TPA0213_07 [TI]
2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE; 耳机驱动器2 -W单声道音频功率放大器
| 型号： | TPA0213_07 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE |
| 文件： | 总24页 (文件大小：703K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
DGQ PACKAGE
(TOP VIEW)
D
Ideal for Notebook Computers, PDAs, and
Other Small Portable Audio Devices
D
D
D
D
2 W Into 4 Ω From 5-V Supply
0.6 W Into 4 Ω From 3-V Supply
Stereo Headphone Drive
1
2
3
4
5
MONO–IN
SHUTDOWN
LO/MO–
LIN
GND
ST/MN
RO/MO+
10
9
V
8
DD
BYPASS
7
Separate Inputs for the Mono (BTL) Signal,
and Stereo (SE) Left/Right Signals
RIN
6
D
D
Wide Power Supply Compatibility 2.5 V to
5.5 V
Low Supply Current
– 4.2 mA Typical at 5 V
– 3.6 mA Typical at 3 V
D
D
D
Shutdown Control . . . 1 µA Typical
Shutdown Pin Is TTL Compatible
–40°C to 85°C Operating Temperature
Range
D
Space-Saving, Thermally-Enhanced MSOP
Packaging
description
The TPA0213 is a 2-W mono bridge-tied-load (BTL) amplifier designed to drive speakers with as low as 4-Ω
impedance. The amplifier can be reconfigured on the fly to drive two stereo single-ended (SE) signals into
headphones. This makes the device ideal for use in small notebook computers, PDAs, personal digital audio
players, anywhere a mono speaker and stereo headphones are required. From a 5-V supply, the TPA0213 can
deliver 2 W of power into a 4-Ω speaker.
The gain of the input stage is set by the user-selected input resistor and a 50-kΩ internal feedback resistor
(A = – R /R ). The power stage is internally configured with a gain of –1.25 V/V in SE mode, and –2.5 V/V in
V
F
I
BTL mode. Thus, the overall gain of the amplifier is –62.5 kΩ/R in SE mode and –125 kΩ/R in BTL mode.
I
I
The TPA0213 is available in the 10-pin thermally-enhanced MSOP package (DGQ) and operates over an
ambient temperature range of –40°C to 85°C.
AVAILABLE OPTIONS
PACKAGED DEVICES
MSOP
†
T
A
MSOP
SYMBOLIZATION
(DGQ)
–40°C to 85°C
TPA0213DGQ
AEH
†
The DGQ package are available taped and reeled. To order a taped and reeled part, add the
suffix R to the part number (e.g., TPA0213DGQR).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
functional block diagram
C
B
4
BYPASS
V
DD
V
DD
3
1 kΩ
GND
8
V
DD
BYPASS
50 kΩ
Mono
Audio
Input
50 kΩ
C
C
i
i
R
R
1.25*R
I
I
100 kΩ
1
5
R
M
U
X
C
C
–
MONO-IN
RIN
–
Right
Audio
Input
RO/MO+
6
+
+
BYPASS
BYPASS
100 kΩ
50 kΩ
50 kΩ
ST/MN
7
Stereo/Mono
Control
50 kΩ
1.25*R
Left
Audio
Input
R
M
U
X
C
C
C
–
i
R
I
–
9
2
LIN
LO/MO– 10
+
+
1 kΩ
BYPASS
BYPASS
From
System Control
Shutdown
and Depop
Circuitry
SHUTDOWN
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
Terminal Functions
TERMINAL
NAME
BYPASS
I/O
DESCRIPTION
NO.
4
I
BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected to a
0.1-µF to 1-µF capacitor.
GND
8
9
Ground terminal
LIN
I
O
I
Left-channel input terminal
LO/MO–
MONO-IN
RIN
10
1
Left-output in SE mode and mono negative output in BTL mode.
Mono input terminal
5
I
Right-channel input terminal
RO/MO+
SHUTDOWN
ST/MN
6
O
I
Right-output in SE mode and mono positive output in BTL mode
SHUTDOWN places the entire device in shutdown mode when held low. TTL compatible input.
2
7
I
Selects between stereo and mono mode. When held high, the amplifier is in SE stereo mode, while held low,
the amplifier is in BTL mono mode.
V
DD
3
I
V
DD
is the supply voltage terminal.
§
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
DD
Input voltage range, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to V +0.3 V
I
DD
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . internally limited (see Dissipation Rating Table)
Operating free-air temperature range, T (see Table 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 85°C
A
Operating junction temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 150°C
J
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
§
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
T
A
≤ 25°C
DERATING FACTOR
T
A
= 70°C
T = 85°C
A
¶
DGQ
2.14 W
17.1 mW/°C
1.37 W
1.11 W
¶
Please see the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report
(SLMA002), for more information on the PowerPAD package. The thermal data was measured on a PCB
layoutbased on theinformation inthe section entitledTexasInstrumentsRecommendedBoardforPowerPAD
on page 33 of that document.
PowerPAD is a trademark of Texas Instruments
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
recommended operating conditions
MIN
2.5
2.7
4.5
2
MAX
UNIT
Supply voltage, V
DD
5.5
V
V
V
= 3 V
= 5 V
DD
ST/MN
High-level input voltage, V
V
DD
IH
SHUTDOWN
V
V
= 3 V
= 5 V
1.65
2.75
0.8
DD
ST/MN
Low-level input voltage, V
V
DD
IL
SHUTDOWN
Operating free-air temperature, T
–40
85
°C
A
electrical characteristics at specified free-air temperature, V
noted)
= 3 V, T = 25°C (unless otherwise
A
DD
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
mV
|V
|
Output offset voltage (measured differentially)
Power supply rejection ratio
R
= 4 Ω, ST/MN = 0 V, SHUTDOWN = 2 V
30
OO
PSRR
L
V
DD
= 2.9 V to 3.1 V,
BTL mode
65
dB
SHUTDOWN, V
= 3.3 V,
V = V
1
1
1
1
DD
= 3.3 V,
I
DD
DD
|I
|
High-level input current
Low-level input current
µA
µA
IH
ST/MN, V
V = V
I
DD
SHUTDOWN, V
= 3.3 V,
V = 0 V
I
DD
= 3.3 V,
|I
|
IL
ST/MN, V
V = 0 V
I
DD
z
Input impedance
50
3.6
1
kΩ
mA
µA
i
I
Supply current
V
= 2.5 V, SHUTDOWN = 2 V
5.5
10
DD
DD
SHUTDOWN = 0 V
= 2.5 V, R = 4 Ω, ST/MN = 1.375 V,
I
Supply current, shutdown mode
DD(SD)
V
DD
L
R
Feedback resistor
46
50
57
kΩ
F
SHUTDOWN = 2 V
operating characteristics, V
= 3 V, T = 25°C, R = 4 Ω, f = 1 kHz (unless otherwise noted)
DD
A
L
PARAMETER
TEST CONDITIONS
BTL mode
MIN
TYP MAX
UNIT
THD = 1%,
660
33
P
O
Output power, see Note 1
mW
THD = 0.1%,
SE mode,
R = 32 Ω
L
THD + N Total harmonic distortion plus noise
P
= 500 mW, f = 20 Hz to 20 kHz
0.2%
20
O
B
OM
Maximum output power bandwidth
Supply ripple rejection ratio
Gain = 8 dB,
THD = 2%
kHz
dB
BTL mode
SE mode
BTL mode
SE mode
52
f = 1 kHz,
CB = 0.47 µF
62
42
V
n
Noise output voltage
CB = 0.47 µF,
f = 20 Hz to 20 kHz
µV
RMS
21
NOTE 1: Output power is measured at the output terminals of the device at f = 1 kHz.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
electrical characteristics at specified free-air temperature, V
noted)
= 5 V, T = 25°C (unless otherwise
A
DD
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
mV
|V
|
Output offset voltage (measured differentially)
Power supply rejection ratio
R
= 4 Ω, ST/MN = 0 V, SHUTDOWN = 2 V
30
OO
PSRR
L
V
DD
= 4.9 V to 5.1 V,
BTL mode
62
dB
SHUTDOWN, V
= 5.5 V,
V = V
1
1
1
1
DD
= 5.5 V,
I
DD
DD
|I
|
High-level input current
Low-level input current
µA
µA
IH
ST/MN, V
V = V
I
DD
SHUTDOWN, V
= 5.5 V,
V = 0 V
I
DD
= 5.5 V,
|I
|
IL
ST/MN, V
V = 0 V
I
DD
z
Input impedance
50
4.2
1
kΩ
mA
µA
i
I
I
Supply current
SHUTDOWN = 2 V
SHUTDOWN = 0 V
6.3
10
DD
Supply current, shutdown mode
DD(SD)
operating characteristics, V
= 5 V, T = 25°C, R = 4 Ω
DD
A
L
PARAMETER
TEST CONDITIONS
BTL mode
MIN
TYP
2
MAX
UNIT
W
THD = 0.3%,
THD = 0.1%,
P
O
Output power, see Note 1
SE mode,
R
= 32 Ω
90
mW
L
Total harmonic distortion plus
noise
THD + N
P
= 1.5 W,
f = 20 Hz to 20 kHz
THD = 2%
0.2%
O
B
OM
Maximum output power bandwidth Gain = 6 dB,
20
52
62
42
21
kHz
dB
BTL mode
SE mode
BTL mode
SE mode
Supply ripple rejection ratio
Noise output voltage
f = 1 kHz,
CB = 0.47 µF
V
n
CB = 0.47 µF,
f = 20 Hz to 20 kHz
µV
RMS
NOTE 1: Output power is measured at the output terminals of the device at f = 1 kHz.
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
vs Output power
vs Frequency
vs Frequency
vs Frequency
1, 3, 5, 6, 8, 10
2, 4, 7, 9
11
THD+N
Total harmonic distortion plus noise
V
n
Output noise voltage
Power supply rejection ratio
12, 13
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
TYPICAL CHARACTERISTICS
TOTAL HARMONIC DISTORTION + NOISE
TOTAL HARMONIC DISTORTION + NOISE
vs
vs
OUTPUT POWER
FREQUENCY
10
1
V
= 3 V
DD
Mono/BTL
V
=3 V
DD
Mono/BTL
f = 1 kHz
Gain = 8 dB
R
= 8 Ω
= 250 mW
L
P
O
1
0.1
Gain = 20 dB
R
= 4 Ω
L
Gain = 8 dB
R
= 8 Ω
.10
.01
L
0.01
0.001
0.001
0.01
0.1
1
10
10
100
1k
10k 20k
P
O
– Output Power – W
f – Frequency – Hz
Figure 1
Figure 2
TOTAL HARMONIC DISTORTION + NOISE
TOTAL HARMONIC DISTORTION + NOISE
vs
vs
OUTPUT POWER
FREQUENCY
10
1
V
= 3 V
DD
Mono/BTL
= 8 Ω
V
= 3 V
DD
Stereo/SE
R
L
Gain = 1.9 dB
Gain = 8 dB
1
0.1
R
= 32 Ω
= 25 mW
f = 20 kHz
L
P
O
0.1
0.01
0.01
0.001
f = 1 kHz
R
= 10 kΩ
L
f = 20 Hz
V
O
= 1 V
RMS
0.001
0.01
0.1
1
2
10
100
1k
10k 20k
P
O
– Output Power – W
f – Frequency – Hz
Figure 3
Figure 4
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
TYPICAL CHARACTERISTICS
TOTAL HARMONIC DISTORTION + NOISE
TOTAL HARMONIC DISTORTION + NOISE
vs
vs
OUTPUT POWER
OUTPUT POWER
10
10
V
= 3 V
DD
Stereo/SE
= 32 Ω
V
DD
= 5 V
Mono/BTL
f = 1 kHz
R
L
Gain = 1.9 dB
Gain = 8 dB
1
1
R
= 4 Ω
L
f = 20 kHz
0.1
0.01
0.1
0.01
R
= 8 Ω
L
f = 1 kHz
f = 20 Hz
0.01
0.1
0.001
0.01
P
0.1
– Output Power – W
1
10
P
O
– Output Power – W
O
Figure 5
Figure 6
TOTAL HARMONIC DISTORTION + NOISE
TOTAL HARMONIC DISTORTION + NOISE
vs
vs
FREQUENCY
OUTPUT POWER
1
10
V
= 5 V
DD
Mono/BTL
V
= 5 V
DD
Mono/BTL
R = 8 Ω
L
R
= 8 Ω
= 1 W
L
P
O
Gain = 8 dB
0.1
f = 20 kHz
1
Gain = 20 dB
Gain = 8 dB
f = 1 kHz
0.01
0.001
0.1
0.01
f = 20 Hz
10
100
1k
10k 20k
0.001
0.01
P
0.1
1
2
f – Frequency – Hz
– Output Power – W
O
Figure 7
Figure 8
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
TYPICAL CHARACTERISTICS
TOTAL HARMONIC DISTORTION + NOISE
TOTAL HARMONIC DISTORTION + NOISE
vs
vs
FREQUENCY
OUTPUT POWER
1
10
V
= 5 V
DD
V
= 5 V
DD
Stereo/SE
= 32 Ω
Stereo/SE
Gain = 1.9 dB
R
L
Gain = 1.9 dB
0.1
1
R
= 32 Ω
= 75 mW
L
P
O
f = 20 kHz
f = 1 kHz
0.01
0.001
0.1
0.01
R
= 10 kΩ
L
V
O
= 1 V
RMS
f = 20 Hz
0.1
10
100
1k
10k 20k
0.01
1
f – Frequency – Hz
P
O
– Output Power – W
Figure 9
Figure 10
OUTPUT NOISE VOLTAGE
POWER SUPPLY REJECTION RATIO
vs
vs
FREQUENCY
FREQUENCY
100
0
–20
V
= 5 V
DD
Mono/BTL
C
= 0.47 µF
B
Mono/BTL
= 8 Ω
Gain = 8 dB
Gain = 8 dB
Mono/BTL
= 8 Ω
Gain = 20 dB
R
R
L
L
C
= 1 µF
B
–40
C
= 10 µF
B
Stereo/SE
Stereo/SE
R = 32 Ω
L
Gain = 1.9 dB
–60
R
= 32 Ω
L
Gain = 14 dB
–80
Bypass = 2.5 V
–100
10
10
–120
100
1k
10k 20k
20
100
1k
10k 20k
f – Frequency – Hz
f – Frequency – Hz
Figure 11
Figure 12
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
TYPICAL CHARACTERISTICS
POWER SUPPLY REJECTION RATIO
vs
FREQUENCY
0
–20
V
= 5 V
DD
Stereo/SE
Gain = 1.9 dB
C
= 0.47 µF
B
–40
C
= 1 µF
B
–60
–80
Bypass = 2.5 V
–100
–120
20
100
1k
10k 20k
f – Frequency – Hz
Figure 13
APPLICATION INFORMATION
gain setting via input resistance
The gain of the input stage is set by the user-selected input resistor and a 50-kΩ internal feedback resistor.
However, the power stage is internally configured with a gain of –1.25 V/V in SE mode, and –2.5 V/V in BTL
mode. Thus, the feedback resistor (R ) is effectively 62.5 kΩ in SE mode and 125 kΩ in BTL mode. Therefore,
F
the overall gain can be calculated using equations (1) and (2).
–125 kW
A
A
+
+
(BTL)
(SE)
V
V
R
(1)
(2)
I
–62.5 kW
R
I
The –3 dB frequency can be calculated using equation 3:
1
(3)
ƒ
+
–3 dB
2p R C
I i
If the filter must be more accurate, the value of the capacitor should be increased while the value of the resistor
to ground should be decreased. In addition, the order of the filter could be increased.
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
APPLICATION INFORMATION
input capacitor, C
i
In the typical application an input capacitor, C , is required to allow the amplifier to bias the input signal to the
i
proper dc level for optimum operation. In this case, C and the input resistance of the amplifier, R , form a
i
I
high-pass filter with the corner frequency determined in equation 4.
–3 dB
(4)
1
f
+
c(highpass)
2pR C
i
I
f
c
The value of C is important to consider as it directly affects the bass (low frequency) performance of the circuit.
i
Consider the example where R is 710 kΩ and the specification calls for a flat bass response down to 40 Hz.
I
Equation 2 is reconfigured as equation 5.
1
C +
i
2pR f
(5)
c
I
In this example, C is 5.6 nF so one would likely choose a value in the range of 5.6 nF to 1 µF. A further
I
consideration for this capacitor is the leakage path from the input source through the input network (C ) and the
i
feedback network to the load. This leakage current creates a dc offset voltage at the input to the amplifier that
reduces useful headroom, especially in high gain applications. For this reason a low-leakage tantalum or
ceramic capacitor is the best choice. When polarized capacitors are used, the positive side of the capacitor
should face the amplifier input in most applications as the dc level there is held at V /2, which is likely higher
DD
than the source dc level. Note that it is important to confirm the capacitor polarity in the application.
power supply decoupling, C
(S)
The TPA0213 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling
to ensure the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also
prevents oscillations for long lead lengths between the amplifier and the speaker. The optimum decoupling is
achieved by using two capacitors of different types that target different types of noise on the power supply leads.
For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance
(ESR) ceramic capacitor, typically 0.1 µF placed as close as possible to the device V
filtering lower-frequency noise signals, a larger aluminum electrolytic capacitor of 10 µF or greater placed near
lead, works best. For
DD
the audio power amplifier is recommended.
midrail bypass capacitor, C
(BYP)
The midrail bypass capacitor, C
During start-up or recovery from shutdown mode, C
, is the most critical capacitor and serves several important functions.
(BYP)
determines the rate at which the amplifier starts up.
(BYP)
The second function is to reduce noise produced by the power supply caused by coupling into the output drive
signal. This noise is from the midrail generation circuit internal to the amplifier, which appears as degraded
PSRR and THD+N.
Bypass capacitor, C
for the best THD and noise performance.
, values of 0.47 µF to 1 µF ceramic or tantalum low-ESR capacitors are recommended
(BYP)
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
APPLICATION INFORMATION
output coupling capacitor, C
(C)
In the typical single-supply SE configuration, an output coupling capacitor (C ) is required to block the dc bias
(C)
at the output of the amplifier, thus preventing dc currents in the load. As with the input coupling capacitor, the
output coupling capacitor and impedance of the load form a high-pass filter governed by equation 6.
–3 dB
1
f
+
(6)
c(high)
2pR C
L
(C)
f
c
The main disadvantage, from a performance standpoint, is that the load impedances are typically small, which
drives the low-frequency corner higher, degrading the bass response. Large values of C are required to pass
(C)
low frequencies into the load. Consider the example where a C
of 330 µF is chosen and loads vary from
(C)
3 Ω, 4 Ω, 8 Ω, 32 Ω, 10 kΩ, to 47 kΩ. Table 1 summarizes the frequency response characteristics of each
configuration.
Table 1. Common Load Impedances vs Low Frequency Output Characteristics in SE Mode
R
C
Lowest Frequency
161 Hz
L
(C)
3 Ω
330 µF
330 µF
330 µF
330 µF
330 µF
330 µF
4 Ω
8 Ω
120 Hz
60 Hz
32 Ω
10,000 Ω
47,000 Ω
Ą15 Hz
0.05 Hz
0.01 Hz
As Table 1 indicates, most of the bass response is attenuated into a 4-Ω load, an 8-Ω load is adequate,
headphone response is good, and drive into line level inputs (a home stereo for example) is exceptional.
Furthermore, the total amount of ripple current that must flow through the capacitor must be considered when
choosing the component. As shown in the application circuit, one coupling capacitor must be in series with the
mono loudspeaker for proper operation of the stereo-mono switching circuit. For a 4-Ω load, this capacitor must
be able to handle about 700 mA of ripple current for a continuous output power of 2 W.
using low-ESR capacitors
Low-ESR capacitors are recommended throughout this applications section. A real (as opposed to ideal)
capacitor can be modeled simply as a resistor in series with an ideal capacitor. The voltage drop across this
resistor minimizes the beneficial effects of the capacitor in the circuit. The lower the equivalent value of this
resistance the more the real capacitor behaves like an ideal capacitor.
11
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
APPLICATION INFORMATION
bridged-tied load versus single-ended mode
Figure 14 shows a Class-AB audio power amplifier (APA) in a BTL configuration. The TPA0213 BTL amplifier
consists of two Class-AB amplifiers driving both ends of the load. There are several potential benefits to this
differential drive configuration, but initially consider power to the load. The differential drive to the speaker
means that as one side is slewing up, the other side is slewing down, and vice versa. This, in effect, doubles
the voltage swing on the load as compared to a ground referenced load. Plugging 2 × V
equation, where voltage is squared, yields 4× the output power from the same supply rail and load impedance.
into the power
O(PP)
See equation 7.
V
O(PP)
(7)
V
+
(RMS)
Ǹ
2 2
2
V
(RMS)
Power +
R
L
V
DD
V
O(PP)
2x V
R
O(PP)
L
V
DD
–V
O(PP)
Figure 14. Bridge-Tied Load Configuration
In a typical computer sound channel operating at 5 V, bridging raises the power into an 8-Ω speaker from a
singled-ended (SE, ground reference) limit of 250 mW to 1 W. In sound power, that is a 6-dB improvement—
which is loudness that can be heard. In addition to increased power, there are frequency response concerns.
Consider the single-supply SE configuration shown in Figure 15. A coupling capacitor is required to block the
dc offset voltage from reaching the load. These capacitors can be quite large (approximately 33 µF to 1000 µF)
so they tend to be expensive and heavy. Also, they occupy valuable PCB area, and they limit low-frequency
performance of the system. This frequency limiting effect is due to the high pass filter network created with the
speaker impedance and the coupling capacitance and is calculated with equation 8.
1
(8)
f
+
c
2pR C
L (C)
12
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
APPLICATION INFORMATION
bridged-tied load versus single-ended mode (continued)
For example, a 68-µF capacitor with an 8-Ω speaker would attenuate low frequencies below 293 Hz. The BTL
configuration cancels the dc offsets, which eliminates the need for the blocking capacitors. Low-frequency
performance is then limited only by the input network and speaker response. Cost and PCB space are also
minimized by eliminating the bulky coupling capacitor.
V
DD
–3 dB
V
O(PP)
C
(C)
V
O(PP)
R
L
f
c
Figure 15. Single-Ended Configuration and Frequency Response
Increasing power to the load does carry a penalty of increased internal power dissipation. The increased
dissipation is understandable considering that the BTL configuration produces 4× the output power of the SE
configuration. Internal dissipation versus output power is discussed further in the crest factor and thermal
considerations section.
single-ended operation
In SE mode (see Figure 14 and Figure 15), the load is driven from the primary amplifier output for each channel
(LO and RO, terminals 6 and 10)
The amplifier switches to single-ended operation when the ST/MN terminal is held high.
input MUX operation
The input MUX allows two separate inputs to be applied to the amplifier. When the ST/MN terminal is held high,
the headphone inputs (LIN and RIN) are active. When the ST/MN terminal is held low, the line BTL input
(MONO-IN) is active.
BTL amplifier efficiency
Class-AB amplifiers are inefficient. The primary cause of inefficiencies is the voltage drop across the output
stage transistors. There are two components of the internal voltage drop. One is the headroom or dc voltage
drop that varies inversely to output power. The second component is due to the sinewave nature of the output.
The total voltage drop can be calculated by subtracting the RMS value of the output voltage from V . The
DD
internal voltage drop multiplied by the RMS value of the supply current, I rms, determines the internal power
DD
dissipation of the amplifier.
An easy-to-use equation to calculate efficiency starts out as being equal to the ratio of power from the power
supply to the power delivered to the load. To accurately calculate the RMS and average values of power in the
load and in the amplifier, the current and voltage waveform shapes must first be understood. See Figure 16.
13
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
APPLICATION INFORMATION
BTL amplifier efficiency (continued)
I
V
O
DD
I
DD(avg)
V
(LRMS)
Figure 16. Voltage and Current Waveforms for BTL Amplifiers
Although the voltages and currents for SE and BTL are sinusoidal in the load, currents from the supply are very
different between SE and BTL configurations. In an SE application the current waveform is a half-wave rectified
shape, whereas in BTL it is a full-wave rectified waveform. This means RMS conversion factors are different.
Keep in mind that for most of the waveform both the push and pull transistors are not on at the same time, which
supports the fact that each amplifier in the BTL device only draws current from the supply for half the waveform.
The following equations are the basis for calculating amplifier efficiency.
P
L
Efficiency of a BTL amplifier +
(9)
P
SUP
where
2
2
L
V
V
V
P
2R
LRMS
P
P
+
, andV
+
, therefore, P
1
+
L
LRMS
L
Ǹ
R
2
L
p
+
[cos(t)] p
0
2V
V
V
P
1
P
P
+
ŕ
P
+ V
I
avg
I
avg +
sin(t) dt
and
and
p
p
SUP
DD DD
DD
p R
L
R
R
L
L
0
therefore,
P
2 V
V
DD
p R
P
+
SUP
L
substituting P and P
into equation 9,
L
SUP
2
V
P
2 R
p V
L
P
Efficiency of a BTL amplifier +
+
4 V
2 V
V
P
DD
DD
p R
L
where
Ǹ2 P R
V
+
P
L
L
Therefore,
Ǹ2 P R
p
L
L
h
+
(10)
BTL
4 V
DD
P = Power devilered to load
V
= Peak voltage on BTL load
avg = Average current drawn from the power supply
L
P
P
V
= Power drawn from power supply
I
V
SUP
DD
= RMS voltage on BTL load
= Power supply voltage
= Efficiency of a BTL amplifier
LRMS
DD
R = Load resistance
η
L
BTL
14
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
APPLICATION INFORMATION
BTL amplifier efficiency (continued)
Table 2 employs equation 10 to calculate efficiencies for four different output power levels. Note that the
efficiency of the amplifier is quite low for lower power levels and rises sharply as power to the load is increased
resulting in a nearly flat internal power dissipation over the normal operating range. Note that the internal
dissipation at full output power is less than in the half power range. Calculating the efficiency for a specific
systemisthekeytoproperpowersupplydesign. Forastereo1-Waudiosystemwith8-Ω loadsanda5-Vsupply,
the maximum draw on the power supply is almost 3.25 W.
Table 2. Efficiency Vs Output Power in 5-V 8-Ω BTL Systems
Output Power
(W)
Efficiency
(%)
Peak Voltage
(V)
Internal Dissipation
(W)
0.25
0.50
1.00
1.25
31.4
44.4
62.8
70.2
2.00
2.83
4.00
0.55
0.62
0.59
0.53
†
4.47
†
High peak voltages cause the THD to increase.
A final point to remember about Class-AB amplifiers (either SE or BTL) is how to manipulate the terms in the
efficiency equation to utmost advantage when possible. Note that in equation 10, V is in the denominator.
DD
This indicates that as V
goes down, efficiency goes up.
DD
crest factor and thermal considerations
Class-AB power amplifiers dissipate a significant amount of heat in the package under normal operating
conditions. AtypicalmusicCDrequires12dBto15dBofdynamicrange, orheadroomabovetheaveragepower
output, to pass the loudest portions of the signal without distortion. In other words, music typically has a crest
factor between 12 dB and 15 dB. When determining the optimal ambient operating temperature, the internal
dissipated power at the average output power level must be used. The TPA0213 data sheet shows that when
the TPA0213 is operating from a 5-V supply into a 4-Ω speaker 4-W peaks are available. Converting watts to
dB:
P
W
4 W
1 W
P
+ 10Log
+ 10Log
+ 6 dB
(11)
dB
P
ref
Subtracting the headroom restriction to obtain the average listening level without distortion yields:
6 dB – 15 dB = –9 dB (15-dB crest factor)
6 dB – 12 dB = –6 dB (12-dB crest factor)
6 dB – 9 dB = –3 dB (9-dB crest factor)
6 dB – 6 dB = 0 dB (6-dB crest factor)
6 dB – 3 dB = 3 dB (3-dB crest factor)
15
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
APPLICATION INFORMATION
crest factor and thermal considerations (continued)
Converting dB back into watts:
PdBń10
P
+ 10
P
W
ref
(12)
+ 63 mW (18-dB crest factor)
+ 125 mW (15-dB crest factor)
+ 250 mW (12-dB crest factor)
+ 500 mW (9-dB crest factor)
+ 1000 mW (6-dB crest factor)
+ 2000 mW (3-dB crest factor)
This is valuable information to consider when attempting to estimate the heat dissipation requirements for the
amplifier system. Comparing the absolute worst case, which is 2 W of continuous power output with a 3 dB crest
factor, against 12 dB and 15 dB applications drastically affects maximum ambient temperature ratings for the
system. Table 3 shows maximum ambient temperatures and TPA0213 internal power dissipation for various
output-power levels.
Table 3. TPA0213 Power Rating, 5-V, 3-Ω, Mono
PEAK OUTPUT POWER
(W)
POWER DISSIPATION
(W)
MAXIMUM AMBIENT
TEMPERATURE
AVERAGE OUTPUT POWER
4
4
4
4
4
4
2 W (3-dB crest factor)
1000 mW (6-dB crest factor)
500 mW (9-dB crest factor)
250 mW (12-dB crest factor)
125 mW (15-dB crest factor)
63 mW (18-dB crest factor)
1.7
1.6
1.4
1.1
0.8
0.6
–3°C
6°C
24°C
51°C
78°C
96°C
Table 4. TPA0213 Power Rating, 5-V, 8-Ω, Stereo
PEAK OUTPUT POWER
(W)
POWER DISSIPATION
MAXIMUM AMBIENT
TEMPERATURE
AVERAGE OUTPUT POWER
(W)
2.5
2.5
2.5
2.5
1250 mW (3-dB crest factor)
1000 mW (4-dB crest factor)
500 mW (7-dB crest factor)
250 mW (10-dB crest factor)
0.55
0.62
0.59
0.53
100°C
94°C
97°C
102°C
The maximum dissipated power, P
an 8-Ω load. As a result, this simple formula for calculating P
, is reached at a much lower output power level for an 4-Ω load than for
Dmax
may be used for a 4-Ω application:
Dmax
2
2V
DD
(13)
P
+
Dmax
2
p R
L
However, in the case of an 8-Ω load, the P
The amplifier may therefore be operated at a higher ambient temperature than required by the P
for an 8-Ω load.
occurs at a point well above the normal operating power level.
Dmax
formula
Dmax
The maximum ambient temperature depends on the heat sinking ability of the PCB system. The derating factor
for the DGQ package is shown in the dissipation rating table. Converting this to Θ
:
JA
1
1
Θ
+
+
+ 58.48°CńW
(14)
JA
0.0171
Derating Factor
16
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
APPLICATION INFORMATION
crest factor and thermal considerations (continued)
To calculate maximum ambient temperatures, first consider that the numbers from the dissipation graphs are
per channel so the dissipated power needs to be doubled for two channel operation. Given Θ , the maximum
JA
allowable junction temperature, and the total internal dissipation, the maximum ambient temperature can be
calculated with the following equation. The maximum recommended junction temperature for the TPA0213 is
150°C. The internal dissipation figures are taken from the Power Dissipation vs Output Power graphs.
(15)
(
)
(
)
T Max + T Max * Θ
P
+ 150 * 58.48 0.8 2 + 56°C 15-dB crest factor
A
J
JA
D
NOTE:
Internal dissipation of 0.8 W is estimated for a 2-W system with 15-dB crest factor per channel.
Tables 3 and 4 show that for some applications no airflow is required to keep junction temperatures in the
specified range. The TPA0213 is designed with thermal protection that turns the device off when the junction
temperature surpasses 150°C to prevent damage to the IC. Tables 3 and 4 were calculated for maximum
listening volume without distortion. When the output level is reduced the numbers in the table change
significantly. Also, using 8-Ω speakers dramatically increases the thermal performance by increasing amplifier
efficiency.
ST/MN (stereo/mono) operation
The ability of the TPA0213 to easily switch between mono BTL and stereo SE modes is one of its most important
cost saving features. This feature eliminates the requirement for an additional headphone amplifier in
applications where an internal speaker is driven in BTL mode but external stereo headphone or speakers must
be accommodated. When ST/MN is held high, the input mux selects the RIN and LIN inputs and the output is
in stereo SE mode. When ST/MN is held low, the input mux selects the mono-in input and the output is in mono
BTL mode. Control of the ST/MN input can be from a logic-level CMOS source or, more typically, from a
switch-controlled resistor divider network as shown in Figure 17.
17
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
APPLICATION INFORMATION
ST/MN (stereo/mono) operation (continued)
C
B
4
BYPASS
V
DD
V
DD
3
1 kΩ
GND
8
V
DD
BYPASS
50 kΩ
Mono
Audio
Input
50 kΩ
C
C
i
i
R
R
1.25*R
I
I
100 kΩ
1
5
R
M
U
X
C
C
–
MONO-IN
RIN
–
Right
Audio
Input
RO/MO+
6
+
+
BYPASS
BYPASS
100 kΩ
50 kΩ
50 kΩ
ST/MN
7
Stereo/Mono
Control
50 kΩ
1.25*R
Left
Audio
Input
R
M
U
X
C
C
C
–
i
R
I
–
9
2
LIN
LO/MO– 10
+
+
1 kΩ
BYPASS
BYPASS
From
System Control
Shutdown
and Depop
Circuitry
SHUTDOWN
Figure 17. TPA0213 Resistor Divider Network Circuit
Using a readily available 1/8-in. (3,5 mm) stereo headphone jack, the control switch is closed when no plug is
inserted. When closed, the 100-kΩ/1-kΩ divider pulls the ST/MN input low. When a plug is inserted, the 1-kΩ
resistor is disconnected and the ST/MN input is pulled high. The mono speaker is also physically disconnected
from the RO/MO+ output so that no sound is heard from the speaker while the headphones are inserted.
18
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPA0213
2-W MONO AUDIO POWER AMPLIFIER
WITH HEADPHONE DRIVE
SLOS276D – JANUARY 2000 – REVISED NOVEMBER 2002
MECHANICAL DATA
DGQ (S-PDSO-G10)
PowerPAD PLASTIC SMALL-OUTLINE PACKAGE
0,27
0,17
M
0,50
10
0,25
6
Thermal Pad
(See Note D)
0,15 NOM
3,05
2,95
4,98
4,78
Gage Plane
0,25
0°–ā6°
1
5
0,69
0,41
3,05
2,95
Seating Plane
0,10
0,15
0,05
1,07 MAX
4073273/A 04/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads. The dimension of the thermal
pad is 1,40 mm (height as illustrated) × 1,80 (width as illustrated) mm (maximum). The pad is centered on the bottom of the package.
PowerPAD is a trademark of Texas Instruments.
19
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TPA0213DGQ
ACTIVE
MSOP-
Power
PAD
DGQ
10
10
10
10
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPA0213DGQG4
TPA0213DGQR
ACTIVE
ACTIVE
ACTIVE
MSOP-
Power
PAD
DGQ
DGQ
DGQ
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MSOP-
Power
PAD
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPA0213DGQRG4
MSOP-
Power
PAD
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to
discontinue any product or service without notice. Customers should obtain the latest relevant information
before placing orders and should verify that such information is current and complete. All products are sold
subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent
TI deems necessary to support this warranty. Except where mandated by government requirements, testing
of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible
for their products and applications using TI components. To minimize the risks associated with customer
products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent
right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,
or process in which TI products or services are used. Information published by TI regarding third-party
products or services does not constitute a license from TI to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or
other intellectual property of the third party, or a license from TI under the patents or other intellectual
property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not
responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for
that product or service voids all express and any implied warranties for the associated TI product or service
and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Amplifiers
Data Converters
DSP
Interface
Applications
Audio
Automotive
Broadband
Digital Control
Military
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
interface.ti.com
logic.ti.com
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Logic
Power Mgmt
Microcontrollers
Low Power Wireless
power.ti.com
microcontroller.ti.com
www.ti.com/lpw
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明