multiple
times. Block read does not disrupt the conversion process.
7.6.1.13 Lock Register
Register C4h allows the device configuration and limit registers to lock, as shown by the Lock column in 表 3. To
lock the registers, write 0x5CA6. To unlock the registers, write 0xEB19. When the lock function is enabled,
reading the register yields 0x8000; when unlocked, 0x0000 is transmitted.
7.6.1.14 Manufacturer and Device Identification Plus Revision Registers
The TMP468 device allows the two-wire bus controller to query the device for manufacturer and device
identifications (IDs) to enable software identification of the device at the particular two-wire bus address. The
manufacturer ID is obtained by reading from pointer address FEh; the device ID is obtained from register FFh.
Note that the most significant byte of the Device ID register identifies the TMP468 device revision level. The
TMP468 device reads 0x5449 for the manufacturer code and 0x0468 for the device ID code for the first release.
28
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8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TMP468 device requires a transistor connected between the D+ and D– pins for remote temperature
measurement. Tie the D+ pin to D– if the remote channel is not used and only the local temperature is
measured. The SDA, ALERT, and THERM pins (and SCL, if driven by an open-drain output) require pullup
resistors as part of the communication bus. TI recommends a 0.1-µF power-supply decoupling capacitor for local
bypassing. 图 22 and 图 23 illustrate the typical configurations for the TMP468 device.
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8.2 Typical Application
RS1
CDIFF
RS1
RS2
1.7 V to 3.6 V
1.7 V to 3.6 V
CDIFF
CBYPASS
RSCL RSDA RT1
RT2
RS2
RS1
B1
D2+
A1
D1+
D3
V+
B4
ADD
CDIFF
C1
D1
A2
B2
D4
C4
C3
B3
D3+
D4+
D5+
D6+
Two-Wire Interface
SMBus / I2C Compatible
Controller
SCL
SDA
RS2
TMP468
RS1
THERM2
Overtemperature
Shutdown
CDIFF
THERM
RS2
RS1
D7+
C2
D8+
D2
D-
A3
GND
A4
CDIFF
RS2
RS1
RS1
CDIFF
CDIFF
RS2
RS2
Copyright © 2017, Texas Instruments Incorporated
(1) The diode-connected configuration provides better settling time. The transistor-connected configuration provides
better series resistance cancellation. TI recommends a MMBT3904 or MMBT3906 transistor with an η-factor of 1.008.
(2) RS (optional) is < 1 kΩ in most applications. RS is the combined series resistance connected externally to the D+, D–
pins. RS selection depends on the application.
(3) CDIFF (optional) is < 1000 pF in most applications. CDIFF selection depends on the application; see 图 9.
(4) Unused diode channels must be tied to D– .as shown for D5+.
图 22. TMP468 Basic Connections Using a Discrete Remote Transistor
30
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Typical Application (接下页)
(2)
RS
Series Resistance
(2)
RS
NPN Diode-Connected Configuration(1)
(2)
RS
Series Resistance
(2)
RS
D+
D-
(3)
PNP Diode-Connected Configuration(1)
CDIFF
TMP468
(2)
RS
Series Resistance
(2)
RS
PNP Transistor-Connected Configuration(1)
(2)
(2)
RS
RS
RS
(2)
(2)
RS
Internal and PCB
Series Resistance
trocessor, CtD!, or !{L/
Integrated PNP Transistor-Connected Configuration(1)
Copyright © 2017, Texas Instruments Incorporated
图 23. TMP468 Remote Transistor Configuration Options
8.2.1 Design Requirements
The TMP468 device is designed to be used with either discrete transistors or substrate transistors built into
processor chips, field programmable gate arrays (FPGAs), and application-specific integrated circuits (ASICs) ;
see 图 23. Either NPN or PNP transistors can be used, as long as the base-emitter junction is used as the
remote temperature sensor. NPN transistors must be diode-connected. PNP transistors can either be transistor-
or diode-connected (see 图 23).
Errors in remote temperature sensor readings are typically the consequence of the ideality factor (η-factor) and
current excitation used by the TMP468 device versus the manufacturer-specified operating current for a given
transistor. Some manufacturers specify a high-level and low-level current for the temperature-sensing substrate
transistors. The TMP468 uses 7.5 μA (typical) for ILOW and 120 μA (typical) for IHIGH
.
The ideality factor (η-factor) is a measured characteristic of a remote temperature sensor diode as compared to
an ideal diode. The TMP468 allows for different η-factor values; see the η-Factor Correction Register section.
The η-factor for the TMP468 device is trimmed to 1.008. For transistors that have an ideality factor that does not
match the TMP468 device, 公式 4 can be used to calculate the temperature error.
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Typical Application (接下页)
注
For 公式 4 to be used correctly, the actual temperature (°C) must be converted to Kelvin
(K).
h -1.008
1.008
≈
’
O
TERR
=
ì 273.15 + T C
(
)
∆
«
÷
◊
where
•
•
•
TERR = error in the TMP468 device because η ≠ 1.008
η = ideality factor of the remote temperature sensor
T(°C) = actual temperature, and
(4)
(5)
In 公式 4, the degree of delta is the same for °C and K.
For η = 1.004 and T(°C) = 100°C:
1.004 - 1.008
1.008
≈
’
TERR
=
ì 273.15 + 100èC
(
)
∆
÷
◊
«
TERR = -1.48èC
If a discrete transistor is used as the remote temperature sensor with the TMP468 device, then select the
transistor according to the following criteria for best accuracy:
•
•
•
•
Base-emitter voltage is > 0.25 V at 7.5 μA, at the highest-sensed temperature.
Base-emitter voltage is < 0.95 V at 120 μA, at the lowest-sensed temperature.
Base resistance is < 100 Ω.
Tight control of VBE characteristics indicated by small variations in hFE (50 to 150).
Based on these criteria, TI recommends using a MMBT3904 (NPN) or a MMBT3906 (PNP) transistor.
8.2.2 Detailed Design Procedure
The local temperature sensor inside the TMP468 is influenced by the ambient air around the device but mainly
monitors the PCB temperature that it is mounted to. The thermal time constant for the TMP468 device is
approximately two seconds. This constant implies that if the ambient air changes quickly by 100°C, then the
TMP468 device takes approximately 10 seconds (that is, five thermal time constants) to settle to within 1°C of
the final value. In most applications, the TMP468 package is in electrical (and therefore thermal) contact with the
printed-circuit board (PCB), and subjected to forced airflow. The accuracy of the measured temperature directly
depends on how accurately the PCB and forced airflow temperatures represent the temperature that the TMP468
device is measuring. Additionally, the internal power dissipation of the TMP468 device can cause the
temperature to rise above the ambient or PCB temperature. The internal power is negligible because of the small
current drawn by the TMP468 device. 公式 6 can be used to calculate the average conversion current for power
dissipation and self-heating based on the number of conversions per second and temperature sensor channel
enabled. 公式 7 shows an example with local and all remote sensor channels enabled and conversion rate of 1
conversion per second; see the Electrical Characteristics table for typical values required for these calculations.
For a 3.3-V supply and a conversion rate of 1 conversion per second, the TMP468 device dissipates 0.224 mW
(PDIQ = 3.3 V × 68 μA) when both the remote and local channels are enabled.
Average Conversion Current = (Local Conversion Time) × (Conversions Per Second) × (Local Active IQ ) +
(Remote Conversion Time) × (Conversions Per Second) × (Remote Active IQ) × (Number of Active Channels +
(Standby Mode) × [1 œ ((Local Conversion Time) + (Remote Conversion Time) × (Number of Active
Channels)) × (Conversions Per Second)]
(6)
32
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Typical Application (接下页)
1
sec
1
Average Conversion Current =(16 ms)ì(
)ì(240 mA)
+ (16 ms)ì(
)ì(400 mA)ì(8)
sec
1
»
ÿ
+ (15 mA)ì 1 - ((16 ms)+ (16 ms)ì(8))ì(
)
…
Ÿ
⁄
sec
= 68 mA
(7)
(8)
The temperature measurement accuracy of the TMP468 device depends on the remote and local temperature
sensor being at the same temperature as the monitored system point. If the temperature sensor is not in good
thermal contact with the part of the monitored system, then there is a delay between the sensor response and
the system changing temperature. This delay is usually not a concern for remote temperature-sensing
applications that use a substrate transistor (or a small, SOT-23 transistor) placed close to the monitored device.
8.2.3 Application Curve
图 24 and 图 25 show the typical step response to submerging a TMP468 device (initially at 25°C) in an oil bath
with a temperature of 100°C and logging the local temperature readings.
110%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0
110%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0
-2
0
2
4
6
8
10
12
14
16
18
-2
0
2
4
6
8
10
12
14
16
18
Time (s)
Time (s)
D014
图 24. TMP468DSBGA Temperature Step Response 图 25. TMP468VQFN Temperature Step Response
of Local Sensor
of Local Sensor
9 Power Supply Recommendations
The TMP468 device operates with a power-supply range from 1.7 V to 3.6 V. The device is optimized for
operation at a 1.8-V supply, but can measure temperature accurately in the full supply range.
TI recommends a power-supply bypass capacitor. Place this capacitor as close as possible to the supply and
ground pins of the device. A typical value for this supply bypass capacitor is 0.1 μF. Applications with noisy or
high-impedance power supplies may require additional decoupling capacitors to reject power-supply noise.
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10 Layout
10.1 Layout Guidelines
Remote temperature sensing on the TMP468 device measures very small voltages using very low currents;
therefore, noise at the device inputs must be minimized. Most applications using the TMP468 device have high
digital content, with several clocks and a multitude of logic-level transitions that create a noisy environment.
Layout must adhere to the following guidelines:
1. Place the TMP468 device as close to the remote junction sensor as possible.
2. Route the D+ and D– traces next to each other and shield them from adjacent signals through the use of
ground guard traces, as shown in 图 26. If a multilayer PCB is used, bury these traces between the ground
or V+ planes to shield them from extrinsic noise sources. TI recommends 5-mil (0.127 mm) PCB traces.
3. Minimize additional thermocouple junctions caused by copper-to-solder connections. If these junctions are
used, make the same number and approximate locations of copper-to-solder connections in both the D+ and
D– connections to cancel any thermocouple effects.
4. Use a 0.1-μF local bypass capacitor directly between the V+ and GND of the TMP468. For optimum
measurement performance, minimize filter capacitance between D+ and D– to 1000 pF or less. This
capacitance includes any cable capacitance between the remote temperature sensor and the TMP468.
5. If the connection between the remote temperature sensor and the TMP468 is wired and is less than eight
inches (20.32 cm) long, use a twisted-wire pair connection. For lengths greater than eight inches, use a
twisted, shielded pair with the shield grounded as close to the TMP468 device as possible. Leave the remote
sensor connection end of the shield wire open to avoid ground loops and 60-Hz pickup.
6. Thoroughly clean and remove all flux residue in and around the pins of the TMP468 device to avoid
temperature offset readings as a result of leakage paths between D+ and GND, or between D+ and V+.
V+
D+
Ground or V+ layer
on bottom and top,
if possible.
D-
GND
NOTE: Use a minimum of 5-mil (0.127 mm) traces with 5-mil spacing.
图 26. Suggested PCB Layer Cross-Section
34
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ZHCSFP4B –NOVEMBER 2016–REVISED JUNE 2017
10.2 Layout Example
ëL! to ꢁoꢂer or Dround ꢁlane
ëL! to Lnternal [ayer
1 nF
51+
!1
5ꢀ+
!2
5-
!3
Db5
!4
1 nF
1 nF
1 nF
1 nF
52+
.1
56+
.2
ÇIw
.3
!55
.4
53+
/1
57+
/2
ÇI2
/3
{5!
/4
54+
51
58+
52
ë+
53
{/[
54
0.1 ꢀF
1 nF
图 27. TMP468 YFF Package Layout Example
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35
TMP468
ZHCSFP4B –NOVEMBER 2016–REVISED JUNE 2017
www.ti.com.cn
Layout Example (接下页)
ëL! to ꢀower or Dround ꢀlane
ëL! to Lnternal [ayer
0.1 ꢀF
1 nF
1 nF
58+ ë+
57+
{/[
16 1ꢃ 14 13
56+
5ꢃ+
54+
1 nF
1 nF
1 nF
1 nF
{5!
1
2
3
4
12
11
10
ꢄ
ÇI9ꢁꢂ2
ÇI9ꢁꢂ
Exposed
Thermal Pad
53+
!55
ꢃ
6
7
8
Db5
52+ 51+ 5-
1 nF
1 nF
图 28. TMP468 RGT Package Layout Example
36
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11 器件和文档支持
11.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击右上角的提醒我 (Alert me) 注册后，即可每周定
期收到已更改的产品信息。有关更改的详细信息，请查阅已修订文档中包含的修订历史记录。
11.2 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 商标
E2E is a trademark of Texas Instruments.
SMBus is a trademark of Intel Corporation.
All other trademarks are the property of their respective owners.
11.4 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页面包括机械、封装和可订购信息。这些信息是指定器件的最新可用数据。这些数据发生变化时，我们可能不
会另行通知或修订此文档。如欲获取此产品说明书的浏览器版本，请参见左侧的导航栏。
版权 © 2016–2017, Texas Instruments Incorporated
37
PACKAGE OPTION ADDENDUM
www.ti.com
28-Sep-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TMP468AIRGTR
TMP468AIRGTT
TMP468AIYFFR
TMP468AIYFFT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
VQFN
VQFN
RGT
RGT
YFF
YFF
16
16
16
16
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
T468
T468
NIPDAU
SNAGCU
SNAGCU
DSBGA
DSBGA
TMP468
TMP468
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Sep-2021
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Aug-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMP468AIRGTR
TMP468AIRGTT
TMP468AIYFFR
TMP468AIYFFT
VQFN
VQFN
RGT
RGT
YFF
YFF
16
16
16
16
3000
250
330.0
180.0
180.0
180.0
12.4
12.4
8.4
3.3
3.3
3.3
3.3
1.1
1.1
8.0
8.0
4.0
4.0
12.0
12.0
8.0
Q2
Q2
Q1
Q1
DSBGA
DSBGA
3000
250
1.65
1.65
1.65
1.65
0.81
0.81
8.4
8.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Aug-2017
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMP468AIRGTR
TMP468AIRGTT
TMP468AIYFFR
TMP468AIYFFT
VQFN
VQFN
RGT
RGT
YFF
YFF
16
16
16
16
3000
250
367.0
210.0
182.0
182.0
367.0
185.0
182.0
182.0
35.0
35.0
20.0
20.0
DSBGA
DSBGA
3000
250
Pack Materials-Page 2
PACKAGE OUTLINE
RGT0016C
VQFN - 1 mm max height
S
C
A
L
E
3
.
6
0
0
PLASTIC QUAD FLATPACK - NO LEAD
3.1
2.9
B
A
PIN 1 INDEX AREA
3.1
2.9
SIDE WALL
METAL THICKNESS
DIM A
OPTION 1
0.1
OPTION 2
0.2
1.0
0.8
C
SEATING PLANE
0.08
0.05
0.00
1.68 0.07
(DIM A) TYP
5
8
EXPOSED
THERMAL PAD
12X 0.5
4
9
4X
SYMM
1.5
1
12
0.30
16X
0.18
13
16
0.1
C A B
PIN 1 ID
(OPTIONAL)
SYMM
0.05
0.5
0.3
16X
4222419/D 04/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RGT0016C
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
1.68)
SYMM
13
16
16X (0.6)
1
12
16X (0.24)
SYMM
(2.8)
(0.58)
TYP
12X (0.5)
9
4
(
0.2) TYP
VIA
5
(0.58) TYP
8
(R0.05)
ALL PAD CORNERS
(2.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222419/D 04/2022
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RGT0016C
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
1.55)
16
13
16X (0.6)
1
12
16X (0.24)
17
SYMM
(2.8)
12X (0.5)
9
4
METAL
ALL AROUND
5
8
SYMM
(2.8)
(R0.05) TYP
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 17:
85% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:25X
4222419/D 04/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OUTLINE
YFF0016
DSBGA - 0.625 mm max height
SCALE 8.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
0.625 MAX
C
SEATING PLANE
0.05 C
0.30
0.12
BALL TYP
1.2 TYP
D
C
B
SYMM
1.2
D: Max = 1.592 mm, Min =1.531 mm
E: Max = 1.592 mm, Min =1.531 mm
TYP
0.4 TYP
A
1
2
3
4
0.3
0.2
16X
0.015
SYMM
C A B
0.4 TYP
4219386/A 05/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YFF0016
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
16X ( 0.23)
(0.4) TYP
4
3
1
2
A
B
C
SYMM
D
SYMM
LAND PATTERN EXAMPLE
SCALE:30X
0.05 MAX
0.05 MIN
METAL UNDER
SOLDER MASK
(
0.23)
METAL
(
0.23)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4219386/A 05/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information,
see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YFF0016
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
(R0.05) TYP
16X ( 0.25)
1
2
3
4
A
(0.4) TYP
B
SYMM
METAL
TYP
C
D
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:30X
4219386/A 05/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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Copyright © 2022，德州仪器 (TI) 公司
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