TMS320F28063PFPS [TI]

Piccolo Microcontrollers; Piccolo微处理器
TMS320F28063PFPS
型号: TMS320F28063PFPS
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Piccolo Microcontrollers
Piccolo微处理器

微控制器和处理器 外围集成电路 微处理器 时钟
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TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
www.ti.com  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Piccolo Microcontrollers  
Check for Samples: TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066,  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
1 TMS320F2806x ( Piccolo™) MCUs  
1.1 Features  
123  
• High-Efficiency 32-Bit CPU (TMS320C28x™)  
– 90 MHz (11.11-ns Cycle Time)  
– 16 x 16 and 32 x 32 MAC Operations  
– 16 x 16 Dual MAC  
• Clocking  
– Two Internal Zero-pin Oscillators  
– On-Chip Crystal Oscillator/External Clock  
Input  
– Dynamic PLL Ratio Changes Supported  
– Watchdog Timer Module  
– Harvard Bus Architecture  
– Atomic Operations  
– Missing Clock Detection Circuitry  
• Peripheral Interrupt Expansion (PIE) Block That  
Supports All Peripheral Interrupts  
• Three 32-Bit CPU Timers  
• Advanced Control Peripherals  
• Up to 8 Enhanced Pulse Width Modulator  
(ePWM) Modules  
– 16 PWM Channels Total (8 HRPWM-Capable)  
– Independent 16-Bit Timer in Each Module  
• Three Input Capture (eCAP) Modules  
– Fast Interrupt Response and Processing  
– Unified Memory Programming Model  
– Code-Efficient (in C/C++ and Assembly)  
• Floating-Point Unit  
– Native Single-Precision Floating-Point  
Operations  
• Programmable Control Law Accelerator (CLA)  
– 32-Bit Floating-Point Math Accelerator  
– Executes Code Independently of the Main  
CPU  
• Up to 4 High-Resolution Input Capture (HRCAP)  
Modules  
• Up to 2 Quadrature Encoder (eQEP) Modules  
• 12-Bit ADC, Dual Sample-and-Hold (S/H)  
– Up to 3.46 MSPS  
• Viterbi, Complex Math, CRC Unit (VCU)  
– Extends C28x™ Instruction Set to Support  
Complex Multiply, Viterbi Operations, and  
Cyclic Redundency Check (CRC)  
• Embedded Memory  
– Up to 256KB Flash  
– Up to 16 Channels  
– Up to 100KB RAM  
– 2KB OTP ROM  
• 6-Channel DMA  
• Low Device and System Cost  
– Single 3.3-V Supply  
– No Power Sequencing Requirement  
• On-Chip Temperature Sensor  
• 128-Bit Security Key and Lock  
– Protects Secure Memory Blocks  
– Prevents Firmware Reverse Engineering  
• Serial Port Peripherals  
– Two Serial Communications Interface (SCI)  
[UART] Modules  
– Two Serial Peripheral Interface (SPI)  
Modules  
– Integrated Power-on Reset and Brown-out  
Reset  
– Low-Power Operating Modes  
– No Analog Support Pin  
– One Inter-Integrated-Circuit (I2C) Bus  
– One Multichannel Buffered Serial Port  
(McBSP) Bus  
• Endianness: Little Endian  
– One Enhanced Controller Area Network  
(eCAN)  
– One Universal Serial Bus (USB) 2.0 Module  
(Available on TMS320F2806xU Devices Only)  
Full-Speed Device Mode  
Full-Speed or Low-Speed Host Mode  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
Piccolo, PowerPAD, C28x, TMS320C2000, C2000, ControlSUITE, Code Composer Studio, XDS510, XDS560, TMS320C28x,  
TMS320C54x, TMS320C55x are trademarks of Texas Instruments.  
All other trademarks are the property of their respective owners.  
3
UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information  
current as of publication date. Products conform to specifications per the terms of Texas  
Instruments standard warranty. Production processing does not necessarily include  
testing of all parameters.  
Copyright © 2010–2012, Texas Instruments Incorporated  
 
 
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
www.ti.com  
• Up to 54 Individually Programmable,  
Multiplexed GPIO Pins With Input Filtering  
• 2806x Packages  
– 80-Pin PFP and 100-Pin PZP PowerPAD™  
• Advanced Emulation Features  
– Analysis and Breakpoint Functions  
– Real-Time Debug via Hardware  
Thermally Enhanced Thin Quad Flatpacks  
(HTQFPs)  
– 80-Pin PN and 100-Pin PZ Low-Profile Quad  
Flatpacks (LQFPs)  
1.2 Description  
The F2806x Piccolo™ family of microcontrollers provides the power of the C28x™ core and Control Law  
Accelerator (CLA) coupled with highly integrated control peripherals in low pin-count devices. This family  
is code-compatible with previous C28x-based code, as well as providing a high level of analog integration.  
An internal voltage regulator allows for single-rail operation. Enhancements have been made to the  
HRPWM module to allow for dual-edge control (frequency modulation). Analog comparators with internal  
10-bit references have been added and can be routed directly to control the PWM outputs. The ADC  
converts from 0 to 3.3-V fixed full scale range and supports ratio-metric VREFHI/VREFLO references. The  
ADC interface has been optimized for low overhead and latency.  
2
TMS320F2806x ( Piccolo™) MCUs  
Copyright © 2010–2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065  
TMS320F28064 TMS320F28063 TMS320F28062  
 
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
www.ti.com  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
1.3 Functional Block Diagram  
M0 SARAM (1Kx16)  
(0-wait, Non-Secure)  
L0 DPSARAM (2Kx16)  
(0-wait, Secure)  
CLA Data RAM2  
OTP 1Kx16  
Secure  
M1 SARAM (1Kx16)  
(0-wait, Non-Secure)  
L1 DPSARAM (1Kx16)  
(0-wait, Secure)  
CLA Data RAM0  
FLASH  
128Kx16  
64Kx16  
L5 DPSARAM (8Kx16)  
(0-wait, Non-Secure)  
DMA RAM0  
Code  
Security  
Module  
(CSM)  
L2 DPSARAM (1Kx16)  
(0-wait, Secure)  
CLA Data RAM1  
8 equal sectors  
Secure  
L6 DPSARAM (8Kx16)  
(0-wait, Non-Secure)  
DMA RAM1  
L3 DPSARAM (4Kx16)  
(0-wait, Secure)  
CLA Program RAM  
PUMP  
L7 DPSARAM (8Kx16)  
(0-wait, Non-Secure)  
DMA RAM2  
OTP/Flash  
Wrapper  
L4 SARAM (8Kx16)  
(0-wait, Secure)  
PSWD  
L8 DPSARAM (8Kx16)  
(0-wait, Non-Secure)  
DMA RAM3  
Memory Bus  
DMA Bus  
Boot-ROM  
(32Kx16)  
(0-wait,  
COMP1OUT  
COMP2OUT  
Non-Secure)  
TRST  
C28x 32-bit CPU  
FPU  
VCU  
TCK, TDI, TMS  
TDO  
COMP3OUT  
COMP  
+
DAC  
COMP1A  
XCLKIN  
CLA +  
Message  
RAMs  
COMP1B  
COMP2A  
COMP2B  
OSC1, OSC2,  
Ext, PLLs,  
LPM, WD,  
CPU Timer 0,  
CPU Timer 1,  
CPU Timer 2,  
PIE  
LPM Wakeup  
3 Ext. Interrupts  
COMP3A  
COMP3B  
X1  
X2  
DMA  
6-ch  
XRS  
ADC  
0-wait  
Result  
Regs  
CLA Bus  
DMA Bus  
A7:0  
ADC  
B7:0  
Memory Bus  
32-bit Peripheral  
Bus  
32-bit  
Peripheral Bus  
(CLA accessible)  
32-bit Peripheral Bus  
(CLA accessible)  
32-bit Peripheral  
Bus  
32-bit Peripheral  
Bus  
16-bit Peripheral Bus  
HRCAP1  
HRCAP2  
HRCAP3  
HRCAP4  
ePWM1 to ePWM8  
HRPWM (8ch)  
SCI-A SPI-A  
SCI-B SPI-B  
(4L FIFO) (4L FIFO)  
eCAP1  
eCAP2  
eCAP3  
I2C-A  
(4L FIFO)  
eCAN-A  
(32-mbox)  
eQEP1  
eQEP2  
USB-0  
McBSP-A  
GPIO Mux  
A. Not all peripheral pins are available at the same time due to multiplexing.  
Figure 1-1. Functional Block Diagram  
Copyright © 2010–2012, Texas Instruments Incorporated  
TMS320F2806x ( Piccolo™) MCUs  
3
Submit Documentation Feedback  
Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065  
TMS320F28064 TMS320F28063 TMS320F28062  
 
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
www.ti.com  
1.4 System Device Diagram  
C28x  
Core  
(90-MHz)  
PWM-1A  
PWM-1B  
PWM1  
(DMA-accessible)  
ADC  
(DMA-  
accessible)  
VREFLO  
VREFHI  
PWM-2A  
PWM-2B  
PWM2  
(DMA-accessible)  
FPU  
VCU  
VREF  
PWM-3A  
PWM-3B  
PWM3  
(DMA-accessible)  
Flash Memory  
RAM  
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
B0  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
PWM-4A  
PWM-4B  
PWM4  
(DMA-accessible)  
RAM  
(Dual-Access)  
12-bit  
3.46-MSPS  
Dual  
Sample-  
and-  
Hold  
PWM-5A  
PWM-5B  
PWM5  
(DMA-accessible)  
PWM-6A  
PWM-6B  
PWM6  
(DMA-accessible)  
CLA Core  
90-MHz Floating-Point  
(Accelerator)  
PWM-7A  
PWM-7B  
PWM7  
(DMA-accessible)  
SOC-based  
(DMA-accessible)  
PWM-8A  
PWM-8B  
PWM8  
(DMA-accessible)  
Temp  
Sensor  
6
TZ1  
TZ2  
TZ3  
Trip Zone  
CMP1-Out  
CMP2-Out  
CMP1-out  
CMP2-out  
CMP3-out  
10-bit  
DAC  
3
8
4
eCAP  
eCAP x 3  
eQEP x 2  
10-bit  
DAC  
CMP3-Out  
eQEP  
10-bit  
DAC  
Analog  
Comparators  
HRCAP  
HRCAP x 4  
COMMS  
Timers 32-bit  
Vreg  
Timer-0  
Timer-1  
Timer-2  
4
8
2
2
6
2
UART x 2  
SPI x 2  
Int-Osc-1  
Int-Osc-2  
WD  
PLL  
X1  
X2  
On-chip Osc  
POR/BOR  
System  
GPIO  
Control  
I2C  
CAN  
McBSP  
(DMA-accessible)  
USB  
(DMA-accessible)  
Figure 1-2. Peripheral Blocks  
4
TMS320F2806x ( Piccolo™) MCUs  
Copyright © 2010–2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065  
TMS320F28064 TMS320F28063 TMS320F28062  
 
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
www.ti.com  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
1
TMS320F2806x ( Piccolo™) MCUs .................. 1  
5.4  
Clock Requirements and Characteristics ........... 65  
1.1 Features ............................................. 1  
1.2 Description ........................................... 2  
1.3 Functional Block Diagram ........................... 3  
1.4 System Device Diagram ............................. 4  
Device Overview ........................................ 6  
2.1 Device Characteristics ............................... 6  
2.2 Memory Maps ........................................ 9  
2.3 Pin Assignments .................................... 19  
2.4 Signal Descriptions ................................. 21  
2.5 Brief Descriptions ................................... 30  
2.6 Register Map ....................................... 40  
2.7 Device Emulation Registers ........................ 42  
2.8 VREG, BOR, POR .................................. 44  
2.9 System Control ..................................... 46  
2.10 Low-power Modes Block ........................... 55  
Device and Documentation Support ............... 56  
3.1 Getting Started ..................................... 56  
3.2 Development Support .............................. 56  
5.5 Power Sequencing ................................. 66  
5.6 Current Consumption ............................... 69  
5.7  
Emulator Connection Without Signal Buffering for  
the MCU ............................................ 73  
5.8 Interrupts ............................................ 74  
2
5.9  
Control Law Accelerator (CLA) Overview .......... 79  
5.10 Analog Block ........................................ 82  
5.11 Detailed Descriptions ............................... 96  
5.12 Serial Peripheral Interface (SPI) Module ........... 97  
5.13 Serial Communications Interface (SCI) Module .. 106  
5.14 Multichannel Buffered Serial Port (McBSP) Module  
..................................................... 109  
5.15 Enhanced Controller Area Network (eCAN) Module  
..................................................... 119  
5.16 Inter-Integrated Circuit (I2C) ...................... 123  
5.17 Enhanced Pulse Width Modulator (ePWM) Modules  
(ePWM1–ePWM8) ................................ 126  
3
5.18 High-Resolution PWM (HRPWM) ................. 133  
5.19 Enhanced Capture Module (eCAP1) .............. 134  
5.20 High-Resolution Capture Modules  
3.3  
Device and Development Support Tool  
(HRCAP1–HRCAP4) .............................. 136  
5.21 Enhanced Quadrature Encoder Modules (eQEP1,  
Nomenclature ....................................... 56  
3.4 Documentation Support ............................ 58  
3.5 Community Resources ............................. 59  
Device Operating Conditions ....................... 60  
4.1 Absolute Maximum Ratings ........................ 60  
4.2 Recommended Operating Conditions .............. 60  
4.3 Electrical Characteristics ........................... 61  
Peripheral and Electrical Specifications .......... 62  
5.1 Parameter Information .............................. 62  
5.2 Test Load Circuit ................................... 62  
5.3 Device Clock Table ................................. 63  
eQEP2) ............................................ 138  
5.22 JTAG Port ......................................... 141  
5.23 General-Purpose Input/Output (GPIO) MUX ...... 142  
5.24 Universal Serial Bus (USB) ....................... 154  
5.25 Flash Timing ...................................... 155  
Revision History ..................................... 157  
4
5
6
7
Mechanical Packaging and Orderable  
Information ............................................ 159  
7.1 Thermal Data ...................................... 159  
7.2 Packaging Information ............................ 160  
Copyright © 2010–2012, Texas Instruments Incorporated  
Contents  
5
Submit Documentation Feedback  
Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065  
TMS320F28064 TMS320F28063 TMS320F28062  
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
www.ti.com  
2 Device Overview  
2.1 Device Characteristics  
Table 2-1 lists the features of the TMS320F2806x devices.  
6
Device Overview  
Copyright © 2010–2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065  
TMS320F28064 TMS320F28063 TMS320F28062  
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
www.ti.com  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Table 2-1. Hardware Features  
28069,  
28069U(2)  
(90 MHz)  
28068,  
28068U(2)  
(90 MHz)  
28067,  
28067U(2)  
(90 MHz)  
28066,  
28066U(2)  
(90 MHz)  
28065,  
28065U(2)  
(90 MHz)  
28064,  
28064U(2)  
(90 MHz)  
28063,  
28063U(2)  
(90 MHz)  
28062,  
28062U(2)  
(90 MHz)  
FEATURE  
TYPE(1)  
Package Type  
(PFP and PZP are HTQFPs.  
PN and PZ are LQFPs.)  
100-Pin  
PZ  
PZP  
80-Pin  
PN  
PFP  
100-Pin  
PZ  
PZP  
80-Pin  
PN  
PFP  
100-Pin  
PZ  
PZP  
80-Pin  
PN  
PFP  
100-Pin  
PZ  
PZP  
80-Pin  
PN  
PFP  
100-Pin  
PZ  
PZP  
80-Pin  
PN  
PFP  
100-Pin  
PZ  
PZP  
80-Pin  
PN  
PFP  
100-Pin  
PZ  
PZP  
80-Pin  
PN  
PFP  
100-Pin  
PZ  
PZP  
80-Pin  
PN  
PFP  
Instruction cycle  
11.11 ns  
11.11 ns  
11.11 ns  
11.11 ns  
11.11 ns  
11.11 ns  
11.11 ns  
11.11 ns  
Floating-Point Unit (FPU)  
Viterbi, Complex Math, CRC Unit (VCU)  
Control Law Accelerator (CLA)  
6-Channel DMA  
Yes  
Yes  
Yes  
Yes  
128K  
50K  
Yes  
Yes  
No  
Yes  
No  
Yes  
No  
Yes  
Yes  
Yes  
Yes  
64K  
50K  
Yes  
Yes  
No  
Yes  
No  
Yes  
No  
0
0
No  
No  
No  
No  
Yes  
128K  
50K  
Yes  
128K  
50K  
Yes  
128K  
34K  
Yes  
64K  
50K  
Yes  
64K  
34K  
Yes  
64K  
26K  
On-chip Flash (16-bit word)  
On-chip SARAM (16-bit word)  
Code security for on-chip Flash, SARAM,  
and OTP blocks  
Yes  
Yes  
1K  
Yes  
Yes  
1K  
Yes  
Yes  
1K  
Yes  
Yes  
1K  
Yes  
Yes  
1K  
Yes  
Yes  
1K  
Yes  
Yes  
1K  
Yes  
Yes  
1K  
Boot ROM (32K x 16)  
One-time programmable (OTP) ROM  
(16-bit word)  
ePWM outputs  
1
1
0
16  
8
14  
6
16  
8
14  
6
16  
8
14  
6
16  
8
14  
6
16  
8
14  
6
16  
8
14  
6
16  
8
14  
6
16  
8
14  
6
High-resolution ePWM Channels  
eCAP inputs  
3
3
3
3
3
3
3
3
High-resolution capture modules  
(HRCAP)  
0
4
2
1
1
4
2
1
1
4
2
1
1
4
2
1
1
4
2
1
1
4
2
1
1
4
2
1
1
4
2
1
1
eQEP modules  
Watchdog timer  
MSPS  
0
Yes  
3.46  
Yes  
3.46  
Yes  
3.46  
Yes  
3.46  
Yes  
3.46  
Yes  
3.46  
Yes  
3.46  
Yes  
3.46  
Conversion Time  
289 ns  
289 ns  
289 ns  
289 ns  
289 ns  
289 ns  
289 ns  
289 ns  
12-Bit ADC  
Channels  
3
16  
12  
16  
12  
16  
12  
16  
12  
16  
12  
16  
12  
16  
12  
16  
12  
Temperature Sensor  
Dual Sample-and-Hold  
Yes  
Yes  
3
Yes  
Yes  
3
Yes  
Yes  
3
Yes  
Yes  
3
Yes  
Yes  
3
Yes  
Yes  
3
Yes  
Yes  
3
Yes  
Yes  
3
32-Bit CPU timers  
0
0
Comparators with Integrated DACs  
Inter-integrated circuit (I2C)  
3
3
3
3
3
3
3
3
1
1
1
1
1
1
1
1
Multichannel Buffered Serial Port  
(McBSP)  
1
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Enhanced Controller Area Network  
(eCAN)  
Serial Peripheral Interface (SPI)  
Serial Communications Interface (SCI)  
Universal Serial Bus (USB)  
1
0
0
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
1(2)  
1(2)  
1(2)  
1(2)  
1(2)  
1(2)  
1(2)  
1(2)  
(1) A type change represents a major functional feature difference in a peripheral module. Within a peripheral type, there may be minor differences between devices that do not affect the  
basic functionality of the module. These device-specific differences are listed in the TMS320x28xx, 28xxx DSP Peripheral Reference Guide (literature number SPRU566) and in the  
peripheral reference guides.  
(2) USB is present only in TMS320F2806xU devices.  
Copyright © 2010–2012, Texas Instruments Incorporated  
Device Overview  
7
Submit Documentation Feedback  
Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065  
TMS320F28064 TMS320F28063 TMS320F28062  
 
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
www.ti.com  
Table 2-1. Hardware Features (continued)  
28069,  
28069U(2)  
(90 MHz)  
28068,  
28068U(2)  
(90 MHz)  
28067,  
28067U(2)  
(90 MHz)  
28066,  
28066U(2)  
(90 MHz)  
28065,  
28065U(2)  
(90 MHz)  
28064,  
28064U(2)  
(90 MHz)  
28063,  
28063U(2)  
(90 MHz)  
28062,  
28062U(2)  
(90 MHz)  
FEATURE  
TYPE(1)  
Package Type  
(PFP and PZP are HTQFPs.  
PN and PZ are LQFPs.)  
100-Pin  
PZ  
PZP  
80-Pin  
PN  
PFP  
100-Pin  
PZ  
PZP  
80-Pin  
PN  
PFP  
100-Pin  
PZ  
PZP  
80-Pin  
PN  
PFP  
100-Pin  
PZ  
PZP  
80-Pin  
PN  
PFP  
100-Pin  
PZ  
PZP  
80-Pin  
PN  
PFP  
100-Pin  
PZ  
PZP  
80-Pin  
PN  
PFP  
100-Pin  
PZ  
PZP  
80-Pin  
PN  
PFP  
100-Pin  
PZ  
PZP  
80-Pin  
PN  
PFP  
2-pin Oscillator  
0-pin Oscillator  
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
GPIO  
54  
40  
54  
40  
54  
40  
54  
40  
54  
40  
54  
40  
54  
40  
54  
40  
I/O pins  
(shared)  
AIO  
6
3
6
3
6
3
6
3
6
3
6
3
6
3
6
3
External interrupts  
Supply voltage (nominal)  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
T: –40°C to 105°C  
PZ  
PN  
PZ  
PN  
PZ  
PN  
PZ  
PN  
PZ  
PN  
PZ  
PN  
PZ  
PN  
PZ  
PN  
Temperature  
options  
S: –40°C to 125°C  
PZP  
PZP  
PFP  
PFP  
PZP  
PZP  
PFP  
PFP  
PZP  
PZP  
PFP  
PFP  
PZP  
PZP  
PFP  
PFP  
PZP  
PZP  
PFP  
PFP  
PZP  
PZP  
PFP  
PFP  
PZP  
PZP  
PFP  
PFP  
PZP  
PZP  
PFP  
PFP  
Q: –40°C to 125°C(3)(4)  
Product status for T-temperature devices  
and S-temperature devices(5)  
TMS  
TMS  
TMS  
TMS  
TMS  
TMS  
TMS  
TMS  
Product status for Q-temperature  
devices(6)  
TMX  
TMX  
TMX  
TMX  
TMX  
TMX  
TMX  
TMX  
(3) "Q" refers to Q100 qualification for automotive applications.  
(4) The "Q" temperature option is not available on the TMS320F2806xU devices.  
(5) The "TMS" product status denotes a fully qualified production device. See Section 3.3, Device and Development Support Tool Nomenclature, for descriptions of device stages.  
(6) The "TMX" product status denotes an experimental device that is not necessarily representative of the final device's electrical specifications. See Section 3.3, Device and Development  
Support Tool Nomenclature, for descriptions of device stages.  
8
Device Overview  
Copyright © 2010–2012, Texas Instruments Incorporated  
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Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065  
TMS320F28064 TMS320F28063 TMS320F28062  
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
www.ti.com  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
2.2 Memory Maps  
In Figure 2-1 through Figure 2-7, the following apply:  
Memory blocks are not to scale.  
Peripheral Frame 0, Peripheral Frame 1, Peripheral Frame 2, and Peripheral Frame 3 memory maps  
are restricted to data memory only. A user program cannot access these memory maps in program  
space.  
Protected means the order of Write-followed-by-Read operations is preserved rather than the pipeline  
order.  
Certain memory ranges are EALLOW protected against spurious writes after configuration.  
Locations 0x3D 7C80–0x3D 7CC0 contain the internal oscillator and ADC calibration routines. These  
locations are not programmable by the user.  
All devices with USB have 2K x16 RAM from 0x40000 to 0x40800. When the clock to the USB module  
is enabled, this RAM is connected to the USB controller and acts as the FIFO RAM. When the clock to  
the USB module is disabled, this RAM is remapped to the CPU-accessible address space and can be  
used as general-purpose RAM.  
Copyright © 2010–2012, Texas Instruments Incorporated  
Device Overview  
9
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Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065  
TMS320F28064 TMS320F28063 TMS320F28062  
 
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
www.ti.com  
Data Space  
Prog Space  
0x00 0000  
0x00 0040  
0x00 0400  
0x00 0800  
0x00 0D00  
M0 Vector RAM (Enabled if VMAP = 0)  
M0 SARAM (1K x 16, 0-Wait)  
M1 SARAM (1K x 16, 0-Wait)  
Peripheral Frame 0  
PIE Vector - RAM  
(256 x 16)  
(Enabled if  
VMAP = 1,  
ENPIE = 1)  
Reserved  
0x00 0E00  
0x00 1400  
Peripheral Frame 0  
CLA Registers  
CLA-to-CPU Message RAM  
CPU-to-CLA Message RAM  
Reserved  
0x00 1480  
0x00 1500  
0x00 1580  
0x00 2000  
0x00 5000  
Reserved  
Peripheral Frame 3  
(4K x 16, Protected)  
DMA-Accessible  
0x00 6000  
0x00 7000  
Peripheral Frame 1  
Reserved  
(4K x 16, Protected)  
Peripheral Frame 2  
(4K x 16, Protected)  
0x00 8000  
0x00 8800  
0x00 8C00  
0x00 9000  
0x00 A000  
0x00 C000  
0x00 E000  
0x01 0000  
0x01 2000  
L0 DPSARAM (2K x 16)  
(0-Wait, Secure Zone + ECSL, CLA Data RAM2)  
L1 DPSARAM (1K x 16)  
(0-Wait, Secure Zone + ECSL, CLA Data RAM 0)  
L2 DPSARAM (1K x 16)  
(0-Wait, Secure Zone + ECSL, CLA Data RAM 1)  
L3 DPSARAM (4K x 16)  
(0-Wait, Secure Zone + ECSL, CLA Program RAM)  
L4 SARAM (8K x 16)  
(0-Wait, Secure Zone + ECSL)  
L5 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 0)  
L6 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 1)  
L7 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 2)  
L8 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 3)  
0x01 4000  
0x3D 7800  
0x3D 7BFA  
0x3D 7C80  
Reserved  
User OTP (1K x 16, Secure Zone + ECSL)  
Reserved  
Calibration Data  
Get_mode function  
Reserved  
0x3D 7CC0  
0x3D 7CD0  
0x3D 7E80  
PARTID  
Calibration Data  
Reserved  
0x3D 7EB0  
0x3D 8000  
FLASH  
(128K x 16, 8 Sectors, Secure Zone + ECSL)  
0x3F 7FF8  
0x3F 8000  
0x3F FFC0  
128-Bit Password  
Boot ROM (32K x 16, 0-Wait)  
Vector (32 Vectors, Enabled if VMAP = 1)  
Figure 2-1. 28069 Memory Map  
10  
Device Overview  
Copyright © 2010–2012, Texas Instruments Incorporated  
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TMS320F28064 TMS320F28063 TMS320F28062  
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
www.ti.com  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Data Space  
Prog Space  
0x00 0000  
0x00 0040  
0x00 0400  
0x00 0800  
0x00 0D00  
M0 Vector RAM (Enabled if VMAP = 0)  
M0 SARAM (1K x 16, 0-Wait)  
M1 SARAM (1K x 16, 0-Wait)  
Peripheral Frame 0  
PIE Vector - RAM  
(256 x 16)  
(Enabled if  
VMAP = 1,  
ENPIE = 1)  
Reserved  
0x00 0E00  
0x00 1400  
0x00 5000  
Peripheral Frame 0  
Reserved  
Peripheral Frame 3  
(4K x 16, Protected)  
DMA-Accessible  
0x00 6000  
0x00 7000  
Peripheral Frame 1  
(4K x 16, Protected)  
Reserved  
Peripheral Frame 2  
(4K x 16, Protected)  
0x00 8000  
0x00 8800  
0x00 8C00  
0x00 9000  
0x00 A000  
0x00 C000  
0x00 E000  
0x01 0000  
0x01 2000  
L0 DPSARAM (2K x 16)  
(0-Wait, Secure Zone + ECSL)  
L1 DPSARAM (1K x 16)  
(0-Wait, Secure Zone + ECSL)  
L2 DPSARAM (1K x 16)  
(0-Wait, Secure Zone + ECSL)  
L3 DPSARAM (4K x 16)  
(0-Wait, Secure Zone + ECSL)  
L4 SARAM (8K x 16)  
(0-Wait, Secure Zone + ECSL)  
L5 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 0)  
L6 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 1)  
L7 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 2)  
L8 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 3)  
0x01 4000  
0x3D 7800  
0x3D 7BFA  
0x3D 7C80  
Reserved  
User OTP (1K x 16, Secure Zone + ECSL)  
Reserved  
Calibration Data  
Get_mode function  
Reserved  
0x3D 7CC0  
0x3D 7CD0  
0x3D 7E80  
PARTID  
Calibration Data  
Reserved  
0x3D 7EB0  
0x3D 8000  
FLASH  
(128K x 16, 8 Sectors, Secure Zone + ECSL)  
0x3F 7FF8  
0x3F 8000  
0x3F FFC0  
128-Bit Password  
Boot ROM (32K x 16, 0-Wait)  
Vector (32 Vectors, Enabled if VMAP = 1)  
Figure 2-2. 28068, 28067 Memory Map  
Copyright © 2010–2012, Texas Instruments Incorporated  
Device Overview  
11  
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Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065  
TMS320F28064 TMS320F28063 TMS320F28062  
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
www.ti.com  
Data Space  
Prog Space  
0x00 0000  
0x00 0040  
0x00 0400  
0x00 0800  
0x00 0D00  
M0 Vector RAM (Enabled if VMAP = 0)  
M0 SARAM (1K x 16, 0-Wait)  
M1 SARAM (1K x 16, 0-Wait)  
Peripheral Frame 0  
PIE Vector - RAM  
(256 x 16)  
(Enabled if  
VMAP = 1,  
ENPIE = 1)  
Reserved  
0x00 0E00  
0x00 1400  
0x00 5000  
Peripheral Frame 0  
Reserved  
Peripheral Frame 3  
(4K x 16, Protected)  
DMA-Accessible  
0x00 6000  
0x00 7000  
Peripheral Frame 1  
(4K x 16, Protected)  
Reserved  
Peripheral Frame 2  
(4K x 16, Protected)  
0x00 8000  
0x00 8800  
0x00 8C00  
0x00 9000  
0x00 A000  
0x00 C000  
0x00 E000  
L0 DPSARAM (2K x 16)  
(0-Wait, Secure Zone + ECSL)  
L1 DPSARAM (1K x 16)  
(0-Wait, Secure Zone + ECSL)  
L2 DPSARAM (1K x 16)  
(0-Wait, Secure Zone + ECSL)  
L3 DPSARAM (4K x 16)  
(0-Wait, Secure Zone + ECSL)  
L4 SARAM (8K x 16)  
(0-Wait, Secure Zone + ECSL)  
L5 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 0)  
L6 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 1)  
0x01 0000  
0x3D 7800  
0x3D 7BFA  
0x3D 7C80  
Reserved  
User OTP (1K x 16, Secure Zone + ECSL)  
Reserved  
Calibration Data  
Get_mode function  
Reserved  
0x3D 7CC0  
0x3D 7CD0  
0x3D 7E80  
PARTID  
Calibration Data  
Reserved  
0x3D 7EB0  
0x3D 8000  
FLASH  
(128K x 16, 8 Sectors, Secure Zone + ECSL)  
0x3F 7FF8  
0x3F 8000  
0x3F FFC0  
128-Bit Password  
Boot ROM (32K x 16, 0-Wait)  
Vector (32 Vectors, Enabled if VMAP = 1)  
Figure 2-3. 28066 Memory Map  
12  
Device Overview  
Copyright © 2010–2012, Texas Instruments Incorporated  
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Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065  
TMS320F28064 TMS320F28063 TMS320F28062  
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
www.ti.com  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Data Space  
Prog Space  
0x00 0000  
0x00 0040  
0x00 0400  
0x00 0800  
0x00 0D00  
M0 Vector RAM (Enabled if VMAP = 0)  
M0 SARAM (1K x 16, 0-Wait)  
M1 SARAM (1K x 16, 0-Wait)  
Peripheral Frame 0  
PIE Vector - RAM  
(256 x 16)  
(Enabled if  
VMAP = 1,  
ENPIE = 1)  
Reserved  
0x00 0E00  
0x00 1400  
Peripheral Frame 0  
CLA Registers  
0x00 1480  
0x00 1500  
0x00 1580  
0x00 2000  
0x00 5000  
CLA-to-CPU Message RAM  
CPU-to-CLA Message RAM  
Reserved  
Reserved  
Peripheral Frame 3  
(4K x 16, Protected)  
DMA-Accessible  
0x00 6000  
0x00 7000  
Peripheral Frame 1  
(4K x 16, Protected)  
Reserved  
Peripheral Frame 2  
(4K x 16, Protected)  
0x00 8000  
0x00 8800  
0x00 8C00  
0x00 9000  
0x00 A000  
0x00 C000  
0x00 E000  
0x01 0000  
0x01 2000  
L0 DPSARAM (2K x 16)  
(0-Wait, Secure Zone + ECSL, CLA Data RAM2)  
L1 DPSARAM (1K x 16)  
(0-Wait, Secure Zone + ECSL, CLA Data RAM 0)  
L2 DPSARAM (1K x 16)  
(0-Wait, Secure Zone + ECSL, CLA Data RAM 1)  
L3 DPSARAM (4K x 16)  
(0-Wait, Secure Zone + ECSL, CLA Program RAM)  
L4 SARAM (8K x 16)  
(0-Wait, Secure Zone + ECSL)  
L5 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 0)  
L6 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 1)  
L7 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 2)  
L8 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 3)  
0x01 4000  
0x3D 7800  
0x3D 7BFA  
0x3D 7C80  
Reserved  
User OTP (1K x 16, Secure Zone + ECSL)  
Reserved  
Calibration Data  
Get_mode function  
Reserved  
0x3D 7CC0  
0x3D 7CD0  
0x3D 7E80  
PARTID  
Calibration Data  
Reserved  
0x3D 7EB0  
0x3E 8000  
FLASH  
(64K x 16, 8 Sectors, Secure Zone + ECSL)  
0x3F 7FF8  
0x3F 8000  
0x3F FFC0  
128-Bit Password  
Boot ROM (32K x 16, 0-Wait)  
Vector (32 Vectors, Enabled if VMAP = 1)  
Figure 2-4. 28065 Memory Map  
Copyright © 2010–2012, Texas Instruments Incorporated  
Device Overview  
13  
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Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065  
TMS320F28064 TMS320F28063 TMS320F28062  
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
www.ti.com  
Data Space  
Prog Space  
0x00 0000  
0x00 0040  
0x00 0400  
0x00 0800  
0x00 0D00  
M0 Vector RAM (Enabled if VMAP = 0)  
M0 SARAM (1K x 16, 0-Wait)  
M1 SARAM (1K x 16, 0-Wait)  
Peripheral Frame 0  
PIE Vector - RAM  
(256 x 16)  
(Enabled if  
VMAP = 1,  
ENPIE = 1)  
Reserved  
0x00 0E00  
0x00 1400  
0x00 5000  
Peripheral Frame 0  
Reserved  
Peripheral Frame 3  
(4K x 16, Protected)  
DMA-Accessible  
0x00 6000  
0x00 7000  
Peripheral Frame 1  
(4K x 16, Protected)  
Reserved  
Peripheral Frame 2  
(4K x 16, Protected)  
0x00 8000  
0x00 8800  
0x00 8C00  
0x00 9000  
0x00 A000  
0x00 C000  
0x00 E000  
0x01 0000  
0x01 2000  
L0 DPSARAM (2K x 16)  
(0-Wait, Secure Zone + ECSL)  
L1 DPSARAM (1K x 16)  
(0-Wait, Secure Zone + ECSL)  
L2 DPSARAM (1K x 16)  
(0-Wait, Secure Zone + ECSL)  
L3 DPSARAM (4K x 16)  
(0-Wait, Secure Zone + ECSL)  
L4 SARAM (8K x 16)  
(0-Wait, Secure Zone + ECSL)  
L5 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 0)  
L6 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 1)  
L7 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 2)  
L8 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 3)  
0x01 4000  
0x3D 7800  
0x3D 7BFA  
0x3D 7C80  
Reserved  
User OTP (1K x 16, Secure Zone + ECSL)  
Reserved  
Calibration Data  
Get_mode function  
Reserved  
0x3D 7CC0  
0x3D 7CD0  
0x3D 7E80  
PARTID  
Calibration Data  
Reserved  
0x3D 7EB0  
0x3E 8000  
FLASH  
(64K x 16, 8 Sectors, Secure Zone + ECSL)  
0x3F 7FF8  
0x3F 8000  
0x3F FFC0  
128-Bit Password  
Boot ROM (32K x 16, 0-Wait)  
Vector (32 Vectors, Enabled if VMAP = 1)  
Figure 2-5. 28064 Memory Map  
14  
Device Overview  
Copyright © 2010–2012, Texas Instruments Incorporated  
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Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065  
TMS320F28064 TMS320F28063 TMS320F28062  
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
www.ti.com  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Data Space  
Prog Space  
0x00 0000  
0x00 0040  
0x00 0400  
0x00 0800  
0x00 0D00  
M0 Vector RAM (Enabled if VMAP = 0)  
M0 SARAM (1K x 16, 0-Wait)  
M1 SARAM (1K x 16, 0-Wait)  
Peripheral Frame 0  
PIE Vector - RAM  
(256 x 16)  
(Enabled if  
VMAP = 1,  
ENPIE = 1)  
Reserved  
0x00 0E00  
0x00 1400  
0x00 5000  
Peripheral Frame 0  
Reserved  
Peripheral Frame 3  
(4K x 16, Protected)  
DMA-Accessible  
0x00 6000  
0x00 7000  
Peripheral Frame 1  
(4K x 16, Protected)  
Reserved  
Peripheral Frame 2  
(4K x 16, Protected)  
0x00 8000  
0x00 8800  
0x00 8C00  
0x00 9000  
0x00 A000  
0x00 C000  
0x00 E000  
L0 DPSARAM (2K x 16)  
(0-Wait, Secure Zone + ECSL)  
L1 DPSARAM (1K x 16)  
(0-Wait, Secure Zone + ECSL)  
L2 DPSARAM (1K x 16)  
(0-Wait, Secure Zone + ECSL)  
L3 DPSARAM (4K x 16)  
(0-Wait, Secure Zone + ECSL)  
L4 SARAM (8K x 16)  
(0-Wait, Secure Zone + ECSL)  
L5 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 0)  
L6 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 1)  
0x01 0000  
0x3D 7800  
0x3D 7BFA  
0x3D 7C80  
Reserved  
User OTP (1K x 16, Secure Zone + ECSL)  
Reserved  
Calibration Data  
Get_mode function  
Reserved  
0x3D 7CC0  
0x3D 7CD0  
0x3D 7E80  
PARTID  
Calibration Data  
Reserved  
0x3D 7EB0  
0x3E 8000  
FLASH  
(64K x 16, 8 Sectors, Secure Zone + ECSL)  
0x3F 7FF8  
0x3F 8000  
0x3F FFC0  
128-Bit Password  
Boot ROM (32K x 16, 0-Wait)  
Vector (32 Vectors, Enabled if VMAP = 1)  
Figure 2-6. 28063 Memory Map  
Copyright © 2010–2012, Texas Instruments Incorporated  
Device Overview  
15  
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Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065  
TMS320F28064 TMS320F28063 TMS320F28062  
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
www.ti.com  
Data Space  
Prog Space  
0x00 0000  
0x00 0040  
0x00 0400  
0x00 0800  
0x00 0D00  
M0 Vector RAM (Enabled if VMAP = 0)  
M0 SARAM (1K x 16, 0-Wait)  
M1 SARAM (1K x 16, 0-Wait)  
Peripheral Frame 0  
PIE Vector - RAM  
(256 x 16)  
(Enabled if  
VMAP = 1,  
ENPIE = 1)  
Reserved  
0x00 0E00  
0x00 1400  
0x00 5000  
Peripheral Frame 0  
Reserved  
Peripheral Frame 3  
(4K x 16, Protected)  
DMA-Accessible  
0x00 6000  
0x00 7000  
Peripheral Frame 1  
(4K x 16, Protected)  
Reserved  
Peripheral Frame 2  
(4K x 16, Protected)  
0x00 8000  
0x00 8800  
0x00 8C00  
0x00 9000  
0x00 A000  
0x00 C000  
L0 DPSARAM (2K x 16)  
(0-Wait, Secure Zone + ECSL)  
L1 DPSARAM (1K x 16)  
(0-Wait, Secure Zone + ECSL)  
L2 DPSARAM (1K x 16)  
(0-Wait, Secure Zone + ECSL)  
L3 DPSARAM (4K x 16)  
(0-Wait, Secure Zone + ECSL)  
L4 SARAM (8K x 16)  
(0-Wait, Secure Zone + ECSL)  
L5 DPSARAM (8K x 16)  
(0-Wait, DMA RAM 0)  
0x00 E000  
0x3D 7800  
0x3D 7BFA  
0x3D 7C80  
Reserved  
User OTP (1K x 16, Secure Zone + ECSL)  
Reserved  
Calibration Data  
Get_mode function  
Reserved  
0x3D 7CC0  
0x3D 7CD0  
0x3D 7E80  
PARTID  
Calibration Data  
Reserved  
0x3D 7EB0  
0x3E 8000  
FLASH  
(64K x 16, 8 Sectors, Secure Zone + ECSL)  
0x3F 7FF8  
0x3F 8000  
0x3F FFC0  
128-Bit Password  
Boot ROM (32K x 16, 0-Wait)  
Vector (32 Vectors, Enabled if VMAP = 1)  
Figure 2-7. 28062 Memory Map  
16  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Table 2-2. Addresses of Flash Sectors in F28069, F28068, F28067, F28066  
ADDRESS RANGE  
0x3D 8000 – 0x3D BFFF  
0x3D C000 – 0x3D FFFF  
0x3E 0000 – 0x3E 3FFF  
0x3E 4000 – 0x3E 7FFF  
0x3E 8000 – 0x3E BFFF  
0x3E C000 – 0x3E FFFF  
0x3F 0000 – 0x3F 3FFF  
0x3F 4000 – 0x3F 7FF5  
PROGRAM AND DATA SPACE  
Sector H (16K x 16)  
Sector G (16K x 16)  
Sector F (16K x 16)  
Sector E (16K x 16)  
Sector D (16K x 16)  
Sector C (16K x 16)  
Sector B (16K x 16)  
Sector A (16K x 16)  
Boot-to-Flash Entry Point  
(program branch instruction here)  
0x3F 7FF6 – 0x3F 7FF7  
0x3F 7FF8 – 0x3F 7FFF  
Security Password (128-Bit)  
(Do not program to all zeros)  
Table 2-3. Addresses of Flash Sectors in F28065, F28064, F28063, F28062  
ADDRESS RANGE  
0x3E 8000 – 0x3E 9FFF  
0x3E A000 – 0x3E BFFF  
0x3E C000 – 0x3E DFFF  
0x3E E000 – 0x3E FFFF  
0x3F 0000 – 0x3F 1FFF  
0x3F 2000 – 0x3F 3FFF  
0x3F 4000 – 0x3F 5FFF  
0x3F 6000 – 0x3F 7FF5  
PROGRAM AND DATA SPACE  
Sector H (8K x 16)  
Sector G (8K x 16)  
Sector F (8K x 16)  
Sector E (8K x 16)  
Sector D (8K x 16)  
Sector C (8K x 16)  
Sector B (8K x 16)  
Sector A (8K x 16)  
Boot-to-Flash Entry Point  
(program branch instruction here)  
0x3F 7FF6 – 0x3F 7FF7  
0x3F 7FF8 – 0x3F 7FFF  
Security Password (128-Bit)  
(Do not program to all zeros)  
NOTE  
Addresses 0x3F 7FF0 – 0x3F 7FF5 are reserved for data and should not contain program  
code.  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
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Peripheral Frame 1 and Peripheral Frame 2 are grouped together to enable these blocks to be write/read  
peripheral block protected. The protected mode makes sure that all accesses to these blocks happen as  
written. Because of the pipeline, a write immediately followed by a read to different memory locations, will  
appear in reverse order on the memory bus of the CPU. This can cause problems in certain peripheral  
applications where the user expected the write to occur first (as written). The CPU supports a block  
protection mode where a region of memory can be protected so that operations occur as written (the  
penalty is extra cycles are added to align the operations). This mode is programmable and by default, it  
protects the selected zones.  
The wait-states for the various spaces in the memory map area are listed in Table 2-4.  
Table 2-4. Wait-States  
AREA  
WAIT-STATES (CPU)  
0-wait  
COMMENTS  
M0 and M1 SARAMs  
Peripheral Frame 0  
Peripheral Frame 1  
Fixed  
0-wait  
0-wait (writes)  
2-wait (reads)  
Cycles can be extended by peripheral-generated ready.  
Back-to-back write operations to Peripheral Frame 1 registers will incur  
a 1-cycle stall (1-cycle delay).  
Peripheral Frame 2  
Peripheral Frame 3  
0-wait (writes)  
2-wait (reads)  
0-wait (writes)  
Fixed. Cycles cannot be extended by the peripheral.  
Assumes no conflict between CPU and CLA/DMA cycles. The wait  
states can be extended by peripheral-generated ready.  
2-wait (reads)  
0-wait data and program  
Programmable  
L0–L8 SARAM  
OTP  
Assumes no CPU conflicts  
Programmed via the Flash registers.  
1-wait is minimum number of wait states allowed.  
Programmed via the Flash registers.  
1-wait minimum  
FLASH  
Programmable  
0-wait Paged min  
1-wait Random min  
Random Paged  
FLASH Password  
Boot-ROM  
16-wait fixed  
0-wait  
Wait states of password locations are fixed.  
18  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
2.3 Pin Assignments  
Figure 2-8 shows the pin assignments on the 80-pin PN and PFP packages. Figure 2-9 shows the pin  
assignments on the 100-pin PZ and PZP packages.  
GPIO27/HRCAP2/SPISTEB/USB0DM  
61  
62  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
76  
77  
78  
79  
80  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
GPIO28/SCIRXDA/SDAA/TZ2  
GPIO26/ECAP3/SPICLKB/USB0DP  
GPIO9/EPWM5B/SCITXDB/ECAP3  
VDDIO  
VSS  
VSS  
VDD3VFL  
VDD  
TEST2  
GPIO3/EPWM2B/SPISOMIA/COMP2OUT  
GPIO2/EPWM2A  
GPIO12/TZ1/SCITXDA/SPISIMOB  
GPIO29/SCITXDA/SCLA/TZ3  
GPIO30/CANRXA/EPWM7A  
GPIO31/CANTXA/EPWM8A  
GPIO25/ECAP2/SPISOMIB  
VDDIO  
GPIO1/EPWM1B/COMP1OUT  
GPIO0/EPWM1A  
GPIO15/ECAP2/SCIRXDB/SPISTEB  
VREGENZ  
VDD  
VDD  
VSS  
VSS  
VDDIO  
ADCINB6/COMP3B/AIO14  
ADCINB5  
GPIO13/TZ2/SPISOMIB  
GPIO14/TZ3/SCITXDB/SPICLKB  
GPIO24/ECAP1/SPISIMOB  
ADCINB4/COMP2B/AIO12  
ADCINB2/COMP1B/AIO10  
ADCINB1  
GPIO22/EQEP1S/MCLKXA/SCITXDB  
ADCINB0  
GPIO32/SDAA/EPWMSYNCI/ADCSOCAO  
GPIO33/SCLA/EPWMSYNCO/ADCSOCBO  
VREFLO, VSSA  
A. Pin 19: VREFHI and ADCINA0 share the same pin on the 80-pin PN and PFP devices and their use is mutually  
exclusive to one another.  
Pin 21: VREFLO is always connected to VSSA on the 80-pin PN and PFP devices.  
Figure 2-8. 80-Pin PN and PFP Packages (Top View)  
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GPIO41/EPWM7B/SCIRXDB  
76  
77  
78  
79  
80  
81  
82  
83  
84  
85  
86  
87  
88  
89  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
GPIO28/SCIRXDA/SDAA/TZ2  
GPIO27/HRCAP2/EQEP2S/SPISTEB/USB0DM  
GPIO9/EPWM5B/SCITXDB/ECAP3  
GPIO26/ECAP3/EQEP2I/SPICLKB/USB0DP  
GPIO51/EQEP1B/MDRA/TZ2  
VSS  
VDDIO  
VSS  
VDD3VFL  
TEST2  
VDD  
GPIO40/EPWM7A/SCITXDB  
GPIO3/EPWM2B/SPISOMIA/COMP2OUT  
GPIO2/EPWM2A  
GPIO12/TZ1/SCITXDA/SPISIMOB  
GPIO29/SCITXDA/SCLA/TZ3  
GPIO50/EQEP1A/MDXA/TZ1  
GPIO30/CANRXA/EQEP2I/EPWM7A  
GPIO31/CANTXA/EQEP2S/EPWM8A  
GPIO25/ECAP2/EQEP2B/SPISOMIB  
VDDIO  
GPIO56/SPICLKA/EQEP2I/HRCAP3  
GPIO1/EPWM1B/COMP1OUT  
GPIO0/EPWM1A  
GPIO15/ECAP2/SCIRXDB/SPISTEB  
GPIO57/SPISTEA/EQEP2S/HRCAP4  
VDD  
VSS  
90  
91  
92  
93  
94  
95  
96  
97  
98  
99  
100  
VREGENZ  
VDD  
ADCINB7  
VSS  
ADCINB6/COMP3B/AIO14  
ADCINB5  
VDDIO  
GPIO58/MCLKRA/SCITXDB/EPWM7A  
ADCINB4/COMP2B/AIO12  
ADCINB3  
GPIO13/TZ2/SPISOMIB  
GPIO14/TZ3/SCITXDB/SPICLKB  
ADCINB2/COMP1B/AIO10  
ADCINB1  
GPIO24/ECAP1/EQEP2A/SPISIMOB  
GPIO22/EQEP1S/MCLKXA/SCITXDB  
ADCINB0  
VREFLO  
GPIO32/SDAA/EPWMSYNCI/ADCSOCAO  
GPIO33/SCLA/EPWMSYNCO/ADCSOCBO  
VSSA  
Figure 2-9. 100-Pin PZ and PZP Packages (Top View)  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
2.4 Signal Descriptions  
Table 2-5 describes the signals. With the exception of the JTAG pins, the GPIO function is the default at  
reset, unless otherwise mentioned. The peripheral signals that are listed under them are alternate  
functions. Some peripheral functions may not be available in all devices. See Table 2-1 for details. Inputs  
are not 5-V tolerant. All GPIO pins are I/O/Z and have an internal pullup, which can be selectively enabled  
or disabled on a per-pin basis. This feature only applies to the GPIO pins. The pullups on the PWM pins  
are not enabled at reset. The pullups on other GPIO pins are enabled upon reset. The AIO pins do not  
have an internal pullup.  
NOTE: When the on-chip VREG is used, the GPIO19, GPIO34, GPIO35, GPIO36, GPIO37, and GPIO38  
pins could glitch during power up. If this is unacceptable in an application, 1.8 V could be supplied  
externally. There is no power-sequencing requirement when using an external 1.8-V supply. However, if  
the 3.3-V transistors in the level-shifting output buffers of the I/O pins are powered prior to the 1.9-V  
transistors, it is possible for the output buffers to turn on, causing a glitch to occur on the pin during power  
up. To avoid this behavior, power the VDD pins prior to or simultaneously with the VDDIO pins, ensuring that  
the VDD pins have reached 0.7 V before the VDDIO pins reach 0.7 V.  
Table 2-5. Terminal Functions(1)  
PIN NO.  
PIN NAME  
I/O/Z  
DESCRIPTION  
PZ  
PN  
PZP  
PFP  
JTAG  
JTAG test reset with internal pulldown. TRST, when driven high, gives the scan system  
control of the operations of the device. If this signal is not connected or driven low, the  
device operates in its functional mode, and the test reset signals are ignored.  
NOTE: TRST is an active-high test pin and must be maintained low at all times during  
normal device operation. An external pull-down resistor is required on this pin. The  
value of this resistor should be based on drive strength of the debugger pods  
applicable to the design. A 2.2-kresistor generally offers adequate protection. Since  
this is application-specific, it is recommended that each target board be validated for  
proper operation of the debugger and the application. ()  
TRST  
12  
10  
I
TCK  
TMS  
See GPIO38  
I
I
See GPIO38. JTAG test clock with internal pullup. ()  
See GPIO36. JTAG test-mode select (TMS) with internal pullup. This serial control  
input is clocked into the TAP controller on the rising edge of TCK. ()  
See GPIO36  
See GPIO35  
See GPIO35. JTAG test data input (TDI) with internal pullup. TDI is clocked into the  
selected register (instruction or data) on a rising edge of TCK. ()  
TDI  
I
See GPIO37. JTAG scan out, test data output (TDO). The contents of the selected  
register (instruction or data) are shifted out of TDO on the falling edge of TCK.  
(8-mA drive)  
TDO  
See GPIO37  
O/Z  
FLASH  
VDD3VFL  
TEST2  
46  
45  
37  
36  
3.3-V Flash Core Power Pin. This pin should be connected to 3.3 V at all times.  
Test Pin. Reserved for TI. Must be left unconnected.  
I/O  
(1) I = Input, O = Output, Z = High Impedance, OD = Open Drain, = Pullup, = Pulldown  
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Table 2-5. Terminal Functions(1) (continued)  
PIN NO.  
PIN NAME  
I/O/Z  
DESCRIPTION  
PZ  
PN  
PZP  
PFP  
CLOCK  
See GPIO18. Output clock derived from SYSCLKOUT. XCLKOUT is either the same  
frequency, one-half the frequency, or one-fourth the frequency of SYSCLKOUT. This is  
controlled by bits 1:0 (XCLKOUTDIV) in the XCLK register. At reset, XCLKOUT =  
SYSCLKOUT/4. The XCLKOUT signal can be turned off by setting XCLKOUTDIV to 3.  
The mux control for GPIO18 must also be set to XCLKOUT for this signal to propogate  
to the pin.  
XCLKOUT  
See GPIO18  
O/Z  
See GPIO19 and GPIO38. External oscillator input. Pin source for the clock is  
controlled by the XCLKINSEL bit in the XCLK register, GPIO38 is the default selection.  
This pin feeds a clock from an external 3.3-V oscillator. In this case, the X1 pin, if  
available, must be tied to GND and the on-chip crystal oscillator must be disabled via  
bit 14 in the CLKCTL register. If a crystal or resonator is used, the XCLKIN path must  
be disabled by bit 13 in the CLKCTL register.  
NOTE: Designs that use the GPIO38/XCLKIN/TCK pin to supply an external clock for  
normal device operation may need to incorporate some hooks to disable this path  
during debug using the JTAG connector. This is to prevent contention with the TCK  
signal, which is active during JTAG debug sessions. The zero-pin internal oscillators  
may be used during this time to clock the device.  
See GPIO19 and  
GPIO38  
XCLKIN  
I
On-chip crystal-oscillator input. To use this oscillator, a quartz crystal or a ceramic  
resonator must be connected across X1 and X2. In this case, the XCLKIN path must  
be disabled by bit 13 in the CLKCTL register. If this pin is not used, it must be tied to  
GND.  
X1  
X2  
60  
59  
48  
47  
I
On-chip crystal-oscillator output. A quartz crystal or a ceramic resonator must be  
connected across X1 and X2. If X2 is not used, it must be left unconnected.  
O
RESET  
Device Reset (in) and Watchdog Reset (out). Piccolo devices have a built-in power-on-  
reset (POR) and brown-out-reset (BOR) circuitry. As such, no external circuitry is  
needed to generate a reset pulse. During a power-on or brown-out condition, this pin is  
driven low by the device. See Section 4.3, Electrical Characteristics, for thresholds of  
the POR/BOR block. This pin is also driven low by the MCU when a watchdog reset  
occurs. During watchdog reset, the XRS pin is driven low for the watchdog reset  
duration of 512 OSCCLK cycles. If need be, an external circuitry may also drive this pin  
to assert a device reset. In this case, it is recommended that this pin be driven by an  
open-drain device. An R-C circuit must be connected to this pin for noise immunity  
reasons. Regardless of the source, a device reset causes the device to terminate  
execution. The program counter points to the address contained at the location  
0x3FFFC0. When reset is deactivated, execution begins at the location designated by  
the program counter. The output buffer of this pin is an open-drain with an internal  
pullup.  
XRS  
11  
9
I/O  
ADC, COMPARATOR, ANALOG I/O  
ADC Group A, Channel 7 input  
ADC Group A, Channel 6 input  
Comparator Input 3A  
ADCINA7  
ADCINA6  
COMP3A  
AIO6  
16  
17  
I
14  
I
I
I/O  
Digital AIO 6  
ADCINA5  
ADCINA4  
COMP2A  
AIO4  
18  
19  
15  
16  
I
ADC Group A, Channel 5 input  
ADC Group A, Channel 4 input  
Comparator Input 2A  
I
I
I/O  
Digital AIO 4  
ADCINA3  
ADCINA2  
COMP1A  
AIO2  
20  
21  
I
ADC Group A, Channel 3 input  
ADC Group A, Channel 2 input  
Comparator Input 1A  
17  
I
I
I/O  
I
Digital AIO 2  
ADCINA1  
22  
23  
18  
19  
ADC Group A, Channel 1 input  
ADC Group A, Channel 0 input.  
NOTE: VREFHI and ADCINA0 share the same pin on the 80-pin PN and PFP devices  
and their use is mutually exclusive to one another.  
ADCINA0  
I
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Table 2-5. Terminal Functions(1) (continued)  
PIN NO.  
PIN NAME  
I/O/Z  
DESCRIPTION  
PZ  
PN  
PZP  
PFP  
ADC External Reference – only used when in ADC external reference mode. See  
Section 5.10.1, Analog-to-Digital Converter (ADC).  
NOTE: VREFHI and ADCINA0 share the same pin on the 80-pin PN and PFP devices  
and their use is mutually exclusive to one another.  
VREFHI  
24  
19  
ADCINB7  
ADCINB6  
COMP3B  
AIO14  
35  
34  
I
ADC Group B, Channel 7 input  
ADC Group B, Channel 6 input  
Comparator Input 3B  
27  
I
I
I/O  
Digital AIO 14  
ADCINB5  
ADCINB4  
COMP2B  
AIO12  
33  
32  
26  
25  
I
ADC Group B, Channel 5 input  
ADC Group B, Channel 4 input  
Comparator Input 2B  
I
I
I/O  
Digital AIO12  
ADCINB3  
ADCINB2  
COMP1B  
AIO10  
31  
30  
I
ADC Group B, Channel 3 input  
ADC Group B, Channel 2 input  
Comparator Input 1B  
24  
I
I
I/O  
Digital AIO 10  
ADCINB1  
ADCINB0  
VREFLO  
29  
28  
27  
23  
22  
21  
I
I
ADC Group B, Channel 1 input  
ADC Group B, Channel 0 input  
NOTE: VREFLO is always connected to VSSA on the 80-pin PN and PFP devices.  
CPU AND I/O POWER  
VDDA  
VSSA  
25  
26  
20  
21  
Analog Power Pin. Tie with a 2.2-μF capacitor (typical) close to the pin.  
Analog Ground Pin.  
NOTE: VREFLO is always connected to VSSA on the 80-pin PN and PFP devices.  
VDD  
3
2
VDD  
14  
37  
63  
81  
91  
5
12  
29  
51  
65  
72  
4
CPU and Logic Digital Power Pins – no supply source needed when using internal  
VREG. Tie with 1.2 µF (minimum) ceramic capacitor (10% tolerance) to ground when  
using internal VREG. Higher value capacitors may be used, but could impact supply-  
rail ramp-up time.  
VDD  
VDD  
VDD  
VDD  
VDDIO  
VDDIO  
VDDIO  
VDDIO  
VDDIO  
VDDIO  
VSS  
13  
38  
61  
79  
93  
4
11  
30  
49  
63  
74  
3
Digital I/O and Flash Power Pin – Single Supply source when VREG is enabled.  
VSS  
15  
36  
47  
62  
80  
92  
13  
28  
38  
50  
64  
73  
VSS  
VSS  
Digital Ground Pins  
VSS  
VSS  
VSS  
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TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
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Table 2-5. Terminal Functions(1) (continued)  
PIN NO.  
PIN NAME  
I/O/Z  
DESCRIPTION  
PZ  
PN  
PZP  
PFP  
VOLTAGE REGULATOR CONTROL SIGNAL  
VREGENZ  
90  
87  
86  
71  
69  
68  
I
Internal VREG Enable/Disable. Pull low to enable VREG, pull high to disable VREG.  
(1)  
GPIO AND PERIPHERAL SIGNALS  
GPIO0  
I/O/Z  
O
General-purpose input/output 0  
Enhanced PWM1 Output A and HRPWM channel  
General-purpose input/output 1  
Enhanced PWM1 Output B  
EPWM1A  
GPIO1  
I/O/Z  
O
EPWM1B  
COMP1OUT  
GPIO2  
O
Direct output of Comparator 1  
General-purpose input/output 2  
Enhanced PWM2 Output A and HRPWM channel  
General-purpose input/output 3  
Enhanced PWM2 Output B  
84  
83  
67  
66  
I/O/Z  
O
EPWM2A  
GPIO3  
I/O/Z  
O
EPWM2B  
SPISOMIA  
COMP2OUT  
GPIO4  
I/O  
O
SPI-A slave out, master in  
Direct output of Comparator 2  
General-purpose input/output 4  
Enhanced PWM3 output A and HRPWM channel  
General-purpose input/output 5  
Enhanced PWM3 output B  
9
7
8
I/O/Z  
O
EPWM3A  
GPIO5  
10  
I/O/Z  
O
EPWM3B  
SPISIMOA  
ECAP1  
I/O  
I/O  
I/O/Z  
O
SPI-A slave in, master out  
Enhanced Capture input/output 1  
General-purpose input/output 6  
Enhanced PWM4 output A and HRPWM channel  
External ePWM sync pulse input  
External ePWM sync pulse output  
General-purpose input/output 7  
Enhanced PWM4 output B  
GPIO6  
58  
57  
54  
46  
45  
43  
EPWM4A  
EPWMSYNCI  
EPWMSYNCO  
GPIO7  
I
O
I/O/Z  
O
EPWM4B  
SCIRXDA  
ECAP2  
I
SCI-A receive data  
I/O  
I/O/Z  
O
Enhanced Capture input/output 2  
General-purpose input/output 8  
Enhanced PWM5 output A and HRPWM channel  
Reserved  
GPIO8  
EPWM5A  
Reserved  
ADCSOCAO  
O
ADC start-of-conversion A  
(1) The GPIO function (shown in bold italics) is the default at reset. The peripheral signals that are listed under them are alternate functions.  
For JTAG pins that have the GPIO functionality multiplexed, the input path to the GPIO block is always valid. The output path from the  
GPIO block and the path to the JTAG block from a pin is enabled or disabled based on the condition of the TRST signal. See the  
"Systems Control and Interrupts" chapter of the TMS320x2806x Piccolo Technical Reference Manual (literature number SPRUH18).  
24  
Device Overview  
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TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
www.ti.com  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Table 2-5. Terminal Functions(1) (continued)  
PIN NO.  
PIN NAME  
I/O/Z  
DESCRIPTION  
PZ  
PN  
PZP  
PFP  
GPIO9  
49  
39  
60  
59  
35  
75  
76  
70  
44  
42  
I/O/Z  
O
General-purpose input/output 9  
Enhanced PWM5 output B  
SCI-B transmit data  
EPWM5B  
SCITXDB  
ECAP3  
O
I/O  
I/O/Z  
O
Enhanced Capture input/output 3  
General-purpose input/output 10  
GPIO10  
EPWM6A  
Reserved  
ADCSOCBO  
GPIO11  
EPWM6B  
SCIRXDB  
ECAP1  
74  
73  
44  
95  
96  
88  
55  
52  
Enhanced PWM6 output A and HRPWM channel  
Reserved  
O
ADC start-of-conversion B  
General-purpose input/output 11  
Enhanced PWM6 output B  
SCI-B receive data  
I/O/Z  
O
I
I/O  
I/O/Z  
I
Enhanced Capture input/output 1  
General-purpose input/output 12  
Trip Zone input 1  
GPIO12  
TZ1  
SCITXDA  
SPISIMOB  
GPIO13  
TZ2  
O
SCI-A transmit data  
I/O  
I/O/Z  
I
SPI-B slave in, master out  
General-purpose input/output 13  
Trip Zone input 2  
Reserved  
SPISOMIB  
GPIO14  
TZ3  
Reserved  
I/O  
I/O/Z  
I
SPI-B slave out, master in  
General-purpose input/output 14  
Trip zone input 3  
SCITXDB  
SPICLKB  
GPIO15  
ECAP2  
O
SCI-B transmit data  
I/O  
I/O/Z  
I/O  
I
SPI-B clock input/output  
General-purpose input/output 15  
Enhanced Capture input/output 2  
SCI-B receive data  
SCIRXDB  
SPISTEB  
GPIO16  
SPISIMOA  
Reserved  
TZ2  
I/O  
I/O/Z  
I/O  
SPI-B slave transmit enable input/output  
General-purpose input/output 16  
SPI-A slave in, master out  
Reserved  
I
Trip Zone input 2  
GPIO17  
SPISOMIA  
Reserved  
TZ3  
I/O/Z  
I/O  
General-purpose input/output 17  
SPI-A slave out, master in  
Reserved  
I
Trip zone input 3  
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Device Overview  
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TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
www.ti.com  
Table 2-5. Terminal Functions(1) (continued)  
PIN NO.  
PIN NAME  
GPIO18  
I/O/Z  
DESCRIPTION  
PZ  
PZP  
PN  
PFP  
51  
41  
I/O/Z  
I/O  
General-purpose input/output 18  
SPI-A clock input/output  
SCI-B transmit data  
SPICLKA  
SCITXDB  
XCLKOUT  
O
O/Z  
Output clock derived from SYSCLKOUT. XCLKOUT is either the same frequency, one-  
half the frequency, or one-fourth the frequency of SYSCLKOUT. This is controlled by  
bits 1:0 (XCLKOUTDIV) in the XCLK register. At reset, XCLKOUT = SYSCLKOUT/4.  
The XCLKOUT signal can be turned off by setting XCLKOUTDIV to 3. The mux control  
for GPIO18 must also be set to XCLKOUT for this signal to propogate to the pin.  
GPIO19  
64  
52  
I/O/Z  
I
General-purpose input/output 19  
XCLKIN  
External Oscillator Input. The path from this pin to the clock block is not gated by the  
mux function of this pin. Care must be taken not to enable this path for clocking if it is  
being used for the other peripheral functions.  
SPISTEA  
SCIRXDB  
ECAP1  
I/O  
I
SPI-A slave transmit enable input/output  
SCI-B receive data  
I/O  
I/O/Z  
I
Enhanced Capture input/output 1  
General-purpose input/output 20  
Enhanced QEP1 input A  
GPIO20  
EQEP1A  
MDXA  
6
7
5
6
O
McBSP transmit serial data  
Direct output of Comparator 1  
General-purpose input/output 21  
Enhanced QEP1 input B  
COMP1OUT  
GPIO21  
EQEP1B  
MDRA  
O
I/O/Z  
I
I
McBSP receive serial data  
Direct output of Comparator 2  
General-purpose input/output 22  
Enhanced QEP1 strobe  
COMP2OUT  
GPIO22  
EQEP1S  
MCLKXA  
SCITXDB  
GPIO23  
EQEP1I  
MFSXA  
O
98  
2
78  
1
I/O/Z  
I/O  
I/O  
O
McBSP transmit clock  
SCI-B transmit data  
I/O/Z  
I/O  
I/O  
I
General-purpose input/output 23  
Enhanced QEP1 index  
McBSP transmit frame synch  
SCI-B receive data  
SCIRXDB  
GPIO24  
ECAP1  
97  
77  
I/O/Z  
I/O  
I
General-purpose input/output 24  
Enhanced Capture input/output 1  
EQEP2A  
Enhanced QEP2 input A.  
NOTE: eQEP2 is only available in the PZ and PZP packages.  
SPISIMOB  
GPIO25  
ECAP2  
I/O  
I/O/Z  
I/O  
SPI-B slave in, master out  
39  
31  
General-purpose input/output 25  
Enhanced Capture input/output 2  
Enhanced QEP2 input B.  
NOTE: eQEP2 is only available in the PZ and PZP packages.  
EQEP2B  
I
SPISOMIB  
I/O  
SPI-B slave out, master in  
26  
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TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
www.ti.com  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Table 2-5. Terminal Functions(1) (continued)  
PIN NO.  
PIN NAME  
I/O/Z  
DESCRIPTION  
PZ  
PN  
PZP  
PFP  
GPIO26  
78  
62  
I/O/Z  
I/O  
General-purpose input/output 26  
Enhanced Capture input/output 3  
Enhanced QEP2 index.  
ECAP3  
EQEP2I  
I/O  
I/O  
I/O  
NOTE: eQEP2 is only available in the PZ and PZP packages.  
SPICLKB  
USB0DP(1)  
SPI-B clock input/output  
Positive Differential half of USB signal. To enable USB functionality on this pin, set the  
USBIOEN bit in the GPACTRL2 register.  
GPIO27  
77  
61  
I/O/Z  
I
General-purpose input/output 27  
High-Resolution Input Capture 2  
HRCAP2  
Enhanced QEP2 strobe.  
NOTE: eQEP2 is only available in the PZ and PZP packages.  
EQEP2S  
I/O  
I/O  
I/O  
SPISTEB  
USB0DM(1)  
SPI-B slave transmit enable input/output  
Negative Differential half of USB signal. To enable USB functionality on this pin, set the  
USBIOEN bit in the GPACTRL2 register.  
GPIO28  
SCIRXDA  
SDAA  
50  
43  
41  
40  
34  
33  
I/O/Z  
General-purpose input/output 28  
SCI-A receive data  
I
I/OD  
I2C data open-drain bidirectional port  
Trip zone input 2  
TZ2  
I
I/O/Z  
O
GPIO29  
SCITXDA  
SCLA  
General-purpose input/output 29  
SCI-A transmit data  
I/OD  
I
I2C clock open-drain bidirectional port  
Trip zone input 3  
TZ3  
GPIO30  
CANRXA  
I/O/Z  
I
General-purpose input/output 30  
CAN receive  
Enhanced QEP2 index.  
NOTE: eQEP2 is only available in the PZ and PZP packages.  
EQEP2I  
I/O  
EPWM7A  
GPIO31  
O
I/O/Z  
O
Enhanced PWM7 Output A and HRPWM channel  
General-purpose input/output 31  
CAN transmit  
40  
32  
CANTXA  
Enhanced QEP2 strobe.  
NOTE: eQEP2 is only available in the PZ and PZP packages.  
EQEP2S  
I/O  
EPWM8A  
GPIO32  
O
I/O/Z  
I/OD  
I
Enhanced PWM8 Output A and HRPWM channel  
General-purpose input/output 32  
I2C data open-drain bidirectional port  
Enhanced PWM external sync pulse input  
ADC start-of-conversion A  
99  
100  
68  
79  
80  
55  
SDAA  
EPWMSYNCI  
ADCSOCAO  
GPIO33  
O
I/O/Z  
I/OD  
O
General-purpose input/output 33  
I2C clock open-drain bidirectional port  
Enhanced PWM external synch pulse output  
ADC start-of-conversion B  
SCLA  
EPWMSYNCO  
ADCSOCBO  
GPIO34  
O
I/O/Z  
O
General-purpose input/output 34  
Direct output of Comparator 2  
COMP2OUT  
COMP3OUT  
O
Direct output of Comparator 3  
(1) Depending on your USB application, additional pins may be required to maintain compliance with the USB 2.0 Specification. For more  
information, see the "Universal Serial Bus (USB) Controller" chapter of the TMS320x2806x Piccolo Technical Reference Manual  
(literature number SPRUH18).  
Copyright © 2010–2012, Texas Instruments Incorporated  
Device Overview  
27  
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TMS320F28064 TMS320F28063 TMS320F28062  
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
www.ti.com  
Table 2-5. Terminal Functions(1) (continued)  
PIN NO.  
PIN NAME  
GPIO35  
I/O/Z  
DESCRIPTION  
PZ  
PZP  
PN  
PFP  
71  
72  
70  
67  
57  
58  
56  
54  
I/O/Z  
I
General-purpose input/output 35  
TDI  
JTAG test data input (TDI) with internal pullup. TDI is clocked into the selected register  
(instruction or data) on a rising edge of TCK.  
GPIO36  
TMS  
I/O/Z  
I
General-purpose input/output 36  
JTAG test-mode select (TMS) with internal pullup. This serial control input is clocked  
into the TAP controller on the rising edge of TCK.  
GPIO37  
TDO  
I/O/Z  
O/Z  
General-purpose input/output 37  
JTAG scan out, test data output (TDO). The contents of the selected register  
(instruction or data) are shifted out of TDO on the falling edge of TCK (8 mA drive).  
GPIO38  
XCLKIN  
I/O/Z  
I
General-purpose input/output 38  
External Oscillator Input. The path from this pin to the clock block is not gated by the  
mux function of this pin. Care must be taken to not enable this path for clocking if it is  
being used for the other functions.  
TCK  
I
JTAG test clock with internal pullup  
General-purpose input/output 39  
General-purpose input/output 40  
Enhanced PWM7 output A and HRPWM channel  
SCI-B transmit data  
GPIO39  
GPIO40  
EPWM7A  
SCITXDB  
GPIO41  
EPWM7B  
SCIRXDB  
GPIO42  
EPWM8A  
TZ1  
66  
82  
53  
I/O/Z  
I/O/Z  
O
O
76  
1
I/O/Z  
General-purpose input/output 41  
Enhanced PWM7 output B  
SCI-B receive data  
O
I
I/O/Z  
General-purpose input/output 42  
Enhanced PWM8 output A and HRPWM channel  
Trip zone input 1  
O
I
COMP1OUT  
GPIO43  
EPWM8B  
TZ2  
O
Direct output of Comparator 1  
General-purpose input/output 43  
Enhanced PWM8 output B  
Trip zone input 2  
8
I/O/Z  
O
I
COMP2OUT  
GPIO44  
MFSRA  
SCIRXDB  
EPWM7B  
GPIO50  
EQEP1A  
MDXA  
O
Direct output of Comparator 2  
General-purpose input/output 44  
McBSP receive frame synch  
SCI-B receive data  
56  
42  
48  
53  
I/O/Z  
I/O  
I
O
Enhanced PWM7 output B  
General-purpose input/output 50  
Enhanced QEP1 input A  
I/O/Z  
I
O
McBSP transmit serial data  
Trip zone input 1  
TZ1  
I
GPIO51  
EQEP1B  
MDRA  
I/O/Z  
General-purpose input/output 51  
Enhanced QEP1 input B  
I
I
I
McBSP receive serial data  
Trip zone input 2  
TZ2  
GPIO52  
EQEP1S  
MCLKXA  
TZ3  
I/O/Z  
I/O  
I/O  
I
General-purpose input/output 52  
Enhanced QEP1 strobe  
McBSP transmit clock  
Trip zone input 3  
28  
Device Overview  
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TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
www.ti.com  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Table 2-5. Terminal Functions(1) (continued)  
PIN NO.  
PIN NAME  
I/O/Z  
DESCRIPTION  
PZ  
PN  
PZP  
PFP  
GPIO53  
65  
I/O/Z  
I/O  
I/O  
I/O/Z  
I/O  
I
General-purpose input/output 53  
Enhanced QEP1 index  
EQEP1I  
MFSXA  
McBSP transmit frame synch  
General-purpose input/output 54  
SPI-A slave in, master out  
Enhanced QEP2 input A  
GPIO54  
69  
75  
85  
89  
94  
SPISIMOA  
EQEP2A  
HRCAP1  
GPIO55  
I
High-Resolution Input Capture 1  
General-purpose input/output 55  
SPI-A slave out, master in  
Enhanced QEP2 input B  
I/O/Z  
I/O  
I
SPISOMIA  
EQEP2B  
HRCAP2  
GPIO56  
I
High-Resolution Input Capture 2  
General-purpose input/output 56  
SPI-A clock input/output  
I/O/Z  
I/O  
I/O  
I
SPICLKA  
EQEP2I  
Enhanced QEP2 index  
HRCAP3  
GPIO57  
High-Resolution Input Capture 3  
General-purpose input/output 57  
I/O/Z  
I/O  
I/O  
I
SPISTEA  
EQEP2S  
HRCAP4  
GPIO58  
SPI-A slave transmit enable input/output  
Enhanced QEP2 strobe  
High-Resolution Input Capture 4  
General-purpose input/output 58  
McBSP receive clock  
I/O/Z  
I/O  
O
MCLKRA  
SCITXDB  
EPWM7A  
SCI-B transmit data  
O
Enhanced PWM7 output A and HRPWM channel  
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Device Overview  
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TMS320F28064 TMS320F28063 TMS320F28062  
 
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
www.ti.com  
2.5 Brief Descriptions  
2.5.1 CPU  
The 2806x (C28x) family is a member of the TMS320C2000™ microcontroller (MCU) platform. The C28x-  
based controllers have the same 32-bit fixed-point architecture as existing C28x MCUs. Each C28x-based  
controller, including the 2806x device, is a very efficient C/C++ engine, enabling users to develop not only  
their system control software in a high-level language, but also enabling development of math algorithms  
using C/C++. The device is as efficient at MCU math tasks as it is at system control tasks that typically are  
handled by microcontroller devices. This efficiency removes the need for a second processor in many  
systems. The 32 x 32-bit MAC 64-bit processing capabilities enable the controller to handle higher  
numerical resolution problems efficiently. Add to this the fast interrupt response with automatic context  
save of critical registers, resulting in a device that is capable of servicing many asynchronous events with  
minimal latency. The device has an 8-level-deep protected pipeline with pipelined memory accesses. This  
pipelining enables it to execute at high speeds without resorting to expensive high-speed memories.  
Special branch-look-ahead hardware minimizes the latency for conditional discontinuities. Special store  
conditional operations further improve performance.  
2.5.2 Control Law Accelerator (CLA)  
The C28x control law accelerator is a single-precision (32-bit) floating-point unit that extends the  
capabilities of the C28x CPU by adding parallel processing. The CLA is an independent processor with its  
own bus structure, fetch mechanism, and pipeline. Eight individual CLA tasks, or routines, can be  
specified. Each task is started by software or a peripheral such as the ADC, ePWM, eCAP, eQEP, or CPU  
Timer 0. The CLA executes one task at a time to completion. When a task completes the main CPU is  
notified by an interrupt to the PIE and the CLA automatically begins the next highest-priority pending task.  
The CLA can directly access the ADC Result registers, ePWM+HRPWM, eCAP, and eQEP registers.  
Dedicated message RAMs provide a method to pass additional data between the main CPU and the CLA.  
30  
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TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
2.5.3 Viterbi, Complex Math, CRC Unit (VCU)  
The C28x VCU enhances the processing power of C2000™ devices by adding additional assembly  
instructions to target complex math, Viterbi decode, and CRC calculations. The VCU instructions  
accelerate many applications, including the following:  
Orthogonal frequency-division multiplex (OFDM) used in the PRIME and G3 standards for power line  
communications  
Short-range radar complex math calculations  
Power calculations  
Memory and data communication packet checks (CRC)  
The VCU features include:  
Instructions to support Cyclic Redundancy Checks (CRCs), which is a polynomial code checksum.  
CRC8  
CRC16  
CRC32  
Instructions to support a flexible software implementation of a Viterbi decoder  
Branch metric calculations for a code rate of 1/2 or 1/3  
Add-Compare Select or Viterbi Butterfly in 5 cycles per butterfly  
Traceback in 3 cycles per stage  
Easily supports a constraint length of K = 7 used in PRIME and G3 standards  
Complex math arithmetic unit  
Single-cycle Add or Subtract  
2-cycle multiply  
2-cycle multiply and accumulate (MAC)  
Single-cycle repeat MAC  
Independent register space  
2.5.4 Memory Bus (Harvard Bus Architecture)  
As with many MCU-type devices, multiple busses are used to move data between the memories and  
peripherals and the CPU. The memory bus architecture contains a program read bus, data read bus, and  
data write bus. The program read bus consists of 22 address lines and 32 data lines. The data read and  
write busses consist of 32 address lines and 32 data lines each. The 32-bit-wide data busses enable  
single cycle 32-bit operations. The multiple bus architecture, commonly termed Harvard Bus, enables the  
C28x to fetch an instruction, read a data value and write a data value in a single cycle. All peripherals and  
memories attached to the memory bus prioritize memory accesses. Generally, the priority of memory bus  
accesses can be summarized as follows:  
Highest:  
Data Writes  
(Simultaneous data and program writes cannot occur on the  
memory bus.)  
Program Writes  
(Simultaneous data and program writes cannot occur on the  
memory bus.)  
Data Reads  
Program Reads  
(Simultaneous program reads and fetches cannot occur on the  
memory bus.)  
Lowest:  
Fetches  
(Simultaneous program reads and fetches cannot occur on the  
memory bus.)  
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2.5.5 Peripheral Bus  
To enable migration of peripherals between various Texas Instruments (TI) MCU family of devices, the  
devices adopt a peripheral bus standard for peripheral interconnect. The peripheral bus bridge multiplexes  
the various busses that make up the processor Memory Bus into a single bus consisting of 16 address  
lines and 16 or 32 data lines and associated control signals. Three versions of the peripheral bus are  
supported. One version supports only 16-bit accesses (called peripheral frame 2). Another version  
supports both 16- and 32-bit accesses (called peripheral frame 1).  
2.5.6 Real-Time JTAG and Analysis  
(1)  
The devices implement the standard IEEE 1149.1 JTAG  
interface for in-circuit based debug.  
Additionally, the devices support real-time mode of operation allowing modification of the contents of  
memory, peripheral, and register locations while the processor is running and executing code and  
servicing interrupts. The user can also single step through non-time-critical code while enabling time-  
critical interrupts to be serviced without interference. The device implements the real-time mode in  
hardware within the CPU. This is a feature unique to the 28x family of devices, requiring no software  
monitor. Additionally, special analysis hardware is provided that allows setting of hardware breakpoint or  
data/address watch-points and generating various user-selectable break events when a match occurs.  
These devices do not support boundary scan; however, IDCODE and BYPASS features are available if  
the following considerations are taken into account. The IDCODE does not come by default. The user  
needs to go through a sequence of SHIFT IR and SHIFT DR state of JTAG to get the IDCODE. For  
BYPASS instruction, the first shifted DR value would be 1.  
2.5.7 Flash  
The F28069, F28068, F28067, and F28066 devices contain 128K x 16 of embedded flash memory,  
segregated into eight 16K x 16 sectors. The F28065, F28064, F28063, and F28062 devices contain 64K x  
16 of embedded flash memory, segregated into eight 8K x 16 sectors. All devices also contain a single  
1K x 16 of OTP memory at address range 0x3D 7800 – 0x3D 7BF9. The user can individually erase,  
program, and validate a flash sector while leaving other sectors untouched. However, it is not possible to  
use one sector of the flash or the OTP to execute flash algorithms that erase or program other sectors.  
Special memory pipelining is provided to enable the flash module to achieve higher performance. The  
flash/OTP is mapped to both program and data space; therefore, it can be used to execute code or store  
data information. Addresses 0x3F 7FF0 – 0x3F 7FF5 are reserved for data variables and should not  
contain program code.  
NOTE  
The Flash and OTP wait-states can be configured by the application. This allows applications  
running at slower frequencies to configure the flash to use fewer wait-states.  
Flash effective performance can be improved by enabling the flash pipeline mode in the  
Flash options register. With this mode enabled, effective performance of linear code  
execution will be much faster than the raw performance indicated by the wait-state  
configuration alone. The exact performance gain when using the Flash pipeline mode is  
application-dependent.  
For more information on the Flash options, Flash wait-state, and OTP wait-state registers,  
see the "Systems Control and Interrupts" chapter of the TMS320x2806x Piccolo Technical  
Reference Manual (literature number SPRUH18).  
(1) IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture  
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2.5.8 M0, M1 SARAMs  
All devices contain these two blocks of single-access memory, each 1K x 16 in size. The stack pointer  
points to the beginning of block M1 on reset. The M0 and M1 blocks, like all other memory blocks on C28x  
devices, are mapped to both program and data space. Hence, the user can use M0 and M1 to execute  
code or for data variables. The partitioning is performed within the linker. The C28x device presents a  
unified memory map to the programmer. This makes for easier programming in high-level languages.  
2.5.9 L4 SARAM, and L0, L1, L2, L3, L5, L6, L7, and L8 DPSARAMs  
The device contains up to 48K x 16 of single-access RAM. To ascertain the exact size for a given device,  
see the device-specific memory map figures in Section 2.2. This block is mapped to both program and  
data space. L0 is 2K in size. L1 and L2 are each 1K in size. L3 is 4K in size. L4, L5, L6, L7, and L8 are  
each 8K in size. L0, L1, and L2 are shared with the CLA, which can utilize these blocks for its data space.  
L3 is shared with the CLA, which can utilize this block for its program space. L5, L6, L7, and L8 are  
shared with the DMA, which can utilize these blocks for its data space. DPSARAM refers to the dual-port  
configuration of these blocks.  
2.5.10 Boot ROM  
The Boot ROM is factory-programmed with boot-loading software. Boot-mode signals are provided to tell  
the bootloader software what boot mode to use on power up. The user can select to boot normally or to  
download new software from an external connection or to select boot software that is programmed in the  
internal Flash/ROM. The Boot ROM also contains standard tables, such as SIN/COS waveforms, for use  
in math-related algorithms.  
Table 2-6. Boot Mode Selection  
GPIO34/COMP2OUT/  
MODE  
GPIO37/TDO  
TRST  
MODE  
COMP3OUT  
3
2
1
1
0
0
x
1
0
1
0
x
0
0
0
0
1
GetMode  
Wait (see Section 2.5.11 for description)  
1
SCI  
0
Parallel IO  
Emulation Boot  
EMU  
2.5.10.1 Emulation Boot  
When the emulator is connected, the GPIO37/TDO pin cannot be used for boot mode selection. In this  
case, the boot ROM detects that an emulator is connected and uses the contents of two reserved SARAM  
locations in the PIE vector table to determine the boot mode. If the content of either location is invalid,  
then the Wait boot option is used. All boot mode options can be accessed in emulation boot.  
2.5.10.2 GetMode  
The default behavior of the GetMode option is to boot to flash. This behavior can be changed to another  
boot option by programming two locations in the OTP. If the content of either OTP location is invalid, then  
boot to flash is used. One of the following loaders can be specified: SCI, SPI, I2C, CAN, or OTP.  
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2.5.10.3 Peripheral Pins Used by the Bootloader  
Table 2-7 shows which GPIO pins are used by each peripheral bootloader. Refer to the GPIO mux table  
to see if these conflict with any of the peripherals you would like to use in your application.  
Table 2-7. Peripheral Bootload Pins  
BOOTLOADER  
PERIPHERAL LOADER PINS  
SCIRXDA (GPIO28)  
SCI  
SCITXDA (GPIO29)  
Parallel Boot  
SPI  
Data (GPIO31,30,5:0)  
28x Control (AIO6)  
Host Control (AIO12)  
SPISIMOA (GPIO16)  
SPISOMIA (GPIO17)  
SPICLKA (GPIO18)  
SPISTEA (GPIO19)  
I2C  
SDAA (GPIO32)  
SCLA (GPIO33)  
CAN  
CANRXA (GPIO30)  
CANTXA (GPIO31)  
2.5.11 Security  
The devices support high levels of security to protect the user firmware from being reverse-engineered.  
The security features a 128-bit password (hardcoded for 16 wait-states), which the user programs into the  
flash. One code security module (CSM) is used to protect the flash/OTP and the L0/L1 SARAM blocks.  
The security feature prevents unauthorized users from examining the memory contents via the JTAG port,  
executing code from external memory or trying to boot-load some undesirable software that would export  
the secure memory contents. To enable access to the secure blocks, the user must write the correct 128-  
bit KEY value that matches the value stored in the password locations within the Flash.  
In addition to the CSM, the emulation code security logic (ECSL) has been implemented to prevent  
unauthorized users from stepping through secure code. Any code or data access to flash, user OTP, or L0  
memory while the emulator is connected will trip the ECSL and break the emulation connection. To allow  
emulation of secure code, while maintaining the CSM protection against secure memory reads, the user  
must write the correct value into the lower 64 bits of the KEY register, which matches the value stored in  
the lower 64 bits of the password locations within the flash. Note that dummy reads of all 128 bits of the  
password in the flash must still be performed. If the lower 64 bits of the password locations are all ones  
(unprogrammed), then the KEY value does not need to match.  
When initially debugging a device with the password locations in flash programmed (that is, secured), the  
CPU will start running and may execute an instruction that performs an access to a protected ECSL area.  
If this happens, the ECSL will trip and cause the emulator connection to be cut.  
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The solution is to use the Wait boot option. This will sit in a loop around a software breakpoint to allow an  
emulator to be connected without tripping security. Piccolo devices do not support a hardware wait-in-  
reset mode.  
NOTE  
When the code-security passwords are programmed, all addresses between 0x3F 7F80  
and 0x3F 7FF5 cannot be used as program code or data. These locations must be  
programmed to 0x0000.  
If the code security feature is not used, addresses 0x3F 7F80 through 0x3F 7FEF may  
be used for code or data. Addresses 0x3F 7FF0 – 0x3F 7FF5 are reserved for data and  
should not contain program code.  
The 128-bit password (at 0x3F 7FF8 – 0x3F 7FFF) must not be programmed to zeros. Doing  
so would permanently lock the device.  
Disclaimer  
Code Security Module Disclaimer  
THE CODE SECURITY MODULE (CSM) INCLUDED ON THIS DEVICE WAS DESIGNED  
TO PASSWORD PROTECT THE DATA STORED IN THE ASSOCIATED MEMORY  
(EITHER ROM OR FLASH) AND IS WARRANTED BY TEXAS INSTRUMENTS (TI), IN  
ACCORDANCE WITH ITS STANDARD TERMS AND CONDITIONS, TO CONFORM TO  
TI'S PUBLISHED SPECIFICATIONS FOR THE WARRANTY PERIOD APPLICABLE FOR  
THIS DEVICE.  
TI DOES NOT, HOWEVER, WARRANT OR REPRESENT THAT THE CSM CANNOT BE  
COMPROMISED OR BREACHED OR THAT THE DATA STORED IN THE ASSOCIATED  
MEMORY CANNOT BE ACCESSED THROUGH OTHER MEANS. MOREOVER, EXCEPT  
AS SET FORTH ABOVE, TI MAKES NO WARRANTIES OR REPRESENTATIONS  
CONCERNING THE CSM OR OPERATION OF THIS DEVICE, INCLUDING ANY IMPLIED  
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.  
IN NO EVENT SHALL TI BE LIABLE FOR ANY CONSEQUENTIAL, SPECIAL, INDIRECT,  
INCIDENTAL, OR PUNITIVE DAMAGES, HOWEVER CAUSED, ARISING IN ANY WAY  
OUT OF YOUR USE OF THE CSM OR THIS DEVICE, WHETHER OR NOT TI HAS BEEN  
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE,  
BUT ARE NOT LIMITED TO LOSS OF DATA, LOSS OF GOODWILL, LOSS OF USE OR  
INTERRUPTION OF BUSINESS OR OTHER ECONOMIC LOSS.  
2.5.12 Peripheral Interrupt Expansion (PIE) Block  
The PIE block serves to multiplex numerous interrupt sources into a smaller set of interrupt inputs. The  
PIE block can support up to 96 peripheral interrupts. On the F2806x, 72 of the possible 96 interrupts are  
used by peripherals. The 96 interrupts are grouped into blocks of 8 and each group is fed into 1 of  
12 CPU interrupt lines (INT1 to INT12). Each of the 96 interrupts is supported by its own vector stored in a  
dedicated RAM block that can be overwritten by the user. The vector is automatically fetched by the CPU  
on servicing the interrupt. Eight CPU clock cycles are needed to fetch the vector and save critical CPU  
registers. Hence the CPU can quickly respond to interrupt events. Prioritization of interrupts is controlled in  
hardware and software. Each individual interrupt can be enabled or disabled within the PIE block.  
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2.5.13 External Interrupts (XINT1–XINT3)  
The devices support three masked external interrupts (XINT1–XINT3). Each of the interrupts can be  
selected for negative, positive, or both negative and positive edge triggering and can also be enabled or  
disabled. These interrupts also contain a 16-bit free-running up counter, which is reset to zero when a  
valid interrupt edge is detected. This counter can be used to accurately time-stamp the interrupt. There  
are no dedicated pins for the external interrupts. XINT1, XINT2, and XINT3 interrupts can accept inputs  
from GPIO0–GPIO31 pins.  
2.5.14 Internal Zero Pin Oscillators, Oscillator, and PLL  
The device can be clocked by either of the two internal zero-pin oscillators, an external oscillator, or by a  
crystal attached to the on-chip oscillator circuit. A PLL is provided supporting up to 16 input-clock-scaling  
ratios. The PLL ratios can be changed on-the-fly in software, enabling the user to scale back on operating  
frequency if lower power operation is desired. Refer to Section 4, Electrical Specifications, for timing  
details. The PLL block can be set in bypass mode. A second PLL (PLL2) feeds the HRCAP module.  
2.5.15 Watchdog  
Each device contains two watchdogs: CPU-Watchdog that monitors the core and NMI-Watchdog that is a  
missing clock-detect circuit. The user software must regularly reset the CPU-watchdog counter within a  
certain time frame; otherwise, the CPU-watchdog generates a reset to the processor. The CPU-watchdog  
can be disabled if necessary. The NMI-Watchdog engages only in case of a clock failure and can either  
generate an interrupt or a device reset.  
2.5.16 Peripheral Clocking  
The clocks to each individual peripheral can be enabled or disabled to reduce power consumption when a  
peripheral is not in use. Additionally, the system clock to the serial ports (except I2C) can be scaled  
relative to the CPU clock.  
2.5.17 Low-power Modes  
The devices are full static CMOS devices. Three low-power modes are provided:  
IDLE:  
Places CPU in low-power mode. Peripheral clocks may be turned off selectively and  
only those peripherals that need to function during IDLE are left operating. An  
enabled interrupt from an active peripheral or the watchdog timer will wake the  
processor from IDLE mode.  
STANDBY: Turns off clock to CPU and peripherals. This mode leaves the oscillator and PLL  
functional. An external interrupt event will wake the processor and the peripherals.  
Execution begins on the next valid cycle after detection of the interrupt event  
HALT:  
This mode basically shuts down the device and places it in the lowest possible power-  
consumption mode. If the internal zero-pin oscillators are used as the clock source,  
the HALT mode turns them off, by default. To keep these oscillators from shutting  
down, the INTOSCnHALTI bits in CLKCTL register may be used. The zero-pin  
oscillators may thus be used to clock the CPU-watchdog in this mode. If the on-chip  
crystal oscillator is used as the clock source, it is shut down in this mode. A reset or  
an external signal (through a GPIO pin) or the CPU-watchdog can wake the device  
from this mode.  
The CPU clock (OSCCLK) and WDCLK should be from the same clock source before attempting to put  
the device into HALT or STANDBY.  
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2.5.18 Peripheral Frames 0, 1, 2, 3 (PFn)  
The device segregates peripherals into four sections. The mapping of peripherals is as follows:  
PF0: PIE:  
Flash:  
PIE Interrupt Enable and Control Registers Plus PIE Vector Table  
Flash Waitstate Registers  
Timers:  
CSM:  
CPU-Timers 0, 1, 2 Registers  
Code Security Module KEY Registers  
ADC:  
ADC Result Registers  
CLA:  
Control Law Accelrator Registers and Message RAMs  
GPIO MUX Configuration and Control Registers  
Enhanced Control Area Network Configuration and Control Registers  
System Control Registers  
PF1: GPIO:  
eCAN:  
PF2: SYS:  
SCI:  
Serial Communications Interface (SCI) Control and RX/TX Registers  
Serial Port Interface (SPI) Control and RX/TX Registers  
ADC Status, Control, and Configuration Registers  
Inter-Integrated Circuit Module and Registers  
External Interrupt Registers  
SPI:  
ADC:  
I2C:  
XINT:  
PF3: McBSP:  
ePWM:  
eCAP:  
Multichannel Buffered Serial Port Registers  
Enhanced Pulse Width Modulator Module and Registers  
Enhanced Capture Module and Registers  
eQEP:  
Enhanced Quadrature Encoder Pulse Module and Registers  
Comparators: Comparator Modules  
USB:  
Universal Serial Bus Module and Registers  
2.5.19 General-Purpose Input/Output (GPIO) Multiplexer  
Most of the peripheral signals are multiplexed with general-purpose input/output (GPIO) signals. This  
enables the user to use a pin as GPIO if the peripheral signal or function is not used. On reset, GPIO pins  
are configured as inputs. The user can individually program each pin for GPIO mode or peripheral signal  
mode. For specific inputs, the user can also select the number of input qualification cycles. This is to filter  
unwanted noise glitches. The GPIO signals can also be used to bring the device out of specific low-power  
modes.  
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2.5.20 32-Bit CPU-Timers (0, 1, 2)  
CPU-Timers 0, 1, and 2 are identical 32-bit timers with presettable periods and with 16-bit clock  
prescaling. The timers have a 32-bit count-down register, which generates an interrupt when the counter  
reaches zero. The counter is decremented at the CPU clock speed divided by the prescale value setting.  
When the counter reaches zero, it is automatically reloaded with a 32-bit period value.  
CPU-Timer 0 is for general use and is connected to the PIE block. CPU-Timer 1 is also for general use  
and can be connected to INT13 of the CPU. CPU-Timer 2 is reserved for DSP/BIOS. CPU-Timer 2 is  
connected to INT14 of the CPU. If DSP/BIOS is not being used, CPU-Timer 2 is available for general use.  
CPU-Timer 2 can be clocked by any one of the following:  
SYSCLKOUT (default)  
Internal zero-pin oscillator 1 (INTOSC1)  
Internal zero-pin oscillator 2 (INTSOC2)  
External clock source  
2.5.21 Control Peripherals  
The devices support the following peripherals that are used for embedded control and communication:  
ePWM:  
The enhanced PWM peripheral supports independent/complementary PWM  
generation, adjustable dead-band generation for leading/trailing edges,  
latched/cycle-by-cycle trip mechanism. Some of the PWM pins support the  
HRPWM high resolution duty and period features. The type 1 module found on  
2806x devices also supports increased dead-band resolution, enhanced SOC and  
interrupt generation, and advanced triggering including trip functions based on  
comparator outputs.  
eCAP:  
eQEP:  
The enhanced capture peripheral uses a 32-bit time base and registers up to four  
programmable events in continuous/one-shot capture modes.  
This peripheral can also be configured to generate an auxiliary PWM signal.  
The enhanced QEP peripheral uses a 32-bit position counter, supports low-speed  
measurement using capture unit and high-speed measurement using a 32-bit unit  
timer. This peripheral has a watchdog timer to detect motor stall and input error  
detection logic to identify simultaneous edge transition in QEP signals.  
ADC:  
The ADC block is a 12-bit converter. The ADC has up to 16 single-ended channels  
pinned out, depending on the device. The ADC also contains two sample-and-hold  
units for simultaneous sampling.  
Comparator: Each comparator block consists of one analog comparator along with an internal  
10-bit reference for supplying one input of the comparator.  
HRCAP:  
The high-resolution capture peripheral operates in normal capture mode via a 16-  
bit counter clocked off of the HCCAPCLK or in high-resolution capture mode by  
utilizing built-in calibration logic in conjunction with a TI-supplied calibration library.  
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2.5.22 Serial Port Peripherals  
The devices support the following serial communication peripherals:  
SPI:  
The SPI is a high-speed, synchronous serial I/O port that allows a serial bit stream  
of programmed length (one to sixteen bits) to be shifted into and out of the device  
at a programmable bit-transfer rate. Normally, the SPI is used for communications  
between the MCU and external peripherals or another processor. Typical  
applications include external I/O or peripheral expansion through devices such as  
shift registers, display drivers, and ADCs. Multi-device communications are  
supported by the master/slave operation of the SPI. The SPI contains a 4-level  
receive and transmit FIFO for reducing interrupt servicing overhead.  
SCI:  
I2C:  
The serial communications interface is a two-wire asynchronous serial port,  
commonly known as UART. The SCI contains a 4-level receive and transmit FIFO  
for reducing interrupt servicing overhead.  
The inter-integrated circuit (I2C) module provides an interface between a MCU  
and other devices compliant with Philips Semiconductors Inter-IC bus (I2C-bus)  
specification version 2.1 and connected by way of an I2C-bus. External  
components attached to this 2-wire serial bus can transmit/receive up to 8-bit data  
to or from the MCU through the I2C module. The I2C contains a 4-level receive-  
and-transmit FIFO for reducing interrupt servicing overhead.  
eCAN:  
This is the enhanced version of the CAN peripheral. The eCAN supports 32  
mailboxes, time stamping of messages, and is CAN 2.0B-compliant.  
McBSP:  
The multichannel buffered serial port (McBSP) connects to E1/T1 lines, phone-  
quality codecs for modem applications or high-quality stereo audio DAC devices.  
The McBSP receive and transmit registers are supported by the DMA to  
significantly reduce the overhead for servicing this peripheral. Each McBSP  
module can be configured as an SPI as required.  
USB:  
The USB peripheral, which conforms to the USB 2.0 specification, may be used as  
either a full-speed (12-Mbps) device controller, or a full-speed (12-Mbps) or low-  
speed (1.5-Mbps) host controller. The controller supports a total of six user-  
configurable endpoints—all of which can be accessed via DMA, in addition to a  
dedicated control endpoint for endpoint zero. All packets transmitted or received  
are buffered in 4KB of dedicated endpoint memory. The USB peripheral supports  
all four transfer types: Control, Interrupt, Bulk, and Isochronous. Because of the  
complexity of the USB peripheral and the associated protocol overhead, a full  
software library with application examples is provided within ControlSUITE™.  
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2.6 Register Map  
The devices contain four peripheral register spaces. The spaces are categorized as follows:  
Peripheral Frame 0: These are peripherals that are mapped directly to the CPU memory bus.  
See Table 2-8.  
Peripheral Frame 1: These are peripherals that are mapped to the 32-bit peripheral bus. See  
Table 2-9.  
Peripheral Frame 2: These are peripherals that are mapped to the 16-bit peripheral bus. See  
Table 2-10.  
Peripheral Frame 3: McBSP registers are mapped to this. See Table 2-11.  
Table 2-8. Peripheral Frame 0 Registers(1)  
NAME  
Device Emulation Registers  
System Power Control Registers  
FLASH Registers(3)  
ADDRESS RANGE  
0x00 0880 – 0x00 0984  
0x00 0985 – 0x00 0987  
0x00 0A80 – 0x00 0ADF  
0x00 0AE0 – 0x00 0AEF  
0x00 0B00 – 0x00 0B0F  
SIZE (×16)  
EALLOW PROTECTED(2)  
261  
3
Yes  
Yes  
Yes  
Yes  
No  
96  
16  
16  
Code Security Module Registers  
ADC registers  
(0 wait read only)  
CPU–TIMER0, CPU–TIMER1, CPU–TIMER2  
Registers  
0x00 0C00 – 0x00 0C3F  
64  
No  
PIE Registers  
0x00 0CE0 – 0x00 0CFF  
0x00 0D00 – 0x00 0DFF  
0x00 1000 – 0x00 11FF  
0x00 1400 – 0x00 147F  
0x00 1480 – 0x00 14FF  
0x00 1500 – 0x00 157F  
32  
No  
Yes  
Yes  
Yes  
NA  
PIE Vector Table  
256  
512  
128  
128  
128  
DMA Registers  
CLA Registers  
CLA to CPU Message RAM (CPU writes ignored)  
CPU to CLA Message RAM (CLA writes ignored)  
NA  
(1) Registers in Frame 0 support 16-bit and 32-bit accesses.  
(2) If registers are EALLOW protected, then writes cannot be performed until the EALLOW instruction is executed. The EDIS instruction  
disables writes to prevent stray code or pointers from corrupting register contents.  
(3) The Flash Registers are also protected by the Code Security Module (CSM).  
40  
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Table 2-9. Peripheral Frame 1 Registers  
NAME  
ADDRESS RANGE  
0x00 6000 – 0x00 61FF  
0x00 6AC0 – 0x00 6ADF  
0x00 6AE0 – 0x00 6AFF  
0x00 6C80 – 0x00 6C9F  
0x00 6CA0 – 0x00 6CBF  
0x00 6F80 – 0x00 6FFF  
SIZE (×16)  
EALLOW PROTECTED  
(1)  
eCAN-A registers  
HRCAP1 registers  
HRCAP2 registers  
HRCAP3 registers  
HRCAP4 registers  
GPIO registers  
512  
32  
(1)  
(1)  
(1)  
(1)  
(1)  
32  
32  
32  
128  
(1) Some registers are EALLOW protected. See the module reference guide for more information.  
Table 2-10. Peripheral Frame 2 Registers  
NAME  
System Control Registers  
ADDRESS RANGE  
0x00 7010 – 0x00 702F  
0x00 7040 – 0x00 704F  
0x00 7050 – 0x00 705F  
0x00 7060 – 0x00 706F  
0x00 7070 – 0x00 707F  
0x00 7100 – 0x00 717F  
0x00 7740 – 0x00 774F  
0x00 7750 – 0x00 775F  
0x00 7900 – 0x00 793F  
SIZE (×16)  
EALLOW PROTECTED  
32  
16  
16  
16  
16  
128  
16  
16  
64  
Yes  
No  
SPI-A Registers  
SCI-A Registers  
No  
NMI Watchdog Interrupt Registers  
External Interrupt Registers  
ADC Registers  
Yes  
Yes  
(1)  
SPI-B Registers  
No  
SCI-B Registers  
No  
(1)  
I2C-A Registers  
(1) Some registers are EALLOW protected. See the module reference guide for more information.  
Table 2-11. Peripheral Frame 3 Registers  
NAME  
ADDRESS RANGE  
0x00 4000 – 0x00 4FFF  
0x00 5000 – 0x00 503F  
0x00 6400 – 0x00 641F  
0x00 6420 – 0x00 643F  
0x00 6440 – 0x00 645F  
0x00 6800 – 0x00 683F  
0x00 6840 – 0x00 687F  
0x00 6880 – 0x00 68BF  
0x00 68C0 – 0x00 68FF  
0x00 6900 – 0x00 693F  
0x00 6940 – 0x00 697F  
0x00 6980 – 0x00 69BF  
0x00 69C0 – 0x00 69FF  
0x00 6A00 – 0x00 6A1F  
0x00 6A20 – 0x00 6A3F  
0x00 6A40 – 0x00 6A57  
0x00 6B00 – 0x00 6B3F  
0x00 6B40 – 0x00 6B7F  
SIZE (×16)  
4096  
64  
EALLOW PROTECTED  
USB0 Registers  
No  
McBSP-A Registers  
No  
(1)  
Comparator 1 registers  
Comparator 2 registers  
Comparator 3 registers  
ePWM1 + HRPWM1 registers  
ePWM2 + HRPWM2 registers  
ePWM3 + HRPWM3 registers  
ePWM4 + HRPWM4 registers  
ePWM5 + HRPWM5 registers  
ePWM6 + HRPWM6 registers  
ePWM7 + HRPWM7 registers  
ePWM8 + HRPWM8 registers  
eCAP1 registers  
32  
(1)  
(1)  
(1)  
(1)  
(1)  
(1)  
(1)  
(1)  
(1)  
(1)  
32  
32  
64  
64  
64  
64  
64  
64  
64  
64  
32  
No  
No  
eCAP2 registers  
32  
eCAP3 registers  
32  
No  
(1)  
eQEP1 registers  
64  
(1)  
eQEP2 registers  
64  
(1) Some registers are EALLOW protected. See the module reference guide for more information.  
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2.7 Device Emulation Registers  
These registers are used to control the protection mode of the C28x CPU and to monitor some critical  
device signals. The registers are defined in Table 2-12.  
Table 2-12. Device Emulation Registers  
ADDRESS  
RANGE  
EALLOW  
PROTECTED  
NAME  
SIZE (x16)  
DESCRIPTION  
Device Configuration Register  
0x0880–  
0x0881  
DEVICECNF  
PARTID  
2
1
Yes  
0x3D 7E80  
Part ID Register  
TMS320F28069PZP/PZ  
TMS320F28069UPZP/PZ  
TMS320F28069PFP/PN  
TMS320F28069UPFP/PN  
TMS320F28068PZP/PZ  
TMS320F28068UPZP/PZ  
TMS320F28068PFP/PN  
TMS320F28068UPFP/PN  
TMS320F28067PZP/PZ  
TMS320F28067UPZP/PZ  
TMS320F28067PFP/PN  
TMS320F28067UPFP/PN  
TMS320F28066PZP/PZ  
TMS320F28066UPZP/PZ  
TMS320F28066PFP/PN  
TMS320F28066UPFP/PN  
TMS320F28065PZP/PZ  
TMS320F28065UPZP/PZ  
TMS320F28065PFP/PN  
TMS320F28065UPFP/PN  
TMS320F28064PZP/PZ  
TMS320F28064UPZP/PZ  
TMS320F28064PFP/PN  
TMS320F28064UPFP/PN  
TMS320F28063PZP/PZ  
TMS320F28063UPZP/PZ  
TMS320F28063PFP/PN  
TMS320F28063UPFP/PN  
TMS320F28062PZP/PZ  
TMS320F28062UPZP/PZ  
TMS320F28062PFP/PN  
TMS320F28062UPFP/PN  
0x009E  
0x009F  
0x009C  
0x009D  
0x008E  
0x008F  
0x008C  
0x008D  
0x008A  
0x008B  
0x0088  
0x0089  
0x0086  
0x0087  
0x0084  
0x0085  
0x007E  
0x007F  
0x007C  
0x007D  
0x006E  
0x006F  
0x006C  
0x006D  
0x006A  
0x006B  
0x0068  
0x0069  
0x0066  
0x0067  
0x0064  
0x0065  
No  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Table 2-12. Device Emulation Registers (continued)  
ADDRESS  
RANGE  
EALLOW  
PROTECTED  
NAME  
SIZE (x16)  
DESCRIPTION  
CLASSID  
0x0882  
1
Class ID Register  
TMS320F28069  
TMS320F28069U  
TMS320F28068  
TMS320F28068U  
TMS320F28067  
TMS320F28067U  
TMS320F28066  
TMS320F28066U  
TMS320F28065  
TMS320F28065U  
TMS320F28064  
TMS320F28064U  
TMS320F28063  
TMS320F28063U  
TMS320F28062  
TMS320F28062U  
0x009F  
0x009F  
0x008F  
0x008F  
0x008F  
0x008F  
0x008F  
0x008F  
0x007F  
0x007F  
0x006F  
0x006F  
0x006F  
0x006F  
0x006F  
0x006F  
No  
REVID  
0x0883  
1
Revision ID Register 0x0000 - Silicon Rev. 0 - TMX  
0x0001 - Silicon Rev. A - TMS  
No  
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2.8 VREG, BOR, POR  
Although the core and I/O circuitry operate on two different voltages, these devices have an on-chip  
voltage regulator (VREG) to generate the VDD voltage from the VDDIO supply. This eliminates the cost and  
space of a second external regulator on an application board. Additionally, internal power-on reset (POR)  
and brown-out reset (BOR) circuits monitor both the VDD and VDDIO rails during power-up and run mode.  
2.8.1 On-chip Voltage Regulator (VREG)  
A linear regulator generates the core voltage (VDD) from the VDDIO supply. Therefore, although capacitors  
are required on each VDD pin to stabilize the generated voltage, power need not be supplied to these pins  
to operate the device. Conversely, the VREG can be disabled, should power or redundancy be the  
primary concern of the application.  
2.8.1.1 Using the On-chip VREG  
To utilize the on-chip VREG, the VREGENZ pin should be tied low and the appropriate recommended  
operating voltage should be supplied to the VDDIO and VDDA pins. In this case, the VDD voltage needed by  
the core logic will be generated by the VREG. Each VDD pin requires on the order of 1.2 μF (minimum)  
capacitance for proper regulation of the VREG. These capacitors should be located as close as possible  
to the VDD pins.  
2.8.1.2 Disabling the On-chip VREG  
To conserve power, it is also possible to disable the on-chip VREG and supply the core logic voltage to  
the VDD pins with a more efficient external regulator. To enable this option, the VREGENZ pin must be tied  
high.  
2.8.2 On-chip Power-On Reset (POR) and Brown-Out Reset (BOR) Circuit  
Two on-chip supervisory circuits, the power-on reset (POR) and the brown-out reset (BOR) remove the  
burden of monitoring the VDD and VDDIO supply rails from the application board. The purpose of the POR is  
to create a clean reset throughout the device during the entire power-up procedure. The trip point is a  
looser, lower trip point than the BOR, which watches for dips in the VDD or VDDIO rail during device  
operation. The POR function is present on both VDD and VDDIO rails at all times. After initial device power-  
up, the BOR function is present on VDDIO at all times, and on VDD when the internal VREG is enabled  
(VREGENZ pin is tied low). Both functions tie the XRS pin low when one of the voltages is below their  
respective trip point. Additionally, when the internal voltage regulator is enabled, an over-voltage  
protection circuit will tie XRS low if the VDD rail rises above its trip point. See Section 4 for the various trip  
points as well as the delay time for the device to release the XRS pin after the under-voltage or over-  
voltage condition is removed. Figure 2-10 shows the VREG, POR, and BOR. To disable both the VDD and  
VDDIO BOR functions, a bit is provided in the BORCFG register. See the "Systems Control and Interrupts"  
chapter of the TMS320x2806x Piccolo Technical Reference Manual (literature number SPRUH18) for  
details.  
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In  
I/O Pin  
Out  
(Force Hi-Z When High)  
DIR (0 = Input, 1 = Output)  
SYSRS  
Internal  
Weak PU  
SYSCLKOUT  
Deglitch  
XRS  
Filter  
Sync  
RS  
C28  
Core  
MCLKRS  
PLL  
JTAG  
TCK  
Detect  
Logic  
XRS  
Pin  
+
Clocking  
Logic  
VREGHALT  
WDRST(A)  
PBRS(B)  
POR/BOR  
Generating  
Module  
On-Chip  
Voltage  
Regulator  
(VREG)  
VREGENZ  
A. WDRST is the reset signal from the CPU-watchdog.  
B. PBRS is the reset signal from the POR/BOR module.  
Figure 2-10. VREG + POR + BOR + Reset Signal Connectivity  
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2.9 System Control  
This section describes the oscillator and clocking mechanisms, the watchdog function and the low power  
modes.  
Table 2-13. PLL, Clocking, Watchdog, and Low-Power Mode Registers  
NAME  
ADDRESS  
0x00 0985  
0x00 7010  
0x00 7011  
0x00 7012  
0x00 7013  
0x00 7014  
0x00 7016  
0x00 7019  
0x00 701B  
0x00 701C  
0x00 701D  
0x00 701E  
0x00 7020  
0x00 7021  
0x00 7022  
0x00 7023  
0x00 7025  
0x00 7029  
0x00 702A  
0x00 7030  
0x00 7032  
0x00 7034  
0x00 7036  
0x00 703A  
SIZE (x16)  
DESCRIPTION(1)  
BOR Configuration Register  
BORCFG  
XCLK  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
XCLKOUT Control  
PLLSTS  
CLKCTL  
PLL Status Register  
Clock Control Register  
PLLLOCKPRD  
INTOSC1TRIM  
INTOSC2TRIM  
PCLKCR2  
LOSPCP  
PLL Lock Period  
Internal Oscillator 1 Trim Register  
Internal Oscillator 2 Trim Register  
Peripheral Clock Control Register 2  
Low-Speed Peripheral Clock Prescaler Register  
Peripheral Clock Control Register 0  
Peripheral Clock Control Register 1  
Low Power Mode Control Register 0  
Peripheral Clock Control Register 3  
PLL Control Register  
PCLKCR0  
PCLKCR1  
LPMCR0  
PCLKCR3  
PLLCR  
SCSR  
System Control and Status Register  
Watchdog Counter Register  
Watchdog Reset Key Register  
Watchdog Control Register  
WDCNTR  
WDKEY  
WDCR  
JTAGDEBUG  
PLL2CTL  
JTAG Port Debug Register  
PLL2 Configuration Register  
PLL2 Multiplier Register  
PLL2MULT  
PLL2STS  
PLL2 Lock Status Register  
SYSCLK2CNTR  
EPWMCFG  
SYSCLK2 Clock Counter Register  
ePWM DMA/CLA Configuration Register  
(1) All registers in this table are EALLOW protected.  
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Figure 2-11 shows the various clock domains that are discussed. Figure 2-12 shows the various clock  
sources (both internal and external) that can provide a clock for device operation.  
SYSCLKOUT  
PCLKCR0/1/2/3  
(System Ctrl Regs)  
LOSPCP  
(System Ctrl Regs)  
PLL2  
C28x Core  
CLKIN  
LSPCLK  
Clock Enables  
SPI-A, SPI-B, SCI-A, SCI-B  
Clock Enables  
USB  
Peripheral  
Registers  
I/O  
I/O  
PF2  
Peripheral  
Registers  
PF3  
LOSPCP  
(System Ctrl Regs)  
Clock Enables  
LSPCLK  
Peripheral  
Registers  
I/O  
I/O  
I/O  
I/O  
McBSP  
Clock Enables  
eCAN-A  
PF3  
PF1  
PF3  
PF3  
PF2  
PF1  
/2  
Peripheral  
Registers  
GPIO  
Mux  
Clock Enables  
Peripheral  
Registers  
eCAP1, eCAP2, eCAP3  
eQEP1, eQEP2  
Clock Enables  
ePWM1, ePWM2,  
ePWM3, ePWM4, ePWM5,  
ePWM6, ePWM7, ePWM8  
Peripheral  
Registers  
Clock Enables  
Peripheral  
Registers  
I2C-A  
I/O  
I/O  
Clock Enables  
Peripheral  
Registers  
HRCAP1, HRCAP2,  
HRCAP3, HRCAP4  
Clock Enables  
12-Bit ADC  
ADC  
Registers  
PF2  
PF0  
16 Ch  
Analog  
GPIO  
Mux  
Clock Enables  
COMP  
Registers  
COMP1, COMP2, COMP3  
6
PF3  
A. CLKIN is the clock into the CPU. CLKIN is passed out of the CPU as SYSCLKOUT (that is, CLKIN is the same  
frequency as SYSCLKOUT).  
Figure 2-11. Clock and Reset Domains  
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CLKCTL[WDCLKSRCSEL]  
Internal  
OSC 1  
(10 MHz)  
0
OSC1CLK  
INTOSC1TRIM Reg(A)  
OSCCLKSRC1  
WDCLK  
CPU-Watchdog  
(OSC1CLK on XRS reset)  
OSCE  
1
CLKCTL[INTOSC1OFF]  
1 = Turn OSC Off  
CLKCTL[OSCCLKSRCSEL]  
CLKCTL[INTOSC1HALT]  
1 = Ignore HALT  
WAKEOSC  
OSC2CLK  
0
1
Internal  
OSC 2  
(10 MHz)  
INTOSC2TRIM Reg(A)  
OSCCLK  
PLL  
Missing-Clock-Detect Circuit(B)  
(OSC1CLK on XRS reset)  
OSCE  
CLKCTL[TRM2CLKPRESCALE]  
CLKCTL[TMR2CLKSRCSEL]  
1 = Turn OSC Off  
10  
11  
CLKCTL[INTOSC2OFF]  
Prescale  
/1, /2, /4,  
/8, /16  
SYNC  
Edge  
Detect  
01, 10, 11  
CPUTMR2CLK  
1 = Ignore HALT  
01  
1
0
00  
CLKCTL[INTOSC2HALT]  
SYSCLKOUT  
OSCCLKSRC2  
CLKCTL[OSCCLKSRC2SEL]  
0 = GPIO38  
1 = GPIO19  
XCLK[XCLKINSEL]  
PLL2CTL.PLL2CLKSRCSEL  
PLL2CTL.PLL2EN  
CLKCTL[XCLKINOFF]  
0
1
0
PLL2  
GPIO19  
or  
XCLKIN  
/2  
GPIO38  
SYSCLK2 to  
USB and  
XCLKIN  
HRCAP Blocks  
X1  
X2  
EXTCLK  
(Crystal)  
OSC  
XTAL  
WAKEOSC  
(Oscillators enabled when this signal is high)  
0 = OSC on (default on reset)  
1 = Turn OSC off  
CLKCTL[XTALOSCOFF]  
A. Register loaded from TI OTP-based calibration function.  
B. See Section 2.9.5 for details on missing clock detection.  
Figure 2-12. Clock Tree  
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2.9.1 Internal Zero Pin Oscillators  
The F2806x devices contain two independent internal zero pin oscillators. By default both oscillators are  
turned on at power up, and internal oscillator 1 is the default clock source at this time. For power savings,  
unused oscillators may be powered down by the user. The center frequency of these oscillators is  
determined by their respective oscillator trim registers, written to in the calibration routine as part of the  
boot ROM execution. See Section 5, Peripheral and Electrical Specifications, for more information on  
these oscillators.  
2.9.2 Crystal Oscillator Option  
The typical specifications for the external quartz crystal (fundamental mode, parallel resonant) are listed in  
Table 2-14. Furthermore, ESR range = 30 to 150 .  
Table 2-14. Typical Specifications for External Quartz Crystal(1)  
FREQUENCY (MHz)  
Rd ()  
2200  
470  
0
CL1 (pF)  
18  
CL2 (pF)  
18  
5
10  
15  
20  
15  
15  
15  
15  
0
12  
12  
(1) Cshunt should be less than or equal to 5 pF.  
XCLKIN/GPIO19/38  
X1  
X2  
Rd  
Turn off  
XCLKIN path  
in CLKCTL  
register  
CL1  
Crystal  
CL2  
Figure 2-13. Using the On-chip Crystal Oscillator  
NOTE  
1. CL1 and CL2 are the total capacitance of the circuit board and components excluding the  
IC and crystal. The value is usually approximately twice the value of the crystal's load  
capacitance.  
2. The load capacitance of the crystal is described in the crystal specifications of the  
manufacturers.  
3. TI recommends that customers have the resonator/crystal vendor characterize the  
operation of their device with the MCU chip. The resonator/crystal vendor has the  
equipment and expertise to tune the tank circuit. The vendor can also advise the  
customer regarding the proper tank component values that will produce proper start up  
and stability over the entire operating range.  
XCLKIN/GPIO19/38  
X1  
X2  
NC  
External Clock Signal  
(Toggling 0−V  
)
DDIO  
Figure 2-14. Using a 3.3-V External Oscillator  
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2.9.3 PLL-Based Clock Module  
The devices have an on-chip, PLL-based clock module. This module provides all the necessary clocking  
signals for the device, as well as control for low-power mode entry. The PLL has a 5-bit ratio control  
PLLCR[DIV] to select different CPU clock rates. The watchdog module should be disabled before writing  
to the PLLCR register. The watchdog module can be re-enabled (if need be) after the PLL module has  
stabilized, which takes 1 ms. The input clock and PLLCR[DIV] bits should be chosen in such a way that  
the output frequency of the PLL (VCOCLK) is at least 50 MHz.  
Table 2-15. PLL Settings  
SYSCLKOUT (CLKIN)  
PLLCR[DIV] VALUE(1) (2)  
PLLSTS[DIVSEL] = 0 or 1(3)  
OSCCLK/4 (Default)(1)  
(OSCCLK * 1)/4  
(OSCCLK * 2)/4  
(OSCCLK * 3)/4  
(OSCCLK * 4)/4  
(OSCCLK * 5)/4  
(OSCCLK * 6)/4  
(OSCCLK * 7)/4  
(OSCCLK * 8)/4  
(OSCCLK * 9)/4  
(OSCCLK * 10)/4  
(OSCCLK * 11)/4  
(OSCCLK * 12)/4  
(OSCCLK * 13)/4  
(OSCCLK * 14)/4  
(OSCCLK * 15)/4  
(OSCCLK * 16)/4  
(OSCCLK * 17)/4  
(OSCCLK * 18)/4  
PLLSTS[DIVSEL] = 2  
OSCCLK/2  
PLLSTS[DIVSEL] = 3  
OSCCLK  
00000 (PLL bypass)  
00001  
(OSCCLK * 1)/2  
(OSCCLK * 2)/2  
(OSCCLK * 3)/2  
(OSCCLK * 4)/2  
(OSCCLK * 5)/2  
(OSCCLK * 6)/2  
(OSCCLK * 7)/2  
(OSCCLK * 8)/2  
(OSCCLK * 9)/2  
(OSCCLK * 10)/2  
(OSCCLK * 11)/2  
(OSCCLK * 12)/2  
(OSCCLK * 13)/2  
(OSCCLK * 14)/2  
(OSCCLK * 15)/2  
(OSCCLK * 16)/2  
(OSCCLK * 17)/2  
(OSCCLK * 18)/2  
(OSCCLK * 1)/1  
(OSCCLK * 2)/1  
(OSCCLK * 3)/1  
(OSCCLK * 4)/1  
(OSCCLK * 5)/1  
(OSCCLK * 6)/1  
(OSCCLK * 7)/1  
(OSCCLK * 8)/1  
(OSCCLK * 9)/1  
(OSCCLK * 10)/1  
(OSCCLK * 11)/1  
(OSCCLK * 12)/1  
(OSCCLK * 13)/1  
(OSCCLK * 14)/1  
(OSCCLK * 15)/1  
(OSCCLK * 16)/1  
(OSCCLK * 17)/1  
(OSCCLK * 18)/1  
00010  
00011  
00100  
00101  
00110  
00111  
01000  
01001  
01010  
01011  
01100  
01101  
01110  
01111  
10000  
10001  
10010  
(1) The PLL control register (PLLCR) and PLL Status Register (PLLSTS) are reset to their default state by the XRS signal or a watchdog  
reset only. A reset issued by the debugger or the missing clock detect logic has no effect.  
(2) This register is EALLOW protected. See the "Systems Control and Interrupts" chapter of the TMS320x2806x Piccolo Technical  
Reference Manual (literature number SPRUH18) for more information.  
(3) By default, PLLSTS[DIVSEL] is configured for /4. (The boot ROM changes this to /1.) PLLSTS[DIVSEL] must be 0 before writing to the  
PLLCR and should be changed only after PLLSTS[PLLLOCKS] = 1.  
Table 2-16. CLKIN Divide Options  
PLLSTS [DIVSEL]  
CLKIN DIVIDE  
0
1
2
3
/4  
/4  
/2  
/1  
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The PLL-based clock module provides four modes of operation:  
INTOSC1 (Internal Zero-pin Oscillator 1): This is the on-chip internal oscillator 1. This can provide  
the clock for the Watchdog block, core and CPU-Timer 2  
INTOSC2 (Internal Zero-pin Oscillator 2): This is the on-chip internal oscillator 2. This can provide  
the clock for the Watchdog block, core and CPU-Timer 2. Both INTOSC1 and INTOSC2 can be  
independently chosen for the Watchdog block, core and CPU-Timer 2.  
Crystal/Resonator Operation: The on-chip (crystal) oscillator enables the use of an external  
crystal/resonator attached to the device to provide the time base. The crystal/resonator is connected to  
the X1/X2 pins. Some devices may not have the X1/X2 pins. See Table 2-5 for details.  
External Clock Source Operation: If the on-chip (crystal) oscillator is not used, this mode allows it to  
be bypassed. The device clocks are generated from an external clock source input on the XCLKIN pin.  
Note that the XCLKIN is multiplexed with GPIO19 or GPIO38 pin. The XCLKIN input can be selected  
as GPIO19 or GPIO38 via the XCLKINSEL bit in XCLK register. The CLKCTL[XCLKINOFF] bit  
disables this clock input (forced low). If the clock source is not used or the respective pins are used as  
GPIOs, the user should disable at boot time.  
Before changing clock sources, ensure that the target clock is present. If a clock is not present, then that  
clock source must be disabled (using the CLKCTL register) before switching clocks.  
Table 2-17. Possible PLL Configuration Modes  
CLKIN AND  
SYSCLKOUT  
PLL MODE  
REMARKS  
PLLSTS[DIVSEL]  
Invoked by the user setting the PLLOFF bit in the PLLSTS register. The PLL block  
is disabled in this mode. This can be useful to reduce system noise and for low  
power operation. The PLLCR register must first be set to 0x0000 (PLL Bypass)  
before entering this mode. The CPU clock (CLKIN) is derived directly from the  
input clock on either X1/X2, X1 or XCLKIN.  
0, 1  
2
3
OSCCLK/4  
OSCCLK/2  
OSCCLK/1  
PLL Off  
PLL Bypass is the default PLL configuration upon power-up or after an external  
reset (XRS). This mode is selected when the PLLCR register is set to 0x0000 or  
while the PLL locks to a new frequency after the PLLCR register has been  
modified. In this mode, the PLL itself is bypassed but the PLL is not turned off.  
0, 1  
2
3
OSCCLK/4  
OSCCLK/2  
OSCCLK/1  
PLL Bypass  
PLL Enable  
0, 1  
2
3
OSCCLK * n/4  
OSCCLK * n/2  
OSCCLK * n/1  
Achieved by writing a non-zero value n into the PLLCR register. Upon writing to the  
PLLCR the device will switch to PLL Bypass mode until the PLL locks.  
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2.9.4 USB and HRCAP PLL Module (PLL2)  
In addition to the main system PLL, these devices also contain a second PLL (PLL2) which can be used to  
clock the USB and HRCAP peripherals. The PLL supports multipliers of 1 to 15 and has a fixed divide-by-  
two on its output.  
PLL2 may be clocked from the following three sources by modifying the PLL2CLKSRCSEL bits  
appropriately in the PLL2CTL register:  
INTOSC1 (Internal Zero-pin Oscillator 1): This is the on-chip internal oscillator 1 and provides a 10-  
MHz clock. If used as a clock source for HRCAP, the oscillator compensation routine should be called  
frequently. Because of accuracy requirements, INTOSC1 cannot be used as a clock source for the  
USB.  
Crystal/Resonator Operation: The (crystal) oscillator enables the use of an external crystal or resonator  
attached to the device to provide the time base. The crystal or resonator is connected to the X1/X2  
pins.  
External Clock Source Operation: This mode allows the reference clock to be derived from an external  
single-ended clock source connected to either GPIO19 or GPIO38. The XCLKINSEL bit in the XCLK  
register should be set appropriately to enable the selected GPIO to drive XCLKIN.  
NOTE  
For proper operation of the USB module, PLL2 should be configured to generate a 120-MHz  
clock. This will be divided by two to yield the desired 60 MHz for the USB peripheral.  
HRCAP supports a maximum clock input frequency of 120 MHz.  
52  
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2.9.5 Loss of Input Clock (NMI Watchdog Function)  
The 2806x devices may be clocked from either one of the internal zero-pin oscillators  
(INTOSC1/INTOSC2), the on-chip crystal oscillator, or from an external clock input. Regardless of the  
clock source, in PLL-enabled and PLL-bypass mode, if the input clock to the PLL vanishes, the PLL will  
issue a limp-mode clock at its output. This limp-mode clock continues to clock the CPU and peripherals at  
a typical frequency of 1–5 MHz.  
When the limp mode is activated, a CLOCKFAIL signal is generated that is latched as an NMI interrupt.  
Depending on how the NMIRESETSEL bit has been configured, a reset to the device can be fired  
immediately or the NMI watchdog counter can issue a reset when it overflows. In addition to this, the  
Missing Clock Status (MCLKSTS) bit is set. The NMI interrupt could be used by the application to detect  
the input clock failure and initiate necessary corrective action such as switching over to an alternative  
clock source (if available) or initiate a shut-down procedure for the system.  
If the software does not respond to the clock-fail condition, the NMI watchdog triggers a reset after a  
preprogrammed time interval. Figure 2-15 shows the interrupt mechanisms involved.  
NMIFLG[NMINT]  
NMIFLGCLR[NMINT]  
Clear  
Latch  
Set  
Clear  
XRS  
Generate  
Interrupt  
Pulse  
When  
Input = 1  
NMIFLG[CLOCKFAIL]  
Clear  
Latch  
1
0
0
NMIFLGCLR[CLOCKFAIL]  
CLOCKFAIL  
NMINT  
SYNC?  
Set  
Clear  
SYSCLKOUT  
NMICFG[CLOCKFAIL]  
NMIFLGFRC[CLOCKFAIL]  
XRS  
SYSCLKOUT  
SYSRS  
NMIWDPRD[15:0]  
NMIWDCNT[15:0]  
See System  
Control Section  
NMI Watchdog  
NMIRS  
Figure 2-15. NMI-Watchdog  
2.9.6 CPU-Watchdog Module  
The CPU-watchdog module on the 2806x device is similar to the one used on the 281x/280x/283xx  
devices. This module generates an output pulse, 512 oscillator clocks wide (OSCCLK), whenever the 8-bit  
watchdog up counter has reached its maximum value. To prevent this, the user must disable the counter  
or the software must periodically write a 0x55 + 0xAA sequence into the watchdog key register that resets  
the watchdog counter. Figure 2-16 shows the various functional blocks within the watchdog module.  
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Normally, when the input clocks are present, the CPU-watchdog counter decrements to initiate a CPU-  
watchdog reset or WDINT interrupt. However, when the external input clock fails, the CPU-watchdog  
counter stops decrementing (that is, the watchdog counter does not change with the limp-mode clock).  
NOTE  
The CPU-watchdog is different from the NMI watchdog. The CPU-watchdog is the legacy  
watchdog that is present in all 28x devices.  
NOTE  
Applications in which the correct CPU operating frequency is absolutely critical should  
implement a mechanism by which the MCU will be held in reset, should the input clocks ever  
fail. For example, an R-C circuit may be used to trigger the XRS pin of the MCU, should the  
capacitor ever get fully charged. An I/O pin may be used to discharge the capacitor on a  
periodic basis to prevent it from getting fully charged. Such a circuit would also help in  
detecting failure of the flash memory.  
WDCR (WDPS[2:0])  
WDCR (WDDIS)  
WDCNTR(7:0)  
WDCLK  
WDCLK  
8-Bit  
Watchdog  
Counter  
CLR  
Watchdog  
Prescaler  
/512  
Clear Counter  
Internal  
Pullup  
WDKEY(7:0)  
WDRST  
WDINT  
Generate  
Watchdog  
55 + AA  
Key Detector  
Output Pulse  
(512 OSCCLKs)  
Good Key  
XRS  
Bad  
WDCHK  
Key  
Core-reset  
SCSR (WDENINT)  
WDCR (WDCHK[2:0])  
1
0
1
(A)  
WDRST  
A. The WDRST signal is driven low for 512 OSCCLK cycles.  
Figure 2-16. CPU-Watchdog Module  
The WDINT signal enables the watchdog to be used as a wakeup from IDLE/STANDBY mode.  
In STANDBY mode, all peripherals are turned off on the device. The only peripheral that remains  
functional is the CPU-watchdog. This module will run off OSCCLK. The WDINT signal is fed to the LPM  
block so that it can wake the device from STANDBY (if enabled). See Section 2.10, Low-power Modes  
Block, for more details.  
In IDLE mode, the WDINT signal can generate an interrupt to the CPU, via the PIE, to take the CPU out of  
IDLE mode.  
In HALT mode, the CPU-watchdog can be used to wake up the device through a device reset.  
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2.10 Low-power Modes Block  
Table 2-18 summarizes the various modes.  
Table 2-18. Low-power Modes  
MODE  
LPMCR0(1:0)  
OSCCLK  
CLKIN  
SYSCLKOUT  
EXIT(1)  
XRS, CPU-watchdog interrupt, any  
enabled interrupt  
IDLE  
00  
On  
On  
On  
On  
XRS, CPU-watchdog interrupt, GPIO  
Port A signal, debugger(2)  
STANDBY  
HALT(3)  
01  
Off  
Off  
(CPU-watchdog still running)  
Off  
(on-chip crystal oscillator and  
PLL turned off, zero-pin oscillator  
and CPU-watchdog state  
dependent on user code.)  
XRS, GPIO Port A signal, debugger(2)  
CPU-watchdog  
,
1X  
Off  
Off  
(1) The Exit column lists which signals or under what conditions the low power mode is exited. A low signal, on any of the signals, exits the  
low power condition. This signal must be kept low long enough for an interrupt to be recognized by the device. Otherwise, the low-power  
mode will not be exited and the device will go back into the indicated low power mode.  
(2) The JTAG port can still function even if the CPU clock (CLKIN) is turned off.  
(3) The WDCLK must be active for the device to go into HALT mode.  
The various low-power modes operate as follows:  
IDLE Mode:  
This mode is exited by any enabled interrupt that is recognized by the  
processor. The LPM block performs no tasks during this mode as long as  
the LPMCR0(LPM) bits are set to 0,0.  
STANDBY Mode:  
Any GPIO port A signal (GPIO[31:0]) can wake the device from STANDBY  
mode. The user must select which signals will wake the device in the  
GPIOLPMSEL register. The selected signals are also qualified by the  
OSCCLK before waking the device. The number of OSCCLKs is specified in  
the LPMCR0 register.  
HALT Mode:  
CPU-watchdog, XRS, and any GPIO port A signal (GPIO[31:0]) can wake  
the device from HALT mode. The user selects the signal in the  
GPIOLPMSEL register.  
NOTE  
The low-power modes do not affect the state of the output pins (PWM pins included). They  
will be in whatever state the code left them in when the IDLE instruction was executed. See  
the "Systems Control and Interrupts" chapter of the TMS320x2806x Piccolo Technical  
Reference Manual (literature number SPRUH18) for more details.  
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3 Device and Documentation Support  
3.1 Getting Started  
This section gives a brief overview of the steps to take when first developing for a C28x device. For more  
detail on each of these steps, see the following:  
Getting Started With TMS320C28x Digital Signal Controllers (literature number SPRAAM0).  
C2000 Getting Started Website (http://www.ti.com/c2000getstarted)  
TMS320F28x MCU Development and Experimenter's Kits (http://www.ti.com/f28xkits)  
3.2 Development Support  
Texas Instruments (TI) offers an extensive line of development tools for the C28x™ generation of MCUs,  
including tools to evaluate the performance of the processors, generate code, develop algorithm  
implementations, and fully integrate and debug software and hardware modules.  
The following products support development of 2806x-based applications:  
Software Development Tools  
Code Composer Studio™ Integrated Development Environment (IDE)  
C/C++ Compiler  
Code generation tools  
Assembler/Linker  
Cycle Accurate Simulator  
Application algorithms  
Sample applications code  
Hardware Development Tools  
Development and evaluation boards  
JTAG-based emulators - XDS510™ class, XDS560™ emulator, XDS100  
Flash programming tools  
Power supply  
Documentation and cables  
3.3 Device and Development Support Tool Nomenclature  
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all  
TMS320™ MCU devices and support tools. Each TMS320™ MCU commercial family member has one of  
three prefixes: TMX, TMP, or TMS (for example, TMS320F28069). Texas Instruments recommends two of  
three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent  
evolutionary stages of product development from engineering prototypes (with TMX for devices and TMDX  
for tools) through fully qualified production devices/tools (with TMS for devices and TMDS for tools).  
Device development evolutionary flow:  
TMX  
TMP  
TMS  
Experimental device that is not necessarily representative of the final device's electrical  
specifications  
Final silicon die that conforms to the device's electrical specifications but has not  
completed quality and reliability verification  
Fully qualified production device  
56  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Support tool development evolutionary flow:  
TMDX Development-support product that has not yet completed Texas Instruments internal  
qualification testing  
TMDS Fully qualified development-support product  
TMX and TMP devices and TMDX development-support tools are shipped against the following  
disclaimer:  
"Developmental product is intended for internal evaluation purposes."  
TMS devices and TMDS development-support tools have been characterized fully, and the quality and  
reliability of the device have been demonstrated fully. TI's standard warranty applies.  
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard  
production devices. Texas Instruments recommends that these devices not be used in any production  
system because their expected end-use failure rate still is undefined. Only qualified production devices are  
to be used.  
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the  
package type (for example, PZP) and temperature range (for example, S). Figure 3-1 provides a legend  
for reading the complete device name for any family member.  
TMS 320  
F
28069 PZP  
S
TEMPERATURE RANGE(A)  
PREFIX  
experimental device  
prototype device  
qualified device  
TMX =  
TMP =  
TMS =  
−40°C to 105°C  
−40°C to 125°C  
−40°C to 125°C  
(Q refers to Q100 qualification for automotive applications.)  
T
S
Q
=
=
=
DEVICE FAMILY  
PACKAGE TYPE  
320 = TMS320 MCU Family  
80-Pin PN Low-Profile Quad Flatpack (LQFP)  
80-Pin PFP PowerPADTM Thermally Enhanced Thin Quad Flatpack (HTQFP)  
100-Pin PZ Low-Profile Quad Flatpack (LQFP)  
100-Pin PZP PowerPADTM Thermally Enhanced Thin Quad Flatpack (HTQFP)  
TECHNOLOGY  
F = Flash  
DEVICE(B)  
28069  
28068  
28067  
28066  
28065  
28064  
28063  
28062  
28069U  
28068U  
28067U  
28066U  
28065U  
28064U  
28063U  
28062U  
A. The "Q" temperature option is not available on the 2806xU devices.  
B. USB is available only on 2806xU devices.  
Figure 3-1. Device Nomenclature  
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TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
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3.4 Documentation Support  
Extensive documentation supports all of the TMS320™ MCU family generations of devices from product  
announcement through applications development. The types of documentation available include: data  
sheets and data manuals, with design specifications; and hardware and software applications.  
See the TMS320x28xx, 28xxx DSP Peripheral Reference Guide (literature number SPRU566) for more  
information on types of peripherals. See the TMS320x2806x Piccolo Technical Reference Manual  
(literature number SPRUH18) for more information about each peripheral.  
The following documents can be downloaded from the TI website (www.ti.com):  
Data Manual and Errata  
SPRS698  
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066, TMS320F28065,  
TMS320F28064, TMS320F28063, TMS320F28062 Piccolo Microcontrollers Data Manual  
contains the pinout, signal descriptions, as well as electrical and timing specifications for the  
2806x devices.  
SPRZ342  
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066, TMS320F28065,  
TMS320F28064, TMS320F28063, TMS320F28062 Piccolo MCU Silicon Errata describes  
known advisories on silicon and provides workarounds.  
CPU User's Guides  
SPRU430 TMS320C28x CPU and Instruction Set Reference Guide describes the central processing  
unit (CPU) and the assembly language instructions of the TMS320C28x fixed-point digital  
signal processors (DSPs). This reference guide also describes emulation features available  
on these DSPs.  
Peripheral Guides and Technical Reference Manuals  
SPRU566  
TMS320x28xx, 28xxx DSP Peripheral Reference Guide describes the peripheral reference  
guides of the 28x digital signal processors (DSPs).  
SPRUH18 TMS320x2806x Piccolo Technical Reference Manual details the integration, the  
environment, the functional description, and the programming models for each peripheral  
and subsystem in the device.  
Tools Guides  
SPRU513  
TMS320C28x Assembly Language Tools v5.0.0 User's Guide describes the assembly  
language tools (assembler and other tools used to develop assembly language code),  
assembler directives, macros, common object file format, and symbolic debugging directives  
for the TMS320C28x device.  
SPRU514  
SPRU608  
TMS320C28x Optimizing C/C++ Compiler v5.0.0 User's Guide describes the  
TMS320C28x™ C/C++ compiler. This compiler accepts ANSI standard C/C++ source code  
and produces TMS320 DSP assembly language source code for the TMS320C28x device.  
TMS320C28x Instruction Set Simulator Technical Overview describes the simulator,  
available within the Code Composer Studio for TMS320C2000 IDE, that simulates the  
instruction set of the C28x™ core.  
58  
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3.5 Community Resources  
The following links connect to TI community resources. Linked contents are provided "AS IS" by the  
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;  
see TI's Terms of Use.  
TI E2E Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration  
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and  
help solve problems with fellow engineers.  
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help  
developers get started with Embedded Processors from Texas Instruments and to foster  
innovation and growth of general knowledge about the hardware and software surrounding  
these devices.  
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4 Device Operating Conditions  
4.1 Absolute Maximum Ratings(1) (2)  
Supply voltage range, VDDIO (I/O and Flash)  
Supply voltage range, VDD  
with respect to VSS  
with respect to VSS  
with respect to VSSA  
–0.3 V to 4.6 V  
–0.3 V to 2.5 V  
–0.3 V to 4.6 V  
–0.3 V to 4.6 V  
–0.3 V to 4.6 V  
±20 mA  
Analog voltage range, VDDA  
Input voltage range, VIN (3.3 V)  
Output voltage range, VO  
(3)  
Input clamp current, IIK (VIN < 0 or VIN > VDDIO  
)
Output clamp current, IOK (VO < 0 or VO > VDDIO  
)
±20 mA  
(4)  
Junction temperature range, TJ  
–40°C to 150°C  
–65°C to 150°C  
(4)  
Storage temperature range, Tstg  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under Section 4.2 is not implied.  
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltage values are with respect to VSS, unless otherwise noted.  
(3) Continuous clamp current per pin is ± 2 mA.  
(4) Long-term high-temperature storage or extended use at maximum temperature conditions may result in a reduction of overall device life.  
For additional information, see IC Package Thermal Metrics Application Report (literature number SPRA953) and Reliability Data for  
TMS320LF24xx and TMS320F28xx Devices Application Report (literature number SPRA963).  
4.2 Recommended Operating Conditions  
MIN  
2.97  
1.71  
NOM  
3.3  
MAX  
3.63  
UNIT  
(1)  
Device supply voltage, I/O, VDDIO  
V
Device supply voltage CPU, VDD (When internal  
VREG is disabled and 1.8 V is supplied externally)  
1.8  
1.995  
V
Supply ground, VSS  
0
3.3  
0
V
V
(1)  
Analog supply voltage, VDDA  
2.97  
3.63  
Analog ground, VSSA  
V
Device clock frequency (system clock)  
High-level input voltage, VIH (3.3 V)  
Low-level input voltage, VIL (3.3 V)  
High-level output source current, VOH = VOH(MIN) , IOH All GPIO/AIO pins  
Group 2(2)  
2
2
90  
MHz  
V
VDDIO + 0.3  
VSS – 0.3  
0.8  
–4  
V
mA  
mA  
mA  
mA  
–8  
Low-level output sink current, VOL = VOL(MAX), IOL  
All GPIO/AIO pins  
Group 2(2)  
4
8
Junction temperature, TJ  
T version  
–40  
–40  
–40  
–40  
105  
125  
125  
150  
°C  
°C  
S version  
Q version(3)  
(Q100 qualification)  
Ambient temperature, TA  
Junction temperature, TJ  
(1) VDDIO and VDDA should be maintained within approximately 0.3 V of each other.  
(2) Group 2 pins are as follows: GPIO16, GPIO17, GPIO18, GPIO19, GPIO28, GPIO29, GPIO36, GPIO37.  
(3) The "Q" temperature option is not available on the 2806xU devices.  
60  
Device Operating Conditions  
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4.3 Electrical Characteristics(1)  
over recommended operating conditions (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
2.4  
TYP  
MAX UNIT  
IOH = IOH MAX  
IOH = 50 μA  
VOH  
VOL  
High-level output voltage  
Low-level output voltage  
V
VDDIO – 0.2  
IOL = IOL MAX  
0.4  
–205  
–375  
V
All GPIO  
XRS pin  
–80  
–140  
–300  
Pin with pullup  
VDDIO = 3.3 V, VIN = 0 V  
enabled  
Input current  
(low level)  
–230  
IIL  
μA  
Pin with pulldown  
enabled  
VDDIO = 3.3 V, VIN = 0 V  
VDDIO = 3.3 V, VIN = VDDIO  
VDDIO = 3.3 V, VIN = VDDIO  
VO = VDDIO or 0 V  
±2  
±2  
80  
Pin with pullup  
enabled  
Input current  
(high level)  
IIH  
μA  
Pin with pulldown  
enabled  
28  
50  
Output current, pullup or  
pulldown disabled  
IOZ  
CI  
±2 μA  
Input capacitance  
2
2.78  
35  
pF  
VDDIO BOR trip point  
VDDIO BOR hysteresis  
Falling VDDIO  
2.50  
400  
2.96  
V
mV  
Supervisor reset release delay  
time  
Time after BOR/POR/OVR event is removed to XRS  
release  
800 μs  
VREG VDD output  
Internal VREG on  
1.9  
V
(1) When the on-chip VREG is used, its output is monitored by the POR/BOR circuit, which will reset the device should the core voltage  
(VDD) go out of range.  
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Device Operating Conditions  
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5 Peripheral and Electrical Specifications  
5.1 Parameter Information  
5.1.1 Timing Parameter Symbology  
Timing parameter symbols used are created in accordance with JEDEC Standard 100. To shorten the  
symbols, some of the pin names and other related terminology have been abbreviated as follows:  
Lowercase subscripts and their  
meanings:  
Letters and symbols and their  
meanings:  
a
c
d
access time  
H
L
High  
Low  
cycle time (period)  
delay time  
V
Valid  
Unknown, changing, or don't care  
level  
f
fall time  
X
Z
h
r
hold time  
High impedance  
rise time  
su  
t
setup time  
transition time  
valid time  
v
w
pulse duration (width)  
5.1.2 General Notes on Timing Parameters  
All output signals from the 28x devices (including XCLKOUT) are derived from an internal clock such that  
all output transitions for a given half-cycle occur with a minimum of skewing relative to each other.  
The signal combinations shown in the following timing diagrams may not necessarily represent actual  
cycles. For actual cycle examples, see the appropriate cycle description section of this document.  
5.2 Test Load Circuit  
This test load circuit is used to measure all switching characteristics provided in this document.  
Tester Pin Electronics  
Data Sheet Timing Reference Point  
W
3.5 nH  
Output  
Under  
Test  
42  
Transmission Line  
(A)  
Z0 = 50 W  
Device Pin(B)  
4.0 pF  
1.85 pF  
A. Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the  
device pin.  
B. The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its  
transmission line effects must be taken into account. A transmission line with a delay of 2 ns or longer can be used to  
produce the desired transmission line effect. The transmission line is intended as a load only. It is not necessary to  
add or subtract the transmission line delay (2 ns or longer) from the data sheet timing.  
Figure 5-1. 3.3-V Test Load Circuit  
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5.3 Device Clock Table  
This section provides the timing requirements and switching characteristics for the various clock options  
available on the 2806x MCUs. Table 5-1 lists the cycle times of various clocks.  
Table 5-1. 2806x Clock Table and Nomenclature (90-MHz Devices)  
MIN  
11.11  
2
NOM  
MAX UNIT  
tc(SCO), Cycle time  
Frequency  
500  
90  
ns  
MHz  
ns  
SYSCLKOUT  
LSPCLK(1)  
ADC clock  
tc(LCO), Cycle time  
Frequency  
11.11  
44.4(2)  
22.5(2)  
90  
45  
MHz  
ns  
tc(ADCCLK), Cycle time  
Frequency  
22.22  
MHz  
(1) Lower LSPCLK will reduce device power consumption.  
(2) This is the default reset value if SYSCLKOUT = 90 MHz.  
Table 5-2. Device Clocking Requirements/Characteristics  
MIN  
NOM  
MAX UNIT  
tc(OSC), Cycle time  
Frequency  
50  
5
200  
20  
ns  
MHz  
ns  
On-chip oscillator (X1/X2 pins)  
(Crystal/Resonator)  
tc(CI), Cycle time (C8)  
Frequency  
33.3  
5
200  
30  
External oscillator/clock source  
(XCLKIN pin) — PLL Enabled  
MHz  
ns  
tc(CI), Cycle time (C8)  
Frequency  
11.11  
4
250  
90  
External oscillator/clock source  
(XCLKIN pin) — PLL Disabled  
MHz  
Limp mode SYSCLKOUT  
(with /2 enabled)  
Frequency range  
1 to 5  
MHz  
tc(XCO), Cycle time (C1)  
50  
2000  
20  
ns  
MHz  
ms  
XCLKOUT  
Frequency  
tp  
0.5  
PLL lock time(1)  
1
(1) The PLLLOCKPRD register must be updated based on the number of OSCCLK cycles. If the zero-pin internal oscillators (10 MHz) are  
used as the clock source, then the PLLLOCKPRD register must be written with a value of 10,000 (minimum).  
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Table 5-3. Internal Zero-Pin Oscillator (INTOSC1/INTOSC2) Characteristics  
PARAMETER  
Internal zero-pin oscillator 1 (INTOSC1) at 30°C(1)(2)  
Internal zero-pin oscillator 2 (INTOSC2) at 30°C(1)(2)  
Step size (coarse trim)  
MIN  
TYP  
10.000  
10.000  
55  
MAX  
UNIT  
MHz  
Frequency  
Frequency  
MHz  
kHz  
Step size (fine trim)  
14  
kHz  
Temperature drift(3)  
Voltage (VDD) drift(3)  
3.03  
4.85  
kHz/°C  
Hz/mV  
175  
(1) In order to achieve better oscillator accuracy (10 MHz ± 1% or better) than shown, refer to the Oscillator Compensation Guide  
Application Report (literature number SPRAB84).  
(2) Frequency range ensured only when VREG is enabled, VREGENZ = VSS  
.
(3) Output frequency of the internal oscillators follows the direction of both the temperature gradient and voltage (VDD) gradient. For  
example:  
Increase in temperature will cause the output frequency to increase per the temperature coefficient.  
Decrease in voltage (VDD) will cause the output frequency to decrease per the voltage coefficient.  
Zero-Pin Oscillator Frequency Movement With Temperature  
10.6  
10.5  
10.4  
10.3  
10.2  
10.1  
10  
9.9  
9.8  
9.7  
9.6  
–40  
–30  
–20  
–10  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
110  
120  
Typical  
Max  
Temperature (°C)  
Figure 5-2. Zero-Pin Oscillator Frequency Movement With Temperature  
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5.4 Clock Requirements and Characteristics  
Table 5-4. XCLKIN Timing Requirements - PLL Enabled  
NO.  
MIN  
MAX  
6
UNIT  
ns  
C9  
tf(CI)  
Fall time, XCLKIN  
C10 tr(CI)  
Rise time, XCLKIN  
6
ns  
C11 tw(CIL)  
C12 tw(CIH)  
Pulse duration, XCLKIN low as a percentage of tc(OSCCLK)  
Pulse duration, XCLKIN high as a percentage of tc(OSCCLK)  
45  
45  
55  
55  
%
%
Table 5-5. XCLKIN Timing Requirements - PLL Disabled  
NO.  
MIN  
MAX UNIT  
C9  
tf(CI)  
Fall time, XCLKIN  
Rise time, XCLKIN  
Up to 20 MHz  
6
2
ns  
20 MHz to 90 MHz  
Up to 20 MHz  
C10 tr(CI)  
6
ns  
20 MHz to 90 MHz  
2
C11 tw(CIL)  
C12 tw(CIH)  
Pulse duration, XCLKIN low as a percentage of tc(OSCCLK)  
Pulse duration, XCLKIN high as a percentage of tc(OSCCLK)  
45  
45  
55  
55  
%
%
The possible configuration modes are shown in Table 2-17.  
Table 5-6. XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)(1)(2)  
over recommended operating conditions (unless otherwise noted)  
NO.  
C3  
C4  
C5  
C6  
PARAMETER  
MIN  
MAX  
UNIT  
ns  
tf(XCO)  
Fall time, XCLKOUT  
Rise time, XCLKOUT  
tr(XCO)  
ns  
tw(XCOL)  
tw(XCOH)  
Pulse duration, XCLKOUT low  
Pulse duration, XCLKOUT high  
H – 2  
H – 2  
H + 2  
H + 2  
ns  
ns  
(1) A load of 40 pF is assumed for these parameters.  
(2) H = 0.5tc(XCO)  
C10  
C9  
C8  
(A)  
XCLKIN  
C6  
C3  
C1  
C4  
C5  
(B)  
XCLKOUT  
A. The relationship of XCLKIN to XCLKOUT depends on the divide factor chosen. The waveform relationship shown is  
intended to illustrate the timing parameters only and may differ based on actual configuration.  
B. XCLKOUT configured to reflect SYSCLKOUT.  
Figure 5-3. Clock Timing  
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5.5 Power Sequencing  
There is no power sequencing requirement needed to ensure the device is in the proper state after reset  
or to prevent the I/Os from glitching during power up or power down (GPIO19, GPIO26–27, GPIO34–38  
do not have glitch-free I/Os). No voltage larger than a diode drop (0.7 V) above VDDIO should be applied to  
any digital pin (for analog pins, it is 0.7 V above VDDA) prior to powering up the device. Voltages applied to  
pins on an unpowered device can bias internal p-n junctions in unintended ways and produce  
unpredictable results.  
VDDIO, VDDA  
(3.3 V)  
VDD (1.8 V)  
INTOSC1  
tINTOSCST  
X1/X2  
tOSCST  
(B)  
(A)  
XCLKOUT  
User-code dependent  
t
w(RSL1)  
XRS(D)  
Address/data valid, internal boot-ROM code execution phase  
Address/Data/  
Control  
(Internal)  
User-code execution phase  
User-code dependent  
t
d(EX)  
(C)  
h(boot-mode)  
t
Boot-Mode  
Pins  
GPIO pins as input  
Peripheral/GPIO function  
Boot-ROM execution starts  
(E)  
Based on boot code  
GPIO pins as input (state depends on internal PU/PD)  
I/O Pins  
User-code dependent  
A. Upon power up, SYSCLKOUT is OSCCLK/4. Since the XCLKOUTDIV bits in the XCLK register come up with a reset  
state of 0, SYSCLKOUT is further divided by 4 before it appears at XCLKOUT. XCLKOUT = OSCCLK/16 during this  
phase.  
B. Boot ROM configures the DIVSEL bits for /1 operation. XCLKOUT = OSCCLK/4 during this phase. Note that  
XCLKOUT will not be visible at the pin until explicitly configured by user code.  
C. After reset, the boot ROM code samples Boot Mode pins. Based on the status of the Boot Mode pin, the boot code  
branches to destination memory or boot code function. If boot ROM code executes after power-on conditions (in  
debugger environment), the boot code execution time is based on the current SYSCLKOUT speed. The SYSCLKOUT  
will be based on user environment and could be with or without PLL enabled.  
D. Using the XRS pin is optional due to the on-chip power-on reset (POR) circuitry.  
E. The internal pullup or pulldown will take effect when BOR is driven high.  
Figure 5-4. Power-on Reset  
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Table 5-7. Reset (XRS) Timing Requirements  
MIN  
1000tc(SCO)  
32tc(OSCCLK)  
MAX  
UNIT  
cycles  
cycles  
th(boot-mode)  
tw(RSL2)  
Hold time for boot-mode pins  
Pulse duration, XRS low on warm reset  
Table 5-8. Reset (XRS) Switching Characteristics  
over recommended operating conditions (unless otherwise noted)  
PARAMETER  
MIN  
TYP  
MAX  
UNIT  
μs  
tw(RSL1)  
tw(WDRS)  
td(EX)  
Pulse duration, XRS driven by device  
600  
Pulse duration, reset pulse generated by watchdog  
Delay time, address/data valid after XRS high  
Start up time, internal zero-pin oscillator  
On-chip crystal-oscillator start-up time  
512tc(OSCCLK)  
cycles  
cycles  
μs  
32tc(OSCCLK)  
tINTOSCST  
3
(1)  
tOSCST  
1
10  
ms  
(1) Dependent on crystal/resonator and board design.  
INTOSC1  
X1/X2  
XCLKOUT  
User-Code Dependent  
t
w(RSL2)  
XRS  
User-Code Execution Phase  
t
d(EX)  
Address/Data/  
User-Code Execution  
Control  
(Internal)  
(A)  
t
Boot-ROM Execution Starts  
GPIO Pins as Input  
h(boot-mode)  
Boot-Mode  
Pins  
Peripheral/GPIO Function  
User-Code Dependent  
Peripheral/GPIO Function  
User-Code Execution Starts  
I/O Pins  
GPIO Pins as Input (State Depends on Internal PU/PD)  
User-Code Dependent  
A. After reset, the Boot ROM code samples BOOT Mode pins. Based on the status of the Boot Mode pin, the boot code  
branches to destination memory or boot code function. If Boot ROM code executes after power-on conditions (in  
debugger environment), the Boot code execution time is based on the current SYSCLKOUT speed. The  
SYSCLKOUT will be based on user environment and could be with or without PLL enabled.  
Figure 5-5. Warm Reset  
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Figure 5-6 shows an example for the effect of writing into PLLCR register. In the first phase, PLLCR =  
0x0004 and SYSCLKOUT = OSCCLK x 2. The PLLCR is then written with 0x0008. Right after the PLLCR  
register is written, the PLL lock-up phase begins. During this phase, SYSCLKOUT = OSCCLK/2. After the  
PLL lock-up is complete, SYSCLKOUT reflects the new operating frequency, OSCCLK x 4.  
OSCCLK  
Write to PLLCR  
SYSCLKOUT  
OSCCLK * 2  
OSCCLK/2  
OSCCLK * 4  
(CPU frequency while PLL is stabilizing  
with the desired frequency. This period  
(PLL lock-up time tp) is 1 ms long.)  
(Current CPU  
Frequency)  
(Changed CPU frequency)  
Figure 5-6. Example of Effect of Writing Into PLLCR Register  
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5.6 Current Consumption  
Table 5-9. TMS320F2806x Current Consumption at 90-MHz SYSCLKOUT  
VREG ENABLED  
VREG DISABLED  
(1)  
(2)  
(1)  
(2)  
MODE  
TEST CONDITIONS  
IDDIO  
IDDA  
IDD3VFL  
TYP(3)  
MAX  
IDD  
IDDIO  
IDDA  
TYP(3)  
MAX  
IDD3VFL  
TYP(3)  
MAX  
TYP(3)  
MAX  
TYP(3)  
MAX  
TYP(3)  
MAX  
TYP(3)  
MAX  
The following peripheral  
clocks are enabled:  
ePWM1, ePWM2,  
ePWM3, ePWM4,  
ePWM5, ePWM6,  
ePWM7, ePWM8  
eCAP1, eCAP2,  
eCAP3  
eQEP1, eQEP2  
eCAN  
CLA  
HRPWM  
SCI-A, SCI-B  
SPI-A, SPI-B  
ADC  
Operational  
(Flash)  
185 mA(6)  
245 mA(6) 16 mA 22 mA 35 mA 40 mA 165 mA(6)  
220 mA(6) 15 mA 20 mA 16 mA 22 mA 35 mA 40 mA  
I2C  
COMP1, COMP2,  
COMP3  
CPU-TIMER0,  
CPU-TIMER1,  
CPU-TIMER2  
McBSP  
USB  
All PWM pins are toggled  
at 90 kHz.  
All I/O pins are left  
(5)  
unconnected.(4)  
Code is running out of  
flash with 3 wait-states.  
XCLKOUT is turned off.  
Flash is powered down.  
XCLKOUT is turned off.  
All peripheral clocks are  
turned off.  
IDLE  
22 mA  
27 mA  
11 mA  
15 µA  
25 µA  
5 µA  
10 µA  
21 mA  
26 mA  
10 mA  
120 µA 400 µA 15 µA  
120 µA 400 µA 15 µA  
25 µA  
5 µA  
10 µA  
Flash is powered down.  
Peripheral clocks are off.  
STANDBY  
HALT  
9 mA  
15 µA  
15 µA  
25 µA  
25 µA  
5 µA  
5 µA  
10 µA  
10 µA  
8 mA  
25 µA  
25 µA  
5 µA  
5 µA  
10 µA  
10 µA  
Flash is powered down.  
Peripheral clocks are off.  
Input clock is disabled.(7)  
75 µA  
25 µA(8)  
40 µA  
15 µA  
(1) IDDIO current is dependent on the electrical loading on the I/O pins.  
(2) In order to realize the IDDA currents shown for IDLE, STANDBY, and HALT, clock to the ADC module must be turned off explicitly by  
writing to the PCLKCR0 register.  
(3) The TYP numbers are applicable over room temperature and nominal voltage.  
(4) The following is done in a loop:  
Data is continuously transmitted out of SPI-A, SPI-B, SCI-A, eCAN-A, McBSP-A, and I2C ports.  
The hardware multiplier is exercised.  
Watchdog is reset.  
ADC is performing continuous conversion.  
COMP1 and COMP2 are continuously switching voltages.  
GPIO17 is toggled.  
(5) CLA is continuously performing polynomial calculations.  
(6) For F2806x devices that do not have CLA, subtract the IDD current number for CLA (see Table 5-10) from the IDD (VREG disabled)/IDDIO  
(VREG enabled) current numbers shown in Table 5-9 for operational mode.  
(7) If a quartz crystal or ceramic resonator is used as the clock source, the HALT mode shuts down the on-chip crystal oscillator.  
(8) To realize the IDD number shown for HALT mode, the following must be done:  
PLL2 must be shut down by clearing bit 2 of the PLLCTL register.  
A value of 0x00FF must be written to address 0x6822.  
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NOTE  
The peripheral - I/O multiplexing implemented in the device prevents all available peripherals  
from being used at the same time. This is because more than one peripheral function may  
share an I/O pin. It is, however, possible to turn on the clocks to all the peripherals at the  
same time, although such a configuration is not useful. If this is done, the current drawn by  
the device will be more than the numbers specified in the current consumption tables.  
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5.6.1 Reducing Current Consumption  
The 2806x devices incorporate a method to reduce the device current consumption. Since each peripheral  
unit has an individual clock-enable bit, significant reduction in current consumption can be achieved by  
turning off the clock to any peripheral module that is not used in a given application. Furthermore, any one  
of the three low-power modes could be taken advantage of to reduce the current consumption even  
further. Table 5-10 indicates the typical reduction in current consumption achieved by turning off the  
clocks.  
Table 5-10. Typical Current Consumption by Various  
Peripherals (at 90 MHz)(1)  
PERIPHERAL  
MODULE(2)  
IDD CURRENT  
REDUCTION (mA)  
ADC  
2(3)  
I2C  
3
ePWM  
2
eCAP  
2
eQEP  
2
SCI  
SPI  
2
2
COMP/DAC  
HRPWM  
1
3
HRCAP  
3
USB  
12  
1
CPU-TIMER  
Internal zero-pin oscillator  
CAN  
0.5  
2.5  
20  
6
CLA  
McBSP  
(1) All peripheral clocks (except CPU Timer clock) are disabled upon  
reset. Writing to or reading from peripheral registers is possible only  
after the peripheral clocks are turned on.  
(2) For peripherals with multiple instances, the current quoted is per  
module. For example, the 2 mA value quoted for ePWM is for one  
ePWM module.  
(3) This number represents the current drawn by the digital portion of  
the ADC module. Turning off the clock to the ADC module results in  
the elimination of the current drawn by the analog portion of the ADC  
(IDDA) as well.  
NOTE  
IDDIO current consumption is reduced by 15 mA (typical) when XCLKOUT is turned off.  
NOTE  
The baseline IDD current (current when the core is executing a dummy loop with no  
peripherals enabled) is 40 mA, typical. To arrive at the IDD current for a given application, the  
current-drawn by the peripherals (enabled by that application) must be added to the baseline  
IDD current.  
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Following are other methods to reduce power consumption further:  
The flash module may be powered down if code is run off SARAM. This results in a current reduction  
of 18 mA (typical) in the VDD rail and 13 mA (typical) in the VDDIO rail.  
Savings in IDDIO may be realized by disabling the pullups on pins that assume an output function.  
5.6.2 Current Consumption Graphs (VREG Enabled)  
Operational Current (Flash) vs Frequency (Internal VREG)  
250  
200  
150  
100  
50  
IDDIO  
IDDA  
IDD3VFL  
Total  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
SYSCLKOUT (MHz)  
Figure 5-7. Typical Operational Current Versus Frequency  
Operational Power vs Frequency (Internal VREG)  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
SYSCLKOUT (MHz)  
Figure 5-8. Typical Operational Power Versus Frequency  
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5.7 Emulator Connection Without Signal Buffering for the MCU  
Figure 5-9 shows the connection between the MCU and JTAG header for a single-processor configuration.  
If the distance between the JTAG header and the MCU is greater than 6 inches, the emulation signals  
must be buffered. If the distance is less than 6 inches, buffering is typically not needed. Figure 5-9 shows  
the simpler, no-buffering situation. For the pullup and pulldown resistor values, see Section 2.4, Signal  
Descriptions.  
6 inches or less  
VDDIO  
VDDIO  
13  
14  
2
5
EMU0  
EMU1  
TRST  
TMS  
PD  
4
6
8
TRST  
TMS  
TDI  
GND  
1
GND  
GND  
GND  
GND  
3
TDI  
7
10  
12  
TDO  
TCK  
TDO  
11  
9
TCK  
TCK_RET  
MCU  
JTAG Header  
A. See Figure 5-48 for JTAG/GPIO multiplexing.  
Figure 5-9. Emulator Connection Without Signal Buffering for the MCU  
NOTE  
The 2806x devices do not have EMU0/EMU1 pins. For designs that have a JTAG Header  
on-board, the EMU0/EMU1 pins on the header must be tied to VDDIO through a 4.7-k  
(typical) resistor.  
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5.8 Interrupts  
Figure 5-10 shows how the various interrupt sources are multiplexed.  
Peripherals  
(SPI, SCI, McBSP, I2C, eCAN, ePWM, eCAP, eQEP,  
HRCAP, ADC, CLA)  
clear  
DMA  
WDINT  
Watchdog  
WAKEINT  
Sync  
LPMINT  
Low-Power Modes  
C28x  
Core  
SYSCLKOUT  
DMA  
M
U
X
XINT1  
XINT1  
Interrupt Control  
XINT1CR[15:0]  
XINT1CTR[15:0]  
GPIOXINT1SEL[4:0]  
XINT2SOC  
DMA  
ADC  
INT1  
to  
INT12  
M
U
X
XINT2  
XINT2  
Interrupt Control  
XINT2CR[15:0]  
XINT2CTR[15:0]  
GPIOXINT2SEL[4:0]  
GPIO0.int  
DMA  
DMA  
M
XINT3  
XINT3  
U
GPIO  
MUX  
Interrupt Control  
XINT3CR[15:0]  
XINT3CTR[15:0]  
X
GPIO31.int  
GPIOXINT3SEL[4:0]  
TINT0  
TINT1  
TINT2  
CPU TIMER 0  
CPU TIMER 1  
CPU TIMER 2  
TOUT1  
Flash Wrapper  
INT13  
INT14  
CPUTMR2CLK  
CLOCKFAIL  
NMIRS  
NMI Interrupt With Watchdog Function  
(See the NMI Watchdog section.)  
System Control  
(See the System Control section.)  
NMI  
Figure 5-10. External and PIE Interrupt Sources  
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Eight PIE block interrupts are grouped into one CPU interrupt. In total, 12 CPU interrupt groups, with  
8 interrupts per group equals 96 possible interrupts. Table 5-11 shows the interrupts used by 2806x  
devices.  
The TRAP #VectorNumber instruction transfers program control to the interrupt service routine  
corresponding to the vector specified. TRAP #0 attempts to transfer program control to the address  
pointed to by the reset vector. The PIE vector table does not, however, include a reset vector. Therefore,  
TRAP #0 should not be used when the PIE is enabled. Doing so will result in undefined behavior.  
When the PIE is enabled, TRAP #1 through TRAP #12 will transfer program control to the interrupt service  
routine corresponding to the first vector within the PIE group. For example: TRAP #1 fetches the vector  
from INT1.1, TRAP #2 fetches the vector from INT2.1, and so forth.  
IFR[12:1]  
IER[12:1]  
INTM  
INT1  
INT2  
1
CPU  
MUX  
0
INT11  
INT12  
Global  
Enable  
(Flag)  
(Enable)  
INTx.1  
INTx.2  
INTx.3  
INTx.4  
INTx.5  
From  
Peripherals  
or  
External  
Interrupts  
INTx  
MUX  
INTx.6  
INTx.7  
INTx.8  
PIEACKx  
(Enable)  
(Flag)  
(Enable/Flag)  
PIEIERx[8:1]  
PIEIFRx[8:1]  
Figure 5-11. Multiplexing of Interrupts Using the PIE Block  
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Table 5-11. PIE MUXed Peripheral Interrupt Vector Table(1)  
INTx.8  
WAKEINT  
(LPM/WD)  
0xD4E  
INTx.7  
TINT0  
INTx.6  
ADCINT9  
(ADC)  
INTx.5  
XINT2  
INTx.4  
XINT1  
INTx.3  
Reserved  
INTx.2  
ADCINT2  
(ADC)  
INTx.1  
ADCINT1  
(ADC)  
INT1.y  
INT2.y  
INT3.y  
INT4.y  
INT5.y  
INT6.y  
INT7.y  
INT8.y  
INT9.y  
INT10.y  
INT11.y  
INT12.y  
(TIMER 0)  
0xD4C  
Ext. int. 2  
0xD48  
Ext. int. 1  
0xD46  
0xD4A  
0xD44  
0xD42  
0xD40  
EPWM8_TZINT  
(ePWM8)  
0xD5E  
EPWM7_TZINT  
(ePWM7)  
0xD5C  
EPWM6_TZINT  
(ePWM6)  
0xD5A  
EPWM5_TZINT  
(ePWM5)  
0xD58  
EPWM4_TZINT  
(ePWM4)  
0xD56  
EPWM3_TZINT  
(ePWM3)  
0xD54  
EPWM2_TZINT  
(ePWM2)  
0xD52  
EPWM1_TZINT  
(ePWM1)  
0xD50  
EPWM8_INT  
(ePWM8)  
0xD6E  
EPWM7_INT  
(ePWM7)  
0xD6C  
EPWM6_INT  
(ePWM6)  
0xD6A  
EPWM5_INT  
(ePWM5)  
0xD68  
EPWM4_INT  
(ePWM4)  
0xD66  
EPWM3_INT  
(ePWM3)  
0xD64  
EPWM2_INT  
(ePWM2)  
0xD62  
EPWM1_INT  
(ePWM1)  
0xD60  
HRCAP2_INT  
(HRCAP2)  
0xD7E  
HRCAP1_INT  
(HRCAP1)  
0xD7C  
Reserved  
Reserved  
Reserved  
ECAP3_INT  
(eCAP3)  
0xD74  
ECAP2_INT  
(eCAP2)  
0xD72  
ECAP1_INT  
(eCAP1)  
0xD70  
0xD7A  
0xD78  
0xD76  
USB0_INT  
(USB0)  
0xD8E  
Reserved  
Reserved  
HRCAP4_INT  
(HRCAP4)  
0xD88  
HRCAP3_INT  
(HRCAP3)  
0xD86  
Reserved  
EQEP2_INT  
(eQEP2)  
0xD82  
EQEP1_INT  
(eQEP1)  
0xD80  
0xD8C  
0xD8A  
0xD84  
Reserved  
Reserved  
MXINTA  
(McBSP-A)  
0xD9A  
MRINTA  
(McBSP-A)  
0xD98  
SPITXINTB  
(SPI-B)  
0xD96  
SPIRXINTB  
(SPI-B)  
0xD94  
SPITXINTA  
(SPI-A)  
SPIRXINTA  
(SPI-A)  
0xD9E  
0xD9C  
0xD92  
0xD90  
Reserved  
Reserved  
DINTCH6  
(DMA)  
DINTCH5  
(DMA)  
DINTCH4  
(DMA)  
DINTCH3  
(DMA)  
DINTCH2  
(DMA)  
DINTCH1  
(DMA)  
0xDAE  
0xDAC  
Reserved  
0xDAA  
0xDA8  
0xDA6  
0xDA4  
0xDA2  
0xDA0  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
I2CINT2A  
(I2C-A)  
I2CINT1A  
(I2C-A)  
0xDBE  
0xDBC  
Reserved  
0xDBA  
0xDB8  
0xDB6  
0xDB4  
0xDB2  
0xDB0  
Reserved  
ECAN1_INTA  
(CAN-A)  
0xDCA  
ECAN0_INTA  
(CAN-A)  
0xDC8  
SCITXINTB  
(SCI-B)  
0xDC6  
SCIRXINTB  
(SCI-B)  
0xDC4  
SCITXINTA  
(SCI-A)  
SCIRXINTA  
(SCI-A)  
0xDCE  
0xDCC  
ADCINT7  
(ADC)  
0xDC2  
0xDC0  
ADCINT8  
(ADC)  
ADCINT6  
(ADC)  
ADCINT5  
(ADC)  
ADCINT4  
(ADC)  
ADCINT3  
(ADC)  
ADCINT2  
(ADC)  
ADCINT1  
(ADC)  
0xDDE  
0xDDC  
CLA1_INT7  
(CLA)  
0xDDA  
0xDD8  
0xDD6  
0xDD4  
0xDD2  
0xDD0  
CLA1_INT8  
(CLA)  
CLA1_INT6  
(CLA)  
CLA1_INT5  
(CLA)  
CLA1_INT4  
(CLA)  
CLA1_INT3  
(CLA)  
CLA1_INT2  
(CLA)  
CLA1_INT1  
(CLA)  
0xDEE  
0xDEC  
LVF  
0xDEA  
0xDE8  
0xDE6  
0xDE4  
0xDE2  
0xDE0  
LUF  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
XINT3  
(CLA)  
(CLA)  
Ext. Int. 3  
0xDF0  
0xDFE  
0xDFC  
0xDFA  
0xDF8  
0xDF6  
0xDF4  
0xDF2  
(1) Out of 96 possible interrupts, some interrupts are not used. These interrupts are reserved for future devices. These interrupts can be  
used as software interrupts if they are enabled at the PIEIFRx level, provided none of the interrupts within the group is being used by a  
peripheral. Otherwise, interrupts coming in from peripherals may be lost by accidentally clearing their flag while modifying the PIEIFR.  
To summarize, there are two safe cases when the reserved interrupts could be used as software interrupts:  
No peripheral within the group is asserting interrupts.  
No peripheral interrupts are assigned to the group (for example, PIE group 7).  
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Table 5-12. PIE Configuration and Control Registers  
NAME  
PIECTRL  
ADDRESS  
0x0CE0  
0x0CE1  
0x0CE2  
0x0CE3  
0x0CE4  
0x0CE5  
0x0CE6  
0x0CE7  
0x0CE8  
0x0CE9  
0x0CEA  
0x0CEB  
0x0CEC  
0x0CED  
0x0CEE  
0x0CEF  
0x0CF0  
0x0CF1  
0x0CF2  
0x0CF3  
0x0CF4  
0x0CF5  
0x0CF6  
0x0CF7  
0x0CF8  
0x0CF9  
SIZE (x16)  
DESCRIPTION(1)  
PIE, Control Register  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
6
PIEACK  
PIEIER1  
PIEIFR1  
PIEIER2  
PIEIFR2  
PIEIER3  
PIEIFR3  
PIEIER4  
PIEIFR4  
PIEIER5  
PIEIFR5  
PIEIER6  
PIEIFR6  
PIEIER7  
PIEIFR7  
PIEIER8  
PIEIFR8  
PIEIER9  
PIEIFR9  
PIEIER10  
PIEIFR10  
PIEIER11  
PIEIFR11  
PIEIER12  
PIEIFR12  
Reserved  
PIE, Acknowledge Register  
PIE, INT1 Group Enable Register  
PIE, INT1 Group Flag Register  
PIE, INT2 Group Enable Register  
PIE, INT2 Group Flag Register  
PIE, INT3 Group Enable Register  
PIE, INT3 Group Flag Register  
PIE, INT4 Group Enable Register  
PIE, INT4 Group Flag Register  
PIE, INT5 Group Enable Register  
PIE, INT5 Group Flag Register  
PIE, INT6 Group Enable Register  
PIE, INT6 Group Flag Register  
PIE, INT7 Group Enable Register  
PIE, INT7 Group Flag Register  
PIE, INT8 Group Enable Register  
PIE, INT8 Group Flag Register  
PIE, INT9 Group Enable Register  
PIE, INT9 Group Flag Register  
PIE, INT10 Group Enable Register  
PIE, INT10 Group Flag Register  
PIE, INT11 Group Enable Register  
PIE, INT11 Group Flag Register  
PIE, INT12 Group Enable Register  
PIE, INT12 Group Flag Register  
Reserved  
0x0CFA –  
0x0CFF  
(1) The PIE configuration and control registers are not protected by EALLOW mode. The PIE vector table  
is protected.  
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5.8.1 External Interrupts  
Table 5-13. External Interrupt Registers  
NAME  
XINT1CR  
ADDRESS  
0x00 7070  
0x00 7071  
0x00 7072  
0x00 7078  
0x00 7079  
0x00 707A  
SIZE (x16)  
DESCRIPTION  
XINT1 configuration register  
XINT2 configuration register  
XINT3 configuration register  
XINT1 counter register  
1
1
1
1
1
1
XINT2CR  
XINT3CR  
XINT1CTR  
XINT2CTR  
XINT3CTR  
XINT2 counter register  
XINT3 counter register  
Each external interrupt can be enabled or disabled or qualified using positive, negative, or both positive  
and negative edge. For more information, see the "Systems Control and Interrupts" chapter of the  
TMS320x2806x Piccolo Technical Reference Manual (literature number SPRUH18).  
5.8.1.1 External Interrupt Electrical Data/Timing  
Table 5-14. External Interrupt Timing Requirements(1)  
MIN  
1tc(SCO)  
MAX  
UNIT  
cycles  
cycles  
(2)  
tw(INT)  
Pulse duration, INT input low/high  
Synchronous  
With qualifier  
1tc(SCO) + tw(IQSW)  
(1) For an explanation of the input qualifier parameters, see Table 5-69.  
(2) This timing is applicable to any GPIO pin configured for ADCSOC functionality.  
Table 5-15. External Interrupt Switching Characteristics(1)  
over recommended operating conditions (unless otherwise noted)  
PARAMETER  
MIN  
MAX  
tw(IQSW) + 12tc(SCO)  
UNIT  
td(INT)  
Delay time, INT low/high to interrupt-vector fetch  
cycles  
(1) For an explanation of the input qualifier parameters, see Table 5-69.  
t
w(INT)  
XINT1, XINT2, XINT3  
t
d(INT)  
Address bus  
(internal)  
Interrupt Vector  
Figure 5-12. External Interrupt Timing  
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5.9 Control Law Accelerator (CLA) Overview  
The control law accelerator extends the capabilities of the C28x CPU by adding parallel processing. Time-  
critical control loops serviced by the CLA can achieve low ADC sample to output delay. Thus, the CLA  
enables faster system response and higher frequency control loops. Utilizing the CLA for time-critical tasks  
frees up the main CPU to perform other system and communication functions concurently. The following is  
a list of major features of the CLA.  
Clocked at the same rate as the main CPU (SYSCLKOUT).  
An independent architecture allowing CLA algorithm execution independent of the main C28x CPU.  
Complete bus architecture:  
Program address bus and program data bus  
Data address bus, data read bus, and data write bus  
Independent eight-stage pipeline.  
12-bit program counter (MPC)  
Four 32-bit result registers (MR0–MR3)  
Two 16-bit auxillary registers (MAR0, MAR1)  
Status register (MSTF)  
Instruction set includes:  
IEEE single-precision (32-bit) floating-point math operations  
Floating-point math with parallel load or store  
Floating-point multiply with parallel add or subtract  
1/X and 1/sqrt(X) estimations  
Data type conversions.  
Conditional branch and call  
Data load and store operations  
The CLA program code can consist of up to eight tasks or interrupt service routines.  
The start address of each task is specified by the MVECT registers.  
No limit on task size as long as the tasks fit within the CLA program memory space.  
One task is serviced at a time through to completion. There is no nesting of tasks.  
Upon task completion, a task-specific interrupt is flagged within the PIE.  
When a task finishes, the next highest-priority pending task is automatically started.  
Task trigger mechanisms:  
C28x CPU via the IACK instruction  
Task1 to Task7: the corresponding ADC, ePWM, eQEP, or eCAP module interrupt. For example:  
Task1: ADCINT1 or EPWM1_INT  
Task2: ADCINT2 or EPWM2_INT  
Task4: ADCINT4 or EPWM4_INT or EQEPx_INT or ECAPx_INT  
Task7: ADCINT7 or EPWM7_INT or EQEPx_INT or ECAPx_INT  
Task8: ADCINT8 or by CPU Timer 0 or EQEPx_INT or ECAPx_INT.  
Memory and Shared Peripherals:  
Two dedicated message RAMs for communication between the CLA and the main CPU.  
The C28x CPU can map CLA program and data memory to the main CPU space or CLA space.  
The CLA has direct access to the ADC Result registers, comparator registers, and the eCAP,  
eQEP, and ePWM+HRPWM registers.  
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Peripheral Interrupts  
CLA Control  
Registers  
IACK  
ADCINT1 to ADCINT8  
ECAP1_INT to ECAP3_INT  
MIFR  
MIOVF  
MICLR  
MICLROVF  
MIFRC  
MIER  
EQEP1_INT and EQEP2_INT  
EPWM1_INT to EPWM8_INT  
CPU Timer 0  
CLA_INT1 to CLA_INT8  
Main  
28x  
CPU  
INT11  
INT12  
MPERINT1  
to  
MPERINT8  
PIE  
LVF  
LUF  
MIRUN  
Main CPU Read/Write Data Bus  
MPISRCSEL1  
MVECT1  
MVECT2  
MVECT3  
MVECT4  
MVECT5  
MVECT6  
MVECT7  
MVECT8  
CLA Program Address Bus  
CLA Program Data Bus  
CLA  
Program  
Memory  
CLA  
Data  
Memory  
Map to CLA or  
CPU Space  
Map to CLA or  
CPU Space  
MMEMCFG  
MCTL  
CLA  
Shared  
Message  
RAMs  
SYSCLKOUT  
CLAENCLK  
SYSRS  
ADC  
Result  
Registers  
MEALLOW  
CLA Execution  
Registers  
ePWM  
and  
CLA Data Read Address Bus  
HRPWM  
Registers  
MPC(12)  
MSTF(32)  
MR0(32)  
MR1(32)  
MR2(32)  
MR3(32)  
CLA Data Read Data Bus  
CLA Data Write Address Bus  
CLA Data Write Data Bus  
Main CPU Read Data Bus  
Comparator  
Registers  
MAR0(32)  
MAR1(32)  
eCAP  
Registers  
eQEP  
Registers  
Figure 5-13. CLA Block Diagram  
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Table 5-16. CLA Control Registers  
CLA1  
ADDRESS  
EALLOW  
PROTECTED  
REGISTER NAME  
SIZE (x16)  
DESCRIPTION(1)  
MVECT1  
MVECT2  
MVECT3  
MVECT4  
MVECT5  
MVECT6  
MVECT7  
MVECT8  
MCTL  
0x1400  
0x1401  
0x1402  
0x1403  
0x1404  
0x1405  
0x1406  
0x1407  
0x1410  
0x1411  
0x1414  
0x1420  
0x1421  
0x1422  
0x1423  
0x1424  
0x1425  
0x1426  
0x1427  
0x1428  
0x142A  
0x142B  
0x142E  
0x1430  
0x1434  
0x1438  
0x143C  
1
1
1
1
1
1
1
1
1
1
2
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
CLA Interrupt/Task 1 Start Address  
CLA Interrupt/Task 2 Start Address  
CLA Interrupt/Task 3 Start Address  
CLA Interrupt/Task 4 Start Address  
CLA Interrupt/Task 5 Start Address  
CLA Interrupt/Task 6 Start Address  
CLA Interrupt/Task 7 Start Address  
CLA Interrupt/Task 8 Start Address  
CLA Control Register  
MMEMCFG  
MPISRCSEL1  
MIFR  
CLA Memory Configure Register  
Peripheral Interrupt Source Select Register 1  
Interrupt Flag Register  
MIOVF  
Interrupt Overflow Register  
Interrupt Force Register  
MIFRC  
MICLR  
Interrupt Clear Register  
MICLROVF  
MIER  
Interrupt Overflow Clear Register  
Interrupt Enable Register  
MIRUN  
Interrupt RUN Register  
MIPCTL  
MPC(2)  
MAR0(2)  
MAR1(2)  
MSTF(2)  
MR0(2)  
MR1(2)  
MR2(2)  
MR3(2)  
Interrupt Priority Control Register  
CLA Program Counter  
CLA Aux Register 0  
CLA Aux Register 1  
CLA STF Register  
CLA R0H Register  
CLA R1H Register  
CLA R2H Register  
CLA R3H Register  
(1) All registers in this table are CSM protected  
(2) The main C28x CPU has read only access to this register for debug purposes. The main CPU cannot perform CPU or debugger writes  
to this register.  
Table 5-17. CLA Message RAM  
ADDRESS RANGE  
0x1480 – 0x14FF  
0x1500 – 0x157F  
SIZE (x16)  
128  
DESCRIPTION  
CLA to CPU Message RAM  
CPU to CLA Message RAM  
128  
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5.10 Analog Block  
A 12-bit ADC core is implemented that has different timings than the 12-bit ADC used on the F280x and  
F2833x devices. The ADC wrapper is modified to incorporate the new timings and also other  
enhancements to improve the timing control of start of conversions. Figure 5-14 shows the interaction of  
the analog module with the rest of the F2806x system.  
80-Pin 100-Pin  
(3.3 V) VDDA  
(Agnd) VSSA  
VDDA  
VDDA  
VSSA  
VREFLO  
VREFLO  
Tied To  
VSSA  
Interface Reference  
Diff  
VREFLO  
VREFHI  
A0  
VREFHI  
Tied To  
A0  
VREFHI  
A0  
B0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
B0  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
A1  
A2  
A1  
B1  
COMP1OUT  
A2  
A4  
A5  
A6  
AIO2  
AIO10  
10-Bit  
DAC  
Comp1  
Comp2  
B2  
A3  
B3  
ADC  
B0  
B1  
B2  
COMP2OUT  
A4  
B4  
AIO4  
AIO12  
10-Bit  
DAC  
B4  
B5  
B6  
B5  
Temperature Sensor  
A5  
A6  
COMP3OUT  
Signal Pinout  
AIO6  
AIO14  
10-Bit  
DAC  
Comp3  
B6  
A7  
B7  
Figure 5-14. Analog Pin Configurations  
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5.10.1 Analog-to-Digital Converter (ADC)  
5.10.1.1 Features  
The core of the ADC contains a single 12-bit converter fed by two sample-and-hold circuits. The sample-  
and-hold circuits can be sampled simultaneously or sequentially. These, in turn, are fed by a total of up to  
16 analog input channels. The converter can be configured to run with an internal bandgap reference to  
create true-voltage based conversions or with a pair of external voltage references (VREFHI/VREFLO) to  
create ratiometric-based conversions.  
Contrary to previous ADC types, this ADC is not sequencer-based. The user can easily create a series of  
conversions from a single trigger. However, the basic principle of operation is centered around the  
configurations of individual conversions, called SOCs, or Start-Of-Conversions.  
Functions of the ADC module include:  
12-bit ADC core with built-in dual sample-and-hold (S/H)  
Simultaneous sampling or sequential sampling modes  
Full range analog input: 0 V to 3.3 V fixed, or VREFHI/VREFLO ratiometric. The digital value of the input  
analog voltage is derived by:  
Internal Reference (VREFLO = VSSA. VREFHI must not exceed VDDA when using either internal or  
external reference modes.)  
Digital Value = 0,  
when input £ 0 V  
Input Analog Voltage -  
VREFLO  
Digital Value = 4096 ´  
when 0 V < input < 3.3 V  
3.3  
Digital Value = 4095,  
when input ³ 3.3 V  
External Reference (VREFHI/VREFLO connected to external references. VREFHI must not exceed VDDA  
when using either internal or external reference modes.)  
Digital Value = 0,  
when input £ 0 V  
Input Analog Voltage -  
VREFLO  
Digital Value = 4096 ´  
when 0 V < input <  
VREFHI  
-
VREFHI VREFLO  
Digital Value = 4095,  
when input ³  
VREFHI  
Runs at full system clock, no prescaling required  
Up to 16-channel, multiplexed inputs  
16 SOCs, configurable for trigger, sample window, and channel  
16 result registers (individually addressable) to store conversion values  
Multiple trigger sources  
S/W – software immediate start  
ePWM 1–8  
GPIO XINT2  
CPU Timer 0, CPU Timer 1, CPU Timer 2  
ADCINT1, ADCINT2  
9 flexible PIE interrupts, can configure interrupt request after any conversion  
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Table 5-18. ADC Configuration and Control Registers  
SIZE  
(x16)  
EALLOW  
PROTECTED  
REGISTER NAME  
ADCCTL1  
ADDRESS  
DESCRIPTION  
0x7100  
0x7101  
0x7104  
0x7105  
0x7106  
0x7107  
0x7108  
0x7109  
0x710A  
0x710B  
0x710C  
0x7110  
0x7112  
0x7114  
0x7115  
0x7118  
0x711A  
0x711C  
0x711E  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Yes  
Yes  
No  
Control 1 Register  
Control 2 Register  
Interrupt Flag Register  
ADCCTL2  
ADCINTFLG  
ADCINTFLGCLR  
ADCINTOVF  
No  
Interrupt Flag Clear Register  
No  
Interrupt Overflow Register  
ADCINTOVFCLR  
INTSEL1N2  
No  
Interrupt Overflow Clear Register  
Interrupt 1 and 2 Selection Register  
Interrupt 3 and 4 Selection Register  
Interrupt 5 and 6 Selection Register  
Interrupt 7 and 8 Selection Register  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
No  
INTSEL3N4  
INTSEL5N6  
INTSEL7N8  
INTSEL9N10  
Interrupt 9 Selection Register (reserved Interrupt 10 Selection)  
SOC Priority Control Register  
SOCPRICTL  
ADCSAMPLEMODE  
ADCINTSOCSEL1  
ADCINTSOCSEL2  
ADCSOCFLG1  
ADCSOCFRC1  
ADCSOCOVF1  
ADCSOCOVFCLR1  
Sampling Mode Register  
Interrupt SOC Selection 1 Register (for 8 channels)  
Interrupt SOC Selection 2 Register (for 8 channels)  
SOC Flag 1 Register (for 16 channels)  
No  
SOC Force 1 Register (for 16 channels)  
No  
SOC Overflow 1 Register (for 16 channels)  
SOC Overflow Clear 1 Register (for 16 channels)  
SOC0 Control Register to SOC15 Control Register  
No  
ADCSOC0CTL to  
ADCSOC15CTL  
0x7120 –  
0x712F  
Yes  
ADCREFTRIM  
ADCOFFTRIM  
COMPHYSTCTL  
ADCREV  
0x7140  
0x7141  
0x714C  
0x714F  
1
1
1
1
Yes  
Yes  
Yes  
No  
Reference Trim Register  
Offset Trim Register  
Comparator Hysteresis Control Register  
Revision Register  
Table 5-19. ADC Result Registers (Mapped to PF0)  
SIZE  
(x16)  
EALLOW  
PROTECTED  
REGISTER NAME  
ADDRESS  
DESCRIPTION  
ADCRESULT0 to  
ADCRESULT15  
0xB00 –  
0xB0F  
1
No  
ADC Result 0 Register to ADC Result 15 Register  
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0-Wait  
Result  
Registers  
PF0 (CPU)  
PF2 (CPU)  
SYSCLKOUT  
ADCENCLK  
ADCINT 1  
PIE  
ADCINT 9  
TINT 0  
CPUTIMER 0  
CPUTIMER 1  
CPUTIMER 2  
ADCTRIG 1  
ADCTRIG 2  
ADCTRIG 3  
TINT 1  
TINT 2  
ADC  
Core  
12-Bit  
XINT 2SOC  
AIO  
MUX  
ADC  
Channels  
XINT 2  
EPWM 1  
EPWM 2  
EPWM 3  
EPWM 4  
EPWM 5  
EPWM 6  
EPWM 7  
EPWM 8  
ADCTRIG 4  
SOCA 1  
SOCB 1  
SOCA 2  
SOCB 2  
SOCA 3  
SOCB 3  
SOCA 4  
SOCB 4  
SOCA 5  
SOCB 5  
SOCA 6  
SOCB 6  
SOCA 7  
SOCB 7  
SOCA 8  
SOCB 8  
ADCTRIG 5  
ADCTRIG 6  
ADCTRIG 7  
ADCTRIG 8  
ADCTRIG 9  
ADCTRIG 10  
ADCTRIG 11  
ADCTRIG 12  
ADCTRIG 13  
ADCTRIG 14  
ADCTRIG 15  
ADCTRIG 16  
ADCTRIG 17  
ADCTRIG 18  
ADCTRIG 19  
ADCTRIG 20  
Figure 5-15. ADC Connections  
ADC Connections if the ADC is Not Used  
It is recommended that the connections for the analog power pins be kept, even if the ADC is not used.  
Following is a summary of how the ADC pins should be connected, if the ADC is not used in an  
application:  
VDDA – Connect to VDDIO  
VSSA – Connect to VSS  
VREFLO – Connect to VSS  
ADCINAn, ADCINBn, VREFHI – Connect to VSSA  
When the ADC module is used in an application, unused ADC input pins should be connected to analog  
ground (VSSA).  
NOTE: Unused ADCIN pins that are multiplexed with AIO function should not be directly connected to  
analog ground. They should be grounded through a 1-kΩ resistor. This is to prevent an errant code from  
configuring these pins as AIO outputs and driving grounded pins to a logic-high state.  
When the ADC is not used, be sure that the clock to the ADC module is not turned on to realize power  
savings.  
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5.10.1.2 ADC Start-of-Conversion Electrical Data/Timing  
Table 5-20. External ADC Start-of-Conversion Switching Characteristics  
over recommended operating conditions (unless otherwise noted)  
PARAMETER  
MIN  
MAX  
UNIT  
tw(ADCSOCL)  
Pulse duration, ADCSOCxO low  
32tc(HCO )  
cycles  
tw(ADCSOCL)  
ADCSOCAO  
or  
ADCSOCBO  
Figure 5-16. ADCSOCAO or ADCSOCBO Timing  
5.10.1.3 On-Chip Analog-to-Digital Converter (ADC) Electrical Data/Timing  
Table 5-21. ADC Electrical Characteristics  
PARAMETER  
MIN  
TYP  
MAX  
UNIT  
DC SPECIFICATIONS  
Resolution  
12  
0.001  
7
Bits  
ADC clock  
90-MHz device  
45  
64  
MHz  
Sample Window  
ADC  
Clocks  
ACCURACY  
INL (Integral nonlinearity)(1)  
–4  
–1  
4
1.5  
20  
LSB  
LSB  
LSB  
DNL (Differential nonlinearity), no missing codes  
(2)  
Offset error  
Executing a single self-  
recalibration(3)  
–20  
Executing periodic self-  
recalibration(4)  
–4  
4
Overall gain error with internal reference  
Overall gain error with external reference  
Channel-to-channel offset variation  
Channel-to-channel gain variation  
ADC temperature coefficient with internal reference  
ADC temperature coefficient with external reference  
VREFLO  
–60  
–40  
–4  
60  
40  
4
LSB  
LSB  
LSB  
–4  
4
LSB  
–50  
–20  
ppm/°C  
ppm/°C  
µA  
–100  
100  
VREFHI  
µA  
ANALOG INPUT  
Analog input voltage with internal reference  
Analog input voltage with external reference  
VREFLO input voltage(5)  
0
VREFLO  
VSSA  
3.3  
VREFHI  
0.66  
V
V
V
V
VREFHI input voltage(6)  
2.64  
VDDA  
VDDA  
with VREFLO = VSSA  
1.98  
Input capacitance  
5
pF  
Input leakage current  
±2  
μA  
(1) INL will degrade when the ADC input voltage goes above VDDA  
.
(2) 1 LSB has the weighted value of full-scale range (FSR)/4096. FSR is 3.3 V with internal reference and VREFHI - VREFLO for external  
reference.  
(3) For more details, see the TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064,  
TMS320F28063, TMS320F28062 Piccolo MCU Silicon Errata (literature number SPRZ342).  
(4) Periodic self-recalibration will remove system-level and temperature dependencies on the ADC zero offset error.  
(5) VREFLO is always connected to VSSA on the 80-pin PN and PFP devices.  
(6) VREFHI must not exceed VDDA when using either internal or external reference modes. Since VREFHI is tied to ADCINA0 on the 80-pin PN  
and PFP devices, the input signal on ADCINA0 must not exceed VDDA  
.
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Table 5-22. ADC Power Modes  
ADC OPERATING MODE  
CONDITIONS  
IDDA  
UNITS  
Mode A – Operating Mode  
Mode B – Quick Wake Mode  
Mode C – Comparator-Only Mode  
Mode D – Off Mode  
ADC Clock Enabled  
16  
mA  
Bandgap On (ADCBGPWD = 1)  
Reference On (ADCREFPWD = 1)  
ADC Powered Up (ADCPWDN = 1)  
ADC Clock Enabled  
4
mA  
mA  
mA  
Bandgap On (ADCBGPWD = 1)  
Reference On (ADCREFPWD = 1)  
ADC Powered Up (ADCPWDN = 0)  
ADC Clock Enabled  
1.5  
Bandgap On (ADCBGPWD = 1)  
Reference On (ADCREFPWD = 0)  
ADC Powered Up (ADCPWDN = 0)  
ADC Clock Enabled  
0.075  
Bandgap On (ADCBGPWD = 0)  
Reference On (ADCREFPWD = 0)  
ADC Powered Up (ADCPWDN = 0)  
5.10.1.3.1 Internal Temperature Sensor  
Table 5-23. Temperature Sensor Coefficient  
PARAMETER(1)  
MIN  
TYP  
MAX  
UNIT  
TSLOPE  
Degrees C of temperature movement per measured ADC LSB change of the  
temperature sensor  
0.18(2)(3)  
°C/LSB  
TOFFSET  
ADC output at 0°C of the temperature sensor  
1750  
LSB  
(1) The temperature sensor slope and offset are given in terms of ADC LSBs using the internal reference of the ADC. Values must be  
adjusted accordingly in external reference mode to the external reference voltage.  
(2) ADC temperature coeffieicient is accounted for in this specification  
(3) Output of the temperature sensor (in terms of LSBs) is sign-consistent with the direction of the temperature movement. Increasing  
temperatures will give increasing ADC values relative to an initial value; decreasing temperatures will give decreasing ADC values  
relative to an initial value.  
5.10.1.3.2 ADC Power-Up Control Bit Timing  
Table 5-24. ADC Power-Up Delays  
PARAMETER(1)  
MIN  
MAX  
UNIT  
td(PWD)  
Delay time for the ADC to be stable after power up  
1
ms  
(1) Timings maintain compatibility to the ADC module. The 2806x ADC supports driving all 3 bits at the same time td(PWD) ms before first  
conversion.  
ADCPWDN/  
ADCBGPWD/  
ADCREFPWD/  
ADCENABLE  
td(PWD)  
Request for ADC  
Conversion  
Figure 5-17. ADC Conversion Timing  
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Ron  
3.4 kW  
Switch  
Rs  
ADCIN  
Cp  
Ch  
Source  
Signal  
ac  
5 pF  
1.6 pF  
28x DSP  
Typical Values of the Input Circuit Components:  
Switch Resistance (Ron): 3.4 kW  
Sampling Capacitor (Ch): 1.6 pF  
Parasitic Capacitance (Cp): 5 pF  
Source Resistance (Rs): 50 W  
Figure 5-18. ADC Input Impedance Model  
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5.10.1.3.3 ADC Sequential and Simultaneous Timings  
Analog Input  
SOC0 Sample  
Window  
SOC1 Sample  
Window  
SOC2 Sample  
Window  
0
2
9
15  
22 24  
37  
ADCCLK  
ADCCTL1.INTPULSEPOS  
ADCSOCFLG1.SOC0  
ADCSOCFLG1.SOC1  
ADCSOCFLG1.SOC2  
S/H Window Pulse to Core  
ADCRESULT 0  
SOC0  
SOC1  
SOC2  
Result 0 Latched  
2 ADCCLKs  
ADCRESULT 1  
EOC0 Pulse  
EOC1 Pulse  
ADCINTFLG.ADCINTx  
Minimum  
7 ADCCLKs  
Conversion 0  
13 ADC Clocks  
1 ADCCLK  
6
Minimum  
ADCCLKs 7 ADCCLKs  
Conversion 1  
13 ADC Clocks  
Figure 5-19. Timing Example for Sequential Mode / Late Interrupt Pulse  
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Analog Input  
SOC0 Sample  
Window  
SOC1 Sample  
Window  
SOC2 Sample  
Window  
0
2
9
15  
22 24  
37  
ADCCLK  
ADCCTL1.INTPULSEPOS  
ADCSOCFLG1.SOC0  
ADCSOCFLG1.SOC1  
ADCSOCFLG1.SOC2  
S/H Window Pulse to Core  
ADCRESULT 0  
SOC0  
SOC1  
SOC2  
Result 0 Latched  
ADCRESULT 1  
EOC0 Pulse  
EOC1 Pulse  
EOC2 Pulse  
ADCINTFLG.ADCINTx  
Minimum  
7 ADCCLKs  
Conversion 0  
13 ADC Clocks  
2 ADCCLKs  
6
Minimum  
ADCCLKs 7 ADCCLKs  
Conversion 1  
13 ADC Clocks  
Figure 5-20. Timing Example for Sequential Mode / Early Interrupt Pulse  
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Analog Input A  
Analog Input B  
SOC0 Sample  
A Window  
SOC2 Sample  
A Window  
SOC0 Sample  
B Window  
SOC2 Sample  
B Window  
0
2
9
22 24  
37  
50  
ADCCLK  
ADCCTL1.INTPULSEPOS  
ADCSOCFLG1.SOC0  
ADCSOCFLG1.SOC1  
ADCSOCFLG1.SOC2  
S/H Window Pulse to Core  
ADCRESULT 0  
SOC0 (A/B)  
SOC2 (A/B)  
2 ADCCLKs  
Result 0 (A) Latched  
ADCRESULT 1  
Result 0 (B) Latched  
ADCRESULT 2  
EOC0 Pulse  
EOC1 Pulse  
1 ADCCLK  
EOC2 Pulse  
ADCINTFLG .ADCINTx  
Minimum  
7 ADCCLKs  
Conversion 0 (A)  
13 ADC Clocks  
Conversion 0 (B)  
13 ADC Clocks  
2 ADCCLKs  
19  
ADCCLKs  
Minimum  
7 ADCCLKs  
Conversion 1 (A)  
13 ADC Clocks  
Figure 5-21. Timing Example for Simultaneous Mode / Late Interrupt Pulse  
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Analog Input A  
SOC0 Sample  
A Window  
SOC2 Sample  
A Window  
Analog Input B  
SOC0 Sample  
B Window  
SOC2 Sample  
B Window  
0
2
9
22 24  
37  
50  
ADCCLK  
ADCCTL1.INTPULSEPOS  
ADCSOCFLG1.SOC0  
ADCSOCFLG1.SOC1  
ADCSOCFLG1.SOC2  
S/H Window Pulse to Core  
ADCRESULT 0  
SOC0 (A/B)  
SOC2 (A/B)  
Result 0 (A) Latched  
2 ADCCLKs  
Result 0 (B) Latched  
ADCRESULT 1  
ADCRESULT 2  
EOC0 Pulse  
EOC1 Pulse  
EOC2 Pulse  
ADCINTFLG.ADCINTx  
Conversion 0 (A)  
13 ADC Clocks  
Conversion 0 (B)  
13 ADC Clocks  
Minimum  
2 ADCCLKs  
7 ADCCLKs  
19  
Minimum  
7 ADCCLKs  
Conversion 1 (A)  
13 ADC Clocks  
ADCCLKs  
Figure 5-22. Timing Example for Simultaneous Mode / Early Interrupt Pulse  
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5.10.2 ADC MUX  
To COMPy A or B input  
To ADC Channel X  
Logic implemented in GPIO MUX block  
AIOx Pin  
SYSCLK  
AIOxIN  
1
AIOxINE  
AIODAT Reg  
(Read)  
SYNC  
0
AIODAT Reg  
(Latch)  
AIOMUX 1 Reg  
AIOSET,  
AIOCLEAR,  
AIOTOGGLE  
Regs  
AIODIR Reg  
(Latch)  
1
(0 = Input, 1 = Output)  
0
0
Figure 5-23. AIOx Pin Multiplexing  
The ADC channel and Comparator functions are always available. The digital I/O function is available only  
when the respective bit in the AIOMUX1 register is 0. In this mode, reading the AIODAT register reflects  
the actual pin state.  
The digital I/O function is disabled when the respective bit in the AIOMUX1 register is 1. In this mode,  
reading the AIODAT register reflects the output latch of the AIODAT register and the input digital I/O buffer  
is disabled to prevent analog signals from generating noise.  
On reset, the digital function is disabled. If the pin is used as an analog input, users should keep the AIO  
function disabled for that pin.  
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5.10.3 Comparator Block  
Figure 5-24 shows the interaction of the Comparator modules with the rest of the system.  
COMP x A  
+
COMP x B  
COMP  
TZ1/2/3  
-
GPIO  
MUX  
COMP x  
+
DAC x  
Wrapper  
ePWM  
AIO  
MUX  
COMPxOUT  
DAC  
Core  
10-Bit  
Figure 5-24. Comparator Block Diagram  
Table 5-25. Comparator Control Registers  
REGISTER  
NAME  
COMP1  
ADDRESS  
COMP2  
ADDRESS  
COMP3  
ADDRESS  
SIZE  
(x16)  
EALLOW  
PROTECTED  
DESCRIPTION  
COMPCTL  
0x6400  
0x6402  
0x6404  
0x6406  
0x6408  
0x6420  
0x6422  
0x6424  
0x6426  
0x6428  
0x6440  
0x6442  
0x6444  
0x6446  
0x6448  
1
1
1
1
1
Yes  
No  
Comparator Control Register  
Comparator Status Register  
DAC Control Register  
COMPSTS  
DACCTL  
DACVAL  
Yes  
No  
DAC Value Register  
RAMPMAXREF_  
ACTIVE  
No  
Ramp Generator Maximum Reference  
(Active) Register  
RAMPMAXREF_  
SHDW  
0x640A  
0x640C  
0x640E  
0x6410  
0x642A  
0x642C  
0x642E  
0x6430  
0x644A  
0x644C  
0x644E  
0x6450  
1
1
1
1
No  
No  
No  
No  
Ramp Generator Maximum Reference  
(Shadow) Register  
RAMPDECVAL_  
ACTIVE  
Ramp Generator Decrement Value (Active)  
Register  
RAMPDECVAL_  
SHDW  
Ramp Generator Decrement Value  
(Shadow) Register  
RAMPSTS  
Ramp Generator Status Register  
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5.10.3.1 On-Chip Comparator/DAC Electrical Data/Timing  
Table 5-26. Electrical Characteristics of the Comparator/DAC  
CHARACTERISTIC  
MIN  
TYP  
MAX  
UNITS  
Comparator  
Comparator Input Range  
VSSA – VDDA  
V
Comparator response time to PWM Trip Zone (Async)  
30  
±5  
35  
ns  
Input Offset  
Input Hysteresis(1)  
mV  
mV  
DAC  
DAC Output Range  
DAC resolution  
DAC settling time  
DAC Gain  
VSSA – VDDA  
V
10  
bits  
See Figure 5-25  
–1.5  
10  
%
DAC Offset  
Monotonic  
mV  
Yes  
±3  
INL  
LSB  
(1) Hysteresis on the comparator inputs is achieved with a Schmidt trigger configuration. This results in an effective 100-kΩ feedback  
resistance between the output of the comparator and the non-inverting input of the comparator.  
1100  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
0
50  
100  
150  
200  
250  
300  
350  
400  
450  
500  
DAC Step Size (Codes)  
DAC Accuracy  
15 Codes  
7 Codes  
3 Codes  
1 Code  
Figure 5-25. DAC Settling Time  
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5.11 Detailed Descriptions  
Integral Nonlinearity  
Integral nonlinearity refers to the deviation of each individual code from a line drawn from zero through full  
scale. The point used as zero occurs one-half LSB before the first code transition. The full-scale point is  
defined as level one-half LSB beyond the last code transition. The deviation is measured from the center  
of each particular code to the true straight line between these two points.  
Differential Nonlinearity  
An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal  
value. A differential nonlinearity error of less than ±1 LSB ensures no missing codes.  
Zero Offset  
The major carry transition should occur when the analog input is at zero volts. Zero error is defined as the  
deviation of the actual transition from that point.  
Gain Error  
The first code transition should occur at an analog value one-half LSB above negative full scale. The last  
transition should occur at an analog value one and one-half LSB below the nominal full scale. Gain error is  
the deviation of the actual difference between first and last code transitions and the ideal difference  
between first and last code transitions.  
Signal-to-Noise Ratio + Distortion (SINAD)  
SINAD is the ratio of the rms value of the measured input signal to the rms sum of all other spectral  
components below the Nyquist frequency, including harmonics but excluding dc. The value for SINAD is  
expressed in decibels.  
Effective Number of Bits (ENOB)  
For a sine wave, SINAD can be expressed in terms of the number of bits. Using the following  
(SINAD -1.76)  
N =  
formula,  
6.02  
it is possible to get a measure of performance expressed as N, the effective  
number of bits. Thus, effective number of bits for a device for sine wave inputs at a given input frequency  
can be calculated directly from its measured SINAD.  
Total Harmonic Distortion (THD)  
THD is the ratio of the rms sum of the first nine harmonic components to the rms value of the measured  
input signal and is expressed as a percentage or in decibels.  
Spurious Free Dynamic Range (SFDR)  
SFDR is the difference in dB between the rms amplitude of the input signal and the peak spurious signal.  
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5.12 Serial Peripheral Interface (SPI) Module  
The device includes the four-pin serial peripheral interface (SPI) module. Up to two SPI modules are  
available. The SPI is a high-speed, synchronous serial I/O port that allows a serial bit stream of  
programmed length (one to sixteen bits) to be shifted into and out of the device at a programmable bit-  
transfer rate. Normally, the SPI is used for communications between the MCU and external peripherals or  
another processor. Typical applications include external I/O or peripheral expansion through devices such  
as shift registers, display drivers, and ADCs. Multidevice communications are supported by the  
master/slave operation of the SPI.  
The SPI module features include:  
Four external pins:  
SPISOMI: SPI slave-output/master-input pin  
SPISIMO: SPI slave-input/master-output pin  
SPISTE: SPI slave transmit-enable pin  
SPICLK: SPI serial-clock pin  
NOTE: All four pins can be used as GPIO if the SPI module is not used.  
Two operational modes: master and slave  
Baud rate: 125 different programmable rates.  
LSPCLK  
Baud rate =  
when SPIBRR = 3 to127  
when SPIBRR = 0,1, 2  
(SPIBRR + 1)  
LSPCLK  
Baud rate =  
4
Data word length: one to sixteen data bits  
Four clocking schemes (controlled by clock polarity and clock phase bits) include:  
Falling edge without phase delay: SPICLK active-high. SPI transmits data on the falling edge of the  
SPICLK signal and receives data on the rising edge of the SPICLK signal.  
Falling edge with phase delay: SPICLK active-high. SPI transmits data one half-cycle ahead of the  
falling edge of the SPICLK signal and receives data on the falling edge of the SPICLK signal.  
Rising edge without phase delay: SPICLK inactive-low. SPI transmits data on the rising edge of the  
SPICLK signal and receives data on the falling edge of the SPICLK signal.  
Rising edge with phase delay: SPICLK inactive-low. SPI transmits data one half-cycle ahead of the  
falling edge of the SPICLK signal and receives data on the rising edge of the SPICLK signal.  
Simultaneous receive and transmit operation (transmit function can be disabled in software)  
Transmitter and receiver operations are accomplished through either interrupt-driven or polled  
algorithms.  
Nine SPI module control registers: Located in control register frame beginning at address 7040h.  
NOTE  
All registers in this module are 16-bit registers that are connected to Peripheral Frame 2.  
When a register is accessed, the register data is in the lower byte (7–0), and the upper byte  
(15–8) is read as zeros. Writing to the upper byte has no effect.  
Enhanced feature:  
4-level transmit/receive FIFO  
Delayed transmit control  
Bi-directional 3 wire SPI mode support  
Audio data receive support via SPISTE inversion  
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The SPI port operation is configured and controlled by the registers listed in Table 5-27 and Table 5-28.  
Table 5-27. SPI-A Registers  
NAME  
SPICCR  
ADDRESS  
0x7040  
0x7041  
0x7042  
0x7044  
0x7046  
0x7047  
0x7048  
0x7049  
0x704A  
0x704B  
0x704C  
0x704F  
SIZE (x16) EALLOW PROTECTED  
DESCRIPTION(1)  
SPI-A Configuration Control Register  
SPI-A Operation Control Register  
SPI-A Status Register  
1
1
1
1
1
1
1
1
1
1
1
1
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
SPICTL  
SPISTS  
SPIBRR  
SPI-A Baud Rate Register  
SPIRXEMU  
SPIRXBUF  
SPITXBUF  
SPIDAT  
SPI-A Receive Emulation Buffer Register  
SPI-A Serial Input Buffer Register  
SPI-A Serial Output Buffer Register  
SPI-A Serial Data Register  
SPIFFTX  
SPIFFRX  
SPIFFCT  
SPIPRI  
SPI-A FIFO Transmit Register  
SPI-A FIFO Receive Register  
SPI-A FIFO Control Register  
SPI-A Priority Control Register  
(1) Registers in this table are mapped to Peripheral Frame 2. This space only allows 16-bit accesses. 32-bit accesses produce undefined  
results.  
Table 5-28. SPI-B Registers  
NAME  
SPICCR  
ADDRESS  
0x7740  
0x7741  
0x7742  
0x7744  
0x7746  
0x7747  
0x7748  
0x7749  
0x774A  
0x774B  
0x774C  
0x774F  
SIZE (x16) EALLOW PROTECTED  
DESCRIPTION(1)  
SPI-B Configuration Control Register  
SPI-B Operation Control Register  
SPI-B Status Register  
1
1
1
1
1
1
1
1
1
1
1
1
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
SPICTL  
SPISTS  
SPIBRR  
SPI-B Baud Rate Register  
SPIRXEMU  
SPIRXBUF  
SPITXBUF  
SPIDAT  
SPI-B Receive Emulation Buffer Register  
SPI-B Serial Input Buffer Register  
SPI-B Serial Output Buffer Register  
SPI-B Serial Data Register  
SPIFFTX  
SPIFFRX  
SPIFFCT  
SPIPRI  
SPI-B FIFO Transmit Register  
SPI-B FIFO Receive Register  
SPI-B FIFO Control Register  
SPI-B Priority Control Register  
(1) Registers in this table are mapped to Peripheral Frame 2. This space only allows 16-bit accesses. 32-bit accesses produce undefined  
results.  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Figure 5-26 is a block diagram of the SPI in slave mode.  
SPIFFENA  
Overrun  
INT ENA  
Receiver  
Overrun Flag  
SPIFFTX.14  
SPISTS.7  
RX FIFO Registers  
SPICTL.4  
SPIRXBUF  
RX FIFO _0  
RX FIFO _1  
-----  
SPIINT  
RX FIFO Interrupt  
RX Interrupt  
Logic  
RX FIFO _3  
16  
SPIRXBUF  
Buffer Register  
SPIFFOVF  
FLAG  
SPIFFRX.15  
To CPU  
TX FIFO Registers  
SPITXBUF  
TX FIFO _3  
TX Interrupt  
Logic  
TX FIFO Interrupt  
-----  
TX FIFO _1  
SPITX  
TX FIFO _0  
16  
SPI INT  
ENA  
16  
SPI INT FLAG  
SPITXBUF  
Buffer Register  
SPISTS.6  
SPICTL.0  
TRIWIRE  
SPIPRI.0  
16  
M
S
M
SPIDAT  
Data Register  
TW  
S
SW1  
SW2  
SPISIMO  
SPISOMI  
M
S
TW  
SPIDAT.15 - 0  
M
S
TW  
STEINV  
SPIPRI.1  
Talk  
STEINV  
SPICTL.1  
SPISTE  
State Control  
Master/Slave  
SPICTL.2  
SPI Char  
LSPCLK  
SPICCR.3 - 0  
S
SW3  
3
2
1
0
Clock  
Polarity  
Clock  
Phase  
M
S
SPI Bit Rate  
SPIBRR.6 - 0  
SPICCR.6  
SPICTL.3  
SPICLK  
M
6
5
4
3
2
1
0
A. SPISTE is driven low by the master for a slave device.  
Figure 5-26. SPI Module Block Diagram (Slave Mode)  
5.12.1 Serial Peripheral Interface (SPI) Master Mode Electrical Data/Timing  
Table 5-29 lists the master mode timing (clock phase = 0) and Table 5-30 lists the master mode timing  
(clock phase = 1). Figure 5-27 and Figure 5-28 show the timing waveforms.  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
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Table 5-29. SPI Master Mode External Timing (Clock Phase = 0)(1)(2)(3)(4)(5)  
SPI WHEN (SPIBRR + 1) IS EVEN OR  
SPIBRR = 0 OR 2  
SPI WHEN (SPIBRR + 1) IS ODD  
AND SPIBRR > 3  
NO.  
UNIT  
MIN  
4tc(LCO)  
MAX  
MIN  
MAX  
1
2
tc(SPC)M  
Cycle time, SPICLK  
128tc(LCO)  
0.5tc(SPC)M  
5tc(LCO)  
127tc(LCO)  
ns  
ns  
tw(SPCH)M  
Pulse duration, SPICLK high  
(clock polarity = 0)  
0.5tc(SPC)M – 10  
0.5tc(SPC)M – 0.5tc(LCO) – 10  
0.5tc(SPC)M – 0.5tc(LCO) – 10  
0.5tc(SPC)M + 0.5tc(LCO) – 10  
0.5tc(SPC)M + 0.5tc(LCO) – 10  
0.5tc(SPC)M – 0.5tc(LCO)  
0.5tc(SPC)M – 0.5tc(LCO)  
0.5tc(SPC)M + 0.5tc(LCO)  
0.5tc(SPC)M + 0.5tc(LCO)  
10  
tw(SPCL)M  
Pulse duration, SPICLK low  
(clock polarity = 1)  
0.5tc(SPC)M – 10  
0.5tc(SPC)M – 10  
0.5tc(SPC)M – 10  
0.5tc(SPC)M  
0.5tc(SPC)M  
0.5tc(SPC)M  
10  
3
4
5
8
9
tw(SPCL)M  
Pulse duration, SPICLK low  
(clock polarity = 0)  
ns  
ns  
ns  
ns  
ns  
tw(SPCH)M  
Pulse duration, SPICLK high  
(clock polarity = 1)  
td(SPCH-SIMO)M  
td(SPCL-SIMO)M  
tv(SPCL-SIMO)M  
tv(SPCH-SIMO)M  
tsu(SOMI-SPCL)M  
tsu(SOMI-SPCH)M  
tv(SPCL-SOMI)M  
tv(SPCH-SOMI)M  
Delay time, SPICLK high to SPISIMO  
valid (clock polarity = 0)  
Delay time, SPICLK low to SPISIMO  
valid (clock polarity = 1)  
10  
10  
Valid time, SPISIMO data valid after  
SPICLK low (clock polarity = 0)  
0.5tc(SPC)M – 10  
0.5tc(SPC)M – 10  
26  
0.5tc(SPC)M + 0.5tc(LCO) – 10  
0.5tc(SPC)M + 0.5tc(LCO) – 10  
26  
Valid time, SPISIMO data valid after  
SPICLK high (clock polarity = 1)  
Setup time, SPISOMI before SPICLK  
low (clock polarity = 0)  
Setup time, SPISOMI before SPICLK  
high (clock polarity = 1)  
26  
26  
Valid time, SPISOMI data valid after  
SPICLK low (clock polarity = 0)  
0.25tc(SPC)M – 10  
0.25tc(SPC)M – 10  
0.5tc(SPC)M – 0.5tc(LCO) – 10  
0.5tc(SPC)M – 0.5tc(LCO) – 10  
Valid time, SPISOMI data valid after  
SPICLK high (clock polarity = 1)  
(1) The MASTER/SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is cleared.  
(2) tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR +1)  
(3) tc(LCO) = LSPCLK cycle time  
(4) Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:  
Master mode transmit 20-MHz MAX, master mode receive 10-MHz MAX  
Slave mode transmit 10-MHz MAX, slave mode receive 10-MHz MAX.  
(5) The active edge of the SPICLK signal referenced is controlled by the clock polarity bit (SPICCR.6).  
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1
SPICLK  
(clock polarity = 0)  
2
3
SPICLK  
(clock polarity = 1)  
4
5
SPISIMO  
Master Out Data Is Valid  
8
9
Master In Data  
Must Be Valid  
SPISOMI  
SPISTE(A)  
A. In the master mode, SPISTE goes active 0.5tc(SPC) (minimum) before valid SPI clock edge. On the trailing end of the word, the SPISTE will go inactive 0.5tc(SPC) after  
the receiving edge (SPICLK) of the last data bit, except that SPISTE stays active between back-to-back transmit words in both FIFO and non-FIFO modes.  
Figure 5-27. SPI Master Mode External Timing (Clock Phase = 0)  
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Table 5-30. SPI Master Mode External Timing (Clock Phase = 1)(1)(2)(3)(4)(5)  
SPI WHEN (SPIBRR + 1) IS EVEN  
OR SPIBRR = 0 OR 2  
SPI WHEN (SPIBRR + 1) IS ODD  
AND SPIBRR > 3  
NO.  
UNIT  
MIN  
4tc(LCO)  
MAX  
MIN  
MAX  
1
2
tc(SPC)M  
Cycle time, SPICLK  
128tc(LCO)  
0.5tc(SPC)M  
5tc(LCO)  
127tc(LCO)  
ns  
ns  
tw(SPCH)M  
Pulse duration, SPICLK high  
(clock polarity = 0)  
0.5tc(SPC)M – 10  
0.5tc(SPC)M – 0.5tc (LCO) – 10  
0.5tc(SPC)M – 0.5tc (LCO) – 10  
0.5tc(SPC)M + 0.5tc(LCO) – 10  
0.5tc(SPC)M + 0.5tc(LCO) – 10  
0.5tc(SPC)M – 10  
0.5tc(SPC)M – 0.5tc(LCO)  
0.5tc(SPC)M – 0.5tc(LCO  
0.5tc(SPC)M + 0.5tc(LCO)  
0.5tc(SPC)M + 0.5tc(LCO)  
tw(SPCL))M  
Pulse duration, SPICLK low  
(clock polarity = 1)  
0.5tc(SPC)M – 10  
0.5tc(SPC)M – 10  
0.5tc(SPC)M – 10  
0.5tc(SPC)M – 10  
0.5tc(SPC)M  
0.5tc(SPC)M  
0.5tc(SPC)M  
3
6
tw(SPCL)M  
Pulse duration, SPICLK low  
(clock polarity = 0)  
ns  
ns  
tw(SPCH)M  
Pulse duration, SPICLK high  
(clock polarity = 1)  
tsu(SIMO-SPCH)M  
Setup time, SPISIMO data valid  
before SPICLK high  
(clock polarity = 0)  
tsu(SIMO-SPCL)M  
Setup time, SPISIMO data valid  
before SPICLK low  
0.5tc(SPC)M – 10  
0.5tc(SPC)M – 10  
(clock polarity = 1)  
7
tv(SPCH-SIMO)M  
tv(SPCL-SIMO)M  
tsu(SOMI-SPCH)M  
tsu(SOMI-SPCL)M  
tv(SPCH-SOMI)M  
tv(SPCL-SOMI)M  
Valid time, SPISIMO data valid after  
SPICLK high (clock polarity = 0)  
0.5tc(SPC)M – 10  
0.5tc(SPC)M – 10  
26  
0.5tc(SPC)M – 10  
0.5tc(SPC)M – 10  
26  
ns  
ns  
ns  
Valid time, SPISIMO data valid after  
SPICLK low (clock polarity = 1)  
10  
11  
Setup time, SPISOMI before  
SPICLK high (clock polarity = 0)  
Setup time, SPISOMI before  
SPICLK low (clock polarity = 1)  
26  
26  
Valid time, SPISOMI data valid after  
SPICLK high (clock polarity = 0)  
0.25tc(SPC)M – 10  
0.25tc(SPC)M – 10  
0.5tc(SPC)M – 10  
0.5tc(SPC)M – 10  
Valid time, SPISOMI data valid after  
SPICLK low (clock polarity = 1)  
(1) The MASTER/SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is set.  
(2) tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1)  
(3) Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:  
Master mode transmit 20-MHz MAX, master mode receive 10-MHz MAX  
Slave mode transmit 10-MHz MAX, slave mode receive 10-MHz MAX.  
(4) tc(LCO) = LSPCLK cycle time  
(5) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
1
SPICLK  
(clock polarity = 0)  
2
3
SPICLK  
(clock polarity = 1)  
6
7
Master out data Is valid  
10  
SPISIMO  
SPISOMI  
Data Valid  
11  
Master in data  
must be valid  
(A)  
SPISTE  
A. In the master mode, SPISTE goes active 0.5tc(SPC) (minimum) before valid SPI clock edge. On the trailing end of the word, the SPISTE will go inactive 0.5tc(SPC) after  
the receiving edge (SPICLK) of the last data bit, except that SPISTE stays active between back-to-back transmit words in both FIFO and non-FIFO modes.  
Figure 5-28. SPI Master Mode External Timing (Clock Phase = 1)  
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5.12.2 Serial Peripheral Interface (SPI) Slave Mode Electrical Data/Timing  
Table 5-31 lists the slave mode external timing (clock phase = 0) and Table 5-32 lists the slave mode  
external timing (clock phase = 1). Figure 5-29 and Figure 5-30 show the timing waveforms.  
Table 5-31. SPI Slave Mode External Timing (Clock Phase = 0)(1)(2)(3)(4)(5)  
NO.  
MIN  
MAX UNIT  
12 tc(SPC)S  
13 tw(SPCH)S  
tw(SPCL)S  
Cycle time, SPICLK  
4tc(LCO)  
ns  
Pulse duration, SPICLK high (clock polarity = 0)  
0.5tc(SPC)S – 10 0.5tc(SPC)S  
ns  
ns  
ns  
ns  
ns  
ns  
Pulse duration, SPICLK low (clock polarity = 1)  
0.5tc(SPC)S – 10 0.5tc(SPC)S  
14 tw(SPCL)S  
tw(SPCH)S  
Pulse duration, SPICLK low (clock polarity = 0)  
0.5tc(SPC)S – 10 0.5tc(SPC)S  
Pulse duration, SPICLK high (clock polarity = 1)  
0.5tc(SPC)S – 10 0.5tc(SPC)S  
15 td(SPCH-SOMI)S  
td(SPCL-SOMI)S  
16 tv(SPCL-SOMI)S  
tv(SPCH-SOMI)S  
19 tsu(SIMO-SPCL)S  
tsu(SIMO-SPCH)S  
20 tv(SPCL-SIMO)S  
tv(SPCH-SIMO)S  
Delay time, SPICLK high to SPISOMI valid (clock polarity = 0)  
Delay time, SPICLK low to SPISOMI valid (clock polarity = 1)  
Valid time, SPISOMI data valid after SPICLK low (clock polarity = 0)  
Valid time, SPISOMI data valid after SPICLK high (clock polarity = 1)  
Setup time, SPISIMO before SPICLK low (clock polarity = 0)  
Setup time, SPISIMO before SPICLK high (clock polarity = 1)  
Valid time, SPISIMO data valid after SPICLK low (clock polarity = 0)  
Valid time, SPISIMO data valid after SPICLK high (clock polarity = 1)  
21  
21  
0.75tc(SPC)S  
0.75tc(SPC)S  
26  
26  
0.5tc(SPC)S – 10  
0.5tc(SPC)S – 10  
(1) The MASTER/SLAVE bit (SPICTL.2) is cleared and the CLOCK PHASE bit (SPICTL.3) is cleared.  
(2) tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1)  
(3) Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:  
Master mode transmit 20-MHz MAX, master mode receive 10-MHz MAX  
Slave mode transmit 10-MHz MAX, slave mode receive 10-MHz MAX.  
(4) tc(LCO) = LSPCLK cycle time  
(5) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).  
12  
SPICLK  
(clock polarity = 0)  
13  
14  
SPICLK  
(clock polarity = 1)  
15  
16  
SPISOMI data Is valid  
19  
SPISOMI  
SPISIMO  
20  
SPISIMO data  
must be valid  
(A)  
SPISTE  
A. In the slave mode, the SPISTE signal should be asserted low at least 0.5tc(SPC) (minimum) before the valid SPI clock  
edge and remain low for at least 0.5tc(SPC) after the receiving edge (SPICLK) of the last data bit.  
Figure 5-29. SPI Slave Mode External Timing (Clock Phase = 0)  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Table 5-32. SPI Slave Mode External Timing (Clock Phase = 1)(1)(2)(3)(4)(5)  
NO.  
MIN  
8tc(LCO)  
MAX UNIT  
12 tc(SPC)S  
13 tw(SPCH)S  
tw(SPCL)S  
Cycle time, SPICLK  
ns  
Pulse duration, SPICLK high (clock polarity = 0)  
Pulse duration, SPICLK low (clock polarity = 1)  
Pulse duration, SPICLK low (clock polarity = 0)  
Pulse duration, SPICLK high (clock polarity = 1)  
Setup time, SPISOMI before SPICLK high (clock polarity = 0)  
Setup time, SPISOMI before SPICLK low (clock polarity = 1)  
0.5tc(SPC)S – 10  
0.5tc(SPC)S – 10  
0.5tc(SPC)S – 10  
0.5tc(SPC)S – 10  
0.125tc(SPC)S  
0.5tc(SPC)S  
ns  
ns  
ns  
ns  
0.5tc(SPC) S  
0.5tc(SPC) S  
0.5tc(SPC)S  
14 tw(SPCL)S  
tw(SPCH)S  
17 tsu(SOMI-SPCH)S  
tsu(SOMI-SPCL)S  
18 tv(SPCL-SOMI)S  
0.125tc(SPC)S  
Valid time, SPISOMI data valid after SPICLK low  
(clock polarity = 1)  
0.75tc(SPC)S  
tv(SPCH-SOMI)S  
Valid time, SPISOMI data valid after SPICLK high  
(clock polarity = 0)  
0.75tc(SPC) S  
21 tsu(SIMO-SPCH)S  
tsu(SIMO-SPCL)S  
Setup time, SPISIMO before SPICLK high (clock polarity = 0)  
Setup time, SPISIMO before SPICLK low (clock polarity = 1)  
26  
26  
ns  
ns  
22 tv(SPCH-SIMO)S  
Valid time, SPISIMO data valid after SPICLK high  
(clock polarity = 0)  
0.5tc(SPC)S – 10  
tv(SPCL-SIMO)S  
Valid time, SPISIMO data valid after SPICLK low  
(clock polarity = 1)  
0.5tc(SPC)S – 10  
(1) The MASTER/SLAVE bit (SPICTL.2) is cleared and the CLOCK PHASE bit (SPICTL.3) is cleared.  
(2) tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1)  
(3) tc(LCO) = LSPCLK cycle time  
(4) Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:  
Master mode transmit 20-MHz MAX, master mode receive 10-MHz MAX  
Slave mode transmit 10-MHz MAX, slave mode receive 10-MHz MAX.  
(5) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).  
12  
SPICLK  
(clock polarity = 0)  
13  
14  
SPICLK  
(clock polarity = 1)  
17  
18  
SPISOMI data is valid  
SPISOMI  
SPISIMO  
Data Valid  
21  
22  
SPISIMO data  
must be valid  
(A)  
SPISTE  
A. In the slave mode, the SPISTE signal should be asserted low at least 0.5tc(SPC) before the valid SPI clock edge and  
remain low for at least 0.5tc(SPC) after the receiving edge (SPICLK) of the last data bit.  
Figure 5-30. SPI Slave Mode External Timing (Clock Phase = 1)  
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5.13 Serial Communications Interface (SCI) Module  
The devices include two serial communications interface (SCI) modules (SCI-A, SCI-B). The SCI module  
supports digital communications between the CPU and other asynchronous peripherals that use the  
standard non-return-to-zero (NRZ) format. The SCI receiver and transmitter are double-buffered, and each  
has its own separate enable and interrupt bits. Both can be operated independently or simultaneously in  
the full-duplex mode. To ensure data integrity, the SCI checks received data for break detection, parity,  
overrun, and framing errors. The bit rate is programmable to over 65000 different speeds through a 16-bit  
baud-select register.  
Features of each SCI module include:  
Two external pins:  
SCITXD: SCI transmit-output pin  
SCIRXD: SCI receive-input pin  
NOTE: Both pins can be used as GPIO if not used for SCI.  
Baud rate programmable to 64K different rates:  
LSPCLK  
Baud rate =  
when BRR ¹ 0  
(BRR + 1) * 8  
LSPCLK  
16  
Baud rate =  
when BRR = 0  
Data-word format  
One start bit  
Data-word length programmable from one to eight bits  
Optional even/odd/no parity bit  
One or two stop bits  
Four error-detection flags: parity, overrun, framing, and break detection  
Two wake-up multiprocessor modes: idle-line and address bit  
Half- or full-duplex operation  
Double-buffered receive and transmit functions  
Transmitter and receiver operations can be accomplished through interrupt-driven or polled algorithms  
with status flags.  
Transmitter: TXRDY flag (transmitter-buffer register is ready to receive another character) and TX  
EMPTY flag (transmitter-shift register is empty)  
Receiver: RXRDY flag (receiver-buffer register is ready to receive another character), BRKDT flag  
(break condition occurred), and RX ERROR flag (monitoring four interrupt conditions)  
Separate enable bits for transmitter and receiver interrupts (except BRKDT)  
NRZ (non-return-to-zero) format  
NOTE  
All registers in this module are 8-bit registers that are connected to Peripheral Frame 2.  
When a register is accessed, the register data is in the lower byte (7–0), and the upper byte  
(15–8) is read as zeros. Writing to the upper byte has no effect.  
Enhanced features:  
Auto baud-detect hardware logic  
4-level transmit/receive FIFO  
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The SCI port operation is configured and controlled by the registers listed in Table 5-33 and Table 5-34.  
Table 5-33. SCI-A Registers(1)  
EALLOW  
PROTECTED  
NAME  
SCICCRA  
ADDRESS  
SIZE (x16)  
DESCRIPTION  
0x7050  
0x7051  
0x7052  
0x7053  
0x7054  
0x7055  
0x7056  
0x7057  
0x7059  
0x705A  
0x705B  
0x705C  
0x705F  
1
1
1
1
1
1
1
1
1
1
1
1
1
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
SCI-A Communications Control Register  
SCI-A Control Register 1  
SCICTL1A  
SCIHBAUDA  
SCILBAUDA  
SCICTL2A  
SCI-A Baud Register, High Bits  
SCI-A Baud Register, Low Bits  
SCI-A Control Register 2  
SCIRXSTA  
SCIRXEMUA  
SCIRXBUFA  
SCITXBUFA  
SCIFFTXA(2)  
SCIFFRXA(2)  
SCIFFCTA(2)  
SCIPRIA  
SCI-A Receive Status Register  
SCI-A Receive Emulation Data Buffer Register  
SCI-A Receive Data Buffer Register  
SCI-A Transmit Data Buffer Register  
SCI-A FIFO Transmit Register  
SCI-A FIFO Receive Register  
SCI-A FIFO Control Register  
SCI-A Priority Control Register  
(1) Registers in this table are mapped to Peripheral Frame 2 space. This space only allows 16-bit accesses. 32-bit accesses produce  
undefined results.  
(2) These registers are new registers for the FIFO mode.  
Table 5-34. SCI-B Registers(1)  
NAME  
SCICCRB  
ADDRESS  
0x7750  
0x7751  
0x7752  
0x7753  
0x7754  
0x7755  
0x7756  
0x7757  
0x7759  
0x775A  
0x775B  
0x775C  
0x775F  
SIZE (x16)  
DESCRIPTION  
SCI-B Communications Control Register  
SCI-B Control Register 1  
1
1
1
1
1
1
1
1
1
1
1
1
1
SCICTL1B  
SCIHBAUDB  
SCILBAUDB  
SCICTL2B  
SCI-B Baud Register, High Bits  
SCI-B Baud Register, Low Bits  
SCI-B Control Register 2  
SCIRXSTB  
SCIRXEMUB  
SCIRXBUFB  
SCITXBUFB  
SCIFFTXB(2)  
SCIFFRXB(2)  
SCIFFCTB(2)  
SCIPRIB  
SCI-B Receive Status Register  
SCI-B Receive Emulation Data Buffer Register  
SCI-B Receive Data Buffer Register  
SCI-B Transmit Data Buffer Register  
SCI-B FIFO Transmit Register  
SCI-B FIFO Receive Register  
SCI-B FIFO Control Register  
SCI-B Priority Control Register  
(1) Registers in this table are mapped to Peripheral Frame 2 space. This space only allows 16-bit accesses. 32-bit accesses produce  
undefined results.  
(2) These registers are new registers for the FIFO mode.  
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Figure 5-31 shows the SCI module block diagram.  
SCICTL1.1  
SCITXD  
Frame Format and Mode  
SCITXD  
TXSHF  
TXENA  
Register  
Parity  
Even/Odd Enable  
TX EMPTY  
SCICTL2.6  
8
SCICCR.6 SCICCR.5  
TXRDY  
TX INT ENA  
SCICTL2.0  
Transmitter-Data  
Buffer Register  
SCICTL2.7  
TXWAKE  
SCICTL1.3  
1
8
TX FIFO _0  
TX FIFO  
Interrupts  
TXINT  
TX Interrupt  
Logic  
TX FIFO _1  
-----  
To CPU  
TX FIFO _3  
SCI TX Interrupt select logic  
SCITXBUF.7-0  
WUT  
TX FIFO registers  
SCIFFENA  
AutoBaud Detect logic  
SCIFFTX.14  
SCIHBAUD. 15 - 8  
SCIRXD  
RXSHF  
Register  
Baud Rate  
MSbyte  
Register  
SCIRXD  
RXWAKE  
LSPCLK  
SCIRXST.1  
SCILBAUD. 7 - 0  
RXENA  
SCICTL1.0  
8
Baud Rate  
LSbyte  
Register  
SCICTL2.1  
Receive Data  
Buffer register  
SCIRXBUF.7-0  
RXRDY  
RX/BK INT ENA  
SCIRXST.6  
8
RX FIFO _3  
BRKDT  
SCIRXST.5  
-----  
RX FIFO  
Interrupts  
RX FIFO_1  
RX FIFO _0  
RXINT  
RX Interrupt  
Logic  
SCIRXBUF.7-0  
RX FIFO registers  
To CPU  
RXFFOVF  
SCIRXST.7 SCIRXST.4 - 2  
SCIFFRX.15  
RX Error  
FE OE PE  
RX Error  
RX ERR INT ENA  
SCICTL1.6  
SCI RX Interrupt select logic  
Figure 5-31. Serial Communications Interface (SCI) Module Block Diagram  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
5.14 Multichannel Buffered Serial Port (McBSP) Module  
The McBSP module has the following features:  
Compatible to McBSP in TMS320C54x™/ TMS320C55x™ DSP devices  
Full-duplex communication  
Double-buffered data registers that allow a continuous data stream  
Independent framing and clocking for receive and transmit  
External shift clock generation or an internal programmable frequency shift clock  
A wide selection of data sizes including 8-, 12-, 16-, 20-, 24-, or 32-bits  
8-bit data transfers with LSB or MSB first  
Programmable polarity for both frame synchronization and data clocks  
Highly programmable internal clock and frame generation  
Direct interface to industry-standard CODECs, Analog Interface Chips (AICs), and other serially  
connected analog-to-digital (A/D) and digital-to-analog (D/A) devices  
Works with SPI-compatible devices  
The following application interfaces can be supported on the McBSP:  
T1/E1 framers  
IOM-2 compliant devices  
AC97-compliant devices (the necessary multiphase frame synchronization capability is provided.)  
IIS-compliant devices  
SPI  
McBSP clock rate,  
CLKSRG  
1+ CLKGDV  
CLKG =  
(
)
where CLKSRG source could be LSPCLK, CLKX, or CLKR. Serial port performance is limited by I/O  
buffer switching speed. Internal prescalers must be adjusted such that the peripheral speed is less  
than the I/O buffer speed limit.  
NOTE  
See Section 5 for maximum I/O pin toggling speed.  
NOTE  
On the 80-pin package, only the clock-stop mode (SPI) of the McBSP is supported.  
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Figure 5-32 shows the block diagram of the McBSP module.  
TX  
Interrupt  
MXINT  
Peripheral Write Bus  
CPU  
TX Interrupt Logic  
To CPU  
16  
16  
McBSP Transmit  
Interrupt Select Logic  
DXR2 Transmit Buffer  
16  
DXR1 Transmit Buffer  
16  
LSPCLK  
MFSXx  
MCLKXx  
Compand Logic  
XSR2  
XSR1  
MDXx  
MDRx  
CPU  
DMA Bus  
RSR1  
16  
RSR2  
16  
MCLKRx  
Expand Logic  
MFSRx  
RBR2 Register  
16  
RBR1 Register  
16  
DRR2 Receive Buffer  
DRR1 Receive Buffer  
McBSP Receive  
16  
16  
Interrupt Select Logic  
RX  
Interrupt  
RX Interrupt Logic  
MRINT  
CPU  
Peripheral Read Bus  
To CPU  
Figure 5-32. McBSP Module  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Table 5-35 provides a summary of the McBSP registers.  
Table 5-35. McBSP Register Summary  
McBSP-A  
ADDRESS  
NAME  
TYPE  
RESET VALUE  
DESCRIPTION  
Data Registers, Receive, Transmit  
DRR2  
DRR1  
DXR2  
DXR1  
0x5000  
0x5001  
0x5002  
0x5003  
R
R
0x0000  
0x0000  
0x0000  
0x0000  
McBSP Data Receive Register 2  
McBSP Data Receive Register 1  
W
W
McBSP Data Transmit Register 2  
McBSP Data Transmit Register 1  
McBSP Control Registers  
SPCR2  
SPCR1  
RCR2  
0x5004  
0x5005  
0x5006  
0x5007  
0x5008  
0x5009  
0x500A  
0x500B  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
McBSP Serial Port Control Register 2  
McBSP Serial Port Control Register 1  
McBSP Receive Control Register 2  
McBSP Receive Control Register 1  
McBSP Transmit Control Register 2  
McBSP Transmit Control Register 1  
McBSP Sample Rate Generator Register 2  
McBSP Sample Rate Generator Register 1  
RCR1  
XCR2  
XCR1  
SRGR2  
SRGR1  
Multichannel Control Registers  
McBSP Multichannel Register 2  
MCR2  
0x500C  
0x500D  
0x500E  
0x500F  
0x5010  
0x5011  
0x5012  
0x5013  
0x5014  
0x5015  
0x5016  
0x5017  
0x5018  
0x5019  
0x501A  
0x501B  
0x501C  
0x501D  
0x501E  
0x5023  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
0x0000  
MCR1  
McBSP Multichannel Register 1  
RCERA  
RCERB  
XCERA  
XCERB  
PCR  
McBSP Receive Channel Enable Register Partition A  
McBSP Receive Channel Enable Register Partition B  
McBSP Transmit Channel Enable Register Partition A  
McBSP Transmit Channel Enable Register Partition B  
McBSP Pin Control Register  
RCERC  
RCERD  
XCERC  
XCERD  
RCERE  
RCERF  
XCERE  
XCERF  
RCERG  
RCERH  
XCERG  
XCERH  
MFFINT  
McBSP Receive Channel Enable Register Partition C  
McBSP Receive Channel Enable Register Partition D  
McBSP Transmit Channel Enable Register Partition C  
McBSP Transmit Channel Enable Register Partition D  
McBSP Receive Channel Enable Register Partition E  
McBSP Receive Channel Enable Register Partition F  
McBSP Transmit Channel Enable Register Partition E  
McBSP Transmit Channel Enable Register Partition F  
McBSP Receive Channel Enable Register Partition G  
McBSP Receive Channel Enable Register Partition H  
McBSP Transmit Channel Enable Register Partition G  
McBSP Transmit Channel Enable Register Partition H  
McBSP Interrupt Enable Register  
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5.14.1 Multichannel Buffered Serial Port (McBSP) Electrical Data/Timing  
5.14.1.1 McBSP Transmit and Receive Timing  
Table 5-36. McBSP Timing Requirements(1)(2)  
NO.  
MIN  
MAX  
20(3)(4)  
1
UNIT  
kHz  
MHz  
ns  
McBSP module clock (CLKG, CLKX, CLKR) range  
1
McBSP module cycle time (CLKG, CLKX, CLKR) range  
50(4)  
ms  
ns  
M11  
M12  
M13  
M14  
M15  
tc(CKRX)  
Cycle time, CLKR/X  
CLKR/X ext  
CLKR/X ext  
CLKR/X ext  
CLKR/X ext  
CLKR int  
CLKR ext  
CLKR int  
CLKR ext  
CLKR int  
CLKR ext  
CLKR int  
CLKR ext  
CLKX int  
2P  
tw(CKRX)  
tr(CKRX)  
Pulse duration, CLKR/X high or CLKR/X low  
Rise time, CLKR/X  
P – 7  
ns  
7
7
ns  
tf(CKRX)  
Fall time, CLKR/X  
ns  
tsu(FRH-CKRL)  
Setup time, external FSR high before CLKR low  
18  
2
ns  
M16  
M17  
M18  
M19  
M20  
th(CKRL-FRH)  
tsu(DRV-CKRL)  
th(CKRL-DRV)  
tsu(FXH-CKXL)  
th(CKXL-FXH)  
Hold time, external FSR high after CLKR low  
Setup time, DR valid before CLKR low  
Hold time, DR valid after CLKR low  
0
ns  
ns  
ns  
ns  
ns  
6
18  
2
0
6
Setup time, external FSX high before CLKX low  
Hold time, external FSX high after CLKX low  
18  
2
CLKX ext  
CLKX int  
0
CLKX ext  
6
(1) Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that  
signal are also inverted.  
(2) 2P = 1/CLKG in ns. CLKG is the output of sample rate generator mux. CLKG = CLKSRG/(1 + CLKGDV). CLKSRG can be LSPCLK,  
CLKX, CLKR as source. CLKSRG (SYSCLKOUT/2). McBSP performance is limited by I/O buffer switching speed.  
(3) Internal clock prescalers must be adjusted such that the McBSP clock (CLKG, CLKX, CLKR) speeds are not greater than the I/O buffer  
speed limit (20 MHz).  
(4) Maximum McBSP module clock frequency decreases to 10 MHz for internal CLKR.  
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Table 5-37. McBSP Switching Characteristics(1)(2)  
over recommended operating conditions (unless otherwise noted)  
NO.  
M1  
M2  
M3  
M4  
PARAMETER  
Cycle time, CLKR/X  
MIN  
MAX UNIT  
tc(CKRX)  
CLKR/X int  
CLKR/X int  
CLKR/X int  
CLKR int  
CLKR ext  
CLKX int  
CLKX ext  
CLKX int  
CLKX ext  
CLKX int  
CLKX ext  
CLKX int  
CLKX ext  
CLKX int  
CLKX ext  
2P  
D – 5(3)  
C – 5(3)  
ns  
tw(CKRXH)  
tw(CKRXL)  
td(CKRH-FRV)  
Pulse duration, CLKR/X high  
D + 5(3)  
C + 5(3)  
ns  
ns  
ns  
Pulse duration, CLKR/X low  
Delay time, CLKR high to internal FSR valid  
0
3
0
3
4
27  
M5  
M6  
M7  
td(CKXH-FXV)  
tdis(CKXH-DXHZ)  
td(CKXH-DXV)  
Delay time, CLKX high to internal FSX valid  
4
ns  
ns  
ns  
27  
Disable time, CLKX high to DX high impedance  
following last data bit  
8
14  
Delay time, CLKX high to DX valid.  
9
This applies to all bits except the first bit transmitted.  
28  
Delay time, CLKX high to DX valid  
DXENA = 0  
8
14  
Only applies to first bit transmitted when DXENA = 1  
in Data Delay 1 or 2 (XDATDLY=01b or  
10b) modes  
P + 8  
P + 14  
M8  
M9  
ten(CKXH-DX)  
Enable time, CLKX high to DX driven  
DXENA = 0  
CLKX int  
CLKX ext  
CLKX int  
CLKX ext  
0
6
ns  
Only applies to first bit transmitted when DXENA = 1  
in Data Delay 1 or 2 (XDATDLY=01b or  
10b) modes  
P
P + 6  
td(FXH-DXV)  
Delay time, FSX high to DX valid  
DXENA = 0  
FSX int  
FSX ext  
FSX int  
FSX ext  
FSX int  
FSX ext  
FSX int  
FSX ext  
8
14  
ns  
ns  
Only applies to first bit transmitted when DXENA = 1  
in Data Delay 0 (XDATDLY=00b) mode.  
P + 8  
P + 14  
M10 ten(FXH-DX)  
Enable time, FSX high to DX driven  
DXENA = 0  
0
6
Only applies to first bit transmitted when DXENA = 1  
in Data Delay 0 (XDATDLY=00b) mode  
P
P + 6  
(1) Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that  
signal are also inverted.  
(2) 2P = 1/CLKG in ns.  
(3) C = CLKRX low pulse width = P  
D = CLKRX high pulse width = P  
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M1, M11  
M2, M12  
M3, M12  
M13  
CLKR  
M4  
M4  
M14  
FSR (int)  
M15  
M16  
FSR (ext)  
M18  
M17  
DR  
Bit (n−1)  
M17  
(n−2)  
(n−3)  
(n−2)  
(n−4)  
(RDATDLY=00b)  
M18  
DR  
Bit (n−1)  
(n−3)  
(n−2)  
(RDATDLY=01b)  
M17  
M18  
DR  
Bit (n−1)  
(RDATDLY=10b)  
Figure 5-33. McBSP Receive Timing  
M1, M11  
M2, M12  
M13  
M14  
M3, M12  
CLKX  
FSX (int)  
FSX (ext)  
M5  
M5  
M19  
M20  
M9  
M7  
M10  
Bit 0  
DX  
Bit (n−1)  
(n−2)  
(n−3)  
(n−2)  
(n−4)  
(n−3)  
(n−2)  
(XDATDLY=00b)  
M7  
M8  
DX  
Bit (n−1)  
M8  
Bit 0  
M6  
(XDATDLY=01b)  
M7  
DX  
Bit 0  
Bit (n−1)  
(XDATDLY=10b)  
Figure 5-34. McBSP Transmit Timing  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
5.14.1.2 McBSP as SPI Master or Slave Timing  
Table 5-38. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)  
MASTER  
SLAVE  
MIN MAX  
NO.  
UNIT  
MIN  
30  
1
MAX  
M30 tsu(DRV-CKXL)  
M31 th(CKXL-DRV)  
M32 tsu(BFXL-CKXH)  
M33 tc(CKX)  
Setup time, DR valid before CLKX low  
Hold time, DR valid after CLKX low  
Setup time, FSX low before CLKX high  
Cycle time, CLKX  
8P – 10  
ns  
ns  
ns  
ns  
8P – 10  
8P + 10  
16P  
2P(1)  
(1) 2P = 1/CLKG  
Table 5-39. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)  
over recommended operating conditions (unless otherwise noted)  
MASTER  
SLAVE  
MIN  
NO.  
PARAMETER  
UNIT  
MIN  
2P(1)  
P
MAX  
MAX  
M24  
M25  
M28  
th(CKXL-FXL)  
td(FXL-CKXH)  
tdis(FXH-DXHZ)  
Hold time, FSX low after CLKX low  
Delay time, FSX low to CLKX high  
ns  
ns  
ns  
Disable time, DX high impedance following  
last data bit from FSX high  
6
6P + 6  
4P + 6  
M29  
td(FXL-DXV)  
Delay time, FSX low to DX valid  
6
ns  
(1) 2P = 1/CLKG  
For all SPI slave modes, CLKX must be a minimum of 8 CLKG cycles. Also CLKG should be LSPCLK/2  
by setting CLKSM = CLKGDV = 1. With maximum LSPCLK speed of 90 MHz, CLKX maximum frequency  
is LSPCLK/16 , that is 5.625 MHz and P = 11.11 ns.  
M33  
M32  
MSB  
LSB  
CLKX  
FSX  
M25  
M24  
M28  
M29  
DX  
DR  
Bit 0  
Bit(n-1)  
(n-2)  
(n-3)  
(n-4)  
M30  
M31  
(n-2)  
Bit 0  
Bit(n-1)  
(n-3)  
(n-4)  
Figure 5-35. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0  
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Table 5-40. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)  
MASTER  
SLAVE  
NO.  
UNIT  
MIN  
30  
1
MAX  
MIN MAX  
M39 tsu(DRV-CKXH)  
M40 th(CKXH-DRV)  
M41 tsu(FXL-CKXH)  
M42 tc(CKX)  
Setup time, DR valid before CLKX high  
Hold time, DR valid after CLKX high  
Setup time, FSX low before CLKX high  
Cycle time, CLKX  
8P – 10  
ns  
ns  
ns  
ns  
8P – 10  
16P + 10  
16P  
2P(1)  
(1) 2P = 1/CLKG  
Table 5-41. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)  
over recommended operating conditions (unless otherwise noted)  
MASTER  
MIN  
SLAVE  
MIN  
NO.  
PARAMETER  
UNIT  
MAX  
MAX  
M34  
M35  
M37  
th(CKXL-FXL)  
td(FXL-CKXH)  
tdis(CKXL-DXHZ)  
Hold time, FSX low after CLKX low  
Delay time, FSX low to CLKX high  
P
2P(1)  
ns  
ns  
ns  
Disable time, DX high impedance following last data bit  
from CLKX low  
P + 6  
7P + 6  
4P + 6  
M38  
td(FXL-DXV)  
Delay time, FSX low to DX valid  
6
ns  
(1) 2P = 1/CLKG  
For all SPI slave modes, CLKX must be a minimum of 8 CLKG cycles. Also, CLKG should be LSPCLK/2  
by setting CLKSM = CLKGDV = 1. With a maximum LSPCLK speed of 90 MHz, CLKX maximum  
frequency is LSPCLK/16; that is, 5.625 MHz and P = 11.11 ns.  
M42  
MSB  
LSB  
M41  
CLKX  
FSX  
DX  
M35  
M34  
M37  
M38  
Bit 0  
Bit(n-1)  
Bit(n-1)  
(n-2)  
(n-3)  
(n-4)  
M39  
M40  
(n-2)  
DR  
Bit 0  
(n-3)  
(n-4)  
Figure 5-36. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Table 5-42. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)  
MASTER  
SLAVE  
MIN MAX  
NO.  
UNIT  
MIN  
30  
1
MAX  
M49  
M50  
M51  
M52  
tsu(DRV-CKXH)  
th(CKXH-DRV)  
tsu(FXL-CKXL)  
tc(CKX)  
Setup time, DR valid before CLKX high  
Hold time, DR valid after CLKX high  
Setup time, FSX low before CLKX low  
Cycle time, CLKX  
8P – 10  
ns  
ns  
ns  
ns  
8P – 10  
8P + 10  
16P  
2P(1)  
(1) 2P = 1/CLKG  
Table 5-43. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)  
over recommended operating conditions (unless otherwise noted)  
MASTER  
SLAVE  
MIN MAX  
NO.  
PARAMETER  
UNIT  
MIN  
2P(1)  
P
MAX  
M43 th(CKXH-FXL)  
M44 td(FXL-CKXL)  
M47 tdis(FXH-DXHZ)  
Hold time, FSX low after CLKX high  
Delay time, FSX low to CLKX low  
ns  
ns  
ns  
Disable time, DX high impedance following last data bit from  
FSX high  
6
6P + 6  
4P + 6  
M48 td(FXL-DXV)  
(1) 2P = 1/CLKG  
Delay time, FSX low to DX valid  
6
ns  
For all SPI slave modes, CLKX must be a minimum of 8 CLKG cycles. Also, CLKG should be LSPCLK/2  
by setting CLKSM = CLKGDV = 1. With maximum LSPCLK speed of 90 MHz, CLKX maximum frequency  
is LSPCLK/16; that is, 5.625 MHz and P = 11.11 ns.  
M52  
M51  
MSB  
LSB  
CLKX  
FSX  
M43  
M44  
M48  
M47  
DX  
DR  
Bit 0  
Bit(n-1)  
Bit(n-1)  
(n-2)  
M50  
(n-3)  
(n-4)  
M49  
Bit 0  
(n-2)  
(n-3)  
(n-4)  
Figure 5-37. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1  
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Table 5-44. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)  
MASTER  
SLAVE  
MIN MAX  
NO.  
UNIT  
MIN  
30  
1
MAX  
M58 tsu(DRV-CKXL)  
M59 th(CKXL-DRV)  
M60 tsu(FXL-CKXL)  
M61 tc(CKX)  
Setup time, DR valid before CLKX low  
Hold time, DR valid after CLKX low  
Setup time, FSX low before CLKX low  
Cycle time, CLKX  
8P – 10  
ns  
ns  
ns  
ns  
8P – 10  
16P + 10  
16P  
2P(1)  
(1) 2P = 1/CLKG  
Table 5-45. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)(1)  
over recommended operating conditions (unless otherwise noted)  
MASTER  
MIN  
SLAVE  
MIN  
NO.  
PARAMETER  
UNIT  
MAX  
MAX  
M53  
M54  
M55  
M56  
th(CKXH-FXL)  
td(FXL-CKXL)  
td(CLKXH-DXV)  
tdis(CKXH-DXHZ)  
Hold time, FSX low after CLKX high  
Delay time, FSX low to CLKX low  
Delay time, CLKX high to DX valid  
P
2P(1)  
ns  
ns  
ns  
ns  
–2  
0
3P + 6  
7P + 6  
5P + 20  
Disable time, DX high impedance following last  
data bit from CLKX high  
P + 6  
M57  
td(FXL-DXV)  
Delay time, FSX low to DX valid  
6
4P + 6  
ns  
(1) 2P = 1/CLKG  
For all SPI slave modes, CLKX must be a minimum of 8 CLKG cycles. Also CLKG should be LSPCLK/2  
by setting CLKSM = CLKGDV = 1. With maximum LSPCLK speed of 90 MHz, CLKX maximum frequency  
is LSPCLK/16 , that is 5.625 MHz and P = 11.11 ns.  
M61  
M60  
MSB  
M54  
LSB  
CLKX  
FSX  
DX  
M53  
M56  
M55  
M57  
Bit 0  
Bit(n-1)  
(n-2)  
(n-3)  
(n-4)  
M58  
M59  
(n-2)  
DR  
Bit 0  
Bit(n-1)  
(n-3)  
(n-4)  
Figure 5-38. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
5.15 Enhanced Controller Area Network (eCAN) Module  
The CAN module (eCAN-A) has the following features:  
Fully compliant with CAN protocol, version 2.0B  
Supports data rates up to 1 Mbps  
Thirty-two mailboxes, each with the following properties:  
Configurable as receive or transmit  
Configurable with standard or extended identifier  
Has a programmable receive mask  
Supports data and remote frame  
Composed of 0 to 8 bytes of data  
Uses a 32-bit time stamp on receive and transmit message  
Protects against reception of new message  
Holds the dynamically programmable priority of transmit message  
Employs a programmable interrupt scheme with two interrupt levels  
Employs a programmable alarm on transmission or reception time-out  
Low-power mode  
Programmable wake-up on bus activity  
Automatic reply to a remote request message  
Automatic retransmission of a frame in case of loss of arbitration or error  
32-bit local network time counter synchronized by a specific message (communication in conjunction  
with mailbox 16)  
Self-test mode  
Operates in a loopback mode receiving its own message. A "dummy" acknowledge is provided,  
thereby eliminating the need for another node to provide the acknowledge bit.  
NOTE  
For a SYSCLKOUT of 90 MHz, the smallest bit rate possible is 6.25 kbps.  
The F2806x CAN has passed the conformance test per ISO/DIS 16845. Contact TI for test report and  
exceptions.  
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eCAN0INT  
eCAN1INT  
Controls Address  
Data  
32  
Enhanced CAN Controller  
Message Controller  
Mailbox RAM  
(512 Bytes)  
Memory Management  
Unit  
eCAN Memory  
(512 Bytes)  
Registers and  
CPU Interface,  
Receive Control Unit,  
Timer Management Unit  
32-Message Mailbox  
of 4 x 32-Bit Words  
Message Objects Control  
32  
32  
32  
eCAN Protocol Kernel  
Receive Buffer  
Transmit Buffer  
Control Buffer  
Status Buffer  
SN65HVD23x  
3.3-V CAN Transceiver  
CAN Bus  
Figure 5-39. eCAN Block Diagram and Interface Circuit  
Table 5-46. 3.3-V eCAN Transceivers  
SUPPLY  
VOLTAGE  
LOW-POWER  
MODE  
SLOPE  
CONTROL  
PART NUMBER  
VREF  
OTHER  
TA  
SN65HVD230  
SN65HVD230Q  
SN65HVD231  
SN65HVD231Q  
SN65HVD232  
SN65HVD232Q  
SN65HVD233  
SN65HVD234  
SN65HVD235  
ISO1050  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3–5.5 V  
Standby  
Standby  
Sleep  
Adjustable  
Adjustable  
Adjustable  
Adjustable  
None  
Yes  
Yes  
–40°C to 85°C  
–40°C to 125°C  
–40°C to 85°C  
–40°C to 125°C  
–40°C to 85°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–55°C to 105°C  
Yes  
Sleep  
Yes  
None  
None  
None  
None  
None  
None  
None  
None  
None  
Standby  
Standby and Sleep  
Standby  
None  
Adjustable  
Adjustable  
Adjustable  
None  
Diagnostic Loopback  
Autobaud Loopback  
Built-in Isolation  
Low Prop Delay  
Thermal Shutdown  
Failsafe Operation  
Dominant Time-Out  
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eCAN-A Control and Status Registers  
Mailbox Enable - CANME  
Mailbox Direction - CANMD  
Transmission Request Set - CANTRS  
Transmission Request Reset - CANTRR  
Transmission Acknowledge - CANTA  
eCAN-A Memory (512 Bytes)  
Abort Acknowledge - CANAA  
Received Message Pending - CANRMP  
Received Message Lost - CANRML  
Remote Frame Pending - CANRFP  
Global Acceptance Mask - CANGAM  
6000h  
Control and Status Registers  
603Fh  
6040h  
Local Acceptance Masks (LAM)  
(32 x 32-Bit RAM)  
607Fh  
6080h  
Master Control - CANMC  
Message Object Time Stamps (MOTS)  
(32 x 32-Bit RAM)  
Bit-Timing Configuration - CANBTC  
60BFh  
60C0h  
Error and Status - CANES  
Message Object Time-Out (MOTO)  
(32 x 32-Bit RAM)  
Transmit Error Counter - CANTEC  
Receive Error Counter - CANREC  
Global Interrupt Flag 0 - CANGIF0  
Global Interrupt Mask - CANGIM  
Global Interrupt Flag 1 - CANGIF1  
Mailbox Interrupt Mask - CANMIM  
Mailbox Interrupt Level - CANMIL  
60FFh  
eCAN-A Memory RAM (512 Bytes)  
6100h-6107h  
6108h-610Fh  
6110h-6117h  
6118h-611Fh  
6120h-6127h  
Mailbox 0  
Mailbox 1  
Mailbox 2  
Mailbox 3  
Mailbox 4  
Overwrite Protection Control - CANOPC  
TX I/O Control - CANTIOC  
RX I/O Control - CANRIOC  
Time Stamp Counter - CANTSC  
Time-Out Control - CANTOC  
Time-Out Status - CANTOS  
61E0h-61E7h  
61E8h-61EFh  
61F0h-61F7h  
61F8h-61FFh  
Mailbox 28  
Mailbox 29  
Mailbox 30  
Mailbox 31  
Reserved  
Message Mailbox (16 Bytes)  
Message Identifier - MSGID  
Message Control - MSGCTRL  
Message Data Low - MDL  
Message Data High - MDH  
61E8h-61E9h  
61EAh-61EBh  
61ECh-61EDh  
61EEh-61EFh  
Figure 5-40. eCAN-A Memory Map  
NOTE  
If the eCAN module is not used in an application, the RAM available (LAM, MOTS, MOTO,  
and mailbox RAM) can be used as general-purpose RAM. The CAN module clock should be  
enabled for this.  
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The CAN registers listed in Table 5-47 are used by the CPU to configure and control the CAN controller  
and the message objects. eCAN control registers only support 32-bit read/write operations. Mailbox RAM  
can be accessed as 16 bits or 32 bits. 32-bit accesses are aligned to an even boundary.  
Table 5-47. CAN Register Map(1)  
eCAN-A  
REGISTER NAME  
CANME  
SIZE (x32)  
DESCRIPTION  
ADDRESS  
0x6000  
0x6002  
0x6004  
0x6006  
0x6008  
0x600A  
0x600C  
0x600E  
0x6010  
0x6012  
0x6014  
0x6016  
0x6018  
0x601A  
0x601C  
0x601E  
0x6020  
0x6022  
0x6024  
0x6026  
0x6028  
0x602A  
0x602C  
0x602E  
0x6030  
0x6032  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Mailbox enable  
CANMD  
Mailbox direction  
CANTRS  
CANTRR  
CANTA  
Transmit request set  
Transmit request reset  
Transmission acknowledge  
Abort acknowledge  
Receive message pending  
Receive message lost  
Remote frame pending  
Global acceptance mask  
Master control  
CANAA  
CANRMP  
CANRML  
CANRFP  
CANGAM  
CANMC  
CANBTC  
CANES  
Bit-timing configuration  
Error and status  
CANTEC  
CANREC  
CANGIF0  
CANGIM  
CANGIF1  
CANMIM  
CANMIL  
CANOPC  
CANTIOC  
CANRIOC  
CANTSC  
CANTOC  
CANTOS  
Transmit error counter  
Receive error counter  
Global interrupt flag 0  
Global interrupt mask  
Global interrupt flag 1  
Mailbox interrupt mask  
Mailbox interrupt level  
Overwrite protection control  
TX I/O control  
RX I/O control  
Time stamp counter (Reserved in SCC mode)  
Time-out control (Reserved in SCC mode)  
Time-out status (Reserved in SCC mode)  
(1) These registers are mapped to Peripheral Frame 1.  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
5.16 Inter-Integrated Circuit (I2C)  
The device contains one I2C Serial Port. Figure 5-41 shows how the I2C peripheral module interfaces  
within the device.  
The I2C module has the following features:  
Compliance with the Philips Semiconductors I2C-bus specification (version 2.1):  
Support for 1-bit to 8-bit format transfers  
7-bit and 10-bit addressing modes  
General call  
START byte mode  
Support for multiple master-transmitters and slave-receivers  
Support for multiple slave-transmitters and master-receivers  
Combined master transmit/receive and receive/transmit mode  
Data transfer rate of from 10 kbps up to 400 kbps (I2C Fast-mode rate)  
One 4-word receive FIFO and one 4-word transmit FIFO  
One interrupt that can be used by the CPU. This interrupt can be generated as a result of one of the  
following conditions:  
Transmit-data ready  
Receive-data ready  
Register-access ready  
No-acknowledgment received  
Arbitration lost  
Stop condition detected  
Addressed as slave  
An additional interrupt that can be used by the CPU when in FIFO mode  
Module enable/disable capability  
Free data format mode  
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I2C Module  
I2CXSR  
I2CDXR  
TX FIFO  
RX FIFO  
FIFO Interrupt to  
CPU/PIE  
SDA  
Peripheral Bus  
I2CRSR  
I2CDRR  
Control/Status  
Registers  
CPU  
Clock  
Synchronizer  
SCL  
Prescaler  
Noise Filters  
Arbitrator  
Interrupt to  
CPU/PIE  
I2C INT  
A. The I2C registers are accessed at the SYSCLKOUT rate. The internal timing and signal waveforms of the I2C port are  
also at the SYSCLKOUT rate.  
B. The clock enable bit (I2CAENCLK) in the PCLKCRO register turns off the clock to the I2C port for low power  
operation. Upon reset, I2CAENCLK is clear, which indicates the peripheral internal clocks are off.  
Figure 5-41. I2C Peripheral Module Interfaces  
The registers in Table 5-48 configure and control the I2C port operation.  
Table 5-48. I2C-A Registers  
EALLOW  
PROTECTED  
NAME  
ADDRESS  
DESCRIPTION  
I2C own address register  
I2COAR  
I2CIER  
0x7900  
0x7901  
0x7902  
0x7903  
0x7904  
0x7905  
0x7906  
0x7907  
0x7908  
0x7909  
0x790A  
0x790C  
0x7920  
0x7921  
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
No  
I2C interrupt enable register  
I2C status register  
I2CSTR  
I2CCLKL  
I2CCLKH  
I2CCNT  
I2CDRR  
I2CSAR  
I2CDXR  
I2CMDR  
I2CISRC  
I2CPSC  
I2CFFTX  
I2CFFRX  
I2CRSR  
I2CXSR  
I2C clock low-time divider register  
I2C clock high-time divider register  
I2C data count register  
I2C data receive register  
I2C slave address register  
I2C data transmit register  
I2C mode register  
I2C interrupt source register  
I2C prescaler register  
I2C FIFO transmit register  
I2C FIFO receive register  
I2C receive shift register (not accessible to the CPU)  
I2C transmit shift register (not accessible to the CPU)  
124  
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TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
5.16.1 Inter-Integrated Circuit (I2C) Electrical Data/Timing  
Table 5-49. I2C Timing  
TEST CONDITIONS  
MIN  
MAX  
UNIT  
fSCL  
SCL clock frequency  
I2C clock module frequency is between  
7 MHz and 12 MHz and I2C prescaler and  
clock divider registers are configured  
appropriately  
400  
kHz  
vil  
Low level input voltage  
High level input voltage  
Input hysteresis  
0.3 VDDIO  
V
V
Vih  
0.7 VDDIO  
Vhys  
Vol  
0.05 VDDIO  
V
Low level output voltage  
Low period of SCL clock  
3 mA sink current  
0
0.4  
V
tLOW  
I2C clock module frequency is between  
7 MHz and 12 MHz and I2C prescaler and  
clock divider registers are configured  
appropriately  
1.3  
μs  
tHIGH  
High period of SCL clock  
I2C clock module frequency is between  
7 MHz and 12 MHz and I2C prescaler and  
clock divider registers are configured  
appropriately  
0.6  
μs  
lI  
Input current with an input voltage  
–10  
10  
μA  
between 0.1 VDDIO and 0.9 VDDIO MAX  
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TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
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5.17 Enhanced Pulse Width Modulator (ePWM) Modules (ePWM1–ePWM8)  
The devices contain up to eight enhanced PWM Modules (ePWM). Figure 5-42 shows a block diagram of  
multiple ePWM modules. Figure 5-43 shows the signal interconnections with the ePWM.  
Table 5-50 and Table 5-51 show the complete ePWM register set per module.  
EPWMSYNCI  
EPWM1SYNCI  
EPWM1B  
EPWM1TZINT  
EPWM1  
Module  
TZ1 to TZ3  
EPWM1INT  
EQEP1ERR(A)  
EPWM2TZINT  
TZ4  
PIE  
EPWM2INT  
CLOCKFAIL  
TZ5  
EPWMxTZINT  
EMUSTOP  
TZ6  
EPWMxINT  
EPWM1ENCLK  
TBCLKSYNC  
eCAPI  
EPWM1SYNCO  
EPWM2SYNCI  
EPWM1SYNCO  
TZ1 to TZ3  
COMPOUT1  
COMPOUT2  
EPWM2B  
EPWM2  
Module  
EQEP1ERR(A)  
CLOCKFAIL  
EMUSTOP  
COMP  
EPWM1A  
EPWM2A  
TZ4  
TZ5  
TZ6  
H
R
P
W
M
EPWM2ENCLK  
TBCLKSYNC  
EPWMxA  
G
P
I
EPWM2SYNCO  
O
M
U
X
SOCA1  
SOCB1  
SOCA2  
SOCB2  
SOCAx  
SOCBx  
ADC  
EPWMxB  
EPWMxSYNCI  
TZ1 to TZ3  
EPWMx  
Module  
EQEP1ERR(A)  
CLOCKFAIL  
EMUSTOP  
EQEP1ERR  
TZ4  
TZ5  
TZ6  
eQEP1  
EPWMxENCLK  
TBCLKSYNC  
System Control  
C28x CPU  
SOCA1  
SOCA2  
SPCAx  
ADCSOCAO  
ADCSOCBO  
Pulse Stretch  
(32 SYSCLKOUT Cycles, Active-Low Output)  
SOCB1  
SOCB2  
SPCBx  
Pulse Stretch  
(32 SYSCLKOUT Cycles, Active-Low Output)  
A. This signal exists only on devices with an eQEP1 module.  
Figure 5-42. ePWM  
126  
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TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
www.ti.com  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Table 5-50. ePWM1–ePWM4 Control and Status Registers  
SIZE (x16)/  
#SHADOW  
NAME  
ePWM1  
ePWM2  
ePWM3  
ePWM4  
DESCRIPTION  
Time Base Control Register  
TBCTL  
0x6800  
0x6801  
0x6802  
0x6803  
0x6804  
0x6805  
0x6806  
0x6807  
0x6808  
0x6809  
0x680A  
0x680B  
0x680C  
0x680D  
0x680E  
0x680F  
0x6810  
0x6811  
0x6812  
0x6813  
0x6814  
0x6815  
0x6816  
0x6817  
0x6818  
0x6819  
0x681A  
0x681B  
0x681C  
0x681D  
0x681E  
0x6820  
0x6840  
0x6841  
0x6842  
0x6843  
0x6844  
0x6845  
0x6846  
0x6847  
0x6848  
0x6849  
0x684A  
0x684B  
0x684C  
0x684D  
0x684E  
0x684F  
0x6850  
0x6851  
0x6852  
0x6853  
0x6854  
0x6855  
0x6856  
0x6857  
0x6858  
0x6859  
0x685A  
0x685B  
0x685C  
0x685D  
0x685E  
0x6860  
0x6880  
0x6881  
0x6882  
0x6883  
0x6884  
0x6885  
0x6886  
0x6887  
0x6888  
0x6889  
0x688A  
0x688B  
0x688C  
0x688D  
0x688E  
0x688F  
0x6890  
0x6891  
0x6892  
0x6893  
0x6894  
0x6895  
0x6896  
0x6897  
0x6898  
0x6899  
0x689A  
0x689B  
0x689C  
0x689D  
0x689E  
0x68A0  
0x68C0  
0x68C1  
0x68C2  
0x68C3  
0x68C4  
0x68C5  
0x68C6  
0x68C7  
0x68C8  
0x68C9  
0x68CA  
0x68CB  
0x68CC  
0x68CD  
0x68CE  
0x68CF  
0x68D0  
0x68D1  
0x68D2  
0x68D3  
0x68D4  
0x68D5  
0x68D6  
0x68D7  
0x68D8  
0x68D9  
0x68DA  
0x68DB  
0x68DC  
0x68DD  
0x68DE  
0x68E0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/1  
1/1  
1/0  
1/1  
1/1  
1/1  
1/0  
1/0  
1/0  
1/1  
1/1  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
TBSTS  
Time Base Status Register  
TBPHSHR  
TBPHS  
TBCTR  
TBPRD  
TBPRDHR  
CMPCTL  
CMPAHR  
CMPA  
Time Base Phase HRPWM Register  
Time Base Phase Register  
Time Base Counter Register  
Time Base Period Register Set  
Time Base Period High Resolution Register(1)  
Counter Compare Control Register  
Time Base Compare A HRPWM Register  
Counter Compare A Register Set  
CMPB  
Counter Compare B Register Set  
AQCTLA  
AQCTLB  
AQSFRC  
AQCSFRC  
DBCTL  
DBRED  
DBFED  
TZSEL  
Action Qualifier Control Register For Output A  
Action Qualifier Control Register For Output B  
Action Qualifier Software Force Register  
Action Qualifier Continuous S/W Force Register Set  
Dead-Band Generator Control Register  
Dead-Band Generator Rising Edge Delay Count Register  
Dead-Band Generator Falling Edge Delay Count Register  
Trip Zone Select Register(1)  
TZDCSEL  
TZCTL  
Trip Zone Digital Compare Register  
Trip Zone Control Register(1)  
Trip Zone Enable Interrupt Register(1)  
TZEINT  
TZFLG  
(1)  
Trip Zone Flag Register  
TZCLR  
Trip Zone Clear Register(1)  
TZFRC  
ETSEL  
Trip Zone Force Register(1)  
Event Trigger Selection Register  
Event Trigger Prescale Register  
Event Trigger Flag Register  
Event Trigger Clear Register  
Event Trigger Force Register  
PWM Chopper Control Register  
HRPWM Configuration Register(1)  
ETPS  
ETFLG  
ETCLR  
ETFRC  
PCCTL  
HRCNFG  
(1) Registers that are EALLOW protected.  
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TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
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Table 5-50. ePWM1–ePWM4 Control and Status Registers (continued)  
SIZE (x16)/  
#SHADOW  
NAME  
HRMSTEP  
ePWM1  
ePWM2  
ePWM3  
ePWM4  
DESCRIPTION  
0x6826  
0x6828  
0x682A  
0x682B  
0x682C  
0x682D  
0x6830  
0x6831  
0x6832  
0x6833  
0x6834  
0x6835  
0x6836  
0x6837  
0x6838  
0x6839  
-
-
-
1/0  
1/0  
HRPWM MEP Step Register  
HRPCTL  
0x6868  
0x686A  
0x686B  
0x686C  
0x686D  
0x6870  
0x6871  
0x6872  
0x6873  
0x6874  
0x6875  
0x6876  
0x6877  
0x6878  
0x6879  
0x68A8  
0x68AA  
0x68AB  
0x68AC  
0x68AD  
0x68B0  
0x68B1  
0x68B2  
0x68B3  
0x68B4  
0x68B5  
0x68B6  
0x68B7  
0x68B8  
0x68B9  
0x68E8  
0x68EA  
0x68EB  
0x68EC  
0x68ED  
0x68F0  
0x68F1  
0x68F2  
0x68F3  
0x68F4  
0x68F5  
0x68F6  
0x68F7  
0x68F8  
0x68F9  
High resolution Period Control Register(1)  
Time Base Period HRPWM Register Mirror  
Time Base Period Register Mirror  
Compare A HRPWM Register Mirror  
Compare A Register Mirror  
TBPRDHRM  
TBPRDM  
1/W(2)  
1/W(2)  
1/W(2)  
1/W(2)  
1/0  
CMPAHRM  
CMPAM  
(1)  
DCTRIPSEL  
DCACTL  
Digital Compare Trip Select Register  
1/0  
Digital Compare A Control Register(1)  
Digital Compare B Control Register(1)  
Digital Compare Filter Control Register(1)  
Digital Compare Capture Control Register(1)  
Digital Compare Filter Offset Register  
DCBCTL  
1/0  
DCFCTL  
1/0  
DCCAPCT  
DCFOFFSET  
DCFOFFSETCNT  
DCFWINDOW  
DCFWINDOWCNT  
DCCAP  
1/0  
1/1  
1/0  
Digital Compare Filter Offset Counter Register  
Digital Compare Filter Window Register  
Digital Compare Filter Window Counter Register  
Digital Compare Counter Capture Register  
1/0  
1/0  
1/1  
(2) W = Write to shadow register  
Table 5-51. ePWM5–ePWM8 Control and Status Registers  
SIZE (x16)/  
#SHADOW  
NAME  
ePWM5  
ePWM6  
ePWM7  
ePWM8  
DESCRIPTION  
Time Base Control Register  
TBCTL  
0x6900  
0x6901  
0x6902  
0x6903  
0x6904  
0x6905  
0x6906  
0x6907  
0x6908  
0x6909  
0x690A  
0x6940  
0x6941  
0x6942  
0x6943  
0x6944  
0x6945  
0x6946  
0x6947  
0x6948  
0x6949  
0x694A  
0x6980  
0x6981  
0x6982  
0x6983  
0x6984  
0x6985  
0x6986  
0x6987  
0x6988  
0x6989  
0x698A  
0x69C0  
0x69C1  
0x69C2  
0x69C3  
0x69C4  
0x69C5  
0x69C6  
0x69C7  
0x69C8  
0x69C9  
0x69CA  
1/0  
TBSTS  
1/0  
Time Base Status Register  
TBPHSHR  
TBPHS  
TBCTR  
TBPRD  
TBPRDHR  
CMPCTL  
CMPAHR  
CMPA  
1/0  
Time Base Phase HRPWM Register  
Time Base Phase Register  
1/0  
1/0  
Time Base Counter Register  
1/1  
Time Base Period Register Set  
Time Base Period High Resolution Register(1)  
Counter Compare Control Register  
Time Base Compare A HRPWM Register  
Counter Compare A Register Set  
Counter Compare B Register Set  
1/1  
1/0  
1/1  
1/1  
CMPB  
1/1  
(1) Registers that are EALLOW protected.  
128 Peripheral and Electrical Specifications  
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TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Table 5-51. ePWM5–ePWM8 Control and Status Registers (continued)  
SIZE (x16)/  
#SHADOW  
NAME  
ePWM5  
ePWM6  
ePWM7  
ePWM8  
DESCRIPTION  
AQCTLA  
AQCTLB  
AQSFRC  
AQCSFRC  
DBCTL  
0x690B  
0x690C  
0x690D  
0x690E  
0x690F  
0x6910  
0x6911  
0x6912  
0x6913  
0x6914  
0x6915  
0x6916  
0x6917  
0x6918  
0x6919  
0x691A  
0x691B  
0x691C  
0x691D  
0x691E  
0x6920  
-
0x694B  
0x694C  
0x694D  
0x694E  
0x694F  
0x6950  
0x6951  
0x6952  
0x6953  
0x6954  
0x6955  
0x6956  
0x6957  
0x6958  
0x6959  
0x695A  
0x695B  
0x695C  
0x695D  
0x695E  
0x6960  
-
0x698B  
0x698C  
0x698D  
0x698E  
0x698F  
0x6990  
0x6991  
0x6992  
0x6993  
0x6994  
0x6995  
0x6996  
0x6997  
0x6998  
0x6999  
0x699A  
0x699B  
0x699C  
0x699D  
0x699E  
0x69A0  
-
0x69CB  
0x69CC  
0x69CD  
0x69CE  
0x69CF  
0x69D0  
0x69D1  
0x69D2  
0x69D3  
0x69D4  
0x69D5  
0x69D6  
0x69D7  
0x69D8  
0x69D9  
0x69DA  
0x69DB  
0x69DC  
0x69DD  
0x69DE  
0x69E0  
-
1/0  
1/0  
Action Qualifier Control Register For Output A  
Action Qualifier Control Register For Output B  
Action Qualifier Software Force Register  
Action Qualifier Continuous S/W Force Register Set  
Dead-Band Generator Control Register  
Dead-Band Generator Rising Edge Delay Count Register  
Dead-Band Generator Falling Edge Delay Count Register  
Trip Zone Select Register(1)  
1/0  
1/1  
1/1  
DBRED  
1/0  
DBFED  
1/0  
TZSEL  
1/0  
TZDCSEL  
TZCTL  
1/0  
Trip Zone Digital Compare Register  
Trip Zone Control Register(1)  
Trip Zone Enable Interrupt Register(1)  
1/0  
TZEINT  
1/0  
(1)  
TZFLG  
1/0  
Trip Zone Flag Register  
TZCLR  
1/0  
Trip Zone Clear Register(1)  
Trip Zone Force Register(2)  
TZFRC  
1/0  
ETSEL  
1/0  
Event Trigger Selection Register  
Event Trigger Prescale Register  
Event Trigger Flag Register  
ETPS  
1/0  
ETFLG  
1/0  
ETCLR  
1/0  
Event Trigger Clear Register  
ETFRC  
1/0  
Event Trigger Force Register  
PCCTL  
1/0  
PWM Chopper Control Register  
HRPWM Configuration Register(2)  
HRPWM MEP Step Register  
High resolution Period Control Register(2)  
Time Base Period HRPWM Register Mirror  
Time Base Period Register Mirror  
Compare A HRPWM Register Mirror  
Compare A Register Mirror  
HRCNFG  
HRMSTEP  
HRPCTL  
TBPRDHRM  
TBPRDM  
CMPAHRM  
CMPAM  
DCTRIPSEL  
DCACTL  
DCBCTL  
DCFCTL  
1/0  
1/0  
0x6928  
0x692A  
0x692B  
0x692C  
0x692D  
0x6930  
0x6931  
0x6932  
0x6933  
0x6968  
0x696A  
0x696B  
0x696C  
0x696D  
0x6970  
0x6971  
0x6972  
0x6973  
0x69A8  
0x69AA  
0x69AB  
0x69AC  
0x69AD  
0x69B0  
0x69B1  
0x69B2  
0x69B3  
0x69E8  
0x69EA  
0x69EB  
0x69EC  
0x69ED  
0x69F0  
0x69F1  
0x69F2  
0x69F3  
1/0  
1/W(3)  
1/W(3)  
1/W(3)  
1/W(3)  
1/0  
(2)  
Digital Compare Trip Select Register  
1/0  
Digital Compare A Control Register(2)  
Digital Compare B Control Register(2)  
Digital Compare Filter Control Register(2)  
1/0  
1/0  
(2) Registers that are EALLOW protected.  
(3) W = Write to shadow register  
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Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065  
TMS320F28064 TMS320F28063 TMS320F28062  
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
www.ti.com  
Table 5-51. ePWM5–ePWM8 Control and Status Registers (continued)  
SIZE (x16)/  
#SHADOW  
NAME  
DCCAPCT  
ePWM5  
ePWM6  
ePWM7  
ePWM8  
DESCRIPTION  
0x6934  
0x6935  
0x6936  
0x6937  
0x6938  
0x6939  
0x6974  
0x6975  
0x6976  
0x6977  
0x6978  
0x6979  
0x69B4  
0x69B5  
0x69B6  
0x69B7  
0x69B8  
0x69B9  
0x69F4  
0x69F5  
0x69F6  
0x69F7  
0x69F8  
0x69F9  
1/0  
1/1  
1/0  
1/0  
1/0  
1/1  
Digital Compare Capture Control Register(2)  
Digital Compare Filter Offset Register  
DCFOFFSET  
DCFOFFSETCNT  
DCFWINDOW  
DCFWINDOWCNT  
DCCAP  
Digital Compare Filter Offset Counter Register  
Digital Compare Filter Window Register  
Digital Compare Filter Window Counter Register  
Digital Compare Counter Capture Register  
130  
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TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Time-Base (TB)  
CTR=ZERO  
Sync  
In/Out  
TBPRD Shadow (24)  
TBPRD Active (24)  
EPWMxSYNCO  
CTR=CMPB  
Disabled  
Select  
Mux  
TBPRDHR (8)  
8
CTR=PRD  
TBCTL[SYNCOSEL]  
TBCTL[PHSEN]  
EPWMxSYNCI  
DCAEVT1.sync  
DCBEVT1.sync  
Counter  
Up/Down  
(16 Bit)  
TBCTL[SWFSYNC]  
(Software Forced  
Sync)  
CTR=ZERO  
CTR_Dir  
TCBNT  
Active (16)  
CTR=PRD  
CTR=ZERO  
TBPHSHR (8)  
EPWMxINT  
CTR=PRD or ZERO  
CTR=CMPA  
Event  
Trigger  
and  
Interrupt  
(ET)  
16  
8
EPWMxSOCA  
Phase  
Control  
CTR=CMPB  
CTR_Dir  
(A)  
DCAEVT1.soc  
(A)  
TBPHS Active (24)  
EPWMxSOCB  
EPWMxSOCA  
ADC  
DCBEVT1.soc  
EPWMxSOCB  
Action  
Qualifier  
(AQ)  
CTR=CMPA  
CMPAHR (8)  
16  
High-resolution PWM (HRPWM)  
CMPA Active (24)  
CMPA Shadow (24)  
EPWMxA  
EPWMA  
EPWMB  
PWM  
Chopper  
(PC)  
Trip  
Zone  
(TZ)  
Dead  
Band  
(DB)  
CTR=CMPB  
16  
EPWMxB  
EPWMxTZINT  
TZ1 to TZ3  
EMUSTOP  
CMPB Active (16)  
CMPB Shadow (16)  
CLOCKFAIL  
(B)  
EQEP1ERR  
CTR=ZERO  
DCAEVT1.inter  
DCBEVT1.inter  
(A)  
(A)  
(A)  
(A)  
DCAEVT1.force  
DCAEVT2.force  
DCBEVT1.force  
DCBEVT2.force  
DCAEVT2.inter  
DCBEVT2.inter  
A. These events are generated by the Type 1 ePWM digital compare (DC) submodule based on the levels of the  
COMPxOUT and TZ signals.  
B. This signal exists only on devices with an eQEP1 module.  
Figure 5-43. ePWM Sub-Modules Showing Critical Internal Signal Interconnections  
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5.17.1 Enhanced Pulse Width Modulator (ePWM) Electrical Data/Timing  
PWM refers to PWM outputs on ePWM1–8. Table 5-52 shows the PWM timing requirements and Table 5-  
53, switching characteristics.  
Table 5-52. ePWM Timing Requirements(1)  
MIN  
2tc(SCO)  
MAX  
UNIT  
cycles  
cycles  
cycles  
tw(SYCIN)  
Sync input pulse width  
Asynchronous  
Synchronous  
2tc(SCO)  
With input qualifier  
1tc(SCO) + tw(IQSW)  
(1) For an explanation of the input qualifier parameters, see Table 5-69.  
Table 5-53. ePWM Switching Characteristics  
over recommended operating conditions (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
33.33  
MAX  
UNIT  
ns  
tw(PWM)  
Pulse duration, PWMx output high/low  
Sync output pulse width  
tw(SYNCOUT)  
td(PWM)tza  
8tc(SCO)  
cycles  
ns  
Delay time, trip input active to PWM forced high  
Delay time, trip input active to PWM forced low  
no pin load  
25  
20  
td(TZ-PWM)HZ  
Delay time, trip input active to PWM Hi-Z  
ns  
5.17.2 Trip-Zone Input Timing  
Table 5-54. Trip-Zone Input Timing Requirements(1)  
MIN  
2tc(TBCLK)  
MAX UNIT  
cycles  
tw(TZ)  
Pulse duration, TZx input low  
Asynchronous  
Synchronous  
2tc(TBCLK)  
cycles  
With input qualifier  
2tc(TBCLK) + tw(IQSW)  
cycles  
(1) For an explanation of the input qualifier parameters, see Table 5-69.  
SYSCLK  
tw(TZ)  
TZ(A)  
td(TZ-PWM)HZ  
PWM(B)  
A. TZ - TZ1, TZ2, TZ3, TZ4, TZ5, TZ6  
B. PWM refers to all the PWM pins in the device. The state of the PWM pins after TZ is taken high depends on the PWM  
recovery software.  
Figure 5-44. PWM Hi-Z Characteristics  
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5.18 High-Resolution PWM (HRPWM)  
This module combines multiple delay lines in a single module and a simplified calibration system by using  
a dedicated calibration delay line. For each ePWM module there is one HR delay line.  
The HRPWM module offers PWM resolution (time granularity) that is significantly better than what can be  
achieved using conventionally derived digital PWM methods. The key points for the HRPWM module are:  
Significantly extends the time resolution capabilities of conventionally derived digital PWM  
This capability can be utilized in both single edge (duty cycle and phase-shift control) as well as dual  
edge control for frequency/period modulation.  
Finer time granularity control or edge positioning is controlled via extensions to the Compare A and  
Phase registers of the ePWM module.  
HRPWM capabilities, when available on a particular device, are offered only on the A signal path of an  
ePWM module (that is, on the EPWMxA output). EPWMxB output has conventional PWM capabilities.  
NOTE  
The minimum SYSCLKOUT frequency allowed for HRPWM is 60 MHz.  
NOTE  
When dual-edge high-resolution is enabled (high-resolution period mode), the PWMxB  
channel will have ±1–2 TBCLK cycles of jitter on the output.  
5.18.1 High-Resolution PWM (HRPWM) Electrical Data/Timing  
Table 5-55 shows the high-resolution PWM switching characteristics.  
Table 5-55. High-Resolution PWM Characteristics(1)  
PARAMETER  
MIN  
TYP  
MAX UNIT  
310 ps  
Micro Edge Positioning (MEP) step size(2)  
150  
(1) The HRPWM operates at a minimum SYSCLKOUT frequency of 60 MHz.  
(2) Maximum MEP step size is based on worst-case process, maximum temperature and maximum voltage. MEP step size will increase  
with low voltage and high temperature and decrease with voltage and cold temperature.  
Applications that use the HRPWM feature should use MEP Scale Factor Optimizer (SFO) estimation software functions. See the TI  
software libraries for details of using SFO function in end applications. SFO functions help to estimate the number of MEP steps per  
SYSCLKOUT period dynamically while the HRPWM is in operation.  
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5.19 Enhanced Capture Module (eCAP1)  
The device contains an enhanced capture (eCAP) module. Figure 5-45 shows a functional block diagram  
of a module.  
CTRPHS  
(phase register−32 bit)  
APWM mode  
SYNCIn  
CTR_OVF  
OVF  
CTR [0−31]  
PRD [0−31]  
CMP [0−31]  
TSCTR  
(counter−32 bit)  
SYNCOut  
PWM  
compare  
logic  
Delta−mode  
RST  
32  
CTR=PRD  
CTR=CMP  
CTR [0−31]  
PRD [0−31]  
32  
eCAPx  
32  
LD1  
CAP1  
(APRD active)  
Polarity  
select  
LD  
APRD  
shadow  
32  
CMP [0−31]  
32  
32  
LD2  
CAP2  
(ACMP active)  
Polarity  
select  
LD  
Event  
qualifier  
Event  
Pre-scale  
32  
ACMP  
shadow  
Polarity  
select  
32  
32  
LD3  
LD4  
CAP3  
(APRD shadow)  
LD  
CAP4  
(ACMP shadow)  
Polarity  
select  
LD  
4
Capture events  
4
CEVT[1:4]  
Interrupt  
Trigger  
and  
Flag  
control  
Continuous /  
Oneshot  
Capture Control  
to PIE  
CTR_OVF  
CTR=PRD  
CTR=CMP  
Figure 5-45. eCAP Functional Block Diagram  
The eCAP module is clocked at the SYSCLKOUT rate.  
The clock enable bits (ECAP1 ENCLK) in the PCLKCR1 register turn off the eCAP module individually (for  
low-power operation). Upon reset, ECAP1ENCLK is set to low, indicating that the peripheral clock is off.  
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NAME  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Table 5-56. eCAP Control and Status Registers  
EALLOW  
PROTECTED  
eCAP1  
eCAP2  
eCAP3  
SIZE (x16)  
DESCRIPTION  
Time-Stamp Counter  
TSCTR  
CTRPHS  
CAP1  
0x6A00  
0x6A02  
0x6A04  
0x6A06  
0x6A08  
0x6A0A  
0x6A20  
0x6A22  
0x6A24  
0x6A26  
0x6A28  
0x6A2A  
0x6A40  
0x6A42  
0x6A44  
0x6A46  
0x6A48  
0x6A4A  
2
2
2
2
2
2
8
No  
No  
No  
No  
No  
No  
No  
Counter Phase Offset Value Register  
Capture 1 Register  
Capture 2 Register  
Capture 3 Register  
Capture 4 Register  
Reserved  
CAP2  
CAP3  
CAP4  
Reserved  
0x6A0C –  
0x6A12  
0x6A2C –  
0x6A32  
0x6A4C –  
0x6A52  
ECCTL1  
ECCTL2  
ECEINT  
ECFLG  
0x6A14  
0x6A15  
0x6A16  
0x6A17  
0x6A18  
0x6A19  
0x6A34  
0x6A35  
0x6A36  
0x6A37  
0x6A38  
0x6A39  
0x6A54  
0x6A55  
0x6A56  
0x6A57  
0x6A58  
0x6A59  
1
1
1
1
1
1
6
No  
No  
No  
No  
No  
No  
No  
Capture Control Register 1  
Capture Control Register 2  
Capture Interrupt Enable Register  
Capture Interrupt Flag Register  
Capture Interrupt Clear Register  
Capture Interrupt Force Register  
Reserved  
ECCLR  
ECFRC  
Reserved  
0x6A1A –  
0x6A1F  
0x6A3A –  
0x6A3F  
0x6A5A –  
0x6A5F  
5.19.1 Enhanced Capture (eCAP) Electrical Data/Timing  
Table 5-57 shows the eCAP timing requirement and Table 5-58 shows the eCAP switching characteristics.  
Table 5-57. Enhanced Capture (eCAP) Timing Requirement(1)  
MIN  
2tc(SCO)  
MAX UNIT  
cycles  
tw(CAP)  
Capture input pulse width  
Asynchronous  
Synchronous  
2tc(SCO)  
cycles  
With input qualifier  
1tc(SCO) + tw(IQSW)  
cycles  
(1) For an explanation of the input qualifier parameters, see Table 5-69.  
Table 5-58. eCAP Switching Characteristics  
over recommended operating conditions (unless otherwise noted)  
PARAMETER  
MIN  
MAX  
UNIT  
tw(APWM)  
Pulse duration, APWMx output high/low  
20  
ns  
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5.20 High-Resolution Capture Modules (HRCAP1–HRCAP4)  
The device contains up to four high-resolution capture (HRCAP) modules. The High-Resolution Capture  
(HRCAP) module measures the difference between external pulses with a typical resolution of 300 ps.  
Uses for the HRCAP include:  
Capactive touch applications  
High-resolution period and duty cycle measurements of pulse train cycles  
Instantaneous speed measurements  
Instantaneous frequency measurements  
Voltage measurements across an isolation boundary  
Distance measurement (sonar) and scanning  
The HRCAP module features include:  
Pulse width capture in either non-high-resolution or high-resolution modes  
Difference (Delta) mode pulse width capture  
Typical high-resolution capture on the order of 300 ps resolution on each edge  
Interrupt on either falling or rising edge  
Continuous mode capture of pulse widths in 2-deep buffer  
Calibration logic for precision high-resolution capture  
All of the above resources are dedicated to a single input pin  
HRCAP calibration software library supplied by TI is used for both calibration and calculating fractional  
pulse widths  
The HRCAP module includes one capture channel in addition to a high-resolution calibration block, which  
connects internally to ePWM8A HRPWM channel when calibrating.  
Each HRCAP channel has the following independent key resources:  
Dedicated input capture pin  
16-bit HRCAP clock which is either equal to the PLL2 output frequency (asynchronous to SYSCLK2) or  
equal to the SYSCLK2 frequency (synchronous to SYSCLK2)  
High-resolution pulse width capture in a 2-deep buffer  
HRCAP Calibration Logic  
EPWMx  
EPWMxA  
HRPWM  
HRCAPxENCLK  
SYSCLK2  
HRCAPx  
Module  
GPIO  
Mux  
PLL2CLK  
HRCAP Calibration Signal (Internal)  
PIE  
HRCAPxINTn  
HRCAPx  
Figure 5-46. HRCAP Functional Block Diagram  
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Table 5-59. HRCAP Registers  
SIZE  
(x16)  
NAME  
HRCAP1  
HRCAP2  
HRCAP3  
HRCAP4  
DESCRIPTION  
HCCTL  
0x6AC0  
0x6AC1  
0x6AC2  
0x6AC3  
0x6AC4  
0x6AE0  
0x6AE1  
0x6AE2  
0x6AE3  
0x6AE4  
0x6C80  
0x6C81  
0x6C82  
0x6C83  
0x6C84  
0x6CA0  
0x6CA1  
0x6CA2  
0x6CA3  
0x6CA4  
1
1
1
1
1
HRCAP Control Register(1)  
HCIFR  
HRCAP Interrupt Flag Register  
HRCAP Interrupt Clear Register  
HRCAP Interrupt Force Register  
HRCAP 16-bit Counter Register  
HCICLR  
HCIFRC  
HCCOUNTER  
HRCAP Capture Counter on  
Rising Edge 0 Register  
HCCAPCNTRISE0  
HCCAPCNTFALL0  
HCCAPCNTRISE1  
HCCAPCNTFALL1  
0x6AD0  
0x6AD2  
0x6AD8  
0x6ADA  
0x6AF0  
0x6AF2  
0x6AF8  
0x6AFA  
0x6C90  
0x6C92  
0x6C98  
0x6C9A  
0x6CB0  
0x6CB2  
0x6CB8  
0x6CBA  
1
1
1
1
HRCAP Capture Counter on  
Falling Edge 0 Register  
HRCAP Capture Counter on  
Rising Edge 1 Register  
HRCAP Capture Counter on  
Falling Edge 1 Register  
(1) Registers that are EALLOW-protected.  
5.20.1 High-Resolution Capture (HRCAP) Electrical Data/Timing  
Table 5-60. High-Resolution Capture (HRCAP) Timing Requirements  
MIN  
NOM  
MAX UNIT  
tc(HCCAPCLK)  
tw(HRCAP)  
Cycle time, HRCAP capture clock  
Pulse width, HRCAP capture  
HRCAP step size(2)  
8.333  
10.204  
ns  
ns  
ps  
(1)  
7tc(HCCAPCLK)  
300  
(1) The listed minimum pulse width does not take into account the limitation that all relevant HCCAP registers must be read and RISE/FALL  
event flags cleared within the pulse width to ensure valid capture data.  
(2) HRCAP step size will increase with low voltage and high temperature and decrease with high voltage and low temperature. Applications  
that use the HRCAP in high-resolution mode should use the HRCAP calibration functions to dynamically calibrate for varying operating  
conditions.  
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5.21 Enhanced Quadrature Encoder Modules (eQEP1, eQEP2)  
The device contains up to two enhanced quadrature encoder (eQEP) modules. Table 5-61 provides a  
summary of the eQEP registers.  
Table 5-61. eQEP Control and Status Registers  
eQEP1  
SIZE(x16)/  
#SHADOW  
eQEP1  
ADDRESS  
eQEP2  
ADDRESS  
NAME  
QPOSCNT  
REGISTER DESCRIPTION  
eQEP Position Counter  
0x6B00  
0x6B02  
0x6B04  
0x6B06  
0x6B08  
0x6B0A  
0x6B0C  
0x6B0E  
0x6B10  
0x6B12  
0x6B13  
0x6B14  
0x6B15  
0x6B16  
0x6B17  
0x6B18  
0x6B19  
0x6B1A  
0x6B1B  
0x6B1C  
0x6B1D  
0x6B1E  
0x6B1F  
0x6B20  
0x6B40  
0x6B42  
0x6B44  
0x6B46  
0x6B48  
0x6B4A  
0x6B4C  
0x6B4E  
0x6B50  
0x6B52  
0x6B53  
0x6B54  
0x6B55  
0x6B56  
0x6B57  
0x6B58  
0x6B59  
0x6B5A  
0x6B5B  
0x6B5C  
0x6B5D  
0x6B5E  
0x6B5F  
0x6B60  
2/0  
2/0  
2/0  
2/1  
2/0  
2/0  
2/0  
2/0  
2/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
31/0  
QPOSINIT  
QPOSMAX  
QPOSCMP  
QPOSILAT  
QPOSSLAT  
QPOSLAT  
QUTMR  
eQEP Initialization Position Count  
eQEP Maximum Position Count  
eQEP Position-compare  
eQEP Index Position Latch  
eQEP Strobe Position Latch  
eQEP Position Latch  
eQEP Unit Timer  
QUPRD  
eQEP Unit Period Register  
eQEP Watchdog Timer  
QWDTMR  
QWDPRD  
QDECCTL  
QEPCTL  
QCAPCTL  
QPOSCTL  
QEINT  
eQEP Watchdog Period Register  
eQEP Decoder Control Register  
eQEP Control Register  
eQEP Capture Control Register  
eQEP Position-compare Control Register  
eQEP Interrupt Enable Register  
eQEP Interrupt Flag Register  
eQEP Interrupt Clear Register  
eQEP Interrupt Force Register  
eQEP Status Register  
QFLG  
QCLR  
QFRC  
QEPSTS  
QCTMR  
eQEP Capture Timer  
QCPRD  
eQEP Capture Period Register  
eQEP Capture Timer Latch  
eQEP Capture Period Latch  
QCTMRLAT  
QCPRDLAT  
Reserved  
0x6B21 –  
0x6B3F  
0x6B61 –  
0x6B7F  
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Figure 5-47 shows the block diagram of the eQEP module.  
System Control  
Registers  
To CPU  
EQEPxENCLK  
SYSCLKOUT  
QCPRD  
QCTMR  
QCAPCTL  
16  
16  
16  
Quadrature  
Capture  
Unit  
QCTMRLAT  
QCPRDLAT  
(QCAP)  
QUTMR  
QUPRD  
QWDTMR  
QWDPRD  
Registers  
Used by  
Multiple Units  
32  
16  
QEPCTL  
QEPSTS  
QFLG  
UTOUT  
QWDOG  
UTIME  
QDECCTL  
16  
WDTOUT  
EQEPxAIN  
EQEPxBIN  
EQEPxIIN  
EQEPxA/XCLK  
EQEPxB/XDIR  
EQEPxI  
QCLK  
QDIR  
QI  
EQEPxINT  
16  
PIE  
Position Counter/  
Control Unit  
(PCCU)  
EQEPxIOUT  
EQEPxIOE  
EQEPxSIN  
EQEPxSOUT  
EQEPxSOE  
Quadrature  
Decoder  
(QDU)  
QS  
GPIO  
MUX  
QPOSLAT  
QPOSSLAT  
QPOSILAT  
PHE  
PCSOUT  
EQEPxS  
32  
32  
16  
QPOSCNT  
QPOSINIT  
QPOSMAX  
QEINT  
QFRC  
QPOSCMP  
QCLR  
QPOSCTL  
Enhanced QEP (eQEP) Peripheral  
Figure 5-47. eQEP Functional Block Diagram  
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5.21.1 Enhanced Quadrature Encoder (eQEP) Electrical Data/Timing  
Table 5-62 shows the eQEP timing requirement and Table 5-63 shows the eQEP switching  
characteristics.  
Table 5-62. Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements(1)  
MIN  
MAX  
UNIT  
cycles  
cycles  
cycles  
cycles  
cycles  
cycles  
cycles  
cycles  
cycles  
cycles  
tw(QEPP)  
QEP input period  
Asynchronous(2)/Synchronous  
With input qualifier  
2tc(SCO)  
2[1tc(SCO) + tw(IQSW)  
]
tw(INDEXH)  
tw(INDEXL)  
tw(STROBH)  
tw(STROBL)  
QEP Index Input High time  
QEP Index Input Low time  
QEP Strobe High time  
QEP Strobe Input Low time  
Asynchronous(2)/Synchronous  
2tc(SCO)  
2tc(SCO) +tw(IQSW)  
2tc(SCO)  
With input qualifier  
Asynchronous(2)/Synchronous  
With input qualifier  
Asynchronous(2)/Synchronous  
2tc(SCO) + tw(IQSW)  
2tc(SCO)  
2tc(SCO) + tw(IQSW)  
2tc(SCO)  
With input qualifier  
Asynchronous(2)/Synchronous  
With input qualifier  
2tc(SCO) +tw(IQSW)  
(1) For an explanation of the input qualifier parameters, see Table 5-69.  
(2) Refer to the TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063,  
TMS320F28062 Piccolo MCU Silicon Errata (literature number SPRZ342) for limitations in the asynchronous mode.  
Table 5-63. eQEP Switching Characteristics  
over recommended operating conditions (unless otherwise noted)  
PARAMETER  
MIN  
MAX  
4tc(SCO)  
6tc(SCO)  
UNIT  
cycles  
cycles  
td(CNTR)xin  
Delay time, external clock to counter increment  
Delay time, QEP input edge to position compare sync output  
td(PCS-OUT)QEP  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
5.22 JTAG Port  
On the 2806x device, the JTAG port is reduced to 5 pins (TRST, TCK, TDI, TMS, TDO). TCK, TDI, TMS  
and TDO pins are also GPIO pins. The TRST signal selects either JTAG or GPIO operating mode for the  
pins in Figure 5-48. During emulation/debug, the GPIO function of these pins are not available. If the  
GPIO38/TCK/XCLKIN pin is used to provide an external clock, an alternate clock source should be used  
to clock the device during emulation/debug since this pin will be needed for the TCK function.  
NOTE  
In 2806x devices, the JTAG pins may also be used as GPIO pins. Care should be taken in  
the board design to ensure that the circuitry connected to these pins do not affect the  
emulation capabilities of the JTAG pin function. Any circuitry connected to these pins should  
not prevent the emulator from driving (or being driven by) the JTAG pins for successful  
debug.  
TRST = 0: JTAG Disabled (GPIO Mode)  
TRST = 1: JTAG Mode  
TRST  
TRST  
XCLKIN  
GPIO38_in  
TCK  
TCK/GPIO38  
GPIO38_out  
C28x  
Core  
GPIO37_in  
TDO  
TDO/GPIO37  
1
0
GPIO37_out  
GPIO36_in  
1
0
TMS  
TMS/GPIO36  
TDI/GPIO35  
1
GPIO36_out  
GPIO35_in  
1
0
TDI  
1
GPIO35_out  
Figure 5-48. JTAG/GPIO Multiplexing  
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TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
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5.23 General-Purpose Input/Output (GPIO) MUX  
The GPIO MUX can multiplex up to three independent peripheral signals on a single GPIO pin in addition  
to providing individual pin bit-banging I/O capability.  
The device supports 45 GPIO pins. The GPIO control and data registers are mapped to Peripheral  
Frame 1 to enable 32-bit operations on the registers (along with 16-bit operations). Table 5-64 shows the  
GPIO register mapping.  
Table 5-64. GPIO Registers  
NAME  
ADDRESS  
GPIO CONTROL REGISTERS (EALLOW PROTECTED)  
0x6F80 GPIO A Control Register (GPIO0 to 31)  
SIZE (x16)  
DESCRIPTION  
GPACTRL  
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
GPAQSEL1  
GPAQSEL2  
GPAMUX1  
GPAMUX2  
GPADIR  
0x6F82  
0x6F84  
0x6F86  
0x6F88  
0x6F8A  
0x6F8C  
0x6F90  
0x6F92  
0x6F94  
0x6F96  
0x6F98  
0x6F9A  
0x6F9C  
0x6FB6  
0x6FBA  
GPIO A Qualifier Select 1 Register (GPIO0 to 15)  
GPIO A Qualifier Select 2 Register (GPIO16 to 31)  
GPIO A MUX 1 Register (GPIO0 to 15)  
GPIO A MUX 2 Register (GPIO16 to 31)  
GPIO A Direction Register (GPIO0 to 31)  
GPIO A Pull Up Disable Register (GPIO0 to 31)  
GPIO B Control Register (GPIO32 to 44)  
GPIO B Qualifier Select 1 Register (GPIO32 to 44)  
GPIO B Qualifier Select 2 Register  
GPAPUD  
GPBCTRL  
GPBQSEL1  
GPBQSEL2  
GPBMUX1  
GPBMUX2  
GPBDIR  
GPIO B MUX 1 Register (GPIO32 to 44)  
GPIO B MUX 2 Register (GPIO50 to 58)  
GPIO B Direction Register (GPIO32 to 44)  
GPIO B Pull Up Disable Register (GPIO32 to 44)  
Analog, I/O mux 1 register (AIO0 to AIO15)  
Analog, I/O Direction Register (AIO0 to AIO15)  
GPBPUD  
AIOMUX1  
AIODIR  
GPIO DATA REGISTERS (NOT EALLOW PROTECTED)  
GPADAT  
0x6FC0  
0x6FC2  
0x6FC4  
0x6FC6  
0x6FC8  
0x6FCA  
0x6FCC  
0x6FCE  
0x6FD8  
0x6FDA  
0x6FDC  
0x6FDE  
2
2
2
2
2
2
2
2
2
2
2
2
GPIO A Data Register (GPIO0 to 31)  
GPASET  
GPIO A Data Set Register (GPIO0 to 31)  
GPIO A Data Clear Register (GPIO0 to 31)  
GPIO A Data Toggle Register (GPIO0 to 31)  
GPIO B Data Register (GPIO32 to 44)  
GPACLEAR  
GPATOGGLE  
GPBDAT  
GPBSET  
GPIO B Data Set Register (GPIO32 to 44)  
GPIO B Data Clear Register (GPIO32 to 44)  
GPIO B Data Toggle Register (GPIO32 to 44)  
Analog I/O Data Register (AIO0 to AIO15)  
Analog I/O Data Set Register (AIO0 to AIO15)  
Analog I/O Data Clear Register (AIO0 to AIO15)  
Analog I/O Data Toggle Register (AIO0 to AIO15)  
GPBCLEAR  
GPBTOGGLE  
AIODAT  
AIOSET  
AIOCLEAR  
AIOTOGGLE  
GPIO INTERRUPT AND LOW POWER MODES SELECT REGISTERS (EALLOW PROTECTED)  
GPIOXINT1SEL  
GPIOXINT2SEL  
GPIOXINT3SEL  
GPIOLPMSEL  
0x6FE0  
0x6FE1  
0x6FE2  
0x6FE8  
1
1
1
2
XINT1 GPIO Input Select Register (GPIO0 to 31)  
XINT2 GPIO Input Select Register (GPIO0 to 31)  
XINT3 GPIO Input Select Register (GPIO0 to 31)  
LPM GPIO Select Register (GPIO0 to 31)  
NOTE  
There is a two-SYSCLKOUT cycle delay from when the write to the GPxMUXn/AIOMUXn  
and GPxQSELn registers occurs to when the action is valid.  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
Table 5-65. GPIOA MUX(1) (2)  
DEFAULT AT RESET  
PRIMARY I/O  
PERIPHERAL  
SELECTION 1  
PERIPHERAL  
SELECTION 2  
PERIPHERAL  
SELECTION 3  
FUNCTION  
GPAMUX1 REGISTER  
BITS  
(GPAMUX1 BITS = 00) (GPAMUX1 BITS = 01)  
(GPAMUX1 BITS = 10)  
(GPAMUX1 BITS = 11)  
1-0  
GPIO0  
GPIO1  
GPIO2  
GPIO3  
GPIO4  
GPIO5  
GPIO6  
GPIO7  
GPIO8  
GPIO9  
GPIO10  
GPIO11  
GPIO12  
GPIO13  
GPIO14  
GPIO15  
EPWM1A (O)  
EPWM1B (O)  
EPWM2A (O)  
EPWM2B (O)  
EPWM3A (O)  
EPWM3B (O)  
EPWM4A (O)  
EPWM4B (O)  
EPWM5A (O)  
EPWM5B (O)  
EPWM6A (O)  
EPWM6B (O)  
TZ1 (I)  
Reserved  
Reserved  
Reserved  
COMP1OUT (O)  
Reserved  
3-2  
5-4  
Reserved  
7-6  
SPISOMIA (I/O)  
Reserved  
COMP2OUT (O)  
Reserved  
9-8  
11-10  
13-12  
15-14  
17-16  
19-18  
21-20  
23-22  
25-24  
27-26  
29-28  
31-30  
SPISIMOA (I/O)  
EPWMSYNCI (I)  
SCIRXDA (I)  
Reserved  
ECAP1 (I/O)  
EPWMSYNCO (O)  
ECAP2 (I/O)  
ADCSOCAO (O)  
ECAP3 (I/O)  
SCITXDB (O)  
Reserved  
ADCSOCBO (O)  
ECAP1 (I/O)  
SCIRXDB (I)  
SCITXDA (O)  
Reserved  
SPISIMOB (I/O)  
SPISOMIB (I/O)  
SPICLKB (I/O)  
SPISTEB (I/O)  
TZ2 (I)  
TZ3 (I)  
SCITXDB (O)  
SCIRXDB (I)  
ECAP2 (I/O)  
GPAMUX2 REGISTER  
BITS  
(GPAMUX2 BITS = 00) (GPAMUX2 BITS = 01)  
(GPAMUX2 BITS = 10)  
(GPAMUX2 BITS = 11)  
1-0  
GPIO16  
GPIO17  
SPISIMOA (I/O)  
SPISOMIA (I/O)  
SPICLKA (I/O)  
SPISTEA (I/O)  
EQEP1A (I)  
Reserved  
Reserved  
TZ2 (I)  
3-2  
TZ3 (I)  
5-4  
GPIO18  
SCITXDB (O)  
SCIRXDB (I)  
MDXA (O)  
XCLKOUT (O)  
ECAP1 (I/O)  
COMP1OUT (O)  
COMP2OUT (O)  
SCITXDB (O)  
SCIRXDB (I)  
SPISIMOB (I/O)  
SPISOMIB (I/O)  
SPICLKB (I/O)  
SPISTEB (I/O)  
TZ2 (I)  
7-6  
GPIO19/XCLKIN  
GPIO20  
9-8  
11-10  
13-12  
15-14  
17-16  
19-18  
21-20  
23-22  
25-24  
27-26  
29-28  
31-30  
GPIO21  
EQEP1B (I)  
MDRA (I)  
GPIO22  
EQEP1S (I/O)  
EQEP1I (I/O)  
ECAP1 (I/O)  
ECAP2 (I/O)  
ECAP3 (I/O)  
HRCAP2 (I)  
MCLKXA (I/O)  
MFSXA (I/O)  
EQEP2A(3) (I)  
EQEP2B(3) (I)  
EQEP2I(3) (I/O)  
EQEP2S(3) (I/O)  
SDAA (I/OD)  
SCLA (I/OD)  
EQEP2I(3) (I/O)  
EQEP2S(3) (I/O)  
GPIO23  
GPIO24  
GPIO25  
GPIO26  
GPIO27  
GPIO28  
SCIRXDA (I)  
SCITXDA (O)  
CANRXA (I)  
CANTXA (O)  
GPIO29  
TZ3 (I)  
GPIO30  
EPWM7A (O)  
EPWM8A (O)  
GPIO31  
(1) The word "Reserved" means that there is no peripheral assigned to this GPxMUX1/2 register setting. Should it be selected, the state of  
the pin will be undefined and the pin may be driven. This selection is a reserved configuration for future expansion.  
(2) I = Input, O = Output, OD = Open Drain  
(3) The eQEP2 peripheral is not available on the 80-pin PN or PFP package.  
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Table 5-66. GPIOB MUX(1)(2)  
DEFAULT AT RESET  
PRIMARY I/O FUNCTION  
PERIPHERAL  
SELECTION 1  
PERIPHERAL  
SELECTION 2  
PERIPHERAL  
SELECTION 3  
GPBMUX1 REGISTER  
BITS  
(GPBMUX1 BITS = 00)  
(GPBMUX1 BITS = 01)  
(GPBMUX1 BITS = 10)  
(GPBMUX1 BITS = 11)  
1-0  
GPIO32  
GPIO33  
SDAA (I/OD)  
SCLA (I/OD)  
COMP2OUT (O)  
Reserved  
EPWMSYNCI (I)  
EPWMSYNCO (O)  
Reserved  
ADCSOCAO (O)  
ADCSOCBO (O)  
COMP3OUT (O)  
Reserved  
3-2  
5-4  
GPIO34  
7-6  
GPIO35 (TDI)  
GPIO36 (TMS)  
GPIO37 (TDO)  
GPIO38/XCLKIN (TCK)  
GPIO39  
Reserved  
9-8  
Reserved  
Reserved  
Reserved  
11-10  
13-12  
15-14  
17-16  
19-18  
21-20  
23-22  
25-24  
27-26  
29-28  
31-30  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
GPIO40(3)  
GPIO41(3)  
GPIO42(3)  
GPIO43(3)  
EPWM7A (O)  
EPWM7B (O)  
EPWM8A (O)  
EPWM8B (O)  
MFSRA (I/O)  
Reserved  
SCITXDB (O)  
SCIRXDB (I)  
TZ1 (I)  
Reserved  
Reserved  
COMP1OUT (O)  
COMP2OUT (O)  
EPWM7B (O)  
Reserved  
TZ2 (I)  
GPIO44(3)  
SCIRXDB (I)  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
GPBMUX2 REGISTER  
BITS  
(GPBMUX2 BITS = 00)  
(GPBMUX2 BITS = 01)  
(GPBMUX2 BITS = 10)  
(GPBMUX2 BITS = 11)  
1-0  
Reserved  
Reserved  
GPIO50(3)  
GPIO51(3)  
GPIO52(3)  
GPIO53(3)  
GPIO54(3)  
GPIO55(3)  
GPIO56(3)  
GPIO57(3)  
GPIO58(3)  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
TZ1 (I)  
3-2  
5-4  
EQEP1A (I)  
EQEP1B (I)  
EQEP1S (I/O)  
EQEP1I (I/O)  
SPISIMOA (I/O)  
SPISOMIA (I/O)  
SPICLKA (I/O)  
SPISTEA (I/O)  
MCLKRA (I/O)  
Reserved  
MDXA (O)  
MDRA (I)  
7-6  
TZ2 (I)  
9-8  
MCLKXA (I/O)  
MFSXA (I/O)  
EQEP2A (I)  
EQEP2B (I)  
EQEP2I (I/O)  
EQEP2S (I/O)  
SCITXDB (O)  
Reserved  
TZ3 (I)  
11-10  
13-12  
15-14  
17-16  
19-18  
21-20  
23-22  
25-24  
27-26  
29-28  
31-30  
Reserved  
HRCAP1 (I)  
HRCAP2 (I)  
HRCAP3 (I)  
HRCAP4 (I)  
EPWM7A (O)  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
(1) The word "Reserved" means that there is no peripheral assigned to this GPxMUX1/2 register setting. Should it be selected, the state of  
the pin will be undefined and the pin may be driven. This selection is a reserved configuration for future expansion.  
(2) I = Input, O = Output, OD = Open Drain  
(3) This pin is not available in the 80-pin PN or PFP package.  
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Table 5-67. Analog MUX(1)  
DEFAULT AT RESET  
PERIPHERAL SELECTION 2 AND  
AIOx AND PERIPHERAL SELECTION 1  
PERIPHERAL SELECTION 3  
AIOMUX1 REGISTER BITS  
AIOMUX1 BITS = 0,x  
ADCINA0 (I)  
ADCINA1 (I)  
AIO2 (I/O)  
AIOMUX1 BITS = 1,x  
ADCINA0 (I)  
1-0  
3-2  
ADCINA1 (I)  
5-4  
ADCINA2 (I), COMP1A (I)  
ADCINA3 (I)  
7-6  
ADCINA3 (I)  
AIO4 (I/O)  
9-8  
ADCINA4 (I), COMP2A (I)  
ADCINA5 (I)  
11-10  
13-12  
15-14  
17-16  
19-18  
21-20  
23-22  
25-24  
27-26  
29-28  
31-30  
ADCINA5 (I)  
AIO6 (I/O)  
ADCINA6 (I), COMP3A (I)  
ADCINA7 (I)  
ADCINA7 (I)  
ADCINB0 (I)  
ADCINB1 (I)  
AIO10 (I/O)  
ADCINB3 (I)  
AIO12 (I/O)  
ADCINB5 (I)  
AIO14 (I/O)  
ADCINB7 (I)  
ADCINB0 (I)  
ADCINB1 (I)  
ADCINB2 (I), COMP1B (I)  
ADCINB3 (I)  
ADCINB4 (I), COMP2B (I)  
ADCINB5 (I)  
ADCINB6 (I), COMP3B (I)  
ADCINB7 (I)  
(1) I = Input, O = Output  
The user can select the type of input qualification for each GPIO pin via the GPxQSEL1/2 registers from  
four choices:  
Synchronization To SYSCLKOUT Only (GPxQSEL1/2 = 0, 0): This is the default mode of all GPIO pins  
at reset and it simply synchronizes the input signal to the system clock (SYSCLKOUT).  
Qualification Using Sampling Window (GPxQSEL1/2 = 0, 1 and 1, 0): In this mode the input signal,  
after synchronization to the system clock (SYSCLKOUT), is qualified by a specified number of cycles  
before the input is allowed to change.  
The sampling period is specified by the QUALPRD bits in the GPxCTRL register and is configurable in  
groups of 8 signals. The sampling period specifies a multiple of SYSCLKOUT cycles for sampling the  
input signal. The sampling window is either 3-samples or 6-samples wide and the output is only  
changed when ALL samples are the same (all 0s or all 1s) as shown in Figure 4-18 (for 6 sample  
mode).  
No Synchronization (GPxQSEL1/2 = 1,1): This mode is used for peripherals where synchronization is  
not required (synchronization is performed within the peripheral).  
Due to the multi-level multiplexing that is required on the device, there may be cases where a peripheral  
input signal can be mapped to more then one GPIO pin. Also, when an input signal is not selected, the  
input signal will default to either a 0 or 1 state, depending on the peripheral.  
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GPIOXINT1SEL  
GPIOXINT2SEL  
GPIOXINT3SEL  
GPIOLMPSEL  
LPMCR0  
External Interrupt  
MUX  
Low Power  
Modes Block  
PIE  
Asynchronous  
path  
GPxDAT (read)  
GPxQSEL1/2  
GPxCTRL  
GPxPUD  
N/C  
00  
01  
Peripheral 1 Input  
Peripheral 2 Input  
Input  
Internal  
Qualification  
10  
11  
Pullup  
Peripheral 3 Input  
GPxTOGGLE  
Asynchronous path  
GPIOx pin  
GPxCLEAR  
GPxSET  
00  
01  
GPxDAT (latch)  
Peripheral 1 Output  
10  
11  
Peripheral 2 Output  
Peripheral 3 Output  
High Impedance  
Output Control  
GPxDIR (latch)  
00  
01  
Peripheral 1 Output Enable  
Peripheral 2 Output Enable  
0 = Input, 1 = Output  
XRS  
10  
11  
Peripheral 3 Output Enable  
= Default at Reset  
GPxMUX1/2  
A. x stands for the port, either A or B. For example, GPxDIR refers to either the GPADIR and GPBDIR register  
depending on the particular GPIO pin selected.  
B. GPxDAT latch/read are accessed at the same memory location.  
C. This is a generic GPIO MUX block diagram. Not all options may be applicable for all GPIO pins. See the "Systems  
Control and Interrupts" chapter of the TMS320x2806x Piccolo Technical Reference Manual (literature number  
SPRUH18) for pin-specific variations.  
Figure 5-49. GPIO Multiplexing  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
5.23.1 General-Purpose Input/Output (GPIO) Electrical Data/Timing  
5.23.1.1 GPIO Output Timing  
Table 5-68. General-Purpose Output Switching Characteristics  
over recommended operating conditions (unless otherwise noted)  
PARAMETER  
MIN  
MAX  
13(1)  
13(1)  
20  
UNIT  
ns  
tr(GPO)  
tf(GPO)  
tfGPO  
Rise time, GPIO switching low to high  
Fall time, GPIO switching high to low  
Toggling frequency  
All GPIOs  
All GPIOs  
ns  
MHz  
(1) Rise time and fall time vary with electrical loading on I/O pins. Values given in Table 5-68 are applicable for a 40-pF load on I/O pins.  
GPIO  
t
r(GPO)  
t
f(GPO)  
Figure 5-50. General-Purpose Output Timing  
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5.23.1.2 GPIO Input Timing  
Table 5-69. General-Purpose Input Timing Requirements  
MIN  
MAX  
UNIT  
cycles  
cycles  
cycles  
cycles  
cycles  
QUALPRD = 0  
1tc(SCO)  
2tc(SCO) * QUALPRD  
tw(SP) * (n(1) – 1)  
tw(SP)  
Sampling period  
QUALPRD 0  
tw(IQSW)  
Input qualifier sampling window  
Pulse duration, GPIO low/high  
Synchronous mode  
With input qualifier  
2tc(SCO)  
(2)  
tw(GPI)  
tw(IQSW) + tw(SP) + 1tc(SCO)  
(1) "n" represents the number of qualification samples as defined by GPxQSELn register.  
(2) For tw(GPI), pulse width is measured from VIL to VIL for an active-low signal and VIH to VIH for an active-high signal.  
(A)  
GPIO Signal  
GPxQSELn = 1,0 (6 samples)  
1
1
0
0
0
0
0
0
0
1
0
0
0
1
1
1
1
1
1
1
1
1
tw(SP)  
Sampling Period determined  
by GPxCTRL[QUALPRD](B)  
tw(IQSW)  
[(SYSCLKOUT cycle * 2 * QUALPRD) * 5(C)  
]
Sampling Window  
SYSCLKOUT  
QUALPRD = 1  
(SYSCLKOUT/2)  
(D)  
Output From  
Qualifier  
A. This glitch will be ignored by the input qualifier. The QUALPRD bit field specifies the qualification sampling period.  
The QUALPRD bit field value can vary from 00 to 0xFF. If QUALPRD = 00, then the sampling period is 1  
SYSCLKOUT cycle. For any other value "n", the qualification sampling period in 2n SYSCLKOUT cycles (that is, at  
every 2n SYSCLKOUT cycles, the GPIO pin will be sampled).  
B. The qualification period selected via the GPxCTRL register applies to groups of 8 GPIO pins.  
C. The qualification block can take either three or six samples. The GPxQSELn Register selects which sample mode is  
used.  
D. In the example shown, for the qualifier to detect the change, the input should be stable for 10 SYSCLKOUT cycles or  
greater. In other words, the inputs should be stable for (5 x QUALPRD x 2) SYSCLKOUT cycles. This would ensure  
5 sampling periods for detection to occur. Since external signals are driven asynchronously, an 13-SYSCLKOUT-wide  
pulse ensures reliable recognition.  
Figure 5-51. Sampling Mode  
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5.23.1.3 Sampling Window Width for Input Signals  
The following section summarizes the sampling window width for input signals for various input qualifier  
configurations.  
Sampling frequency denotes how often a signal is sampled with respect to SYSCLKOUT.  
Sampling frequency = SYSCLKOUT/(2 * QUALPRD), if QUALPRD 0  
Sampling frequency = SYSCLKOUT, if QUALPRD = 0  
Sampling period = SYSCLKOUT cycle x 2 x QUALPRD, if QUALPRD 0  
In the above equations, SYSCLKOUT cycle indicates the time period of SYSCLKOUT.  
Sampling period = SYSCLKOUT cycle, if QUALPRD = 0  
In a given sampling window, either 3 or 6 samples of the input signal are taken to determine the validity of  
the signal. This is determined by the value written to GPxQSELn register.  
Case 1:  
Qualification using 3 samples  
Sampling window width = (SYSCLKOUT cycle x 2 x QUALPRD) x 2, if QUALPRD 0  
Sampling window width = (SYSCLKOUT cycle) x 2, if QUALPRD = 0  
Case 2:  
Qualification using 6 samples  
Sampling window width = (SYSCLKOUT cycle x 2 x QUALPRD) x 5, if QUALPRD 0  
Sampling window width = (SYSCLKOUT cycle) x 5, if QUALPRD = 0  
SYSCLK  
GPIOxn  
tw(GPI)  
Figure 5-52. General-Purpose Input Timing  
VDDIO  
> 1 MS  
2 pF  
VSS  
VSS  
Figure 5-53. Input Resistance Model for a GPIO Pin With an Internal Pull-up  
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5.23.1.4 Low-Power Mode Wakeup Timing  
Table 5-70 shows the timing requirements, Table 5-71 shows the switching characteristics, and Figure 5-  
54 shows the timing diagram for IDLE mode.  
Table 5-70. IDLE Mode Timing Requirements(1)  
MIN  
2tc(SCO)  
MAX  
UNIT  
Without input qualifier  
With input qualifier  
tw(WAKE-INT)  
Pulse duration, external wake-up signal  
cycles  
5tc(SCO) + tw(IQSW)  
(1) For an explanation of the input qualifier parameters, see Table 5-69.  
Table 5-71. IDLE Mode Switching Characteristics(1)  
over recommended operating conditions (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
MAX  
UNIT  
cycles  
cycles  
(2)  
Delay time, external wake signal to program execution resume  
Without input qualifier  
With input qualifier  
Without input qualifier  
With input qualifier  
Without input qualifier  
With input qualifier  
20tc(SCO)  
Wake-up from Flash  
Flash module in active state  
20tc(SCO) + tw(IQSW)  
1050tc(SCO)  
td(WAKE-IDLE)  
cycles  
cycles  
Wake-up from Flash  
Flash module in sleep state  
1050tc(SCO) + tw(IQSW)  
20tc(SCO)  
Wake-up from SARAM  
20tc(SCO) + tw(IQSW)  
(1) For an explanation of the input qualifier parameters, see Table 5-69.  
(2) This is the time taken to begin execution of the instruction that immediately follows the IDLE instruction. execution of an ISR (triggered  
by the wake-up) signal involves additional latency.  
t
d(WAKE−IDLE)  
Address/Data  
(internal)  
XCLKOUT  
t
w(WAKE−INT)  
WAKE INT(A)(B)  
A. WAKE INT can be any enabled interrupt, WDINT or XRS. After the IDLE instruction is executed, a delay of 5  
OSCCLK cycles (minimum) is needed before the wake-up signal could be asserted.  
B. From the time the IDLE instruction is executed to place the device into low-power mode (LPM), wakeup should not be  
initiated until at least 4 OSCCLK cycles have elapsed.  
Figure 5-54. IDLE Entry and Exit Timing  
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Table 5-72. STANDBY Mode Timing Requirements  
MIN  
3tc(OSCCLK)  
MAX  
UNIT  
Without input qualification  
With input qualification(1)  
Pulse duration, external  
wake-up signal  
tw(WAKE-INT)  
cycles  
(2 + QUALSTDBY) * tc(OSCCLK)  
(1) QUALSTDBY is a 6-bit field in the LPMCR0 register.  
Table 5-73. STANDBY Mode Switching Characteristics  
over recommended operating conditions (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
MAX  
UNIT  
Delay time, IDLE instruction  
executed to XCLKOUT low  
td(IDLE-XCOL)  
32tc(SCO)  
45tc(SCO)  
cycles  
Delay time, external wake signal to program execution  
resume(1)  
cycles  
cycles  
Without input qualifier  
100tc(SCO)  
Wake up from flash  
Flash module in active state With input qualifier  
100tc(SCO) + tw(WAKE-INT)  
1125tc(SCO)  
td(WAKE-STBY)  
Without input qualifier  
Wake up from flash  
cycles  
cycles  
Flash module in sleep state With input qualifier  
1125tc(SCO) + tw(WAKE-INT)  
100tc(SCO)  
Without input qualifier  
Wake up from SARAM  
With input qualifier  
100tc(SCO) + tw(WAKE-INT)  
(1) This is the time taken to begin execution of the instruction that immediately follows the IDLE instruction. execution of an ISR (triggered  
by the wake up signal) involves additional latency.  
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(C)  
(F)  
(A)  
(B)  
(D)(E)  
(G)  
Normal Execution  
Device  
Status  
STANDBY  
STANDBY  
Flushing Pipeline  
Wake-up  
Signal(H)  
t
w(WAKE-INT)  
t
d(WAKE-STBY)  
X1/X2 or  
XCLKIN  
XCLKOUT  
t
d(IDLE−XCOL)  
A. IDLE instruction is executed to put the device into STANDBY mode.  
B. The PLL block responds to the STANDBY signal. SYSCLKOUT is held for the number of cycles indicated below  
before being turned off:  
16 cycles, when DIVSEL = 00 or 01  
32 cycles, when DIVSEL = 10  
64 cycles, when DIVSEL = 11  
This delay enables the CPU pipeline and any other pending operations to flush properly.  
C. Clock to the peripherals are turned off. However, the PLL and watchdog are not shut down. The device is now in  
STANDBY mode. After the IDLE instruction is executed, a delay of 5 OSCCLK cycles (minimum) is needed before the  
wake-up signal could be asserted.  
D. The external wake-up signal is driven active.  
E. The wake-up signal fed to a GPIO pin to wake up the device must meet the minimum pulse width requirement.  
Furthermore, this signal must be free of glitches. If a noisy signal is fed to a GPIO pin, the wake-up behavior of the  
device will not be deterministic and the device may not exit low-power mode for subsequent wake-up pulses.  
F. After a latency period, the STANDBY mode is exited.  
G. Normal execution resumes. The device will respond to the interrupt (if enabled).  
H. From the time the IDLE instruction is executed to place the device into low-power mode (LPM), wakeup should not be  
initiated until at least 4 OSCCLK cycles have elapsed.  
Figure 5-55. STANDBY Entry and Exit Timing Diagram  
Table 5-74. HALT Mode Timing Requirements  
MIN  
toscst + 2tc(OSCCLK)  
toscst + 8tc(OSCCLK)  
MAX  
UNIT  
cycles  
cycles  
tw(WAKE-GPIO)  
tw(WAKE-XRS)  
Pulse duration, GPIO wake-up signal  
Pulse duration, XRS wakeup signal  
Table 5-75. HALT Mode Switching Characteristics  
over recommended operating conditions (unless otherwise noted)  
PARAMETER  
MIN  
MAX  
UNIT  
cycles  
ms  
td(IDLE-XCOL)  
tp  
Delay time, IDLE instruction executed to XCLKOUT low  
PLL lock-up time  
32tc(SCO)  
45tc(SCO)  
1
Delay time, PLL lock to program execution resume  
1125tc(SCO)  
35tc(SCO)  
cycles  
cycles  
Wake up from flash  
Flash module in sleep state  
td(WAKE-HALT)  
Wake up from SARAM  
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(C)  
(F)  
(A)  
(H)  
(B)  
(G)  
(D)(E)  
Device  
Status  
HALT  
HALT  
Flushing Pipeline  
PLL Lock-up Time  
Normal  
Execution  
Wake-up Latency  
GPIOn(I)  
t
)
d(WAKE−HALT  
t
w(WAKE-GPIO)  
tp  
X1/X2 or  
XCLKIN  
Oscillator Start-up Time  
XCLKOUT  
t
d(IDLE−XCOL)  
A. IDLE instruction is executed to put the device into HALT mode.  
B. The PLL block responds to the HALT signal. SYSCLKOUT is held for the number of cycles indicated below before  
oscillator is turned off and the CLKIN to the core is stopped:  
16 cycles, when DIVSEL = 00 or 01  
32 cycles, when DIVSEL = 10  
64 cycles, when DIVSEL = 11  
This delay enables the CPU pipeline and any other pending operations to flush properly.  
C. Clocks to the peripherals are turned off and the PLL is shut down. If a quartz crystal or ceramic resonator is used as  
the clock source, the internal oscillator is shut down as well. The device is now in HALT mode and consumes  
absolute minimum power. It is possible to keep the zero-pin internal oscillators (INTOSC1 and INTOSC2) and the  
watchdog alive in HALT mode. This is done by writing to the appropriate bits in the CLKCTL register. After the IDLE  
instruction is executed, a delay of 5 OSCCLK cycles (minimum) is needed before the wake-up signal could be  
asserted.  
D. When the GPIOn pin (used to bring the device out of HALT) is driven low, the oscillator is turned on and the oscillator  
wake-up sequence is initiated. The GPIO pin should be driven high only after the oscillator has stabilized. This  
enables the provision of a clean clock signal during the PLL lock sequence. Since the falling edge of the GPIO pin  
asynchronously begins the wakeup procedure, care should be taken to maintain a low noise environment prior to  
entering and during HALT mode.  
E. The wake-up signal fed to a GPIO pin to wake up the device must meet the minimum pulse width requirement.  
Furthermore, this signal must be free of glitches. If a noisy signal is fed to a GPIO pin, the wake-up behavior of the  
device will not be deterministic and the device may not exit low-power mode for subsequent wake-up pulses.  
F. Once the oscillator has stabilized, the PLL lock sequence is initiated, which takes 1 ms.  
G. When CLKIN to the core is enabled, the device will respond to the interrupt (if enabled), after a latency. The HALT  
mode is now exited.  
H. Normal operation resumes.  
I.  
From the time the IDLE instruction is executed to place the device into low-power mode (LPM), wakeup should not be  
initiated until at least 4 OSCCLK cycles have elapsed.  
Figure 5-56. HALT Wake-Up Using GPIOn  
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5.24 Universal Serial Bus (USB)  
5.24.1 Universal Serial Bus (USB) Electrical Data/Timing  
Table 5-76. USB Input Ports DP and DM Timing Requirements  
VCC  
MIN  
0.8  
MAX  
UNIT  
V
V(CM)  
Z(IN)  
VCRS  
VIL  
Differential input common mode range  
Input impedance  
2.5  
300  
1.3  
kΩ  
V
Crossover voltage  
2.0  
Static SE input logic-low level  
Static SE input logic-high level  
Differential input voltage  
0.8  
V
VIH  
2.0  
0.2  
V
VDI  
V
Table 5-77. USB Output Ports DP and DM Switching Characteristics  
over recommended operating conditions (unless otherwise noted)  
PARAMETER  
D+, D– single-ended  
D+, D– single-ended  
D+, D– impedance  
Rise time  
TEST CONDITIONS  
VCC  
MIN  
2.8  
0
MAX  
UNIT  
V
VOH  
VOL  
USB 2.0 load conditions  
USB 2.0 load conditions  
3.6  
0.3  
44  
V
Z(DRV)  
tr  
28  
4
Ω
Full speed, differential, CL = 50 pF,  
10%/90%, Rpu on D+  
20  
ns  
tf  
Fall time  
Full speed, differential, CL = 50 pF,  
10%/90%, Rpu on D+  
4
20  
ns  
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5.25 Flash Timing  
Table 5-78. Flash/OTP Endurance for T Temperature Material(1)  
ERASE/PROGRAM  
TEMPERATURE  
MIN  
TYP  
MAX  
UNIT  
Nf  
Flash endurance for the array (write/erase cycles)  
OTP endurance for the array (write cycles)  
0°C to 105°C (ambient)  
0°C to 30°C (ambient)  
20000  
50000  
cycles  
write  
NOTP  
1
(1) Write/erase operations outside of the temperature ranges indicated are not specified and may affect the endurance numbers.  
Table 5-79. Flash/OTP Endurance for S Temperature Material(1)  
ERASE/PROGRAM  
MIN  
TYP  
MAX  
UNIT  
TEMPERATURE  
0°C to 125°C (ambient)  
0°C to 30°C (ambient)  
Nf  
Flash endurance for the array (write/erase cycles)  
OTP endurance for the array (write cycles)  
20000  
50000  
cycles  
write  
NOTP  
1
(1) Write/erase operations outside of the temperature ranges indicated are not specified and may affect the endurance numbers.  
Table 5-80. Flash/OTP Endurance for Q Temperature Material(1)(2)  
ERASE/PROGRAM  
TEMPERATURE  
MIN  
TYP  
MAX  
UNIT  
Nf  
Flash endurance for the array (write/erase cycles)  
OTP endurance for the array (write cycles)  
–40°C to 125°C (ambient)  
–40°C to 30°C (ambient)  
20000  
50000  
cycles  
write  
NOTP  
1
(1) Write/erase operations outside of the temperature ranges indicated are not specified and may affect the endurance numbers.  
(2) The "Q" temperature option is not available on the 2806xU devices.  
Table 5-81. Flash Parameters at 90-MHz SYSCLKOUT  
TEST  
CONDITIONS  
PARAMETER  
MIN  
TYP  
MAX  
UNIT  
Program Time  
Erase Time(1)  
16-Bit Word  
16K Sector  
8K Sector  
4K Sector  
16K Sector  
8K Sector  
4K Sector  
50  
500  
250  
125  
2
μs  
ms  
ms  
ms  
s
2
s
2
s
(2)  
IDDP  
VDD current consumption during Erase/Program cycle  
VDDIO current consumption during Erase/Program cycle  
VDDIO current consumption during Erase/Program cycle  
VREG disabled  
VREG enabled  
80  
60  
120  
mA  
(2)  
IDDIOP  
(2)  
IDDIOP  
mA  
(1) The on-chip flash memory is in an erased state when the device is shipped from TI. As such, erasing the flash memory is not required  
prior to programming, when programming the device for the first time. However, the erase operation is needed on all subsequent  
programming operations.  
(2) Typical parameters as seen at room temperature including function call overhead, with all peripherals off.  
Table 5-82. Flash/OTP Access Timing(1)  
PARAMETER  
MIN  
36  
MAX UNIT  
ta(fp)  
Paged Flash access time  
Random Flash access time  
OTP access time  
ns  
ns  
ns  
ta(fr)  
36  
ta(OTP)  
60  
(1) Access time numbers shown in this table are prior to device characterization. Final numbers will be published in the TMS datasheet.  
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Table 5-83. Flash Data Retention Duration  
PARAMETER  
Data retention duration  
TEST CONDITIONS  
TJ = 55°C  
MIN  
MAX UNIT  
tretention  
15  
years  
Table 5-84. Minimum Required Flash/OTP Wait-States at Different Frequencies  
SYSCLKOUT  
SYSCLKOUT  
(ns)  
PAGE  
RANDOM  
OTP  
WAIT-STATE  
(MHz)  
WAIT-STATE(1)  
WAIT-STATE(1)  
90  
11.11  
12.5  
3
2
2
2
1
1
1
1
1
1
3
2
2
2
1
1
1
1
1
1
5
4
4
3
3
2
2
2
2
1
80  
70  
14.29  
16.67  
18.18  
20  
60  
55  
50  
45  
22.22  
25  
40  
35  
28.57  
33.33  
30  
(1) Page and random wait-state must be 1.  
The equations to compute the Flash page wait-state and random wait-state in Table 5-84 are as follows:  
é
ê
ù
æ
ç
ç
è
ö
÷
÷
ta(f ×p)  
Flash Page Wait State =  
-1 round up to the next highest integer, or 1, whichever is larger  
ú
t
ê
ë
ú
c(SCO) ø  
û
é
ù
æ
ö
÷
÷
ta(f ×r)  
ç
ç
è
Flash Random Wait State =  
-1 round up to the next highest integer, or 1, whichever is larger  
ê
ú
t
ê
ú
c(SCO) ø  
ë
û
The equation to compute the OTP wait-state in Table 5-84 is as follows:  
é
ê
ù
æ
ç
ç
è
ö
÷
÷
ta(OTP)  
OTP Wait State =  
-1 round up to the next highest integer, or 1, whichever is larger  
ú
t
ê
ë
ú
c(SCO) ø  
û
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TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
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SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
6 Revision History  
This data sheet revision history highlights the technical changes made to the SPRS698C device-specific  
data sheet to make it an SPRS698D revision.  
Scope: The TMS320F2806xU devices are now "TMS" devices (fully qualified production devices). See  
Section 3.3 for more information on device status.  
Information/data on TMS320F2806xU devices are now Production Data.  
PRODUCTION DATA information is current as of publication date. Products conform to  
specifications per the terms of the Texas Instruments standard warranty. Production processing  
does not necessarily include testing of all parameters.  
Q-temperature devices are "TMX" devices (experimental devices). See Section 3.3 for more  
information on device status.  
The "Q" temperature option (–40°C to 125°C) is not available on the TMS320F2806xU  
devices.  
See table below.  
LOCATION  
Table 2-1  
ADDITIONS, DELETIONS, AND MODIFICATIONS  
Hardware Features:  
Changed "ePWM outputs" for the 100-Pin PZ and PZP packages for all devices from 19 to 16  
Changed "ePWM outputs" for the 80-Pin PN and PFP packages for all devices from 15 to 14  
Updated "Product status" row  
Added "Product status for Q-temperature devices" row  
Added "The "Q" temperature option is not available on the TMS320F2806xU devices" footnote  
Added footnote about "TMX" product status  
Table 2-8  
Peripheral Frame 0 Registers:  
PIE Vector Table: Changed "EALLOW PROTECTED" value from "No" to "Yes"  
Device Emulation Registers:  
Table 2-12  
Removed "For TMS320F28069U devices, the PARTID and CLASSID numbers are also used for TMX  
devices. In the case of TMX320F28069UPFPA and TMX320F28069UPZPA devices, the temperature rating is  
'A' instead of 'T'" footnote  
Table 2-15  
PLL Settings:  
Added data for PLLCR[DIV] VALUE = 10001  
Added data for PLLCR[DIV] VALUE = 10010  
Table 2-17  
Figure 3-1  
Section 4.2  
Possible PLL Configuration Modes:  
Removed "PLLSTS[DIVSEL] should not be set to /1 mode while the PLL is enabled" footnote  
Device Nomenclature:  
Added "The "Q" temperature option is not available on the 2806xU devices" footnote  
Recommended Operating Conditions:  
Changed "VDDIO and VDDA should be maintained within ~0.3 V of each other" footnote to "VDDIO and VDDA  
should be maintained within approximately 0.3 V of each other"  
Added "The "Q" temperature option is not available on the 2806xU devices" footnote  
Table 5-2  
Device Clocking Requirements/Characteristics:  
External oscillator/clock source (XCLKIN pin) — PLL Disabled:  
tc(CI), Cycle time (C8): Changed MIN value from 33.33 ns to 11.11 ns  
Frequency: Changed MAX value from 30 MHz to 90 MHz  
Table 5-5  
XCLKIN Timing Requirements - PLL Disabled:  
C9, tf(CI): Changed frequency range from "20 MHz to 30 MHz" to "20 MHz to 90 MHz"  
C10, tr(CI): Changed frequency range from "20 MHz to 30 MHz" to "20 MHz to 90 MHz"  
Section 5.5  
Power Sequencing:  
Removed "Furthermore, VDDIO and VDDA should always be within 0.3 V of each other" sentence from "There  
is no power sequencing requirement needed ..." paragraph  
Copyright © 2010–2012, Texas Instruments Incorporated  
Revision History  
157  
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TMS320F28064 TMS320F28063 TMS320F28062  
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
www.ti.com  
LOCATION  
Table 5-11  
ADDITIONS, DELETIONS, AND MODIFICATIONS  
PIE MUXed Peripheral Interrupt Vector Table:  
(INTx.8, INT5.y): Changed "USB0_INT / / 0xD8E" to "USB0_INT / (USB0) / 0xD8E"  
Figure 5-43  
Figure 5-44  
Updated "ePWM Sub-Modules Showing Critical Internal Signal Interconnections" figure  
PWM Hi-Z Characteristics:  
Changed XCLKOUT to SYSCLK  
Table 5-62  
Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements:  
TEST CONDITIONS: Changed all five instances of "Synchronous" to "Asynchronous/Synchronous"  
Added footnote about limitations in the asynchronous mode  
Figure 5-52  
Table 5-80  
Table 5-83  
General-Purpose Input Timing:  
Changed XCLKOUT to SYSCLK  
Flash/OTP Endurance for Q Temperature Material:  
Added "The "Q" temperature option is not available on the 2806xU devices" footnote  
Added "Flash Data Retention Duration" table  
158  
Revision History  
Copyright © 2010–2012, Texas Instruments Incorporated  
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Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065  
TMS320F28064 TMS320F28063 TMS320F28062  
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
www.ti.com  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
7 Mechanical Packaging and Orderable Information  
7.1 Thermal Data  
Table 7-1 through Table 7-4 show the thermal data. See Section 7.1.1 for more information on thermal  
design considerations.  
Table 7-1. Thermal Model 100-Pin PZP Results  
AIR FLOW  
PARAMETER  
0 lfm  
24.4  
0.3  
150 lfm  
15.1  
0.4  
250 lfm  
13.9  
0.4  
500 lfm  
12.4  
0.5  
θJA [°C/W] High k PCB  
ΨJT [°C/W]  
ΨJB  
4.5  
4.2  
4.2  
4.2  
θJC  
9.4  
θJB  
4.4  
Table 7-2. Thermal Model 100-Pin PZ Results  
AIR FLOW  
PARAMETER  
0 lfm  
42.2  
0.4  
150 lfm  
32.4  
250 lfm  
30.9  
500 lfm  
28.7  
θJA [°C/W] High k PCB  
ΨJT [°C/W]  
ΨJB  
0.6  
0.7  
0.9  
19.1  
7.2  
18.2  
17.9  
14.1  
θJC  
θJB  
19.6  
Table 7-3. Thermal Model 80-Pin PFP Results  
AIR FLOW  
PARAMETER  
0 lfm  
25.8  
0.3  
150 lfm  
16.3  
0.4  
250 lfm  
15.2  
0.4  
500 lfm  
13.6  
0.5  
θJA [°C/W] High k PCB  
ΨJT [°C/W]  
ΨJB  
4.6  
4.4  
4.3  
4.3  
θJC  
9.4  
θJB  
4.6  
Table 7-4. Thermal Model 80-Pin PN Results  
AIR FLOW  
PARAMETER  
0 lfm  
41.1  
0.4  
150 lfm  
31.2  
250 lfm  
29.7  
500 lfm  
27.5  
θJA [°C/W] High k PCB  
ΨJT [°C/W]  
ΨJB  
0.6  
0.7  
0.9  
15.3  
7.9  
14.6  
14.4  
14.1  
θJC  
θJB  
15.6  
Copyright © 2010–2012, Texas Instruments Incorporated  
Mechanical Packaging and Orderable Information  
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TMS320F28064 TMS320F28063 TMS320F28062  
 
 
TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066  
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062  
SPRS698D NOVEMBER 2010REVISED DECEMBER 2012  
www.ti.com  
7.1.1 Thermal Design Considerations  
Based on the end application design and operational profile, the IDD and IDDIO currents could vary.  
Systems that exceed the recommended maximum power dissipation in the end product may require  
additional thermal enhancements. Ambient temperature (TA) varies with the end application and product  
design. The critical factor that affects reliability and functionality is TJ, the junction temperature, not the  
ambient temperature. Hence, care should be taken to keep TJ within the specified limits. Tcase should be  
measured to estimate the operating junction temperature TJ. Tcase is normally measured at the center of  
the package top-side surface. The thermal application reports IC Package Thermal Metrics (literature  
number SPRA953) and Reliability Data for TMS320LF24xx and TMS320F28xx Devices (literature number  
SPRA963) help to understand the thermal metrics and definitions.  
7.2 Packaging Information  
The following packaging information and addendum reflect the most current data available for the  
designated devices. This data is subject to change without notice and without revision of this document.  
160  
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TMS320F28064 TMS320F28063 TMS320F28062  
MECHANICAL DATA  
MTQF010A – JANUARY 1995 – REVISED DECEMBER 1996  
PN (S-PQFP-G80)  
PLASTIC QUAD FLATPACK  
0,27  
0,17  
0,50  
60  
M
0,08  
41  
61  
40  
0,13 NOM  
80  
21  
1
20  
Gage Plane  
9,50 TYP  
0,25  
12,20  
SQ  
11,80  
0,05 MIN  
0°7°  
14,20  
SQ  
13,80  
0,75  
0,45  
1,45  
1,35  
Seating Plane  
0,08  
1,60 MAX  
4040135 /B 11/96  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MS-026  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTQF013A – OCTOBER 1994 – REVISED DECEMBER 1996  
PZ (S-PQFP-G100)  
PLASTIC QUAD FLATPACK  
0,27  
0,17  
0,50  
75  
M
0,08  
51  
50  
76  
26  
100  
0,13 NOM  
1
25  
12,00 TYP  
Gage Plane  
14,20  
SQ  
13,80  
0,25  
16,20  
SQ  
0,05 MIN  
0°7°  
15,80  
1,45  
1,35  
0,75  
0,45  
Seating Plane  
0,08  
1,60 MAX  
4040149/B 11/96  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MS-026  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
5-May-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
TMS320F28062FPFPQ  
TMS320F28062FPNT  
ACTIVE  
LQFP  
LQFP  
PN  
80  
80  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 105  
ACTIVE  
ACTIVE  
PN  
PZ  
119  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28062FPNT  
TMS320  
TMS320F28062FPZT  
LQFP  
100  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 105  
F28062FPZT  
TMS320  
TMS320F28062PFPQ  
TMS320F28062PFPS  
PREVIEW  
ACTIVE  
HTQFP  
HTQFP  
PFP  
PFP  
80  
80  
1000  
1000  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28062PFPS  
TMS320  
TMS320F28062PNT  
ACTIVE  
LQFP  
PN  
80  
119  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 105  
320F28062PNT  
TMS  
TMS320F28062PZPQ  
TMS320F28062PZPS  
PREVIEW  
ACTIVE  
HTQFP  
HTQFP  
PZP  
PZP  
100  
100  
1000  
90  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28062PZPS  
TMS320  
TMS320F28062PZT  
TMS320F28062UPNT  
TMS320F28062UPZT  
ACTIVE  
ACTIVE  
ACTIVE  
LQFP  
LQFP  
LQFP  
PZ  
PN  
PZ  
100  
80  
90  
119  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
-40 to 105  
-40 to 105  
-40 to 105  
320F28062PZT  
TMS  
Green (RoHS  
& no Sb/Br)  
320F28062UPNT  
TMS  
100  
Green (RoHS  
& no Sb/Br)  
F28062UPZT  
TMS320  
TMS320F28063PFPQ  
TMS320F28063PFPS  
PREVIEW  
ACTIVE  
HTQFP  
HTQFP  
PFP  
PFP  
80  
80  
1000  
1000  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28063PFPS  
TMS320  
TMS320F28063PNT  
ACTIVE  
LQFP  
PN  
80  
119  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 105  
320F28063PNT  
TMS  
TMS320F28063PZPQ  
TMS320F28063PZPS  
PREVIEW  
ACTIVE  
HTQFP  
HTQFP  
PZP  
PZP  
100  
100  
1000  
1000  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28063PZPS  
TMS320  
TMS320F28063PZT  
TMS320F28063UPNT  
ACTIVE  
ACTIVE  
LQFP  
LQFP  
PZ  
PN  
100  
80  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
-40 to 105  
-40 to 105  
320F28063PZT  
TMS  
119  
Green (RoHS  
& no Sb/Br)  
320F28063UPNT  
TMS  
TMS320F28063UPZT  
TMS320F28064PFPQ  
PREVIEW  
PREVIEW  
LQFP  
PZ  
100  
80  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
-40 to 105  
-40 to 125  
HTQFP  
PFP  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
5-May-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
TMS320F28064PFPS  
TMS320F28064PNT  
ACTIVE  
HTQFP  
LQFP  
PFP  
80  
80  
1000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
Level-3-260C-168 HR  
F28064PFPS  
TMS320  
ACTIVE  
PN  
119  
Green (RoHS  
& no Sb/Br)  
Level-3-260C-168 HR  
-40 to 105  
320F28064PNT  
TMS  
TMS320F28064PZPQ  
TMS320F28064PZPS  
PREVIEW  
ACTIVE  
HTQFP  
HTQFP  
PZP  
PZP  
100  
100  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
1000  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28064PZPS  
TMS320  
TMS320F28064PZT  
ACTIVE  
LQFP  
PZ  
100  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 105  
320F28064PZT  
TMS  
TMS320F28065PFPQ  
TMS320F28065PFPS  
PREVIEW  
ACTIVE  
HTQFP  
HTQFP  
PFP  
PFP  
80  
80  
1000  
1000  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28065PFPS  
TMS320  
TMS320F28065PNT  
ACTIVE  
LQFP  
PN  
80  
119  
TBD  
Call TI  
Call TI  
-40 to 105  
TMS320F28065PZPQ  
TMS320F28065PZPS  
PREVIEW  
ACTIVE  
HTQFP  
HTQFP  
PZP  
PZP  
100  
100  
1000  
1000  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28065PZPS  
TMS320  
TMS320F28065PZT  
ACTIVE  
LQFP  
PZ  
100  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 105  
320F28065PZT  
TMS  
TMS320F28065UPFPS  
TMS320F28065UPNT  
PREVIEW  
ACTIVE  
HTQFP  
LQFP  
PFP  
PN  
80  
80  
1000  
119  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 105  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28065UPNT  
TMS320  
TMS320F28065UPZPS  
TMS320F28065UPZT  
ACTIVE  
ACTIVE  
HTQFP  
LQFP  
PZP  
PZ  
100  
100  
1000  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
-40 to 125  
-40 to 105  
F28065UPZPS  
TMS320  
Green (RoHS  
& no Sb/Br)  
F28065UPZT  
TMS320  
TMS320F28066PFPQ  
TMS320F28066PFPS  
PREVIEW  
ACTIVE  
HTQFP  
HTQFP  
PFP  
PFP  
80  
80  
1000  
1000  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28066PFPS  
TMS320  
TMS320F28066PNT  
ACTIVE  
LQFP  
PN  
80  
119  
TBD  
Call TI  
Call TI  
-40 to 105  
TMS320F28066PZPQ  
TMS320F28066PZPS  
PREVIEW  
ACTIVE  
HTQFP  
HTQFP  
PZP  
PZP  
100  
100  
1000  
1000  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28066PZPS  
TMS320  
TMS320F28066PZT  
ACTIVE  
LQFP  
PZ  
100  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 105  
320F28066PZT  
TMS  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
5-May-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
Qty  
1000  
1000  
(1)  
(2)  
(3)  
(4)  
TMS320F28067PFPQ  
TMS320F28067PFPS  
PREVIEW  
ACTIVE  
HTQFP  
HTQFP  
PFP  
80  
80  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
PFP  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28067PFPS  
TMS320  
TMS320F28067PNT  
ACTIVE  
LQFP  
PN  
80  
119  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 105  
320F28067PNT  
TMS  
TMS320F28067PZPQ  
TMS320F28067PZPS  
PREVIEW  
ACTIVE  
HTQFP  
HTQFP  
PZP  
PZP  
100  
100  
1000  
1000  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28067PZPS  
TMS320  
TMS320F28067PZT  
ACTIVE  
LQFP  
PZ  
100  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 105  
320F28067PZT  
TMS  
TMS320F28068FPFPQ  
TMS320F28068FPNT  
ACTIVE  
ACTIVE  
LQFP  
LQFP  
PN  
PN  
80  
80  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 105  
119  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28068FPNT  
TMS320  
TMS320F28068FPZT  
ACTIVE  
LQFP  
PZ  
100  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 105  
F28068FPZT  
TMS320  
TMS320F28068MPFPQ  
TMS320F28068MPNT  
PREVIEW  
ACTIVE  
LQFP  
LQFP  
PN  
PN  
80  
80  
1000  
119  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 105  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28068MPNT  
TMS320  
TMS320F28068MPZT  
ACTIVE  
LQFP  
PZ  
100  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 105  
F28068MPZT  
TMS320  
TMS320F28068PFPQ  
TMS320F28068PFPS  
PREVIEW  
ACTIVE  
HTQFP  
HTQFP  
PFP  
PFP  
80  
80  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
1000  
119  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28068PFPS  
TMS320  
TMS320F28068PNT  
ACTIVE  
LQFP  
PN  
80  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 105  
320F28068PNT  
TMS  
TMS320F28068PZPQ  
TMS320F28068PZPS  
PREVIEW  
ACTIVE  
HTQFP  
HTQFP  
PZP  
PZP  
100  
100  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
1000  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28068PZPS  
TMS320  
TMS320F28068PZT  
ACTIVE  
LQFP  
PZ  
100  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 105  
320F28068PZT  
TMS  
TMS320F28069FPFPQ  
TMS320F28069FPNT  
ACTIVE  
ACTIVE  
LQFP  
LQFP  
PN  
PN  
80  
80  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 105  
119  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28069FPNT  
TMS320  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
5-May-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
TMS320F28069FPZT  
ACTIVE  
LQFP  
PZ  
100  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 105  
F28069FPZT  
TMS320  
TMS320F28069MPFPQ  
TMS320F28069MPNT  
PREVIEW  
ACTIVE  
LQFP  
LQFP  
PN  
PN  
80  
80  
1000  
119  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
-40 to 125  
-40 to 105  
F28069MPNT  
TMS320  
TMS320F28069MPZT  
ACTIVE  
LQFP  
PZ  
100  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 105  
F28069MPZT  
TMS320  
TMS320F28069PFPQ  
TMS320F28069PFPS  
PREVIEW  
ACTIVE  
HTQFP  
HTQFP  
PFP  
PFP  
80  
80  
1000  
96  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28069PFPS  
TMS320  
TMS320F28069PNT  
ACTIVE  
LQFP  
PN  
80  
119  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 105  
320F28069PNT  
TMS  
TMS320F28069PZPQ  
TMS320F28069PZPS  
ACTIVE  
ACTIVE  
HTQFP  
HTQFP  
PZP  
PZP  
100  
100  
TBD  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
90  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
F28069PZPS  
TMS320  
TMS320F28069PZT  
TMS320F28069UPFPS  
TMS320F28069UPNT  
TMS320F28069UPZPS  
TMS320F28069UPZT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
LQFP  
HTQFP  
LQFP  
PZ  
PFP  
PN  
100  
80  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
-40 to 105  
-40 to 125  
-40 to 105  
-40 to 125  
-40 to 105  
320F28069PZT  
TMS  
1000  
119  
1000  
90  
Green (RoHS  
& no Sb/Br)  
F28069UPFPS  
TMS320  
80  
Green (RoHS  
& no Sb/Br)  
F28069UPNT  
TMS320  
HTQFP  
LQFP  
PZP  
PZ  
100  
100  
Green (RoHS  
& no Sb/Br)  
F28069UPZPS  
TMS320  
Green (RoHS  
& no Sb/Br)  
F28069UPZT  
TMS320  
TMX320F28069PNA  
TMX320F28069UPFPA  
TMX320F28069UPZPA  
ACTIVE  
ACTIVE  
LQFP  
HTQFP  
HTQFP  
PN  
80  
80  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
-40 to 85  
PFP  
PZP  
1
OBSOLETE  
100  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
Addendum-Page 4  
PACKAGE OPTION ADDENDUM  
www.ti.com  
5-May-2013  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 5  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
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complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
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Applications  
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www.ti.com/audio  
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www.dlp.com  
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