TPIC9202PWPR [TI]
MICROCONTROLLER POWER SUPPLY AND MULTIPLE LOW-SIDE DRIVER; 微控制器电源和多低侧驱动器
| 型号： | TPIC9202PWPR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | MICROCONTROLLER POWER SUPPLY AND MULTIPLE LOW-SIDE DRIVER |
| 文件： | 总18页 (文件大小：492K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
www.ti.com
SLIS116B–MAY 2005–REVISED JUNE 2006
FEATURES
APPLICATIONS
•
Electrical Applicances
– Air Conditioning Units
– Ranges
•
Eight Low-Side Drivers With Internal Clamp
for Inductive Loads and Current Limiting for
Self Protection
– Seven Outputs are Rated at 150 mA and
Controlled Through Serial Interface
– Dishwashers
– Refrigerators
– One Output Rated at 150 mA and
Controlled Through Serial Interface and
Dedicated Enable Pin
– Microwaves
– Washing Machines
General-Purpose Interface Circuit Allowing
Microcontroller Interface to Relays, Electric
Motors, LEDs, and Buzzers
•
•
•
•
5-V ±5% Regulated Power Supply With
200-mA Load Capability at VIN Max of 18 V
Internal Voltage Supervisory for Regulated
Output
PWP PACKAGE
(TOP VIEW)
Serial Communications for Control of Eight
Low-Side Drivers
1
2
3
4
5
6
7
8
9
10
BO_OUTZ
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
GND
20
19
18
17
16
15
14
13
12
11
BO
VIN
•
•
Enable/Disable Input for OUT1
5VOUT
SCLK
NCS
5-V or 3.3-V I/O Tolerant for Interface to
Microcontroller
MOSI
•
•
Programmable Power On-Reset Delay Before
RST Asserted High, Once 5 V Is Within
Specification (6 ms Typ)
RST
RDELAY
EN1
NC
Programmable Deglitch Timer Before RST Is
Asserted Low (40 µs Typ)
•
•
Programmable Brown-Out Feature
Thermal Shutoff for Self Protection
NC – No internal connection
DESCRIPTION/ORDERING INFORMATION
The power supply provides regulated 5-V output to power the system microcontroller and drive eight low-side
switches. The brown-out detection output (BO_OUTZ) warns the system if there is a temporary drop in the
supply voltage, so the system can prevent potentially hazardous situations.
A serial communications interface controls the eight low-side outputs; each output has an internal snubber circuit
to absorb the inductive load at turn OFF. Alternatively, the system can use a fly-back diode to VIN to help
recirculate the energy in an inductive load at turn OFF.
ORDERING INFORMATION
TA
PACKAGE
Reel of 2000
Tube of 70
ORDERABLE PART NUMBER
TPIC9202PWPR
TOP-SIDE MARKING
–40°C to 125°C
PowerPAD™ – PWP
IC9202
TPIC9202PWP
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
www.ti.com
SLIS116B–MAY 2005–REVISED JUNE 2006
PINOUT CONFIGURATION
NO.
1
NAME
BO_OUTZ
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
GND
I/O
DESCRIPTION
O
O
O
O
O
O
O
O
O
I
Brown-out indicator
Low-side output 1
Low-side output 2
Low-side output 3
Low-side output 4
Low-side output 5
Low-side output 6
Low-side output 7
Low-side output 8
Ground
2
3
4
5
6
7
8
9
10
11
12
13
14(1)
15
16
17
18
19
20
NC
No connection
EN1
I
O
I/O
I
Enable/disable for OUT1
Power-up reset delay
RDELAY
RST
Power-on reset output (open drain)
Serial data input
MOSI
NCS
I
Chip select
SCLK
5VOUT
VIN
I
Serial clock for data synchronization
Regulated output
O
I
Unregulated input voltage source
Brown-out input threshold setting
BO
I
(1) Terminal 14 can be used as an input or an output.
2
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MICROCONTROLLER POWER SUPPLY
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SLIS116B–MAY 2005–REVISED JUNE 2006
FUNCTIONAL BLOCK DIAGRAM
OUT1
EN1
Enables
OUT1
OUT1
EN1
50 kΩ
OUT1 at
150 mA
6 V
Gate Control
for Outputs
1 Through 8
OUT2
OUT2
OUT2 at 150 mA
100 kΩ
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
OUT3 at 150 mA
OUT4 at 150 mA
OUT5 at 150 mA
OUT6 at 150 mA
OUT7 at 150 mA
OUT8 at 150 mA
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
NCS
NCS
Parallel
Register
SCLK
Serial
Register
SCLK
100 kΩ
MOSI
MOSI
20 Ω
(2 W)
100 kΩ
VIN
10 V
7–18 V
PMOS
5VOUT
Gate Drive
and Control
Optional, dependent
on heat-management
implementation
5 V
Bandgap
Ref
Comp
(see Note A)
–
+
GND
5 kΩ
GND
Vref
Voltage
Supervisor
RST
Vref
RST
Iconst
RDELAY
RDELAY
BO
VIN
Comp
BO_OUTZ
BO_OUTZ
1.2 V
Recommended
A. The resistor and Zener diode are required if there is insufficient thermal management allocation.
3
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MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
www.ti.com
SLIS116B–MAY 2005–REVISED JUNE 2006
DETAILED DESCRIPTION
The 5-V regulator is powered from VIN, and the regulated output is within 5 V ±5% over the operating conditions.
The open-drain power-on reset (RST) pin remains low until the regulator exceeds the set threshold, and the
timer value set by the capacitor on the reset delay (RDELAY) pin expires. If both of these conditions are satisfied,
RST is asserted high. This signifies to the microcontroller that serial communications can be initiated to the
TPIC9202.
The serial communications is an 8-bit format, with data transfer synchronized using a serial clock from the
microcontroller. A single register controls all the outputs (one bit per output). The default value is zero (OFF). If
an output requires pulse width modulation (PWM) function, the register must be updated at a rate faster than the
desired PWM frequency. OUT1 can be controlled by serial input from the microcontroller or with the dedicated
enable (EN1) pin. If EN1 is pulled low or left open, the serial input through the shift register controls OUT1. If
EN1 is pulled high, OUT1 always is turned on, and the serial input for OUT1 is ignored.
The brown-out (BO) input is a resistor divided from the input supply and is used to determine if the supply
voltage drops to undesired levels. If the input drops below the programmed value, BO_OUTZ is pulled low, and
all outputs are disabled. Once the input supply line returns to the minimum desired level, the outputs are
enabled to the previous programmed states.
If RST is asserted, all outputs are turned OFF internally, and the input register is reset to all zeroes. The
microcontroller must write to the register to turn the outputs ON again.
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TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
www.ti.com
SLIS116B–MAY 2005–REVISED JUNE 2006
Absolute Maximum Ratings(1)
MIN
MAX
24
UNIT
VIN
VI(unreg)
Unregulated input voltage(2)(3)
Logic input voltage(2)(3)
V
BO
24
7
EN1, MOSI, SCLK, and NCS
RST and RDELAY
OUT1–OUT8
VI(logic)
V
7
VO
Low-side output voltage
Output current limit(4)
16.5
V
OUTn = ON and shorted to VIN
with low impedance
ILIMIT
350
mA
θJA
θJC
θJP
PD
Thermal impedance, junction to ambient(5)
Thermal impedance, junction to top of package(5)
Thermal impedance, junction to thermal pad(5)
Continuous power dissipation(6)
Electrostatic discharge(7)
33 °C/W
20 °C/W
1.4 °C/W
3.7
2
W
kV
°C
°C
°C
ESD
TA
Operating ambient temperature range
Storage temperature range
–40
–65
125
125
260
Tstg
Tlead
Lead temperature
Soldering, 10 s
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
(3) Absolute negative voltage on these pins must not go below –0.5 V.
(4) Not more than one output should be shorted at a time, and duration of the short circuit should not exceed 1 ms.
(5) The thermal data is based on using 1-oz copper trace with JEDEC 51-5 test board for PWP.
(6) The data is based on ambient temperature of 25°C max.
(7) The Human Body Model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.
Dissipation Ratings
T
A ≤ 25°C
DERATING FACTOR
ABOVE TA = 25°C
TA = 125°C
POWER RATING
PACKAGE
POWER RATING
PWP
3787 mW
30.3 mW/°C
757 mW
Recommended Operating Conditions
MIN
7
MAX
18
UNIT
VIN
VI(unreg)
Unregulated input voltage
V
BO (as seen by external resistor network)
0
18
VI(logic)
TA
Logic input voltage
EN1, RST, and RDELAY , MOSI, SCLK, and NCS
0
5.25
125
V
Operating ambient temperature
–40
°C
5
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TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
www.ti.com
SLIS116B–MAY 2005–REVISED JUNE 2006
Electrical Characteristics
TA = –40°C to 125°C, VIN = 7 V to 18 V (unless otherwise stated)
PARAMETER
TEST CONDITIONS
MIN TYP(1)
MAX UNIT
Supply Voltage and Current
(2)
VIN
Input voltage
7
18
3
V
Enable = low, OUT1–OUT8 = OFF
Enable = high, OUT1–OUT8 = ON
IIN
Input supply current
mA
5
Logic Inputs (MOSI, NCS, SCLK, and EN1)
VIL
Logic input low level
Logic input high level
IIL = 100 µA
IIL = 100 µA
0.8
V
V
VIH
2.4
Reset (RST)
VOL
Logic level output
IOL = 1.6 mA
0.4
4.5
V
V
V
V
V
(3)
VOH
Logic level output
5-kΩ pullup to VCC
5-V regulator ramps up
5-V regulator ramps down
VCC – 0.8
VH
Disabling reset threshold
Enabling reset threshold
Threshold hysteresis
4.25
3.75
0.5
VL
3.3
VHYS
0.12
Reset Delay (RDELAY
)
IOUT
tDW
tUP
Output current
18
3
28
6
48
µA
ms
µs
Reset delay timer
C = 47 nF
C = 47 nF
Reset capacitor to low level
45
Output (OUT1–OUT8)
VOL
IOH
Output ON
IOUTn = 150 mA
0.4
5
0.7
2
V
Output leakage
VOH = Max of 16.5 V
µA
Regulator Output (5VOUT
5VOUT Output supply
I5Vout
)
I5VOUT = 5 mA to 200 mA, VIN = 7 V to 18 V,
C5V = 1 µF
4.75
200
5.25
V
Limit output short circuit
current
5 V = 0 V
mA
Brown-Out (BO) Input
Threshold for brown-out
detection
Brown-Out Detection Output (BO_OUTZ)
1.3
V
BOVthes
VIN reduced until BO_OUTZ goes low
VOL
VOH
Logic level output
Logic level output
IOL = 100 µA
0.4
V
V
(3)
Pullup to VCC
VCC – 0.8
Thermal Shutdown
TSD
Thermal shutdown
Hysteresis
150
20
°C
°C
THYS
(1) All typical values are at TA = 25°C.
(2) There are external high-frequency noise-suppression capacitors and filter capacitors on VIN
.
(3) VCC is the pullup resistor voltage.
6
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MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
www.ti.com
SLIS116B–MAY 2005–REVISED JUNE 2006
Output Control Register
MSB
LSB
IN8
IN7
IN6
IN5
IN4
IN3
IN2
IN1
0
0
0
0
0
0
0
0
INn = 0 = Output OFF
INn = 1 = Output ON
To operate the output in PWM mode, the output control register must be updated at a rate twice the desired
PWM frequency of the output. Maximum PWM frequency is 5 kHz. The register is updated every 100 µs.
ENABLE TRUTH TABLE
SERIAL INPUT
FOR OUT1
EN1
OUT1
Open
H
L
On
Off
On
Off
On
On
Open
L
L
H
L
H
H
H
L
7
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MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
www.ti.com
SLIS116B–MAY 2005–REVISED JUNE 2006
Serial Communications Interface
The serial communications are an 8-bit format, with data transfer synchronized using a serial clock from the
microcontroller (see Figure 1). A single register controls all the outputs. The signal gives the instruction to control
the output of TPIC9202.
The NCS signal enables the SCLK and MOSI data when it is low. After NCS is set to low for T1, synchronization
clock and data begin to transmit and, after the 8-bit data has been transmitted, NCS is set high again to disable
SCLK and MOSI and to transfer the serial data to the control register. SCLK must be held low when NCS is
high.
T2
T3
T8
T1
T4
T5
T1
NCS
SCLK
1
2
3
4
5
6
7
8
MSB
IN8
LSB
IN1
MOSI
XXX
IN7
IN6
IN5
IN4
IN3
IN2
T6
T7
Figure 1. Serial Communications
8
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TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
www.ti.com
SLIS116B–MAY 2005–REVISED JUNE 2006
Timing Requirements
TA = –40°C to 125°C, VIN = 7 V to 18 V (unless otherwise stated)
PARAMETER
MIN
TYP
MAX
UNIT
kHz
ns
fSPI
T1
T2
T3
T4
T5
T6
T7
T8
SPI frequency
4
Delay time, NCS falling edge to SCLK rising edge
Delay time, NCS falling edge to SCLK falling edge
Pulse duration, SCLK high
10
80
ns
60
ns
Pulse duration, SCLK low
60
ns
Delay time, last SCLK falling edge to NCS rising edge
Setup time, MOSI valid before SCLK edge
Hold time, MOSI valid after SCLK edge
Time between two words for transmitting
80
ns
10
ns
10
ns
170
ns
Reset Delay (RDELAY
)
The RDELAY output provides a constant current source to charge an external capacitor to approximately 6.5 V.
The external capacitor is selected to provide a delay time, based on the current equation for a capacitor,
I = C(∆v/∆t) and a 28-µA typical output current.
Therefore, the user should select a 47-nF capacitor to provide a 6-ms delay at 3.55 V.
I = C(∆v/∆t)
28 µA = C × (3.55 V/6 ms)
C = 47 nF
9
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TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
www.ti.com
SLIS116B–MAY 2005–REVISED JUNE 2006
APPLICATION INFORMATION
Buzzer Driver
Relꢁy Driver
Relꢁy Driver
Relꢁy Driver
Relꢁy Driver
Fꢁn Driver
MOSI
SCLK
NCS
MCU/DSP
8 Ouapuas
Fꢁn Driver
Fꢁn Driver
BO_OUTZ
TPIC9202
RST
5VOUT 5ꢀ ꢁa 200 ꢂm
EN1
Brown Oua
R
DELmY
DC Inpua 7 V ao 18 V
GND
Figure 2. Typical Application
Display
(LED/LCD/VFD)
Keypad
LED LED
Water
Supply
Valve
Filters
AC
Water
Outlet
Softener
Supply
Volume
Sensor
M
Power
Switch
Water-Level
Sensor
Controller
Driver
Optical
Sensor
BO
BO_OUTZ
Brown-Out
Detect
Temperature
Sensor
(Optional)
VIN
5VOUT
RST
Regulator
+
~
~
POR/SYS
-
Cover
Switch
TPIC9202
Figure 3. Washing-Machine Application
10
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SLIS116B–MAY 2005–REVISED JUNE 2006
APPLICATION INFORMATION (continued)
PCB Layout
To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines
must be followed when laying out this part on the PCB.
The following information is to be used as a guideline only.
For further information, see the PowerPAD concept implementation document.
Application Using a Multilayer PCB
In a multilayer board application, the thermal vias are the primary method of heat transfer from the package
thermal pad to the internal ground plane (see Figure 4 and Figure 5).
The efficiency of this method depends on several factors: die area, number of thermal vias, thickness of copper,
etc. (see the PowerPAD™ Thermally Enhanced Package Technical Brief, literature number SLMA002).
Solder Pad (Land Pattern)
Package Thermal Pad
Thermal Via's
Package Outline
Figure 4. Package and PCB Land Configuration for a Multilayer PCB
Power Pad
Package Solder Pad
Component Traces
1.5038–1.5748-mm
Component Trace
(2-oz Cu)
2 Plane
1.0142–1.0502-mm
Ground Plane
(1-oz Cu)
Thermal Via
4 Plane
1.5748 mm
0.5246–0.5606-mm
Power Plane
(1-oz Cu)
Thermal Isolation
Power Plane Only
0.0–0.071-mm Board Base
and Bottom Pad
Package Solder Pad
(Bottom Trace)
Figure 5. Multilayer Board (Side View)
11
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SLIS116B–MAY 2005–REVISED JUNE 2006
APPLICATION INFORMATION (continued)
Application Using a Single-Layer PCB
In a single-layer board application, the thermal pad is attached to a heat spreader (copper areas) by a low
thermal-impedance attachment method (solder paste or thermal conductive epoxy). With either method, it is
advisable to use as many copper traces as possible to dissipate the heat.
CAUTION:
If the attachment method is not implemented correctly, the functionality of the product can not be
assured. Power-dissipation capability is adversely affected if the device is incorrectly mounted on
the circuit board.
Use as Much Copper Area
as Possible for Heat Spread
Package Thermal Pad
Package Outline
Figure 6. Layout Recommendations for a Single-Layer PCB
12
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SLIS116B–MAY 2005–REVISED JUNE 2006
APPLICATION INFORMATION (continued)
Recommended Board Layout
6,5 SMOC
5,85
SMOC = Solder Mask Over Copper
SMO = Solder Mask Opening
1
0,65
0,27 (´20)
3,7 SMO
Figure 7. Recommended Board Layout for PWP
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PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2006
PACKAGING INFORMATION
Orderable Device
TPIC9202PWP
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
HTSSOP
PWP
20
20
20
20
70 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
TPIC9202PWPG4
TPIC9202PWPR
TPIC9202PWPRG4
HTSSOP
HTSSOP
HTSSOP
PWP
PWP
PWP
70 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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Digital Control
Military
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
Logic
interface.ti.com
logic.ti.com
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
Low Power Wireless www.ti.com/lpw
Telephony
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2006, Texas Instruments Incorporated
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