TPS2068CDGN [TI]
低电平有效且具有输出放电和反向阻断功能的 1.5A 负载 4.5-5.5V、69mΩ USB 电源开关 | DGN | 8 | -40 to 125;型号: | TPS2068CDGN |
厂家: | TEXAS INSTRUMENTS |
描述: | 低电平有效且具有输出放电和反向阻断功能的 1.5A 负载 4.5-5.5V、69mΩ USB 电源开关 | DGN | 8 | -40 to 125 开关 电源开关 |
文件: | 总32页 (文件大小:1549K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TPS20xxC, TPS20xxC-2
www.ti.com
SLVSAU6G –JUNE 2011–REVISED JULY 2013
Current-Limited, Power-Distribution Switches
1
FEATURES
DESCRIPTION
The TPS20xxC and TPS20xxC-2 power-distribution
switch family is intended for applications such as
USB where heavy capacitive loads and short-circuits
are likely to be encountered. This family offers
multiple devices with fixed current-limit thresholds for
applications between 0.5 A and 2 A.
2
•
•
•
•
•
•
•
Single Power Switch Family
Pin for Pin with Existing TI Switch Portfolio
Rated currents of 0.5 A, 1 A, 1.5 A, 2 A
±20% Accurate, Fixed, Constant Current Limit
Fast Over-Current Response – 2 µs
Deglitched Fault Reporting
The TPS20xxC and TPS20xxC-2 family limits the
output current to a safe level by operating in a
constant-current mode when the output load exceeds
the current-limit threshold. This provides a predictable
fault current under all conditions. The fast overload
response time eases the burden on the main 5 V
supply to provide regulated power when the output is
shorted. The power-switch rise and fall times are
controlled to minimize current surges during turn-on
and turn-off.
Selected Parts with (TPS20xxC) and without
(TPS20xxC-2) Output Discharge
•
•
•
•
Reverse Current Blocking
Built-in Softstart
Ambient Temperature Range: –40°C to 85°C
UL Listed and CB-File No. E169910
APPLICATIONS
DGN, DGK
(Top View)
DBV
(Top View)
•
•
•
•
USB Ports/Hubs, Laptops, Desktops
High-Definition Digital TVs
Set Top Boxes
8
7
6
5
GND
IN
IN
1
2
3
4
OUT
OUT
OUT
FLT
OUT
1
5
IN
GND
FLT
2
3
Short-Circuit Protection
EN or EN
4
EN or EN
DGN Only
VIN
RFLT
10 kW
IN
VOUT
150 mF
OUT
GND
Pad*
Fault Signal
FLT
EN or
EN
Control Signal
* DGN only
Figure 1. Typical Application
Table 1. DEVICES(1)
STATUS
SOT23-5
MAXIMUM OPERATING
CURRENT
DEVICES
MSOP-8 ( PowerPad™)
—
MSOP-8
0.5
1
TPS2041C and 51C
TPS2061C and 65C
TPS2065C-2
Active and Active
—
Active and Active
Active
Active and Active
—
1
Active
—
1.5
1.5
2
TPS2068C and 69C
TPS2069C-2
Active and Active
Active
— and Active
—
—
—
—
TPS2000C and 01C
Active and Active
Active and Active
(1) For more details, see the DEVICE INFORMATION table.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPad is a trademark of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011–2013, Texas Instruments Incorporated
TPS20xxC, TPS20xxC-2
SLVSAU6G –JUNE 2011–REVISED JULY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DEVICE INFORMATION(1)
PACKAGED DEVICE AND MARKING(2)
MAXIMUM
OPERATING
CURRENT
OUTPUT
DISCHARGE
BASE PART
NUMBER
ENABLE
MSOP-8 (DGN)
PowerPAD™
SOT23-5
(DBV)
MSOP-8
(DGK)
0.5
0.5
1
Y
Y
Y
Y
N
Y
Y
N
Y
Y
Low
High
Low
High
High
Low
High
High
Low
High
TPS2041C
TPS2051C
TPS2061C
TPS2065C
TPS2065C-2
TPS2068C
TPS2069C
TPS2069C-2
TPS2000C
TPS2001C
–
PYJI
VBYQ
PXLI
VCAQ
PYQI
–
–
–
–
PXMI
VCAQ
PYRI
PXNI
VBUQ
PYSI
BCMS
VBWQ
–
1
–
1
–
–
1.5
1.5
1.5
2
PYKI
–
–
–
–
PXFI
PXGI
2
–
(1) For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) "-" indicates the device is not available in this package.
ABSOLUTE MAXIMUM RATINGS(1)(2)
VALUE
UNIT
MIN
–0.3
–6
MAX
(3)
Voltage range on IN, OUT, EN or EN, FLT
Voltage range from IN to OUT
Maximum junction temperature, TJ
HBM
6
6
V
V
Internally Limited
2
kV
V
Electrostatic Discharge
CDM
IEC 61000-4-2, Contact / Air
500
(4)
8
15
kV
(1) Absolute maximum ratings apply over recommended junction temperature range.
(2) Voltages are with respect to GND unless otherwise noted.
(3) See the Input and Output Capacitance section.
(4) VOUT was surged on a pcb with input and output bypassing per Figure 1 (except input capacitor was 22 µF) with no device failures.
THERMAL INFORMATION
0.5 A or 1 A
Rated
1.5 A or 2 A
Rated
0.5 A or 1 A
Rated
1.5 A or 2 A
Rated
2 A
Rated
THERMAL METRIC(1)
UNITS
(See DEVICE INFORMATION table.)
DBV
5 PINS
224.9
95.2
DBV
5 PINS
220.4
89.7
DGN
8 PINS
72.1
87.3
42.2
7.3
DGN
8 PINS
67.1
80.8
37.2
5.6
DGK
8 PINS
205.5
94.3
θJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
θJCtop
θJB
51.4
46.9
126.9
24.7
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
6.6
5.2
°C/W
ψJB
50.3
46.2
42.0
39.2
36.9
32.1
125.2
N/A
θJCbot
N/A
N/A
See the Power DIssipation and Junction
Temperature section
θJACustom
139.3
134.9
66.5
61.3
110.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
Submit Documentation Feedback
Copyright © 2011–2013, Texas Instruments Incorporated
TPS20xxC, TPS20xxC-2
www.ti.com
SLVSAU6G –JUNE 2011–REVISED JULY 2013
RECOMMENDED OPERATING CONDITIONS
MIN
4.5
0
NOM
MAX
5.5
UNIT
VIN
VEN
VIH
VIL
Input voltage, IN
V
V
V
V
Input voltage, EN or EN
5.5
High-level input voltage, EN or EN
Low-level input voltage, EN or EN
2
0.7
0.5
1
TPS2041C and TPS2051C
TPS2061C, TPS2065C and TPS2065C-2
TPS2068C, TPS2069C and TPS2069C-2
TPS2000C and TPS2001C
Continuous output current,
OUT(1)
IOUT
A
1.5
2
TJ
Operating junction temperature
Sink current into FLT
–40
0
125
5
°C
IFLT
mA
(1) Some package and current rating may request an ambient temperature derating of 85°C.
ELECTRICAL CHARACTERISTICS: TJ = TA = 25°C(1)
Unless otherwise noted:, VIN = 5 V, VEN = VIN or VEN = GND, IOUT = 0 A. See the 'Device Information' table for the rated
current of each part number. Parametrics over a wider operational range are shown in the second 'Electrical Characteristics'
table.
PARAMETER
TEST CONDITIONS(1)
MIN
TYP
MAX
UNIT
POWER SWITCH
0.5 A rated output, 25°C
DBV
DBV
97
96
110
130
mΩ
mΩ
0.5 A rated output,
–40°C ≤ (TJ , TA) ≤ 85°C
DBV
96
86
96
86
76
69
76
69
72
110
100
130
120
91
1 A rated output, 25°C
mΩ
mΩ
DGN
DBV
1 A rated output,
–40°C ≤ (TJ , TA) ≤ 85°C
DGN
RDS(on)
Input – output resistance
DBV
mΩ
mΩ
mΩ
mΩ
mΩ
1.5 A rated output, 25°C
DGN
84
DBV
106
98
1.5 A rated output,
–40°C ≤ (TJ , TA) ≤ 85°C
DGN
2 A rated output, 25°C
DGN, DGK
84
2 A rated output, –40°C ≤ (TJ , TA) ≤
85°C
DGN, DGK
72
98
mΩ
CURRENT LIMIT
0.5A rated output
1 A rated output
TPS20xxC
TPS20xxC
TPS20xxC-2
TPS20xxC
TPS20xxC-2
TPS20xxC
0.67
1.3
0.85
1.55
1.53
2.15
2.23
2.9
1.01
1.8
1.18
1.7
1.88
2.5
Current-limit,
See Figure 7
(2)
IOS
A
1.5 A rated output
2 A rated output
1.71
2.35
2.75
3.4
SUPPLY CURRENT
ISD Supply current, switch disabled
IOUT = 0 A
0.01
60
1
2
µA
µA
–40°C ≤ (TJ , TA) ≤ 85°C, VIN = 5.5 V, IOUT = 0 A
IOUT = 0 A
70
85
ISE
Supply current, switch enabled
Leakage current
–40°C ≤ (TJ , TA) ≤ 85°C, VIN = 5.5 V, IOUT = 0 A
VOUT = 0 V, VIN = 5 V, disabled,
measure IVIN
0.05
1
2
Ilkg
TPS20xxC-2
µA
–40°C ≤ (TJ , TA) ≤ 85°C, VOUT = 0 V,
VIN = 5 V, disabled, measure IVIN
(1) Pulsed testing techniques maintain junction temperature approximately equal to ambient temperature
(2) See CURRENT LIMIT section for explanation of this parameter.
Copyright © 2011–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
TPS20xxC, TPS20xxC-2
SLVSAU6G –JUNE 2011–REVISED JULY 2013
www.ti.com
ELECTRICAL CHARACTERISTICS: TJ = TA = 25°C(1) (continued)
Unless otherwise noted:, VIN = 5 V, VEN = VIN or VEN = GND, IOUT = 0 A. See the 'Device Information' table for the rated
current of each part number. Parametrics over a wider operational range are shown in the second 'Electrical Characteristics'
table.
PARAMETER
TEST CONDITIONS(1)
MIN
TYP
MAX
UNIT
VOUT = 5 V, VIN = 0 V, measure IVOUT
0.1
1
IREV
Reverse leakage current
µA
–40°C ≤ (TJ , TA) ≤ 85°C, VOUT = 5 V, VIN = 0 V, measure
IVOUT
5
OUTPUT DISCHARGE
RPD
Output pull-down resistance(3)
VIN = VOUT = 5 V, disabled
TPS20xxC
400
470
600
Ω
(3) These parameters are provided for reference only, and do not constitute part of TI's published device specifications for purposes of TI's
product warranty.
ELECTRICAL CHARACTERISTICS: –40°C ≤ TJ ≤ 125°C
Unless otherwise noted:4.5 V ≤ VIN ≤ 5.5 V, VEN = VIN or VEN = GND, IOUT = 0 A, typical values are at 5 V and 25°C. See the
DEVICE INFORMATION table for the rated current of each part number.
PARAMETER
TEST CONDITIONS(1)
MIN
TYP
MAX
UNIT
POWER SWITCH
0.5 A rated output
1 A rated output
DBV
97
96
86
76
69
72
154
154
140
121
112
112
mΩ
mΩ
DBV
DGN
RDS(ON)
Input – output resistance
DBV
mΩ
mΩ
mΩ
1.5 A rated output
2 A rated output
DGN
DGN, DGK
ENABLE INPUT (EN or EN)
Threshold
Input rising
1
0.07
–1
1.45
0.13
0
2
0.20
1
V
V
Hysteresis
Leakage current
(VEN or VEN) = 0 V or 5.5 V
µA
VIN = 5 V, CL = 1 µF, RL = 100 Ω, EN ↑ or EN ↓.
See Figure 2, Figure 4, and Figure 5
tON
Turnon time
Turnoff time
ms
ms
0.5A / 1A Rated
1.5A / 2A Rated
1
1.4
1.7
1.8
2.2
1.2
VIN = 5 V, CL = 1 µF, RL = 100 Ω, EN ↓ or EN ↑.
See Figure 2, Figure 4, and Figure 5
tOFF
0.5A and 1A Rated
1.3
1.7
1.65
2.1
2
1.5A / 2A Rated
2.5
CL = 1 µF, RL = 100 Ω, VIN = 5 V. See Figure 3
0.5A / 1A Rated
tR
Rise time, output
Fall time, output
0.4
0.5
0.55
0.7
0.7
1.0
ms
ms
1.5A / 2A Rated
CL = 1 µF, RL = 100 Ω, VIN = 5 V. See Figure 3
0.5A / 1A Rated
tF
0.25
0.3
0.35
0.43
0.45
0.55
1.5A / 2A Rated
CURRENT LIMIT
0.5 A rated output
1 A rated output
TPS20xxC
0.65
1.2
1.1
1.6
1.6
2.3
0.85
1.55
1.53
2.15
2.23
2.9
1.05
1.9
TPS20xxC
TPS20xxC-2
TPS20xxC
TPS20xxC-2
TPS20xxC
1.96
2.7
Current-limit,
See Figure 10
(2)
IOS
A
1.5 A rated output
2 A rated output
2.86
3.6
(1) Pulsed testing techniques maintain junction temperature approximately equal to ambient temperature
(2) See CURRENT LIMIT section for explanation of this parameter.
4
Submit Documentation Feedback
Copyright © 2011–2013, Texas Instruments Incorporated
TPS20xxC, TPS20xxC-2
www.ti.com
SLVSAU6G –JUNE 2011–REVISED JULY 2013
ELECTRICAL CHARACTERISTICS: –40°C ≤ TJ ≤ 125°C (continued)
Unless otherwise noted:4.5 V ≤ VIN ≤ 5.5 V, VEN = VIN or VEN = GND, IOUT = 0 A, typical values are at 5 V and 25°C. See the
DEVICE INFORMATION table for the rated current of each part number.
PARAMETER
TEST CONDITIONS(1)
MIN
TYP
MAX
UNIT
VIN = 5 V (see Figure 7),
One-half full load → RSHORT = 50 mΩ,
Measure from application to when current falls below 120% of
final value
tIOS
Short-circuit response time(3)
2
µs
SUPPLY CURRENT
ISD Supply current, switch disabled
ISE
IOUT = 0 A
IOUT = 0 A
0.01
65
10
90
µA
µA
Supply current, switch enabled
Leakage current
VOUT = 0 V, VIN = 5 V, disabled,
TPS20XXC-2
Ilkg
0.05
0.2
µA
µA
measure IVIN
IREV
Reverse leakage current
VOUT = 5.5 V, VIN = 0 V, measure IVOUT
20
4
UNDERVOLTAGE LOCKOUT
VUVLO
Rising threshold
Hysteresis(3)
VIN
↑
↓
3.5
3.75
0.14
V
V
VIN
FLT
Output low voltage, FLT
Off-state leakage
FLT deglitch
IFLT = 1 mA
0.2
1
V
VFLT = 5.5 V
µA
ms
tFLT
FLT assertion or deassertion deglitch
6
9
12
OUTPUT DISCHARGE
VIN = 4 V, VOUT = 5 V, disabled
VIN = 5 V, VOUT = 5 V, disabled
TPS20XXC
TPS20XXC
350
300
560
470
1200
800
RPD
Output pull-down resistance
Ω
THERMAL SHUTDOWN
In current limit
135
155
Rising threshold (TJ)
Not in current limit
°C
(4)
Hysteresis
20
(3) These parameters are provided for reference only, and do not constitute part of TI's published device specifications for purposes of TI's
product warranty.
(4) These parameters are provided for reference only, and do not constitute part of TI's published device specifications for purposes of TI's
product warranty.
OUT
90%
tR
tF
VOUT
R
C
L
L
10%
Figure 2. Output Rise / Fall Test Load
Figure 3. Power-On and Off Timing
V
V
/EN
50%
EN
50%
50%
50%
t
t
OFF
ON
t
OFF
t
ON
90%
90%
V
OUT
V
OUT
10%
10%
Figure 4. Enable Timing, Active High Enable
Figure 5. Enable Timing, Active Low Enable
Copyright © 2011–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
TPS20xxC, TPS20xxC-2
SLVSAU6G –JUNE 2011–REVISED JULY 2013
www.ti.com
120% x I
I
OS
OUT
I
OS
0 A
t
IOS
Figure 6. Output Short Circuit Parameters
VIN
Decreasing
Load
Resistance
Slope = -RDS(ON)
0 V
0 A
IOUT
IOS
Figure 7. Output Characteristic Showing Current Limit
FUNCTIONAL BLOCK DIAGRAM
Current
Sense
CS
OUT
IN
Charge
Pump
Current
Limit
(Disabled+
UVLO)
EN or
EN
Driver
FLT
UVLO
9-ms
Deglitch
OTSD
Thermal
Sense
GND
Figure 8. TPS20xxC Block Diagram
6
Submit Documentation Feedback
Copyright © 2011–2013, Texas Instruments Incorporated
TPS20xxC, TPS20xxC-2
www.ti.com
SLVSAU6G –JUNE 2011–REVISED JULY 2013
Current
Sense
CS
OUT
FLT
IN
Charge
Pump
Current
Limit
EN or
EN
Driver
UVLO
9-ms
Deglitch
OTSD
Thermal
Sense
GND
Figure 9. TPS20xxC-2 Block Diagram
DEVICE INFORMATION
PIN FUNCTIONS
NAME
PINS DESCRIPTION
8-PIN PACKAGE
EN or EN
GND
4
1
Enable input, logic high turns on power switch
Ground connection
IN
2, 3
Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to GND close
to the IC
FLT
5
Active-low open-drain output, asserted during over-current, or over-temperature conditions
OUT
6, 7, 8 Power-switch output, connect to load
PowerPAD
(DGN ONLY)
PAD
Internally connected to GND. Connect PAD to GND plane as a heatsink for the best thermal performance.
PAD may be left floating if desired. See POWER DISSIPATION AND JUNCTION TEMPERATURE section
for guidance.
5-PIN PACKAGE
EN or EN
GND
4
2
5
Enable input, logic high turns on power switch
Ground connection
IN
Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to GND close
to the IC
FLT
3
1
Active-low open-drain output, asserted during over-current, or over-temperature conditions
Power-switch output, connect to load.
OUT
Copyright © 2011–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
TPS20xxC, TPS20xxC-2
SLVSAU6G –JUNE 2011–REVISED JULY 2013
www.ti.com
TYPICAL CHARACTERISTICS
IOUT
VIN
VOUT
OUT
IN
OUT1
IN1
OUT1
VIN
RLOAD
680mF3
Enable
Signal
2
3.01kW2
EN or
EN
FLT
Fault Signal
Pad1 GND
(1) Not every package has all pins
(2) These parts are for test purposes
(3) Helps with output shorting tests when external supply is used.
Figure 10. Test Circuit for System Operation in Typical Characteristics Section
9
8
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
−0.25
−0.50
9
8
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
−0.25
−0.50
VIN = 5 V, COUT = 150 µF, RLOAD = 5 Ω, TPS2065C
VIN = 5 V, COUT = 150 µF, RLOAD = 100 Ω, TPS2065C
Output Current
Output Current
7
7
Output Voltage
FLT
6
6
FLT
5
5
4
4
EN
3
3
EN
2
2
1
1
Output Voltage
0
0
−1
−2m
−1
−2m
0
2m 4m 6m 8m 10m 12m 14m 16m 18m 20m
0
2m 4m 6m 8m 10m 12m 14m 16m 18m 20m
Time (s)
Time (s)
G001
G002
Figure 11. TPS2065C Output Rise / Fall 5Ω
Figure 12. TPS2065C Output Rise / Fall 100Ω
9
8
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
−0.25
−0.50
9
8
2.00
1.80
1.50
1.20
1.00
0.75
0.50
0.25
0.00
−0.25
−0.50
VIN = 5 V, COUT = 150 µF, RLOAD = 0 Ω, TPS2065C
VIN = 5 V,COUT = 150 µF,RLOAD = 50 mΩ, TPS2065C
7
7
Output Current
EN
6
6
FLT
Output Current
5
5
4
4
FLT
3
3
EN
2
2
Output Voltage
1
1
0
0
Output Voltage
−1
−2m
−1
−2.5m
0
2m 4m 6m 8m 10m 12m 14m 16m 18m
Time (s)
2.5m
7.5m
12.5m
Time (s)
17.5m
22.5m25m
G003
G004
Figure 13. TPS2065C Enable into Output Short
Figure 14. TPS2065C Pulsed Short Applied
8
Submit Documentation Feedback
Copyright © 2011–2013, Texas Instruments Incorporated
TPS20xxC, TPS20xxC-2
www.ti.com
SLVSAU6G –JUNE 2011–REVISED JULY 2013
TYPICAL CHARACTERISTICS (continued)
10
26
24
22
20
18
16
14
12
10
8
6
30
25
20
15
10
5
VIN = 5 V, COUT = 0 µF, TPS2065C
VIN = 5 V, COUT = 0 µF, RLOAD = 50 mΩ, TPS2065C
9
8
5
Input Voltage
7
4
IOUT
6
5
3
4
3
VOUT
Output Voltage
Output Current
2
2
1
1
0
6
−1
−2
−3
4
0
0
2
0
−1
−1u
−5
−1u
0
1u
2u
3u
4u
0
1u
2u
3u
4u
Time (s)
Time (s)
G005
G006
Figure 15. TPS2065C Short Applied
Figure 16. TPS2065C Pulsed 1.45-A Load
6
5
2.5
9
8
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
−0.25
−0.50
VIN = 5 V, COUT = 0 µF,
RLOAD = 50 mΩ, TPS2065C
VIN = 5 V, COUT = 150 µF, RLOAD = 7.5Ω, TPS2065C
2.0
7
Output Voltage
4
1.5
6
5
3
1.0
EN, VIN
4
IOUT
2
0.5
3
VOUT
FLT
2
1
0.0
Output Current
1
0
−0.5
−1.0
0
−1
−100u
−1
0
100u
200u
300u
400u
500u
600u
−5m −4m −3m −2m −1m
0
1m 2m 3m 4m 5m
Time (s)
Time (s)
G007
G008
Figure 17. TPS2065C 50 mΩ Short Circuit
Figure 18. TPS2065C Power Up - Enabled
9
8
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
−0.25
−0.50
9
7
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0
−0.4
−0.8
VIN = 5 V, COUT = 150 µF, RLOAD = 7.5Ω, TPS2065C
VIN = 5 V, COUT = 150 µF, RLOAD = 2.5 Ω, TPS2001C
Output Current
7
6
FLT
5
5
FLT
EN, VIN
4
3
3
EN
2
Output Current
Output Voltage
1
1
Output Voltage
0
−1
−1
−2m
−40m −30m −20m −10m
0
10m 20m 30m 40m
0
2m 4m 6m 8m 10m 12m 14m 16m 18m
Time (s)
Time (s)
G009
G010
Figure 19. TPS2065C Power Down - Enabled
Figure 20. TPS2001C Turn ON into 2.5Ω
Copyright © 2011–2013, Texas Instruments Incorporated
Submit Documentation Feedback
9
TPS20xxC, TPS20xxC-2
SLVSAU6G –JUNE 2011–REVISED JULY 2013
www.ti.com
TYPICAL CHARACTERISTICS (continued)
9
8
3.6
9
3.6
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0
−0.4
VIN = 5 V, COUT = 150 µF, RLOAD = 50 mΩ, TPS2001C
VIN = 5 V, COUT = 150 µF,RLOAD = 50mΩ, TPS2001C
3.2
8
7
Output Current 2.8
2.4
7
Output Current
EN
6
6
EN
FLT
5
2.0
5
4
1.6
1.2
4
Output Voltage
FLT
3
3
Output Voltage
0.8
2
2
1
0.4
0.0
1
0
0
−1
−2m
−0.4
−1
−2.5m
0
2m 4m 6m 8m 10m 12m 14m 16m 18m
Time (s)
0
2.5m 5m 7.5m 10m 12.5m 15m 17.5m 20m 22.5m
Time (s)
G011
G013
G015
G012
G014
G016
Figure 21. TPS2001C Enable into Short
Figure 22. TPS2001C Pulsed Output Short
9
8
1.4
9
8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
−0.2
−0.4
VIN = 5 V, COUT = 150 µF, RLOAD = 10 Ω, TPS2051C
Output Current
VIN = 5 V, COUT = 150 µF, RLOAD = 50 mΩ, TPS2051C
1.2
7
1.0
7
Output Current
Output Voltage
6
0.8
6
5
FLT
0.6
5
4
0.4
4
3
0.2
3
EN
2
0.0
2
Output Voltage
FLT
EN
1
−0.2
−0.4
−0.6
1
0
0
−1
−2m
−1
−2m
0
2m 4m 6m 8m 10m 12m 14m 16m 18m
Time (s)
0
2m 4m 6m 8m 10m 12m 14m 16m 18m
Time (s)
Figure 23. TPS2051C Turn ON into 10Ω
Figure 24. TPS2051C Enable into Short
9
8
1.4
12
10
8
2.5
VIN = 5 V, COUT = 150 µF, RLOAD = 50mΩ, TPS2051C
VIN = 5 V, COUT = 150 µF, RLOAD = 3.3 Ω, TPS2069C
1.2
2.0
7
1.0
Output Current
1.5
6
0.8
EN
5
0.6
Output Current
6
1.0
EN
4
0.4
4
0.5
3
0.2
FLT
2
0.0
2
0.0
FLT
Output Voltage
1
−0.2
−0.4
−0.6
Output Voltage
0
−0.5
−1.0
0
−1
−2.5m
−2
0
2.5m 5m 7.5m 10m 12.5m 15m 17.5m 20m 22.5m
−4m −2m
0
2m 4m 6m 8m 10m 12m 14m 16m
Time (s)
Time (s)
Figure 25. TPS2051C Pulsed Output Short
Figure 26. TPS2069C Turn ON into 3.3Ω
10
Submit Documentation Feedback
Copyright © 2011–2013, Texas Instruments Incorporated
TPS20xxC, TPS20xxC-2
www.ti.com
SLVSAU6G –JUNE 2011–REVISED JULY 2013
TYPICAL CHARACTERISTICS (continued)
10
8
3.0
2.5
2.0
1.5
1.0
0.5
0.0
−0.5
10
3.0
2.5
2.0
1.5
1.0
0.5
0.0
−0.5
VIN = 5 V, COUT = 150 µF, RLOAD = 50 mΩ, TPS2069C
VIN = 5 V, COUT = 150 µF, RLOAD = 50 mΩ, TPS2069C
8
Output
Current
EN
EN
6
4
6
4
2
2
Output Current
FLT
0
0
−2
−4
−2
−4
Output Voltage
−7.5m
FLT
Output Voltage
−2m
0
2m 4m 6m 8m 10m 12m 14m 16m 18m
Time (s)
−12.5m
−2.5m
2.5m
7.5m
12.5m
Time (s)
G017
G018
Figure 27. TPS2069C Enable into Short
Figure 28. TPS2069C Pulsed Output Short
9.3
14
VIN = 5 V
All Versions, 5 V
85°C
12
10
8
9.2
9.1
9.0
8.9
8.8
25°C
−40°C
6
125°C
4
2
0
−40 −20
0
20
40
60
80
100 120 140
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Output Voltage (V)
Junction Temperature (°C)
G019
G020
Figure 29. Deglitch Period (tFLT) vs Temperature
Figure 30. Output Discharge Current vs Output Voltage
3.5
3.0
2.5
2.0
1.5
1.0
0.5
7
VIN = 5 V
All Unit Types, 5 V
6
2-A Rated
5
4
1.5-A Rated
1-A Rated
3
2
0.5-A Rated
1
0
−1
−40 −20
0
20
40
60
80
100 120 140
−40 −20
0
20
40
60
80
100 120 140
Junction Temperature (°C)
Junction Temperature (°C)
G021
G022
Figure 31. Short Circuit Current (IOS) vs Temperature
Figure 32. Reverse Leakage Current (IREV) vs Temperature
Copyright © 2011–2013, Texas Instruments Incorporated
Submit Documentation Feedback
11
TPS20xxC, TPS20xxC-2
SLVSAU6G –JUNE 2011–REVISED JULY 2013
www.ti.com
TYPICAL CHARACTERISTICS (continued)
1.0
0.8
1.0
Input Voltage = 5.5 V
All Unit Types
0.8
0.6
0.6
125°C
85°C
0.4
0.4
0.2
0.2
0.0
0.0
−40°C and 25°C
4.50 4.75
Input Voltage (V)
−0.2
−0.2
−40 −20
0
20
40
60
80
100 120 140
4.00
4.25
5.00
5.25
5.50
Junction Temperature (°C)
G023
G024
Figure 33. Disabled Supply Current (ISD) vs Temperature
Figure 34. Disabled Supply Current (ISD) vs Input Voltage
6.0
80
All unit types, VIN = 0 V
All Unit Types,VIN = 5.5 V
5.5
5.0
75
70
65
60
55
50
4.5
125°C
4.0
3.5
3.0
2.5
2.0
85°C
1.5
1.0
25°C
−40°C
0.5
0.0
−0.5
4.00
4.25
4.50
4.75
5.00
5.25
5.50
−40 −20
0
20
40
60
80
100 120 140
Output Voltage (V)
Junction Temperature (°C)
G025
G026
Figure 35. Reverse Leakage Current (IREV) vs Output
Voltage
Figure 36. Enabled Supply Current (ISE) vs Temperature
80
0.475
COUT = 1 µF, RLOAD = 100 Ω
75
125°C
85°C
70
0.450
0.425
65
60
55
0.400
1.5-A and 2-A Rated, VIN = 4.5 V
1.5-A and 2-A Rated, VIN = 5 V
0.375
1.5-A and 2-A Rated, VIN = 5.5 V
50
0.350
25°C
45
−40°C
0.5-A and 1-A Rated, VIN = 5 V
0.325
40
4.00
4.25
4.50
4.75
5.00
5.25
5.50
−40 −20
0
20
40
60
80
100 120 140
Input Voltage (V)
Junction Temperature (°C)
G027
G028
Figure 37. Enabled Supply Current (ISE) vs Input Voltage
Figure 38. Output Fall Time (tF) vs Temperature
12
Submit Documentation Feedback
Copyright © 2011–2013, Texas Instruments Incorporated
TPS20xxC, TPS20xxC-2
www.ti.com
SLVSAU6G –JUNE 2011–REVISED JULY 2013
TYPICAL CHARACTERISTICS (continued)
0.85
0.80
0.75
0.70
0.65
0.60
0.55
0.50
140
130
120
110
100
90
COUT = 1 µF, RLOAD = 100 Ω
VIN = 5 V
1.5 A, 2 A, 5.5 V
0.5-A, 1-A Rated
80
0.5 A, 1 A, 5 V
70
1.5 A, 2 A, 5 V
1.5-A, 2-A Rated
60
1.5 A, 2 A, 4.5 V
50
40
−40 −20
0
20
40
60
80
100 120 140
−40 −20
0
20
40
60
80
100 120 140
Junction Temperature (°C)
Junction Temperature (°C)
G029
G030
Figure 39. Output Rise Time (tR) vs Temperature
Figure 40. Input-Output Resistance (RDS(ON)) vs
Temperature
100
VIN = 5 V, CIN = 730 µF, TPS2065C, IEND = 1.68 A
IOS
10
1
0
5
10
15
20
25
IPK (Shorted) (A)
G031
Figure 41. Recovery vs Current Peak
Copyright © 2011–2013, Texas Instruments Incorporated
Submit Documentation Feedback
13
TPS20xxC, TPS20xxC-2
SLVSAU6G –JUNE 2011–REVISED JULY 2013
www.ti.com
DETAILED DESCRIPTION
The TPS20xxC and TPS20xxC-2 are current-limited, power-distribution switches providing between 0.5 A and 2
A of continuous load current in 5 V circuits. These parts use N-channel MOSFETs for low resistance, maintaining
voltage regulation to the load. They are designed for applications where short circuits or heavy capacitive loads
will be encountered. Device features include enable, reverse blocking when disabled, output discharge pulldown,
overcurrent protection, over-temperature protection, and deglitched fault reporting.
UVLO
The undervoltage lockout (UVLO) circuit disables the power switch until the input voltage reaches the UVLO turn-
on threshold. Built-in hysteresis prevents unwanted on/off cycling due to input voltage drop from large current
surges. FLT is high impedance when the TPS20xxC and TPS20xxC-2 are in UVLO.
ENABLE
The logic enable input (EN, or EN), controls the power switch, bias for the charge pump, driver, and other
circuits. The supply current is reduced to less than 1 µA when the TPS20xxC and TPS20xxC-2 are disabled.
Disabling the TPS20xxC and TPS20xxC-2 will immediately clear an active FLT indication. The enable input is
compatible with both TTL and CMOS logic levels.
The turnon and turnoff times (tON, tOFF) are composed of a delay and a rise or fall time (tR, tF). The delay times
are internally controlled. The rise time is controlled by both the TPS20xxC and TPS20xxC-2 and the external
loading (especially capacitance). TPS20xxC fall time is controlled by the loading (R and C), and the output
discharge (RPD). TPS20xxC-2 does not have the output discharge (RPD), fall time is controlled by the loading (R
and C). An output load consisting of only a resistor will experience a fall time set by the TPS20xxC and
TPS20xxC-2. An output load with parallel R and C elements will experience a fall time determined by the (R × C)
time constant if it is longer than the TPS20xxC and TPS20xxC-2’s tF.
The enable should not be left open, and may be tied to VIN or GND depending on the device.
INTERNAL CHARGE PUMP
The device incorporates an internal charge pump and gate drive circuitry necessary to drive the N-channel
MOSFET. The charge pump supplies power to the gate driver circuit and provides the necessary voltage to pull
the gate of the MOSFET above the source. The driver incorporates circuitry that controls the rise and fall times of
the output voltage to limit large current and voltage surges on the input supply, and provides built-in soft-start
functionality. The MOSFET power switch will block current from OUT to IN when turned off by the UVLO or
disabled.
CURRENT LIMIT
The TPS20xxC and TPS20xxC-2 responds to overloads by limiting output current to the static IOS levels shown in
the Electrical Characteristics table. When an overload condition is present, the device maintains a constant
output current, with the output voltage determined by (IOS × RLOAD). Two possible overload conditions can occur.
The first overload condition occurs when either: 1) input voltage is first applied, enable is true, and a short circuit
is present (load which draws IOUT > IOS), or 2) input voltage is present and the TPS20xxC and TPS20xxC-2 are
enabled into a short circuit. The output voltage is held near zero potential with respect to ground and the
TPS20xxC and TPS20xxC-2 ramps the output current to IOS. The TPS20xxC and TPS20xxC-2 will limit the
current to IOS until the overload condition is removed or the device begins to thermal cycle. This is demonstrated
in Figure 13 where the device was enabled into a short, and subsequently cycles current off and on as the
thermal protection engages.
The second condition is when an overload occurs while the device is enabled and fully turned on. The device
responds to the overload condition within tIOS (Figure 6 and Figure 7) when the specified overload (per Electrical
Characteristics table) is applied. The response speed and shape will vary with the overload level, input circuit,
and rate of application. The current-limit response will vary between simply settling to IOS, or turnoff and
controlled return to IOS. Similar to the previous case, the TPS20xxC and TPS20xxC-2 will limit the current to IOS
until the overload condition is removed or the device begins to thermal cycle. This is demonstrated by Figure 14,
Figure 15, and Figure 16.
14
Submit Documentation Feedback
Copyright © 2011–2013, Texas Instruments Incorporated
TPS20xxC, TPS20xxC-2
www.ti.com
SLVSAU6G –JUNE 2011–REVISED JULY 2013
The TPS20xxC and TPS20xxC-2 thermal cycles if an overload condition is present long enough to activate
thermal limiting in any of the above cases. This is due to the relatively large power dissipation [(VIN – VOUT) x IOS
]
driving the junction temperature up. The device turns off when the junction temperature exceeds 135°C (min)
while in current limit. The device remains off until the junction temperature cools 20°C and then restarts.
There are two kinds of current limit profiles typically available in TI switch products similar to the TPS20xxC and
TPS20xxC-2. Many older designs have an output I vs V characteristic similar to the plot labeled "Current Limit
with Peaking" in Figure 42. This type of limiting can be characterized by two parameters, the current limit corner
(IOC), and the short circuit current (IOS). IOC is often specified as a maximum value. The TPS20xxC and
TPS20xxC-2 family of parts does not present noticeable peaking in the current limit, corresponding to the
characteristic labeled "Flat Current Limit" in Figure 42. This is why the IOC parameter is not present in the
Electrical Characteristics tables.
Current Limit
with Peaking
Flat Current
Limit
VIN
VIN
Decreasing
Load
Resistance
Decreasing
Load
Resistance
Slope = -RDS(ON)
Slope = -RDS(ON)
0 V
0 V
0 A
0 A
IOUT
IOUT
IOS IOC
IOS
Figure 42. Current Limit Profiles
FLT
The FLT open-drain output is asserted (active low) during an overload or over-temperature condition. A 9 ms
deglitch on both the rising and falling edges avoids false reporting at startup and during transients. A current limit
condition shorter than the deglitch period will clear the internal timer upon termination. The deglitch timer will not
integrate multiple short overloads and declare a fault. This is also true for exiting from a faulted state. An input
voltage with excessive ripple and large output capacitance may interfere with operation of FLT around IOS as the
ripple will drive the TPS20xxC and TPS20xxC-2 in and out of current limit.
If the TPS20xxC and TPS20xxC-2 are in current limit and the over-temperature circuit goes active, FLT will go
true immediately (see Figure 14) however exiting this condition is deglitched (see Figure 16). FLT is tripped just
as the knee of the constant-current limiting is entered. Disabling the TPS20xxC and TPS20xxC-2 will clear an
active FLT as soon as the switch turns off (see Figure 13). FLT is high impedance when the TPS20xxC and
TPS20xxC-2 are disabled or in under-voltage lockout (UVLO).
OUTPUT DISCHARGE
A 470Ω (typical) output discharge will dissipate stored charge and leakage current on OUT when the TPS20xxC
is in UVLO or disabled. The pull-down circuit will lose bias gradually as VIN decreases, causing a rise in the
discharge resistance as VIN falls towards 0 V. The TPS20xxC-2 does not have this function. The output is be
controlled by an external loadings when the device is in ULVO or disabled.
Copyright © 2011–2013, Texas Instruments Incorporated
Submit Documentation Feedback
15
TPS20xxC, TPS20xxC-2
SLVSAU6G –JUNE 2011–REVISED JULY 2013
www.ti.com
APPLICATION INFORMATION
INPUT AND OUTPUT CAPACITANCE
Input and output capacitance improves the performance of the device; the actual capacitance should be
optimized for the particular application. For all applications, a 0.1 µF or greater ceramic bypass capacitor
between IN and GND is recommended as close to the device as possible for local noise decoupling.
All protection circuits such as the TPS20xxC and TPS20xxC-2 will have the potential for input voltage overshoots
and output voltage undershoots.
Input voltage overshoots can be caused by either of two effects. The first cause is an abrupt application of input
voltage in conjunction with input power bus inductance and input capacitance when the IN terminal is high
impedance (before turn on). Theoretically, the peak voltage is 2 times the applied. The second cause is due to
the abrupt reduction of output short circuit current when the TPS20xxC and TPS20xxC-2 turns off and energy
stored in the input inductance drives the input voltage high. Input voltage droops may also occur with large load
steps and as the TPS20xxC and TPS20xxC-2 output is shorted. Applications with large input inductance (e.g.
connecting the evaluation board to the bench power-supply through long cables) may require large input
capacitance reduce the voltage overshoot from exceeding the absolute maximum voltage of the device. The fast
current-limit speed of the TPS20xxC and TPS20xxC-2 to hard output short circuits isolates the input bus from
faults. However, ceramic input capacitance in the range of 1µF to 22µF adjacent to the TPS20xxC and
TPS20xxC-2 input aids in both speeding the response time and limiting the transient seen on the input power
bus. Momentary input transients to 6.5V are permitted.
Output voltage undershoot is caused by the inductance of the output power bus just after a short has occurred
and the TPS20xxC and TPS20xxC-2 has abruptly reduced OUT current. Energy stored in the inductance will
drive the OUT voltage down and potentially negative as it discharges. Applications with large output inductance
(such as from a cable) benefit from use of a high-value output capacitor to control the voltage undershoot. When
implementing USB standard applications, a 120 µF minimum output capacitance is required. Typically a 150 µF
electrolytic capacitor is used, which is sufficient to control voltage undershoots. However, if the application does
not require 120 µF of capacitance, and there is potential to drive the output negative, a minimum of 10 µF
ceramic capacitance on the output is recommended. The voltage undershoot should be controlled to less than
1.5 V for 10 µs.
POWER DISSIPATION AND JUNCTION TEMPERATURE
It is good design practice to estimate power dissipation and maximum expected junction temperature of the
TPS20xxC and TPS20xxC-2. The system designer can control choices of package, proximity to other power
dissipating devices, and printed circuit board (PCB) design based on these calculations. These have a direct
influence on maximum junction temperature. Other factors, such as airflow and maximum ambient temperature,
are often determined by system considerations. It is important to remember that these calculations do not include
the effects of adjacent heat sources, and enhanced or restricted air flow.
Addition of extra PCB copper area around these devices is recommended to reduce the thermal impedance and
maintain the junction temperature as low as practical. The lower junction temperatures achieved by soldering the
pad improve the efficiency and reliability of both TPS20xxC and TPS20xxC-2 parts and the system. The following
examples were used to determine the θJACustom thermal impedances noted in the THERMAL INFORMATION
table. They were based on use of the JEDEC high-k circuit board construction (2 signal and 2 plane) with 4, 1oz.
copper weight, layers.
While it is recommended that the DGN package PAD be soldered to circuit board copper fill and vias for low
thermal impedance, there may be cases where this is not desired. For example, use of routing area under the IC.
Some devices are available in packages without the Power Pad (DGK) specifically for this purpose. The θJA for
the DGN package with the pad not soldered and no extra copper, is approximately 141°C/W for 0.5 - A and 1- A
rated parts, and 139°C/W for the 1.5 - A and 2- A rated parts. The θJA for the DGK mounted per Figure 45 is
110.3C/W. These values may be used in Equation 1 to determine the maximum junction temperature.
16
Submit Documentation Feedback
Copyright © 2011–2013, Texas Instruments Incorporated
TPS20xxC, TPS20xxC-2
www.ti.com
SLVSAU6G –JUNE 2011–REVISED JULY 2013
GND: 0.052in2 Total
& 3 x 0.018in vias
GND: 0.056in2 total area
& 3 x 0.018in vias
COUT
COUT
0.050in trace
CIN
0.050in trace
CIN
4 x 0.01in vias
VOUT: 0.048in2 total area
5 x 0.01in vias
VIN: 0.0145in2 area
& 2 x 0.018in vias
V : 0.00925in2
VOUT: 0.041in2 total
IN
& 3 x 0.018in vias
Figure 43. DBV Package PCB Layout Example
Figure 44. DGN Package PCB Layout Example
0.100 x 0.175
& 5 18 mil vias
0.08 x 0.250
0.15 x 0.15
0.185 x 0.045
& 3 18 mil vias
50 mil trace
0.100 x 0.060
& 3 18 mil vias to
0.07 x 0.08
inner plane 2
10 mil trace
Figure 45. DGK Package PCB Layout Example
The following procedure requires iteration because power loss is due to the internal MOSFET I2 × RDS(ON), and
RDS(ON) is a function of the junction temperature. As an initial estimate, use the RDS(ON) at 125°C from the
TYPICAL CHARACTERISTICS, and the preferred package thermal resistance for the preferred board
construction from the THERMAL INFORMATION table.
TJ = TA + ((IOUT2 x RDS(ON)) x θJA
)
(1)
Where:
IOUT = rated OUT pin current (A)
RDS(ON) = Power switch on-resistance at an assumed TJ (Ω)
TA = Maximum ambient temperature (°C)
TJ = Maximum junction temperature (°C)
θJA = Thermal resistance (°C/W)
If the calculated TJ is substantially different from the original assumption, estimate a new value of RDS(ON) using
the typical characteristic plot and recalculate.
If the resulting TJ is not less than 125°C, try a PCB construction and/or package with lower θJA
.
Copyright © 2011–2013, Texas Instruments Incorporated
Submit Documentation Feedback
17
TPS20xxC, TPS20xxC-2
SLVSAU6G –JUNE 2011–REVISED JULY 2013
www.ti.com
REVISION HISTORY
Changes from Original (June 2011) to Revision A
Page
•
•
Changed the TPS2051C, TPS2065C, and TPS2069C Devices Status From: Preview To: Active ...................................... 1
Corrected pinout numbers for the 5-PIN PACKAGE ............................................................................................................ 7
Changes from Revision A (July 2011) to Revision B
Page
•
•
Added the DGK Package Information throughout the data sheet ........................................................................................ 1
Changed title of Figure 17 From: NEW FIG To: TPS2065C 50 Ω Short Circuit ................................................................... 9
Changes from Revision B (September 2011) to Revision C
Page
•
•
Changed TPS2000C (MSOP-8) status From: Preview To: Active in Table 1 ...................................................................... 1
Changed From: PXF1 To: PXFI and From: PSG1 To: PXGI in the DEVICE INFORMATION table MOSP-8 (DGK)
column .................................................................................................................................................................................. 2
•
•
Changed the θJACustom 2 A Rated DGK value from N/A to 110.3 .................................................................................... 2
Added Figure 45 - DGK Package PCB Layout Example .................................................................................................... 17
Changes from Revision C (October 2011) to Revision D
Page
•
•
•
Added Feature UL Listed and CB-File No. E169910 (See Table 1) .................................................................................... 1
Added table Note 2, UL listed and CB complete. ................................................................................................................. 1
Added VIH and VIL information to the ROC Table ................................................................................................................. 3
Changes from Revision D (February 2012) to Revision E
Page
•
Changed the POWER DISSIPATION AND JUNCTION TEMPERATURE section. Replaced paragraph " While it is
recommended..." ................................................................................................................................................................. 16
18
Submit Documentation Feedback
Copyright © 2011–2013, Texas Instruments Incorporated
TPS20xxC, TPS20xxC-2
www.ti.com
SLVSAU6G –JUNE 2011–REVISED JULY 2013
Changes from Revision E (April 2012) to Revision F
Page
•
•
Added device TPS20xxC-2 ................................................................................................................................................... 1
Changed Feature From: Ouput Discharge When TPS20XXC is Disabled To: Selected parts with (TPS20xxC) and
without (TPS20xxC-2) Output Discharge .............................................................................................................................. 1
•
Added devices TPS2041C, TPS2061C, TPS2065C-2, TPS2068C, and TPS2069C-2 to Table 1 and removed
Product Preview .................................................................................................................................................................... 1
•
•
•
•
•
Added the TPS2069C-2 Device ............................................................................................................................................ 1
Added devices TPS2041C, TPS2061C, TPS2065C-2, TPS2068C, and TPS2069C-2 to the Device Information table ..... 2
Added PXKI in the DEVICE INFORMATION table SOT23-5 (DBV) column (TPS2069C) ................................................... 2
Added Note 1 to the RECOMMENDED OPERATING CONDITIONS table ......................................................................... 3
Added TPS2041C, TPS2061C, TPS2068C, TPS2065C-2 and TPS2069C-2 devices to IOUT in the RECOMMENDED
OPERATING CONDITIONS table ........................................................................................................................................ 3
•
•
•
•
•
•
•
•
•
Added the DBV option to Power Switch RDS(on) 1.5 A rated output, 25°C mΩ ..................................................................... 3
Added the DBV option to Power Switch RDS(on) 1.5 A rated output ...................................................................................... 3
Changed ISO Current Limit .................................................................................................................................................... 3
Added Leakage Current ........................................................................................................................................................ 3
Added the DBV option to Power Switch RDS(on) 1.5 A rated output . .................................................................................... 4
Changed ISO Current Limit .................................................................................................................................................... 4
Added Leakage Current ........................................................................................................................................................ 5
Changed the second para graph of the ENABLE section .................................................................................................. 14
Added sentence to end of paragraph in the OUTPUT DISCHARGE section .................................................................... 15
Changes from Revision F (August 2012) to Revision G
Page
•
•
•
Deleted (See Table 1) from Feature: UL Listed and CB-File No. E169910 ......................................................................... 1
Deleted Note 2 from Table 1: "UL listed and CB complete" ................................................................................................. 1
Changed From: PXKI To: PYKI in the DEVICE INFORMATION table SOT23-5 (DBV) column (TPS2069C) .................... 2
Copyright © 2011–2013, Texas Instruments Incorporated
Submit Documentation Feedback
19
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
PACKAGING INFORMATION
Orderable Device
905X0205100
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
SOT-23
VSSOP
VSSOP
DBV
5
8
8
8
8
8
8
8
8
5
5
5
5
5
5
8
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAUAG
CU NIPDAUAG
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
VBYQ
PXFI
PXFI
TPS2000CDGK
TPS2000CDGKR
TPS2000CDGN
TPS2000CDGNR
TPS2001CDGK
TPS2001CDGKR
TPS2001CDGN
TPS2001CDGNR
TPS2041CDBVR
TPS2041CDBVT
TPS2051CDBVR
TPS2051CDBVT
TPS2061CDBVR
TPS2061CDBVT
TPS2061CDGN
TPS2061CDGNR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DGK
DGK
DGN
DGN
DGK
DGK
DGN
DGN
DBV
DBV
DBV
DBV
DBV
DBV
DGN
DGN
80
2500
80
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
BCMS
BCMS
PXGI
PXGI
VBWQ
VBWQ
PYJI
MSOP-
PowerPAD
2500
80
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
VSSOP
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
VSSOP
2500
80
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
MSOP-
PowerPAD
2500
3000
250
3000
250
3000
250
80
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAUAG
CU NIPDAUAG
Green (RoHS
& no Sb/Br)
PYJI
Green (RoHS
& no Sb/Br)
VBYQ
VBYQ
PXLI
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
PXLI
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
PXMI
PXMI
MSOP-
2500
Green (RoHS
& no Sb/Br)
PowerPAD
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
TPS2065CDBVR
TPS2065CDBVR-2
TPS2065CDBVT
TPS2065CDBVT-2
TPS2065CDGN
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
DBV
5
5
5
5
8
8
8
8
8
8
5
5
8
8
8
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
VCAQ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
DBV
DBV
DGN
DGN
DGN
DGN
DGN
DGN
DBV
DBV
DGN
DGN
DGN
DGN
3000
250
250
80
Green (RoHS
& no Sb/Br)
PYQI
VCAQ
PYQI
VCAQ
PYRI
VCAQ
PYRI
PXNI
PXNI
PYKI
PYKI
VBUQ
PYSI
VBUQ
PYSI
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
TPS2065CDGN-2
TPS2065CDGNR
TPS2065CDGNR-2
TPS2068CDGN
MSOP-
PowerPAD
80
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
MSOP-
PowerPAD
2500
2500
80
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
CU NIPDAUAG
CU NIPDAUAG
CU NIPDAU
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
TPS2068CDGNR
TPS2069CDBVR
TPS2069CDBVT
TPS2069CDGN
MSOP-
PowerPAD
2500
3000
250
80
Green (RoHS
& no Sb/Br)
SOT-23
SOT-23
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CU NIPDAU
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
TPS2069CDGN-2
TPS2069CDGNR
TPS2069CDGNR-2
MSOP-
PowerPAD
80
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
MSOP-
PowerPAD
2500
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
MSOP-
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
PowerPAD
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Jul-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS2000CDGKR
TPS2000CDGNR
VSSOP
DGK
DGN
8
8
2500
2500
330.0
330.0
12.4
12.4
5.3
5.3
3.4
3.4
1.4
1.4
8.0
8.0
12.0
12.0
Q1
Q1
MSOP-
Power
PAD
TPS2001CDGKR
TPS2001CDGNR
VSSOP
DGK
DGN
8
8
2500
2500
330.0
330.0
12.4
12.4
5.3
5.3
3.4
3.4
1.4
1.4
8.0
8.0
12.0
12.0
Q1
Q1
MSOP-
Power
PAD
TPS2041CDBVR
TPS2051CDBVR
TPS2061CDBVR
TPS2061CDGNR
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DGN
5
5
5
8
3000
3000
3000
2500
178.0
178.0
178.0
330.0
9.0
9.0
3.23
3.23
3.23
5.3
3.17
3.17
3.17
3.4
1.37
1.37
1.37
1.4
4.0
4.0
4.0
8.0
8.0
8.0
Q3
Q3
Q3
Q1
9.0
8.0
MSOP-
Power
PAD
12.4
12.0
TPS2065CDBVR
TPS2065CDBVR-2
TPS2065CDGNR
SOT-23
SOT-23
DBV
DBV
DGN
5
5
8
3000
3000
2500
178.0
178.0
330.0
9.0
9.0
3.23
3.23
5.3
3.17
3.17
3.4
1.37
1.37
1.4
4.0
4.0
8.0
8.0
8.0
Q3
Q3
Q1
MSOP-
Power
PAD
12.4
12.0
TPS2065CDGNR-2
MSOP-
Power
DGN
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Jul-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
PAD
TPS2068CDGNR
MSOP-
Power
PAD
DGN
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TPS2069CDBVR
TPS2069CDGNR
SOT-23
DBV
DGN
5
8
3000
2500
178.0
330.0
9.0
3.23
5.3
3.17
3.4
1.37
1.4
4.0
8.0
8.0
Q3
Q1
MSOP-
Power
PAD
12.4
12.0
TPS2069CDGNR-2
MSOP-
Power
PAD
DGN
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS2000CDGKR
TPS2000CDGNR
TPS2001CDGKR
TPS2001CDGNR
TPS2041CDBVR
TPS2051CDBVR
TPS2061CDBVR
TPS2061CDGNR
VSSOP
MSOP-PowerPAD
VSSOP
DGK
DGN
DGK
DGN
DBV
DBV
DBV
DGN
8
8
8
8
5
5
5
8
2500
2500
2500
2500
3000
3000
3000
2500
366.0
360.0
366.0
360.0
180.0
180.0
180.0
366.0
364.0
162.0
364.0
162.0
180.0
180.0
180.0
364.0
50.0
98.0
50.0
98.0
18.0
18.0
18.0
50.0
MSOP-PowerPAD
SOT-23
SOT-23
SOT-23
MSOP-PowerPAD
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Jul-2013
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS2065CDBVR
TPS2065CDBVR-2
TPS2065CDGNR
TPS2065CDGNR-2
TPS2068CDGNR
TPS2069CDBVR
TPS2069CDGNR
TPS2069CDGNR-2
SOT-23
DBV
DBV
DGN
DGN
DGN
DBV
DGN
DGN
5
5
8
8
8
5
8
8
3000
3000
2500
2500
2500
3000
2500
2500
180.0
180.0
360.0
366.0
366.0
180.0
360.0
366.0
180.0
180.0
162.0
364.0
364.0
180.0
162.0
364.0
18.0
18.0
98.0
50.0
50.0
18.0
98.0
50.0
SOT-23
MSOP-PowerPAD
MSOP-PowerPAD
MSOP-PowerPAD
SOT-23
MSOP-PowerPAD
MSOP-PowerPAD
Pack Materials-Page 3
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明