TMS320C6743ZKB2 [TI]

16-BIT, 50MHz, OTHER DSP, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256;
TMS320C6743ZKB2
型号: TMS320C6743ZKB2
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

16-BIT, 50MHz, OTHER DSP, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256

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TMS320C6743 Fixed/Floating-Point Digital Signal Processor  
Check for Samples: TMS320C6743  
1 TMS320C6743 Fixed/Floating-Point Digital Signal Processor  
1.1 Features  
12  
Cycle  
• Highlights  
– Two Multiply Functional Units  
– Up to 375-MHz FIxed/Floating-Point VLIW  
DSP Core  
– Enhanced Direct-Memory-Access Controller  
(EDMA3)  
Mixed-Precision IEEE Floating Point  
Multiply Supported up to:  
2 SP x SP -> SP Per Clock  
– Two External Memory Interfaces  
2 SP x SP -> DP Every Two Clocks  
2 SP x DP -> DP Every Three Clocks  
2 DP x DP -> DP Every Four Clocks  
– Two Configurable 16550 type UART Modules  
– One Serial Peripheral Interface (SPI)  
– Multimedia Card (MMC)/Secure Digital (SD)  
– Two Master/Slave Inter-Integrated Circuit  
Modules (I2C)  
– RMII Ethernet Media Access Controller  
(EMAC)  
– Three Event Capture (eCAP) Modules  
Fixed Point Multiply Supports Two 32 x  
32-Bit Multiplies, Four 16 x 16-Bit  
Multiplies, or Eight 8 x 8-Bit Multiplies per  
Clock Cycle, and Complex Multiples  
– Instruction Packing Reduces Code Size  
– All Instructions Conditional  
– Hardware Support for Modulo Loop  
Operation  
– Protected Mode Operation  
– Two Quadrature Encoding (eQEP) Modules  
– Two Multi-Channel Audio Serial Ports  
(McASP)  
– Exceptions Support for Error Detection and  
Program Redirection  
– Programmable Real-Time Unit Subsystem  
(PRUSS)  
• C674x Instruction Set Features  
– Two 64-bit Timers (each configurable as 32-  
bit)  
• Applications  
– Superset of the C67x+™ and C64x+™ ISAs  
– 3000/2250 C674x MIPS/MFLOPS  
– Industrial Control  
– Networking  
– Byte-Addressable (8-/16-/32-/64-Bit Data)  
– 8-Bit Overflow Protection  
– High-Speed Encoding  
– Professional Audio™  
• Software Support  
– Bit-Field Extract, Set, Clear  
– Normalization, Saturation, Bit-Counting  
– Compact 16-Bit Instructions  
– TI DSP/BIOS™  
– Chip Support Library and DSP Library  
• TMS320C674x Floating Point VLIW DSP Core  
• C674x Two Level Cache Memory Architecture  
– 32K-Byte L1P Program RAM/Cache  
– 32K-Byte L1D Data RAM/Cache  
– Load-Store Architecture With Non-Aligned  
Support  
– 128K-Byte L2 Unified Mapped RAM/Cache  
– Flexible RAM/Cache Partition (L1 and L2)  
– 64 General-Purpose Registers (32 Bit)  
– Six ALU (32-/40-Bit) Functional Units  
• Enhanced Direct-Memory-Access Controller 3  
(EDMA3):  
Supports 32-Bit Integer, SP (IEEE Single  
Precision/32-Bit) and DP (IEEE Double  
Precision/64-Bit) Floating Point  
Supports up to Four SP Additions Per  
Clock, Four DP Additions Every 2 Clocks  
Supports up to Two Floating Point (SP or  
DP) Reciprocal Approximation (RCPxP)  
and Square-Root Reciprocal  
– 2 Transfer Controllers  
– 32 Independent DMA Channels  
– 8 Quick DMA Channels  
– Programmable Transfer Burst Size  
• 3.3V LVCMOS IOs  
• Two External Memory Interfaces:  
– EMIFA  
NOR (8-Bit-Wide Data)  
Approximation (RSQRxP) Operations Per  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date. Products conform to  
specifications per the terms of the Texas Instruments standard warranty. Production  
processing does not necessarily include testing of all parameters.  
Copyright © 2009–2013, Texas Instruments Incorporated  
 
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SPRS565C APRIL 2009REVISED MARCH 2013  
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NAND (8-Bit-Wide Data)  
– Supports TDM, I2S, and Similar Formats  
– EMIFB  
– FIFO buffers for Transmit and Receive  
• 10/100 Mb/s Ethernet MAC (EMAC):  
– IEEE 802.3 Compliant (3.3-V I/O Only)  
– RMII Media Independent Interface  
– Management Data I/O (MDIO) Module  
16-bit SDRAM, up to 128 MB  
• Two Configurable 16550 type UART Modules:  
– UART0 With Modem Control Signals  
– 16-byte FIFO  
– 16x or 13x Oversampling Option  
• One Serial Peripheral Interface (SPI) With One  
Chip-Select  
• Multimedia Card (MMC)/Secure Digital (SD)  
Card Interface with Secure Data I/O (SDIO)  
• Two Master/Slave Inter-Integrated Circuit (I2C  
Bus™)  
• One 64-Bit General-Purpose Timer  
(Configurable as Two 32-Bit Timers)  
• One 64-Bit General-Purpose/Watch Dog Timer  
(Configurable as Two 32-Bit Timers)  
• Three Enhanced Pulse Width Modulators  
(eHRPWM):  
– Dedicated 16-Bit Time-Base Counter With  
Period And Frequency Control  
– 6 Single Edge, 6 Dual Edge Symmetric or 3  
Dual Edge Asymmetric Outputs  
• Programmable Real-Time Unit Subsystem  
(PRUSS)  
– Two Independent Programmable Realtime  
Unit (PRU) Cores  
– Dead-Band Generation  
32-Bit Load/Store RISC architecture  
4K Byte instruction RAM per core  
512 Bytes data RAM per core  
PRU Subsystem (PRUSS) can be disabled  
via software to save power  
Register 30 of each PRU is exported from  
the subsystem in addition to the normal  
R31 output of the PRU cores.  
– PWM Chopping by High-Frequency Carrier  
– Trip Zone Input  
• Three 32-Bit Enhanced Capture Modules  
(eCAP):  
– Configurable as 3 Capture Inputs or 3  
Auxiliary Pulse Width Modulator (APWM)  
outputs  
– Single Shot Capture of up to Four Event  
Time-Stamps  
– Standard power management mechanism  
• Two 32-Bit Enhanced Quadrature Encoder  
Pulse Modules (eQEP)  
• 256-Ball Pb-Free Plastic Ball Grid Array (PBGA)  
[ZKB Suffix], 1.0-mm Ball Pitch  
• 176-Pin Thin Quad Flat Pack (TQFP) [PTP  
Suffix], 0.5-mm Pin Pitch  
• Commercial or Automotive Temperature  
Clock gating  
Entire subsystem under a single PSC  
clock gating domain  
– Dedicated interrupt controller  
– Dedicated switched central resource  
• Two Multichannel Audio Serial Ports:  
2
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The C6743 is a Low-power digital signal processor based on C674x DSP core. It consumes significantly  
lower power than other members of the TMS320C6000™ platform of DSPs.  
The C6743 enables OEMs and ODMs to quickly bring to market devices featuring high processing  
performance .  
The C6743 DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a  
32KB direct mapped cache and the Level 1 data cache (L1D) is a 32KB 2-way set-associative cache. The  
Level 2 program cache (L2P) consists of a 128KB memory space that is shared between program and  
data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.  
The peripheral set includes: a 10/100 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output  
(MDIO) module; two inter-integrated circuit (I2C) Bus interfaces; 2 multichannel audio serial port (McASP)  
with 14/9 serializers and FIFO buffers; 2 64-bit general-purpose timers each configurable (one  
configurable as watchdog); up to 8 banks of 16 pins of general-purpose input/output (GPIO) with  
programmable interrupt/event generation modes, multiplexed with other peripherals; 2 UART interfaces  
(one with RTS and CTS); 3 enhanced high-resolution pulse width modulator (eHRPWM) peripherals; 3 32-  
bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3  
auxiliary pulse width modulator (APWM) outputs; 2 32-bit enhanced quadrature pulse (eQEP) peripherals;  
and 2 external memory interfaces: an asynchronous external memory interface (EMIFA) for slower  
memories or peripherals, and a higher speed memory interface (EMIFB) for SDRAM.  
The Ethernet Media Access Controller (EMAC) provides an efficient interface between the C6743 and the  
network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps  
in either half- or full-duplex mode. Additionally an Management Data Input/Output (MDIO) interface is  
available for PHY configuration.  
The rich peripheral set provides the ability to control external peripheral devices and communicate with  
external processors. For details on each of the peripherals, see the related sections later in this document  
and the associated peripheral reference guides.  
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1.2 Functional Block Diagram  
DSP Subsystem  
JTAG Interface  
System Control  
C674x  
DSP CPU  
PLL/Clock  
Generator  
w/OSC  
Input  
Clock(s)  
Memory  
Protection  
AET  
General-  
Purpose  
Timer  
Power/Sleep  
Controller  
32 KB  
L1 Pgm  
32 KB  
L1 RAM  
General-  
Purpose  
Timer  
Pin  
Multiplexing  
BOOT ROM  
(Watchdog)  
Switched Central Resource (SCR)  
Peripherals  
DMA  
Audio Ports  
Serial Interfaces  
McASP  
w/FIFO  
(2)  
2
SPI  
(1)  
UART  
(2)  
I C  
(2)  
EDMA3  
GPIO  
Connectivity  
External Memory Interfaces  
EMIFB  
Control Timers  
(10/100)  
EMAC  
(RMII)  
ePWM  
(3)  
eCAP  
(3)  
eQEP  
(2)  
MMC/SD  
(8b)  
EMIFA(8b)  
NAND/Flash  
SDRAM Only  
(16b)  
MDIO  
(1) Not all peripherals are available at the same time due to multiplexing.  
Figure 1-1. TMS320C6743 Functional Block Diagram  
4
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Revision History  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
This data manual revision history highlights the changes made to the SPRS565B device-specific data  
manual to make it an SPRS565C revision.  
Revision History  
See  
ADDITIONS/MODIFICATIONS/DELETIONS  
Global  
EMIFB sub-bullets:  
Section 1.1  
Features  
Updated/Changed "16-bit SDRAM, up to 256 MB" to "16-bit SDRAM, up to 128 MB"  
Figure 1-1, Functional Block Diagram:  
Added “Memory Protection” in the System Control Block  
Section 1.2  
Functional Block Diagram  
Table 2-1, Characteristics of the C6743 Processor:  
Updated/Changed EMIFB “SDRAM only, 16-bit bus width, up to 256 Mbit (PTP)” to “SDRAM  
only, 16-bit bus width, up to 128 MB (PTP)”  
Section 2.1  
Device Characteristics  
Updated/Changed EMIFB SDRAM only, “16-bit bus width, up to 512 Mbit (ZKB)” to “16-bit  
bus width, up to 128 MB (ZKB)”  
Added Silicon Revisions "3.0" and "2.1" to the JTAG BSDL_ID row  
Table 2-2, C674x Cache Registers:  
Updated/Changed DESCRIPTION for MAR192 – MAR223 from “… SDRAM Data (CS2) …”  
to “…SDRAM Data (CS0) …”  
Section 2.3.2.3  
C674x CPU  
Added “Note: Read/Write accesses …” sentence  
Section 2.4  
Memory Map Summary  
Table 2-4, C6743 Top Level Memory Map:  
Updated/Changed "0xC000 0000" – "0xCFFF FFFF" "256M" "EMIFB SDRAM Data" to  
"0xC000 0000" – "0xC7FF FFFF" "128M"  
Updated/Changed "0xD000 0000" – "0xFFFF FFFF” to "0xC800 0000" – "0xFFFF FFFF"  
"BLANK" RESERVED row  
Table 2-18, Ethernet Media Access Controller (EMAC) Terminal Functions:  
Section 2.6.14  
Ethernet Media Access  
Controller (EMAC)  
Added “MDIO serial data” DESCRIPTION for the MDIO AXR0[8]/MDIO_D/GP3[8] SIGNAL  
NAME  
Table 2-21, Reserved and No Connect Terminal Functions:  
Updated/Changed the RSV1 TYPE column from “PWR” to “-“  
Section 2.6.17  
Reserved and No Connect  
Terminal Functions  
Updated/Changed RSV2 DESCRIPTION to “… be tied either directly to CVDD or left  
unconnected [do not connect to ground (VSS)]”  
NOR Flash Boot bullet:  
Deleted "or 16-bit" from NOR Direct boot  
Deleted "or 16-bit" from NOR Legacy boot  
Deleted "or 16-bit" from NOR AIS boot  
Section 3.1  
Boot Modes  
Table 3-1, System Configuration (SYSCFG) Module Register Access:  
Updated/Changed 0x01C1 4018, DEVIDR0 REGISTER DESCRIPTION from “Device  
Identification Register 0” to “JTAG Identification Register”  
Section 3.2  
SYSCFG Module  
Added 0x01C1 4024, CHIPREVID, Silicon Revision Identification Register row  
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Revision History (continued)  
See  
ADDITIONS/MODIFICATIONS/DELETIONS  
Section 4.1, Absolute Maximum Ratings Over Operating Case Temperature Range:  
Updated/Changed Input voltage ranges, VI I/O, 3.3V (Steady State) from “-0.3V to DVDD +  
0.3V” to  
“-0.3V to DVDD + 0.35V”  
Section 4  
Device Operating Conditions  
Section 4.2, Recommended Operating Conditions:  
Updated/Change DVDD, Supply voltage, I/O, 3.3V (DVDD) MIN value from “3.15” to “3.0” V  
Section 5.4.1, Power-On Reset (POR):  
Deleted "RESETOUT, which remains active through the reset sequence, and" from the "All  
pins are tri-stated ..." sentence in the first paragraph  
Section 5.4  
Reset  
Section 5.4.2, Warm Reset:  
Deleted "RESETOUT, which remains active through the reset sequence, and" from the "All  
pins are tri-stated ..." sentence in the first paragraph  
Updated/Changed "During reset, GP7[14] is ..." sentence in the first paragraph  
Table 5-4, Allowed PLL Operating Conditions:  
Added “Max PLL Lock Time =” to PARAMETER NO 2, Lock time MAX equation  
Section 5.6.1  
PLL Device-Specific  
Information  
Table 5-7, C6743 DSP Interrupts:  
Updated/Changed EVT# 74 INTERRUPT NAME from “PROTERR” to  
“MPU_BOOTCFG_ERR”  
Section 5.6.1  
DSP Interrupts  
Updated/Changed EVT# 74 SOURCE from “SYSCFG Protection Shared Interrupt” to “Shared  
MPU and SYSCFG Address/Protection Error Interrupt"  
Section 5.11  
External Memory Interface B  
(EMIFB)  
Figure 5-17, EMIFB Functional Block Diagram:  
Added MPU2 block to figure  
Section 5.11.1, EMIFB SDRAM Loading Limitations:  
Added new Subsection  
Section 5.11.2  
Interfacing to SDRAM  
Deleted "EMIFB to Dual 4M × 16 × 4 Bank SDRAM Interface" figure, incorrect  
Table 5-25, EMIFB SDRAM Interface Switching Characteristics:  
Updated/Changed PARAMETER No. 1, tc(CLK) Cycle time, EMIF clock EMB_CLK MIN value  
from “7.5” to “6.579” ns  
Section 5.11.3  
EMIFB Electrical Data/Timing  
Updated/Changed PARAMETER No. 2, tw(CLK) Pulse width, EMIF clock EMB_CLK high or  
low MIN value from “3” to “2.63” ns  
Section 5.27, JTAG Peripheral Register Description(s) – JTAG ID Register (DEVIDR0):  
Added Silicon Revisions "3.0" and "2.1" to the "0x9B7D F02F for silicon revision 2.0" bullet  
Section 5.27  
IEEE 1149.1 JTAG  
Section 6.1.2  
Device and Development-  
Support Tool Nomenclature  
Updated/Changed subsection title from “Device Nomenclature” to “Device and Development-  
Support Tool Nomenclature”  
Figure 6-1, Device Nomenclature:  
Updated/Changed Silicon Revision to include Revision 3.0  
6
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2 Device Overview  
2.1 Device Characteristics  
Table 2-1 provides an overview of the C6743 Low power digital signal processor. The table shows  
significant features of the device, including the capacity of on-chip RAM, peripherals, and the package  
type with pin count.  
Table 2-1. Characteristics of the C6743 Processor  
HARDWARE FEATURES  
C6743  
SDRAM only, 16-bit bus width, up to  
128 MB (PTP)  
SDRAM only, 16-bit bus width, up to  
128 MB (ZKB)  
EMIFB  
EMIFA  
Asynchronous (8-bit bus width) RAM, Flash, NOR, NAND  
MMC and SD cards supported.  
Flash Card Interface  
EDMA3  
32 independent channels, 8 QDMA channels, 2 Transfer controllers  
2 64-Bit General Purpose (configurable as 2 separate 32-bit timers, 1  
configurable as Watch Dog)  
Timers  
UART  
SPI  
I2C  
2 (One with RTS and CTS flow control)  
One with one hardware chip select  
2 (both Master/Slave)  
Peripherals  
Not all peripherals pins  
are available at the  
same time (for more  
detail, see the Device  
Configurations section).  
Multichannel Audio Serial Port  
[McASP]  
2 (each with transmit/receive, FIFO buffer, 14/9 serializers)  
1 (RMII Interface)  
10/100 Ethernet MAC with  
Management Data I/O  
eHRPWM  
eCAP  
6 Single Edge, 6 Dual Edge Symmetric, or 3 Dual Edge Asymmetric Outputs  
3 32-bit capture inputs or 3 32-bit auxiliary PWM outputs  
2 32-bit QEP channels with 4 inputs/channel  
eQEP  
General-Purpose Input/Output  
Port  
8 banks of 16-bit  
PRU Subsystem (PRUSS)  
Size (Bytes)  
2 Programmable PRU Cores  
320KB RAM  
DSP  
32KB L1 Program (L1P)/Cache (up to 32KB)  
32KB L1 Data (L1D)/Cache (up to 32KB)  
On-Chip Memory  
Organization  
128KB Unified Mapped RAM/Cache (L2)  
DSP Memories can be made accessible to EDMA3, and other peripherals.  
C674x CPU ID + CPU Control Status Register  
0x1400  
0x0000  
Rev ID  
(CSR.[31:16])  
C674x Megamodule  
Revision  
Revision ID Register  
(MM_REVID[15:0])  
0x8B7DF02F (Silicon Revision 1.0)  
0x8B7DF02F (Silicon Revision 1.1)  
JTAG BSDL_ID  
DEVIDR0 register  
0x9B7DF02F (Silicon Revision 3.0, 2.1, and 2.0)  
CPU Frequency  
Voltage  
MHz  
C674x DSP 375(/200) MHz  
Core (V)  
I/O (V)  
1.2 V  
3.3 V  
24 mm x 24 mm, 176-Pin, 0.5 mm  
pitch, TQFP (PTP)  
17 mm x 17 mm, 256-Ball 1 mm pitch,  
PBGA (ZKB)  
Package  
Product Preview (PP),  
Advance Information (AI),  
or Production Data (PD)  
Product Status(1)  
PD  
(1) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.  
Copyright © 2009–2013, Texas Instruments Incorporated  
Device Overview  
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2.2 Device Compatibility  
The C674x DSP core is code-compatible with the C6000™ DSP platform and supports features of both  
the C64x+ and C67x+ DSP families.  
2.3 DSP Subsystem  
The DSP Subsystem includes the following features:  
C674x DSP CPU  
32KB L1 Program (L1P)/Cache (up to 32KB)  
32KB L1 Data (L1D)/Cache (up to 32KB)  
128KB Unified Mapped RAM/Cache (L2)  
Boot ROM (cannot be used for application code)  
Little endian  
32K Bytes  
L1P RAM/  
Cache  
128K Bytes  
L2 RAM  
Boot ROM  
256  
256  
256  
256  
Cache Control  
Memory Protect  
Bandwidth Mgmt  
Cache Control  
Memory Protect  
Bandwidth Mgmt  
L1P  
L2  
256  
256  
Power Down  
Interrupt  
Controller  
256  
256  
Instruction Fetch  
C64x  
Fixed/Floating-Point CPU  
IDMA  
256  
Register  
File A  
Register  
File B  
64  
64  
CFG  
Bandwidth Mgmt  
Memory Protect  
Cache Control  
EMC  
Configuration  
Peripherals  
Bus  
32  
L1D  
MDMA  
SDMA  
8 x 32  
64  
64  
64  
64  
32K Bytes  
L1D RAM/  
Cache  
High  
Performance  
Switch Fabric  
Figure 2-1. C674x Megamodule Block Diagram  
8
Device Overview  
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2.3.1 C674x DSP CPU Description  
The C674x Central Processing Unit (CPU) consists of eight functional units, two register files, and two  
data paths as shown in Figure 2-2. The two general-purpose register files (A and B) each contain 32 32-  
bit registers for a total of 64 registers. The general-purpose registers can be used for data or can be data  
address pointers. The data types supported include packed 8-bit data, packed 16-bit data, 32-bit data, 40-  
bit data, and 64-bit data. Values larger than 32 bits, such as 40-bit-long or 64-bit-long values are stored in  
register pairs, with the 32 LSBs of data placed in an even register and the remaining 8 or 32 MSBs in the  
next upper register (which is always an odd-numbered register).  
The eight functional units (.M1, .L1, .D1, .S1, .M2, .L2, .D2, and .S2) are each capable of executing one  
instruction every clock cycle. The .M functional units perform all multiply operations. The .S and .L units  
perform a general set of arithmetic, logical, and branch functions. The .D units primarily load data from  
memory to the register file and store results from the register file into memory.  
Each C674x .M unit can perform one of the following each clock cycle: one 32 x 32 bit multiply, one 16 x  
32 bit multiply, two 16 x 16 bit multiplies, two 16 x 32 bit multiplies, two 16 x 16 bit multiplies with  
add/subtract capabilities, four 8 x 8 bit multiplies, four 8 x 8 bit multiplies with add operations, and four  
16 x 16 multiplies with add/subtract capabilities (including a complex multiply). There is also support for  
Galois field multiplication for 8-bit and 32-bit data. Many communications algorithms such as FFTs and  
modems require complex multiplication. The complex multiply (CMPY) instruction takes four 16-bit inputs  
and produces a 32-bit real and a 32-bit imaginary output. There are also complex multiplies with rounding  
capability that produces one 32-bit packed output that contain 16-bit real and 16-bit imaginary values. The  
32 x 32 bit multiply instructions provide the extended precision necessary for high-precision algorithms on  
a variety of signed and unsigned 32-bit data types.  
The .L or (Arithmetic Logic Unit) now incorporates the ability to do parallel add/subtract operations on a  
pair of common inputs. Versions of this instruction exist to work on 32-bit data or on pairs of 16-bit data  
performing dual 16-bit add and subtracts in parallel. There are also saturated forms of these instructions.  
The C674x core enhances the .S unit in several ways. On the previous cores, dual 16-bit MIN2 and MAX2  
comparisons were only available on the .L units. On the C674x core they are also available on the .S unit  
which increases the performance of algorithms that do searching and sorting. Finally, to increase data  
packing and unpacking throughput, the .S unit allows sustained high performance for the quad 8-bit/16-bit  
and dual 16-bit instructions. Unpack instructions prepare 8-bit data for parallel 16-bit operations. Pack  
instructions return parallel results to output precision including saturation support.  
Other new features include:  
SPLOOP - A small instruction buffer in the CPU that aids in creation of software pipelining loops where  
multiple iterations of a loop are executed in parallel. The SPLOOP buffer reduces the code size  
associated with software pipelining. Furthermore, loops in the SPLOOP buffer are fully interruptible.  
Compact Instructions - The native instruction size for the C6000 devices is 32 bits. Many common  
instructions such as MPY, AND, OR, ADD, and SUB can be expressed as 16 bits if the C674x  
compiler can restrict the code to use certain registers in the register file. This compression is  
performed by the code generation tools.  
Instruction Set Enhancement - As noted above, there are new instructions such as 32-bit  
multiplications, complex multiplications, packing, sorting, bit manipulation, and 32-bit Galois field  
multiplication.  
Exceptions Handling - Intended to aid the programmer in isolating bugs. The C674x CPU is able to  
detect and respond to exceptions, both from internally detected sources (such as illegal op-codes) and  
from system events (such as a watchdog time expiration).  
Privilege - Defines user and supervisor modes of operation, allowing the operating system to give a  
basic level of protection to sensitive resources. Local memory is divided into multiple pages, each with  
read, write, and execute permissions.  
Time-Stamp Counter - Primarily targeted for Real-Time Operating System (RTOS) robustness, a free-  
running time-stamp counter is implemented in the CPU which is not sensitive to system stalls.  
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For more details on the C674x CPU and its enhancements over the C64x architecture, see the following  
documents:  
TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (SPRU732)  
TMS320C64x Technical Overview (SPRU395)  
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Even  
Odd  
register  
src1  
src2  
register  
file A  
file A  
(A0, A2,  
(A1, A3,  
A4...A30)  
A5...A31)  
.L1  
odd dst  
even dst  
long src  
(D)  
8
32 MSB  
32 LSB  
ST1b  
ST1a  
8
long src  
even dst  
odd dst  
src1  
(D)  
Data path A  
.S1  
src2  
32  
32  
(A)  
(B)  
dst2  
dst1  
src1  
.M1  
src2  
(C)  
32 MSB  
32 LSB  
LD1b  
LD1a  
dst  
src1  
src2  
.D1  
DA1  
2x  
1x  
Even  
register  
file B  
Odd  
register  
file B  
src2  
DA2  
.D2  
(B0, B2,  
B4...B30)  
src1  
dst  
(B1, B3,  
B5...B31)  
32 LSB  
LD2a  
LD2b  
32 MSB  
src2  
(C)  
.M2  
src1  
dst2  
32  
32  
(B)  
(A)  
dst1  
src2  
src1  
.S2  
odd dst  
even dst  
long src  
(D)  
Data path B  
8
32 MSB  
32 LSB  
ST2a  
ST2b  
8
long src  
even dst  
(D)  
odd dst  
src2  
.L2  
src1  
Control Register  
A. On .M unit, dst2 is 32 MSB.  
B. On .M unit, dst1 is 32 LSB.  
C. On C64x CPU .M unit, src2 is 32 bits; on C64x+ CPU .M unit, src2 is 64 bits.  
D. On .L and .S units, odd dst connects to odd register files and even dst connects to even register files.  
Figure 2-2. TMS320C674x CPU (DSP Core) Data Paths  
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2.3.2 DSP Memory Mapping  
The DSP memory map is shown in Section 2.4.  
2.3.2.1 External Memories  
The DSP has access to the following External memories:  
Asynchronous EMIF / NAND / NOR Flash (EMIFA)  
SDRAM (EMIFB)  
2.3.2.2 DSP Internal Memories  
The DSP has access to the following DSP memories:  
L2 RAM  
L1P RAM  
L1D RAM  
2.3.2.3 C674x CPU  
The C674x core uses a two-level cache-based architecture. The Level 1 Program cache (L1P) is 32 KB  
direct mapped cache and the Level 1 Data cache (L1D) is 32 KB 2-way set associated cache. The Level 2  
memory/cache (L2) consists of a 128 KB memory space that is shared between program and data space.  
L2 memory can be configured as mapped memory, cache, or a combination of both.  
Table 2-2 shows a memory map of the C674x CPU cache registers for the device.  
Table 2-2. C674x Cache Registers  
HEX ADDRESS RANGE  
0x0184 0000  
REGISTER NAME  
L2CFG  
DESCRIPTION  
L2 Cache configuration register  
L1P Size Cache configuration register  
L1P Freeze Mode Cache configuration register  
L1D Size Cache configuration register  
L1D Freeze Mode Cache configuration register  
Reserved  
0x0184 0020  
L1PCFG  
L1PCC  
0x0184 0024  
0x0184 0040  
L1DCFG  
L1DCC  
0x0184 0044  
0x0184 0048 - 0x0184 0FFC  
0x0184 1000  
-
EDMAWEIGHT  
-
L2 EDMA access control register  
Reserved  
0x0184 1004 - 0x0184 1FFC  
0x0184 2000  
L2ALLOC0  
L2ALLOC1  
L2ALLOC2  
L2ALLOC3  
-
L2 allocation register 0  
0x0184 2004  
L2 allocation register 1  
0x0184 2008  
L2 allocation register 2  
0x0184 200C  
L2 allocation register 3  
0x0184 2010 - 0x0184 3FFF  
0x0184 4000  
Reserved  
L2WBAR  
L2WWC  
L2WIBAR  
L2WIWC  
L2IBAR  
L2 writeback base address register  
L2 writeback word count register  
L2 writeback invalidate base address register  
L2 writeback invalidate word count register  
L2 invalidate base address register  
L2 invalidate word count register  
L1P invalidate base address register  
L1P invalidate word count register  
L1D writeback invalidate base address register  
L1D writeback invalidate word count register  
Reserved  
0x0184 4004  
0x0184 4010  
0x0184 4014  
0x0184 4018  
0x0184 401C  
L2IWC  
0x0184 4020  
L1PIBAR  
L1PIWC  
L1DWIBAR  
L1DWIWC  
-
0x0184 4024  
0x0184 4030  
0x0184 4034  
0x0184 4038  
0x0184 4040  
L1DWBAR  
L1D Block Writeback  
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Table 2-2. C674x Cache Registers (continued)  
HEX ADDRESS RANGE  
REGISTER NAME  
L1DWWC  
L1DIBAR  
L1DIWC  
-
DESCRIPTION  
0x0184 4044  
0x0184 4048  
L1D Block Writeback  
L1D invalidate base address register  
L1D invalidate word count register  
Reserved  
0x0184 404C  
0x0184 4050 - 0x0184 4FFF  
0x0184 5000  
L2WB  
L2 writeback all register  
0x0184 5004  
L2WBINV  
L2INV  
L2 writeback invalidate all register  
L2 Global Invalidate without writeback  
Reserved  
0x0184 5008  
0x0184 500C - 0x0184 5027  
0x0184 5028  
-
L1PINV  
L1P Global Invalidate  
0x0184 502C - 0x0184 5039  
0x0184 5040  
-
Reserved  
L1DWB  
L1D Global Writeback  
0x0184 5044  
L1DWBINV  
L1DINV  
L1D Global Writeback with Invalidate  
L1D Global Invalidate without writeback  
Reserved 0x0000 0000 – 0x3FFF FFFF  
Reserved 0x4000 0000 – 0x5FFF FFFF  
0x0184 5048  
0x0184 8000 – 0x0184 80FF  
0x0184 8100 – 0x0184 817F  
MAR0 - MAR63  
MAR64 – MAR95  
Memory Attribute Registers for EMIFA Async Data (CS2) 0x6000 0000 –  
0x61FF FFFF  
0x0184 8180 – 0x0184 8187  
0x0184 8188 – 0x0184 818F  
MAR96 - MAR97  
MAR98 – MAR99  
Memory Attribute Registers for EMIFA Async Data (CS3) 0x6200 0000 –  
0x63FF FFFF  
0x0184 8190 – 0x0184 8197  
0x0184 8198 – 0x0184 819F  
MAR100 – MAR101  
MAR102 – MAR103  
Reserved 0x6400 0000 – 0x65FF FFFF  
Reserved 0x6600 0000 – 0x67FF FFFF  
Reserved 0x6800 0000 – 0x7FFF FFFF  
Reserved 0x8000 0000 – 0x81FF FFFF  
Reserved 0x8200 0000 – 0xBFFF FFFF  
0x0184 81A0 – 0x0184 81FF MAR104 – MAR127  
0x0184 8200  
MAR128  
0x0184 8204 – 0x0184 82FF  
MAR129 – MAR191  
Memory Attribute Registers for EMIFB SDRAM Data (CS0) 0xC000  
0000 – 0xDFFF FFFF  
0x0184 8300 – 0x0184 837F  
0x0184 8380 – 0x0184 83FF  
MAR192 – MAR223  
MAR224 – MAR255  
Reserved 0xE000 0000 – 0xFFFF FFFF  
Table 2-3. C674x L1/L2 Memory Protection Registers  
HEX ADDRESS RANGE  
0x0184 A000  
REGISTER NAME  
L2MPFAR  
L2MPFSR  
L2MPFCR  
-
DESCRIPTION  
L2 memory protection fault address register  
L2 memory protection fault status register  
L2 memory protection fault command register  
Reserved  
0x0184 A004  
0x0184 A008  
0x0184 A00C - 0x0184 A0FF  
0x0184 A100  
L2MPLK0  
L2MPLK1  
L2MPLK2  
L2MPLK3  
L2MPLKCMD  
L2MPLKSTAT  
-
L2 memory protection lock key bits [31:0]  
L2 memory protection lock key bits [63:32]  
L2 memory protection lock key bits [95:64]  
L2 memory protection lock key bits [127:96]  
L2 memory protection lock key command register  
L2 memory protection lock key status register  
Reserved  
0x0184 A104  
0x0184 A108  
0x0184 A10C  
0x0184 A110  
0x0184 A114  
0x0184 A118 - 0x0184 A1FF  
L2 memory protection page attribute register 0  
(controls memory address 0x0080 0000 - 0x0080 1FFF)  
0x0184 A200  
0x0184 A204  
0x0184 A208  
0x0184 A20C  
L2MPPA0  
L2MPPA1  
L2MPPA2  
L2MPPA3  
L2 memory protection page attribute register 1  
(controls memory address 0x0080 2000 - 0x0080 3FFF)  
L2 memory protection page attribute register 2  
(controls memory address 0x0080 4000 - 0x0080 5FFF)  
L2 memory protection page attribute register 3  
(controls memory address 0x0080 6000 - 0x0080 7FFF)  
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Table 2-3. C674x L1/L2 Memory Protection Registers (continued)  
HEX ADDRESS RANGE  
REGISTER NAME  
DESCRIPTION  
L2 memory protection page attribute register 4  
(controls memory address 0x0080 8000 - 0x0080 9FFF)  
0x0184 A210  
L2MPPA4  
L2 memory protection page attribute register 5  
(controls memory address 0x0080 A000 - 0x0080 BFFF)  
0x0184 A214  
0x0184 A218  
0x0184 A21C  
0x0184 A220  
0x0184 A224  
0x0184 A228  
0x0184 A22C  
0x0184 A230  
0x0184 A234  
0x0184 A238  
0x0184 A23C  
0x0184 A240  
0x0184 A244  
0x0184 A248  
0x0184 A24C  
0x0184 A250  
0x0184 A254  
0x0184 A258  
0x0184 A25C  
0x0184 A260  
0x0184 A264  
0x0184 A268  
0x0184 A26C  
0x0184 A270  
0x0184 A274  
0x0184 A278  
0x0184 A27C  
L2MPPA5  
L2 memory protection page attribute register 6  
(controls memory address 0x0080 C000 - 0x0080 DFFF)  
L2MPPA6  
L2 memory protection page attribute register 7  
(controls memory address 0x0080 E000 - 0x0080 FFFF)  
L2MPPA7  
L2 memory protection page attribute register 8  
(controls memory address 0x0081 0000 - 0x0081 1FFF)  
L2MPPA8  
L2 memory protection page attribute register 9  
(controls memory address 0x0081 2000 - 0x0081 3FFF)  
L2MPPA9  
L2 memory protection page attribute register 10  
(controls memory address 0x0081 4000 - 0x0081 5FFF)  
L2MPPA10  
L2MPPA11  
L2MPPA12  
L2MPPA13  
L2MPPA14  
L2MPPA15  
L2MPPA16  
L2MPPA17  
L2MPPA18  
L2MPPA19  
L2MPPA20  
L2MPPA21  
L2MPPA22  
L2MPPA23  
L2MPPA24  
L2MPPA25  
L2MPPA26  
L2MPPA27  
L2MPPA28  
L2MPPA29  
L2MPPA30  
L2MPPA31  
L2 memory protection page attribute register 11  
(controls memory address 0x0081 6000 - 0x0081 7FFF)  
L2 memory protection page attribute register 12  
(controls memory address 0x0081 8000 - 0x0081 9FFF)  
L2 memory protection page attribute register 13  
(controls memory address 0x0081 A000 - 0x0081 BFFF)  
L2 memory protection page attribute register 14  
(controls memory address 0x0081 C000 - 0x0081 DFFF)  
L2 memory protection page attribute register 15  
(controls memory address 0x0081 E000 - 0x0081 FFFF)  
L2 memory protection page attribute register 16  
(controls memory address 0x0082 0000 - 0x0082 1FFF)  
L2 memory protection page attribute register 17  
(controls memory address 0x0082 2000 - 0x0082 3FFF)  
L2 memory protection page attribute register 18  
(controls memory address 0x0082 4000 - 0x0082 5FFF)  
L2 memory protection page attribute register 19  
(controls memory address 0x0082 6000 - 0x0082 7FFF)  
L2 memory protection page attribute register 20  
(controls memory address 0x0082 8000 - 0x0082 9FFF)  
L2 memory protection page attribute register 21  
(controls memory address 0x0082 A000 - 0x0082 BFFF)  
L2 memory protection page attribute register 22  
(controls memory address 0x0082 C000 - 0x0082 DFFF)  
L2 memory protection page attribute register 23  
(controls memory address 0x0082 E000 - 0x0082 FFFF)  
L2 memory protection page attribute register 24  
(controls memory address 0x0083 0000 - 0x0083 1FFF)  
L2 memory protection page attribute register 25  
(controls memory address 0x0083 2000 - 0x0083 3FFF)  
L2 memory protection page attribute register 26  
(controls memory address 0x0083 4000 - 0x0083 5FFF)  
L2 memory protection page attribute register 27  
(controls memory address 0x0083 6000 - 0x0083 7FFF)  
L2 memory protection page attribute register 28  
(controls memory address 0x0083 8000 - 0x0083 9FFF)  
L2 memory protection page attribute register 29  
(controls memory address 0x0083 A000 - 0x0083 BFFF)  
L2 memory protection page attribute register 30  
(controls memory address 0x0083 C000 - 0x0083 DFFF)  
L2 memory protection page attribute register 31  
(controls memory address 0x0083 E000 - 0x0083 FFFF)  
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Table 2-3. C674x L1/L2 Memory Protection Registers (continued)  
HEX ADDRESS RANGE  
REGISTER NAME  
DESCRIPTION  
L2 memory protection page attribute register 32  
(controls memory address 0x0070 0000 - 0x0070 7FFF)  
0x0184 A280  
0x0184 A284  
0x0184 A288  
0x0184 A28C  
0x0184 A290  
0x0184 A294  
0x0184 A298  
0x0184 A29C  
0x0184 A2A0  
0x0184 A2A4  
0x0184 A2A8  
0x0184 A2AC  
0x0184 A2B0  
0x0184 A2B4  
0x0184 A2B8  
0x0184 A2BC  
0x0184 A2C0  
0x0184 A2C4  
0x0184 A2C8  
0x0184 A2CC  
0x0184 A2D0  
0x0184 A2D4  
0x0184 A2D8  
0x0184 A2DC  
0x0184 A2E0  
0x0184 A2E4  
0x0184 A2E8  
0x0184 A2EC  
L2MPPA32  
L2 memory protection page attribute register 33  
(controls memory address 0x0070 8000 - 0x0070 FFFF)  
L2MPPA33  
L2MPPA34  
L2MPPA35  
L2MPPA36  
L2MPPA37  
L2MPPA38  
L2MPPA39  
L2MPPA40  
L2MPPA41  
L2MPPA42  
L2MPPA43  
L2MPPA44  
L2MPPA45  
L2MPPA46  
L2MPPA47  
L2MPPA48  
L2MPPA49  
L2MPPA50  
L2MPPA51  
L2MPPA52  
L2MPPA53  
L2MPPA54  
L2MPPA55  
L2MPPA56  
L2MPPA57  
L2MPPA58  
L2MPPA59  
L2 memory protection page attribute register 34  
(controls memory address 0x0071 0000 - 0x0071 7FFF)  
L2 memory protection page attribute register 35  
(controls memory address 0x0071 8000 - 0x0071 FFFF)  
L2 memory protection page attribute register 36  
(controls memory address 0x0072 0000 - 0x0072 7FFF)  
L2 memory protection page attribute register 37  
(controls memory address 0x0072 8000 - 0x0072 FFFF)  
L2 memory protection page attribute register 38  
(controls memory address 0x0073 0000 - 0x0073 7FFF)  
L2 memory protection page attribute register 39  
(controls memory address 0x0073 8000 - 0x0073 FFFF)  
L2 memory protection page attribute register 40  
(controls memory address 0x0074 0000 - 0x0074 7FFF)  
L2 memory protection page attribute register 41  
(controls memory address 0x0074 8000 - 0x0074 FFFF)  
L2 memory protection page attribute register 42  
(controls memory address 0x0075 0000 - 0x0075 7FFF)  
L2 memory protection page attribute register 43  
(controls memory address 0x0075 8000 - 0x0075 FFFF)  
L2 memory protection page attribute register 44  
(controls memory address 0x0076 0000 - 0x0076 7FFF)  
L2 memory protection page attribute register 45  
(controls memory address 0x0076 8000 - 0x0076 FFFF)  
L2 memory protection page attribute register 46  
(controls memory address 0x0077 0000 - 0x0077 7FFF)  
L2 memory protection page attribute register 47  
(controls memory address 0x0077 8000 - 0x0077 FFFF)  
L2 memory protection page attribute register 48  
(controls memory address 0x0078 0000 - 0x0078 7FFF)  
L2 memory protection page attribute register 49  
(controls memory address 0x0078 8000 - 0x0078 FFFF)  
L2 memory protection page attribute register 50  
(controls memory address 0x0079 0000 - 0x0079 7FFF)  
L2 memory protection page attribute register 51  
(controls memory address 0x0079 8000 - 0x0079 FFFF)  
L2 memory protection page attribute register 52  
(controls memory address 0x007A 0000 - 0x007A 7FFF)  
L2 memory protection page attribute register 53  
(controls memory address 0x007A 8000 - 0x007A FFFF)  
L2 memory protection page attribute register 54  
(controls memory address 0x007B 0000 - 0x007B 7FFF)  
L2 memory protection page attribute register 55  
(controls memory address 0x007B 8000 - 0x007B FFFF)  
L2 memory protection page attribute register 56  
(controls memory address 0x007C 0000 - 0x007C 7FFF)  
L2 memory protection page attribute register 57  
(controls memory address 0x007C 8000 - 0x007C FFFF)  
L2 memory protection page attribute register 58  
(controls memory address 0x007D 0000 - 0x007D 7FFF)  
L2 memory protection page attribute register 59  
(controls memory address 0x007D 8000 - 0x007D FFFF)  
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Table 2-3. C674x L1/L2 Memory Protection Registers (continued)  
HEX ADDRESS RANGE  
REGISTER NAME  
DESCRIPTION  
L2 memory protection page attribute register 60  
(controls memory address 0x007E 0000 - 0x007E 7FFF)  
0x0184 A2F0  
L2MPPA60  
L2 memory protection page attribute register 61  
(controls memory address 0x007E 8000 - 0x007E FFFF)  
0x0184 A2F4  
0x0184 A2F8  
0x0184 A2FC  
L2MPPA61  
L2MPPA62  
L2MPPA63  
L2 memory protection page attribute register 62  
(controls memory address 0x007F 0000 - 0x007F 7FFF)  
L2 memory protection page attribute register 63  
(controls memory address 0x007F 8000 - 0x007F FFFF)  
0x0184 A300 - 0x0184 A3FF  
0x0184 A400  
-
Reserved  
L1PMPFAR  
L1PMPFSR  
L1PMPFCR  
-
L1P memory protection fault address register  
L1P memory protection fault status register  
L1P memory protection fault command register  
Reserved  
0x0184 A404  
0x0184 A408  
0x0184 A40C - 0x0184 A4FF  
0x0184 A500  
L1PMPLK0  
L1PMPLK1  
L1PMPLK2  
L1PMPLK3  
L1PMPLKCMD  
L1PMPLKSTAT  
-
L1P memory protection lock key bits [31:0]  
L1P memory protection lock key bits [63:32]  
L1P memory protection lock key bits [95:64]  
L1P memory protection lock key bits [127:96]  
L1P memory protection lock key command register  
L1P memory protection lock key status register  
Reserved  
0x0184 A504  
0x0184 A508  
0x0184 A50C  
0x0184 A510  
0x0184 A514  
0x0184 A518 - 0x0184 A5FF  
0x0184 A600 - 0x0184 A63F  
(1)  
-
Reserved.  
L1P memory protection page attribute register 16  
(controls memory address 0x00E0 0000 - 0x00E0 07FF)  
0x0184 A640  
0x0184 A644  
0x0184 A648  
0x0184 A64C  
0x0184 A650  
0x0184 A654  
0x0184 A658  
0x0184 A65C  
0x0184 A660  
0x0184 A664  
0x0184 A668  
0x0184 A66C  
0x0184 A670  
0x0184 A674  
0x0184 A678  
L1PMPPA16  
L1PMPPA17  
L1PMPPA18  
L1PMPPA19  
L1PMPPA20  
L1PMPPA21  
L1PMPPA22  
L1PMPPA23  
L1PMPPA24  
L1PMPPA25  
L1PMPPA26  
L1PMPPA27  
L1PMPPA28  
L1PMPPA29  
L1PMPPA30  
L1P memory protection page attribute register 17  
(controls memory address 0x00E0 0800 - 0x00E0 0FFF)  
L1P memory protection page attribute register 18  
(controls memory address 0x00E0 1000 - 0x00E0 17FF)  
L1P memory protection page attribute register 19  
(controls memory address 0x00E0 1800 - 0x00E0 1FFF)  
L1P memory protection page attribute register 20  
(controls memory address 0x00E0 2000 - 0x00E0 27FF)  
L1P memory protection page attribute register 21  
(controls memory address 0x00E0 2800 - 0x00E0 2FFF)  
L1P memory protection page attribute register 22  
(controls memory address 0x00E0 3000 - 0x00E0 37FF)  
L1P memory protection page attribute register 23  
(controls memory address 0x00E0 3800 - 0x00E0 3FFF)  
L1P memory protection page attribute register 24  
(controls memory address 0x00E0 4000 - 0x00E0 47FF)  
L1P memory protection page attribute register 25  
(controls memory address 0x00E0 4800 - 0x00E0 4FFF)  
L1P memory protection page attribute register 26  
(controls memory address 0x00E0 5000 - 0x00E0 57FF)  
L1P memory protection page attribute register 27  
(controls memory address 0x00E0 5800 - 0x00E0 5FFF)  
L1P memory protection page attribute register 28  
(controls memory address 0x00E0 6000 - 0x00E0 67FF)  
L1P memory protection page attribute register 29  
(controls memory address 0x00E0 6800 - 0x00E0 6FFF)  
L1P memory protection page attribute register 30  
(controls memory address 0x00E0 7000 - 0x00E0 77FF)  
(1) These addresses correspond to the L1P memory protection page attribute registers 0-15 (L1PMPPA0-L1PMPPA15) of the C674x  
megamaodule. These registers are not supported for this device.  
16  
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Table 2-3. C674x L1/L2 Memory Protection Registers (continued)  
HEX ADDRESS RANGE  
REGISTER NAME  
DESCRIPTION  
L1P memory protection page attribute register 31  
(controls memory address 0x00E0 7800 - 0x00E0 7FFF)  
0x0184 A67C  
L1PMPPA31  
0x0184 A67F – 0x0184 ABFF  
0x0184 AC00  
-
Reserved  
L1DMPFAR  
L1DMPFSR  
L1DMPFCR  
-
L1D memory protection fault address register  
L1D memory protection fault status register  
L1D memory protection fault command register  
Reserved  
0x0184 AC04  
0x0184 AC08  
0x0184 AC0C - 0x0184 ACFF  
0x0184 AD00  
L1DMPLK0  
L1DMPLK1  
L1DMPLK2  
L1DMPLK3  
L1DMPLKCMD  
L1DMPLKSTAT  
-
L1D memory protection lock key bits [31:0]  
L1D memory protection lock key bits [63:32]  
L1D memory protection lock key bits [95:64]  
L1D memory protection lock key bits [127:96]  
L1D memory protection lock key command register  
L1D memory protection lock key status register  
Reserved  
0x0184 AD04  
0x0184 AD08  
0x0184 AD0C  
0x0184 AD10  
0x0184 AD14  
0x0184 AD18 - 0x0184 ADFF  
0x0184 AE00 - 0x0184 AE3F  
(2)  
-
Reserved.  
L1D memory protection page attribute register 16  
(controls memory address 0x00F0 0000 - 0x00F0 07FF)  
0x0184 AE40  
0x0184 AE44  
0x0184 AE48  
0x0184 AE4C  
0x0184 AE50  
0x0184 AE54  
0x0184 AE58  
0x0184 AE5C  
0x0184 AE60  
0x0184 AE64  
0x0184 AE68  
0x0184 AE6C  
0x0184 AE70  
0x0184 AE74  
0x0184 AE78  
L1DMPPA16  
L1DMPPA17  
L1DMPPA18  
L1DMPPA19  
L1DMPPA20  
L1DMPPA21  
L1DMPPA22  
L1DMPPA23  
L1DMPPA24  
L1DMPPA25  
L1DMPPA26  
L1DMPPA27  
L1DMPPA28  
L1DMPPA29  
L1DMPPA30  
L1D memory protection page attribute register 17  
(controls memory address 0x00F0 0800 - 0x00F0 0FFF)  
L1D memory protection page attribute register 18  
(controls memory address 0x00F0 1000 - 0x00F0 17FF)  
L1D memory protection page attribute register 19  
(controls memory address 0x00F0 1800 - 0x00F0 1FFF)  
L1D memory protection page attribute register 20  
(controls memory address 0x00F0 2000 - 0x00F0 27FF)  
L1D memory protection page attribute register 21  
(controls memory address 0x00F0 2800 - 0x00F0 2FFF)  
L1D memory protection page attribute register 22  
(controls memory address 0x00F0 3000 - 0x00F0 37FF)  
L1D memory protection page attribute register 23  
(controls memory address 0x00F0 3800 - 0x00F0 3FFF)  
L1D memory protection page attribute register 24  
(controls memory address 0x00F0 4000 - 0x00F0 47FF)  
L1D memory protection page attribute register 25  
(controls memory address 0x00F0 4800 - 0x00F0 4FFF)  
L1D memory protection page attribute register 26  
(controls memory address 0x00F0 5000 - 0x00F0 57FF)  
L1D memory protection page attribute register 27  
(controls memory address 0x00F0 5800 - 0x00F0 5FFF)  
L1D memory protection page attribute register 28  
(controls memory address 0x00F0 6000 - 0x00F0 67FF)  
L1D memory protection page attribute register 29  
(controls memory address 0x00F0 6800 - 0x00F0 6FFF)  
L1D memory protection page attribute register 30  
(controls memory address 0x00F0 7000 - 0x00F0 77FF)  
L1D memory protection page attribute register 31  
(controls memory address 0x00F0 7800 - 0x00F0 7FFF)  
0x0184 AE7C  
L1DMPPA31  
-
0x0184 AE80 – 0x0185 FFFF  
Reserved  
(2) These addresses correspond to the L1D memory protection page attribute registers 0-15 (L1DMPPA0-L1DMPPA15) of the C674x  
megamaodule. These registers are not supported for this device.  
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Device Overview  
17  
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2.4 Memory Map Summary  
Note: Read/Write accesses to illegal or reserved addresses in the memory map may cause undefined  
behavior.  
Table 2-4. C6743 Top Level Memory Map  
START  
ADDRESS  
END  
ADDRESS  
SIZE  
DSP MEM MAP  
EDMA MEM MAP  
PRUSS MEM MAP  
MASTER PERIPHERAL  
MEM MAP  
0x0000 0000  
0x0000 0FFF  
4K  
PRUSS Local  
Address Space  
0x0000 1000  
0x0070 0000  
0x0080 0000  
0x0082 0000  
0x0084 0000  
0x00E0 0000  
0x00E0 8000  
0x00F0 0000  
0x00F0 8000  
0x0180 0000  
0x006F FFFF  
0x007F FFFF  
0x0081 FFFF  
0x0083 FFFF  
0x00DF FFFF  
0x00E0 7FFF  
0x00EF FFFF  
0x00F0 7FFF  
0x017F FFFF  
0x0180 FFFF  
1024K  
128K  
32K  
DSP L2 ROM(1)  
DSP L2 RAM  
DSP L1P RAM  
DSP L1D RAM  
32K  
64K  
4K  
DSP Interrupt  
Controller  
0x0181 0000  
0x0181 0FFF  
DSP Powerdown  
Controller  
0x0181 1000  
0x0181 2000  
0x0181 3000  
0x0182 0000  
0x0183 0000  
0x0181 1FFF  
0x0181 2FFF  
0x0181 FFFF  
0x0182 FFFF  
0x0183 FFFF  
4K  
4K  
DSP Security ID  
DSP Revision ID  
64K  
64K  
DSP EMC  
DSP Internal  
Reserved  
0x0184 0000  
0x0184 FFFF  
64K  
DSP Memory  
System  
0x0185 0000  
0x01C0 0000  
0x01C0 8000  
0x01C0 8400  
0x01C0 8800  
0x01C1 0000  
0x01C1 1000  
0x01C1 2000  
0x01C1 4000  
0x01C1 5000  
0x01C2 0000  
0x01C2 1000  
0x01C2 2000  
0x01C2 3000  
0x01C4 0000  
0x01C4 1000  
0x01C4 2000  
0x01C4 3000  
0x01D0 0000  
0x01D0 1000  
0x01BF FFFF  
0x01C0 7FFF  
0x01C0 83FF  
0x01C0 87FF  
0x01C0 FFFF  
0x01C1 0FFF  
0x01C1 1FFF  
0x01C1 3FFF  
0x01C1 4FFF  
0x01C1 FFFF  
0x01C2 0FFF  
0x01C2 1FFF  
0x01C2 2FFF  
0x01C2 FFFF  
0x01C4 0FFF  
0x01C4 1FFF  
0x01C4 2FFF  
0x01CF FFFF  
0x01D0 0FFF  
0x01D0 1FFF  
32K  
1024  
1024  
EDMA3 CC  
EDMA3 TC0  
EDMA3 TC1  
4K  
4K  
PSC 0  
PLL Controller  
4K  
BootConfig  
4K  
4K  
4K  
Timer64P 0  
Timer64P 1  
I2C 0  
4K  
4K  
4K  
MMC/SD 0  
SPI 0  
UART 0  
4K  
4K  
McASP 0 Control  
McASP 0 AFIFO Ctrl  
(1) The DSP L2 ROM is used for boot purposes and cannot be programmed with application code.  
18 Device Overview  
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Table 2-4. C6743 Top Level Memory Map (continued)  
START  
ADDRESS  
END  
ADDRESS  
SIZE  
DSP MEM MAP  
EDMA MEM MAP  
PRUSS MEM MAP  
MASTER PERIPHERAL  
MEM MAP  
0x01D0 2000  
0x01D0 3000  
0x01D0 4000  
0x01D0 5000  
0x01D0 6000  
0x01D0 7000  
0x01D0 D000  
0x01D0 E000  
0x01E1 4000  
0x01E1 5000  
0x01E1 6000  
0x01E2 0000  
0x01E2 2000  
0x01E2 3000  
0x01E2 4000  
0x01E2 5000  
0x01E2 6000  
0x01E2 7000  
0x01E2 8000  
0x01E2 9000  
0x01F0 0000  
0x01F0 1000  
0x01F0 2000  
0x01F0 3000  
0x01F0 4000  
0x01F0 5000  
0x01F0 6000  
0x01F0 7000  
0x01F0 8000  
0x01F0 9000  
0x01F0 A000  
0x01F0 B000  
0x1170 0000  
0x1180 0000  
0x1182 0000  
0x1184 0000  
0x11E0 0000  
0x11E0 8000  
0x11F0 0000  
0x11F0 8000  
0x6000 0000  
0x6200 0000  
0x6400 0000  
0x6800 0000  
0x6800 8000  
0xB000 0000  
0x01D0 2FFF  
0x01D0 3FFF  
0x01D0 4FFF  
0x01D0 5FFF  
0x01D0 6FFF  
0x01D0 CFFF  
0x01D0 DFFF  
0x01E1 3FFF  
0x01E1 4FFF  
0x01E1 5FFF  
0x01E1 FFFF  
0x01E2 1FFF  
0x01E2 2FFF  
0x01E2 3FFF  
0x01E2 4FFF  
0x01E2 5FFF  
0x01E2 6FFF  
0x01E2 7FFF  
0x01E2 8FFF  
0x01EF FFFF  
0x01F0 0FFF  
0x01F0 1FFF  
0x01F0 2FFF  
0x01F0 3FFF  
0x01F0 4FFF  
0x01F0 5FFF  
0x01F0 6FFF  
0x01F0 7FFF  
0x01F0 8FFF  
0x01F0 9FFF  
0x01F0 AFFF  
0x116F FFFF  
0x117F FFFF  
0x1181 FFFF  
0x1183 FFFF  
0x11DF FFFF  
0x11E0 7FFF  
0x11EF FFFF  
0x11F0 7FFF  
0x5FFF FFFF  
0x61FF FFFF  
0x63FF FFFF  
0x67FF FFFF  
0x6800 7FFF  
0xAFFF FFFF  
0xB000 7FFF  
4K  
McASP 0 Data  
4K  
4K  
4K  
McASP 1 Control  
McASP 1 AFIFO Ctrl  
McASP 1 Data  
4K  
UART2  
4K  
4K  
Memory Protection Unit 1  
Memory Protection Unit 2  
8K  
4K  
4K  
4K  
EMAC Control Module RAM  
EMAC Control Module Registers  
EMAC Control Registers  
EMAC MDIO port  
4K  
4K  
4K  
GPIO  
PSC 1  
12C 1  
4K  
4K  
4K  
4K  
4K  
4K  
4K  
4K  
4K  
4K  
4K  
eHRPWM 0  
HRPWM 0  
eHRPWM 1  
HRPWM 1  
eHRPWM 2  
HRPWM 2  
ECAP 0  
ECAP 1  
ECAP 2  
EQEP 0  
EQEP 1  
1024K  
128K  
32K  
DSP L2 ROM(2)  
DSP L2 RAM  
DSP L1P RAM  
DSP L1D RAM  
32K  
32M  
32M  
EMIFA async data (CS2)  
EMIFA async data (CS3)  
32K  
32K  
EMIFA Control Regs  
EMIFB Control Regs  
(2) The DSP L2 ROM is used for boot purposes and cannot be programmed with application code.  
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www.ti.com  
Table 2-4. C6743 Top Level Memory Map (continued)  
START  
ADDRESS  
END  
ADDRESS  
SIZE  
DSP MEM MAP  
EDMA MEM MAP  
PRUSS MEM MAP  
MASTER PERIPHERAL  
MEM MAP  
0xB000 8000  
0xC000 0000  
0xC800 0000  
0xBFFF FFFF  
0xC7FF FFFF  
0xFFFF FFFF  
128M  
EMIFB SDRAM Data  
20  
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SPRS565C APRIL 2009REVISED MARCH 2013  
2.5 Pin Assignments  
Extensive use of pin multiplexing is used to accommodate the largest number of peripheral functions in  
the smallest possible package. Pin multiplexing is controlled using a combination of hardware  
configuration at device reset and software programmable register settings.  
2.5.1 Pin Map (Bottom View)  
Figure 2-3 and Figure 2-4 show the pin assignments for ZKB package and PTP packages, respectively.  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
SPI0_CLK/  
EQEP1I/  
GP5[2]/  
EMA_D[0]/  
MMCSD_DAT[0]/  
GP0[0]/  
EQEP1S/  
GP5[7]/  
BOOT[7]  
AXR1[0]/  
GP4[0]  
EMA_A[0]/  
GP1[0]  
EMA_A[4]/  
GP1[4]  
EMA_A[8]/  
GP1[8]  
EMA_CS[3]/  
GP2[6]  
T
R
P
N
M
L
T
R
P
N
M
L
VSS  
VSS  
VSS  
VSS  
NC  
NC  
NC  
GP0[9]  
BOOT[2]  
BOOT[12]  
/
SPI0_ENA/  
SPI0_SOMI[0]/  
EQEP0I/  
GP5[0]/  
UART0_RXD/  
I2C0_SDA  
EMA_A[1]/  
MMCSD_CLK/  
GP1[1]  
EMA_D[2]/  
MMCSD_DAT[2]/  
GP0[2]  
EMA_D[1]/  
MMCSD_DAT[1]/  
GP0[1]  
EMA_OE/  
AXR0[13]/  
GP2[7]  
UART0_CTS/  
EQEP0A/  
GP5[3]/  
AXR1[1]/  
GP4[1]  
UART2_RXD/  
GP5[12]  
EMA_BA[0]/  
GP1[14]  
EMA_A[5]/  
GP1[5]  
EMA_A[9]/  
GP1[9]  
DVDD  
DVDD  
GP0[11]  
GP0[13]  
GP0[15]  
NC  
NC  
NC  
GP0[10]  
GP0[12]  
GP0[14]  
NC  
TM64P0_IN12/  
GP5[8]/BOOT[8]  
BOOT[0]  
BOOT[3]  
SPI0_SIMO[0]/  
EQEP0S/  
GP5[1]/  
UART0_TXD/  
I2C0_SCL/  
AXR1[3]/  
EQEP1A/  
GP4[3]  
I2C1_SCL/  
GP5[5]/  
BOOT[5]  
EMA_A[2]/  
MMCSD_CMD/  
GP1[2]  
EMA_D[4]/  
MMCSD_DAT[4]/  
GP0[4]  
EMA_D[3]/  
MMCSD_DAT[3]/  
GP0[3]  
EMA_CS[2]/  
GP2[5]/  
BOOT[15]  
AXR1[2]/  
GP4[2]  
UART2_TXD/  
GP5[13]  
EMA_BA[1]/  
GP1[13]  
EMA_A[6]/  
GP1[6]  
EMA_A[11]/  
GP1[11]  
TM64P0_OUT12/  
GP5[9]/BOOT[9]  
BOOT[1]  
SPI0_SCS[0]/  
UART0_RTS/  
EQEP0B/  
GP5[4]/  
BOOT[4]  
AXR1[5]/  
EPWM2B/  
GP4[5]  
AXR1[4]/  
EQEP1B/  
GP4[4]  
I2C1_SDA/  
GP5[6]/  
BOOT[6]  
EMA_D[6]/  
MMCSD_DAT[6]/  
GP0[6]  
EMA_D[5]/  
MMCSD_DAT[5]/  
GP0[5]  
EMA_WAIT[0]/  
GP2[10]  
EMA_A[10]/  
GP1[10]  
EMA_A[3]/  
GP1[3]  
EMA_A[7]/  
GP1[7]  
EMA_A[12]/  
GP1[12]  
NC  
NC  
GP0[8]  
DVDD  
DVDD  
DVDD  
CVDD  
RVDD  
DVDD  
DVDD  
EMA_WE/  
AXR0[12]/  
GP2[3]/  
EMA_D[7]/  
MMCSD_DAT[7]/  
GP0[7]/  
AXR1[8]/  
EPWM1A/  
GP4[8]  
AXR1[7]/  
EPWM1B/  
GP4[7]  
AXR1[6]/  
EPWM2A/  
GP4[6]  
DVDD  
DVDD  
DVDD  
VSS  
VSS  
DVDD  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
DVDD  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
NC  
BOOT[14]  
BOOT[13]  
ACLKR1/  
ECAP2/  
APWM2/  
GP4[12]  
AHCLKR1/  
GP4[11]  
AFSR1/  
GP4[13]  
CVDD  
CVDD  
CVDD  
VSS  
VSS  
DVDD  
CVDD  
CVDD  
CVDD  
CVDD  
DVDD  
VSS  
EMB_CAS  
NC  
NC  
NC  
AFSX1/  
EPWMSYNCI/  
EPWMSYNCO/  
GP4[10]  
AHCLKX1/  
EPWM0B/  
GP3[14]  
ACLKX1/  
EPWM0A/  
GP3[15]  
EMB_WE_  
DQM[0]/  
GP5[15]  
K
J
K
J
GP7[14]  
TMS  
CVDD  
CVDD  
CVDD  
CVDD  
RSV1  
CVDD  
CVDD  
CVDD  
CVDD  
VSS  
EMB_WE  
NC  
NC  
EMB_D[5]/  
GP6[5]  
EMB_D[6]/  
GP6[6]  
EMB_D[7]/  
GP6[7]  
EMU0/  
GP7[15]  
TDI  
TDO  
TCK  
TRST  
NC  
NC  
NC  
NC  
NC  
EMB_D[3]/  
GP6[3]  
EMB_D[4]/  
GP6[4]  
H
G
F
H
G
F
RSV4  
RV  
DD  
NC  
NC  
VSS  
VSS  
NC  
NC  
NC  
NC  
NC  
EMB_D[1]/  
GP6[1]  
EMB_D[2]/  
GP6[2]  
CVDD  
VSS  
RESET  
DV  
DD  
CV  
DD  
EMB_D[15]/  
GP6[15]  
EMB_D[0]/  
GP6[0]  
OSCOUT  
PLL0_VSSA  
PLL0_VDDA  
OSCIN  
OSCVSS  
DV  
DD  
CV  
DD  
NC  
NC  
NC  
NC  
VSS  
EMB_D[13]/  
GP6[13]  
EMB_D[14]/  
GP6[14]  
E
D
C
B
A
E
D
C
B
A
DV  
DD  
VSS  
VSS  
DV  
DD  
DV  
DD  
VSS  
DV  
DD  
NC  
AMUTE1/  
EPWMTZ/  
GP4[14]  
AFSX0/  
GP2[13]/  
BOOT[10]  
AXR0[6]/ AXR0[2]/  
RMII_RXER/ RMII_TXEN/ EMB_CS[0]  
AXR0[10]/  
GP3[10]  
EMB_A[0]/  
GP7[2]  
EMB_A[4]/  
GP7[6]  
EMB_A[8]/  
GP7[10]  
EMB_D[9]/  
GP6[9]  
EMB_D[10]/ EMB_D[11]/ EMB_D[12]/  
GP6[12]  
NC  
NC  
VSS  
GP6[10]  
GP6[11]  
GP3[6]  
GP3[2]  
ACLKX0/  
ECAP0/  
APWM0/  
GP2[12]  
AXR0[5]/ AXR0[1]/  
RMII_RXD[1]/ RMII_TXD[1]/  
GP3[5]  
EMB_WE_  
DQM[1]/  
GP5[14]  
AFSR0/  
GP3[12]  
AXR0[9]/  
GP3[9]  
EMB_BA[0]/  
GP7[1]  
EMB_A[1]/  
GP7[3]  
EMB_A[5]/  
GP7[7]  
EMB_A[9]/  
GP7[11]  
EMB_D[8]/  
GP6[8]  
EMB_SDCKE EMB_CLK  
NC  
GP3[1]  
ACLKR0/  
ECAP1/  
APWM1/  
GP2[15]  
AHCLKX0/  
AHCLKX2/  
GP2[11]  
AXR0[8]/  
MDIO_D/  
GP3[8]  
AXR0[4]/ AXR0[0]/  
RMII_RXD[0]/ RMII_TXD[0]/  
GP3[4]  
EMB_BA[1]/  
GP7[0]  
EMB_A[2]/  
GP7[4]  
EMB_A[6]/  
GP7[8]  
EMB_A[11]/  
GP7[13]  
EMB_A[12]/  
GP3[13]  
RSV2  
DVDD  
NC  
NC  
GP3[0]  
AHCLKR0/  
RMII_MHZ_  
50_CLK/  
GP2[14]/  
BOOT[11]  
AXR0[7]/  
MDIO_CLK/ RMII_CRS_DV/  
GP3[7]  
AXR0[3]/  
AXR0[11]/  
GP3[11]  
EMB_A[10]/  
GP7[12]  
EMB_A[3]/  
GP7[5]  
EMB_A[7]/  
GP7[9]  
VSS  
VSS  
VSS  
VSS  
VSS  
EMB_RAS  
8
NC  
12  
NC  
13  
NC  
14  
GP3[3]  
1
Note: NC = No Connect  
2
3
4
5
6
7
9
10  
11  
15  
16  
Figure 2-3. Pin Map (ZKB)  
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RSV2  
133  
134  
135  
136  
137  
138  
139  
140  
141  
142  
143  
144  
145  
146  
147  
148  
149  
150  
151  
152  
153  
154  
155  
156  
157  
158  
159  
160  
161  
162  
163  
164  
165  
166  
167  
168  
169  
170  
171  
172  
173  
174  
175  
176  
88  
87  
86  
85  
84  
83  
82  
81  
80  
79  
78  
77  
76  
75  
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
EMB_SDCKE  
DVDD  
NC  
NC  
EMB_CLK  
NC  
EMB_WE_DQM[1]/GP5[14]  
EMB_D[8]/GP6[8]  
EMB_D[9]/GP6[9]  
EMB_D[10]/GP6[10]  
DVDD  
NC  
NC  
NC  
NC  
PLL0_VDDA  
EMB_D[11]/GP6[11]  
EMB_D[12]/GP6[12]  
EMB_D[13]/GP6[13]  
CVDD  
PLL0_VSSA  
OSCIN  
OSCVSS  
OSCOUT  
EMB_D[14]/GP6[14]  
DVDD  
RESET  
CVDD  
EMB_D[15]/GP6[15]  
EMB_D[0]/GP6[0]  
EMB_D[1]/GP6[1]  
DVDD  
RSV4  
RSV3  
TRST  
DVDD  
EMB_D[2]/GP6[2]  
CVDD  
TMS  
TDI  
EMB_D[3]/GP6[3]  
RVDD  
CVDD  
Thermal Pad  
(177)  
TCK  
EMB_D[4]/GP6[4]  
DVDD  
TDO  
GP7[14]  
EMB_D[5]/GP6[5]  
EMB_D[6]/GP6[6]  
EMB_D[7]/GP6[7]  
CVDD  
DVDD  
RVDD  
AHCLKX1/EPWM0B/GP3[14]  
CVDD  
EMB_WE_DQM[0]/GP5[15]  
EMB_WE  
ACLKX1/EPWM0A/GP3[15]  
AFSX1/EPWMSYNCI/EPWMSYNC0/GP4[10]  
DVDD  
DVDD  
EMB_CAS  
ACLKR1/ECAP2/APWM2/GP4[12]  
AFSR1/GP4[13]  
CVDD  
EMA_WE/AXR0[12]/GP2[3]/BOOT[14]  
EMA_D[7]/MMCSD_DAT[7]/GP0[7]/BOOT[13]  
DVDD  
CVDD  
AXR1[8]/EPWM1A/GP4[8]  
AXR1[7]/EPWM1B/GP4[7]  
AXR1[6]/EPWM2A/GP4[6]  
AXR1[5]/EPWM2B/GP4[5]  
DVDD  
EMA_D[6]/MMCSD_DAT[6]/GP0[6]  
EMA_D[5]/MMCSD_DAT[5]/GP0[5]  
CVDD  
EMA_D[4]/MMCSD_DAT[4]/GP0[4]  
EMA_D[3]/MMCSD_DAT[3]/GP0[3]  
DVDD  
AXR1[4]/EQEP1B/GP4[4]  
AXR1[3]/EQEP1A/GP4[3]  
AXR1[2]/GP4[2]  
EMA_D[2]/MMCSD_DAT[2]/GP0[2]  
EMA_D[1]/MMCSD_DAT[1]/GP0[1]  
AXR1[1]/GP4[1]  
Figure 2-4. Pin Map (PTP)  
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2.6 Terminal Functions  
Table 2-5 to Section 2.6.18 identify the external signal names, the associated pin/ball numbers along with  
the mechanical package designator, the pin type (I, O, IO, OZ, or PWR), whether the pin/ball has any  
internal pullup/pulldown resistors, whether the pin/ball is configurable as an IO in GPIO mode, and a  
functional pin description.  
2.6.1 Device Reset and JTAG  
Table 2-5. Reset and JTAG Terminal Functions  
PIN NO  
SIGNAL NAME  
TYPE(1)  
PULL(2)  
RESET  
MUXED  
DESCRIPTION  
PTP  
ZKB  
RESET  
146  
G3  
I
Device reset input  
JTAG  
IPU  
IPU  
IPU  
IPU  
IPD  
IPD  
TMS  
TDI  
152  
153  
156  
155  
150  
-
J1  
J2  
J3  
H3  
J4  
J5  
I
I
JTAG test mode select  
JTAG test data input  
JTAG test data output  
JTAG test clock  
TDO  
TCK  
TRST  
O
I
I
JTAG test reset  
EMU0/GP7[15]  
I/O  
GPIO  
Emulation Signal  
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.  
Note: For multiplexed pins where functions have different types (i.e., input versus output), the table reflects the pin function direction for  
that particular peripheral.  
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor  
2.6.2 High-Frequency Oscillator and PLL  
Table 2-6. High-Frequency Oscillator and PLL Terminal Functions  
PIN NO  
SIGNAL NAME  
TYPE(1)  
PULL(2)  
DESCRIPTION  
PTP  
ZKB  
1.2-V OSCILLATOR  
OSCIN  
143  
145  
144  
F2  
F1  
E2  
I
Oscillator input  
Oscillator output  
OSCOUT  
OSCVSS  
O
GND  
Oscillator ground (for filter only)  
1.2-V PLL  
PLL0_VDDA  
PLL0_VSSA  
141  
142  
D1  
E1  
PWR  
GND  
PLL analog VDD (1.2-V filtered supply)  
PLL analog VSS (for filter)  
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.  
Note: For multiplexed pins where functions have different types (i.e., input versus output), the table reflects the pin function direction for  
that particular peripheral.  
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor  
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2.6.3 External Memory Interface A (ASYNC)  
Table 2-7. External Memory Interface A (EMIFA) Terminal Functions  
PIN NO  
PTP  
SIGNAL NAME  
TYPE(1) PULL(2)  
MUXED  
DESCRIPTION  
ZKB  
M15  
N13  
N15  
P13  
P15  
R13  
R15  
T13  
N11  
P11  
N8  
EMA_D[7]/MMCSD_DAT[7]/GP0[7]/BOOT[13]  
EMA_D[6]/MMCSD_DAT[6]/GP0[6]  
EMA_D[5]/MMCSD_DAT[5]/GP0[5]  
EMA_D[4]/MMCSD_DAT[4]/GP0[4]  
EMA_D[3]/MMCSD_DAT[3]/GP0[3]  
EMA_D[2]/MMCSD_DAT[2]/GP0[2]  
EMA_D[1]/MMCSD_DAT[1]/GP0[1]  
EMA_D[0]/MMCSD_DAT[0]/GP0[0]/BOOT[12]  
EMA_A[12]/GP1[12]  
54  
52  
51  
49  
48  
46  
45  
44  
42  
41  
27  
40  
39  
37  
36  
35  
34  
32  
31  
30  
29  
26  
25  
21  
23  
55  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
O
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPD  
IPD  
IPD  
IPD  
IPD  
IPU  
IPU  
IPD  
IPU  
IPU  
IPU  
IPU  
IPU  
MMC/SD, GPIO, BOOT  
MMC/SD, GPIO  
EMIFA data bus  
MMC/SD, GPIO, BOOT  
EMA_A[11]/ GP1[11]  
O
EMA_A[10]/GP1[10]  
O
EMA_A[9]/GP1[9]  
R11  
T11  
N10  
P10  
R10  
T10  
N9  
O
EMA_A[8]/GP1[8]  
O
GPIO  
EMIFA address bus  
EMA_A[7]/GP1[7]  
O
EMA_A[6]/GP1[6]  
O
EMA_A[5]/GP1[5]  
O
EMA_A[4]/GP1[4]  
O
EMA_A[3]/GP1[3]  
O
EMA_A[2]/MMCSD_CMD/GP1[2]  
EMA_A[1]/MMCSD_CLK/GP1[1]  
EMA_A[0]/GP1[0]  
P9  
O
MMCSD, GPIO  
GPIO  
R9  
O
EMIFA address bus  
T9  
O
EMA_BA[1]/GP1[13]  
P8  
O
EMIFA bank  
address  
EMA_BA[0]/GP1[14]  
R8  
O
EMA_CS[3] /GP2[6]  
T7  
O
GPIO  
EMIFA Async Chip  
Select  
EMA_CS[2] /GP2[5]/BOOT[15]  
EMA_WE /AXR0[12]/GP2[3]/BOOT[14]  
P7  
O
GPIO, BOOT  
M13  
O
MCASP0, GPIO, BOOT EMIFA write enable  
EMIFA output  
EMA_OE /AXR0[13]/GP2[7]  
EMA_WAIT[0]/ GP2[10]  
22  
19  
R7  
N6  
O
I
IPU  
IPU  
McASP0, GPIO  
enable  
EMIFA wait  
input/interrupt  
GPIO  
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.  
Note: For multiplexed pins where functions have different types (i.e., input versus output), the table reflects the pin function direction for  
that particular peripheral.  
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor  
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2.6.4 External Memory Interface B (SDRAM only)  
Table 2-8. External Memory Interface B (EMIFB) Terminal Functions  
PIN NO  
PTP  
SIGNAL NAME  
EMB_D[15]/GP6[15]  
TYPE(1)  
PULL(2)  
MUXED  
DESCRIPTION  
ZKB  
F13  
E16  
E13  
D16  
D15  
D14  
D13  
C16  
J16  
J15  
J13  
H16  
H13  
G16  
G13  
F16  
B15  
B12  
A9  
74  
76  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
O
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
EMB_D[14]/GP6[14]  
EMB_D[13]/GP6[13]  
EMB_D[12]/GP6[12]  
EMB_D[11]/GP6[11]  
EMB_D[10]/GP6[10]  
EMB_D[9]/GP6[9]  
EMB_D[8]/GP6[8]  
EMB_D[7]/GP6[7]  
EMB_D[6]/GP6[6]  
EMB_D[5]/GP6[5]  
EMB_D[4]/GP6[4]  
EMB_D[3]/GP6[3]  
EMB_D[2]/GP6[2]  
EMB_D[1]/GP6[1]  
EMB_D[0]/GP6[0]  
EMB_A[12]/GP3[13]  
EMB_A[11]/GP7[13]  
EMB_A[10]/GP7[12]  
EMB_A[9]/GP7[11]  
EMB_A[8]/GP7[10]  
EMB_A[7]/GP7[9]  
EMB_A[6]/GP7[8]  
EMB_A[5]/GP7[7]  
EMB_A[4]/GP7[6]  
EMB_A[3]/GP7[5]  
EMB_A[2]/GP7[4]  
EMB_A[1]/GP7[3]  
EMB_A[0]/GP7[2]  
EMB_BA[1]/GP7[0]  
EMB_BA[0]/GP7[1]  
EMB_CLK  
78  
79  
80  
82  
83  
84  
GPIO  
EMIFB SDRAM data bus  
62  
63  
64  
66  
68  
70  
72  
73  
89  
91  
O
105  
92  
O
C12  
D12  
A11  
B11  
C11  
D11  
A10  
B10  
C10  
D10  
B9  
O
EMIFB SDRAM row/column address  
bus  
GPIO  
94  
O
95  
O
96  
O
97  
O
98  
O
100  
101  
102  
103  
106  
107  
86  
O
O
EMIFB SDRAM row/column address  
EMIFB SDRAM bank address  
O
GPIO  
O
O
C9  
O
C14  
C13  
K15  
A8  
O
EMIF SDRAM clock  
EMB_SDCKE  
88  
O
EMIFB SDRAM clock enable  
EMIFB write enable  
EMB_WE  
59  
I/O  
O
GPIO  
GPIO  
EMB_RAS  
110  
57  
EMIFB SDRAM row address strobe  
EMIFB column address strobe  
EMIFB SDRAM chip select 0  
EMB_CAS  
L13  
D9  
O
EMB_CS[0]  
108  
85  
O
EMB_WE_DQM[1]  
EMB_WE_DQM[0]  
C15  
K14  
O
EMIFB write enable/data mask for  
EMB_D  
60  
O
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.  
Note: For multiplexed pins where functions have different types (i.e., input versus output), the table reflects the pin function direction for  
that particular peripheral.  
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor  
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2.6.5 Serial Peripheral Interface Modules (SPI0)  
Table 2-9. Serial Peripheral Interface (SPI) Terminal Functions  
PIN NO  
SIGNAL NAME  
TYPE(1) PULL(2)  
MUXED  
DESCRIPTION  
PTP  
ZKB  
SPI0  
UART0, EQEP0B,  
GPIO, BOOT  
SPI0_SCS[0] /UART0_RTS/EQEP0B/GP5[4]/BOOT[4]  
9
N4  
I/O  
IPU  
SPI0 chip select  
SPI0 enable  
UART0, EQEP0A,  
GPIO, BOOT  
SPI0_ENA /UART0_CTS/EQEP0A/GP5[3]/BOOT[3]  
SPI0_CLK/EQEP1I/GP5[2]/BOOT[2]  
12  
11  
18  
R5  
T5  
P6  
I/O  
I/O  
I/O  
IPU  
IPD  
IPD  
eQEP1, GPIO, BOOT SPI0 clock  
SPI0 data slave-in-  
master-out  
SPI0_SIMO[0]/EQEP0S/GP5[1]/BOOT[1]  
eQEP0, GPIO, BOOT  
eQEP0, GPIO, BOOT  
SPI0 data slave-  
out-master-in  
SPI0_SOMI[0]/EQEP0I/GP5[0]/BOOT[0]  
17  
R6  
I/O  
IPD  
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.  
Note: For multiplexed pins where functions have different types (i.e., input versus output), the table reflects the pin function direction for  
that particular peripheral.  
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor  
2.6.6 Enhanced Capture/Auxiliary PWM Modules (eCAP0, eCAP1, eCAP2)  
The eCAP Module pins function as either input captures or auxiliary PWM 32-bit outputs, depending upon  
how the eCAP module is programmed.  
Table 2-10. Enhanced Capture Module (eCAP) Terminal Functions  
PIN NO  
SIGNAL NAME  
TYPE(1) PULL(2)  
eCAP0  
MUXED  
DESCRIPTION  
PTP  
ZKB  
enhanced capture 0 input or  
auxiliary PWM 0 output  
ACLKX0/ECAP0/APWM0/GP2[12]  
ACLKR0/ECAP1/APWM1/GP2[15]  
ACLKR1/ECAP2/APWM2/GP4[12]  
126  
C5  
I/O  
IPD  
IPD  
IPD  
McASP0, GPIO  
McASP0, GPIO  
McASP1, GPIO  
eCAP1  
I/O  
enhanced capture 1 input or  
auxiliary PWM 1 output  
130  
B4  
eCAP2  
I/O  
enhanced capture 2 input or  
auxiliary PWM 2 output  
165  
L2  
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.  
Note: For multiplexed pins where functions have different types (i.e., input versus output), the table reflects the pin function direction for  
that particular peripheral.  
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor  
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2.6.7 Enhanced Pulse Width Modulators (eHRPWM0, eHRPWM1, eHRPWM2)  
Table 2-11. Enhanced Pulse Width Modulator (eHRPWM) Terminal Functions  
PIN NO  
SIGNAL NAME  
TYPE(1) PULL(2)  
MUXED  
DESCRIPTION  
PTP  
ZKB  
eHRPWM0  
eHRPWM0 A output (with  
high-resolution)  
ACLKX1/EPWM0A/GP3[15]  
162  
160  
K3  
K2  
I/O  
I/O  
IPD  
IPD  
McASP1, GPIO  
AHCLKX1/EPWM0B/GP3[14]  
AMUTE1/EPWMTZ/GP4[14]  
eHRPWM0 B output  
McASP1,  
eHRPWM1, GPIO,  
eHRPWM2  
132  
163  
D4  
K4  
I/O  
I/O  
IPD  
IPD  
eHRPWM0 trip zone input  
Sync input to eHRPWM0  
module or sync output to  
external PWM  
McASP1,  
eHRPWM0, GPIO  
AFSX1/EPWMSYNCI/EPWMSYNCO/GP4[10]  
eHRPWM1  
eHRPWM1 A (with high-  
resolution)  
AXR1[8]/EPWM1A/GP4[8]  
AXR1[7]/EPWM1B/GP4[7]  
168  
169  
M2  
I/O  
I/O  
IPD  
IPD  
McASP1, GPIO  
M3  
D4  
eHRPWM1 B output  
McASP1,  
eHRPWM0, GPIO,  
eHRPWM2  
AMUTE1/EPWMTZ/GP4[14]  
132  
I/O  
IPD  
eHRPWM1 trip zone input  
eHRPWM2  
eHRPWM2 A (with high-  
resolution)  
AXR1[6]/EPWM2A/GP4[6]  
AXR1[5]/EPWM2B/GP4[5]  
170  
171  
M4  
I/O  
I/O  
IPD  
IPD  
McASP1, GPIO  
N1  
D4  
eHRPWM2 B output  
McASP1,  
eHRPWM0, GPIO,  
eHRPWM2  
AMUTE1/EPWMTZ/GP4[14]  
132  
I/O  
IPD  
eHRPWM2 trip zone input  
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.  
Note: For multiplexed pins where functions have different types (i.e., input versus output), the table reflects the pin function direction for  
that particular peripheral.  
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor  
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2.6.8 Enhanced Quadrature Encoder Pulse Module (eQEP)  
Table 2-12. Enhanced Quadrature Encoder Pulse Module (eQEP) Terminal Functions  
PIN NO  
SIGNAL NAME  
TYPE(1) PULL(2)  
MUXED  
DESCRIPTION  
PTP  
ZKB  
eQEP0  
eQEP0A quadrature  
input  
SPI0_ENA/UART0_CTS/EQEP0A/GP5[3]/BOOT[3]  
SPI0_SCS[0]/UART0_RTS/EQEP0B/GP5[4]/BOOT[4]  
12  
9
R5  
N4  
I
I
IPU  
IPU  
SPIO, UART0,  
GPIO, BOOT  
eQEP0B quadrature  
input  
SPI0_SOMI[0]/EQEP0I/GP5[0]/BOOT[0]  
SPI0_SIMO[0]/EQEP0S/GP5[1]/BOOT[1]  
17  
18  
R6  
I
I
IPD  
IPD  
eQEP0 index  
eQEP0 strobe  
SPI0, GPIO, BOOT  
McASP1, GPIO  
P6  
eQEP1  
eQEP1A quadrature  
input  
AXR1[3]/EQEP1A/GP4[3]  
AXR1[4]/EQEP1B/GP4[4]  
174  
173  
P1  
N2  
I
I
IPD  
IPD  
eQEP1B quadrature  
input  
SPI0_CLK/EQEP1I/GP5[2]/BOOT[2]  
EQEP1S/GP5[7]/BOOT[7]  
11  
16  
T5  
T6  
I
I
IPD  
IPD  
SPI0, GPIO, BOOT eQEP1 index  
GPIO, BOOT eQEP1 strobe  
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.  
Note: For multiplexed pins where functions have different types (i.e., input versus output), the table reflects the pin function direction for  
that particular peripheral.  
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor  
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2.6.9 Boot  
Table 2-13. Boot Terminal Functions(1)  
PIN NO  
SIGNAL NAME  
TYPE(2) PULL(3)  
MUXED  
DESCRIPTION  
PTP  
ZKB  
EMA_CS[2]/GP2[5]/BOOT[15]  
23  
P7  
I
I
IPU  
IPU  
EMIFA, GPIO  
BOOT[15]  
BOOT[14]  
EMIFA, McASP0,  
GPIO  
EMA_WE/AXR0[12]/GP2[3]/BOOT[14]  
55  
M13  
EMA_D[7]/MMCSD_DAT[7]/GP0[7]/BOOT[13]  
EMA_D[0]/MMCSD_DAT[0]/GP0[0]/BOOT[12]  
54  
44  
M15  
T13  
I
I
IPU  
IPU  
BOOT[13]  
BOOT[12]  
EMIFA, MMC/SD,  
GPIO  
McASP0, EMAC,  
GPIO  
AHCLKR0/RMII_MHZ_50_CLK/GP2[14]/BOOT[11]  
AFSX0/GP2[13]/BOOT[10]  
129  
127  
3
A4  
D5  
P3  
I
I
I
IPD  
IPD  
IPU  
BOOT[11]  
BOOT[10]  
BOOT[9]  
McASP0, GPIO  
UART0, I2C0,  
Timer0, GPIO  
UART0_TXD/I2C0_SCL/TM64P0_OUT12/GP5[9]/BOOT[9]  
UART0, I2C0,  
Timer0, GPIO  
UART0_RXD/I2C0_SDA/TM64P0_IN12/GP5[8]/BOOT[8]  
2
R3  
I
IPU  
BOOT[8]  
EQEP1S/GP5[7]/BOOT[7]  
I2C1_SDA/GP5[6]/BOOT[6]  
I2C1_SCL/GP5[5]/BOOT[5]  
16  
14  
13  
T6  
N5  
P5  
I
I
I
IPD  
IPU  
IPU  
eQEP1, GPIO  
BOOT[7]  
BOOT[6]  
BOOT[5]  
I2C1, GPIO  
SPI0, UART0,  
eQEP0, GPIO  
SPI0_SCS[0]/UART0_RTS/EQEP0B/GP5[4]/BOOT[4]  
SPI0_ENA/UART0_CTS/EQEP0A/GP5[3]/BOOT[3]  
9
N4  
R5  
I
I
IPU  
IPU  
BOOT[4]  
BOOT[3]  
SPI0, UART0,  
eQEP0, GPIO  
12  
SPI0_CLK/EQEP1I/GP5[2]/BOOT[2]  
SPI0_SIMO[0]/EQEP0S/GP5[1]/BOOT[1]  
SPI0_SOMI[0]/EQEP0I/GP5[0]/BOOT[0]  
11  
18  
17  
T5  
P6  
R6  
I
I
I
IPD  
IPD  
IPD  
SPIO, eQEP1, GPIO BOOT[2]  
BOOT[1]  
SPI0, eQEP0, GPIO  
BOOT[0]  
(1) Boot decoding will be defined in the ROM datasheet.  
(2) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.  
Note: For multiplexed pins where functions have different types (i.e., input versus output), the table reflects the pin function direction for  
that particular peripheral.  
(3) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor  
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2.6.10 Universal Asynchronous Receiver/Transmitters (UART0, UART2)  
Table 2-14. Universal Asynchronous Receiver/Transmitter (UART) Terminal Functions  
PIN NO  
SIGNAL NAME  
TYPE(1) PULL(2)  
MUXED  
DESCRIPTION  
PTP  
ZKB  
UART0  
I2C0, BOOT,  
Timer0, GPIO,  
UART0 receive  
data  
UART0_RXD/I2C0_SDA/TM64P0_IN12/GP5[8]/BOOT[8]  
UART0_TXD/I2C0_SCL/TM64P0_OUT12/GP5[9]/BOOT[9]  
SPI0_SCS[0]/ UART0_RTS /EQEP0B/GP5[4]/BOOT[4]  
SPI0_ENA/ UART0_CTS /EQEP0A/GP5[3]/BOOT[3]  
2
3
R3  
P3  
N4  
R5  
I
IPU  
IPU  
IPU  
IPU  
I2C0, Timer0,  
GPIO, BOOT  
UART0 transmit  
data  
O
O
I
UART0 ready-to-  
send output  
9
SPIO, eQEP0,  
GPIO, BOOT  
UART0 clear-to-  
send input  
12  
UART2  
UART2 receive  
data  
UART2_RXD/GP5[12]  
UART2_TXD/GP5[13]  
7
8
R4  
P4  
I
IPU  
IPU  
GPIO  
UART2 transmit  
data  
O
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.  
Note: For multiplexed pins where functions have different types (i.e., input versus output), the table reflects the pin function direction for  
that particular peripheral.  
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor  
2.6.11 Inter-Integrated Circuit Modules (I2C0, I2C1)  
Table 2-15. Inter-Integrated Circuit (I2C) Terminal Functions  
PIN NO  
SIGNAL NAME  
TYPE(1) PULL(2)  
MUXED  
DESCRIPTION  
PTP  
ZKB  
I2C0  
UART0, Timer0,  
GPIO, BOOT  
UART0_RXD/I2C0_SDA/TM64P0_IN12/GP5[8]/BOOT[8]  
UART0_TXD/I2C0_SCL/TM64P0_OUT12/GP5[9]/BOOT[9]  
2
3
R3  
P3  
I/O  
I/O  
IPU  
IPU  
I2C0 serial data  
I2C0 serial clock  
UART0, Timer0,  
GPIO, BOOT  
I2C1  
I2C1_SDA/GP5[6]/BOOT[6]  
I2C1_SCL/GP5[5]/BOOT[5]  
14  
13  
N5  
P5  
I/O  
I/O  
IPU  
IPU  
I2C1 serial data  
I2C1 serial clock  
GPIO, BOOT  
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.  
Note: For multiplexed pins where functions have different types (i.e., input versus output), the table reflects the pin function direction for  
that particular peripheral.  
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor  
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2.6.12 Timers  
Table 2-16. Timers Terminal Functions  
PIN NO  
SIGNAL NAME  
TYPE(1) PULL(2)  
MUXED  
DESCRIPTION  
PTP  
ZKB  
TIMER0  
UART0_RXD/I2C0_SDA/TM64P0_IN12/GP5[8]/BOOT[8]  
UART0_TXD/I2C0_SCL/TM64P0_OUT12/GP5[9]/BOOT[9]  
2
3
R3  
I
IPU  
IPU  
Timer0 lower input  
UART0, I2C0,  
GPIO, BOOT  
Timer0 lower  
output  
P3  
O
TIMER1 (Watchdog )  
No external pins. The Timer1 peripheral pins are not pinned out as external pins.  
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.  
Note: For multiplexed pins where functions have different types (i.e., input versus output), the table reflects the pin function direction for  
that particular peripheral.  
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor  
2.6.13 Multichannel Audio Serial Ports (McASP0, McASP1)  
Table 2-17. Multichannel Audio Serial Ports (McASPs) Terminal Functions  
PIN NO  
SIGNAL NAME  
TYPE(1) PULL(2) MUXED  
DESCRIPTION  
PTP  
ZKB  
McASP0  
EMA_OE/AXR0[13]/GP2[7]  
22  
R7  
M13  
A5  
D6  
C6  
B6  
A6  
D7  
C7  
B7  
A7  
D8  
C8  
B8  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
IPU  
IPU  
IPD  
IPD  
IPD  
IPU  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
EMIFA, GPIO  
EMIFA, GPIO, BOOT  
GPIO  
EMA_WE/AXR0[12]/GP2[3]/BOOT[14]  
AXR0[11]/ GP3[11]  
55  
124  
123  
122  
121  
120  
118  
117  
116  
115  
113  
112  
111  
AXR0[10]/GP3[10]  
GPIO  
AXR0[9]/GP3[9]  
GPIO  
AXR0[8]/MDIO_D/GP3[8]  
AXR0[7]/MDIO_CLK/GP3[7]  
AXR0[6]/RMII_RXER/GP3[6]  
AXR0[5]/RMII_RXD[1]/GP3[5]  
AXR0[4]/RMII_RXD[0]/GP3[4]  
AXR0[3]/RMII_CRS_DV/GP3[3]  
AXR0[2]/RMII_TXEN/GP3[2]  
AXR0[1]/RMII_TXD[1]/GP3[1]  
AXR0[0]/RMII_TXD[0]/GP3[0]  
MDIO, GPIO  
McASP0 serial data  
EMAC, GPIO  
McASP0 transmit  
master clock  
AHCLKX0/GP2[11]  
125  
126  
127  
129  
130  
131  
B5  
C5  
D5  
A4  
B4  
C4  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
GPIO  
McASP0 transmit bit  
clock  
ACLKX0/ECAP0/APWM0/GP2[12]  
AFSX0/GP2[13]/BOOT[10]  
eCAP0, GPIO  
GPIO, BOOT  
EMAC, GPIO, BOOT  
eCAP1, GPIO  
GPIO  
McASP0 transmit  
frame sync  
McASP0 receive  
master clock  
AHCLKR0/RMII_MHZ_50_CLK/GP2[14]/BOOT[11]  
ACLKR0/ECAP1/APWM1/GP2[15]  
AFSR0/GP3[12]  
McASP0 receive bit  
clock  
McASP0 receive frame  
sync  
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.  
Note: For multiplexed pins where functions have different types (i.e., input versus output), the table reflects the pin function direction for  
that particular peripheral.  
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor  
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Table 2-17. Multichannel Audio Serial Ports (McASPs) Terminal Functions (continued)  
PIN NO  
PTP ZKB  
McASP1  
SIGNAL NAME  
TYPE(1) PULL(2) MUXED  
DESCRIPTION  
AXR1[8]/EPWM1A/GP4[8]  
168  
169  
170  
171  
173  
174  
175  
176  
1
M2  
M3  
M4  
N1  
N2  
P1  
P2  
R2  
T3  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
eHRPWM1 A, GPIO  
eHRPWM1 B, GPIO  
eHRPWM2 A, GPIO  
eHRPWM2 B, GPIO  
AXR1[7]/EPWM1B/GP4[7]  
AXR1[6]/EPWM2A/GP4[6]  
AXR1[5]/EPWM2B/GP4[5]  
AXR1[4]/EQEP1B/GP4[4]  
AXR1[3]/EQEP1A/GP4[3]  
AXR1[2]/GP4[2]  
McASP1 serial data  
eQEP, GPIO  
AXR1[1]/GP4[1]  
GPIO  
AXR1[0]/GP4[0]  
McASP1 transmit  
master clock  
AHCLKX1/EPWM0B/GP3[14]  
ACLKX1/EPWM0A/GP3[15]  
AFSX1/EPWMSYNCI/EPWMSYNCO/GP4[10]  
AHCLKR1/GP4[11]  
160  
162  
163  
-
K2  
K3  
K4  
L1  
L2  
L3  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
eHRPWM0, GPIO  
eHRPWM0, GPIO  
eHRPWM0, GPIO  
GPIO  
McASP1 transmit bit  
clock  
McASP1 transmit  
frame sync  
McASP1 receive  
master clock  
McASP1 receive bit  
clock  
ACLKR1/ECAP2/APWM2/GP4[12]  
AFSR1/GP4[13]  
165  
166  
eCAP2, GPIO  
GPIO  
McASP1 receive frame  
sync  
eHRPWM0,  
AMUTE1/EPWMTZ/GP4[14]  
132  
D4  
O
IPD  
eHRPWM1, GPIO,  
eHRPWM2  
McASP1 mute output  
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2.6.14 Ethernet Media Access Controller (EMAC)  
Table 2-18. Ethernet Media Access Controller (EMAC) Terminal Functions  
PIN NO  
PTP ZKB  
RMII  
SIGNAL NAME  
TYPE(1) PULL(2)  
MUXED  
DESCRIPTION  
McASP0, GPIO,  
BOOT  
EMAC 50-MHz clock  
input or output  
AHCLKR0/RMII_MHZ_50_CLK/GP2[14]/BOOT[11]  
129  
A4  
I/O  
IPD  
AXR0[6]/RMII_RXER/GP3[6]  
AXR0[5]/RMII_RXD[1]/GP3[5]  
AXR0[4]/RMII_RXD[0]/GP3[4]  
118  
117  
116  
D7  
C7  
B7  
I
I
I
IPD  
IPD  
IPD  
EMAC RMII receiver error  
EMAC RMII receive data  
EMAC RMII carrier sense  
data valid  
AXR0[3]/RMII_CRS_DV/GP3[3]  
AXR0[2]/RMII_TXEN/GP3[2]  
115  
113  
A7  
D8  
I
IPD  
IPD  
McASP0, GPIO  
EMAC RMII transmit  
enable  
O
AXR0[1]/RMII_TXD[1]/GP3[1]  
AXR0[0]/RMII_TXD[0]/GP3[0]  
112  
111  
C8  
B8  
O
O
IPD  
IPD  
EMAC RMII trasmit data  
MDIO  
AXR0[8]/MDIO_D/GP3[8]  
121  
120  
B6  
A6  
I/O  
O
IPU  
IPD  
MDIO serial data  
MDIO data clock  
McASP0, GPIO  
AXR0[7]/MDIO_CLK/GP3[7]  
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.  
Note: For multiplexed pins where functions have different types (i.e., input versus output), the table reflects the pin function direction for  
that particular peripheral.  
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor  
2.6.15 Multimedia Card/Secure Digital (MMC/SD)  
Table 2-19. Multimedia Card/Secure Digital (MMC/SD) Terminal Functions  
PIN NO  
SIGNAL NAME  
TYPE(1) PULL(2)  
MUXED  
DESCRIPTION  
PTP  
30  
31  
54  
52  
51  
49  
48  
46  
45  
44  
ZKB  
R9  
EMA_A[1]/MMCSD_CLK/GP1[1]  
O
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
MMCSD_CLK  
MMCSD_CMD  
EMIFA, GPIO  
EMA_A[2]/MMCSD_CMD/GP1[2]  
P9  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
EMA_D[7]/MMCSD_DAT[7]/GP0[7]/BOOT[13]  
EMA_D[6]/MMCSD_DAT[6]/GP0[6]  
EMA_D[5]/MMCSD_DAT[5]/GP0[5]  
EMA_D[4]/MMCSD_DAT[4]/GP0[4]  
EMA_D[3]/MMCSD_DAT[3]/GP0[3]  
EMA_D[2]/MMCSD_DAT[2]/GP0[2]  
EMA_D[1]/MMCSD_DAT[1]/GP0[1]  
EMA_D[0]/MMCSD_DAT[0]/GP0[0]/BOOT[12]  
M15  
N13  
N15  
P13  
P15  
R13  
R15  
T13  
EMIFA, GPIO, BOOT  
EMIFA, GPIO  
MMC/SD data  
EMIFA, GPIO, BOOT  
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.  
Note: For multiplexed pins where functions have different types (i.e., input versus output), the table reflects the pin function direction for  
that particular peripheral.  
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor  
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2.6.16 General-Purpose IO Only Terminal Functions  
Table 2-20. General-Purpose IO Only Terminal Functions  
PIN NO  
PTP  
SIGNAL NAME  
TYPE(1) PULL(2)  
MUXED  
DESCRIPTION  
ZKB  
M16  
N14  
N16  
P14  
P16  
R14  
T14  
N12  
-
GP0[15]  
GP0[14]  
GP0[13]  
GP0[12]  
GP0[11]  
GP0[10]  
GP0[9]  
-
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
-
-
-
-
-
None  
General-Purpose IO  
-
-
GP0[8]  
GP5[11]  
GP5[10]  
GP7[14](3)  
6
4
-
157  
-
K1  
EMU0/GP7[15]  
J5  
I/O  
Emulation  
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.  
Note: For multiplexed pins where functions have different types (i.e., input versus output), the table reflects the pin function direction for  
that particular peripheral.  
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor  
(3) GP7[14] is initially configured as a reserved function after reset and will not be in a predictable state. This signal will be stable only after  
the GPIO configuration for this pin has been completed. Users should carefully consider the system implications of this pin being in an  
unknown state after reset.  
2.6.17 Reserved and No Connect Terminal Functions  
Table 2-21. Reserved and No Connect Terminal Functions  
PIN NO  
SIGNAL NAME  
RSV1  
TYPE(1)  
DESCRIPTION  
PTP  
ZKB  
Reserved. (Leave unconnected, do not connect to power or  
-
F7  
-
ground.)  
Reserved. For proper device operation, this pin must be tied  
either directly to CVDD or left unconnected (do not connect to  
ground).  
RSV2  
133  
B1  
PWR  
Reserved. For proper device operation, this pin must be tied  
RSV3  
RSV4  
149  
148  
-
PWR  
I
directly to CVDD  
.
H1  
Reserved. This pin may be tied high or low.  
A12, A13, A14, B13,  
B14, C1, C2, C3, D2,  
D3, E3, E4, E14, E15,  
F14, F15, G14, G15, H2,  
H5, H14, H15, J14, K13,  
K16, L4, L14, L15, L16,  
M1, M14, N3, N7, P12,  
R12, T4, T8, T12  
134, 135,  
137, 138,  
140  
-
-
No Connect (leave unconnected)  
NC  
136, 139  
F3, H4,  
This pin may be left unconnected or connected to VSS.  
(1) PWR = Supply voltage.  
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2.6.18 Supply and Ground Terminal Functions  
Table 2-22. Supply and Ground Terminal Functions  
PIN NO  
SIGNAL NAME  
TYPE(1)  
DESCRIPTION  
PTP  
ZKB  
F6, G1, G6, G7, G10,  
G11, H7, H10, H11, J6,  
J7, J10, J11, J12, K6,  
K7, K10, K11, L6  
10, 20, 28, 38, 50, 56,  
61, 69, 77, 93, 104,  
114, 147, 154, 161, 167  
CVDD (Core supply)  
PWR  
PWR  
1.2-V core supply voltage pins  
1.2V internal ram supply voltage  
pins  
RVDD (Internal RAM supply)  
DVDD (I/O supply)  
67, 159  
H6, H12  
5, 15, 24, 33, 43, 47,  
53, 58, 65, 71, 75, 81,  
87, 90, 99, 109, 119,  
128, 151, 158, 164,  
172,  
B16, E5, E8, E9, E12,  
F5, F11, F12, G5, G12,  
K5, K12, L5, L11, L12,  
M5, M8, M9, M12, R1,  
R16  
PWR  
3.3-V I/O supply voltage pins.  
A1, A2, A3, A15, A16,  
B2, B3, E6, E7, E10,  
E11, F4, F8, F9, F10,  
G2, G4, G8, G9, H8,  
H9, J8, J9, K8, K9, L7,  
L8, L9, L10, M6, M7,  
M10, M11, T1, T2, T15,  
T16  
VSS (Ground)  
177  
GND  
Ground pins.  
(1) PWR = Supply voltage, GND - Ground.  
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3 Device Configuration  
3.1 Boot Modes  
This device supports a variety of boot modes through an internal ROM bootloader. This device does not  
support dedicated hardware boot modes; therefore, all boot modes utilize the internal ROM. The input  
states of the BOOT pins are sampled and latched into the BOOTCFG register, which is part of the system  
configuration (SYSCFG) module, when device reset is deasserted. Boot mode selection is determined by  
the values of the BOOT pins.  
See Using the D800K001 Bootloader Application Report (SPRAB04) for more details on the ROM Boot  
Loader.  
The following boot modes are supported:  
NAND Flash boot  
8-bit NAND  
NOR Flash boot  
NOR Direct boot (8-bit)  
NOR Legacy boot (8-bit)  
NOR AIS boot (8-bit)  
I2C0 / I2C1 Boot  
EEPROM (Master Mode)  
External Host (Slave Mode)  
SPI0 Boot  
Serial Flash (Master Mode)  
SERIAL EEPROM (Master Mode)  
External Host (Slave Mode)  
UART0 / UART2 Boot  
External Host  
3.2 SYSCFG Module  
The following system level features of the chip are controlled by the SYSCFG peripheral:  
Readable Device, Die, and Chip Revision ID  
Control of Pin Multiplexing  
Priority of bus accesses different bus masters in the system  
Capture at power on reset the chip BOOT[15:0] pin values and make them available to software  
Special case settings for peripherals:  
Locking of PLL controller settings  
Default burst sizes for EDMA3 TC0 and TC1  
Selection of the source for the eCAP module input capture (including on chip sources)  
Clock source selection for EMIFA and EMIFB  
Selects the source of emulation suspend signal (from DSP) of peripherals supporting this function.  
Since the SYSCFG peripheral controls global operation of the device, its registers are protected against  
erroneous accesses by several mechanisms:  
A special key sequence must be written to KICK0, KICK1 registers before any other registers are  
writeable.  
Additionally, many registers are accessible only by a host (DSP) when it is operating in its privileged  
mode. (ex. from the kernel, but not from user space code).  
36  
Device Configuration  
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Table 3-1. System Configuration (SYSCFG) Module Register Access  
BYTE ADDRESS  
REGISTER NAME  
REVID  
REGISTER DESCRIPTION  
Revision Identification Register  
ACCESS  
0x01C1 4000  
0x01C1 4008  
0x01C1 400C  
0x01C1 4010  
0x01C1 4014  
0x01C1 4018  
0x01C1 4020  
0x01C1 4024  
0x01C1 4038  
0x01C1 403C  
0x01C1 4040  
0x01C1 4044  
0x01C1 40E0  
0x01C1 40E4  
0x01C1 40E8  
0x01C1 40EC  
0x01C1 40F0  
0x01C1 40F4  
0x01C1 40F8  
0x01C1 4110  
0x01C1 4114  
0x01C1 4118  
0x01C1 4120  
0x01C1 4124  
0x01C1 4128  
0x01C1 412C  
0x01C1 4130  
0x01C1 4134  
0x01C1 4138  
0x01C1 413C  
0x01C1 4140  
0x01C1 4144  
0x01C1 4148  
0x01C1 414C  
0x01C1 4150  
0x01C1 4154  
0x01C1 4158  
0x01C1 415C  
0x01C1 4160  
0x01C1 4164  
0x01C1 4168  
0x01C1 416C  
0x01C1 4170  
0x01C1 4174  
0x01C1 4178  
0x01C1 417C  
0x01C1 4180  
DIEIDR0  
Device Identification Register 0  
Device Identification Register 1  
Device Identification Register 2  
Device Identification Register 3  
JTAG Identification Register  
Boot Configuration Register  
DIEIDR1  
DIEIDR2  
DIEIDR3  
DEVIDR0  
BOOTCFG  
CHIPREVID  
KICK0R  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Silicon Revision Identification Register  
Kick 0 Register  
KICK1R  
Kick 1 Register  
HOST0CFG  
HOST1CFG  
IRAWSTAT  
IENSTAT  
IENSET  
Host 0 Configuration Register  
Host 1 Configuration Register  
Interrupt Raw Status/Set Register  
Interrupt Enable Status/Clear Register  
Interrupt Enable Register  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
IENCLR  
Interrupt Enable Clear Register  
End of Interrupt Register  
EOI  
FLTADDRR  
FLTSTAT  
MSTPRI0  
MSTPRI1  
MSTPRI2  
PINMUX0  
PINMUX1  
PINMUX2  
PINMUX3  
PINMUX4  
PINMUX5  
PINMUX6  
PINMUX7  
PINMUX8  
PINMUX9  
PINMUX10  
PINMUX11  
PINMUX12  
PINMUX13  
PINMUX14  
PINMUX15  
PINMUX16  
PINMUX17  
PINMUX18  
PINMUX19  
SUSPSRC  
CHIPSIG  
Fault Address Register  
Fault Status Register  
Master Priority 0 Register  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Privileged mode  
Master Priority 1 Register  
Master Priority 2 Register  
Pin Multiplexing Control 0 Register  
Pin Multiplexing Control 1 Register  
Pin Multiplexing Control 2 Register  
Pin Multiplexing Control 3 Register  
Pin Multiplexing Control 4 Register  
Pin Multiplexing Control 5 Register  
Pin Multiplexing Control 6 Register  
Pin Multiplexing Control 7 Register  
Pin Multiplexing Control 8 Register  
Pin Multiplexing Control 9 Register  
Pin Multiplexing Control 10 Register  
Pin Multiplexing Control 11 Register  
Pin Multiplexing Control 12 Register  
Pin Multiplexing Control 13 Register  
Pin Multiplexing Control 14 Register  
Pin Multiplexing Control 15 Register  
Pin Multiplexing Control 16 Register  
Pin Multiplexing Control 17 Register  
Pin Multiplexing Control 18 Register  
Pin Multiplexing Control 19 Register  
Suspend Source Register  
Chip Signal Register  
CHIPSIG_CLR  
CFGCHIP0  
CFGCHIP1  
Chip Signal Clear Register  
Chip Configuration 0 Register  
Chip Configuration 1 Register  
Privileged mode  
Privileged mode  
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Table 3-1. System Configuration (SYSCFG) Module Register Access (continued)  
BYTE ADDRESS  
0x01C1 4184  
0x01C1 4188  
0x01C1 418C  
REGISTER NAME  
CFGCHIP2  
REGISTER DESCRIPTION  
Chip Configuration 2 Register  
ACCESS  
Privileged mode  
Privileged mode  
Privileged mode  
CFGCHIP3  
Chip Configuration 3 Register  
Chip Configuration 4 Register  
CFGCHIP4  
3.3 Pullup/Pulldown Resistors  
Proper board design should ensure that input pins to the device always be at a valid logic level and not  
floating. This may be achieved via pullup/pulldown resistors. The device features internal pullup (IPU) and  
internal pulldown (IPD) resistors on most pins to eliminate the need, unless otherwise noted, for external  
pullup/pulldown resistors.  
An external pullup/pulldown resistor needs to be used in the following situations:  
Boot and Configuration Pins: If the pin is both routed out and 3-stated (not driven), an external  
pullup/pulldown resistor is strongly recommended, even if the IPU/IPD matches the desired value/state.  
Other Input Pins: If the IPU/IPD does not match the desired value/state, use an external  
pullup/pulldown resistor to pull the signal to the opposite rail.  
For the boot and configuration pins, if they are both routed out and 3-stated (not driven), it is strongly  
recommended that an external pullup/pulldown resistor be implemented. Although, internal  
pullup/pulldown resistors exist on these pins and they may match the desired configuration value,  
providing external connectivity can help ensure that valid logic levels are latched on these device boot and  
configuration pins. In addition, applying external pullup/pulldown resistors on the boot and configuration  
pins adds convenience to the user in debugging and flexibility in switching operating modes.  
Tips for choosing an external pullup/pulldown resistor:  
Consider the total amount of current that may pass through the pullup or pulldown resistor. Make sure  
to include the leakage currents of all the devices connected to the net, as well as any internal pullup or  
pulldown resistors.  
Decide a target value for the net. For a pulldown resistor, this should be below the lowest VIL level of  
all inputs connected to the net. For a pullup resistor, this should be above the highest VIH level of all  
inputs on the net. A reasonable choice would be to target the VOL or VOH levels for the logic family of  
the limiting device; which, by definition, have margin to the VIL and VIH levels.  
Select a pullup/pulldown resistor with the largest possible value; but, which can still ensure that the net  
will reach the target pulled value when maximum current from all devices on the net is flowing through  
the resistor. The current to be considered includes leakage current plus, any other internal and  
external pullup/pulldown resistors on the net.  
For bidirectional nets, there is an additional consideration which sets a lower limit on the resistance  
value of the external resistor. Verify that the resistance is small enough that the weakest output buffer  
can drive the net to the opposite logic level (including margin).  
Remember to include tolerances when selecting the resistor value.  
For pullup resistors, also remember to include tolerances on the IO supply rail.  
For most systems, a 1-kresistor can be used to oppose the IPU/IPD while meeting the above  
criteria. Users should confirm this resistor value is correct for their specific application.  
For most systems, a 20-kresistor can be used to compliment the IPU/IPD on the boot and  
configuration pins while meeting the above criteria. Users should confirm this resistor value is correct  
for their specific application.  
For more detailed information on input current (II), and the low-/high-level input voltages (VIL and VIH)  
for the device, see Section 4.2, Recommended Operating Conditions.  
For the internal pullup/pulldown resistors for all device pins, see the peripheral/system-specific terminal  
functions table.  
38  
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4 Device Operating Conditions  
4.1 Absolute Maximum Ratings Over Operating Junction Temperature Range  
(1)  
(Unless Otherwise Noted)  
Core  
-0.5 V to 1.4 V  
-0.5 V to 3.8V  
(2)  
(CVDD, RVDD, PLL0_VDDA )  
Supply voltage ranges  
I/O, 3.3V  
(DVDD)  
(2)  
VI I/O, 1.2V  
(OSCIN)  
-0.3 V to CVDD + 0.35V  
-0.3V to DVDD + 0.3V  
VI I/O, 3.3V  
Input voltage ranges  
(Steady State)  
VI I/O, 3.3V  
(Transient Overshoot/Undershoot)  
20% of DVDD for up to  
20% of the signal period  
VO I/O, 3.3V  
-0.5 V to DVDD + 0.3V  
(Steady State)  
Output voltage ranges  
VO I/O, 3.3V  
20% of DVDD for up to  
20% of the signal period  
(Transient Overshoot/Undershoot )  
Input or Output Voltages 0.3V above or below their respective power  
±20mA  
Clamp Current  
rails. Limit clamp current that flows through the I/O's internal diode  
protection cells.  
(default)  
0°C to 90°C  
-40°C to 125°C  
-55°C to 150°C  
>2000V  
Operating Junction Temperature ranges,  
TJ  
(T version)  
Storage temperature range, Tstg  
(default)  
Human Body Model (HBM)(4)  
Charged Device Model (CDM)(5)  
(3)  
ESD Stress Voltage, VESD  
>500V  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltage values are with respect to VSS, PLL0_VSSA, OSCVSS  
(3) Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into the device.  
(4) Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001-2010. JEDEC document JEP155 states that 500V HBM allows  
safe manufacturing with a standard ESD control process, and manufacturing with less than 500V HBM is possible if necessary  
precautions are taken. Pins listed as 1000V may actually have higher performance.  
(5) Level listed above is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250V CDM allows safe  
manufacturing with a standard ESD control process. Pins listed as 250V may actually have higher performance.  
40  
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4.2 Recommended Operating Conditions  
MIN  
1.14  
1.14  
3.0  
NOM  
1.2  
MAX UNIT  
Supply voltage, Core  
CVDD  
1.32  
1.32  
3.45  
V
V
V
(CVDD, PLL0_VDDA )  
RVDD  
DVDD  
Supply Voltage, Internal RAM  
1.2  
Supply voltage, I/O, 3.3V  
(DVDD)  
3.3  
Supply ground  
VSS  
VIH  
0
0
0
V
(VSS, PLL0_VSSA, OSCVSS(1)  
)
High-level input voltage, I/O, 3.3V  
High-level input voltage, OSCIN  
Low-level input voltage, I/O, 3.3V  
Low-level input voltage, OSCIN  
Input Hysteresis  
2
V
V
0.7*CVDD  
0.8  
V
VIL  
0.3*CVDD  
V
VHYS  
tt  
160  
mV  
Transition time, 10%-90%, All Inputs (unless otherwise  
specified in the electrical data sections)  
0.25P or 10(2)  
90  
ns  
°C  
Default  
0
-40  
0
TJ  
Operating junction temperature range  
DSP Operating Frequency (SYSCLK1,6)  
Automotive  
(T suffix)  
125  
°C  
Default  
375 or 200  
375 or 200  
MHz  
MHz  
FSYSCLK1,6  
Automotive  
(T suffix)  
0
(1) When an external crystal is used oscillator (OSC_VSS) ground must be kept separate from other grounds and connected directly to the  
crystal load capacitor ground. These pins are shorted to VSS on the device itself and should not be connected to VSS on the circuit  
board. If a crystal is not used and the clock input is driven directly, then the oscillator VSS may be connected to board ground.  
(2) Whichever is smaller. P = the period of the applied signal. Maintaining transition times as fast as possible is recommended to improve  
noise immunity on input signals.  
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4.3 Notes on Recommended Power-On Hours (POH)  
The information in the section below is provided solely for your convenience and does not extend or  
modify the warranty provided under TI’s standard terms and conditions for TI semiconductor products.  
To avoid significant degradation, the device power-on hours (POH) must be limited to the following:  
Table 4-1. Recommended Power-On Hours  
SILICON  
REVISION  
OPERATING JUNCTION  
TEMPERATURE (Tj)  
POWER-ON HOURS [POH]  
(HOURS)  
SPEED GRADE  
NOMINAL CVDD VOLTAGE (V)  
A
B
B
B
B
300 MHZ  
200 MHZ  
200 MHZ  
375 MHz  
375 MHZ  
0 to 90 °C  
0 to 90 °C  
1.2V  
1.2V  
1.2V  
1.2V  
1.2V  
100,000  
100,000  
20,000  
-40° to 125°  
0 to 90 °C  
100,000  
20,000  
-40 to 125 °C  
Note: Logic functions and parameter values are not assured out of the range specified in the recommended  
operating conditions.  
The above notations cannot be deemed a warranty or deemed to extend or modify the warranty under  
TI’s standard terms and conditions for TI semiconductor products.  
42  
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4.4 Electrical Characteristics Over Recommended Ranges of Supply Voltage and  
Operating Junction Temperature (Unless Otherwise Noted)  
PARAMETER  
TEST CONDITIONS  
DVDD= 3.15V, IOH = 4 mA  
DVDD= 3.15V, IOH = 100 μA  
DVDD= 3.15V, IOL = -4mA  
DVDD= 3.15V, IOL = -100 μA  
MIN  
2.4  
TYP  
MAX UNIT  
V
V
VOH  
High-level output voltage (3.3V I/O)  
2.95  
0.4  
0.2  
V
V
VOL  
Low-level output voltage (3.3V I/O)  
Input current  
VI = VSS to DVDD without opposing  
internal resistor  
±35  
-200  
300  
μA  
μA  
μA  
VI = VSS to DVDD with opposing  
(1)  
II  
-30  
50  
(2)  
internal pullup resistor  
VI = VSS to DVDD with opposing  
(2)  
internal pulldown resistor  
IOH  
IOL  
High-level output current  
Low-level output current  
All peripherals  
All peripherals  
-4  
4
mA  
mA  
VO = VDD or VSS; Internal pull  
disabled  
(3)  
IOZ  
I/O Off-state output current  
±35  
μA  
LVCMOS signals  
OSCIN  
3
2
3
pF  
pF  
pF  
CI  
Input capacitance  
Output capacitance  
CO  
LVCMOS signals  
(1) II applies to input-only pins and bi-directional pins. For input-only pins, II indicates the input leakage current. For bi-directional pins, II  
indicates the input leakage current and off-state (Hi-Z) output leakage current.  
(2) Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor.  
(3) IOZ applies to output-only pins, indicating off-state (Hi-Z) output leakage current.  
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5 Peripheral Information and Electrical Specifications  
5.1 Parameter Information  
5.1.1 Parameter Information Device-Specific Information  
Tester Pin Electronics  
Data Sheet Timing Reference Point  
42  
3.5 nH  
Output  
Under  
Test  
Transmission Line  
Z0 = 50 Ω  
(see note)  
Device Pin  
(see note)  
4.0 pF  
1.85 pF  
A. The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its  
transmission line effects must be taken into account. A transmission line with a delay of 2 ns or longer can be used to  
produce the desired transmission line effect. The transmission line is intended as a load only. It is not necessary to  
add or subtract the transmission line delay (2 ns or longer) from the data sheet timings.  
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the  
device pin and the input signals are driven between 0V and the appropriate IO supply rail for the signal.  
Figure 5-1. Test Load Circuit for AC Timing Measurements  
The load capacitance value stated is only for characterization and measurement of AC timing signals. This  
load capacitance value does not indicate the maximum load the device is capable of driving.  
5.1.1.1 Signal Transition Levels  
All input and output timing parameters are referenced to Vref for both "0" and "1" logic levels. For 3.3 V I/O,  
Vref = 1.65 V. For 1.2 V I/O, Vref = 0.6 V.  
V
ref  
Figure 5-2. Input and Output Voltage Reference Levels for AC Timing Measurements  
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks,  
VOLMAX and VOH MIN for output clocks.  
V
ref  
= V MIN (or V MIN)  
IH OH  
V
ref  
= V MAX (or V MAX)  
IL OL  
Figure 5-3. Rise and Fall Transition Time Voltage Reference Levels  
44  
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5.2 Recommended Clock and Control Signal Transition Behavior  
All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic  
manner.  
5.3 Power Supplies  
5.3.1 Power-On Sequence  
The device should be powered-on in the following order:  
1. Logic supplies:  
(a) CVDD core logic supply  
(b) Other static logic supplies (RVDD, PLL0_VDDA).  
Groups 1a) and 1b) may be powered up together; or 1a) first, followed by 1b).  
2. All digital IO supplies (DVDD).  
There is no specific required voltage ramp rate for any of the supplies.  
Note: Future devices may support higher performance at a higher core logic voltage (CVDD). If future  
migration is desired, the current design should provide separate supplies for 1a) and 1b). If not, then 1a)  
and 1b) may be provided by a single supply.  
RESET must be maintained active until all power supplies have reached their nominal values.  
5.3.2 Power-Off Sequence  
The power supplies can be powered-off in any order as long as the 3.3V supplies do not remain powered  
with the other supplies unpowered.  
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5.4 Reset  
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5.4.1 Power-On Reset (POR)  
A power-on reset (POR) is required to place the device in a known good state after power-up. Power-On  
Reset is initiated by bringing RESET and TRST low at the same time. POR sets all of the device internal  
logic to its default state. All pins are tri-stated with the exception of GP7[14]. During reset, GP7[14] is  
configured as a reserved function, and its behavior is not guaranteed; the user should be aware that this  
pin will drive a level, and in fact may toggle, during reset.  
While both TRST and RESET need to be asserted upon power up, only RESET needs to be released for  
the device to boot properly. TRST may be asserted indefinitely for normal operation, keeping the JTAG  
port interface and device's emulation logic in the reset state.  
TRST only needs to be released when it is necessary to use a JTAG controller to debug the device or  
exercise the device's boundary scan functionality. Note: TRST is synchronous and must be clocked by  
TCK; otherwise, the boundary scan logic may not respond as expected after TRST is asserted.  
RESET must be released only in order for boundary-scan JTAG to read the variant field of IDCODE  
correctly. Other boundary-scan instructions work correctly independent of current state of RESET. For  
maximum reliability, the device includes an internal pulldown on the TRST pin to ensure that TRST will  
always be asserted upon power up and the device's internal emulation logic will always be properly  
initialized.  
JTAG controllers from Texas Instruments actively drive TRST high. However, some third-party JTAG  
controllers may not drive TRST high but expect the use of a pullup resistor on TRST. When using this type  
of JTAG controller, assert TRST to intialize the device after powerup and externally drive TRST high  
before attempting any emulation or boundary scan operations.  
A summary of the effects of Power-On Reset is given below:  
All internal logic (including emulation logic and the PLL logic) is reset to its default state  
Internal memory is not maintained through a POR  
All device pins go to a high-impedance state  
CAUTION  
A watchdog reset triggers a POR.  
5.4.2 Warm Reset  
A warm reset provides a limited reset to the device. Warm Reset is initiated by bringing only RESET low  
(TRST is maintained high through a warm reset). Warm reset sets certain portions of the device to their  
default state while leaving others unaltered. All pins are tri-stated with the exception of GP7[14]. During  
reset, GP7[14] is configured as a reserved function, and its behavior is not deterministic; the user should  
be aware that this pin will drive a level, and in fact may toggle, during reset.  
During emulation, the emulator will maintain TRST high so only warm reset (not POR) is available during  
emulation debug and development.  
A summary of the effects of Warm Reset is given below:  
All internal logic (except for the emulation logic and the PLL logic) is reset to its default state  
Internal memory is maintained through a warm reset  
All device pins go to a high-impedance state  
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5.4.3 Reset Electrical Data Timings  
Table 5-1 assumes testing over the recommended operating conditions.  
Table 5-1. Reset Timing Requirements ((1)  
)
NO.  
MIN  
100  
20  
MAX  
UNIT  
ns  
1
2
3
tw(RSTL)  
Pulse width, RESET/TRST low  
tsu(BPV-RSTH)  
th(RSTH-BPV)  
Setup time, boot pins valid before RESET/TRST high  
Hold time, boot pins valid after RESET/TRST high  
ns  
20  
ns  
(1) For power-on reset (POR), the reset timings in this table refer to RESET and TRST together. For warm reset, the reset timings in this  
table refer to RESET only (TRST is held high).  
Power  
Supplies  
Ramping  
Power Supplies Stable  
Clock Source Stable  
OSCIN  
1
RESET  
TRST  
3
2
Boot Pins  
Config  
Figure 5-4. Power-On Reset (RESET and TRST active) Timing  
Power Supplies Stable  
OSCIN  
TRST  
1
RESET  
3
2
Config  
Boot Pins  
Driven or Hi-Z  
Figure 5-5. Warm Reset (RESET active, TRST high) Timing  
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5.5 Crystal Oscillator or External Clock Input  
The device includes two choices to provide an external clock input, which is fed to the on-chip PLL to  
generate high-frequency system clocks. These options are illustrated in Figure 5-6 and Figure 5-7. For  
input clock frequencies between 12 and 20 MHz, a crystal with 80 ohm max ESR is recommended. For  
input clock frequencies between 20 and 30 MHz, a crystal with 60 ohm max ESR is recommended.  
Typical load capacitance values are 10-20 pF, where the load capacitance is the series combination of C1  
and C2.  
The CLKMODE bit in the PLLCTL register must be 0 to use the on-chip oscillator. If CLKMODE is set to 1,  
the internal oscillator is disabled.  
Figure 5-6 illustrates the option that uses on-chip 1.2V oscillator with external crystal circuit.  
Figure 5-7 illustrates the option that uses an external 1.2V clock input.  
C2  
OSCIN  
Clock Input  
to PLL  
X1  
OSCOUT  
C1  
OSCVSS  
Figure 5-6. On-Chip 1.2V Oscillator  
Table 5-2. Oscillator Timing Requirements  
NO  
fosc  
PARAMETER  
MIN  
MAX  
UNIT  
Oscillator frequency range (OSCIN/OSCOUT)  
12  
30  
MHz  
Clock  
Input  
to PLL  
OSCIN  
OSCOUT  
NC  
OSCVSS  
Figure 5-7. External 1.2V Clock Source  
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Table 5-3. OSCIN Timing Requirements for Externally Driven Clock  
NO  
MIN  
12  
MAX  
UNIT  
MHz  
ns  
fOSCIN  
OSCIN frequency range (OSCIN)  
Cycle time, external clock driven on OSCIN  
Pulse width high, external clock on OSCIN  
Pulse width low, external clock on OSCIN  
Transition time, OSCIN  
50  
tc(OSCIN)  
tw(OSCINH)  
tw(OSCINL)  
tt(OSCIN)  
tj(OSCIN)  
20  
0.4 tc(OSCIN)  
0.4 tc(OSCIN)  
ns  
ns  
0.25P or 10(1)  
0.02P  
ns  
Period jitter, OSCIN  
ns  
(1) Whichever is smaller. P = the period of the applied signal. Maintaining transition times as fast as possible is recommended to improve  
noise immunity on input signals.  
5.6 Clock PLLs  
The device has one PLL controller that provides clock to different parts of the system. PLL0 provides  
clocks (though various dividers) to most of the components of the device.  
The PLL controller provides the following:  
Glitch-Free Transitions (on changing clock settings)  
Domain Clocks Alignment  
Clock Gating  
PLL power down  
The various clock outputs given by the controller are as follows:  
Domain Clocks: SYSCLK [1:n]  
Auxiliary Clock from reference clock source: AUXCLK  
Various dividers that can be used are as follows:  
Post-PLL Divider: POSTDIV  
SYSCLK Divider: D1, ¼, Dn  
Various other controls supported are as follows:  
PLL Multiplier Control: PLLM  
Software programmable PLL Bypass: PLLEN  
5.6.1 PLL Device-Specific Information  
The device DSP generates the high-frequency internal clocks it requires through an on-chip PLL.  
The PLL requires some external filtering components to reduce power supply noise as shown in Figure 5-  
8.  
1.14V - 1.32V  
50R  
PLL0_VDDA  
0.1  
µF  
0.01  
µF  
VSS  
50R  
PLL0_VSSA  
Ferrite Bead: Murata BLM31PG500SN1L or Equivalent  
Figure 5-8. PLL External Filtering Components  
The input to the PLL is either from the on-chip oscillator or from an external clock on the OSCIN pin. The  
PLL outputs seven clocks that have programmable divider options. Figure 5-9 illustrates the PLL  
Topology.  
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The PLL is disabled by default after a device reset. It must be configured by software according to the  
allowable operating conditions listed in Table 5-4 before enabling the DSP to run from the PLL by setting  
PLLEN = 1.  
CLKMODE  
PLLEN  
Square  
1
Wave  
PLLDIV1 (/1)  
PLLDIV2 (/2)  
OSCIN  
Pre-Div  
PLL  
Post-Div  
1
0
SYSCLK1  
SYSCLK2  
Crystal  
0
PLLM  
PLLDIV3 (/3)  
PLLDIV4 (/4)  
SYSCLK3  
SYSCLK4  
PLLDIV5 (/3)  
PLLDIV7 (/6)  
SYSCLK5  
SYSCLK7  
AUXCLK  
EMIFA  
0
1
Internal  
Clock  
Source  
DIV4.5  
CFGCHIP3[EMA_CLKSRC]  
EMIFB  
DIV4.5  
1
0
Internal  
Clock  
Source  
CFGCHIP3[EMB_CLKSRC]  
Figure 5-9. PLL Topology  
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Table 5-4. Allowed PLL Operating Conditions  
Default  
Value  
NO  
PARAMETER  
MIN  
MAX  
N/A  
UNIT  
1
PLLRST: Assertion time during initialization  
N/A  
N/A  
/1  
1000  
ns  
2000 N  
m
Max PLL Lock Time =  
Lock time: The time that the application has to wait for  
the PLL to acquire locks before setting PLLEN, after  
changing PREDIV, PLLM, or OSCIN  
OSCIN  
cycles  
2
N/A  
where N = Pre-Divider Ratio  
M = PLL Multiplier  
3
4
PREDIV  
/1  
/32  
PLL input frequency  
( PLLREF)  
30 (if internal oscillator is used)  
50 (if external clock source is used)  
12  
MHz  
MHz  
(1)  
5
6
7
PLL multiplier values (PLLM)  
x20  
N/A  
/1  
x4  
300  
/1  
x32  
600  
/32  
PLL output frequency. ( PLLOUT )  
POSTDIV  
(1) The multiplier values must be chosen such that the PLL output frequency (at PLLOUT) is between 300 and 600 MHz, but the frequency  
going into the SYSCLK dividers (after the post divider) cannot exceed the maximum clock frequency defined for the device at a given  
voltage operating point.  
5.6.2 Device Clock Generation  
PLL0 is controlled by PLL Controller 0. The PLLC0 manages the clock ratios, alignment, and gating for the  
system clocks to the chip. The PLLC is responsible for controlling all modes of the PLL through software,  
in terms of pre-division of the clock inputs, multiply factor within the PLL, and post-division for each of the  
chip-level clocks from the PLL output. The PLLC also controls reset propagation through the chip, clock  
alignment, and test points.  
PLLC0 generates several clocks from the PLL0 output clock for use by the various modules. These are  
summarized in Table 5-5. The clock ratios between SYSCLK1, SYSCLK2, SYSCLK4 and SYSCLK6 must  
always be maintained as shown in the table.  
Table 5-5. System PLLC0 Output Clocks  
OUTPUT  
CLOCK  
USED BY  
DEFAULT RATIO  
(RELATIVE TO  
SYSCLK1)  
NOTES  
SYSCLK1  
SYSCLK2  
DSP  
/1  
/2  
No Required Ratio  
SYSCLK1 / 2  
EDMA, DSP ports, EMIFB (ports to switch fabric), ECAP 0/1/2,  
EPWM 0/1/2, EQEP 0/1, McASP/FIFO 0/1, UART 2, HRPWM  
0/1/2, SPI0  
SYSCLK3  
EMIFA  
/3  
/4  
No Required Ratio  
SYSCLK1 / 4  
SYSCLK4 SYSCFG, Interrupt Controller, PLLC0, PSC 0, EMAC/MDIO, GPIO,  
I2C 1, PSC 1  
SYSCLK5  
SYSCLK7  
EMIFB  
/3  
/6  
No Required Ratio  
RMII clock to EMAC  
No Required Ratio ;  
Should be set to 50 MHz  
AUXCLK  
DIV4p5  
McASP AuxClk, Timer64P0,Timer64P1, I2C0,  
133MHz clock source for EMIFB  
N/A  
No Required Ratio  
No Required Ratio  
PLL output/4.5  
The divide values in the PLL Controller 0 for SYSCLK1/SYSCLK6, SYSCLK2 and SYSCLK4 are not  
fixed so that user can change the divide values for power saving reasons. But users are responsible to  
guarantee that the divide ratios between these clock domains must be fixed to 1:2:4.  
Although the PLL is capable of running at 600 MHz, the SYSCLK dividers in the PLLC0 are not  
(maximum 400 MHz). For this reason, the post-divider in the PLLC0 should be configured for /2 to  
provide 300 MHz to each of the SYSCLK dividers.  
The DIV4p5 (/4.5) hardware clock divider is provided to generate 133 MHz from the 600 MHz PLL  
clock for use as clocks to the EMIFs.  
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5.6.3 PLL Controller 0 Registers  
Table 5-6. PLL Controller 0 Registers  
ADDRESS  
0x01C1 1000  
0x01C1 10E4  
0x01C1 1100  
0x01C1 1104  
0x01C1 1110  
0x01C1 1114  
0x01C1 1118  
0x01C1 111C  
0x01C1 1120  
0x01C1 1124  
0x01C1 1128  
0x01C1 1138  
0x01C1 113C  
0x01C1 1140  
0x01C1 1144  
0x01C1 1148  
0x01C1 114C  
0x01C1 1150  
0x01C1 1160  
0x01C1 1164  
0x01C1 1168  
0x01C1 116C  
REGISTER NAME  
REVID  
REGISTER DESCRIPTION  
Revision Identification Register  
Reset Type Status Register  
PLL Control Register  
RSTYPE  
PLLCTL  
-
Reserved  
PLLM  
PLL Multiplier Control Register  
PLL Pre-Divider Control Register  
PLL Controller Divider 1 Register  
PLL Controller Divider 2 Register  
PLL Controller Divider 3 Register  
Reserved  
PREDIV  
PLLDIV1  
PLLDIV2  
PLLDIV3  
-
POSTDIV  
PLLCMD  
PLLSTAT  
ALNCTL  
DCHANGE  
CKEN  
PLL Post-Divider Control Register  
PLL Controller Command Register  
PLL Controller Status Register  
PLL Controller Clock Align Control Register  
PLLDIV Ratio Change Status Register  
Clock Enable Control Register  
Clock Status Register  
CKSTAT  
SYSTAT  
PLLDIV4  
PLLDIV5  
PLLDIV6  
PLLDIV7  
SYSCLK Status Register  
PLL Controller Divider 4 Register  
PLL Controller Divider 5 Register  
PLL Controller Divider 6 Register  
PLL Controller Divider 7 Register  
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5.7 DSP Interrupts  
The C674x DSP interrupt controller combines device events into 12 prioritized interrupts. The source for  
each of the 12 CPU interrupts is user programmable and is listed in Table 5-7. Also, the interrupt  
controller controls the generation of the CPU exception, NMI, and emulation interrupts. Table 5-8  
summarizes the C674x interrupt controller registers and memory locations.  
Table 5-7. C6743 DSP Interrupts  
EVT#  
0
INTERRUPT NAME  
EVT0  
SOURCE  
C674x Int Ctl 0  
1
EVT1  
C674x Int Ctl 1  
2
EVT2  
C674x Int Ctl 2  
3
EVT3  
C674x Int Ctl 3  
4
T64P0_TINT12  
SYSCFG_CHIPINT2  
PRU_EVTOUT0  
EHRPWM0  
Timer64P0 - TINT12  
SYSCFG_CHIPSIG Register  
PRU Interrupt  
5
6
7
HiResTimer/PWM0 Interrupt  
EDMA3 CC0 Region 1 interrupt  
C674x-ECM  
8
EDMA3_CC0_INT1  
EMU-DTDMA  
EHRPWM0TZ  
EMU-RTDXRX  
EMU-RTDXTX  
IDMAINT0  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19-21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
HiResTimer/PWM0 Trip Zone Interrupt  
C674x-RTDX  
C674x-RTDX  
C674x-EMC  
IDMAINT1  
C674x-EMC  
MMCSD_INT0  
MMCSD_INT1  
PRU_EVTOUT1  
EHRPWM1  
MMCSD MMC/SD Interrupt  
MMCSD SDIO Interrupt  
PRU Interrupt  
HiResTimer/PWM1 Interrupt  
Reserved  
-
PRU_EVTOUT2  
EHRPWM1TZ  
EHRPWM2  
PRU Interrupt  
HiResTimer/PWM1 Trip Zone Interrupt  
HiResTimer/PWM2 Interrupt  
HiResTimer/PWM2 Trip Zone Interrupt  
EMAC - Core 0 Receive Threshold Interrupt  
EMAC - Core 0 Receive Interrupt  
EMAC - Core 0 Transmit Interrupt  
EMAC - Core 0 Miscellaneous Interrupt  
EMAC - Core 1 Receive Threshold Interrupt  
EMAC - Core 1 Receive Interrupt  
EMAC - Core 1 Transmit Interrupt  
EMAC - Core 1 Miscellaneous Interrupt  
Reserved  
EHRPWM2TZ  
EMAC_C0RXTHRESH  
EMAC_C0RX  
EMAC_C0TX  
EMAC_C0MISC  
EMAC_C1RXTHRESH  
EMAC_C1RX  
EMAC_C1TX  
EMAC_C1MISC  
-
PRU_EVTOUT3  
IIC0_INT  
PRU Interrupt  
I2C0  
SP0_INT  
SPI0  
UART0_INT  
PRU_EVTOUT5  
T64P1_TINT12  
GPIO_B1INT  
IIC1_INT  
UART0  
PRU Interrupt  
Timer64P1 Interrupt 12  
GPIO Bank 1 Interrupt  
I2C1  
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Table 5-7. C6743 DSP Interrupts (continued)  
EVT#  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75-77  
78  
79  
80  
81  
82  
83  
84  
85  
86  
87  
88  
89  
90  
91  
INTERRUPT NAME  
-
SOURCE  
Reserved  
PRU_EVTOUT6  
ECAP0  
PRU Interrupt  
ECAP0  
-
Reserved  
ECAP1  
ECAP1  
T64P1_TINT34  
GPIO_B2INT  
PRU_EVTOUT7  
ECAP2  
Timer64P1 Interrupt 34  
GPIO Bank 2 Interrupt  
PRU Interrupt  
ECAP2  
GPIO_B3INT  
EQEP1  
GPIO Bank 3 Interrupt  
EQEP1  
GPIO_B4INT  
EMIFA_INT  
GPIO Bank 4 Interrupt  
EMIFA  
EDMA3_CC0_ERRINT  
EDMA3_TC0_ERRINT  
EDMA3_TC1_ERRINT  
GPIO_B5INT  
EMIFB_INT  
EDMA3 Channel Controller 0  
EDMA3 Transfer Controller 0  
EDMA3 Transfer Controller 1  
GPIO Bank 5 Interrupt  
EMIFB Memory Error Interrupt  
McASP0,1 Combined RX/TX Interrupts  
GPIO Bank 6 Interrupt  
Reserved  
MCASP_INT  
GPIO_B6INT  
-
T64P0_TINT34  
GPIO_B0INT  
PRU_EVTOUT4  
SYSCFG_CHIPINT3  
EQEP0  
Timer64P0 Interrupt 34  
GPIO Bank 0 Interrupt  
PRU Interrupt  
SYSCFG_CHIPSIG Register  
EQEP0  
UART2_INT  
UART2  
PSC0_ALLINT  
PSC1_ALLINT  
GPIO_B7INT  
-
PSC0  
PSC1  
GPIO Bank 7 Interrupt  
Reserved  
MPU_BOOTCFG_ERR  
-
Shared MPU and SYSCFG Address/Protection Error Interrupt  
Reserved  
T64P0_CMPINT0  
T64P0_CMPINT1  
T64P0_CMPINT2  
T64P0_CMPINT3  
T64P0_CMPINT4  
T64P0_CMPINT5  
T64P0_CMPINT6  
T64P0_CMPINT7  
T64P1_CMPINT0  
T64P1_CMPINT1  
T64P1_CMPINT2  
T64P1_CMPINT3  
T64P1_CMPINT4  
T64P1_CMPINT5  
Timer64P0 - Compare 0  
Timer64P0 - Compare 1  
Timer64P0 - Compare 2  
Timer64P0 - Compare 3  
Timer64P0 - Compare 4  
Timer64P0 - Compare 5  
Timer64P0 - Compare 6  
Timer64P0 - Compare 7  
Timer64P1 - Compare 0  
Timer64P1 - Compare 1  
Timer64P1 - Compare 2  
Timer64P1 - Compare 3  
Timer64P1 - Compare 4  
Timer64P1 - Compare 5  
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Table 5-7. C6743 DSP Interrupts (continued)  
EVT#  
92  
INTERRUPT NAME  
T64P1_CMPINT6  
T64P1_CMPINT7  
-
SOURCE  
Timer64P1 - Compare 6  
Timer64P1 - Compare 7  
Reserved  
93  
94-95  
96  
INTERR  
C674x-Int Ctl  
C674x-EMC  
Reserved  
97  
EMC_IDMAERR  
-
98-112  
113  
PMC_ED  
C674x-PMC  
Reserved  
114-115  
116  
-
UMC_ED1  
UMC_ED2  
PDC_INT  
C674x-UMC  
C674x-UMC  
C674x-PDC  
C674x-SYS  
117  
118  
119  
SYS_CMPA  
PMC_CMPA  
PMC_CMPA  
DMC_CMPA  
DMC_CMPA  
UMC_CMPA  
UMC_CMPA  
EMC_CMPA  
EMC_BUSERR  
120  
C674x-PMC  
C674x-PMC  
C674x-DMC  
C674x-DMC  
C674x-UMC  
C674x-UMC  
C674x-EMC  
C674x-EMC  
121  
122  
123  
124  
125  
126  
127  
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Table 5-8. C674x DSP Interrupt Controller Registers  
BYTE ADDRESS  
0x0180 0000  
0x0180 0004  
0x0180 0008  
0x0180 000C  
0x0180 0020  
0x0180 0024  
0x0180 0028  
0x0180 002C  
0x0180 0040  
0x0180 0044  
0x0180 0048  
0x0180 004C  
0x0180 0080  
0x0180 0084  
0x0180 0088  
0x0180 008C  
0x0180 00A0  
0x0180 00A4  
0x0180 00A8  
0x0180 00AC  
0x0180 00C0  
0x0180 00C4  
0x0180 00C8  
0x0180 00CC  
0x0180 00E0  
0x0180 00E4  
0x0180 00E8  
0x0180 00EC  
REGISTER NAME  
EVTFLAG0  
EVTFLAG1  
EVTFLAG2  
EVTFLAG3  
EVTSET0  
REGISTER DESCRIPTION  
Event flag register 0  
Event flag register 1  
Event flag register 2  
Event flag register 3  
Event set register 0  
EVTSET1  
Event set register 1  
EVTSET2  
Event set register 2  
EVTSET3  
Event set register 3  
EVTCLR0  
Event clear register 0  
EVTCLR1  
Event clear register 1  
EVTCLR2  
Event clear register 2  
EVTCLR3  
Event clear register 3  
EVTMASK0  
EVTMASK1  
EVTMASK2  
EVTMASK3  
MEVTFLAG0  
MEVTFLAG1  
MEVTFLAG2  
MEVTFLAG3  
EXPMASK0  
EXPMASK1  
EXPMASK2  
EXPMASK3  
MEXPFLAG0  
MEXPFLAG1  
MEXPFLAG2  
MEXPFLAG3  
Event mask register 0  
Event mask register 1  
Event mask register 2  
Event mask register 3  
Masked event flag register 0  
Masked event flag register 1  
Masked event flag register 2  
Masked event flag register 3  
Exception mask register 0  
Exception mask register 1  
Exception mask register 2  
Exception mask register 3  
Masked exception flag register 0  
Masked exception flag register 1  
Masked exception flag register 2  
Masked exception flag register 3  
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5.8 General-Purpose Input/Output (GPIO)  
The GPIO peripheral provides general-purpose pins that can be configured as either inputs or outputs.  
When configured as an output, a write to an internal register can control the state driven on the output pin.  
When configured as an input, the state of the input is detectable by reading the state of an internal  
register. In addition, the GPIO peripheral can produce CPU interrupts and EDMA events in different  
interrupt/event generation modes. The GPIO peripheral provides generic connections to external devices.  
The GPIO pins are grouped into banks of 16 pins per bank (i.e., bank 0 consists of GPIO [0:15]). See the  
TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide (SPRUFK9) for more  
details.  
The GPIO peripheral supports the following:  
Up to 128 Pins on ZKB and up to 109 Pins on PTP package configurable as GPIO  
External Interrupt and DMA request Capability  
Every GPIO pin may be configured to generate an interrupt request on detection of rising and/or  
falling edges on the pin.  
The interrupt requests within each bank are combined (logical or) to create eight unique bank level  
interrupt requests.  
The bank level interrupt service routine may poll the INTSTATx register for its bank to determine  
which pin(s) have triggered the interrupt.  
GPIO Banks 0, 1, 2, 3, 4, 5, 6, and 7 Interrupts assigned to DSP Events 65, 41, 49, 52, 54, 59, 62  
and 72 respectively  
Additionally, GPIO Banks 0, 1, 2, 3, 4, and 5 Interrupts assigned to EDMA events 6, 7, 22, 23, 28,  
and 29 respectively.  
Set/clear functionality: Firmware writes 1 to corresponding bit position(s) to set or to clear GPIO  
signal(s). This allows multiple firmware processes to toggle GPIO output signals without critical section  
protection (disable interrupts, program GPIO, re-enable interrupts, to prevent context switching to  
anther process during GPIO programming).  
Separate Input/Output registers  
Output register in addition to set/clear so that, if preferred by firmware, some GPIO output signals can  
be toggled by direct write to the output register(s).  
Output register, when read, reflects output drive status. This, in addition to the input register reflecting  
pin status and open-drain I/O cell, allows wired logic be implemented.  
The memory map for the GPIO registers is shown in Table 5-9.  
5.8.1 GPIO Register Description(s)  
Table 5-9. GPIO Registers  
GPIO  
REGISTER NAME  
REGISTER DESCRIPTION  
BYTE ADDRESS  
0x01E2 6000  
0x01E2 6004  
0x01E2 6008  
REV  
Peripheral Revision Register  
-
Reserved  
BINTEN  
GPIO Interrupt Per-Bank Enable Register  
GPIO Banks 0 and 1  
0x01E2 6010  
0x01E2 6014  
0x01E2 6018  
0x01E2 601C  
0x01E2 6020  
0x01E2 6024  
0x01E2 6028  
0x01E2 602C  
DIR01  
GPIO Banks 0 and 1 Direction Register  
GPIO Banks 0 and 1 Output Data Register  
GPIO Banks 0 and 1 Set Data Register  
GPIO Banks 0 and 1 Clear Data Register  
GPIO Banks 0 and 1 Input Data Register  
GPIO Banks 0 and 1 Set Rising Edge Interrupt Register  
GPIO Banks 0 and 1 Clear Rising Edge Interrupt Register  
GPIO Banks 0 and 1 Set Falling Edge Interrupt Register  
OUT_DATA01  
SET_DATA01  
CLR_DATA01  
IN_DATA01  
SET_RIS_TRIG01  
CLR_RIS_TRIG01  
SET_FAL_TRIG01  
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Table 5-9. GPIO Registers (continued)  
GPIO  
REGISTER NAME  
REGISTER DESCRIPTION  
BYTE ADDRESS  
0x01E2 6030  
0x01E2 6034  
CLR_FAL_TRIG01  
INTSTAT01  
GPIO Banks 0 and 1 Clear Falling Edge Interrupt Register  
GPIO Banks 0 and 1 Interrupt Status Register  
GPIO Banks 2 and 3  
0x01E2 6038  
0x01E2 603C  
0x01E2 6040  
0x01E2 6044  
0x01E2 6048  
0x01E2 604C  
0x01E2 6050  
0x01E2 6054  
0x01E2 6058  
0x01E2 605C  
DIR23  
GPIO Banks 2 and 3 Direction Register  
OUT_DATA23  
SET_DATA23  
CLR_DATA23  
IN_DATA23  
GPIO Banks 2 and 3 Output Data Register  
GPIO Banks 2 and 3 Set Data Register  
GPIO Banks 2 and 3 Clear Data Register  
GPIO Banks 2 and 3 Input Data Register  
SET_RIS_TRIG23  
CLR_RIS_TRIG23  
SET_FAL_TRIG23  
CLR_FAL_TRIG23  
INTSTAT23  
GPIO Banks 2 and 3 Set Rising Edge Interrupt Register  
GPIO Banks 2 and 3 Clear Rising Edge Interrupt Register  
GPIO Banks 2 and 3 Set Falling Edge Interrupt Register  
GPIO Banks 2 and 3 Clear Falling Edge Interrupt Register  
GPIO Banks 2 and 3 Interrupt Status Register  
GPIO Banks 4 and 5  
0x01E2 6060  
0x01E2 6064  
0x01E2 6068  
0x01E2 606C  
0x01E2 6070  
0x01E2 6074  
0x01E2 6078  
0x01E2 607C  
0x01E2 6080  
0x01E2 6084  
DIR45  
GPIO Banks 4 and 5 Direction Register  
OUT_DATA45  
SET_DATA45  
CLR_DATA45  
IN_DATA45  
GPIO Banks 4 and 5 Output Data Register  
GPIO Banks 4 and 5 Set Data Register  
GPIO Banks 4 and 5 Clear Data Register  
GPIO Banks 4 and 5 Input Data Register  
SET_RIS_TRIG45  
CLR_RIS_TRIG45  
SET_FAL_TRIG45  
CLR_FAL_TRIG45  
INTSTAT45  
GPIO Banks 4 and 5 Set Rising Edge Interrupt Register  
GPIO Banks 4 and 5 Clear Rising Edge Interrupt Register  
GPIO Banks 4 and 5 Set Falling Edge Interrupt Register  
GPIO Banks 4 and 5 Clear Falling Edge Interrupt Register  
GPIO Banks 4 and 5 Interrupt Status Register  
GPIO Banks 6 and 7  
0x01E2 6088  
0x01E2 608C  
0x01E2 6090  
0x01E2 6094  
0x01E2 6098  
0x01E2 609C  
0x01E2 60A0  
0x01E2 60A4  
0x01E2 60A8  
0x01E2 60AC  
DIR67  
GPIO Banks 6 and 7 Direction Register  
OUT_DATA67  
SET_DATA67  
CLR_DATA67  
IN_DATA67  
GPIO Banks 6 and 7 Output Data Register  
GPIO Banks 6 and 7 Set Data Register  
GPIO Banks 6 and 7 Clear Data Register  
GPIO Banks 6 and 7 Input Data Register  
SET_RIS_TRIG67  
CLR_RIS_TRIG67  
SET_FAL_TRIG67  
CLR_FAL_TRIG67  
INTSTAT67  
GPIO Banks 6 and 7 Set Rising Edge Interrupt Register  
GPIO Banks 6 and 7 Clear Rising Edge Interrupt Register  
GPIO Banks 6 and 7 Set Falling Edge Interrupt Register  
GPIO Banks 6 and 7 Clear Falling Edge Interrupt Register  
GPIO Banks 6 and 7 Interrupt Status Register  
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5.8.2 GPIO Peripheral Input/Output Electrical Data/Timing  
Table 5-10. Timing Requirements for GPIO Inputs(1) (see Figure 5-10)  
NO.  
MIN MAX UNIT  
2C(1) (2)  
ns  
2C(1) (2)  
1
2
tw(GPIH)  
tw(GPIL)  
Pulse duration, GPIx high  
Pulse duration, GPIx low  
(1) The pulse width given is sufficient to generate a CPU interrupt or an EDMA event. However, if a user wants to have the device  
recognize the GPIx changes through software polling of the GPIO register, the GPIx duration must be extended to allow the device  
enough time to access the GPIO register through the internal bus.  
(2) C=SYSCLK4 period in ns.  
Table 5-11. Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs  
(see Figure 5-10)  
NO.  
3
PARAMETER  
MIN MAX UNIT  
tw(GPOH)  
tw(GPOL)  
Pulse duration, GPOx high  
Pulse duration, GPOx low  
2C(1) (2)  
2C(1) (2)  
ns  
ns  
4
(1) This parameter value should not be used as a maximum performance specification. Actual performance of back-to-back accesses of the  
GPIO is dependent upon internal bus activity.  
(2) C=SYSCLK4 period in ns.  
2
1
GPn[m] as input  
4
3
GPn[m] as output  
Figure 5-10. GPIO Port Timing  
5.8.3 GPIO Peripheral External Interrupts Electrical Data/Timing  
Table 5-12. Timing Requirements for External Interrupts(1) (see Figure 5-11)  
NO.  
1
MIN MAX UNIT  
2C(1) (2)  
ns  
2C(1) (2)  
tw(ILOW)  
tw(IHIGH)  
Width of the external interrupt pulse low  
Width of the external interrupt pulse high  
2
(1) The pulse width given is sufficient to generate an interrupt or an EDMA event. However, if a user wants to have the device recognize the  
GPIO changes through software polling of the GPIO register, the GPIO duration must be extended to allow the device enough time to  
access the GPIO register through the internal bus.  
(2) C=SYSCLK4 period in ns.  
2
1
GPn[m] as input  
Figure 5-11. GPIO External Interrupt Timing  
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5.9 EDMA  
Table 5-13 is the list of EDMA3 Channel Contoller Registers and Table 5-14 is the list of EDMA3 Transfer  
Controller registers. See the TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide  
(SPRUFK9) for more details.  
Table 5-13. EDMA3 Channel Controller (EDMA3CC) Registers  
BYTE ADDRESS  
0x01C0 0000  
REGISTER NAME  
PID  
REGISTER DESCRIPTION  
Peripheral Identification Register  
EDMA3CC Configuration Register  
0x01C0 0004  
CCCFG  
Global Registers  
0x01C0 0200  
0x01C0 0204  
0x01C0 0208  
0x01C0 020C  
0x01C0 0210  
0x01C0 0214  
0x01C0 0218  
0x01C0 021C  
0x01C0 0240  
0x01C0 0244  
0x01C0 0248  
0x01C0 024C  
0x01C0 0260  
0x01C0 0284  
0x01C0 0300  
0x01C0 0308  
0x01C0 0310  
0x01C0 0314  
0x01C0 0318  
0x01C0 031C  
0x01C0 0320  
0x01C0 0340  
0x01C0 0348  
0x01C0 0350  
0x01C0 0358  
0x01C0 0380  
0x01C0 0384  
0x01C0 0388  
0x01C0 038C  
0x01C0 0400 - 0x01C0 043C  
0x01C0 0440 - 0x01C0 047C  
0x01C0 0600  
0x01C0 0604  
0x01C0 0620  
0x01C0 0640  
QCHMAP0  
QCHMAP1  
QCHMAP2  
QCHMAP3  
QCHMAP4  
QCHMAP5  
QCHMAP6  
QCHMAP7  
DMAQNUM0  
DMAQNUM1  
DMAQNUM2  
DMAQNUM3  
QDMAQNUM  
QUEPRI  
QDMA Channel 0 Mapping Register  
QDMA Channel 1 Mapping Register  
QDMA Channel 2 Mapping Register  
QDMA Channel 3 Mapping Register  
QDMA Channel 4 Mapping Register  
QDMA Channel 5 Mapping Register  
QDMA Channel 6 Mapping Register  
QDMA Channel 7 Mapping Register  
DMA Channel Queue Number Register 0  
DMA Channel Queue Number Register 1  
DMA Channel Queue Number Register 2  
DMA Channel Queue Number Register 3  
QDMA Channel Queue Number Register  
Queue Priority Register(1)  
EMR  
Event Missed Register  
EMCR  
Event Missed Clear Register  
QEMR  
QDMA Event Missed Register  
QEMCR  
QDMA Event Missed Clear Register  
EDMA3CC Error Register  
CCERR  
CCERRCLR  
EEVAL  
EDMA3CC Error Clear Register  
Error Evaluate Register  
DRAE0  
DMA Region Access Enable Register for Region 0  
DMA Region Access Enable Register for Region 1  
DMA Region Access Enable Register for Region 2  
DMA Region Access Enable Register for Region 3  
QDMA Region Access Enable Register for Region 0  
QDMA Region Access Enable Register for Region 1  
QDMA Region Access Enable Register for Region 2  
QDMA Region Access Enable Register for Region 3  
Event Queue Entry Registers Q0E0-Q0E15  
Event Queue Entry Registers Q1E0-Q1E15  
Queue 0 Status Register  
DRAE1  
DRAE2  
DRAE3  
QRAE0  
QRAE1  
QRAE2  
QRAE3  
Q0E0-Q0E15  
Q1E0-Q1E15  
QSTAT0  
QSTAT1  
Queue 1 Status Register  
QWMTHRA  
CCSTAT  
Queue Watermark Threshold A Register  
EDMA3CC Status Register  
(1) On previous architectures, the EDMA3TC priority was controlled by the queue priority register (QUEPRI) in the EDMA3CC memory-  
map. However for this device, the priority control for the transfer controllers is controlled by the chip-level registers in the System  
Configuration Module. You should use the chip-level registers and not QUEPRI to configure the TC priority.  
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Table 5-13. EDMA3 Channel Controller (EDMA3CC) Registers (continued)  
BYTE ADDRESS  
REGISTER NAME  
REGISTER DESCRIPTION  
Global Channel Registers  
0x01C0 1000  
0x01C0 1008  
0x01C0 1010  
0x01C0 1018  
0x01C0 1020  
0x01C0 1028  
0x01C0 1030  
0x01C0 1038  
0x01C0 1040  
0x01C0 1050  
0x01C0 1058  
0x01C0 1060  
0x01C0 1068  
0x01C0 1070  
0x01C0 1078  
0x01C0 1080  
0x01C0 1084  
0x01C0 1088  
0x01C0 108C  
0x01C0 1090  
0x01C0 1094  
ER  
Event Register  
ECR  
Event Clear Register  
ESR  
Event Set Register  
CER  
Chained Event Register  
EER  
Event Enable Register  
EECR  
EESR  
SER  
Event Enable Clear Register  
Event Enable Set Register  
Secondary Event Register  
Secondary Event Clear Register  
Interrupt Enable Register  
Interrupt Enable Clear Register  
Interrupt Enable Set Register  
Interrupt Pending Register  
Interrupt Clear Register  
SECR  
IER  
IECR  
IESR  
IPR  
ICR  
IEVAL  
QER  
Interrupt Evaluate Register  
QDMA Event Register  
QEER  
QEECR  
QEESR  
QSER  
QSECR  
QDMA Event Enable Register  
QDMA Event Enable Clear Register  
QDMA Event Enable Set Register  
QDMA Secondary Event Register  
QDMA Secondary Event Clear Register  
Shadow Region 0 Channel Registers  
0x01C0 2000  
0x01C0 2008  
0x01C0 2010  
0x01C0 2018  
0x01C0 2020  
0x01C0 2028  
0x01C0 2030  
0x01C0 2038  
0x01C0 2040  
0x01C0 2050  
0x01C0 2058  
0x01C0 2060  
0x01C0 2068  
0x01C0 2070  
0x01C0 2078  
0x01C0 2080  
0x01C0 2084  
0x01C0 2088  
0x01C0 208C  
0x01C0 2090  
0x01C0 2094  
ER  
Event Register  
ECR  
Event Clear Register  
ESR  
Event Set Register  
CER  
Chained Event Register  
EER  
Event Enable Register  
EECR  
EESR  
SER  
Event Enable Clear Register  
Event Enable Set Register  
Secondary Event Register  
Secondary Event Clear Register  
Interrupt Enable Register  
Interrupt Enable Clear Register  
Interrupt Enable Set Register  
Interrupt Pending Register  
Interrupt Clear Register  
SECR  
IER  
IECR  
IESR  
IPR  
ICR  
IEVAL  
QER  
Interrupt Evaluate Register  
QDMA Event Register  
QEER  
QEECR  
QEESR  
QSER  
QSECR  
QDMA Event Enable Register  
QDMA Event Enable Clear Register  
QDMA Event Enable Set Register  
QDMA Secondary Event Register  
QDMA Secondary Event Clear Register  
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Table 5-13. EDMA3 Channel Controller (EDMA3CC) Registers (continued)  
BYTE ADDRESS  
REGISTER NAME  
REGISTER DESCRIPTION  
Shadow Region 1 Channel Registers  
0x01C0 2200  
0x01C0 2208  
0x01C0 2210  
0x01C0 2218  
0x01C0 2220  
0x01C0 2228  
0x01C0 2230  
0x01C0 2238  
0x01C0 2240  
0x01C0 2250  
0x01C0 2258  
0x01C0 2260  
0x01C0 2268  
0x01C0 2270  
0x01C0 2278  
0x01C0 2280  
0x01C0 2284  
0x01C0 2288  
0x01C0 228C  
0x01C0 2290  
0x01C0 2294  
0x01C0 4000 - 0x01C0 4FFF  
ER  
Event Register  
ECR  
Event Clear Register  
ESR  
Event Set Register  
CER  
Chained Event Register  
EER  
Event Enable Register  
EECR  
EESR  
SER  
Event Enable Clear Register  
Event Enable Set Register  
Secondary Event Register  
Secondary Event Clear Register  
Interrupt Enable Register  
Interrupt Enable Clear Register  
Interrupt Enable Set Register  
Interrupt Pending Register  
Interrupt Clear Register  
SECR  
IER  
IECR  
IESR  
IPR  
ICR  
IEVAL  
QER  
QEER  
QEECR  
QEESR  
QSER  
QSECR  
Interrupt Evaluate Register  
QDMA Event Register  
QDMA Event Enable Register  
QDMA Event Enable Clear Register  
QDMA Event Enable Set Register  
QDMA Secondary Event Register  
QDMA Secondary Event Clear Register  
Parameter RAM (PaRAM)  
Table 5-14. EDMA3 Transfer Controller (EDMA3TC) Registers  
TRANSFER  
TRANSFER  
REGISTER NAME REGISTER DESCRIPTION  
CONTROLLER 0  
BYTE ADDRESS  
CONTROLLER 1  
BYTE ADDRESS  
0x01C0 8000  
0x01C0 8004  
0x01C0 8100  
0x01C0 8120  
0x01C0 8124  
0x01C0 8128  
0x01C0 812C  
0x01C0 8130  
0x01C0 8140  
0x01C0 8240  
0x01C0 8244  
0x01C0 8248  
0x01C0 824C  
0x01C0 8250  
0x01C0 8254  
0x01C0 8258  
0x01C0 825C  
0x01C0 8260  
0x01C0 8280  
0x01C0 8284  
0x01C0 8400  
0x01C0 8404  
0x01C0 8500  
0x01C0 8520  
0x01C0 8524  
0x01C0 8528  
0x01C0 852C  
0x01C0 8530  
0x01C0 8540  
0x01C0 8640  
0x01C0 8644  
0x01C0 8648  
0x01C0 864C  
0x01C0 8650  
0x01C0 8654  
0x01C0 8658  
0x01C0 865C  
0x01C0 8660  
0x01C0 8680  
0x01C0 8684  
PID  
Peripheral Identification Register  
EDMA3TC Configuration Register  
EDMA3TC Channel Status Register  
Error Status Register  
TCCFG  
TCSTAT  
ERRSTAT  
ERREN  
Error Enable Register  
ERRCLR  
ERRDET  
ERRCMD  
RDRATE  
SAOPT  
Error Clear Register  
Error Details Register  
Error Interrupt Command Register  
Read Command Rate Register  
Source Active Options Register  
SASRC  
Source Active Source Address Register  
Source Active Count Register  
SACNT  
SADST  
Source Active Destination Address Register  
Source Active B-Index Register  
SABIDX  
SAMPPRXY  
SACNTRLD  
SASRCBREF  
SADSTBREF  
DFCNTRLD  
DFSRCBREF  
Source Active Memory Protection Proxy Register  
Source Active Count Reload Register  
Source Active Source Address B-Reference Register  
Source Active Destination Address B-Reference Register  
Destination FIFO Set Count Reload Register  
Destination FIFO Set Source Address B-Reference Register  
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Table 5-14. EDMA3 Transfer Controller (EDMA3TC) Registers (continued)  
TRANSFER  
TRANSFER  
REGISTER NAME REGISTER DESCRIPTION  
CONTROLLER 0  
BYTE ADDRESS  
CONTROLLER 1  
BYTE ADDRESS  
0x01C0 8288  
0x01C0 8300  
0x01C0 8304  
0x01C0 8308  
0x01C0 830C  
0x01C0 8310  
0x01C0 8314  
0x01C0 8340  
0x01C0 8344  
0x01C0 8348  
0x01C0 834C  
0x01C0 8350  
0x01C0 8354  
0x01C0 8380  
0x01C0 8384  
0x01C0 8388  
0x01C0 838C  
0x01C0 8390  
0x01C0 8394  
0x01C0 83C0  
0x01C0 83C4  
0x01C0 83C8  
0x01C0 83CC  
0x01C0 83D0  
0x01C0 83D4  
0x01C0 8688  
0x01C0 8700  
0x01C0 8704  
0x01C0 8708  
0x01C0 870C  
0x01C0 8710  
0x01C0 8714  
0x01C0 8740  
0x01C0 8744  
0x01C0 8748  
0x01C0 874C  
0x01C0 8750  
0x01C0 8754  
0x01C0 8780  
0x01C0 8784  
0x01C0 8788  
0x01C0 878C  
0x01C0 8790  
0x01C0 8794  
0x01C0 87C0  
0x01C0 87C4  
0x01C0 87C8  
0x01C0 87CC  
0x01C0 87D0  
0x01C0 87D4  
DFDSTBREF  
DFOPT0  
Destination FIFO Set Destination Address B-Reference Register  
Destination FIFO Options Register 0  
DFSRC0  
Destination FIFO Source Address Register 0  
Destination FIFO Count Register 0  
DFCNT0  
DFDST0  
Destination FIFO Destination Address Register 0  
Destination FIFO B-Index Register 0  
DFBIDX0  
DFMPPRXY0  
DFOPT1  
Destination FIFO Memory Protection Proxy Register 0  
Destination FIFO Options Register 1  
DFSRC1  
Destination FIFO Source Address Register 1  
Destination FIFO Count Register 1  
DFCNT1  
DFDST1  
Destination FIFO Destination Address Register 1  
Destination FIFO B-Index Register 1  
DFBIDX1  
DFMPPRXY1  
DFOPT2  
Destination FIFO Memory Protection Proxy Register 1  
Destination FIFO Options Register 2  
DFSRC2  
Destination FIFO Source Address Register 2  
Destination FIFO Count Register 2  
DFCNT2  
DFDST2  
Destination FIFO Destination Address Register 2  
Destination FIFO B-Index Register 2  
DFBIDX2  
DFMPPRXY2  
DFOPT3  
Destination FIFO Memory Protection Proxy Register 2  
Destination FIFO Options Register 3  
DFSRC3  
Destination FIFO Source Address Register 3  
Destination FIFO Count Register 3  
DFCNT3  
DFDST3  
Destination FIFO Destination Address Register 3  
Destination FIFO B-Index Register 3  
DFBIDX3  
DFMPPRXY3  
Destination FIFO Memory Protection Proxy Register 3  
Table 5-15 shows an abbreviation of the set of registers which make up the parameter set for each of 128  
EDMA events. Each of the parameter register sets consist of 8 32-bit word entries. Table 5-16 shows the  
parameter set entry registers with relative memory address locations within each of the parameter sets.  
Table 5-15. EDMA Parameter Set RAM  
HEX ADDRESS RANGE  
0x01C0 4000 - 0x01C0 401F  
0x01C0 4020 - 0x01C0 403F  
0x01C0 4040 - 0x01cC0 405F  
0x01C0 4060 - 0x01C0 407F  
0x01C0 4080 - 0x01C0 409F  
0x01C0 40A0 - 0x01C0 40BF  
...  
DESCRIPTION  
Parameters Set 0 (8 32-bit words)  
Parameters Set 1 (8 32-bit words)  
Parameters Set 2 (8 32-bit words)  
Parameters Set 3 (8 32-bit words)  
Parameters Set 4 (8 32-bit words)  
Parameters Set 5 (8 32-bit words)  
...  
0x01C0 4FC0 - 0x01C0 4FDF  
0x01C0 4FE0 - 0x01C0 4FFF  
Parameters Set 126 (8 32-bit words)  
Parameters Set 127 (8 32-bit words)  
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Table 5-16. Parameter Set Entries  
HEX OFFSET ADDRESS  
WITHIN THE PARAMETER SET  
ACRONYM  
PARAMETER ENTRY  
0x0000  
0x0004  
0x0008  
0x000C  
0x0010  
0x0014  
0x0018  
0x001C  
OPT  
SRC  
Option  
Source Address  
A_B_CNT  
DST  
A Count, B Count  
Destination Address  
SRC_DST_BIDX  
LINK_BCNTRLD  
SRC_DST_CIDX  
CCNT  
Source B Index, Destination B Index  
Link Address, B Count Reload  
Source C Index, Destination C Index  
C Count  
Table 5-17. EDMA Events  
EVENT  
EVENT NAME / SOURCE  
McASP0 Receive  
EVENT  
EVENT NAME / SOURCE  
0
1
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
MMCSD Receive  
MMCSD Transmit  
-
McASP0 Transmit  
McASP1 Receive  
McASP1 Transmit  
-
2
3
-
4
PRU_EVTOUT6  
PRU_EVTOUT7  
GPIO Bank 2 Interrupt  
GPIO Bank 3 Interrupt  
I2C0 Receive  
5
-
6
GPIO Bank 0 Interrupt  
GPIO Bank 1 Interrupt  
UART0 Receive  
UART0 Transmit  
Timer64P0 Event Out 12  
Timer64P0 Event Out 34  
-
7
8
9
I2C0 Transmit  
10  
11  
12  
13  
14  
15  
I2C1 Receive  
I2C1 Transmit  
GPIO Bank 4 Interrupt  
GPIO Bank 5 Interrupt  
UART2 Receive  
UART2 Transmit  
-
SPI0 Receive  
SPI0 Transmit  
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5.10 External Memory Interface A (EMIFA)  
EMIFA is one of two external memory interfaces supported on the device. It is primarily intended to  
support asynchronous memory types, such as NAND and NOR flash and Asynchronous SRAM. See the  
TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide (SPRUFK9) for more  
details.  
5.10.1 EMIFA Asynchronous Memory Support  
EMIFA supports asynchronous:  
SRAM memories  
NAND Flash memories  
NOR Flash memories  
The EMIFA data bus width is up to 16-bits on the ZKB package and 8 bits on the PTP package. Both  
devices support up to fifteen address lines and an external wait/interrupt input. Up to four asynchronous  
chip selects are supported by EMIFA (EMA_CS[5:2]) . All four chip selects are available on the ZKB  
package. Two of the four are available on the PTP package (EMA_CS[3:2]).  
Each chip select has the following individually programmable attributes:  
Data Bus Width  
Read cycle timings: setup, hold, strobe  
Write cycle timings: setup, hold, strobe  
Bus turn around time  
Extended Wait Option With Programmable Timeout  
Select Strobe Option  
NAND flash controller supports 1-bit and 4-bit ECC calculation on blocks of 512 bytes.  
5.10.2 EMIFA Connection Examples  
A likely use case with more than one EMIFA chip select used for NAND flash is illustrated in Figure 5-12.  
This figure shows how two multiplane NAND flash devices with two chip selects each would connect to the  
EMIFA. In this case if NAND is the boot memory, then the boot image needs to be stored in the NAND  
area selected by EMA_CS[3]. Part of the application image could spill over into the NAND regions  
selected by other EMIFA chip selects; but would rely on the code stored in the EMA_CS[3] area to  
bootload it.  
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EMA_A[1]  
EMA_A[2]  
ALE  
CLE  
DQ[7:0]  
CE1  
CE2  
WE  
EMA_D[7:0]  
EMA_CS[2]  
EMA_CS[3]  
EMA_WE  
NAND  
FLASH  
x8,  
MultiPlane  
EMA_OE  
RE  
EMIFA  
R/B1  
R/B2  
EMA_WAIT  
DVDD  
ALE  
CLE  
DQ[7:0]  
CE1  
CE2  
WE  
NAND  
FLASH  
x8,  
EMA_CS[4]  
EMA_CS[5]  
MultiPlane  
RE  
R/B1  
R/B2  
Figure 5-12. C6743 EMIFA Connection Diagram: Multiple NAND Flash Planes  
5.10.3 External Memory Interface (EMIF) Registers  
Table 5-18 is a list of the EMIF registers.  
Table 5-18. External Memory Interface (EMIFA) Registers  
BYTE ADDRESS  
0x6800 0000  
0x6800 0004  
0x6800 0008  
0x6800 000C  
0x6800 0010  
0x6800 0014  
0x6800 0018  
0x6800 001C  
0x6800 0020  
0x6800 003C  
0x6800 0040  
0x6800 0044  
0x6800 0048  
0x6800 004C  
0x6800 0060  
0x6800 0064  
0x6800 0070  
0x6800 0074  
0x6800 0078  
0x6800 007C  
0x6800 00BC  
0x6800 00C0  
0x6800 00C4  
0x6800 00C8  
REGISTER NAME  
MIDR  
REGISTER DESCRIPTION  
Module ID Register  
AWCC  
Asynchronous Wait Cycle Configuration Register  
SDRAM Configuration Register (Not supported)  
SDRAM Refresh Control Register (Not supported)  
Asynchronous 1 Configuration Register  
Asynchronous 2 Configuration Register  
Asynchronous 3 Configuration Register  
Asynchronous 4 Configuration Register  
SDRAM Timing Register (Not supported)  
SDRAM Self Refresh Exit Timing Register (Not supported)  
EMIFA Interrupt Raw Register  
SDCR  
SDRCR  
CE2CFG  
CE3CFG  
CE4CFG  
CE5CFG  
SDTIMR  
SDSRETR  
INTRAW  
INTMSK  
EMIFA Interrupt Mask Register  
INTMSKSET  
INTMSKCLR  
NANDFCR  
NANDFSR  
NANDF1ECC  
NANDF2ECC  
NANDF3ECC  
NANDF4ECC  
NAND4BITECCLOAD  
NAND4BITECC1  
NAND4BITECC2  
NAND4BITECC3  
EMIFA Interrupt Mask Set Register  
EMIFA Interrupt Mask Clear Register  
NAND Flash Control Register  
NAND Flash Status Register  
NAND Flash 1 ECC Register (CS2 Space)  
NAND Flash 2 ECC Register (CS3 Space)  
NAND Flash 3 ECC Register (CS4 Space)  
NAND Flash 4 ECC Register (CS5 Space)  
NAND Flash 4-Bit ECC Load Register  
NAND Flash 4-Bit ECC Register 1  
NAND Flash 4-Bit ECC Register 2  
NAND Flash 4-Bit ECC Register 3  
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Table 5-18. External Memory Interface (EMIFA) Registers (continued)  
BYTE ADDRESS  
REGISTER NAME  
NAND4BITECC4  
NANDERRADD1  
NANDERRADD2  
NANDERRVAL1  
NANDERRVAL2  
REGISTER DESCRIPTION  
0x6800 00CC  
0x6800 00D0  
0x6800 00D4  
0x6800 00D8  
0x6800 00DC  
NAND Flash 4-Bit ECC Register 4  
NAND Flash 4-Bit ECC Error Address Register 1  
NAND Flash 4-Bit ECC Error Address Register 2  
NAND Flash 4-Bit ECC Error Value Register 1  
NAND Flash 4-Bit ECC Error Value Register 2  
5.10.4 EMIFA Electrical Data/Timing  
Table 5-19 and Table 5-20 assume testing over recommended operating conditions.  
Table 5-19. EMIFA Asynchronous Memory Timing Requirements(1)  
NO.  
MIN  
NOM  
MAX  
UNIT  
READS and WRITES  
Cycle time, EMIFA module clock  
E
2
tc(CLK)  
10  
2E  
ns  
ns  
tw(EM_WAIT)  
Pulse duration, EM_WAIT assertion and deassertion  
READS  
12 tsu(EMDV-EMOEH)  
13 th(EMOEH-EMDIV)  
14 tsu (EMOEL-EMWAIT)  
Setup time, EMA_D[15:0] valid before EM_OE high  
Hold time, EMA_D[15:0] valid after EM_OE high  
Setup time, EM_WAIT asserted before end of Strobe Phase(2)  
WRITES  
3
0
ns  
ns  
ns  
4E+3  
28 tsu (EMWEL-EMWAIT) Setup time, EM_WAIT asserted before end of Strobe Phase(2)  
4E+3  
ns  
(1) E = EMA_CLK period or in ns. EMA_CLK is selected either as SYSCLK3 or the PLL output clock divided by 4.5. As an example, when  
SYSCLK3 is selected and set to 100MHz, E=10ns.  
(2) Setup before end of STROBE phase (if no extended wait states are inserted) by which EM_WAIT must be asserted to add extended  
wait states. Figure 5-15 and Figure 5-16 describe EMIF transactions that include extended wait states inserted during the STROBE  
phase. However, cycles inserted as part of this extended wait period should not be counted; the 4E requirement is to the start of where  
the HOLD phase would begin if there were no extended wait cycles.  
Table 5-20. EMIFA Asynchronous Memory Switching Characteristics(1) (2) (3)  
NO.  
PARAMETER  
MIN  
NOM  
MAX UNIT  
READS and WRITES  
(TA)*E-3  
1
td(TURNAROUND)  
Turn around time  
(TA)*E  
(TA)*E+3  
ns  
READS  
(RS+RST+RH)*E-3  
EMIF read cycle time (EW = 0)  
EMIF read cycle time (EW = 1)  
(RS+RST+RH)*E  
(RS+RST+RH)*E+3  
ns  
ns  
3
4
tc(EMRCYCLE)  
(RS+RST+RH+(EWC*16))*E-3 (RS+RST+RH+(EWC*16))*E  
(RS+RST+RH+(EWC*16))*E+3  
Output setup time,  
EMA_CE[5:2] low to EMA_OE low (SS = 0)  
(RS)*E-3  
-3  
(RS)*E  
0
(RS)*E+3  
+3  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tsu(EMCEL-EMOEL)  
Output setup time,  
EMA_CE[5:2] low to EMA_OE low (SS = 1)  
Output hold time,  
EMA_OE high to EMA_CE[5:2] high (SS = 0)  
(RH)*E-3  
-3  
(RH)*E  
0
(RH)*E+3  
+3  
5
th(EMOEH-EMCEH)  
Output hold time,  
EMA_OE high to EMA_CE[5:2] high (SS = 1)  
Output setup time,  
EMA_BA[1:0] valid to EMA_OE low  
6
7
8
tsu(EMBAV-EMOEL)  
th(EMOEH-EMBAIV)  
tsu(EMBAV-EMOEL)  
(RS)*E-3  
(RH)*E-3  
(RS)*E-3  
(RS)*E  
(RH)*E  
(RS)*E  
(RS)*E+3  
(RH)*E+3  
(RS)*E+3  
Output hold time,  
EMA_OE high to EMA_BA[1:0] invalid  
Output setup time,  
EMA_A[13:0] valid to EMA_OE low  
(1) TA = Turn around, RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold,  
MEWC = Maximum external wait cycles. These parameters are programmed via the Asynchronous Bank and Asynchronous Wait Cycle  
Configuration Registers. These support the following range of values: TA[4-1], RS[16-1], RST[64-1], RH[8-1], WS[16-1], WST[64-1],  
WH[8-1], and MEW[1-256].  
(2) E = EMA_CLK period or in ns. EMA_CLK is selected either as SYSCLK3 or the PLL output clock divided by 4.5. As an example, when  
SYSCLK3 is selected and set to 100MHz, E=10ns.  
(3) EWC = external wait cycles determined by EMA_WAIT input signal. EWC supports the following range of values EWC[256-1]. Note that  
the maximum wait time before timeout is specified by bit field MEWC in the Asynchronous Wait Cycle Configuration Register.  
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MAX UNIT  
Table 5-20. EMIFA Asynchronous Memory Switching Characteristics(1) (2) (3) (continued)  
NO.  
PARAMETER  
MIN  
NOM  
Output hold time,  
9
th(EMOEH-EMAIV)  
(RH)*E-3  
(RH)*E  
(RH)*E+3  
ns  
EMA_OE high to EMA_A[13:0] invalid  
EMA_OE active low width (EW = 0)  
EMA_OE active low width (EW = 1)  
(RST)*E-3  
(RST)*E  
(RST)*E+3  
ns  
ns  
10 tw(EMOEL)  
(RST+(EWC*16))*E-3  
(RST+(EWC*16))*E  
(RST+(EWC*16))*E+3  
Delay time from EMA_WAIT deasserted to  
EMA_OE high  
11 td(EMWAITH-EMOEH)  
3E-3  
4E  
4E+3  
ns  
WRITES  
EMIF write cycle time (EW = 0)  
EMIF write cycle time (EW = 1)  
(WS+WST+WH)*E-3  
(WS+WST+WH)*E  
(WS+WST+WH)*E+3  
ns  
ns  
15 tc(EMWCYCLE)  
(WS+WST+WH+(EWC*16))*E-3 (WS+WST+WH+(EWC*16))*E (WS+WST+WH+(EWC*16))*E+3  
Output setup time,  
EMA_CE[5:2] low to EMA_WE low (SS = 0)  
(WS)*E-3  
-3  
(WS)*E  
0
(WS)*E+3  
+3  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
16 tsu(EMCEL-EMWEL)  
Output setup time,  
EMA_CE[5:2] low to EMA_WE low (SS = 1)  
Output hold time,  
EMA_WE high to EMA_CE[5:2] high (SS = 0)  
(WH)*E-3  
-3  
(WH)*E  
0
(WH)*E+3  
+3  
17 th(EMWEH-EMCEH)  
Output hold time,  
EMA_WE high to EMA_CE[5:2] high (SS = 1)  
Output setup time,  
EMA_BA[1:0] valid to EMA_WE low  
18 tsu(EMDQMV-EMWEL)  
19 th(EMWEH-EMDQMIV)  
20 tsu(EMBAV-EMWEL)  
21 th(EMWEH-EMBAIV)  
22 tsu(EMAV-EMWEL)  
23 th(EMWEH-EMAIV)  
(WS)*E-3  
(WH)*E-3  
(WS)*E-3  
(WH)*E-3  
(WS)*E-3  
(WH)*E-3  
(WS)*E  
(WH)*E  
(WS)*E  
(WH)*E  
(WS)*E  
(WH)*E  
(WS)*E+3  
(WH)*E+3  
(WS)*E+3  
(WH)*E+3  
(WS)*E+3  
(WH)*E+3  
Output hold time,  
EMA_WE high to EMA_BA[1:0] invalid  
Output setup time,  
EMA_BA[1:0] valid to EMA_WE low  
Output hold time,  
EMA_WE high to EMA_BA[1:0] invalid  
Output setup time,  
EMA_A[13:0] valid to EMA_WE low  
Output hold time,  
EMA_WE high to EMA_A[13:0] invalid  
EMA_WE active low width (EW = 0)  
EMA_WE active low width (EW = 1)  
(WST)*E-3  
(WST)*E  
(WST)*E+3  
ns  
ns  
24 tw(EMWEL)  
(WST+(EWC*16))*E-3  
(WST+(EWC*16))*E  
(WST+(EWC*16))*E+3  
Delay time from EMA_WAIT deasserted to  
EMA_WE high  
25 td(EMWAITH-EMWEH)  
26 tsu(EMDV-EMWEL)  
27 th(EMWEH-EMDIV)  
3E-3  
(WS)*E-3  
(WH)*E-3  
4E  
(WS)*E  
(WH)*E  
4E+3  
(WS)*E+3  
(WH)*E+3  
ns  
ns  
ns  
Output setup time,  
EMA_D[15:0] valid to EMA_WE low  
Output hold time,  
EMA_WE high to EMA_D[15:0] invalid  
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3
1
EMA_CS[5:2]  
EMA_BA[1:0]  
EMA_A[22:0]  
EMA_WE_DQM[1:0]  
EMA_A_RW  
1
4
8
5
9
7
6
10  
EMA_OE  
13  
12  
EMA_D[15:0]  
EMA_WE  
Figure 5-13. Asynchronous Memory Read Timing for EMIFA  
15  
1
EMA_CS[5:2]  
EMA_BA[1:0]  
EMA_A[22:0]  
EMA_WE_DQM[1:0]  
EMA_A_RW  
16  
18  
20  
22  
17  
19  
21  
23  
1
24  
EMA_WE  
26  
27  
EMA_D[15:0]  
EMA_OE  
Figure 5-14. Asynchronous Memory Write Timing for EMIFA  
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SETUP  
STROBE  
Extended Due to EMA_WAIT  
STROBE HOLD  
EMA_CS[5:2]  
EMA_BA[1:0]  
EMA_A[12:0]  
EMA_D[15:0]  
EMA_A_RW  
14  
11  
EMA_OE  
2
2
EMA_WAIT  
Asserted  
Deasserted  
Figure 5-15. EMA_WAIT Read Timing Requirements  
Figure 5-16. EMA_WAIT Write Timing Requirements  
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5.11 External Memory Interface B (EMIFB)  
Figure 5-17, EMIFB Functional Block Diagram illustrates a high-level view of the EMIFB and its  
connections within the device. Multiple requesters have access to EMIFB through a switched central  
resource (indicated as crossbar in the figure). The EMIFB implements a split transaction internal bus,  
allowing concurrence between reads and writes from the various requesters. See the  
TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide (SPRUFK9) for more  
details.  
EMIFB  
Registers  
CPU  
EMB_CS  
EMB_CAS  
EDMA  
Cmd/Write  
FIFO  
EMB_RAS  
EMB_WE  
Crossbar  
MPU2  
Master  
Peripherals  
(USB, UHPI...)  
EMB_CLK  
SDRAM  
Interface  
EMB_SDCKE  
EMB_BA[1:0]  
EMB_A[x:0]  
Read  
FIFO  
EMB_D[x:0]  
EMB_WE_DQM[x:0]  
Figure 5-17. EMIFB Functional Block Diagram  
EMIFB supports a 3.3V LVCMOS Interface.  
5.11.1 EMIFB SDRAM Loading Limitations  
EMIFB supports SDRAM up to 152MHz with up to two SDRAM or asynchronous memory loads. Additional  
loads will limit the SDRAM operation to lower speeds and the maximum speed should be confirmed by  
board simulation using IBIS models.  
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5.11.2 Interfacing to SDRAM  
The EMIFB supports a glueless interface to SDRAM devices with the following characteristics:  
Pre-charge bit is A[10]  
Supports 8, 9, 10 or 11 column address bits.  
Supports up to 13 row address bits is 13.  
Supports 1, 2 or 4 internal banks.  
Table 5-21 shows the supported SDRAM configurations for EMIFB.  
Table 5-21. EMIFB Supported SDRAM Configurations(1)  
SDRAM  
Memory  
Data  
Bus Width  
(bits)  
Memory  
Density  
(Mbits)  
Number of EMIFB Data  
Total Memory Total Memory  
Rows  
Columns  
Banks  
Memories  
Bus Size  
(Mbits)  
(Mbytes)  
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
13  
13  
13  
13  
13  
13  
13  
13  
13  
13  
13  
13  
13  
13  
13  
13  
13  
13  
13  
13  
13  
13  
13  
13  
8
8
1
2
4
1
2
4
1
2
4
1
2
4
1
2
4
1
2
4
1
2
4
1
2
4
32  
64  
4
8
32  
64  
8
128  
64  
16  
8
128  
64  
9
9
128  
256  
128  
256  
512  
256  
512  
1024  
32  
16  
32  
16  
32  
64  
32  
64  
128  
4
128  
256  
128  
256  
512  
256  
512  
1024  
16  
9
16  
10  
10  
10  
11  
11  
11  
8
8
64  
8
32  
8
128  
64  
16  
8
64  
9
32  
9
128  
256  
128  
256  
512  
256  
512  
1024  
16  
32  
16  
32  
64  
32  
64  
128  
64  
9
128  
64  
8
10  
10  
10  
11  
11  
11  
128  
256  
128  
256  
512  
(1) The shaded cells indicate configurations that are possible on the EMIFB interface but as of this writing SDRAM memories capable of  
supporting these densities are not available in the market.  
Figure 5-18 shows an interface between the EMIFB and a 2M × 16 × 4 bank SDRAM device. In addition,  
and shows an interface between the EMIFB and two 4M × 16 × 4 bank SDRAM devices. Refer to Table 5-  
22, as an example that shows additional list of commonly-supported SDRAM devices and the required  
connections for the address pins. Note that in Table 5-22, page size/column size (not indicated in the  
table) is varied to get the required addressability range.  
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SDRAM  
2M x 16 x 4  
Bank  
EMIFB  
EMB_CS  
CE  
EMB_CAS  
EMB_RAS  
CAS  
RAS  
WE  
EMB_WE  
EMB_CLK  
CLK  
CKE  
EMB_SDCKE  
EMB_BA[1:0]  
EMB_A[11:0]  
EMB_WE_DQM[0]  
EMB_WE_DQM[1]  
EMB_D[15:0]  
BA[1:0]  
A[11:0]  
LDQM  
UDQM  
DQ[15:0]  
Figure 5-18. EMIFB to 2M × 16 × 4 Bank SDRAM Interface  
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Table 5-22. Example of 16/32-Bit EMIFB Address Pin Connections  
SDRAM SIZE  
WIDTH  
BANKS  
MEMORY  
SDRAM  
EMIFB  
ADDRESS PINS  
64M bits  
×16  
4
A[11:0]  
EMB_A[11:0]  
A[10:0]  
×32  
×16  
×32  
×16  
×32  
×16  
×32  
4
4
4
4
4
4
4
SDRAM  
EMIFB  
EMB_A[10:0]  
A[11:0]  
128M bits  
256M bits  
512M bits  
SDRAM  
EMIFB  
EMB_A[11:0]  
A[11:0]  
SDRAM  
EMIFB  
EMB_A[11:0]  
A[12:0]  
SDRAM  
EMIFB  
EMB_A[12:0]  
A[11:0]  
SDRAM  
EMIFB  
EMB_A[11:0]  
A[12:0]  
SDRAM  
EMIFB  
EMB_A[12:0]  
A[12:0]  
SDRAM  
EMIFB  
EMB_A[12:0]  
Table 5-23 is a list of the EMIFB registers.  
Table 5-23. EMIFB Base Controller Registers  
BYTE ADDRESS  
0xB000 0000  
0xB000 0008  
0xB000 000C  
0xB000 0010  
0xB000 0014  
0xB000 001C  
0xB000 0020  
0xB000 0040  
0xB000 0044  
0xB000 0048  
0xB000 004C  
0xB000 0050  
0xB000 00C0  
0xB000 00C4  
0xB000 00C8  
0xB000 00CC  
REGISTER NAME  
REGISTER DESCRIPTION  
MIDR  
SDCFG  
SDRFC  
SDTIM1  
SDTIM2  
SDCFG2  
BPRIO  
PC1  
Module ID Register  
SDRAM Configuration Register  
SDRAM Refresh Control Register  
SDRAM Timing Register 1  
SDRAM Timing Register 2  
SDRAM Configuration 2 Register  
Peripheral Bus Burst Priority Register  
Performance Counter 1 Register  
Performance Counter 2 Register  
Performance Counter Configuration Register  
Performance Counter Master Region Select Register  
Performance Counter Time Register  
Interrupt Raw Register  
PC2  
PCC  
PCMRS  
PCT  
IRR  
IMR  
Interrupt Mask Register  
IMSR  
Interrupt Mask Set Register  
IMCR  
Interrupt Mask Clear Register  
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5.11.3 EMIFB Electrical Data/Timing  
Table 5-24. EMIFB SDRAM Interface Timing Requirements  
NO.  
19  
MIN  
0.8  
MAX UNIT  
tsu(EMA_DV-EM_CLKH)  
th(CLKH-DIV)  
Input setup time, read data valid on EMB_D[31:0] before EMB_CLK rising  
Input hold time, read data valid on EMB_D[31:0] after EMB_CLK rising  
ns  
ns  
20  
1.5  
Table 5-25. EMIFB SDRAM Interface Switching Characteristics  
NO.  
1
PARAMETER  
MIN  
6.579  
2.63  
MAX UNIT  
tc(CLK)  
Cycle time, EMIF clock EMB_CLK  
ns  
ns  
2
tw(CLK)  
Pulse width, EMIF clock EMB_CLK high or low  
3
td(CLKH-CSV)  
toh(CLKH-CSIV)  
td(CLKH-DQMV)  
toh(CLKH-DQMIV)  
td(CLKH-AV)  
Delay time, EMB_CLK rising to EMB_CS[0] valid  
Output hold time, EMB_CLK rising to EMB_CS[0] invalid  
Delay time, EMB_CLK rising to EMB_WE_DQM[3:0] valid  
Output hold time, EMB_CLK rising to EMB_WE_DQM[3:0] invalid  
Delay time, EMB_CLK rising to EMB_A[12:0] and EMB_BA[1:0] valid  
Output hold time, EMB_CLK rising to EMB_A[12:0] and EMB_BA[1:0] invalid  
Delay time, EMB_CLK rising to EMB_D[31:0] valid  
Output hold time, EMB_CLK rising to EMB_D[31:0] invalid  
Delay time, EMB_CLK rising to EMB_RAS valid  
5.1  
5.1  
5.1  
5.1  
5.1  
5.1  
5.1  
5.1  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
4
0.9  
0.9  
0.9  
0.9  
0.9  
0.9  
0.9  
0.9  
5
6
7
8
toh(CLKH-AIV)  
td(CLKH-DV)  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
toh(CLKH-DIV)  
td(CLKH-RASV)  
toh(CLKH-RASIV)  
td(CLKH-CASV)  
toh(CLKH-CASIV)  
td(CLKH-WEV)  
toh(CLKH-WEIV)  
tdis(CLKH-DHZ)  
tena(CLKH-DLZ)  
Output hold time, EMB_CLK rising to EMB_RAS invalid  
Delay time, EMB_CLK rising to EMB_CAS valid  
Output hold time, EMB_CLK rising to EMB_CAS invalid  
Delay time, EMB_CLK rising to EMB_WE valid  
Output hold time, EMB_CLK rising to EMB_WE invalid  
Delay time, EMB_CLK rising to EMB_D[31:0] tri-stated  
Output hold time, EMB_CLK rising to EMB_D[31:0] driving  
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1
BASIC SDRAM  
WRITE OPERATION  
2
2
EMB_CLK  
EMB_CS[0]  
3
5
7
7
9
4
6
EMB_WE_DQM[3:0]  
EMB_BA[1:0]  
8
8
EMB_A[12:0]  
10  
EMB_D[31:0]  
EMB_RAS  
EMB_CAS  
EMB_WE  
11  
12  
13  
15  
16  
Figure 5-19. EMIFB Basic SDRAM Write Operation  
1
BASIC SDRAM  
READ OPERATION  
2
2
EMB_CLK  
EMB_CS[0]  
3
5
7
7
4
6
EMB_WE_DQM[3:0]  
EMB_BA[1:0]  
8
8
EMB_A[12:0]  
19  
20  
2 EM_CLK Delay  
17  
18  
EMB_D[31:0]  
EMB_RAS  
11  
12  
13  
14  
EMB_CAS  
EMB_WE  
Figure 5-20. EMIFB Basic SDRAM Read Operation  
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5.12 Memory Protection Units  
The MPU performs memory protection checking. It receives requests from a bus master in the system and  
checks the address against the fixed and programmable regions to see if the access is allowed. If allowed,  
the transfer is passed unmodified to its output bus (to the targeted address). If the transfer is illegal (fails  
the protection check) then the MPU does not pass the transfer to the output bus but rather services the  
transfer internally back to the input bus (to prevent a hang) returning the fault status to the requestor as  
well as generating an interrupt about the fault. The following features are supported by the MPU:  
Provides memory protection for fixed and programmable address ranges.  
Supports multiple programmable address region.  
Supports secure and debug access privileges.  
Supports read, write, and execute access privileges.  
Supports privid(8) associations with ranges.  
Generates an interrupt when there is a protection violation, and saves violating transfer parameters.  
MMR access is also protected.  
Table 5-26. MPU1 Registers  
BYTE ADDRESS  
0x01E1 4000  
0x01E1 4004  
0x01E1 4010  
0x01E1 4014  
0x01E1 4018  
0x01E1 401C  
REGISTER NAME  
REVID  
REGISTER DESCRIPTION  
Revision ID  
CONFIG  
Configuration  
IRAWSTAT  
IENSTAT  
Interrupt raw status/set  
Interrupt enable status/clear  
IENSET  
Interrupt enable  
IENCLR  
Interrupt enable clear  
0x01E1 4020 - 0x01E1 41FF  
0x01E1 4200  
-
Reserved  
PROG1_MPSAR  
PROG1_MPEAR  
PROG1_MPPA  
-
Programmable range 1, start address  
Programmable range 1, end address  
Programmable range 1, memory page protection attributes  
Reserved  
0x01E1 4204  
0x01E1 4208  
0x01E1 420C - 0x01E1 420F  
0x01E1 4210  
PROG2_MPSAR  
PROG2_MPEAR  
PROG2_MPPA  
-
Programmable range 2, start address  
Programmable range 2, end address  
Programmable range 2, memory page protection attributes  
Reserved  
0x01E1 4214  
0x01E1 4218  
0x01E1 421C - 0x01E1 421F  
0x01E1 4220  
PROG3_MPSAR  
PROG3_MPEAR  
PROG3_MPPA  
-
Programmable range 3, start address  
Programmable range 3, end address  
Programmable range 3, memory page protection attributes  
Reserved  
0x01E1 4224  
0x01E1 4228  
0x01E1 422C - 0x01E1 422F  
0x01E1 4230  
PROG4_MPSAR  
PROG4_MPEA  
PROG4_MPPA  
-
Programmable range 4, start address  
Programmable range 4, end address  
Programmable range 4, memory page protection attributes  
Reserved  
0x01E1 4234  
0x01E1 4238  
0x01E1 423C - 0x01E1 423F  
0x01E1 4240  
PROG5_MPSAR  
PROG5_MPEAR  
PROG5_MPPA  
-
Programmable range 5, start address  
Programmable range 5, end address  
Programmable range 5, memory page protection attributes  
Reserved  
0x01E1 4244  
0x01E1 4248  
0x01E1 424C - 0x01E1 424F  
0x01E1 4250  
PROG6_MPSAR  
PROG6_MPEAR  
PROG6_MPPA  
-
Programmable range 6, start address  
Programmable range 6, end address  
Programmable range 6, memory page protection attributes  
Reserved  
0x01E1 4254  
0x01E1 4258  
0x01E1 425C - 0x01E1 42FF  
0x01E1 4300  
FLTADDRR  
Fault address  
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Table 5-26. MPU1 Registers (continued)  
BYTE ADDRESS  
0x01E1 4304  
REGISTER NAME  
REGISTER DESCRIPTION  
Fault status  
FLTSTAT  
FLTCLR  
-
0x01E1 4308  
Fault clear  
0x01E1 430C - 0x01E1 4FFF  
Reserved  
Table 5-27. MPU2 Registers  
BYTE ADDRESS  
0x01E1 5000  
REGISTER NAME  
REVID  
REGISTER DESCRIPTION  
Revision ID  
0x01E1 5004  
CONFIG  
Configuration  
0x01E1 5010  
IRAWSTAT  
IENSTAT  
Interrupt raw status/set  
Interrupt enable status/clear  
Interrupt enable  
0x01E1 5014  
0x01E1 5018  
IENSET  
0x01E1 501C  
IENCLR  
Interrupt enable clear  
Reserved  
0x01E1 5020 - 0x01E1 51FF  
0x01E1 5200  
-
PROG1_MPSAR  
PROG1_MPEAR  
PROG1_MPPA  
-
Programmable range 1, start address  
Programmable range 1, end address  
0x01E1 5204  
0x01E1 5208  
Programmable range 1, memory page protection attributes  
Reserved  
0x01E1 520C - 0x01E1 520F  
0x01E1 5210  
PROG2_MPSAR  
PROG2_MPEAR  
PROG2_MPPA  
-
Programmable range 2, start address  
Programmable range 2, end address  
Programmable range 2, memory page protection attributes  
Reserved  
0x01E1 5214  
0x01E1 5218  
0x01E1 521C - 0x01E1 521F  
0x01E1 5220  
PROG3_MPSAR  
PROG3_MPEAR  
PROG3_MPPA  
-
Programmable range 3, start address  
Programmable range 3, end address  
Programmable range 3, memory page protection attributes  
Reserved  
0x01E1 5224  
0x01E1 5228  
0x01E1 522C - 0x01E1 522F  
0x01E1 5230  
PROG4_MPSAR  
PROG4_MPEA  
PROG4_MPPA  
-
Programmable range 4, start address  
Programmable range 4, end address  
Programmable range 4, memory page protection attributes  
Reserved  
0x01E1 5234  
0x01E1 5238  
0x01E1 523C - 0x01E1 523F  
0x01E1 5240  
PROG5_MPSAR  
PROG5_MPEAR  
PROG5_MPPA  
-
Programmable range 5, start address  
Programmable range 5, end address  
Programmable range 5, memory page protection attributes  
Reserved  
0x01E1 5244  
0x01E1 5248  
0x01E1 524C - 0x01E1 524F  
0x01E1 5250  
PROG6_MPSAR  
PROG6_MPEAR  
PROG6_MPPA  
-
Programmable range 6, start address  
Programmable range 6, end address  
Programmable range 6, memory page protection attributes  
Reserved  
0x01E1 5254  
0x01E1 5258  
0x01E1 525C - 0x01E1 525F  
0x01E1 5260  
PROG7_MPSAR  
PROG7_MPEAR  
PROG7_MPPA  
-
Programmable range 7, start address  
Programmable range 7, end address  
Programmable range 7, memory page protection attributes  
Reserved  
0x01E1 5264  
0x01E1 5268  
0x01E1 526C - 0x01E1 526F  
0x01E1 5270  
PROG8_MPSAR  
PROG8_MPEAR  
PROG8_MPPA  
-
Programmable range 8, start address  
Programmable range 8, end address  
Programmable range 8, memory page protection attributes  
Reserved  
0x01E1 5274  
0x01E1 5278  
0x01E1 527C - 0x01E1 527F  
0x01E1 5280  
PROG9_MPSAR  
PROG9_MPEAR  
Programmable range 9, start address  
Programmable range 9, end address  
0x01E1 5284  
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Table 5-27. MPU2 Registers (continued)  
BYTE ADDRESS  
REGISTER NAME  
PROG9_MPPA  
-
REGISTER DESCRIPTION  
0x01E1 5288  
Programmable range 9, memory page protection attributes  
Reserved  
0x01E1 528C - 0x01E1 528F  
0x01E1 5290  
PROG10_MPSAR  
PROG10_MPEAR  
PROG10_MPPA  
-
Programmable range 10, start address  
Programmable range 10,end address  
Programmable range 10, memory page protection attributes  
Reserved  
0x01E1 5294  
0x01E1 5298  
0x01E1 529C - 0x01E1 529F  
0x01E1 52A0  
PROG11_MPSAR  
PROG11_MPEAR  
PROG11_MPPA  
-
Programmable range 11, start address  
Programmable range 11, end address  
Programmable range 11, memory page protection attributes  
Reserved  
0x01E1 52A4  
0x01E1 52A8  
0x01E1 52AC - 0x01E1 52AF  
0x01E1 52B0  
PROG12_MPSAR  
PROG12_MPEAR  
PROG12_MPPA  
-
Programmable range 12, start address  
Programmable range 12, end address  
Programmable range 12, memory page protection attributes  
Reserved  
0x01E1 52B4  
0x01E1 52B8  
0x01E1 52BC - 0x01E1 52FF  
0x01E1 5300  
FLTADDRR  
FLTSTAT  
Fault address  
0x01E1 5304  
Fault status  
0x01E1 5308  
FLTCLR  
Fault clear  
0x01E1 530C - 0x01E1 5FFF  
-
Reserved  
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5.13 MMC / SD / SDIO (MMCSD)  
The C6743 includes an MMCSD controller which is compliant with MMC V3.31, Secure Digital Part 1  
Physical Layer Specification V1.1 and Secure Digital Input Output (SDIO) V2.0 specifications. See the  
TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide (SPRUFK9) for more  
details.  
The MMC/SD Controller has following features:  
MultiMediaCard (MMC)  
Secure Digital (SD) Memory Card  
MMC/SD protocol support  
SD high capacity support  
SDIO protocol support  
Programmable clock frequency  
512 bit Read/Write FIFO to lower system overhead  
Slave EDMA transfer capability  
The C6743 MMC/SD Controller does not support SPI mode.  
5.13.1 MMCSD Peripheral Register Description(s)  
Table 5-28. Multimedia Card/Secure Digital (MMC/SD) Card Controller Registers  
BYTE ADDRESS  
0x01C4 0000  
0x01C4 0004  
0x01C4 0008  
0x01C4 000C  
0x01C4 0010  
0x01C4 0014  
0x01C4 0018  
0x01C4 001C  
0x01C4 0020  
0x01C4 0024  
0x01C4 0028  
0x01C4 002C  
0x01C4 0030  
0x01C4 0034  
0x01C4 0038  
0x01C4 003C  
0x01C4 0040  
0x01C4 0044  
0x01C4 0048  
0x01C4 0050  
0x01C4 0064  
0x01C4 0068  
0x01C4 006C  
0x01C4 0070  
0x01C4 0074  
REGISTER NAME  
MMCCTL  
REGISTER DESCRIPTION  
MMC Control Register  
MMCCLK  
MMC Memory Clock Control Register  
MMC Status Register 0  
MMCST0  
MMCST1  
MMC Status Register 1  
MMCIM  
MMC Interrupt Mask Register  
MMC Response Time-Out Register  
MMC Data Read Time-Out Register  
MMC Block Length Register  
MMC Number of Blocks Register  
MMC Number of Blocks Counter Register  
MMC Data Receive Register  
MMC Data Transmit Register  
MMC Command Register  
MMCTOR  
MMCTOD  
MMCBLEN  
MMCNBLK  
MMCNBLC  
MMCDRR  
MMCDXR  
MMCCMD  
MMCARGHL  
MMCRSP01  
MMCRSP23  
MMCRSP45  
MMCRSP67  
MMCDRSP  
MMCCIDX  
SDIOCTL  
MMC Argument Register  
MMC Response Register 0 and 1  
MMC Response Register 2 and 3  
MMC Response Register 4 and 5  
MMC Response Register 6 and 7  
MMC Data Response Register  
MMC Command Index Register  
SDIO Control Register  
SDIOST0  
SDIO Status Register 0  
SDIOIEN  
SDIO Interrupt Enable Register  
SDIO Interrupt Status Register  
MMC FIFO Control Register  
SDIOIST  
MMCFIFOCTL  
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5.13.2 MMC/SD Electrical Data/Timing  
Table 5-29. Timing Requirements for MMC/SD Module  
(see Figure 5-22 and Figure 5-24)  
NO.  
1
MIN  
3.2  
1.5  
3.2  
1.5  
MAX UNIT  
tsu(CMDV-CLKH)  
th(CLKH-CMDV)  
tsu(DATV-CLKH)  
th(CLKH-DATV)  
Setup time, MMCSD_CMD valid before MMCSD_CLK high  
Hold time, MMCSD_CMD valid after MMCSD_CLK high  
Setup time, MMCSD_DATx valid before MMCSD_CLK high  
Hold time, MMCSD_DATx valid after MMCSD_CLK high  
ns  
ns  
ns  
ns  
2
3
4
Table 5-30. Switching Characteristics Over Recommended Operating Conditions for MMC/SD Module  
(see Figure 5-21 through Figure 5-24)  
NO.  
7
PARAMETER  
MIN  
0
MAX UNIT  
f(CLK)  
Operating frequency, MMCSD_CLK  
Identification mode frequency, MMCSD_CLK  
Pulse width, MMCSD_CLK low  
52  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
8
f(CLK_ID)  
tW(CLKL)  
tW(CLKH)  
tr(CLK)  
0
400  
9
6.5  
6.5  
10  
11  
12  
13  
14  
Pulse width, MMCSD_CLK high  
Rise time, MMCSD_CLK  
3
3
tf(CLK)  
Fall time, MMCSD_CLK  
td(CLKL-CMD)  
td(CLKL-DAT)  
Delay time, MMCSD_CLK low to MMCSD_CMD transition  
Delay time, MMCSD_CLK low to MMCSD_DATx transition  
-4.5  
-4.5  
2.5  
2.5  
10  
9
7
MMCSD_CLK  
MMCSD_CMD  
13  
13  
13  
13  
START  
XMIT  
Valid  
Valid  
Valid  
END  
Figure 5-21. MMC/SD Host Command Timing  
9
10  
7
MMCSD_CLK  
MMCSD_CMD  
1
2
Valid  
START  
XMIT  
Valid  
Valid  
END  
Figure 5-22. MMC/SD Card Response Timing  
10  
9
7
MMCSD_CLK  
MMCSD_DATx  
14  
14  
14  
Dx  
14  
START  
D0  
D1  
END  
Figure 5-23. MMC/SD Host Write Timing  
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9
10  
7
MMCSD_CLK  
4
4
3
Start  
3
MMCSD_DATx  
D0  
D1  
Dx  
End  
Figure 5-24. MMC/SD Host Read and Card CRC Status Timing  
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5.14 Ethernet Media Access Controller (EMAC)  
The Ethernet Media Access Controller (EMAC) provides an efficient interface between C6743 and the  
network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps  
in either half- or full-duplex mode, with hardware flow control and quality of service (QOS) support.  
The EMAC controls the flow of packet data from the C6743 device to the PHY. The MDIO module controls  
PHY configuration and status monitoring.  
Both the EMAC and the MDIO modules interface to the C6743 device through a custom interface that  
allows efficient data transmission and reception. This custom interface is referred to as the EMAC control  
module, and is considered integral to the EMAC/MDIO peripheral. The control module is also used to  
multiplex and control interrupts. See the TMS320C674x/OMAP-L1x Processor Peripherals Overview  
Reference Guide(SPRUFK9) for more details.  
5.14.1 EMAC Peripheral Register Description(s)  
Table 5-31. Ethernet Media Access Controller (EMAC) Registers  
BYTE ADDRESS  
0x01E2 3000  
0x01E2 3004  
0x01E2 3008  
0x01E2 3010  
0x01E2 3014  
0x01E2 3018  
0x01E2 3080  
0x01E2 3084  
0x01E2 3088  
0x01E2 308C  
0x01E2 3090  
0x01E2 3094  
0x01E2 30A0  
0x01E2 30A4  
0x01E2 30A8  
0x01E2 30AC  
0x01E2 30B0  
0x01E2 30B4  
0x01E2 30B8  
0x01E2 30BC  
0x01E2 3100  
0x01E2 3104  
0x01E2 3108  
0x01E2 310C  
0x01E2 3110  
0x01E2 3114  
0x01E2 3120  
0x01E2 3124  
0x01E2 3128  
0x01E2 312C  
0x01E2 3130  
0x01E2 3134  
0x01E2 3138  
REGISTER NAME  
TXREV  
REGISTER DESCRIPTION  
Transmit Revision Register  
TXCONTROL  
Transmit Control Register  
TXTEARDOWN  
RXREV  
Transmit Teardown Register  
Receive Revision Register  
RXCONTROL  
Receive Control Register  
RXTEARDOWN  
TXINTSTATRAW  
TXINTSTATMASKED  
TXINTMASKSET  
TXINTMASKCLEAR  
MACINVECTOR  
MACEOIVECTOR  
RXINTSTATRAW  
RXINTSTATMASKED  
RXINTMASKSET  
RXINTMASKCLEAR  
MACINTSTATRAW  
MACINTSTATMASKED  
MACINTMASKSET  
MACINTMASKCLEAR  
RXMBPENABLE  
RXUNICASTSET  
RXUNICASTCLEAR  
RXMAXLEN  
Receive Teardown Register  
Transmit Interrupt Status (Unmasked) Register  
Transmit Interrupt Status (Masked) Register  
Transmit Interrupt Mask Set Register  
Transmit Interrupt Clear Register  
MAC Input Vector Register  
MAC End Of Interrupt Vector Register  
Receive Interrupt Status (Unmasked) Register  
Receive Interrupt Status (Masked) Register  
Receive Interrupt Mask Set Register  
Receive Interrupt Mask Clear Register  
MAC Interrupt Status (Unmasked) Register  
MAC Interrupt Status (Masked) Register  
MAC Interrupt Mask Set Register  
MAC Interrupt Mask Clear Register  
Receive Multicast/Broadcast/Promiscuous Channel Enable Register  
Receive Unicast Enable Set Register  
Receive Unicast Clear Register  
Receive Maximum Length Register  
Receive Buffer Offset Register  
RXBUFFEROFFSET  
RXFILTERLOWTHRESH Receive Filter Low Priority Frame Threshold Register  
RX0FLOWTHRESH  
RX1FLOWTHRESH  
RX2FLOWTHRESH  
RX3FLOWTHRESH  
RX4FLOWTHRESH  
RX5FLOWTHRESH  
RX6FLOWTHRESH  
Receive Channel 0 Flow Control Threshold Register  
Receive Channel 1 Flow Control Threshold Register  
Receive Channel 2 Flow Control Threshold Register  
Receive Channel 3 Flow Control Threshold Register  
Receive Channel 4 Flow Control Threshold Register  
Receive Channel 5 Flow Control Threshold Register  
Receive Channel 6 Flow Control Threshold Register  
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Table 5-31. Ethernet Media Access Controller (EMAC) Registers (continued)  
BYTE ADDRESS  
0x01E2 313C  
0x01E2 3140  
0x01E2 3144  
0x01E2 3148  
0x01E2 314C  
0x01E2 3150  
0x01E2 3154  
0x01E2 3158  
0x01E2 315C  
0x01E2 3160  
0x01E2 3164  
0x01E2 3168  
0x01E2 316C  
0x01E2 3170  
0x01E2 3174  
0x01E2 31D0  
0x01E2 31D4  
0x01E2 31D8  
0x01E2 31DC  
0x01E2 31E0  
0x01E2 31E4  
0x01E2 31E8  
0x01E2 31EC  
REGISTER NAME  
RX7FLOWTHRESH  
RX0FREEBUFFER  
RX1FREEBUFFER  
RX2FREEBUFFER  
RX3FREEBUFFER  
RX4FREEBUFFER  
RX5FREEBUFFER  
RX6FREEBUFFER  
RX7FREEBUFFER  
MACCONTROL  
MACSTATUS  
REGISTER DESCRIPTION  
Receive Channel 7 Flow Control Threshold Register  
Receive Channel 0 Free Buffer Count Register  
Receive Channel 1 Free Buffer Count Register  
Receive Channel 2 Free Buffer Count Register  
Receive Channel 3 Free Buffer Count Register  
Receive Channel 4 Free Buffer Count Register  
Receive Channel 5 Free Buffer Count Register  
Receive Channel 6 Free Buffer Count Register  
Receive Channel 7 Free Buffer Count Register  
MAC Control Register  
MAC Status Register  
EMCONTROL  
Emulation Control Register  
FIFOCONTROL  
MACCONFIG  
FIFO Control Register  
MAC Configuration Register  
SOFTRESET  
Soft Reset Register  
MACSRCADDRLO  
MACSRCADDRHI  
MACHASH1  
MAC Source Address Low Bytes Register  
MAC Source Address High Bytes Register  
MAC Hash Address Register 1  
MACHASH2  
MAC Hash Address Register 2  
BOFFTEST  
Back Off Test Register  
TPACETEST  
Transmit Pacing Algorithm Test Register  
Receive Pause Timer Register  
RXPAUSE  
TXPAUSE  
Transmit Pause Timer Register  
0x01E2 3200 - 0x01E2 32FC (see Table 5-32)  
EMAC Statistics Registers  
0x01E2 3500  
0x01E2 3504  
0x01E2 3508  
0x01E2 3600  
0x01E2 3604  
0x01E2 3608  
0x01E2 360C  
0x01E2 3610  
0x01E2 3614  
0x01E2 3618  
0x01E2 361C  
0x01E2 3620  
0x01E2 3624  
0x01E2 3628  
0x01E2 362C  
0x01E2 3630  
0x01E2 3634  
0x01E2 3638  
0x01E2 363C  
0x01E2 3640  
0x01E2 3644  
0x01E2 3648  
0x01E2 364C  
MACADDRLO  
MACADDRHI  
MACINDEX  
TX0HDP  
TX1HDP  
TX2HDP  
TX3HDP  
TX4HDP  
TX5HDP  
TX6HDP  
TX7HDP  
RX0HDP  
RX1HDP  
RX2HDP  
RX3HDP  
RX4HDP  
RX5HDP  
RX6HDP  
RX7HDP  
TX0CP  
MAC Address Low Bytes Register, Used in Receive Address Matching  
MAC Address High Bytes Register, Used in Receive Address Matching  
MAC Index Register  
Transmit Channel 0 DMA Head Descriptor Pointer Register  
Transmit Channel 1 DMA Head Descriptor Pointer Register  
Transmit Channel 2 DMA Head Descriptor Pointer Register  
Transmit Channel 3 DMA Head Descriptor Pointer Register  
Transmit Channel 4 DMA Head Descriptor Pointer Register  
Transmit Channel 5 DMA Head Descriptor Pointer Register  
Transmit Channel 6 DMA Head Descriptor Pointer Register  
Transmit Channel 7 DMA Head Descriptor Pointer Register  
Receive Channel 0 DMA Head Descriptor Pointer Register  
Receive Channel 1 DMA Head Descriptor Pointer Register  
Receive Channel 2 DMA Head Descriptor Pointer Register  
Receive Channel 3 DMA Head Descriptor Pointer Register  
Receive Channel 4 DMA Head Descriptor Pointer Register  
Receive Channel 5 DMA Head Descriptor Pointer Register  
Receive Channel 6 DMA Head Descriptor Pointer Register  
Receive Channel 7 DMA Head Descriptor Pointer Register  
Transmit Channel 0 Completion Pointer Register  
TX1CP  
Transmit Channel 1 Completion Pointer Register  
TX2CP  
Transmit Channel 2 Completion Pointer Register  
TX3CP  
Transmit Channel 3 Completion Pointer Register  
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Table 5-31. Ethernet Media Access Controller (EMAC) Registers (continued)  
BYTE ADDRESS  
REGISTER NAME  
TX4CP  
REGISTER DESCRIPTION  
0x01E2 3650  
0x01E2 3654  
0x01E2 3658  
0x01E2 365C  
0x01E2 3660  
0x01E2 3664  
0x01E2 3668  
0x01E2 366C  
0x01E2 3670  
0x01E2 3674  
0x01E2 3678  
0x01E2 367C  
Transmit Channel 4 Completion Pointer Register  
Transmit Channel 5 Completion Pointer Register  
Transmit Channel 6 Completion Pointer Register  
Transmit Channel 7 Completion Pointer Register  
Receive Channel 0 Completion Pointer Register  
Receive Channel 1 Completion Pointer Register  
Receive Channel 2 Completion Pointer Register  
Receive Channel 3 Completion Pointer Register  
Receive Channel 4 Completion Pointer Register  
Receive Channel 5 Completion Pointer Register  
Receive Channel 6 Completion Pointer Register  
Receive Channel 7 Completion Pointer Register  
TX5CP  
TX6CP  
TX7CP  
RX0CP  
RX1CP  
RX2CP  
RX3CP  
RX4CP  
RX5CP  
RX6CP  
RX7CP  
Table 5-32. EMAC Statistics Registers  
BYTE ADDRESS  
REGISTER NAME  
REGISTER DESCRIPTION  
0x01E2 3200  
RXGOODFRAMES  
Good Receive Frames Register  
Broadcast Receive Frames Register  
(Total number of good broadcast frames received)  
0x01E2 3204  
RXBCASTFRAMES  
Multicast Receive Frames Register  
(Total number of good multicast frames received)  
0x01E2 3208  
0x01E2 320C  
0x01E2 3210  
RXMCASTFRAMES  
RXPAUSEFRAMES  
RXCRCERRORS  
Pause Receive Frames Register  
Receive CRC Errors Register  
(Total number of frames received with CRC errors)  
Receive Alignment/Code Errors Register  
(Total number of frames received with alignment/code errors)  
0x01E2 3214  
0x01E2 3218  
0x01E2 321C  
0x01E2 3220  
RXALIGNCODEERRORS  
RXOVERSIZED  
Receive Oversized Frames Register  
(Total number of oversized frames received)  
Receive Jabber Frames Register  
(Total number of jabber frames received)  
RXJABBER  
Receive Undersized Frames Register  
(Total number of undersized frames received)  
RXUNDERSIZED  
0x01E2 3224  
0x01E2 3228  
0x01E2 322C  
RXFRAGMENTS  
RXFILTERED  
Receive Frame Fragments Register  
Filtered Receive Frames Register  
Received QOS Filtered Frames Register  
RXQOSFILTERED  
Receive Octet Frames Register  
(Total number of received bytes in good frames)  
0x01E2 3230  
0x01E2 3234  
RXOCTETS  
Good Transmit Frames Register  
(Total number of good frames transmitted)  
TXGOODFRAMES  
0x01E2 3238  
0x01E2 323C  
0x01E2 3240  
0x01E2 3244  
0x01E2 3248  
0x01E2 324C  
0x01E2 3250  
0x01E2 3254  
0x01E2 3258  
0x01E2 325C  
0x01E2 3260  
0x01E2 3264  
TXBCASTFRAMES  
TXMCASTFRAMES  
TXPAUSEFRAMES  
TXDEFERRED  
Broadcast Transmit Frames Register  
Multicast Transmit Frames Register  
Pause Transmit Frames Register  
Deferred Transmit Frames Register  
Transmit Collision Frames Register  
Transmit Single Collision Frames Register  
Transmit Multiple Collision Frames Register  
Transmit Excessive Collision Frames Register  
Transmit Late Collision Frames Register  
Transmit Underrun Error Register  
TXCOLLISION  
TXSINGLECOLL  
TXMULTICOLL  
TXEXCESSIVECOLL  
TXLATECOLL  
TXUNDERRUN  
TXCARRIERSENSE  
TXOCTETS  
Transmit Carrier Sense Errors Register  
Transmit Octet Frames Register  
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Table 5-32. EMAC Statistics Registers (continued)  
BYTE ADDRESS  
0x01E2 3268  
0x01E2 326C  
0x01E2 3270  
0x01E2 3274  
0x01E2 3278  
0x01E2 327C  
0x01E2 3280  
0x01E2 3284  
0x01E2 3288  
0x01E2 328C  
REGISTER NAME  
FRAME64  
REGISTER DESCRIPTION  
Transmit and Receive 64 Octet Frames Register  
Transmit and Receive 65 to 127 Octet Frames Register  
Transmit and Receive 128 to 255 Octet Frames Register  
Transmit and Receive 256 to 511 Octet Frames Register  
Transmit and Receive 512 to 1023 Octet Frames Register  
Transmit and Receive 1024 to 1518 Octet Frames Register  
Network Octet Frames Register  
FRAME65T127  
FRAME128T255  
FRAME256T511  
FRAME512T1023  
FRAME1024TUP  
NETOCTETS  
RXSOFOVERRUNS  
RXMOFOVERRUNS  
RXDMAOVERRUNS  
Receive FIFO or DMA Start of Frame Overruns Register  
Receive FIFO or DMA Middle of Frame Overruns Register  
Receive DMA Start of Frame and Middle of Frame Overruns Register  
Table 5-33. EMAC Control Module Registers  
BYTE ADDRESS  
0x01E2 2000  
0x01E2 2004  
0x01E2 200C  
0x01E2 2010  
0x01E2 2014  
0x01E2 2018  
0x01E2 201C  
0x01E2 2020  
0x01E2 2024  
0x01E2 2028  
0x01E2 202C  
0x01E2 2030  
0x01E2 2034  
0x01E2 2038  
0x01E2 203C  
0x01E2 2040  
0x01E2 2044  
0x01E2 2048  
0x01E2 204C  
0x01E2 2050  
0x01E2 2054  
0x01E2 2058  
0x01E2 205C  
0x01E2 2060  
0x01E2 2064  
0x01E2 2068  
0x01E2 206C  
0x01E2 2070  
0x01E2 2074  
0x01E2 2078  
0x01E2 207C  
0x01E2 2080  
0x01E2 2084  
REGISTER NAME  
REV  
REGISTER DESCRIPTION  
EMAC Control Module Revision Register  
SOFTRESET  
INTCONTROL  
C0RXTHRESHEN  
C0RXEN  
EMAC Control Module Software Reset Register  
EMAC Control Module Interrupt Control Register  
EMAC Control Module Interrupt Core 0 Receive Threshold Interrupt Enable Register  
EMAC Control Module Interrupt Core 0 Receive Interrupt Enable Register  
EMAC Control Module Interrupt Core 0 Transmit Interrupt Enable Register  
EMAC Control Module Interrupt Core 0 Miscellaneous Interrupt Enable Register  
EMAC Control Module Interrupt Core 1 Receive Threshold Interrupt Enable Register  
EMAC Control Module Interrupt Core 1 Receive Interrupt Enable Register  
EMAC Control Module Interrupt Core 1 Transmit Interrupt Enable Register  
EMAC Control Module Interrupt Core 1 Miscellaneous Interrupt Enable Register  
EMAC Control Module Interrupt Core 2 Receive Threshold Interrupt Enable Register  
EMAC Control Module Interrupt Core 2 Receive Interrupt Enable Register  
EMAC Control Module Interrupt Core 2 Transmit Interrupt Enable Register  
EMAC Control Module Interrupt Core 2 Miscellaneous Interrupt Enable Register  
EMAC Control Module Interrupt Core 0 Receive Threshold Interrupt Status Register  
EMAC Control Module Interrupt Core 0 Receive Interrupt Status Register  
EMAC Control Module Interrupt Core 0 Transmit Interrupt Status Register  
EMAC Control Module Interrupt Core 0 Miscellaneous Interrupt Status Register  
EMAC Control Module Interrupt Core 1 Receive Threshold Interrupt Status Register  
EMAC Control Module Interrupt Core 1 Receive Interrupt Status Register  
EMAC Control Module Interrupt Core 1 Transmit Interrupt Status Register  
EMAC Control Module Interrupt Core 1 Miscellaneous Interrupt Status Register  
EMAC Control Module Interrupt Core 2 Receive Threshold Interrupt Status Register  
EMAC Control Module Interrupt Core 2 Receive Interrupt Status Register  
EMAC Control Module Interrupt Core 2 Transmit Interrupt Status Register  
EMAC Control Module Interrupt Core 2 Miscellaneous Interrupt Status Register  
EMAC Control Module Interrupt Core 0 Receive Interrupts Per Millisecond Register  
EMAC Control Module Interrupt Core 0 Transmit Interrupts Per Millisecond Register  
EMAC Control Module Interrupt Core 1 Receive Interrupts Per Millisecond Register  
EMAC Control Module Interrupt Core 1 Transmit Interrupts Per Millisecond Register  
EMAC Control Module Interrupt Core 2 Receive Interrupts Per Millisecond Register  
EMAC Control Module Interrupt Core 2 Transmit Interrupts Per Millisecond Register  
C0TXEN  
C0MISCEN  
C1RXTHRESHEN  
C1RXEN  
C1TXEN  
C1MISCEN  
C2RXTHRESHEN  
C2RXEN  
C2TXEN  
C2MISCEN  
C0RXTHRESHSTAT  
C0RXSTAT  
C0TXSTAT  
C0MISCSTAT  
C1RXTHRESHSTAT  
C1RXSTAT  
C1TXSTAT  
C1MISCSTAT  
C2RXTHRESHSTAT  
C2RXSTAT  
C2TXSTAT  
C2MISCSTAT  
C0RXIMAX  
C0TXIMAX  
C1RXIMAX  
C1TXIMAX  
C2RXIMAX  
C2TXIMAX  
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Table 5-34. EMAC Control Module RAM  
BYTE ADDRESS  
DESCRIPTION  
EMAC Local Buffer Descriptor Memory  
0x01E2 0000 - 0x01E2 1FFF  
5.14.2 EMAC Electrical Data/Timing  
Table 5-35. RMII Timing Requirements(1)  
NO.  
1
MIN  
TYP MAX UNIT  
tc(REFCLK)  
Cycle Time, RMII_MHZ_50_CLK  
20  
ns  
ns  
ns  
ns  
ns  
ns  
2
tw(REFCLKH)  
tw(REFCLKL)  
Pulse Width, RMII_MHZ_50_CLK High  
7
7
4
2
4
13  
13  
3
Pulse Width, RMII_MHZ_50_CLK Low  
6
tsu(RXD-REFCLK)  
th(REFCLK-RXD)  
Input Setup Time, RXD Valid before RMII_MHZ_50_CLK High  
Input Hold Time, RXD Valid after RMII_MHZ_50_CLK High  
Input Setup Time, CRSDV Valid before RMII_MHZ_50_CLK High  
7
8
tsu(CRSDV-  
REFCLK)  
9
th(REFCLK-CRSDV) Input Hold Time, CRSDV Valid after RMII_MHZ_50_CLK High  
tsu(RXER-REFCLK) Input Setup Time, RXER Valid before RMII_MHZ_50_CLK High  
th(REFCLKR-RXER) Input Hold Time, RXER Valid after RMII_MHZ_50_CLK High  
2
4
2
ns  
ns  
ns  
10  
11  
(1) Per the RMII industry specification, the RMII reference clock (RMII_MHZ_50_CLK) must have jitter tolerance of 50 ppm or less.  
Table 5-36. RMII Switching Characteristics  
NO.  
4
MIN TYP  
MAX UNIT  
td(REFCLK-TXD)  
td(REFCLK-TXEN)  
Output Delay Time, RMII_MHZ_50_CLK High to TXD Valid  
Output Delay Time, RMII_MHZ_50_CLK High to TXEN Valid  
2.5  
2.5  
13  
13  
ns  
ns  
5
1
2
3
RMII_MHz_50_CLK  
5
5
RMII_TXEN  
4
RMII_TXD[1:0]  
6
7
RMII_RXD[1:0]  
RMII_CRS_DV  
8
9
10  
11  
RMII_RXER  
Figure 5-25. RMII Timing Diagram  
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5.15 Management Data Input/Output (MDIO)  
The Management Data Input/Output (MDIO) module continuously polls all 32 MDIO addresses in order to  
enumerate all PHY devices in the system.  
The Management Data Input/Output (MDIO) module implements the 802.3 serial management interface to  
interrogate and control Ethernet PHY(s) using a shared two-wire bus. Host software uses the MDIO  
module to configure the auto-negotiation parameters of each PHY attached to the EMAC, retrieve the  
negotiation results, and configure required parameters in the EMAC module for correct operation. The  
module is designed to allow almost transparent operation of the MDIO interface, with very little  
maintenance from the core processor. Only one PHY may be connected at any given time. See the  
TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide (SPRUFK9) for more  
details.  
5.15.1 MDIO Peripheral Register Description(s)  
For a list of supported MDIO registers see Table 5-37 [MDIO Registers].  
Table 5-37. MDIO Register Memory Map  
BYTE ADDRESS  
0x01E2 4000  
REGISTER NAME  
REV  
REGISTER DESCRIPTION  
Revision Identification Register  
0x01E2 4004  
CONTROL  
MDIO Control Register  
0x01E2 4008  
ALIVE  
MDIO PHY Alive Status Register  
0x01E2 400C  
LINK  
MDIO PHY Link Status Register  
0x01E2 4010  
LINKINTRAW  
LINKINTMASKED  
MDIO Link Status Change Interrupt (Unmasked) Register  
MDIO Link Status Change Interrupt (Masked) Register  
Reserved  
0x01E2 4014  
0x01E2 4018  
0x01E2 4020  
USERINTRAW  
USERINTMASKED  
USERINTMASKSET  
USERINTMASKCLEAR  
MDIO User Command Complete Interrupt (Unmasked) Register  
MDIO User Command Complete Interrupt (Masked) Register  
MDIO User Command Complete Interrupt Mask Set Register  
MDIO User Command Complete Interrupt Mask Clear Register  
Reserved  
0x01E2 4024  
0x01E2 4028  
0x01E2 402C  
0x01E2 4030 - 0x01E2 407C  
0x01E2 4080  
USERACCESS0  
USERPHYSEL0  
USERACCESS1  
USERPHYSEL1  
MDIO User Access Register 0  
0x01E2 4084  
MDIO User PHY Select Register 0  
MDIO User Access Register 1  
0x01E2 4088  
0x01E2 408C  
MDIO User PHY Select Register 1  
Reserved  
0x01E2 4090 - 0x01E2 47FF  
5.15.2 Management Data Input/Output (MDIO) Electrical Data/Timing  
Table 5-38. Timing Requirements for MDIO Input (see Figure 5-26 and Figure 5-27)  
NO.  
1
MIN  
400  
180  
MAX UNIT  
tc(MDIO_CLK)  
Cycle time, MDIO_CLK  
ns  
ns  
2
tw(MDIO_CLK)  
Pulse duration, MDIO_CLK high/low  
3
tt(MDIO_CLK)  
Transition time, MDIO_CLK  
5
ns  
ns  
ns  
4
tsu(MDIO-MDIO_CLKH)  
th(MDIO_CLKH-MDIO)  
Setup time, MDIO_D data input valid before MDIO_CLK high  
Hold time, MDIO_D data input valid after MDIO_CLK high  
10  
0
5
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1
3
3
MDIO_CLK  
4
5
MDIO_D  
(input)  
Figure 5-26. MDIO Input Timing  
Table 5-39. Switching Characteristics Over Recommended Operating Conditions for MDIO Output  
(see Figure 5-27)  
NO.  
PARAMETER  
MIN  
MAX UNIT  
100 ns  
7
td(MDIO_CLKL-MDIO)  
Delay time, MDIO_CLK low to MDIO_D data output valid  
0
1
MDIO_CLK  
7
MDIO_D  
(output)  
Figure 5-27. MDIO Output Timing  
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5.16 Multichannel Audio Serial Ports (McASP0, McASP1)  
The McASP serial port is specifically designed for multichannel audio applications. Its key features are:  
Flexible clock and frame sync generation logic and on-chip dividers  
Up to fourteen transmit or receive data pins and serializers  
Large number of serial data format options, including:  
TDM Frames with 2 to 32 time slots per frame (periodic) or 1 slot per frame (burst)  
Time slots of 8,12,16, 20, 24, 28, and 32 bits  
First bit delay 0, 1, or 2 clocks  
MSB or LSB first bit order  
Left- or right-aligned data words within time slots  
Extensive error checking and mute generation logic  
All unused pins GPIO-capable  
Additionally, while the McASP modules are backward compatible with the McASP on previous devices; the  
McASP also includes the following new features:  
Transmit & Receive FIFO Buffers for each McASP. Allows the McASP to operate at a higher sample  
rate by making it more tolerant to DMA latency.  
Dynamic Adjustment of Clock Dividers  
Clock Divider Value may be changed without resetting the McASP  
See the TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide (SPRUFK9) for  
more details.  
The three McASPs on the C6743 are configured with the following options:  
Table 5-40. C6743 McASP Configurations(1)  
MODULE  
SERIALIZERS  
AFIFO  
DIT  
C6743 PINS  
64 Word RX  
64 Word TX  
AXR0[15:0], AHCLKR0, ACLKR0, AFSR0, AHCLKX0, ACLKX0,  
AFSX0  
McASP0  
16  
N
64 Word RX  
64 Word TX  
AXR1[11:10], AXR1[8:0], AHCLKR1, ACLKR1, AFSR1, AHCLKX1,  
ACLKX1, AFSX1, AMUTE1  
McASP1  
12  
N
(1) Pins available are the maximum number of pins that may be configured for a particular McASP; not including pin multiplexing.  
Pins Function  
AHCLKRx Receive Master Clock  
Receive Logic  
Clock/Frame Generator  
State Machine  
Peripheral  
Configuration  
Bus  
GIO  
Control  
ACLKRx  
AFSRx  
Receive Bit Clock  
Receive Left/Right Clock or Frame Sync  
The McASPs DO NOT have  
dedicated AMUTEINx pins.  
AMUTEINx  
AMUTEx  
Clock Check and  
Error Detection  
AFSXx  
Transmit Left/Right Clock or Frame Sync  
Transmit Bit Clock  
Transmit Master Clock  
Transmit Logic  
Clock/Frame Generator  
State Machine  
ACLKXx  
AHCLKXx  
Transmit  
Formatter  
Serializer 0  
Serializer 1  
AXRx[0]  
AXRx[1]  
Transmit/Receive Serial Data Pin  
Transmit/Receive Serial Data Pin  
McASP  
DMA Bus  
(Dedicated)  
Receive  
Formatter  
Serializer y  
AXRx[y]  
Transmit/Receive Serial Data Pin  
McASPx (x = 0, 1)  
Figure 5-28. McASP Block Diagram  
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5.16.1 McASP Peripheral Registers Description(s)  
Registers for the McASP are summarized in Table 5-41. The registers are accessed through the  
peripheral configuration port. The receive buffer registers (RBUF) and transmit buffer registers (XBUF) can  
also be accessed through the DMA port, as listed in Table 5-42  
Registers for the McASP Audio FIFO (AFIFO) are summarized in Table 5-43. Note that the AFIFO Write  
FIFO (WFIFO) and Read FIFO (RFIFO) have independent control and status registers. The AFIFO control  
registers are accessed through the peripheral configuration port.  
Table 5-41. McASP Registers Accessed Through Peripheral Configuration Port  
McASP0  
BYTE  
McASP1  
BYTE  
REGISTER NAME  
REGISTER DESCRIPTION  
ADDRESS  
ADDRESS  
0x01D0 0000  
0x01D0 0010  
0x01D0 0014  
0x01D0 0018  
0x01D0 001C  
0x01D0 001C  
0x01D0 0020  
0x01D0 0044  
0x01D0 0048  
0x01D0 004C  
0x01D0 0050  
0x01D0 0060  
0x01D0 4000  
0x01D0 4010  
0x01D0 4014  
0x01D0 4018  
0x01D0 401C  
0x01D0 401C  
0x01D0 4020  
0x01D0 4044  
0x01D0 4048  
0x01D0 404C  
0x01D0 4050  
0x01D0 4060  
REV  
Revision identification register  
Pin function register  
PFUNC  
PDIR  
Pin direction register  
PDOUT  
PDIN  
Pin data output register  
Read returns: Pin data input register  
Writes affect: Pin data set register (alternate write address: PDOUT)  
Pin data clear register (alternate write address: PDOUT)  
Global control register  
PDSET  
PDCLR  
GBLCTL  
AMUTE  
DLBCTL  
DITCTL  
RGBLCTL  
Audio mute control register  
Digital loopback control register  
DIT mode control register  
Receiver global control register: Alias of GBLCTL, only receive bits  
are affected - allows receiver to be reset independently from  
transmitter  
0x01D0 0064  
0x01D0 0068  
0x01D0 006C  
0x01D0 0070  
0x01D0 0074  
0x01D0 0078  
0x01D0 007C  
0x01D0 0080  
0x01D0 0084  
0x01D0 0088  
0x01D0 008C  
0x01D0 00A0  
0x01D0 4064  
0x01D0 4068  
0x01D0 406C  
0x01D0 4070  
0x01D0 4074  
0x01D0 4078  
0x01D0 407C  
0x01D0 4080  
0x01D0 4084  
0x01D0 4088  
0x01D0 408C  
0x01D0 40A0  
RMASK  
Receive format unit bit mask register  
Receive bit stream format register  
Receive frame sync control register  
Receive clock control register  
RFMT  
AFSRCTL  
ACLKRCTL  
AHCLKRCTL  
RTDM  
Receive high-frequency clock control register  
Receive TDM time slot 0-31 register  
Receiver interrupt control register  
Receiver status register  
RINTCTL  
RSTAT  
RSLOT  
Current receive TDM time slot register  
Receive clock check control register  
Receiver DMA event control register  
RCLKCHK  
REVTCTL  
XGBLCTL  
Transmitter global control register. Alias of GBLCTL, only transmit  
bits are affected - allows transmitter to be reset independently from  
receiver  
0x01D0 00A4  
0x01D0 00A8  
0x01D0 00AC  
0x01D0 00B0  
0x01D0 00B4  
0x01D0 00B8  
0x01D0 00BC  
0x01D0 00C0  
0x01D0 00C4  
0x01D0 00C8  
0x01D0 00CC  
0x01D0 40A4  
0x01D0 40A8  
0x01D0 40AC  
0x01D0 40B0  
0x01D0 40B4  
0x01D0 40B8  
0x01D0 40BC  
0x01D0 40C0  
0x01D0 40C4  
0x01D0 40C8  
0x01D0 40CC  
XMASK  
Transmit format unit bit mask register  
Transmit bit stream format register  
Transmit frame sync control register  
Transmit clock control register  
XFMT  
AFSXCTL  
ACLKXCTL  
AHCLKXCTL  
XTDM  
Transmit high-frequency clock control register  
Transmit TDM time slot 0-31 register  
Transmitter interrupt control register  
Transmitter status register  
XINTCTL  
XSTAT  
XSLOT  
Current transmit TDM time slot register  
Transmit clock check control register  
Transmitter DMA event control register  
XCLKCHK  
XEVTCTL  
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Table 5-41. McASP Registers Accessed Through Peripheral Configuration Port (continued)  
McASP0  
BYTE  
McASP1  
BYTE  
REGISTER NAME  
REGISTER DESCRIPTION  
ADDRESS  
ADDRESS  
0x01D0 0100  
0x01D0 0104  
0x01D0 0108  
0x01D0 010C  
0x01D0 0110  
0x01D0 0114  
0x01D0 0118  
0x01D0 011C  
0x01D0 0120  
0x01D0 0124  
0x01D0 0128  
0x01D0 012C  
0x01D0 0130  
0x01D0 0134  
0x01D0 0138  
0x01D0 013C  
0x01D0 0140  
0x01D0 0144  
0x01D0 0148  
0x01D0 014C  
0x01D0 0150  
0x01D0 0154  
0x01D0 0158  
0x01D0 015C  
0x01D0 0180  
0x01D0 0184  
0x01D0 0188  
0x01D0 018C  
0x01D0 0190  
0x01D0 0194  
0x01D0 0198  
0x01D0 019C  
0x01D0 01A0  
0x01D0 01A4  
0x01D0 01A8  
0x01D0 01AC  
0x01D0 01B0  
0x01D0 01B4  
0x01D0 01B8  
0x01D0 01BC  
0x01D0 4100  
0x01D0 4104  
0x01D0 4108  
0x01D0 410C  
0x01D0 4110  
0x01D0 4114  
0x01D0 4118  
0x01D0 411C  
0x01D0 4120  
0x01D0 4124  
0x01D0 4128  
0x01D0 412C  
0x01D0 4130  
0x01D0 4134  
0x01D0 4138  
0x01D0 413C  
0x01D0 4140  
0x01D0 4144  
0x01D0 4148  
0x01D0 414C  
0x01D0 4150  
0x01D0 4154  
0x01D0 4158  
0x01D0 415C  
0x01D0 4180  
0x01D0 4184  
0x01D0 4188  
0x01D0 418C  
0x01D0 4190  
0x01D0 4194  
0x01D0 4198  
0x01D0 419C  
0x01D0 41A0  
0x01D0 41A4  
0x01D0 41A8  
0x01D0 41AC  
0x01D0 41B0  
0x01D0 41B4  
0x01D0 41B8  
0x01D0 41BC  
DITCSRA0  
DITCSRA1  
DITCSRA2  
DITCSRA3  
DITCSRA4  
DITCSRA5  
DITCSRB0  
DITCSRB1  
DITCSRB2  
DITCSRB3  
DITCSRB4  
DITCSRB5  
DITUDRA0  
DITUDRA1  
DITUDRA2  
DITUDRA3  
DITUDRA4  
DITUDRA5  
DITUDRB0  
DITUDRB1  
DITUDRB2  
DITUDRB3  
DITUDRB4  
DITUDRB5  
SRCTL0  
Left (even TDM time slot) channel status register (DIT mode) 0  
Left (even TDM time slot) channel status register (DIT mode) 1  
Left (even TDM time slot) channel status register (DIT mode) 2  
Left (even TDM time slot) channel status register (DIT mode) 3  
Left (even TDM time slot) channel status register (DIT mode) 4  
Left (even TDM time slot) channel status register (DIT mode) 5  
Right (odd TDM time slot) channel status register (DIT mode) 0  
Right (odd TDM time slot) channel status register (DIT mode) 1  
Right (odd TDM time slot) channel status register (DIT mode) 2  
Right (odd TDM time slot) channel status register (DIT mode) 3  
Right (odd TDM time slot) channel status register (DIT mode) 4  
Right (odd TDM time slot) channel status register (DIT mode) 5  
Left (even TDM time slot) channel user data register (DIT mode) 0  
Left (even TDM time slot) channel user data register (DIT mode) 1  
Left (even TDM time slot) channel user data register (DIT mode) 2  
Left (even TDM time slot) channel user data register (DIT mode) 3  
Left (even TDM time slot) channel user data register (DIT mode) 4  
Left (even TDM time slot) channel user data register (DIT mode) 5  
Right (odd TDM time slot) channel user data register (DIT mode) 0  
Right (odd TDM time slot) channel user data register (DIT mode) 1  
Right (odd TDM time slot) channel user data register (DIT mode) 2  
Right (odd TDM time slot) channel user data register (DIT mode) 3  
Right (odd TDM time slot) channel user data register (DIT mode) 4  
Right (odd TDM time slot) channel user data register (DIT mode) 5  
Serializer control register 0  
SRCTL1  
Serializer control register 1  
SRCTL2  
Serializer control register 2  
SRCTL3  
Serializer control register 3  
SRCTL4  
Serializer control register 4  
SRCTL5  
Serializer control register 5  
SRCTL6  
Serializer control register 6  
SRCTL7  
Serializer control register 7  
SRCTL8  
Serializer control register 8  
SRCTL9  
Serializer control register 9  
SRCTL10  
SRCTL11  
SRCTL12  
SRCTL13  
SRCTL14  
SRCTL15  
Serializer control register 10  
Serializer control register 11  
Serializer control register 12  
Serializer control register 13  
Serializer control register 14  
Serializer control register 15  
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Table 5-41. McASP Registers Accessed Through Peripheral Configuration Port (continued)  
McASP0  
BYTE  
McASP1  
BYTE  
REGISTER NAME  
REGISTER DESCRIPTION  
ADDRESS  
ADDRESS  
0x01D0 0200  
0x01D0 0204  
0x01D0 0208  
0x01D0 020C  
0x01D0 0210  
0x01D0 0214  
0x01D0 0218  
0x01D0 021C  
0x01D0 0220  
0x01D0 0224  
0x01D0 0228  
0x01D0 022C  
0x01D0 0230  
0x01D0 0234  
0x01D0 0238  
0x01D0 023C  
0x01D0 0280  
0x01D0 0284  
0x01D0 0288  
0x01D0 028C  
0x01D0 0290  
0x01D0 0294  
0x01D0 0298  
0x01D0 029C  
0x01D0 02A0  
0x01D0 02A4  
0x01D0 02A8  
0x01D0 02AC  
0x01D0 02B0  
0x01D0 02B4  
0x01D0 02B8  
0x01D0 02BC  
0x01D0 4200  
0x01D0 4204  
0x01D0 4208  
0x01D0 420C  
0x01D0 4210  
0x01D0 4214  
0x01D0 4218  
0x01D0 421C  
0x01D0 4220  
0x01D0 4224  
0x01D0 4228  
0x01D0 422C  
0x01D0 4230  
0x01D0 4234  
0x01D0 4238  
0x01D0 423C  
0x01D0 4280  
0x01D0 4284  
0x01D0 4288  
0x01D0 428C  
0x01D0 4290  
0x01D0 4294  
0x01D0 4298  
0x01D0 429C  
0x01D0 42A0  
0x01D0 42A4  
0x01D0 42A8  
0x01D0 42AC  
0x01D0 42B0  
0x01D0 42B4  
0x01D0 42B8  
0x01D0 42BC  
XBUF0(1)  
XBUF1(1)  
XBUF2(1)  
XBUF3(1)  
XBUF4(1)  
XBUF5(1)  
XBUF6(1)  
XBUF7(1)  
XBUF8(1)  
XBUF9(1)  
XBUF10(1)  
XBUF11(1)  
XBUF12(1)  
XBUF13(1)  
XBUF14(1)  
XBUF15(1)  
RBUF0(2)  
RBUF1(2)  
RBUF2(2)  
RBUF3(2)  
RBUF4(2)  
RBUF5(2)  
RBUF6(2)  
RBUF7(2)  
RBUF8(2)  
RBUF9(2)  
RBUF10(2)  
RBUF11(2)  
RBUF12(2)  
RBUF13(2)  
RBUF14(2)  
RBUF15(2)  
Transmit buffer register for serializer 0  
Transmit buffer register for serializer 1  
Transmit buffer register for serializer 2  
Transmit buffer register for serializer 3  
Transmit buffer register for serializer 4  
Transmit buffer register for serializer 5  
Transmit buffer register for serializer 6  
Transmit buffer register for serializer 7  
Transmit buffer register for serializer 8  
Transmit buffer register for serializer 9  
Transmit buffer register for serializer 10  
Transmit buffer register for serializer 11  
Transmit buffer register for serializer 12  
Transmit buffer register for serializer 13  
Transmit buffer register for serializer 14  
Transmit buffer register for serializer 15  
Receive buffer register for serializer 0  
Receive buffer register for serializer 1  
Receive buffer register for serializer 2  
Receive buffer register for serializer 3  
Receive buffer register for serializer 4  
Receive buffer register for serializer 5  
Receive buffer register for serializer 6  
Receive buffer register for serializer 7  
Receive buffer register for serializer 8  
Receive buffer register for serializer 9  
Receive buffer register for serializer 10  
Receive buffer register for serializer 11  
Receive buffer register for serializer 12  
Receive buffer register for serializer 13  
Receive buffer register for serializer 14  
Receive buffer register for serializer 15  
(1) Writes to XRBUF originate from peripheral configuration port only when XBUSEL = 1 in XFMT.  
(2) Reads from XRBUF originate on peripheral configuration port only when RBUSEL = 1 in RFMT.  
Table 5-42. McASP Registers Accessed Through DMA Port  
HEX  
McASP0  
McASP1  
REGISTER REGISTER DESCRIPTION  
ADDRESS  
BYTE ADDRESS  
BYTE ADDRESS NAME  
Read  
Accesses  
01D0 2000  
01D0 6000  
01D0 6000  
RBUF  
XBUF  
Receive buffer DMA port address. Cycles through receive serializers,  
skipping over transmit serializers and inactive serializers. Starts at  
the lowest serializer at the beginning of each time slot. Reads from  
DMA port only if XBUSEL = 0 in XFMT.  
Write  
Accesses  
01D0 2000  
Transmit buffer DMA port address. Cycles through transmit  
serializers, skipping over receive and inactive serializers. Starts at  
the lowest serializer at the beginning of each time slot. Writes to  
DMA port only if RBUSEL = 0 in RFMT.  
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Table 5-43. McASP AFIFO Registers Accessed Through Peripheral Configuration Port  
McASP0  
McASP1  
REGISTER NAME  
REGISTER DESCRIPTION  
BYTE ADDRESS  
BYTE ADDRESS  
0x01D0 1000  
0x01D0 1010  
0x01D0 1014  
0x01D0 1018  
0x01D0 101C  
0x01D0 5000  
0x01D0 5010  
0x01D0 5014  
0x01D0 5018  
0x01D0 501C  
AFIFOREV  
WFIFOCTL  
WFIFOSTS  
RFIFOCTL  
RFIFOSTS  
AFIFO revision identification register  
Write FIFO control register  
Write FIFO status register  
Read FIFO control register  
Read FIFO status register  
5.16.2 McASP Electrical Data/Timing  
5.16.2.1 Multichannel Audio Serial Port 0 (McASP0) Timing  
Table 5-44 and Table 5-45 assume testing over recommended operating conditions (see Figure 5-29 and  
Figure 5-30).  
Table 5-44. McASP0 Timing Requirements(1)(2)  
NO.  
MIN  
MAX UNIT  
Cycle time, AHCLKR0 external, AHCLKR0 input  
Cycle time, AHCLKX0 external, AHCLKX0 input  
Pulse duration, AHCLKR0 external, AHCLKR0 input  
Pulse duration, AHCLKX0 external, AHCLKX0 input  
Cycle time, ACLKR0 external, ACLKR0 input  
25  
1
tc(AHCLKRX)  
tw(AHCLKRX)  
tc(ACLKRX)  
tw(ACLKRX)  
ns  
25  
12.5  
2
3
4
ns  
ns  
ns  
12.5  
greater of 2P or 25  
Cycle time, ACLKX0 external, ACLKX0 input  
greater of 2P or 25  
Pulse duration, ACLKR0 external, ACLKR0 input  
Pulse duration, ACLKX0 external, ACLKX0 input  
Setup time, AFSR0 input to ACLKR0 internal(3)  
Setup time, AFSX0 input to ACLKX0 internal  
Setup time, AFSR0 input to ACLKR0 external input(3)  
Setup time, AFSX0 input to ACLKX0 external input  
Setup time, AFSR0 input to ACLKR0 external output(3)  
Setup time, AFSX0 input to ACLKX0 external output  
Hold time, AFSR0 input after ACLKR0 internal(3)  
Hold time, AFSX0 input after ACLKX0 internal  
Hold time, AFSR0 input after ACLKR0 external input(3)  
Hold time, AFSX0 input after ACLKX0 external input  
Hold time, AFSR0 input after ACLKR0 external output(3)  
Hold time, AFSX0 input after ACLKX0 external output  
Setup time, AXR0[n] input to ACLKR0 internal(3)  
Setup time, AXR0[n] input to ACLKX0 internal(4)  
Setup time, AXR0[n] input to ACLKR0 external input(3)  
Setup time, AXR0[n] input to ACLKX0 external input(4)  
Setup time, AXR0[n] input to ACLKR0 external output(3)  
Setup time, AXR0[n] input to ACLKX0 external output(4)  
12.5  
12.5  
9.4  
9.4  
2.9  
2.9  
2.9  
2.9  
-1.2  
-1.2  
0.9  
0.9  
0.9  
0.9  
9.4  
9.4  
2.9  
2.9  
2.9  
2.9  
5
6
7
tsu(AFSRX-ACLKRX)  
th(ACLKRX-AFSRX)  
tsu(AXR-ACLKRX)  
ns  
ns  
ns  
(1) ACLKX0 internal – McASP0 ACLKXCTL.CLKXM = 1, PDIR.ACLKX = 1  
ACLKX0 external input – McASP0 ACLKXCTL.CLKXM = 0, PDIR.ACLKX = 0  
ACLKX0 external output – McASP0 ACLKXCTL.CLKXM = 0, PDIR.ACLKX = 1  
ACLKR0 internal – McASP0 ACLKRCTL.CLKRM = 1, PDIR.ACLKR =1  
ACLKR0 external input – McASP0 ACLKRCTL.CLKRM = 0, PDIR.ACLKR = 0  
ACLKR0 external output – McASP0 ACLKRCTL.CLKRM = 0, PDIR.ACLKR = 1  
(2) P = SYSCLK2 period  
(3) McASP0 ACLKXCTL.ASYNC=1: Receiver is clocked by its own ACLKR0  
(4) McASP0 ACLKXCTL.ASYNC=0: Receiver is clocked by transmitter's ACLKX0  
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Table 5-44. McASP0 Timing Requirements(1)(2) (continued)  
MIN  
-1.3  
-1.3  
0.5  
MAX UNIT  
Hold time, AXR0[n] input after ACLKR0 internal(3)  
Hold time, AXR0[n] input after ACLKX0 internal(4)  
Hold time, AXR0[n] input after ACLKR0 external input(3)  
Hold time, AXR0[n] input after ACLKX0 external input(4)  
Hold time, AXR0[n] input after ACLKR0 external output(3)  
Hold time, AXR0[n] input after ACLKX0 external output(4)  
8
th(ACLKRX-AXR)  
ns  
0.5  
0.5  
0.5  
Table 5-45. McASP0 Switching Characteristics(1)  
NO.  
PARAMETER  
MIN  
25  
MAX UNIT  
Cycle time, AHCLKR0 internal, AHCLKR0 output  
Cycle time, AHCLKR0 external, AHCLKR0 output  
Cycle time, AHCLKX0 internal, AHCLKX0 output  
Cycle time, AHCLKX0 external, AHCLKX0 output  
25  
9
tc(AHCLKRX)  
tw(AHCLKRX)  
tc(ACLKRX)  
tw(ACLKRX)  
ns  
25  
25  
Pulse duration, AHCLKR0 internal, AHCLKR0 output  
Pulse duration, AHCLKR0 external, AHCLKR0 output  
Pulse duration, AHCLKX0 internal, AHCLKX0 output  
Pulse duration, AHCLKX0 external, AHCLKX0 output  
Cycle time, ACLKR0 internal, ACLKR0 output  
Cycle time, ACLKR0 external, ACLKR0 output  
Cycle time, ACLKX0 internal, ACLKX0 output  
Cycle time, ACLKX0 external, ACLKX0 output  
Pulse duration, ACLKR0 internal, ACLKR0 output  
Pulse duration, ACLKR0 external, ACLKR0 output  
Pulse duration, ACLKX0 internal, ACLKX0 output  
Pulse duration, ACLKX0 external, ACLKX0 output  
Delay time, ACLKR0 internal, AFSR output(7)  
Delay time, ACLKX0 internal, AFSX output  
(AHR/2) – 2.5(2)  
(AHR/2) – 2.5(2)  
(AHX/2) – 2.5(3)  
(AHX/2) – 2.5(3)  
10  
11  
12  
ns  
ns  
ns  
greater of 2P or 25(4)  
greater of 2P or 25(4)  
greater of 2P or 25(4)  
greater of 2P or 25(4)  
(AR/2) – 2.5(5)  
(AR/2) – 2.5(5)  
(AX/2) – 2.5(6)  
(AX/2) – 2.5(6)  
0
0
5.8  
5.8  
Delay time, ACLKR0 external input, AFSR output(7)  
Delay time, ACLKX0 external input, AFSX output  
Delay time, ACLKR0 external output, AFSR output(7)  
Delay time, ACLKX0 external output, AFSX output  
Delay time, ACLKX0 internal, AXR0[n] output  
Delay time, ACLKX0 external input, AXR0[n] output  
Delay time, ACLKX0 external output, AXR0[n] output  
Disable time, ACLKX0 internal, AXR0[n] output  
Disable time, ACLKX0 external input, AXR0[n] output  
Disable time, ACLKX0 external output, AXR0[n] output  
2.5  
2.5  
2.5  
2.5  
0
11.6  
ns  
13  
td(ACLKRX-AFSRX)  
11.6  
11.6  
11.6  
5.8  
14  
15  
td(ACLKX-AXRV)  
2.5  
2.5  
0
11.6  
11.6  
5.8  
ns  
ns  
tdis(ACLKX-AXRHZ)  
3
11.6  
11.6  
3
(1) McASP0 ACLKX0 internal – ACLKXCTL.CLKXM = 1, PDIR.ACLKX = 1  
ACLKX0 external input – McASP0 ACLKXCTL.CLKXM = 0, PDIR.ACLKX = 0  
ACLKX0 external output – McASP0ACLKXCTL.CLKXM = 0, PDIR.ACLKX = 1  
ACLKR0 internal – McASP0 ACLKR0CTL.CLKRM = 1, PDIR.ACLKR =1  
ACLKR0 external input – McASP0 ACLKRCTL.CLKRM = 0, PDIR.ACLKR = 0  
ACLKR0 external output – McASP0 ACLKRCTL.CLKRM = 0, PDIR.ACLKR = 1  
(2) AHR - Cycle time, AHCLKR0.  
(3) AHX - Cycle time, AHCLKX0.  
(4) P = SYSCLK2 period  
(5) AR - ACLKR0 period.  
(6) AX - ACLKX0 period.  
(7) McASP0 ACLKXCTL.ASYNC=1: Receiver is clocked by its own ACLKR0  
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5.16.2.2 Multichannel Audio Serial Port 1 (McASP1) Timing  
Table 5-46 and Table 5-47 assume testing over recommended operating conditions (see Figure 5-29 and  
Figure 5-30).  
Table 5-46. McASP1 Timing Requirements(1)(2)  
NO.  
MIN  
MAX UNIT  
Cycle time, AHCLKR1 external, AHCLKR1 input  
Cycle time, AHCLKX1 external, AHCLKX1 input  
Pulse duration, AHCLKR1 external, AHCLKR1 input  
Pulse duration, AHCLKX1 external, AHCLKX1 input  
Cycle time, ACLKR1 external, ACLKR1 input  
25  
1
tc(AHCLKRX)  
tw(AHCLKRX)  
tc(ACLKRX)  
tw(ACLKRX)  
ns  
25  
12.5  
2
3
4
ns  
ns  
ns  
12.5  
greater of 2P or 25  
Cycle time, ACLKX1 external, ACLKX1 input  
greater of 2P or 25  
Pulse duration, ACLKR1 external, ACLKR1 input  
Pulse duration, ACLKX1 external, ACLKX1 input  
Setup time, AFSR1 input to ACLKR1 internal(3)  
Setup time, AFSX1 input to ACLKX1 internal  
Setup time, AFSR1 input to ACLKR1 external input(3)  
Setup time, AFSX1 input to ACLKX1 external input  
Setup time, AFSR1 input to ACLKR1 external output(3)  
Setup time, AFSX1 input to ACLKX1 external output  
Hold time, AFSR1 input after ACLKR1 internal(3)  
Hold time, AFSX1 input after ACLKX1 internal  
Hold time, AFSR1 input after ACLKR1 external input(3)  
Hold time, AFSX1 input after ACLKX1 external input  
Hold time, AFSR1 input after ACLKR1 external output(3)  
Hold time, AFSX1 input after ACLKX1 external output  
Setup time, AXR1[n] input to ACLKR1 internal(3)  
Setup time, AXR1[n] input to ACLKX1 internal(4)  
Setup time, AXR1[n] input to ACLKR1 external input(3)  
Setup time, AXR1[n] input to ACLKX1 external input(4)  
Setup time, AXR1[n] input to ACLKR1 external output(3)  
Setup time, AXR1[n] input to ACLKX1 external output(4)  
Hold time, AXR1[n] input after ACLKR1 internal(3)  
Hold time, AXR1[n] input after ACLKX1 internal(4)  
Hold time, AXR1[n] input after ACLKR1 external input(3)  
Hold time, AXR1[n] input after ACLKX1 external input(4)  
Hold time, AXR1[n] input after ACLKR1 external output(3)  
Hold time, AXR1[n] input after ACLKX1 external output(4)  
12.5  
12.5  
10.4  
10.4  
2.6  
5
6
7
8
tsu(AFSRX-ACLKRX)  
th(ACLKRX-AFSRX)  
tsu(AXR-ACLKRX)  
th(ACLKRX-AXR)  
ns  
ns  
ns  
ns  
2.6  
2.6  
2.6  
-1.9  
-1.9  
0.7  
0.7  
0.7  
0.7  
10.4  
10.4  
2.6  
2.6  
2.6  
2.6  
-1.8  
-1.8  
0.5  
0.5  
0.5  
0.5  
(1) ACLKX1 internal – McASP1 ACLKXCTL.CLKXM = 1, PDIR.ACLKX = 1  
ACLKX1 external input – McASP1 ACLKXCTL.CLKXM = 0, PDIR.ACLKX = 0  
ACLKX1 external output – McASP1 ACLKXCTL.CLKXM = 0, PDIR.ACLKX = 1  
ACLKR1 internal – McASP1 ACLKRCTL.CLKRM = 1, PDIR.ACLKR =1  
ACLKR1 external input – McASP1 ACLKRCTL.CLKRM = 0, PDIR.ACLKR = 0  
ACLKR1 external output – McASP1 ACLKRCTL.CLKRM = 0, PDIR.ACLKR = 1  
(2) P = SYSCLK2 period  
(3) McASP1 ACLKXCTL.ASYNC=1: Receiver is clocked by its own ACLKR1  
(4) McASP1 ACLKXCTL.ASYNC=0: Receiver is clocked by transmitter's ACLKX1  
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Table 5-47. McASP1 Switching Characteristics(1)  
PARAMETER  
MIN  
MAX UNIT  
Cycle time, AHCLKR1 internal, AHCLKR1 output  
Cycle time, AHCLKR1 external, AHCLKR1 output  
Cycle time, AHCLKX1 internal, AHCLKX1 output  
Cycle time, AHCLKX1 external, AHCLKX1 output  
Pulse duration, AHCLKR1 internal, AHCLKR1 output  
Pulse duration, AHCLKR1 external, AHCLKR1 output  
Pulse duration, AHCLKX1 internal, AHCLKX1 output  
Pulse duration, AHCLKX1 external, AHCLKX1 output  
Cycle time, ACLKR1 internal, ACLKR1 output  
Cycle time, ACLKR1 external, ACLKR1 output  
Cycle time, ACLKX1 internal, ACLKX1 output  
Cycle time, ACLKX1 external, ACLKX1 output  
Pulse duration, ACLKR1 internal, ACLKR1 output  
Pulse duration, ACLKR1 external, ACLKR1 output  
Pulse duration, ACLKX1 internal, ACLKX1 output  
Pulse duration, ACLKX1 external, ACLKX1 output  
Delay time, ACLKR1 internal, AFSR output(7)  
Delay time, ACLKX1 internal, AFSX output  
Delay time, ACLKR1 external input, AFSR output(7)  
Delay time, ACLKX1 external input, AFSX output  
Delay time, ACLKR1 external output, AFSR output(7)  
Delay time, ACLKX1 external output, AFSX output  
Delay time, ACLKX1 internal, AXR1[n] output  
Delay time, ACLKX1 external input, AXR1[n] output  
Delay time, ACLKX1 external output, AXR1[n] output  
Disable time, ACLKX1 internal, AXR1[n] output  
Disable time, ACLKX1 external input, AXR1[n] output  
Disable time, ACLKX1 external output, AXR1[n] output  
25  
25  
9
tc(AHCLKRX)  
ns  
25  
25  
(AHR/2) – 2.5(2)  
(AHR/2) – 2.5(2)  
(AHX/2) – 2.5(3)  
(AHX/2) – 2.5(3)  
10  
11  
12  
tw(AHCLKRX)  
tc(ACLKRX)  
tw(ACLKRX)  
ns  
ns  
ns  
greater of 2P or 25(4)  
greater of 2P or 25(4)  
greater of 2P or 25(4)  
greater of 2P or 25(4)  
(AR/2) – 2.5(5)  
(AR/2) – 2.5(5)  
(AX/2) – 2.5(6)  
(AX/2) – 2.5(6)  
0.5  
0.5  
3.4  
3.4  
3.4  
3.4  
0.5  
3.4  
3.4  
0.5  
3.9  
3.9  
6.7  
6.7  
13.8  
ns  
13  
td(ACLKRX-AFSRX)  
13.8  
13.8  
13.8  
6.7  
14  
15  
td(ACLKX-AXRV)  
13.8  
13.8  
6.7  
ns  
ns  
tdis(ACLKX-AXRHZ)  
13.8  
13.8  
(1) McASP1 ACLKX1 internal – ACLKXCTL.CLKXM = 1, PDIR.ACLKX = 1  
McASP1 ACLKX1 external input – ACLKXCTL.CLKXM = 0, PDIR.ACLKX = 0  
McASP1 ACLKX1 external output – ACLKXCTL.CLKXM = 0, PDIR.ACLKX = 1  
McASP1 ACLKR1 internal – ACLKR1CTL.CLKRM = 1, PDIR.ACLKR =1  
McASP1 ACLKR1 external input – ACLKRCTL.CLKRM = 0, PDIR.ACLKR = 0  
McASP1 ACLKR1 external output – ACLKRCTL.CLKRM = 0, PDIR.ACLKR = 1  
(2) AHR - Cycle time, AHCLKR1.  
(3) AHX - Cycle time, AHCLKX1.  
(4) P = SYSCLK2 period  
(5) AR - ACLKR1 period.  
(6) AX - ACLKX1 period.  
(7) McASP1 ACLKXCTL.ASYNC=1: Receiver is clocked by its own ACLKR1  
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2
1
2
AHCLKR/X (Falling Edge Polarity)  
AHCLKR/X (Rising Edge Polarity)  
4
3
4
(A)  
ACLKR/X (CLKRP = CLKXP = 0)  
(B)  
ACLKR/X (CLKRP = CLKXP = 1)  
6
5
AFSR/X (Bit Width, 0 Bit Delay)  
AFSR/X (Bit Width, 1 Bit Delay)  
AFSR/X (Bit Width, 2 Bit Delay)  
AFSR/X (Slot Width, 0 Bit Delay)  
AFSR/X (Slot Width, 1 Bit Delay)  
AFSR/X (Slot Width, 2 Bit Delay)  
8
7
AXR[n] (Data In/Receive)  
A0 A1  
A30 A31 B0 B1  
B30 B31 C0 C1 C2 C3  
C31  
A. For CLKRP = CLKXP = 0, the McASP transmitter is configured for rising edge (to shift data out) and the McASP  
receiver is configured for falling edge (to shift data in).  
B. For CLKRP = CLKXP = 1, the McASP transmitter is configured for falling edge (to shift data out) and the McASP  
receiver is configured for rising edge (to shift data in).  
Figure 5-29. McASP Input Timings  
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10  
10  
9
AHCLKR/X (Falling Edge Polarity)  
AHCLKR/X (Rising Edge Polarity)  
12  
11  
12  
(A)  
ACLKR/X (CLKRP = CLKXP = 1)  
(B)  
ACLKR/X (CLKRP = CLKXP = 0)  
13  
13  
13  
13  
AFSR/X (Bit Width, 0 Bit Delay)  
AFSR/X (Bit Width, 1 Bit Delay)  
AFSR/X (Bit Width, 2 Bit Delay)  
AFSR/X (Slot Width, 0 Bit Delay)  
AFSR/X (Slot Width, 1 Bit Delay)  
AFSR/X (Slot Width, 2 Bit Delay)  
AXR[n] (Data Out/Transmit)  
13  
13  
13  
14  
15  
A0 A1  
A30 A31 B0 B1  
B30 B31 C0 C1 C2 C3  
C31  
A. For CLKRP = CLKXP = 1, the McASP transmitter is configured for falling edge (to shift data out) and the McASP  
receiver is configured for rising edge (to shift data in).  
B. For CLKRP = CLKXP = 0, the McASP transmitter is configured for rising edge (to shift data out) and the McASP  
receiver is configured for falling edge (to shift data in).  
Figure 5-30. McASP Output Timings  
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5.17 Serial Peripheral Interface Ports (SPI0)  
Figure 5-31 is a block diagram of the SPI module, which is a simple shift register and buffer plus control  
logic. Data is written to the shift register before transmission occurs and is read from the buffer at the end  
of transmission. The SPI can operate either as a master, in which case, it initiates a transfer and drives  
the SPIx_CLK pin, or as a slave. Four clock phase and polarity options are supported as well as many  
data formatting options.  
SPIx_SIMO  
SPIx_SOMI  
Peripheral  
16-Bit Shift Register  
16-Bit Buffer  
Configuration Bus  
SPIx_ENA  
SPIx_SCS  
SPIx_CLK  
State  
Machine  
GPIO  
Control  
(all pins)  
Interrupt and  
Clock  
Control  
DMA Requests  
Figure 5-31. Block Diagram of SPI Module  
The SPI supports 3-, 4-, and 5-pin operation with three basic pins (SPIx_CLK, SPIx_SIMO, and  
SPIx_SOMI) and two optional pins (SPIx_SCS, SPIx_ENA).  
The optional SPIx_SCS (Slave Chip Select) pin is most useful to enable in slave mode when there are  
other slave devices on the same SPI port. The C6743 will only shift data and drive the SPIx_SOMI pin  
when SPIx_SCS is held low.  
In slave mode, SPIx_ENA is an optional output and can be driven in either a push-pull or open-drain  
manner. The SPIx_ENA output provides the status of the internal transmit buffer (SPIDAT0/1 registers). In  
four-pin mode with the enable option, SPIx_ENA is asserted only when the transmit buffer is full, indicating  
that the slave is ready to begin another transfer. In five-pin mode, the SPIx_ENA is additionally qualified  
by SPIx_SCS being asserted. This allows a single handshake line to be shared by multiple slaves on the  
same SPI bus.  
In master mode, the SPIx_ENA pin is an optional input and the master can be configured to delay the start  
of the next transfer until the slave asserts SPIx_ENA. The addition of this handshake signal simplifies SPI  
communications and, on average, increases SPI bus throughput since the master does not need to delay  
each transfer long enough to allow for the worst-case latency of the slave device. Instead, each transfer  
can begin as soon as both the master and slave have actually serviced the previous SPI transfer.  
Although the SPI module supports two interrupt outputs, SPIx_INT1 is the only interrupt connected on this  
device. See the TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide (SPRUFK9)  
for more details.  
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Optional − Slave Chip Select  
Optional Enable (Ready)  
SPIx_SCS  
SPIx_ENA  
SPIx_CLK  
SPIx_SOMI  
SPIx_SIMO  
SPIx_SCS  
SPIx_ENA  
SPIx_CLK  
SPIx_SOMI  
SPIx_SIMO  
MASTER SPI  
SLAVE SPI  
Figure 5-32. Illustration of SPI Master-to-SPI Slave Connection  
5.17.1 SPI Peripheral Registers Description(s)  
Table 5-48 is a list of the SPI registers.  
Table 5-48. SPIx Configuration Registers  
SPI0  
BYTE ADDRESS  
REGISTER NAME  
REGISTER DESCRIPTION  
0x01C4 1000  
0x01C4 1004  
0x01C4 1008  
0x01C4 100C  
0x01C4 1010  
0x01C4 1014  
0x01C4 1018  
0x01C4 101C  
0x01C4 1020  
0x01C4 1024  
0x01C4 1028  
0x01C4 102C  
0x01C4 1030  
0x01C4 1034  
0x01C4 1038  
0x01C4 103C  
0x01C4 1040  
0x01C4 1044  
SPIGCR0  
SPIGCR1  
SPIINT0  
SPILVL  
Global Control Register 0  
Global Control Register 1  
Interrupt Register  
Interrupt Level Register  
SPIFLG  
SPIPC0  
SPIPC1  
SPIPC2  
SPIPC3  
SPIPC4  
SPIPC5  
Reserved  
Reserved  
Reserved  
SPIDAT0  
SPIDAT1  
SPIBUF  
SPIEMU  
Flag Register  
Pin Control Register 0 (Pin Function)  
Pin Control Register 1 (Pin Direction)  
Pin Control Register 2 (Pin Data In)  
Pin Control Register 3 (Pin Data Out)  
Pin Control Register 4 (Pin Data Set)  
Pin Control Register 5 (Pin Data Clear)  
Reserved - Do not write to this register  
Reserved - Do not write to this register  
Reserved - Do not write to this register  
Shift Register 0 (without format select)  
Shift Register 1 (with format select)  
Buffer Register  
Emulation Register  
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Table 5-48. SPIx Configuration Registers (continued)  
SPI0  
BYTE ADDRESS  
REGISTER NAME  
REGISTER DESCRIPTION  
0x01C4 1048  
0x01C4 104C  
0x01C4 1050  
0x01C4 1054  
0x01C4 1058  
0x01C4 105C  
0x01C4 1060  
0x01C4 1064  
SPIDELAY  
SPIDEF  
Delay Register  
Default Chip Select Register  
Format Register 0  
SPIFMT0  
SPIFMT1  
SPIFMT2  
SPIFMT3  
Reserved  
INTVEC1  
Format Register 1  
Format Register 2  
Format Register 3  
Reserved - Do not write to this register  
Interrupt Vector for SPI INT1  
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5.17.2 SPI Electrical Data/Timing  
5.17.2.1 Serial Peripheral Interface (SPI) Timing  
Table 5-49 assumes testing over recommended operating conditions (see Figure 5-33 through Figure 5-  
36).  
Table 5-49. General Timing Requirements for SPI0 Master Modes(1)  
NO.  
1
MIN  
greater of 3P or 20  
0.5tc(SPC)M - 1  
MAX UNIT  
tc(SPC)M  
Cycle Time, SPI0_CLK, All Master Modes  
Pulse Width High, SPI0_CLK, All Master Modes  
Pulse Width Low, SPI0_CLK, All Master Modes  
256P  
ns  
ns  
ns  
2
tw(SPCH)M  
tw(SPCL)M  
3
0.5tc(SPC)M - 1  
Polarity = 0, Phase = 0,  
to SPI0_CLK rising  
5
Polarity = 0, Phase = 1,  
to SPI0_CLK rising  
-0.5tc(SPC)M + 5  
Delay, initial data bit valid on  
SPI0_SIMO after initial edge  
on SPI0_CLK(2)  
4
5
6
7
8
td(SIMO_SPC)M  
td(SPC_SIMO)M  
toh(SPC_SIMO)M  
tsu(SOMI_SPC)M  
tih(SPC_SOMI)M  
ns  
ns  
ns  
ns  
ns  
Polarity = 1, Phase = 0,  
to SPI0_CLK falling  
5
Polarity = 1, Phase = 1,  
to SPI0_CLK falling  
-0.5tc(SPC)M + 5  
Polarity = 0, Phase = 0,  
from SPI0_CLK rising  
5
5
5
5
Polarity = 0, Phase = 1,  
from SPI0_CLK falling  
Delay, subsequent bits valid  
on SPI0_SIMO after transmit  
edge of SPI0_CLK  
Polarity = 1, Phase = 0,  
from SPI0_CLK falling  
Polarity = 1, Phase = 1,  
from SPI0_CLK rising  
Polarity = 0, Phase = 0,  
from SPI0_CLK falling  
0.5tc(SPC)M -3  
Polarity = 0, Phase = 1,  
from SPI0_CLK rising  
0.5tc(SPC)M -3  
Output hold time, SPI0_SIMO  
valid after  
receive edge of SPI0_CLK  
Polarity = 1, Phase = 0,  
from SPI0_CLK rising  
0.5tc(SPC)M -3  
Polarity = 1, Phase = 1,  
from SPI0_CLK falling  
0.5tc(SPC)M -3  
Polarity = 0, Phase = 0,  
to SPI0_CLK falling  
0
0
0
0
5
5
5
5
Polarity = 0, Phase = 1,  
to SPI0_CLK rising  
Input Setup Time, SPI0_SOMI  
valid before  
receive edge of SPI0_CLK  
Polarity = 1, Phase = 0,  
to SPI0_CLK rising  
Polarity = 1, Phase = 1,  
to SPI0_CLK falling  
Polarity = 0, Phase = 0,  
from SPI0_CLK falling  
Polarity = 0, Phase = 1,  
from SPI0_CLK rising  
Input Hold Time, SPI0_SOMI  
valid after  
receive edge of SPI0_CLK  
Polarity = 1, Phase = 0,  
from SPI0_CLK rising  
Polarity = 1, Phase = 1,  
from SPI0_CLK falling  
(1) P = SYSCLK2 period  
(2) First bit may be MSB or LSB depending upon SPI configuration. MO(0) refers to first bit and MO(n) refers to last bit output on  
SPI0_SIMO. MI(0) refers to the first bit input and MI(n) refers to the last bit input on SPI0_SOMI.  
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Table 5-50. General Timing Requirements for SPI0 Slave Modes(1)  
NO.  
9
MIN  
MAX UNIT  
tc(SPC)S  
Cycle Time, SPI0_CLK, All Slave Modes  
Pulse Width High, SPI0_CLK, All Slave Modes  
Pulse Width Low, SPI0_CLK, All Slave Modes  
greater of 3P or 40  
ns  
ns  
ns  
10  
11  
tw(SPCH)S  
tw(SPCL)S  
18  
18  
Polarity = 0, Phase = 0,  
to SPI0_CLK rising  
2P  
2P  
2P  
2P  
Polarity = 0, Phase = 1,  
to SPI0_CLK rising  
Setup time, transmit data written to  
SPI before initial clock edge from  
master.(2) (3)  
12  
13  
14  
15  
16  
tsu(SOMI_SPC)S  
td(SPC_SOMI)S  
toh(SPC_SOMI)S  
tsu(SIMO_SPC)S  
tih(SPC_SIMO)S  
ns  
Polarity = 1, Phase = 0,  
to SPI0_CLK falling  
Polarity = 1, Phase = 1,  
to SPI0_CLK falling  
Polarity = 0, Phase = 0,  
from SPI0_CLK rising  
18.5  
Polarity = 0, Phase = 1,  
from SPI0_CLK falling  
18.5  
ns  
Delay, subsequent bits valid on  
SPI0_SOMI after transmit edge of  
SPI0_CLK  
Polarity = 1, Phase = 0,  
from SPI0_CLK falling  
18.5  
Polarity = 1, Phase = 1,  
from SPI0_CLK rising  
18.5  
Polarity = 0, Phase = 0,  
from SPI0_CLK falling  
0.5tc(SPC)S -3  
Polarity = 0, Phase = 1,  
from SPI0_CLK rising  
0.5tc(SPC)S -3  
Output hold time, SPI0_SOMI valid  
after  
receive edge of SPI0_CLK  
ns  
Polarity = 1, Phase = 0,  
from SPI0_CLK rising  
0.5tc(SPC)S -3  
Polarity = 1, Phase = 1,  
from SPI0_CLK falling  
0.5tc(SPC)S -3  
Polarity = 0, Phase = 0,  
to SPI0_CLK falling  
0
0
0
0
5
5
5
5
Polarity = 0, Phase = 1,  
to SPI0_CLK rising  
Input Setup Time, SPI0_SIMO valid  
before  
receive edge of SPI0_CLK  
ns  
Polarity = 1, Phase = 0,  
to SPI0_CLK rising  
Polarity = 1, Phase = 1,  
to SPI0_CLK falling  
Polarity = 0, Phase = 0,  
from SPI0_CLK falling  
Polarity = 0, Phase = 1,  
from SPI0_CLK rising  
Input Hold Time, SPI0_SIMO valid  
after  
receive edge of SPI0_CLK  
ns  
Polarity = 1, Phase = 0,  
from SPI0_CLK rising  
Polarity = 1, Phase = 1,  
from SPI0_CLK falling  
(1) P = SYSCLK2 period  
(2) First bit may be MSB or LSB depending upon SPI configuration. SO(0) refers to first bit and SO(n) refers to last bit output on  
SPI0_SOMI. SI(0) refers to the first bit input and SI(n) refers to the last bit input on SPI0_SIMO.  
(3) Measured from the termination of the write of new data to the SPI module, In analyzing throughput requirements, additional internal bus  
cycles must be accounted for to allow data to be written to the SPI module by the DSP CPU.  
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Table 5-51. Additional(1) SPI0 Master Timings, 4-Pin Enable Option(2) (3)  
MIN  
MAX UNIT  
3P + 3.6  
Polarity = 0, Phase = 0,  
to SPI0_CLK rising  
Polarity = 0, Phase = 1,  
to SPI0_CLK rising  
0.5tc(SPC)M + 3P + 3.6  
3P + 3.6  
Delay from slave assertion of  
SPI0_ENA active to first SPI0_CLK  
from master.(4)  
17  
td(ENA_SPC)M  
ns  
Polarity = 1, Phase = 0,  
to SPI0_CLK falling  
Polarity = 1, Phase = 1,  
to SPI0_CLK falling  
0.5tc(SPC)M + 3P + 3.6  
0.5tc(SPC)M + P + 5  
P + 5  
Polarity = 0, Phase = 0,  
from SPI0_CLK falling  
Polarity = 0, Phase = 1,  
from SPI0_CLK falling  
Max delay for slave to deassert  
SPI0_ENA after final SPI0_CLK edge  
to ensure master does not begin the  
next transfer.(5)  
18  
td(SPC_ENA)M  
ns  
Polarity = 1, Phase = 0,  
from SPI0_CLK rising  
0.5tc(SPC)M + P + 5  
P + 5  
Polarity = 1, Phase = 1,  
from SPI0_CLK rising  
(1) These parameters are in addition to the general timings for SPI master modes (Table 5-49).  
(2) P = SYSCLK2 period  
(3) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four master clocking modes.  
(4) In the case where the master SPI is ready with new data before SPI0_ENA assertion.  
(5) In the case where the master SPI is ready with new data before SPI0_EN A deassertion.  
Table 5-52. Additional(1) SPI0 Master Timings, 4-Pin Chip Select Option(2) (3)  
NO.  
PARAMETER  
MIN  
MAX UNIT  
Polarity = 0, Phase = 0,  
to SPI0_CLK rising  
2P - 5  
Polarity = 0, Phase = 1,  
to SPI0_CLK rising  
0.5tc(SPC)M + 2P - 5  
2P - 5  
Delay from SPI0_SCS active to first  
SPI0_CLK(4) (5)  
19  
td(SCS_SPC)M  
ns  
Polarity = 1, Phase = 0,  
to SPI0_CLK falling  
Polarity = 1, Phase = 1,  
to SPI0_CLK falling  
0.5tc(SPC)M + 2P - 5  
0.5tc(SPC)M +P - 3  
P - 3  
Polarity = 0, Phase = 0,  
from SPI0_CLK falling  
Polarity = 0, Phase = 1,  
from SPI0_CLK falling  
Delay from final SPI0_CLK edge to  
master deasserting SPI0_SCS  
20  
td(SPC_SCS)M  
ns  
(6) (7)  
Polarity = 1, Phase = 0,  
from SPI0_CLK rising  
0.5tc(SPC)M + P -3  
P - 3  
Polarity = 1, Phase = 1,  
from SPI0_CLK rising  
(1) These parameters are in addition to the general timings for SPI master modes (Table 5-49).  
(2) P = SYSCLK2 period  
(3) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four master clocking modes.  
(4) In the case where the master SPI is ready with new data before SPI0_SCS assertion.  
(5) This delay can be increased under software control by the register bit field SPIDELAY.C2TDELAY[4:0].  
(6) Except for modes when SPIDAT1.CSHOLD is enabled and there is additional data to transmit. In this case, SPI0_SCS will remain  
asserted.  
(7) This delay can be increased under software control by the register bit field SPIDELAY.T2CDELAY[4:0].  
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MAX UNIT  
Table 5-53. Additional(1) SPI0 Master Timings, 5-Pin Option(2) (3)  
NO.  
MIN  
Polarity = 0, Phase = 0,  
from SPI0_CLK falling  
0.5tc(SPC)M+ P + 5  
Max delay for slave to  
deassert SPI0_ENA after final  
SPI0_CLK edge to ensure  
master does not begin the  
next transfer.(4)  
Polarity = 0, Phase = 1,  
from SPI0_CLK falling  
P + 5  
0.5tc(SPC)M+ P + 5  
P + 5  
18  
td(SPC_ENA)M  
ns  
Polarity = 1, Phase = 0,  
from SPI0_CLK rising  
Polarity = 1, Phase = 1,  
from SPI0_CLK rising  
Polarity = 0, Phase = 0,  
from SPI0_CLK falling  
0.5tc(SPC)M+ P - 3  
P - 3  
0.5tc(SPC)M+ P - 3  
P - 3  
Polarity = 0, Phase = 1,  
from SPI0_CLK falling  
Delay from final SPI0_CLK  
edge to  
20  
21  
22  
td(SPC_SCS)M  
td(SCSL_ENAL)M  
td(SCS_SPC)M  
ns  
ns  
ns  
master deasserting  
Polarity = 1, Phase = 0,  
from SPI0_CLK rising  
(5) (6)  
SPI0_SCS  
Polarity = 1, Phase = 1,  
from SPI0_CLK rising  
Max delay for slave SPI to drive SPI0_ENA valid after  
master asserts SPI0_SCS to delay the  
master from beginning the next transfer,  
C2TDELAY + P  
Polarity = 0, Phase = 0,  
to SPI0_CLK rising  
2P - 5  
0.5tc(SPC)M + 2P - 5  
2P - 5  
Polarity = 0, Phase = 1,  
to SPI0_CLK rising  
Delay from SPI0_SCS active  
to first SPI0_CLK(7) (8) (9)  
Polarity = 1, Phase = 0,  
to SPI0_CLK falling  
Polarity = 1, Phase = 1,  
to SPI0_CLK falling  
0.5tc(SPC)M + 2P - 5  
Polarity = 0, Phase = 0,  
to SPI0_CLK rising  
3P + 3.6  
0.5tc(SPC)M + 3P + 3.6  
3P + 3.6  
Polarity = 0, Phase = 1,  
to SPI0_CLK rising  
Delay from assertion of  
SPI0_ENA low to first  
SPI0_CLK edge.(10)  
23  
td(ENA_SPC)M  
ns  
Polarity = 1, Phase = 0,  
to SPI0_CLK falling  
Polarity = 1, Phase = 1,  
to SPI0_CLK falling  
0.5tc(SPC)M + 3P + 3.6  
(1) These parameters are in addition to the general timings for SPI master modes (Table 5-50).  
(2) P = SYSCLK2 period  
(3) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four master clocking modes.  
(4) In the case where the master SPI is ready with new data before SPI0_ENA deassertion.  
(5) Except for modes when SPIDAT1.CSHOLD is enabled and there is additional data to transmit. In this case, SPI0_SCS will remain  
asserted.  
(6) This delay can be increased under software control by the register bit field SPIDELAY.T2CDELAY[4:0].  
(7) If SPI0_ENA is asserted immediately such that the transmission is not delayed by SPI0_ENA.  
(8) In the case where the master SPI is ready with new data before SPI0_SCS assertion.  
(9) This delay can be increased under software control by the register bit field SPIDELAY.C2TDELAY[4:0].  
(10) If SPI0_ENA was initially deasserted high and SPI0_CLK is delayed.  
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Table 5-54. Additional(1) SPI0 Slave Timings, 4-Pin Enable Option(2) (3)  
MIN  
1.5 P - 3  
– 0.5tc(SPC)M + 1.5 P - 3 – 0.5tc(SPC)M + 2.5 P + 18.5  
1.5 P - 3 2.5 P + 18.5  
– 0.5tc(SPC)M + 1.5 P - 3 – 0.5tc(SPC)M + 2.5 P + 18.5  
MAX UNIT  
Polarity = 0, Phase = 0,  
from SPI0_CLK falling  
2.5 P + 18.5  
Polarity = 0, Phase = 1,  
from SPI0_CLK falling  
Delay from final  
SPI0_CLK edge to  
slave deasserting  
SPI0_ENA.  
24  
td(SPC_ENAH)S  
ns  
Polarity = 1, Phase = 0,  
from SPI0_CLK rising  
Polarity = 1, Phase = 1,  
from SPI0_CLK rising  
(1) These parameters are in addition to the general timings for SPI slave modes (Table 5-50).  
(2) P = SYSCLK2 period  
(3) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four slave clocking modes.  
Table 5-55. Additional(1) SPI0 Slave Timings, 4-Pin Chip Select Option(2) (3)  
NO.  
MIN  
MAX UNIT  
Required delay from SPI0_SCS asserted at slave to first  
SPI0_CLK edge at slave.  
25  
td(SCSL_SPC)S  
2P  
ns  
Polarity = 0, Phase = 0,  
from SPI0_CLK falling  
0.5tc(SPC)M + P + 5  
P + 5  
Polarity = 0, Phase = 1,  
Required delay from final  
from SPI0_CLK falling  
26  
td(SPC_SCSH)S  
SPI0_CLK edge before  
ns  
Polarity = 1, Phase = 0,  
SPI0_SCS is deasserted.  
0.5tc(SPC)M + P + 5  
P + 5  
from SPI0_CLK rising  
Polarity = 1, Phase = 1,  
from SPI0_CLK rising  
Delay from master asserting SPI0_SCS to slave driving  
SPI0_SOMI valid  
27  
28  
tena(SCSL_SOMI)S  
tdis(SCSH_SOMI)S  
P + 18.5  
P + 18.5  
Delay from master deasserting SPI0_SCS to slave 3-stating  
SPI0_SOMI  
(1) These parameters are in addition to the general timings for SPI slave modes (Table 5-50).  
(2) P = SYSCLK2 period  
(3) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four slave clocking modes.  
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Table 5-56. Additional(1) SPI0 Slave Timings, 5-Pin Option(2) (3)  
NO.  
PARAMETER  
MIN  
MAX UNIT  
Required delay from SPI0_SCS asserted at slave to first  
SPI0_CLK edge at slave.  
25  
td(SCSL_SPC)S  
2P  
ns  
Polarity = 0, Phase = 0,  
from SPI0_CLK falling  
0.5tc(SPC)M + 5  
Polarity = 0, Phase = 1,  
from SPI0_CLK falling  
5
0.5tc(SPC)M + 5  
5
Required delay from final SPI0_CLK  
edge before SPI0_SCS is  
deasserted.  
26  
td(SPC_SCSH)S  
ns  
Polarity = 1, Phase = 0,  
from SPI0_CLK rising  
Polarity = 1, Phase = 1,  
from SPI0_CLK rising  
Delay from master asserting SPI0_SCS to slave driving  
SPI0_SOMI valid  
27  
28  
29  
tena(SCSL_SOMI)S  
tdis(SCSH_SOMI)S  
tena(SCSL_ENA)S  
P + 18.5  
ns  
ns  
ns  
Delay from master deasserting SPI0_SCS to slave 3-stating  
SPI0_SOMI  
P + 18.5  
18.5  
Delay from master deasserting SPI0_SCS to slave driving  
SPI0_ENA valid  
Polarity = 0, Phase = 0,  
from SPI0_CLK falling  
2.5 P + 18.5  
2.5 P + 18.5  
2.5 P + 18.5  
2.5 P + 18.5  
Polarity = 0, Phase = 1,  
Delay from final clock receive edge  
from SPI0_CLK rising  
30  
tdis(SPC_ENA)S  
on SPI0_CLK to slave 3-stating or  
ns  
driving high SPI0_ENA.(4)  
Polarity = 1, Phase = 0,  
from SPI0_CLK rising  
Polarity = 1, Phase = 1,  
from SPI0_CLK falling  
(1) These parameters are in addition to the general timings for SPI slave modes (Table 5-50).  
(2) P = SYSCLK2 period  
(3) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four slave clocking modes.  
(4) SPI0_ENA is driven low after the transmission completes if the SPIINT0.ENABLE_HIGHZ bit is programmed to 0. Otherwise it is tri-  
stated. If tri-stated, an external pullup resistor should be used to provide a valid level to the master. This option is useful when tying  
several SPI slave devices to a single master.  
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1
MASTER MODE  
POLARITY = 0 PHASE = 0  
2
3
SPIx_CLK  
SPIx_SIMO  
SPIx_SOMI  
5
4
6
MO(0)  
7
MO(1)  
MO(n−1)  
MO(n)  
MI(n)  
8
MI(0)  
MI(1)  
MI(n−1)  
MASTER MODE  
POLARITY = 0 PHASE = 1  
4
SPIx_CLK  
SPIx_SIMO  
SPIx_SOMI  
6
5
MO(0)  
7
MO(1)  
MI(1)  
MO(n−1)  
MI(n−1)  
MO(n)  
MI(n)  
8
MI(0)  
4
MASTER MODE  
POLARITY = 1 PHASE = 0  
SPIx_CLK  
SPIx_SIMO  
SPIx_SOMI  
5
6
MO(0)  
7
MO(1)  
MI(1)  
MO(n−1)  
MO(n)  
8
MI(0)  
MI(n−1)  
MI(n)  
MASTER MODE  
POLARITY = 1 PHASE = 1  
SPIx_CLK  
SPIx_SIMO  
SPIx_SOMI  
5
4
6
MO(0)  
7
MO(1)  
MI(1)  
MO(n−1)  
MI(n−1)  
MO(n)  
MI(n)  
8
MI(0)  
Figure 5-33. SPI Timings—Master Mode  
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9
SLAVE MODE  
POLARITY = 0 PHASE = 0  
12  
10  
15  
11  
SPIx_CLK  
SPIx_SIMO  
SPIx_SOMI  
16  
SI(0)  
SI(1)  
13  
SI(n−1)  
SI(n)  
14  
SO(0)  
SO(1)  
SO(n−1)  
SO(n)  
12  
SLAVE MODE  
POLARITY = 0 PHASE = 1  
SPIx_CLK  
SPIx_SIMO  
SPIx_SOMI  
15  
SI(0)  
16  
SI(1)  
SI(n−1)  
SI(n)  
13  
SO(1)  
14  
SO(0)  
SO(n−1)  
SO(n)  
SLAVE MODE  
12  
POLARITY = 1 PHASE = 0  
SPIx_CLK  
SPIx_SIMO  
SPIx_SOMI  
15  
16  
SI(0)  
SI(1)  
13  
SO(1)  
SI(n−1)  
14  
SO(n−1)  
SI(n)  
SO(0)  
SO(n)  
SLAVE MODE  
12  
POLARITY = 1 PHASE = 1  
SPIx_CLK  
SPIx_SIMO  
SPIx_SOMI  
15  
16  
SI(0)  
SI(1)  
SI(n−1)  
SI(n)  
13  
SO(1)  
14  
SO(0)  
SO(n−1)  
SO(n)  
Figure 5-34. SPI Timings—Slave Mode  
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MASTER MODE 4 PIN WITH ENABLE  
17  
18  
SPIx_CLK  
SPIx_SIMO  
SPIx_SOMI  
SPIx_ENA  
MO(0)  
MI(0)  
MO(n)  
MI(n)  
MO(n−1)  
MI(n−1)  
MO(1)  
MI(1)  
MASTER MODE 4 PIN WITH CHIP SELECT  
19  
20  
SPIx_CLK  
SPIx_SIMO  
SPIx_SOMI  
SPIx_SCS  
MO(0)  
MO(n)  
MI(n)  
MO(n−1)  
MI(n−1)  
MO(1)  
MI(1)  
MI(0)  
MASTER MODE 5 PIN  
23  
22  
20  
MO(1)  
18  
SPIx_CLK  
SPIx_SIMO  
SPIx_SOMI  
MO(0)  
MO(n−1)  
MO(n)  
MI(0)  
MI(1)  
MI(n−1)  
MI(n)  
21  
(A)  
(A)  
SPIx_ENA  
SPIx_SCS  
DESEL  
DESEL  
A. DESELECTED IS PROGRAMMABLE EITHER HIGH OR  
3−STATE (REQUIRES EXTERNAL PULLUP)  
Figure 5-35. SPI Timings—Master Mode (4-Pin and 5-Pin)  
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SLAVE MODE 4 PIN WITH ENABLE  
24  
SPIx_CLK  
SPIx_SOMI  
SPIx_SIMO  
SPIx_ENA  
SO(0)  
SI(0)  
SO(1)  
SO(n−1) SO(n)  
SI(n−1) SI(n)  
SI(1)  
SLAVE MODE 4 PIN WITH CHIP SELECT  
25  
26  
SPIx_CLK  
27  
28  
SO(n−1)  
SPIx_SOMI  
SPIx_SIMO  
SPIx_SCS  
SO(0)  
SO(1)  
SO(n)  
SI(0)  
SI(1)  
SI(n−1)  
SI(n)  
SLAVE MODE 5 PIN  
25  
26  
30  
SPIx_CLK  
27  
29  
28  
SO(1)  
SPIx_SOMI  
SPIx_SIMO  
SO(0)  
SI(0)  
SO(n−1)  
SO(n)  
SI(1)  
SI(n−1) SI(n)  
SPIx_ENA  
(A)  
(A)  
DESEL  
DESEL  
SPIx_SCS  
A. DESELECTED IS PROGRAMMABLE EITHER HIGH OR  
3−STATE (REQUIRES EXTERNAL PULLUP)  
Figure 5-36. SPI Timings—Slave Mode (4-Pin and 5-Pin)  
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5.18 Enhanced Capture (eCAP) Peripheral  
The device contains up to three enhanced capture (eCAP) modules. Figure 5-37 shows a functional block  
diagram of a module. See the TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference  
Guide (SPRUFK9) for more details.  
Uses for ECAP include:  
Speed measurements of rotating machinery (e.g. toothed sprockets sensed via Hall sensors)  
Elapsed time measurements between position sensor triggers  
Period and duty cycle measurements of Pulse train signals  
Decoding current or voltage amplitude derived from cuty cycle encoded current/voltage sensors  
The ECAP module described in this specification includes the following features:  
32 bit time base  
4 event time-stamp registers (each 32 bits)  
Edge polarity selection for up to 4 sequenced time-stamp capture events  
Interrupt on either of the 4 events  
Single shot capture of up to 4 event time-stamps  
Continuous mode capture of time-stamps in a 4 deep circular buffer  
Absolute time-stamp capture  
Difference mode time-stamp capture  
All the above resources are dedicated to a single input pin  
The eCAP modules are clocked at the SYSCLK2 rate.  
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CTRPHS  
(phase register−32 bit)  
SYNCIn  
APWM mode  
CTR_OVF  
OVF  
CTR [0−31]  
PRD [0−31]  
CMP [0−31]  
TSCTR  
(counter−32 bit)  
SYNCOut  
PWM  
compare  
logic  
Delta−mode  
RST  
32  
CTR=PRD  
CTR=CMP  
CTR [0−31]  
PRD [0−31]  
32  
eCAPx  
32  
LD1  
CAP1  
(APRD active)  
Polarity  
select  
LD  
APRD  
shadow  
32  
CMP [0−31]  
32  
32  
LD2  
CAP2  
(ACMP active)  
Polarity  
select  
LD  
Event  
qualifier  
Event  
Pre-scale  
32  
ACMP  
shadow  
Polarity  
select  
32  
32  
LD3  
LD4  
CAP3  
(APRD shadow)  
LD  
CAP4  
(ACMP shadow)  
Polarity  
select  
LD  
4
Capture events  
CEVT[1:4]  
4
Interrupt  
Trigger  
and  
Flag  
control  
Continuous /  
Oneshot  
Capture Control  
to Interrupt  
Controller  
CTR_OVF  
CTR=PRD  
CTR=CMP  
Figure 5-37. eCAP Functional Block Diagram  
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Table 5-57 is the list of the ECAP registers.  
Table 5-57. ECAPx Configuration Registers  
ECAP0  
ECAP1  
BYTE ADDRESS  
ECAP2  
BYTE ADDRESS  
REGISTER NAME  
REGISTER DESCRIPTION  
BYTE ADDRESS  
0x01F0 6000  
0x01F0 6004  
0x01F0 6008  
0x01F0 600C  
0x01F0 6010  
0x01F0 6014  
0x01F0 6028  
0x01F0 602A  
0x01F0 602C  
0x01F0 602E  
0x01F0 6030  
0x01F0 6032  
0x01F0 605C  
0x01F0 7000  
0x01F0 7004  
0x01F0 7008  
0x01F0 700C  
0x01F0 7010  
0x01F0 7014  
0x01F0 7028  
0x01F0 702A  
0x01F0 702C  
0x01F0 702E  
0x01F0 7030  
0x01F0 7032  
0x01F0 705C  
0x01F0 8000  
0x01F0 8004  
0x01F0 8008  
0x01F0 800C  
0x01F0 8010  
0x01F0 8014  
0x01F0 8028  
0x01F0 802A  
0x01F0 802C  
0x01F0 802E  
0x01F0 8030  
0x01F0 8032  
0x01F0 805C  
TSCTR  
CTRPHS  
CAP1  
Time-Stamp Counter  
Counter Phase Offset Value Register  
Capture 1 Register  
CAP2  
Capture 2 Register  
CAP3  
Capture 3 Register  
CAP4  
Capture 4 Register  
ECCTL1  
ECCTL2  
ECEINT  
ECFLG  
ECCLR  
ECFRC  
REVID  
Capture Control Register 1  
Capture Control Register 2  
Capture Interrupt Enable Register  
Capture Interrupt Flag Register  
Capture Interrupt Clear Register  
Capture Interrupt Force Register  
Revision ID  
Table 5-58 shows the eCAP timing requirement and Table 5-59 shows the eCAP switching characteristics.  
Table 5-58. Enhanced Capture (eCAP) Timing Requirement  
TEST CONDITIONS  
Asynchronous  
Synchronous  
MIN  
2tc(SCO)  
2tc(SCO)  
MAX UNIT  
cycles  
tw(CAP)  
Capture input pulse width  
cycles  
Table 5-59. eCAP Switching Characteristics  
PARAMETER  
Pulse duration, APWMx output high/low  
TEST CONDITIONS  
MIN  
MAX  
UNIT  
tw(APWM)  
20  
ns  
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5.19 Enhanced Quadrature Encoder (eQEP) Peripheral  
The device contains up to two enhanced quadrature encoder (eQEP) modules. See the  
TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide (SPRUFK9) for more  
details.  
System  
control registers  
To CPU  
EQEPxENCLK  
SYSCLK2  
QCPRD  
QCAPCTL  
16  
QCTMR  
16  
16  
Quadrature  
capture unit  
(QCAP)  
QCTMRLAT  
QCPRDLAT  
QUTMR  
QUPRD  
QWDTMR  
QWDPRD  
Registers  
used by  
multiple units  
32  
16  
QEPCTL  
QEPSTS  
QFLG  
UTOUT  
UTIME  
QWDOG  
QDECCTL  
16  
WDTOUT  
EQEPxAIN  
EQEPxBIN  
EQEPxIIN  
EQEPxINT  
16  
QCLK  
QDIR  
QI  
EQEPxA/XCLK  
EQEPxB/XDIR  
EQEPxI  
Position counter/  
control unit  
(PCCU)  
Quadrature  
decoder  
(QDU)  
EQEPxIOUT  
EQEPxIOE  
EQEPxSIN  
EQEPxSOUT  
EQEPxSOE  
QS  
GPIO  
MUX  
QPOSLAT  
QPOSSLAT  
QPOSILAT  
PHE  
PCSOUT  
EQEPxS  
32  
32  
16  
QPOSCNT  
QPOSINIT  
QPOSMAX  
QEINT  
QFRC  
QPOSCMP  
QCLR  
QPOSCTL  
Enhanced QEP (eQEP) peripheral  
Figure 5-38. eQEP Functional Block Diagram  
Table 5-60 is the list of the EQEP registers.  
Table 5-61 shows the eQEP timing requirement and Table 5-62 shows the eQEP switching  
characteristics.  
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Table 5-60. EQEP Registers  
EQEP0  
EQEP1  
BYTE ADDRESS  
0x01F0 9000  
0x01F0 9004  
0x01F0 9008  
0x01F0 900C  
0x01F0 9010  
0x01F0 9014  
0x01F0 9018  
0x01F0 901C  
0x01F0 9020  
0x01F0 9024  
0x01F0 9026  
0x01F0 9028  
0x01F0 902A  
0x01F0 902C  
0x01F0 902E  
0x01F0 9030  
0x01F0 9032  
0x01F0 9034  
0x01F0 9036  
0x01F0 9038  
0x01F0 903A  
0x01F0 903C  
0x01F0 903E  
0x01F0 9040  
0x01F0 905C  
BYTE ADDRESS  
REGISTER NAME  
QPOSCNT  
QPOSINIT  
QPOSMAX  
QPOSCMP  
QPOSILAT  
QPOSSLAT  
QPOSLAT  
QUTMR  
REGISTER DESCRIPTION  
eQEP Position Counter  
0x01F0 A000  
0x01F0 A004  
0x01F0 A008  
0x01F0 A00C  
0x01F0 A010  
0x01F0 A014  
0x01F0 A018  
0x01F0 A01C  
0x01F0 A020  
0x01F0 A024  
0x01F0 A026  
0x01F0 A028  
0x01F0 A02A  
0x01F0 A02C  
0x01F0 A02E  
0x01F0 A030  
0x01F0 A032  
0x01F0 A034  
0x01F0 A036  
0x01F0 A038  
0x01F0 A03A  
0x01F0 A03C  
0x01F0 A03E  
0x01F0 A040  
0x01F0 A05C  
eQEP Initialization Position Count  
eQEP Maximum Position Count  
eQEP Position-compare  
eQEP Index Position Latch  
eQEP Strobe Position Latch  
eQEP Position Latch  
eQEP Unit Timer  
QUPRD  
eQEP Unit Period Register  
eQEP Watchdog Timer  
QWDTMR  
QWDPRD  
QDECCTL  
QEPCTL  
eQEP Watchdog Period Register  
eQEP Decoder Control Register  
eQEP Control Register  
QCAPCTL  
QPOSCTL  
QEINT  
eQEP Capture Control Register  
eQEP Position-compare Control Register  
eQEP Interrupt Enable Register  
eQEP Interrupt Flag Register  
eQEP Interrupt Clear Register  
eQEP Interrupt Force Register  
eQEP Status Register  
QFLG  
QCLR  
QFRC  
QEPSTS  
QCTMR  
eQEP Capture Timer  
QCPRD  
eQEP Capture Period Register  
eQEP Capture Timer Latch  
eQEP Capture Period Latch  
eQEP Revision ID  
QCTMRLAT  
QCPRDLAT  
REVID  
Table 5-61. Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements  
TEST CONDITIONS  
Asynchronous/synchronous  
Asynchronous/synchronous  
Asynchronous/synchronous  
Asynchronous/synchronous  
Asynchronous/synchronous  
MIN  
2tc(SCO)  
2tc(SCO)  
2tc(SCO)  
2tc(SCO)  
2tc(SCO)  
MAX  
UNIT  
cycles  
cycles  
cycles  
cycles  
cycles  
tw(QEPP)  
QEP input period  
tw(INDEXH)  
tw(INDEXL)  
tw(STROBH)  
tw(STROBL)  
QEP Index Input High time  
QEP Index Input Low time  
QEP Strobe High time  
QEP Strobe Input Low time  
Table 5-62. eQEP Switching Characteristics  
PARAMETER  
MIN  
MAX  
UNIT  
cycles  
cycles  
td(CNTR)xin  
Delay time, external clock to counter increment  
Delay time, QEP input edge to position compare sync output  
4tc(SCO)  
6tc(SCO)  
td(PCS-OUT)QEP  
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5.20 Enhanced Pulse Width Modulator (eHRPWM) Modules  
The device contains up to three enhanced PWM Modules (eHRPWM). Figure 5-39 shows a block diagram  
of multiple eHRPWM modules. Figure 4-4 shows the signal interconnections with the eHRPWM. See the  
TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide (SPRUFK9) for more  
details.  
EPWMSYNCI  
EPWM0SYNCI  
EPWM0INT  
EPWM0A  
EPWM0B  
ePWM0 module  
TZ  
EPWM0SYNCO  
EPWM1SYNCI  
EPWM1INT  
EPWM1A  
EPWM1B  
TZ  
GPIO  
MUX  
ePWM1 module  
EPWM1SYNCO  
EPWM2SYNCI  
ePWM2 module  
EPWM2SYNCO  
EPWM2INT  
EPWM2A  
EPWM2B  
Interrupt  
Controllers  
TZ  
To eCAP0  
module  
(sync in)  
EPWMSYNCO  
Peripheral Bus  
Figure 5-39. Multiple PWM Modules in a C6743 System  
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Time−base (TB)  
Sync  
in/out  
select  
Mux  
CTR=ZERO  
CTR=CMPB  
Disabled  
TBPRD shadow (16)  
TBPRD active (16)  
EPWMSYNCO  
CTR=PRD  
TBCTL[SYNCOSEL]  
TBCTL[CNTLDE]  
EPWMSYNCI  
Counter  
up/down  
(16 bit)  
TBCTL[SWFSYNC]  
(software forced sync)  
CTR=ZERO  
CTR_Dir  
TBCNT  
active (16)  
TBPHSHR (8)  
16  
8
CTR = PRD  
CTR = ZERO  
Phase  
control  
Event  
trigger  
and  
interrupt  
(ET)  
TBPHS active (24)  
EPWMxINT  
CTR = CMPA  
CTR = CMPB  
CTR_Dir  
Counter compare (CC)  
Action  
qualifier  
(AQ)  
CTR=CMPA  
CMPAHR (8)  
16  
8
HiRes PWM (HRPWM)  
CMPA active (24)  
EPWMA  
EPWMB  
EPWMxA  
CMPA shadow (24)  
CTR=CMPB  
Dead  
band  
(DB)  
PWM  
chopper  
(PC)  
Trip  
zone  
(TZ)  
16  
EPWMxB  
EPWMxTZINT  
TZ  
CMPB active (16)  
CMPB shadow (16)  
CTR = ZERO  
Figure 5-40. eHRPWM Sub-Modules Showing Critical Internal Signal Interconnections  
Table 5-63. eHRPWM Module Control and Status Registers Grouped by Submodule  
eHRPWM1  
eHRPWM2  
eHRPWM3  
REGISTER  
SIZE  
BYTE ADDRESS  
BYTE ADDRESS  
BYTE ADDRESS NAME  
(×16) SHADOW REGISTER DESCRIPTION  
Time-Base Submodule Registers  
0x01F0 4000 TBCTL  
TBSTS  
0x01F0 0000  
0x01F0 0002  
0x01F0 0004  
0x01F0 2000  
0x01F0 2002  
0x01F0 2004  
1
No  
No  
No  
Time-Base Control Register  
Time-Base Status Register  
0x01F0 4002  
0x01F0 4004  
1
TBPHSHR  
1
Extension for HRPWM Phase Register  
(1)  
0x01F0 0006  
0x01F0 0008  
0x01F0 000A  
0x01F0 2006  
0x01F0 2008  
0x01F0 200A  
0x01F0 4006  
0x01F0 4008  
0x01F0 400A  
TBPHS  
TBCNT  
TBPRD  
1
1
1
No  
No  
Time-Base Phase Register  
Time-Base Counter Register  
Time-Base Period Register  
Yes  
Counter-Compare Submodule Registers  
0x01F0 000E  
0x01F0 0010  
0x01F0 200E  
0x01F0 2010  
0x01F0 400E  
0x01F0 4010  
CMPCTL  
CMPAHR  
1
1
No  
No  
Counter-Compare Control Register  
Extension for HRPWM Counter-  
Compare A Register  
(1)  
0x01F0 0012  
0x01F0 0014  
0x01F0 2012  
0x01F0 2014  
0x01F0 4012  
0x01F0 4014  
CMPA  
CMPB  
1
1
Yes  
Yes  
Counter-Compare A Register  
Counter-Compare B Register  
(1) These registers are only available on eHRPWM instances that include the high-resolution PWM (HRPWM) extension; otherwise, these  
locations are reserved.  
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Table 5-63. eHRPWM Module Control and Status Registers Grouped by Submodule (continued)  
eHRPWM1  
eHRPWM2  
eHRPWM3  
REGISTER  
SIZE  
BYTE ADDRESS  
BYTE ADDRESS  
BYTE ADDRESS NAME  
(×16) SHADOW REGISTER DESCRIPTION  
Action-Qualifier Submodule Registers  
0x01F0 0016  
0x01F0 0018  
0x01F0 2016  
0x01F0 2018  
0x01F0 4016  
AQCTLA  
1
No  
No  
Action-Qualifier Control Register for  
Output A (eHRPWMxA)  
0x01F0 4018  
AQCTLB  
1
Action-Qualifier Control Register for  
Output B (eHRPWMxB)  
0x01F0 001A  
0x01F0 001C  
0x01F0 201A  
0x01F0 201C  
0x01F0 401A  
0x01F0 401C  
AQSFRC  
1
1
No  
Action-Qualifier Software Force Register  
AQCSFRC  
Yes  
Action-Qualifier Continuous S/W Force  
Register Set  
Dead-Band Generator Submodule Registers  
0x01F0 001E  
0x01F0 0020  
0x01F0 201E  
0x01F0 2020  
0x01F0 401E  
0x01F0 4020  
DBCTL  
DBRED  
1
1
No  
No  
Dead-Band Generator Control Register  
Dead-Band Generator Rising Edge  
Delay Count Register  
0x01F0 0022  
0x01F0 003C  
0x01F0 2022  
0x01F0 203C  
0x01F0 4022  
DBFED  
1
No  
No  
Dead-Band Generator Falling Edge  
Delay Count Register  
PWM-Chopper Submodule Registers  
0x01F0 403C PCCTL  
Trip-Zone Submodule Registers  
1
PWM-Chopper Control Register  
0x01F0 0024  
0x01F0 0028  
0x01F0 002A  
0x01F0 002C  
0x01F0 002E  
0x01F0 0030  
0x01F0 2024  
0x01F0 2028  
0x01F0 202A  
0x01F0 202C  
0x01F0 202E  
0x01F0 2030  
0x01F0 4024  
0x01F0 4028  
0x01F0 402A  
0x01F0 402C  
0x01F0 402E  
0x01F0 4030  
TZSEL  
TZCTL  
TZEINT  
TZFLG  
TZCLR  
TZFRC  
1
1
1
1
1
1
No  
No  
No  
No  
No  
No  
Trip-Zone Select Register  
Trip-Zone Control Register  
Trip-Zone Enable Interrupt Register  
Trip-Zone Flag Register  
Trip-Zone Clear Register  
Trip-Zone Force Register  
Event-Trigger Submodule Registers  
0x01F0 0032  
0x01F0 0034  
0x01F0 0036  
0x01F0 0038  
0x01F0 003A  
0x01F0 2032  
0x01F0 2034  
0x01F0 2036  
0x01F0 2038  
0x01F0 203A  
0x01F0 4032  
0x01F0 4034  
0x01F0 4036  
0x01F0 4038  
0x01F0 403A  
ETSEL  
ETPS  
1
1
1
1
1
No  
No  
No  
No  
No  
Event-Trigger Selection Register  
Event-Trigger Pre-Scale Register  
Event-Trigger Flag Register  
Event-Trigger Clear Register  
Event-Trigger Force Register  
ETFLG  
ETCLR  
ETFRC  
High-Resolution PWM (HRPWM) Submodule Registers  
0x01F0 5040 HRCNFG No  
(2)  
0x01F0 1040  
0x01F0 3040  
1
HRPWM Configuration Register  
(2) These registers are only available on eHRPWM instances that include the high-resolution PWM (HRPWM) extension; otherwise, these  
locations are reserved.  
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5.20.1 Enhanced Pulse Width Modulator (eHRPWM) Timing  
PWM refers to PWM outputs on eHRPWM1-6. Table 5-64 shows the PWM timing requirements and  
Table 5-65, switching characteristics.  
Table 5-64. eHRPWM Timing Requirements  
TEST  
MIN  
MAX  
UNIT  
CONDITIONS  
tw(SYCIN)  
Sync input pulse width  
Asynchronous  
Synchronous  
2tc(SCO)  
2tc(SCO)  
cycles  
cycles  
Table 5-65. eHRPWM Switching Characteristics  
PARAMETER  
TEST  
MIN  
MAX  
UNIT  
CONDITIONS  
tw(PWM)  
Pulse duration, PWMx output high/low  
Sync output pulse width  
20  
ns  
cycles  
ns  
tw(SYNCOUT)  
td(PWM)tza  
8tc(SCO)  
Delay time, trip input active to PWM forced high  
Delay time, trip input active to PWM forced low  
no pin load; no  
additional  
programmable  
delay  
25  
20  
td(TZ-PWM)HZ  
Delay time, trip input active to PWM Hi-Z  
no additional  
programmable  
delay  
ns  
5.20.2 Trip-Zone Input Timing  
t
w(TZ)  
TZ  
t
d(TZ-PWM)HZ  
(A)  
PWM  
A. PWM refers to all the PWM pins in the device. The state of the PWM pins after TZ is taken high depends on the PWM  
recovery software.  
Figure 5-41. PWM Hi-Z Characteristics  
Table 5-66. Trip-Zone input Timing Requirements  
TEST CONDITIONS  
Asynchronous  
MIN  
1tc(SCO)  
2tc(SCO)  
MAX UNIT  
cycles  
tw(TZ)  
Pulse duration, TZx input low  
Synchronous  
cycles  
Table 5-67 shows the high-resolution PWM switching characteristics.  
Table 5-67. High Resolution PWM Characteristics at SYSCLKOUT = (60 - 100 MHz)  
PARAMETER  
MIN  
TYP  
MAX UNIT  
Micro Edge Positioning (MEP) step size(1)  
200  
ps  
(1) MEP step size will increase with low voltage and high temperature, and decrease with high voltage and cold temperature.  
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5.21 Timers  
The timers support the following features:  
Configurable as single 64-bit timer or two 32-bit timers  
Period timeouts generate interrupts, DMA events or external pin events  
8 32-bit compare registers  
Compare matches generate interrupt events  
Capture capability  
64-bit Watchdog capability (Timer64P1 only)  
Table 5-68 lists the timer registers. See the TMS320C674x/OMAP-L1x Processor Peripherals Overview  
Reference Guide (SPRUFK9) for more details.  
Table 5-68. Timer Registers  
TIMER64P 0  
0x01C2 0000  
0x01C2 0004  
0x01C2 0008  
0x01C2 000C  
0x01C2 0010  
0x01C2 0014  
0x01C2 0018  
0x01C2 001C  
0x01C2 0020  
0x01C2 0024  
0x01C2 0028  
0x01C2 0034  
0x01C2 0038  
0x01C2 003C  
0x01C2 0040  
0x01C2 0044  
0x01C2 0060  
0x01C2 0064  
0x01C2 0068  
0x01C2 006C  
0x01C2 0070  
0x01C2 0074  
0x01C2 0078  
0x01C2 007C  
TIMER64P 1  
0x01C2 1000  
0x01C2 1004  
0x01C2 1008  
0x01C2 100C  
0x01C2 1010  
0x01C2 1014  
0x01C2 1018  
0x01C2 101C  
0x01C2 1020  
0x01C2 1024  
0x01C2 1028  
0x01C2 1034  
0x01C2 1038  
0x01C2 103C  
0x01C2 1040  
0x01C2 1044  
0x01C2 1060  
0x01C2 1064  
0x01C2 1068  
0x01C2 106C  
0x01C2 1070  
0x01C2 1074  
0x01C2 1078  
0x01C2 107C  
REGISTER NAME  
REV  
REGISTER DESCRIPTION  
Revision Register  
EMUMGT  
GPINTGPEN  
GPDATGPDIR  
TIM12  
Emulation Management Register  
GPIO Interrupt and GPIO Enable Register  
GPIO Data and GPIO Direction Register  
Timer Counter Register 12  
Timer Counter Register 34  
Timer Period Register 12  
Timer Period Register 34  
Timer Control Register  
TIM34  
PRD12  
PRD34  
TCR  
TGCR  
Timer Global Control Register  
Watchdog Timer Control Register  
Timer Reload Register 12  
Timer Reload Register 34  
Timer Capture Register 12  
Timer Capture Register 34  
Timer Interrupt Control and Status Register  
Compare Register 0  
WDTCR  
REL12  
REL34  
CAP12  
CAP34  
INTCTLSTAT  
CMP0  
CMP1  
Compare Register 1  
CMP2  
Compare Register 2  
CMP3  
Compare Register 3  
CMP4  
Compare Register 4  
CMP5  
Compare Register 5  
CMP6  
Compare Register 6  
CMP7  
Compare Register 7  
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5.21.1 Timer Electrical Data/Timing  
Table 5-69. Timing Requirements for Timer Input(1)(2) (see Figure 5-42)  
NO.  
1
MIN  
4P  
MAX UNIT  
tc(TM64Px_IN12) Cycle time, TM64Px_IN12  
tw(TINPH) Pulse duration, TM64Px_IN12 high  
tw(TINPL) Pulse duration, TM64Px_IN12 low  
ns  
2
0.45C  
0.45C  
0.55C  
0.55C  
ns  
ns  
3
0.25P or  
10(3)  
4
tt(TM64Px_IN12) Transition time, TM64Px_IN12  
ns  
(1) P = OSCIN cycle time in ns.  
(2) C = TM64P0_IN12 cycle time in ns.  
(3) Whichever is smaller. P = The period of the applied signal. Maintaining transition times as fast as possible is recommended to improve  
noise immunity on input signals.  
1
2
3
4
4
TM64P0_IN12  
Figure 5-42. Timer Timing  
Table 5-70. Switching Characteristics Over Recommended Operating Conditions for Timer Output(1)  
NO.  
5
PARAMETER  
Pulse duration, TM64P0_OUT12 high  
Pulse duration, TM64P0_OUT12 low  
MIN  
4P  
MAX UNIT  
tw(TOUTH)  
tw(TOUTL)  
ns  
ns  
6
4P  
(1) P = OSCIN cycle time in ns.  
5
6
TM64P0_OUT12  
Figure 5-43. Timer Timing  
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5.22 Inter-Integrated Circuit Serial Ports (I2C0, I2C1)  
5.22.1 I2C Device-Specific Information  
Having two I2C modules on the device simplifies system architecture, since one module may be used by  
the DSP to control local peripherals ICs (DACs, ADCs, etc.) while the other may be used to communicate  
with other controllers in a system or to implement a user interface. Figure 5-44 is the block diagram of the  
I2C Module. See the TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide  
(SPRUFK9) for more details.  
Each I2C port supports:  
Compatible with Philips® I2C Specification Revision 2.1 (January 2000)  
Fast Mode up to 400 Kbps (no fail-safe I/O buffers)  
Noise Filter to Remove Noise 50 ns or less  
Seven- and Ten-Bit Device Addressing Modes  
Master (Transmit/Receive) and Slave (Transmit/Receive) Functionality  
Events: DMA, Interrupt, or Polling  
General-Purpose I/O Capability if not used as I2C  
Clock Prescaler  
I2CPSCx  
Control  
I2CCOARx  
Prescaler  
Register  
Own Address  
Register  
Slave Address  
Register  
I2CSARx  
Bit Clock Generator  
I2CCLKHx  
Noise  
Filter  
I2Cx_SCL  
Clock Divide  
High Register  
I2CCMDRx  
I2CEMDRx  
I2CCNTx  
I2CPID1  
Mode Register  
Extended Mode  
Register  
Clock Divide  
Low Register  
I2CCLKLx  
Data Count  
Register  
Peripheral  
Configuration  
Bus  
Transmit  
I2CXSRx  
Peripheral ID  
Register 1  
Transmit Shift  
Register  
Peripheral ID  
Register 2  
I2CPID2  
I2CDXRx  
Transmit Buffer  
Noise  
Filter  
I2Cx_SDA  
Interrupt/DMA  
Interrupt Enable  
Register  
Receive  
I2CIERx  
Interrupt DMA  
Requests  
Receive Buffer  
I2CDRRx  
Interrupt Status  
Register  
I2CSTRx  
I2CSRCx  
Receive Shift  
Register  
Interrupt Source  
Register  
I2CRSRx  
Control  
Pin Function  
Register  
Pin Data Out  
Register  
I2CPDOUT  
I2CPFUNC  
Pin Direction  
Register  
Pin Data Set  
Register  
I2CPDIR  
I2CPDIN  
I2CPDSET  
I2CPDCLR  
Pin Data In  
Register  
Pin Data Clear  
Register  
Figure 5-44. I2C Module Block Diagram  
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5.22.2 I2C Peripheral Registers Description(s)  
Table 5-71 is the list of the I2C registers.  
Table 5-71. Inter-Integrated Circuit (I2C) Registers  
I2C0  
I2C1  
REGISTER NAME  
REGISTER DESCRIPTION  
BYTE ADDRESS  
BYTE ADDRESS  
0x01C2 2000  
0x01C2 2004  
0x01C2 2008  
0x01C2 200C  
0x01C2 2010  
0x01C2 2014  
0x01C2 2018  
0x01C2 201C  
0x01C2 2020  
0x01C2 2024  
0x01C2 2028  
0x01C2 202C  
0x01C2 2030  
0x01C2 2034  
0x01C2 2038  
0x01C2 2048  
0x01C2 204C  
0x01C2 2050  
0x01C2 2054  
0x01C2 2058  
0x01C2 205C  
0x01E2 8000  
0x01E2 8004  
0x01E2 8008  
0x01E2 800C  
0x01E2 8010  
0x01E2 8014  
0x01E2 8018  
0x01E2 801C  
0x01E2 8020  
0x01E2 8024  
0x01E2 8028  
0x01E2 802C  
0x01E2 8030  
0x01E2 8034  
0x01E2 8038  
0x01E2 8048  
0x01E2 804C  
0x01E2 8050  
0x01E2 8054  
0x01E2 8058  
0x01E2 805C  
ICOAR  
I2C Own Address Register  
I2C Interrupt Mask Register  
I2C Interrupt Status Register  
I2C Clock Low-Time Divider Register  
I2C Clock High-Time Divider Register  
I2C Data Count Register  
ICIMR  
ICSTR  
ICCLKL  
ICCLKH  
ICCNT  
ICDRR  
I2C Data Receive Register  
I2C Slave Address Register  
I2C Data Transmit Register  
I2C Mode Register  
ICSAR  
ICDXR  
ICMDR  
ICIVR  
I2C Interrupt Vector Register  
I2C Extended Mode Register  
I2C Prescaler Register  
ICEMDR  
ICPSC  
REVID1  
REVID2  
ICPFUNC  
ICPDIR  
ICPDIN  
ICPDOUT  
ICPDSET  
ICPDCLR  
I2C Revision Identification Register 1  
I2C Revision Identification Register 2  
I2C Pin Function Register  
I2C Pin Direction Register  
I2C Pin Data In Register  
I2C Pin Data Out Register  
I2C Pin Data Set Register  
I2C Pin Data Clear Register  
5.22.3 I2C Electrical Data/Timing  
5.22.3.1 Inter-Integrated Circuit (I2C) Timing  
Table 5-72 and Table 5-73 assume testing over recommended operating conditions (see Figure 5-45 and  
Figure 5-46).  
Table 5-72. I2C Input Timing Requirements  
NO.  
MIN  
10  
2.5  
4.7  
0.6  
4
MAX UNIT  
Standard Mode  
Fast Mode  
1
tc(SCL)  
Cycle time, I2Cx_SCL  
μs  
Standard Mode  
Fast Mode  
2
3
4
5
6
7
tsu(SCLH-SDAL)  
th(SCLL-SDAL)  
tw(SCLL)  
Setup time, I2Cx_SCL high before I2Cx_SDA low  
Hold time, I2Cx_SCL low after I2Cx_SDA low  
Pulse duration, I2Cx_SCL low  
μs  
μs  
μs  
μs  
ns  
Standard Mode  
Fast Mode  
0.6  
4.7  
1.3  
4
Standard Mode  
Fast Mode  
Standard Mode  
Fast Mode  
tw(SCLH)  
Pulse duration, I2Cx_SCL high  
0.6  
250  
100  
0
Standard Mode  
Fast Mode  
tsu(SDA-SCLH)  
Setup time, I2Cx_SDA before I2Cx_SCL high  
Hold time, I2Cx_SDA after I2Cx_SCL low  
Standard Mode  
Fast Mode  
th(SDA-SCLL)  
μs  
0
0.9  
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Table 5-72. I2C Input Timing Requirements (continued)  
NO.  
MIN  
4.7  
MAX UNIT  
Standard Mode  
Fast Mode  
8
tw(SDAH)  
Pulse duration, I2Cx_SDA high  
Rise time, I2Cx_SDA  
μs  
1.3  
Standard Mode  
Fast Mode  
1000  
ns  
9
tr(SDA)  
20 + 0.1Cb  
20 + 0.1Cb  
20 + 0.1Cb  
300  
Standard Mode  
Fast Mode  
1000  
ns  
10 tr(SCL)  
11 tf(SDA)  
12 tf(SCL)  
13 tsu(SCLH-SDAH)  
14 tw(SP)  
Rise time, I2Cx_SCL  
300  
Standard Mode  
Fast Mode  
300  
ns  
Fall time, I2Cx_SDA  
300  
Standard Mode  
Fast Mode  
300  
ns  
Fall time, I2Cx_SCL  
20 + 0.1Cb  
300  
Standard Mode  
Fast Mode  
4
0.6  
N/A  
0
Setup time, I2Cx_SCL high before I2Cx_SDA high  
Pulse duration, spike (must be suppressed)  
Capacitive load for each bus line  
μs  
Standard Mode  
Fast Mode  
ns  
50  
Standard Mode  
Fast Mode  
400  
pF  
15 Cb  
400  
Table 5-73. I2C Switching Characteristics(1)  
NO.  
PARAMETER  
MIN  
10  
2.5  
4.7  
0.6  
4
MAX UNIT  
Standard Mode  
16 tc(SCL)  
Cycle time, I2Cx_SCL  
μs  
Fast Mode  
Standard Mode  
Fast Mode  
17 tsu(SCLH-SDAL)  
18 th(SDAL-SCLL)  
19 tw(SCLL)  
Setup time, I2Cx_SCL high before I2Cx_SDA low  
Hold time, I2Cx_SCL low after I2Cx_SDA low  
Pulse duration, I2Cx_SCL low  
μs  
μs  
μs  
μs  
ns  
Standard Mode  
Fast Mode  
0.6  
4.7  
1.3  
4
Standard Mode  
Fast Mode  
Standard Mode  
Fast Mode  
20 tw(SCLH)  
Pulse duration, I2Cx_SCL high  
0.6  
250  
100  
0
Standard Mode  
Fast Mode  
21 tsu(SDAV-SCLH)  
22 th(SCLL-SDAV)  
23 tw(SDAH)  
Setup time, I2Cx_SDA valid before I2Cx_SCL high  
Hold time, I2Cx_SDA valid after I2Cx_SCL low  
Pulse duration, I2Cx_SDA high  
Standard Mode  
Fast Mode  
μs  
0
0.9  
Standard Mode  
Fast Mode  
4.7  
1.3  
4
μs  
μs  
Standard Mode  
Fast Mode  
28 tsu(SCLH-SDAH)  
Setup time, I2Cx_SCL high before I2Cx_SDA high  
0.6  
(1) I2C must be configured correctly to meet the timings in Table 5-73.  
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I2Cx_SDA  
I2Cx_SCL  
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11  
9
6
8
14  
13  
4
5
10  
1
12  
3
2
7
3
Stop  
Start  
Repeated  
Start  
Stop  
Figure 5-45. I2C Receive Timings  
26  
24  
I2Cx_SDA  
I2Cx_SCL  
21  
23  
19  
28  
20  
25  
16  
27  
18  
17  
22  
18  
Stop  
Start  
Repeated  
Start  
Stop  
Figure 5-46. I2C Transmit Timings  
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5.23 Universal Asynchronous Receiver/Transmitter (UART)  
The device has 2 UART peripherals. Each UART has the following features:  
16-byte storage space for both the transmitter and receiver FIFOs  
Autoflow control signals (CTS, RTS) on UART0 only.  
1, 4, 8, or 14 byte selectable receiver FIFO trigger level for autoflow control and DMA  
DMA signaling capability for both received and transmitted data  
Programmable auto-rts and auto-cts for autoflow control  
Programmable Baud Rate up to 3MBaud  
Programmable Oversampling Options of x13 and x16  
Frequency pre-scale values from 1 to 65,535 to generate appropriate baud rates  
Prioritized interrupts  
Programmable serial data formats  
5, 6, 7, or 8-bit characters  
Even, odd, or no parity bit generation and detection  
1, 1.5, or 2 stop bit generation  
False start bit detection  
Line break generation and detection  
Internal diagnostic capabilities  
Loopback controls for communications link fault isolation  
Break, parity, overrun, and framing error simulation  
The UART registers are listed in Section 5.23.1. See the TMS320C674x/OMAP-L1x Processor Peripherals  
Overview Reference Guide (SPRUFK9) for more details.  
5.23.1 UART Peripheral Registers Description(s)  
Table 5-74 is the list of UART registers.  
Table 5-74. UART Registers  
UART0  
UART2  
REGISTER NAME  
REGISTER DESCRIPTION  
BYTE ADDRESS  
BYTE ADDRESS  
0x01C4 2000  
0x01C4 2000  
0x01C4 2004  
0x01C4 2008  
0x01C4 2008  
0x01C4 200C  
0x01C4 2010  
0x01C4 2014  
0x01C4 2020  
0x01C4 2024  
0x01C4 2028  
0x01C4 2030  
0x01C4 2034  
0x01D0 D000  
0x01D0 D000  
0x01D0 D004  
0x01D0 D008  
0x01D0 D008  
0x01D0 D00C  
0x01D0 D010  
0x01D0 D014  
0x01D0 D020  
0x01D0 D024  
0x01D0 D028  
0x01D0 D030  
0x01D0 D034  
RBR  
Receiver Buffer Register (read only)  
Transmitter Holding Register (write only)  
Interrupt Enable Register  
THR  
IER  
IIR  
Interrupt Identification Register (read only)  
FIFO Control Register (write only)  
Line Control Register  
FCR  
LCR  
MCR  
Modem Control Register  
LSR  
Line Status Register  
DLL  
Divisor LSB Latch  
DLH  
Divisor MSB Latch  
REVID1  
Revision Identification Register 1  
Power and Emulation Management Register  
Mode Definition Register  
PWREMU_MGMT  
MDR  
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5.23.2 UART Electrical Data/Timing  
Table 5-75. Timing Requirements for UARTx Receive(1) (see Figure 5-47)  
NO.  
4
MIN  
0.96U  
0.96U  
MAX  
1.05U MBaud  
1.05U ns  
UNIT  
tw(URXDB)  
tw(URXSB)  
Pulse duration, receive data bit (RXDn)  
Pulse duration, receive start bit  
5
(1) U = UART baud time = 1/programmed baud rate.  
Table 5-76. Switching Characteristics Over Recommended Operating Conditions for UARTx Transmit(1)  
(see Figure 5-47)  
NO.  
1
PARAMETER  
MIN  
MAX  
D/E(3)(4) MBaud  
UNIT  
f(baud)  
Maximum programmable baud rate(2)  
Pulse duration, transmit data bit (TXDn)  
Pulse duration, transmit start bit  
2
tw(UTXDB)  
tw(UTXSB)  
U - 2  
U - 2  
U + 2  
U + 2  
ns  
ns  
3
(1) U = UART baud time = 1/programmed baud rate.  
(2) Baud rate is not indicative of data rate. Actual data rate will be limited by system factors such as EDMA loading, EMIF loading, system  
frequency, etc.  
(3) D = UART input clock in MHz. The UART(s) input clock source is PLL0_SYSCLK2.  
(4) E = UART divisor x UART sampling rate. The UART divisor is set through the UART divisor latch registers (DLL and DLH). The UART  
sampling rate is set through the over-sampling mode select bit (OSM_SEL) of the UART mode definition register (MDR).  
3
2
Start  
Bit  
UART_TXDn  
Data Bits  
5
4
Start  
Bit  
UART_RXDn  
Data Bits  
Figure 5-47. UART Transmit/Receive Timing  
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5.24 Power and Sleep Controller (PSC)  
The Power and Sleep Controllers (PSC) are responsible for managing transitions of system power on/off,  
clock on/off, resets (device level and module level). It is used primarily to provide granular power control  
for on chip modules (peripherals and CPU). A PSC module consists of a Global PSC (GPSC) and a set of  
Local PSCs (LPSCs). The GPSC contains memory mapped registers, PSC interrupts, a state machine for  
each peripheral/module it controls. An LPSC is associated with every module that is controlled by the PSC  
and provides clock and reset control. See the TMS320C674x/OMAP-L1x Processor Peripherals Overview  
Reference Guide (SPRUFK9) for more details.  
The PSC includes the following features:  
Provides a software interface to:  
Control module clock enable/disable  
Control module reset  
Control CPU local reset  
Supports IcePick emulation features: power, clock and reset  
5.24.1 PSC Peripheral Registers Description(s)  
Table 5-77. Power and Sleep Controller (PSC) Registers  
PSC0  
PSC1  
REGISTER NAME  
REGISTER DESCRIPTION  
BYTE ADDRESS  
BYTE ADDRESS  
0x01C1 0000  
0x01E2 7000  
REVID  
Peripheral Revision and Class Information  
Register  
0x01C1 0018  
0x01C1 0040  
0x01E2 7018  
0x01E2 7040  
INTEVAL  
Interrupt Evaluation Register  
MERRPR0  
Module Error Pending Register 0 (module 0-  
15) (PSC0)  
Module Error Pending Register 0 (module 0-  
31) (PSC1)  
0x01C1 0050  
0x01E2 7050  
MERRCR0  
Module Error Clear Register 0 (module 0-15)  
(PSC0)  
Module Error Clear Register 0 (module 0-31)  
(PSC1)  
0x01C1 0060  
0x01C1 0068  
0x01C1 0120  
0x01C1 0128  
0x01C1 0200  
0x01C1 0204  
0x01C1 0300  
0x01C1 0304  
0x01C1 0400  
0x01C1 0404  
0x01E2 7060  
0x01E2 7068  
0x01E2 7120  
0x01E2 7128  
0x01E2 7200  
0x01E2 7204  
0x01E2 7300  
0x01E2 7304  
0x01E2 7400  
0x01E2 7404  
PERRPR  
PERRCR  
PTCMD  
Power Error Pending Register  
Power Error Clear Register  
Power Domain Transition Command Register  
Power Domain Transition Status Register  
Power Domain 0 Status Register  
Power Domain 1 Status Register  
Power Domain 0 Control Register  
Power Domain 1 Control Register  
Power Domain 0 Configuration Register  
Power Domain 1 Configuration Register  
PTSTAT  
PDSTAT0  
PDSTAT1  
PDCTL0  
PDCTL1  
PDCFG0  
PDCFG1  
0x01C1 0800 - 0x01C1 083C 0x01E2 7800 - 0x01E2 787C MDSTAT0-MDSTAT15  
Module Status n Register (modules 0-15)  
(PSC0)  
MDSTAT0-MDSTAT31  
Module Status n Register (modules 0-31)  
(PSC1)  
0x01C1 0A00 - 0x01C1 0A3C 0x01E2 7A00 - 0x01E2 7A7C MDCTL0-MDCTL15  
MDCTL0-MDCTL31  
Module Control n Register (modules 0-15)  
(PSC0)  
Module Control n Register (modules 0-31)  
(PSC1)  
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5.24.2 Power Domain and Module Topology  
The device includes two PSC modules.  
Each PSC module controls clock states for several on the on chip modules, controllers and interconnect  
components. Table 5-78 and Table 5-79 lists the set of peripherals/modules that are controlled by the  
PSC, the power domain they are associated with, the LPSC assignment and the default (power-on reset)  
module states. The module states and terminology are defined in Section 5.24.2.2.  
Table 5-78. PSC0 Default Module Configuration  
LPSC NUMBER  
MODULE NAME  
POWER DOMAIN  
DEFAULT MODULE  
STATE  
AUTO SLEEP/WAKE  
ONLY  
0
1
EDMA3 Channel Controller  
AlwaysON (PD0)  
AlwaysON (PD0)  
AlwaysON (PD0)  
AlwaysON (PD0)  
AlwaysON (PD0)  
AlwaysON (PD0)  
SwRstDisable  
SwRstDisable  
SwRstDisable  
SwRstDisable  
SwRstDisable  
SwRstDisable  
EDMA3 Transfer Controller 0  
2
EDMA3 Transfer Controller 1  
3
EMIFA (BR7)  
SPI 0  
4
5
MMC/SD 0  
8
9
UART 0  
AlwaysON (PD0)  
AlwaysON (PD0)  
SwRstDisable  
Enable  
10  
SCR0  
Yes  
(Br 0, Br 1, Br 2, Br 8)  
11  
12  
SCR1  
(Br 4)  
AlwaysON (PD0)  
AlwaysON (PD0)  
Enable  
Enable  
Yes  
Yes  
SCR2  
(Br 3, Br 5, Br 6)  
13  
15  
PRUSS  
DSP  
AlwaysON (PD0)  
PD_DSP (PD1)  
SwRstDisable-  
Enable  
Table 5-79. PSC1 Default Module Configuration  
LPSC NUMBER  
MODULE NAME  
POWER DOMAIN  
DEFAULT MODULE  
AUTO SLEEP/WAKE  
ONLY  
STATE  
0-2  
3
Yes  
GPIO  
AlwaysON (PD0)  
SwRstDisable  
4
5
EMAC  
AlwaysON (PD0)  
AlwaysON (PD0)  
AlwaysON (PD0)  
AlwaysON (PD0)  
SwRstDisable  
SwRstDisable  
SwRstDisable  
SwRstDisable  
6
EMIFB (Br 20)  
7
McASP0 ( + McASP0 FIFO)  
8
McASP1 ( + McASP1 FIFO)  
9-10  
11  
I2C 1  
AlwaysON (PD0)  
SwRstDisable  
12  
13  
UART 2  
AlwaysON (PD0)  
SwRstDisable  
14-16  
17  
eHRPWM0/1/2  
AlwaysON (PD0)  
SwRstDisable  
18-19  
20  
ECAP0/1/2  
EQEP0/1  
AlwaysON (PD0)  
AlwaysON (PD0)  
SwRstDisable  
SwRstDisable  
21  
22-23  
24  
SCR8  
AlwaysON (PD0)  
Enable  
(Br 15)  
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Table 5-79. PSC1 Default Module Configuration (continued)  
LPSC NUMBER  
MODULE NAME  
POWER DOMAIN  
AlwaysON (PD0)  
AlwaysON (PD0)  
DEFAULT MODULE  
STATE  
AUTO SLEEP/WAKE  
ONLY  
25  
26  
SCR7  
(Br 12)  
Enable  
Enable  
Yes  
SCR12  
(Br 18)  
Yes  
27-31  
5.24.2.1 Power Domain States  
A power domain can only be in one of the two states: ON or OFF, defined as follows:  
ON: power to the domain is on  
OFF: power to the domain is off  
In the device, for both PSC0 and PSC1, the Always ON domain, or PD0 power domain, is always in the  
ON state when the chip is powered-on. This domain is not programmable to OFF state.  
On PSC0 PD1/PD_DSP Domain: Controls the sleep state for DSP L1 and L2 Memories  
5.24.2.2 Module States  
The PSC defines several possible states for a module. This states are essentially a combination of the  
module reset asserted or de-asserted and module clock on/enabled or off/disabled. The module states are  
defined in Table 5-80.  
Table 5-80. Module States  
MODULE STATE MODULE RESET  
MODULE  
CLOCK  
MODULE STATE DEFINITION  
Enable  
Disable  
De-asserted  
De-asserted  
On  
A module in the enable state has its module reset de-asserted and it has its  
clock on. This is the normal operational state for a given module  
Off  
A module in the disabled state has its module reset de-asserted and it has its  
module clock off. This state is typically used for disabling a module clock to  
save power. The device is designed in full static CMOS, so when you stop a  
module clock, it retains the module’s state. When the clock is restarted, the  
module resumes operating from the stopping point.  
SyncReset  
Asserted  
Asserted  
On  
Off  
A module state in the SyncReset state has its module reset asserted and it has  
its clock on. Generally, software is not expected to initiate this state  
SwRstDisable  
A module in the SwResetDisable state has its module reset asserted and it has  
its clock disabled. After initial power-on, several modules come up in the  
SwRstDisable state. Generally, software is not expected to initiate this state  
Auto Sleep  
De-asserted  
Off  
A module in the Auto Sleep state also has its module reset de-asserted and its  
module clock disabled, similar to the Disable state. However this is a special  
state, once a module is configured in this state by software, it can  
“automatically” transition to “Enable” state whenever there is an internal  
read/write request made to it, and after servicing the request it will  
“automatically” transition into the sleep state (with module reset re de-asserted  
and module clock disabled), without any software intervention. The transition  
from sleep to enabled and back to sleep state has some cycle latency  
associated with it. It is not envisioned to use this mode when peripherals are  
fully operational and moving data.  
Auto Wake  
De-asserted  
Off  
A module in the Auto Wake state also has its module reset de-asserted and its  
module clock disabled, similar to the Disable state. However this is a special  
state, once a module is configured in this state by software, it will  
“automatically” transition to “Enable” state whenever there is an internal  
read/write request made to it, and will remain in the “Enabled” state from then  
on (with module reset re de-asserted and module clock on), without any  
software intervention. The transition from sleep to enabled state has some  
cycle latency associated with it. It is not envisioned to use this mode when  
peripherals are fully operational and moving data.  
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5.25 Programmable Real-Time Unit Subsystem (PRUSS)  
The Programmable Real-Time Unit Subsystem (PRUSS) consists of  
Two Programmable Real-Time Units (PRU0 and PRU1) and their associated memories  
An Interrupt Controller (INTC) for handling system interrupt events. The INTC also supports posting  
events back to the device level host CPU.  
A Switched Central Resource (SCR) for connecting the various internal and external masters to the  
resources inside the PRUSS.  
The two PRUs can operate completely independently or in coordination with each other. The PRUs can  
also work in coordination with the device level host CPU. This is determined by the nature of the program  
which is loaded into the PRUs instruction memory. Several different signaling mechanisms are available  
between the two PRUs and the device level host CPU.  
The PRUs are optimized for performing embedded tasks that require manipulation of packed memory  
mapped data structures, handling of system events that have tight realtime constraints and interfacing with  
systems external to the device.  
The PRUSS comprises various distinct addressable regions. Externally the subsystem presents a single  
64Kbyte range of addresses. The internal interconnect bus (also called switched central resource, or SCR)  
of the PRUSS decodes accesses for each of the individual regions. The PRUSS memory map is  
documented in Table 5-81 and in Table 5-82. Note that these two memory maps are implemented inside  
the PRUSS and are local to the components of the PRUSS.  
Table 5-81. Programmable Real-Time Unit Subsystem (PRUSS) Local Instruction Space Memory Map  
BYTE ADDRESS  
PRU0  
PRU1  
0x0000 0000 - 0x0000 0FFF  
PRU0 Instruction RAM  
PRU1 Instruction RAM  
Table 5-82. Programmable Real-Time Unit Subsystem (PRUSS) Local Data Space Memory Map  
BYTE ADDRESS  
PRU0  
Data RAM 0  
Reserved  
PRU1  
Data RAM 1  
Reserved  
(1)  
(1)  
(1)  
(1)  
0x0000 0000 - 0x0000 01FF  
0x0000 0200 - 0x0000 1FFF  
0x0000 2000 - 0x0000 21FF  
0x0000 2200 - 0x0000 3FFF  
0x0000 4000 - 0x0000 6FFF  
0x0000 7000 - 0x0000 73FF  
0x0000 7400 - 0x0000 77FF  
0x0000 7800 - 0x0000 7BFF  
0x0000 7C00 - 0xFFFF FFFF  
Data RAM 1  
Reserved  
Data RAM 0  
Reserved  
INTC Registers  
PRU0 Control Registers  
Reserved  
INTC Registers  
PRU0 Control Registers  
Reserved  
PRU1 Control Registers  
Reserved  
PRU1 Control Registers  
Reserved  
(1) Note that PRU0 accesses Data RAM0 at address 0x0000 0000, also PRU1 accesses Data RAM1 at address 0x0000 0000. Data RAM0  
is intended to be the primary data memory for PRU0 and Data RAM1 is intended to be the primary data memory for PRU1. However for  
passing information between PRUs, each PRU can access the data ram of the ‘other’ PRU through address 0x0000 2000.  
The global view of the PRUSS internal memories and control ports is documented in Table 5-83. The  
offset addresses of each region are implemented inside the PRUSS but the global device memory  
mapping places the PRUSS slave port in the address range 0x01C3 0000-0x01C3 FFFF. The PRU0 and  
PRU1 can use either the local or global addresses to access their internal memories, but using the local  
addresses will provide access time several cycles faster than using the global addresses. This is because  
when accessing via the global address the access needs to be routed through the switch fabric outside  
PRUSS and back in through the PRUSS slave port.  
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Table 5-83. Programmable Real-Time Unit Subsystem (PRUSS) Global Memory Map  
BYTE ADDRESS  
REGION  
Data RAM 0  
0x01C3 0000 - 0x01C3 01FF  
0x01C3 0200 - 0x01C3 1FFF  
0x01C3 2000 - 0x01C3 21FF  
0x01C3 2200 - 0x01C3 3FFF  
0x01C3 4000 - 0x01C3 6FFF  
0x01C3 7000 - 0x01C3 73FF  
0x01C3 7400 - 0x01C3 77FF  
0x01C3 7800 - 0x01C3 7BFF  
0x01C3 7C00 - 0x01C3 7FFF  
0x01C3 8000 - 0x01C3 8FFF  
0x01C3 9000 - 0x01C3 BFFF  
0x01C3 C000 - 0x01C3 CFFF  
0x01C3 D000 - 0x01C3 FFFF  
Reserved  
Data RAM 1  
Reserved  
INTC Registers  
PRU0 Control Registers  
PRU0 Debug Registers  
PRU1 Control Registers  
PRU1 Debug Registers  
PRU0 Instruction RAM  
Reserved  
PRU1 Instruction RAM  
Reserved  
Each of the PRUs can access the rest of the device memory (including memory mapped peripheral and  
configuration registers) using the global memory space addresses  
5.25.1 PRUSS Register Descriptions  
Table 5-84. Programmable Real-Time Unit Subsystem (PRUSS) Control / Status Registers  
PRU0 BYTE ADDRESS  
0x01C3 7000  
PRU1 BYTE ADDRESS  
0x01C3 7800  
ACRONYM  
CONTROL  
STATUS  
REGISTER DESCRIPTION  
PRU Control Register  
PRU Status Register  
0x01C3 7004  
0x01C3 7804  
0x01C3 7008  
0x01C3 7808  
WAKEUP  
CYCLCNT  
STALLCNT  
PRU Wakeup Enable Register  
PRU Cycle Count  
0x01C3 700C  
0x01C3 780C  
0x01C3 7010  
0x01C3 7810  
PRU Stall Count  
PRU Constant Table Block Index  
Register 0  
0x01C3 7020  
0x01C3 7028  
0x01C3 7820  
0x01C3 7828  
CONTABBLKIDX0  
CONTABPROPTR0  
PRU Constant Table Programmable  
Pointer Register 0  
PRU Constant Table Programmable  
Pointer Register 1  
0x01C3 702C  
0x01C3 782C  
CONTABPROPTR1  
PRU Internal General Purpose  
Register 0 (for Debug)  
0x01C37400 - 0x01C3747C  
0x01C37480 - 0x01C374FC  
0x01C3 7C00 - 0x01C3 7C7C  
0x01C3 7C80 - 0x01C3 7CFC  
INTGPR0 – INTGPR31  
INTCTER0 – INTCTER31  
PRU Internal General Purpose  
Register 0 (for Debug)  
Table 5-85. Programmable Real-Time Unit Subsystem Interrupt Controller (PRUSS INTC) Registers  
BYTE ADDRESS  
0x01C3 4000  
0x01C3 4004  
0x01C3 4010  
0x01C3 401C  
0x01C3 4020  
0x01C3 4024  
0x01C3 4028  
0x01C3 402C  
0x01C3 4034  
0x01C3 4038  
ACRONYM  
REVID  
REGISTER DESCRIPTION  
Revision ID Register  
CONTROL  
Control Register  
GLBLEN  
Global Enable Register  
GLBLNSTLVL  
STATIDXSET  
STATIDXCLR  
ENIDXSET  
Global Nesting Level Register  
System Interrupt Status Indexed Set Register  
System Interrupt Status Indexed Clear Register  
System Interrupt Enable Indexed Set Register  
System Interrupt Enable Indexed Clear Register  
Host Interrupt Enable Indexed Set Register  
Host Interrupt Enable Indexed Clear Register  
ENIDXCLR  
HSTINTENIDXSET  
HSTINTENIDXCLR  
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Table 5-85. Programmable Real-Time Unit Subsystem Interrupt Controller (PRUSS INTC)  
Registers (continued)  
BYTE ADDRESS  
ACRONYM  
REGISTER DESCRIPTION  
Global Prioritized Index Register  
0x01C3 4080  
0x01C3 4200  
GLBLPRIIDX  
STATSETINT0  
System Interrupt Status Raw/Set Register 0  
System Interrupt Status Raw/Set Register 1  
System Interrupt Status Enabled/Clear Register 0  
System Interrupt Status Enabled/Clear Register 1  
System Interrupt Enable Set Register 0  
System Interrupt Enable Set Register 1  
System Interrupt Enable Clear Register 0  
System Interrupt Enable Clear Register 1  
Channel Map Registers 0-15  
0x01C3 4204  
STATSETINT1  
0x01C3 4280  
STATCLRINT0  
0x01C3 4284  
STATCLRINT1  
0x01C3 4300  
ENABLESET0  
0x01C3 4304  
ENABLESET1  
0x01C3 4380  
ENABLECLR0  
0x01C3 4384  
ENABLECLR1  
0x01C3 4400 - 0x01C3 4440  
0x01C3 4800 - 0x01C3 4808  
CHANMAP0 - CHANMAP15  
HOSTMAP0 - HOSTMAP2  
Host Map Register 0-2  
HOSTINTPRIIDX0 -  
HOSTINTPRIIDX9  
0x01C3 4900 - 0x01C3 4928  
Host Interrupt Prioritized Index Registers 0-9  
0x01C3 4D00  
0x01C3 4D04  
0x01C3 4D80  
0x01C3 4D84  
POLARITY0  
POLARITY1  
TYPE0  
System Interrupt Polarity Register 0  
System Interrupt Polarity Register 1  
System Interrupt Type Register 0  
System Interrupt Type Register 1  
TYPE1  
HOSTINTNSTLVL0-  
HOSTINTNSTLVL9  
0x01C3 5100 - 0x01C3 5128  
0x01C3 5500  
Host Interrupt Nesting Level Registers 0-9  
Host Interrupt Enable Register  
HOSTINTEN  
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5.26 Emulation Logic  
The debug capabilities and features for DSP are as shown below.  
DSP:  
Basic Debug  
Execution Control  
System Visibility  
Real-Time Debug  
Interrupts serviced while halted  
Low/non-intrusive system visibility while running  
Advanced Debug  
Global Start  
Global Stop  
Specify targeted memory level(s) during memory accesses  
HSRTDX (High Speed Real Time Data eXchange)  
Advanced System Control  
Subsystem reset via debug  
Peripheral notification of debug events  
Cache-coherent debug accesses  
Analysis Actions  
Stop program execution  
Generate debug interrupt  
Benchmarking with counters  
External trigger generation  
Debug state machine state transition  
Combinational and Sequential event generation  
Analysis Events  
Program event detection  
Data event detection  
External trigger Detection  
System event detection (i.e. cache miss)  
Debug state machine state detection  
Analysis Configuration  
Application access  
Debugger access  
Table 5-86. DSP Debug Features  
CATEGORY  
HARDWARE FEATURE  
AVAILABILITY  
Software breakpoint  
Unlimited  
Up to 10 HWBPs, including:  
4 precise(1) HWBPs inside DSP core and one of them is associated with a  
counter.  
2 imprecise(1) HWBPs from AET.  
Basic Debug  
Hardware breakpoint  
4 imprecise(1) HWBPs from AET which are shared for watch point.  
(1) Precise hardware breakpoints will halt the processor immediately prior to the execution of the selected instruction. Imprecise breakpoints  
will halt the processor some number of cycles after the selected instruction depending on device conditions.  
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Table 5-86. DSP Debug Features (continued)  
CATEGORY  
HARDWARE FEATURE  
AVAILABILITY  
Up to 4 watch points, which are shared with HWBPs, and can also be used as 2  
watch points with data (32 bits)  
Watch point  
Watch point with Data  
Counters/timers  
Up to 2, Which can also be used as 4 watch points.  
Analysis  
1x64-bits (cycle only) + 2x32-bits (water marke counters)  
External Event Trigger In  
External Event Trigger Out  
1
1
5.26.1 JTAG Port Description  
The device target debug interface uses the five standard IEEE 1149.1(JTAG) signals (TRST, TCK, TMS,  
TDI, and TDO).  
TRST holds the debug and boundary scan logic in reset (normal DSP operation) when pulled low (its  
default state). Since TRST has an internal pull-down resistor, this ensures that at power up the device  
functions in its normal (non-test) operation mode if TRST is not connected. Otherwise, TRST should be  
driven inactive by the emulator or boundary scan controller. Boundary scan test cannot be performed  
while the TRST pin is pulled low.  
Table 5-87. JTAG Port Description  
PIN  
TYPE  
NAME  
DESCRIPTION  
When asserted (active low) causes all test and debug logic in the device to  
be reset along with the IEEE 1149.1 interface  
TRST  
I
Test Logic Reset  
This is the test clock used to drive an IEEE 1149.1 TAP state machine and  
logic.  
TCK  
I
Test Clock  
TMS  
TDI  
I
I
Test Mode Select  
Test Data Input  
Test Data Output  
Emulation 0  
Directs the next state of the IEEE 1149.1 test access port state machine  
Scan data input to the device  
TDO  
EMU0  
O
I/O  
Scan data output of the device  
Channel 0 trigger + HSRTDX  
5.26.2 Scan Chain Configuration Parameters  
Table 5-88 shows the TAP configuration details required to configure the router/emulator for this device.  
Table 5-88. Router TAP Configuration  
ROUTER PORT  
ID  
DEFAULT TAP  
TAP NAME  
TAP IR LENGTH  
17  
No  
C674x  
38  
The router is revision C and has a 6-bit IR length.  
5.26.3 JTAG 1149.1 Boundary Scan Considerations  
To use boundary scan, the following sequence should be followed:  
Execute a valid reset sequence and exit reset  
Wait at least 6000 OSCIN clock cycles  
Enter boundary scan mode using the JTAG pins  
No specific value is required on the EMU0 pin for boundary scan testing. If TRST is not driven by the  
boundary scan tool or tester, TRST should be externally pulled high during boundary scan testing.  
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5.27 IEEE 1149.1 JTAG  
The JTAG (1) interface is used for BSDL testing and emulation of the device.  
The device requires that both TRST and RESET be asserted upon power up to be properly initialized.  
While RESET initializes the device, TRST initializes the device's emulation logic. Both resets are required  
for proper operation.  
While both TRST and RESET need to be asserted upon power up, only RESET needs to be released for  
the device to boot properly. TRST may be asserted indefinitely for normal operation, keeping the JTAG  
port interface and device's emulation logic in the reset state.  
TRST only needs to be released when it is necessary to use a JTAG controller to debug the device or  
exercise the device's boundary scan functionality.  
RESET must be released only in order for boundary-scan JTAG to read the variant field of IDCODE  
correctly. Other boundary-scan instructions work correctly independent of current state of RESET.  
For maximum reliability, the device includes an internal pulldown (IPD) on the TRST pin to ensure that  
TRST will always be asserted upon power up and the device's internal emulation logic will always be  
properly initialized.  
JTAG controllers from Texas Instruments actively drive TRST high. However, some third-party JTAG  
controllers may not drive TRST high but expect the use of a pullup resistor on TRST.  
When using this type of JTAG controller, assert TRST to initialize the device after powerup and externally  
drive TRST high before attempting any emulation or boundary scan operations.  
Note: The sequencing of all the JTAG signals must follow the IEEE.1149.1 JTAG standard.  
5.27.1 JTAG Peripheral Register Description(s) – JTAG ID Register  
Table 5-89. JTAG ID Register  
HEX ADDRESS RANGE  
ACRONYM  
REGISTER NAME  
COMMENTS  
0x01C4 0028  
JTAGID  
JTAG Identification Register  
Read-only. Provides 32-bit JTAG ID of the device.  
(1) IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.  
The JTAG ID register is a read-only register that identifies to the customer the JTAG/Device ID. The  
register hex value each silicon revision is:  
0x0B79 F02F for silicon revision 1.0.  
0x8B79 F02F for silicon revision 1.1.  
0x9B79 F02F for silicon revision 3.0, 2.1, and 2.0.  
For the actual register bit names and their associated bit field descriptions, see Figure 5-48 and Table 5-  
90.  
31  
VARIANT (4-Bit)  
R-xxxx  
28  
27  
12  
11  
1
0
PART NUMBER (16-Bit)  
R-1011 0111 1101 1111  
MANUFACTURER (11-Bit)  
R-0000 0010 111  
LSB  
R-1  
LEGEND: R = Read, W = Write, n = value after reset  
Figure 5-48. JTAG ID (DEVIDR0) Register Description - Register Value  
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Table 5-90. JTAG ID Register Selection Bit Descriptions  
BIT  
31:28  
27:12  
11-1  
0
NAME  
DESCRIPTION  
VARIANT  
Variant (4-bit) value  
PART NUMBER  
MANUFACTURER  
LSB  
Part Number (16-Bit) value  
Manufacturer (11-Bit) value  
LSB. This bit is read as a "1".  
5.27.2 JTAG Test-Port Electrical Data/Timing  
Table 5-91. Timing Requirements for JTAG Test Port (see Figure 5-49)  
No.  
1
PARAMETER  
MIN  
MAX  
UNIT  
ns  
tc(TCK)  
Cycle time, TCK  
40  
16  
16  
4
2
tw(TCKH)  
Pulse duration, TCK high  
ns  
3
tw(TCKL)  
Pulse duration, TCK low  
ns  
4
tsu(TDIV-TCKH)  
th(TCLKH-TDIV)  
Setup time, TDI/TMS/TRST valid before TCK high  
Hold time, TDI/TMS/TRST valid after TCK high  
ns  
5
4
ns  
Table 5-92. Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port  
(see Figure 5-49)  
No.  
PARAMETER  
Delay time, TCK low to TDO valid  
MIN  
MAX  
UNIT  
6
td(TCKL-TDOV)  
15  
ns  
1
3
TCK  
TDO  
2
6
6
5
4
TDI/TMS/TRST  
Figure 5-49. JTAG Test-Port Timing  
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6 Device and Documentation Support  
6.1 Device Support  
6.1.1 Development Support  
TI offers an extensive line of development tools for the TMS320C6743 platform, including tools to evaluate  
the performance of the processors, generate code, develop algorithm implementations, and fully integrate  
and debug software and hardware modules. The tool's support documentation is electronically available  
within the Code Composer Studio™ Integrated Development Environment (IDE).  
The following products support development of TMS320C6743 applications:  
Software Development Tools:  
Code Composer Studio™ Integrated Development Environment (IDE): including Editor  
C/C++/Assembly Code Generation, and Debug plus additional development tools  
Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target  
software needed to support any application.  
Hardware Development Tools:  
Extended Development System (XDS™) Emulator  
For a complete listing of development-support tools for the device , visit the Texas Instruments web  
site on the Worldwide Web at www.ti.com uniform resource locator (URL). For information on pricing  
and availability, contact the nearest TI field sales office or authorized distributor.  
6.1.2 Device and Development-Support Tool Nomenclature  
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all  
DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX,  
TMP, or TMS (e.g., TMS320C6743). Texas Instruments recommends two of three possible prefix  
designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of  
product development from engineering prototypes (TMX/TMDX) through fully qualified production  
devices/tools (TMS/TMDS).  
Device development evolutionary flow:  
TMX  
TMP  
TMS  
Experimental device that is not necessarily representative of the final device's electrical  
specifications.  
Final silicon die that conforms to the device's electrical specifications but has not completed  
quality and reliability verification.  
Fully-qualified production device.  
Support tool development evolutionary flow:  
TMDX  
Development-support product that has not yet completed Texas Instruments internal  
qualification testing.  
TMDS  
Fully qualified development-support product.  
TMX and TMP devices and TMDX development-support tools are shipped against the following  
disclaimer:  
"Developmental product is intended for internal evaluation purposes."  
TMS devices and TMDS development-support tools have been characterized fully, and the quality and  
reliability of the device have been demonstrated fully. TI's standard warranty applies.  
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Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard  
production devices. Texas Instruments recommends that these devices not be used in any production  
system because their expected end-use failure rate still is undefined. Only qualified production devices are  
to be used.  
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the  
package type (for example, ZWT), the temperature range (for example, "Blank" is the commercial  
temperature range), and the device speed range in megahertz (for example, "Blank" is the default).  
Figure 6-1 provides a legend for reading the complete device name for any TMS320C674x member.  
( )  
( ) ( )  
TMS  
320  
C6743  
ZKB  
PREFIX  
DEVICE SPEED RANGE  
TMX = Experimental Device  
TMS = Qualified Device  
2 = 200 MHz  
3 = 300 MHz for revision 1.x  
3 = 375 MHz for revision 2.x, 3.0  
DEVICE FAMILY  
TEMPERATURE RANGE (JUNCTION)  
320 = TMS320™ DSP Family  
Blank = 0°C to 90°C, Commercial Grade  
= –40°C to 125°C, Automotive Grade  
T
DEVICE  
C6743  
PACKAGE TYPE(A)  
SILICON REVISION  
Blank = Revision 1.0  
A = Revision 1.1  
B = Revision 2.0  
C = Revision 2.1  
D = Revision 3.0  
ZKB = 256-Pin Plastic BGA, with Pb-free Soldered  
Balls [Green]  
PTP = 176-Pin Thin Quad Flat Pack (TQFP)  
[PTP Suffix], 0.5 mm Pin Pitch  
A. BGA = Ball Grid Array.  
Figure 6-1. Device Nomenclature  
6.2 Documentation Support  
The following documents describe the TMS320C6743 Low-power digital signal processor. Copies of these  
documents are available on the Internet at www.ti.com. Tip: Enter the literature number in the search box  
provided at www.ti.com.  
DSP Reference Guides  
SPRUG82 TMS320C674x DSP Cache User's Guide. Explains the fundamentals of memory caches  
and describes how the two-level cache-based internal memory architecture in the  
TMS320C674x digital signal processor (DSP) can be efficiently used in DSP applications.  
Shows how to maintain coherence with external memory, how to use DMA to reduce  
memory latencies, and how to optimize your code to improve cache efficiency. The internal  
memory architecture in the C674x DSP is organized in a two-level hierarchy consisting of a  
dedicated program cache (L1P) and a dedicated data cache (L1D) on the first level.  
Accesses by the CPU to the these first level caches can complete without CPU pipeline  
stalls. If the data requested by the CPU is not contained in cache, it is fetched from the next  
lower memory level, L2 or external memory.  
SPRUFE8 TMS320C674x DSP CPU and Instruction Set Reference Guide. Describes the CPU  
architecture, pipeline, instruction set, and interrupts for the TMS320C674x digital signal  
processors (DSPs). The C674x DSP is an enhancement of the C64x+ and C67x+ DSPs with  
added functionality and an expanded instruction set.  
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SPRU186  
TMS320C6000 Assembly Language Tools User's Guide. Describes the assembly  
language tools (assembler, linker, and other tools used to develop assembly language code),  
assembler directives, macros, common object file format, and symbolic debugging directives  
for the TMS320C6000 platform of devices (including the C64x+, C67x+, and C674x  
generations).  
SPRU187  
TMS320C6000 Optimizing Compiler User's Guide. Describes the TMS320C6000 C  
compiler and the assembly optimizer. This C compiler accepts ANSI standard C source code  
and produces assembly language source code for the TMS320C6000 platform of devices  
(including the C64x+, C67x+, and C674x generations). The assembly optimizer helps you  
optimize your assembly code.  
SPRUGJ0 TMS320C6743 DSP System Reference Guide. Describes the System-on-Chip (SoC)  
system. The SoC system includes TI’s standard TMS320C674x Megamodule and several  
blocks of internal memory (L1P, L1D, and L2).  
SPRUFK5 TMS320C674x DSP Megamodule Reference Guide. Describes the TMS320C674x digital  
signal processor (DSP) megamodule. Included is a discussion on the internal direct memory  
access (IDMA) controller, the interrupt controller, the power-down controller, memory  
protection, bandwidth management, and the memory and cache.  
SPRUFK9 TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide. Provides  
an overview and briefly describes the peripherals available on TMS320C6743.  
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7 Mechanical Packaging and Orderable Information  
This section describes the orderable part numbers, packaging options, materials, thermal and mechanical  
parameters.  
7.1 Thermal Data for ZKB  
The following table(s) show the thermal resistance characteristics for the PBGA–ZKB mechanical  
package.  
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZKB]  
NO.  
CHARACTERISTIC  
°C/W(1)  
°C/W(2)  
AIR FLOW  
(m/s)(3)  
1
2
RΘJC  
RΘJB  
RΘJA  
Junction-to-case  
12.8  
15.1  
24.5  
21.9  
21.1  
20.4  
19.6  
0.6  
13.5  
19.7  
33.8  
30  
N/A  
N/A  
Junction-to-board  
Junction-to-free air  
3
0.00  
0.50  
1.00  
2.00  
4.00  
0.00  
0.50  
1.00  
2.00  
4.00  
0.00  
0.50  
1.00  
2.00  
4.00  
4
5
28.7  
27.4  
26  
RΘJMA  
Junction-to-moving air  
6
7
8
0.8  
9
0.8  
1
10  
11  
12  
13  
14  
15  
16  
17  
PsiJT  
Junction-to-package top  
0.9  
1.2  
1.1  
1.4  
1.3  
1.8  
14.9  
14.4  
14.4  
14.3  
14.1  
19.1  
18.2  
18  
PsiJB  
Junction-to-board  
17.7  
17.4  
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.  
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment  
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount  
Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and  
1.5oz (50um) inner copper thickness  
(2) Simulation data, using the same model but with 1oz (35um) top and bottom copper thickness and 0.5oz (18um) inner copper thickness.  
Power dissipation of 1W and ambient temp of 70C assumed.  
(3) m/s = meters per second  
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7.2 Thermal Data for PTP  
The following table(s) show the thermal resistance characteristics for the HTQFP–PTP mechanical  
package.  
Table 7-2. Thermal Resistance Characteristics (HTQFP Package) [PTP]  
NO.  
CHARACTERISTIC  
°C/W(1)  
°C/W(2)  
°C/W(3)  
°C/W(4)  
AIR FLOW  
(m/s)(5)  
1
2
3
4
5
6
7
8
9
RΘJC  
RΘJB  
RΘJA  
Junction-to-case  
7.8  
6.2  
9.4  
9.9  
8.6  
7.1  
10.1  
10.6  
30.6  
22.6  
21.0  
19.6  
18.2  
0.8  
N/A  
N/A  
Junction-to-board  
Junction-to-free air  
21.3  
14.3  
13.1  
12.1  
11.2  
0.5  
27.9  
20.2  
18.6  
17.4  
16.2  
0.7  
23.2  
0.00  
0.50  
1.00  
2.00  
4.00  
0.00  
0.50  
1.00  
2.00  
4.00  
0.00  
0.50  
1.00  
2.00  
4.00  
RΘJMA Junction-to-moving air  
0.6  
0.9  
1.0  
10 PsiJT  
Junction-to-package top  
Junction-to-board  
0.7  
1.0  
1.1  
11  
0.8  
1.1  
1.3  
12  
1.0  
1.3  
1.5  
13  
6.3  
9.5  
10.8  
9.9  
14  
5.9  
8.8  
15 PsiJB  
5.9  
8.7  
9.8  
16  
17  
5.8  
8.6  
9.7  
5.8  
8.5  
9.6  
(1) Simulation data, using a model of a JEDEC defined 2S2P system with a 12mmx12mm copper pad on the top and bottom copper layers  
connected with an 8x8 thermal via array and soldered to the package thermal pad. Power dissipation of 1W assumed, 70C Ambient  
temp assumed. Signal layer copper coverage 20%, inner layer copper coverage 90%. Actual performance will change based on  
environment as well as application. For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal  
Test Method Environment Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for  
Leaded Surface Mount Packages.  
(2) Simulation data, using the same model but with 1oz (35um) top and bottom copper thickness and 0.5oz (18um) inner copper thickness.  
Power dissipation of 1W and ambient temp of 70C assumed.  
(3) Simulation data, 1S1P PCB model with 12x12mm copper pad on the top layer soldered to device thermal pad and connected to the  
bottom copper layer (90% copper) with an 8x8 thermal via array. Power dissipation of 1W and ambient temp of 70C assumed. Copper  
thickness 2oz (70um) top and bottom.  
(4) Simulation data, 1S1P PCB model with 12x12mm copper pad on the top layer soldered to device thermal pad and connected to the  
bottom copper layer (90% copper) with an 8x8 thermal via array. Power dissipation of 1W and ambient temp of 70C assumed. Copper  
thickness 1oz (35um) top and bottom.  
(5) m/s = meters per second  
7.3 Supplementary Information About the 176-pin PTP PowerPAD™ Package  
This section highlights a few important details about the 176-pin PTP PowerPAD™ package. Texas  
Instruments' PowerPAD Thermally Enhanced Package Technical Brief (SLMA002) should be consulted  
when creating a PCB footprint for this device.  
7.3.1 Standoff Height  
As illustrated in Figure 7-1, the standoff height specification for this device (between 0.050 mm and  
0.150 mm) is measured from the seating plane established by the three lowest package pins to the lowest  
point on the package body. Due to warpage, the lowest point on the package body is located in the center  
of the package at the exposed thermal pad.  
Using this definition of standoff height provides the correct result for determining the correct solder paste  
thickness. According to TI's PowerPAD Thermally Enhanced Package Technical Brief (SLMA002), the  
recommended range of solder paste thickness for this package is between 0.152 mm and 0.178 mm.  
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Standoff Height  
Figure 7-1. Standoff Height Measurement on 176-pin PTP Package  
7.3.2 PowerPAD™ PCB Footprint  
In general, for proper thermal performance, the thermal pad under the package body should be as large  
as possible. However, the soldermask opening for the PowerPAD™ should be sized to match the pad size  
on the 176-pin PTP package; as illustrated in Figure 7-2.  
Thermal Pad on T op Copper  
should be as large as Possible.  
Soldermask opening should be smaller and match  
the size of the thermal pad on the DSP .  
Figure 7-2. Soldermask Opening Should Match Size of DSP Thermal Pad  
7.4 Mechanical Drawings  
This section contains mechanical drawings for the ZKB Plastic Ball Grid Array package and the PTP Thin  
Quad Flat Pack package. Additionally, for the PTP package a detailed drawing of the actual thermal pad  
dimensions as well as a recommended PCB footprint are provided.  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Aug-2013  
PACKAGING INFORMATION  
Orderable Device  
TMS320C6743BPTP2  
TMS320C6743BPTP3  
TMS320C6743BPTPT2  
TMS320C6743BPTPT3  
TMS320C6743BZKB3  
TMS320C6743BZKBT3  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
0 to 90  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
NRND  
HLQFP  
HLQFP  
HLQFP  
HLQFP  
BGA  
PTP  
176  
176  
176  
176  
256  
256  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
SNAGCU  
Level-4-260C-72 HR  
Level-4-260C-72 HR  
Level-4-260C-72 HR  
Level-4-260C-72 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
TMS320  
C6743BPTP2  
NRND  
NRND  
NRND  
NRND  
NRND  
PTP  
PTP  
PTP  
ZKB  
ZKB  
Green (RoHS  
& no Sb/Br)  
0 to 90  
TMS320  
C6743BPTP3  
Green (RoHS  
& no Sb/Br)  
-40 to 125  
-40 to 125  
0 to 90  
TMS320  
C6743BPTPT2  
Green (RoHS  
& no Sb/Br)  
TMS320  
C6743BPTPT3  
Green (RoHS  
& no Sb/Br)  
TMS320  
C6743BZKB3  
BGA  
Green (RoHS  
& no Sb/Br)  
SNAGCU  
-40 to 125  
TMS320  
C6743BZKBT3  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Aug-2013  
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
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