TPD1E10B06_V02 [TI]
TPD1E10B06 Single-Channel ESD Protection Diode;
| 型号： | TPD1E10B06_V02 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | TPD1E10B06 Single-Channel ESD Protection Diode 光电二极管 |
| 文件： | 总25页 (文件大小：1868K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPD1E10B06
SLLSEB1F – FEBRUARY 2012 – REVISED OCTOBER 2021
TPD1E10B06 Single-Channel ESD Protection Diode
1 Features
3 Description
•
Provides system-level ESD protection for low-
voltage I/O interface
IEC 61000-4-2 level 4 ESD protection
– ±30 kV contact discharge
– ±30 kV air-gap discharge
IEC 61000-4-5 surge: 6 A (8/20 µs)
I/O capacitance 12 pF (typical)
RDYN 0.4 Ω (typical)
DC breakdown voltage ±6 V (minimum)
Ultralow leakage current 100 nA (maximum)
10-V clamping voltage (maximum at IPP = 1 A)
Industrial temperature range: –40°C to 125°C
Small 0402 footprint
The TPD1E10B06 is a single-channel ESD TVS
diode in a small 0402 package convenient for space
contrained applications and an industry standard
SOD-523 package. This TVS protection product offers
±30 kV contact ESD, ±30 kV IEC air-gap protection,
and has an ESD clamp circuit with a back-to-back
TVS diode for bipolar or bidirectional signal support.
The 12 pF line capacitance of this ESD protection
diode is suitable for a wide range of applications
supporting data rates up to 400 Mbps.
•
•
•
•
•
•
•
•
•
Typical applications of this ESD protection product
are circuit protection for audio lines (microphone,
earphone, and speakerphone), SD interfacing, keypad
or other buttons, VBUS pin and ID pin of USB ports,
and general-purpose I/O ports.This ESD clamp is
good for the protection of end equipment like portable
devices, wearables, set-top boxes, electronic point-of-
sale equipment, appliances, and products for building
automation.
(1 mm × 0.6 mm × 0.5 mm)
Industry standard SOD-523 package
(0.8 mm × 1.2 mm)
•
2 Applications
•
End equipment:
– Portable devices
– Wearables
– Set-top boxes
– Electronic point of sale (EPOS)
– Appliances
Device Information(1)
PART NUMBER
PACKAGE
X1SON (2)
SOD-523 (2)
BODY SIZE (NOM)
0.60 mm × 1.00 mm
0.80 mm × 1.20 mm
TPD1E10B06
– Building automation
Interfaces:
– Audio lines
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
•
– Push-buttons
IO Line 1
– General-purpose input or output (GPIO)
IO Line 2
Connector
(source of ESD)
ESD sensitive
device
1
2
1
2
GND Line
Application Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPD1E10B06
SLLSEB1F – FEBRUARY 2012 – REVISED OCTOBER 2021
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Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................4
6 Specifications.................................................................. 5
6.1 Absolute Maximum Ratings ....................................... 5
6.2 ESD Ratings—JEDEC Specification ..........................5
6.3 ESD Ratings—IEC Specification ............................... 5
6.4 Recommended Operating Conditions ........................5
6.5 Thermal Information ...................................................5
6.6 Electrical Characteristics ............................................6
6.7 Typical Characteristics................................................7
7 Detailed Description........................................................9
7.1 Overview.....................................................................9
7.2 Functional Block Diagram...........................................9
7.3 Feature Description.....................................................9
7.4 Device Functional Modes............................................9
8 Application and Implementation..................................10
8.1 Application Information............................................. 10
8.2 Typical Application.................................................... 10
9 Power Supply Recommendations................................12
10 Layout...........................................................................12
10.1 Layout Guidelines................................................... 12
10.2 Layout Example...................................................... 12
11 Device and Documentation Support..........................13
11.1 Receiving Notification of Documentation Updates..13
11.2 Support Resources................................................. 13
11.3 Trademarks............................................................. 13
11.4 Electrostatic Discharge Caution..............................13
11.5 Glossary..................................................................13
12 Mechanical, Packaging, and Orderable
Information.................................................................... 13
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (June 2021) to Revision F (October 2021)
Page
•
•
•
•
•
•
•
•
Updated the Application Schematic figure..........................................................................................................1
Updated the Description of Pin 1 and pin 2 in the Pin Configuration and Functions section..............................4
Changed HBM spec to per JS-001....................................................................................................................5
Changed CDM spec to per JESD22-C101 ........................................................................................................ 5
Changed HBM spec to Q101-001.......................................................................................................................5
Changed CDM spec to Q101-005 ..................................................................................................................... 5
Updated the Typical Application Schematic figure............................................................................................10
Changed the system-level ESD protection from: ±20 kV Contact/± 25 kV Air-Gap to: ±8 kV Contact/± 15 kV
Air-Gap .............................................................................................................................................................11
Changes from Revision D (Novemeber 2015) to Revision E (June 2021)
Page
•
•
•
•
•
•
•
•
•
Updated the numbering format for tables, figures, and cross-references throughout the document..................1
Added the DYA package.....................................................................................................................................1
Updated the Features section.............................................................................................................................1
Updated the Applications section....................................................................................................................... 1
Updated the Description section.........................................................................................................................1
Added Thermal information for DYA package.....................................................................................................5
Updated the Overview section............................................................................................................................9
Updated the Functional Block Diagram section..................................................................................................9
Updated the Feature Description section........................................................................................................... 9
Changes from Revision C (April 2015) to Revision D (November 2015)
Page
•
Added frequency test condition to capacitance specification............................................................................ 6
Changes from Revision B (October 2012) to Revision C (April 2015)
Page
•
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ............................................................................................................................................................... 1
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Changes from Revision A (March 2012) to Revision B (October 2012)
Page
•
Added THERMAL INFORMATION table.............................................................................................................5
Changes from Revision * (February 2011) to Revision A (March 2012)
Page
•
•
•
Updated FEATURES.......................................................................................................................................... 1
Added graphs to TYPICAL CHARACTERISTICS section..................................................................................7
Added APPLICATION INFORMATION section.................................................................................................10
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5 Pin Configuration and Functions
1
2
Figure 5-1. DPY Package
2-Pin X1SON
Top View
ID Area
1
2
Figure 5-2. DYA Package
2-Pin SOD-523
Top View
Table 5-1. Pin Functions
PIN
1
I/O
DESCRIPTION
I/O
ESD Protected I/O. Connect other pin ground.
2
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
90
UNIT
W
IEC 61000-4-5 power (tp - 8/20 µs) at 25°C
Peak pulse
IEC 61000-4-5 current (tp - 8/20 µs) at 25°C
6
A
TA
Operating free-air temperature
Storage temperature
-40
125
155
°C
Tstg
–65
°C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated
under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
6.2 ESD Ratings—JEDEC Specification
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001
±2500
V
V(ESD)
Electrostatic discharge - DPY
Electrostatic discharge - DYA
Charged device model (CDM), per JEDEC
specification JESD22-C101
±1000
±2500
±1000
V
V
V
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001
V(ESD)
Charged device model (CDM), per JEDEC
specification JS-002
6.3 ESD Ratings—IEC Specification
VALUE
±30000
±30000
UNIT
IEC 61000-4-2 Contact Discharge, all pins
IEC 61000-4-2 Air-gap Discharge, all pins
V(ESD)
Electrostatic discharge
V
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
–5.5
-40
NOM
MAX
UNIT
V
Operating
Pin 1 to 2 or Pin 2 to 1
voltage
5.5
TA
Operating free-air temperature
125
°C
6.5 Thermal Information
TPD1E10B06
THERMAL METRIC(1)
DPY (X1SON)
2 PINS
615.5
DYA (SOD523)
2 PINS
730.8
UNIT
RθJA
RθJC(top)
RθJB
ΨJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
404.8
413.4
493.3
497.7
Junction-to-top characterization parameter
Junction-to-board characterization parameter
127.7
129.7
ΨJB
493.3
491.8
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6.5 Thermal Information (continued)
TPD1E10B06
THERMAL METRIC(1)
DPY (X1SON)
2 PINS
DYA (SOD523)
UNIT
2 PINS
RθJC(bot)
Junction-to-case (bottom) thermal resistance
162
-
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.6 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
Reverse stand-off voltage
Leakage current
TEST CONDITION
MIN
TYP
MAX
5.5
UNIT
V
VRWM
ILEAK
Pin 1 to 2 or Pin 2 to 1
Pin 1 = 5 V, Pin 2 = 0 V
IPP = 1 A, tp = 8/20 µs(2)
100
nA
Clamp voltage with surge strike on pin 1,
pin 2 grounded.
VClamp1,2
10
14
V
V
Clamp voltage with surge strike on pin 1,
pin 2 grounded.
VClamp1,2
IPP =5 A, tp = 8/20 µs(2)
IPP = 1 A, tp = 8/20 µs(2)
IPP = 5 A, tp = 8/20 µs(2)
Pin 1 to Pin 2(1)
8.5
14
Clamp voltage with surge strike on pin 2,
pin 1 grounded.
VClamp2,1
V
0.32
0.38
12
RDYN
Dynamic resistance
Ω
Pin 2 to Pin 1(1)
CIO
I/O capacitance
VIO = 2.5 V; ƒ = 1 MHz
IIO = 1 mA
pF
V
VBR1,2
VBR2,1
Break-down voltage, pin 1 to pin 2
Break-down voltage, pin 2 to pin 1
6
6
IIO = 1 mA
V
(1) Extraction of RDYN using least squares fit of TLP characteristics between IPP = 10 A and IPP = 20 A.
(2) Nonrepetitive current pulse 8 to 20 µs exponentially decaying waveform according to IEC 61000-4-5
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6.7 Typical Characteristics
Figure 6-1. IEC 61000-4-2 Clamp Voltage +8 kV Contact ESD
Figure 6-2. IEC 61000-4-2 Clamp Voltage –8-kV Contact ESD
Figure 6-3. Transmission Line Pulse (TLP) Waveform Pin 1 to
Pin 2
Figure 6-4. Transmission Line Pulse (TLP) Waveform Pin 2 to
Pin 1
Figure 6-5. IV Curve
Figure 6-6. Positive Surge Waveform 8 to 20 µs
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6.7 Typical Characteristics (continued)
Figure 6-7. Negative Surge Waveform 8 to 20 µs
Figure 6-8. Pin Capacitance Across VBIAS
Figure 6-9. Insertion Loss
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7 Detailed Description
7.1 Overview
The TPD1E108B06 is a single-channel ESD TVS diode in a small 0402 package convenient for space
constrained applications and an industry standard SOD-523 package. This TVS protection product offers ±30 kV
IEC air-gap, ±30 kV contact ESD protection, and has an ESD clamp circuit with a back-to-back TVS diode for
bipolar or bidirectional signal support. The 12 pF line capacitance of this ESD protection diode is suitable for a
wide range of applications supporting data rates up to 400 Mbps.
Typical application of this ESD protection product is the circuit protection for audio lines (microphone, earphone,
and speakerphone), SD interfacing, keypad or other buttons, VBUS pin and ID pin of USB ports, and general-
purpose I/O ports. This ESD clamp is a good fit for the protection of the end equipment like ebooks, tablets,
remote controllers, wearables, set-top boxes, and electronic point of sale equipment.
7.2 Functional Block Diagram
1
2
7.3 Feature Description
TPD1E10B06 is a bidirectional TVS with high ESD protection level. This device protects circuit from ESD strikes
up to ±30 kV contact and ±30 kV air-gap specified in the IEC 61000-4-2 international standard. The device can
also handle up to 6-A surge current (IEC61000-4-5 8/20 µs). The I/O capacitance of 12 pF supports a data
rate up to 400 Mbps. This clamping device has a small dynamic resistance of 0.4 Ω typically, which makes the
clamping voltage low when the device is actively protecting other circuits. For example, the clamping voltage is
only 10 V when the device is taking 1-A transient current. The breakdown is bidirectional so that this protection
device is a good fit for GPIO and especially audio lines which carry bidirectional signals. Low leakage allows
the diode to conserve power when working below the VRWM. The industrial temperature range of –40°C to
125°C makes this ESD device work at extensive temperatures in most environments. The 0402 package can fit
into small electronic devices like mobile equipment and wearables whereas the SOD-523 package is good for
industrial applications.
7.4 Device Functional Modes
TPD1E10B06 is a passive clamp that has low leakage during normal operation when the voltage between pin 1
and pin 2 is below VRWM and activates when the voltage between pin 1 and pin 2 goes above VBR. During IEC
ESD events, transient voltages as high as ±30 kV can be clamped between the two pins. When the voltages on
the protected lines fall below the trigger voltage, the device reverts back to the low leakage passive state.
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8 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
When a system contains a human interface connector, the system becomes vulnerable to large system-level
ESD strikes that standard ICs cannot survive. TVS ESD protection diodes are typically used to suppress ESD at
these connectors. TPD1E10B06 is a single-channel ESD protection device containing back-to-back TVS diodes,
which is typically used to provide a path to ground for dissipating ESD events on bidirectional signal lines
between a human interface connector and a system. As the current from ESD passes through the device, only a
small voltage drop is present across the diode structure. This is the voltage presented to the protected IC. The
low RDYN of the triggered TVS holds this voltage, VCLAMP, to a tolerable level to the protected IC.
8.2 Typical Application
L Audio
Audio amplifier
L Audio IN
class AB
L
(ESD sensitive)
GND
Speaker
connector
(source of ESD)
R Audio
GND
Audio amplifier
class AB
(ESD sensitive)
R Audio IN
R
1
2
1
2
GND
Figure 8-1. Typical Application Schematic
8.2.1 Design Requirements
For this design example, two TPD1E10B06s will be used to protect left and right audio channels. For this audio
application, the following system parameters are known.
Table 8-1. Design Parameters
DESIGN PARAMETER
VALUE
AB
Audio Amplifier Class
Audio signal voltage range
Audio frequency content
–3 V to 3 V
20 Hz to 20 kHz
±20 kV Contact/ ±25 kV Air-Gap
Required IEC 61000-4-2 ESD Protection
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8.2.2 Detailed Design Procedure
To begin the design process, some parameters must be decided upon; the designer should make sure:
•
Voltage range on the protected line must not exceed the reverse standoff voltage of one or more TVS diodes
(VRWM
)
•
•
Operating frequency is supported by the I/O capacitance CIO of the TVS diode
IEC 61000-4-2 protection requirement is covered by the IEC performance of the TVS diode
For this application, the audio signal voltage range is –3 V to 3 V. The VRWM for the TVS is –5.5 V to 5.5 V;
therefore, the bidirectional TVS will not break down during normal operation, and therefore normal operation of
the audio signal will not be effected due to the signal voltage range. In this application, a bidirectional TVS like
TPD1E10B06 is required.
Next, consider the frequency content of this audio signal. In this application with the class AB amplifier, the
frequency content is from 20 Hz to 20 kHz; ensure that the TVS I/O capacitance will not distort this signal by
filtering it. With TPD1E10B06 typical capacitance of 12 pF, which leads to a typical 3-dB bandwidth of 400 MHz,
this diode has sufficient bandwidth to pass the audio signal without distorting it.
Finally, the human interface in this application requires above standard Level 4 IEC 61000-4-2 system-level
ESD protection (±8 kV Contact/ ±15 kV Air-Gap). A standard TVS cannot survive this level of IEC ESD stress.
However, TPD1E10B06 can survive at least ±30 kV Contact/ ±30 kV Air-Gap. Therefore, the device can provide
sufficient ESD protection for the interface, even though the requirements are stringent. For any TVS diode to
provide the full range of ESD protection capabilities, as well as to minimize the noise and EMI disturbances the
board will see during ESD events, a system designer must use proper board layout of their TVS ESD protection
diodes. See Section 10 for instructions on properly laying out TPD1E10B06.
8.2.3 Application Curves
Figure 8-2. IEC 61000-4-2 Clamp Voltage +8 kV
Contact ESD
Figure 8-3. IEC 61000-4-2 Clamp Voltage –8 kV
Contact ESD
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9 Power Supply Recommendations
This device is a passive TVS diode-based ESD protection device, therefore there is no requirement to power it.
Take care to make sure that the maximum voltage specifications for each pin are not violated.
10 Layout
10.1 Layout Guidelines
•
The optimum placement is as close to the connector as possible.
– EMI during an ESD event can couple from the trace being struck to other nearby unprotected traces,
resulting in early system failures.
– The PCB designer must minimize the possibility of EMI coupling by keeping any unprotected traces away
from the protected traces which are between the TVS and the connector.
Route the protected traces as straight as possible.
Eliminate any sharp corners on the protected traces between the TVS and the connector by using rounded
corners with the largest radii possible.
•
•
– Electric fields tend to build up on corners, increasing EMI coupling.
If pin 1 or pin 2 is connected to ground, use a thick and short trace for this return path
•
10.2 Layout Example
To connector
To protected IC
Place pin 1 on the signal line
Minimum
distance
from
connector
(source of
ESD)
Thick and short return path to GND
Figure 10-1. Layout Recommendation
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11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
11.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPD1E10B06DPYR
TPD1E10B06DPYT
TPD1E10B06DYAR
ACTIVE
ACTIVE
ACTIVE
X1SON
X1SON
DPY
DPY
DYA
2
2
2
10000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-3-260C-168 HR
-40 to 125
-40 to 125
-40 to 125
(B1, B2, B6, BI)
NIPDAU
SN
(B1, B2, B6, BI)
1KF
SOT-5X3
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPD1E10B06 :
Automotive : TPD1E10B06-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
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5-Dec-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPD1E10B06DPYR
TPD1E10B06DPYR
TPD1E10B06DPYR
TPD1E10B06DPYT
TPD1E10B06DPYT
TPD1E10B06DPYT
TPD1E10B06DPYT
TPD1E10B06DYAR
X1SON
X1SON
X1SON
X1SON
X1SON
X1SON
X1SON
DPY
DPY
DPY
DPY
DPY
DPY
DPY
2
2
2
2
2
2
2
2
10000
10000
10000
250
180.0
178.0
180.0
180.0
178.0
180.0
180.0
178.0
8.4
8.4
9.5
9.5
8.4
8.4
9.5
9.5
0.07
0.7
1.1
0.47
0.47
0.66
0.66
0.47
0.47
0.5
2.0
2.0
2.0
2.0
2.0
2.0
2.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
1.15
1.15
1.15
1.15
1.1
0.66
0.66
0.7
250
250
0.07
0.73
0.5
250
1.13
1.94
SOT-5X3 DYA
3000
0.73
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Dec-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPD1E10B06DPYR
TPD1E10B06DPYR
TPD1E10B06DPYR
TPD1E10B06DPYT
TPD1E10B06DPYT
TPD1E10B06DPYT
TPD1E10B06DPYT
TPD1E10B06DYAR
X1SON
X1SON
X1SON
X1SON
X1SON
X1SON
X1SON
SOT-5X3
DPY
DPY
DPY
DPY
DPY
DPY
DPY
DYA
2
2
2
2
2
2
2
2
10000
10000
10000
250
203.2
205.0
184.0
184.0
205.0
203.2
189.0
210.0
196.8
200.0
184.0
184.0
200.0
196.8
185.0
200.0
33.3
33.0
19.0
19.0
33.0
33.3
36.0
42.0
250
250
250
3000
Pack Materials-Page 2
PACKAGE OUTLINE
DPY0002A
X1SON - 0.45 mm max height
S
C
A
L
E
1
1
.
0
0
0
PLASTIC SMALL OUTLINE - NO LEAD
1.1
0.9
B
A
PIN 1 INDEX AREA
0.7
0.5
0.45
0.30
C
SEATING PLANE
0.08 C
0.05
0.00
0.65
1
2
SYMM
0.55
0.45
2X
0.1
C A B
SYMM
0.3
0.2
2X
0.05
C A B
4224561/B 03/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
DPY0002A
X1SON - 0.45 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
2X (0.3)
SYMM
1
2
SYMM
2X (0.5)
(R0.05) TYP
(0.7)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:60X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL EDGE
METAL UNDER
SOLDER MASK
EXPOSED
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
(PREFERRED)
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4224561/B 03/2021
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
4. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view.
It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
DPY0002A
X1SON - 0.45 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(0)
2X (0.3)
2X (0.5)
SYMM
PCB PAD METAL
UNDER SOLDER PASTE
SYMM
2
1
(R0.05) TYP
(0.7)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:60X
4224561/B 03/2021
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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PACKAGE OUTLINE
DYA0002A
SOT (SOD-523) - 0.77 mm max height
PLASTIC SMALL OUTLINE
1.7
1.5
PIN 1
ID AREA
A
0.85
0.75
NOTE 3
2
1
1.3
1.1
0.3
0.1
0.7
0.5
B
2X
TYP
0.77 MAX
C
SEATING PLANE
0.05 C
0.15
2X
0.08
SYMM
SYMM
0.35
0.25
2X
0.1
0.05
C A B
0.4
0.2
2X
4224978/B 09/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEITA SC-79 registration except for package height
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EXAMPLE BOARD LAYOUT
DYA0002A
SOT (SOD-523) - 0.77 mm max height
PLASTIC SMALL OUTLINE
SYMM
2X (0.67)
(R0.05) TYP
SYMM
2
1
2X (0.4)
(1.48)
LAND PATTERN EXAMPLE
SCALE:40X
0.05 MIN
AROUND
0.05 MAX
AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDERMASK DETAILS
4224978/B 09/2021
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DYA0002A
SOT (SOD-523) - 0.77 mm max height
PLASTIC SMALL OUTLINE
SYMM
2X (0.67)
(R0.05) TYP
SYMM
2
1
2X (0.4)
(1.48)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
4224978/B 09/2021
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
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