TPIC71004TDCARQ1 [TI]
Quad-Channel Driver for Airbag Deployment;
| 型号： | TPIC71004TDCARQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Quad-Channel Driver for Airbag Deployment 光电二极管 |
| 文件： | 总8页 (文件大小：379K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPIC71004-Q1
www.ti.com
SLVSAT2 –FEBRUARY 2011
Quad-Channel Driver for Airbag Deployment
Check for Samples: TPIC71004-Q1
1
FEATURES
•
An External Pin Connection to the
Microprocessor ADC Supply for Ratio-metric
Squib Resistance Measurement
2
•
Quad-Channel Squib Drivers for Airbag
Application
•
•
•
40-V Pin Capability on All Pins (Except GNDx,
AGND, DGND, VCC5, VDDIO, AMX_OUT)
•
•
Loop Diagnostics Monitor and Reporting
Two Logic Inputs Providing Independent
Safety Logic for Enabling/Disabling
Deployment
Operating Ambient Temperature Range: –40°C
to 105°C
Thermally Enhanced 48-Pin TSSOP DCA
PowerPad™ Package
•
•
Four Independent Thermally Protected
High-Side Drivers That can Source
Deployment or Diagnostic Current Level to
Each Squib Load
APPLICATIONS
•
Squib Drivers for Airbag Application
Four Independent Avalanche Voltage and
Thermally Protected Low-Side Drivers That
Can Sink Deployment or Diagnostic Current
Level From Each Squib Load
1
2
3
4
5
6
7
8
9
48
47
46
45
NC
NC
NC
NC
VZ3
Z3
VZ0
•
•
•
Each Output Capable of 1.2 A/1.75 A Firing
Current for Typical 2 ms/0.5 ms
Z0
ZM0
GND0
TEST
VCC5
IWD
44 ZM3
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
GND3
DGND2
SOMI
SIMO
SCLK
CS_N
TZ0
SPI Slave Interface for Serial Bus
Communication with Parity Check
Firing VZx Voltage Range 10 V to 35 V,
Transients up to 40 V
SPI/
Digital
AMX_OUT 10
DIAG
•
•
Programmable Firing Time up to 8.2 ms
11
DGND1
12
13
14
15
16
17
18
19
20
21
22
23
24
AGND1
SQREF1
SQREF2
VADC
TEST2
VA2
Common Load Current Settings for All
Deployment Loops, Using Registers
RESET_N
VDDIO
AGND
VA1
BIAS
•
•
Individual Firing Current Timer Limit Set for
Each Deployment Loop, Using Registers
Firing Current Timer to Monitor Firing Current
Over Deployment Time for Each Deployment
Loop
TEST4
NC
TEST3
GND1
ZM1
GND2
ZM2
•
Independent Switch Control for Both High- and
Low-Side Switches
Z2
Z1
VZ1
VZ2
•
•
•
Diagnostic Mode for Fault Checking
NC
NC
Internal Fault Monitoring for Safe Operation
NC
NC
A Multiplex-able Output Buffer for Analog
Voltage Measurements
•
Use of External Clamping devices on Squib
Pins is Not Required to Protect the
Deployment ASIC Against Substrate Injection
Effects During Deployment Due to Dynamic
Shorts to Ground
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
PowerPad is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
© 2011, Texas Instruments Incorporated
TPIC71004-Q1
SLVSAT2 –FEBRUARY 2011
www.ti.com
DESCRIPTION
The TPIC71004-Q1 is a quad channel squib driver for airbags deployment in automotive applications. Each
channel consists of a high side and a low side switch with independent control logic for protection against
inadvertent deployment. Both the high and the low side switches have internal current limits, over-temperature
protection.
The IC registers are used for four channel configuration, control and status monitoring. To prevent inadvertent
deployment, the high and the low side switches will be turned on only if the proper configuration sequence is
used and multiple inputs to the deploy controller logic are at the correct level. The registers are programmed
using a serial communications interface.
The maximum on time for each channel is limited by programmable Firing Time Out Timer to prevent excessive
power dissipation. In addition, a current limit register is used to program the maximum current through the
switches during a deployment. The current limitation on the low side switch is larger than the corresponding high
side switch. During deployment, the low side switch will be full enhanced and operate with RDS_ON mode and
the high side switch will be in current regulation mode.
The implemented diagnostic functions monitor deployment ASIC pin voltages to provide High Side switch test,
Low Side switch test, squib resistance measurements, squib leakage measurement to battery, ground and
between any squib channels. Furthermore, the squib leakage measurement is provided for both Zx and ZMx pins
and does not require the squib load to be present to operate properly. Diagnostic information is communicated
through the AMX_OUT pin (for analog signals) and SPI mapped status registers (for status signals latched in
digital core).
The high-side and low-side squib drivers have a diagnostic level current limit and a deployment level current limit.
The default current limit for high-side and low-side squib drivers is the diagnostic level current limit. The high-side
switch deployment current limit for all high-side drivers can be set to either 1.2 A min or 1.75 A min (see Table 1)
through SPI mapped registers, device EEPROM settings (see Table 2). The low-side switch deployment current
limit is not programmable and is fixed to a level greater than the high-side driver current limit. The ON time
duration for each individual squib driver can be programmed through SPI mapped registers.
The deployment sequence requires a specific set of software commands combined with external hardware
enable logic lines (TZ0=H, IWD=L) to provide deployment capability. The turn-on sequence of the high-side
driver and low-side drivers is software controlled via SPI commands, but the turn-off procedure is automatically
provided by the deployment ASIC. After the programmed ON time duration has been achieved, the high-side
switch is deactivated first then followed by the low-side driver deactivation by approximately 100µsec.
The RESET_N is an active low input reset signal. This input will be released high by the power supply unit and/or
the µC once the external voltage supplies are within the specified limits. The external microcontroller is required
to configure and control device through the serial communication interface. Reliable software is critical for the
system operation.
Table 1. Potential Deployment Settings for Typical Firing Current
MAXIMUM AVERAGE FIRING VOLTAGE
FIRING
VOLTAGE
TYPICAL FIRING
CURRENT
DWELL
BETWEEN VZx AND Zx PINS TO
ACHIEVE DEPLOYMENT
(FIRING) TIME(1)
35 V
35 V
32.56 V
35.0 V
1.2 A
2 ms
1.75 A
0.5 ms
(1) For programming desired dwell (firing) time.
Extended deployment duration activates the over temperature protection circuit and terminates deployment. If
short-to-ground condition occurs during deployment, 35V firing voltage is completely dropped across the
HS_FET: therefore, thermal shut down protection kicks in to protect the device.
2
Submit Documentation Feedback
© 2011, Texas Instruments Incorporated
Product Folder Link(s): TPIC71004-Q1
TPIC71004-Q1
www.ti.com
SLVSAT2 –FEBRUARY 2011
Table 2. Potential Deployment Settings for Maximum Firing Current
MAXIMUM AVERAGE FIRING
FIRING
VOLTAGE
VOLTAGE BETWEEN VZx AND
Zx PINS TO ACHIEVE
DEPLOYMENT
DWELL
MAX FIRING CURRENT(1)
(FIRING) TIME(2)
35 V
35 V
30 V
31 V
2.6 A (for 1.75 A current setting)
2.0 A (for 1.2 A current setting)
0.7 ms
2.0 ms
(1) The max firing current levels are set through device EEPROM setting
(2) For programming desired dwell (firing) time
For the full version of this document, please contact msamktg@list.ti.com .
ORDERING INFORMATION
ORDERABLE PART
TA
PACKAGE(1)
TOP-SIDE MARKING
NUMBER
TPIC71004TDCAQ1
TPIC71004TDCARQ1
–40°C to 125°C
HTSSOP – DCA
Tape and reel
TPIC71004
(1) “Pb-Free” is defined to be compliant with the current RoHS requirements for all 6 substances, including the requirement that lead not
exceed 0.1% by weight in homogeneous materials unless exempt. Where designed to be soldered at high temperatures, TI "Pb-Free"
and "RoHS Compliant" products are suitable for use in specified lead-free processes.
Functional Block Diagram
1
2
3
4
5
6
7
8
9
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
NC
NC
NC
NC
VZ0
VZ3
Z0
ZM0
Z3
squib
squib
ZM3
GND3
DGND2
GND0
TEST
VCC5
SOMI
SIMO
SCLK
CS_N
IWD
SPI/
Digital
AMX_OUT 10
DIAG
DGND1
AGND1
11
12
13
14
15
16
17
18
19
20
21
22
23
24
TZ0
SQREF1
SQREF2
RESET_N
VDDIO
BIAS
AGND
VA1
VADC
TEST2
VA2
TEST4
NC
TEST3
GND1
GND2
ZM2
ZM1
squib
squib
Z2
Z1
VZ1
VZ2
NC
NC
NC
NC
© 2011, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TPIC71004-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Feb-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TPIC71004TDCARQ1
ACTIVE
HTSSOP
DCA
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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Addendum-Page 1
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