TPA6120A2RGYR [TI]

High Fidelity Headphone Amplifier;
TPA6120A2RGYR
型号: TPA6120A2RGYR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

High Fidelity Headphone Amplifier

放大器 商用集成电路
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TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
HIGH FIDELITY HEADPHONE AMPLIFIER  
FEATURES  
DESCRIPTION  
80 mW into 600 From a ±12-V Supply at  
0.00014% THD + N  
The TPA6120A2 is a high fidelity audio amplifier built  
on current-feedback architecture. This high  
a
bandwidth, extremely low noise device is ideal for  
high performance equipment. The better than 120 dB  
of dynamic range exceeds the capabilities of the  
human ear, ensuring that nothing audible is lost due  
to the amplifier. The solid design and performance of  
the TPA6120A2 ensures that music, not the amplifier,  
is heard.  
Current-Feedback Architecture  
Greater than 120 dB of Dynamic Range  
SNR of 120 dB  
Output Voltage Noise of 5 µVrms at  
Gain = 2 V/V  
Power Supply Range: ±5 V to ±15 V  
1300 V/µs Slew Rate  
Three key features make current-feedback amplifiers  
outstanding for audio. The first feature is the high  
slew rate that prevents odd order distortion  
anomalies. The second feature is current-on-demand  
at the output that enables the amplifier to respond  
quickly and linearly when necessary without risk of  
output distortion. When large amounts of output  
power are suddenly needed, the amplifier can re-  
spond extremely quickly without raising the noise  
floor of the system and degrading the signal-to-noise  
ratio. The third feature is the gain-independent fre-  
quency response that allows the full bandwidth of the  
amplifier to be used over a wide range of gain  
settings. The excess loop gain does not deteriorate at  
a rate of 20 dB/decade.  
Differential Inputs  
Independent Power Supplies for Low  
Crosstalk  
Short Circuit and Thermal Protection  
APPLICATIONS  
Professional Audio Equipment  
Mixing Boards  
Headphone Distribution Amplifiers  
Headphone Drivers  
Microphone Preamplifiers  
I/V Gain Stage  
Filter and  
Stereo Hi−Fi  
Headphone Driver  
1/2 OPA4134  
2.7 nF  
C
F
AUDIO DAC  
TPA6120A2  
R
F
1 k  
R
F
−IN A  
+IN A  
R
I
1 kΩ  
OUT A  
OUT B  
I
L−  
OUT  
LRCK  
BCK  
PCM  
Audio  
Data  
1 kΩ  
LIN−  
LIN+  
R
O
LOUT  
+IN B  
−IN B  
R
I
DATA  
SCK  
10 Ω  
Source  
I
L+  
OUT  
1 kΩ  
R
F
1 kΩ  
1 kΩ  
R
F
PCM1792  
or  
C
2.7 nF  
F
1/2 OPA4134  
C
DSD1792  
2.7 nF  
F
ZEROL  
ZEROR  
R
F
1 kΩ  
RIN+  
RIN−  
1 kΩ  
R
F
+IN C  
−IN C  
R
I
MS  
I
R+  
OUT  
OUT C  
OUT D  
R
O
ROUT  
MDI  
MC  
Controller  
1 kΩ  
10 Ω  
DYR > 120 dB  
for Whole  
System!  
+IN D  
−IN D  
R
I
MDO  
I
R−  
OUT  
R
F
1 kΩ  
1 kΩ  
RST  
R
F
1 kΩ  
C
F
2.7 nF  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerPAD is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2004, Texas Instruments Incorporated  
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage.  
ABSOLUTE MAXIMUM RATINGS  
over operating free-air temperature range (unless otherwise noted)  
(1)  
TPA6120A2  
Supply voltage, VCC+ to VCC-  
Input voltage, VI(2)  
33 V  
± VCC  
Differential input voltage, VID  
Minimum load impedance  
6 V  
8 Ω  
Continuous total power dissipation  
Operating free–air temperature range, TA  
Operating junction temperature range, TJ  
Storage temperature range, Tstg  
See Dissipation Rating Table  
- 40°C to 85°C  
- 40°C to 150°C  
- 40°C to 125°C  
235°C  
(3)  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds  
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating  
conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.  
(2) When the TPA6120A2 is powered down, the input source voltage must be kept below 600-mV peak.  
(3) The TPA6120A2 incorporates an exposed PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a  
thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature that  
could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD thermally  
enhanced package.  
DISSIPATION RATING TABLE  
(1)  
θJA  
θJC  
TA = 25°C  
PACKAGE  
(°C/W)  
(°C/W)  
POWER RATING  
DWP  
44.4  
33.8  
2.8 W  
(1) The PowerPAD must be soldered to a thermal land on the printed-circuit board. See the PowerPAD  
Thermally Enhanced Package application note (SLMA002)  
AVAILABLE OPTIONS  
TA  
PACKAGE  
PART NUMBER  
SYMBOL  
-40°C to 85°C  
DWP(1)  
TPA6120A2DWP  
6120A2  
(1) The DWP package is available taped and reeled. To order a taped and reeled part, add the suffix R  
to the part number (e.g., TPA6120A2DWPR).  
RECOMMENDED OPERATING CONDITIONS  
MIN  
±5  
MAX  
±15  
30  
UNIT  
Split Supply  
Single Supply  
Supply voltage, VCC+ and VCC-  
V
10  
Load impedance  
VCC = ±5 V or ±15 V  
16  
Operating free–air temperature, TA  
-40  
85  
°C  
2
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
ELECTRICAL CHARACTERISTICS  
over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
2
MAX  
UNIT  
mV  
|VIO  
|
Input offset voltage (measured differentially)  
Power supply rejection ratio  
VCC = ±5 V or ±15 V  
VCC = 2.5 V to 5.5 V  
VCC = ±5 V  
5
PSRR  
75  
dB  
±3.6  
±3.7  
±13.5  
11.5  
VIC  
Common mode input voltage  
Supply current (each channel)  
V
VCC = ±15 V  
±13.4  
VCC = ±5 V  
13  
15  
ICC  
IO  
mA  
VCC= ±15 V  
Output current (per channel)  
Input offset voltage drift  
Input resistance  
VCC= ±5 V to ±15 V  
VCC = ±5 V or ±15 V  
700  
20  
mA  
µV/°C  
kΩ  
ri  
300  
13  
ro  
Output resistance  
Open Loop  
11.8 to  
-11.5  
12.5 to  
-12.2  
VO  
Output voltage swing  
VCC = ±15 V, RL = 25 Ω  
V
3
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
OPERATING CHARACTERISTICS(1)  
TA = 25°C, RL = 25 , Gain = 2 V/V (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
VCC = ±12 V to ±15 V,  
RL = 32 ,  
VI = 1 VPP  
0.00014%  
SMTPE ratio = 4:1,  
Gain = 2 V/V,  
Intermodulation distortion  
(SMPTE)  
IMD  
IM frequency = 60 Hz  
High frequency = 7 kHz  
VCC = ±12 V to ±15 V,  
RL = 64 ,  
0.000095%  
VI = 1 VPP  
VCC = ±12 V  
VCC = ±15 V  
VCC = ±12 V  
VCC = ±15 V  
PO = 80 mW  
PO = 40 mW  
PO = 125 mW  
PO = 62.5 mW  
0.00055%  
0.00060%  
0.00038%  
0.00029%  
0.00014%  
0.000065%  
0.00012%  
0.000061%  
PO = 100 mW, RL = 32 Ω  
f = 1 kHz  
PO = 100 mW, RL = 64 Ω  
f = 1 kHz  
VCC = ±12 V, Gain = 3 V/V  
RL = 600 , f = 1 kHz  
Total harmonic distortion  
plus noise  
THD+N  
VCC = ±15 V, Gain = 3 V/V  
RL = 600 , f = 1 kHz  
VO = 15 VPP  
RL = 10 kΩ  
f = 1 kHz  
,
VCC = ±12 V,  
Gain = 3 V/V  
0.000024%  
0.000021%  
VO = 15 VPP  
RL = 10 kΩ  
f = 1 kHz  
,
VCC = ±15 V,  
Gain = 3 V/V  
RL = 32 Ω  
f = 10 Hz to 22 kHz  
V(RIPPLE) = 1 VPP  
VCC= ±12 V  
VCC= ±15 V  
VCC= ±12 V  
VCC= ±15 V  
-80  
-83  
-76  
-79  
Supply voltage rejection  
ratio  
kSVR  
dB  
RL = 64 Ω  
f = 10 Hz to 22 kHz  
V(RIPPLE) = 1 VPP  
Common mode rejection  
ratio (differential)  
CMRR  
SR  
VCC = ±5 V or ±15 V  
100  
dB  
VCC = ±15 V, Gain = 5 V/V, VO = 20 VPP  
VCC = ±5 V, Gain = 2 V/V, VO = 5 VPP  
1300  
900  
5
Slew rate  
V/µs  
VCC = ±12 V to ±15 V  
RL = 32 to 64 Ω  
f = 1 kHz  
Gain = 2 V/V  
Gain = 100 V/V  
Gain = 2 V/V  
Gain = 100 V/V  
Vn  
Output noise voltage  
µVrms  
50  
VCC = ±12 V to ±15 V  
RL = 32 to 64 Ω  
f = 1 kHz  
125  
104  
SNR  
Signal-to-noise ratio  
Dynamic range  
Crosstalk  
dB  
VCC = ±12 V  
VCC = ±15 V  
VCC = ±12 V  
VCC = ±15 V  
123  
125  
124  
126  
RL = 32 , f = 1 kHz  
RL = 64 , f = 1 kHz  
dB  
dB  
VCC = ±12 V to ±15 V  
RL = 32 to 64 Ω  
f = 1 kHz  
VI = 1 VRMS  
RF = 1 kΩ  
-90  
(1) For IMD, THD+N, kSVR, and crosstalk, the bandwidth of the measurement instruments was set to 80 kHz.  
4
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
DEVICE INFORMATION  
Thermally Enhansed SOIC (DWP)  
PowerPAD™ Package  
Top View  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
LVCC−  
LOUT  
LVCC+  
LIN+  
LIN−  
NC  
RVCC−  
ROUT  
RVCC+  
RIN+  
RIN−  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC − No internal connection  
TERMINAL FUNCTIONS  
PIN NAME  
PIN NUMBER  
I/O  
DESCRIPTION  
Left channel negative power supply – must be kept at the same potential as  
RVCC-.  
LVCC-  
1
I
LOUT  
LVCC+  
LIN+  
2
O
I
Left channel output  
3
Left channel positive power supply  
Left channel positive input  
Left channel negative input  
Not internally connected  
4
I
LIN-  
5
I
NC  
6,7,8,9,10,11,12,13,14,15  
-
RIN-  
16  
17  
18  
19  
I
Right channel negative input  
Right channel positive input  
Right channel positive power supply  
Right channel output  
RIN+  
RVCC+  
ROUT  
I
I
O
Right channel negative power supply - must be kept at the same potential as  
LVCC-.  
RVCC-  
20  
-
I
Connect to ground. The thermal pad must be soldered down in all  
applications to properly secure device on the PCB.  
Thermal Pad  
-
5
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
TYPICAL CHARACTERISTICS  
Table of Graphs  
FIGURE  
1, 2, 3, 4  
5
vs Frequency  
vs Output voltage  
vs Output power  
vs Output power  
vs Frequency  
vs High frequency  
vs IM Amplitude  
vs Frequency  
vs Gain  
Total harmonic distortion + noise  
6, 7, 8  
9
Power dissipation  
Supply voltage rejection ratio  
10, 11  
12  
Intermodulation distortion  
13  
Crosstalk  
14  
Signal-to-noise ratio  
Slew rate  
15, 16  
17, 18  
19, 20  
21  
vs Output step  
Small and large signal frequency response  
400-mV step response  
10-V step response  
20-V step response  
22  
23  
TOTAL HARMONIC DISTORTION + NOISE  
TOTAL HARMONIC DISTORTION + NOISE  
vs  
vs  
FREQUENCY  
FREQUENCY  
0.01  
0.01  
R
= 10 kW,  
L
R
= 600 W,  
L
Gain = 3 V/V,  
Gain = 3 V/V,  
R
F
= 2 kW,  
R
F
= 2 kW,  
R = 1 kW,  
I
R = 1 kW,  
I
BW = 80 kHz  
BW = 80 kHz  
0.001  
0.001  
V
CC  
= +15 V = 15 V  
O PP  
V
CC  
= +12 V = 15 V  
O PP  
0.0001  
V
CC  
= +12 V = 12 V  
O PP  
V
O
= +15 V,  
V
= +12 V,  
CC  
CC  
O
P
= 125 mW  
P
= 80 mW  
V
= +15 V = 23 V  
O PP  
CC  
0.00001  
0.0001  
10  
100  
1 k  
10 k  
50 k  
10  
100  
1 k  
10 k  
50 k  
f − Frequency − Hz  
f − Frequency − Hz  
Figure 1.  
Figure 2.  
6
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
TYPICAL CHARACTERISTICS (continued)  
TOTAL HARMONIC DISTORTION + NOISE  
TOTAL HARMONIC DISTORTION + NOISE  
vs  
vs  
FREQUENCY  
FREQUENCY  
0.1  
1
R
= 64 W,  
L
R
= 32 W,  
L
Gain = 2 V/V,  
Gain = 2 V/V,  
R
F
= 1 kW,  
R
F
= 1 kW,  
R = 1 kW,  
I
R = 1 kW,  
I
BW = 80 kHz  
BW = 80 kHz  
0.1  
0.01  
V
CC  
= +15 V, P = 700 mW  
O
V
CC  
= +15 V, P = 1.5 W  
O
0.01  
V
CC  
= +15 V, P = 1.25 W  
O
V
CC  
= +15 V, P = 1.35 W  
O
V
CC  
= +12 V, P = 950 mW  
O
V
CC  
= +12 V, P = 425 mW  
O
0.001  
V
CC  
= + 12 V, P = 800 mW  
O
0.001  
V
CC  
= +12 V, P = 500 mW  
O
0.0001  
0.0001  
10  
100  
1 k  
10 k  
50 k  
10  
100  
1 k  
10 k  
50 k  
f − Frequency − Hz  
f − Frequency − Hz  
Figure 3.  
Figure 4.  
TOTAL HARMONIC DISTORTION + NOISE  
TOTAL HARMONIC DISTORTION + NOISE  
vs  
vs  
OUTPUT VOLTAGE  
OUTPUT POWER  
10  
10  
1
R
= 600 W,  
L
R
= 10 kW,  
L
Gain = 3 V/V,  
f = 1 kHz,  
Gain = 3 V/V,  
f = 1 kHz,  
1
R = 2 kW,  
F
R
F
= 2 kW,  
R = 1 kW,  
I
R = 1 kW,  
I
BW = 80 kHz  
BW = 80 kHz  
0.1  
0.1  
V
CC  
= + 12 V  
0.01  
0.01  
V
CC  
= + 15 V  
V
CC  
= +12 V  
0.001  
0.001  
0.0001  
0.0001  
V
CC  
= +15 V  
0.00001  
0.00001  
3
5
10  
15  
20  
25  
30  
35  
0.01  
0.1  
0.2  
V
O
− Output Voltage − V  
PP  
P
O
− Output Power − W  
Figure 5.  
Figure 6.  
7
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
TYPICAL CHARACTERISTICS (continued)  
TOTAL HARMONIC DISTORTION + NOISE  
TOTAL HARMONIC DISTORTION + NOISE  
vs  
vs  
OUTPUT POWER  
OUTPUT POWER  
10  
10  
R
= 64 W,  
R = 32 W,  
L
L
Gain = 2 V/V,  
f = 1 kHz,  
Gain = 2 V/V,  
f = 1 kHz,  
R
F
= 1 kW,  
R = 1 kW,  
F
1
0.1  
1
0.1  
R = 1 kW,  
R = 1 kW,  
I
I
BW = 80 kHz  
BW = 80 kHz  
V
CC  
= + 12 V  
V
CC  
= + 12 V  
V
CC  
= + 15 V  
V
CC  
= + 15 V  
0.01  
0.01  
0.001  
0.001  
0.0001  
0.0001  
0.01  
0.1  
− Output Power − W  
1
2
0.01  
0.1  
P − Output Power − W  
O
1
2
3 4  
P
O
Figure 7.  
Figure 8.  
POWER DISSIPATION  
vs  
OUTPUT POWER  
SUPPLY VOLTAGE REJECTION RATIO  
vs  
FREQUENCY  
0
2
Mono Operation  
V
CC  
= +15 V, R = 32 W  
L
V
= + 12 V,  
CC  
V
= 1 V ,  
PP  
(ripple)  
Gain = 2 V/V  
BW = 80 kHz  
1.8  
−10  
1.6  
1.4  
1.2  
1
−20  
−30  
−40  
−50  
V
CC  
= +12 V, R = 32 W  
L
Representative of both positive and  
negative supplies.  
V
CC  
R
= +15 V,  
L
= 64 W  
0.8  
−60  
−70  
−80  
64 W  
0.6  
0.4  
V
= +12 V,  
L
32 W  
CC  
R
= 64 W  
0.2  
0
−90  
10  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
100  
1 k  
10 k  
50 k  
f − Frequency − Hz  
P
O
− Output Power − W  
Figure 9.  
Figure 10.  
8
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
TYPICAL CHARACTERISTICS (continued)  
SUPPLY VOLTAGE REJECTION RATIO  
INTERMODULATION DISTORTION  
vs  
vs  
FREQUENCY  
HIGH FREQUENCY  
−0  
0.1  
4:1 SMPTE Ratio  
V
V
= + 15 V,  
(ripple)  
CC  
V = 1 V ,  
I PP  
−10  
= 1 V  
,
PP  
Gain = 2 V/V,  
Gain = 2 V/V  
BW = 80 kHz  
IM Frequency = 60 Hz  
−20  
−30  
−40  
−50  
0.01  
Representative of both positive and  
negative supplies.  
0.001  
V
CC  
R
= +12 V,  
= 32 W  
V
CC  
R
= +15 V,  
= 32 W  
L
L
−60  
64 W  
0.0001  
−70  
−80  
−90  
32 W  
V
CC  
R
= +15 V,  
= 64 W  
V
CC  
R
= +12 V,  
L
L
= 64 W  
0.00001  
2 k  
10 k  
50 k  
10  
100  
1 k  
10 k  
50 k  
f − High Frequency − Hz  
f − Frequency − Hz  
Figure 11.  
Figure 12.  
INTERMODULATION DISTORTION  
vs  
CROSSTALK  
vs  
FREQUENCY  
IM AMPLITUDE (AT INPUT)  
10  
1
−60  
−70  
−80  
R
= 1 kW,  
F
4:1 SMPTE Ratio  
Gain = 2 V/V,  
BW = 80 kHz  
Gain = 3 V/V,  
High Frequency = 7 kHz  
IM Frequency = 60 Hz  
V
= +15 V,  
= 64 W  
CC  
L
R
V
CC  
= +12 V, R = 32 W  
L
V
CC  
= +12 V,  
R
L
= 64 W  
0.1  
V
CC  
= +12 V, R = 64 W  
L
−90  
V
= +15 V,  
= 32 W  
CC  
L
0.01  
R
V
CC  
= +15 V, R = 32 W  
L
V
= +12 V,  
= 32 W  
CC  
L
R
−100  
110  
0.001  
0.0001  
V
CC  
= +15 V, R = 64 W  
L
−120  
10  
0.00001  
100  
1 k  
10 k  
50 k  
0
1
2
3
4
5
6
7
8
9
10  
f − Frequency − Hz  
IM Amplitude (At Input) − V  
PP  
Figure 13.  
Figure 14.  
9
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
TYPICAL CHARACTERISTICS (continued)  
SIGNAL-TO-NOISE RATIO  
SIGNAL-TO-NOISE RATIO  
vs  
vs  
GAIN  
GAIN  
130  
130  
V
CC  
= +12 V  
V
CC  
= +15 V  
THD+N, R = 64 W  
I
R = 64 W  
I
125  
120  
115  
125  
120  
115  
110  
110  
105  
100  
R = 32 W  
I
THD+N, R = 32 W  
I
105  
100  
1
10 20 30 40 50 60 70 80 90 100  
Gain − V/V  
1
10 20 30 40 50 60 70 80 90 100  
Gain − V/V  
Figure 15.  
Figure 16.  
SLEW RATE  
vs  
OUTPUT STEP  
SLEW RATE  
vs  
OUTPUT STEP  
1500  
1300  
1100  
900  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
V
= ± 15 V  
V
= ± 5 V  
CC  
CC  
Gain = 5 V/V  
R
R
Gain = 2 V/V  
R
R
= 1 k  
= 25 Ω  
= 1 k  
= 25 Ω  
F
L
F
L
+SR  
−SR  
+SR  
−SR  
700  
500  
300  
100  
0
20  
0
5
5
10  
15  
1
2
3
4
Output Step (Peak−To−Peak) − V  
Output Step (Peak−To−Peak) − V  
Figure 17.  
Figure 18.  
10  
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
TYPICAL CHARACTERISTICS (continued)  
SMALL AND LARGE SIGNAL  
FREQUENCY RESPONSE  
SMALL AND LARGE SIGNAL  
FREQUENCY RESPONSE  
−3  
3
0
V = 500 mV  
I
V = 500 mV  
I
−6  
−9  
−12  
−15  
−3  
−6  
−9  
V = 250 mV  
I
V = 250 mV  
I
V = 125 mV  
I
V = 125 mV  
I
−18  
−21  
−24  
−27  
−30  
−12  
−15  
−18  
−21  
−24  
V = 62.5 mV  
I
V = 62.5 mV  
I
Gain = 1 V/V  
Gain = 2 V/V  
V
R
R
= ± 15 V  
= 820  
= 25 Ω  
V
R
R
= ± 15 V  
= 680  
= 25 Ω  
CC  
CC  
F
L
F
L
10 100  
1k  
10k 100k 1M 10M 100M 500M  
f − Frequency − Hz  
10 100  
1k  
10k 100k 1M 10M 100M 500M  
f − Frequency − Hz  
Figure 19.  
Figure 20.  
400-mV STEP RESPONSE  
10-V STEP RESPONSE  
400  
300  
200  
100  
0
8
6
4
2
0
−100  
−2  
−4  
V
= ±15 V  
CC  
V
= ±15 V  
CC  
Gain = 2 V/V  
R
R
Gain = 2 V/V  
R
R
= 25  
= 1 kΩ  
−200  
L
= 25  
= 1 kΩ  
L
F
F
t /t = 5 ns  
r
f
−300  
−400  
t /t = 300 ps  
−6  
−8  
r
f
See Figure 3  
See Figure 3  
0
50 100 150 200 250 300 350 400 450 500  
t − Time − ns  
0
50 100 150 200 250 300 350 400 450 500  
t − Time − ns  
Figure 21.  
Figure 22.  
11  
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
TYPICAL CHARACTERISTICS (continued)  
20-V STEP RESPONSE  
16  
12  
8
V
= ±15 V  
CC  
Gain = 5 V/V  
R
R
= 25  
= 2 kΩ  
L
F
t /t = 5 ns  
r
f
See Figure 3  
4
0
−4  
−8  
−12  
−16  
0
50 100 150 200 250 300 350 400 450 500  
t − Time − ns  
Figure 23.  
12  
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
APPLICATION INFORMATION  
Current-Feedback Amplifiers  
The TPA6120A2 is  
a current-feedback amplifier with differential inputs and single-ended outputs.  
Current-feedback results in low voltage noise, high open-loop gain throughout a large frequency range, and low  
distortion. It can be used in a similar fashion as voltage-feedback amplifiers. The low distortion of the  
TPA6120A2 results in a signal-to-noise ratio of 120 dB as well as a dynamic range of 120 dB.  
Independent Power Supplies  
The TPA6120A2 consists of two independent high-fidelity amplifiers. Each amplifier has its own voltage supply.  
This allows the user to leave one of the amplifiers off, saving power, and reducing the heat generated. It also  
reduces crosstalk.  
Although the power supplies are independent, there are some limitations. When both amplifiers are used, the  
same voltage must be applied to each amplifier. For example, if the left channel amplifier is connected to a ±12-V  
supply, the right channel amplifier must also be connected to a ±12-V supply. If it is connected to a different  
supply voltage, the device may not operate properly and consistently.  
When the use of only one amplifier is preferred, it must be the left amplifier. The voltage supply to the left  
amplifier is also responsible for internal start-up and bias circuitry of the device. Regardless of whether one or  
both amplifiers are used, the VCC- pins of both amplifiers must always be at the same potential.  
To power down the right channel amplifier, disconnect the VCC+ pin from the power source.  
The two independent power supplies can be tied together on the board to receive their power from the same  
source.  
Power Supply Decoupling  
As with any design, proper power supply decoupling is essential. It prevents noise from entering the device via  
the power traces and provides the extra power the device can sometimes require in a rapid fashion. This  
prevents the device from being momentarily current starved. Both of these functions serve to reduce distortion,  
leaving a clean, uninterrupted signal at the output.  
Bulk decoupling capacitors should be used where the main power is brought to the board. Smaller capacitors  
should be placed as close as possible to the actual power pins of the device. Because the TPA6120A2 has four  
power pins, use four surface mount capacitors. Both types of capacitors should be low ESR.  
Resistor Values  
R = 1 kW  
F
V
CC−  
R = 1 kW  
I
R
O
= 10 W  
V
I
+
R
L
R
S
= 50 W  
V
CC+  
Figure 24. Single-Ended Input With a Noninverting Gain of 2 V/V  
In the most basic configuration (see Figure 24), four resistors must be considered, not including the load  
impedance. The feedback and input resistors, RF and RI, respectively, determine the closed-loop gain of the  
amplifier. RO is a series output resistor designed to protect the amplifier from any capacitance on the output path,  
including board and load capacitance. RS is a series input resistor. Because the TPA6120A2 is a  
current-feedback amplifier, take care when choosing the feedback resistor.  
13  
 
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
APPLICATION INFORMATION (continued)  
The value of the feedback resistor should be chosen by using Figure 27 through Figure 32 as guidelines. The  
gain can then be set by adjusting the input resistor. The smaller the feedback resistor, the less noise is  
introduced into the system. However, smaller values move the dominant pole to higher and higher frequencies,  
making the device more susceptible to oscillations. Higher feedback resistor values add more noise to the  
system, but pull the dominant pole down to lower frequencies, making the device more stable. Higher impedance  
loads tend to make the device more unstable. One way to combat this problem is to increase the value of the  
feedback resistor. It is not recommended that the feedback resistor exceed a value of 10 k. The typical value  
for the feedback resistor for the TPA6120A2 is 1 k. In some cases, where a high-impedance load is used along  
with a relatively large gain and a capacitive load, it may be necessary to increase the value of the feedback  
resistor from 1 kto 2 k, thus adding more stability to the system. Another method to deal with oscillations is to  
increase the size of RO.  
CAUTION:  
Do not place a capacitor in the feedback path. Doing so can cause oscillations.  
Capacitance at the outputs can cause oscillations. Capacitance from some sources, such as layout, can be  
minimized. Other sources, such as those from the load (e.g., the inherent capacitance in a pair of headphones),  
cannot be easily minimized. In this case, adjustments to RO and/or RF may be necessary.  
The series output resistor should be kept at a minimum of 10 . It is small enough so that the effect on the load  
is minimal, but large enough to provide the protection necessary such that the output of the amplifier sees little  
capacitance. The value can be increased to provide further isolation, up to 100 .  
The series resistor, RS, should be used for two reasons:  
1. It prevents the positive input pin from being exposed to capacitance from the line and source.  
2. It prevents the source from seeing the input capacitance of the TPA6120A2.  
The 50-resistor was chosen because it provides ample protection without interfering in any noticeable way with  
the signal. Not shown is another 50-resistor that can be placed on the source side of RS to ground. In that  
capacity, it serves as an impedance match to any 50-source.  
R
F
= 1 kW  
V
CC−  
R = 1 kW  
I
V
I
R = 10 W  
O
+
R
L
V
CC+  
Figure 25. Single-Ended Input With a Noninverting Gain of -1 V/V  
R
F
= 1 kW  
V
CC−  
R = 1 kW  
I
V
V
R = 10 W  
O
+
I−  
I+  
R
L
R = 1 kW  
I
V
CC+  
R = 1 kW  
F
Figure 26. Differential Input With a Noninverting Gain of 2 V/V  
Figure 26 shows the TPA6120A2 connected with differential inputs. Differential inputs are useful because they  
take the greatest advantage of the device's high CMRR. The two feedback resistor values must be kept the  
same, as do the input resistor values.  
14  
 
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
APPLICATION INFORMATION (continued)  
Special note regarding mono operation:  
If both amplifiers are powered on, but only one channel is to be used, the unused amplifier MUST have a  
feedback resistor from the output to the negative input. Additionally, the positive input should be grounded as  
close to the pin as possible. Terminate the output as close to the output pin as possible with a 25-load to  
ground.  
These measures should be followed to prevent the unused amplifier from oscillating. If it oscillates, and the  
power pins of both amplifiers are tied together, the performance of the amplifier could be seriously degraded.  
Checking for Oscillations and Instability  
Checking the stability of the amplifier setup is recommended. High frequency oscillations in the megahertz region  
can cause undesirable effects in the audio band.  
Sometimes, the oscillations can be quite clear. An unexpectedly large draw from the power supply may be an  
indication of oscillations. These oscillations can be seen with an oscilloscope. However, if the oscillations are not  
obvious, or there is a chance that the system is stable but close to the edge, placing a scope probe with 10 pF of  
capacitance can make the oscillations worse, or actually cause them to start.  
A network analyzer can be used to determine the inherent stability of a system. An output vs frequency curve  
generated by a network analyzer can be a good indicator of stability. At high frequencies, the curve shows  
whether a system is oscillating, close to oscillation, or stable. Looking at Figure 27 through Figure 32, several  
different phenomena occur. In one scenario, the system is stable because the high frequency rolloff is smooth  
and has no peaking. Increasing RF decreases the frequency at which this rolloff occurs (see the Resistor Values  
section). Another scenario shows some peaking at high frequency. If the peaking is 2 dB, the amplifier is stable  
as there is still 45 degrees of phase margin. As the peaking increases, the phase margin shrinks, the amplifier  
and the system, move closer to instability. The same system that has a 2-dB peak has an increased peak when  
a capacitor is added to the output. This indicates the system is either on the verge of oscillation or is oscillating,  
and corrective action is required.  
3
3
R
= 620  
2
1
F
2
1
R
F
= 430  
R
F
= 820 Ω  
0
0
−1  
−2  
−1  
−2  
R
F
= 1 kΩ  
R
= 620 Ω  
= 1 kΩ  
F
−3  
−4  
−5  
−3  
−4  
−5  
−6  
R
F
V
R
= ±15 V  
= 100 Ω  
V
= ±15 V  
R = 100 Ω  
L
CC  
CC  
L
Gain = 1 V/V  
V = 200 mV  
Gain = 2 V/V  
V = 200 mV  
−6  
−7  
I
I
10 100  
1k  
10k 100k 1M 10M 100M 500M  
f − Frequency − Hz  
10 100  
1k  
10k 100k 1M 10M 100M 500M  
f − Frequency − Hz  
Figure 27. Normalized Output Response vs Frequency  
Figure 28. Normalized Output Response vs Frequency  
15  
 
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
APPLICATION INFORMATION (continued)  
1
1
0
R
= 200  
L
0
−1  
−2  
−3  
−4  
−1  
−2  
−3  
−4  
R
= 100 Ω  
L
R
L
= 25  
R
= 50 Ω  
L
R
R
= 200 Ω  
= 100 Ω  
L
−5  
−6  
−5  
−6  
R
L
= 25 Ω  
L
V
R
= ±15 V  
= 1 kΩ  
CC  
V
R
= ±15 V  
= 1 kΩ  
CC  
−7  
−8  
−9  
−7  
−8  
−9  
F
F
R
L
= 50 Ω  
Gain = 1 V/V  
V = 200 mV  
Gain = 2 V/V  
V = 200 mV  
I
I
10 100  
1k  
10k 100k 1M 10M 100M 500M  
f − Frequency − Hz  
10 100  
1k  
10k 100k 1M 10M 100M 500M  
f − Frequency − Hz  
Figure 29. Normalized Output Response vs Frequency  
Figure 30. Normalized Output Response vs Frequency  
3
9
2
8
7
R
F
= 510  
R
F
= 620  
1
0
6
5
−1  
R
F
= 1 kΩ  
R
F
= 820 Ω  
F
−2  
−3  
−4  
−5  
−6  
4
3
2
1
0
R
= 1.5 kΩ  
R
F
= 1.2 kΩ  
V
= ± 5 V  
V
CC  
= ± 5 V  
CC  
Gain = 1 V/V  
= 25 Ω  
Gain = 2 V/V  
R = 25 Ω  
L
V = 200 mV  
I
R
L
V = 200 mV  
I
10 100  
1k  
10k 100k 1M 10M 100M 500M  
f − Frequency − Hz  
10 100  
1k  
10k 100k 1M 10M 100M 500M  
f − Frequency − Hz  
Figure 31. Output Amplitude vs Frequency  
Figure 32. Output Amplitude vs Frequency  
PCB Layout  
Proper board layout is crucial to getting the maximum performance out of the TPA6120A2.  
A ground plane should be used on the board to provide a low inductive ground connection. Having a ground  
plane underneath traces adds capacitance, so care must be taken when laying out the ground plane on the  
underside of the board (assuming a 2-layer board). The ground plane is necessary on the bottom for thermal  
reasons. However, certain areas of the ground plane should be left unfilled. The area underneath the device  
where the PowerPAD is soldered down should remain, but there should be no ground plane underneath any of  
the input and output pins. This places capacitance directly on those pins and leads to oscillation problems. The  
underside ground plane should remain unfilled until it crosses the device side of the input resistors and the  
output series resistor. Thermal reliefs should be avoided if possible because of the inductance they introduce.  
16  
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
APPLICATION INFORMATION (continued)  
Despite the removal of the ground plane in critical areas, stray capacitance can still make its way onto the  
sensitive outputs and inputs. Place components as close as possible to the pins and reduce trace lengths. See  
Figure 33 and Figure 34. It is important for the feedback resistor to be extremely close to the pins, as well as the  
series output resistor. The input resistor should also be placed close to the pin. If the amplifier is to be driven in a  
noninverting configuration, ground the input close to the device so the current has a short, straight path to the  
PowerPAD (gnd).  
Too Long  
Too Long  
R
F
R
I
V
I
+
R
O
TPA6120A2  
Too Long  
Too Long  
R
L
Figure 33. Layout That Can Cause Oscillation  
Minimized Length of  
Feedback Path  
Short Trace  
Before Resistors  
R
F
R
O
V
I
+
R
I
R
L
Minimized Length of  
the Trace Between  
TPA6120A2  
Ground as Close to  
the Pin as Possible  
Output Node and R  
O
Figure 34. Layout Designed To Reduce Capacitance On Critical Nodes  
Thermal Considerations  
Amplifiers can generate quite a bit of heat. Linear amplifiers, as opposed to Class-D amplifiers, are extremely  
inefficient, and heat dissipation can be a problem. There is no one to one relationship between output power and  
heat dissipation, so the following equations must be used:  
P
L
Efficiency of an amplifier +  
P
SUP  
(1)  
Where  
2
2
V
V
V
P
LRMS  
P
P
+
, and V  
+
, therefore, P +  
L
per channel  
L
LRMS  
Ǹ
R
2R  
2
L
L
(2)  
(3)  
P
+ V  
I
avg ) V I  
CC CC(q)  
SUP  
CC CC  
p
p
V
V
V
2
1
p
P
P
P
2
ŕ
I
+
sin(t) dt + *  
[cos(t)]  
+
avg  
CC  
R
pR  
p R  
L
L
L
0
0
(4)  
17  
Where  
 
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
APPLICATION INFORMATION (continued)  
Ǹ2 P R  
+
V
P
L
L
(5)  
(6)  
Therefore,  
V
V
CC  
P
P
+
) V  
I
CC CC(q)  
SUP  
p R  
L
PL = Power delivered to load (per channel)  
PSUP = Power drawn from power supply  
VLRMS = RMS voltage on the load  
RL = Load resistance  
VP = Peak voltage on the load  
ICCavg = Average current drawn from the power supply  
ICC(q) = Quiescent current (per channel)  
VCC = Power supply voltage (total supply voltage = 30 V if running on a ±15-V power supply  
η = Efficiency of a SE amplifier  
For stereo operation, the efficiency does not change because both PL and PSUP are doubled. This effects the  
amount of power dissipated by the package in the form of heat.  
A simple formula for calculating the power dissipated, PDISS, is shown in Equation 7:  
P
(1  
h) P  
DISS  
SUP  
(7)  
In stereo operation, PSUP is twice the quantity that is present in mono operation.  
The maximum ambient temperature, TA, depends on the heat-sinking ability of the system. θJA for a 20-pin DWP,  
whose thermal pad is properly soldered down, is shown in the dissipation rating table.  
T
Max  
T Max  
Θ
P
A
J
JA Diss  
(8)  
2
Mono Operation  
V
CC  
= +15 V, R = 32 W  
L
1.8  
1.6  
1.4  
1.2  
1
V
= +12 V, R = 32 W  
L
CC  
V
= +15 V,  
CC  
R
= 64 W  
L
0.8  
0.6  
0.4  
V
CC  
R
= +12 V,  
L
= 64 W  
0.2  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
P
O
− Output Power − W  
Figure 35. Power Dissipation vs Output Power  
18  
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
Application Circuit  
OPA4134  
TPA6120A2  
V
V
CC+  
V+  
V−  
CC−  
5 V  
−5 V  
12 V  
−12 V  
0.1 µF  
0.1 µF  
10 µF  
10 µF  
100 µF  
10 µF  
10 µF  
100 µF  
C
F
2.7 nF  
R
F
1 kW  
V−  
R
F
1 kW  
11  
2
−INA  
OUTA  
1
V
3
CC−  
+
0.1 mF  
R
1 kW  
I
4
4
5 V  
5
V+  
LOUT  
LIN−  
LIN+  
4
0.1 µF  
2
C
2.7 nF  
R
O
10 W  
ZEROL  
ZEROR  
MSEL  
LRCK  
DATA  
BCK  
V
2L  
1
2
3
F
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
10 µF  
CC  
+
3
R
1 kW  
I
0.1 mF  
AGND3L  
R
F
1 kW  
V
CC+  
R
F
1 kW  
I
I
L−  
OUT  
V−  
11  
−INB  
5 V  
6
L+  
4
OUT  
7
5
PCM  
Audio  
+
OUTB  
AGND2  
5
4
Data  
Source  
V+  
V
1
CC  
6
10 µF  
47 µF  
+
+
SCK  
V L  
COM  
7
PCM1792  
C
F
2.7 nF  
DGND  
V
COM  
R
8
0.1 µF  
47 µF  
V
DD  
I
REF  
9
R
F
1 kW  
10 kΩ  
MS  
AGND1  
10  
11  
V−  
R
F
9
11  
1 kW  
MDI  
MC  
I
I
R−  
R+  
OUTC  
OUT  
8
−INC  
10  
V
CC−  
+
0.1 mF  
Controller  
12  
R
I
1 kW  
OUT  
4
20  
0.1 µF  
5 V  
16  
V+  
AGND3R  
2R  
MDO  
RST  
13  
14  
ROUT  
RIN−  
C
2.7 nF  
F
19  
V
CC  
RIN+  
R
O
10 W  
+
18  
10 µF  
17  
0.1 mF  
R
I
R
F
1 kW  
1 kW  
3.3 V  
+
V
CC+  
R
F
V−  
1 kW  
13  
11  
14  
10 µF  
−IND  
12  
+
OUTD  
4
V+  
Figure 36. Typical Application Circuit  
In many applications, the audio source is digital. It must go through a digital-to-analog converter (DAC) so that  
traditional analog amplifiers can drive the speakers or headphones.  
Figure 36 shows a complete circuit schematic for such a system. The digital audio is fed into a high performance  
DAC. The PCM1792, a Burr-Brown product from TI, is a 24-bit, stereo DAC.  
The output of the PCM1792 is current, not voltage, so the OPA4134 is used to convert the current input to a  
voltage output. The OPA4134, a Burr-Brown product from TI, is a low-noise, high-speed, high-performance  
operational amplifier. CF and RF are used to set the cutoff frequency of the filter. The RC combination in  
Figure 36 has a cutoff frequency of 59 kHz. All four amplifiers of the OPA4134 are used so the TPA6120A2 can  
be driven differentially.  
19  
 
TPA6120A2  
www.ti.com  
SLOS431MARCH 2004  
The output of the OPA4134 goes into the TPA6120A2. The TPA6120A2 is configured for use with differential  
inputs, stereo use, and a gain of 2V/V. Note that the 0.1-uF capacitors are placed at every supply pin of the  
TPA6120A2, as well as the 10-series output resistor.  
Each output goes to one channel of a pair of stereo headphones, where the listener enjoys crisp, clean, virtually  
noise free music with a dynamic range greater than the human ear is capable of detecting.  
20  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Apr-2006  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TPA6120A2DWP  
ACTIVE  
SO  
Power  
PAD  
DWP  
20  
20  
20  
25 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TPA6120A2DWPG4  
TPA6120A2DWPR  
ACTIVE  
ACTIVE  
SO  
Power  
PAD  
DWP  
DWP  
25 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SO  
Power  
PAD  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
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information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
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