TPS2069DDBVT [TI]
高电平有效且具有输出放电和反向阻断功能的 1.5A 负载、4.5-5.5V、76mΩ USB 电源开关 | DBV | 5 | -40 to 105;
| 型号： | TPS2069DDBVT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 高电平有效且具有输出放电和反向阻断功能的 1.5A 负载、4.5-5.5V、76mΩ USB 电源开关 | DBV | 5 | -40 to 105 开关 电源开关 光电二极管 信号电路 复用器 复用器或开关 |
| 文件： | 总30页 (文件大小：801K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DGN−8
TPS2060, TPS2064
TPS2068, TPS2069
www.ti.com
SLVS553E–MARCH 2005–REVISED APRIL 2007
CURRENT-LIMITED, POWER-DISTRIBUTION SWITCHES
FEATURES
APPLICATIONS
•
Heavy Capacitive Loads
•
•
•
•
•
•
•
•
•
•
•
•
•
70-mΩ High-Side MOSFET
•
Short-Circuit Protections
1.5-A Continuous Current
Thermal and Short-Circuit Protection
Accurate Current Limit (1.6 A min, 2.6 A max)
Operating Range: 2.7 V to 5.5 V
0.6-ms Typical Rise Time
Undervoltage Lockout
Deglitched Fault Report (OC)
TPS2068
DGN PACKAGE
(TOP VIEW)
TPS2069
DGN PACKAGE
(TOP VIEW)
No OC Glitch During Power Up
1-µA Maximum Standby Supply Current
Reverse Current Blocking
OUT
OUT
OUT
OC
OUT
OUT
OUT
OC
GND
GND
IN
IN
IN
IN
EN
EN
TPS2060/64 Temperature Range: 0°C to 70°C
TPS2068/69 Temperature Range:
-40°C to 85°C
•
•
ESD Protection
UL Listed – File No. E169910
DESCRIPTION
The TPS206x power-distribution switches are intended for applications where heavy capacitive loads and
short-circuits are likely to be encountered. This device incorporates 70-mΩ N-channel MOSFET power switches
for power-distribution systems that require single or dual power switches in a single package. Each switch is
controlled by a logic enable input. Gate drive is provided by an internal charge pump designed to control the
power-switch rise times and fall times to minimize current surges during switching. The charge pump requires no
external components and allows operation from supplies as low as 2.7 V.
When the output load exceeds the current-limit threshold or a short is present, the device limits the output
current to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low.
When continuous heavy overloads and short-circuits increase the power dissipation in the switch, causing the
junction temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a
thermal shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch
remains off until valid input voltage is present. Current limit is typically 2.1 A.
1.5 A
1.5 A
TPS2069
TPS2068
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPad is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS2060, TPS2064
TPS2068, TPS2069
www.ti.com
SLVS553E–MARCH 2005–REVISED APRIL 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTION AND ORDERING INFORMATION
RECOMMENDED
MAXIMUM
CONTINUOUS
LOAD CURRENT
TYPICAL
SHORT-CIRCUIT
CURRENT LIMIT
AT 25°C
PACKAGED
DEVICES
(1)(2)
NUMBER OF
SWITCHES
TA
ENABLE
MSOP (DGN)
Active low
Active high
Active low
Active high
TPS2060DGN
TPS2064DGN
TPS2068DGN
TPS2069DGN
0°C to 70°C
Dual
1.5 A
2.1 A
-40°C to 85°C
Single
(1) The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2060DGN).
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
UNIT
Input voltage range, VI(IN)
–0.3 V to 6 V
–0.3 V to 6 V
VI
Input voltage range, VI(ENx), VI(ENx)
Voltage range, VI(OC), VI(/OCx)
–0.3 V to 6 V
VO
IO
Output voltage range, VO(OUT), VO(OUTx)
Continuous output current, IO(OUT), IO(OUTx)
Continuous total power dissipation
–0.3 V to 6 V
Internally limited
See Dissipation Rating Table
0°C to 105°C
TPS2060/64
TPS2068/69
Operating virtual junction temperature
range
TJ
-40°C to 105°C
–65°C to 150°C
2 kV
Tstg
Storage temperature range
Human body model MIL-STD-883C
Charge device model (CDM)
Electrostatic discharge (ESD) protection
500 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATING RATING TABLE(1)
TA < 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
PACKAGE
DGN-8
1370 mW
17 mW/°C
600 mW
342 mW
(1) Heatsink the PowerPad™per the recommendations of SLMA002A. PCB used for recommendations per appendix A4.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
5.5
UNIT
Input voltage, VI(IN)
2.7
0
V
V
A
VI
Input voltage, VI(ENx), VI(ENx)
Continuous output current, IO(OUTx)
5.5
IO
0
1.5
TJ
TPS2060/64
TPS2068/69
0
105
105
Operating virtual junction temperature
°C
-40
2
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SLVS553E–MARCH 2005–REVISED APRIL 2007
ELECTRICAL CHARACTERISTICS
0°C ≤ TJ≤ 105°C for the TPS2060/64 and -40°C ≤ TJ≤ 105° for the TPS2068/69, VI(IN) = 5.5 V, IO = 1 A, VI(ENx) = 0 V, or
VI(ENx) = 5.5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN TYP
MAX UNIT
POWER SWITCH
Static drain-source on-state
resistance, 5-V operation and
3.3-V operation
VI(IN) = 5 V or 3.3 V, IO = 1.5 A
70
75
115 mΩ
rDS(on)
Static drain-source on-state
resistance, 2.7-V operation
VI(IN) = 2.7 V, IO = 1.5 A
VI(IN) = 5.5 V
125 mΩ
0.6
0.4
1.5
tr
tf
Rise time, output
Fall time, output
VI(IN) = 2.7 V
VI(IN) = 5.5 V
VI(IN) = 2.7 V
1
ms
0.5
CL = 1 µF,
RL = 5 Ω
TJ = 25°C
0.05
0.05
0.5
ENABLE INPUT EN OR EN
VIH
VIL
II
High-level input voltage
2.7 V < VI(IN) < 5.5 V
2.7 V < VI(IN) < 5.5 V
2
V
Low-level input voltage
Input current
0.8
VI(ENx) = 0 V or 5.5 V, VI(ENx) = 0 V or 5.5 V
CL = 100 µF, RL = 5 Ω
-0.5
0.5
3
µA
ton
toff
Turnon time
ms
Turnoff time
CL = 100 µF, RL = 5 Ω
10
CURRENT LIMIT
VI(IN) = 5 V, OUT connected to GND, device enabled
into short-circuit
IOS
Short-circuit output current
1.6
3.2
2.1
2.6
A
A
TPS2060/64
TPS2068/69
3.2
3.9
3.4
VI(IN) = 5 V, Current ramp
(≤ 100 A/s) on OUT
IOC_TRIP
Overcurrent trip threshold
Short-circuit output current
2.85
VI(IN) = 5 V, OUT1 and OUT2 connected to GND,
device enabled into short-circuit, current measured at
VI(IN)
(2)
IOS
4.2
5.2
A
Overcurrent trip threshold
TPS2060/64
VI(IN) = 5 V, Current ramp (≤ 100 A/s) on OUT1 and
OUT2 tied together, current measured at VI(IN)
(2)
IOC_TRIP
IOL
6.4
7.8
A
TJ = 25°C
0.5
0.5
50
50
43
43
1
5
No load on OUT, VI(ENx) = 5.5 V,
or VI(ENx) = 0 V
Supply current, low-level output
µA
Over TJ range
TJ = 25°C
70
90
60
70
Supply current, high-level output
TPS2060/64
No load on OUT, VI(ENx) = 0 V,
or VI(ENx) = 5.5 V
IOH
µA
µA
Over TJ range
TJ = 25°C
Supply current, high-level output
TPS2068/69
No load on OUT, VI(ENx) = 0 V,
or VI(ENx) = 5.5 V
IOH
Ilkg
Over TJ range
OUT connected to ground, VI(ENx) = 5.5 V,
or VI(ENx) = 0 V
Leakage current
1
µA
µA
Reverse leakage current
VI(OUTx) = 5.5 V, IN = ground
TJ = 25°C
0.2
UNDERVOLTAGE LOCKOUT
Low-level input voltage, IN
Hysteresis, IN
OVERCURRENT OCx
2
4
2.5
V
TJ = 25°C
75
8
mV
VOL(OCx)
Output low voltage
Off-state current
OC deglitch
IO(OCx) = 5 mA
0.4
1
V
VO(OCx) = 5 V or 3.3 V
OCx assertion or deassertion
µA
ms
15
THERMAL SHUTDOWN(3)
Thermal shutdown threshold
Recovery from thermal shutdown
135
125
°C
°C
(1) Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account
separately.
(2) This configuration has not been tested for UL certification.
(3) The thermal shutdown only reacts under overcurrent conditions.
3
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SLVS553E–MARCH 2005–REVISED APRIL 2007
ELECTRICAL CHARACTERISTICS (continued)
0°C ≤ TJ≤ 105°C for the TPS2060/64 and -40°C ≤ TJ≤ 105° for the TPS2068/69, VI(IN) = 5.5 V, IO = 1 A, VI(ENx) = 0 V, or
VI(ENx) = 5.5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN TYP
MAX UNIT
Hysteresis
10
°C
DEVICE INFORMATION
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
NO.
TPS2060 TPS2064
EN1
EN2
EN1
EN2
GND
IN
3
4
-
-
I
I
I
I
Enable input, logic low turns on power switch IN-OUT1
Enable input, logic low turns on power switch IN-OUT2
Enable input, logic high turns on power switch IN-OUT1
Enable input, logic high turns on power switch IN-OUT2
Ground
-
3
4
1
2
8
5
7
6
-
1
2
8
5
7
6
I
Input voltage
OC1
OC2
OUT1
OUT2
O
O
O
O
Overcurrent, open-drain output, active low, IN-OUT1
Overcurrent, open-drain output, active low, IN-OUT2
Power-switch output, IN-OUT1
Power-switch output, IN-OUT2
PowerPad PowerPad
Connect to GND
Functional Block Diagram (TPS2060 and TPS2064)
OC1
Thermal
Deglitch
Sense
GND
EN1
(See Note B)
Current
Driver
Limit
Charge
Pump
(See Note A)
CS
OUT1
OUT2
UVLO
(See Note A)
CS
IN
Charge
Pump
Current
Driver
Limit
OC2
EN2
(See Note B)
Thermal
Sense
Deglitch
A. Current sense.
B. Active low (ENx) for TPS2060. Active high (ENx) for TPS2064.
4
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TPS2068, TPS2069
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SLVS553E–MARCH 2005–REVISED APRIL 2007
DEVICE INFORMATION
Terminal Functions (TPS2068 and TPS2069)
TERMINAL
I/O
DESCRIPTION
NAME
TPS2068
TPS2069
EN
4
-
I
I
Enable input, logic low turns on power switch
Enable input, logic high turns on power switch
Ground
EN
-
4
GND
IN
1
2, 3
1
2, 3
I
Input voltage
OC
OUT
5
5
O
O
Overcurrent, open-drain output, active-low
Power-switch output
6, 7, 8
PowerPad
6, 7, 8
PowerPad
Connect to GND
Functional Block Diagram (TPS2068 and TPS2069)
(See Note A)
CS
OUT
IN
Charge
Pump
Current
EN
Driver
Limit
(See Note B)
OC
UVLO
Deglitch
Thermal
Sense
GND
A. Current sense.
B. Active low (EN) for TPS2068. Active high (EN) for TPS2069.
5
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SLVS553E–MARCH 2005–REVISED APRIL 2007
PARAMETER MEASUREMENT INFORMATION
OUT
t
f
t
r
R
L
C
L
V
90%
10%
O(OUT)
90%
10%
TEST CIRCUIT
50%
90%
50%
50%
50%
V
V
I(EN)
I(EN)
t
off
t
off
t
on
t
on
90%
V
V
O(OUT)
O(OUT)
10%
10%
VOLTAGE WAVEFORMS
Figure 1. Test Circuit and Voltage Waveforms
RL = 5 W,
CL = 1 mF,
VI(EN)
VI(EN)
TA = 25 °C
5 V/div
5 V/div
RL = 5 W,
CL = 1 mF,
TA = 25 °C
VO(OUT)
2 V/div
VO(OUT)
2 V/div
t - Time - 400 ms
Figure 3. Turnoff Delay and Fall Time With 1-µF Load
t - Time - 400 ms
Figure 2. Turnon Delay and Rise Time With 1-µF Load
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SLVS553E–MARCH 2005–REVISED APRIL 2007
PARAMETER MEASUREMENT INFORMATION (continued)
RL = 5 W,
CL = 100 mF,
TA = 25 °C
VI(EN)
VI(EN)
5 V/div
5 V/div
RL = 5 W,
CL = 100 mF,
TA = 25 °C
VO(OUT)
2 V/div
VO(OUT)
2 V/div
t - Time - 400 ms
Figure 4. Turnon Delay and Rise Time With 100-µF Load
t - Time - 400 ms
Figure 5. Turnoff Delay and Fall Time With 100-µF Load
V
= 5 V,
= 3 W,
= 255C
IN
R
T
L
V
A
I(EN)
5 V/div
V
I(EN)
5 V/div
220 mF
470 mF
I
100 mF
O(OUT)
500 mA/div
I
O(OUT)
500 mA/div
t − Time − 500 ms/div
t − Time − 500 ms/div
Figure 6. Short-Circuit Current,
Device Enabled Into Short
Figure 7. Inrush Current With Different
Load Capacitance
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SLVS553E–MARCH 2005–REVISED APRIL 2007
PARAMETER MEASUREMENT INFORMATION (continued)
VO(OCx)
2 V/div
IO(OUT)
1 A/div
t - Time - 2 ms/div
Figure 8. 0.6-Ω Load Connected to Enabled Device
TYPICAL CHARACTERISTICS
TURNON TIME
vs
INPUT VOLTAGE
TURNOFF TIME
vs
INPUT VOLTAGE
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
2
1.9
1.8
1.7
C
R
T
= 100 mF,
= 5 W,
= 255C
C
R
T
= 100 mF,
= 5 W,
= 255C
L
L
L
L
A
A
1.6
1.5
0.1
0
2
3
4
5
6
2
3
4
5
6
V − Input Voltage − V
I
V − Input Voltage − V
I
Figure 9.
Figure 10.
8
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TPS2068, TPS2069
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SLVS553E–MARCH 2005–REVISED APRIL 2007
TYPICAL CHARACTERISTICS (continued)
RISE TIME
vs
INPUT VOLTAGE
FALL TIME
vs
INPUT VOLTAGE
0.25
0.2
0.6
0.5
0.4
C
R
T
= 1 mF,
= 5 W,
= 255C
C
R
T
= 1 mF,
= 5 W,
= 255C
L
L
L
L
A
A
0.15
0.1
0.3
0.2
0.1
0.05
0
0
2
3
4
5
6
2
3
4
5
6
V − Input Voltage − V
I
V − Input Voltage − V
I
Figure 11.
Figure 12.
TPS2060, TPS2064
TPS2068, TPS2069
SUPPLY CURRENT, OUTPUT ENABLED
SUPPLY CURRENT, OUTPUT ENABLED
vs
vs
JUNCTION TEMPERATURE
JUNCTION TEMPERATURE
60
50
40
30
20
70
60
50
40
30
20
10
VI = 5.5 V
V = 5.5 V
I
VI = 5 V
V = 5 V
I
V = 3.3 V
I
V = 2.7 V
I
VI = 2.7 V
VI = 3.3 V
10
0
0
−50
0
50
100
150
-50
0
50
100
150
T − Junction Temperature − 5C
J
TJ - Junction Temperature - °C
Figure 13.
Figure 14.
9
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SLVS553E–MARCH 2005–REVISED APRIL 2007
TYPICAL CHARACTERISTICS (continued)
SUPPLY CURRENT, OUTPUT DISABLED
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
vs
JUNCTION TEMPERATURE
JUNCTION TEMPERATURE
120
100
80
60
40
20
0
0.5
I
O
= 0.5 A
V = 5.5 V
0.45
I
Out1 = 5 V
V = 5 V
I
0.4
0.35
0.3
Out1 = 3.3 V
Out1 = 2.7 V
V = 3.3 V
I
V = 2.7 V
I
0.25
0.2
0.15
0.1
0.05
0
−50
0
50
100
150
−50
0
50
100
150
T − Junction Temperature − 5C
J
T − Junction Temperature − 5C
J
Figure 15.
Figure 16.
SHORT-CIRCUIT OUTPUT CURRENT
UNDERVOLTAGE LOCKOUT
vs
JUNCTION TEMPERATURE
vs
JUNCTION TEMPERATURE
2.6
2.3
UVLO Rising
2.5
2.4
2.26
VI = 3.3 V
VI = 2.7 V
2.3
2.22
2.18
2.2
2.1
UVLO Falling
VI = 5.5 V
VI = 5 V
2
1.9
1.8
1.7
1.6
2.14
2.1
−50
0
50
100
150
-50
0
50
100
150
T − Junction Temperature − 5C
J
TJ - Junction Temperature - °C
Figure 17.
Figure 18.
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SLVS553E–MARCH 2005–REVISED APRIL 2007
TYPICAL CHARACTERISTICS (continued)
CURRENT-LIMIT RESPONSE
vs
PEAK CURRENT
200
150
100
V = 5 V,
I
TA = 25 °C
50
0
0
2.5
5
7.5
10
Peak Current - A
Figure 19.
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SLVS553E–MARCH 2005–REVISED APRIL 2007
APPLICATION INFORMATION
POWER-SUPPLY CONSIDERATIONS
TPS2060
2
Power Supply
2.7 V to 5.5 V
IN
7
6
Load
Load
OUT1
0.1 µF
0.1 µF
0.1 µF
22 µF
22 µF
8
OC1
EN1
OC2
3
5
OUT2
4
EN2
GND
1
Figure 20. Typical Application
A 0.01-µF to 0.1-µF ceramic bypass capacitor between IN and GND, close to the device, is recommended.
Placing a high-value electrolytic capacitor on the output pin(s) is recommended when the output load is heavy.
This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the
output with a 0.01-µF to 0.1-µF ceramic capacitor improves the immunity of the device to short-circuit transients.
OVERCURRENT
A sense FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not
increase the series resistance of the current path. When an overcurrent condition is detected, the device
maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only
if the fault is present long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted before the
device is enabled or before VI(IN) has been applied (see Figure 6). The TPS206x senses the short and
immediately switches into a constant-current output.
In the second condition, a short or an overload occurs while the device is enabled. At the instant the overload
occurs, high currents may flow for a short period of time before the current-limit circuit can react (see Figure 8).
After the current-limit circuit has tripped (reached the overcurrent trip threshold), the device switches into
constant-current mode.
In the third condition, the load has been gradually increased beyond the recommended operating current. The
current is permitted to rise until the current-limit threshold is reached or until the thermal limit of the device is
exceeded. The TPS206x is capable of delivering current up to the current-limit threshold without damaging the
device. Once the threshold has been reached, the device switches into its constant-current mode.
OC RESPONSE
The OCx open-drain output is asserted (active low) when an overcurrent or overtemperature shutdown condition
is encountered after a 10-ms deglitch timeout. The output remains asserted until the overcurrent or
overtemperature condition is removed. Connecting a heavy capacitive load to an enabled device can cause a
momentary overcurrent condition; however, no false reporting on OCx occurs due to the 10-ms deglitch circuit.
The TPS206x is designed to eliminate false overcurrent reporting. The internal overcurrent deglitch eliminates
the need for external components to remove unwanted pulses. OCx is not deglitched when the switch is turned
off due to an overtemperature shutdown.
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SLVS553E–MARCH 2005–REVISED APRIL 2007
APPLICATION INFORMATION (continued)
V+
R
pullup
TPS2060
GND
OC1
OUT1
OUT2
OC2
IN
EN1
EN2
Figure 21. Typical Circuit for the OC Pin
POWER DISSIPATION AND JUNCTION TEMPERATURE
The low on-resistance on the N-channel MOSFET allows the small surface-mount packages to pass large
currents. The thermal resistances of these packages are high compared to those of power packages; it is good
design practice to check power dissipation and junction temperature. Begin by determining the rDS(on) of the
N-channel MOSFET relative to the input voltage and operating temperature. As an initial estimate, use the
highest operating ambient temperature of interest and read rDS(on) from Figure 16. Using this value, the power
dissipation per switch can be calculated by:
PD = rDS(on) × I2
Multiply this number by the number of switches being used. This step renders the total power dissipation from
the N-channel MOSFETs.
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA= Ambient temperature °C
R
θJA = Thermal resistance
PD = Total power dissipation based on number of switches being used.
Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees,
repeat the calculation, using the calculated value as the new estimate. Two or three iterations are generally
sufficient to get a reasonable answer.
THERMAL PROTECTION
Thermal protection prevents damage to the IC when heavy-overload or short-circuit faults are present for
extended periods of time. The TPS206x implements a thermal sensing to monitor the operating junction
temperature of the power distribution switch. In an overcurrent or short-circuit condition, the junction temperature
rises due to excessive power dissipation. Once the die temperature rises to approximately 140°C due to
overcurrent conditions, the internal thermal sense circuitry turns the power switch off, thus preventing the power
switch from damage. Hysteresis is built into the thermal sense circuit, and after the device has cooled
approximately 10°C, the switch turns back on. The switch continues to cycle in this manner until the load fault or
input power is removed. The OCx open-drain output is asserted (active low) when an overtemperature shutdown
or overcurrent occurs.
UNDERVOLTAGE LOCKOUT (UVLO)
An undervoltage lockout ensures that the power switch is in the off state at power up. Whenever the input
voltage falls below approximately 2 V, the power switch is quickly turned off. This facilitates the design of
hot-insertion systems where it is not possible to turn off the power switch before input power is removed. The
UVLO also keeps the switch from being turned on until the power supply has reached at least 2 V, even if the
switch is enabled. On reinsertion, the power switch is turned on, with a controlled rise time to reduce EMI and
voltage overshoots.
13
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TPS2068, TPS2069
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SLVS553E–MARCH 2005–REVISED APRIL 2007
APPLICATION INFORMATION (continued)
UNIVERSAL SERIAL BUS (USB) APPLICATIONS
The universal serial bus (USB) interface is a 12-Mb/s, or 1.5-Mb/s, multiplexed serial bus designed for
low-to-medium bandwidth PC peripherals (e.g., keyboards, printers, scanners, and mice). The four-wire USB
interface is conceived for dynamic attach-detach (hot plug-unplug) of peripherals. Two lines are provided for
differential data, and two lines are provided for 5-V power distribution.
USB data is a 3.3-V level signal, but power is distributed at 5 V to allow for voltage drops in cases where power
is distributed through more than one hub across long cables. Each function must provide its own regulated 3.3 V
from the 5-V input or its own internal power supply.
The USB specification defines the following five classes of devices, each differentiated by power-consumption
requirements:
•
•
•
•
•
Hosts/self-powered hubs (SPH)
Bus-powered hubs (BPH)
Low-power, bus-powered functions
High-power, bus-powered functions
Self-powered functions
SPHs and BPHs distribute data and power to downstream functions. The TPS206x has higher current capability
than required by one USB port; so, it can be used on the host side and supplies power to multiple downstream
ports or functions.
HOST/SELF-POWERED AND BUS-POWERED HUBS
Hosts and SPHs have a local power supply that powers the embedded functions and the downstream ports (see
Figure 22). This power supply must provide from 5.25 V to 4.75 V to the board side of the downstream
connection under full-load and no-load conditions. Hosts and SPHs are required to have current-limit protection
and must report overcurrent conditions to the USB controller. Typical SPHs are desktop PCs, monitors, printers,
and stand-alone hubs.
14
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APPLICATION INFORMATION (continued)
Downstream
USB Ports
D+
D−
V
BUS
0.1 µF
0.1 µF
0.1 µF
22 µF
22 µF
22 µF
GND
D+
D−
V
BUS
GND
Power Supply
3.3 V
5 V
D+
D−
TPS2060
2
8
IN
7
V
BUS
OUT1
0.1 µF
GND
OC1
EN1
OC2
EN2
3
5
USB
Controller
D+
D−
4
6
V
BUS
OUT2
0.1 µF
2 µF
GND
GND
1
D+
D−
V
BUS
0.1 µF
22 µF
GND
D+
D−
V
BUS
0.1 µF
22 µF
GND
Figure 22. Typical Six-Port USB Host / Self-Powered Hub
BPHs obtain all power from upstream ports and often contain an embedded function. The hubs are required to
power up with less than one unit load. The BPH usually has one embedded function, and power is always
available to the controller of the hub. If the embedded function and hub require more than 100 mA on power up,
the power to the embedded function may need to be kept off until enumeration is completed. This can be
accomplished by removing power or by shutting off the clock to the embedded function. Power switching the
embedded function is not necessary if the aggregate power draw for the function and controller is less than one
unit load. The total current drawn by the bus-powered device is the sum of the current to the controller, the
embedded function, and the downstream ports, and it is limited to 500 mA from an upstream port.
15
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APPLICATION INFORMATION (continued)
LOW-POWER BUS-POWERED AND HIGH-POWER BUS-POWERED FUNCTIONS
Both low-power and high-power bus-powered functions obtain all power from upstream ports; low-power
functions always draw less than 100 mA; high-power functions must draw less than 100 mA at power up and
can draw up to 500 mA after enumeration. If the load of the function is more than the parallel combination of
44 Ω and 10 µF at power up, the device must implement inrush current limiting (see Figure 23). With TPS206x,
the internal functions could draw more than 500 mA, which fits the needs of some applications such as motor
driving circuits.
Power Supply
D+
D−
3.3 V
TPS2060
2
8
IN
V
BUS
7
10 µF
0.1 µF
Internal
Function
OUT1
GND
0.1 µF
10 µF
OC1
EN1
OC2
EN2
3
5
USB
Control
6
4
OUT2
GND
Internal
Function
0.1 µF
10 µF
1
Figure 23. High-Power Bus-Powered Function
USB POWER-DISTRIBUTION REQUIREMENTS
USB can be implemented in several ways, and, regardless of the type of USB device being developed, several
power-distribution features must be implemented.
•
•
Hosts/SPHs must:
–
–
Current-limit downstream ports
Report overcurrent conditions on USB VBUS
BPHs must:
–
–
–
Enable/disable power to downstream ports
Power up at <100 mA
Limit inrush current (<44 Ω and 10 µF)
•
Functions must:
–
–
Limit inrush currents
Power up at <100 mA
The feature set of the TPS206x allows them to meet each of these requirements. The integrated current-limiting
and overcurrent reporting is required by hosts and self-powered hubs. The logic-level enable and controlled rise
times meet the need of both input and output ports on bus-powered hubs, as well as the input ports for
bus-powered functions (see Figure 24).
16
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TPS2068, TPS2069
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SLVS553E–MARCH 2005–REVISED APRIL 2007
APPLICATION INFORMATION (continued)
TUSB2040
Hub Controller
SN75240
BUSPWR
Tie to TPS2041 EN Input
Downstream
Ports
Upstream
Port
A
B
C
D
GANGED
DP1
DM1
D +
D −
DP0
DM0
D +
D −
Ferrite Beads
A
B
C
D
GND
5 V
†
GND
SN75240
DP2
DM2
TPS2041B
OC EN
IN OUT
1 µF
33 µF
5-V Power
Supply
DP3
DM3
5 V
D +
D −
A
B
C
D
Ferrite Beads
TPS76333
IN
SN75240
GND
DP4
DM4
0.1 µF
4.7 µF
V
CC
3.3 V
GND
5 V
†
4.7 µF
TPS2060
PWRON1
GND
EN1
OC1
OUT1
OUT2
33 µF
OVRCUR1
PWRON2
OVRCUR2
48-MHz
Crystal
EN2
OC2
XTAL1
XTAL2
D +
D −
IN
0.1 µF
Ferrite Beads
Tuning
Circuit
GND
5 V
†
OCSOFF
GND
33 µF
D +
D −
Ferrite Beads
GND
5 V
†
33 µF
†
USB rev 1.1 requires 120 µF per hub.
Figure 24. Hybrid Self / Bus-Powered Hub Implementation
GENERIC HOT-PLUG APPLICATIONS
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating.
These are considered hot-plug applications. Such implementations require the control of current surges seen by
the main power supply and the card being inserted. The most effective way to control these surges is to limit and
slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply
normally turns on. Due to the controlled rise times and fall times of the TPS206x, these devices can be used to
provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the TPS206x
also ensures that the switch is off after the card has been removed, and that the switch is off during the next
insertion. The UVLO feature insures a soft start with a controlled rise time for every insertion of the card or
module.
17
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TPS2068, TPS2069
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APPLICATION INFORMATION (continued)
PC Board
TPS2060
Power
Supply
Block of
Circuitry
OC1
GND
2.7 V to 5.5 V
IN
OUT1
OUT2
0.1 µF
EN1
EN2
1000 µF
Optimum
OC2
Block of
Circuitry
Overcurrent Response
Figure 25. Typical Hot-Plug Implementation
By placing the TPS206x between the VCC input and the rest of the circuitry, the input power reaches these
devices first after insertion. The typical rise time of the switch is approximately 1 ms, providing a slow voltage
ramp at the output of the device. This implementation controls system surge currents and provides a
hot-plugging mechanism for any device.
DETAILED DESCRIPTION
Power Switch
The power switch is an N-channel MOSFET with a low on-state resistance. Configured as a high-side switch,
the power switch prevents current flow from OUT to IN and IN to OUT when disabled. The power switch
supplies a minimum current of 1.5 A.
Charge Pump
An internal charge pump supplies power to the driver circuit and provides the necessary voltage to pull the gate
of the MOSFET above the source. The charge pump operates from input voltages as low as 2.7 V and requires
little supply current.
Driver
The driver controls the gate voltage of the power switch. To limit large current surges and reduce the associated
electromagnetic interference (EMI) produced, the driver incorporates circuitry that controls the rise times and fall
times of the output voltage.
Enable (ENx)
The logic enable disables the power switch and the bias for the charge pump, driver, and other circuitry to
reduce the supply current. The supply current is reduced to less than 1 µA when a logic high is present on ENx,
or when a logic low is present on ENx. A logic zero input on ENx, or a logic high input on ENx restores bias to
the drive and control circuits and turns the switch on. The enable input is compatible with both TTL and CMOS
logic levels.
Overcurrent (OCx)
The OCx open-drain output is asserted (active low) when an overcurrent or overtemperature condition is
encountered. The output remains asserted until the overcurrent or overtemperature condition is removed. A
10-ms deglitch circuit prevents the OCx signal from oscillation or false triggering. If an overtemperature
shutdown occurs, the OCx is asserted instantaneously.
18
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DETAILED DESCRIPTION (continued)
Current Sense
A sense FET monitors the current supplied to the load. The sense FET measures current more efficiently than
conventional resistance methods. When an overload or short circuit is encountered, the current-sense circuitry
sends a control signal to the driver. The driver in turn reduces the gate voltage and drives the power FET into its
saturation region, which switches the output into a constant-current mode and holds the current constant while
varying the voltage on the load.
Thermal Sense
The TPS206x implements a thermal sensing to monitor the operating temperature of the power distribution
switch. In an overcurrent or short-circuit condition the junction temperature rises. When the die temperature rises
to approximately 140°C due to overcurrent conditions, the internal thermal sense circuitry turns off the switch,
thus preventing the device from damage. Hysteresis is built into the thermal sense, and after the device has
cooled approximately 10 degrees, the switch turns back on. The switch continues to cycle off and on until the
fault is removed. The open-drain false reporting output (OCx) is asserted (active low) when an overtemperature
shutdown or overcurrent occurs.
Undervoltage Lockout
A voltage sense circuit monitors the input voltage. When the input voltage is below approximately 2 V, a control
signal turns off the power switch.
19
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improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
www.ti.com/lpw
Low Power
Wireless
Telephony
www.ti.com/telephony
Video & Imaging
Wireless
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
www.ti.com/lpw
Low Power
Wireless
Telephony
www.ti.com/telephony
Video & Imaging
Wireless
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
14-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TPS2060DGN
ACTIVE
MSOP-
Power
PAD
DGN
8
8
8
8
8
8
8
8
8
8
8
8
8
8
80 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS2060DGNG4
TPS2060DGNR
TPS2060DGNRG4
TPS2064DGN
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
MSOP-
Power
PAD
DGN
DGN
DGN
DGN
DGN
DGN
DGN
DGN
DGN
DGN
DGN
DGN
DGN
80 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
MSOP-
Power
PAD
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
MSOP-
Power
PAD
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
MSOP-
Power
PAD
80 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS2064DGNG4
TPS2064DGNR
TPS2064DGNRG4
TPS2068DGN
MSOP-
Power
PAD
80 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
MSOP-
Power
PAD
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
MSOP-
Power
PAD
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
MSOP-
Power
PAD
80 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS2068DGNG4
TPS2068DGNR
TPS2068DGNRG4
TPS2069DGN
MSOP-
Power
PAD
80 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
MSOP-
Power
PAD
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
MSOP-
Power
PAD
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
MSOP-
Power
PAD
80 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS2069DGNR
MSOP-
Power
PAD
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-May-2007
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-May-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
330
330
330
(mm)
12
TPS2060DGNR
TPS2064DGNR
TPS2068DGNR
TPS2069DGNR
DGN
DGN
DGN
DGN
8
8
8
8
NSE
NSE
NSE
NSE
5.3
5.3
5.3
5.3
3.3
3.3
3.3
3.3
1.3
1.3
1.3
1.3
8
8
8
8
12
12
12
12
NONE
NONE
NONE
NONE
12
12
12
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
TPS2060DGNR
TPS2064DGNR
TPS2068DGNR
TPS2069DGNR
DGN
DGN
DGN
DGN
8
8
8
8
NSE
NSE
NSE
NSE
370.0
370.0
370.0
370.0
355.0
355.0
355.0
355.0
75.0
75.0
55.0
55.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-May-2007
Pack Materials-Page 3
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Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
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