TMS37F158LGIDBTRG4 [TI]
CONTROLLER ENTRY DEVICE WITH INTEGRATED DST80 AUTHENTICATION, EEPROM, AND LF IMMOBILIZER INTERFACE;
| 型号： | TMS37F158LGIDBTRG4 |
| 厂家： | 
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| 描述： | CONTROLLER ENTRY DEVICE WITH INTEGRATED DST80 AUTHENTICATION, EEPROM, AND LF IMMOBILIZER INTERFACE 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 光电二极管 外围集成电路 |
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TMS37F158
www.ti.com
SCBS877 –MAY 2012
CONTROLLER ENTRY DEVICE WITH INTEGRATED DST80 AUTHENTICATION, EEPROM,
AND LF IMMOBILIZER INTERFACE
Check for Samples: TMS37F158
1
FEATURES
•
Wide Supply Voltage Range: 2.0 V to 3.6 V
•
Low-Frequency (LF) Immobilizer Interface
•
Ultra-Low Power Consumption
–
–
Integrated Batteryless Immobilizer Interface
–
–
–
–
CPU Active Mode: 200 μA/MHz at 2.2 V
Standby Mode (LPM3): 0.7 μA
Off Mode (LPM4): 0.1 μA
Half-Duplex (HDX) Immobilizer
Communication Achieves up to 4-in (10-cm)
Read Range
–
Special Selective Addressing Mode Allows
Reliable Learn-In Sequence
Power Down Mode: 60 nA
•
Microcontroller System and Peripherals
–
–
–
–
–
–
80-Bit Authentication Key Length
Up to 8-kbit/s Uplink Data Rate
5/3-Byte Challenge/Response Algorithm
Fast Authentication Within 42 ms
Fast Mutual Authentication Within 65 ms
150-Byte EEPROM
–
16-Bit RISC Architecture, 125-ns Instruction
Cycle Time
–
–
Wake-Up From Standby Mode in <6 μs
Basic Clock Module Configurations
–
–
–
–
–
Single External Resistor
32-kHz Crystal
–
124-Byte Available EEPROM User
Memory
High-Frequency Crystal
Resonator
–
–
–
–
32-Bit Unique Serial Number
External Clock Source
High EEPROM Security and Flexibility
Write-Only Authentication Keys
–
16-Bit Timer_A With Three
Capture/Compare Registers
Pages Are Irreversibly Lockable and
Protectable
–
–
–
–
8KB + 256B Flash Memory
256B RAM
–
Protected Pages Programmable Only
Through Mutual Authentication
150-Byte EEPROM
Serial Onboard Programming, No External
Programming Voltage Needed
–
–
–
–
Battery Check and Charge Functions
Each User Page is Lockable
–
–
Programmable Code Protection by Security
Fuse
Resonant Frequency: 134.2 kHz
Integrated Resonant Frequency Trimming
80-Bit DST80 Security Authentication
Coprocessor
–
–
12 I/O Ports
Integrated Push-Button Logic
DESCRIPTION
The TMS37F158 Controller Entry Device (CED80) combines an ultra-low-power 16-bit RISC microcontroller with
the proven TI DST80 immobilizer interface and a sophisticated power management system. It is the ideal device
for any remote control or remote keyless entry application. The embedded DST80 low-frequency (LF)immobilizer
interface offers a high level of security through its hardware encryption and mutual authentication with 80-bit
security key length. The immobilizer interface is always accessible and operates without the need for a battery.
The low-power microcontroller MSP430 core offers a 16-bit RISC architecture, 8KB program memory, battery
charge and check functions, and 12 user-accessible I/O ports.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TMS37F158
SCBS877 –MAY 2012
www.ti.com
The CED80 manages the immobilizer communication and push-button interaction. During sleep state, the device
enters a special low-power mode with only 60 nA of current consumption. By sensing the pressing of a push
button, the device wakes up and controls an external UHF transmitter or UHF transceiver. Security keys and
rolling codes can be stored in the integrated EEPROM memory. This memory is accessible over the LF interface
without support from the battery in the keyfob or by the internal microcontroller if the battery is functional. The
CED80 offers a special battery-charge mode; to achieve faster charging, it is recommend to add a charging
amplifier device on the base station side. The external resonant circuit with an LF coil and a resonant capacitor
can be trimmed to the correct resonant frequency with the integrated trimming capability, which eliminates part
tolerances.
The small DBT 30-pin package together with only a few external components results in cost-efficient design.
Ordering Information(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TMS37F158LGIDBTRG4
–40°C to 85°C
TSSOP – DBT
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
DBT PACKAGE
(TOP VIEW)
1
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
TDAT
TEN
TCLK
RF
VCL
2
3
EOB
NPOR
PUSH
BUSY
P2.3
P2.4
P1.0
P1.1
P1.2
P1.4
P1.5
P1.6
P1.7
4
GND
VBAT
VBATI
P2.2
P2.0
RESET
XIN
5
6
7
8
9
10
11
12
13
14
15
XOUT
VSS
P2.5
VCC
TEST
2
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TMS37F158
TMS37F158
www.ti.com
SCBS877 –MAY 2012
Functional Block Diagram
XIN XOUT
P1.x
P2.x
LF
Controller
Oscillator
I/O Port
P3
4 Internal
I/Os
ACLK
I/O Port
P1
7 I/Os
I/O Port
P2
5 I/Os
External
LF
Interface
Comp_A
POR
Clock
System
Internal
SPI
Interface
SMCLK
EEPROM
DMA
Controller
Authentication
Coprocessor
3 Channel
MAB
MDB
Bus
Control
Logic
Analog Frontend
8MHz
CPU
incl. 16
Registers
Flash
Timer_A3
USART0
Watchdog
15,16 Bit
RAM
256B
JTAG
Interface
8KB
+
256B
3 CC
Registers
UART,
SPI Mode
Car side
Key fob side
Current
Measurement
Load Drivers
UHF Transceiver
or
UHF Receiver
CC11x1-Q1
UHF Transmitter or
UHF Transceiver
CC11x1-Q1
GIO
SPI
UHF
antenna
Up to 13 ft (4 m)
cable length
SPI
Optional for
battery charge
Controller
Entry Device
Push
Buttons
Charging
Amplifier
LF
Base Station
TMS3705-Q1
1D LF
Antenna
GIO
(Immobilizer and
Microcontroller)
LF Immobilizer
Antenna
Embedded
Processor
CED80
LED
GIO
System Supply
Power Supply
Figure 1. Application Diagram
Copyright © 2012, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TMS37F158
TMS37F158
SCBS877 –MAY 2012
www.ti.com
CX1
CX2
XTAL
VBATI
XOSC
XOSC
VCC
SCLK
SI
Antenna
Matching
Network
RF_N
RF_P
UHF Transmitter
or UHF Transceiver
CC11x1-Q1
RBIAS
SO / GDO1
CSn
RBIAS
GND
JTAG TEST Interface
VBATI
VBATI
RST
TEST
TCK
TMS
TDI
47k
P1.2
P2.0
P2.2
P2.3
TDO
NRST
TEST
VBAT
XIN
470
XOUT
ROSC
P2.5
VCC
P2.4
VSS
P1.0
P1.1
P1.4
P1.5
P1.6
P1.7
MICROCONTROLLER
CBATI
RVbati
R1 .. R6
D1 .. D6
NPOR
PUSH
Important Values
RL = 1 M
Rvbati = 100 k
LR = 2.66 mH
CR = 470 pF
CL = 220 nF
BUSY
VBATI
EOB
RF1
VBAT
CED 80 FRONT END
LR
CR
BAT
CBAT
VCL
TEST I/F
Note:
R1 to R6, D1 to D6,
RVbati can be integrated
in ROM version
TDAT
TCLK
TEN
CL
GND
VCL
RL
Figure 2. Application Schematic
4
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TMS37F158
TMS37F158
www.ti.com
SCBS877 –MAY 2012
Operating Characteristics
PART NUMBER
TMS37F158ADBTIRG4
Features
Immobilizer plus microcontroller with integrated power management
80-bit key length, 4-byte or 5-byte challenge, 3-byte signature
DST80 authentication logic
Mutual authentication: 65 ms
Fast authentication: 42 ms
DST80 encryption time
Microcontroller
16-bit RISC ultra-low power based on MSP430F123 core
2.0 V to 3.6 V
Supply voltage (VBAT)
Active current consumption
Standby current consumption
Transponder
200 μA (VCC = 2.2 V, fosc = 1 MHz)
60 nA (typ) (with PUSH logic)
Transmission principle
HDX (half duplex telegram protocol)
134.2 kHz
Operating frequency
Integrated resonant frequency trimming capability via LF or test interface
Security
Downlink
Uplink
Challenge/response, mutual authentication
100% AM, PPM bit coding with 2 kbit/s (typ)
FSK modulation with 7.9 kbit/s (typ)
124-byte free available EEPROM user memory
EEPROM memory
150 bytes
32-bit unique serial number
EEPROM endurance
Clock reference for microcontroller
Battery check
200 000 cycles (TA = 25°C) (min)
Resonant circuit can be used as clock reference for the microcontroller
Two free programmable voltage levels: 2.0 V to 3.6 V with 0.1-V steps
Integrated battery-charge functionality
Battery charge
Key learn-in
Special selective addressing to provide secure learn-in procedure
Microcontroller
Memory
8KB program memory , 256-byte RAM
256-byte information memory
100 000 cycles (typ)
100 years (min)
User data flash memory
Flash program and erase endurance
Flash data retention
Program, erase, read supply voltage
I/O ports
2.7 V (min)
12
Operating temperature
Package
-40 to 85°C
30-pin TSSOP (DBT)
Copyright © 2012, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TMS37F158
PACKAGE OPTION ADDENDUM
www.ti.com
30-May-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TMS37F158LGIDBTRG4
ACTIVE
TSSOP
DBT
30
TBD
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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Addendum-Page 1
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