TPA6047A4RHBR_技术文档

TPA6045A4C

www.ti.com.............................................................................................................................................................................................. SLOS614–OCTOBER 2008

2-W STEREO AUDIO POWER AMPLIFIER

WITH DirectPath™ STEREO HEADPHONE DRIVE AND REGULATOR

1

FEATURES

DESCRIPTION

23

•

Microsoft™ Windows Vista™ Compliant

•

Fully Differential Architecture and High PSRR

Provide Excellent RF Rectification Immunity

The TPA6045A4C is a stereo audio power amplifier

and DirectPath™ headphone amplifier in a thermally

enhanced, space-saving, 32-pin QFN package. The

speaker amplifier is capable of driving 2.1 W per

channel continuously into 4-Ω loads at 5 V. The

headphone amplifier achieves a minimum of 85 mW

at 1% THD+N from a 5-V supply. A built-in internal

4-step gain control for the speaker amplifier and a

fixed –1.5 V/V gain for the headphone amplifier

minimizes external components needed.

•

2.1-W, 1% THD+N Into 4-Ω Speakers and

85-mW, 1% THD+N Into 16-Ω Headphones

From 5-V Supply

•

DirectPath™ Headphone Amplifier Eliminates

(1)

Output Capacitors

Internal 4-Step Speaker Gain Control: 10, 12,

15.6, 21.6 dB and Fixed –1.5-V/V Headphone

Independent shutdown control and dedicated inputs

for the speaker and headphone allow the

•

3.3-V Low Dropout Regulator for CODEC

Independent Shutdown Controls for Speaker,

Headphone Amplifier, and Low Dropout

Regulator (LDO)

TPA6045A4C

to

simultaneously

drive

both

headphones and internal speakers. Differential inputs

to the speaker amplifiers offer superior power-supply

and common-mode noise rejection.

•

Output Short-Circuit and Thermal Protection

APPLICATIONS

•

Notebook Computers

•

Portable DVD

SIMPLIFIED APPLICATION CIRCUIT

TPA6045A4C

Speaker

LDO (V)

4.75

3.3

Gain (dB)

Enable

CODEC

ROUT+

ROUT–

SPKR_RIN+

SPKR_RIN–

SPKR

HPR

6, 10, 15.6,

21.6

TPA6040A4

TPA6041A4

TPA6043A4

TPA6045A4C

TPA6047A4

Active Low

LOUT+

LOUT–

HPL

10, 12, 15.6,

21.6

SPKR_LIN+

SPKR_LIN–

SPKL

Active Low

Active High

VDD

SPVDD

SPGND

4.5 V – 5.5 V

6, 10, 15.6,

21.6

BYPASS

3.3

GAIN0

GAIN1

Gain

Control

HP_EN

10, 12, 15.6,

21.6

Shutdown

Control

3.3

SPKR_EN

OUTL

OUTR

10, 12, 15.6,

21.6

HP_INR

SGND

4.75

HPVSS

CPVSS

HP_INL

HPVDD

CPVDD

VDD

3 V – 5.5 V

CPGND

C1P

C1N

4.5 V – 5.5 V

Regulator Enable

REG_EN

REG_OUT

3.3 V (To CODEC)

(1) US Patent Number 5289137

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

3

DirectPath, PowerPAD are trademarks of Texas Instruments.

Microsoft, Windows Vista are trademarks of Microsoft Corporation.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

TPA6045A4C

SLOS614–OCTOBER 2008.............................................................................................................................................................................................. www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Functional Block Diagram

REG_EN

BYPASS

(3.3-V Output)

REG_OUT

SPKR_EN

Bias Control

LDO

0.47 mF

1 mF

HP_EN

VDD

1 mF

SPVDD

ROUT+

SPKR_RIN+

SPKR_RIN–

+

–

1 mF

+

–

ROUT–

GAIN0

GAIN1

SPGND

SPVDD

Gain Control

SPKR_LIN+

SPKR_LIN–

LOUT+

LOUT–

1 mF

+

–

+

4.5 V – 5.5 V

SPVDD

HP_INL

SPGND

1 mF

HPVDD

–

HP_OUTL

HP_OUTR

1 mF

+

HPVSS

+

HP_INR

HPVDD

–

1 mF

HPVDD

3 V – 5.5 V

CPVDD

CPGND

Charge Pump

1 mF

C1P

C1N

CPVSS

GND

HPVSS

SPGND

1 mF

2

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AVAILABLE PACKAGE OPTIONS

T_A

PACKAGED DEVICE⁽¹⁾⁽²⁾

32-Pin QFN (RHB)

–40°C to 85°C

TPA6045A4CRHB

(1) The RHB package is available taped and reeled. To order a taped and reeled part, add the suffix R to

the part number (e.g., TPA6045A4CRHBR).

(2) For the most current package and ordering information, see the Package Option Addendum at the end

of this document, or see the TI website at www.ti.com.

TPA6045A4CRHB

(TOP VIEW)

32 31 30 29 28 27 26 25

1

2

3

4

5

6

7

8

24

23

22

21

20

19

18

17

SPKR_RIN–

BYPASS

SPKR_EN

HP_EN

SPGND

ROUT+

ROUT–

SPVDD

HPVDD

SPKR_RIN+

SPKR_LIN+

SPKR_LIN–

SPGND

LOUT+

Thermal

Pad

LOUT–

SPVDD

9

10 11 12 13 14 15 16

TERMINAL FUNCTIONS

TERMINAL

NAME

I/O/P

DESCRIPTION

NO.

1

SPKR_RIN–

SPKR_RIN+

SPKR_LIN+

SPKR_LIN–

SPGND

LOUT+

I

Right-channel negative differential audio input for speaker amplifier

Right-channel positive differential audio input for speaker amplifier

Left-channel positive differential audio input for speaker amplifier

Left-channel negative differential audio input for speaker amplifier

Speaker power ground

2

3

I

4

I

5, 21

6

P

O

P

Left-channel positive audio output

LOUT–

7

Left-channel negative audio output

SPVDD

8, 18

9

Supply voltage terminal for speaker amplifier

CPVDD

Charge pump positive supply, connect to HPVDD via star connection

C1P

10

11

12

13

14

15

16

17

I/O Charge pump flying capacitor positive terminal

Charge pump ground

I/O Charge pump flying capacitor negative terminal

CPGND

C1N

P

CPVSS

P

O

P

Charge pump output (negative supply for headphone amplifier), connect to HPVSS

Headphone amplifier negative supply, connect to CPVSS

Right-channel capacitor-free headphone output

HPVSS

HP_OUTR

HP_OUTL

HPVDD

Left-channel capacitor-free headphone output

Headphone amplifier supply voltage, connect to CPVDD

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TERMINAL FUNCTIONS (continued)

TERMINAL

I/O/P

DESCRIPTION

NAME

NO.

19

20

22

23

24

25

26

27

28

29

30

31

32

ROUT–

ROUT+

HP_EN

SPKR_EN

BYPASS

REG_EN

HP_INR

HP_INL

SGND

O

I

Right-channel negative audio output

Right-channel positive audio output

Headphone channel enable logic input; active high enable. HIGH=ENABLE.

Speaker channel enable logic input; active high enable. HIGH=ENABLE.

Common-mode bias voltage for speaker preamplifiers

Enable pin for turning on/off LDO. HIGH=ENABLE

Headphone right-channel audio input

I

P

I

Headphone left-channel audio input

P

O

P

I

Signal ground, connect to CPGND and SPGND

Regulated 3.3-V output

REG_OUT

VDD

Positive power supply

GAIN0

Bit 0, MSB, of gain select bits

GAIN1

I

Bit 1, LSB, of gain select bits

Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB. It is required for

mechanical stability and will enhance thermal performance.

Thermal Pad Die Pad

P

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

VALUE

–0.3 to 6

–0.3 to 6.3

UNIT

Supply voltage

Input voltage

HPVDD, VDD, SPVDD, CPVDD

V

SPKR_LIN+, SPKR_LIN-, SPKR_RIN+, SPKR_RIN-,

HP_EN,GAIN0, GAIN1, SPK_EN, REG_EN

V_I

V

HP_INL, HP_INR HP Enabled

–3.5 to 3.5

HP_INL, HP_INR HP not Enabled

–0.3 to 3.5

Continuous total power dissipation

Operating free-air temperature range

Operating junction temperature range

Storage temperature range

See Dissipation Rating Table

T_A

–40 to 85

°C

kV

V

T_J

–40 to 150

T_stg

–65 to 150

Electrostatic discharge

HBM for HP_OUTL and HP_OUTR

8

500

2

CDM

HBM

Electrostatic discharge,

all other pins

kV

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DISSIPATION RATINGS

PACKAGE⁽¹⁾

T_A≤ 25°C

DERATING FACTOR

T_A= 70°C

T_A= 85°C

RHB

5.06 W

40 mW/°C

4.04 W

3.23 W

(1) The PowerPAD™ must be soldered to a thermal land on the printed-circuit board. Refer to the Texas Instruments document,

PowerPAD™ Thermally Enhanced Package application report (literature number SLMA002) for more information regarding the

PowerPAD™ package.

RECOMMENDED OPERATING CONDITIONS

MIN

4.5

3

MAX

5.5

UNIT

V

Supply voltage

VDD, SPVDD

HPVDD, CPVDD

5.5

V

4

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RECOMMENDED OPERATING CONDITIONS (continued)

MIN

MAX

UNIT

V

V_IH

V_IL

T_A

High-level input voltage

Low-level input voltage

SPKR_EN, HP_EN, GAIN0, GAIN1, REG_EN

2

0.8

85

V

Operating free-air temperature

–40

°C

GENERAL DC ELECTRICAL CHARACTERISTICS

T_A= 25°C, VDD = SPVDD = HPVDD = CPVDD = 5 V (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SPKR_EN, HP_EN, GAIN0, GAIN1,

REG_EN = VDD

I_IH

High-level input current

0.02

1

µA

SPKR_EN, HP_EN, GAIN0, GAIN1,

REG_EN = 0 V

I_IL

Low-level input current

0.02

5

1

12

14

µA

mA

Supply current, speaker amplifier

ONLY enabled

I_DD(Speaker)

I_DD(HP)

I_DD(REG)

I_DD(SD)

SPKR_EN = 2 V, HP_EN = REG_EN = 0 V

HP_EN = 2 V, SPKR_EN = REG_EN = 0 V

Supply current, headphone

amplifier ONLY enabled

7.5

Supply current, regulator ONLY

enabled

REG_EN = 2 V, SPKR_EN = HP_EN = 0 V

SPKR_EN = HP_EN = REG_EN = 0 V

0.65

2.5

1

5

mA

Supply current, shutdown mode

µA

SPEAKER AMPLIFIER DC CHARACTERISTICS

T_A= 25°C, VDD = SPVDD = 5 V, R_L= 4 Ω, Gain = 10 dB (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

| V_OO

|

Output offset voltage (measured differentially)

Inputs AC-coupled to GND, Gain = 10

dB

0.5

10

mV

PSRR

Power supply rejection ratio

VDD = SPVDD = 4.5 V to 5.5 V

-60

–74

dB

SPEAKER AMPLIFIER AC CHARACTERISTICS

T_A= 25°C, VDD = SPVDD = 5 V, R_L= 4 Ω, Gain = 10 dB (unless otherwise noted)

PARAMETER

TEST CONDITIONS

THD+N = 1%, f = 1 kHz, R_L= 8 Ω

THD+N = 10%, f = 1 kHz, R_L= 8 Ω

THD+N = 1%, f = 1 kHz, R_L= 4 Ω

THD+N = 10%, f = 1 kHz, R_L= 4 Ω

P_O= 1 W, R_L= 8 Ω, f = 20 Hz to 20 kHz

P_O= 1 W, R_L= 4 Ω, f = 20 Hz to 20 kHz

MIN

TYP

1.3

MAX

UNIT

1.6

P_O

Output power

2.1

W

2.6

0.06%

0.1%

THD+N

Total harmonic distortion plus noise

f = 1 kHz, CBYPASS = 0.47 µF, R_L= 8 Ω

V_RIPPLE= 200 mV_PP

kSVR

SNR

Supply ripple rejection ratio

Signal-to-noise rejection ratio

–53

90

dB

Maximum output at THD+N <1%, f = 1 kHz,

Gain = 10 dB

f = 1 kHz, P_o= 1 W, Gain = 10 dB

f = 10 kHz, P_o= 1 W, Gain = 10 dB

–110

–100

dB

Crosstalk (Left-Right; Right-Left)

CBYPASS = 0.47 µF, f = 20 Hz to 20 kHz,

Gain = 10 dB, No weighting

Vn

Z_I

Noise output voltage

Input Impedance

21

µVrms

kΩ

Gain = 21.6 dB

15

9.4

11.4

15

20

10

GAIN0, GAIN1 = 0.8 V

GAIN0 = 0.8 V; GAIN1 = 2 V

GAIN0 = 2 V, GAIN1 = 0.8 V

GAIN0, GAIN1 = 2 V

Channel-to Channel

10.6

12.6

16.2

22.2

12

G

Gain

dB

15.6

21.6

0.01

21

Gain Matching

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SPEAKER AMPLIFIER AC CHARACTERISTICS (continued)

T_A= 25°C, VDD = SPVDD = 5 V, R_L= 4 Ω, Gain = 10 dB (unless otherwise noted)

PARAMETER

TEST CONDITIONS

CBYPASS = 0.47 µF

MIN

TYP

MAX

UNIT

Start-up time from shutdown

25

ms

HEADPHONE AMPLIFIER DC ELECTRICAL CHARACTERISTICS

T_A= 25°C, HPVDD = CPVDD = VDD = 5 V, R_L= 16 Ω (unless otherwise noted)

PARAMETER

TEST CONDITIONS

Inputs grounded

HPVDD = 4.5 V to 5.5 V

MIN

TYP

1

MAX

UNIT

mV

| V_OS

|

Output offset voltage

Power supply rejection ratio

3

PSRR

–75

–100

dB

HEADPHONE AMPLIFIER AC CHARACTERISTICS

T_A= 25°C, HPVDD = 5 V, R_L= 16 Ω (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

200

100

MAX

UNIT

THD+N = 10%, R_L= 16 Ω, f = 1 kHz

THD+N = 10%, R_L= 32 Ω, f = 1 kHz

P_O

Output power (outputs in phase)

mW

P_O= 85 mW, f = 20 Hz to 20 kHz,

R_L= 16 Ω

0.03%

0.04%

THD+N

Total harmonic distortion plus noise

P_O= 50 mW, f = 20 Hz to 20 kHz,

R_L= 32 Ω

Dynamic Range with Signal Present

Supply ripple rejection ratio

Crosstalk

A-Weighted, f = 20 Hz to 20 kHz

f = 1 kHz, 200-mV_PPripple

–100

-60

-80

95

dB FS

dB

kSVR

P_o= 35 mW, f = 20 Hz to 20 kHz

Maximum output at THD+N 1%, f = 1 kHz

f = 20 Hz to 20 kHz, No weighting

dB

SNR

V_n

Signal-to-noise ratio

dB

Noise output voltage

20

µVrms

kΩ

Z_I

Input Impedance

15

20

Gain

Closed-loop voltage gain

Start-up time from shutdown

R_L= 16 Ω

–1.45

–1.5

7.5

–1.55

V/V

ms

LDO CHARACTERISTICS

T_A= 25°C, VDD = 5 V (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

4.5

TYP

MAX

UNIT

V

V_I

Input voltage

V_DD

5.5

I_O

Continuous output current

Output voltage

120

3.2

mA

V

V_O

0 < I_O< 120 mA; 4.9 V < Vin < 5.5 V

I_L= 5 mA; 4.9 V < Vin < 5.5 V

I_L= 0 – 120 mA, Vin = 5 V

3.3

1.8

3.4

10

Line regulation

mV

Load regulation

0.13

-46

0.23 mV/ mA

dB

Power supply ripple rejection

V_DD= 4.9 V, I_L= 10 mA

f = 100 Hz

6

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TYPICAL CHARACTERISTICS

Default graph conditions: V_CC= 5 V, Freq = 1 kHz, AES17 Filter.

TOTAL HARMONIC DISTORTION + NOISE (SP)

vs

FREQUENCY

1

Gain = 10 dB,

R

V

= 8 W,

P

= 0.1 W

L

R

V

= 4 W,

O

L

= 5 V

DD

= 5 V

P

= 1 W

DD

O

P

= 0.25 W

O

0.1

P

= 0.25 W

O

0.1

0.01

P

= 1 W

O

P

= 1.5 W

O

0.01

0.001

0.0001

0.001

10

100

1 k

f - Frequency - Hz

10 k

100 k

10

100

1 k

f - Frequency - Hz

10 k

100 k

Figure 1.

Figure 2.

TOTAL HARMONIC DISTORTION + NOISE (HP)

vs

FREQUENCY

1

Gain = 3.5 dB

R

= 16 Ω

= 5 V

R

= 32 Ω

= 5 V

L

V

DD

V

DD

0.1

P

O

= 50 mW

P

O

= 2.8 mW

P

O

= 100 mW

P

O

= 1.4 mW

P

O

= 25 mW

P

O

= 50 mW

0.01

0.001

10

100

1k

10k

100k

100

1k

10k

100k

f − Frequency − Hz

G003

G004

Figure 3.

Figure 4.

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TYPICAL CHARACTERISTICS (continued)

TOTAL HARMONIC DISTORTION + NOISE (SP)

vs

OUTPUT POWER

100

10

1

100

10

Gain = 10 dB,

= 4 W

Gain = 10 dB,

= 8 W

R

L

V

= 4.5 V

DD

V

= 4.5 V

= 5 V

DD

V

= 5 V

DD

V

DD

V

= 5.5 V

DD

1

V

= 5.5 V

DD

0.1

0.01

0.1

P

O

1

- Output Power - W

10

0.01

0.1

P

O

1

- Output Power - W

10

Figure 5.

Figure 6.

TOTAL HARMONIC DISTORTION + NOISE (HP)

vs

OUTPUT POWER

10

1

10

1

Gain = 3.5 dB

R

L

= 16 Ω

= 5 V

R

L

= 32 Ω

= 5 V

V

DD

V

DD

0.1

V

DD

= 5 V

In Phase

0.01

0.001

0.01

0.001

V

DD

= 5 V

100µ

1m

10m

100m

1

100µ

1m

10m

100m

1

P

O

− Output Power − W

P

O

− Output Power − W

G007

G008

Figure 7.

Figure 8.

8

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TYPICAL CHARACTERISTICS (continued)

CROSSTALK (SP)

vs

FREQUENCY

CROSSTALK (SP)

vs

FREQUENCY

0

-10

-20

0

Gain = 10 dB,

Power = 1 W,

-10

Gain = 10 dB,

P

= 1 W,

= 8 W,

= 5 V

O

R

V

= 4 W,

-20

L

R

V

L

= 5 V

DD

-30

-40

-50

-30

-40

-50

DD

-60

-70

-60

-70

-80

-90

-80

-90

L to R

-100

-110

-100

-110

R to L

-120

-130

-140

-120

-130

-140

R to L

10 k

10

100

1 k

f - Frequency - Hz

10 k

100 k

10

100

1 k

100 k

f - Frequency - Hz

Figure 9.

Figure 10.

CROSSTALK (LDO)

vs

CROSSTALK (HP)

vs

FREQUENCY

0

-10

-20

-30

-40

-50

-60

0

Gain = 10 dB,

Gain = 3.5 dB,

-10

-20

P

= 2 W,

= 4 W,

= 5 V

P

= 2.8 m W,

= 16 W,

= 5 V

O

R

V

R

V

L

DD

-30

-40

-50

-60

-70

-80

L to LDO

-70

-90

R to L

-80

-100

-110

R to LDO

-90

L to R

-100

-110

-120

-130

-140

10

100

1 k

10 k

100 k

10

100

1 k

f - Frequency - Hz

10 k

100 k

f - Frequency - Hz

Figure 11.

Figure 12.

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TYPICAL CHARACTERISTICS (continued)

CROSSTALK (HP)

vs

FREQUENCY

CROSSTALK (HP)

vs

FREQUENCY

0

−10

−20

−30

−40

−50

−60

−70

−80

−90

−100

−110

−120

0

Gain = 3.5 dB

P_O= 2.8 mW

Gain = 3.5 dB

–10

P

= 35 mW

= 16 Ω

O

R_L= 32 W

R

–20

–30

L

V_DD= 5 V

V

DD

= 5 V

–40

–50

–60

–70

R to L

–80

–90

–100

L to R

–110

–120

10

100

1k

10k

100k

10

100

1k

f – Frequency – Hz

10k

100k

f − Frequency − Hz

G012

Figure 13.

Figure 14.

CROSSTALK (HP)

vs

FREQUENCY

OUTPUT POWER (SP)

vs

SUPPLY VOLTAGE

0

−10

−20

−30

−40

−50

−60

−70

−80

−90

−100

−110

−120

3.2

Gain = 10 dB,

= 4 W

3.1

3

Gain = 3.5 dB

R

L

P

= 35 mW

= 32 Ω

O

R

L

2.9

THD+N = 10%

V

DD

= 5 V

2.8

2.7

2.6

2.5

2.4

2.3

2.2

2.1

THD+N = 1%

R to L

2

1.9

1.8

1.7

L to R

1.6

10

100

1k

10k

100k

4.5 4.6 4.7 4.8 4.9

V

5 5.1 5.2 5.3 5.4 5.5

- Supply Voltage - V

f − Frequency − Hz

DD

G013

Figure 15.

Figure 16.

10

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TYPICAL CHARACTERISTICS (continued)

OUTPUT POWER (SP)

vs

SUPPLY VOLTAGE

OUTPUT POWER (HP)

vs

SUPPLY VOLTAGE

0.30

0.25

0.20

0.15

0.10

0.05

0.00

2.05

1.95

Gain = 10 dB,

= 8 W

THD+N = 10%

R

L

THD+N = 10%

1.85

1.75

1.65

1.55

1.45

1.35

THD+N = 1%

1.25

Gain = 3.5 dB

= 16 Ω

1.15

1.05

R

L

4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5

4.5 4.6 4.7 4.8 4.9

5

5.1 5.2 5.3 5.4 5.5

V

- Supply Voltage - V

V

− Supply Voltage − V

DD

Figure 17.

Figure 18.

SUPPLY CURRENT (SP)

vs

TOTAL OUTPUT POWER

SUPPLY CURRENT (SP)

vs

TOTAL OUTPUT POWER

1.6

1.4

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0

V

= 5 V

DD

V

= 5 V

Gain = 10 dB,

= 8 W

DD

V = 4.5 V

DD

Gain = 10 dB,

= 4 W

R

V

= 4.5 V

L

DD

R

L

V = 5.5 V

DD

1.2

1

V

= 5.5 V

DD

0.8

0.6

0.4

0.2

0

0.4 0.8 1.2 1.6

2

2.4 2.8 3.2 3.6

4

0

1

2

3

4

5

6

P

- Output Power - W

P

- Output Power - W

O

Figure 19.

Figure 20.

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TYPICAL CHARACTERISTICS (continued)

POWER DISSIPATION (SP)

vs

TOTAL OUTPUT POWER

POWER DISSIPATION (SP)

vs

TOTAL OUTPUT POWER

3.2

3

1.6

1.4

1.2

2.8

2.6

V

= 5.5 V

DD

2.4

2.2

2

V

= 5 V

DD

V

= 5.5 V

DD

1

0.8

0.6

0.4

1.8

1.6

V

= 5 V

V

= 4.5 V

DD

V

= 4.5 V

DD

1.4

1.2

1

0.8

0.6

0.4

Gain = 10 dB,

= 8 W

0.2

0

Gain = 10 dB,

= 4 W

R

L

R

0.2

0

L

0

0.5

1

1.5

2

2.5

- Output Power - W

3

3.5

4

0

1

2

3

4

- Output Power - W

5

6

P

O

Figure 21.

Figure 22.

REGULATOR OUTPUT VOLTAGE (LDO)

SUPPLY VOLTAGE (LDO)

vs

SUPPLY VOLTAGE

LOAD CURRENT

3.40

3.36

3.32

3.40

3.38

3.36

3.34

V

= 5 V

DD

V

= 5.5 V

DD

3.28

I

= -10 mA

I

= -1 mA

L

V

= 4.5 V

DD

3.24

3.20

3.16

3.12

3.08

3.32

3.30

3.28

3.26

I

= -50 mA

L

I

= -120 mA

L

3.24

3.04

3

3.22

3.20

0

0.025 0.05 0.075 0.1 0.125 0.15 0.175 0.2

4.5 4.6 4.7 4.8 4.9

5

5.1 5.2 5.3 5.4 5.5

- V

V

I

- Load Current - A

DD

L

Figure 23.

Figure 24.

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TYPICAL CHARACTERISTICS (continued)

COMMON-MODE REJECTION RATIO (SP)

vs

FREQUENCY

0

-10

-20

0

-10

-20

-30

-40

Gain = 10 dB,

Input Level = 0.2 V

Gain = 10 dB,

Input Level = 0.2 V

,

PP

,

PP

R

V

= 4 W,

L

R

V

= 8 W,

L

= 5 V

DD

= 5 V

DD

-30

-40

-50

-60

-70

-80

-50

-60

-70

-80

-90

-100

10

100

1 k

f - Frequency - Hz

10 k

100 k

10

100

1 k

f - Frequency - Hz

10 k

100 k

Figure 25.

Figure 26.

POWER SUPPLY REJECTION RATIO (LDO)

POWER SUPPLY REJECTION RATIO (SP)

vs

FREQUENCY

0

-10

-20

-30

-40

-50

0

Gain = 10 dB,

I

= 10 mA,

O

R

V

= 8 W,

L

-10

V

= 0.20 V

,

PP

ripple

= 5 V

DD

-20

-30

-40

-50

-60

-70

-80

-70

-80

10

100

1 k

10 k

100 k

10

100

1 k

f - Frequency - Hz

10 k

100 k

f - Frequency - Hz

Figure 27.

Figure 28.

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TYPICAL CHARACTERISTICS (continued)

POWER SUPPLY REJECTION RATIO (HP)

OUTPUT POWER (HP)

vs

LOAD RESISTANCE

vs

FREQUENCY

0

−10

−20

−30

−40

−50

−60

−70

−80

−90

−100

500

450

400

350

300

250

200

150

100

50

f

= 1 kHz

IN

Gain = 3.5 dB

= 5 V

R

= 16 Ω

= 5 V

L

V

DD

V

DD

THD+N = 10%

THD+N = 1%

0

10

100

1k

10k

100k

100

1k

f − Frequency − Hz

R − Load Resistance − Ω

L

G028

G029

Figure 29.

Figure 30.

OUTPUT POWER (SP)

vs

LOAD RESISTANCE

2.6

2.4

2.2

2

f = 1 kHz

I

Gain = 10 dB,

= 5 V

V

DD

1.8

1.6

1.4

1.2

1

THD+N = 10%

0.8

0.6

0.4

THD+N = 1%

4

6

8

10 12 14 16 18 20 22 24 26 28 30

R

- Load Resistance - W

L

Figure 31.

14

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TYPICAL CHARACTERISTICS (continued)

SPEAKER SHUTDOWN - 8 Ω - 10 dB

SPEAKER STARTUP - 8 Ω - 10 dB

Figure 32.

Figure 33.

LDO SHUTDOWN - 120 mA

LDO STARTUP - 120 mA

Figure 34.

Figure 35.

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TYPICAL CHARACTERISTICS (continued)

HP SHUTDOWN - 32 Ω

HP STARTUP - 32 Ω

Figure 36.

Figure 37.

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APPLICATION INFORMATION

3.3 V

(Output)

4.5 V - 5.5 V

mF

0.1

HP Left Input

mF

2.2

HP Right Input

mF

1

1 mF

4-Step

Gain Control

Regulator Enable

{

mF

0.47

SPKR_RIN–

SPKR_RIN+

SPKR_LIN+

BYPASS

0.47 mF

SPKR Right Input

SPKR Left Input

SPKR_EN

HP_EN

Speaker Enable

0.47 mF

Headphone Enable

SPKR_LIN–

SPGND

ROUT+

0.47 mF

TPA6045A4C

SPGND

LOUT+

Right

Speaker

ROUT-

Left

Speaker

SPVDD

4.5 V - 5.5 V

3 V - 5.5 V

LOUT-

HPVDD

SPVDD

4.5 V - 5.5 V

1 mF

3 V - 5.5 V

10 mF

1 mF

Headphone

Output

Figure 38. Single-Ended Input Application Circuit

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3.3 V

(Output)

4.5 V - 5.5 V

mF

0.1

HP Left Input

mF

2.2

HP Right Input

mF

1

1 mF

4-Step

Gain Control

Regulator Enable

{

mF

0.47

SPKR_RIN–

SPKR_RIN+

SPKR_LIN+

SPKR Right (–) Input

SPKR Right (+) Input

SPKR Left (+) Input

SPKR Left (–) Input

BYPASS

0.47 mF

SPKR_EN

HP_EN

Speaker Enable

Headphone Enable

SPKR_LIN–

SPGND

ROUT+

TPA6045A4C

SPGND

LOUT+

Right

Speaker

ROUT-

Left

Speaker

SPVDD

LOUT-

HPVDD

3 V - 5.5 V

SPVDD

4.5 V - 5.5 V

1 mF

10 mF

1 mF

Headphone

Output

Figure 39. Differential Input Application Circuit

Power Enable Modes

The TPA6045A4C allows disable of any or all of the main circuit blocks when not in use in order to reduce

operating power to an absolute minimum. The SPKR_EN control can be used to disable the speaker amplifier

while the HP_EN can be used separately to turn off the headphone amplifier. The LDO also has an independent

power control, REG_EN. With all circuit blocks disabled, the supply current in shutdown mode is only 5 µA. See

the General DC Electrical Characteristics for operating currents with each circuit block operating independently.

Speaker Amplifier Description

The speaker amplifier is capable of driving 2.1 W/ch of continuous RMS power into a 4-Ω load at 5 V. An internal

4-step control allows variation of the gain from 10 dB to 21.6 dB.

Fully Differential Amplifier

The TPA6045A4C speaker amplifier is a fully differential amplifier with differential inputs and outputs. The fully

differential architecture consist of a differential amplifier and a common mode amplifier. The differential amplifier

ensures that the amplifier outputs a differential voltage that is equal to the differential input times the gain. The

common-mode voltage at the output is biased around V_DD/2 regardless of the common-mode voltage at the

input.

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One of the primary advantages of the fully differential amplifier is improved RF immunity. GSM handsets save

power by turning on and off the RF transmitter at a rate of 217 Hz. The transmitted signal is picked up on input

and output traces. The fully differential amplifier cancels the signal and others of this type much better than

typical audio amplifiers.

Gain Setting via GAIN0 and GAIN1 Inputs

The gain of the TPA6045A4C is set by two terminals, GAIN0 and GAIN1. The gains listed in Table 1 are realized

by changing the taps on the input resistors and feedback resistors inside the amplifier. This causes the input

impedance (Z_I) to vary as a function of the gain setting.

Gain Setting

AMPLIFIER GAIN

INPUT IMPEDANCE (kΩ)

(dB)

TYPICAL

10

GAIN1

GAIN0

TYPICAL

0

1

0

1

0

1

78

65

46

20

12

15.6

21.6

Input Capacitor, C_I

The input capacitor allows the amplifier to bias the input signal to the proper dc level for proper operation. In this

case, the input capacitor, C_I, and the input impedance of the amplifier, R_I, form a high-pass filter with the corner

frequency determined in Equation 1. Figure 40 shows how the input capacitor and the input resistor within the

amplifier interact.

Figure 40. Input Resistor and Input Capacitor

(1)

The value of C_Iis important to consider as it directly affects the low-frequency, or bass, performance of the

circuit. Furthermore, the input impedance changes with a change in volume. The higher the volume, the lower

the input impedance is. To determine the appropriate capacitor value, reconfigure Equation 1 into Equation 2.

The value of the input resistor, R_I, can be determined from Equation 2.

1

C_I+

2pR_If_c

(2)

Low-leakage tantalum or ceramic capacitors are recommended. When polarized capacitors are used, the positive

side of the capacitor should face the amplifier input in most applications as the dc level there is held at VCC/2,

which is likely higher than the source dc level. Note that it is important to confirm the capacitor polarity in each

specific application. Recommended capacitor values are between 0.1 µF and 1 µF.

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Windows Vista™ Premium Mobile Mode Specifications

Windows Premium Mobile Vista

Device Type

Requirement

TPA6045A4C Typical Performance

–88 dB FS[20 Hz, 20 kHz]

–88 dB FS A-Weight

Specifications

THD+N

≤ –65 dB FS [20 Hz, 20 kHz]

Analog Speaker Line Jack

(R_L= 10 kΩ, FS = 0.707

Vrms)

Dynamic Range with Signal

Present

≤ –80 dB FS A-Weight

Line Output Crosstalk

THD+N

≤ –60 dB [20 Hz, 20 kHz]

–105 dB [20 Hz, 20 kHz]

–88 dB FS [20 Hz, 20 kHz]

≤ –45 dB FS [20 Hz, 20 kHz]

Analog Headphone Out Jack

(R_L= 32Ω, FS = 0.300

Vrms)

Dynamic Range with Signal

Present

≤ –80 dB FS A-Weight

–89 dB FS A-Weight

Headphone Output Crosstalk

≤ –60 dB [20 Hz, 20 kHz]

–100 dB [20 Hz, 20 kHz]

Bridge-Tied Load Versus Single-Ended Mode

Figure 41 shows a Class-AB audio power amplifier (APA) in a bridge-tied-load (BTL) configuration. The

TPA6045A4C speaker amplifier consists of two Class-AB differential amplifiers per channel driving the positive

and negative terminals of the load. Specifically, differential drive means that as one side of the amplifier (the

positive terminal, for example) is slewing up, the other side is slewing down, and vice versa. This doubles the

voltage swing across the load as opposed to a ground-referenced load, or a single-ended load. Power is

proportional to the square of the voltage. Plugging 2x VO(PP) into the power equation yields 4X the output power

from the same supply rail and load impedance as would have been obtained with a ground-referenced load (see

Equation 3).

V

O(PP)

V

+

(RMS)

Ǹ

2 2

2

V

(RMS)

Power +

R

L

(3)

V

DD

V

O(PP)

2x V

O(PP)

R

L

V

DD

−V

O(PP)

Figure 41. Differential Output Configuration

V_DD

–3 dB

V_O(PP)

C_C

V_O(PP)

R_L

f_c

Figure 42. Single-Ended Configuration and Frequency Response

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Bridge-tying the outputs in a typical computer audio, LCD TV, or multimedia LCD monitor application drastically

increases output power. For example, if an amplifier in a single-ended configuration was capable of outputting a

maximum of 250 mW for a given load with a supply voltage of 12 V, then that same amplifier would be able to

output 1 W of power in a BTL configuration with the same supply voltage and load. In addition to the increase in

output power, the BTL configuration does not suffer from the same low-frequency issues that plague the

single-ended configuration. In a BTL configuration, there is no need for an output capacitor to block dc, so no

unwanted filtering occurs. In addition, the BTL configuration saves money and space, as the dc-blocking

capacitors needed for single-ended operation are large and expensive. For example, with an 8-Ω load in SE

operation, the user needs a 1000-µF capacitor to obtain a cutoff frequency below 20 Hz. This capacitor is

expensive and large.

Headphone Amplifier Description

The headphone amplifier has a fixed gain of –1.5 V/V. It uses single-ended (SE) inputs. The DirectPath™

amplifier architecture operates from a single supply but makes use of an internal charge pump to provide a

negative voltage rail. Combining the user-provided positive rail and the negative rail generated by the IC, the

device operates in what is effectively a split supply mode. The output voltages are now centered at zero volts

with the capability to swing to the positive rail or negative rail. The DirectPath™ amplifier requires no output dc

blocking capacitors and does not place any voltage on the sleeve. The block diagram and waveform of Figure 43

illustrate the ground-referenced headphone architecture. This is the architecture of the TPA6045A4C.

Single-supply headphone amplifiers typically require dc-blocking capacitors. The capacitors are required because

most headphone amplifiers have a dc bias on the outputs pin. If the dc bias is not removed, the output signal is

severely clipped, and large amounts of dc current rush through the headphones, potentially damaging them. The

left-side drawing in Figure 43 illustrates the conventional headphone amplifier connection to the headphone jack

and output signal.

DC blocking capacitors are often large in value. The headphone speakers (typical resistive values of 16 Ω or

32 Ω) combine with the dc blocking capacitors to form a high-pass filter. Equation 4 shows the relationship

between the load impedance (R_L), the capacitor (C_O), and the cutoff frequency (f_C).

1

f_c+

2pR_LC_O

(4)

C_Ocan be determined using Equation 5, where the load impedance and the cutoff frequency are known.

1

C_O

+

2pR_Lf_c

(5)

If f_cis low, the capacitor must then have a large value because the load resistance is small. Large capacitance

values require large package sizes. Large package sizes consume PCB area, stand high above the PCB,

increase cost of assembly, and can reduce the fidelity of the audio output signal.

Two different headphone amplifier applications are available that allow for the removal of the output dc blocking

capacitors. The capacitor-less amplifier architecture is implemented in the same manner as the conventional

amplifier with the exception of the headphone jack shield pin. This amplifier provides a reference voltage, which

is connected to the headphone jack shield pin. This is the voltage on which the audio output signals are

centered. This voltage reference is half of the amplifier power supply to allow symmetrical swing of the output

voltages. Do not connect the shield to any GND reference, or large currents will result. The scenario can happen

if, for example, an accessory other than a floating GND headphone is plugged into the headphone connector.

See the second block diagram and waveform in Figure 43.

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Conventional

V_DD

C_O

V_OUT

GND

V_DD/2

C_O

Capacitor-Less

V_DD

V_OUT

GND

V_BIAS

DirectPath^TM

V_DD

GND

V_SS

Figure 43. Amplifier Applications

Input-Blocking Capacitors

DC input-blocking capacitors block the dc portion of the audio source and allow the inputs to properly bias.

Maximum performance is achieved when the inputs of the TPA6045A4C are properly biased. Performance

issues such as pop are optimized with proper input capacitors.

The dc input-blocking capacitors can be removed, provided the inputs are connected differentially and within the

input common-mode range of the amplifier, the audio signal does not exceed ±3 V, and pop performance is

sufficient.

C_INis a theoretical capacitor used for mathematical calculations only. Its value is the series combination of the dc

input-blocking capacitors, C_{(DCINPUT-BLOCKING)}. Use Equation 6 to determine the value of C_{(DCINPUT-BLOCKING)}. For

example, if C_INis equal to 0.22 µF, then C_{(DCINPUT-BLOCKING)}is equal to about 0.47 µF.

1

2

C

=

(DCINPUT-BLOCKING)

IN

(6)

The two C_{(DCINPUT-BLOCKING)}capacitors form a high-pass filter with the input impedance of the TPA6045A4C. Use

Equation 6 to calculate C_IN, then calculate the cutoff frequency using C_INand the differential input impedance of

the TPA6045A4C, R_IN, using Equation 7. Note that the differential input impedance changes with gain. See

Figure 39 for input impedance values. The frequency and/or capacitance can be determined when one of the two

values are given.

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1

fc_IN

+

C_IN

+

or

2p R_INC_IN

2p fc_INR_IN

(7)

If a high-pass filter with a -3-dB point of no more than 20 Hz is desired over all gain settings, the minimum

impedance would be used in the Equation 7. The minimum input impedance for TPA6045A4C is 20 kΩ. The

capacitor value by Equation 7 would be 0.399 µF. However, this is C_IN, and the desired value is for

C_{(DCINPUT-BLOCKING)}. Multiplying C_INby 2 yields 0.80 µF, which is close to the standard capacitor value of 1 µF.

Place 1-µF capacitors at each input terminal of the TPA6045A4C to complete the filter.

Charge Pump Flying Capacitor and CPVSS Capacitor

The charge pump flying capacitor serves to transfer charge during the generation of the negative supply voltage.

The CPVSS capacitor must be at least equal to the flying capacitor in order to allow maximum charge transfer.

Low ESR capacitors are an ideal selection, and a value of 1 µF is typical.

Decoupling Capacitors

The TPA6045A4C is a DirectPath™ headphone amplifier that requires adequate power supply decoupling to

ensure that the noise and total harmonic distortion (THD) are as low as possible. To filter high-frequency

transients, spikes, and digital hash on the power line, use good low equivalent-series-resistance (ESR) ceramic

capacitors, typically 1 µF. Find the smallest package possible, and place as close as possible to the device V_DD

lead. Placing the decoupling capacitors close to the TPA6045A4C is important for the performance of the

amplifier. Use a 10 µF or greater capacitor near the TPA6045A4C to filter lower frequency noise signals;

however, the high PSRR of the TPA6045A4C makes the 10-µF capacitor unnecessary in most applications.

Midrail Bypass Capacitor, C_BYPASS

The midrail bypass capacitor, C_(BYPASS), has several important functions. During start-up or recovery from

shutdown mode, C_BYPASSdetermines the rate at which the amplifier starts up. A 1-µF capacitor yields a start-up

time of approximately 25 ms. C_BYPASSalso reduces the noise coupled into the output signal by the power supply.

This improves the power supply ripple rejection (PSRR) of the amplifier. Ceramic or polyester capacitors with low

ESR and values in the range of 0.47 µF to 1 µF are recommended.

Low Dropout Regulator (LDO) Description

The TPA6045A4C contains a 3.3-V output low dropout regulator (LDO) capable of providing a maximum of 120

mA with a drop of less than 150 mV from the 5-V supply. This can be used to power an external CODEC. A

10-µF decoupling capacitor is recommended at the output of the LDO as well as 0.1-µF capacitor to filter

high-frequency noise from the supply line.

Layout Recommendations

Solder the exposed thermal pad (metal pad on the bottom of the part) on the TPA6045A4C QFN package to a

pad on the PCB.

It is important to keep the TPA6045A4C external components close to the body of the amplifier to limit noise

pickup. One should lay out the differential input leads symmetrical and close together to take advantage of the

inherent common mode rejection of the TPA6045A4C. The layout of the TPA6045A4C evaluation module (EVM)

is a good example of component placement and the layout files are available at www.ti.com.

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PACKAGE OPTION ADDENDUM

www.ti.com

20-Nov-2008

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

TPA6045A4CRHBR

ACTIVE

QFN

RHB

32

3000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR

no Sb/Br)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

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information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

27-Nov-2008

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

A0 (mm)

B0 (mm)

K0 (mm)

P1

W

Pin1

Diameter Width

(mm) W1 (mm)

(mm) (mm) Quadrant

TPA6045A4CRHBR

QFN

RHB

32

3000

330.0

12.4

5.3

1.5

8.0

12.0

Q2

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

27-Nov-2008

*All dimensions are nominal

Device

Package Type Package Drawing Pins

QFN RHB 32

SPQ

Length (mm) Width (mm) Height (mm)

346.0 346.0 29.0

TPA6045A4CRHBR

3000

Pack Materials-Page 2

IMPORTANT NOTICE

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Products

Applications

Audio

Automotive

Broadband

Digital Control

Medical

Amplifiers

Data Converters

DSP

Clocks and Timers

Interface

amplifier.ti.com

dataconverter.ti.com

dsp.ti.com

www.ti.com/clocks

interface.ti.com

logic.ti.com

www.ti.com/audio

www.ti.com/automotive

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www.ti.com/digitalcontrol

www.ti.com/medical

www.ti.com/military

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power.ti.com

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www.ti-rfid.com

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Security

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Video & Imaging

Wireless

www.ti.com/opticalnetwork

www.ti.com/security

www.ti.com/telephony

www.ti.com/video

RF/IF and ZigBee® Solutions www.ti.com/lprf

www.ti.com/wireless

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265


型号：	TPA6047A4RHBR
厂家：	TEXAS INSTRUMENTS
描述：	具有 4.75V LDO、使能端高电平有效的 2W、立体声 AB 类扬声器和耳机放大器 \| RHB \| 32 \| -40 to 85 放大器消费电路商用集成电路音频放大器视频放大器
文件：	总30页 (文件大小：1207K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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