TMS320VC549PGE-100 [TI]
IC-SMD-DSP PROCESSOR ; IC- SMD- DSP处理器\n型号: | TMS320VC549PGE-100 |
厂家: | TEXAS INSTRUMENTS |
描述: | IC-SMD-DSP PROCESSOR
|
文件: | 总60页 (文件大小:785K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
D
D
D
Advanced Multibus Architecture With Three
Separate 16-Bit Data Memory Buses and
One Program Memory Bus
D
D
D
D
Arithmetic Instructions With Parallel Store
and Parallel Load
Conditional Store Instructions
Fast Return From Interrupt
40-Bit Arithmetic Logic Unit (ALU)
Including a 40-Bit Barrel Shifter and Two
Independent 40-Bit Accumulators
On-Chip Peripherals
– Software-Programmable Wait-State
Generator and Programmable Bank
Switching
– On-Chip Phase-Locked Loop (PLL) Clock
Generator With Internal Oscillator or
External Clock Source
– Time-Division Multiplexed (TDM) Serial
Port
– Buffered Serial Port (BSP)
– 8-Bit Parallel Host Port Interface (HPI)
– One 16-Bit Timer
17- × 17-Bit Parallel Multiplier Coupled to a
40-Bit Dedicated Adder for Non-Pipelined
Single-Cycle Multiply/Accumulate (MAC)
Operation
D
D
D
Compare, Select, and Store Unit (CSSU) for
the Add/Compare Selection of the Viterbi
Operator
Exponent Encoder to Compute an
Exponent Value of a 40-Bit Accumulator
Value in a Single Cycle
– External-Input/Output (XIO) Off Control
to Disable the External Data Bus,
Address Bus and Control Signals
Two Address Generators With Eight
Auxiliary Registers and Two Auxiliary
Register Arithmetic Units (ARAUs)
D
Power Consumption Control With IDLE1,
IDLE2, and IDLE3 Instructions With
Power-Down Modes
D
D
D
Data Bus With a Bus Holder Feature
Address Bus With a Bus Holder Feature
Extended Addressing Mode for 8M × 16-Bit
Maximum Addressable External Program
Space
D
D
CLKOUT Off Control to Disable CLKOUT
On-Chip Scan-Based Emulation Logic,
†
IEEE Std 1149.1 (JTAG) Boundary Scan
D
D
D
D
D
D
D
D
192K × 16-Bit Maximum Addressable
Memory Space (64K Words Program,
64K Words Data, and 64K Words I/O)
Logic
D
D
D
D
12.5-ns Single-Cycle Fixed-Point
Instruction Execution Time (80 MIPS) for
3.3-V Power Supply)
On-Chip ROM with Some Configurable to
Program/Data Memory
10-ns Single-Cycle Fixed-Point Instruction
Execution Time (100 MIPS) for 3.3-V Power
Supply (2.5-V Core)
Dual-Access On-Chip RAM
Single-Access On-Chip RAM
Single-Instruction Repeat and
Block-Repeat Operations for Program Code
8.3-ns Single-Cycle Fixed-Point Instruction
Execution Time (120 MIPS) for 3.3-V Power
Supply (2.5-V Core) (Product Preview Data)
Block-Memory-Move Instructions for Better
Program and Data Management
Available in a 144-Pin Plastic Thin Quad
Flatpack (TQFP) (PGE Suffix) and a 144-Pin
Ball Grid Array (BGA) (GGU Suffix)
Instructions With a 32-Bit Long Word
Operand
Instructions With Two- or Three-Operand
Reads
NOTE: The data provided in this data sheet for the 8.3-ns, 120 MIPS device is considered to be
Product Preview data as the devices have not completed reliability performance qualification
testing according to TI Quality Systems Specifications.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
†
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
Copyright 2000, Texas Instruments Incorporated
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
Table of Contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . 12
Recommended Operating Conditions . . . . . . . . . . . 12
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 13
Parameter Measurement Information . . . . . . . . . . . . 14
Timing Parameter Symbology . . . . . . . . . . . . . . . . . . 14
Signal Transition Reference Points . . . . . . . . . . . . . . 14
Internal Oscillator With External Crystal . . . . . . . . . 15
Divide-By-Two/Divide-By-Four Clock Option . . . . . 16
Multiply-By-N Clock Option . . . . . . . . . . . . . . . . . . . . 18
Memory and Parallel I/O Interface Timing . . . . . . . . 20
Timing Requirements for a Parallel I/O Port Read . 26
SPICE Simulation Results . . . . . . . . . . . . . . . . . . . . . 28
Ready Timing for Externally Generated Wait States 31
HOLD and HOLDA Timing . . . . . . . . . . . . . . . . . . . . . 36
Reset, BIO, Interrupt, and MP/MC Timings . . . . . . . 38
Serial Port Receive Timing . . . . . . . . . . . . . . . . . . . . . 42
Buffered Serial Port Receive Timing . . . . . . . . . . . . . 45
Serial-Port Receive Timing in TDM Mode . . . . . . . . 49
Host-Port Interface Timing . . . . . . . . . . . . . . . . . . . . . 53
Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
description
The TMS320VC549 fixed-point, digital signal processor (DSP) (hereafter referred to as the ’549) is based on
an advanced modified Harvard architecture that has one program memory bus and three data memory buses.
The processor also provides an arithmetic logic unit (ALU) that has a high degree of parallelism,
application-specific hardware logic, on-chip memory, and additional on-chip peripherals. The ’549 also utilizes
a highly specialized instruction set, which is the basis of its operational flexibility and speed.
Separate program and data spaces allow simultaneous access to program instructions and data, providing the
high degree of parallelism. Two reads and one write operation can be performed in a single cycle. Instructions
with parallel store and application-specific instructions can fully utilize this architecture. In addition, data can be
transferred between data and program spaces. Such parallelism supports a powerful set of arithmetic, logic,
and bit-manipulation operations that can all be performed in a single machine cycle. In addition, the ’549
includes the control mechanisms to manage interrupts, repeated operations, and function calls.
This data sheet contains the pin layouts, signal descriptions, and electrical specifications for the TMS320VC549
DSP. For additional information, see the TMS320C54x, TMS320LC54x, TMS320VC54x Fixed-Point Digital
Signal Processors data sheet (literature number SPRS039). The SPRS039 is considered a family functional
overview and should be used in conjunction with this data sheet.
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
†‡
PGE PACKAGE
(TOP VIEW)
1
108
V
A18
A17
SS
A22
2
107
3
106
V
DV
V
A16
D5
D4
D3
D2
D1
D0
RS
X2/CLKIN
X1
HD3
CLKOUT
SS
DD
SS
4
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
5
A10
HD7
A11
A12
A13
A14
A15
6
7
8
9
10
11
12
13
14
15
16
17
18
CV
HAS
DD
V
V
SS
SS
DD
CV
HCS
V
SS
HPIENA
CV
HR/W
DD
READY 19
PS 20
V
TMS
SS
DS 21
IS 22
TCK
TRST
TDI
TDO
EMU1/OFF
EMU0
TOUT
HD2
TEST1
CLKMD3
CLKMD2
CLKMD1
R/W 23
MSTRB 24
IOSTRB 25
MSC 26
XF 27
HOLDA 28
IAQ 29
HOLD 30
BIO 31
MP/MC 32
DV
V
33
V
DD
SS
SS
DV
34
DD
BDR1 35
BFSR1 36
BDX1
BFSX1
†
‡
NC = No connection
DV
is the power supply for the I/O pins while CV
DD
is the power supply for the core CPU, and V is the ground for both the I/O pins and the
SS
DD
core CPU.
For the 144-pin TQFP, the letter B in front of CLKRn, FSRn, DRn, CLKXn, FSXn, and DXn pin names denotes
buffered serial port (BSP), where n = 0 or 1 port. The letter T in front of CLKR, FSR, DR, CLKX, FSX, and DX
pin names denotes time-division multiplexed (TDM) serial port.
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
GGU PACKAGE
(BOTTOM VIEW)
13 12 11 10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
The pin assignments table to follow lists each signal quadrant and BGA ball pin number for the 144-pin BGA
package.
The ’549 signal descriptions table lists each terminal name, function, and operating mode(s).
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
†
Pin Assignments for the 144-Pin GGU Package
SIGNAL
QUADRANT 1
SIGNAL
QUADRANT 2
SIGNAL
QUADRANT 3
SIGNAL
QUADRANT 4
BGA BALL #
BGA BALL #
BGA BALL #
BGA BALL #
V
A1
B1
C2
C1
D4
D3
D2
D1
E4
E3
E2
E1
F4
F3
F2
F1
G2
G1
G3
G4
H1
H2
H3
H4
J1
BFSX1
BDX1
N13
M13
L12
L13
K10
K11
K12
K13
J10
J11
V
N1
N2
M3
N3
K4
A19
A20
A13
A12
B11
A11
D10
C10
B10
A10
D9
C9
B9
SS
A22
SS
BCLKR1
HCNTL0
V
DV
V
SS
DV
DD
SS
DV
V
SS
V
SS
DD
A10
DD
D6
CLKMD1
CLKMD2
CLKMD3
TEST1
HD2
BCLKR0
TCLKR
BFSR0
HD7
A11
A12
A13
A14
A15
L4
D7
D8
M4
N4
K5
TFSR/TADD
BDR0
D9
D10
D11
D12
HD4
D13
D14
D15
HD5
TOUT
HCNTL1
TDR
L5
EMU0
EMU1/OFF
TDO
J12
J13
H10
H11
H12
H13
G12
G13
G11
G10
F13
F12
F11
F10
E13
E12
E11
E10
D13
D12
D11
C13
C12
C11
B13
B12
M5
N5
K6
CV
DD
HAS
BCLKX0
TCLKX
A9
D8
C8
B8
V
V
TDI
V
SS
L6
SS
TRST
HINT
CVDD
M6
N6
M7
N7
L7
SS
CV
DD
HCS
TCK
A8
TMS
BFSX0
CV
B7
DD
HR/W
READY
PS
V
TFSX/TFRM
HRDY
V
SS
HDS1
A7
SS
CV
C7
D7
A6
DD
HPIENA
DV
K7
V
DD
SS
HDS2
DV
DS
V
SS
V
SS
N8
M8
L8
IS
CLKOUT
HD3
X1
HD0
BDX0
TDX
IACK
HBIL
NMI
B6
DD
A0
R/W
C6
D6
A5
MSTRB
IOSTRB
MSC
XF
K8
A1
A2
A3
HD6
A4
A5
A6
A7
A8
A9
X2/CLKIN
RS
N9
M9
L9
J2
B5
J3
D0
C5
D5
A4
HOLDA
IAQ
J4
D1
INT0
INT1
INT2
INT3
K9
K1
K2
K3
L1
D2
N10
M10
L10
N11
M11
L11
N12
M12
HOLD
BIO
D3
B4
D4
C4
A3
MP/MC
D5
CV
DD
DV
L2
A16
HD1
B3
DD
V
SS
L3
V
SS
V
SS
CV
DD
A21
C3
A2
BDR1
M1
M2
A17
A18
BCLKX1
BFSR1
V
V
SS
B2
SS
is the power supply for the core CPU, and V
†
DV
is the power supply for the I/O pins while CV
DD
is the ground for both the I/O pins and the
SS
DD
core CPU.
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
’549 Signal Descriptions
TERMINAL
DESCRIPTION
†
NAME
TYPE
DATA SIGNALS
A22 (MSB)
A21
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A9
Parallel port address bus A22 (MSB) through A0 (LSB). The sixteen LSBs (A15–A0) are multiplexed to address
external data/program memory or I/O. A15–A0 are placed in the high-impedance state in the hold mode. A15–A0
also go into the high-impedance state when EMU1/OFF is low. The seven MSBs (A22 to A16) are used for
extended program memory addressing.
The address bus have a feature called bus holder that eliminates passive components and the power dissipation
associated with it. The bus holders keep the address bus at the previous logic level when the bus goes into a
high-impedance state. The bus holders on the address bus are always enabled.
O/Z
A8
A7
A6
A5
A4
A3
A2
A1
A0
(LSB)
D15 (MSB)
D14
D13
D12
D11
D10
D9
Parallel port data bus D15 (MSB) through D0 (LSB). D15–D0 are multiplexed to transfer data between the core
CPU and external data/program memory or I/O devices. D15–D0 are placed in the high-impedance state when
not output or when RS or HOLD is asserted. D15–D0 also go into the high-impedance state when EMU1/OFF
is low.
The data bus has a feature called bus holder that eliminates passive components and the power dissipation
associated with it. The bus holders keep the data bus at the previous logic level when the bus goes into a
high-impedance state. These bus holders are enabled or disabled by the BH bit in the bank switching control
register (BSCR).
D8
D7
I/O/Z
D6
D5
D4
D3
D2
D1
D0
(LSB)
INITIALIZATION, INTERRUPT AND RESET OPERATIONS
Interrupt acknowledge signal. IACK indicates the receipt of an interrupt and that the program counter is fetching
the interrupt vector location designated by A15–0. IACK also goes into the high-impedance state when
EMU1/OFF is low.
IACK
O/Z
I
INT0
INT1
INT2
INT3
External user interrupt inputs. INT0–INT3 are prioritized and are maskable by the interrupt mask register and the
interrupt mode bit. INT0 –INT3 can be polled and reset by the interrupt flag register.
†
I = Input, O = Output, Z = High impedance
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
’549 Signal Descriptions (Continued)
TERMINAL
NAME TYPE
DESCRIPTION
†
INITIALIZATION, INTERRUPT AND RESET OPERATIONS (CONTINUED)
Nonmaskable interrupt. NMI is an external interrupt that cannot be masked by way of the INTM or the IMR. When
NMI is activated, the processor traps to the appropriate vector location.
NMI
RS
I
I
Reset input. RS causes the DSP to terminate execution and forces the program counter to 0FF80h. When RS
is brought to a high level, execution begins at location 0FF80h of the program memory. RS affects various
registers and status bits.
Microprocessor/microcomputer mode-select pin. If active-low at reset (microcomputer mode), MP/MC causes
the internal program ROM to be mapped into the upper program memory space. In the microprocessor mode,
off-chip memory and its corresponding addresses (instead of internal program ROM) are accessed by the DSP.
MP/MC
CNT
I
I
I/O level select. With CMOS-compatible I/O interface levels, CNT is pulled to a high level.
MULTIPROCESSING SIGNALS
Branch control input. A branch can be conditionally executed when BIO is active. If low, the processor executes
the conditional instruction. The BIO condition is sampled during the decode phase of the pipeline for the XC
instruction, and all other instructions sample BIO during the read phase of the pipeline.
BIO
XF
I
External flag output (latched software-programmable signal). XF is set high by the SSBX XF instruction, set low
by RSBX XF instruction or by loading the ST1 status register. XF is used for signaling other processors in
multiprocessor configurations or as a general-purpose output pin. XF goes into the high-impedance state when
OFF is low, and is set high at reset.
O/Z
MEMORY CONTROL SIGNALS
Data, program, and I/O space select signals. DS, PS, and IS are always high unless driven low for communicating
to a particular external space. Active period corresponds to valid address information. Placed into a
high-impedance state in hold mode. DS, PS, and IS also go into the high-impedance state when EMU1/OFF is
low.
DS
PS
IS
O/Z
O/Z
I
Memory strobe signal. MSTRB is always high unless low-level asserted to indicate an external bus access to data
or program memory. Placed in high-impedance state in hold mode. MSTRB also goes into the high-impedance
state when OFF is low.
MSTRB
READY
R/W
Data-ready input. READY indicates that an external device is prepared for a bus transaction to be completed.
If the device is not ready (READY is low), the processor waits one cycle and checks READY again. Note that the
processor performs ready-detection if at least two software wait states are programmed. The READY signal is
not sampled until the completion of the software wait states.
Read/write signal. R/W indicates transfer direction during communication to an external device and is normally
high (in read mode), unless asserted low when the DSP performs a write operation. Placed in the high-impedance
state in hold mode, R/W also goes into the high-impedance state when EMU1/OFF is low.
O/Z
I/O strobe signal. IOSTRB is always high unless low level asserted to indicate an external bus access to an I/O
device. Placed in high-impedance state in hold mode. IOSTRB also goes into the high-impedance state when
EMU1/OFF is low.
IOSTRB
HOLD
O/Z
I
Hold input. HOLD is asserted to request control of the address, data, and control lines. When acknowledged,
these lines go into high-impedance state.
Hold acknowledge signal. HOLDA indicates to the external circuitry that the processor is in a hold state and that
the address, data, and control lines are in a high-impedance state, allowing them to be available to the external
circuitry. HOLDA also goes into the high-impedance state when EMU1/OFF is low.
HOLDA
O/Z
Microstate complete signal. Goes low on CLKOUT falling at the start of the first software wait state. Remains low
until one CLKOUT cycle before the last programmed software wait state. If connected to the READY line, MSC
forces one external wait state after the last internal wait state has been completed. MSC also goes into the
high-impedance state when EM1/OFF is low.
MSC
O/Z
†
I = Input, O = Output, Z = High impedance
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
’549 Signal Descriptions (Continued)
TERMINAL
NAME TYPE
DESCRIPTION
†
MEMORY CONTROL SIGNALS (CONTINUED)
Instruction acquisition signal. IAQ is asserted (active low) when there is an instruction address on the address
bus and goes into the high-impedance state when EMU1/OFF is low.
IAQ
O/Z
OSCILLATOR/TIMER SIGNALS
Master clock output signal. CLKOUT cycles at the machine-cycle rate of the CPU. The internal machine cycle
is bounded by the falling edges of this signal. CLKOUT also goes into the high-impedance state when EMU1/OFF
is low.
CLKOUT
O/Z
CLKMD1
CLKMD2
CLKMD3
Clock mode external/internal input signals. CLKMD1, CLKMD2, and CLKMD3 allow you to select and configure
different clock modes, such as crystal, external clock, and various PLL factors. Refer to PLL section for a detailed
functional description of these pins.
I
I
Input pin to internal oscillator from the crystal. If the internal (crystal) oscillator is not being used, a clock can
become input to the device using this pin. The internal machine cycle time is determined by the clock
operating-mode pins (CLKMD1, CLKMD2 and CLKMD3).
X2/CLKIN
Output pin from the internal oscillator for the crystal. If the internal oscillator is not used, X1 should be left
unconnected. X1 does not go into the high-impedance state when EMU1/OFF is low.
X1
O
Timer output. TOUT signals a pulse when the on-chip timer counts down past zero. The pulse is a CLKOUT-cycle
wide. TOUT also goes into the high-impedance state when EMU1/OFF is low.
TOUT
O/Z
BUFFERED SERIAL PORT 0 AND BUFFERED SERIAL PORT 1 SIGNALS
Receive clocks. External clock signal for clocking data from the data-receive (DR) pin into the buffered serial port
receive shift registers (RSRs). Must be present during buffered serial port transfers. If the buffered serial port is
not being used, BCLKR0 and BCLKR1 can be sampled as an input by way of IN0 bit of the SPC register.
BCLKR0
BCLKR1
I
Transmit clock. Clock signal for clocking data from the serial port transmit shift register (XSR) to the data transmit
(DX) pin. BCLKX can be an input if MCM in the serial port control register is cleared to 0. It also can be driven
by the device at 1/(CLKDV + 1) where CLKDV range is 0–31 CLKOUT frequency when MCM is set to 1. If the
buffered serial port is not used, BCLKX can be sampled as an input by way of IN1 of the SPC register. BCLKX0
and BCLKX1 go into the high-impedance state when OFF is low.
BCLKX0
BCLKX1
I/O/Z
BDR0
BDR1
I
O/Z
I
Buffered serial-data-receive input. Serial data is received in the RSR by BDR0/BDR1.
BDX0
BDX1
Buffered serial-port-transmit output. Serial data is transmitted from the XSR by way of BDX. BDX0 and BDX1 are
placed in the high-impedance state when not transmitting and when EMU1/OFF is low.
BFSR0
BFSR1
Frame synchronization pulse for receive input. The falling edge of the BFSR pulse initiates the data-receive
process, beginning the clocking of the RSR.
Frame synchronization pulse for transmit input/output. The falling edge of the BFSX pulse initiates the
data-transmit process, beginning the clocking of the XSR. Following reset, the default operating condition of
BFSX is an input. BFSX0 and BFSX1 can be selected by software to be an output when TXM in the serial control
register is set to 1. This pin goes into the high-impedance state when EMU1/OFF is low.
BFSX0
BFSX1
I/O/Z
SERIAL PORT 0 AND SERIAL PORT 1 SIGNALS
Receive clocks. External clock signal for clocking data from the data receive (DR) pin into the serial port receive
shift register (RSR). Must be present during serial port transfers. If the serial port is not being used, CLKR0 and
CLKR1 can be sampled as an input via IN0 bit of the SPC register.
CLKR0
CLKR1
I
Transmit clock. Clock signal for clocking data from the serial port transmit shift register (XSR) to the data transmit
(DX) pin. CLKX can be an input if MCM in the serial port control register is cleared to 0. It also can be driven by
the device at 1/4 CLKOUT frequency when MCM is set to 1. If the serial port is not used, CLKX can be sampled
as an input via IN1 of the SPC register. CLKX0 and CLKX1 go into the high-impedance state when EMU1/OFF
is low.
CLKX0
CLKX1
I/O/Z
I
DR0
DR1
Serial-data-receive input. Serial data is received in the RSR by DR.
†
I = Input, O = Output, Z = High impedance
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’549 Signal Descriptions (Continued)
TERMINAL
NAME TYPE
DESCRIPTION
†
SERIAL PORT 0 AND SERIAL PORT 1 SIGNALS (CONTINUED)
DX0
DX1
Serial port transmit output. Serial data is transmitted from the XSR via DX. DX0 and DX1 are placed in the
high-impedance state when not transmitting and when EMU1/OFF is low.
O/Z
I
FSR0
FSR1
Frame synchronization pulse for receive input. The falling edge of the FSR pulse initiates the data-receive
process, beginning the clocking of the RSR.
Frame synchronization pulse for transmit input/output. The falling edge of the FSX pulse initiates the data transmit
process, beginning the clocking of the XSR. Following reset, the default operating condition of FSX is an input.
FSX0 and FSX1 can be selected by software to be an output when TXM in the serial control register is set to 1.
This pin goes into the high-impedance state when EMU1/OFF is low.
FSX0
FSX1
I/O/Z
TDM SERIAL PORT SIGNALS
TDM receive clock input
TCLKR
I
TDR
I
TDM serial data-receive input
TFSR/TADD
TCLKX
I/O
TDM receive frame synchronization or TDM address
TDM transmit clock
I/O/Z
O/Z
I/O/Z
TDX
TDM serial data-transmit output
TFSX/TFRM
TDM transmit frame synchronization
HOST PORT INTERFACE SIGNALS
Parallel bidirectional data bus. HD0–HD7 are placed in the high-impedance state when not outputting data. The
signals go into the high-impedance state when EMU1/OFF is low. These pins each have bus holders similar to
those on the address/data bus, but which are always enabled.
HD0–HD7
I/O/Z
I
HCNTL0
HCNTL1
Control inputs
HBIL
HCS
I
I
Byte-identification input
Chip-select input
HDS1
HDS2
I
Data strobe inputs
HAS
I
I
Address strobe input
HR/W
HRDY
Read/write input
O/Z
Ready output. This signal goes into the high-impedance state when EMU1/OFF is low.
Interrupt output. When the DSP is in reset, this signal is driven high. The signal goes into the high-impedance
HINT
O/Z
I
state when EMU1/OFF is low.
HPI module select input. This signal must be tied to a logic 1 state to have HPI selected. If this input is left open
or connected to ground, the HPI module will not be selected, internal pullup for the HPI input pins are enabled,
and the HPI data bus has keepers set. This input is provided with an internal pull-down resistor which is active
only when RS is low. HPIENA is sampled when RS goes high and ignored until RS goes low again. Refer to the
Electrical Characteristics section for the input current requirements for this pin.
HPIENA
SUPPLY PINS
CV
DV
Supply
Supply
Supply
+V . CV
DD
is the dedicated power supply for the core CPU.
is the dedicated power supply for I/O pins.
is the dedicated power ground for the device.
DD
DD
DD
DD
SS
+V . DV
DD
V
†
Ground. V
SS
I = Input, O = Output, Z = High impedance
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’549 Signal Descriptions (Continued)
TERMINAL
NAME TYPE
DESCRIPTION
†
IEEE1149.1 TEST PINS
IEEE standard 1149.1 test clock. Pin with internal pullup device. This is normally a free-running clock signal with
a 50% duty cycle. The changes on the test-access port (TAP) of input signals TMS and TDI are clocked into the
TAP controller, instruction register, or selected test data register on the rising edge of TCK. Changes at the TAP
output signal (TDO) occur on the falling edge of TCK.
TCK
I
IEEE standard 1149.1 test data input. Pin with internal pullup device. TDI is clocked into the selected register
(instruction or data) on a rising edge of TCK.
TDI
I
IEEE standard 1149.1 test data output. The contents of the selected register (instruction or data) is shifted out
of TDO on the falling edge of TCK. TDO is in the high-impedance state except when the scanning of data is in
progress. TDO also goes into the high-impedance state when EMU1/OFF is low.
TDO
TMS
TRST
O/Z
IEEE standard 1149.1 test mode select. Pin with internal pullup device. This serial control input is clocked into
the TAP controller on the rising edge of TCK.
I
I
IEEE standard 1149.1 test reset. TRST, when high, gives the IEEE standard 1149.1 scan system control of the
operations of the device. If TRST is not connected or driven low, the device operates in its functional mode, and
the IEEE standard 1149.1 signals are ignored. Pin with internal pulldown device.
Emulator interrupt 0 pin. When TRST is driven low, EMU0 must be high for the activation of the EMU1/OFF
condition. When TRST is driven high, EMU0 is used as an interrupt to or from the emulator system and is defined
as input/output by way of IEEE standard 1149.1 scan system.
EMU0
I/O/Z
Emulator interrupt 1 pin/disable all outputs. When TRST is driven high, EMU1/OFF is used as an interrupt to or
from the emulator system and is defined as input/output by way of IEEE standard 1149.1 scan system. When
TRST is driven low, EMU1/OFF is configured as OFF. The EMU1/OFF signal, when active low, puts all output
drivers into the high-impedance state. Note that OFF is used exclusively for testing and emulation purposes (not
for multiprocessing applications). Therefore, for the OFF condition, the following conditions apply:
TRST = low,
EMU1/OFF
I/O/Z
EMU0 = high
EMU1/OFF = low
DEVICE TEST PIN
TEST1
I
Test1 – Reserved for internal use only. This pin must not be connected (NC).
†
I = Input, O = Output, Z = High impedance
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†
absolute maximum ratings over specified temperature range (unless otherwise noted)
Supply voltage I/O range, DV ‡ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 4.6 V
DD
DD
‡
Supply voltage core range, CV
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 3.75 V
Input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 4.6 V
Output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 4.6 V
Operating case temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 100°C
C
Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 150°C
stg
†
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to V
.
SS
recommended operating conditions
MIN
3
NOM
3.3
MAX
3.6
UNIT
V
†
Device supply voltage, I/O
DV
CV
DD
DD
†
Device supply voltage, core
Supply voltage, GND
2.4
2.5
2.75
V
V
V
V
0
V
SS
Schmitt trigger inputs, DV
DD
=
2.5
DV
DV
+ 0.3
DD
DD
‡
3.3"0.3 V
High-level input voltage, I/O
V
IH
All other inputs
2
+ 0.3
Low-level input voltage
High-level output current
Low-level output current
Operating case temperature
–0.3
0.8
V
IL
I
–300
1.5
µA
mA
°C
OH
OL
I
T
C
–40
100
†
Texas Instrument DSPs do not require specific power sequencing between the core supply and the I/O supply. However, systems should be
designed to ensure that neither supply is powered up for extended periods of time if the other supply is below the proper operating voltage.
Excessive exposure to these conditions can adversely affect the long term reliability of the devices. System-level concerns such as bus contention
may require supply sequencing to be implemented. In this case, the core supply should be powered up at the same time as, or prior to (and
powered down after), the I/O buffers. For additional power sequencing information, see the Power Supply Sequencing Solutions For Dual Supply
Voltage DSPs application report (literature number SLVA073).
‡
On the ’VC549 devices, the following pins have schmitt trigger inputs: RS, INTn, NMI, X2/CLKIN, CLKMDn, TCK, HAS, HCS, HDSn, BCLKRn,
TCLKR, BCLKXn, and TCLKX
Refer to Figure 1 for 3.3-V device test load circuit values.
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electrical characteristics over recommended operating case temperature range (unless otherwise
noted)
†
TYP
PARAMETER
TEST CONDITIONS
= 3.3"0.3 V, = MAX
MIN
2.4
MAX
UNIT
‡
V
V
V
DD
I
OH
V
High-level output voltage
OH
‡
Low-level output voltage
I
= MAX
0.4
V
OL
OL
A[22:0]
V
= MAXk
–150
–10
250
DD
Input current in high
impedance
I
IZ
µA
All other pins
V
DD
= MAX, V = V to V
SS DD
10
I
TRST
With internal pulldown
–10
–10
800
400
10
HPIENA
With internal pulldown, RS = 0
With internal pullups
||
TMS, TCK, TDI, HPI
D[15:0], HD[7:0]
X2/CLKIN
–400
–150
–40
Input current
I
I
µA
(V = V
SS
to V )
DD
Bus holders enabled, V
= MAXk
250
40
I
DD
Oscillator enabled
All other input-only pins
–10
10
§
§
¶
#
2
I
I
Supply current, core CPU
Supply current, pins
CV
DV
= 2.5 V, f = 40 MHz,
T
T
= 25°C
= 25°C
20
mA
DDC
DD
DD
x
C
= 3.3 V, f = 40 MHz,
12
mA
mA
DDP
x
C
IDLE2
PLL × 1 mode, 40 MHz input
Divide-by-two mode, CLKIN stopped
(’VC549-80 and ’VC549-100)
15
Supply current,
standby
I
DD
IDLE3
µA
Divide-by-two mode, CLKIN stopped
(’VC549-120 only)
170
C
C
Input capacitance
Output capacitance
10
10
pF
pF
i
o
†
‡
§
¶
All values are typical unless otherwise specified.
All input and output voltage levels except RS, INT0–INT3, NMI, CNT, X2/CLKIN, CLKMD0–CLKMD3 are LVTTL-compatible.
Clock mode: PLL × 1 with external source
This value was obtained with 50% usage of MAC and 50% usage of NOP instructions. Actual operating current varies with program being
executed.
#
||
This value was obtained with single-cycle external writes, CLKOFF = 0 and load = 15 pF. For more details on how this calculation is performed,
refer to the Calculation of TMS320C54x Power Dissipation application report (literature number SPRA164).
HPI input signals except for HPIENA.
kV
≤ V ≤ V
IL(MAX)
or V
IH(MIN)
≤ V ≤ V
IH(MAX)
IL(MIN)
I
I
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PARAMETER MEASUREMENT INFORMATION
timing parameter symbology
Timing parameter symbols used are created in accordance with JEDEC Standard 100-A. To shorten the
symbols, some of the pin names and other related terminology have been abbreviated as follows:
Lowercase subscripts and their meanings:
Letters and symbols and their meanings:
a
access time
H
L
High
c
cycle time (period)
delay time
Low
d
V
Z
Valid
dis
en
f
disable time
High impedance
enable time
fall time
h
hold time
r
rise time
su
t
setup time
transition time
valid time
v
w
X
pulse duration (width)
Unknown, changing, or don’t care level
signal transition reference points
All timing references are made at a voltage of 1.5 volts, except rise and fall times which are referenced at the
10% and 90% points of the specified low and high logic levels, respectively.
I
OL
50 Ω
Output
Under
Test
Tester Pin
Electronics
V
Load
C
T
I
OH
Where: I
I
= 1.5 mA (all outputs)
= 300 µA (all outputs)
= 1.5 V
OL
OH
Load
T
V
C
= 40 pF typical load circuit capacitance.
Figure 1. 3.3-V Test Load Circuit
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internal oscillator with external crystal
The internal oscillator is enabled by selecting the appropriate clock mode at reset (this is device dependent –
see PLL section) and connecting a crystal or ceramic resonator across X1 and X2/CLKIN. The CPU clock
frequency is one-half the crystal’s oscillation frequency following reset. After reset, the clock mode of the devices
with the software PLL can also be changed to divide-by-four.
The crystal should be in fundamental mode operation and parallel resonant with an effective series resistance
of 30ohms and power dissipation of 1 mW. The connection of the required circuit, consisting of the crystal and
two load capacitors, is shown in Figure 2. The load capacitors, C and C , should be chosen such that the
1
2
equation below is satisfied. C in the equation is the load specified for the crystal.
L
C1C2
CL +
(C1 ) C2)
recommended operating conditions (see Figure 2)
’549-80
’549-100
’549-120
UNIT
MIN NOM
MAX
MIN NOM
MAX
MIN NOM
MAX
†
10
‡
20
†
10
‡
20
†
10
‡
20
f
x
Input clock frequency
MHz
†
‡
This device utilizes a fully static design and therefore can operate with t
approaching 0 Hz.
It is recommended that the PLL clocking option be used for maximum frequency operation.
approaching ∞. The device is characterized at frequencies
c(CI)
X1
X2/CLKIN
Crystal
C1
C2
Figure 2. Internal Divide-by-Two Clock Option With External Crystal
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divide-by-two/divide-by-four clock option – PLL disabled
The frequency of the reference clock provided at the X2/CLKIN pin can be divided by a factor of two or four to
generate the internal machine cycle.
When an external clock source is used, the frequency injected must conform to specifications listed in the timing
requirements table.
switching characteristics over recommended operating conditions for divide-by-two/
divide-by-four clock option – PLL disabled [H = 0.5t
recommended operating conditions table)
] (see Figure 2 and Figure 3, and the
c(CO)
’549-80
’549-100
TYP
’549-120
TYP
PARAMETER
UNIT
ns
MIN
TYP
MAX
MIN
MAX
MIN
MAX
‡
12.5
†
‡
10
†
‡
8.33
†
t
Cycle time, CLKOUT
2t
c(CI)
2t
2t
c(CO)
c(CI)
6
c(CI)
6
Delay time, X2/CLKIN high to
CLKOUT high/low
t
3
6
10
3
10
3
10
ns
d(CIH-CO)
†
t
Fall time, CLKOUT
2
2
2
2
2
2
ns
ns
ns
ns
f(CO)
†
t
t
t
Rise time, CLKOUT
r(CO)
†
Pulse duration, CLKOUT low
H–3
H–3
H–1
H–1
H
H
H–2
H–2
H–1
H–1
H
H
H–2
H–2
H–1
H–1
H
H
w(COL)
w(COH)
†
Pulse duration, CLKOUT high
†
This device utilizes a fully static design and therefore can operate with t
approaching 0 Hz.
It is recommended that the PLL clocking option be used for maximum frequency operation.
approaching ∞. The device is characterized at frequencies
c(CI)
‡
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divide-by-two/divide-by-four clock option – PLL disabled (continued)
timing requirements for divide-by-two/divide-by-four clock option – PLL disabled (see Figure 3)
’549-80
MIN MAX
’549-100
MIN MAX
’549-120
MIN MAX
UNIT
‡
†
‡
†
‡
†
t
t
t
t
t
Cycle time, X2/CLKIN
20
20
20
ns
ns
ns
ns
ns
c(CI)
Fall time, X2/CLKIN
8
8
8
f(CI)
Rise time, X2/CLKIN
8
†
8
†
8
†
r(CI)
Pulse duration, X2/CLKIN low
Pulse duration, X2/CLKIN high
5
5
5
5
5
5
w(CIL)
w(CIH)
†
†
†
†
This device utilizes a fully static design and therefore can operate with t
approaching 0 Hz.
It is recommended that the PLL clocking option be used for maximum frequency operation.
approaching ∞. The device is characterized at frequencies
c(CI)
‡
t
r(CI)
t
f(CI)
t
w(CIH)
t
c(CI)
X2/CLKIN
CLKOUT
t
w(CIL)
t
w(COH)
t
f(CO)
t
c(CO)
t
r(CO)
t
d(CIH-CO)
t
w(COL)
Figure 3. External Divide-by-Two Clock Timing
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multiply-by-N clock option – PLL enabled
The frequency of the reference clock provided at the X2/CLKIN pin can be multiplied by a factor of N to generate
the internal machine cycle.
When an external clock source is used, the frequency injected must conform to specifications listed in the timing
requirements table.
switching characteristics over recommended operating conditions for multiply-by-N clock option
– PLL enabled [H = 0.5t
conditions table)
] (see Figure 2 and Figure 4, and the recommended operating
c(CO)
’549-80
TYP
’549-100
TYP
’549-120
TYP
PARAMETER
UNIT
ns
MIN
MAX
MIN
MAX
MIN
MAX
t
Cycle time, CLKOUT
12.5
t
10
t
8.33
t
c(CO)
c(CI)/N
6
c(CI)/N
6
c(CI)/N
6
Delay time, X2/CLKIN high/low to
CLKOUT high/low
t
3
10
3
10
3
10
ns
d(CIH-CO)
t
Fall time, CLKOUT
2
2
2
2
2
2
ns
ns
ns
ns
ms
f(CO)
r(CO)
w(COL)
w(COH)
p
t
t
t
t
Rise time, CLKOUT
Pulse duration, CLKOUT low
Pulse duration, CLKOUT high
Transitory phase, PLL lock-up time
H–3
H–3
H–1
H–1
H
H
H–2
H–2
H–1
H–1
H
H
H–2
H–2
H–1
H–1
H
H
29
35
45
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PRO CE SSO R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
multiply-by-N clock option – PLL enabled (continued)
timing requirements for multiply-by-N clock option – PLL enabled (see Figure 4)
’549-100
’549-120
’549-80
UNIT
MIN
MAX
200
100
50
MIN
MAX
†
20
†
20
†
20
†
20
†
20
†
20
Integer PLL multiplier N (N = 1–15)
PLL multiplier N = x.5
200
100
50
t
Cycle time, X2/CLKIN
ns
c(CI)
PLL multiplier N = x.25, x.75
t
t
t
t
Fall time, X2/CLKIN
8
8
8
8
ns
ns
ns
ns
f(CI)
Rise time, X2/CLKIN
r(CI)
Pulse duration, X2/CLKIN low
Pulse duration, X2/CLKIN high
5
5
5
5
w(CIL)
w(CIH)
†
Note that for all values of t
, the minimum t
period must not be exceeded.
c(CI)
c(CO)
t
f(CI)
t
t
w(CIL)
t
w(CIH)
r(CI)
t
c(CI)
X2/CLKIN
t
d(CIH-CO)
t
f(CO)
t
w(COH)
t
c(CO)
t
w(COL)
t
tp
r(CO)
Unstable
CLKOUT
Figure 4. External Multiply-by-One Clock Timing
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P RO C ES S O R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
memory and parallel I/O interface timing
switching characteristics over recommended operating conditions for a memory read
†‡
(MSTRB = 0) (see Figure 5)
’549-80
MIN
– 1
’549-100
MIN MAX
’549-120
MIN MAX
PARAMETER
UNIT
MAX
§
t
t
Delay time, address valid from CLKOUT low
5
5
5
5
5
5
– 1
– 1
– 1
– 1
– 1
–1
4
4
4
5
4
4
– 1
– 1
– 1
– 1
– 1
–1
4
4
3
3
4
4
ns
ns
ns
ns
ns
ns
d(CLKL-A)
¶
Delay time, address valid from CLKOUT high (transition)
Delay time, MSTRB low from CLKOUT low
– 1
d(CLKH-A)
t
– 1
d(CLKL-MSL)
t
Delay time, MSTRB high from CLKOUT low
– 1
d(CLKL-MSH)
§
t
Hold time, address valid after CLKOUT low
– 1
h(CLKL-A)R
h(CLKH-A)R
¶
t
Hold time, address valid after CLKOUT high
– 1
†
Address, PS, and DS timings are all included in timings referenced as address.
‡
§
¶
See Table 1, Table 2, and Table 3 for address bus timing variation with load capacitance.
In the case of a memory read preceded by a memory read
In the case of a memory read preceded by a memory write
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PRO CE SSO R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
memory and parallel I/O interface timing (continued)
†‡
timing requirements for a memory read (MSTRB = 0) [H = 0.5 t
]
(see Figure 5)
c(CO)
’549-80
’549-100
’549-120
UNIT
MIN
MAX
2H–9
2H–8
MIN
MAX
2H–8
2H–7
MIN
MAX
t
t
t
t
t
t
Access time, read data access from address valid
Access time, read data access from MSTRB low
Setup time, read data before CLKOUT low
Hold time, read data after CLKOUT low
2H–8
2H–7
ns
ns
ns
ns
ns
ns
a(A)M
a(MSTRBL)
su(D)R
5
0
0
0
5
0
0
0
5
0
0
0
h(D)R
Hold time, read data after address invalid
Hold time, read data after MSTRB high
h(A-D)R
h(D)MSTRBH
†
‡
Address, PS, and DS timings are all included in timings referenced as address.
See Table 1, Table 2, and Table 3 for address bus timing variation with load capacitance.
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P RO C ES S O R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
memory and parallel I/O interface timing (continued)
CLKOUT
t
d(CLKL-A)
t
h(CLKL-A)R
A[15:0]
t
h(A-D)R
t
su(D)R
t
a(A)M
t
h(D)R
D[15:0]
t
h(D)MSTRBH
t
d(CLKL-MSL)
t
d(CLKL-MSH)
t
a(MSTRBL)
MSTRB
R/W
PS, DS
Figure 5. Memory Read (MSTRB = 0)
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PRO CE SSO R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
memory and parallel I/O interface timing (continued)
switching characteristics over recommended operating conditions for a memory write
†‡
(MSTRB = 0) [H = 0.5 t
]
(see Figure 6)
c(CO)
’549-80
MIN MAX
’549-100
MIN MAX
’549-120
MIN MAX
UNIT
UNIT
ns
PARAMETER
Delay time, address valid from CLKOUT high
§
t
t
– 1
– 1
5
5
5
7
5
5
5
– 1
– 1
– 1
0
4
4
4
7
5
4
4
– 1
– 1
– 1
0
4
4
3
5
3
4
4
d(CLKH-A)
¶
Delay time, address valid from CLKOUT low
Delay time, MSTRB low from CLKOUT low
Delay time, data valid from CLKOUT low
Delay time, MSTRB high from CLKOUT low
Delay time, R/W low from CLKOUT high
Delay time, R/W high from CLKOUT high
Delay time, MSTRB low after R/W low
ns
d(CLKL-A)
t
– 1
ns
d(CLKL-MSL)
t
0
ns
d(CLKL-D)W
t
– 1
– 1
0
– 1
– 1
– 1
ns
d(CLKL-MSH)
t
0
ns
d(CLKH-RWL)
t
– 1
– 1
ns
d(CLKH-RWH)
t
H – 2
– 1
H + 3 H – 2
H + 2 H – 2 H + 2
ns
d(RWL-MSTRBL)
§
t
Hold time, address valid after CLKOUT high
Hold time, write data valid after MSTRB high
Pulse duration, MSTRB low
5
– 1
4
– 1
4
ns
h(A)W
¶
¶
¶
t
t
t
t
H–4
2H–5
2H–5
2H–7
H+4
H–3 H+3
H–3 H+3
ns
ns
ns
ns
h(D)MSH
w(SL)MS
su(A)W
2H–4
2H–4
Setup time, address valid before MSTRB low
2H–4
2H–4
¶
¶
¶
2H–4 2H+4
Setup time, write data valid before MSTRB high
2H+7
2H–5 2H+5
su(D)MSH
†
Address, PS, and DS timings are all included in timings referenced as address.
‡
§
¶
See Table 1, Table 2, and Table 3 for address bus timing variation with load capacitance.
In the case of a memory write preceded by a memory write.
In the case of a memory write preceded by an I/O cycle.
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P RO C ES S O R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
memory and parallel I/O interface timing (continued)
CLKOUT
t
d(CLKH-A)
t
d(CLKL-A)
t
h(A)W
A[15:0]
D[15:0]
MSTRB
R/W
t
d(CLKL-D)W
t
h(D)MSH
t
su(D)MSH
t
d(CLKL-MSL)
t
d(CLKL-MSH)
t
t
su(A)W
t
d(CLKH-RWL)
d(CLKH-RWH)
t
w(SL)MS
t
d(RWL-MSTRBL)
PS, DS
Figure 6. Memory Write (MSTRB = 0)
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PRO CE SSO R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
memory and parallel I/O interface timing (continued)
switching characteristics over recommended operating conditions for a parallel I/O port read
†‡
(IOSTRB = 0) (see Figure 7)
’549-80
MIN
– 1
’549-100
MIN
– 1
’549-120
MIN
– 1
PARAMETER
UNIT
MAX
MAX
MAX
t
Delay time, address valid from CLKOUT low
Delay time, IOSTRB low from CLKOUT high
Delay time, IOSTRB high from CLKOUT high
Hold time, address after CLKOUT low
5
5
5
5
4
4
4
4
4
4
4
4
ns
ns
ns
ns
d(CLKL-A)
t
0
0
0
d(CLKH-ISTRBL)
t
– 1
– 1
– 1
d(CLKH-ISTRBH)
t
– 1
– 1
– 1
h(A)IOR
†
‡
Address and IS timings are included in timings referenced as address.
See Table 1, Table 2, and Table 3 for address bus timing variation with load capacitance.
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P RO C ES S O R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
memory and parallel I/O interface timing (continued)
timing requirements for a parallel I/O port read (IOSTRB = 0) [H = 0.5 t
†‡
]
(see Figure 7)
c(CO)
’549-80
MAX
’549-100
’549-120
UNIT
MIN
MIN
MAX
3H–8
2H–8
MIN
MAX
3H–8
2H–7
t
t
t
t
t
Access time, read data access from address valid
Access time, read data access from IOSTRB low
Setup time, read data before CLKOUT high
Hold time, read data after CLKOUT high
3H–9
2H–9
ns
ns
ns
ns
ns
a(A)IO
a(ISTRBL)IO
su(D)IOR
4
0
0
4
4
0
0
0
0
h(D)IOR
Hold time, read data after IOSTRB high
h(ISTRBH-D)R
†
‡
Address and IS timings are included in timings referenced as address.
See Table 1, Table 2, and Table 3 for address bus timing variation with load capacitance.
CLKOUT
t
t
h(A)IOR
d(CLKL-A)
A[15:0]
t
h(D)IOR
t
su(D)IOR
t
a(A)IO
D[15:0]
t
h(ISTRBH-D)R
d(CLKH-ISTRBH)
t
a(ISTRBL)IO
t
t
d(CLKH-ISTRBL)
IOSTRB
R/W
IS
Figure 7. Parallel I/O Port Read (IOSTRB = 0)
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PRO CE SSO R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
memory and parallel I/O interface timing (continued)
switching characteristics over recommended operating conditions for a parallel I/O port write
†
(IOSTRB = 0) [H = 0.5 t
] (see Figure 8)
c(CO)
’549-80
MIN
’549-100
’549-120
PARAMETER
UNIT
MAX
5
MIN MAX
MIN MAX
‡
t
Delay time, address valid from CLKOUT low
– 1
0
– 1
0
4
4
– 1
0
4
4
ns
ns
ns
ns
ns
ns
ns
ns
ns
d(CLKL-A)
t
Delay time, IOSTRB low from CLKOUT high
5
d(CLKH-ISTRBL)
t
Delay time, write data valid from CLKOUT high
Delay time, IOSTRB high from CLKOUT high
Delay time, R/W low from CLKOUT low
Delay time, R/W high from CLKOUT low
H–5
– 1
0
H+7
5
H–5
– 1
0
H+7
4
H–5
– 1
0
H+6
4
d(CLKH-D)IOW
t
d(CLKH-ISTRBH)
t
5
4
4
d(CLKL-RWL)
d(CLKL-RWH)
h(A)IOW
t
t
t
t
t
0
5
0
4
0
4
‡
Hold time, address valid from CLKOUT low
Hold time, write data after IOSTRB high
Setup time, write data before IOSTRB high
– 1
H–4
H–5
5
– 1
H–3
H–5
4
– 1
H–3
H–5
4
H+4
H+1
H+3
H+1
H+3
H
h(D)IOW
su(D)IOSTRBH
Setup time, address valid before IOSTRB low
H–5
H+5
H–3
H+3
H–3
H+3
ns
su(A)IOSTRBL
†
‡
See Table 1, Table 2, and Table 3 for address bus timing variation with load capacitance.
Address and IS timings are included in timings referenced as address.
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P RO C ES S O R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
memory and parallel I/O interface timing (continued)
CLKOUT
t
su(A)IOSTRBL
t
h(A)IOW
t
d(CLKL-A)
A[15:0]
t
d(CLKH-D)IOW
t
h(D)IOW
D[15:0]
t
d(CLKH-ISTRBL)
t
d(CLKH-ISTRBH)
t
su(D)IOSTRBH
t
IOSTRB
R/W
t
d(CLKL-RWL)
d(CLKL-RWH)
IS
Figure 8. Parallel I/O Port Write (IOSTRB = 0)
I/O timing variation with load capacitance: SPICE simulation results
Condition: Temperature : 125° C
Capacitance : 0–100pF
Voltage
Model
: 2.7/3.0/3.3 V
: Weak/Nominal/Strong
90%
10%
Figure 9. Rise and Fall Time Diagram
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PRO CE SSO R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
I/O timing variation with load capacitance: SPICE simulation results (continued)
Table 1. Timing Variation With Load Capacitance: [2.7 V] 10% – 90%
WEAK
NOMINAL
STRONG
RISE
FALL
RISE
FALL
RISE
FALL
0 pF
10 pF
20 pF
30 pF
40 pF
50 pF
60 pF
70 pF
80 pF
90 pF
100 pF
0.476 ns
1.511 ns
2.551 ns
3.614 ns
4.664 ns
5.752 ns
6.789 ns
7.817 ns
8.897 ns
10.021 ns
11.072 ns
0.457 ns
1.278 ns
2.133 ns
3.011 ns
3.899 ns
4.786 ns
5.656 ns
6.598 ns
7.531 ns
8.332 ns
9.299 ns
0.429 ns
1.386 ns
2.350 ns
3.327 ns
4.394 ns
5.273 ns
6.273 ns
7.241 ns
8.278 ns
9.152 ns
10.208 ns
0.391 ns
1.148 ns
1.956 ns
2.762 ns
3.566 ns
4.395 ns
5.206 ns
6.000 ns
6.928 ns
7.735 ns
8.537 ns
0.382 ns
1.215 ns
2.074 ns
2.929 ns
3.798 ns
4.655 ns
5.515 ns
6.442 ns
7.262 ns
8.130 ns
8.997 ns
0.323 ns
1.049 ns
1.779 ns
2.512 ns
3.264 ns
4.010 ns
4.750 ns
5.487 ns
6.317 ns
7.066 ns
7.754 ns
Table 2. Timing Variation With Load Capacitance: [3 V] 10% – 90%
WEAK
NOMINAL
STRONG
RISE
FALL
RISE
FALL
RISE
FALL
0 pF
10 pF
20 pF
30 pF
40 pF
50 pF
60 pF
70 pF
80 pF
90 pF
100 pF
0.436 ns
1.349 ns
2.273 ns
3.226 ns
4.168 ns
5.110 ns
6.033 ns
7.077 ns
8.020 ns
8.917 ns
9.885 ns
0.387 ns
1.185 ns
1.966 ns
2.765 ns
3.573 ns
4.377 ns
5.230 ns
5.997 ns
6.899 ns
7.709 ns
8.541 ns
0.398 ns
1.240 ns
2.098 ns
2.974 ns
3.849 ns
4.732 ns
5.660 ns
6.524 ns
7.416 ns
8.218 ns
9.141 ns
0.350 ns
1.064 ns
1.794 ns
2.539 ns
3.292 ns
4.052 ns
4.811 ns
5.601 ns
6.336 ns
7.124 ns
7.830 ns
0.345 ns
1.092 ns
1.861 ns
2.637 ns
3.406 ns
4.194 ns
5.005 ns
5.746 ns
6.559 ns
7.323 ns
8.101 ns
0.290 ns
0.964 ns
1.634 ns
2.324 ns
3.013 ns
3.710 ns
4.401 ns
5.117 ns
5.861 ns
6.498 ns
7.238 ns
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P RO C ES S O R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
I/O timing variation with load capacitance: SPICE simulation results (continued)
Table 3. Timing Variation With Load Capacitance: [3.3 V] 10% – 90% [3 V] 10% – 90%
WEAK
NOMINAL
STRONG
RISE
FALL
RISE
FALL
RISE
FALL
0 pF
10 pF
20 pF
30 pF
40 pF
50 pF
60 pF
70 pF
80 pF
90 pF
100 pF
0.404 ns
1.227 ns
2.070 ns
2.931 ns
3.777 ns
4.646 ns
5.487 ns
6.405 ns
7.284 ns
8.159 ns
8.994 ns
0.361 ns
1.081 ns
1.822 ns
2.567 ns
3.322 ns
4.091 ns
4.859 ns
5.608 ns
6.463 ns
7.097 ns
7.935 ns
0.371 ns
1.133 ns
1.915 ns
2.719 ns
3.515 ns
4.319 ns
5.145 ns
5.980 ns
6.723 ns
7.560 ns
8.300 ns
0.310 ns
1.001 ns
1.675 ns
2.367 ns
3.072 ns
3.779 ns
4.503 ns
5.234 ns
5.873 ns
6.692 ns
7.307 ns
0.321 ns
1.000 ns
1.704 ns
2.414 ns
3.120 ns
3.842 ns
4.571 ns
5.301 ns
5.941 ns
6.740 ns
7.431 ns
0.284 ns
0.892 ns
1.530 ns
2.169 ns
2.823 ns
3.466 ns
4.142 ns
4.767 ns
5.446 ns
6.146 ns
6.822 ns
29
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PRO CE SSO R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
ready timing for externally generated wait states
†
timing requirements for externally generated wait states [H = 0.5 t
Figure 12, and Figure 13)
] (see Figure 10, Figure 11,
c(CO)
’549-80
’549-100
MIN MAX
’549-120
MIN MAX
UNIT
MIN
6
MAX
t
t
t
t
t
t
t
t
Setup time, READY before CLKOUT low
Hold time, READY after CLKOUT low
5
0
5
0
ns
ns
ns
ns
ns
ns
ns
ns
su(RDY)
0
h(RDY)
‡
Valid time, READY after MSTRB low
4H–10
5H–10
4H–8
5H–8
4H–8
5H–8
v(RDY)MSTRB
h(RDY)MSTRB
v(RDY)IOSTRB
h(RDY)IOSTRB
v(MSCL)
‡
Hold time, READY after MSTRB low
4H
4H
4H
‡
Valid time, READY after IOSTRB low
‡
Hold time, READY after IOSTRB low
5H
0
5H
0
5H
0
Valid time, MSC low after CLKOUT low
Valid time, MSC high after CLKOUT low
5
5
4
4
4
4
0
0
0
v(MSCH)
†
The hardware wait states can be used only in conjunction with the software wait states to extend the bus cycles. To generate wait states by
READY, at least two software wait states must be programmed. READY is not sampled until the completion of the internal software wait states.
These timings are included for reference only. The critical timings for READY are those referenced to CLKOUT.
‡
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P RO C ES S O R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
ready timing for externally generated wait states (continued)
CLKOUT
A[15:0]
t
su(RDY)
t
h(RDY)
READY
MSTRB
MSC
t
v(RDY)MSTRB
t
h(RDY)MSTRB
t
v(MSCH)
t
v(MSCL)
Wait State
Generated
by READY
Wait States
Generated Internally
Figure 10. Memory Read With Externally Generated Wait States
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PRO CE SSO R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
ready timing for externally generated wait states (continued)
CLKOUT
A[15:0]
D[15:0]
t
h(RDY)
t
su(RDY)
READY
MSTRB
MSC
t
v(RDY)MSTRB
t
h(RDY)MSTRB
t
v(MSCH)
t
v(MSCL)
Wait States
Generated Internally
Wait State Generated
by READY
Figure 11. Memory Write With Externally Generated Wait States
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P RO C ES S O R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
ready timing for externally generated wait states (continued)
CLKOUT
A[15:0]
t
h(RDY)
t
su(RDY)
READY
IOSTRB
MSC
t
v(RDY)IOSTRB
t
h(RDY)IOSTRB
t
v(MSCH)
t
v(MSCL)
Wait State Generated
by READY
Wait
States
Generated
Internally
Figure 12. I/O Read With Externally Generated Wait States
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PRO CE SSO R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
ready timing for externally generated wait states (continued)
CLKOUT
A[15:0]
D[15:0]
t
h(RDY)
t
su(RDY)
READY
t
v(RDY)IOSTRB
t
h(RDY)IOSTRB
IOSTRB
MSC
t
v(MSCH)
t
v(MSCL)
Wait State Generated
by READY
Wait States
Generated
Internally
Figure 13. I/O Write With Externally Generated Wait States
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P RO C ES S O R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
HOLD and HOLDA timing
switching characteristics over recommended operating conditions for memory control signals
and HOLDA [H = 0.5 t
] (see Figure 14)
c(CO)
’549-80
’549-100
’549-120
PARAMETER
UNIT
MIN
MAX
t
t
Disable time, CLKOUT low to address, PS, DS, IS high impedance
Disable time, CLKOUT low to R/W high impedance
5
5
ns
ns
dis(CLKL-A)
dis(CLKL-RW)
Disable time, CLKOUT low to MSTRB, IOSTRB high
impedance
t
5
ns
dis(CLKL-S)
t
t
t
Enable time, CLKOUT low to address, PS, DS, IS
Enable time, CLKOUT low to R/W enabled
2H+5
2H+5
2H+5
ns
ns
ns
en(CLKL-A)
en(CLKL-RW)
en(CLKL-S)
Enable time, CLKOUT low to MSTRB, IOSTRB enabled
2
0
5
5
ns
ns
ns
Valid time, HOLDA low after CLKOUT low
t
t
v(HOLDA)
0
Valid time, HOLDA high after CLKOUT low
Pulse duration, HOLDA low duration
2H–3
w(HOLDA)
timing requirements for HOLD [H = 0.5 t
] (see Figure 14)
c(CO)
’549-80
’549-100
’549-120
UNIT
MIN
MAX
t
t
Pulse duration, HOLD low duration
Setup time, HOLD before CLKOUT low
4H+10
10
ns
ns
w(HOLD)
su(HOLD)
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O
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
HOLD and HOLDA timing (continued)
CLKOUT
t
t
su(HOLD)
su(HOLD)
t
w(HOLD)
HOLD
t
t
v(HOLDA)
v(HOLDA)
t
w(HOLDA)
HOLDA
t
dis(CLKL-A)
t
en(CLKL-A)
A[15:0]
PS, DS, IS
D[15:0]
R/W
t
t
t
t
dis(CLKL-RW)
dis(CLKL-S)
dis(CLKL-S)
en(CLKL-RW)
t
en(CLKL-S)
MSTRB
IOSTRB
t
en(CLKL-S)
Figure 14. HOLD and HOLDA Timing (HM = 1)
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P RO C ES S O R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
reset, BIO, interrupt, and MP/MC timings
timing requirements over recommended operating conditions for reset, interrupt, BIO, and MP/MC
[H = 0.5 t ] (see Figure 15, Figure 16, and Figure 17) (continued)
c(CO)
’549-80
’549-100
’549-120
MIN MAX
UNIT
MIN
0
MAX
MIN
0
MAX
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
Hold time, RS after CLKOUT low
0
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
h(RS)
Hold time, BIO after CLKOUT low
0
0
h(BIO)
†
Hold time, INTn, NMI, after CLKOUT low
0
0
0
h(INT)
Hold time, MP/MC after CLKOUT low
0
0
0
h(MPMC)
w(RSL)
द
Pulse duration, RS low
4H+7
2H+7
4H
2H+7
4H
2H+7
4H
10
4H+5
2H+5
4H
2H+7
4H
2H+7
4H
8
4H+5
2H+5
4H
2H+7
4H
2H+7
4H
8
Pulse duration, BIO low, synchronous
Pulse duration, BIO low, asynchronous
w(BIO)S
w(BIO)A
w(INTH)S
w(INTH)A
w(INTL)S
w(INTL)A
w(INTL)WKP
su(RS)
Pulse duration, INTn, NMI high (synchronous)
Pulse duration, INTn, NMI high (asynchronous)
Pulse duration, INTn, NMI low (synchronous)
Pulse duration, INTn, NMI low (asynchronous)
Pulse duration, INTn, NMI low for IDLE2/IDLE3 wakeup
§
Setup time, RS before X2/CLKIN low
5
5
5
Setup time, BIO before CLKOUT low
10
2H
2H
9
2H
2H
8
2H
2H
su(BIO)
Setup time, INTn, NMI, RS before CLKOUT low
Setup time, MP/MC before CLKOUT low
10
9
8
su(INT)
10
8
8
su(MPMC)
†
The external interrupts (INT0–INT3, NMI) are synchronized to the core CPU by way of a two flip-flop synchronizer which samples these inputs
with consecutive falling edges of CLKOUT. The input to the interrupt pins is required to represent a 1–0–0 sequence at the timing that is
corresponding to three CLKOUTs sampling sequence.
If the PLL mode is selected, then at power-on sequence, or at wakeup from IDLE3, RS must be held low for at least 50 µs to assure synchronization
and lock-in of the PLL.
‡
§
¶
Divide-by-two mode
Note that RS may cause a change in clock frequency, therefore changing the value of H (see the PLL section).
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PRO CE SSO R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
reset, BIO, interrupt, and MP/MC timings (continued)
X2/CLKIN
t
su(RS)
t
w(RSL)
RS, INTn, NMI
t
su(INT)
t
h(RS)
CLKOUT
t
su(BIO)
t
h(BIO)
BIO
t
w(BIO)S
Figure 15. Reset and BIO Timings
CLKOUT
t
t
t
su(INT)
su(INT)
h(INT)
INTn, NMI
t
w(INTH)A
t
w(INTL)A
Figure 16. Interrupt Timing
CLKOUT
RS
t
h(MPMC)
t
su(MPMC)
MP/MC
Figure 17. MP/MC Timing
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P RO C ES S O R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
instruction acquisition (IAQ), interrupt acknowledge (IACK), external flag (XF), and TOUT timing
switching characteristics over recommended operating conditions for IAQ and IACK
[H = 0.5 t
] (see Figure 18)
c(CO)
’549-80
’549-100
’549-120
PARAMETER
UNIT
MIN
– 1
MAX
MIN
– 1
MAX
t
Delay time, IAQ low from CLKOUT low
Delay time, IAQ high from CLKOUT low
Delay time, address valid before IAQ low
Delay time, IACK low from CLKOUT low
Delay time , IACK high from CLKOUT low
Delay time, address valid before IACK low
Hold time, address valid after IAQ high
Hold time, address valid after IACK high
Pulse duration, IAQ low
5
5
4
5
5
3
4
4
4
4
4
3
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
d(CLKL-IAQL)
t
t
– 1
– 1
d(CLKL-IAQH)
d(A)IAQ
t
0
0
0
0
d(CLKL-IACKL)
t
d(CLKL-IACKH)
d(A)IACK
h(A)IAQ
t
t
t
t
t
– 3
– 3
– 3
– 3
h(A)IACK
w(IAQL)
2H–3
2H–3
2H–3
2H–3
Pulse duration, IACK low
w(IACKL)
CLKOUT
A[15:0]
IAQ
t
t
t
d(CLKL-IAQH)
d(CLKL-IAQL)
t
h(A)IAQ
t
d(A)IAQ
t
w(IAQL)
t
d(CLKL-IACKH)
d(CLKL-IACKL)
t
h(A)IACK
t
d(A)IACK
t
w(IACKL)
IACK
MSTRB
Figure 18. Instruction Acquisition (IAQ) and Interrupt Acknowledge (IACK) Timing
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PRO CE SSO R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
instruction acquisition (IAQ), interrupt acknowledge (IACK), external flag (XF), and TOUT timing
(continued)
switching characteristics over recommended operating conditions for external flag (XF) and TOUT
[H = 0.5 t
] (see Figure 19 and Figure 20)
c(CO)
’549-80
’549-100
’549-120
PARAMETER
UNIT
MIN
0
MAX
MIN
0
MAX
Delay time, XF high after CLKOUT low
Delay time, XF low after CLKOUT low
5
5
4
4
t
ns
d(XF)
0
0
t
t
t
Delay time, TOUT high after CLKOUT low
Delay time, TOUT low after CLKOUT low
Pulse duration, TOUT
0
–1
5
5
– 1
– 1
4
4
ns
ns
ns
d(TOUTH)
d(TOUTL)
w(TOUT)
2H–3
2H–3
CLKOUT
t
d(XF)
XF
Figure 19. External Flag (XF) Timing
CLKOUT
TOUT
t
t
d(TOUTL)
d(TOUTH)
t
w(TOUT)
Figure 20. TOUT Timing
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P RO C ES S O R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
serial port receive timing
timing requirements over recommended operating conditions for serial port receive [H = 0.5 t
(see Figure 21)
]
c(CO)
’549-80
’549-100
’549-120
UNIT
MIN
MAX
t
t
t
t
t
t
t
t
Cycle time, serial port clock
6H
†
6
6
ns
ns
ns
ns
ns
ns
ns
ns
c(SCK)
f(SCK)
r(SCK)
w(SCK)
su(FSR)
h(FSR)
h(DR)
Fall time, serial port clock
Rise time, serial port clock
Pulse duration, serial port clock low/high
Setup time, FSR before CLKR falling edge
Hold time, FSR after CLKR falling edge
Hold time, DR after CLKR falling edge
Setup time, DR before CLKR falling edge
3H
4
4
6
6
su(DR)
†
The serial port design is fully static and, therefore, can operate with t
of 0 Hz but tested at a much higher frequency to minimize test time.
approaching ∞. It is characterized approaching an input frequency
c(SCK)
t
c(SCK)
t
f(SCK)
t
w(SCK)
CLKR
FSR
t
h(FSR)
t
r(SCK)
t
w(SCK)
t
su(FSR)
t
su(DR)
t
h(DR)
DR
BIT
1
2
7/15
8/16
Figure 21. Serial Port Receive Timing
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PRO CE SSO R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
serial port transmit timing
switching characteristics over recommended operating conditions for serial port transmit with
external clocks and frames [H = 0.5t ] (see Figure 22)
c(CO)
’549-80
’549-100
’549-120
PARAMETER
UNIT
MIN
MAX
t
t
t
Delay time, DX valid after CLKX rising
25
ns
ns
ns
d(DX)
h(DX)
dis(DX)
Hold time, DX valid after CLKX rising
Disable time, DX after CLKX rising
– 5
40
timing requirements over recommended operating conditions for serial port transmit with external
clocks and frames [H = 0.5t ] (see Figure 22)
c(CO)
’549-80
’549-100
’549-120
UNIT
MIN
6H
6
MAX
†
t
t
t
t
t
t
t
Cycle time, serial port clock
ns
ns
ns
ns
ns
ns
ns
c(SCK)
h(FSX)
h(FSX)H
d(FSX)
f(SCK)
r(SCK)
w(SCK)
Hold time, FSX after CLKX falling edge (see Note 1)
Hold time, FSX after CLKX rising edge (see Note 1)
Delay time, FSX after CLKX rising edge
Fall time, serial port clock
‡
2H–3
2H–3
6
6
Rise time, serial port clock
Pulse duration, serial port clock low/high
3H
†
The serial port design is fully static and, therefore, can operate with t
of 0 Hz but tested at a much higher frequency to minimize test time.
If the FSX pulse does not meet this specification, the first bit of serial data is driven on DX until the falling edge of FSX. After the falling edge of
FSX, data is shifted out on DX pin. The transmit buffer-empty interrupt is generated when the t specification is met.
approaching ∞. It is characterized approaching an input frequency
c(SCK)
‡
t
h(FSX) and h(FSX)H
NOTE 1: Internal clock with external FSX and vice versa are also allowable. However, FSX timings to CLKX always are defined depending on
the source of FSX, and CLKX timings always are dependent upon the source of CLKX. Specifically, the relationship of FSX to CLKX
is independent of the source of CLKX.
t
c(SCK)
t
t
f(SCK)
w(SCK)
CLKX
t
h(FSX)H
t
d(FSX)
t
r(SCK)
t
w(SCK)
t
h(FSX)
FSX
t
d(DX)
1
t
dis(DX)
8/16
t
h(DX)
DX BIT
2
7/15
Figure 22. Serial Port Transmit Timing With External Clocks and Frames
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P RO C ES S O R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
serial port transmit timing (continued)
switching characteristics over recommended operating conditions for serial port transmit with
internal clocks and frames [H = 0.5t
] (see Figure 23)
c(CO)
’549-80
’549-100
’549-120
PARAMETER
UNIT
MIN
TYP
MAX
t
t
t
t
t
t
t
t
Cycle time, serial port clock
Delay time, CLKX rising to FSX
Delay time, CLKX rising to DX
Disable time, CLKX rising to DX
8H
ns
ns
ns
ns
ns
ns
ns
ns
c(SCK)
d(FSX)
d(DX)
7
7
20
dis(DX)
h(DX)
Hold time, DX valid after CLKX rising edge
Fall time, serial port clock
–2
3
3
f(SCK)
r(SCK)
w(SCK)
Rise time, serial port clock
Pulse duration, serial port clock low/high
4H–4
t
c(SCK)
t
t
f(SCK)
w(SCK)
CLKX
t
d(FSX)
t
w(SCK)
t
r(SCK)
t
d(FSX)
t
d(DX)
FSX
DX
t
dis(DX)
t
h(DX)
1
2
7/15
8/16
Figure 23. Serial Port Transmit Timing With Internal Clocks and Frames
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PRO CE SSO R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
buffered serial port receive timing
timing requirements over recommended operating conditions (see Figure 24)
’549-80
’549-100
’549-120
UNIT
MIN
MAX
†
t
t
t
t
t
t
t
t
Cycle time, serial port clock
20
ns
ns
ns
ns
ns
ns
ns
ns
c(SCK)
Fall time, serial port clock
4
4
f(SCK)
Rise time, serial port clock
r(SCK)
Pulse duration, serial port clock low/high
Setup time, BFSR before BCLKR falling edge (see Note 2)
Hold time, BFSR after BCLKR falling edge (see Note 2)
Setup time, BDR before BCLKR falling edge
Hold time, BDR after BCLKR falling edge
6
2
7
0
7
w(SCK)
su(BFSR)
h(BFSR)
su(BDR)
h(BDR)
‡
t
c(SCK)–2
†
The serial port design is fully static and therefore can operate with t
of 0 Hz but tested at a much higher frequency to minimize test time.
First bit is read when BFSR is sampled low by BCLKR clock.
approaching infinity. It is characterized approaching an input frequency
c(SCK)
‡
NOTE 2: Timings for BCLKR and BFSR are given with polarity bits (BCLKP and BFSP) set to 0.
t
c(SCK)
t
w(SCK)
t
f(SCK)
BCLKR
BFSR
BDR
t
r(SCK)
t
t
w(SCK)
h(BFSR)
t
su(BFSR)
t
su(BDR)
t
h(BDR)
1
2
8/10/12/16
Figure 24. Buffered Serial Port Receive Timing
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P RO C ES S O R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
buffered serial port transmit timing of external frames
switching characteristics over recommended operating conditions (see Figure 25)
’549-80
’549-100
’549-120
PARAMETER
UNIT
MIN
MAX
t
t
t
t
t
Delay time, BDX valid after BCLKX rising
18
6
ns
ns
ns
ns
ns
d(BDX)
Disable time, BDX after BCLKX rising
4
dis(BDX)
Disable time, PCM mode, BDX after BCLKX rising
Enable time, PCM mode, BDX after BCLKX rising
Hold time, BDX valid after BCLKX rising
6
dis(BDX)pcm
en(BDX)pcm
h(BDX)
8
2
timing requirements over recommended operating conditions (see Figure 25)
’549-80
’549-100
’549-120
UNIT
MIN
MAX
†
t
t
t
t
t
t
Cycle time, serial port clock
20
ns
ns
ns
ns
ns
ns
c(SCK)
Fall time, serial port clock
4
4
f(SCK)
Rise time, serial port clock
r(SCK)
Pulse duration, serial port clock low/high
Hold time, BFSX after CLKX falling edge (see Notes 3 and 4)
Setup time, FSX before CLKX falling edge (see Notes 3 and 4)
6
6
6
w(SCK)
h(BFSX)
su(BFSX)
‡
t
c(SCK)–6
†
The serial port design is fully static and therefore can operate with t
c(SCK)
approaching infinity. It is characterized approaching an input frequency
of 0 Hz but tested at a much higher frequency to minimize test time.
‡
If BFSX does not meet this specification, the first bit of the serial data is driven on BDX until BFSX goes low (sampled on falling edge of BCLKX).
After falling edge of the BFSX, data will be shifted out on the BDX pin.
NOTES: 3. Internal clock with external BFSX and vice versa are also allowable. However, BFSX timings to BCLKX always are defined
depending on the source of BFSX, and BCLKX timings always are dependent upon the source of BCLKX.
4. Timings for BCLKX and BFSX are given with polarity bits (BCLKP and BFSP) set to 0.
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buffered serial port transmit timing of external frames (continued)
t
c(SCK)
t
w(SCK)
t
f(SCK)
BCLKX
BFSX
BDX
t
r(SCK)
t
h(BFSX)
t
w(SCK)
t
su(BFSX)
t
dis(BDX)
t
h(BDX)
t
d(BDX)
1
2
8/10/12/16
Figure 25. Buffered Serial Port Transmit Timing of External Clocks and External Frames
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buffered serial port transmit timing of internal frame and internal clock
switching characteristics over recommended operating conditions [H = 0.5tc(CO)] (see Figure 26)
’549-80
’549-100
’549-120
PARAMETER
UNIT
MIN MAX
t
t
Cycle time, serial port clock, internal clock
20
62H
7
ns
ns
c(SCK)
Delay time, BFSX after BCLKX rising edge
(see Notes 3 and 4)
d(BFSX)
t
t
t
t
t
t
t
t
Delay time, BDX valid after BCLKX rising edge
Disable time, BDX after BCLKX rising edge
Disable time, PCM mode, BDX after BCLKX rising edge
Enable time, PCM mode, BDX after BCLKX rising edge
Hold time, BDX valid after BCLKX rising edge
Fall time, serial port clock
7
5
5
ns
ns
ns
ns
ns
ns
ns
ns
d(BDX)
0
dis(BDX)
dis(BDX)pcm
en(BDX)pcm
h(BDX)
7
0
3.5
3.5
f(SCK)
Rise time, serial port clock
r(SCK)
Pulse duration, serial port clock low/high
6
w(SCK)
NOTES: 3. Internal clock with external BFSX and vice versa are also allowable. However, BFSX timings to BCLKX always are defined
depending on the source of BFSX, and BCLKX timings always are dependent upon the source of BCLKX.
4. Timings for BCLKX and BFSX are given with polarity bits (BCLKP and BFSP) set to 0.
t
c(SCK)
t
w(SCK)
t
f(SCK)
BCLKX
BFSX
BDX
t
r(SCK)
t
d(BFSX)
t
w(SCK)
t
d(BFSX)
t
dis(BDX)
t
h(BDX)
t
d(BDX)
1
2
8/10/12/16
Figure 26. Buffered Serial Port Transmit Timing of Internal Clocks and Internal Frames
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serial-port receive timing in TDM mode
timing requirements over recommended ranges of supply voltage and operating free-air
temperature [H = 0.5t ] (see Figure 27)
c(CO)
’549-80
’549-100
’549-120
UNIT
MIN
MAX
†
t
t
t
t
t
t
t
t
Cycle time, serial-port clock
16H
ns
ns
ns
ns
ns
ns
ns
ns
c(SCK)
Fall time, serial-port clock
6
6
f(SCK)
Rise time, serial-port clock
r(SCK)
Pulse duration, serial-port clock low/high
Setup time, TDAT/TADD before TCLK rising edge
Hold time, TDAT/TADD after TCLK rising edge
Setup time, TFRM before TCLK rising edge‡
Hold time, TFRM after TCLK rising edge‡
8H
10
1
w(SCK)
su(TD-TCH)
h(TCH-TD)
su(TF-TCH)
h(TCH-TF)
10
10
†
The serial-port design is fully static and, therefore, can operate with t
c(SCK)
approaching infinity. It is characterized approaching an input frequency
of 0 Hz but tested at a much higher frequency to minimize test time.
‡
TFRM timing and waveforms shown in Figure 27 are for external TFRM. TFRM can also be configured as internal. The TFRM internal case is
illustrated in the transmit timing diagram in Figure 28.
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
serial-port receive timing in TDM mode (continued)
t
w(SCK)
t
t
f(SCK)
w(SCK)
TCLK
‡
‡
t
t
su(TD-TCL)
su(TD-TCL)
t
c(SCK)
t
†
r(SCK)
t
su(TD-TCH)
‡
‡
t
t
h(TCL-TD)
h(TCL-TD)
t
h(TCH-TD)
TDAT
B0
B14
A1
B13
B12
A3
B11
A4
B2
B1
B0
B15
A0
t
su(TF-TCH)
A7
A2
TADD
TFRM
t
h(TCH-TF)
†
‡
All devices except ’542/’543
’542/’543 only
Figure 27. Serial-Port Receive Timing in TDM Mode
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
serial-port transmit timing in TDM mode
switching characteristics over recommended operating conditions [H = 0.5t
] (see Figure 28)
c(CO)
’549-80
549-100
’549-120
PARAMETER
UNIT
MIN
MAX
t
t
Hold time, TDAT/TADD valid after TCLK rising edge, TCLK external
Hold time, TDAT/TADD valid after TCLK rising edge, TCLK internal
1
1
ns
ns
h(TCH-TDV)
h(TCH-TDV)
†
Delay time, TFRM valid after TCLK rising edge, TCLK ext
H – 3
H – 3
3H+22
3H+12
25
t
ns
ns
d(TCH-TFV)
d(TC-TDV)
†
Delay time, TFRM valid after TCLK rising edge, TCLK int
Delay time, TCLK to valid TDAT/TADD, TCLK ext
Delay time, TCLK to valid TDAT/TADD, TCLK int
t
18
†
TFRM timing and waveforms shown in Figure 28 are for internal TFRM. TFRM can also be configured as external. The TFRM external case is
illustrated in the receive timing diagram in Figure 27.
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
serial-port transmit timing in TDM mode (continued)
timing requirements over recommended ranges of supply voltage and operating free-air
temperature [H = 0.5t ] (see Figure 28)
c(CO)
’549–80
’549-100
’549-120
UNIT
MIN
MAX
†
‡
t
t
t
t
Cycle time, serial-port clock
Fall time, serial-port clock
16H
ns
ns
ns
ns
c(SCK)
f(SCK)
r(SCK)
w(SCK)
6
6
Rise time, serial-port clock
†
8H
Pulse duration, serial-port clock low/high
†
‡
When SCK is generated internally, this value is typical.
The serial-port design is fully static and, therefore, can operate with t
approaching 1. It is characterized approaching an input frequency
c(SCK)
of 0 Hz but tested as a much higher frequency to minimize test time.
t
w(SCK)
t
w(SCK)
t
f(SCK)
TCLK
t
c(SCK)
t
t
d(TC-TDV)
r(SCK)
B1
B15
TDAT
TADD
B0
h(TCH-TDV)
B14
B13
A2
B12
A3
B8 B7
B2
B0
t
h(TCH-TDV)
t
t
d(TC-TDV)
A1
A7
t
d(TCH-TFV)
A0
t
d(TCH-TFV)
TFRM
Figure 28. Serial-Port Transmit Timing in TDM Mode
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PRO CE SSO R
SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
host port interface timing
switching characteristics over recommended operating conditions [H = 0.5t
(see Notes 5 and 6) (see Figure 29 through Figure 32) (continued)
]
c(CO)
’549-80
’549-100
PARAMETER
’549-120
UNIT
MIN
MAX
t
t
Delay time, DS low to HD driven
5
12
ns
d(DSL-HDV)
d(HEL-HDV1)
Case 1: Shared-access mode if
< 7H
7H+20–t
w(DSH)
20
t
w(DSH)
Case 2: Shared-access mode if
> 7H
t
w(DSH)
Case 3: Host-only mode if
< 20 ns
Delay time, HDS falling to HD valid for first byte
of a non-subsequent read: → max 20 ns
ns
†‡
40–t
w(DSH)
20
t
w(DSH)
Case 4: Host-only mode if
> 20 ns
t
w(DSH)
‡
t
t
t
t
t
t
t
Delay time, DS low to HD valid, second byte
Delay time, DS high to HRDY high
5
20
10H+10
ns
ns
ns
ns
ns
ns
ns
d(DSL-HDV2)
d(DSH-HYH)
su(HDV-HYH)
h(DSH-HDV)R
d(COH-HYH)
d(DSH-HYL)
d(COH-HTX)
Setup time, HD valid before HRDY rising edge
Hold time, HD valid after DS rising edge, read
Delay time, CLKOUT rising edge to HRDY high
Delay time, HDS or HCS high to HRDY low
3H–10
0
12
10
12
15
Delay time, CLKOUT rising edge to HINT change
†
Host-only mode timings apply for read accesses to HPIC or HPIA, write accesses to BOB, and resetting DSPINT or HINT to 0 in shared-access
mode. HRDY does not go low for these accesses.
Shared-access mode timings will be met automatically if HRDY is used.
‡
NOTES: 5. SAM = shared-access mode, HOM = host-only mode
HAD stands for HCNTRL0, HCNTRL1, and HR/W.
HDS refers to either HDS1 or HDS2.
DS refers to the logical OR of HCS and HDS.
6. On host read accesses to the HPI, the setup time of HD before DS rising edge depends on the host waveforms and cannot be
specified here.
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
host port interface timing (continued)
timing requirements over recommended operating conditions [H = 0.5t
(see Figure 29 through Figure 32)
] (see Note 7)
c(CO)
’549-80
’549-100
’549-120
UNIT
MIN
10
5
MAX
MIN
10
5
MAX
t
t
t
t
t
Setup time, HAD/HBIL valid before DS or HAS falling edge
Hold time, HAD/HBIL valid after DS or HAS falling edge
Setup time, HAS low before DS falling edge
Pulse duration, DS low
ns
ns
ns
ns
ns
su(HBV-DSL)
h(DSL-HBV)
su(HSL-DSL)
w(DSL)
12
30
10
12
30
10
Pulse duration, DS high
w(DSH)
Case 1: HOM access timings
(see Access Timing Without HRDY)
50
40
Cycle time, DS rising
edge to next DS rising
edge
t
ns
Case 2a: SAM accesses and HOM active writes
to DSPINT or HINT
(see Access Timings With HRDY)
c(DSH-DSH)
†
10H
10H
t
t
t
Setup time, HD valid before DS rising edge
Delay time, DS high to next HAS low
12
10H
3
12
10H
3
ns
ns
ns
su(HDV-DSH)
‡
d(DSH-HSL)
Hold time, HD valid after DS rising edge, write
h(DSH – HDV)W
†
A host not using HRDY should meet this timing requirement all the time unless a software handshake is used to change the access rate according
to the HPI mode.
Must only be met if HAS is going low when not accessing the HPI (as would be the case where multiple devices are being driven by one host).
‡
NOTE 7: SAM = shared-access mode, HOM = host-only mode
HAD stands for HCNTRL0, HCNTRL1, and HR/W.
HDS refers to either HDS1 or HDS2.
DS refers to the logical OR of HCS and HDS.
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
host port interface timing (continued)
FIRST BYTE
SECOND BYTE
Valid
Valid
Valid
HAD
t
h(DSL-HBV)
t
h(DSL-HBV)
t
su(HBV-DSL)
t
su(HBV-DSL)
HBIL
t
t
w(DSH)
w(DSH)
t
w(DSL)
t
w(DSL)
HCS
HDS
t
c(DSH-DSH)
t
d(DSL-HDV2)
Valid
t
d(HEL-HDV1)
t
h(DSH-HDV)
t
h(DSH-HDV)R
t
d(DSL-HDV)
HD
READ
Valid
t
t
t
su(HDV-DSH)
h(DSH-HDV)
su(HDV-DSH)
t
h(DSH-HDV)W
HD
WRITE
Valid
Valid
Figure 29. Read/Write Access Timings Without HRDY or HAS
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
host port interface timing (continued)
FIRST BYTE
SECOND BYTE
HAS
t
su(HBV-DSL)
t
d(DSH-HSL)
t
h(DSL-HBV)
t
su(HSL-DSL)
Valid
Valid
Valid
HAD
†
t
h(DSL-HBV)
†
t
su(HBV-DSL)
HBIL
t
c(DSH-DSH)
t
w(DSH)
t
w(DSL)
HCS
HDS
t
d(HEL-HDV1)
t
d(DSL-HDV2)
Valid
t
h(DSH-HDV)R
t
h(DSH-HDV)R
t
d(DSL-HDV)
HD
READ
Valid
t
t
su(HDV-DSH)
su(HDV-DSH)
t
h(DSH-HDV)W
t
h(DSH-HDV)W
HD
WRITE
Valid
Valid
†
When HAS is tied to V
DD
Figure 30. Read/Write Access Timings Using HAS Without HRDY
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
host port interface timing (continued)
FIRST BYTE
SECOND BYTE
HAS
t
su(HSL-DSL)
t
d(DSH-HSL)
t
su(HBV-DSL)
t
h(DSL-HBV)
HAD
†
t
h(DSL-HBV)
†
t
su(HBV-DSL)
HBIL
t
c(DSH-DSH)
t
w(DSH)
t
w(DSL)
HCS
HDS
t
su(HDV-HYH)
t
d(DSH-HYH)
HRDY
t
d(DSH-HYL)
t
d(DSL-HDV2)
Valid
t
d(HEL-HDV1)
t
h(DSH-HDV)R
t
h(DSH-HDV)R
t
d(DSL-HDV)
HD
READ
Valid
t
su(HDV-DSH)
t
su(HDV-DSH)
t
h(DSH-HDV)W
t
h(DSH-HDV)W
HD
WRITE
Valid
Valid
t
d(COH-HYH)
CLKOUT
HINT
t
d(COH-HTX)
†
When HAS is tied to V
DD
Figure 31. Read/Write Access Timing With HRDY
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host port interface timing (continued)
HCS
t
d(DSH-HYL)
HRDY
HDS
t
d(DSH-HYH)
Figure 32. HRDY Signal When HCS is Always Low
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MECHANICAL DATA
PGE (S-PQFP-G144)
PLASTIC QUAD FLATPACK
108
73
109
72
0,27
0,17
M
0,08
0,50
0,13 NOM
144
37
1
36
Gage Plane
17,50 TYP
20,20
SQ
19,80
0,25
0,05 MIN
22,20
SQ
0°–ā7°
21,80
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040147/C 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
Thermal Resistance Characteristics
PARAMETER
°C/W
R
56
ΘJA
ΘJC
R
5
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SPRS078F – SEPTEMBER 1998 – REVISED MAY 2000
MECHANICAL DATA
TMS320VC5409 144-Pin Plastic Ball Grid Array Package (BGA)
GGU (S-PBGA-N144)
PLASTIC BALL GRID ARRAY PACKAGE
12,10
11,90
SQ
13 12 11 10 9
8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
0,80
K
L
M
N
0,80
0,95
0,85
1,40 MAX
0,10
0,12
0,08
0,55
0,45
0,45
0,35
M
0,08
4073221/A 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
Thermal Resistance Characteristics
PARAMETER
°C/W
R
38
ΘJA
ΘJC
R
5
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TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
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Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
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Copyright 2000, Texas Instruments Incorporated
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