TMS29VF040-15C5DDE4 [TI]

512KX8 FLASH 3V PROM, 150ns, PDSO32;
TMS29VF040-15C5DDE4
型号: TMS29VF040-15C5DDE4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

512KX8 FLASH 3V PROM, 150ns, PDSO32

可编程只读存储器 光电二极管 内存集成电路
文件: 总38页 (文件大小:481K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢅꢆ  
ꢋ ꢃ ꢈ ꢌ ꢃꢍ ꢍ ꢎ ꢏ ꢍꢐ ꢎ ꢑꢀ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
FM PACKAGE  
(TOP VIEW)  
D
Single Power Supply  
3.3 V 0.3 V − TMS29LF040  
2.7 V to 3.6 V − TMS29VF040  
5 V 10% − See TMS29F040 Data sheet  
(Literature Number SMJS820)  
4
3 2 1 32 31 30  
D
D
Organization . . . 524288 By 8 Bits  
5
29  
28  
27  
26  
25  
24  
23  
22  
21  
A7  
A6  
A14  
A13  
A8  
6
Eight Equal Sectors of 64K Bytes  
− Any Combination of Sectors Can Be  
Erased  
− Any Combination of Sectors Can Be  
Marked as Read-Only  
7
A5  
8
A4  
A9  
9
A3  
A11  
G
10  
11  
12  
13  
A2  
A1  
A10  
E
D
D
Compatible With JEDEC Electrically  
Erasable Programmable Read-Only  
Memory (EEPROM) Command Set  
A0  
DQ0  
DQ7  
14 15 16 17 18 19 20  
Fully Automated On-Chip Erase and  
Byte-Program Operations  
D
D
D
D
100000 Program/Erase Cycles  
Erase-Suspend/Erase-Resume Operation  
Compatible With JEDEC Byte-Wide Pinouts  
PIN NOMENCLATURE  
A[0:18]  
DQ[0:7]  
E
Address Inputs  
Low-Current Consumption  
− Active Read . . . 20 mA Typical  
− Active Program/Erase . . . 30 mA Typical  
Inputs (programming)/Outputs  
Chip Enable  
G
Output Enable  
Power Supply  
Ground  
V
D
All Inputs/Outputs CMOS-Compatible Only  
CC  
V
SS  
W
Write Enable  
description  
The TMS29LF040 and TMS29VF040 are 524288 by 8-bit (4194304-bit), low-voltage, single-supply,  
programmable read-only memories that can be erased electrically and reprogrammed. These devices are  
organized as eight independent 64K-byte sectors and are offered with access times between 80 ns and  
150 ns.  
An on-chip state machine controls the program and erase operations. The embedded-byte program and  
sector/chip-erase functions are fully automatic. The command set is compatible with that of JEDEC 4M-bit  
EEPROMs. A suspend/resume feature allows access to unaltered memory sectors during a sector-erase  
operation. Data protection of any sector combination is accomplished using a hardware sector-protection  
feature.  
Device operations are selected by writing JEDEC-standard commands into the command register using  
standard microprocessor-write timings. The command register acts as input to an internal state machine that  
interprets the commands, controls the erase and programming operations, and outputs the status of the device,  
the data stored in the device, and the device algorithm-selection code. On initial power-up operation, the device  
defaults to the read mode.  
The TMS29xF040 is offered in a 32-pin 8 x 14 mm thin small-outline package (DBW suffix), a 32-pin  
8 x 20 mm thin small-outline package (DD suffix), and a 32-pin plastic leaded chip carrier (FM suffix) using  
1.27 mm (50-mil) lead pitch.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢀꢧ  
Copyright 1998, Texas Instruments Incorporated  
ꢣ ꢧ ꢤ ꢣꢜ ꢝꢱ ꢟꢞ ꢢ ꢪꢪ ꢨꢢ ꢠ ꢢ ꢡ ꢧ ꢣ ꢧ ꢠ ꢤ ꢬ  
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ꢆ ꢅ ꢒ ꢂꢓ ꢁ ꢔꢁ ꢕꢖ ꢑ ꢔꢂ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
DBW and DD PACKAGES  
(TOP VIEW)  
A11  
A9  
1
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
G
2
A10  
E
A8  
3
4
A13  
A14  
A17  
W
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
5
6
7
8
V
CC  
9
A18  
V
SS  
10  
11  
12  
13  
14  
15  
16  
A16  
A15  
A12  
A7  
DQ2  
DQ1  
DQ0  
A0  
A6  
A1  
A5  
A2  
A4  
A3  
device symbol nomenclature  
TMS29LF040  
-10 C5  
DBW  
L
Temperature Range Designator  
= Commercial (0°C to 70°C)  
= Extended ( − 40°C to 85°C)  
L
E
Package Designator  
DD  
=
Thin Small-Outline Package  
(8 × 20 mm)  
DBW = Thin Small-Outline Package  
(8 × 14 mm)  
= Plastic Leaded Chip Carrier  
FM  
Program/Erase Endurance  
C5 = 100000 Cycles  
Speed Designator  
’LF040  
’VF040  
-80 = 80 ns  
-90 = 90 ns  
-10 = 100 ns  
-12 = 120 ns  
-15 = 150 ns  
-10 = 100 ns  
-12 = 120 ns  
-15 = 150 ns  
V
CC  
Range Designator  
L = 3.3 V 0.3 V V  
V = 2.7 V − 3.6 V V  
(Low Voltage)  
(Very Low Voltage)  
CC  
CC  
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ꢖꢑ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
block diagram  
DQ0DQ7  
V
CC  
V
CC  
Detector  
V
SS  
Input/Output Buffers  
Timer  
Command Register  
State Control  
Erase-Voltage  
Generator  
W
Program-Voltage  
Generator  
Data Latch  
E
Chip-Enable  
Output-Enable  
Logic  
G
Column-Gating  
Column Decoder  
A
d
d
r
e
s
s
64K × 8-Bit Array  
64K × 8-Bit Array  
64K × 8-Bit Array  
64K × 8-Bit Array  
64K × 8-Bit Array  
64K × 8-Bit Array  
64K × 8-Bit Array  
64K × 8-Bit Array  
A0A18  
Row-Decoder  
L
a
t
c
h
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ꢋꢃ ꢈꢌꢃ ꢍ ꢍ ꢎ ꢏ ꢍ ꢐꢎ ꢑ ꢀ  
ꢆ ꢅ ꢒ ꢂꢓ ꢁ ꢔꢁ ꢕꢖ ꢑ ꢔꢂ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
memory-sector architecture  
7FFFFh  
64K-Byte Sector 7  
64K-Byte Sector 6  
64K-Byte Sector 5  
64K-Byte Sector 4  
64K-Byte Sector 3  
64K-Byte Sector 2  
64K-Byte Sector 1  
64K-Byte Sector 0  
70000h  
6FFFFh  
60000h  
5FFFFh  
50000h  
4FFFFh  
40000h  
3FFFFh  
30000h  
2FFFFh  
20000h  
1FFFFh  
10000h  
0FFFFh  
00000h  
A18 A17 A16 Address Range  
Sector 0  
Sector 1  
Sector 2  
Sector 3  
Sector 4  
Sector 5  
Sector 6  
Sector 7  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
00000h − 0FFFFh  
10000h − 1FFFFh  
20000h − 2FFFFh  
30000h − 3FFFFh  
40000h − 4FFFFh  
50000h − 5FFFFh  
60000h − 6FFFFh  
70000h − 7FFFFh  
4
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ꢖꢑ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
operation  
Table 1 summarizes the operation modes.  
Table 1. Operation Modes  
FUNCTIONS  
MODE  
E
G
W
A0  
A0  
X
A9  
A9  
X
DQ0DQ7  
A1  
A1  
X
A6  
A6  
X
Read  
V
IL  
V
IL  
V
IH  
Data out  
Output disable  
V
IL  
V
IH  
V
IH  
Hi-Z  
Hi-Z  
Standby and write inhibit  
V
IH  
X
X
X
X
X
X
V
Mfr. equivalent code 97h  
Device equivalent code 94h  
Data in  
IL  
Algorithm-selection mode  
V
V
V
V
V
V
V
IL  
IL  
IH  
IL  
IL  
ID  
V
IH  
Write  
Sector-protect  
Sector-protect verify  
§¶  
V
V
V
V
A0  
X
A1  
X
A6  
X
A9  
IL  
IH  
IL  
§
V
V
V
ID  
X
IL  
ID  
IL  
§
V
IL  
V
IH  
V
IL  
V
IH  
V
V
V
V
Data out  
IL  
IL  
IH  
IH  
ID  
Sector-unprotect  
V
ID  
V
ID  
V
X
X
V
V
X
IL  
ID  
ID  
§
Sector-unprotect verify  
V
IL  
V
IL  
V
IH  
V
IL  
V
IH  
Data out  
See  
Note 1  
See  
Note 1  
See  
Note 1  
See  
Note 1  
See  
Note 1  
Erase operations  
V
IL  
V
IH  
See Note 1  
§
X can be V or V  
IL IH  
.
See Table 3 for valid address and data during write (byte program).  
Operation at V = 3.3 V and T = 25°C.  
CC  
Address pins A12 and A16 = V  
A
IH  
.
NOTE 1: See Figure 6 through Figure 9.  
read mode  
To read the output of the TMS29xF040, a low-level logic signal is applied to the E and G pins. When two or more  
TMS29xF040 devices are connected in parallel, the output of any one device can be read without interference.  
The E pin is power control and is used for device selection. The G pin is output control and is used to gate the  
data output onto the bus from the selected device.  
The address-access time (t  
) is the delay from stable address to valid output data. The chip-enable access  
AVQV  
time (t  
) is the delay from E = V and stable addresses to valid output data. The output-enable access time  
ELQV  
IL  
(t  
) is the delay from G = V to valid output data when E = V and addresses are stable for at least the  
GLQV  
IL IL  
duration of t  
−t  
.
AVQV GLQV  
standby mode  
The I  
supply current is reduced by applying a logic-high level on E to enter the standby mode. In the standby  
CC  
mode, the outputs are placed in the high-impedance state. Applying a CMOS logic-high level on E reduces the  
current to 100 µA maximum.  
If the TMS29xF040 is deselected during erasure or programming, the device continues to draw active current  
until the operation is complete.  
output disable  
When either G = V or E = V , output from the device is disabled and the output pins (DQ0DQ7) are placed  
IH  
IH  
in the high-impedance state.  
5
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ꢋꢃ ꢈꢌꢃ ꢍ ꢍ ꢎ ꢏ ꢍ ꢐꢎ ꢑ ꢀ  
ꢆ ꢅ ꢒ ꢂꢓ ꢁ ꢔꢁ ꢕꢖ ꢑ ꢔꢂ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
algorithm selection mode  
The algorithm-selection mode provides access to a binary code that matches the device with its proper  
programming- and erase-command operations. This mode is activated when V (11.5 V to 12.5 V) is placed  
ID  
on address pin A9. Address pins A1 and A6 must be logic low. Two bytes of code are accessed by toggling the  
address pin A0 from V to V . All other address pins can be logic low or logic high.  
IL  
IH  
The algorithm-selection code also can be read by using the command register, which is useful when V is not  
ID  
available to be placed on address pin A9. Table 2 lists the binary algorithm-selection codes for the  
TMS29xF040.  
Table 2. Algorithm-Selection Codes  
ALGORITHM SELECTION  
Byte 0  
Byte 1  
A0  
0
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
DQ2  
DQ1  
DQ0  
HEX  
97h  
94h  
1
1
0
0
0
0
1
1
0
0
1
1
1
0
1
0
1
A1 = V , A6 = V , E = V , G = V  
IL IL IL IL  
erasure and programming  
Erasure and programming of the TMS29xF040 are accomplished by writing a sequence of commands using  
standard microprocessor write timings. The commands are written to a command register and input to the  
command-state machine (CSM). The CSM interprets the command entered and initiates program, erase,  
suspend, and resume operations as instructed. TheCSM acts as the interface between the write-state machine  
(WSM) and the external chip operations. The WSM controls all voltage generation, pulse generation,  
preconditioning, and verification of the memory contents. Program and sector/chip-erase functions are fully  
automatic. When the end of a program or erase operation is reached, the device internally resets to the read  
mode. If a byte-program or chip-erase operation is in progress, additional program/erase commands are  
ignored until the operation in progress is completed.  
command definitions  
Device operating modes are selected by writing specific address and data sequences into the command  
register. Table 3 defines the valid command sequences. Writing incorrect address and data values or writing  
them in the incorrect sequence causes the device to reset to the read mode. The command register does not  
occupy an addressable memory location. The register stores the command sequence along with the address  
and data needed by the memory array. Commands are written by setting E = V and G = V and bringing W  
IL  
IH  
from V to V . Addresses are latched on the falling edge of W and data is latched on the rising edge of W.  
IH  
IL  
Holding W = V and toggling E is an alternative method. See the byte-program and chip/sector-erase sections  
IL  
for a more complete description.  
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SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
command definitions (continued)  
Table 3. Command Definitions  
BUS  
COMMAND  
1ST CYCLE  
ADDR DATA  
2ND CYCLE  
ADDR DATA  
3RD CYCLE  
4TH CYCLE 5TH CYCLE 6TH CYCLE  
CYCLES  
ADDR DATA ADDR DATA ADDR DATA ADDR DATA  
Read  
1
2
4
4
4
6
6
RA RD  
XXXXh F0h  
5555h AAh  
5555h AAh  
5555h AAh  
5555h AAh  
5555h AAh  
RA  
RD  
§
Reset/Read  
2AAAh 55h  
2AAAh 55h  
2AAAh 55h  
2AAAh 55h  
2AAAh 55h  
5555h F0h  
5555h 90h  
5555h A0h  
5555h 80h  
5555h 80h  
RA  
RA  
PA  
RD  
RD  
PD  
Algorithm selection  
Byte program  
Chip erase  
5555h AAh  
5555h AAh  
2AAAh 55h  
2AAAh 55h  
5555h 10h  
SA 30h  
Sector erase  
Sector-erase suspend  
Sector-erase resume  
XXXXh B0h Erase-suspend valid during sector-erase operation  
XXXXh 30h Erase-resume valid only after erase-suspend  
RA  
PA  
SA  
=
=
=
Address of the location to be read  
Address of the location to be programmed  
Address of the sector to be erased  
Addresses A16, A17, and A18 select one of eight sectors  
Data to be read at selected address location  
Data to be programmed at selected address location  
RD  
PD  
=
=
Address pins A15, A16, A17, A18 = V or V for all bus cycle addresses except for program address (PA), sector address (SA), and read address  
IL IH  
(RA).  
§
No command cycles are required when the device is in read mode.  
The reset command is required to return to the read mode when the device is in the algorithm-selection mode or if DQ5 goes high.  
reset/read command  
The read mode is activated by writing either of the two reset command sequences into the command register.  
The device remains in this mode until another valid command sequence is input into the command register.  
Memory data is available in the read mode and can be read with standard microprocessor read-cycle timing.  
On power up, the device defaults to the read mode; therefore, a reset command sequence is not required and  
memory data is available.  
algorithm-selection command  
The algorithm-selection command allows access to a binary code that matches the device with the proper  
programming and erase-command operations. After writing the three-bus-cycle command sequence, the first  
byte of the algorithm-selection code (97h) can be read from address XX00h. The second byte of the code (94h)  
can be read from address XX01h (see Table 2). This mode remains in effect until another valid command  
sequence is written to the device.  
Sector-protection can be determined using the algorithm-selection command. After issuing the three-bus-cycle  
command sequence, the sector-protection status can be read on DQ0. Set address pins A0 = V and A1 = V  
IL  
IH.  
The sector address pins A16, A17, and A18 select the sector to be checked. The remaining address pins can  
be V or V . If the sector selected is protected, DQ0 outputs a 1. If the sector selected is not protected, DQ0  
IL  
IH  
outputs a 0. This mode remains in effect until another valid command sequence is written to the device.  
byte-program command  
Byte-programming is a four-bus-cycle command sequence. The first three bus cycles put the device into the  
program-setup state. The fourth bus cycle loads the address location and the data to be programmed into the  
device. The addresses are latched on the falling edge of W and the data is latched on the rising edge of W inthe  
fourth bus cycle. The rising edge of W starts the byte-program operation. The embedded byte-programming  
function automatically provides voltage and timing to program and to verify the cell margin. Any further  
commands written to the device during the program operation are ignored.  
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SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
byte-program command (continued)  
Programming can be performed at any address location in any order, resulting in logic 0s being programmed  
into the device. Attempting to program a logic 1 into a bit that was previously programmed to a logic 0 causes  
the internal pulse counter to exceed the pulse-count limit. This sets the exceed-timing-limit indicator (DQ5) to  
a logic-high state. Only an erase operation can change bits from logic 0s to logic 1s. When erased, all bits  
become logic 1. Figure 3 shows a flow chart of the typical byte-programming operation.  
The status of the device during the automatic programming operation can be monitored for completion using  
the data-polling feature or the toggle-bit feature. See the operation status section for a full description.  
chip-erase command  
Chip erase is a six-bus-cycle command sequence. The first three bus cycles put the device into the erase-setup  
state. The next two bus cycles unlock the erase mode and then the sixth bus cycle loads the chip-erase  
command. This command sequence is required to ensure that the memory contents are not erased accidentally.  
The rising edge of W starts the chip-erase operation. Any further commands written to the device during the  
chip-erase operation are ignored.  
The embedded chip-erase function automatically provides the voltage and timing needed to program and verify  
all the memory cells prior to electrical erase, and then erases and verifies the cell margin automatically. The user  
is not required to program the memory cells prior to erase. The status of the device during the automatic  
chip-erase operation can be monitored for completion using the data-polling feature or the toggle-bit feature.  
See the operation status section for a full description. Figure 6 shows a flow chart of the typical chip-erase  
operation.  
sector-erase command  
Sector erase is a six-bus-cycle command sequence. The first three bus cycles cause the device to go into the  
erase-setup state. The next two bus cycles unlock the erase mode, and the sixth bus cycle loads the  
sector-erase command and the sector-address location to be erased. Any address location within the desired  
sector can be used. The addresses are latched on the falling edge of W and the sector-erase command (30h)  
is latched on the rising edge of W in the sixth bus cycle. After a delay of 80 µs from the rising edge of W, the  
sector-erase operation begins on the selected sector(s).  
Additional sectors can be selected to be erased concurrently during the sector-erase command sequence. For  
each additional sector to be selected for erase, another bus cycle is issued. The bus cycle loads the next  
sector-address location and the sector-erase command. The time between the end of the previous bus cycle  
and the start of the next bus cycle must be less than 80 µs; otherwise, the new sector location is not loaded.  
A time delay of 80 µs from the rising edge of the last W starts the sector-erase operation. If there is a falling edge  
of W within the 80-µs time delay, the timer is reset.  
One to eight sector-address locations can be loaded in any order. The state of the delay timer can be monitored  
using the sector-erase delay indicator (DQ3). If DQ3 is logic-low, the time delay has not expired. See the  
operation status section for a description.  
Any command other than erase suspend (B0h) or sector erase (30h) written to the device during the  
sector-erase operation causes the device to exit the sector-erase mode and the contents of the sector(s)  
selected for erase are no longer valid. To complete the sector-erase operation, the sector-erase command  
sequence must be repeated.  
The embedded sector-erase function automatically provides needed voltage and timing to program and to verify  
all of the memory cells prior to electrical erase and then erases and verifies the cell margin automatically.  
Programming the memory cells prior to erase is not required. The status of the device during the automatic  
sector-erase operation can be monitored for completion by using the data-polling feature or the toggle-bit  
feature. See the operation status section for a full description. Figure 8 shows a flow chart of the typical  
sector-erase operation.  
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SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
erase-suspend command  
The erase-suspend command (B0h) allows interruption of a sector-erase operation to read data from unaltered  
sectors of the device. Erase-suspend is a one-bus-cycle command. The addresses can be V or V and the  
IL  
IH  
erase-suspend command (B0h) is latched on the rising edge of W. Once the sector-erase operation is in  
progress, the erase-suspend command requests the internal write-state machine to halt operation at  
predetermined breakpoints. The erase-suspend command is valid only during the sector-erase operation and  
is invalid during the byte-programming and chip-erase operations. The sector-erase delay timer expires  
immediately if the erase-suspend command is issued while the delay is active.  
After the erase-suspend command is issued, the device typically takes between 0.1 µs and 15 µs to suspend  
the operation. The toggle bit must be monitored to determine when the suspend has been executed. When the  
toggle bit stops toggling, data can be read from sectors that are not selected for erase. Reading from a sector  
selected for erase can result in invalid data. See the operation status section for a full description.  
Once the sector-erase operation is suspended, further writes of the erase-suspend command are ignored. The  
erase-resume command (30h) causes the device to restart the suspended sector operation. To erase additional  
sectors, reissue the six-cycle sector-erase command sequence. Any other command sequence written while  
in suspend mode causes the device to reset to the read mode.  
erase-resume command  
The erase-resume command (30h) restarts a suspended sector-erase operation from where it was halted to  
completion. Erase resume is a one-bus-cycle command. The addresses can be V or V and the erase-resume  
IL  
IH  
command (30h) is latched on the rising edge of W. When an erase-suspend/erase-resume command  
combination is written, the internal pulse counter is reset to zero and the exceed-timing-limit indicator (DQ5)  
is set to logic-low. The erase-resume command is valid only in the erase-suspend state. After the erase-resume  
command is executed, the device returns to the valid sector-erase state and further writes of the erase-resume  
command are ignored. After the device has resumed the sector-erase operation, another erase-suspend  
command can be issued to the device.  
operation status  
status-bit definitions  
During operation of the embedded program and erase functions, the status of the device can be determined  
by reading the data state of designated outputs. The data-polling bit (DQ7) and toggle bit (DQ6) require multiple  
successive reads to observe a change in the state of the designated output. Table 4 defines the values of the  
status flags.  
Table 4. Operation Status Flags  
Device Operation  
DQ7  
DQ7  
DQ7  
D
DQ6  
T
DQ5  
DQ4  
X
DQ3  
DQ2  
X
DQ1  
X
DQ0  
X
Byte-programming in progress  
Byte-programming exceed time limit  
Byte-programming complete  
0
1
D
0
1
1
0
0
D
1
1
1
T
X
X
X
X
D
D
D
D
D
Sector-/chip-erase in progress  
Sector-/chip-erase exceed time limit  
Sector-/chip-erase complete  
0
T
X
X
X
X
0
T
X
X
X
X
1
1
1
1
1
1
T= toggle, D = data, X = data undefined, DQ7 = complement of data written to DQ7  
DQ4, DQ2, DQ1, and DQ0 are reserved for future use.  
9
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SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
data-polling (DQ7)  
The data-polling status function outputs the complement of the data latched into the DQ7 data register while  
the write-state machine is engaged in a program or erase operation. Data bit DQ7 changing from complement  
to true indicates the end of an operation. Data-polling is available only during the byte-programming, chip-erase,  
sector-erase, and sector-erase timing delay. Data-polling is valid after the rising edge of W in the last bus cycle  
of the command sequence loaded into the command register. Figure 10 shows a flow chart of the data-polling  
operation.  
During a byte-program operation, reading DQ7 outputs the complement of the DQ7 data to be programmed at  
the selected address location. Upon completion, reading DQ7 outputs the true DQ7 data loaded into the  
program data register. During the erase operations, reading DQ7 outputs a 0. Upon completion of erase  
operations, reading DQ7 outputs a 1. Also, data-polling must be performed at a sector address that is within  
a sector being erased; otherwise, the status is invalid. When using data-polling, the address must remain stable  
throughout the operation.  
During a data-polling read, while G is low, data bit DQ7 can change asynchronously with the other DQs.  
Depending on the read timing, the system can read valid data on DQ7, while other DQ pins are still invalid. The  
data on DQ0−DQ7 is valid with a subsequent read of the device. Figure 11 shows the data-polling timing  
diagram.  
toggle bit (DQ6)  
The toggle-bit status function outputs data on DQ6 that toggles between logic 1 and logic 0 while the write-state  
machine is engaged in a program or erase operation. When toggle bit DQ6 stops toggling after two consecutive  
reads to the same address, the operation is complete. The toggle bit is only available during the  
byte-programming, chip-erase, sector-erase, and sector-erase timing delay. Toggle-bit data is valid after the  
rising edge of W in the last bus cycle of the command sequence loaded into the command register. Figure 12  
shows a flow chart of the toggle-bit status-read algorithm. Depending on the read timing, DQ6 can stop toggling  
while other DQ pins are still invalid. The data on DQ0−DQ7 is valid with a subsequent read of the device.  
Figure 13 shows the toggle-bit timing diagram.  
exceed-time-limit (DQ5)  
The program and erase operations use an internal pulse counter to limit the number of pulses applied. If the  
pulse count limit is exceeded, DQ5 is set to a logic 1, indicating that the program or erase operation has failed.  
DQ7 does not change from complemented data to true data and DQ6 does not stop toggling when read. The  
device must be reset to continue operation.  
This condition occurs when attempting to program a logic 1 into a bit that has been programmed previously to  
a logic 0. Only an erase operation can change bits from 0 to 1. After reset, the device is functional and can be  
erased and reprogrammed.  
sector-load-timer bit (DQ3)  
The sector-load-timer status bit, DQ3, is used to determine whether the time to load additional sector addresses  
has expired. After completion of a sector-erase command sequence, DQ3 remains at a logic 0 for 80 µs. This  
indicates that another sector-erase command sequence can be issued. If DQ3 is at a logic 1, it indicates that  
the delay has expired and attempts to issue additional sector-erase commands are ignored. See the  
sector-erase command section for a description.  
The data-polling bit and toggle bit are valid during the 80-µs time delay and can be used to determine if a valid  
sector-erase command has been issued. To ensure additional sector-erase commands have been accepted,  
the status of DQ3 should be read before and after each additional sector-erase command. If DQ3 is at a logic  
low on both reads, then the additional sector-erase command was accepted.  
10  
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SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
data protection  
hardware-sector protection feature  
This feature disables both programming and erase operations on any combination of one to eight sectors.  
Commands to program or erase a protected sector do not change the data contained in the sector. The  
data-polling and toggle bits operate for 2 µs to 100 µs and then return to valid data. This feature is enabled using  
high-voltage V (11.5 V to 12.5 V) on address pin A9 and control pin G, and V on control pin E. Figure 14 shows  
ID  
IL  
a flow chart of the sector-protect operation.  
The device is delivered with all sectors unprotected. The sector-unprotect mode is available to unprotect  
protected sectors. Figure 16 is a flow chart of the sector-unprotect operation.  
sector-protect operation  
The sector-protect mode is activated when V  
= 3.3 V (operating at T = 25°C), W = V , E= V , and address  
A IH IL  
CC  
pin A9 and control pin G are forced to V . The sector-select address pins A16, A17, and A18 are used to select  
ID  
the sector to be protected. Address pins A0−A8, A10−A15, and I/O pins DQ0−DQ7 must be stable and can be  
V
or V . Once the addresses are stable, W is pulsed low for 100 µs. The operation begins on the falling edge  
IL  
IH  
of W and terminates on the rising edge of W. Figure 15 shows a timing diagram of the sector-protect operation.  
sector-protect verify  
Verification of sector-protection is activated when V  
= 3.3 V (operating at T = 25°C), W = V , G = V ,  
A IH IL  
CC  
E = V , and address pin A9 = V . Address pins A0 and A6 are set to V , and A1 is set to V . The sector-address  
IL  
ID  
IL  
IH  
pins A16, A17, and A18 select the sector to be verified. The other address pins can be V or V . If the sector  
IH  
IL  
selected is protected, the DQs output 01h. If the sector selected is not protected, the DQs output 00h.  
sector-unprotect operation  
Prior to a sector-unprotect operation, all sectors should be protected using the sector-protect mode.  
Sector-unprotect mode is activated when V  
= 3.3 V (operating at T = 25°C), W = V , and address pin A9  
CC  
A IH  
and control pins G and E are forced to V . Address pins A6, A12, and A16 are set to V . The sector-select  
ID  
IH  
address pins A17 and A18 can be V or V . All eight sectors are unprotected in parallel. Once the inputs are  
IL  
IH  
stable, W is pulsed low for 10 ms. The unprotect operation begins on the falling edge of W and terminates on  
the rising edge of W. Figure 17 shows a timing diagram of the sector-unprotect operation.  
sector-unprotect verify  
Verification of the sector-unprotection is activated when V  
= 3.3 V (operating at T = 25°C), W = V ,  
A IH  
CC  
G = V , E = V , and address pin A9 = V . The sector to be verified must be selected. Address pins A1 and  
IL  
IL  
ID  
A6 are set to V , and A0 is set to V . The other address pins can be V or V . If the sector that is selected  
IH  
IL  
IH  
IL  
is protected, the DQs output 01h. If the sector selected is not protected, the DQs output 00h.  
glitching  
Pulses of less than 5 ns (typical) on G, W, or E do not issue a write cycle.  
power supply considerations  
Each device should have a 0.1-µF ceramic capacitor connected between V  
and V to suppress circuit noise.  
SS  
CC  
Printed-circuit traces to V  
should be appropriate to handle the current demand and minimize inductance.  
CC  
11  
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SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
absolute maximum ratings over operating ambient temperature range (unless otherwise noted)  
Voltage range with respect to ground:  
Supply voltage range, V  
(see Note 2) . . . . . . . . . . . . . . . . . . . . . −0.5 V to + 3.6 V  
CC  
All pins except A9, E, G (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to + 3.6 V  
A9, E, G (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to + 13.5 V  
Ambient temperature range during read/erase/program, T  
A
Commercial (L) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C  
Extended (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 40°C to 85°C  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
Storage temperature range, T  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 2. Minimum dc voltage on input or I/O pins is −0.5 V. During voltage transitions, input or I/O pins may undershoot V  
to −2.0 V for  
SS  
periods of up to 20 ns. Maximum dc voltage on input and I/O pins is +3.6 V. During voltage transitions, input and I/O pins may  
overshoot to V + 2.0 V for periods up to 20 ns.  
CC  
3. Minimum dc input voltage on A9, E, and G pins is −0.5 V. During voltage transitions, A9, E, and G may undershoot V  
to −2.0 V  
SS  
for periods of up to 20 ns. Maximum dc input voltage on A9, E, and G pins is +12.5 V, which may overshoot to +13.5 V for periods  
up to 20 ns.  
recommended operating conditions  
MIN  
3
NOM  
3.3  
3
MAX  
3.6  
3.6  
70  
UNIT  
’29LF040 V  
CC  
range  
range  
V
Supply voltage  
V
CC  
’29VF040 V  
CC  
2.7  
0
Commercial (L)  
Extended (E)  
T
A
Ambient temperature during read/erase/program  
°C  
−40  
85  
12  
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SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
electrical dc characteristics over recommended ranges of supply voltage and ambient  
temperature  
PARAMETER  
High-level dc input voltage  
Low-level dc input voltage  
TEST CONDITIONS  
MIN  
0.7 * V  
MAX  
+ 0.3  
0.8  
UNIT  
V
V
V
CMOS  
CMOS  
V
CC  
IH  
CC  
− 0.5  
V
IL  
Algorithm-selection and sector-protect/unprotect  
input voltage  
V
ID  
V
CC  
= 3.3 V  
11.5  
12.5  
V
CMOS  
V
V
= V  
= V  
MIN  
I
I
= − 2.0 mA  
0.85  
V
CC  
CC  
OH  
*
CC  
V
V
High-level dc output voltage  
V
V
OH  
CMOS  
MIN  
= − 100 µA  
V
CC  
− 0.4  
CC  
CC  
OH  
Low-level dc output voltage  
CMOS  
V
CC  
= V  
MIN  
I
= 4.0 mA  
0.45  
OL  
CC  
OL  
(see Note 4)  
I
I
I
I
I
Input current (leakage)  
Output current (leakage)  
High-voltage load current  
V
V
V
= V  
= V  
= V  
MAX  
MAX  
MAX  
V =V  
SS  
to V  
CC  
1
1
µA  
µA  
I
CC  
CC  
CC  
CC  
I
V =V  
O SS  
to V  
CC  
O
CC  
A9 = 12.5 V  
50  
40  
60  
µA  
ID  
CC  
,
V
CC  
V
CC  
V
CC  
active current (see Note 5)  
active current (see Notes 6)  
supply current  
E = V  
G = V  
G = V  
mA  
mA  
CC1  
CC2  
IL  
IL  
IH  
E = V  
,
IH  
I
CMOS-input level  
V
CC  
= V  
MAX  
E = V  
0.3 V  
100  
µA  
CC3  
CC  
CC  
(standby)  
See the recommended operating conditions table.  
NOTES: 4. 5.8-mA I also available  
OL  
current in the read mode, switching at 6 MHz, I  
5.  
6.  
I
I
= 0 mA  
OUT  
CC  
CC  
current while erase or program operation is in progress  
capacitance over recommended ranges of supply voltage and ambient temperature  
PARAMETER  
Input capacitance (All inputs except A9, E, G)  
Input capacitance (A9, E, G)  
TEST CONDITIONS  
V = 0 V, f = 1 MHz  
MIN  
MAX  
7.5  
9
UNIT  
pF  
C
C
C
i1  
i2  
o
I
V = 0 V, f = 1 MHz  
I
pF  
Output capacitance  
V
O
= 0 V, f = 1 MHz  
12  
pF  
13  
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SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
switching characteristics over recommended ranges of supply voltage and ambient temperature,  
read-only operation (see Figure 2, Figure 11, Figure 13, Figure 15, and Figure 17)  
’29LF040-10  
’29VF040-10  
’29LF040-80  
’29LF040-90  
ALTERNATE  
SYMBOL  
PARAMETER  
UNIT  
MIN MAX  
MIN MAX  
MIN MAX  
t
t
t
t
t
t
t
t
t
Access time, address  
t
t
80  
90  
100  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
AVQV  
ELQV  
GLQV  
AVAV  
a(A)  
a(E)  
a(G)  
Access time, E  
80  
90  
100  
Access time, G  
t
35  
40  
45  
Cycle time, read  
t
80  
20  
20  
0
90  
20  
20  
0
100  
30  
30  
0
c(R)  
Disable time, E to high impedance  
Disable time, G to high impedance  
Hold time, output from address, E or G change  
Hold time, G read  
t
EHQZ  
GHQZ  
AXQX  
WHGL1  
WHGL2  
dis(E)  
dis(G)  
t
t
h(D)  
0
0
0
Hold time, G toggle and data polling  
10  
10  
10  
’29LF040-12  
’29VF040-12  
’29LF040-15  
’29VF040-15  
ALTERNATE  
SYMBOL  
PARAMETER  
UNIT  
MIN MAX  
MIN MAX  
t
t
t
t
t
t
t
t
t
Access time, address  
t
t
120  
150  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
AVQV  
ELQV  
GLQV  
AVAV  
a(A)  
a(E)  
a(G)  
Access time, E  
120  
150  
Access time, G  
t
50  
55  
Cycle time, read  
t
120  
30  
30  
0
150  
35  
35  
0
c(R)  
Disable time, E to high impedance  
Disable time, G to high impedance  
Hold time, output from address, E or G change  
Hold time, G read  
t
EHQZ  
GHQZ  
AXQX  
WHGL1  
WHGL2  
dis(E)  
t
dis(G)  
t
h(D)  
0
0
Hold time, G toggle and data polling  
10  
10  
See Figure 1 for ac test output load circuit and voltage waveforms.  
14  
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SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
timing requirements controlled by W (see Figure 4, Figure 7, Figure 9, Figure 11, Figure 13,  
Figure 15, and Figure 17)  
’29LF040-10  
’29VF040-10  
’29LF040-80  
’29LF040-90  
ALTERNATE  
SYMBOL  
UNIT  
MIN  
TYP MAX  
MIN  
TYP MAX  
MIN  
TYP MAX  
t
t
Cycle time, write  
t
80  
90  
100  
ns  
AVAV  
c(W)  
Cycle time, programming  
operation  
t
20  
20  
20  
µs  
WHWH1  
c(W)PR  
Cycle time, sector-erase  
operation  
t
2
30  
2
30  
2
30  
s
WHWH2  
Cycle time, chip-erase  
operation  
t
t
t
14  
120  
14  
120  
14  
120  
s
WHWH3  
Hold time, address  
t
45  
0
45  
0
45  
0
ns  
ns  
WLAX  
h(A)  
Hold time, data valid after  
W high  
t
WHDX  
h(D)  
t
t
t
Hold time, E  
t
0
20  
35  
0
20  
45  
0
20  
45  
ns  
ns  
ns  
WHEH  
WHWL  
WLWH1  
h(E)  
Pulse duration, W high  
Pulse duration, W low  
t
w(WH)  
t
w(WL)  
Pulse duration, W low  
(see Note 7)  
t
t
t
100  
10  
0
100  
10  
0
100  
10  
0
µs  
ms  
ns  
WLWH2  
WLWH3  
GHWL  
Pulse duration, W low  
(see Note 8)  
Recovery time, read  
before write  
t
rec(R)  
t
t
Setup time, address  
Setup time, data  
t
0
0
0
ns  
ns  
AVWL  
su(A)  
t
35  
45  
45  
DVWH  
su(D)  
Setup time, A0 and A6  
low and A1 high to G high  
(see Note 7)  
t
0
0
0
0
0
0
ns  
ns  
AVGH  
Setup time, A0 low and  
A1 high to G and E high  
(see Note 8)  
t
AVGEH  
t
t
t
Setup time, E  
Setup time, G  
t
0
0
0
0
0
0
ns  
ns  
µs  
ELWL  
GHWH  
VCEL  
su(E)  
Setup time, V  
CC  
50  
50  
50  
Setup time, E V to W  
ID  
t
t
t
4
4
4
4
4
4
4
4
4
µs  
µs  
µs  
EHVWL  
GHVWL  
HVT  
(see Note 8)  
Setup time, G V to W  
ID  
(see Notes 7 and 8)  
Transition time, V (see  
ID  
Notes 7 and 8)  
NOTES: 7. Sector-protect timing (see Figure 15)  
8. Sector-unprotect timing (see Figure 17)  
15  
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SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
timing requirements controlled by W (see Figure 4, Figure 7, Figure 9, Figure 11, Figure 13,  
Figure 15, and Figure 17) (continued)  
’29LF040-12  
’29VF040-12  
’29LF040-15  
’29VF040-15  
ALTERNATE  
SYMBOL  
UNIT  
MIN  
TYP MAX  
MIN  
TYP MAX  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
Cycle time, write  
t
120  
150  
ns  
µs  
s
AVAV  
c(W)  
Cycle time, programming operation  
Cycle time, sector-erase operation  
Cycle time, chip-erase operation  
Hold time, address  
t
20  
20  
WHWH1  
WHWH2  
WHWH3  
WLAX  
c(W)PR  
2
30  
2
30  
14  
120  
14  
120  
s
t
50  
0
50  
0
ns  
ns  
ns  
ns  
ns  
µs  
ms  
ns  
ns  
ns  
h(A)  
Hold time, data valid after W high  
Hold time, E  
t
WHDX  
WHEH  
WHWL  
WLWH1  
WLWH2  
WLWH3  
GHWL  
AVWL  
h(D)  
t
0
0
h(E)  
Pulse duration, W high  
t
20  
50  
100  
10  
0
20  
50  
100  
10  
0
w(WH)  
Pulse duration, W low  
t
w(WL)  
Pulse duration, W low (see Note 7)  
Pulse duration, W low (see Note 8)  
Recovery time, read before write  
Setup time, address  
t
rec(R)  
t
0
0
su(A)  
Setup time, data  
t
50  
50  
DVWH  
su(D)  
Setup time, A0 and A6 low and A1 high to G high  
(see Note 7)  
t
t
0
0
0
0
ns  
ns  
AVGH  
Setup time, A0 low and A1 high to G and E high  
(see Note 8)  
AVGEH  
t
t
t
t
t
Setup time, E  
Setup time, G  
t
0
0
0
0
ns  
ns  
µs  
µs  
µs  
µs  
ELWL  
su(E)  
GHWH  
VCEL  
Setup time, V  
CC  
50  
4
50  
4
Setup time, E V to W (see Note 8)  
ID  
EHVWL  
GHVWL  
Setup time, G V to W (see Notes 7 and 8)  
ID  
4
4
t
Transition time, V (see Notes 7 and 8)  
ID  
4
4
HVT  
NOTES: 7. Sector-protect timing (see Figure 15)  
8. Sector-unprotect timing (see Figure 17)  
16  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢅꢆ  
ꢋ ꢃ ꢈ ꢌ ꢃꢍ ꢍ ꢎ ꢏ ꢍꢐ ꢎ ꢑꢀ  
ꢖꢑ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
timing requirements controlled by E (see Figure 5)  
’29LF040-10  
’29LF040-90  
’29LF040-80  
ALTERNATE  
’29VF040-10  
UNIT  
SYMBOL  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
t
t
Cycle time, write  
t
80  
90  
100  
ns  
AVAV  
c(W)  
Cycle time, programming  
operation  
20  
2
20  
2
20  
2
µs  
EHEH1  
Cycle time, sector-erase  
operation (see Note 9)  
t
t
30  
30  
30  
s
s
EHEH2  
EHEH3  
Cycle time, chip-erase  
operation (see Note 10)  
14  
120  
14  
120  
14  
120  
t
t
t
t
t
Hold time, address  
Hold time, data  
t
45  
0
45  
0
45  
0
ns  
ns  
ns  
ns  
ns  
ELAX  
EHDX  
EHWH  
ELEH  
EHEL  
h(A)  
h(D)  
h(W)  
t
Hold time, W  
t
0
0
0
Pulse duration, E low  
Pulse duration, E high  
t
35  
20  
45  
20  
45  
20  
w(EL)  
t
w(EH)  
rec(R)  
Recovery time, read  
before write  
t
t
0
0
0
ns  
GHEL  
t
t
t
Setup time, address  
Setup time, data  
Setup time, W  
t
0
35  
0
0
45  
0
0
45  
0
ns  
ns  
ns  
AVE  
su(A)  
su(D)  
su(W)  
L
t
DVEH  
WLEL  
t
’29LF040-12  
’29VF040-12  
’29LF040-15  
’29VF040-15  
ALTERNATE  
SYMBOL  
UNIT  
MIN  
TYP MAX  
MIN  
TYP MAX  
t
t
t
t
t
t
t
t
t
t
t
t
t
Cycle time, write  
t
120  
150  
ns  
µs  
s
AVAV  
c(W)  
Cycle time, programming operation  
Cycle time, sector-erase operation (see Note 9)  
Cycle time, chip-erase operation (see Note 10)  
Hold time, address  
20  
20  
EHEH1  
EHEH2  
EHEH3  
ELAX  
2
30  
2
30  
14  
120  
14  
120  
s
t
50  
0
50  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
h(A)  
h(D)  
h(W)  
Hold time, data  
t
EHDX  
EHWH  
ELEH  
Hold time, W  
t
0
0
Pulse duration, E low  
t
50  
20  
0
50  
20  
0
w(EL)  
Pulse duration, E high  
t
t
EHEL  
w(EH)  
Recovery time, read before write  
Setup time, address  
GHEL  
rec(R)  
t
0
0
AVE  
su(A)  
su(D)  
su(W)  
L
Setup time, data  
t
50  
0
50  
0
DVEH  
WLEL  
Setup time, W  
t
NOTES: 9. Timing diagram of E-controlled sector-erase operation not enclosed.  
10. Timing diagram of E-controlled chip-erase operation not enclosed.  
17  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢈꢇꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊꢆ ꢇꢈ ꢇ  
ꢋꢃ ꢈꢌꢃ ꢍ ꢍ ꢎ ꢏ ꢍ ꢐꢎ ꢑ ꢀ  
ꢆ ꢅ ꢒ ꢂꢓ ꢁ ꢔꢁ ꢕꢖ ꢑ ꢔꢂ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
PARAMETER MEASUREMENT INFORMATION  
I
OL  
0.1 mA  
Output  
Under  
Test  
1.50 V  
C
= 30 pF  
L
(see Note A, Note B, and Note C)  
I
− 0.1 mA  
OH  
3.0 V  
0.0 V  
1.5 V  
1.5 V  
NOTES: A.  
B. The ac testing inputs are driven at 3 V for logic high and 0 V for logic low. Timing measurements are made at 1.5 V for logic high  
and 1.5 V for logic low on both inputs and outputs. Each device should have a 0.1-µF ceramic capacitor connected between V  
C includes probe and fixture capacitance.  
L
CC  
and V  
as closely as possible to the device pins.  
SS  
C. Input rise and fall 5 ns.  
Figure 1. AC Test Output Load Circuit and Voltage Waveforms  
18  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢁꢂ  
ꢅꢆ  
ꢋ ꢃ ꢈ ꢌ ꢃꢍ ꢍ ꢎ ꢏ ꢍꢐ ꢎ ꢑꢀ  
ꢖꢑ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
read operation  
t
AVAV  
Valid Addresses  
Addresses  
t
AVQV  
E
G
t
EHQZ  
t
ELQV  
t
GHQZ  
t
GLQV  
W
t
AXQX  
t
WHGL1  
Valid Data  
DQ0DQ7  
Figure 2. AC Waveform for Read Operation  
19  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢈꢇꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊꢆ ꢇꢈ ꢇ  
ꢋꢃ ꢈꢌꢃ ꢍ ꢍ ꢎ ꢏ ꢍ ꢐꢎ ꢑ ꢀ  
ꢆ ꢅ ꢒ ꢂꢓ ꢁ ꢔꢁ ꢕꢖ ꢑ ꢔꢂ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
write operation  
Start  
Write Bus Cycle  
5555H/AAH  
Write Bus Cycle  
2AAAH/55H  
Write Bus Cycle  
5555H/A0H  
Write Bus Cycle  
Program Address/Program Data  
Poll Device Status  
No  
Operation  
Complete  
?
Yes  
Last  
Address  
?
No  
Next Address  
Yes  
End  
Figure 3. Byte-Program Algorithm  
20  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢁꢂ  
ꢅꢆ  
ꢋ ꢃ ꢈ ꢌ ꢃꢍ ꢍ ꢎ ꢏ ꢍꢐ ꢎ ꢑꢀ  
ꢖꢑ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
write operation (continued)  
t
AVAV  
5555H  
2AAAH  
5555H  
PA  
PA  
Addresses  
t
WLAX  
t
AVWL  
E
t
ELWL  
t
WHEH  
G
t
WHDX  
t
GHWL  
t
WHWL  
t
WLWH1  
W
t
WHWH1  
DQ7  
t
DVWH  
AAH  
55H  
A0H  
PD  
DOUT  
DQ0DQ7  
NOTES: A. PA = Address of the location to be programmed  
B. PD = Data to be programmed  
C. DQ7 = Complement of data written to DQ7  
Figure 4. AC Waveform for Byte-Program (W-Controlled) Operation  
21  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢈꢇꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊꢆ ꢇꢈ ꢇ  
ꢋꢃ ꢈꢌꢃ ꢍ ꢍ ꢎ ꢏ ꢍ ꢐꢎ ꢑ ꢀ  
ꢆ ꢅ ꢒ ꢂꢓ ꢁ ꢔꢁ ꢕꢖ ꢑ ꢔꢂ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
write operation (continued)  
t
AVAV  
5555H  
2AAAH  
5555H  
PA  
Addresses  
PA  
t
AVEL  
t
ELAX  
t
ELEH  
E
t
t
EHEL  
GHEL  
G
t
DVEH  
t
EHEH1  
t
t
WLEL  
EHWH  
W
t
EHDX  
AAH  
55H  
A0H  
PD  
DQ7  
DOUT  
DQ0DQ7  
NOTES: A. PA  
B. PD  
=
=
Address of the location to be programmed  
Data to be programmed  
C. DQ7= Complement of data written to DQ7  
Figure 5. AC Waveform for Byte-Program (Alternate E-Controlled) Operation  
22  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢁꢂ  
ꢅꢆ  
ꢋ ꢃ ꢈ ꢌ ꢃꢍ ꢍ ꢎ ꢏ ꢍꢐ ꢎ ꢑꢀ  
ꢖꢑ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
chip-erase operation  
Start  
Write Bus Cycle  
5555H/AAH  
Write Bus Cycle  
2AAAH/55H  
Write Bus Cycle  
5555H/80H  
Write Bus Cycle  
5555H/AAH  
Write Bus Cycle  
2AAAH/55H  
Write Bus Cycle  
5555H/10H  
Poll Device Status  
No  
Operation  
Complete  
?
Yes  
End  
Figure 6. Chip-Erase Algorithm  
23  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢈꢇꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊꢆ ꢇꢈ ꢇ  
ꢋꢃ ꢈꢌꢃ ꢍ ꢍ ꢎ ꢏ ꢍ ꢐꢎ ꢑ ꢀ  
ꢆ ꢅ ꢒ ꢂꢓ ꢁ ꢔꢁ ꢕꢖ ꢑ ꢔꢂ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
chip-erase operation (continued)  
t
AVAV  
Addresses  
5555H  
t
2AAAH  
5555H  
5555H  
2AAAH  
5555H  
VA  
AVWL  
t
WLAX  
E
t
ELWL  
t
WHEH  
G
t
GHWL  
t
WHWL  
t
WLWH1  
W
t
DVWH  
t
WHWH3  
t
WHDX  
10H  
DQ0DQ7  
AAH  
55H  
80H  
AAH  
55H  
DQ7=0  
DOUT=FFH  
t
VCEL  
V
CC  
NOTE A: VA = any valid address  
Figure 7. AC Waveform for Chip-Erase Operation  
24  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢁꢂ  
ꢅꢆ  
ꢋ ꢃ ꢈ ꢌ ꢃꢍ ꢍ ꢎ ꢏ ꢍꢐ ꢎ ꢑꢀ  
ꢖꢑ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
sector-erase operation  
Start  
Write Bus Cycle  
5555H/AAH  
Write Bus Cycle  
2AAAH/55H  
Write Bus Cycle  
5555H/80H  
Write Bus Cycle  
5555H/AAH  
Write Bus Cycle  
2AAAH/55H  
Write Bus Cycle  
Sector Address/30H  
No  
DQ3 = 0  
?
Yes  
Load  
Additional  
Sectors  
?
Yes  
No  
Poll Device Status  
Operation  
Complete  
?
No  
Yes  
End  
Figure 8. Sector-Erase Algorithm  
25  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢈꢇꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊꢆ ꢇꢈ ꢇ  
ꢋꢃ ꢈꢌꢃ ꢍ ꢍ ꢎ ꢏ ꢍ ꢐꢎ ꢑ ꢀ  
ꢆ ꢅ ꢒ ꢂꢓ ꢁ ꢔꢁ ꢕꢖ ꢑ ꢔꢂ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
sector-erase operation (continued)  
t
AVAV  
5555H  
t
Addresses  
2AAAH  
5555H  
5555H  
2AAAH  
SA  
SA  
AVWL  
t
WLAX  
E
t
ELWL  
t
WHEH  
G
t
GHWL  
t
WHWL  
t
WLWH1  
W
t
DVWH  
t
WHWH2  
t
WHDX  
DQ0DQ7  
AAH  
55H  
80H  
AAH  
55H  
30H  
DQ7=0  
DOUT=FFH  
t
VCEL  
V
CC  
NOTE A: SA = Sector address to be erased  
Figure 9. AC Waveform for Sector-Erase Operation  
26  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢁꢂ  
ꢅꢆ  
ꢋ ꢃ ꢈ ꢌ ꢃꢍ ꢍ ꢎ ꢏ ꢍꢐ ꢎ ꢑꢀ  
ꢖꢑ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
data-polling operation  
Start  
Read DQ0DQ7  
ADDR = VA  
Yes  
DQ7 =  
Data  
?
No  
No  
DQ5 = 1  
?
Yes  
Read DQ0DQ7  
ADDR = VA  
DQ7 =  
Data  
?
Yes  
No  
Fail  
Pass  
NOTES: A. DQ7 is checked again after DQ5 is checked, even if DQ5 = 1.  
B. VA  
=
=
=
Program address for byte-programming  
Selected sector address for sector erase  
Any valid address for chip erase  
Figure 10. Data-Polling Algorithm  
27  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢈꢇꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊꢆ ꢇꢈ ꢇ  
ꢋꢃ ꢈꢌꢃ ꢍ ꢍ ꢎ ꢏ ꢍ ꢐꢎ ꢑ ꢀ  
ꢆ ꢅ ꢒ ꢂꢓ ꢁ ꢔꢁ ꢕꢖ ꢑ ꢔꢂ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
data-polling operation (continued)  
Addresses  
AIN  
AIN  
AIN  
t
AVQV  
t
AVQV  
t
AXQX  
t
ELQV  
t
ELQV  
E
t
GLQV  
t
GLQV  
G
t
WHGL2  
t
GHQZ  
W
t
WHWH1, 2, or 3  
DQ7  
DQ  
DIN  
DQ7  
DQ7  
DOUT  
NOTES: A. DIN  
B. DQ7  
=
=
=
=
Last command data written to the device  
Complement of data written to DQ7  
Valid data output  
C. DOUT  
D. AIN  
Valid address for byte-program, sector-erase, or chip-erase operation  
E. The data-polling operation is valid for both W- and E-controlled byte-program, sector-erase, and chip-erase operations.  
Figure 11. AC Waveform for Data-Polling Operation  
28  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢁꢂ  
ꢅꢆ  
ꢋ ꢃ ꢈ ꢌ ꢃꢍ ꢍ ꢎ ꢏ ꢍꢐ ꢎ ꢑꢀ  
ꢖꢑ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
toggle-bit operation  
Start  
Read DQ0DQ7  
ADDR = VA  
Read DQ0DQ7  
ADDR = VA  
No  
DQ6 =  
Toggle  
?
Yes  
No  
DQ5 = 1  
?
Yes  
Read DQ0DQ7  
DQ6 =  
Toggle  
?
No  
Yes  
Fail  
Pass  
NOTE A: DQ6 is checked again after DQ5 is checked, even if DQ5 = 1.  
Figure 12. Toggle-Bit Algorithm  
29  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢈꢇꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊꢆ ꢇꢈ ꢇ  
ꢋꢃ ꢈꢌꢃ ꢍ ꢍ ꢎ ꢏ ꢍ ꢐꢎ ꢑ ꢀ  
ꢆ ꢅ ꢒ ꢂꢓ ꢁ ꢔꢁ ꢕꢖ ꢑ ꢔꢂ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
toggle-bit operation (continued)  
Addresses  
AIN  
t
t
AVQV  
t
ELQV  
GLQV  
ELQV  
E
t
GLQV  
t
G
t
GHWH  
t
WHGL2  
W
t
WHWH1, 2, OR 3  
DQ6 =  
Toggle  
DQ6 =  
Toggle  
DQ6 =  
Toggle  
DQ6 = Stop  
Toggle  
DIN  
DOUT  
DQ  
NOTES: A. DIN  
B. DQ6  
=
=
=
=
Last command data written to the device  
Toggle bit output  
Valid data output  
C. DOUT  
D. AIN  
Valid address for byte-program, sector-erase, or chip-erase operation  
E. The toggle-bit operation is valid for both W- and E-controlled byte-program, sector-erase, and chip-erase operations.  
Figure 13. AC Waveform for Toggle-Bit Operation  
30  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢁꢂ  
ꢅꢆ  
ꢋ ꢃ ꢈ ꢌ ꢃꢍ ꢍ ꢎ ꢏ ꢍꢐ ꢎ ꢑꢀ  
ꢖꢑ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
sector-protect operation  
Start  
Select Sector Address  
A18, A17, A16  
X = 1  
G and A9 = V  
ID  
E = V  
IL  
Apply One 100-µs  
Pulse  
G, A0, and A6 = V  
IL  
X = X+1  
W and A1 = V  
IH  
Read Data  
No  
No  
X = 25  
?
Data = 01H  
?
Yes  
Yes  
Yes  
Sector Protect  
Failed  
Protect  
Additional  
Sectors  
?
No  
A9 = V or V  
IH IL  
Write Reset Command  
End  
Figure 14. Sector-Protect Algorithm  
31  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢈꢇꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊꢆ ꢇꢈ ꢇ  
ꢋꢃ ꢈꢌꢃ ꢍ ꢍ ꢎ ꢏ ꢍ ꢐꢎ ꢑ ꢀ  
ꢆ ꢅ ꢒ ꢂꢓ ꢁ ꢔꢁ ꢕꢖ ꢑ ꢔꢂ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
sector-protect operation (continued)  
A18−A16  
Sector Address  
V
ID  
A9  
t
HVT  
A6  
A1  
A0  
t
AVGH  
E
V
ID  
G
t
WLWH2  
t
HVT  
t
HVT  
t
GHVWL  
W
t
GLQV  
DOUT  
DQ  
NOTE A: DOUT  
=
=
00H if selected sector is not protected,  
01H if the sector is protected  
Figure 15. AC Waveform for Sector-Protect Operation  
32  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢁꢂ  
ꢅꢆ  
ꢋ ꢃ ꢈ ꢌ ꢃꢍ ꢍ ꢎ ꢏ ꢍꢐ ꢎ ꢑꢀ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
sector-unprotect operation  
Start  
Protect All Sectors  
X = 1  
E, G, A9 = V  
A6, A12, A16 = V  
ID  
IH  
Apply One  
10-ms Pulse  
E, G, A0 = V  
IL  
W, A6, A1 = V  
IH  
Select Sector Address  
A18, A17, A16  
X = X+1  
Read Data  
No  
No  
X=1000  
?
Next Sector  
Address  
Data = 00H  
?
Yes  
Yes  
No  
Last  
Sector  
?
Sector-Unprotect Failed  
Yes  
A9 = V or V  
IH IL  
Write Reset Command  
End  
Figure 16. Sector-Unprotect Algorithm  
33  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢈꢇꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊꢆ ꢇꢈ ꢇ  
ꢋꢃ ꢈꢌꢃ ꢍ ꢍ ꢎ ꢏ ꢍ ꢐꢎ ꢑ ꢀ  
ꢆ ꢅ ꢒ ꢂꢓ ꢁ ꢔꢁ ꢕꢖ ꢑ ꢔꢂ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
sector-unprotect operation (continued)  
Sector Address  
Sector Address  
A18A17  
A16  
A12  
V
ID  
A9  
t
AVQV  
t
HVT  
A6  
A1  
A0  
t
AVGEH  
V
V
ID  
E
t
t
EHVWL  
GHVWL  
t
t
HVT  
HVT  
ID  
G
t
WLWH3  
t
HVT  
W
t
GLQV  
DOUT  
DQ  
NOTE A: DOUT  
=
=
00H if selected sector is not protected,  
01H if the sector is protected  
Figure 17. AC Waveform for Sector-Unprotect Operation  
34  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢁꢂ  
ꢅꢆ  
ꢋ ꢃ ꢈ ꢌ ꢃꢍ ꢍ ꢎ ꢏ ꢍꢐ ꢎ ꢑꢀ  
ꢖꢑ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
MECHANICAL DATA  
FM (R-PQCC-J32)  
PLASTIC J-LEADED CHIP CARRIER  
Seating Plane  
0.004 (0,10)  
0.140 (3,56)  
0.132 (3,35)  
0.495 (12,57)  
0.485 (12,32)  
0.129 (3,28)  
0.123 (3,12)  
0.453 (11,51)  
0.447 (11,35)  
0.049 (1,24)  
0.043 (1,09)  
0.008 (0,20) NOM  
1
30  
4
29  
5
0.020 (0,51)  
0.015 (0,38)  
0.595 (15,11)  
0.585 (14,86)  
0.553 (14,05)  
0.547 (13,89)  
0.030 (0,76)  
TYP  
21  
13  
14  
20  
0.050 (1,27)  
4040201-4/B 03/95  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MS-016  
35  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢈꢇꢉ ꢀ ꢁꢂ ꢃ ꢄ ꢊꢆ ꢇꢈ ꢇ  
ꢋꢃ ꢈꢌꢃ ꢍ ꢍ ꢎ ꢏ ꢍ ꢐꢎ ꢑ ꢀ  
ꢆ ꢅ ꢒ ꢂꢓ ꢁ ꢔꢁ ꢕꢖ ꢑ ꢔꢂ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
MECHANICAL DATA  
DBW (R-PDSO-G32)  
PLASTIC THIN SMALL-OUTLINE PACKAGE  
1
32  
0.020 (0,50)  
0.319 (8,10)  
0.311 (7,90)  
0.011 (0,27)  
0.007 (0,17)  
0.003 (0,08)  
M
17  
16  
0.492 (12,50)  
0.484 (12,30)  
0.559 (14,20)  
0.543 (13,80)  
0.006 (0,15)  
NOM  
0.047 (1,20) MAX  
Seating Plane  
0.003 (0,08)  
0.028 (0,70)  
0.020 (0,50)  
0.006 (0,15)  
0.002 (0,05)  
4073304-2/C 10/97  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
36  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢁꢂ  
ꢅꢆ  
ꢋ ꢃ ꢈ ꢌ ꢃꢍ ꢍ ꢎ ꢏ ꢍꢐ ꢎ ꢑꢀ  
SMJS825D − SEPTEMBER 1995 − REVISED JUNE 1998  
MECHANICAL DATA  
DD (R-PDSO-G32)  
PLASTIC THIN SMALL-OUTLINE PACKAGE  
1
32  
0.319 (8,10)  
0.311 (7,90)  
0.020 (0,50)  
0.011 (0,27)  
0.005 (0,12)  
M
0.007 (0,17)  
17  
16  
0.728 (18,50)  
0.720 (18,30)  
0.028 (0,70)  
0.020 (0,50)  
0.047 (1,20) MAX  
Seating Plane  
0.003 (0,08)  
0.006 (0,15)  
0.002 (0,05)  
0.006 (0,15)  
NOM  
0.795 (20,20)  
0.780 (19,80)  
4040097/E 10/97  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
37  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
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