TPA6404QDKQRQ1 [TI]
具有负载突降保护功能的汽车类 45W、2MHz、4 通道、4.5V 至 18V 电源模拟输入 D 类音频放大器 | DKQ | 56 | -40 to 125;型号: | TPA6404QDKQRQ1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有负载突降保护功能的汽车类 45W、2MHz、4 通道、4.5V 至 18V 电源模拟输入 D 类音频放大器 | DKQ | 56 | -40 to 125 放大器 音频放大器 |
文件: | 总12页 (文件大小:1516K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TPA6404-Q1
ZHCSHN5A –OCTOBER 2017–REVISED FEBRUARY 2018
TPA6404-Q1 45W、2MHz 模拟输入 通道汽车用 D 类音频放大器,带有负
载突降保护和 I2C 诊断功能
1 特性
–
欠压和过压
•
常规运行
1
•
高级负载诊断
–
–
–
4.5V 至 18V 电源电压
–
交流诊断可进行高频扬声器检测,提供阻抗和相
位响应
I2C 控制,具有 4 个地址选项
–
集成正弦波发生器
削波探测和热折返
•
•
轻松满足 CISPR25-L5 EMC 规范
2 应用
具有适用于汽车应用且符合 AEC-Q100 标准的下列
特性:
•
•
汽车音响主机
汽车外部放大器模块
–
器件温度 1 级:–40°C 至 125°C 的环境运行温
度范围
3 说明
–
–
器件 HBM ESD 分类等级:3A
器件 CDM ESD 分类等级:C4B
该TPA6404-Q1器件是一款采用 2.1MHz PWM 开关频
率的四通道模拟输入 D 类音频放大器,以非常小的
4.5cm 2 PCB 尺寸实现成本优化的解决方案,可针对
启停事件在低至 4.5V 的电压下全面运行,并可在高达
100kHz 的音频带宽下提供卓越的音质。
•
•
音频输入
–
–
–
4 通道差分模拟输入
四个 I2C 控制增益选项
可进行低值交流耦合的高输入阻抗
音频输出
TPA6404-Q1 D 类音频放大器的设计十分出色,可适
用于入门级汽车音响主机,以作为系统设计的一部分提
供模拟音频输入信号。
–
四通道桥接式负载 (BTL),具有并行 BTL
(PBTL) 模式
–
–
最高可达 2.1MHz 的输出开关频率
与传统的线性放大器解决方案相比,D 类拓扑技术显
著提高了器件效率。
在 4Ω 负载、25V 电源电压的条件下输出功率
为 75W,THD 为 10%
–
–
在 2Ω 负载、14.4V 电源电压的条件下,输出功
率为 45W,THD 为 10%
输出开关频率高于 AM 频带,这样可以消除 AM 频带
干扰并降低输出滤波器尺寸及成本。
在 14.4V PBTL,1Ω 负载的条件下,输出功率
为 85 W,THD 为 10%;
该器件采用带外露散热焊盘的 56 引脚 HSSOP 封装。
•
•
在 4Ω 负载和 14.4V、1 kHz 电源电压条件下的音
频性能
器件信息(1)
器件型号
封装
封装尺寸(标称值)
–
–
–
THD+N < 0.01%
42 µVRMS 输出噪声
- 90dB 串扰
TPA6404-Q1
HSSOP (56)
18.41mm × 7.49mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
负载诊断功能
方框图
–
–
–
–
输出负载开路和短路
DVDD
VBAT
GVDD
AVDD
PVDD
输出至电池短路或接地短路
线路输出检测高达 6kΩ
无输入时钟的情况下也可运行
Gate Drive
Regulator
MUTE
STANDBY
WARN
Digital Core
Closed Loop Class-D Amplifier
Channel 1
FAULT
OUT 1P
OUT 1M
Powerstage
CH1
Channel 2
Powerstage
OUT 2P
OUT 2M
•
保护
PWM
Gate
CH2
CH3
CH4
modulators
Drives
Differential Analog input
with 4 gain options
Channel 3
Powerstage
OUT 3P
OUT 3M
–
–
–
–
–
–
输出限流
Clip
detection
Channel 4
Powerstage
OUT 4P
OUT 4M
输出短路保护
40V 负载突降
意外接地开路和电源开路
直流失调电压
过热
Protection
Diagnostics
SYNC
PLL & Clock
I2C Control
Over-Current Limit/SD
Thermal Foldback
DC Short to GND
DC Short to Power
DC Open Load
SCL
SDA
Over Temperature
Over/Under Voltage
DC Detection
DC Shorted Load
AC Diagnostics
I2C_ADDR0
I2C_ADDR1
Copyright
© 2017, Texas Instruments Incorporated
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLOS995
TPA6404-Q1
ZHCSHN5A –OCTOBER 2017–REVISED FEBRUARY 2018
www.ti.com.cn
4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
Changes from Original (October 2017) to Revision A
Page
•
将数据表发布为“生产数据”...................................................................................................................................................... 1
2
版权 © 2017–2018, Texas Instruments Incorporated
TPA6404-Q1
www.ti.com.cn
ZHCSHN5A –OCTOBER 2017–REVISED FEBRUARY 2018
5 器件和文档支持
5.1 文档支持
5.1.1 相关文档
请参阅如下相关文档:
PurePath™ Console 3 图形开发套件
5.2 接收文档更新通知
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
5.3 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范,
并且不一定反映 TI 的观点;请参阅 TI 的 《使用条款》。
TI E2E™ 中文在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2echina.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
E2E 音频放大器论坛 TI 的音频放大器工程师对工程师 (E2E) 社区此社区的创建目的在于促进工程师之间的协作。
用户可进行实时问答。
5.4 商标
PurePath, E2E are trademarks of Texas Instruments.
5.5 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损
伤。
5.6 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
6 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查看左侧的导航栏。
版权 © 2017–2018, Texas Instruments Incorporated
3
重要声明和免责声明
TI 均以“原样”提供技术性及可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资
源,不保证其中不含任何瑕疵,且不做任何明示或暗示的担保,包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示
担保。
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任:(1) 针对您的应用选择合适的TI 产品;(2) 设计、
验证并测试您的应用;(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更,恕不另行通知。TI 对您使用
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源,也不提供其它TI或任何第三方的知识产权授权
许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等,TI对此概不负责,并且您须赔偿由此对TI 及其代表造成的损害。
TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
邮寄地址:上海市浦东新区世纪大道 1568 号中建大厦 32 楼,邮政编码:200122
Copyright © 2019 德州仪器半导体技术(上海)有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPA6404QDKQRQ1
ACTIVE
HSSOP
DKQ
56
1000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
TPA6404
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Feb-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPA6404QDKQRQ1
HSSOP
DKQ
56
1000
330.0
32.4
11.35 18.67
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Feb-2018
*All dimensions are nominal
Device
Package Type Package Drawing Pins
HSSOP DKQ 56
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 55.0
TPA6404QDKQRQ1
1000
Pack Materials-Page 2
PACKAGE OUTLINE
DKQ0056A
PowerPADTM HSSOP - 2.475 mm max height
S
C
A
L
E
1
.
0
0
0
PLASTIC SMALL OUTLINE
C
10.67
10.03
TYP
SEATING PLANE
A
PIN 1 ID AREA
0.1 C
54X 0.635
56
1
EXPOSED
THERMAL PAD
18.54
18.29
NOTE 3
8.661
8.611
2X
17.15
5.533
5.483
28
29
0.37
56X
0.17
0.13
(2.29)
7.59
7.39
B
C A B
NOTE 4
0.25
0.13
2.29 0.05
TYP
2.475
2.240
NOTE 6
0.25
GAGE PLANE
SEE DETAIL A
0.08
0.00
1.02
0.51
0 - 8
DETAIL A
TYPICAL
4221870/D 01/2019
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. The exposed thermal pad is designed to be attached to an external heatsink.
6. For clamped heatsink design, refer to overall package height above the seating plane as 2.325 +/- 0.075 and molded body
thickness dimension.
www.ti.com
EXAMPLE BOARD LAYOUT
DKQ0056A
PowerPADTM HSSOP - 2.475 mm max height
PLASTIC SMALL OUTLINE
56X (1.9)
SEE DETAILS
SYMM
1
56
56X (0.4)
54X (0.635)
SYMM
28
29
(R0.05) TYP
(9.5)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
METAL UNDER
SOLDER MASK
SOLDER MASK
METAL
SOLDER MASK
OPENING
OPENING
EXPOSED METAL
EXPOSED METAL
0.05 MIN
AROUND
0.05 MAX
AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221870/D 01/2019
NOTES: (continued)
7. Publication IPC-7351 may have alternate designs.
8. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
9. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
DKQ0056A
PowerPADTM HSSOP - 2.475 mm max height
PLASTIC SMALL OUTLINE
56X (1.9)
SYMM
1
56
56X (0.4)
54X (0.635)
SYMM
28
29
(R0.05) TYP
(9.5)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE:6X
4221870/D 01/2019
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
www.ti.com
重要声明和免责声明
TI 均以“原样”提供技术性及可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资
源,不保证其中不含任何瑕疵,且不做任何明示或暗示的担保,包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示
担保。
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任:(1) 针对您的应用选择合适的TI 产品;(2) 设计、
验证并测试您的应用;(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更,恕不另行通知。TI 对您使用
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源,也不提供其它TI或任何第三方的知识产权授权
许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等,TI对此概不负责,并且您须赔偿由此对TI 及其代表造成的损害。
TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
邮寄地址:上海市浦东新区世纪大道 1568 号中建大厦 32 楼,邮政编码:200122
Copyright © 2020 德州仪器半导体技术(上海)有限公司
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