TMS320DM643AZDK5 [TI]
Video/Imaging Fixed-Point Digital Signal Processor; 视频/影像定点数字信号处理器
| 型号： | TMS320DM643AZDK5 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Video/Imaging Fixed-Point Digital Signal Processor |
| 文件： | 总164页 (文件大小：1170K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TMS320DM643
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SPRS269D–FEBRUARY 2005–REVISED OCTOBER 2010
TMS320DM643
Video/Imaging Fixed-Point Digital Signal Processor
Check for Samples: TMS320DM643
1 TMS320DM643 Video/Imaging Fixed-Point Digital Signal Processor
1234
Synchronous Memories (SDRAM, SBSRAM,
ZBT SRAM, and FIFO)
– 1024M-Byte Total Addressable External
Memory Space
• Enhanced Direct-Memory-Access (EDMA)
Controller (64 Independent Channels)
• High-Performance Digital Media Processor
– 2-, 1.67-ns Instruction Cycle Time
– 500-, 600-MHz Clock Rate
– Eight 32-Bit Instructions/Cycle
– 4000, 4800 MIPS
– Fully Software-Compatible With C64x™
• 10/100 Mb/s Ethernet MAC (EMAC)
– IEEE 802.3 Compliant
• VelociTI.2™ Extensions to VelociTI™
Advanced Very-Long-Instruction-Word (VLIW)
TMS320C64x™ DSP Core
– Media Independent Interface (MII)
– 8 Independent Transmit (TX) Channels and 1
Receive (RX) Channel
– Eight Highly Independent Functional Units
With VelociTI.2™ Extensions:
• Management Data Input/Output (MDIO)
• Two Configurable Video Ports (VP1, VP2)
•
Six ALUs (32-/40-Bit), Each Supports
Single 32-Bit, Dual 16-Bit, or Quad 8-Bit
Arithmetic per Clock Cycle
– Providing a Glueless I/F to Common Video
Decoder and Encoder Devices
•
Two Multipliers Support Four 16 x 16-Bit
Multiplies (32-Bit Results) per Clock
Cycle or Eight 8 x 8-Bit Multiplies (16-Bit
Results) per Clock Cycle
– Supports Multiple Resolutions/Video Stds
• VCXO Interpolated Control Port (VIC)
– Supports Audio/Video Synchronization
• Host-Port Interface (HPI) [32-/16-Bit]
• Multichannel Audio Serial Port (McASP)
– Eight Serial Data Pins
– Load-Store Architecture With Non-Aligned
Support
– 64 32-Bit General-Purpose Registers
– Instruction Packing Reduces Code Size
– All Instructions Conditional
– Wide Variety of I2S and Similar Bit Stream
Format
• Instruction Set Features
– Integrated Digital Audio I/F Transmitter
Supports S/PDIF, IEC60958-1, AES-3, CP-430
Formats
– Byte-Addressable (8-/16-/32-/64-Bit Data)
– 8-Bit Overflow Protection
– Bit-Field Extract, Set, Clear
• Inter-Integrated Circuit ( I2C Bus™)
• Multichannel Buffered Serial Port
– CLKS Input Not Supported
– Normalization, Saturation, Bit-Counting
– VelociTI.2™ Increased Orthogonality
• L1/L2 Memory Architecture
• Three 32-Bit General-Purpose Timers
• Sixteen General-Purpose I/O (GPIO) Pins
• Flexible PLL Clock Generator
– 128K-Bit (16K-Byte) L1P Program Cache
(Direct Mapped)
– 128K-Bit (16K-Byte) L1D Data Cache (2-Way
Set-Associative)
• IEEE-1149.1 (JTAG) Boundary-
Scan-Compatible
– 2M-Bit (256K-Byte) L2 Unified Mapped
RAM/Cache (Flexible RAM/Cache
Allocation)
• 548-Pin Ball Grid Array (BGA) Package
(GDK and ZDK Suffixes), 0.8-mm Ball Pitch
• 548-Pin Ball Grid Array (BGA) Package
(GNZ and ZNZ Suffixes), 1.0-mm Ball Pitch
• 0.13-µm/6-Level Cu Metal Process (CMOS)
• 3.3-V I/O, 1.2-V Internal (-500)
• 3.3-V I/O, 1.4-V Internal (-600)
• Endianess: Little Endian, Big Endian
• 64-Bit External Memory Interface (EMIF)
– Glueless Interface to Asynchronous
Memories (SRAM and EPROM) and
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Windows is a registered trademark of Microsoft Corporation.
2
3
4
I2C Bus is a trademark of Philips Electronics N.V.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2010, Texas Instruments Incorporated
TMS320DM643
SPRS269D–FEBRUARY 2005–REVISED OCTOBER 2010
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The TMS320C64x™ DSPs (including the TMS320DM643 device) are the highest-performance fixed-point
DSP generation in the TMS320C6000™ DSP platform. The TMS320DM643 (DM643) device is based on
the second-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW)
architecture (VelociTI.2™) developed by Texas Instruments (TI), making these DSPs an excellent choice
for digital media applications. The C64x™ is a code-compatible member of the C6000™ DSP platform.
With performance of up to 4800 million instructions per second (MIPS) at a clock rate of 600 MHz, the
DM643 device offers cost-effective solutions to high-performance DSP programming challenges. The
DM643 DSP possesses the operational flexibility of high-speed controllers and the numerical capability of
array processors. The C64x™ DSP core processor has 64 general-purpose registers of 32-bit word length
and eight highly independent functional units—two multipliers for a 32-bit result and six arithmetic logic
units (ALUs)—with VelociTI.2™ extensions. The VelociTI.2™ extensions in the eight functional units
include new instructions to accelerate the performance in video and imaging applications and extend the
parallelism of the VelociTI™ architecture. The DM643 can produce four 16-bit multiply-accumulates
(MACs) per cycle for a total of 2400 million MACs per second (MMACS), or eight 8-bit MACs per cycle for
a total of 4800 MMACS. The DM643 DSP also has application-specific hardware logic, on-chip memory,
and additional on-chip peripherals similar to the other C6000™ DSP platform devices.
The DM643 uses a two-level cache-based architecture and has a powerful and diverse set of peripherals.
The Level 1 program cache (L1P) is a 128-Kbit direct mapped cache and the Level 1 data cache (L1D) is
a 128-Kbit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of an 2-Mbit memory
space that is shared between program and data space. L2 memory can be configured as mapped
memory, cache, or combinations of the two. The peripheral set includes: two configurable video ports; a
10/100 Mb/s Ethernet MAC (EMAC); a management data input/output (MDIO) module; a VCXO
interpolated control port (VIC); one multichannel buffered audio serial port (McASP0); an inter-integrated
circuit (I2C) Bus module; one multichannel buffered serial port (McBSP); three 32-bit general-purpose
timers; a user-configurable 16-bit or 32-bit host-port interface (HPI16/HPI32); a 16-pin general-purpose
input/output port (GP0) with programmable interrupt/event generation modes; and a 64-bit glueless
external memory interface (EMIFA), which is capable of interfacing to synchronous and asynchronous
memories and peripherals.
The DM643 device has two configurable video port peripherals (VP1 and VP2). These video port
peripherals provide a glueless interface to common video decoder and encoder devices. The DM643
video port peripherals support multiple resolutions and video standards (e.g., CCIR601, ITU-BT.656,
BT.1120, SMPTE 125M, 260M, 274M, and 296M).
These two video port peripherals are configurable and can support either video capture and/or video
display modes. Each video port consists of two channels — A and B with a 5120-byte capture/display
buffer that is splittable between the two channels.
For more details on the Video Port peripherals, see the TMS320C64x DSP Video Port/VCXO Interpolated
Control (VIC) Port Reference Guide (literature number SPRU629).
The McASP0 port supports one transmit and one receive clock zone, with eight serial data pins which can
be individually allocated to any of the two zones. The serial port supports time-division multiplexing on
each pin from 2 to 32 time slots. The DM643 has sufficient bandwidth to support all 8 serial data pins
transmitting a 192-kHz stereo signal. Serial data in each zone may be transmitted and received on
multiple serial data pins simultaneously and formatted in a multitude of variations on the Philips Inter-IC
Sound (I2S) format.
In addition, the McASP0 transmitter may be programmed to output multiple S/PDIF, IEC60958, AES-3,
CP-430 encoded data channels simultaneously, with a single RAM containing the full implementation of
user data and channel status fields.
McASP0 also provides extensive error-checking and recovery features, such as the bad clock detection
circuit for each high-frequency master clock which verifies that the master clock is within a programmed
frequency range.
2
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The VCXO interpolated control (VIC) port provides digital-to-analog conversion with resolution from 9-bits
to up to 16-bits. The output of the VIC is a single bit interpolated D/A output.For more details on the VIC
port, see the TMS320C64x DSP Video Port/VCXO Interpolated Control (VIC) Port Reference Guide
(literature number SPRU629).
The ethernet media access controller (EMAC) provides an efficient interface between the DM643 DSP
core processor and the network. The DM643 EMAC support both 10Base-T and 100Base-TX, or
10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex, with hardware flow control and quality
of service (QOS) support. The DM643 EMAC makes use of a custom interface to the DSP core that
allows efficient data transmission and reception.For more details on the EMAC, see the TMS320C6000
DSP Ethernet Media Access Controller (EMAC) / Management Data Input/Output (MDIO) Module
Reference Guide (literature number SPRU628).
The management data input/output (MDIO) module continuously polls all 32 MDIO addresses in order to
enumerate all PHY devices in the system. Once a PHY candidate has been selected by the DSP, the
MDIO module transparently monitors its link state by reading the PHY status register. Link change events
are stored in the MDIO module and can optionally interrupt the DSP, allowing the DSP to poll the link
status of the device without continuously performing costly MDIO accesses. For more details on the
MDIO, see the TMS320C6000 DSP Ethernet Media Access Controller (EMAC) / Management Data
Input/Output (MDIO) Module Reference Guide (literature number SPRU628).
The I2C0 port on the TMS320DM643 allows the DSP to easily control peripheral devices and
communicate with a host processor. In addition, the standard multichannel buffered serial port (McBSP)
may be used to communicate with serial peripheral interface (SPI) mode peripheral devices.
The DM643 has a complete set of development tools which includes: a new C compiler, an assembly
optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into
source code execution.
1.1 Device Compatibility
The DM643 device is a code-compatible member of the C6000™ DSP platform.
The C64x™ DSP generation of devices has a diverse and powerful set of peripherals.
For more detailed information on the device compatibility and similarities/differences among the DM642
and other C64x™ devices, see the TMS320DM642 Technical Overview (literature number SPRU615).
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1.2 Functional Block Diagram
Figure 1-1 shows the functional block diagram of the DM643 device.
64
SDRAM
TMS320DM643
EMIF A
SBSRAM
Timer 2
L1P Cache
Direct-Mapped
16K Bytes Total
ZBT SRAM
Timer 1
FIFO
Timer 0
SRAM
VCXO
C64x DSP Core
Interpolated
ROM/FLASH
I/O Devices
Control Port
(VIC)
Instruction Fetch
Control
Registers
Video Port 2
(VP2)
Instruction Dispatch
Advanced Instruction Packet
Control
Logic
Instruction Decode
(A)
McBSP0
Data Path A
Data Path B
Test
McASP0
Control
A Register File
A31−A16
B Register File
B31−B16
Advanced
In-Circuit
Emulation
A15−A0
B15−B0
Video Port 1
(VP1)
Enhanced
DMA
Controller
(EDMA)
L2
.L1 .S1 .M1 .D1
.D2 .M2 .S2 .L2
Interrupt
Control
OR
Cache
Memory
256K
8/10-bit VP1
AND
Bytes
See Note (B)
McASP0
Data
L1D Cache 2-Way Set-Associative
16K Bytes Total
Power-Down
Logic
PLL
(x1, x6, x12)
HPI32
OR
HPI16
AND/OR
EMAC
MDIO
16
16
GP0
I2C0
Boot Configuration
A. McBSP: AC97 Devices; SPI Devices; Codecs
B. The Video Port 1 (VP1) peripheral is muxed with the McASP0 data pins. The HPI(32/16) peripheral is muxed with the EMAC and MDIO
peripherals. For more details on the multiplexed pins of these peripherals, see the Device Configurations section of this data sheet.
Figure 1-1. Functional Block Diagram
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1
TMS320DM643 Video/Imaging Fixed-Point Digital
Signal Processor ........................................ 1
1.1 Device Compatibility ................................. 3
1.2 Functional Block Diagram ............................ 4
Device Overview ........................................ 6
5
DM643 Peripheral Information and Electrical
Specifications .......................................... 64
5.1 Parameter Information .............................. 64
5.2
Recommended Clock and Control Signal Transition
Behavior ............................................ 66
2
5.3 Power Supplies ..................................... 66
2.1 Device Characteristics ............................... 6
2.2 CPU (DSP Core) Description ........................ 6
2.3 Memory Map Summary ............................. 13
2.4 Bootmode ........................................... 16
2.5 Pin Assignments .................................... 16
2.6 Development ........................................ 46
Device Configurations ................................ 49
3.1 Configurations at Reset ............................ 49
3.2 Configurations After Reset ......................... 50
3.3 Peripheral Configuration Lock ...................... 53
3.4 Device Status Register Description ................ 55
3.5 Multiplexed Pin Configurations ..................... 56
3.6 Debugging Considerations ......................... 58
5.4
Enhanced Direct Memory Access (EDMA)
Controller ........................................... 71
5.5 Interrupts ............................................ 75
5.6 Reset ............................................... 77
5.7 Clock PLL ........................................... 80
5.8 External Memory Interface (EMIIF) ................. 86
5.9
Multichannel Audio Serial Port (McASP0) Peripheral
3
..................................................... 102
5.10 Inter-Integrated Circuit (I2C) ...................... 110
5.11 Host-Port Interface (HPI) .......................... 116
5.12 Multichannel Buffered Serial Port (McBSP) ....... 122
5.13 Video Port ......................................... 130
5.14 VCXO Interpolated Control (VIC) ................. 138
5.15 Ethernet Media Access Controller (EMAC) ....... 140
5.16 Management Data Input/Output (MDIO) .......... 146
5.17 Timer .............................................. 148
5.18 General-Purpose Input/Output (GPIO) ............ 150
5.19 JTAG .............................................. 153
3.7 Configuration Examples ............................ 58
4
Device Operating Conditions ....................... 62
4.1
Absolute Maximum Ratings Over Operating Case
Temperature Range
(Unless Otherwise Noted) ................................. 62
4.2 Recommended Operating Conditions .............. 62
6
7
Revision History ...................................... 155
Mechanical Data ...................................... 156
7.1 Thermal Data ...................................... 156
7.2 Packaging Information ............................ 157
4.3
Electrical Characteristics Over Recommended
Ranges of Supply Voltage and Operating Case
Temperature (Unless Otherwise Noted) ............ 63
Copyright © 2005–2010, Texas Instruments Incorporated
Contents
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2 Device Overview
2.1 Device Characteristics
Table 2-1 provides an overview of the DM643 DSP. The table shows significant features of the DM643
device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type
with pin count.
Table 2-1. Characteristics of the DM643 Processor
HARDWARE FEATURES
DM643
EMIFA (64-bit bus width)
(clock source = AECLKIN)
1
EDMA (64 independent channels)
McASP0 (uses Peripheral Clock [AUXCLK])
I2C0 (uses Peripheral Clock)
1
1
1
Peripherals
HPI (32- or 16-bit user selectable)
1 (HPI16 or HPI32)
McBSP
Not all peripherals pins are
available at the same time
(For more detail, see the
Device Configuration
section).
1
(internal clock source = CPU/4 clock frequency)
Configurable Video Ports (VP1 and VP2)
10/100 Ethernet MAC (EMAC)
2
1
1
1
Management Data Input/Output (MDIO)
VCXO Interpolated Control Port (VIC)
32-Bit Timers
(internal clock source = CPU/8 clock frequency)
3
General-Purpose Input/Output Port (GP0)
Size (Bytes)
16
288K
16K-Byte (16KB) L1 Program (L1P) Cache
16KB L1 Data (L1D) Cache
On-Chip Memory
Organization
256KB Unified Mapped RAM/Cache (L2)
CPU ID + CPU Rev ID
JTAG BSDL_ID
Frequency
Control Status Register (CSR.[31:16])
JTAGID register (address location: 0x01B3F008)
MHz
0x0C01
0x0007902F
500, 600
2 ns (DM643-500)
[500 MHz CPU, 100 MHz EMIF(1)
1.67 ns (DM643-600)
]
]
Cycle Time
Voltage
ns
[600 MHz CPU, 133 MHz EMIF(1)
1.2 V (-500)
1.4 V (-600)
Core (V)
I/O (V)
3.3 V
PLL Options
CLKIN frequency multiplier
23 x 23 mm
Bypass (x1), x6, x12
548-Pin BGA (GDK and ZDK)
548-Pin BGA (GNZ and ZNZ)
0.13 µm
BGA Package
27 x 27 mm
Process Technology
Product Status(2)
µm
Product Preview (PP), Advance Information (AI),
or Production Data (PD)
PD
(1) On this DM64x™ device, the rated EMIF speed affects only the SDRAM interface on the EMIF. For more detailed information, see the
EMIF device speed portion of this data sheet.
(2) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
2.2 CPU (DSP Core) Description
The CPU fetches VelociTI™ advanced very-long instruction words (VLIWs) (256 bits wide) to supply up to
eight 32-bit instructions to the eight functional units during every clock cycle. The VelociTI™ VLIW
architecture features controls by which all eight units do not have to be supplied with instructions if they
are not ready to execute. The first bit of every 32-bit instruction determines if the next instruction belongs
6
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to the same execute packet as the previous instruction, or whether it should be executed in the following
clock as a part of the next execute packet. Fetch packets are always 256 bits wide; however, the execute
packets can vary in size. The variable-length execute packets are a key memory-saving feature,
distinguishing the C64x CPUs from other VLIW architectures. The C64x™ VelociTI.2™ extensions add
enhancements to the TMS320C62x™ DSP VelociTI™ architecture. These enhancements include:
•
•
•
•
•
•
Register file enhancements
Data path extensions
Quad 8-bit and dual 16-bit extensions with data flow enhancements
Additional functional unit hardware
Increased orthogonality of the instruction set
Additional instructions that reduce code size and increase register flexibility
The CPU features two sets of functional units. Each set contains four units and a register file. One set
contains functional units .L1, .S1, .M1, and .D1; the other set contains units .D2, .M2, .S2, and .L2. The
two register files each contain 32 32-bit registers for a total of 64 general-purpose registers. In addition to
supporting the packed 16-bit and 32-/40-bit fixed-point data types found in the C62x™ VelociTI™ VLIW
architecture, the C64x™ register files also support packed 8-bit data and 64-bit fixed-point data types. The
two sets of functional units, along with two register files, compose sides A and B of the CPU [see the
functional block and CPU (DSP core) diagram, and Figure 2-1]. The four functional units on each side of
the CPU can freely share the 32 registers belonging to that side. Additionally, each side features a "data
cross path"—a single data bus connected to all the registers on the other side, by which the two sets of
functional units can access data from the register files on the opposite side. The C64x CPU pipelines
data-cross-path accesses over multiple clock cycles. This allows the same register to be used as a
data-cross-path operand by multiple functional units in the same execute packet. All functional units in the
C64x CPU can access operands via the data cross path. Register access by functional units on the same
side of the CPU as the register file can service all the units in a single clock cycle. On the C64x CPU, a
delay clock is introduced whenever an instruction attempts to read a register via a data cross path if that
register was updated in the previous clock cycle.
In addition to the C62x™ DSP fixed-point instructions, the C64x™ DSP includes a comprehensive
collection of quad 8-bit and dual 16-bit instruction set extensions. These VelociTI.2™ extensions allow the
C64x CPU to operate directly on packed data to streamline data flow and increase instruction set
efficiency. This is a key factor for video and imaging applications.
Another key feature of the C64x CPU is the load/store architecture, where all instructions operate on
registers (as opposed to data in memory). Two sets of data-addressing units (.D1 and .D2) are
responsible for all data transfers between the register files and the memory. The data address driven by
the .D units allows data addresses generated from one register file to be used to load or store data to or
from the other register file. The C64x .D units can load and store bytes (8 bits), half-words (16 bits), and
words (32 bits) with a single instruction. And with the new data path extensions, the C64x .D unit can load
and store doublewords (64 bits) with a single instruction. Furthermore, the non-aligned load and store
instructions allow the .D units to access words and doublewords on any byte boundary. The C64x CPU
supports a variety of indirect addressing modes using either linear- or circular-addressing with 5- or 15-bit
offsets. All instructions are conditional, and most can access any one of the 64 registers. Some registers,
however, are singled out to support specific addressing modes or to hold the condition for conditional
instructions (if the condition is not automatically "true").
The two .M functional units perform all multiplication operations. Each of the C64x .M units can perform
two 16 × 16-bit multiplies or four 8 × 8-bit multiplies per clock cycle. The .M unit can also perform 16 ×
32-bit multiply operations, dual 16 × 16-bit multiplies with add/subtract operations, and quad 8 × 8-bit
multiplies with add operations. In addition to standard multiplies, the C64x .M units include bit-count,
rotate, Galois field multiplies, and bidirectional variable shift hardware.
The two .S and .L functional units perform a general set of arithmetic, logical, and branch functions with
results available every clock cycle. The arithmetic and logical functions on the C64x CPU include single
32-bit, dual 16-bit, and quad 8-bit operations.
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The processing flow begins when a 256-bit-wide instruction fetch packet is fetched from a program
memory. The 32-bit instructions destined for the individual functional units are "linked" together by "1" bits
in the least significant bit (LSB) position of the instructions. The instructions that are "chained" together for
simultaneous execution (up to eight in total) compose an execute packet. A "0" in the LSB of an
instruction breaks the chain, effectively placing the instructions that follow it in the next execute packet. A
C64x™ DSP device enhancement now allows execute packets to cross fetch-packet boundaries. In the
TMS320C62x™/TMS320C67x™ DSP devices, if an execute packet crosses the fetch-packet boundary
(256 bits wide), the assembler places it in the next fetch packet, while the remainder of the current fetch
packet is padded with NOP instructions. In the C64x™ DSP device, the execute boundary restrictions
have been removed, thereby, eliminating all of the NOPs added to pad the fetch packet, and thus,
decreasing the overall code size. The number of execute packets within a fetch packet can vary from one
to eight. Execute packets are dispatched to their respective functional units at the rate of one per clock
cycle and the next 256-bit fetch packet is not fetched until all the execute packets from the current fetch
packet have been dispatched. After decoding, the instructions simultaneously drive all active functional
units for a maximum execution rate of eight instructions every clock cycle. While most results are stored in
32-bit registers, they can be subsequently moved to memory as bytes, half-words, or doublewords. All
load and store instructions are byte-, half-word-, word-, or doubleword-addressable.
For more details on the C64x CPU functional units enhancements, see the following documents:
•
•
TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189)
TMS320C64x Technical Overview (literature number SPRU395)
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src1
.L1
src2
dst
8
long dst
long src
8
8
32 MSBs
32 LSBs
ST1b (Store Data)
ST1a (Store Data)
long src
long dst
dst
8
Register
File A
(A0−A31)
src1
.S1
Data Path A
src2
(A)
(A)
long dst
dst
src1
.M1
src2
32 MSBs
32 LSBs
LD1b (Load Data)
LD1a (Load Data)
dst
DA1 (Address)
src1
.D1
.D2
src2
2X
1X
src2
src1
dst
DA2 (Address)
32 LSBs
32 MSBs
LD2a (Load Data)
LD2b (Load Data)
src2
src1
dst
.M2
(A)
(A)
long dst
Register
File B
(B0− B31)
src2
Data Path B
.S2
src1
dst
8
8
long dst
long src
8
32 MSBs
32 LSBs
ST2a (Store Data)
ST2b (Store Data)
8
long src
long dst
dst
src2
.L2
src1
Control Register
File
A. For the .M functional units, the long dst is 32 MSBs and the dst is 32 LSBs.
Figure 2-1. TMS320C64x™ CPU (DSP Core) Data Paths
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2.2.1 CPU Core Registers
Table 2-2. L2 Cache Registers (C64x)
HEX ADDRESS RANGE
0184 0000
ACRONYM
REGISTER NAME
Cache configuration register
Reserved
COMMENTS
CCFG
–
0184 0004 – 0184 0FFC
0184 1000
EDMAWEIGHT L2 EDMA access control register
0184 1004 – 0184 1FFC
0184 2000
–
Reserved
L2ALLOC0
L2ALLOC1
L2ALLOC2
L2ALLOC3
–
L2 allocation register 0
0184 2004
L2 allocation register 1
0184 2008
L2 allocation register 2
0184 200C
L2 allocation register 3
0184 2010 – 0184 3FFC
0184 4000
Reserved
L2WBAR
L2WWC
L2WIBAR
L2WIWC
L2IBAR
L2IWC
L2 writeback base address register
L2 writeback word count register
L2 writeback invalidate base address register
L2 writeback invalidate word count register
L2 invalidate base address register
L2 invalidate word count register
L1P invalidate base address register
L1P invalidate word count register
L1D writeback invalidate base address register
L1D writeback invalidate word count register
Reserved
0184 4004
0184 4010
0184 4014
0184 4018
0184 401C
0184 4020
L1PIBAR
L1PIWC
L1DWIBAR
L1DWIWC
–
0184 4024
0184 4030
0184 4034
0184 4038 – 0184 4044
0184 4048
L1DIBAR
L1DIWC
–
L1D invalidate base address register
L1D invalidate word count register
Reserved
0184 404C
0184 4050 – 0184 4FFC
0184 5000
L2WB
L2 writeback all register
0184 5004
L2WBINV
–
L2 writeback invalidate all register
Reserved
0184 5008 – 0184 7FFC
MAR0 to
MAR127
0184 8000 – 0184 81FC
Reserved
0184 8200
0184 8204
0184 8208
0184 820C
0184 8210
0184 8214
0184 8218
0184 821C
0184 8220
0184 8224
0184 8228
0184 822C
0184 8230
0184 8234
0184 8238
0184 823C
0184 8240
0184 8244
MAR128
MAR129
MAR130
MAR131
MAR132
MAR133
MAR134
MAR135
MAR136
MAR137
MAR138
MAR139
MAR140
MAR141
MAR142
MAR143
MAR144
MAR145
Controls EMIFA CE0 range 8000 0000 – 80FF FFFF
Controls EMIFA CE0 range 8100 0000 – 81FF FFFF
Controls EMIFA CE0 range 8200 0000 – 82FF FFFF
Controls EMIFA CE0 range 8300 0000 – 83FF FFFF
Controls EMIFA CE0 range 8400 0000 – 84FF FFFF
Controls EMIFA CE0 range 8500 0000 – 85FF FFFF
Controls EMIFA CE0 range 8600 0000 – 86FF FFFF
Controls EMIFA CE0 range 8700 0000 – 87FF FFFF
Controls EMIFA CE0 range 8800 0000 – 88FF FFFF
Controls EMIFA CE0 range 8900 0000 – 89FF FFFF
Controls EMIFA CE0 range 8A00 0000 – 8AFF FFFF
Controls EMIFA CE0 range 8B00 0000 – 8BFF FFFF
Controls EMIFA CE0 range 8C00 0000 – 8CFF FFFF
Controls EMIFA CE0 range 8D00 0000 – 8DFF FFFF
Controls EMIFA CE0 range 8E00 0000 – 8EFF FFFF
Controls EMIFA CE0 range 8F00 0000 – 8FFF FFFF
Controls EMIFA CE1 range 9000 0000 – 90FF FFFF
Controls EMIFA CE1 range 9100 0000 – 91FF FFFF
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Table 2-2. L2 Cache Registers (C64x) (continued)
HEX ADDRESS RANGE
0184 8248
0184 824C
0184 8250
0184 8254
0184 8258
0184 825C
0184 8260
0184 8264
0184 8268
0184 826C
0184 8270
0184 8274
0184 8278
0184 827C
0184 8280
0184 8284
0184 8288
0184 828C
0184 8290
0184 8294
0184 8298
0184 829C
0184 82A0
0184 82A4
0184 82A8
0184 82AC
0184 82B0
0184 82B4
0184 82B8
0184 82BC
0184 82C0
0184 82C4
0184 82C8
0184 82CC
0184 82D0
0184 82D4
0184 82D8
0184 82DC
0184 82E0
0184 82E4
0184 82E8
0184 82EC
0184 82F0
0184 82F4
0184 82F8
0184 82FC
ACRONYM
MAR146
MAR147
MAR148
MAR149
MAR150
MAR151
MAR152
MAR153
MAR154
MAR155
MAR156
MAR157
MAR158
MAR159
MAR160
MAR161
MAR162
MAR163
MAR164
MAR165
MAR166
MAR167
MAR168
MAR169
MAR170
MAR171
MAR172
MAR173
MAR174
MAR175
MAR176
MAR177
MAR178
MAR179
MAR180
MAR181
MAR182
MAR183
MAR184
MAR185
MAR186
MAR187
MAR188
MAR189
MAR190
MAR191
REGISTER NAME
COMMENTS
Controls EMIFA CE1 range 9200 0000 – 92FF FFFF
Controls EMIFA CE1 range 9300 0000 – 93FF FFFF
Controls EMIFA CE1 range 9400 0000 – 94FF FFFF
Controls EMIFA CE1 range 9500 0000 – 95FF FFFF
Controls EMIFA CE1 range 9600 0000 – 96FF FFFF
Controls EMIFA CE1 range 9700 0000 – 97FF FFFF
Controls EMIFA CE1 range 9800 0000 – 98FF FFFF
Controls EMIFA CE1 range 9900 0000 – 99FF FFFF
Controls EMIFA CE1 range 9A00 0000 – 9AFF FFFF
Controls EMIFA CE1 range 9B00 0000 – 9BFF FFFF
Controls EMIFA CE1 range 9C00 0000 – 9CFF FFFF
Controls EMIFA CE1 range 9D00 0000 – 9DFF FFFF
Controls EMIFA CE1 range 9E00 0000 – 9EFF FFFF
Controls EMIFA CE1 range 9F00 0000 – 9FFF FFFF
Controls EMIFA CE2 range A000 0000 – A0FF FFFF
Controls EMIFA CE2 range A100 0000 – A1FF FFFF
Controls EMIFA CE2 range A200 0000 – A2FF FFFF
Controls EMIFA CE2 range A300 0000 – A3FF FFFF
Controls EMIFA CE2 range A400 0000 – A4FF FFFF
Controls EMIFA CE2 range A500 0000 – A5FF FFFF
Controls EMIFA CE2 range A600 0000 – A6FF FFFF
Controls EMIFA CE2 range A700 0000 – A7FF FFFF
Controls EMIFA CE2 range A800 0000 – A8FF FFFF
Controls EMIFA CE2 range A900 0000 – A9FF FFFF
Controls EMIFA CE2 range AA00 0000 – AAFF FFFF
Controls EMIFA CE2 range AB00 0000 – ABFF FFFF
Controls EMIFA CE2 range AC00 0000 – ACFF FFFF
Controls EMIFA CE2 range AD00 0000 – ADFF FFFF
Controls EMIFA CE2 range AE00 0000 – AEFF FFFF
Controls EMIFA CE2 range AF00 0000 – AFFF FFFF
Controls EMIFA CE3 range B000 0000 – B0FF FFFF
Controls EMIFA CE3 range B100 0000 – B1FF FFFF
Controls EMIFA CE3 range B200 0000 – B2FF FFFF
Controls EMIFA CE3 range B300 0000 – B3FF FFFF
Controls EMIFA CE3 range B400 0000 – B4FF FFFF
Controls EMIFA CE3 range B500 0000 – B5FF FFFF
Controls EMIFA CE3 range B600 0000 – B6FF FFFF
Controls EMIFA CE3 range B700 0000 – B7FF FFFF
Controls EMIFA CE3 range B800 0000 – B8FF FFFF
Controls EMIFA CE3 range B900 0000 – B9FF FFFF
Controls EMIFA CE3 range BA00 0000 – BAFF FFFF
Controls EMIFA CE3 range BB00 0000 – BBFF FFFF
Controls EMIFA CE3 range BC00 0000 – BCFF FFFF
Controls EMIFA CE3 range BD00 0000 – BDFF FFFF
Controls EMIFA CE3 range BE00 0000 – BEFF FFFF
Controls EMIFA CE3 range BF00 0000 – BFFF FFFF
MAR192 to
MAR255
0184 8300 – 0184 83FC
Reserved
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Table 2-2. L2 Cache Registers (C64x) (continued)
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
COMMENTS
0184 8400 – 0187 FFFF
–
Reserved
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2.3 Memory Map Summary
Table 2-3 shows the memory map address ranges of the DM643 device. Internal memory is always
located at address 0 and can be used as both program and data memory. The external memory address
ranges in the DM643 device begin at the hex address location 0x8000 0000 for EMIFA.
Table 2-3. TMS320DM643 Memory Map Summary
BLOCK SIZE
MEMORY BLOCK DESCRIPTION
Internal RAM (L2)
HEX ADDRESS RANGE
(BYTES)
256K
768K
23M
0000 0000 – 0003 FFFF
0004 0000 – 000F FFFF
0010 0000 – 017F FFFF
0180 0000 – 0183 FFFF
0184 0000 – 0187 FFFF
0188 0000 – 018B FFFF
018C 0000 – 018F FFFF
0190 0000 – 0193 FFFF
0194 0000 – 0197 FFFF
0198 0000 – 019B FFFF
019C 0000 – 019F FFFF
01A0 0000 – 01A3 FFFF
01A4 0000 – 01AB FFFF
01AC 0000 – 01AF FFFF
01B0 0000 – 01B3 EFFF
01B3 F000 – 01B3 FFFF
01B4 0000 – 01B4 3FFF
01B4 4000 – 01B4 BFFF
01B4 C000 – 01B4 FFFF
01B5 0000 – 01B7 FFFF
01B8 0000 – 01BB FFFF
01BC 0000 – 01BF FFFF
01C0 0000 – 01C3 FFFF
01C4 0000 – 01C4 3FFF
01C4 4000 – 01C4 7FFF
01C4 8000 – 01C4 BFFF
01C4 C000 – 01C4 FFFF
01C5 0000 – 01C7 FFFF
01C8 0000 – 01C8 0FFF
01C8 1000 – 01C8 2FFF
01C8 3000 – 01C8 37FF
01C8 3800 – 01C8 3FFF
01C8 4000 – 01FF FFFF
0200 0000 – 0200 0033
0200 0034 – 2FFF FFFF
3000 0000 – 33FF FFFF
3400 0000 – 37FF FFFF
3800 0000 – 3BFF FFFF
3C00 0000 – 3C0F FFFF
3C10 0000 – 3FFF FFFF
4000 0000 – 73FF FFFF
7400 0000 – 75FF FFFF
Reserved
Reserved
External Memory Interface A (EMIFA) Registers
L2 Registers
256K
256K
256K
256K
256K
256K
256K
256K
256K
512K
256K
256K – 4K
4K
HPI Registers
McBSP 0 Registers
Reserved
Timer 0 Registers
Timer 1 Registers
Interrupt Selector Registers
EDMA RAM and EDMA Registers
Reserved
Timer 2 Registers
GP0 Registers
Device Configuration Registers
I2C0 Data and Control Registers
Reserved
16K
32K
McASP0 Control Registers
Reserved
16K
192K
256K
256K
256K
16K
Reserved
Emulation
Reserved
Reserved
VP1 Control
16K
VP2 Control
16K
VIC Control
16K
Reserved
192K
4K
EMAC Control
EMAC Wrapper
EWRAP Registers
MDIO Control Registers
Reserved
8K
2K
2K
3.5M
52
QDMA Registers
Reserved
928M – 52
64M
McBSP 0 Data
Reserved
64M
Reserved
64M
McASP0 Data
1M
Reserved
64M – 1M
832M
32M
Reserved
Reserved
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Table 2-3. TMS320DM643 Memory Map Summary (continued)
BLOCK SIZE
(BYTES)
MEMORY BLOCK DESCRIPTION
HEX ADDRESS RANGE
Reserved
32M
32M
32M
32M
32M
256M
256M
256M
256M
1G
7600 0000 – 77FF FFFF
7800 0000 – 79FF FFFF
7A00 0000 – 7BFF FFFF
7C00 0000 – 7DFF FFFF
7E00 0000 – 7FFF FFFF
8000 0000 – 8FFF FFFF
9000 0000 – 9FFF FFFF
A000 0000 – AFFF FFFF
B000 0000 – BFFF FFFF
C000 0000 – FFFF FFFF
VP1 Channel A Data
VP1 Channel B Data
VP2 Channel A Data
VP2 Channel B Data
EMIFA CE0
EMIFA CE1
EMIFA CE2
EMIFA CE3
Reserved
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2.3.1 L2 Architecture Expanded
Figure 2-2 shows the detail of the L2 architecture on the TMS320DM643 device. For more information on
the L2MODE bits, see the cache configuration (CCFG) register bit field descriptions in the TMS320C64x
Two-Level Internal Memory Reference Guide (literature number SPRU610).
L2MODE
010
L2 Memory
Block Base Address
000
001
011
111
0x0000 0000
128K-Byte SRAM
0x0002 0000
64K-Byte RAM
0x0003 0000
0x0003 8000
32K-Byte RAM
32K-Byte RAM
0x0003 FFFF
0x0004 0000
Figure 2-2. TMS320DM643 L2 Architecture Memory Configuration
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2.4 Bootmode
The DM643 device resets using the active-low signal RESET. While RESET is low, the device is held in
reset and is initialized to the prescribed reset state. Refer to reset timing for reset timing characteristics
and states of device pins during reset. The release of RESET starts the processor running with the
prescribed device configuration and boot mode.
The DM643 has three types of boot modes:
•
Host boot
If host boot is selected, upon release of RESET, the CPU is internally "stalled" while the remainder of
the device is released. During this period, an external host can initialize the CPU's memory space as
necessary through the host interface, including internal configuration registers, such as those that
control the EMIF or other peripherals. Once the host is finished with all necessary initialization, it must
set the DSPINT bit in the HPIC register to complete the boot process. This transition causes the boot
configuration logic to bring the CPU out of the "stalled" state. The CPU then begins execution from
address 0. The DSPINT condition is not latched by the CPU, because it occurs while the CPU is still
internally "stalled". Also, DSPINT brings the CPU out of the "stalled" state only if the host boot process
is selected. All memory may be written to and read by the host. This allows for the host to verify what it
sends to the DSP if required. After the CPU is out of the "stalled" state, the CPU needs to clear the
DSPINT, otherwise, no more DSPINTs can be received.
•
EMIF boot (using default ROM timings)
Upon the release of RESET, the 1K-Byte ROM code located in the beginning of CE1 is copied to
address 0 by the EDMA using the default ROM timings, while the CPU is internally "stalled". The data
should be stored in the endian format that the system is using. In this case, the EMIF automatically
assembles consecutive 8-bit bytes to form the 32-bit instruction words to be copied. The transfer is
automatically done by the EDMA as a single-frame block transfer from the ROM to address 0. After
completion of the block transfer, the CPU is released from the "stalled" state and starts running from
address 0.
•
No boot
With no boot, the CPU begins direct execution from the memory located at address 0. Note: operation
is undefined if invalid code is located at address 0.
2.5 Pin Assignments
2.5.1 Pin Map
Figure 2-3 through Figure 2-6 show the DM643 pin assignments in four quadrants (A, B, C, and D).
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1
2
3
4
5
6
7
8
9
10
11
12
13
AF
V
DV
RSV04
VP1CTL0
VP1D[0]
V
VP1CLK0
VP1CLK1
V
RSV19
V
SS
VP1D[1]
SS
DD
DD
SS
V
SS
SS
VP1D[15]/
AXR0[3]
AE
DV
DV
V
CLKMODE1 VP1CTL1
VP1D[2]
VP1D[3]
VP1D[4]
VP1D[5]
VP1D[6]
VP1D[7]
V
VP1D[10]
VP1D[11]
V
V
DV
DD
DD
SS
SS
SS
SS
VDAC/
GP0[8]
VP1D[13]/
AXR0[1]
VP1D[16]/
AXR0[4]
AD
AC
AB
AA
Y
AFSX0
AMUTEIN0
AMUTE0
ACLKX0
V
RSV03
V
VP1CTL2
VP1D[8]
VP1D[9]
SS
SS
VP1D[12]/
AXR0[0]
VP1D[14]/
AXR0[2]
VP1D[17]/
AXR0[5]
AHCLKX0
STCLK
CLKIN
V
RSV02
V
SS
SS
VP1D[18]/
AXR0[6]
VP1D[19]/
AXR0[7]
V
V
RSV01
RSV00
HD0
V
V
DV
V
DV
CV
CV
DV
V
DV
DD
SS
SS
SS
SS
DD
SS
DD
DD
DD
DD
SS
HD1
HD5
CLKMODE0
HD3
V
CV
CV
V
V
DV
V
V
DV
V
SS
SS
DD
DD
SS
DD
SS
SS
DD
HD2
HD6
DV
DV
V
CV
V
CV
CV
V
CV
DD
DD
DD
DD
SS
DD
DD
SS
W
V
HD7
HD4
V
RSV06
SS
SS
HD10
HD14
HD8
HD9
RSV10
HD11
PLLV
V
SS
SS
U
HD12
HDS2
HDS1
HD13
HD15
HCNTL0
DV
V
V
CV
DD
DD
SS
T
V
RSV11
RSV12
V
CV
DD
SS
SS
SS
R
HCS
MDCLK
RSV08
V
V
CV
V
SS
SS
DD
P
HCNTL1
V
HAS
3
RESET
4
MDIO
5
V
CV
DD
CV
SS
SS
DD
SS
1
2
6
7
8
9
10
11
12
13
Figure 2-3. DM643 Pin Map [Quadrant A]
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14
15
16
17
18
19
20
21
22
23
24
25
26
AF
AED50
AED54
V
AED62
AED63
DV
V
SS
RSV18
V
FSX0
CLKX0
RSV13
V
SS
DD
DD
SS
SS
SS
AE
AED52
AED53
AED51
AED56
AED57
AED55
AED58
AED59
AED61
AED60
V
DV
DV
DD
V
CLKR0
RSV15
RSV16
RSV17
DX0
RSV23
DR0
RSV20
RSV22
RSV21
RSV14
V
SS
SS
AD
AC
AB
AA
Y
AED48
AED49
DV
DD
AED33
AED34
AED37
AED40
AED44
AED32
AED35
ACLKR0
AFSR0
V
SS
V
DV
DD
V
V
SS
SS
SS
DV
DD
DV
DD
V
DV
DD
AED38
AED41
AED45
AED47
AEA18
AEA22
ABE6
AED36
AED39
AED43
AHOLD
AEA21
AEA17
AEA14
AEA11
V
AHCLKR0
FSR0
DV
DD
V
SS
SS
SS
DV
V
V
DV
V
CV
CV
CV
CV
CV
V
SS
AED42
AED46
DD
SS
SS
DD
SS
DD
DD
DD
DD
DD
V
SS
CV
V
CV
CV
V
CV
DV
DV
DD
SS
DD
DD
SS
DD
DD
DD
W
V
V
DV
V
SS
SS
DD
V
DV
V
SS
AEA20
AEA16
AEA13
ABE5
AEA19
AEA15
SS
DD
U
CV
CV
V
V
DV
DD
DD
DD
SS
T
ABE7
V
SS
SS
R
V
CV
V
DV
DD
ASOE3
AEA12
ABE4
SS
DD
SS
P
CV
V
CV
V
ABUSREQ
22
AEA10
23
AEA9
24
DV
DD
AEA8
26
DD
SS
DD
SS
14
15
16
17
18
19
20
21
25
Figure 2-4. DM643 Pin Map [Quadrant B]
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1
2
3
4
5
6
7
8
9
10
11
12
13
N
M
L
HRDY
HR/W
DV
HHWIL
HINT
V
V
CV
V
CV
DD
DD
SS
SS
DD
SS
HD17/
MTXD1
HD16/
MTXD0
HD18/
MTXD2
GP0[0]
GP0[3]
DV
V
CV
V
SS
DD
SS
DD
HD19/
MTXD3
HD20/
MTXEN
HD22/
MTCLK
V
V
V
CV
CV
SS
SS
DD
DD
HD21/
MCOL
HD24/
MRXD0
K
J
HD23
GP0[9]
DV
DD
SS
HD25/
MRXD1
HD26/
MRXD2
HD28/
MRXDV
GP0[10]
V
DV
V
SS
SS
DD
HD27/
MRXD3
HD30/
MCRS
H
G
F
V
GP0[12]
DV
DV
V
SS
RSV07
SS
DD
DD
HD31/
MRCLK
HD29/
MRXER
GP0[15]
GP0[5]/
GP0[13]
GP0[4]/
CV
CV
CV
DD
CV
V
CV
CV
V
CV
DD
DD
DD
DD
SS
DD
DD
SS
GP0[6]/
GP0[11]
V
CV
DV
V
DV
V
V
DV
V
SS
SS
DD
DD
SS
DD
SS
SS
DD
EXT_INT6 EXT_INT5 EXT_INT4
GP0[7]/
EXT_INT7
E
D
C
B
A
RSV09
V
SCL0
DV
V
DV
V
DV
DD
VP2D[14]
VP2D[13]
VP2D[12]
VP2D[11]
VP2D[18]
VP2D[17]
VP2D[16]
VP2D[15]
VP2D[19]
SS
DD
SS
DD
SS
CLKOUT4/
GP0[1]
V
V
V
SDA0
DV
V
VP2CTL1
VP2CTL2
VP2D[1]
VP2D[0]
VP2CTL0
VP2D[5]
VP2D[4]
VP2D[3]
VP2D[9]
VP2D[8]
VP2D[7]
V
V
V
SS
SS
SS
DD
SS
SS
SS
SS
TOUT0/
MAC_EN
CLKOUT6/
GP0[2]
GP0[14]
DV
V
SS
DD
TOUT1/
LENDIAN
DV
DV
DV
V
V
NMI
V
V
V
SS
DD
DD
DD
SS
SS
SS
V
TINP0
4
TINP1
5
VP2CLK0
V
VP2D[2]
9
VP2D[6]
10
VP2D[10]
11
V
SS
VP2CLK1
13
SS
SS
SS
1
2
3
6
7
8
12
Figure 2-5. DM643 Pin Map [Quadrant C]
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14
15
16
17
18
19
20
21
22
23
24
25
26
N
M
L
V
CV
CV
V
AHOLDA
AEA7
AEA6
V
SS
AEA5
ABE2
ACE3
SS
DD
DD
SS
CV
V
V
DV
DD
APDT
AEA4
ABE1
ACE2
AEA3
ABE0
ABE3
ASDCKE
ACE0
DD
SS
SS
CV
CV
V
V
AARDY
DD
DD
SS
AAWE/
ASDWE/
ASWE
K
J
DV
ACE1
SS
DD
AARE/
ASDCAS/
ASADS/
ASRE
AAOE/
AECLKOUT2 ASDRAS/
ASOE
V
DV
V
SS
AECLKOUT1
SS
DD
H
G
F
CV
CV
CV
DV
V
DV
DV
AED17
AED19
AED23
AED16
AED21
AED25
AED27
AECLKIN
AED20
AED24
AED26
AED28
AED30
V
SS
DD
DD
DD
DD
SS
DD
DD
CV
V
CV
CV
V
CV
CV
CV
AED18
AED22
DD
SS
DD
DD
SS
DD
DD
DD
V
DV
V
V
V
DV
V
V
SS
SS
DD
SS
SS
DD
SS
E
D
C
B
A
RSV05
TRST
EMU1
TMS
DV
V
V
V
DV
V
DV
V
V
SS
SS
DD
SS
DD
SS
DD
SS
EMU4
EMU3
EMU2
EMU8
EMU6
EMU5
EMU11
EMU10
EMU9
AED14
AED15
AED12
AED10
AED11
AED8
AED6
AED7
V
DV
V
SS
AED29
AED31
SS
SS
SS
DD
AED4
AED3
V
DV
DD
SS
DV
TDO
V
V
AED2
AED0
DV
DV
DV
DD
DD
SS
SS
DD
V
EMU0
15
TCK
16
EMU7
17
TDI
18
AED13
20
AED9
21
V
AED5
23
AED1
24
V
SS
SS
SS
22
DD
25
14
19
26
Figure 2-6. DM643 Pin Map [Quadrant D]
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2.5.2 Signal Groups Description
RESET
NMI
CLKIN
(A)
(B)
CLKOUT4/GP0[1]
GP0[7]/EXT_INT7
GP0[6]/EXT_INT6
GP0[5]/EXT_INT5
GP0[4]/EXT_INT4
Reset and
Interrupts
(A)
(B)
CLKOUT6/GP0[2]
Clock/PLL
(B)
CLKMODE1
CLKMODE0
PLLV
(B)
RSV23
RSV22
RSV21
TMS
TDO
TDI
TCK
Reserved
TRST
EMU0
EMU1
EMU2
EMU3
EMU4
EMU5
EMU6
EMU7
EMU8
EMU9
EMU10
EMU11
RSV02
RSV01
RSV00
IEEE Standard
1149.1
(JTAG)
Emulation
Peripheral
Control/Status
TOUT0/MAC_EN
Control/Status
(B)
GP0[7]/EXT_INT7
GP0[15]
GP0[14]
GP0[13]
(B)
GP0[6]/EXT_INT6
(B)
GP0[5]/EXT_INT5
(B)
GP0[4]/EXT_INT4
GP0[3]
GP0[12]
GP0[11]
GP0[10]
GP0
(A)
CLKOUT6/GP0[2]
(A)
CLKOUT4/GP0[1]
GP0[0]
GP0[9]
VDAC/GP0[8]
General-Purpose Input/Output 0 (GP0) Port
A. These pins are muxed with the GP0 pins and by default these signals function as clocks (CLKOUT4 or CLKOUT6). To use these muxed
pins as GPIO signals, the appropriate GPIO register bits (GPxEN and GPxDIR) must be properly enabled and configured. For more
details, see the Device Configurations section of this data sheet.
B. These pins are GP0 pins that can also function as external interrupt sources (EXT_INT[7:4]). Default after reset is EXT_INTx or GPIO as
input-only.
Figure 2-7. CPU and Peripheral Signals
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64
Data
AED[63:0]
AECLKIN
AECLKOUT1
AECLKOUT2
ASDCKE
ACE3
ACE2
Memory Map
Space Select
External
Memory I/F
Control
AARE/ASDCAS/ASADS/ASRE
ACE1
ACE0
AAOE/ASDRAS/ASOE
AAWE/ASDWE/ASWE
AARDY
20
Address
AEA[22:3]
ASOE3
ABE7
ABE6
ABE5
ABE4
ABE3
ABE2
ABE1
ABE0
APDT
Byte Enables
AHOLD
Bus
Arbitration
AHOLDA
ABUSREQ
EMIFA (64-bit)
Data
VDAC/GP0[8]
VCXO Interpolated
Control Port (VIC)
Figure 2-8. EMIFA/VIC Peripheral Signals
HPI
32
HD[15:0]
(Host-Port Interface)
Data
(A)
HD[31:16]
HAS
HR/W
HCS
HDS1
HDS2
HRDY
HCNTL0
HCNTL1
Register Select
Control
Half-Word
Select
HHWIL
(HPI16 ONLY)
HINT
A. These HPI data pins (HD[31:16], excluding HD[23]) are muxed with the EMAC peripheral. By default, these pins function as HPI.
For more details on the EMAC pin functions, see the Ethernet MAC (EMAC) peripheral signals section and the terminal functions
table portions of this data sheet.
Figure 2-9. HPI Peripheral Signals
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McBSP0
Transmit
CLKX0
FSX0
DX0
CLKR0
FSR0
Receive
Clock
DR0
CLKS0 not supported
on DM643
McBSP
(Multichannel Buffered
Serial Port)
TOUT1/LENDIAN
TINP1
TOUT0/MACEN
TINP0
Timer 0
Timer 1
Timer 2
Timers
SCL0
SDA0
I2C0
I2C0
Figure 2-10. McBSP/Timer/I2C0 Peripheral Signals
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EMAC
(A)
HD16/MTXD0
(A)
HD17/MTXD1
Transmit
(A)
HD18/MTXD2
(A)
HD19/MTXD3
MDIO
(A)
HD24/MRXD0
(A)
HD25/MRXD1
Receive
MDIO
Input/Output
(A)
HD26/MRXD2
(A)
HD27/MRXD3
(A)
HD20/MTXEN
Clock
MDCLK
(A)
HD29/MRXER
Error Detect
and Control
(A)
HD28/MRXDV
(A)
HD21/MCOL
(A)
HD30/MCRS
(A)
HD22/MTCLK
HD31/MRCLK
Clocks
(A)
Ethernet MAC (EMAC)
and MDIO
A. These EMAC pins are muxed with the upper data pins of the HPI peripheral. By default, these signals function as HPI. For more details
on these muxed pins, see the Device Configurations section of this data sheet.
Figure 2-11. EMAC/MDIO Peripheral Signals
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(C)
STCLK
VP1CLK0
VP1CLK1
VP1CTL0
VP1CTL1
VP1CTL2
Timing and
Control Logic
VP1D[0]
VP1D[1]
VP1D[2]
VP1D[3]
VP1D[4]
VP1D[5]
VP1D[6]
VP1D[7]
VP1D[8]
VP1D[9]
VP1D[10]
VP1D[11]
VP1D[12]/AXR0[0]
VP1D[13]/AXR0[1]
VP1D[14]/AXR0[2]
VP1D[15]/AXR0[3]
VP1D[16]/AXR0[4]
VP1D[17]/AXR0[5]
VP1D[18]/AXR0[6]
VP1D[19]/AXR0[7]
Capture/Display
Buffer
(2560 Bytes)
(A)
Channel A
Channel B uses only
the VP1D[19:10]
bidirectional pins
Capture/Display
Buffer
(2560 Bytes)
(B)
Channel B
Video Port 1 (VP1)
A. Channel A supports: BT.656 (8/10-bit), Y/C Video (16/20-bit), RAW Video (16/20-bit) display modes and BT.656 (8/10-bit), Y/C Video
(16/20-bit), RAW Video (16/20-bit) capture modes [TSI (8-bit) capture mode].
B. Channel B supports: BT.656 (8/10-bit), RAW Video (8/10-bit) capture modes and can display synchronized RAW Video data with
Channel A.
C. The same STCLK signal is used for both video ports (VP1 and VP2).
Figure 2-12. Video Port 1 Peripheral Signals
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(C)
STCLK
VP2CLK0
VP2CLK1
VP2CTL0
VP2CTL1
VP2CTL2
Timing and
Control Logic
VP2D[0]
VP2D[1]
VP2D[2]
VP2D[3]
VP2D[4]
VP2D[5]
VP2D[6]
VP2D[7]
VP2D[8]
VP2D[9]
VP2D[10]
VP2D[11]
VP2D[12]
VP2D[13]
VP2D[14]
VP2D[15]
VP2D[16]
VP2D[17]
VP2D[18]
VP2D[19]
Capture/Display
Buffer
(2560 Bytes)
(A)
Channel A
Channel B uses only
the VP2D[19:10]
bidirectional pins
Capture/Display
Buffer
(2560 Bytes)
(B)
Channel B
Video Port 2 (VP2)
A. Channel A supports: BT.656 (8/10-bit), Y/C Video (16/20-bit), RAW Video (16/20-bit) display modes and BT.656 (8/10-bit), Y/C
Video (16/20-bit), RAW Video (16/20-bit) capture modes [TSI (8-bit) capture mode].
B. Channel B supports: BT.656 (8/10-bit), RAW Video (8/10-bit) capture modes and can display synchronized RAW Video data with
Channel A.
C. The same STCLK signal is used for both video ports (VP1 and VP2).
Figure 2-13. Video Port 2 Peripheral Signals
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(Transmit/Receive Data Pins)
(Transmit/Receive Data Pins)
VP1D[12]/AXR0[0]
VP1D[13]/AXR0[1]
VP1D[14]/AXR0[2]
VP1D[15]/AXR0[3]
VP1D[16]/AXR0[4]
VP1D[17]/AXR0[5]
VP1D[18]/AXR0[6]
VP1D[19]/AXR0[7]
8-Serial Ports
Flexible
Partitioning
Tx, Rx, OFF
(Transmit Bit Clock)
(Receive Bit Clock)
Transmit
Clock
Generator
ACLKX0
Receive Clock
Generator
ACLKR0
AHCLKR0
AHCLKX0
(Receive Master Clock)
(Transmit Master Clock)
Transmit
Clock Check
Circuit
Receive Clock
Check Circuit
Receive Frame
Sync
Transmit
Frame Sync
AFSR0
AFSX0
(Receive Frame Sync or
Left/Right Clock)
(Transmit Frame Sync or
Left/Right Clock)
(A)
Error Detect
AMUTE0
AMUTEIN0
Auto Mute
Logic
McASP0
(Multichannel Audio Serial Port 0)
NOTES: On multiplexed pins, bolded text denotes the active function of the pin for that particular peripheral module.
Bolded and italicized text within parentheses denotes the function of the pins in an audio system.
A. The McASP’s Error Detect function detects underruns, overruns, early/late frame syncs, DMA errors, and external mute input.
Figure 2-14. McASP0 Peripheral Signals
2.5.3 Terminal Functions
Table 2-4, the terminal functions table, identifies the external signal names, the associated pin (ball)
numbers along with the mechanical package designator, the pin type (I, O/Z, or I/O/Z), whether the pin
has any internal pullup/pulldown resistors and a functional pin description. For more detailed information
on device configuration, peripheral selection, multiplexed/shared pins, and debugging considerations, see
the Device Configurations section of this data sheet.
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Table 2-4. Terminal Functions
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
CLOCK/PLL CONFIGURATION
CLKIN
AC2
D6
I
Clock Input. This clock is the input to the on-chip PLL.
Clock output at 1/4 of the device speed (O/Z) [default] or this pin can be
programmed as a GP0 1 pin (I/O/Z).
CLKOUT4/GP0[1](3)
I/O/Z
IPU
Clock output at 1/6 of the device speed (O/Z) [default] or this pin can be
programmed as a GP0 2 pin (I/O/Z).
CLKOUT6/GP0[2](3)
CLKMODE1
C6
I/O/Z
I
IPU
IPD
AE4
Clock mode select
•
Selects whether the CPU clock frequency = input clock frequency x1
(Bypass), x6, or x12.
CLKMODE0
PLLV(4)
AA2
V6
I
IPD
For more details on the CLKMODE pins and the PLL multiply factors, see
the Clock PLL section of this data sheet.
A(1)
PLL voltage supply
JTAG EMULATION
TMS
TDO
TDI
E15
B18
A18
A16
I
IPU
IPU
IPU
IPU
JTAG test-port mode select
JTAG test-port data out
JTAG test-port data in
JTAG test-port clock
O/Z
I
I
TCK
JTAG test-port reset. For IEEE 1149.1 JTAG compatibility, see the IEEE 1149.1
JTAG compatibility statement portion of this data sheet.
TRST
D14
I
IPD
EMU11
EMU10
EMU9
EMU8
EMU7
EMU6
EMU5
EMU4
EMU3
EMU2
EMU1
EMU0
D17
C17
B17
D16
A17
C16
B16
D15
C15
B15
C14
A15
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I/O/Z
IPU
IPU
IPU
IPU
IPU
IPU
IPU
IPU
IPU
IPU
IPU
IPU
Emulation pin 11. Reserved for future use, leave unconnected.
Emulation pin 10. Reserved for future use, leave unconnected.
Emulation pin 9. Reserved for future use, leave unconnected.
Emulation pin 8. Reserved for future use, leave unconnected.
Emulation pin 7. Reserved for future use, leave unconnected.
Emulation pin 6. Reserved for future use, leave unconnected.
Emulation pin 5. Reserved for future use, leave unconnected.
Emulation pin 4. Reserved for future use, leave unconnected.
Emulation pin 3. Reserved for future use, leave unconnected.
Emulation pin 2. Reserved for future use, leave unconnected.
(5)
Emulation pin 1
(5)
Emulation pin 0
RESETS, INTERRUPTS, AND GENERAL-PURPOSE INPUT/OUTPUTS
RESET
NMI
P4
B4
I
I
Device reset
Nonmaskable interrupt, edge-driven (rising edge)
Note: Any noise on the NMI pin may trigger an NMI interrupt; therefore, if the
NMI pin is not used, it is recommended that the NMI pin be grounded versus
relying on the IPD.
IPD
GP0[7]/EXT_INT7
GP0[6]/EXT_INT6
GP0[5]/EXT_INT5
E1
F2
F3
I/O/Z
I/O/Z
I/O/Z
IPU
IPU
IPU
General-purpose input/output (GPIO) pins (I/O/Z) or external interrupts (input
only). The default after reset setting is GPIO enabled as input-only.
•
When these pins function as External Interrupts [by selecting the
corresponding interrupt enable register bit (IER.[7:4])], they are edge-driven
and the polarity can be independently selected via the External Interrupt
Polarity Register bits (EXTPOL.[3:0]).
GP0[4]/EXT_INT4
F4
I/O/Z
IPU
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
(2) IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-kΩ IPD or IPU resistor. To pull up a signal to the
opposite supply rail, a 1-kΩ resistor should be used.)
(3) These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
(4) PLLV is not part of external voltage supply. See the Clock PLL section for information on how to connect this pin.
(5) The EMU0 and EMU1 pins are internally pulled up with 30-kΩ resistors; therefore, for emulation and normal operation, no external
pullup/pulldown resistors are necessary. However, for boundary scan operation, pull down the EMU1 and EMU0 pins with a dedicated
1-kΩ resistor.
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
G3
C1
G4
H4
F1
GP0[15]
GP0[14]
GP0[13]
GP0[12]
GP0[11]
GP0[10]
GP0[9]
General-purpose input/output GP0[15:9] pins (I/O/Z).
Note: By default, no function is enabled upon reset. To configure these pins, see
the Device Configuration section of this data sheet.
I/O/Z
J2
K3
L5
GP0[3]
IPD
IPD
GP0 3 pin (I/O/Z)
General-purpose 0 pin (GP0[0]) (I/O/Z) [default]
This pin can be programmed as GPIO 0 (input only) [default] or as GP0[0]
(output only) pin or output as a general-purpose interrupt (GP0INT) signal
(output only).
GP0[0]
M5
I/O/Z
I/O/Z
Note: This pin must remain low during device reset.
VCXO Interpolated Control Port (VIC) single-bit digital-to-analog converter
(VDAC) output [output only] [default] or this pin can be programmed as a GP0 8
pin (I/O/Z).
VDAC/GP0[8](3)
AD1
IPD
Clock output at 1/6 of the device speed (O/Z) [default] or this pin can be
programmed as a GP0 2 pin (I/O/Z).
CLKOUT6/GP0[2](3)
CLKOUT4/GP0[1](3)
C6
D6
I/O/Z
I/O/Z
IPD
IPD
Clock output at 1/4 of the device speed (O/Z) [default] or this pin can be
programmed as a GP0 1 pin (I/O/Z).
HOST-PORT INTERFACE (HPI) or EMAC
HINT
N4
P1
R3
O/Z
Host interrupt from DSP to host (O).
HCNTL1
HCNTL0
I
I
Host control – selects between control, address, or data registers (I).
Host control – selects between control, address, or data registers (I).
Host half-word select – first or second half-word (not necessarily high or low
order). [For HPI16 bus width selection only] (I).
HHWIL
N3
I
HR/W
HAS
M1
P3
R1
R2
I
I
I
I
Host read or write select (I).
Host address strobe (I)
Host chip select (I)
Host data strobe 1 (I)
Host data strobe 2 (I)
HCS
HDS1
Note: If unused, the following HPI control signals should be externally pulled
high.
HDS2
HRDY
T2
N1
I
O/Z
Host ready from DSP to host (O)
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
G1
H3
G2
J4
HD31/MRCLK(6)
HD30/MCRS(6)
HD29/MRXER(6)
HD28/MRXDV(6)
HD27/MRXD3(6)
HD26/MRXD2(6)
HD25/MRXD1(6)
HD24/MRXD0(6)
HD23
HD22/MTCLK(6)
HD21/MCOL(6)
HD20/MTXEN(6)
HD19/MTXD3(6)
HD18/MTXD2(6)
HD17/MTXD1(6)
HD16/MTXD0(6)
HD15
H2
J3
J1
K4
K1
L4
Host-port data (I/O/Z) [default] or EMAC transmit/receive or control pins
As HPI data bus
K2
L3
•
•
Used for transfer of data, address, and control
Host-Port bus width user-configurable at device reset via a 10-kΩ resistor
pullup/pulldown resistor on the HD5 pin:
L2
Note: If a configuration pin must be routed out from the device, the internal
pullup/pulldown (IPU/IPD) resistor should not be relied upon; TI recommends the
use of an external pullup/pulldown resistor.
M4
M2
M3
T3
Boot Configuration:
I/O/Z
•
HD5 pin = 0: HPI operates as an HPI16.
(HPI bus is 16 bits wide. HD[15:0] pins are used and the remaining
HD[31:16] pins are reserved pins in the high-impedance state.)
HD14
U1
U3
U2
U4
V1
V3
V2
W2
W4
Y1
W3
Y2
Y4
AA1
Y3
HD13
•
HD5 pin = 1: HPI operates as an HPI32.
HD12
(HPI bus is 32 bits wide. All HD[31:0] pins are used for host-port operations.)
HD11
For superset devices like DM643, the HD31 through HD16 pins can also function
as EMAC transmit/receive or control pins (when MAC_EN pin = 1). For more
details on the EMAC pin functions, see the Ethernet MAC (EMAC) peripheral
section of this table and for more details on how to configure the EMAC pin
functions, see the device configuration section of this data sheet.
HD10
HD9
HD8
HD7
HD6
HD5
HD4
HD3
HD2
HD1
HD0
EMIFA (64-bit) – CONTROL SIGNALS COMMON TO ALL TYPES OF MEMORY
ACE3
ACE2
ACE1
ACE0
ABE7
ABE6
ABE5
ABE4
ABE3
ABE2
ABE1
ABE0
L26
K23
K24
K25
T22
T23
R25
R26
M25
M26
L23
L24
O/Z
O/Z
O/Z
O/Z
O/Z
O/Z
O/Z
O/Z
O/Z
O/Z
O/Z
O/Z
IPU
IPU
IPU
IPU
IPU
IPU
IPU
IPU
IPU
IPU
IPU
IPU
EMIFA memory space enables
•
•
Enabled by bits 28 through 31 of the word address
Only one pin is asserted during any external data access
EMIFA byte-enable control
•
Decoded from the low-order address bits. The number of address bits or
byte enables used depends on the width of external memory.
•
•
Byte-write enables for most types of memory
Can be directly connected to SDRAM read and write mask signal (SDQM)
(6) These pins are multiplexed pins. For more details, see the Device Configurations section of this data sheet.
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
EMIFA peripheral data transfer, allows direct transfer between external
peripherals
APDT
M22
O/Z
IPU
EMIFA (64-bit) – BUS ARBITRATION
AHOLDA
AHOLD
N22
W24
P22
O
I
IPU
IPU
IPU
EMIFA hold-request-acknowledge to the host
EMIFA hold request from the host
EMIFA bus request output
ABUSREQ
O
EMIFA (64-bit) – ASYNCHRONOUS/SYNCHRONOUS MEMORY CONTROL
EMIFA external input clock. The EMIFA input clock (AECLKIN, CPU/4 clock, or
CPU/6 clock) is selected at reset via the pullup/pulldown resistors on the
AEA[20:19] pins.
AECLKIN
H25
I
IPD
AECLKIN is the default for the EMIFA input clock.
EMIFA output clock 2. Programmable to be EMIFA input clock (AECLKIN,
CPU/4 clock, or CPU/6 clock) frequency divided-by-1, -2, or -4.
AECLKOUT2
AECLKOUT1
J23
J26
O/Z
O/Z
IPD
IPD
EMIFA output clock 1 [at EMIFA input clock (AECLKIN, CPU/4 clock, or CPU/6
clock) frequency].
EMIFA asynchronous memory read-enable/SDRAM column-address
strobe/programmable synchronous interface-address strobe or read-enable
AARE/
ASDCAS/
ASADS/ASRE
•
For programmable synchronous interface, the RENEN field in the CE Space
Secondary Control Register (CExSEC) selects between ASADS and ASRE:
If RENEN = 0, then the ASADS/ASRE signal functions as the ASADS signal.
If RENEN = 1, then the ASADS/ASRE signal functions as the ASRE signal.
J25
O/Z
IPU
AAOE/
ASDRAS/
ASOE
EMIFA asynchronous memory output-enable/SDRAM row-address
strobe/programmable synchronous interface output-enable
J24
K26
L25
O/Z
O/Z
O/Z
IPU
IPU
IPU
AAWE/
ASDWE/
ASWE
EMIFA asynchronous memory write-enable/SDRAM write-enable/programmable
synchronous interface write-enable
EMIFA SDRAM clock-enable (used for self-refresh mode).
ASDCKE
•
If SDRAM is not in system, ASDCKE can be used as a general-purpose
output.
EMIFA synchronous memory output-enable for ACE3 (for glueless FIFO
interface)
ASOE3
AARDY
R22
L22
O/Z
I
IPU
IPU
Asynchronous memory ready input
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
EMIFA (64-bit) – ADDRESS
AEA22
AEA21
AEA20
AEA19
AEA18
AEA17
AEA16
AEA15
AEA14
AEA13
AEA12
AEA11
AEA10
AEA9
U23
V24
V25
V26
V23
U24
U25
U26
T24
T25
R23
R24
P23
P24
P26
N23
N24
N26
M23
M24
EMIFA external address (doubleword address)
EMIFA address numbering for the DM643 device starts with AEA3 to maintain
signal name compatibility with other C64x™ devices (e.g., C6414, C6415, and
C6416) [see the 64-bit EMIF addressing scheme in the TMS320C6000 DSP
External Memory Interface (EMIF) Reference Guide (literature number
SPRU266)].
Note: If a configuration pin must be routed out from the device, the internal
pullup/pulldown (IPU/IPD) resistor should not be relied upon; TI recommends the
use of an external pullup/pulldown resistor.
Boot Configuration:
•
Controls initialization of DSP modes at reset (I) via pullup/pulldown resistors
O/Z
IPD
–
Boot mode (AEA[22:21]):
00 - No boot (default mode)
01 - HPI boot
10 - Reserved
11 - EMIFA 8-bit ROM boot
–
EMIF clock select AEA[20:19]:
Clock mode select for EMIFA (AECLKIN_SEL[1:0])
00 - AECLKIN (default mode)
01 - CPU/4 Clock Rate
AEA8
AEA7
AEA6
10 - CPU/6 Clock Rate
11 - Reserved
AEA5
For more details, see the Device Configurations section of this data sheet.
AEA4
AEA3
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
EMIFA (64-bit) – DATA
AED63
AED62
AED61
AED60
AED59
AED58
AED57
AED56
AED55
AED54
AED53
AED52
AED51
AED50
AED49
AED48
AED47
AED46
AED45
AED44
AED43
AED42
AED41
AED40
AED39
AED38
AED37
AED36
AED35
AED34
AED33
AED32
AED31
AED30
AED29
AED28
AED27
AED26
AED25
AED24
AED23
AED22
AED21
AED20
AF24
AF23
AE23
AD23
AD22
AE22
AD21
AE21
AC21
AF21
AD20
AE20
AC20
AF20
AC19
AD19
W23
Y26
Y23
Y25
Y24
AA26
AA23
AA25
AA24
AB23
AB25
AB24
AC26
AC25
AD25
AD26
C26
I/O/Z
IPU
EMIFA external data
C25
D26
D25
E24
E25
F24
F25
F23
F26
G24
G25
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
G23
G26
H23
H24
C19
D19
A20
D20
B20
C20
A21
D21
B21
C21
A23
C22
B22
B23
A24
B24
AED19
AED18
AED17
AED16
AED15
AED14
AED13
AED12
AED11
AED10
AED9
I/O/Z
IPU
EMIFA external data
AED8
AED7
AED6
AED5
AED4
AED3
AED2
AED1
AED0
MANAGEMENT DATA INPUT/OUTPUT (MDIO)
MDCLK
MDIO
R5
P5
I/O/Z
I/O/Z
IPD
IPU
MDIO serial clock input/output (I/O/Z).
MDIO serial data input/output (I/O/Z).
VCXO INTERPOLATED CONTROL PORT (VIC)
VCXO Interpolated Control Port (VIC) single-bit digital-to-analog converter
VDAC/GP0[8](3)
STCLK
AD1
AC1
I/O/Z
I
IPD
(VDAC) output [output only] [default] or this pin can be programmed as a GP0 8
pin (I/O/Z)
VIDEO PORTS (VP1 AND VP2)
IPD The STCLK signal drives the hardware counter on the video ports.
34
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
VIDEO PORT 2 (VP2)
VP2D[19]
VP2D[18]
VP2D[17]
VP2D[16]
VP2D[15]
VP2D[14]
VP2D[13]
VP2D[12]
VP2D[11]
VP2D[10]
VP2D[9]
VP2D[8]
VP2D[7]
VP2D[6]
VP2D[5]
VP2D[4]
VP2D[3]
VP2D[2]
VP2D[1]
VP2D[0]
VP2CLK1
VP2CLK0
VP2CTL2
VP2CTL1
VP2CTL0
E13
E12
D12
C12
B12
E11
D11
C11
B11
A11
D10
C10
B10
A10
D9
Video port 2 (VP2) data input/output (I/O/Z)
I/O/Z
IPD
Note: By default, no function is enabled upon reset. To configure these pins, see
the Device Configuration section of this data sheet.
C9
B9
A9
D8
C8
A13
A7
I/O/Z
I
IPD
IPD
VP2 clock 1 (I/O/Z)
VP2 clock 0 (I)
C7
VP2 control 2 (I/O/Z)
VP2 control 1 (I/O/Z)
VP2 control 0 (I/O/Z)
D7
I/O/Z
IPD
B8
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
VIDEO PORT 1 (VP1) OR McASP0 DATA
VP1D[19]/AXR0[7](3)
VP1D[18]/AXR0[6](3)
VP1D[17]/AXR0[5](3)
VP1D[16]/AXR0[4](3)
VP1D[15]/AXR0[3](3)
VP1D[14]/AXR0[2](3)
VP1D[13]/AXR0[1](3)
VP1D[12]/AXR0[0](3)
VP1D[11]
AB12
AB11
AC11
AD11
AE11
AC10
AD10
AC9
AD9
AE9
Video port 1 (VP1) data input/output (I/O/Z) or McASP0 data pins (I/O/Z)
By default, standalone VP1 data input/output pins have no function enabled
upon reset. To configure these pins, see the Device Configuration section of this
data sheet.
VP1D[10]
I/O/Z
IPD
VP1D[9]
AC8
AD8
AC7
AD7
AE7
For more details on the McASP0 data pin functions, see McASP0 data section of
this table and the Device Configurations section of this data sheet.
VP1D[8]
VP1D[7]
VP1D[6]
VP1D[5]
VP1D[4]
AC6
AD6
AE6
VP1D[3]
VP1D[2]
VP1D[1]
AF6
VP1D[0]
AF5
VP1CLK1
AF10
AF8
I/O/Z
I
IPD
IPD
VP1 clock 1 (I/O/Z)
VP1CLK0
VP1 clock 0 (I)
VP1CTL2
AD5
AE5
VP1 control 2 (I/O/Z)
VP1CTL1
I/O/Z
IPD
VP1 control 1 (I/O/Z)
VP1CTL0
AF4
VP1 control 0 (I/O/Z)
TIMER 2
–
No external pins. The timer 2 peripheral pins are not pinned out as external pins.
TIMER 1
Timer 1 output (O/Z)
Boot Configuration: Device endian mode [LENDIAN] (I)
Controls initialization of DSP modes at reset via pullup/pulldown resistors
•
Device Endian mode
0 - Big Endian
1 - Little Endian (default)
For more details on LENDIAN, see the Device Configurations section of this data
sheet.
TOUT1
TINP1
B5
A5
O/Z
IPU
IPD
Note: If a configuration pin must be routed out from the device, the internal
pullup/pulldown (IPU/IPD) resistor should not be relied upon; TI recommends the
use of an external pullup/pulldown resistor.
I
Timer 1 or general-purpose input
TIMER 0
Timer 0 output (O/Z)
Boot Configuration: MAC enable pin [MAC_EN] (I)
The MAC_EN pin controls the selection (enable/disable) of the HPI, EMAC and
MDIO peripherals.
TOUT0
TINP0
C5
A4
O/Z
IPD
IPD
For more details, see the Device Configurations section of this data sheet.
Note: If a configuration pin must be routed out from the device, the internal
pullup/pulldown (IPU/IPD) resistor should not be relied upon; TI recommends the
use of an external pullup/pulldown resistor.
I
Timer 0 or general-purpose input
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
INTER-INTEGRATED CIRCUIT 0 (I2C0)
SCL0
SDA0
E4
D3
I/O/Z
I/O/Z
—
—
I2C0 clock.
I2C0 data.
MULTICHANNEL BUFFERED SERIAL PORT 0 (McBSP0)
CLKR0
FSR0
DR0
AE15
AB16
AC16
AE16
AF16
AF17
I/O/Z
I/O/Z
I
IPD
IPD
IPD
IPD
IPD
IPD
McBSP0 receive clock (I/O/Z)
McBSP0 receive frame sync (I/O/Z)
McBSP0 receive data (I)
DX0
O/Z
I/O/Z
I/O/Z
McBSP0 transmit data (O/Z)
McBSP0 transmit frame sync (I/O/Z)
McBSP0 transmit clock (I/O/Z)
ETHERNET MAC (EMAC)
FSX0
CLKX0
HD31/MRCLK(3)
HD30/MCRS(3)
HD29/MRXER(3)
HD28/MRXDV(3)
HD27/MRXD3(3)
HD26/MRXD2(3)
HD25/MRXD1(3)
HD24/MRXD0(3)
HD22/MTCLK(3)
HD21/MCOL(3)
HD20/MTXEN(3)
HD19/MTXD3(3)
HD18/MTXD2(3)
HD17/MTXD1(3)
G1
H3
G2
J4
I
Host-port data (I/O/Z) [default] or EMAC transmit/receive or control pins (I) (O/Z)
HPI pin functions are default, see the Device Configurations section of this data
sheet. EMAC Media Independent I/F (MII) data, clocks, and control pins for
Transmit/Receive.
I
I
•
•
•
MII transmit clock (MTCLK),
I
Transmit clock source from the attached PHY.
MII transmit data (MTXD[3:0]),
H2
J3
I
I
Transmit data nibble synchronous with transmit clock (MTCLK).
MII transmit enable (MTXEN),
J1
I
I
K4
L4
K2
L3
L2
M4
M2
This signal indicates a valid transmit data on the transmit data pins
(MTDX[3:0]).
I
•
MII collision sense (MCOL)
I
Assertion of this signal during half-duplex operation indicates network
collision.
During full-duplex operation, transmission of new frames will not begin if this
pin is asserted.
O/Z
O/Z
O/Z
O/Z
•
•
•
•
MII carrier sense (MCRS)
Indicates a frame carrier signal is being received.
MII receive data (MRXD[3:0]),
Receive data nibble synchronous with receive clock (MRCLK).
MII receive clock (MRCLK),
Receive clock source from the attached PHY.
MII receive data valid (MRXDV),
HD16/MTXD0(3)
M3
O/Z
This signal indicates a valid data nibble on the receive data pins
(MRDX[3:0]) and
•
MII receive error (MRXER),
Indicates reception of a coding error on the receive data.
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
MULTICHANNEL AUDIO SERIAL PORT 0 (McASP0) CONTROL
AHCLKX0
AC12
AD12
AB13
AC13
AD13
AB14
AC14
AD14
I/O/Z
I/O/Z
I/O/Z
O/Z
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
McASP0 transmit high-frequency master clock (I/O/Z).
McASP0 transmit frame sync or left/right clock (LRCLK) (I/O/Z).
McASP0 transmit bit clock (I/O/Z).
AFSX0
ACLKX0
AMUTE0
AMUTEIN0
AHCLKR0
AFSR0
McASP0 mute output (O/Z).
I/O/Z
I/O/Z
I/O/Z
I/O/Z
McASP0 mute input (I/O/Z).
McASP0 receive high-frequency master clock (I/O/Z).
McASP0 receive frame sync or left/right clock (LRCLK) (I/O/Z).
McASP0 receive bit clock (I/O/Z).
ACLKR0
MULTICHANNEL AUDIO SERIAL PORT 0 (McASP0) DATA
VP1D[19]/AXR0[7](3)
VP1D[18]/AXR0[6](3)
VP1D[17]/AXR0[5](3)
VP1D[16]/AXR0[4](3)
VP1D[15]/AXR0[3](3)
VP1D[14]/AXR0[2](3)
VP1D[13]/AXR0[1](3)
VP1D[12]/AXR0[0](3)
AB12
AB11
AC11
AD11
AE11
AC10
AD10
AC9
VP1 input/output data pins [19:12] (I/O/Z) or McASP0 TX/RX data pins [7:0]
(I/O/Z) [default].
I/O/Z
IPD
RESERVED FOR TEST
RSV07
RSV08
RSV05
RSV06
RSV00
RSV01
RSV02
RSV03
RSV04
H7
R6
A
A
—
—
Reserved. This pin must be connected directly to CVDD for proper operation.
Reserved. This pin must be connected directly to DVDD for proper operation.
E14
W7
I
IPD
—
A
AA3
AB3
AC4
AD3
AF3
A
—
Reserved (leave unconnected, do not connect to power or ground. If the signal
must be routed out from the device, the internal pull-up/down resistance should
not be relied upon and an external pull-up/down should be used.)
I
—
O/Z
O/Z
O
—
—
IPU
ADDITIONAL RESERVED FOR TEST
Reserved. For proper DM643 device operation, this pin at device reset must be
pulled down via a 10-kΩ external resistor.
RSV09
E2
I
IPD
RSV10
RSV12
RSV11
RSV17
RSV16
RSV21
RSV15
RSV23
RSV22
RSV20
RSV14
RSV19
RSV18
RSV13
V4
I/O/Z
I
—
Reserved. This pin must be pulled down via a 10-kΩ external resistor.
R4
IPU
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
T4
O
AB15
AC15
AC17
AD15
AD16
AD17
AE17
AE18
AF12
AF14
AF18
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I
Reserved (leave unconnected, do not connect to power or ground. If the signal
must be routed out from the device, the internal pull-up/down resistance should
not be relied upon and an external pull-up/down should be used.)
I/O/Z
I/O/Z
I/O/Z
I/O/Z
I
I/O/Z
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
SUPPLY VOLTAGE PINS
A2
A25
B1
B2
B14
B25
B26
C3
C24
D4
D23
E5
E7
E8
E10
E17
E19
E20
E22
F9
F12
F15
F18
G5
3.3-V supply voltage
(see the Power-Supply Decoupling section of this data sheet)
DVDD
S
G22
H5
H22
J6
J21
K5
K22
M6
M21
N2
P25
R21
U5
U22
V21
W5
W22
W25
Y5
Y22
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
AA9
AA12
AA15
AA18
AB5
AB7
AB8
AB10
AB17
AB19
AB20
AB22
AC23
AD24
AE1
3.3-V supply voltage
(see the Power-Supply Decoupling section of this data sheet)
DVDD
S
AE2
AE13
AE25
AE26
AF2
AF25
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
F6
F7
F20
F21
G6
G7
G8
G10
G11
G13
G14
G16
G17
G19
G20
G21
H20
K7
K20
L7
L20
M12
M14
N7
1.2-V supply voltage (-500 device)
1.4 V supply voltage (-600 device)
(see the Power-Supply Decoupling section of this data sheet)
CVDD
S
N13
N15
N20
P7
P12
P14
P20
R13
R15
T7
T20
U7
U20
W20
Y6
Y7
Y8
Y10
Y11
Y13
Y14
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
Y16
Y17
Y19
Y20
1.2-V supply voltage (-500 device)
CVDD
Y21
S
1.4 V supply voltage (-600 device)
(see the Power-Supply Decoupling section of this data sheet)
AA6
AA7
AA20
AA21
GROUND PINS
A1
A3
A6
A8
A12
A14
A19
A22
A26
B3
B6
B7
B13
B19
C2
C4
C13
C18
C23
D1
VSS
GND
Ground pins
D2
D5
D13
D18
D22
D24
E3
E6
E9
E16
E18
E21
E23
E26
F5
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
F8
F10
F11
F13
F14
F16
F17
F19
F22
G9
G12
G15
G18
H1
H6
H21
H26
J5
J7
J20
J22
K6
VSS
K21
L1
GND
Ground pins
L6
L21
M7
M13
M15
M20
N5
N6
N12
N14
N21
N25
P2
P6
P13
P15
P21
R7
R12
R14
R20
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
T1
T5
T6
T21
T26
U6
U21
V5
V7
V20
V22
W1
W6
W21
W26
Y9
Y12
Y15
Y18
AA4
AA5
AA8
AA10
AA11
AA13
AA14
AA16
AA17
AA19
AA22
AB1
AB2
AB4
AB6
AB9
AB18
AB21
AB26
AC3
AC5
AC18
AC22
AC24
AD2
AD4
VSS
GND
Ground pins
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Table 2-4. Terminal Functions (continued)
SIGNAL
NAME
IPD/
TYPE(1)
DESCRIPTION
IPU(2)
NO.
AD18
AE3
AE8
AE10
AE12
AE14
AE19
AE24
AF1
VSS
GND
Ground pins
AF7
AF9
AF11
AF13
AF15
AF19
AF22
AF26
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2.6 Development
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2.6.1 Development Support
TI offers an extensive line of development tools for the TMS320C6000™ DSP platform, including tools to
evaluate the performance of the processors, generate code, develop algorithm implementations, and fully
integrate and debug software and hardware modules.
The following products support development of C6000™ DSP-based applications:
Software Development Tools:
Code Composer Studio™ Integrated Development Environment (IDE): including Editor
C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target
software needed to support any DSP application.
Hardware Development Tools:
Extended Development System (XDS™) Emulator (supports C6000™ DSP multiprocessor system debug)
EVM (Evaluation Module)
For a complete listing of development-support tools for the TMS320C6000™ DSP platform, visit the Texas
Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL). For
information on pricing and availability, contact the nearest TI field sales office or authorized distributor.
2.6.2 Device Support
2.6.2.1 Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX,
TMP, or TMS (e.g., TMS320DM643GDK500). Texas Instruments recommends two of three possible prefix
designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of
product development from engineering prototypes (TMX/TMDX) through fully qualified production
devices/tools (TMS/TMDS).
Device development evolutionary flow:
TMX
TMP
TMS
Experimental device that is not necessarily representative of the final device's electrical
specifications
Final silicon die that conforms to the device's electrical specifications but has not completed
quality and reliability verification
Fully qualified production device
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal
qualification testing.
TMDS
Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following
disclaimer:
"Developmental product is intended for internal evaluation purposes."
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
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Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, GDK), the temperature range (for example, “blank” is the default commercial
temperature range), and the device speed range in megahertz (for example, 500 is 500 MHz). Figure 2-15
provides a legend for reading the complete device name for any TMS320C6000™ DSP platform member.
The ZDK package, like the GDK package, is a 548-ball plastic BGA only with Pb-free balls. The ZNZ is the
Pb-free package version of the GNZ package.
For device part numbers and further ordering information for TMS320DM643 in the GDK, GNZ, ZDK, and
ZNZ package types, see the TI website (http://www.ti.com) or contact your TI sales representative.
(
)
TMS 320 DM643 GDK
500
PREFIX
DEVICE SPEED RANGE
TMX= Experimental device
TMP= Prototype device
500 (500-MHz CPU, 100-MHz EMIF
600 (600-MHz CPU, 133-MHz EMIF
TMS= Qualified device
SMX= Experimental device, MIL
SMJ = MIL-PRF-38535, QML
TEMPERATURE RANGE (DEFAULT: 0°C TO 90°C)
Blank = 0°C to 90°C, commercial temperature
SM
= High Rel (non-38535)
DEVICE FAMILY
320 = TMS320t DSP family
(A)(B)
PACKAGE TYPE
GDK = 548-pin plastic BGA
GNZ = 548-pin plastic BGA
ZDK = 548-pin plastic BGA, with Pb-free soldered balls
ZNZ = 548-pin plastic BGA, with Pb-free soldered balls
(C)
DEVICE
DM64x DSP:
643
642
641
640
A. BGA = Ball Grid Array
B. The ZDK and ZNZ mechanical package designators represent the version of the GDK and GLZ packages, respectively, with Pb-free
balls. For more detailed information, see the Mechanical Data section of this document.
C. For actual device part numbers (P/Ns) and ordering information, see the TI website (www.ti.com).
Figure 2-15. TMS320DM64x™ DSP Device Nomenclature (Including the TMS320DM643 Device)
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2.6.2.2 Documentation Support
Extensive documentation supports all TMS320™ DSP family generations of devices from product
announcement through applications development. The types of documentation available include: data
sheets, such as this document, with design specifications; complete user's reference guides for all devices
and tools; technical briefs; development-support tools; on-line help; and hardware and software
applications. The following is a brief, descriptive list of support documentation specific to the C6000™
DSP devices:
The TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189) describes the
C6000™ DSP CPU (core) architecture, instruction set, pipeline, and associated interrupts.
The TMS320C6000 DSP Peripherals Overview Reference Guide (literature number SPRU190) provides
an overview and briefly describes the functionality of the peripherals available on the C6000™ DSP
platform of devices. This document also includes a table listing the peripherals available on the C6000
devices along with literature numbers and hyperlinks to the associated peripheral documents.
The TMS320C64x Technical Overview (literature number SPRU395) gives an introduction to the C64x™
digital signal processor, and discusses the application areas that are enhanced by the C64x™ DSP
VelociTI.2™ VLIW architecture.
The TMS320C64x DSP Video Port/VCXO Interpolated Control (VIC) Port Reference Guide (literature
number SPRU629) describes the functionality of the Video Port and VIC Port peripherals.
The TMS320C6000 DSP Multichannel Audio Serial Port (McASP) Reference Guide (literature number
SPRU041) describes the functionality of the McASP peripheral.
TMS320C6000 DSP Inter-Integrated Circuit (I2C) Module Reference Guide (literature number SPRU175)
describes the functionality of the I2C peripheral.
TMS320C6000 DSP Ethernet Media Access Controller (EMAC)/ Management Data Input/Output (MDIO)
Module Reference Guide (literature number SPRU628) describes the functionality of the EMAC and MDIO
peripherals.
The Using IBIS Models for Timing Analysis application report (literature number SPRA839) describes how
to properly use IBIS models to attain accurate timing analysis for a given system.
The tools support documentation is electronically available within the Code Composer Studio™ Integrated
Development Environment (IDE). For a complete listing of C6000™ DSP latest documentation, visit the
Texas Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL).
2.6.2.3 Device Silicon Revision
This data manual supports the initial release of the DM643 device; therefore, no device-specific silicon
errata document is currently available.
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3 Device Configurations
On the DM643 device, bootmode and certain device configurations/peripheral selections are determined at
device reset, while other device configurations/peripheral selections are software-configurable via the
peripheral configurations register (PERCFG) [address location 0x01B3F000] after device reset.
3.1 Configurations at Reset
For proper DM643 device operation, the following external pins must be configured correctly:
•
•
The GP0[0] (pin M5) must remain low, do not oppose the internal pulldown (IPD).
The RSV09 (pin E2) at device reset must be pulled down via a 10-kΩ resistor.
3.1.1 Peripheral Selection at Device Reset
Some DM643 peripherals share the same pins (internally muxed) and are mutually exclusive (i.e., HPI,
EMAC, and MDIO). Other DM643 peripherals (i.e., the Timers, I2C0, GP0, McBSP0, and VP2), are
always available.
•
HPI, EMAC, and MDIO peripherals
The MAC_EN pin is latched at reset and determines specific peripheral selection, summarized in
Table 3-1. For further clarification of the HPI vs. EMAC configuration, see Table 3-2.
Table 3-1. HD5, and MAC_EN Peripheral Selection (HPI, EMAC, and MDIO)
PERIPHERAL SELECTION
HD5 MAC_EN
Pin [C5]
PERIPHERALS SELECTED
HPI Data
Lower
HPI Data
Upper
EMAC and MDIO
Pin [Y1]
0
0
1
1
0
1
0
1
√
√
√
Hi-Z
Hi-Z
√
Disabled
√
Disabled
√
Disabled
•
•
The HPI peripheral is enabled and based on the HD5 and MAC_EN pin configuration at reset, HPI16
mode or EMAC and MDIO can be selected.
The MAC_EN pin, in combination with the HD5 pin, controls the selection of the EMAC and MDIO
peripherals (for more details, see Table 3-2).
Table 3-2. HPI vs. EMAC Peripheral Pin Selection
CONFIGURATION SELECTION
PERIPHERALS SELECTED
GP0[0] (Pin [M5])(1)
HD5 (Pin [Y1])
MAC_EN (Pin [C5])
HD[15:0]
HD[31:16]
Hi-Z
0
0
0
0
0
0
1
1
0
1
0
1
HPI16
HPI16
used for EMAC
HPI32 (HD[31:0])
Hi-Z
used for EMAC
(1) Invalid configuration. The GP0[0] pin must remain low during
device reset.
1
x
x
3.1.2 Device Configuration at Device Reset
Table 3-3 describes the DM643 device configuration pins, which are set up via external pullup/pulldown
resistors through the specified EMIFA address bus pins (AEA[22:19]), and the TOUT1/LENDIAN, and the
HD5 pins (all of which are latched during device reset).
Note: If a configuration pin must be routed out from the device, the internal pullup/pulldown (IPU/IPD)
resistor should not be relied upon; TI recommends the use of an external pullup/pulldown resistor.
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Table 3-3. DM643 Device Configuration Pins (TOUT1/LENDIAN, AEA[22:19], HD5, and MAC_EN)
CONFIGURATION
NO.
FUNCTIONAL DESCRIPTION
PIN
Device Endian mode (LEND)
TOUT1/LENDIAN
B5
0 - System operates in Big Endian mode
1 - System operates in Little Endian mode (default)
Bootmode [1:0]
00 - No boot (default mode)
01 - HPI boot
10 - Reserved
[U23,
V24]
AEA[22:21]
AEA[20:19]
11 - EMIFA 8-bit ROM boot
EMIFA input clock select
Clock mode select for EMIFA (AECLKIN_SEL[1:0])
[V25,
V26]
00 - AECLKIN (default mode)
01 - CPU/4 Clock Rate
10 - CPU/6 Clock Rate
11 - Reserved
HPI peripheral bus width (HPI_WIDTH)
0 - HPI operates as an HPI16.
(HPI bus is 16 bits wide. HD[15:0] pins are used and the remaining HD[31:16] pins are reserved pins in
the Hi-Z state.)
1 - HPI operates as an HPI32.
HD5
Y1
C5
(HPI bus is 32 bits wide. All HD[31:0] pins are used for host-port operations.)
(Also see the TOUT0/MAC_EN functional description in this table)
Peripheral Selection
TOUT0/MAC_EN
0 - EMAC and MDIO disabled; HPI16 enabled (default mode) [HPI32, if HD5 = 1; HPI16 if HD5 = 0]
1 - EMAC and MDIO enabled; HPI16 enabled, if HD5 = 0; HPI32 disabled, if HD5 = 1
3.2 Configurations After Reset
3.2.1 Peripheral Selection After Device Reset
Video Ports, McBSP0, McASP0 and I2C0
The DM643 device has designated registers for peripheral configuration (PERCFG), device status
(DEVSTAT), and JTAG identification (JTAGID). These registers are part of the Device Configuration
module and are mapped to a 4K block memory starting at 0x01B3F000. The CPU accesses these
registers via the CFGBUS.
The peripheral configuration register (PERCFG), allows the user to control the peripheral selection of the
Video Ports (VP1 and VP2) McBSP0, McASP0, and I2C0 peripherals. For more detailed information on
the PERCFG register control bits, see Figure 3-1 and Table 3-4.
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24
31
Reserved
R-0
23
15
16
8
Reserved
R-0
Reserved
R-0
7
6
5
4
3
2
1
0
Reserved
R-0
VP2EN
R/W-0
VP1EN
R/W-0
Reserved
R-0
I2C0EN
R/W-0
MCBSP1EN(1)
MCBSP0EN
R/W-1
MCASP0EN
R/W-0
R/W-1
Legend: R = Read only, R/W = Read/Write, -n = value after reset
(1) The DM643 device does not support the McBSP1 peripheral.
Figure 3-1. Peripheral Configuration Register (PERCFG)
[Address Location: 0x01B3F000 - 0x01B3F003]
Table 3-4. Peripheral Configuration (PERCFG) Register Selection Bit Descriptions
BIT
NAME
DESCRIPTION
31:7
Reserved
Reserved. Read-only, writes have no effect.
VP2 Enable bit.
Determines whether the VP2 peripheral is enabled or disabled.
6
5
VP2EN
VP1EN
0 = VP2 is disabled, the module is powered down (default).
(This feature allows power savings by disabling the peripheral when not in use.)
1 = VP2 is enabled.
VP1 Enable bit.
Determines whether the VP1 peripheral is enabled or disabled.
0 = VP1 is disabled, the module is powered down (default).
(This feature allows power savings by disabling the peripheral when not in use.)
1 = VP1 is enabled.
Note: For proper DM643 device operation, the MCBSP1EN bit must be set to zero (0).
4
3
Reserved
I2C0EN
Reserved. Read-only, writes have no effect.
Inter-integrated circuit 0 (I2C0) enable bit.
Selects whether I2C0 peripheral is enabled or disabled (default).
0 = I2C0 is disabled, the module is powered down (default).
1 = I2C0 is enabled.
For C64x compatibility and possible future expansion, at device reset this bit is a one (1). The DM643
device does not support the McBSP1 peripheral.
2
1
MCBSP1EN
MCBSP0EN
Note: For proper DM643 device operation, this bit must be set to zero (0).
McBSP0 Enable bit.
Determines whether the McBSP0 peripheral is enabled or disabled.
0 = McBSP0 is disabled, the module is powered down.
(This feature allows power savings by disabling the peripheral when not in use.)
1 = McBSP0 is enabled (default).
For a graphic (logic) representation of this Peripheral Configuration (PERCFG) Register selection bit and
the signal pins controlled/selected, see Figure 3-2.
McASP0 vs. VP1 upper-data pins select bit.
Selects whether the McASP0 peripheral or the VP1 upper-data pins are enabled.
0 = McASP0 is disabled; VP1 upper-data pins are enabled; and the VP1lower-data pins are dependent on
the MCSBP1EN and VP1EN bits (default).
1 = McASP0 is enabled; VP1 upper-data pins are disabled; and the VP1 lower-data pins are dependent
on the MCSBP1EN and VP1EN bits.
0
MCASP0EN
For a graphic (logic) representation of this Peripheral Configuration (PERCFG) Register selection bit and
the signal pins controlled/selected, see Figure 3-2.
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(B)
MCBSP1EN [PERCFG.2]
Reserved for C64x Compatibility.
McBSP1 peripheral not supported on
DM643.
1
0
VP1
Lower Data (10 pins)
VP1 (Channel A)
VP1D[9:0]
(B)
MCBSP1EN [PERCFG.2]
MCASP0EN [PERCFG.0]
1
0
VP1 (Channel A)
VP1
MCASP0EN [PERCFG.0]
Upper Data (10 pins)
(A)
VP1D[19:12] Muxed
VP1D[11:10] Standalone
McASP0 Data
1
0
VP1 (Channel B)
A. Consists of: VP1D[19:12]/AXR0[7:0]
B. McBSP1 peripheral not supported on DM643. For proper DM643 device operation, the MCBSP1EN bit must be
set to zero.
Figure 3-2. VP1, McBSP1, McBSP0, and McASP0 Data/Control Pin Muxing
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3.3 Peripheral Configuration Lock
By default, the McASP0, VP1, VP2, and I2C peripherals are disabled on power up. In order to use these
peripherals on the DM643 device, the peripheral must first be enabled in the Peripheral Configuration
register (PERCFG). Software muxed pins should not be programmed to switch functionalities
during run-time. Care should also be taken to ensure that no accesses are being performed before
disabling the peripherals. To help minimize power consumption in the DM643 device, unused
peripherals may be disabled.
Figure 3-3 shows the flow needed to enable (or disable) a given peripheral on the DM643 device.
Unlock the PERCFG Register
Using the PCFGLOCK Register
Write to
PERCFG Register
to Enable/Disable Peripherals
Read from
PERCFG Register
Wait 128 CPU Cycles Before
Accessing Enabled Peripherals
Figure 3-3. Peripheral Enable/Disable Flow Diagram
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A 32-bit key (value = 0x10C0010C) must be written to the Peripheral Configuration Lock register
(PCFGLOCK) in order to unlock access to the PERCFG register. Reading the PCFGLOCK register
determines whether the PERCFG register is currently locked (LOCKSTAT bit = 1) or unlocked
(LOCKSTAT bit = 0), see Figure 3-4. A peripheral can only be enabled when the PERCFG register is
"unlocked" (LOCKSTAT bit = 0).
Read Accesses
31
1
0
Reserved
R-0
LOCKSTAT
R-1
Write Accesses
31
0
LOCK
W-0
Legend: R = Read only, R/W = Read/Write, -n = value after reset
Figure 3-4. PCFGLOCK Register Diagram [Address Location: 0x01B3 F018] - Read/Write Accesses
Table 3-5. PCFGLOCK Register Selection Bit Descriptions - Read Accesses
BIT
NAME
DESCRIPTION
31:1
Reserved
Reserved. Read-only, writes have no effect.
Lock status bit.
Determines whether the PERCFG register is locked or unlocked.
0
LOCKSTAT
0 = Unlocked, read accesses to the PERCFG register allowed.
1 = Locked, write accesses to the PERCFG register do not modify the register state [default].
Reads are unaffected by Lock Status.
Table 3-6. PCFGLOCK Register Selection Bit Descriptions - Write Accesses
BIT
NAME
LOCK
DESCRIPTION
Lock bits.
0x10C0010C = Unlocks PERCFG register accesses.
31:0
Any write to the PERCFG register will automatically relock the register. In order to avoid the unnecessary
overhead of multiple unlock/enable sequences, all peripherals should be enabled with a single write to the
PERCFG register with the necessary enable bits set.
Prior to waiting 128 CPU cycles, the PERCFG register should be read. There is no direct correlation
between the CPU issuing a write to the PERCFG register and the write actually occurring. Reading the
PERCFG register after the write is issued forces the CPU to wait for the write to the PERCFG register to
occur.
Once a peripheral is enabled, the DSP (or other peripherals such as the HPI) must wait a minimum of 128
CPU cycles before accessing the enabled peripheral. The user must ensure that no accesses are
performed to a peripheral while it is disabled.
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3.4 Device Status Register Description
The device status register depicts the status of the device peripheral selection. For the actual register bit
names and their associated bit field descriptions, see Figure 3-5 and Table 3-7.
31
24
Reserved
R-0
23
15
16
Reserved
R-0
12
11
10
HPI_WIDTH
R-x
9
8
Reserved
R-0
MAC_EN
R-x
Reserved
R-x
Reserved
R-x
7
6
5
4
3
2
1
0
Reserved
R-x
CLKMODE1
R-x
CLKMODE0
R-x
LENDIAN
R-x
BOOTMODE1 BOOTMODE0 AECLKINSEL1 AECLKINSEL0
R-x R-x R-x R-x
Legend: R = Read only, R/W = Read/Write, -n = value after reset
Figure 3-5. Device Status Register (DEVSTAT) Description - 0x01B3 F004
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Table 3-7. Device Status (DEVSTAT) Register Selection Bit Descriptions
BIT
NAME
DESCRIPTION
31:12
Reserved
Reserved. Read-only, writes have no effect.
EMAC enable bit.
Shows the status of whether EMAC peripheral is enabled or disabled (default).
11
10
MAC_EN
0 = EMAC is disabled, and the module is powered down (default).
1 = EMAC is enabled.
HPI bus width control bit.
Shows the status of whether the HPI bus operates in 32-bit mode or in 16-bit mode (default).
HPI_WIDTH
0 = HPI operates in 16-bit mode. (default).
1 = HPI operates in 32-bit mode.
9:7
6
Reserved
Reserved. Read-only, writes have no effect.
Clock mode select bits
CLKMODE1
Shows the status of whether the CPU clock frequency equals the input clock frequency X1 (Bypass), x6,
or x12.
Clock mode select for CPU clock frequency (CLKMODE[1:0])
00 - Bypass (x1) (default mode)
01 - x6
10 - x12
5
CLKMODE0
11 - Reserved
For more details on the CLKMODE pins and the PLL multiply factors, see the Clock PLL section of this
data sheet.
Device Endian mode (LEND)
Shows the status of whether the system is operating in Big Endian mode or Little Endian mode (default).
4
3
LENDIAN
0 - System is operating in Big Endian mode
1 - System is operating in Little Endian mode (default)
BOOTMODE1
Bootmode configuration bits
Shows the status of what device bootmode configuration is operational.
Bootmode [1:0]
00 - No boot (default mode)
01 - HPI boot
10 - Reserved
2
1
0
BOOTMODE0
AECLKINSEL1
AECLKINSEL0
11 - EMIFA 8-bit ROM boot
EMIFA input clock select
Shows the status of what clock mode is enabled or disabled for the EMIF.
Clock mode select for EMIFA (AECLKIN_SEL[1:0])
00 - AECLKIN (default mode)
01 - CPU/4 Clock Rate
10 - CPU/6 Clock Rate
11 - Reserved
3.5 Multiplexed Pin Configurations
Multiplexed pins are pins that are shared by more than one peripheral and are internally multiplexed.
Some of these pins are configured by software, and the others are configured by external pullup/pulldown
resistors only at reset. Those muxed pins that are configured by software should not be programmed to
switch functionalities during run-time. Those muxed pins that are configured by external pullup/pulldown
resistors are mutually exclusive; only one peripheral has primary control of the function of these pins after
reset. Table 3-8 identifies the multiplexed pins on the DM643 device; shows the default (primary) function
and the default settings after reset; and describes the pins, registers, etc. necessary to configure specific
multiplexed functions.
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Table 3-8. DM643 Device Multiplexed Pin Configurations
MULTIPLEXED PINS
DEFAULT
FUNCTION
DEFAULT
SETTING
DESCRIPTION
NAME
NO.
CLKOUT4/GP0[1]
D6
CLKOUT4
GP1EN = 0 (disabled)
These pins are software-configurable. To use these pins
as GPIO pins, the GPxEN bits in the GPIO Enable
Register and the GPxDIR bits in the GPIO Direction
Register must be properly configured.
CLKOUT6/GP0[2]
VDAC/GP0[8]
C6
CLKOUT6
GP2EN = 0 (disabled)
GPxEN = 1: GPx pin enabled
GPxDIR = 0: GPx pin is an input
GPxDIR = 1: GPx pin is an output
The VDAC output pin function is default.
To use GP0[8] as a GPIO pin, the GPxEN bits in the GPIO
Enable Register and the GPxDIR bits in the GPIO
Direction Register must be properly configured.
GP8EN = 0 (disabled)
MAC_EN = 0 (disabled)
AD1
None
GP8EN = 1: GP8 pin enabled
GP8DIR = 0: GP8 pin is an input
GP8DIR = 1: GP8 pin is an output
VP1D[19]/AXR0[7]
VP1D[18]/AXR0[6]
VP1D[17]/AXR0[5]
VP1D[16]/AXR0[4]
VP1D[15]/AXR0[3]
VP1D[14]/AXR0[2]
VP1D[13]/AXR0[1]
VP1D[12]/AXR0[0]
HD31/MRCLK
HD30/MCRS
AB12
AB11
AC11
AD11
AE11
AC10
AD10
AC9
G1
By default, no function is enabled upon reset.
To enable the Video Port 1 data pins, the VP1EN bit in the
VP1EN bit = 0 (disabled) PERCFG register must be set to a 1. (McASP0 data pins
None
MCASP0EN bit = 0
(disabled)
are disabled).
To enable the McASP0[7:0] data pins, the MCASP0EN bit
in the PERCFG register must be set to a 1. (VP1 upper
data pins are disabled).
HD31
HD30
HD29
HD28
HD27
HD26
HD25
HD24
HD22
HD21
HD20
HD19
HD18
HD17
HD16
H3
HD29/MRXER
HD28/MRXDV
HD27/MRXD3
HD26/MRXD2
HD25/MRXD1
HD24/MRXD0
HD22/MTCLK
G2
J4
H2
J3
J1
To enable the EMAC peripheral, an external pullup resistor
MAC_EN = 0 (disabled) (1 kΩ) must be provided on the MAC_EN pin (setting
K4
MAC_EN = 1 at reset).
L4
HD21/MCOL
K2
HD20/MTXEN
HD19/MTXD3
L3
L2
HD18/MTXD2
M4
HD17/MTXD1
M2
HD16/MTXD0
M3
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3.6 Debugging Considerations
It is recommended that external connections be provided to device configuration pins, including
TOUT1/LENDIAN, AEA[22:19], HD5, and TOUT0/MAC_EN. Although internal pullup/pulldown resistors
exist on these pins, providing external connectivity adds convenience to the user in debugging and
flexibility in switching operating modes.
Internal pullup/pulldown resistors also exist on the non-configuration pins on the AEA bus (AEA[18:0]). Do
not oppose the internal pullup/pulldown resistors on these non-configuration pins with external
pullup/pulldown resistors. If an external controller provides signals to these non-configuration pins, these
signals must be driven to the default state of the pins at reset, or not be driven at all.
For the internal pullup/pulldown resistors for all device pins, see the terminal functions table.
3.7 Configuration Examples
Figure 3-6 through Figure 3-8 illustrate examples of peripheral selections that are configurable on the
DM643 device.
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AED[63:0]
EMIFA
AECLKIN, AARDY, AHOLD
AEA[22:3], ACE[3:0], ABE[7:0],
AECLKOUT1, AECLKOUT2,
ASDCKE, ASOE3, APDT,
AHOLDA, ABUSREQ,
AARE/ASDCAS/ASADS/ASRE,
AAOE/ASDRAS/ASOE,
16
HD[15:0]
HPI
(16-Bit)
Clock
and
System
HRDY, HINT
HCNTL0, HCNTL1,
HHWIL, HAS, HR/W,
HCS, HDS1, HDS2
AAWE/ASDWE/ASWE
CLKIN,
MTXD[3:0], MTXEN
CLKMODE0, CLKMODE1
EMAC
MDIO
TIMER2
TIMER1
MRXD[3:0], MRXER,
MRXDV, MCOL, MCRS,
MTCLK, MRCLK
CLKOUT4, CLKOUT6, PLLV
TINP1
MDIO, MDCLK
TOUT1/LENDIAN
TINP0
TIMER0
TOUT0/MACEN
GP0
and
EXT_INT
GP0[15:9, 3:0]
GP0[7:4]
CLKR0, FSR0, DR0,
DX0, FSX0, CLKX0
McBSP0
McASP0 Control
McASP0 Data
SCL0
SDA0
I2C0
VIC
VDAC/GP0[8]
(A)
STCLK
VP1
(20-Bit)
VP1CLK0
(A)
STCLK
VP2
(20-Bit)
VP1CLK1,
VP1CTL[2:0],
VP1D[19:0]
VP2CLK0
VP2CLK1,
VP2CTL[2:0],
VP2D[19:0]
PERCFG Register Value:
External Pins:
0x0000 006A
HD5 = 0
TOUT0/MAC_EN = 1
Shading denotes a peripheral module not available for this configuration.
A. STCLK supports both video ports (VP2 and VP1).
Figure 3-6. Configuration Example A
(2 20-Bit Video Ports + 1 McBSP + HPI + EMAC + MDIO + I2C0 + EMIF + 3 Timers)
[TBD]
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AED[63:0]
EMIFA
AECLKIN, AARDY, AHOLD
AEA[22:3], ACE[3:0], ABE[7:0],
AECLKOUT1, AECLKOUT2,
ASDCKE, ASOE3, APDT,
AHOLDA, ABUSREQ,
AARE/ASDCAS/ASADS/ASRE,
AAOE/ASDRAS/ASOE,
Clock
and
System
HPI
(16-Bit)
AAWE/ASDWE/ASWE
CLKIN,
CLKMODE0, CLKMODE1
MTXD[3:0], MTXEN
EMAC
TIMER2
TIMER1
TIMER0
CLKOUT4, CLKOUT6, PLLV
MRXD[3:0], MRXER,
MRXDV, MCOL, MCRS,
MTCLK, MRCLK
TINP1
MDIO, MDCLK
MDIO
TOUT1/LENDIAN
TINP0
TOUT0/MACEN
GP0
and
EXT_INT
GP0[15:9, 3:0]
GP0[7:4]
CLKR0, FSR0, DR0,
DX0, FSX0, CLKX0
McBSP0
McASP0 Control
McASP0 Data
SCL0
SDA0
I2C0
VIC
VDAC/GP0[8]
(A)
(A)
STCLK
STCLK
VP1
(8/10-Bit)
VP2
(20-Bit)
VP1CLK0
VP2CLK0
VP2CLK1,
VP2CTL[2:0],
VP2D[19:0]
VP1CLK1,
VP1CTL[2:0],
VP1D[9:2]
PERCFG Register Value:
External Pins:
0x0000 006B
HD5 = 1
TOUT0/MAC_EN = 1
Shading denotes a peripheral module not available for this configuration.
A. STCLK supports both video ports (VP2 and VP1)
Figure 3-7. Configuration Example B
(1 20-Bit Video Port + 1 10-Bit Video Port + 1 McBSP + EMAC + MDIO + I2C0 + EMIF)
[Possible Video IP Phone Applications]
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AED[63:0]
EMIFA
AECLKIN, AARDY, AHOLD
AEA[22:3], ACE[3:0], ABE[7:0],
AECLKOUT1, AECLKOUT2,
ASDCKE, ASOE3, APDT,
AHOLDA, ABUSREQ,
AARE/ASDCAS/ASADS/ASRE,
AAOE/ASDRAS/ASOE,
16
HD[15:0]
Clock
and
System
HPI
(16-Bit)
HRDY, HINT
HCNTL0, HCNTL1,
HHWIL, HAS, HR/W,
HCS, HDS1, HDS2
AAWE/ASDWE/ASWE
CLKIN,
CLKMODE0, CLKMODE1
MTXD[3:0], MTXEN
EMAC
MDIO
TIMER2
TIMER1
TIMER0
CLKOUT4, CLKOUT6, PLLV
MRXD[3:0], MRXER,
MRXDV, MCOL, MCRS,
MTCLK, MRCLK
TINP1
MDIO, MDCLK
TOUT1/LENDIAN
TINP0
TOUT0/MACEN
CLKR0, FSR0, DR0,
DX0, FSX0, CLKX0
GP0
and
EXT_INT
GP0[15:9, 3:0]
GP0[7:4]
McBSP0
AHCLKX0, AFSX0,
ACLKX0, AMUTE0,
AMUTEIN0, AHCLKR0,
AFSR0, ACLKR0
McASP0 Control
McASP0 Data
SCL0
SDA0
I2C0
VIC
AXR0[7:0]
VDAC/GP0[8]
(A)
(A)
STCLK
STCLK
VP2
(20-Bit)
VP1
(10-Bit)
VP1CLK0
VP2CLK0
VP1CLK1,
VP1CTL[2:0],
VP1D[9:0]
VP2CLK1,
VP2CTL[2:0],
VP2D[19:0]
PERCFG Register Value:
External Pins:
0x0000 006B
HD5 = 0
TOUT0/MAC_EN = 1
Shading denotes a peripheral module not available for this configuration.
A. STCLK supports both video ports (VP2 and VP1).
Figure 3-8. Configuration Example C
(1 20-Bit Video Port, 1 10-Bit Video Port + 1 McBSP + 1 McASP0 + VIC + I2C0 + EMIF)
[TBD]
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4 Device Operating Conditions
4.1 Absolute Maximum Ratings Over Operating Case Temperature Range
(1)
(Unless Otherwise Noted)
(2)
CVDD
–0.3 V to 1.8 V
–0.3 V to 4 V
–0.3 V to 4 V
–0.3 V to 4 V
0°C to 90°C
–65°C to 150°C
–40°C to 125°C
500
Supply voltage ranges:
(2)
DVDD
Input voltage ranges:
VI
Output voltage ranges:
VO
Operating case temperature ranges, TC:
(default)
Storage temperature range, Tstg
:
Temperature Range
Number of Cycles
Package Temperature Cycling:
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to VSS.
4.2 Recommended Operating Conditions
MIN NOM
MAX UNIT
(1)
(1)
Supply voltage, Core (-500 device)
Supply voltage, Core (-600 device)
Supply voltage, I/O
1.14
1.36
3.14
0
1.2
1.4
3.3
0
1.26
1.44
3.46
0
V
V
CVDD
DVDD
VSS
VIH
V
Supply ground
V
High-level input voltage
2
V
VIL
Low-level input voltage
0.8
V
VOS
VUS
TC
Maximum voltage during overshoot
4.3(2)
V
(2)
Maximum voltage during undershoot
Operating case temperature Default
–1.0
V
0
90
°C
(1) Future variants of the C64x DSPs may operate at voltages ranging from 0.9 V to 1.4 V to provide a range of system power/performance
options. TI highly recommends that users design-in a supply that can handle multiple voltages within this range (i.e., 1.2 V, 1.25 V,
1.3 V, 1.35 V, 1.4 V with ± 3% tolerances) by implementing simple board changes such as reference resistor values or input pin
configuration modifications. Examples of such supplies include the PT4660, PT5500, PT5520, PT6440, and PT6930 series from Power
Trends, a subsidiary of Texas Instruments. Not incorporating a flexible supply may limit the system's ability to easily adapt to future
versions of C64x devices.
(2) The absolute maximum ratings should not be exceeded for more than 30% of the cycle period.
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4.3 Electrical Characteristics Over Recommended Ranges of Supply Voltage and
Operating Case Temperature (Unless Otherwise Noted)
(1)
PARAMETER
High-level output voltage
Low-level output voltage
TEST CONDITIONS
DVDD = MIN, IOH = MAX(2)
DVDD = MIN, IOL = MAX(2)
MIN
TYP
MAX UNIT
VOH
VOL
2.4
V
0.4
V
VI = VSS to DVDD no opposing internal
resistor
±10
uA
VI = VSS to DVDD opposing internal pullup
resistor
II
Input current
50
100
150
uA
(3)
VI = VSS to DVDD opposing internal
pulldown resistor
–150
–100
–50
–16
–8
uA
mA
mA
(3)
EMIF, CLKOUT4, CLKOUT6, EMUx
Video Ports, Timer, TDO, GPIO
(Excluding GP0[2:1]), McBSP
IOH
High-level output current
Low-level output current
HPI
–0.5(3)
16
mA
mA
EMIF, CLKOUT4, CLKOUT6, EMUx
Video Ports, Timer, TDO, GPIO
(Excluding GP0[2:1]), McBSP
8
mA
IOL
SCL0 and SDA0
3
1.5(3)
±10
mA
mA
uA
HPI
IOZ
Off-state output current
Core supply current(4)
VO = DVDD or 0 V
CVDD = 1.4 V, CPU clock = 600 MHz
CVDD = 1.2 V, CPU clock = 500 MHz
DVDD = 3.3 V, CPU clock = 600 MHz
DVDD = 3.3 V, CPU clock = 500 MHz
890
620
210
165
mA
mA
mA
mA
pF
ICDD
IDDD
I/O supply current(4)
Ci
Input capacitance
Output capacitance
10
10
Co
pF
(1) For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table.
(2) Single pin driving IOH/IOL = MAX.
(3) Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor.
(4) Measured with average activity (50% high/50% low power) at 25°C case temperature and 133-MHz EMIF for -600 speed (100-MHz
EMIF for -500 speed). This model represents a device performing high-DSP-activity operations 50% of the time, and the remainder
performing low-DSP-activity operations. The high/low-DSP-activity models are defined as follows:
•
High-DSP-Activity Model:
•
CPU: 8 instructions/cycle with 2 LDDW instructions [L1 Data Memory: 128 bits/cycle via LDDW instructions;
L1 Program Memory: 256 bits/cycle; L2/EMIF EDMA: 50% writes, 50% reads to/from SDRAM (50% bit-switching)]
McBSP: 1 channel at 2.048 MHz
•
•
Timers: 2 timers at maximum rate
•
Low-DSP-Activity Model:
•
CPU: 2 instructions/cycle with 1 LDH instruction [L1 Data Memory: 16 bits/cycle; L1 Program Memory: 256 bits per 4 cycles;
L2/EMIF EDMA: None]
•
•
McBSP: 1 channel at 2.048 MHz
Timers: 2 timers at maximum rate
The actual current draw is highly application-dependent. For more details on core and I/O activity, refer to the TMS320DMx Power
Consumption Summary application report (literature number SPRA962).
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5 DM643 Peripheral Information and Electrical Specifications
5.1 Parameter Information
5.1.1 Parameter Information Device-Specific Information
Tester Pin Electronics
Data Sheet Timing Reference Point
42 Ω
3.5 nH
Output
Under
Test
Transmission Line
Z0 = 50 Ω
(see note)
Device Pin
(see note)
4.0 pF
1.85 pF
NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must
be taken into account. A transmission line with a delay of 2 ns or longer can be used to produce the desired transmission line effect. The
transmission line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns or longer) from the data
sheet timings.
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.
Figure 5-1. Test Load Circuit for AC Timing Measurements
The load capacitance value stated is only for characterization and measurement of AC timing signals. This
load capacitance value does not indicate the maximum load the device is capable of driving.
5.1.1.1 Signal Transition Levels
All input and output timing parameters are referenced to 1.5 V for both "0" and "1" logic levels.
V
ref
= 1.5 V
Figure 5-2. Input and Output Voltage Reference Levels for AC Timing Measurements
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks,
VOLMAX and VOH MIN for output clocks.
V
ref
= V MIN (or V MIN)
IH OH
V
ref
= V MAX (or V MAX)
IL OL
Figure 5-3. Rise and Fall Transition Time Voltage Reference Levels
5.1.1.2 AC Transient Rise/Fall Time Specifications
Figure 5-4 and Figure 5-5 show the AC transient specifications for Rise and Fall time. For device-specific
information on these values, refer to the Recommended Operating Conditions section of this Data Sheet.
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(A)
t = 0.3 T (max)
C
V
OS
(max)
Minimum
Risetime
V
IH
(min)
Waveform
Valid Region
Ground
A. t = the peripheral cycle time.
c
Figure 5-4. AC Transient Specification Rise Time
(A)
t = 0.3 T (max)
C
V
IL
(max)
V
US
(max)
Ground
A. t = the peripheral cycle time.
c
Figure 5-5. AC Transient Specification Fall Time
5.1.1.3 Signal Transition Rates
All timings are tested with an input edge rate of 4 Volts per nanosecond (4 V/ns).
5.1.1.4 Timing Parameters and Board Routing Analysis
The timing parameter values specified in this data sheet do not include delays by board routings. As a
good board design practice, such delays must always be taken into account. Timing values may be
adjusted by increasing/decreasing such delays. TI recommends utilizing the available I/O buffer
information specification (IBIS) models to analyze the timing characteristics correctly. To properly use IBIS
models to attain accurate timing analysis for a given system, see the Using IBIS Models for Timing
Analysis application report (literature number SPRA839). If needed, external logic hardware such as
buffers may be used to compensate any timing differences.
For inputs, timing is most impacted by the round-trip propagation delay from the DSP to the external
device and from the external device to the DSP. This round-trip delay tends to negatively impact the input
setup time margin, but also tends to improve the input hold time margins (see Table 5-1 and Figure 5-6).
Figure 5-6 represents a general transfer between the DSP and an external device. The figure also
represents board route delays and how they are perceived by the DSP and the external device.
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Table 5-1. Board-Level Timing Example
(see Figure 5-6)
NO.
1
DESCRIPTION
Clock route delay
2
Minimum DSP hold time
3
Minimum DSP setup time
External device hold time requirement
External device setup time requirement
Control signal route delay
External device hold time
4
5
6
7
8
External device access time
DSP hold time requirement
DSP setup time requirement
Data route delay
9
10
11
ECLKOUTx
(Output from DSP)
1
ECLKOUTx
(Input to External Device)
2
3
(A)
Control Signals
(Output from DSP)
4
5
6
Control Signals
(Input to External Device)
7
8
(B)
Data Signals
(Output from External Device)
9
10
11
(B)
Data Signals
(Input to DSP)
A. Control signals include data for Writes.
B. Data signals are generated during Reads from an external device.
Figure 5-6. Board-Level Input/Output Timings
5.2 Recommended Clock and Control Signal Transition Behavior
All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic
manner.
5.3 Power Supplies
For more information regarding TI's power management products and suggested devices to power TI
DSPs, visit www.ti.com/dsppower.
5.3.1 Power-Supply Sequencing
TI DSPs do not require specific power sequencing between the core supply and the I/O supply. However,
systems should be designed to ensure that neither supply is powered up for extended periods of time
(>1 second) if the other supply is below the proper operating voltage.
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5.3.2 Power-Supply Design Considerations
A dual-power supply with simultaneous sequencing can be used to eliminate the delay between core and
I/O power up. A Schottky diode can also be used to tie the core rail to the I/O rail (see Figure 5-7).
I/O Supply
DV
DD
Schottky
Diode
C6000
DSP
Core Supply
CV
DD
V
SS
GND
Figure 5-7. Schottky Diode Diagram
Core and I/O supply voltage regulators should be located close to the DSP (or DSP array) to minimize
inductance and resistance in the power delivery path. Additionally, when designing for high-performance
applications utilizing the C6000™ platform of DSPs, the PC board should include separate power planes
for core, I/O, and ground, all bypassed with high-quality low-ESL/ESR capacitors.
5.3.3 Power-Supply Decoupling
In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as
possible close to the DSP. Assuming 0603 caps, the user should be able to fit a total of 60 caps, 30 for
the core supply and 30 for the I/O supply. These caps need to be close to the DSP power pins, no more
than 1.25 cm maximum distance to be effective. Physically smaller caps, such as 0402, are better
because of their lower parasitic inductance. Proper capacitance values are also important. Small bypass
caps (near 560 pF) should be closest to the power pins. Medium bypass caps (220 nF or as large as can
be obtained in a small package) should be next closest. TI recommends no less than 8 small and
8 medium caps per supply (32 total) be placed immediately next to the BGA vias, using the "interior" BGA
space and at least the corners of the "exterior".
Eight larger caps (4 for each supply) can be placed further away for bulk decoupling. Large bulk caps (on
the order of 100 µF) should be furthest away (but still as close as possible). No less than 4 large caps per
supply (8 total) should be placed outside of the BGA.
Any cap selection needs to be evaluated from a yield/manufacturing point-of-view. As with the selection of
any component, verification of capacitor availability over the product’s production lifetime should be
considered.
5.3.4 Peripheral Power-Down Operation
The DM643 device can be powered down in three ways:
•
•
Power-down due to pin configuration
Power-down due to software configuration – relates to the default state of the peripheral configuration
bits in the PERCFG register.
•
Power-down during run-time via software configuration
On the DM643 device, the HPI and EMAC and MDIO peripherals are controlled (selected) at the pin level
during chip reset (e.g., HD5 and MAC_EN pins).
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The McASP0, McBSP0, VP1, VP2, and I2C0 peripheral functions are selected via the peripheral
configuration (PERCFG) register bits.
For more detailed information on the peripheral configuration pins and the PERCFG register bits, see the
Device Configurations section of this document.
5.3.5 Power-Down Modes Logic
Figure 5-8 shows the power-down mode logic on the DM643.
CLKOUT4
CLKOUT6
Internal Clock Tree
Clock
Distribution
and Dividers
PD1
PD2
IFR
Power-
Internal
Peripherals
Clock
PLL
IER
CSR
Down
Logic
PWRD
CPU
PD3
TMS320DM643
CLKIN
RESET
A. External input clocks, with the exception of CLKIN, are not gated by the power-down mode logic.
Figure 5-8. Power-Down Mode Logic(A)
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5.3.6 Triggering, Wake-up, and Effects
The power-down modes and their wake-up methods are programmed by setting the PWRD field (bits
15–10) of the control status register (CSR). The PWRD field of the CSR is shown in Figure 5-9 and
described in Table 5-2. When writing to the CSR, all bits of the PWRD field should be set at the same
time. Logic 0 should be used when writing to the reserved bit (bit 15) of the PWRD field. The CSR is
discussed in detail in the TMS320C6000 CPU and Instruction Set Reference Guide (literature number
SPRU189).
31
16
(See NOTE)
15
14
13
12
11
10
9
8
Enable or
Non-Enabled
Interrupt Wake
Enabled
Interrupt Wake
Reserved
PD3
PD2
PD1
(See NOTE)
R/W-0
7
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
0
(See NOTE)
Legend: R/W = Readable/Writable, -n = value after reset, -x = undefined value after reset
NOTE: The shaded bits are not part of the power-down logic discussion and therefore are not covered here. For information on these other
bit fields in the CSR register, see the TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189).
Figure 5-9. PWRD Field of the CSR Register
A delay of up to nine clock cycles may occur after the instruction that sets the PWRD bits in the CSR
before the PD mode takes effect. As best practice, NOPs should be padded after the PWRD bits are set in
the CSR to account for this delay.
If PD1 mode is terminated by a non-enabled interrupt, the program execution returns to the instruction
where PD1 took effect. If PD1 mode is terminated by an enabled interrupt, the interrupt service routine will
be executed first, then the program execution returns to the instruction where PD1 took effect. In the case
with an enabled interrupt, the GIE bit in the CSR and the NMIE bit in the interrupt enable register (IER)
must also be set in order for the interrupt service routine to execute; otherwise, execution returns to the
instruction where PD1 took effect upon PD1 mode termination by an enabled interrupt.
PD2 and PD3 modes can only be aborted by device reset. Table 5-2 summarizes all the power-down
modes.
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Table 5-2. Characteristics of the Power-Down Modes
PRWD Field
(BITS 15–10)
POWER-DOWN
WAKE-UP METHOD
EFFECT ON CHIP'S OPERATION
MODE
No power-down
PD1
000000
001001
—
—
Wake by an enabled interrupt
CPU halted (except for the interrupt logic)
Power-down mode blocks the internal clock inputs at the
boundary of the CPU, preventing most of the CPU's logic from
switching. During PD1, EDMA transactions can proceed
between peripherals and internal memory.
Wake by an enabled or
non-enabled interrupt
010001
PD1
Output clock from PLL is halted, stopping the internal clock
structure from switching and resulting in the entire chip being
halted. All register and internal RAM contents are preserved. All
functional I/O "freeze" in the last state when the PLL clock is
turned off.
011010
PD2(1)
Wake by a device reset
Input clock to the PLL stops generating clocks. All register and
internal RAM contents are preserved. All functional I/O "freeze"
in the last state when the PLL clock is turned off. Following
reset, the PLL needs time to re-lock, just as it does following
power-up.
011100
PD3(1)
Wake by a device reset
Wake-up from PD3 takes longer than wake-up from PD2
because the PLL needs to be re-locked, just as it does following
power-up.
All others
Reserved
—
—
(1) When entering PD2 and PD3, all functional I/O remains in the previous state. However, for peripherals which are asynchronous in
nature or peripherals with an external clock source, output signals may transition in response to stimulus on the inputs. Under these
conditions, peripherals will not operate according to specifications.
5.3.7 C64x Power-Down Mode with an Emulator
If user power-down modes are programmed, and an emulator is attached, the modes will be masked to
allow the emulator access to the system. This condition prevails until the emulator is reset or the cable is
removed from the header. If power measurements are to be performed when in a power-down mode, the
emulator cable should be removed.
When the DSP is in power-down mode PD2 or PD3, emulation logic will force any emulation execution
command (such as Step or Run) to spin in IDLE. For this reason, PC writes (such as loading code) will
fail. A DSP reset will be required to get the DSP out of PD2/PD3.
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5.4 Enhanced Direct Memory Access (EDMA) Controller
The EDMA controller handles all data transfers between the level-two (L2) cache/memory controller and
the device peripherals on the DM643 DSP. These data transfers include cache servicing, non-cacheable
memory accesses, user-programmed data transfers, and host accesses.
5.4.1 EDMA Device-Specific Information
5.4.1.1 EDMA Channel Synchronization Events
The C64x EDMA supports up to 64 EDMA channels which service peripheral devices and external
memory. Table 5-3 lists the source of C64x EDMA synchronization events associated with each of the
programmable EDMA channels. For the DM643 device, the association of an event to a channel is fixed;
each of the EDMA channels has one specific event associated with it. These specific events are captured
in the EDMA event registers (ERL, ERH) even if the events are disabled by the EDMA event enable
registers (EERL, EERH). The priority of each event can be specified independently in the transfer
parameters stored in the EDMA parameter RAM. For more detailed information on the EDMA module and
how EDMA events are enabled, captured, processed, linked, chained, and cleared, etc., see the
TMS320C6000 DSP Enhanced Direct Memory Access (EDMA) Controller Reference Guide (literature
number SPRU234).
Table 5-3. TMS320DM643 EDMA Channel Synchronization Events(1)
EDMA
EVENT NAME
EVENT DESCRIPTION
CHANNEL(1)
0
1
DSP_INT
TINT0
HPI-to-DSP interrupt
Timer 0 interrupt
2
TINT1
Timer 1 interrupt
3
SD_INTA
GPINT4/EXT_INT4
GPINT5/EXT_INT5
GPINT6/EXT_INT6
GPINT7/EXT_INT7
GPINT0
EMIFA SDRAM timer interrupt
GP0 event 4/External interrupt pin 4
GP0 event 5/External interrupt pin 5
GP0 event 6/External interrupt pin 6
GP0 event 7/External interrupt pin 7
GP0 event 0
4
5
6
7
8
9
GPINT1
GP0 event 1
10
11
12
13
14–18
19
20–31
32
33
34
35
36
37
38
39
40
GPINT2
GP0 event 2
GPINT3
GP0 event 3
XEVT0
McBSP0 transmit event
McBSP0 receive event
None
REVT0
–
TINT2
Timer 2 interrupt
–
None
AXEVTE0
AXEVTO0
AXEVT0
McASP0 transmit even event
McASP0 transmit odd event
McASP0 transmit event
McASP0 receive even event
McASP0 receive odd event
McASP0 receive event
AREVTE0
AREVTO0
AREVT0
VP1EVTYB
VP1EVTUB
VP1EVTVB
VP1 Channel B Y event DMA request
VP1 Channel B Cb event DMA request
VP1 Channel B Cr event DMA request
(1) In addition to the events shown in this table, each of the 64 channels can also be synchronized with the transfer completion or alternate
transfer completion events. For more detailed information on EDMA event-transfer chaining, see the TMS320C6000 DSP Enhanced
Direct Memory Access (EDMA) Controller Reference Guide (literature number SPRU234).
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Table 5-3. TMS320DM643 EDMA Channel Synchronization Events(1) (continued)
EDMA
EVENT NAME
EVENT DESCRIPTION
CHANNEL(1)
41
42
VP2EVTYB
VP2EVTUB
VP2EVTVB
ICREVT0
ICXEVT0
–
VP2 Channel B Y event DMA request
VP2 Channel B Cb event DMA request
VP2 Channel B Cr event DMA request
I2C0 receive event
43
44
45
I2C0 transmit event
46–47
48
None
GPINT8
GP0 event 8
49
GPINT9
GP0 event 9
50
GPINT10
GPINT11
GPINT12
GPINT13
GPINT14
GPINT15
VP1EVTYA
VP1EVTUA
VP1EVTVA
VP2EVTYA
VP2EVTUA
VP2EVTVA
–
GP0 event 10
51
GP0 event 11
52
GP0 event 12
53
GP0 event 13
54
GP0 event 14
55
GP0 event 15
56
VP1 Channel A Y event DMA request
VP1 Channel A Cb event DMA request
VP1 Channel A Cr event DMA request
VP2 Channel A Y event DMA request
VP2 Channel A Cb event DMA request
VP2 Channel A Cr event DMA request
None
57
58
59
60
61
62–63
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5.4.2 EDMA Peripheral Register Description(s)
Table 5-4. EDMA Registers (C64x)
HEX ADDRESS RANGE
01A0 0800 – 01A0 FF98
01A0 FF9C
ACRONYM
–
REGISTER NAME
Reserved
EPRH
CIPRH
CIERH
CCERH
ERH
Event polarity high register
01A0 FFA4
Channel interrupt pending high register
Channel interrupt enable high register
Channel chain enable high register
Event high register
01A0 FFA8
01A0 FFAC
01A0 FFB0
01A0 FFB4
EERH
ECRH
ESRH
PQAR0
PQAR1
PQAR2
PQAR3
EPRL
PQSR
CIPRL
CIERL
CCERL
ERL
Event enable high register
Event clear high register
01A0 FFB8
01A0 FFBC
Event set high register
01A0 FFC0
Priority queue allocation register 0
Priority queue allocation register 1
Priority queue allocation register 2
Priority queue allocation register 3
Event polarity low register
01A0 FFC4
01A0 FFC8
01A0 FFCC
01A0 FFDC
01A0 FFE0
Priority queue status register
Channel interrupt pending low register
Channel interrupt enable low register
Channel chain enable low register
Event low register
01A0 FFE4
01A0 FFE8
01A0 FFEC
01A0 FFF0
01A0 FFF4
EERL
ECRL
ESRL
–
Event enable low register
01A0 FFF8
Event clear low register
01A0 FFFC
Event set low register
01A1 0000 – 01A3 FFFF
Reserved
Table 5-5. Quick DMA (QDMA) and Pseudo Registers
HEX ADDRESS RANGE
0200 0000
ACRONYM
QOPT
REGISTER NAME
QDMA options parameter register
QDMA source address register
QDMA frame count register
QDMA destination address register
QDMA index register
0200 0004
QSRC
QCNT
0200 0008
0200 000C
QDST
0200 0010
QIDX
0200 0014 – 0200 001C
0200 0020
Reserved
QSOPT
QSSRC
QSCNT
QSDST
QSIDX
QDMA pseudo options register
QDMA psuedo source address register
QDMA psuedo frame count register
QDMA destination address register
QDMA psuedo index register
0200 0024
0200 0028
0200 002C
0200 0030
Table 5-6. EDMA Parameter RAM (C64x)(1)
HEX ADDRESS RANGE
01A0 0000 – 01A0 0017
01A0 0018 – 01A0 002F
ACRONYM
REGISTER NAME
Parameters for Event 0 (6 words)
Parameters for Event 1 (6 words)
COMMENTS
Parameters for Event 0
(6 words) or Reload/Link
Parameters for other Event
–
–
(1) The DM643 device has 213 EDMA parameters total: 64-Event/Reload channels and 149-Reload only parameter sets [six (6) words
each] that can be used to reload/link EDMA transfers.
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Table 5-6. EDMA Parameter RAM (C64x) (continued)
HEX ADDRESS RANGE
01A0 0030 – 01A0 0047
01A0 0048 – 01A0 005F
01A0 0060 – 01A0 0077
01A0 0078 – 01A0 008F
01A0 0090 – 01A0 00A7
01A0 00A8 – 01A0 00BF
01A0 00C0 – 01A0 00D7
01A0 00D8 – 01A0 00EF
01A0 00F0 – 01A0 00107
01A0 0108 – 01A0 011F
01A0 0120 – 01A0 0137
01A0 0138 – 01A0 014F
01A0 0150 – 01A0 0167
01A0 0168 – 01A0 017F
01A0 0180 – 01A0 0197
01A0 0198 – 01A0 01AF
...
ACRONYM
REGISTER NAME
Parameters for Event 2 (6 words)
COMMENTS
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Parameters for Event 3 (6 words)
Parameters for Event 4 (6 words)
Parameters for Event 5 (6 words)
Parameters for Event 6 (6 words)
Parameters for Event 7 (6 words)
Parameters for Event 8 (6 words)
Parameters for Event 9 (6 words)
Parameters for Event 10 (6 words)
Parameters for Event 11 (6 words)
Parameters for Event 12 (6 words)
Parameters for Event 13 (6 words)
Parameters for Event 14 (6 words)
Parameters for Event 15 (6 words)
Parameters for Event 16 (6 words)
Parameters for Event 17 (6 words)
...
01A0 05D0 – 01A0 05E7
01A0 05E8 – 01A0 05FF
–
–
Parameters for Event 62 (6 words)
Parameters for Event 63 (6 words)
Reload/Link Parameters for
other Event 0–15
01A0 0600 – 01A0 0617
–
–
Reload/link parameters for Event 0 (6 words)
01A0 0618 – 01A0 062F
...
Reload/link parameters for Event 1 (6 words)
...
01A0 07E0 – 01A0 07F7
01A0 07F8 – 01A0 080F
01A0 0810 – 01A0 0827
...
–
–
–
Reload/link parameters for Event 20 (6 words)
Reload/link parameters for Event 21 (6 words)
Reload/link parameters for Event 22 (6 words)
...
01A0 13C8 – 01A0 13DF
01A0 13E0 – 01A0 13F7
01A0 13F8 – 01A0 13FF
01A0 1400 – 01A3 FFFF
–
–
–
–
Reload/link parameters for Event 147 (6 words)
Reload/link parameters for Event 148 (6 words)
Scratch pad area (2 words)
Reserved
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5.5 Interrupts
5.5.1 Interrupt Sources and Interrupt Selector
The C64x DSP core supports 16 prioritized interrupts, which are listed in Table 5-7. The highest-priority
interrupt is INT_00 (dedicated to RESET) while the lowest-priority interrupt is INT_15. The first four
interrupts (INT_00–INT_03) are non-maskable and fixed. The remaining interrupts (INT_04–INT_15) are
maskable and default to the interrupt source specified in Table 5-7. The interrupt source for interrupts
4–15 can be programmed by modifying the selector value (binary value) in the corresponding fields of the
Interrupt Selector Control registers: MUXH (address 0x019C0000) and MUXL (address 0x019C0004).
Table 5-7. DM643 DSP Interrupts
INTERRUPT
CPU
INTERRUPT
NUMBER
SELECTOR
VALUE
(BINARY)
SELECTOR
CONTROL
REGISTER
INTERRUPT
EVENT
INTERRUPT SOURCE
INT_00(1)
INT_01(1)
–
–
RESET
NMI
–
–
INT_02(1)
–
–
Reserved
Reserved. Do not use.
INT_03(1)
INT_04(2)
INT_05(2)
INT_06(2)
INT_07(2)
INT_08(2)
INT_09(2)
INT_10(2)
INT_11(2)
INT_12(2)
INT_13(2)
INT_14(2)
–
–
Reserved
Reserved. Do not use.
GP0 interrupt 4/External interrupt pin 4
GP0 interrupt 5/External interrupt pin 5
GP0 interrupt 6/External interrupt pin 6
GP0 interrupt 7/External interrupt pin 7
EDMA channel (0 through 63) interrupt
EMU DTDMA
MUXL[4:0]
00100
00101
00110
00111
01000
01001
00011
01010
01011
00000
00001
00010
01100
01101
01110
01111
10000
10001
10010
10011
10100
10101
10110
10111
11000
11001
11010
11011
11100
GPINT4/EXT_INT4
GPINT5/EXT_INT5
GPINT6/EXT_INT6
GPINT7/EXT_INT7
EDMA_INT
EMU_DTDMA
SD_INTA
MUXL[9:5]
MUXL[14:10]
MUXL[20:16]
MUXL[25:21]
MUXL[30:26]
MUXH[4:0]
EMIFA SDRAM timer interrupt
EMU real-time data exchange (RTDX) receive
EMU RTDX transmit
MUXH[9:5]
EMU_RTDXRX
EMU_RTDXTX
DSP_INT
MUXH[14:10]
MUXH[20:16]
HPI-to-DSP interrupt
MUXH[25:21]
TINT0
Timer 0 interrupt
INT_15(2)
MUXH[30:26]
TINT1
Timer 1 interrupt
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
XINT0
McBSP0 transmit interrupt
McBSP0 receive interrupt
Reserved. Do not use.
Reserved. Do not use.
GP0 interrupt 0
RINT0
Reserved
Reserved
GPINT0
Reserved
Reserved. Do not use.
Reserved. Do not use.
Timer 2 interrupt
Reserved
TINT2
Reserved
Reserved. Do not use.
Reserved. Do not use.
I2C0 interrupt
Reserved
ICINT0
Reserved
Reserved. Do not use.
EMAC/MDIO interrupt
EMAC_MDIO_INT
Reserved
Reserved. Do not use.
VP1 interrupt
VPINT1
VPINT2
VP2 interrupt
AXINT0
McASP0 transmit interrupt
(1) Interrupts INT_00 through INT_03 are non-maskable and fixed.Interrupts
(2) INT_04 through INT_15 are programmable by modifying the binary selector values in the Interrupt Selector Control registers fields.
Table 5-7 shows the default interrupt sources for Interrupts INT_04 through INT_15. For more detailed information on interrupt sources
and selection, see the TMS320C6000 DSP Interrupt Selector Reference Guide (literature number SPRU646).
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Table 5-7. DM643 DSP Interrupts (continued)
INTERRUPT
SELECTOR
CONTROL
REGISTER
CPU
INTERRUPT
NUMBER
SELECTOR
VALUE
(BINARY)
INTERRUPT
EVENT
INTERRUPT SOURCE
–
–
–
–
11101
ARINT0
McASP0 receive interrupt
Reserved. Do not use.
11110 – 11111
Reserved
5.5.2 Interrupts Peripheral Register Description(s)
Table 5-8. Interrupt Selector Registers (C64x)
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
Interrupt multiplexer high
COMMENTS
Selects which interrupts drive CPU
interrupts 10–15 (INT10–INT15)
019C 0000
MUXH
Selects which interrupts drive CPU
interrupts 4–9 (INT04–INT09)
019C 0004
MUXL
Interrupt multiplexer low
Sets the polarity of the external
interrupts (EXT_INT4–EXT_INT7)
019C 0008
EXTPOL
–
External interrupt polarity
Reserved
019C 000C – 019F FFFF
5.5.3 External Interrupts Electrical Data/Timing
Table 5-9. Timing Requirements for External Interrupts(1) (see Figure 5-10)
–500
–600
NO.
UNIT
MIN
MAX
Width of the NMI interrupt pulse low
4P
8P
4P
8P
ns
ns
ns
ns
1
2
tw(ILOW)
Width of the EXT_INT interrupt pulse low
Width of the NMI interrupt pulse high
Width of the EXT_INT interrupt pulse high
tw(IHIGH)
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
2
1
EXT_INTx, NMI
Figure 5-10. External/NMI Interrupt Timing
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5.6 Reset
A hardware reset (RESET) is required to place the DSP into a known good state out of power-up. The
RESET signal can be asserted (pulled low) prior to ramping the core and I/O voltages or after the core
and I/O voltages have reached their proper operating conditions. As a best practice, reset should be held
low during power-up. Prior to deasserting RESET (low-to-high transition), the core and I/O voltages should
be at their proper operating conditions and CLKIN should also be running at the correct frequency.
For information on peripheral selection at the rising edge of RESET, see the Device Configuration section
of this data manual.
5.6.1 Reset Electrical Data/Timing
Table 5-10. Timing Requirements for Reset (see Figure 5-11)
–500
–600
NO.
UNIT
MIN
MAX
1
tw(RST)
tsu(boot)
th(boot)
Width of the RESET pulse
250
4E or 4C(2)
4P(3)
µs
ns
ns
(1)
16
17
Setup time, boot configuration bits valid before RESET high
(1)
Hold time, boot configuration bits valid after RESET high
(1) AEA[22:19], LENDIAN, and HD5 are the boot configuration pins during device reset.
(2) E = 1/AECLKIN clock frequency in ns. C = 1/CLKIN clock frequency in ns.
Select the MIN parameter value, whichever value is larger.
(3) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
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Table 5-11. Switching Characteristics Over Recommended Operating Conditions During Reset(1) (2) (3)
(see Figure 5-11)
–500
–600
NO.
PARAMETER
UNIT
MIN
MAX
3P + 20E
8P + 20E
2
3
td(RSTL-ECKI)
Delay time, RESET low to AECLKIN synchronized internally
Delay time, RESET high to AECLKIN synchronized internally
Delay time, RESET low to AECLKOUT1 high impedance
Delay time, RESET high to AECLKOUT1 valid
Delay time, RESET low to EMIF Z high impedance
Delay time, RESET high to EMIF Z valid
2E
2E
2E
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
td(RSTH-ECKI)
4
td(RSTL-ECKO1HZ)
td(RSTH-ECKO1V)
td(RSTL-EMIFZHZ)
td(RSTH-EMIFZV)
td(RSTL-EMIFHIV)
td(RSTH-EMIFHV)
td(RSTL-EMIFLIV)
td(RSTH-EMIFLV)
td(RSTL-ZHZ)
5
8P + 20E
3P + 4E
6
2E
16E
2E
7
8P + 20E
8
Delay time, RESET low to EMIF high group invalid
Delay time, RESET high to EMIF high group valid
Delay time, RESET low to EMIF low group invalid
Delay time, RESET high to EMIF low group valid
Delay time, RESET low to Z group high impedance
Delay time, RESET high to Z group valid
9
8P + 20E
8P + 20E
8P
10
11
14
15
2E
0
td(RSTH-ZV)
2P
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
(2) E = the EMIF input clock (AECLKIN, CPU/4 clock, or CPU/6 clock) period in ns for EMIFA.
(3) EMIF Z group consists of: AEA[22:3], AED[63:0], ACE[3:0], ABE[7:0], AARE/ASDCAS/ASADS/ASRE, AAWE/ASDWE/ASWE,
AAOE/ASDRAS/ASOE, ASOE3, ASDCKE, and APDT
EMIF high group consists of: AHOLDA (when the corresponding HOLD input is high)
EMIF low group consists of: ABUSREQ; AHOLDA (when the corresponding HOLD input is low)
Z group consists of: HD[31:0] and the muxed EMAC output pins, MDCLK, MDIO, CLKX0, FSX0, DX0, CLKR0, FSR0, TOUT0,
TOUT1, VDAC/GP0[8], GP0[13, 11, 10, 7:0], HR/W, HDS2, HDS1, HCS, HCNTL1, HAS, HCNTL0, HHWIL (16-bit HPI mode only),
HRDY, HINT, VP1D[19:0], and VP2D[19:0].
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CLKOUT4
CLKOUT6
1
RESET
2
4
3
5
AECLKIN
AECLKOUT1
AECLKOUT2
6
7
(A)(B)
EMIF Z Group
9
8
(A)
(A)
EMIF High Group
11
10
EMIF Low Group
14
15
17
(A)(B)
Z Group
16
Boot and Device
Configuration Inputs
(C)
A. EMIF Z group consists of:
AEA[22:3], AED[63:0], ACE[3:0], ABE[7:0], AARE/ASDCAS/ASADS/ASRE, AAWE/ASDWE/ASWE,
and AAOE/ASDRAS/ASOE, ASOE3, ASDCKE, and APDT.
EMIF high group consists of: AHOLDA (when the corresponding HOLD input is high)
EMIF low group consists of: ABUSREQ; AHOLDA (when the corresponding HOLD input is low)
Z group consists of:
HD[31:0] and the muxed EMAC output pins, MDCLK, MDIO, CLKX0, FSX0, DX0, CLKR0, FSR0,
TOUT0, TOUT1, VDAC/GP0[8], GP0[13, 11, 10, 7:0], HR/W, HDS2, HDS1, HCS, HCNTL1, HAS,
HCNTL0, HHWIL (16-bit HPI mode only), HRDY, HINT, VP1D[19:0], and VP2D[19:0].
B. If AEA[22:19], LENDIAN, and HD5 pins are actively driven, care must be taken to ensure no timing contention between parameters
6, 7, 14, 15, 16, and 17.
C. Boot and Device Configurations Inputs (during reset) include: AEA[22:19], LENDIAN, and HD5.
Figure 5-11. Reset Timing
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5.7 Clock PLL
The PLL controller features hardware-configurable PLL multiplier controller, dividers (/2, /4, /6, and /8),
and reset controller. The PLL controller accepts an input clock, as determined by the logic state on the
CLKMODE[1:0] pins, from the CLKIN pin. The resulting clock outputs are passed to the DSP core,
peripherals, and other modules inside the C6000™ DSP.
5.7.1 Clock PLL Device-Specific Information
Most of the internal C64x™ DSP clocks are generated from a single source through the CLKIN pin. This
source clock either drives the PLL, which multiplies the source clock frequency to generate the internal
CPU clock, or bypasses the PLL to become the internal CPU clock.
To use the PLL to generate the CPU clock, the external PLL filter circuit must be properly designed.
Figure 5-12 shows the external PLL circuitry for either x1 (PLL bypass) or other PLL multiply modes.
To minimize the clock jitter, a single clean power supply should power both the C64x™ DSP device and
the external clock oscillator circuit. The minimum CLKIN rise and fall times should also be observed. For
the input clock timing requirements, see the input and output clocks electricals section.
Rise/fall times, duty cycles (high/low pulse durations), and the load capacitance of the external clock
source must meet the DSP requirements in this data sheet (see the electrical characteristics over
recommended ranges of supply voltage and operating case temperature table and the input and output
clocks electricals section).
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3.3 V
CPU Clock
C1
C2
Peripheral Bus, EDMA
Clock
EMI
filter
/2
/8
/4
/6
10 µF 0.1 µF
Timer Internal Clock
PLLV
CLKOUT4, Peripheral Clock
(AUXCLK for McASP),
McBSP Internal Clock
CLKMODE0
CLKOUT6
PLLMULT
CLKMODE1
PLL
x6, x12
00 01 10
CLKIN
PLLCLK
1
0
/4
/2
ECLKIN
AEA[20:19]
EK2RATE
(GBLCTL.[19,18])
EMIF
00 01 10
Internal to DM643
ECLKOUT1 ECLKOUT2
(For the PLL Options, CLKMODE Pins Setup, and PLL Clock Frequency Ranges, see the “TMS320DM643 PLL Multiply Factor
Options, Clock Frequency Ranges, and Typical Lock Time” table.)
NOTES: Place all PLL external components (C1, C2, and the EMI Filter) as close to the C6000 DSP device as possible. For the
best performance, TI recommends that all the PLL external components be on a single side of the board without jumpers,
switches, or components other than the ones shown.
For reduced PLL jitter, maximize the spacing between switching signals and the PLL external components (C1, C2, and
the EMI Filter).
The 3.3-V supply for the EMI filter must be from the same 3.3-V power plane supplying the I/O voltage, D
.
VDD
EMI filter manufacturer TDK part number ACF451832-333, -223, -153, -103. Panasonic part number EXCCET103U.
Figure 5-12. External PLL Circuitry for Either PLL Multiply Modes or x1 (Bypass) Mode
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Table 5-12. TMS320DM643 PLL Multiply Factor Options, Clock Frequency Ranges,
and Typical Lock Time(1) (2)
GDK and ZDK PACKAGES – 23 x 23 mm BGA,
GNZ and ZNZ PACKAGES – 27 x 27 mm BGA
CLKMODE
CLKMODE1 CLKMODE0 (PLL MULTIPLY
FACTORS)
CLKIN
RANGE
(MHz)
CPU CLOCK
FREQUENCY
RANGE (MHz)
TYPICAL
CLKOUT4
RANGE (MHz)
CLKOUT6
RANGE (MHz)
LOCK TIME
(µs)(3)
0
0
1
1
0
1
0
1
Bypass (x1)
x6
30–75
30–75
30–50
–
30–75
180–450
360–600
–
7.5–18.8
45–112.5
90–150
–
5–12.5
30–75
60–100
–
N/A
75
–
x12
Reserved
(1) These clock frequency range values are applicable to a DM643-600 speed device. For -500 device speed values, see the CLKIN timing
requirements table for the specific device speed.
(2) Use external pullup resistors on the CLKMODE pins (CLKMODE1 and CLKMODE0) to set the DM643 device to one of the valid PLL
multiply clock modes (x6 or x12). With internal pulldown resistors on the CLKMODE pins (CLKMODE1, CLKMODE0), the default clock
mode is x1 (bypass).
(3) Under some operating conditions, the maximum PLL lock time may vary by as much as 150% from the specified typical value. For
example, if the typical lock time is specified as 100 µs, the maximum value may be as long as 250 µs.
5.7.2 Clock PLL Electrical Data/Timing (Input and Output Clocks)
Table 5-13. Timing Requirements for CLKIN for –500 Devices(1) (2) (3) (see Figure 5-13)
–500
NO.
PLL MODE x12
PLL MODE x6
x1 (Bypass)
UNIT
MIN
24
MAX
MIN
13.3
MAX
MIN
13.3
MAX
1
2
3
4
5
tc(CLKIN)
tw(CLKINH)
tw(CLKINL)
tt(CLKIN)
Cycle time, CLKIN
33.3
33.3
33.3
ns
ns
ns
ns
ns
Pulse duration, CLKIN high
Pulse duration, CLKIN low
Transition time, CLKIN
Period jitter, CLKIN
0.45C
0.45C
0.45C
0.45C
0.45C
0.45C
5
5
1
tJ(CLKIN)
0.02C
0.02C
0.02C
(1) The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
(2) For more details on the PLL multiplier factors (x6, x12), see the Clock PLL section of this data sheet.
(3) C = CLKIN cycle time in ns. For example, when CLKIN frequency is 50 MHz, use C = 20 ns.
Table 5-14. Timing Requirements for CLKIN for –600 Devices(1) (2) (3) (see Figure 5-13)
–600
NO.
PLL MODE x12
PLL MODE x6
x1 (Bypass)
UNIT
MIN
20
MAX
MIN
13.3
MAX
MIN
13.3
MAX
1
2
3
4
5
tc(CLKIN)
tw(CLKINH)
tw(CLKINL)
tt(CLKIN)
Cycle time, CLKIN
33.3
33.3
33.3
ns
ns
ns
ns
ns
Pulse duration, CLKIN high
Pulse duration, CLKIN low
Transition time, CLKIN
Period jitter, CLKIN
0.45C
0.45C
0.45C
0.45C
0.45C
0.45C
5
5
1
tJ(CLKIN)
0.02C
0.02C
0.02C
(1) The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
(2) For more details on the PLL multiplier factors (x6, x12), see the Clock PLL section of this data sheet.
(3) C = CLKIN cycle time in ns. For example, when CLKIN frequency is 50 MHz, use C = 20 ns.
1
5
4
2
CLKIN
3
4
Figure 5-13. CLKIN Timing
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Table 5-15. Switching Characteristics Over Recommended Operating Conditions for CLKOUT4(1) (2) (3)
(see Figure 5-14)
–500
–600
NO.
PARAMETER
UNIT
CLKMODE = x1, x6, x12
MIN
MAX
1
2
3
tw(CKO4H)
tw(CKO4L)
tt(CKO4)
Pulse duration, CLKOUT4 high
2P – 0.7
2P – 0.7
2P + 0.7
2P + 0.7
1
ns
ns
ns
Pulse duration, CLKOUT4 low
Transition time, CLKOUT4
(1) The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
(2) PH is the high period of CLKIN in ns and PL is the low period of CLKIN in ns.
(3) P = 1/CPU clock frequency in nanoseconds (ns)
3
1
CLKOUT4
2
3
Figure 5-14. CLKOUT4 Timing
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Table 5-16. Switching Characteristics Over Recommended Operating Conditions for CLKOUT6(1) (2) (3)
(see Figure 5-15)
–500
–600
NO.
PARAMETER
UNIT
CLKMODE = x1, x6, x12
MIN
MAX
1
2
3
tw(CKO6H)
tw(CKO6L)
tt(CKO6)
Pulse duration, CLKOUT6 high
3P – 0.7
3P – 0.7
3P + 0.7
3P + 0.7
1
ns
ns
ns
Pulse duration, CLKOUT6 low
Transition time, CLKOUT6
(1) The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
(2) PH is the high period of CLKIN in ns and PL is the low period of CLKIN in ns.
(3) P = 1/CPU clock frequency in nanoseconds (ns)
3
1
CLKOUT6
2
3
Figure 5-15. CLKOUT6 Timing
Table 5-17. Timing Requirements for AECLKIN for EMIFA(1) (2) (3) (see Figure 5-16)
–500
–600
NO.
UNIT
MIN
MAX
1
2
3
4
5
tc(EKI)
tw(EKIH)
tw(EKIL)
tt(EKI)
Cycle time, AECLKIN
6(4)
2.7
2.7
16P
ns
ns
ns
ns
ns
Pulse duration, AECLKIN high
Pulse duration, AECLKIN low
Transition time, AECLKIN
Period jitter, AECLKIN
3
tJ(EKI)
0.02E
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
(2) The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
(3) E = the EMIF input clock (AECLKIN, CPU/4 clock, or CPU/6 clock) period in ns for EMIFA.
(4) Minimum AECLKIN cycle times must be met, even when AECLKIN is generated by an internal clock source. Minimum AECLKIN times
are based on internal logic speed; the maximum useable speed of the EMIF may be lower due to AC timing requirements. On the 600
devices, 133-MHz operation is achievable if the requirements of the EMIF Device Speed section are met. On the 500 devices, 100-MHz
operation is achievable if the requirements of the EMIF Device Speed section are met.
1
5
4
2
AECLKIN
3
4
Figure 5-16. AECLKIN Timing for EMIFA
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Table 5-18. Switching Characteristics Over Recommended Operating Conditions for AECLKOUT1 for the
EMIFA Module(1) (2) (3) (see Figure 5-17)
–500
–600
NO.
PARAMETER
UNIT
MIN
MAX
1
2
3
4
5
tw(EKO1H)
Pulse duration, AECLKOUT1 high
EH – 0.7 EH + 0.7
EL – 0.7 EL + 0.7
1
ns
ns
ns
ns
ns
tw(EKO1L)
Pulse duration, AECLKOUT1 low
tt(EKO1)
Transition time, AECLKOUT1
td(EKIH-EKO1H)
td(EKIL-EKO1L)
Delay time, AECLKIN high to AECLKOUT1 high
Delay time, AECLKIN low to AECLKOUT1 low
1
1
8
8
(1) E = the EMIF input clock (AECLKIN, CPU/4 clock, or CPU/6 clock) period in ns for EMIFA.
(2) The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
(3) EH is the high period of E (EMIF input clock period) in ns and EL is the low period of E (EMIF input clock period) in ns for EMIFA.
AECLKIN
5
2
3
3
1
4
AECLKOUT1
Figure 5-17. AECLKOUT1 Timing for the EMIFA Module
Table 5-19. Switching Characteristics Over Recommended Operating Conditions for AECLKOUT2 for the
EMIFA Module(1) (2) (see Figure 5-18)
–500
–600
NO.
PARAMETER
UNIT
MIN
MAX
1
2
3
4
5
tw(EKO2H)
Pulse duration, AECLKOUT2 high
0.5NE – 0.7
0.5NE – 0.7
0.5NE + 0.7
ns
ns
ns
ns
ns
tw(EKO2L)
Pulse duration, AECLKOUT2 low
0.5NE + 0.7
tt(EKO2)
Transition time, AECLKOUT2
1
8
8
td(EKIH-EKO2H)
td(EKIL-EKO2L)
Delay time, AECLKIN high to AECLKOUT2 high
Delay time, AECLKIN low to AECLKOUT2 low
1
1
(1) The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
(2) E = the EMIF input clock (AECLKIN, CPU/4 clock, or CPU/6 clock) period in ns for EMIFA. N = the EMIF input clock divider; N = 1, 2,
or 4.
AECLKIN
5
2
3
3
1
4
AECLKOUT2
Figure 5-18. AECLKOUT2 Timing for the EMIFA Module
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5.8 External Memory Interface (EMIIF)
EMIF supports a glueless interface to a variety of external devices, including:
•
•
•
•
Pipelined synchronous-burst SRAM (SBSRAM)
Synchronous DRAM (SDRAM)
Asynchronous devices, including SRAM, ROM, and FIFOs
An external shared-memory device
5.8.1 EMIF Device-Specific Information
EMIF Device Speed
The rated EMIF speed of these devices only applies to the SDRAM interface when in a system that meets
the following requirements:
•
•
•
•
•
1 chip-enable (CE) space (maximum of 2 chips) of SDRAM connected to EMIF
up to 1 CE space of buffers connected to EMIF
EMIF trace lengths between 1 and 3 inches
166-MHz SDRAM for 133-MHz operation
143-MHz SDRAM for 100-MHz operation
Other configurations may be possible, but timing analysis must be done to verify all AC timings are met.
Verification of AC timings is mandatory when using configurations other than those specified above. TI
recommends utilizing I/O buffer information specification (IBIS) to analyze all AC timings.
To properly use IBIS models to attain accurate timing analysis for a given system, see the Using IBIS
Models for Timing Analysis application report (literature number SPRA839).
To maintain signal integrity, serial termination resistors should be inserted into all EMIF output signal lines
(see the Terminal Functions table for the EMIF output signals).
For more detailed information on the DM643 EMIF peripheral, see the TMS320C6000 DSP External
Memory Interface (EMIF) Reference Guide (literature number SPRU266).
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5.8.2 EMIF Peripheral Register Description(s)
Table 5-20. EMIFA Registers
HEX ADDRESS RANGE
0180 0000
ACRONYM
GBLCTL
CECTL1
CECTL0
–
REGISTER NAME
EMIFA global control
COMMENTS
0180 0004
EMIFA CE1 space control
EMIFA CE0 space control
Reserved
0180 0008
0180 000C
0180 0010
CECTL2
CECTL3
SDCTL
SDTIM
SDEXT
–
EMIFA CE2 space control
EMIFA CE3 space control
EMIFA SDRAM control
0180 0014
0180 0018
0180 001C
EMIFA SDRAM refresh control
EMIFA SDRAM extension
Reserved
0180 0020
0180 0024 – 0180 003C
0180 0040
PDTCTL
CESEC1
CESEC0
–
Peripheral device transfer (PDT) control
EMIFA CE1 space secondary control
EMIFA CE0 space secondary control
Reserved
0180 0044
0180 0048
0180 004C
0180 0050
CESEC2
CESEC3
–
EMIFA CE2 space secondary control
EMIFA CE3 space secondary control
Reserved
0180 0054
0180 0058 – 0183 FFFF
5.8.3 EMIF Electrical Data/Timing
5.8.3.1 Asynchronous Memory Timing
Table 5-21. Timing Requirements for Asynchronous Memory Cycles for EMIFA Module(1) (2)
(see Figure 5-19 and Figure 5-20)
–500
–600
NO.
UNIT
MIN MAX
3
4
6
7
tsu(EDV-AREH)
th(AREH-EDV)
tsu(ARDY-EKO1H)
th(EKO1H-ARDY)
Setup time, AEDx valid before AARE high
Hold time, AEDx valid after AARE high
6.5
1
ns
ns
ns
ns
Setup time, AARDY valid before AECLKOUTx high
Hold time, AARDY valid after AECLKOUTx high
3
2.5
(1) To ensure data setup time, simply program the strobe width wide enough. AARDY is internally synchronized. The AARDY signal is only
recognized two cycles before the end of the programmed strobe time and while AARDY is low, the strobe time is extended
cycle-by-cycle. When AARDY is recognized low, the end of the strobe time is two cycles after AARDY is recognized high. To use
AARDY as an asynchronous input, the pulse width of the AARDY signal should be wide enough (e.g., pulse width = 2E) to ensure setup
and hold time is met.
(2) RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters
are programmed via the EMIF CE space control registers.
Table 5-22. Switching Characteristics Over Recommended Operating Conditions for Asynchronous
Memory Cycles for EMIFA Module(1) (2) (3) (see Figure 5-19 and Figure 5-20)
–500
–600
NO.
PARAMETER
UNIT
MIN
MAX
1
2
tosu(SELV-AREL)
toh(AREH-SELIV)
Output setup time, select signals valid to AARE low
Output hold time, AARE high to select signals invalid
RS * E – 1.8
RH * E – 1.9
ns
ns
(1) RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters
are programmed via the EMIF CE space control registers.
(2) E = AECLKOUT1 period in ns for EMIFA
(3) Select signals for EMIFA include: ACEx, ABE[7:0], AEA[22:3], AAOE; and for EMIFA writes, include AED[63:0].
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Table 5-22. Switching Characteristics Over Recommended Operating Conditions for Asynchronous
Memory Cycles for EMIFA Module (see Figure 5-19 and Figure 5-20) (continued)
–500
–600
NO.
PARAMETER
UNIT
MIN
1
MAX
5
8
td(EKO1H-AREV)
tosu(SELV-AWEL)
toh(AWEH-SELIV)
td(EKO1H-AWEV)
Delay time, AECLKOUTx high to AARE valid
Output setup time, select signals valid to AAWE low
Output hold time, AAWE high to select signals invalid
Delay time, AECLKOUTx high to AAWE valid
7
ns
ns
ns
ns
WS * E – 2.0
WH * E – 2.5
1.3
9
10
7.1
Setup = 2
Strobe = 3
Not Ready
Hold = 2
AECLKOUTx
2
2
1
1
1
ACEx
ABE[7:0]
BE
2
AEA[22:3]
Address
3
4
2
AED[63:0]
1
5
Read Data
(A)
AAOE/ASDRAS/ASOE
5
(A)
AARE/ASDCAS/ASADS/ASRE
(A)
AAWE/ASDWE/ASWE
7
7
6
6
AARDY
A. AAOE/ASDRAS/ASOE, AARE/ASDCAS/ASADS/ASRE, and AAWE/ASDWE/ASWE operate as AAOE (identified under select signals),
AARE, and AAWE, respectively, during asynchronous memory accesses.
Figure 5-19. Asynchronous Memory Read Timing for EMIFA
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Setup = 2
Hold = 2
Strobe = 3
Not Ready
AECLKOUTx
ACEx
9
9
8
8
8
8
ABE[7:0]
BE
9
9
AEA[22:3]
Address
Write Data
AED[63:0]
(A)
AAOE/ASDRAS/ASOE
(A)
AARE/ASDCAS/ASADS/ASRE
10
10
(A)
AAWE/ASDWE/ASWE
7
7
6
6
AARDY
A. AAOE/ASDRAS/ASOE, AARE/ASDCAS/ASADS/ASRE, and AAWE/ASDWE/ASWE operate as AAOE (identified under select signals), AARE,
and AAWE, respectively, during asynchronous memory accesses.
Figure 5-20. Asynchronous Memory Write Timing for EMIFA
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5.8.3.2 Programmable Synchronous Interface Timing
Table 5-23. Timing Requirements for Programmable Synchronous Interface Cycles for EMIFA Module
(see Figure 5-21)
–500
MIN
–600
MIN
NO.
UNIT
MAX
MAX
6
7
tsu(EDV-EKOxH)
th(EKOxH-EDV)
Setup time, read AEDx valid before AECLKOUTx high
Hold time, read AEDx valid after AECLKOUTx high
3.1
1.8
2
ns
ns
1.5
Table 5-24. Switching Characteristics Over Recommended Operating Conditions for Programmable
Synchronous Interface Cycles for EMIFA Module(1) (see Figure 5-21–Figure 5-23)
–500
MIN
–600
MIN
NO.
PARAMETER
UNIT
MAX
6.4
MAX
4.9
1
2
td(EKOxH-CEV)
td(EKOxH-BEV)
td(EKOxH-BEIV)
td(EKOxH-EAV)
td(EKOxH-EAIV)
td(EKOxH-ADSV)
td(EKOxH-OEV)
td(EKOxH-EDV)
td(EKOxH-EDIV)
td(EKOxH-WEV)
Delay time, AECLKOUTx high to ACEx valid
Delay time, AECLKOUTx high to ABEx valid
Delay time, AECLKOUTx high to ABEx invalid
Delay time, AECLKOUTx high to AEAx valid
Delay time, AECLKOUTx high to AEAx invalid
Delay time, AECLKOUTx high to ASADS/ASRE valid
Delay time, AECLKOUTx high to ASOE valid
Delay time, AECLKOUTx high to AEDx valid
Delay time, AECLKOUTx high to AEDx invalid
Delay time, AECLKOUTx high to ASWE valid
1.1
1.1
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
6.4
4.9
3
1.1
1.1
4
6.4
4.9
5
1.1
1.1
1.1
1.1
1.1
1.1
8
6.4
6.4
6.4
4.9
4.9
4.9
9
10
11
12
1.1
1.1
1.1
1.1
6.4
4.9
(1) The following parameters are programmable via the EMIF CE Space Secondary Control register (CExSEC):
•
•
•
Read latency (SYNCRL): 0-, 1-, 2-, or 3-cycle read latency
Write latency (SYNCWL): 0-, 1-, 2-, or 3-cycle write latency
ACEx assertion length (CEEXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has
been issued (CEEXT = 0). For synchronous FIFO interface with glue, ACEx is active when ASOE is active (CEEXT = 1).
Function of ASADS/ASRE (RENEN): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE acts as ASADS with deselect
cycles (RENEN = 0). For FIFO interface, ASADS/ASRE acts as ASRE with NO deselect cycles (RENEN = 1).
Synchronization clock (SNCCLK): Synchronized to AECLKOUT1 or AECLKOUT2
•
•
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READ latency = 2
AECLKOUTx
1
2
1
ACEx
3
ABE[7:0]
BE1
BE2
BE3
BE4
4
5
AEA[22:3]
EA1
8
EA2
EA3
EA4
6
7
AED[63:0]
(C)
Q1
Q2
Q3
Q4
8
9
AARE/ASDCAS/ASADS/ASRE
9
(C)
(C)
AAOE/ASDRAS/ASOE
AAWE/ASDWE/ASWE
A. The read latency and the length of ACEx assertion are programmable via the SYNCRL and CEEXT fields, respectively, in the EMIFA CE
Space Secondary Control register (CExSEC). In this figure, SYNCRL = 2 and CEEXT = 0.
B. The following parameters are programmable via the EMIF CE Space Secondary Control register (CExSEC):
−
−
−
Read latency (SYNCRL): 0-, 1-, 2-, or 3-cycle read latency
Write latency (SYNCWL): 0-, 1-, 2-, or 3-cycle write latency
ACEx assertion length (CEEXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has been
issued (CEEXT = 0). For synchronous FIFO interface with glue, ACEx is active when ASOE is active (CEEXT = 1).
Function of ASADS/ASRE (RENEN): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE acts as ASADS with deselect cycles
(RENEN = 0). For FIFO interface, ASADS/ASRE acts as ASRE with NO deselect cycles (RENEN = 1).
Synchronization clock (SNCCLK): Synchronized to AECLKOUT1 or AECLKOUT2
−
−
C. AARE/ASDCAS/ASADS/ASRE, AAOE/ASDRAS/ASOE, and AAWE/ASDWE/ASWE operate as ASADS/ASRE, ASOE, and ASWE, respectively,
during programmable synchronous interface accesses.
Figure 5-21. Programmable Synchronous Interface Read Timing for EMIFA (With Read Latency = 2) (A)(B)
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AECLKOUTx
1
2
1
3
ACEx
ABE[7:0]
AEA[22:3]
BE1
BE2
EA2
Q2
BE3
EA3
Q3
BE4
EA4
Q4
5
4
EA1
10
Q1
10
11
AED[63:0]
8
8
(C)
AARE/ASDCAS/ASADS/ASRE
(C)
AAOE/ASDRAS/ASOE
12
12
(C)
AAWE/ASDWE/ASWE
A. The write latency and the length of ACEx assertion are programmable via the SYNCWL and CEEXT fields, respectively, in the EMIFA CE
Space Secondary Control register (CExSEC). In this figure, SYNCWL = 0 and CEEXT = 0.
B. The following parameters are programmable via the EMIF CE Space Secondary Control register (CExSEC):
−
−
−
Read latency (SYNCRL): 0-, 1-, 2-, or 3-cycle read latency
Write latency (SYNCWL): 0-, 1-, 2-, or 3-cycle write latency
ACEx assertion length (CEEXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has
been issued (CEEXT = 0). For synchronous FIFO interface with glue, ACEx is active when ASOE is active (CEEXT = 1).
Function of ASADS/ASRE (RENEN): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE acts as ASADS with deselect
cycles(RENEN = 0). For FIFO interface, ASADS/ASRE acts as ASRE with NO deselect cycles (RENEN = 1).
Synchronization clock (SNCCLK): Synchronized to AECLKOUT1 or AECLKOUT2
−
−
C. AARE/ASDCAS/ASADS/ASRE, AAOE/ASDRAS/ASOE, and AAWE/ASDWE/ASWE operate as ASADS/ASRE, ASOE, and ASWE,
respectively, during programmable synchronous interface accesses.
Figure 5-22. Programmable Synchronous Interface Write Timing for EMIFA (With Write Latency = 0)(A)(B)
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Write
Latency =
(B)
1
AECLKOUTx
1
1
3
ACEx
2
ABE[7:0]
BE1
BE2
BE3
EA3
Q2
BE4
EA4
Q3
5
4
AEA[22:3]
EA1
10
EA2
10
11
8
AED[63:0]
(C)
Q1
Q4
8
AARE/ASDCAS/ASADS/ASRE
(C)
AAOE/ASDRAS/ASOE
12
12
(C)
AAWE/ASDWE/ASWE
A. The write latency and the length of ACEx assertion are programmable via the SYNCWL and CEEXT fields, respectively, in the EMIFA CE
Space Secondary Control register (CExSEC). In this figure, SYNCWL = 0 and CEEXT = 0.
B. The following parameters are programmable via the EMIF CE Space Secondary Control register (CExSEC):
−
−
−
Read latency (SYNCRL): 0-, 1-, 2-, or 3-cycle read latency
Write latency (SYNCWL): 0-, 1-, 2-, or 3-cycle write latency
ACEx assertion length (CEEXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has
been issued (CEEXT = 0). For synchronous FIFO interface with glue, ACEx is active when ASOE is active (CEEXT = 1).
Function of ASADS/ASRE (RENEN): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE acts as ASADS with deselect
cycles (RENEN = 0). For FIFO interface, ASADS/ASRE acts as ASRE with NO deselect cycles (RENEN = 1).
Synchronization clock (SNCCLK): Synchronized to AECLKOUT1 or AECLKOUT2
−
−
C. AARE/ASDCAS/ASADS/ASRE, AAOE/ASDRAS/ASOE, and AAWE/ASDWE/ASWE operate as ASADS/ASRE, ASOE, and ASWE,
respectively, during programmable synchronous interface accesses.
Figure 5-23. Programmable Synchronous Interface Write Timing for EMIFA (With Write Latency = 1) (A)(B)
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5.8.3.3 Synchronous DRAM Timing
Table 5-25. Timing Requirements for Synchronous DRAM Cycles for EMIFA Module (see Figure 5-24)
–500
MIN MAX
2.1
–600
MIN MAX
0.6
NO.
UNIT
6
7
tsu(EDV-EKO1H)
th(EKO1H-EDV)
Setup time, read AEDx valid before AECLKOUTx high
Hold time, read AEDx valid after AECLKOUTx high
ns
ns
2.8
2.1
Table 5-26. Switching Characteristics Over Recommended Operating Conditions for Synchronous DRAM
Cycles for EMIFA Module (see Figure 5-24–Figure 5-31)
–500
MIN
–600
MIN
NO.
PARAMETER
UNIT
MAX
6.4
MAX
4.9
1
2
td(EKO1H-CEV)
td(EKO1H-BEV)
td(EKO1H-BEIV)
td(EKO1H-EAV)
td(EKO1H-EAIV)
td(EKO1H-CASV)
td(EKO1H-EDV)
td(EKO1H-EDIV)
td(EKO1H-WEV)
td(EKO1H-RAS)
td(EKO1H-ACKEV)
td(EKO1H-PDTV)
Delay time, AECLKOUTx high to ACEx valid
Delay time, AECLKOUTx high to ABEx valid
Delay time, AECLKOUTx high to ABEx invalid
Delay time, AECLKOUTx high to AEAx valid
Delay time, AECLKOUTx high to AEAx invalid
Delay time, AECLKOUTx high to ASDCAS valid
Delay time, AECLKOUTx high to AEDx valid
Delay time, AECLKOUTx high to AEDx invalid
Delay time, AECLKOUTx high to ASDWE valid
Delay time, AECLKOUTx high to ASDRAS valid
Delay time, AECLKOUTx high to ASDCKE valid
Delay time, AECLKOUTx high to APDT valid
1.3
1.3
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
6.4
4.9
3
1.3
1.3
4
6.4
4.9
5
1.3
1.3
1.3
1.3
8
6.4
6.4
4.9
4.9
9
10
11
12
13
14
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
6.4
6.4
6.4
6.4
4.9
4.9
4.9
4.9
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READ
AECLKOUTx
ACEx
1
4
1
2
3
ABE[7:0]
BE1
BE2
BE3
BE4
5
5
5
Bank
AEA[22:14]
AEA[12:3]
4
Column
4
AEA13
6
7
D2
AED[63:0]
(A)
D1
D3
D4
AAOE/ASDRAS/ASOE
8
8
(A)
AARE/ASDCAS/ASADS/ASRE
(A)
AAWE/ASDWE/ASWE
14
14
(B)
APDT
A. AARE/ASDCAS/ASADS/ASRE, AAWE/ASDWE/ASWE, and AAOE/ASDRAS/ASOE operate as ASDCAS, ASDWE, and ASDRAS,
respectively, during SDRAM accesses.
B. APDT signal is only asserted when the EDMA is in PDT mode (set the PDTS bit to 1 in the EDMA options parameter RAM). For APDT read,
data is not latched into EMIF. The PDTRL field in the PDT control register (PDTCTL) configures the latency of the APDT signal with respect to
the data phase of a read transaction. The latency of the APDT signal for a read can be programmed to 0, 1, 2, or 3 by setting PDTRL to 00, 01,
10, or 11, respectively. PDTRL equals 00 (zero latency) in this figure.
Figure 5-24. SDRAM Read Command (CAS Latency 3) for EMIFA
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WRITE
AECLKOUTx
ACEx
1
2
4
4
4
9
2
4
5
5
5
9
3
ABE[7:0]
BE1
BE2
BE3
BE4
Bank
AEA[22:14]
Column
AEA[12:3]
AEA13
10
AED[63:0]
D1
D2
D3
D4
(A)
AAOE/ASDRAS/ASOE
8
8
(A)
AARE/ASDCAS/ASADS/ASRE
11
14
11
(A)
AAWE/ASDWE/ASWE
14
(B)
APDT
A. AARE/ASDCAS/ASADS/ASRE, AAWE/ASDWE/ASWE, and AAOE/ASDRAS/ASOE operate as ASDCAS, ASDWE, and ASDRAS,
respectively, during SDRAM accesses.
B. APDT signal is only asserted when the EDMA is in PDT mode (set the PDTD bit to 1 in the EDMA options parameter RAM). For APDT write,
data is not driven (in High-Z). The PDTWL field in the PDT control register (PDTCTL) configures the latency of the APDT signal with respect to
the data phase of a write transaction. The latency of the APDT signal for a write transaction can be programmed to 0, 1, 2, or 3 by setting
PDTWL to 00, 01, 10, or 11, respectively. PDTWL equals 00 (zero latency) in this figure.
Figure 5-25. SDRAM Write Command for EMIFA
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ACTV
AECLKOUTx
1
4
1
5
ACEx
ABE[7:0]
Bank Activate
AEA[22:14]
AEA[12:3]
4
5
5
Row Address
4
Row Address
AEA13
AED[63:0]
12
12
(A)
AAOE/ASDRAS/ASOE
(A)
AARE/ASDCAS/ASADS/ASRE
(A)
AAWE/ASDWE/ASWE
A. AARE/ASDCAS/ASADS/ASRE, AAWE/ASDWE/ASWE, and AAOE/ASDRAS/ASOE operate as ASDCAS, ASDWE, and ASDRAS,
respectively, during SDRAM accesses.
Figure 5-26. SDRAM ACTV Command for EMIFA
DCAB
AECLKOUTx
1
1
ACEx
ABE[7:0]
AEA[22:14, 12:3]
4
12
11
5
12
11
AEA13
AED[63:0]
(A)
AAOE/ASDRAS/ASOE
(A)
AARE/ASDCAS/ASADS/ASRE
(A)
AAWE/ASDWE/ASWE
A. AARE/ASDCAS/ASADS/ASRE, AAWE/ASDWE/ASWE, and AAOE/ASDRAS/ASOE operate as ASDCAS, ASDWE, and ASDRAS,
respectively, during SDRAM accesses.
Figure 5-27. SDRAM DCAB Command for EMIFA
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DEAC
AECLKOUTx
1
1
ACEx
ABE[7:0]
4
5
AEA[22:14]
AEA[12:3]
Bank
4
5
AEA13
AED[63:0]
12
11
12
11
(A)
AAOE/ASDRAS/ASOE
(A)
AARE/ASDCAS/ASADS/ASRE
(A)
AAWE/ASDWE/ASWE
A. AARE/ASDCAS/ASADS/ASRE, AAWE/ASDWE/ASWE, and AAOE/ASDRAS/ASOE operate as ASDCAS, ASDWE, and ASDRAS, respectively,
during SDRAM accesses.
Figure 5-28. SDRAM DEAC Command for EMIFA
REFR
AECLKOUTx
1
1
ACEx
ABE[7:0]
AEA[22:14, 12:3]
AEA13
AED[63:0]
12
8
12
8
(A)
AAOE/ASDRAS/ASOE
(A)
AARE/ASDCAS/ASADS/ASRE
(A)
AAWE/ASDWE/ASWE
A. AARE/ASDCAS/ASADS/ASRE, AAWE/ASDWE/ASWE, and AAOE/ASDRAS/ASOE operate as ASDCAS, ASDWE, and ASDRAS,
respectively, during SDRAM accesses.
Figure 5-29. SDRAM REFR Command for EMIFA
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MRS
AECLKOUTx
1
4
1
5
ACEx
ABE[7:0]
AEA[22:3]
AED[63:0]
MRS value
12
8
12
8
(A)
AAOE/ASDRAS/ASOE
(A)
AARE/ASDCAS/ASADS/ASRE
11
11
(A)
AAWE/ASDWE/ASWE
A. AARE/ASDCAS/ASADS/ASRE, AAWE/ASDWE/ASWE, and AAOE/ASDRAS/ASOE operate as ASDCAS, ASDWE, and ASDRAS,
respectively, during SDRAM accesses.
Figure 5-30. SDRAM MRS Command for EMIFA
≥ TRAS cycles
End Self-Refresh
Self Refresh
AECLKOUTx
ACEx
ABE[7:0]
AEA[22:14, 12:3]
AEA13
AED[63:0]
(A)
AAOE/ASDRAS/ASOE
(A)
AARE/ASDCAS/ASADS/ASRE
(A)
AAWE/ASDWE/ASWE
13
13
ASDCKE
A. AARE/ASDCAS/ASADS/ASRE, AAWE/ASDWE/ASWE, and AAOE/ASDRAS/ASOE operate as ASDCAS, ASDWE, and ASDRAS,
respectively, during SDRAM accesses.
Figure 5-31. SDRAM Self-Refresh Timing for EMIFA
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5.8.3.4 HOLD/HOLDA Timing
Table 5-27. Timing Requirements for the HOLD/HOLDA Cycles for EMIFA Module(1) (see Figure 5-32)
–500
MIN MAX
E
–600
MIN MAX
E
NO.
UNIT
3
th(HOLDAL-HOLDL)
Hold time, HOLD low after HOLDA low
ns
(1) E = the EMIF input clock (ECLKIN, CPU/4 clock, or CPU/6 clock) period in ns for EMIFA.
Table 5-28. Switching Characteristics Over Recommended Operating Conditions for the HOLD/HOLDA
Cycles for EMIFA Module(1) (2) (3) (see Figure 5-32)
–500
MIN
–600
MIN
NO.
PARAMETER
UNIT
MAX
MAX
(4)
(4)
1
2
4
5
6
7
td(HOLDL-EMHZ)
td(EMHZ-HOLDAL)
td(HOLDH-EMLZ)
td(EMLZ-HOLDAH)
td(HOLDL-EKOHZ)
td(HOLDH-EKOLZ)
Delay time, HOLD low to EMIFA Bus high impedance
Delay time, EMIF Bus high impedance to HOLDA low
Delay time, HOLD high to EMIF Bus low impedance
Delay time, EMIFA Bus low impedance to HOLDA high
Delay time, HOLD low to AECLKOUTx high impedance
Delay time, HOLD high to AECLKOUTx low impedance
2E
0
2E
0
ns
ns
ns
ns
ns
ns
2E
7E
2E
7E
2E
0
2E
0
2E
(4)
2E
(4)
2E
2E
2E
2E
7E
7E
(1) E = the EMIF input clock (ECLKIN, CPU/4 clock, or CPU/6 clock) period in ns for EMIFA.
(2) EMIFA Bus consists of: ACE[3:0], ABE[7:0], AED[63:0], AEA[22:3], AARE/ASDCAS/ASADS/ASRE, AAOE/ASDRAS/ASOE, and
AAWE/ASDWE/ASWE , ASDCKE, ASOE3, and APDT.
(3) The EKxHZ bits in the EMIF Global Control register (GBLCTL) determine the state of the ECLKOUTx signals during HOLDA. If EKxHZ =
0, ECLKOUTx continues clocking during Hold mode. If
EKxHZ = 1, ECLKOUTx goes to high impedance during Hold mode, as shown in Figure 5-32.
(4) All pending EMIF transactions are allowed to complete before HOLDA is asserted. If no bus transactions are occurring, then the
minimum delay time can be achieved. Also, bus hold can be indefinitely delayed by setting NOHOLD = 1.
External Requestor
DSP Owns Bus
DSP Owns Bus
Owns Bus
3
HOLD
2
5
HOLDA
1
4
7
(A)
EMIF Bus
DM643
DM643
(B)
AECLKOUTx
(EKxHZ = 0)
6
(B)
AECLKOUTx
(EKxHZ = 1)
A. EMIFA Bus consists of: ACE[3:0], ABE[7:0], AED[63:0], AEA[22:3], AARE/ASDCAS/ASADS/ASRE, AAOE/ASDRAS/ASOE,
and AAWE/ASDWE/ASWE, ASDCKE, ASOE3, and APDT.
B. The EKxHZ bits in the EMIF Global Control register (GBLCTL) determine the state of the ECLKOUTx signals during HOLDA. If
EKxHZ = 0, ECLKOUTx continues clocking during Hold mode. If EKxHZ = 1, ECLKOUTx goes to high impedance during Hold
mode, as shown in this figure.
Figure 5-32. HOLD/HOLDA Timing for EMIFA
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5.8.3.5 BUSREQ Timing
Table 5-29. Switching Characteristics Over Recommended Operating Conditions for the BUSREQ Cycles
for EMIFA Module (see Figure 5-33)
–500
MIN
0.6
–600
MIN
NO.
PARAMETER
UNIT
MAX
MAX
1
td(AEKO1H-ABUSRV)
Delay time, AECLKOUTx high to ABUSREQ valid
7.1
1
5.5
ns
AECLKOUTx
1
1
ABUSREQ
Figure 5-33. BUSREQ Timing for EMIFA
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5.9 Multichannel Audio Serial Port (McASP0) Peripheral
The McASP functions as a general-purpose audio serial port optimized for the needs of multichannel
audio applications. The McASP is useful for time-division multiplexed (TDM) stream, Inter-Integrated
Sound (I2S) protocols, and intercomponent digital audio interface transmission (DIT).
5.9.1 McASP0 Device-Specific Information
The TMS320DM643 device includes one multichannel audio serial port (McASP) interface peripheral
(McASP0). The McASP is a serial port optimized for the needs of multichannel audio applications.
The McASP consists of a transmit and receive section. These sections can operate completely
independently with different data formats, separate master clocks, bit clocks, and frame syncs or
alternatively, the transmit and receive sections may be synchronized. The McASP module also includes a
pool of 16 shift registers that may be configured to operate as either transmit data, receive data, or
general-purpose I/O (GPIO).
The transmit section of the McASP can transmit data in either a time-division-multiplexed (TDM)
synchronous serial format or in a digital audio interface (DIT) format where the bit stream is encoded for
S/PDIF, AES-3, IEC-60958, CP-430 transmission. The receive section of the McASP supports the TDM
synchronous serial format.
The McASP can support one transmit data format (either a TDM format or DIT format) and one receive
format at a time. All transmit shift registers use the same format and all receive shift registers use the
same format. However, the transmit and receive formats need not be the same.
Both the transmit and receive sections of the McASP also support burst mode which is useful for
non-audio data (for example, passing control information between two DSPs).
The McASP peripheral has additional capability for flexible clock generation, and error detection/handling,
as well as error management.
For more detailed information on and the functionality of the McASP peripheral, see the TMS320C6000
DSP Multichannel Audio Serial Port (McASP) Reference Guide (literature number SPRU041).
5.9.1.1 McASP Block Diagram
Figure 5-34 illustrates the major blocks along with external signals of the TMS320DM643 McASP0
peripheral; and shows the 8 serial data [AXR] pins. The McASP also includes full general-purpose I/O
(GPIO) control, so any pins not needed for serial transfers can be used for general-purpose I/O.
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McASP0
Transmit
Frame Sync
Generator
DIT
RAM
AFSX0
Transmit
Clock Check
(High-
Transmit
Clock
Generator
AHCLKX0
ACLKX0
Frequency)
AMUTE0
Error
Detect
AMUTEIN0
Receive
Clock Check
(High-
Receive
Clock
Generator
AHCLKR0
ACLKR0
Frequency)
Transmit
Data
Formatter
Receive
Frame Sync
Generator
AFSR0
Serializer 0
AXR0[0]
AXR0[1]
AXR0[2]
AXR0[3]
AXR0[4]
AXR0[5]
AXR0[6]
AXR0[7]
Serializer 1
Serializer 2
Serializer 3
Serializer 4
Serializer 5
Serializer 6
Serializer 7
Receive
Data
Formatter
GPIO
Control
Figure 5-34. McASP0 Configuration
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5.9.2 McASP0 Peripheral Register Description(s)
Table 5-30. McASP0 Control Registers
HEX ADDRESS RANGE
01B4 C000
ACRONYM
REGISTER NAME
PID
PWRDEMU
–
Peripheral Identification register [Register value: 0x0010 0101]
01B4 C004
Power down and emulation management register
01B4 C008
Reserved
01B4 C00C
–
Reserved
01B4 C010
PFUNC
PDIR
Pin function register
01B4 C014
Pin direction register
01B4 C018
PDOUT
PDIN/PDSET
PDCLR
–
Pin data out register
01B4 C01C
Pin data in / data set registerRead returns: PDINWrites affect: PDSET
Pin data clear register
01B4 C020
01B4 C024 – 01B4 C040
01B4 C044
Reserved
GBLCTL
AMUTE
DLBCTL
DITCTL
–
Global control register
01B4 C048
Mute control register
01B4 C04C
Digital Loop-back control register
DIT mode control register
Reserved
01B4 C050
01B4 C054 – 01B4 C05C
Alias of GBLCTL containing only Receiver Reset bits, allows transmit to be reset
independently from receive.
01B4 C060
RGBLCTL
01B4 C064
01B4 C068
RMASK
RFMT
Receiver format UNIT bit mask register
Receive bit stream format register
Receive frame sync control register
Receive clock control register
High-frequency receive clock control register
Receive TDM slot 0–31 register
Receiver interrupt control register
Status register – Receiver
01B4 C06C
AFSRCTL
ACLKRCTL
AHCLKRCTL
RTDM
01B4 C070
01B4 C074
01B4 C078
01B4 C07C
RINTCTL
RSTAT
01B4 C080
01B4 C084
RSLOT
Current receive TDM slot register
Receiver clock check control register
Reserved
01B4 C088
RCLKCHK
–
01B4 C08C – 01B4 C09C
Alias of GBLCTL containing only Transmitter Reset bits, allows transmit to be reset
independently from receive.
01B4 C0A0
XGBLCTL
01B4 C0A4
01B4 C0A8
01B4 C0AC
01B4 C0B0
01B4 C0B4
01B4 C0B8
01B4 C0BC
01B4 C0C0
01B4 C0C4
01B4 C0C8
XMASK
XFMT
Transmit format UNIT bit mask register
Transmit bit stream format register
Transmit frame sync control register
Transmit clock control register
AFSXCTL
ACLKXCTL
AHCLKXCTL
XTDM
High-frequency Transmit clock control register
Transmit TDM slot 0–31 register
Transmit interrupt control register
Status register – Transmitter
XINTCTL
XSTAT
XSLOT
Current transmit TDM slot
XCLKCHK
Transmit clock check control register
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Table 5-30. McASP0 Control Registers (continued)
HEX ADDRESS RANGE
01B4 C0CC – 01B4 C0FC
01B4 C100
ACRONYM
–
REGISTER NAME
Reserved
DITCSRA0
DITCSRA1
DITCSRA2
DITCSRA3
DITCSRA4
DITCSRA5
DITCSRB0
DITCSRB1
DITCSRB2
DITCSRB3
DITCSRB4
DITCSRB5
DITUDRA0
DITUDRA1
DITUDRA2
DITUDRA3
DITUDRA4
DITUDRA5
DITUDRB0
DITUDRB1
DITUDRB2
DITUDRB3
DITUDRB4
DITUDRB5
–
Left (even TDM slot) channel status register file
Left (even TDM slot) channel status register file
Left (even TDM slot) channel status register file
Left (even TDM slot) channel status register file
Left (even TDM slot) channel status register file
Left (even TDM slot) channel status register file
Right (odd TDM slot) channel status register file
Right (odd TDM slot) channel status register file
Right (odd TDM slot) channel status register file
Right (odd TDM slot) channel status register file
Right (odd TDM slot) channel status register file
Right (odd TDM slot) channel status register file
Left (even TDM slot) user data register file
Left (even TDM slot) user data register file
Left (even TDM slot) user data register file
Left (even TDM slot) user data register file
Left (even TDM slot) user data register file
Left (even TDM slot) user data register file
Right (odd TDM slot) user data register file
Right (odd TDM slot) user data register file
Right (odd TDM slot) user data register file
Right (odd TDM slot) user data register file
Right (odd TDM slot) user data register file
Right (odd TDM slot) user data register file
Reserved
01B4 C104
01B4 C108
01B4 C10C
01B4 C110
01B4 C114
01B4 C118
01B4 C11C
01B4 C120
01B4 C124
01B4 C128
01B4 C12C
01B4 C130
01B4 C134
01B4 C138
01B4 C13C
01B4 C140
01B4 C144
01B4 C148
01B4 C14C
01B4 C150
01B4 C154
01B4 C158
01B4 C15C
01B4 C160 – 01B4 C17C
01B4 C180
SRCTL0
SRCTL1
SRCTL2
SRCTL3
SRCTL4
SRCTL5
SRCTL6
SRCTL7
–
Serializer 0 control register
01B4 C184
Serializer 1 control register
01B4 C188
Serializer 2 control register
01B4 C18C
Serializer 3 control register
01B4 C190
Serializer 4 control register
01B4 C194
Serializer 5 control register
01B4 C198
Serializer 6 control register
01B4 C19C
Serializer 7 control register
01B4 C1A0 – 01B4 C1FC
01B4 C200
Reserved
XBUF0
Transmit Buffer for Serializer 0
01B4 C204
XBUF1
Transmit Buffer for Serializer 1
01B4 C208
XBUF2
Transmit Buffer for Serializer 2
01B4 C20C
XBUF3
Transmit Buffer for Serializer 3
01B4 C210
XBUF4
Transmit Buffer for Serializer 4
01B4 C214
XBUF5
Transmit Buffer for Serializer 5
01B4 C218
XBUF6
Transmit Buffer for Serializer 6
01B4 C21C
XBUF7
Transmit Buffer for Serializer 7
01B4 C220 – 01B4 C27C
01B4 C280
–
Reserved
RBUF0
Receive Buffer for Serializer 0
01B4 C284
RBUF1
Receive Buffer for Serializer 1
01B4 C288
RBUF2
Receive Buffer for Serializer 2
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Table 5-30. McASP0 Control Registers (continued)
HEX ADDRESS RANGE
01B4 C28C
ACRONYM
RBUF3
RBUF4
RBUF5
RBUF6
RBUF7
–
REGISTER NAME
Receive Buffer for Serializer 3
Receive Buffer for Serializer 4
Receive Buffer for Serializer 5
Receive Buffer for Serializer 6
Receive Buffer for Serializer 7
Reserved
01B4 C290
01B4 C294
01B4 C298
01B4 C29C
01B4 C2A0 – 01B4 FFFF
Table 5-31. McASP0 Data Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
COMMENTS
(Used when RSEL or XSEL
bits = 0 [these bits are located
in the RFMT or XFMT registers,
respectively].)
McASPx receive buffers or McASPx transmit buffers via
the Peripheral Data Bus.
3C00 0000 – 3C0F FFFF
RBUF/XBUFx
5.9.3 McASP0 Electrical Data/Timing
5.9.3.1 Multichannel Audio Serial Port (McASP) Timing
Table 5-32. Timing Requirements for McASP (see Figure 5-35 and Figure 5-36)
–500
–600
NO.
UNIT
MIN
MAX
1
2
3
4
tc(AHCKRX)
tw(AHCKRX)
tc(CKRX)
Cycle time, AHCLKR/X
20
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Pulse duration, AHCLKR/X high or low
Cycle time, ACLKR/X
10
33
ACLKR/X ext
ACLKR/X ext
ACLKR/X int
ACLKR/X ext
ACLKR/X int
ACLKR/X ext
ACLKR/X int
ACLKR/X ext
ACLKR/X int
ACLKR/X ext
tw(CKRX)
Pulse duration, ACLKR/X high or low
16.5
5
5
6
7
8
tsu(FRX-CKRX)
th(CKRX-FRX)
tsu(AXR-CKRX)
th(CKRX-AXR)
Setup time, AFSR/X input valid before ACLKR/X latches data
Hold time, AFSR/X input valid after ACLKR/X latches data
Setup time, AXR input valid before ACLKR/X latches data
Hold time, AXR input valid after ACLKR/X latches data
5
5
5
5
5
5
5
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Table 5-33. Switching Characteristics Over Recommended Operating Conditions for McASP
(see Figure 5-35 and Figure 5-36)
–500
–600
NO.
PARAMETER
UNIT
MIN
MAX
9
tc(AHCKRX)
tw(AHCKRX)
tc(CKRX)
Cycle time, AHCLKR/X
20
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
10
11
12
Pulse duration, AHCLKR/X high or low
Cycle time, ACLKR/X
10
33
ACLKR/X int
ACLKR/X int
ACLKR/X int
ACLKR/X ext
ACLKX int
tw(CKRX)
Pulse duration, ACLKR/X high or low
16.5
–1
0
5
13
14
15
td(CKRX-FRX)
Delay time, ACLKR/X transmit edge to AFSX/R output valid
Delay time, ACLKX transmit edge to AXR output valid
10
5
–1
0
td(CKX-AXRV)
ACLKX ext
10
10
10
ACLKR/X int
ACLKR/X ext
0
Disable time, AXR high impedance following last data bit from
ACLKR/X transmit edge
tdis(CKRX-AXRHZ)
0
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2
1
2
AHCLKR/X (Falling Edge Polarity)
AHCLKR/X (Rising Edge Polarity)
4
3
4
†
ACLKR/X (CLKRP = CLKXP = 0)
‡
ACLKR/X (CLKRP = CLKXP = 1)
6
5
AFSR/X (Bit Width, 0 Bit Delay)
AFSR/X (Bit Width, 1 Bit Delay)
AFSR/X (Bit Width, 2 Bit Delay)
AFSR/X (Slot Width, 0 Bit Delay)
AFSR/X (Slot Width, 1 Bit Delay)
AFSR/X (Slot Width, 2 Bit Delay)
8
7
AXR[n] (Data In/Receive)
A0 A1
A30 A31 B0 B1
B30 B31 C0 C1 C2 C3
C31
†
For CLKRP = CLKXP = 0, the McASP transmitter is configured for rising edge (to shift data out) and the McASP receiver is configured for falling
edge (to shift data in).
‡
For CLKRP = CLKXP = 1, the McASP transmitter is configured for falling edge (to shift data out) and the McASP receiver is configured for rising
edge (to shift data in).
Figure 5-35. McASP Input Timings
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10
10
9
AHCLKR/X (Falling Edge Polarity)
AHCLKR/X (Rising Edge Polarity)
12
11
12
†
ACLKR/X (CLKRP = CLKXP = 1)
‡
ACLKR/X (CLKRP = CLKXP = 0)
13
13
13
13
AFSR/X (Bit Width, 0 Bit Delay)
AFSR/X (Bit Width, 1 Bit Delay)
AFSR/X (Bit Width, 2 Bit Delay)
AFSR/X (Slot Width, 0 Bit Delay)
AFSR/X (Slot Width, 1 Bit Delay)
AFSR/X (Slot Width, 2 Bit Delay)
AXR[n] (Data Out/Transmit)
13
13
13
14
15
A0 A1
A30 A31 B0 B1
B30 B31 C0 C1 C2 C3
C31
†
‡
For CLKRP = CLKXP = 1, the McASP transmitter is configured for falling edge (to shift data out) and the McASP receiver is configured for rising
edge (to shift data in).
For CLKRP = CLKXP = 0, the McASP transmitter is configured for rising edge (to shift data out) and the McASP receiver is configured for falling
edge (to shift data in).
Figure 5-36. McASP Output Timings
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5.10 Inter-Integrated Circuit (I2C)
The inter-integrated circuit (I2C) module provides an interface between a TMS320C6000™ DSP and other
devices compliant with Philips Semiconductors Inter-IC bus (I2C bus) specification version 2.1 and
connected by way of an I2C-bus. External components attached to this 2-wire serial bus can
transmit/receive up to 8-bit data to/from the DSP through the I2C module.
5.10.1 I2C Device-Specific Information
The I2C module on the TMS320DM643 may be used by the DSP to control local peripherals ICs (DACs,
ADCs, etc.) while the other may be used to communicate with other controllers in a system or to
implement a user interface.
The I2C port supports:
•
•
•
•
•
•
•
Compatible with Philips I2C Specification Revision 2.1 (January 2000)
Fast Mode up to 400 Kbps (no fail-safe I/O buffers)
Noise Filter to Remove Noise 50 ns or less
Seven- and Ten-Bit Device Addressing Modes
Master (Transmit/Receive) and Slave (Transmit/Receive) Functionality
Events: DMA, Interrupt, or Polling
Slew-Rate Limited Open-Drain Output Buffers
Figure 5-37 is a block diagram of the I2C0 module.
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I2C0 Module
Clock
Prescale
Peripheral Clock
(CPU/4)
I2CPSCx
Bit Clock
Control
I2COARx
I2CSARx
I2CMDRx
I2CCNTx
Generator
SCL
Noise
Filter
Own
Address
I2C Clock
I2CCLKHx
I2CCLKLx
Slave
Address
Mode
Transmit
I2CXSRx
Data
Count
Transmit
Shift
Transmit
Buffer
I2CDXRx
SDA
Interrupt/DMA
I2CIERx
Noise
Filter
I2C Data
Interrupt
Enable
Receive
Receive
Buffer
I2CDRRx
Interrupt
Status
I2CSTRx
Interrupt
Source
Receive
Shift
I2CRSRx
I2CISRCx
Shading denotes a peripheral module not available for this configuration.
Figure 5-37. I2C0 Module Block Diagram
For more detailed information on the I2C peripheral, see the TMS320C6000 DSP Inter-Integrated Circuit
(I2C) Module Reference Guide (literature number SPRU175).
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5.10.2 I2C Peripheral Register Description(s)
Table 5-34. I2C0 Registers
HEX ADDRESS RANGE
01B4 0000
ACRONYM
I2COAR0
I2CIER0
I2CSTR0
I2CCLKL0
I2CCLKH0
I2CCNT0
I2CDRR0
I2CSAR0
I2CDXR0
I2CMDR0
I2CISRC0
–
REGISTER NAME
I2C0 own address register
I2C0 interrupt enable register
I2C0 interrupt status register
01B4 0004
01B4 0008
01B4 000C
I2C0 clock low-time divider register
I2C0 clock high-time divider register
I2C0 data count register
01B4 0010
01B4 0014
01B4 0018
I2C0 data receive register
01B4 001C
I2C0 slave address register
I2C0 data transmit register
01B4 0020
01B4 0024
I2C0 mode register
01B4 0028
I2C0 interrupt source register
Reserved
01B4 002C
01B4 0030
I2CPSC0
I2CPID10
I2CPID20
–
I2C0 prescaler register
01B4 0034
I2C0 Peripheral Identification register 1 [Value: 0x0000 0101]
I2C0 Peripheral Identification register 2 [Value: 0x0000 0005]
Reserved
01B4 0038
01B4 003C – 01B4 3FFF
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5.10.3 I2C Electrical Data/Timing
5.10.3.1 Inter-Integrated Circuits (I2C) Timing
Table 5-35. Timing Requirements for I2C Timings(1) (see Figure 5-38)
–500
–600
NO.
STANDARD
MODE
UNIT
FAST MODE
MIN
MAX
MIN
MAX
1
2
tc(SCL)
Cycle time, SCL
10
2.5
µs
µs
Setup time, SCL high before SDA low (for a repeated START
condition)
tsu(SCLH-SDAL)
4.7
4
0.6
0.6
Hold time, SCL low after SDA low (for a START and a repeated
START condition)
3
th(SCLL-SDAL)
µs
4
5
6
7
tw(SCLL)
Pulse duration, SCL low
4.7
4
1.3
0.6
100(2)
µs
µs
ns
µs
tw(SCLH)
Pulse duration, SCL high
tsu(SDAV-SDLH)
th(SDA-SDLL)
Setup time, SDA valid before SCL high
Hold time, SDA valid after SCL low (For I2C bus™ devices)
250
0(3)
0(3) 0.9(4)
Pulse duration, SDA high between STOP and START
conditions
8
tw(SDAH)
tr(SDA)
tr(SCL)
tf(SDA)
tf(SCL)
4.7
1.3
µs
ns
ns
ns
ns
20 + 0.1Cb
9
Rise time, SDA
Rise time, SCL
Fall time, SDA
Fall time, SCL
1000
1000
300
300
300
300
300
(5)
20 + 0.1Cb
10
11
12
(5)
20 + 0.1Cb
(5)
20 + 0.1Cb
300
(5)
13
14
15
tsu(SCLH-SDAH)
tw(SP)
Setup time, SCL high before SDA high (for STOP condition)
Pulse duration, spike (must be suppressed)
Capacitive load for each bus line
4
0.6
0
µs
ns
pF
50
(5)
Cb
400
400
(1) The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered
down.
(2) A Fast-mode I2C-bus™ device can be used in a Standard-mode I2C-bus™ system, but the requirement tsu(SDA-SCLH) ≥250 ns must then
be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch
the LOW period of the SCL signal, it must output the next data bit to the SDA line tr max + tsu(SDA-SCLH) = 1000 + 250 = 1250 ns
(according to the Standard-mode I2C-Bus Specification) before the SCL line is released.
(3) A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the
undefined region of the falling edge of SCL.
(4) The maximum th(SDA-SCLL) has only to be met if the device does not stretch the low period [tw(SCLL)] of the SCL signal.
(5) Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
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11
9
SDA
6
8
14
4
13
5
10
SCL
1
12
3
2
7
3
Stop
Start
Repeated
Start
Stop
Figure 5-38. I2C Receive Timings
Table 5-36. Switching Characteristics for I2C Timings(1) (see Figure 5-39)
–500
–600
NO.
PARAMETER
STANDARD
MODE
UNIT
FAST MODE
MIN
MAX
MIN
MAX
16
17
tc(SCL)
td(SCLH-SDAL)
td(SDAL-SCLL)
Cycle time, SCL
10
2.5
µs
µs
Delay time, SCL high to SDA low (for a repeated START
condition)
4.7
4
0.6
0.6
Delay time, SDA low to SCL low (for a START and a repeated
START condition)
18
µs
19
20
21
22
tw(SCLL)
Pulse duration, SCL low
4.7
4
1.3
0.6
100
0
µs
µs
ns
µs
tw(SCLH)
Pulse duration, SCL high
td(SDAV-SDLH)
tv(SDLL-SDAV)
Delay time, SDA valid to SCL high
Valid time, SDA valid after SCL low (For I2C bus™ devices)
250
0
0.9
Pulse duration, SDA high between STOP and START
conditions
23
24
25
26
27
tw(SDAH)
tr(SDA)
tr(SCL)
tf(SDA)
tf(SCL)
4.7
1.3
µs
ns
ns
ns
ns
20 + 0.1Cb
Rise time, SDA
Rise time, SCL
Fall time, SDA
Fall time, SCL
1000
1000
300
300
300
300
300
(2)
20 + 0.1Cb
(2)
20 + 0.1Cb
(2)
20 + 0.1Cb
300
(2)
28
29
td(SCLH-SDAH)
Cp
Delay time, SCL high to SDA high (for STOP condition)
Capacitance for each I2C pin
4
0.6
µs
pF
10
10
(1) Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
(2) Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
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26
24
SDA
21
23
19
28
20
25
SCL
16
27
18
17
22
18
Stop
Start
Repeated
Start
Stop
Figure 5-39. I2C Transmit Timings
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5.11 Host-Port Interface (HPI)
The HPI is a parallel port through which a host processor can directly access the CPU memory space.
The host device functions as a master to the interface, which increases ease of access. The host and
CPU can exchange information via internal or external memory. The host also has direct access to
memory-mapped peripherals. Connectivity to the CPU memory space is provided through the enhanced
DMA (EDMA) controller. Both the host and the CPU can access the HPI control register (HPIC) and the
HPI address register (HPIA). The host can access the HPI data register (HPID) and the HPIC by using the
external data and interface control signals.
For more detailed information on the HPI peripheral, see the TMS320C6000 DSP Host Port Interface
(HPI) Reference Guide (literature number SPRU578).
5.11.1 HPI Peripheral Register Description(s)
Table 5-37. HPI Registers
HEX ADDRESS RANGE
ACRONYM
HPID
REGISTER NAME
HPI data register
COMMENTS
Host read/write access only
–
0188 0000
HPIC
HPI control register
HPIC has both Host/CPU read/write access
HPIA
HPI address register
(Write)
0188 0004
(HPIAW)(1)
HPIA has both Host/CPU read/write access
HPIA
HPI address register
(Read)
0188 0008
(HPIAR)(1)
0188 000C – 0189 FFFF
018A 0000
–
Reserved
HPI transfer request control
register
HPI_TRCTL
–
018A 0004 – 018B FFFF
Reserved
(1) Host access to the HPIA register updates both the HPIAW and HPIAR registers. The CPU can access HPIAW and HPIAR
independently.
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5.11.2 Host-Port Interface (HPI) Electrical Data/Timing
Table 5-38. Timing Requirements for Host-Port Interface Cycles(1) (2) (see Figure 5-40 through
Figure 5-47)
–500
–600
NO.
UNIT
MIN
5
MAX
1
2
tsu(SELV-HSTBL)
th(HSTBL-SELV)
tw(HSTBL)
Setup time, select signals(3) valid before HSTROBE low
Hold time, select signals(3) valid after HSTROBE low
Pulse duration, HSTROBE low
ns
ns
ns
ns
ns
ns
ns
ns
2.4
4P(4)
4P
5
3
4
tw(HSTBH)
Pulse duration, HSTROBE high between consecutive accesses
Setup time, select signals(3) valid before HAS low
Hold time, select signals(3) valid after HAS low
Setup time, host data valid before HSTROBE high
Hold time, host data valid after HSTROBE high
10
11
12
13
tsu(SELV-HASL)
th(HASL-SELV)
tsu(HDV-HSTBH)
th(HSTBH-HDV)
2
5
2.8
Hold time, HSTROBE low after HRDY low. HSTROBE should not be inactivated
until HRDY is active (low); otherwise, HPI writes will not complete properly.
14
th(HRDYL-HSTBL)
2
ns
18
19
tsu(HASL-HSTBL)
th(HSTBL-HASL)
Setup time, HAS low before HSTROBE low
Hold time, HAS low after HSTROBE low
2
ns
ns
2.1
(1) HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
(2) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
(3) Select signals include: HCNTL[1:0] and HR/W. For HPI16 mode only, select signals also include HHWIL.
(4) Select the parameter value of 4P or 12.5 ns, whichever is larger.
Table 5-39. Switching Characteristics Over Recommended Operating Conditions During Host-Port
Interface Cycles(1) (2) (see Figure 5-40 through Figure 5-47)
–500
–600
NO.
PARAMETER
UNIT
MIN
1.3
2
MAX
6
7
td(HSTBL-HRDYH)
td(HSTBL-HDLZ)
td(HDV-HRDYL)
toh(HSTBH-HDV)
td(HSTBH-HDHZ)
td(HSTBL-HDV)
Delay time, HSTROBE low to HRDY high(3)
4P + 8
ns
ns
ns
ns
ns
ns
Delay time, HSTROBE low to HD low impedance for an HPI read
Delay time, HD valid to HRDY low
8
–3
9
Output hold time, HD valid after HSTROBE high
Delay time, HSTROBE high to HD high impedance
Delay time, HSTROBE low to HD valid (HPI16 mode, 2nd half-word only)
1.5
15
16
12
4P + 8
(1) HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
(2) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
(3) This parameter is used during HPID reads and writes. For reads, at the beginning of a word transfer (HPI32) or the first half-word
transfer (HPI16) on the falling edge of HSTROBE, the HPI sends the request to the EDMA internal address generation hardware, and
HRDY remains high until the EDMA internal address generation hardware loads the requested data into HPID. For writes, HRDY goes
high if the internal write buffer is full.
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HAS
1
1
1
1
2
2
2
2
2
HCNTL[1:0]
1
HR/W
1
2
HHWIL
4
3
3
(A)
HSTROBE
HCS
15
9
15
9
7
16
HD[15:0] (output)
1st half-word
2nd half-word
6
8
HRDY
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 5-40. HPI16 Read Timing (HAS Not Used, Tied High)
(A)
HAS
19
11
19
11
10
10
10
10
HCNTL[1:0]
HR/W
11
11
11
11
10
10
HHWIL
4
3
(B)
HSTROBE
18
18
HCS
15
15
7
9
16
9
HD[15:0] (output)
HRDY
1st half-word
2nd half-word
6
8
A. For correct operation, strobe the HAS signal only once per HSTROBE active cycle.
B. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 5-41. HPI16 Read Timing (HAS Used)
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HAS
HCNTL[1:0]
HR/W
1
1
2
2
2
2
1
1
2
1
1
2
HHWIL
3
3
4
(A)
HSTROBE
HCS
12
12
13
13
HD[15:0] (input)
1st half-word
2nd half-word
6
14
HRDY
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 5-42. HPI16 Write Timing (HAS Not Used, Tied High)
19
11
19
(A)
HAS
11
11
11
10
10
10
10
10
10
HCNTL[1:0]
HR/W
11
11
HHWIL
3
4
(B)
HSTROBE
18
12
18
HCS
12
13
13
HD[15:0] (input)
1st half-word
2nd half-word
6
14
HRDY
A. For correct operation, strobe the HAS signal only once per HSTROBE active cycle.
B. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 5-43. HPI16 Write Timing (HAS Used)
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HAS
1
1
2
HCNTL[1:0]
HR/W
2
3
(A)
HSTROBE
HCS
7
9
15
HD[31:0] (output)
HRDY
6
8
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 5-44. HPI32 Read Timing (HAS Not Used, Tied High)
19
(A)
HAS
11
10
HCNTL[1:0]
11
10
HR/W
18
3
(B)
HSTROBE
HCS
7
9
15
HD[31:0] (output)
HRDY
6
8
A. For correct operation, strobe the HAS signal only once per HSTROBE active cycle.
B. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 5-45. HPI32 Read Timing (HAS Used)
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HAS
HCNTL[1:0]
HR/W
1
1
2
2
3
(A)
HSTROBE
HCS
12
13
HD[31:0] (input)
HRDY
6
14
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 5-46. HPI32 Write Timing (HAS Not Used, Tied High)
19
(A)
HAS
11
10
HCNTL[1:0]
11
10
HR/W
3
18
(B)
HSTROBE
HCS
12
13
HD[31:0] (input)
HRDY
6
14
A. For correct operation, strobe the HAS signal only once per HSTROBE active cycle.
B. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 5-47. HPI32 Write Timing (HAS Used)
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5.12 Multichannel Buffered Serial Port (McBSP)
The McBSP provides these functions:
•
•
•
•
Full-duplex communication
Double-buffered data registers, which allow a continuous data stream
Independent framing and clocking for receive and transmit
Direct interface to industry-standard codecs, analog interface chips (AICs), and other serially
connected analog-to-digital (A/D) and digital-to-analog (D/A) devices
On the DM643 device, the McBSP peripheral does not support external clocking to the sample rate
generator (no CLKS input).
For more detailed information on the McBSP peripheral, see the TMS320C6000 DSP Multichannel
Buffered Serial Port (McBSP) Reference Guide (literature number SPRU580).
5.12.1 McBSP Peripheral Register Description(s)
Table 5-40. McBSP 0 Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
COMMENTS
The CPU and EDMA controller
can only read this register; they
cannot write to it.
018C 0000
DRR0
McBSP0 data receive register via Configuration Bus
0x3000 0000 – 0x33FF FFFF
018C 0004
DRR0
DXR0
DXR0
SPCR0
RCR0
XCR0
McBSP0 data receive register via Peripheral Bus
McBSP0 data transmit register via Configuration Bus
McBSP0 data transmit register via Peripheral Bus
McBSP0 serial port control register
0x3000 0000 – 0x33FF FFFF
018C 0008
018C 000C
McBSP0 receive control register
018C 0010
McBSP0 transmit control register
CLKSP (Bit 30) and CLKSM
(Bit 29) are RSV on DM643
018C 0014
SRGR0
McBSP0 sample rate generator register
018C 0018
018C 001C
MCR0
RCERE00
XCERE00
PCR0
McBSP0 multichannel control register
McBSP0 enhanced receive channel enable register 0
McBSP0 enhanced transmit channel enable register 0
McBSP0 pin control register
018C 0020
018C 0024
018C 0028
RCERE10
XCERE10
RCERE20
XCERE20
RCERE30
XCERE30
–
McBSP0 enhanced receive channel enable register 1
McBSP0 enhanced transmit channel enable register 1
McBSP0 enhanced receive channel enable register 2
McBSP0 enhanced transmit channel enable register 2
McBSP0 enhanced receive channel enable register 3
McBSP0 enhanced transmit channel enable register 3
Reserved
018C 002C
018C 0030
018C 0034
018C 0038
018C 003C
018C 0040 – 018F FFFF
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5.12.2 McBSP Electrical Data/Timing
5.12.2.1 Multichannel Buffered Serial Port (McBSP) Timing
Table 5-41. Timing Requirements for McBSP(1) (see Figure 5-48)
–500
–600
NO.
UNIT
MIN
MAX
2
3
tc(CKRX)
tw(CKRX)
Cycle time, CLKR/X
CLKR/X ext
CLKR/X ext
CLKR int
CLKR ext
CLKR int
CLKR ext
CLKR int
CLKR ext
CLKR int
CLKR ext
CLKX int
CLKX ext
CLKX int
CLKX ext
4P or 6.67(2) (3)
0.5tc(CKRX) –1(4)
ns
ns
Pulse duration, CLKR/X high or CLKR/X low
9
1.3
6
5
6
tsu(FRH-CKRL)
th(CKRL-FRH)
tsu(DRV-CKRL)
th(CKRL-DRV)
tsu(FXH-CKXL)
th(CKXL-FXH)
Setup time, external FSR high before CLKR low
Hold time, external FSR high after CLKR low
Setup time, DR valid before CLKR low
ns
ns
ns
ns
ns
ns
3
8
7
0.9
3
8
Hold time, DR valid after CLKR low
3.1
9
10
11
Setup time, external FSX high before CLKX low
Hold time, external FSX high after CLKX low
1.3
6
3
(1) CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also
inverted.
(2) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
(3) Use whichever value is greater. Minimum CLKR/X cycle times must be met, even when CLKR/X is generated by an internal clock
source. The minimum CLKR/X cycle times are based on internal logic speed; the maximum usable speed may be lower due to EDMA
limitations and AC timing requirements.
(4) This parameter applies to the maximum McBSP frequency. Operate serial clocks (CLKR/X) in the reasonable range of 40/60 duty cycle.
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Table 5-42. Switching Characteristics Over Recommended Operating Conditions for McBSP(1) (2)
(see Figure 5-48)
–500
–600
NO.
PARAMETER
UNIT
MIN
MAX
4P or 6.67(3) (4)
2
tc(CKRX)
Cycle time, CLKR/X
CLKR/X int
ns
(5)
3
4
tw(CKRX)
Pulse duration, CLKR/X high or CLKR/X low
Delay time, CLKR high to internal FSR valid
CLKR/X int
CLKR int
CLKX int
CLKX ext
CLKX int
CLKX ext
CLKX int
CLKX ext
FSX int
C – 1(6)
–2.1
C + 1(6)
ns
ns
td(CKRH-FRV)
3
–1.7
3
9
td(CKXH-FXV)
tdis(CKXH-DXHZ)
td(CKXH-DXV)
Delay time, CLKX high to internal FSX valid
ns
ns
ns
1.7
9
4
–3.9
Disable time, DX high impedance following last data
bit from CLKX high
12
13
–2.1
9
–3.9 + D1(7)
–2.1 + D1(7)
–2.3 + D1(8)
4 + D2(7)
9 + D2(7)
5.6 + D2(8)
Delay time, CLKX high to DX valid
Delay time, FSX high to DX valid
14
td(FXH-DXV)
ns
ONLY applies when in data
delay 0 (XDATDLY = 00b) mode
FSX ext
1.9 + D1(8)
9 + D2(8)
(1) CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also
inverted.
(2) Minimum delay times also represent minimum output hold times.
(3) Minimum CLKR/X cycle times must be met, even when CLKR/X is generated by an internal clock source. Minimum CLKR/X cycle times
are based on internal logic speed; the maximum usable speed may be lower due to EDMA limitations and AC timing requirements.
(4) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
(5) Use whichever value is greater.
(6) The CLKSM bit in the SRGR0 register must remain a 1, the DM643 device does not support a CLKS input.
C = H or L
H = CLKX high pulse width = (CLKGDV/2 + 1) * 4P if CLKGDV is even
H = CLKX high pulse width = (CLKGDV + 1)/2 * 4P if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * 4P if CLKGDV is even
L = CLKX low pulse width = (CLKGDV + 1)/2 * 4P if CLKGDV is odd or zero
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the maximum limit (see footnote (4) above).
(7) Extra delay from CLKX high to DX valid applies only to the first data bit of a device, if and only if DXENA = 1 in SPCR.
if DXENA = 0, then D1 = D2 = 0
if DXENA = 1, then D1 = 4P, D2 = 8P
(8) Extra delay from FSX high to DX valid applies only to the first data bit of a device, if and only if DXENA = 1 in SPCR.
if DXENA = 0, then D1 = D2 = 0
if DXENA = 1, then D1 = 4P, D2 = 8P
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2
3
3
CLKR
4
4
FSR (int)
5
6
FSR (ext)
DR
7
8
Bit(n-1)
(n-2)
(n-3)
2
3
3
CLKX
9
FSX (int)
11
10
FSX (ext)
FSX
(XDATDLY=00b)
(A)
13
14
13
(A)
12
DX
Bit 0
Bit(n-1)
(n-2)
(n-3)
A. Parameter No. 13 applies to the first data bit only when XDATDLY ≠ 0.
Figure 5-48. McBSP Timing
Table 5-43. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0(1) (2)
(see Figure 5-49)
–500
–600
NO.
UNIT
MASTER
SLAVE
MIN MAX
MIN
12
4
MAX
4
5
tsu(DRV-CKXL)
th(CKXL-DRV)
Setup time, DR valid before CLKX low
Hold time, DR valid after CLKX low
2 – 12P
5 + 24P
ns
ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
(2) For all SPI Slave modes, CLKG is programmed as 1/4 of the CPU clock by setting CLKSM = CLKGDV = 1.
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Table 5-44. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI
Master or Slave: CLKSTP = 10b, CLKXP = 0(1) (2) (see Figure 5-49)
–500
–600
NO.
PARAMETER
UNIT
MASTER(3)
SLAVE
MIN
MIN
MAX
MAX
1
2
3
th(CKXL-FXL)
td(FXL-CKXH)
td(CKXH-DXV)
Hold time, FSX low after CLKX low(4)
Delay time, FSX low to CLKX high(5)
Delay time, CLKX high to DX valid
T – 2 T + 3
L – 2.5 L + 3
ns
ns
ns
–2
4
12P + 2.8 20P + 17
Disable time, DX high impedance following last data bit
from CLKX low
6
tdis(CKXL-DXHZ)
L – 2 L + 3
ns
Disable time, DX high impedance following last data bit
from FSX high
7
8
tdis(FXH-DXHZ)
td(FXL-DXV)
4P + 3 12P + 17
ns
ns
Delay time, FSX low to DX valid
8P + 1.8 16P + 17
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
(2) For all SPI Slave modes, CLKG is programmed as 1/4 of the CPU clock by setting CLKSM = CLKGDV = 1.
(3) The CLKSM bit in the SRGR0 register must remain a 1, the DM643 device does not support a CLKS input.
T = CLKX period = (1 + CLKGDV) * 4P
H = CLKX high pulse width = (CLKGDV/2 + 1) * 4P if CLKGDV is even
H = CLKX high pulse width = (CLKGDV + 1)/2 * 4P if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * 4P if CLKGDV is even
L = CLKX low pulse width = (CLKGDV + 1)/2 * 4P if CLKGDV is odd or zero
(4) FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input
on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP
(5) FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master
clock (CLKX).
CLKX
1
2
8
FSX
7
6
3
DX
DR
Bit 0
Bit(n-1)
Bit(n-1)
(n-2)
(n-3)
(n-3)
(n-4)
4
5
Bit 0
(n-2)
(n-4)
Figure 5-49. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
Table 5-45. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0(1) (2)
(see Figure 5-50)
–500
–600
NO.
UNIT
MASTER
SLAVE
MIN MAX
MIN
12
4
MAX
4
5
tsu(DRV-CKXH)
th(CKXH-DRV)
Setup time, DR valid before CLKX high
Hold time, DR valid after CLKX high
2 – 12P
5 + 24P
ns
ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
(2) For all SPI Slave modes, CLKG is programmed as 1/4 of the CPU clock by setting CLKSM = CLKGDV = 1.
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Table 5-46. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI
Master or Slave: CLKSTP = 11b, CLKXP = 0(1) (2) (see Figure 5-50)
–500
–600
NO.
PARAMETER
UNIT
MASTER(3)
SLAVE
MIN MAX
MIN
MAX
1
2
3
th(CKXL-FXL)
td(FXL-CKXH)
td(CKXL-DXV)
Hold time, FSX low after CLKX low(4)
Delay time, FSX low to CLKX high(5)
Delay time, CLKX low to DX valid
L – 2 L + 3
T – 2.5 T + 3
ns
ns
ns
–2
4
12P + 3 20P + 17
12P + 3 20P + 17
Disable time, DX high impedance following last data bit from
CLKX low
6
7
tdis(CKXL-DXHZ)
td(FXL-DXV)
–2
4
ns
ns
Delay time, FSX low to DX valid
H – 2 H + 4 8P + 2 16P + 17
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
(2) For all SPI Slave modes, CLKG is programmed as 1/4 of the CPU clock by setting CLKSM = CLKGDV = 1.
(3) The CLKSM bit in the SRGR0 register must remain a 1, the DM643 device does not support a CLKS input.
T = CLKX period = (1 + CLKGDV) * 4P
H = CLKX high pulse width = (CLKGDV/2 + 1) * 4P if CLKGDV is even
H = CLKX high pulse width = (CLKGDV + 1)/2 * 4P if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * 4P if CLKGDV is even
L = CLKX low pulse width = (CLKGDV + 1)/2 * 4P if CLKGDV is odd or zero
(4) FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input
on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP
(5) FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master
clock (CLKX).
CLKX
1
2
7
FSX
DX
6
3
Bit 0
Bit(n-1)
Bit(n-1)
(n-2)
(n-3)
(n-3)
(n-4)
4
5
DR
Bit 0
(n-2)
(n-4)
Figure 5-50. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
Table 5-47. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1(1) (2)
(see Figure 5-51)
–500
–600
NO.
UNIT
MASTER
SLAVE
MIN MAX
MIN
12
4
MAX
4
5
tsu(DRV-CKXH)
th(CKXH-DRV)
Setup time, DR valid before CLKX high
Hold time, DR valid after CLKX high
2 – 12P
5 + 24P
ns
ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
(2) For all SPI Slave modes, CLKG is programmed as 1/4 of the CPU clock by setting CLKSM = CLKGDV = 1.
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Table 5-48. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI
Master or Slave: CLKSTP = 10b, CLKXP = 1(1) (2) (see Figure 5-51)
–500
–600
NO.
PARAMETER
UNIT
MASTER(3)
SLAVE
MIN MAX
MIN
MAX
1
2
3
th(CKXH-FXL)
td(FXL-CKXL)
td(CKXL-DXV)
Hold time, FSX low after CLKX high(4)
Delay time, FSX low to CLKX low(5)
Delay time, CLKX low to DX valid
T – 2 T + 3
H – 2.5 H + 3
ns
ns
ns
–2
4
12P + 3 20P + 17
Disable time, DX high impedance following last data bit
from CLKX high
6
tdis(CKXH-DXHZ)
H – 2 H + 3
ns
Disable time, DX high impedance following last data bit
from FSX high
7
8
tdis(FXH-DXHZ)
td(FXL-DXV)
4P + 3 12P + 17
8P + 2 16P + 17
ns
ns
Delay time, FSX low to DX valid
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
(2) For all SPI Slave modes, CLKG is programmed as 1/4 of the CPU clock by setting CLKSM = CLKGDV = 1.
(3) The CLKSM bit in the SRGR0 register must remain a 1, the DM643 device does not support a CLKS input.
T = CLKX period = (1 + CLKGDV) * 4P
H = CLKX high pulse width = (CLKGDV/2 + 1) * 4P if CLKGDV is even
H = CLKX high pulse width = (CLKGDV + 1)/2 * 4P if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * 4P if CLKGDV is even
L = CLKX low pulse width = (CLKGDV + 1)/2 * 4P if CLKGDV is odd or zero
(4) FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input
on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP
(5) FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master
clock (CLKX).
CLKX
1
2
8
FSX
7
6
3
DX
DR
Bit 0
Bit(n-1)
Bit(n-1)
(n-2)
(n-3)
(n-4)
4
5
Bit 0
(n-2)
(n-3)
(n-4)
Figure 5-51. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
Table 5-49. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1(1) (2)
(see Figure 5-52)
–500
–600
NO.
UNIT
MASTER
SLAVE
MIN MAX
MIN
12
4
MAX
4
5
tsu(DRV-CKXH)
th(CKXH-DRV)
Setup time, DR valid before CLKX high
Hold time, DR valid after CLKX high
2 – 12P
5 + 24P
ns
ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
(2) For all SPI Slave modes, CLKG is programmed as 1/4 of the CPU clock by setting CLKSM = CLKGDV = 1.
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Table 5-50. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI
Master or Slave: CLKSTP = 11b, CLKXP = 1(1) (2) (see Figure 5-52)
–500
–600
NO.
PARAMETER
UNIT
MASTER(3)
SLAVE
MIN MAX
MIN
MAX
H + 3
1
2
3
th(CKXH-FXL)
td(FXL-CKXL)
td(CKXH-DXV)
Hold time, FSX low after CLKX high(4)
Delay time, FSX low to CLKX low(5)
Delay time, CLKX high to DX valid
H – 2
ns
ns
ns
T – 2.5 T + 1.5
–2
4
12P + 3 20P + 17
12P + 3 20P + 17
Disable time, DX high impedance following last data bit
from CLKX high
6
7
tdis(CKXH-DXHZ)
td(FXL-DXV)
–2
4
ns
ns
Delay time, FSX low to DX valid
L – 2
L + 4 8P + 2 16P + 17
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
(2) For all SPI Slave modes, CLKG is programmed as 1/4 of the CPU clock by setting CLKSM = CLKGDV = 1.
(3) The CLKSM bit in the SRGR0 register must remain a 1, the DM643 device does not support a CLKS input.
T = CLKX period = (1 + CLKGDV) * 4P
H = CLKX high pulse width = (CLKGDV/2 + 1) * 4P if CLKGDV is even
H = CLKX high pulse width = (CLKGDV + 1)/2 * 4P if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * 4P if CLKGDV is even
L = CLKX low pulse width = (CLKGDV + 1)/2 * 4P if CLKGDV is odd or zero
(4) FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input
on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP
(5) FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master
clock (CLKX).
CLKX
1
2
FSX
DX
7
6
3
Bit 0
Bit 0
Bit(n-1)
Bit(n-1)
(n-2)
(n-3)
(n-4)
4
5
DR
(n-2)
(n-3)
(n-4)
Figure 5-52. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
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5.13 Video Port
Each Video Port is capable of sending and receiving digital video data. The Video Ports are also capable
of capturing/displaying RAW data. The Video Port peripherals follow video standards such as BT.656 and
SMPTE296.
5.13.1 Video Port Device-Specific Information
The TMS320DM643 device has two video port peripherals.
The video port peripheral can operate as a video capture port, video display port, or as a transport stream
interface (TSI) capture port.
The port consists of two channels: A and B. A 5120-byte capture/display buffer is splittable between the
two channels. The entire port (both channels) is always configured for either video capture or display only.
Separate data pipelines control the parsing and formatting of video capture or display data for each of the
BT.656, Y/C, raw video, and TSI modes.
For video capture operation, the video port may operate as two 8/10-bit channels of BT.656 or raw video
capture; or as a single channel of 8/10-bit BT.656, 8/10-bit raw video, 16/20-bit Y/C video, 16/20-bit raw
video, or 8-bit TSI.
For video display operation, the video port may operate as a single channel of 8/10-bit BT.656; or as a
single channel of 8/10-bit BT.656, 8/10-bit raw video, 16/20 bit Y/C video, or 16/20-bit raw video. It may
also operate in a two channel 8/10-bit raw mode in which the two channels are locked to the same timing.
Channel B is not used during single channel operation.
For more detailed information on the DM643 Video Port peripherals, see the TMS320C64x DSP Video
Port/VCXO Interpolated Control (VIC) Port Reference Guide (literature number SPRU629).
5.13.2 Video Port Peripheral Register Description(s)
Table 5-51. Video Port 1 and 2 (VP1 and VP2) Control Registers
HEX ADDRESS RANGE
ACRONYM
DESCRIPTION
VP1
VP2
01C4 4000
01C4 4004
01C4 4008
01C4 400C
01C4 4020
01C4 4024
01C4 4028
01C4 402C
01C4 4030
01C4 4034
01C4 4038
01C4 403C
01C4 4040
01C4 4044
01C4 40C0
01C4 40C4
01C4 40C8
01C4 40CC
01C4 4100
01C4 4104
01C4 8000
01C4 8004
01C4 8008
01C4 800C
01C4 8020
01C4 8024
01C4 8028
01C4 802C
01C4 8030
01C4 8034
01C4 8038
01C4 803C
01C4 8040
01C4 8044
01C4 80C0
01C4 80C4
01C4 80C8
01C4 80CC
01C4 8100
01C4 8104
VP_PIDx
VP_PCRx
–
Video Port Peripheral Identification Register
Video Port Peripheral Control Register
Reserved
–
Reserved
VP_PFUNCx
VP_PDIRx
VP_PDINx
VP_PDOUTx
VP_PDSETx
VP_PDCLRx
VP_PIENx
VP_PIPOx
VP_PISTATx
VP_PICLRx
VP_CTLx
VP_STATx
VP_IEx
Video Port Pin Function Register
Video Port Pin Direction Register
Video Port Pin Data Input Register
Video Port Pin Data Output Register
Video Port Pin Data Set Register
Video Port Pin Data Clear Register
Video Port Pin Interrupt Enable Register
Video Port Pin Interrupt Polarity Register
Video Port Pin Interrupt Status Register
Video Port Pin Interrupt Clear Register
Video Port Control Register
Video Port Status Register
Video Port Interrupt Enable Register
Video Port interrupt Status Register
Video Capture Channel A Status Register
Video Capture Channel A Control Register
VP_ISx
VC_STATx
VC_CTLx
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Table 5-51. Video Port 1 and 2 (VP1 and VP2) Control Registers (continued)
HEX ADDRESS RANGE
ACRONYM
DESCRIPTION
VP1
VP2
01C4 4108
01C4 410C
01C4 4110
01C4 4114
01C4 4118
01C4 411C
01C4 4120
01C4 4140
01C4 4144
01C4 4148
01C4 414C
01C4 4150
01C4 4154
01C4 4158
01C4 415C
01C4 4160
01C4 4180
01C4 4184
01C4 4188
01C4 418C
01C4 4190
01C4 4194
01C4 4198
01C4 419C
01C4 41A0
01C4 41A4
01C4 4200
01C4 4204
01C4 4208
01C4 420C
01C4 4210
01C4 4214
01C4 4218
01C4 421C
01C4 4220
01C4 4224
01C4 4228
01C4 422C
01C4 4230
01C4 4234
01C4 4238
01C4 423C
01C4 4240
01C4 4244
01C4 4248
01C4 424C
01C4 8108
01C4 810C
01C4 8110
01C4 8114
01C4 8118
01C4 811C
01C4 8120
01C4 8140
01C4 8144
01C4 8148
01C4 814C
01C4 8150
01C4 8154
01C4 8158
01C4 815C
01C4 8160
01C4 8180
01C4 8184
01C4 8188
01C4 818C
01C4 8190
01C4 8194
01C4 8198
01C4 819C
01C4 81A0
01C4 81A4
01C4 8200
01C4 8204
01C4 8208
01C4 820C
01C4 8210
01C4 8214
01C4 8218
01C4 821C
01C4 8220
01C4 8224
01C4 8228
01C4 822C
01C4 8230
01C4 8234
01C4 8238
01C4 823C
01C4 8240
01C4 8244
01C4 8248
01C4 824C
VC_ASTRTx
VC_ASTOPx
VC_ASTRTx
VC_ASTOPx
VC_AVINTx
Video Capture Channel A Field 1 Start Register
Video Capture Channel A Field 1 Stop Register
Video Capture Channel A Field 2 Start Register
Video Capture Channel A Field 2 Stop Register
Video Capture Channel A Vertical Interrupt Register
Video Capture Channel A Threshold Register
Video Capture Channel A Event Count Register
Video Capture Channel B Status Register
Video Capture Channel B Control Register
Video Capture Channel B Field 1 Start Register
Video Capture Channel B Field 1 Stop Register
Video Capture Channel B Field 2 Start Register
Video Capture Channel B Field 2 Stop Register
Video Capture Channel B Vertical Interrupt Register
Video Capture Channel B Threshold Register
Video Capture Channel B Event Count Register
TCI Capture Control Register
VC_ATHRLDx
VC_AEVTCTx
VC_BSTATx
VC_BCTLx
VC_BSTRTx
VC_BSTOPx
VC_BSTRTx
VC_BSTOPx
VC_BVINTx
VC_BTHRLDx
VC_BEVTCTx
TSI_CTLx
TSI_CLKINITLx
TSI_CLKINITMx
TSI_STCLKLx
TSI_STCLKMx
TSI_STCMPLx
TSI_STCMPMx
TSI_STMSKLx
TSI_STMSKMx
TSI_TICKSx
VD_STATx
TCI Clock Initialization LSB Register
TCI Clock Initialization MSB Register
TCI System Time Clock LSB Register
TCI System Time Clock MSB Register
TCI System Time Clock Compare LSB Register
TCI System Time Clock Compare MSB Register
TCI System Time Clock Compare Mask LSB Register
TCI System Time Clock Compare Mask MSB Register
TCI System Time Clock Ticks Interrupt Register
Video Display Status Register
VD_CTLx
Video Display Control Register
VD_FRMSZx
VD_HBLNKx
VD_VBLKS1x
VD_VBLKE1x
VD_VBLKS2x
VD_VBLKE2x
VD_IMGOFF1x
VD_IMGSZ1x
VD_IMGOFF2x
VD_IMGSZ2x
VD_FLDT1x
Video Display Frame Size Register
Video Display Horizontal Blanking Register
Video Display Field 1 Vertical Blanking Start Register
Video Display Field 1 Vertical Blanking End Register
Video Display Field 2 Vertical Blanking Start Register
Video Display Field 2 Vertical Blanking End Register
Video Display Field 1 Image Offset Register
Video Display Field 1 Image Size Register
Video Display Field 2 Image Offset Register
Video Display Field 2 Image Size Register
Video Display Field 1 Timing Register
VD_FLDT2x
Video Display Field 2 Timing Register
VD_THRLDx
VD_HSYNCx
VD_VSYNS1x
VD_VSYNE1x
VD_VSYNS2x
VD_VSYNE2x
Video Display Threshold Register
Video Display Horizontal Synchronization Register
Video Display Field 1 Vertical Synchronization Start Register
Video Display Field 1 Vertical Synchronization End Register
Video Display Field 2 Vertical Synchronization Start Register
Video Display Field 2 Vertical Synchronization End Register
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Table 5-51. Video Port 1 and 2 (VP1 and VP2) Control Registers (continued)
HEX ADDRESS RANGE
ACRONYM
DESCRIPTION
VP1
VP2
01C4 4250
01C4 4254
01C4 4258
01C4 425C
01C4 4260
01C4 4264
01C4 4268
01C4 426C
7800 0000
7800 0008
7800 0010
7800 0020
7800 0028
7800 0030
7A00 0000
7A00 0008
7A00 0010
7A00 0020
01C4 8250
01C4 8254
01C4 8258
01C4 825C
01C4 8260
01C4 8264
01C4 8268
01C4 826C
7C00 0000
7C00 0008
7C00 0010
7C00 0020
7C00 0028
7C00 0030
7E00 0000
7E00 0008
7E00 0010
7E00 0020
VD_RELOADx
VD_DISPEVTx
VD_CLIPx
VD_DEFVALx
VD_VINTx
VD_FBITx
VD_VBIT1x
VD_VBIT2x
Y_RSCA
Video Display Counter Reload Register
Video Display Display Event Register
Video Display Clipping Register
Video Display Default Display Value Register
Video Display Vertical Interrupt Register
Video Display Field Bit Register
Video Display Field 1Vertical Blanking Bit Register
Video Display Field 2Vertical Blanking Bit Register
Y FIFO Source Register A
CB_SRCA
CR_SRCA
Y_DSTA
CB FIFO Source Register A
CR FIFO Source Register A
Y FIFO Destination Register A
CB_DST
CB FIFO Destination Register
CR_DST
CR FIFO Destination Register
Y_SRCB
Y FIFO Source Register B
CB_SRCB
CR_SRCB
Y_DSTB
CB FIFO Source Register b
CR FIFO Source Register B
Y FIFO Destination Register B
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5.13.3 Video Port (VP1, VP2) Electrical Data/Timing
5.13.3.1 VCLKIN Timing (Video Capture Mode)
Table 5-52. Timing Requirements for Video Capture Mode for VPxCLKINx(1)
(see Figure 5-53)
–500
–600
NO.
UNIT
MIN
MAX
1
2
3
4
tc(VKI)
Cycle time, VPxCLKINx
12.5
5.4
ns
ns
ns
ns
tw(VKIH)
tw(VKIL)
tt(VKI)
Pulse duration, VPxCLKINx high
Pulse duration, VPxCLKINx low
Transition time, VPxCLKINx
5.4
3
(1) The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
4
1
2
3
VPxCLKINx
4
Figure 5-53. Video Port Capture VPxCLKINx TIming
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5.13.3.2 Video Data and Control Timing (Video Capture Mode)
Table 5-53. Timing Requirements in Video Capture Mode for Video Data and Control Inputs
(see Figure 5-54)
–500
–600
NO.
UNIT
MIN
2.9
0.5
2.9
0.5
MAX
1
2
3
4
tsu(VDATV-VKIH) Setup time, VPxDx valid before VPxCLKINx high
ns
ns
ns
ns
th(VDATV-VKIH)
tsu(VCTLV-VKIH)
th(VCTLV-VKIH)
Hold time, VPxDx valid after VPxCLKINx high
Setup time, VPxCTLx valid before VPxCLKINx high
Hold time, VPxCTLx valid after VPxCLKINx high
VPxCLKINx
1
3
2
VPxD[19:0] (Input)
VPxCTLx (Input)
4
Figure 5-54. Video Port Capture Data and Control Input Timing
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5.13.3.3 VCLKIN Timing (Video Display Mode)
Table 5-54. Timing Requirements for Video Display Mode for VPxCLKINx(1) (see Figure 5-55)
–500
–600
NO.
UNIT
MIN
9
MAX
1
2
3
4
tc(VKI)
Cycle time, VPxCLKINx
ns
ns
ns
ns
tw(VKIH)
tw(VKIL)
tt(VKI)
Pulse duration, VPxCLKINx high
Pulse duration, VPxCLKINx low
Transition time, VPxCLKINx
4.1
4.1
3
(1) The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
4
1
2
3
VPxCLKINx
4
Figure 5-55. Video Port Display VPxCLKINx Timing
5.13.3.4 Video Control Input/Output and Video Display Data Output Timing With Respect to VPxCLKINx
and VPxCLKOUTx (Video Display Mode)
Table 5-55. Timing Requirements in Video Display Mode for Video Control Input Shown With Respect to
VPxCLKINx and VPxCLKOUTx (see Figure 5-56)
–500
–600
NO.
UNIT
MIN
MAX
13 tsu(VCTLV-VKIH)
14 th(VCTLV-VKIH)
15 tsu(VCTLV-VKOH)
16 th(VCTLV-VKOH)
Setup time, VPxCTLx valid before VPxCLKINx high
Hold time, VPxCTLx valid after VPxCLKINx high
Setup time, VPxCTLx valid before VPxCLKOUTx high(1)
Hold time, VPxCTLx valid after VPxCLKOUTx high(1)
2.9
0.5
ns
ns
ns
ns
7.4
–0.9
(1) Assuming non-inverted VPxCLKOUTx signal.
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Table 5-56. Switching Characteristics Over Recommended Operating Conditions in Video Display Mode
for Video Data and Control Output Shown With Respect to VPxCLKINx and VPxCLKOUTx(1) (2)
(see Figure 5-56)
–500
–600
MIN
V – 0.7
NO.
PARAMETER
UNIT
MAX
1
2
3
4
5
6
7
8
9
tc(VKO)
Cycle time, VPxCLKOUTx
V + 0.7
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tw(VKOH)
Pulse duration, VPxCLKOUTx high
VH – 0.7 VH + 0.7
VL – 0.7 VL + 0.7
1.8
tw(VKOL)
Pulse duration, VPxCLKOUTx low
tt(VKO)
Transition time, VPxCLKOUTx
td(VKIH-VKOH)
td(VKIL-VKOL)
td(VKIH-VKOL)
td(VKIL-VKOH)
td(VKIH-VPOUTV)
Delay time, VPxCLKINx high to VPxCLKOUTx high(3)
Delay time, VPxCLKINx low to VPxCLKOUTx low(3)
Delay time, VPxCLKINx high to VPxCLKOUTx low
Delay time, VPxCLKINx low to VPxCLKOUTx high
Delay time, VPxCLKINx high to VPxOUT valid(4)
Delay time, VPxCLKINx high to VPxOUT invalid(4)
Delay time, VPxCLKOUTx high to VPxOUT valid(1) (4)
Delay time, VPxCLKOUTx high to VPxOUT invalid(1) (4)
1.1
1.1
1.1
1.1
5.7
5.7
5.7
5.7
9
10 td(VKIH-VPOUTIV)
11 td(VKOH-VPOUTV)
12 td(VKOH-VPOUTIV)
1.7
4.3
–0.2
(1) V = the video input clock (VPxCLKINx) period in ns.
(2) VH is the high period of V (video input clock period) in ns and VL is the low period of V (video input clock period) in ns.
(3) Assuming non-inverted VPxCLKOUTx signal.
(4) VPxOUT consists of VPxCTLx and VPxD[19:0]
VPxCLKINx
5
7
2
1
6
8
3
VPxCLKOUTx
[VCLK2P = 0]
4
4
VPxCLKOUTx
(Inverted)
[VCLK2P = 1]
12
10
11
9
VPxCTLx,V
PxD[19:0]
(Outputs)
15
16
14
13
VPxCTLx
(Input)
Figure 5-56. Video Port Display Data Output Timing and Control Input/Output Timing With Respect to
VPxCLKINx and VPxCLKOUTx
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5.13.3.5 Video Dual-Display Sync Mode Timing (With Respect to VPxCLKINx)
Table 5-57. Timing Requirements for Dual-Display Sync Mode for VPxCLKINx (see Figure 5-57)
–500
–600
NO.
UNIT
MIN
MAX
1
tskr(VKI)
Skew rate, VPxCLKINx before VPyCLKINy
±500
ps
VPxCLKINx
1
VPyCLKINy
Figure 5-57. Video Port Dual-Display Sync Timing
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5.14 VCXO Interpolated Control (VIC)
The VIC can be used in conjunction with the Video Ports (VPs) to maintain synchronization of a video
stream. The VIC can also be used to control a VCXO to adjust the pixel clock rate to a video port.
5.14.1 VIC Device-Specific Information
The VCXO interpolated control (VIC) port provides digital-to-analog conversation with resolution from
9-bits to up to 16-bits. The output of the VIC is a single bit interpolated D/A output (VDAC pin).
Typical D/A converters provide a discrete output level for every value of the digital word that is being
converted. This is a problem for digital words that are long. This is avoided in a Sigma Delta type D/A
converter by choosing a few widely spaced output levels and interpolating values between them. The
interpolating mechanism causes the output to oscillate rapidly between the levels in such a manner that
the average output represents the value of input code.
In the VIC, two output levels are chosen (0 and 1), and Sigma Delta interpolation scheme is implemented
to interpolate between these levels with a rapidly changing signal. The frequency of interpolation is
dependent on the resolution needed.
When the video port is used in transport stream interface (TSI) mode, the VIC port is used to control the
system clock, VCXO, for MPEG transport stream.
The VIC supports the following features:
•
•
•
Single interpolation for D/A conversion
Programmable precision from 9-to-16 bits
Interface for register accesses
For more detailed information on the DM643 VCXO interpolated control (VIC) peripheral, see the
TMS320C64x DSP Video Port/VCXO Interpolated Control (VIC) Port Reference Guide (literature number
SPRU629).
5.14.2 VIC Peripheral Register Description(s)
Table 5-58. VCXO Interpolated Control (VIC) Port Registers
HEX ADDRESS RANGE
01C4 C000
ACRONYM
VICCTL
VICIN
REGISTER NAME
VIC control register
01C4 C004
VIC input register
VIC clock divider register
Reserved
01C4 C008
VPDIV
–
01C4 C00C – 01C4 FFFF
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5.14.3 VIC Electrical Data/Timing
5.14.3.1 STCLK Timing
Table 5-59. Timing Requirments for STCLK(1) (see Figure 5-58)
–500
–600
NO.
UNIT
MIN
MAX
1
2
3
4
tc(STCLK)
tw(STCLKH)
tw(STCLKL)
tt(STCLK)
Cycle time, STCLK
33.3
16
ns
ns
ns
ns
Pulse duration, STCLK high
Pulse duration, STCLK low
Transition time, STCLK
16
3
(1) The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
4
1
2
3
STCLK
4
Figure 5-58. STCLK Timing
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5.15 Ethernet Media Access Controller (EMAC)
The EMAC controls the flow of packet data from the DSP to the PHY.
5.15.1 EMAC Device-Specific Information
The ethernet media access controller (EMAC) provides an efficient interface between the DM643 DSP
core processor and the network. The DM643 EMAC support both 10Base-T and 100Base-TX, or
10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex, with hardware flow control and quality
of service (QOS) support. The DM643 EMAC makes use of a custom interface to the DSP core that
allows efficient data transmission and reception.
The EMAC controls the flow of packet data from the DSP to the PHY. The MDIO module controls PHY
configuration and status monitoring.
Both the EMAC and the MDIO modules interface to the DSP through a custom interface that allows
efficient data transmission and reception. This custom interface is referred to as the EMAC control
module, and is considered integral to the EMAC/MDIO peripheral. The control module is also used to
control device reset, interrupts, and system priority.
The TMS320C6000 DSP Ethernet Media Access Controller (EMAC) / Management Data Input/Output
(MDIO) Module Reference Guide (literature number SPRU628) describes the DM643 EMAC peripheral in
detail. Some of the features documented in this peripheral reference guide are not supported on the
DM643 at this time. The DM643 supports one receive channel and does not support receive quality of
service (QOS). For a list of supported registers and register fields, see Table 5-60 [Ethernet MAC (EMAC)
Control Registers] and Table 5-61 [EMAC Statistics Registers] in this data manual.
5.15.2 EMAC Peripheral Register Description(s)
Table 5-60. Ethernet MAC (EMAC) Control Registers
HEX ADDRESS RANGE
01C8 0000
ACRONYM
TXIDVER
REGISTER NAME
Transmit Identification and Version Register
01C8 0004
TXCONTROL
TXTEARDOWN
–
Transmit Control Register
Transmit Teardown Register
Reserved
01C8 0008
01C8 000C
01C8 0010
RXIDVER
Receive Identification and Version Register
Receive Control Register
01C8 0014
RXCONTROL
Receive Teardown Register
(RXTDNCH field only supports writes of 0.)
01C8 0018
RXTEARDOWN
–
01C8 001C – 01C8 00FF
Reserved
Receive Multicast/Broadcast/Promiscuous Channel Enable Register
(The RXQOSEN field is reserved and only supports writes of 0. The PROMCH,
BROADCH, and MUCTCH bit fields only support writes of 0.)
01C8 0100
RXMBPENABLE
Receive Unicast Set Register
(Bits 7–1 are reserved and only support writes of 0.)
01C8 0104
01C8 0108
RXUNICASTSET
Receive Unicast Clear Register
(Bits 7–1 are reserved and only support writes of 0.)
RXUNICASTCLEAR
01C8 010C
01C8 0110
RXMAXLEN
Receive Maximum Length Register
Receive Buffer Offset Register
RXBUFFEROFFSET
01C8 0114
RXFILTERLOWTHRESH Receive Filter Low Priority Packets Threshold Register
01C8 0118 – 01C8 011F
01C8 0120
–
Reserved
RX0FLOWTHRESH
Receive Channel 0 Flow Control Threshold Register
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Table 5-60. Ethernet MAC (EMAC) Control Registers (continued)
HEX ADDRESS RANGE
01C8 0124
ACRONYM
RX1FLOWTHRESH
RX2FLOWTHRESH
RX3FLOWTHRESH
RX4FLOWTHRESH
RX5FLOWTHRESH
RX6FLOWTHRESH
RX7FLOWTHRESH
RX0FREEBUFFER
RX1FREEBUFFER
RX2FREEBUFFER
RX3FREEBUFFER
RX4FREEBUFFER
RX5FREEBUFFER
RX6FREEBUFFER
RX7FREEBUFFER
MACCONTROL
MACSTATUS
REGISTER NAME
01C8 0128
01C8 012C
01C8 0130
Reserved. Do not write.
01C8 0134
01C8 0138
01C8 013C
01C8 0140
Receive Channel 0 Free Buffer Count Register
01C8 0144
01C8 0148
01C8 014C
01C8 0150
Reserved. Do not write.
01C8 0154
01C8 0158
01C8 015C
01C8 0160
MAC Control Register
01C8 0164
MAC Status Register (RXQOSACT field is reserved.)
Reserved
01C8 0168 – 01C8 016C
01C8 0170
–
TXINTSTATRAW
TXINTSTATMASKED
TXINTMASKSET
TXINTMASKCLEAR
MACINVECTOR
–
Transmit Interrupt Status (Unmasked) Register
Transmit Interrupt Status (Masked) Register
Transmit Interrupt Mask Set Register
Transmit Interrupt Mask Clear Register
MAC Input Vector Register
01C8 0174
01C8 0178
01C8 017C
01C8 0180
01C8 0184 – 01C8 018F
Reserved
Receive Interrupt Status (Unmasked) Register
(Bits 7–1 are reserved.)
01C8 0190
01C8 0194
01C8 0198
01C8 019C
RXINTSTATRAW
RXINTSTATMASKED
RXINTMASKSET
Receive Interrupt Status (Masked) Register
(Bits 7–1 are reserved.)
Receive Interrupt Mask Set Register
(Bits 7–1 are reserved and only support writes of 0.)
Receive Interrupt Mask Clear Register
(Bits 7–1 are reserved and only support writes of 0.)
RXINTMASKCLEAR
01C8 01A0
01C8 01A4
01C8 01A8
01C8 01AC
01C8 01B0
01C8 01B4
01C8 01B8
01C8 01BC
01C8 01C0
01C8 01C4
01C8 01C8
01C8 01CC
01C8 01D0
01C8 01D4
01C8 01D8
01C8 01DC
MACINTSTATRAW
MACINTSTATMASKED
MACINTMASKSET
MACINTMASKCLEAR
MACADDRL0
MAC Interrupt Status (Unmasked) Register
MAC Interrupt Status (Masked) Register
MAC Interrupt Mask Set Register
MAC Interrupt Mask Clear Register
MAC Address Channel 0 Lower Byte Register
MACADDRL1
MACADDRL2
MACADDRL3
MACADDRL4
Reserved. Do not write.
MACADDRL5
MACADDRL6
MACADDRL7
MACADDRM
MAC Address Middle Byte Register
MAC Address High Bytes Register
MAC Address Hash 1 Register
MAC Address Hash 2 Register
MACADDRH
MACHASH1
MACHASH2
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Table 5-60. Ethernet MAC (EMAC) Control Registers (continued)
HEX ADDRESS RANGE
01C8 01E0
ACRONYM
BOFFTEST
TPACETEST
RXPAUSE
TXPAUSE
–
REGISTER NAME
Backoff Test Register
01C8 01E4
Transmit Pacing Test Register
Receive Pause Timer Register
Transmit Pause Timer Register
Reserved
01C8 01E8
01C8 01EC
01C8 01F0 – 01C8 01FF
01C8 0200 – 01C8 05FF
01C8 0600
(see Table 5-61)
TX0HDP
EMAC Statistics Registers
Transmit Channel 0 DMA Head Descriptor Pointer Register
Transmit Channel 1 DMA Head Descriptor Pointer Register
Transmit Channel 2 DMA Head Descriptor Pointer Register
Transmit Channel 3 DMA Head Descriptor Pointer Register
Transmit Channel 4 DMA Head Descriptor Pointer Register
Transmit Channel 5 DMA Head Descriptor Pointer Register
Transmit Channel 6 DMA Head Descriptor Pointer Register
Transmit Channel 7 DMA Head Descriptor Pointer Register
Receive Channel 0 DMA Head Descriptor Pointer Register
01C8 0604
TX1HDP
01C8 0608
TX2HDP
01C8 060C
01C8 0610
TX3HDP
TX4HDP
01C8 0614
TX5HDP
01C8 0618
TX6HDP
01C8 061C
01C8 0620
TX7HDP
RX0HDP
01C8 0624
RX1HDP
01C8 0628
RX2HDP
01C8 062C
01C8 0630
RX3HDP
RX4HDP
Reserved. Do not write.
01C8 0634
RX5HDP
01C8 0638
RX6HDP
01C8 063C
01C8 0640
RX7HDP
TX0INTACK
TX1INTACK
TX2INTACK
TX3INTACK
TX4INTACK
TX5INTACK
TX6INTACK
TX7INTACK
RX0INTACK
RX1INTACK
RX2INTACK
RX3INTACK
RX4INTACK
RX5INTACK
RX6INTACK
RX7INTACK
–
Transmit Channel 0 Interrupt Acknowledge Register
Transmit Channel 1 Interrupt Acknowledge Register
Transmit Channel 2 Interrupt Acknowledge Register
Transmit Channel 3 Interrupt Acknowledge Register
Transmit Channel 4 Interrupt Acknowledge Register
Transmit Channel 5 Interrupt Acknowledge Register
Transmit Channel 6 Interrupt Acknowledge Register
Transmit Channel 7 Interrupt Acknowledge Register
Receive Channel 0 Interrupt Acknowledge Register
01C8 0644
01C8 0648
01C8 064C
01C8 0650
01C8 0654
01C8 0658
01C8 065C
01C8 0660
01C8 0664
01C8 0668
01C8 066C
01C8 0670
Reserved. Do not write.
01C8 0674
01C8 0678
01C8 067C
01C8 0680 – 01C8 0FFF
Reserved
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Table 5-61. EMAC Statistics Registers
HEX ADDRESS RANGE
ACRONYM
RXGOODFRAMES
RXBCASTFRAMES
RXMCASTFRAMES
RXPAUSEFRAMES
RXCRCERRORS
RXALIGNCODEERRORS
RXOVERSIZED
RXJABBER
REGISTER NAME
Good Receive Frames Register
01C8 0200
01C8 0204
01C8 0208
01C8 020C
01C8 0210
01C8 0214
01C8 0218
01C8 021C
01C8 0220
01C8 0224
01C8 0228
01C8 022C
01C8 0230
01C8 0234
01C8 0238
01C8 023C
01C8 0240
01C8 0244
01C8 0248
01C8 024C
01C8 0250
01C8 0254
01C8 0258
01C8 025C
01C8 0260
01C8 0264
01C8 0268
01C8 026C
01C8 0270
01C8 0274
01C8 0278
01C8 027C
01C8 0280
01C8 0284
01C8 0288
01C8 028C
01C8 0290 – 01C8 05FF
Broadcast Receive Frames Register
Multicast Receive Frames Register
Pause Receive Frames Register
Receive CRC Errors Register
Receive Alignment/Code Errors Register
Receive Oversized Frames Register
Receive Jabber Frames Register
RXUNDERSIZED
RXFRAGMENTS
RXFILTERED
Receive Undersized Frames Register
Receive Frame Fragments Register
Filtered Receive Frames Register
Reserved
RXQOSFILTERED
RXOCTETS
Receive Octet Frames Register
TXGOODFRAMES
TXBCASTFRAMES
TXMCASTFRAMES
TXPAUSEFRAMES
TXDEFERRED
Good Transmit Frames Register
Broadcast Transmit Frames Register
Multicast Transmit Frames Register
Pause Transmit Frames Register
Deferred Transmit Frames Register
Collision Register
TXCOLLISION
TXSINGLECOLL
TXMULTICOLL
Single Collision Transmit Frames Register
Multiple Collision Transmit Frames Register
Excessive Collisions Register
TXEXCESSIVECOLL
TXLATECOLL
Late Collisions Register
TXUNDERRUN
TXCARRIERSLOSS
TXOCTETS
Transmit Underrun Register
Transmit Carrier Sense Errors Register
Transmit Octet Frames Register
FRAME64
Transmit and Receive 64 Octet Frames Register
Transmit and Receive 65 to 127 Octet Frames Register
Transmit and Receive 128 to 255 Octet Frames Register
Transmit and Receive 256 to 511 Octet Frames Register
Transmit and Receive 512 to 1023 Octet Frames Register
Transmit and Receive 1024 or Above Octet Frames Register
Network Octet Frames Register
FRAME65T127
FRAME128T255
FRAME256T511
FRAME512T1023
FRAME1024TUP
NETOCTETS
RXSOFOVERRUNS
RXMOFOVERRUNS
RXDMAOVERRUNS
–
Receive Start of Frame Overruns Register
Receive Middle of Frame Overruns Register
Receive DMA Overruns Register
Reserved
Table 5-62. EMAC Wrapper
HEX ADDRESS RANGE
01C8 1000 – 01C8 1FFF
01C8 2000 – 01C8 2FFF
ACRONYM
REGISTER NAME
EMAC Control Module Descriptor Memory
Reserved
–
Table 5-63. EWRAP Registers
HEX ADDRESS RANGE
01C8 3000
ACRONYM
EWTRCTRL
EWCTL
REGISTER NAME
TR control
01C8 3004
Interrupt control register
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Table 5-63. EWRAP Registers (continued)
HEX ADDRESS RANGE
01C8 3008
ACRONYM
EWINTTCNT
–
REGISTER NAME
Interrupt timer count
Reserved
01C8 300C – 01C8 37FF
5.15.3 EMAC Electrical Data/Timing
Table 5-64. Timing Requirements for MRCLK (see Figure 5-59)
–500
–600
NO.
UNIT
MIN
MAX
1
2
3
tc(MRCLK)
Cycle time, MRCLK
40
14
14
ns
ns
ns
tw(MRCLKH)
tw(MRCLKL)
Pulse duration, MRCLK high
Pulse duration, MRCLK low
1
2
3
MRCLK
Figure 5-59. MRCLK Timing (EMAC – Receive)
Table 5-65. Timing Requirements for MTCLK (see Figure 5-59)
–500
–600
NO.
UNIT
MIN
MAX
1
2
3
tc(MTCLK)
Cycle time, MTCLK
40
14
14
ns
ns
ns
tw(MTCLKH)
tw(MTCLKL)
Pulse duration, MTCLK high
Pulse duration, MTCLK low
1
2
3
MTCLK
Figure 5-60. MTCLK Timing (EMAC – Transmit)
Table 5-66. Timing Requirements for EMAC MII Receive 10/100 Mbit/s(1) (see Figure 5-61)
–500
–600
NO.
UNIT
MIN
8
MAX
1
2
tsu(MRXD-MRCLKH)
th(MRCLKH-MRXD)
Setup time, receive selected signals valid before MRCLK high
Hold time, receive selected signals valid after MRCLK high
ns
ns
8
(1) Receive selected signals include: MRXD3-MRXD0, MRXDV, and MRXER.
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MRXD3–MRXD0 is driven by the PHY on the falling edge of MRCLK. MRXD3–MRXD0 timing must be
met during clock periods when MRXDV is asserted. MRXDV is asserted and deasserted by the PHY on
the falling edge of MRCLK. MRXER is driven by the PHY on the falling edge of MRCLK (xx = 00–01).
1
2
MRCLK (Input)
MRXD3−MRXD0,
MRXDV, MRXER (Inputs)
Figure 5-61. EMAC Receive Interface Timing
Table 5-67. Switching Characteristics Over Recommended Operating Conditions for EMAC MII Transmit
10/100 Mbit/s(1) (see Figure 5-62)
–500
–600
NO.
UNIT
MIN
MAX
1
td(MTCLKH-MTXD)
Delay time, MTCLK high to transmit selected signals valid
5
25
ns
(1) Transmit selected signals include: MTXD3–MTXD0, and MTXEN.
MTXD3–MTXD0 is driven by the reconciliation sublayer synchronous to the MTCLK. MTXEN is asserted
and deasserted by the reconciliation sublayer synchronous to the MTCLK rising edge.
1
MTCLK (Input)
MTXD3−MTXD0,
MTXEN (Outputs)
Figure 5-62. EMAC Transmit Interface Timing
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5.16 Management Data Input/Output (MDIO)
The MDIO module controls PHY configuration and status monitoring.
5.16.1 Device-Specific Information
The management data input/output (MDIO) module continuously polls all 32 MDIO addresses in order to
enumerate all PHY devices in the system.
The management data input/output (MDIO) module implements the 802.3 serial management interface to
interrogate and control Ethernet PHY(s) using a shared two-wire bus. Host software uses the MDIO
module to configure the auto-negotiation parameters of each PHY attached to the EMAC, retrieve the
negotiation results, and configure required parameters in the EMAC module for correct operation. The
module is designed to allow almost transparent operation of the MDIO interface, with very little
maintenance from the core processor.
The TMS320C6000 DSP Ethernet Media Access Controller (EMAC) / Management Data Input/Output
(MDIO) Module Reference Guide (literature number SPRU628) describes the DM643 MDIO peripheral in
detail. Some of the features documented in this peripheral reference guide are not supported on the
DM643 at this time. The DM643 only supports one EMAC module. For a list of supported registers and
register fields, see Table 5-68 [MDIO Registers] in this data manual.
5.16.2 Peripheral Register Description(s)
Table 5-68. MDIO Registers
HEX ADDRESS RANGE
01C8 3800
ACRONYM
VERSION
CONTROL
ALIVE
REGISTER NAME
MDIO Version Register
MDIO Control Register
01C8 3804
01C8 3808
MDIO PHY Alive Indication Register
MDIO PHY Link Status Register
01C8 380C
LINK
MDIO Link Status Change Interrupt Register
(MAC1 field is reserved and only supports writes of 0.)
01C8 3810
01C8 3814
01C8 3818
01C8 381C
01C8 3820
01C8 3824
LINKINTRAW
LINKINTMASKED
USERINTRAW
MDIO Link Status Change Interrupt (Masked) Register
(MAC1 field is reserved and only supports writes of 0.)
MDIO User Command Complete Interrupt Register
(MAC1 field is reserved and only supports writes of 0.)
MDIO User Command Complete Interrupt (Masked) Register
(MAC1 field is reserved and only supports writes of 0.)
USERINTMASKED
USERINTMASKSET
USERINTMASKCLEAR
MDIO User Command Complete Interrupt Mask Set Register
(MAC1 field is reserved and only supports writes of 0.)
MDIO User Command Complete Interrupt Mask Clear Register
(MAC1 field is reserved and only supports writes of 0.)
01C8 3828
01C8 382C
USERACCESS0
USERACCESS1
USERPHYSEL0
USERPHYSEL1
–
MDIO User Access Register 0
Reserved. Do not write.
MDIO User PHY Select Register 0
Reserved. Do not write.
Reserved
01C8 3830
01C8 3834
01C8 3838 – 01C8 3FFF
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5.16.3 Management Data Input/Output (MDIO) Electrical Data/Timing
Table 5-69. Timing Requirements for MDIO Input (see Figure 5-63)
–500
–600
NO.
UNIT
MIN
MAX
1
2
3
4
tc(MDCLK)
Cycle time, MDCLK
400
180
10
ns
ns
ns
ns
tw(MDCLK)
Pulse duration, MDCLK high/low
tsu(MDIO-MDCLKH)
th(MDCLKH-MDIO)
Setup time, MDIO data input valid before MDCLK high
Hold time, MDIO data input valid after MDCLK high
0
1
MDCLK
3
4
MDIO
(input)
Figure 5-63. MDIO Input Timing
Table 5-70. Switching Characteristics Over Recommended Operating Conditions for MDIO Output
(see Figure 5-64)
–500
–600
MIN
–10
NO.
UNIT
MAX
7
td(MDCLKL-MDIO)
Delay time, MDCLK low to MDIO data output valid
100
ns
1
MDCLK
7
MDIO
(output)
Figure 5-64. MDIO Output Timing
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5.17 Timer
The C6000™ DSP device has 32-bit general-purpose timers that can be used to:
•
•
•
•
•
Time events
Count events
Generate pulses
Interrupt the CPU
Send synchronization events to the DMA
The timers have two signaling modes and can be clocked by an internal or an external source. The timers
have an input pin and an output pin. The input and output pins (TINP and TOUT) can function as timer
clock input and clock output. They can also be respectively configured for general-purpose input and
output.
With an internal clock, for example, the timer can signal an external A/D converter to start a conversion, or
it can trigger the DMA controller to begin a data transfer. With an external clock, the timer can count
external events and interrupt the CPU after a specified number of events.
5.17.1 Timer Device-Specific Information
The DM643 device has a total of three 32-bit general-purpose timers (Timer0, Timer1, and Timer2).
Timer2 is not externally pinned out.
For more detailed information, see the TMS320C6000 DSP 32-Bit Timer Reference Guide (literature
number SPRU582).
5.17.2 Timer Peripheral Register Description(s)
Table 5-71. Timer 0 Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
COMMENTS
Determines the operating mode of the timer, monitors the
timer status, and controls the function of the TOUT pin.
0194 0000
CTL0
Timer 0 control register
Contains the number of timer input clock cycles to count.
This number controls the TSTAT signal frequency.
0194 0004
PRD0
Timer 0 period register
0194 0008
CNT0
–
Timer 0 counter register
Reserved
Contains the current value of the incrementing counter.
0194 000C – 0197 FFFF
Table 5-72. Timer 1 Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
COMMENTS
Determines the operating mode of the timer, monitors the
timer status, and controls the function of the TOUT pin.
0198 0000
CTL1
Timer 1 control register
Timer 1 period register
Contains the number of timer input clock cycles to count.
This number controls the TSTAT signal frequency.
0198 0004
PRD1
0198 0008
CNT1
–
Timer 1 counter register
Reserved
Contains the current value of the incrementing counter.
0198 000C – 019B FFFF
Table 5-73. Timer 2 Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
COMMENTS
Determines the operating mode of the timer, monitors the
timer status.
01AC 0000
CTL2
Timer 2 control register
Timer 2 period register
Contains the number of timer input clock cycles to count.
This number controls the TSTAT signal frequency.
01AC 0004
PRD2
01AC 0008
CNT2
–
Timer 2 counter register
Reserved
Contains the current value of the incrementing counter.
01AC 000C – 01AF FFFF
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5.17.3 Timer Electrical Data/Timing
Table 5-74. Timing Requirements for Timer Inputs(1) (see Figure 5-65)
–500
–600
NO.
UNIT
MIN
MAX
1
2
tw(TINPH)
tw(TINPL)
Pulse duration, TINP high
Pulse duration, TINP low
8P
8P
ns
ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
Table 5-75. Switching Characteristics Over Recommended Operating Conditions for Timer Outputs(1)
(see Figure 5-65)
–500
–600
NO.
PARAMETER
UNIT
MIN
MAX
3
4
tw(TOUTH)
tw(TOUTL)
Pulse duration, TOUT high
Pulse duration, TOUT low
8P – 3
8P – 3
ns
ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
2
1
TINPx
4
3
TOUTx
Figure 5-65. Timer Timing
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5.18 General-Purpose Input/Output (GPIO)
The GPIO peripheral provides dedicated general-purpose pins that can be configured as either inputs or
outputs. When configured as an output, you can write to an internal register to control the state driven on
the output pin. When configured as an input, you can detect the state of the input by reading the state of
an internal register.
In addition, the GPIO peripheral can produce CPU interrupts and EDMA events in different interrupt/event
generation modes.
5.18.1 GPIO Device-Specific Information
To use the GP[15:0] software-configurable GPIO pins, the GPxEN bits in the GP Enable (GPEN) Register
and the GPxDIR bits in the GP Direction (GPDIR) Register must be properly configured.
GPxEN = 1
GPxDIR = 0
GPxDIR = 1
GP[x] pin is enabled
GP[x] pin is an input
GP[x] pin is an output
where "x" represents one of the 15 through 0 GPIO pins
Figure 5-66 shows the GPIO enable bits in the GPEN register for the DM643 device. To use any of the
GPx pins as general-purpose input/output functions, the corresponding GPxEN bit must be set to "1"
(enabled). Default values are device-specific, so refer to Figure 5-66 for the DM643 default configuration.
31
15
16
Reserved
R-0
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
GP15 GP14 GP13 GP12 GP11 GP10
EN EN EN EN EN EN
GP9
EN
GP8
EN
GP7
EN
GP6
EN
GP5
EN
GP4
EN
GP3
EN
GP2
EN
GP1
EN
GP0
EN
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 R/W-1
Legend: R/W = Readable/Writable, -n = value after reset, -x = undefined value after reset
Figure 5-66. GPIO Enable Register (GPEN) [Hex Address: 01B0 0000]
Figure 5-67 shows the GPIO direction bits in the GPDIR register. This register determines if a given GPIO
pin is an input or an output providing the corresponding GPxEN bit is enabled (set to "1") in the GPEN
register. By default, all the GPIO pins are configured as input pins.
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16
31
Reserved
R-0
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
GP15 GP14 GP13 GP12 GP11 GP10
DIR DIR DIR DIR DIR DIR
GP9
DIR
GP8
DIR
GP7
DIR
GP6
DIR
GP5
DIR
GP4
DIR
GP3
DIR
GP2
DIR
GP1
DIR
GP0
DIR
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
Legend: R/W = Readable/Writable, -n = value after reset, -x = undefined value after reset
Figure 5-67. GPIO Direction Register (GPDIR) [Hex Address: 01B0 0004]
For more detailed information on general-purpose inputs/outputs (GPIOs), see the TMS320C6000 DSP
General-Purpose Input/Output (GPIO) Reference Guide (literature number SPRU584).
5.18.2 GPIO Peripheral Register Description(s)
Table 5-76. GP0 Registers
HEX ADDRESS RANGE
01B0 0000
ACRONYM
GPEN
GPDIR
GPVAL
–
REGISTER NAME
GP0 enable register
GP0 direction register
GP0 value register
01B0 0004
01B0 0008
01B0 000C
Reserved
01B0 0010
GPDH
GPHM
GPDL
GPLM
GPGC
GPPOL
–
GP0 delta high register
GP0 high mask register
GP0 delta low register
GP0 low mask register
GP0 global control register
GP0 interrupt polarity register
Reserved
01B0 0014
01B0 0018
01B0 001C
01B0 0020
01B0 0024
01B0 0028 – 01B3 EFFF
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5.18.3 General-Purpose Input/Output (GPIO) Electrical Data/Timing
Table 5-77. Timing Requirements for GPIO Inputs(1) (2) (see Figure 5-68)
–500
–600
NO.
UNIT
MIN
MAX
1
2
tw(GPIH)
tw(GPIL)
Pulse duration, GPIx high
Pulse duration, GPIx low
8P
8P
ns
ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
(2) The pulse width given is sufficient to generate a CPU interrupt or an EDMA event. However, if a user wants to have the DSP recognize
the GPIx changes through software polling of the GPIO register, the GPIx duration must be extended to at least 12P to allow the DSP
enough time to access the GPIO register through the CFGBUS.
Table 5-78. Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs(1)
(see Figure 5-68)
–500
–600
NO.
PARAMETER
UNIT
MIN
MAX
3
4
tw(GPOH)
tw(GPOL)
Pulse duration, GPOx high
Pulse duration, GPOx low
24P – 8(2)
24P – 8(2)
ns
ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 600 MHz, use P = 1.67 ns.
(2) This parameter value should not be used as a maximum performance specification. Actual performance of back-to-back accesses of the
GPIO is dependent upon internal bus activity.
2
1
GPIx
4
3
GPOx
Figure 5-68. GPIO Port Timing
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5.19 JTAG
The JTAG interface is used for BSDL testing and emulation of the DM643 device.
Note: IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
5.19.1 JTAG Device-Specific Information
5.19.1.1 IEEE 1149.1 JTAG Compatibility Statement
The TMS320DM643 DSP requires that both TRST and RESET be asserted upon power up to be properly
initialized. While RESET initializes the DSP core, TRST initializes the DSP's emulation logic. Both resets
are required for proper operation.
Note: TRST is synchronous and must be clocked by TCLK; otherwise, BSCAN may not respond as
expected after TRST is asserted.
While both TRST and RESET need to be asserted upon power up, only RESET needs to be released for
the DSP to boot properly. TRST may be asserted indefinitely for normal operation, keeping the JTAG port
interface and DSP's emulation logic in the reset state. TRST only needs to be released when it is
necessary to use a JTAG controller to debug the DSP or exercise the DSP's boundary scan functionality.
RESET must be released only in order for boundary-scan JTAG to read the variant field of IDCODE
correctly. Other boundary-scan instructions work correctly independent of current state of RESET.
The TMS320DM643 DSP includes an internal pulldown (IPD) on the TRST pin to ensure that TRST will
always be asserted upon power up and the DSP's internal emulation logic will always be properly
initialized when this pin is not routed out. JTAG controllers from Texas Instruments actively drive TRST
high. However, some third-party JTAG controllers may not drive TRST high but expect the use of a pullup
resistor on TRST. When using this type of JTAG controller, assert TRST to intialize the DSP after powerup
and externally drive TRST high before attempting any emulation or boundary scan operations.
Following the release of RESET, the low-to-high transition of TRST must be "seen" to latch the state of
EMU1 and EMU0. The EMU[1:0] pins configure the device for either Boundary Scan mode or Emulation
mode. For more detailed information, see the terminal functions section of this data sheet.
Note: The DESIGN_WARNING section of the TMS320DM643 BSDL file contains information and
constraints regarding proper device operation while in Boundary Scan Mode.
5.19.1.2 JTAG ID Register Description
The JTAG ID register is a read-only register that identifies to the customer the JTAG/Device ID. For the
DM643 device, the JTAG ID register resides at address location 0x01B3 F008. The register hex value for
the DM643 device is: 0x0007 902F. For the actual register bit names and their associated bit field
descriptions, see Figure 5-69 and Table 5-79.
31-28
VARIANT (4-Bit)
R-0000
27-12
11-1
0
PART NUMBER (16-Bit)
R-0000 0000 0111 1001
MANUFACTURER (11-Bit)
R-0000 0010 111
LSB
R-1
Legend: R = Read only, -n = value after reset
Figure 5-69. JTAG ID Register Description – TMS320DM643 Register Value – 0x0007 902F
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Table 5-79. JTAG ID Register Selection Bit Descriptions
BIT
31:28
27:12
11–1
0
NAME
VARIANT
DESCRIPTION
Variant (4-Bit) value. DM643 value: 0000.
Part Number (16-Bit) value. DM643 value: 0000 0000 0111 1001.
PART NUMBER
MANUFACTURER Manufacturer (11-Bit) value. DM643 value: 0000 0010 111.
LSB LSB. This bit is read as a "1" for DM643.
5.19.2 JTAG Peripheral Register Description(s)
Table 5-80. JTAG ID Register
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
JTAG Identification Register
COMMENTS
Read-only. Provides 32-bit
JTAG ID of the device.
01B3 F008
JTAGID
5.19.3 JTAG Test-Port Electrical Data/Timing
Table 5-81. Timing Requirements for JTAG Test Port (see Figure 5-70)
–500
–600
NO.
UNIT
MIN
MAX
1
3
4
tc(TCK)
Cycle time, TCK
35
10
9
ns
ns
ns
tsu(TDIV-TCKH)
th(TCKH-TDIV)
Setup time, TDI/TMS/TRST valid before TCK high
Hold time, TDI/TMS/TRST valid after TCK high
Table 5-82. Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port
(see Figure 5-70)
–500
–600
NO.
PARAMETER
Delay time, TCK low to TDO valid
UNIT
MIN
MAX
2
td(TCKL-TDOV)
0
18
ns
1
TCK
TDO
2
2
4
3
TDI/TMS/TRST
Figure 5-70. JTAG Test-Port Timing
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6 Revision History
This data sheet revision history highlights the technical changes made to the SPRS269C device-specific
data sheet to make it a SPRS269D revision.
SEE
ADDS/CHANGES/DELETES
Section 4.3 Added note regarding VOH and VOL
.
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7 Mechanical Data
The following table(s) show the thermal resistance characteristics for the PBGA − GDK, GNZ, ZDK, and
ZNZ mechanical packages.
7.1 Thermal Data
Table 7-1. Thermal Resistance Characteristics (S-PBGA Package) [GDK]
NO.
1
°C/W
AIR FLOW (m/s)(1)
RΘJC
RΘJB
Junction-to-case
Junction-to-board
3.3
7.92
18.2
15.3
13.7
12.2
0.37
0.47
0.57
0.7
N/A
N/A
0.00
0.5
2
3
4
RΘJA
PsiJT
PsiJB
Junction-to-free air
Junction-to-package top
Junction-to-board
5
1.0
6
2.00
0.00
0.5
7
8
9
1.0
10
11
12
13
14
2.00
0.00
0.5
11.4
11
10.7
10.2
1.0
2.00
(1) m/s = meters per second
Table 7-2. Thermal Resistance Characteristics (S-PBGA Package) [GNZ]
NO.
1
°C/W
AIR FLOW (m/s)(1)
RΘJC
RΘJB
Junction-to-case
Junction-to-board
3.3
7.46
17.4
14.0
12.3
10.8
0.37
0.47
0.57
0.7
N/A
N/A
0.00
0.5
2
3
4
RΘJA
PsiJT
PsiJB
Junction-to-free air
Junction-to-package top
Junction-to-board
5
1.0
6
2.00
0.00
0.5
7
8
9
1.0
10
11
12
13
14
2.00
0.00
0.5
11.4
11
10.7
10.2
1.0
2.00
(1) m/s = meters per second
Table 7-3. Thermal Resistance Characteristics (S-PBGA Package) [ZDK]
NO.
1
°C/W
AIR FLOW (m/s)(1)
RΘJC
RΘJB
Junction-to-case
Junction-to-board
3.3
N/A
N/A
2
7.92
(1) m/s = meters per second
156 Mechanical Data
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Table 7-3. Thermal Resistance Characteristics (S-PBGA Package) [ZDK] (continued)
NO.
3
°C/W
AIR FLOW (m/s)(1)
18.2
15.3
13.7
12.2
0.37
0.47
0.57
0.7
0.00
0.5
4
RΘJA
Junction-to-free air
Junction-to-package top
Junction-to-board
5
6
1.0
2.00
0.00
0.5
7
8
PsiJT
9
1.0
10
11
12
13
14
2.00
0.00
0.5
11.4
11
PsiJB
10.7
10.2
1.0
2.00
Table 7-4. Thermal Resistance Characteristics (S-PBGA Package) [ZNZ]
(1)
NO.
1
°C/W
AIR FLOW (m/s)
RΘJC
RΘJB
Junction-to-case
Junction-to-board
3.3
7.46
17.4
14.0
12.3
10.8
0.37
0.47
0.57
0.7
N/A
N/A
0.00
0.5
2
3
4
RΘJA
PsiJT
PsiJB
Junction-to-free air
Junction-to-package top
Junction-to-board
5
1.0
6
2.00
0.00
0.5
7
8
9
1.0
10
11
12
13
14
2.00
0.00
0.5
11.4
11
10.7
10.2
1.0
2.00
(1) m/s = meters per second
7.2 Packaging Information
The following packaging information and addendum reflect the most current released data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
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PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
TMS320DM643AGDK5
ACTIVE
FC/CSP
FCBGA
FCBGA
GDK
548
548
548
60
TBD
SNPB
Level-4-220C-72 HR
Level-4-220C-72 HR
Level-4-260C-72HR
TMS320DM643A
@ 2003 TI
GDK
500
TMS320DM643AGNZ5
TMS320DM643AZDK5
ACTIVE
ACTIVE
GNZ
ZDK
40
60
TBD
SNPB
TMS320DM643A
@ 2003 TI
GNZ
500
Pb-Free (RoHS
Exempt)
SNAGCU
TMS320DM643A
@ 2003 TI
ZDK
500
TMS320DM643AZDK6
TMS320DM643AZNZ6
ACTIVE
ACTIVE
FCBGA
FCBGA
ZDK
ZNZ
548
548
60
40
Pb-Free (RoHS
Exempt)
SNAGCU
SNAGCU
Level-4-260C-72HR
Level-4-260C-72HR
TMS320DM643A
@ 2003 TI
ZDK
Pb-Free (RoHS
Exempt)
TMS320DM643A
@ 2003 TI
ZNZ
TMS320DM643GDK600
TMS320DM643ZNZ500
OBSOLETE
OBSOLETE
FC/CSP
FCBGA
GDK
ZNZ
548
548
TBD
TBD
Call TI
Call TI
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
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Addendum-Page 2
MECHANICAL DATA
MPBG301 – JULY 2002
GDK (S–PBGA–N548)
PLASTIC BALL GRID ARRAY
23,10
22,90
SQ
SQ
20,00 TYP
21,10
20,90
0,80
0,40
AF
AD
AB
Y
AE
AC
AA
W
U
V
0,80
T
R
P
N
M
K
L
0,40
A1 Corner
J
H
G
F
E
D
C
B
A
1
3
5
7
9
11 13 15 17 19 21 23 25
2
4
6
8
10 12 14 16 18 20 22 24 26
Bottom View
2,80 MAX
0,50 NOM
Seating Plane
0,12
0,55
0,45
0,10
0,45
0,35
4203481-3/B 07/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Flip chip application only.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂꢃꢄ ꢅꢆꢂ ꢄꢇ ꢈ ꢄꢉꢄ
MPBG314A – OCTOBER 2002 – REVISED DECEMBER 2002
GNZ (S–PBGA–N548)
PLASTIC BALL GRID ARRAY
27,20
26,80
25,00 TYP
1,00
SQ
SQ
25,20
24,80
0,50
AF
AE
AD
AC
AB
AA
Y
W
V
1,00
U
T
R
P
N
M
L
0,50
K
J
H
A1 Corner
G
F
E
D
C
B
A
1
3
5
7
9
11 13 15 17 19 21 23 25
10 12 14 16 18 20 22 24 26
2
4
6
8
Bottom View
2,80 MAX
0,50 NOM
Seating Plane
0,15
0,70
0,50
0,10
0,60
0,40
4202595-5\E 12/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Flip chip application only.
D. Substrate color may vary.
1
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