TPS2116DRLR [TI]

1.6V 至 5.5V、40mΩ、2.5A、低 IQ、优先级电源多路复用器 | DRL | 8 | -40 to 125;


型号：	TPS2116DRLR
厂家：	TEXAS INSTRUMENTS
描述：	1.6V 至 5.5V、40mΩ、2.5A、低 IQ、优先级电源多路复用器 \| DRL \| 8 \| -40 to 125 复用器
文件：	总26页 (文件大小：2402K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TPS2116

ZHCSN31A –JANUARY 2021 –REVISED MAY 2021

具有手动和优先级切换功能的TPS2116 1.6V 至5.5V、2.5A 低I_Q电源多路复用

器

1 特性

3 说明

• 输入电压范围：1.6V 至5.5V

• 最大持续电流：2.5A

• 导通电阻：40mΩ（典型值）

• VIN2 待机电流：50nA（典型值）

• 静态电流：1.32uA（典型值）

• 切换模式：

– 优先级模式

– 手动模式

• 受控输出压摆率：

TPS2116 是一款电源多路复用器，具有 1.6V 至 5.5V

的额定电压和 2.5A 的最大额定电流。该器件使用 N 沟

道 MOSFET 在电源之间切换，同时在第一次施加电压

时提供受控的压摆率。

凭借 1.32uA（典型值）的低静态电流和 50nA（典型

值）的低待机电流，TPS2116 适用于其中一个输入由

电池供电的系统。这些低电流延长了电池的使用寿命和

续航时间。

TPS2116 可根据应用配置用于两种不同的切换操作。

自动优先级模式优先选择连接到 VIN1 的电源，在

VIN1 下降时将切换到次级电源 (VIN2)。手动模式允许

用户切换GPIO 或使信号能够在通道之间切换。

– 电压为3.3V 时为1.3ms（典型值）

• VOUT 大于VINx 时实现反向电流阻断

• 热关断

2 应用

器件信息⁽¹⁾

• 备用电池系统

• 电表

• 电机驱动器

• 楼宇自动化

封装尺寸（标称值）

器件型号

TPS2116

封装

SOT (8)

2.1mm x 1.6mm

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

基本应用

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLVSFG1

TPS2116

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ZHCSN31A –JANUARY 2021 –REVISED MAY 2021

Table of Contents

7.4 VINx Collapse Rate...................................................11

7.5 Output Voltage Drop................................................. 12

7.6 Device Functional Modes..........................................12

8 Application and Implementation..................................14

8.1 Application Information............................................. 14

8.2 Typical Application.................................................... 14

9 Power Supply Recommendations................................16

10 Layout...........................................................................17

10.1 Layout Guidelines................................................... 17

10.2 Layout Example...................................................... 17

11 Device and Documentation Support..........................18

11.1 Documentation Support.......................................... 18

11.2 接收文档更新通知................................................... 18

11.3 Trademarks............................................................. 18

11.4 Electrostatic Discharge Caution..............................18

11.5 Glossary..................................................................18

12 Mechanical, Packaging, and Orderable

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 4

6.1 Absolute Maximum Ratings ....................................... 4

6.2 ESD Ratings .............................................................. 4

6.3 Recommended Operating Conditions ........................4

6.4 Thermal Information ...................................................4

6.5 Electrical Characteristics ............................................5

6.6 Switching Characteristics ...........................................7

6.7 Timing Diagrams ........................................................7

6.8 Typical Characteristics................................................8

7 Detailed Description......................................................10

7.1 Overview...................................................................10

7.2 Functional Block Diagram.........................................10

7.3 Feature Description...................................................10

Information.................................................................... 18

4 Revision History

Changes from Revision * (January 2021) to Revision A (May 2021)

Page

• 将状态从“预告信息”更改为“量产数据”....................................................................................................... 1

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5 Pin Configuration and Functions

图5-1. DRL Package 8-Pin SOT Top View

表5-1. Pin Functions

I/O

DESCRIPTION

NAME

GND

NO.

Device ground.

VOUT

VIN1

2, 7

Output power.

Channel 1 input power.

Selects between VIN1 and VIN2. When PR1 is high VIN1 is

selected, and when PR1 is low VIN2 is selected.

PR1

Device is put into Priority mode when MODE is tied to VIN1 and

manual mode when MODE is pulled up to an external voltage.

MODE

VIN2

Channel 2 input power.

Open drain status pin. Pulled low when VIN1 is not being used.

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

MIN

–0.3

MAX

UNIT

V_IN1, V_IN2

V_OUT

Input Voltage

Output Voltage

V_ST, V_PR1

V_MODE

Control Pin Voltage

Maximum Current

2.5

–0.3

I_MAX

Maximum Pulsed Current

Max duration 1ms, Duty cycle of 2%

I_MAX,PLS

Internally

Limited

T_J

Junction temperature

Storage temperature

°C

T_stg

150

–65

(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins⁽¹⁾

±2000

V_(ESD)

Electrostatic discharge

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins⁽²⁾

±500

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

1.6

NOM

MAX

5.5

UNIT

V_IN1,V_IN2

V_OUT

V_ST

Input Voltage

Output Voltage

5.5

V_MODE

V_PR1

Control Pin Voltage

5.5

T_A

Ambient Temperature

105

°C

–40

6.4 Thermal Information

TPS2116

THERMAL METRIC⁽¹⁾

DRL (SOT)

8-PINS

111.5

19.4

UNIT

R_θJA

R_θJC(top)

R_θJB

Ψ_JT

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W

35.8

Junction-to-top characterization parameter

Junction-to-board characterization parameter

1.2

19.1

Ψ_JB

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6.4 Thermal Information (continued)

TPS2116

THERMAL METRIC⁽¹⁾

DRL (SOT)

8-PINS

N/A

UNIT

R_θJC(bot)

Junction-to-case (bottom) thermal resistance

°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Electrical Characteristics

Over operating free-air temperature range and operating voltage range of 1.6V to 5.5V (unless otherwise noted). Typical

specifications are at an input voltage of 3.3V and ambient temperature of 25°C.

PARAMETER

TEST CONDITIONS

T_A

MIN

TYP

MAX UNIT

Power Consumption

25°C

1.1

VIN2 powers VOUT

VIN1 > VIN2 + 0.1V

-40°C to 85°C

-40°C to 105°C

25°C

1.9

I_STBY,

VIN1 Standby Current

VIN1

0.22

1.2

VIN2 powers VOUT

VIN2 > VIN1 + 0.2V

-40°C to 85°C

-40°C to 105°C

25°C

0.31

0.32

VIN1 powers VOUT

VIN2 > VIN1 + 0.2V

-40°C to 85°C

-40°C to 105°C

25°C

2.1

I_STBY,

VIN2 Standby Current

VIN2

0.05

1.32

0.3

VIN1 powers VOUT

VIN1 > VIN2 + 0.1V

-40°C to 85°C

-40°C to 105°C

25°C

0.07

0.09

VIN1 powers VOUT

VIN1 > VIN2 + 0.1V

-40°C to 85°C

-40°C to 105°C

25°C

3.6

4.4

I_{Q, VIN1}VIN1 Quiescent Current

I_{Q, VIN2}VIN2 Quiescent Current

I_SD,VIN1VIN1 Shutdown Current

VIN1 powers VOUT

VIN2 > VIN1 + 0.2V

-40°C to 85°C

-40°C to 105°C

25°C

0.51

0.55

1.35

0.1

VIN2 powers VOUT

VIN2 > VIN1 + 0.2V

-40°C to 85°C

-40°C to 105°C

25°C

3.7

4.5

VIN2 powers VOUT

VIN1 > VIN2 + 0.1V

-40°C to 85°C

-40°C to 105°C

25°C

0.27

0.29

0.1

MODE = 0V, PR1 = 5V

VIN1 > VIN2

VOUT = 0V

-40°C to 85°C

-40°C to 105°C

25°C

1.3

2.9

0.05

MODE = 0V, PR1 = 5V

VIN1 < VIN2

VOUT = 0V

-40°C to 85°C

-40°C to 105°C

2.4

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6.5 Electrical Characteristics (continued)

Over operating free-air temperature range and operating voltage range of 1.6V to 5.5V (unless otherwise noted). Typical

specifications are at an input voltage of 3.3V and ambient temperature of 25°C.

PARAMETER

TEST CONDITIONS

T_A

MIN

TYP

MAX UNIT

25°C

0.05

MODE = 0V, PR1 = 5V

VIN2 > VIN1

VOUT = 0V

-40°C to 85°C

-40°C to 105°C

25°C

1.3

2.9

I_SD,VIN2VIN2 Shutdown Current

0.05

MODE = 0V, PR1 = 5V

VIN2 < VIN1

VOUT = 0V

-40°C to 85°C

-40°C to 105°C

25°C

0.7

2.1

0.001

0.05

0.15

0.01

0.1

Reverse leakage current out of

VINx

V_OUT= 5.5V

V_INx= 0V, V_INy= Open

85°C

105°C

I_REV

25°C

V_OUT= 5.5V

V_INx= 0V, V_INy= Open

Reverse leakage current into VOUT

85°C

105°C

0.25

I_PR1

I_MODE

I_ST

PR1 pin leakage

MODE pin leakage

ST pin leakage

-40°C to 105°C

0.1

0.03

Performance

25°C

0.1

mΩ

VINx = 5V

I_OUT= 200mA

-40°C to 85°C

-40°C to 105°C

25°C

VINx = 3.3V

I_OUT= 200mA

-40°C to 85°C

-40°C to 105°C

25°C

R_ON

On-Resistance

VINx = 1.8V

I_OUT= 200mA

-40°C to 85°C

-40°C to 105°C

25°C

VINx = 1.6V

I_OUT= 200mA

-40°C to 85°C

-40°C to 105°C

V_OL,STStatus pin V_OL

I_ST= 1mA

ST pin pulled high to low

R_ST= 10kΩ

t_ST

Status pin response time

-40°C to 105°C

V_REF

PR1 reference voltage

0.92

1.08

5.5

V_IH,

MODE logic high threshold

MODE

V_IL,

MODE logic low threshold

-40°C to 105°C

0.35

MODE

Protection

Reverse current blocking response

time

t_RCB

VOUT > Selected VIN + 1V

-40°C to 105°C

Reverse current blocking rising

threshold (V_OUT- V_IN)

V_RCB,R

V_RCB,F

I_RCB

Reverse current blocking falling

threshold (V_OUT- V_IN)

Reverse current blocking activation

current

1.4

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6.5 Electrical Characteristics (continued)

Over operating free-air temperature range and operating voltage range of 1.6V to 5.5V (unless otherwise noted). Typical

specifications are at an input voltage of 3.3V and ambient temperature of 25°C.

PARAMETER

TEST CONDITIONS

T_A

MIN

TYP

170

MAX UNIT

TSD

Thermal shutdown

°C

TSD_HYSThermal shutdown hysteresis

6.6 Switching Characteristics

Typical switching characteristics are defined at an ambient temperature of 25°C

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Switchover

t_SW

t_D

Switchover time, VINx = 5 V

Switchover time, VINx = 3.3 V

Switchover time, VINx = 1.8 V

Delay time, VINx = 5 V

6.2

17.7

R_L= 10 Ω, C_L= 10 uF

R_L= 100 Ω, C_L= 10 uF

t_D

Delay time, VINx = 3.3 V

Delay time, VINx = 1.8 V

Soft-start time, VINx = 5 V

Soft-start time, VINx = 3.3 V

Soft-start time, VINx = 1.8 V

1.2

1.4

1.7

1.3

0.9

t_D

t_SS

6.7 Timing Diagrams

图6-1. TPS2116 Timing Diagram

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6.8 Typical Characteristics

1.5

1.55

1.5

-40°C

25°C

85°C

105°C

25°C

85°C

105°C

1.45

1.4

1.45

1.4

1.35

1.3

1.35

1.3

1.25

1.2

1.25

1.2

1.15

1.1

1.15

1.1

1.05

1.5

2.5

VIN1 Voltage (V)

3.5

4.5

5.5

1.5

2.5

VIN2 Voltage (V)

3.5

4.5

5.5

D001

D002

VIN2 = 1.6 V

VOUT = Open

VIN1 = 1.6 V

VOUT = Open

图6-2. VIN1 Quiescent Current vs Input Voltage

图6-3. VIN2 Quiescent Current vs Input Voltage

1.3

1.35

-40°C

25°C

85°C

1.3

1.25

1.2

25°C

85°C

105°C

1.25

105°C

1.2

1.15

1.1

1.15

1.1

1.05

0.95

0.9

0.95

0.9

0.85

1.5

2.5

VIN1 Voltage (V)

3.5

4.5

5.5

1.5

2.5

VIN2 Voltage (V)

3.5

4.5

5.5

D003

D004

VIN2 = 1.6 V

VOUT = Open

VIN1 = 1.6 V

VOUT = Open

图6-4. VIN1 Standby Current vs Input Voltage

图6-5. VIN2 Standby Current vs Input Voltage

0.36

0.4

-40°C

25°C

85°C

-40°C

25°C

85°C

105°C

0.3

0.33

0.35

0.3

105°C

0.27

0.24

0.21

0.18

0.15

0.12

0.09

0.06

0.25

0.2

0.15

0.1

0.05

1.5

2.5

VIN1 Voltage (V)

3.5

4.5

5.5

1.5

2.5

VIN2 Voltage (V)

3.5

4.5

5.5

D005

D006

VIN2 = 1.6 V

VOUT = Open

VIN1 = 1.6 V

VOUT = 0 V

图6-6. VIN1 Shutdown Current vs Input Voltage

图6-7. VIN2 Shutdown Current vs Input Voltage

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6.8 Typical Characteristics (continued)

-40°C

25°C

85°C

105°C

-40°C

25°C

85°C

105°C

1.5

2.5

VIN1 Voltage (V)

3.5

4.5

5.5

1.5

2.5

VIN2 Voltage (V)

3.5

4.5

5.5

D007

D008

I_OUT= 200 mA

图6-8. Channel 1 On-Resistance vs Input Voltage

图6-9. Channel 2 On-Resistance vs Input Voltage

240

160

-40°C

25°C

85°C

105°C

25°C

85°C

105°C

210

180

150

120

140

120

100

1.5

2.5

VOUT Voltage (V)

3.5

4.5

5.5

1.5

2.5

VOUT Voltage (V)

3.5

4.5

5.5

D009

D010

V_INx= 0 V

V_INy= Open

V_INx= 0 V

V_INy= Open

图6-10. Reverse Leakage Current into VOUT

图6-11. Reverse Leakage Current out of VINx

图6-13. Manual Mode Switchover Behavior (MODE = 5 V, R_L=

10 Ω, CL = 10 uF)

图6-12. Output Voltage Drop vs Output Capacitance (MODE = 5

V, R_L= 10 Ω)

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7 Detailed Description

7.1 Overview

The TPS2116 is a power mux device with a voltage rating of 1.6 V to 5.5 V and a maximum current rating of 2.5

A. The device uses N-channel MOSFETs to switch between supplies while providing a controlled slew rate when

voltage is first applied.

The TPS2116 can be configured for two different switchover behaviors depending on the application. Automatic

priority mode prioritizes the supply connected to VIN1 and switches over to the secondary supply (VIN2) when

VIN1 drops. Manual mode allows the user to toggle a GPIO or enable signal to switch between channels.

Due to its low quiescent of 1.32 uA (typical) and standby current of 50 nA (typical), the TPS2116 is ideal for

systems where a battery is connected to one of the inputs. These low currents extend the life and operation of

the battery when in use.

7.2 Functional Block Diagram

7.3 Feature Description

The below sections detail the features of the TPS2116.

7.3.1 Truth Table

The below table shows the expected behavior of the TPS2116. For Priority mode, VIN1 is connected to PR1

through a resistor divider.

MODE

VIN1

VIN2

PR1

VOUT

High

VIN1

(V_PR1> V_REF

)

VIN1

VIN1 through resistor

divider

(Priority mode)

Low

(V_PR1< V_REF

Low

VIN2

≥1.6 V

High

Low

High

Low

VIN1

VIN2

Hi-Z

≥1.6 V

External Bias ≥1 V

(Manual mode)

External Bias ≤0.35

V (Manual mode)

> V_IN2

Low

High

Low

VIN1

VIN2

> V_IN1

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X = do not care

7.3.2 Soft Start

When an input voltage is applied to the TPS2116 and the output voltage is lower than 1 V, the output will be

brought up with soft start to minimize the inrush current due to output capacitance. However, when the device

switches from one power supply to another (switchover) and VOUT > 1 V, soft start is not used to minimize the

output voltage drop. For linear soft start behavior, it is recommended to have an output capacitance of at least

0.1 µF.

7.3.3 Status Indication

The ST pin is an open drain output that should be pulled up to an external voltage for proper operation. When

the TPS2116 is powering the output using VIN1, the ST pin will be pulled high by the external voltage source.

Even if the device is blocking reverse current from VOUT to VIN1, selection of VIN1 will keep the ST pin pulled

high. When the TPS2116 is powering the output using VIN2 or both channels are disabled, the ST pin will be

pulled low. During thermal shutdown, the ST pin will be pulled low regardless of the channel being used.

7.3.4 Reverse Current Blocking

The TPS2116 initiates reverse current blocking (RCB) when the VOUT voltage is externally biased and exceeds

the input voltage supply being used. Once the output voltage is higher than the input voltage by 42mV (V_RCB,R),

the device will shut off. During this state, the leakage into VOUT and out of VIN is defined by I_REV. Once the

voltage difference between the output and input lowers to 17mV (V_RCB,F), the channel will turn back on.

图7-1. Reverse Current Blocking Behavior

If RCB is expected to occur, it is recommended to clamp the output or use a high output capacitance (about

100µF). This will prevent voltage spikes from damaging the device due to output inductance.

7.4 VINx Collapse Rate

The TPS2116 uses the highest voltage supply to power the device. When one supply drops below the other, the

device changes the supply used to power the device. If the supply powering the device drops at a rate faster

than 1 V/10 μs, the other supply must be at 2.5 V or higher to prevent the device from resetting. If the other

supply is lower than 2.5 V, then the device may not be able to switch to the supply quickly enough, and the

device will reset and turn on with soft start timing if VOUT < 1 V.

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7.5 Output Voltage Drop

The output voltage drop during switchover from one supply to another is based on the load capacitance and load

resistance. The stronger the resistive load, the faster the output will discharge. The higher the capacitance on

the output, the less the voltage will drop during switchover.

7.6 Device Functional Modes

The below sections detail the two different configuraiton options for the device.

7.6.1 Priority/Manual Mode

When MODE is tied high, PR1 determines the channel selected. To configure VIN1 as the priority supply,

connect MODE to VIN1 and set the proper threshold through a resistor divider from VIN1 to PR1. To configure

manual selection, pull up MODE to an external supply and follow the truth table. When PR1 is pulled above

V_REF, the voltage on VIN1 is used to power the output, and when it is pulled below V_REF, VIN2 is used to power

the output. The expected behavior for the device is shown in the waveform below.

图7-2. Priority/Manual Mode Switching

When PR1 is toggled, the device implements a break-before-make switchover which shuts off both channels

before turning on the new channel to power the output. This means that for time t_SW, the output is unpowered

and will dip depending on the load current and output capacitance. If the output voltage is greater than the input

supply being switched to, then the device will not turn on the new channel until the output has discharged down

to V_IN+ V_RCBto prevent reverse current flow.

When MODE is pulled low and PR1 is pulled high, the device enters shutdown. Both channels are turned off and

the output is high impedance. When the PR1 pin is pulled low, the higher voltage supply between VIN1 and VIN2

is passed to the output.

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7.6.1.1 Priority Switching

In the case where VIN1 takes priority over VIN2, a resistor divider can be used to set the switchover voltage

threshold. When VIN1 is first applied, PR1 is brought high and VOUT is powered by that input. As VIN1 begins

to drop, the voltage on PR1 is lowered until it crosses the V_REFthreshold. At this point, the device switches over

to VIN2.

7.6.1.2 Manual Switching

For applications where a GPIO pin is used to select which input passes to the output, the GPIO pin can be

directly connected to the PR1 pin when MODE is tied high (≥1V). When the GPIO is pulled high, VIN1 is used,

and when the GPIO pin is pulled low, VIN2 is used.

Manual mode can also disable both channels by pulling the MODE pin low and keeping PR1 high. In this state,

the output of the device is high impedance and the leakage on each input is the shutdown current, I_SD,VINx

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8 Application and Implementation

Note

Information in the following applications sections is not part of the TI component specification, and TI

does not warrant its accuracy or completeness. TI’s customers are responsible for determining

suitability of components for their purposes, as well as validating and testing their design

implementation to confirm system functionality.

8.1 Application Information

This section highlights some of the design considerations when implementing this device in various applications.

8.2 Typical Application

This typical application demonstrates how the TPS2116 device can be used to control inrush current for high

output capacitances.

图8-1. TPS2116 Typical Application Diagram

8.2.1 Design Requirements

For this example, the values below are used as the design parameters.

表8-1. Design Parameters

PARAMETER

VALUE

VIN1 Input Voltage

5 V

Mode

Priority

100 µF

500 mA

Output Capacitance

Maximum Inrush Current

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8.2.2 Detailed Design Procedure

To determine how much inrush current is caused by the output capacitor, use the equation below.

I_INRUSH= C_OUT× V_OUT/ t_SS

(1)

where

• I_INRUSH= amount of inrush current caused by C_OUT

• C_OUT= capacitance on VOUT

• t_SS= output voltage soft start time

• V_OUT= final value of the output voltage

With a final output voltage of 5 V, the expected rise time is 1.7 ms. Using the inrush current equation, the inrush

current caused by a 100-µF capacitance would be 294 mA, well below the 500-mA target.

8.2.3 Application Curves

The below oscilloscope capture shows 5 V being applied to VIN1. The output comes up with slew rate control

and limits the inrush current to below 500 mA.

图8-2. TPS2116 Inrush Current Control

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9 Power Supply Recommendations

The device is designed to operate with a VIN range of 1.6 V to 5.5 V. The VIN power supplies must be well

regulated and placed as close to the device terminals as possible. The power supplies must be able to withstand

all transient load current steps. In most situations, using an input capacitance (C_IN) of 1 μF is sufficient to

prevent the supply voltage from dipping when the switch is turned on. In cases where the power supply is slow to

respond to a large transient current or large load current step, additional bulk capacitance may be required on

the input.

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10 Layout

10.1 Layout Guidelines

For best performance, all traces must be as short as possible. To be most effective, the input and output

capacitors must be placed close to the device to minimize the effects that parasitic trace inductances may have

on normal operation. Using wide traces for VIN1, VIN2, VOUT, and GND helps minimize the parasitic electrical

effects.

10.2 Layout Example

图10-1. TPS2116 Layout Example

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11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

• Basics of Power MUX

• 11 Ways to Protect Your Power Path

11.2 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新进行注册，即可每周接收产品信息更

改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

11.3 Trademarks

所有商标均为其各自所有者的财产。

11.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

11.5 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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重要声明和免责声明

TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没

有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。

这些资源可供使用TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可

将这些资源用于研发本资源所述的TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他TI 知识产权或任何第三方知

识产权。您应全额赔偿因在这些资源的使用中对TI 及其代表造成的任何索赔、损害、成本、损失和债务，TI 对此概不负责。

TI 提供的产品受TI 的销售条款(https:www.ti.com/legal/termsofsale.html) 或ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI

提供这些资源并不会扩展或以其他方式更改TI 针对TI 产品发布的适用的担保或担保免责声明。重要声明

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

PACKAGE OPTION ADDENDUM

www.ti.com

11-Jan-2022

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

TPS2116DRLR

ACTIVE

SOT-5X3

DRL

4000 RoHS & Green

Call TI | SN

Level-1-260C-UNLIM

-40 to 125

2116

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

18-Jul-2021

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

TPS2116DRLR

SOT-5X3

DRL

4000

180.0

8.4

2.75

1.9

0.8

4.0

8.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

18-Jul-2021

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SOT-5X3 DRL

SPQ

Length (mm) Width (mm) Height (mm)

210.0 185.0 35.0

TPS2116DRLR

4000

Pack Materials-Page 2

PACKAGE OUTLINE

DRL0008A

SOT-5X3 - 0.6 mm max height

PLASTIC SMALL OUTLINE

1.3

1.1

PIN 1

ID AREA

6X 0.5

2.2

2.0

2X 1.5

NOTE 3

0.27

0.17

1.7

1.5

0.05

0.00

0.1

C A B

0.05

0.6 MAX

SEATING PLANE

0.05 C

0.18

0.08

SYMM

0.4

0.2

SYMM

4224486/E 12/2021

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, interlead flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4.Reference JEDEC Registration MO-293, Variation UDAD

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EXAMPLE BOARD LAYOUT

DRL0008A

SOT-5X3 - 0.6 mm max height

PLASTIC SMALL OUTLINE

8X (0.67)

SYMM

8X (0.3)

SYMM

6X (0.5)

(R0.05) TYP

(1.48)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:30X

0.05 MIN

AROUND

0.05 MAX

AROUND

EXPOSED

METAL

EXPOSED

METAL

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDERMASK DETAILS

4224486/E 12/2021

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

7. Land pattern design aligns to IPC-610, Bottom Termination Component (BTC) solder joint inspection criteria.

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EXAMPLE STENCIL DESIGN

DRL0008A

SOT-5X3 - 0.6 mm max height

PLASTIC SMALL OUTLINE

8X (0.67)

SYMM

8X (0.3)

SYMM

6X (0.5)

(R0.05) TYP

(1.48)

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

SCALE:30X

4224486/E 12/2021

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

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重要声明和免责声明

TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，

不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担

保。

这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。

这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。

您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成

本、损失和债务，TI 对此概不负责。

TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改

TI 针对 TI 产品发布的适用的担保或担保免责声明。

TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

TPS2116DRLR [TI]

相关型号：

TPS2117

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TPS2120YFPR

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TPS2121RUXR

TPS2121RUXT

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TPS2140

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TPS2140IPWPG4