TPS22924CYZPT [TI]
ULTRA-SMALL, LOW-INPUT-VOLTAGE, LOW rON LOAD SWITCH; 超小型，低输入电压，低rON的负载开关
| 型号： | TPS22924CYZPT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | ULTRA-SMALL, LOW-INPUT-VOLTAGE, LOW rON LOAD SWITCH |
| 文件： | 总17页 (文件大小：1174K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS22924C
www.ti.com
SLVSA52 –NOVEMBER 2009
ULTRA-SMALL, LOW-INPUT-VOLTAGE, LOW rON LOAD SWITCH
Check for Samples: TPS22924C
1
FEATURES
DESCRIPTION
•
•
•
Integrated Single Load Switch
Input Voltage: 0.75 V to 3.6 V
Ultra-Low ON Resistance
The TPS22924C is a small, ultra-low rON load switch
with controlled turn on. The devices contain
N-channel MOSFETs that can operate over an input
voltage range of 0.75 V to 3.6 V. An integrated
charge pump biases the NMOS switch to achieve a
minimum switch ON resistance. The switch is
controlled by an on/off input (ON), which is capable of
interfacing directly with low-voltage control signals.
–
–
–
–
–
rDS(ON) = 5.7 mΩ at VIN = 3.6 V
rDS(ON) = 5.8 mΩ at VIN = 2.5 V
rDS(ON) = 5.9 mΩ at VIN = 1.8 V
rDS(ON) = 6 mΩ at VIN = 1.2 V
rDS(ON) = 8 mΩ at VIN = 0.75 V
A 1250-Ω on-chip load resistor is added for output
quick discharge when switch is turned off. The rise
time of the device is internally controlled to avoid
inrush current. The TPS22924C features a rise time
of 800 µs at 3.6 V.
•
Ultra Small CSP-6 package
0.9 mm x 1.4 mm, 0.5-mm Pitch
•
•
•
•
•
•
2-A Maximum Continuous Switch Current
Low Shutdown Current
The TPS22924C is available in an ultra-small
Low Threshold Control Input
space-saving
6-pin
CSP
package
and
is
Controlled Slew Rate to Avoid Inrush Currents
Quick Output Discharge Transistor
ESD Performance Tested Per JESD 22
characterized for operation over the free-air
temperature range of –40ºC to 85ºC.
TYPICAL APPLICATION
–
5000-V Human-Body Model
(A114-B, Class II)
LOAD
V
V
IN
OUT
SMPS
ON
–
1000-V Charged-Device Model (C101)
TPS22924C
GND
C
R
L
L
C
= 1 µF
IN
OFF
APPLICATIONS
GND
GND
•
•
•
•
•
•
•
•
•
Battery Powered Equipment
Portable Industrial Equipment
Portable Medical Equipment
Portable Media Players
Point Of Sales Terminal
GPS Devices
Digital Cameras
Netbooks / Notebooks
Smartphones
NOTE: SMPS = Switched-mode power supply
Table 1. FEATURE LIST
SLEW RATE
(TYP)
AT 3.6 V
QUICK
OUTPUT
MAXIMUM
OUTPUT
CURRENT
rON (TYP)
AT 3.6 V
ENABLE
DISCHARGE(1)
TPS22924C
5.7 mΩ
800 μs
Yes
2 A
Active high
(1) This feature discharges the output of the switch to ground through a 1250-Ω resistor, preventing the
output from floating. See the Output Pulldown section in Application Information.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
TPS22924C
SLVSA52 –NOVEMBER 2009
www.ti.com
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(3)
_ _ _ 5L _
–40°C to 85°C DSBGA – YZP (0.5-mm pitch)
Tape and reel
TPS22924CYZPR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to
designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
YZP PACKAGE
C
B
A
C
B
A
2
1
1
2
Laser Marking View
Bump View
TERMINALS ASSIGNMENTS (YZP PACKAGE)
C
B
A
GND
VOUT
VOUT
1
ON
VIN
VIN
2
TERMINAL FUNCTIONS
NO.
C1
NAME
GND
ON
DESCRIPTION
Ground
C2
Switch control input, active high. Do not leave floating
Switch output
A1, B1 VOUT
A2, B2 VIN
Switch input, bypass this input with a ceramic capacitor to ground
2
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SLVSA52 –NOVEMBER 2009
BLOCK DIAGRAM
V
IN
Charge
Pump
Control
Logic
ON
Turn-On
V
OUT
Output Discharge
GND
FUNCTION TABLE
ON (Control Signal)
VIN to VOUT
VOUT to GND(1)
L
OFF
ON
H
ON
OFF
(1) See application section Output Pulldown.
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SLVSA52 –NOVEMBER 2009
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ABSOLUTE MAXIMUM RATINGS(1)
MIN
MAX
UNIT
V
VIN
Input voltage range
–0.3
4
VOUT
VON
IMAX
IPLS
TA
Output voltage range
VIN + 0.3
V
Input voltage range
–0.3
4
2
V
Maximum continuous switch current, TA = -40°C to 85°C
Maximum pulsed switch current, 100-µs pulse, 2% duty cycle, TA = -40°C to 85°C
Operating free-air temperature range
Storage temperature range
A
4
A
–40
–65
85
°C
°C
Tstg
150
5000
1000
Human-Body Model (HBM)
Electrostatic discharge protection
ESD
V
Charged-Device Model (CDM)
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
DERATING
FACTOR
ABOVE
BOARD
PACKAGE
RθJC
RθJA
TA < 25°C
TA = 70°C
TA = 85°C
TA = 25°C
- 8.1063
mW/°C
High-K(1)
YZP
17.6°C/W
123.36°C/W
810.63 mW
445.84 mW
324.25 mW
(1) The JEDEC high-K (2s2p) board used to derive this data was a 3- × 3-inch, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on top and bottom of the board.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
3.6
VIN
3.6
3.6
0.6
0.4
UNIT
V
VIN
Input voltage
0.75
VOUT
Output voltage
V
VIN = 2.5 V to 3.6 V
VIN = 0.75 V to 2.5 V
VIN = 2.5 V to 3.6 V
VIN = 0.75 V to 2.5 V
1.2
0.9
VIH
High-level input voltage, ON
V
VIL
Low-level input voltage, ON
Input capacitance
V
CIN
1(1)
μF
(1) See the Input Capacitor section in Application Information.
4
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SLVSA52 –NOVEMBER 2009
ELECTRICAL CHARACTERISTICS
VIN = 0.75 V to 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIN = 2.5 V to 3.6 V
TA
MIN TYP(1)
MAX UNIT
160
60
100
40
IIN
Quiescent current
IOUT = 0, VIN = VON
VIN = 1.2 V to 2.5 V
Full
350 μA
100
VIN = 0.75 V to 1.25 V
OFF-state supply
current
IIN(OFF)
VON = GND, OUT = Open
Full
2
μA
mΩ
Ω
25°C
Full
5.7
5.8
5.9
6
13
17
13
17
14
18
15
21
16
21
19
28
VIN = 3.6 V
VIN = 2.5 V
VIN = 1.8 V
VIN = 1.2 V
VIN = 1.0 V
VIN = 0.75 V
25°C
Full
25°C
Full
rON
ON-state resistance
IOUT = -200 mA
25°C
Full
25°C
Full
7
25°C
Full
8
Output pulldown
resistance(2)
rPD
ION
VIN = 3.3 V, VON = 0, IOUT = 3 mA
VON = 0.9 V to 3.6 V or GND
25°C
Full
1250
1500
ON-state input leakage
current
0.1 μA
(1) Typical values are at VIN = 3.3 V and TA = 25°C.
(2) See Output Pulldown in Application Information.
SWITCHING CHARACTERISTICS
VIN = 3.6 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
840
3
MAX
UNIT
μs
tON
tOFF
tr
Turn-ON time
Turn-OFF time
VOUT rise time
VOUT fall time
RL = 10 Ω, CL = 0.1 μF
RL = 10 Ω, CL = 0.1 μF
RL = 10 Ω, CL = 0.1 μF
RL = 10 Ω, CL = 0.1 μF
μs
800
2.5
μs
tf
μs
SWITCHING CHARACTERISTICS
VIN = 0.9 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
865
20
MAX
UNIT
μs
tON
tOFF
tr
Turn-ON time
Turn-OFF time
VOUT rise time
VOUT fall time
RL = 10 Ω, CL = 0.1 μF
RL = 10 Ω, CL = 0.1 μF
RL = 10 Ω, CL = 0.1 μF
RL = 10 Ω, CL = 0.1 μF
μs
500
5
μs
tf
μs
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SLVSA52 –NOVEMBER 2009
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PARAMETER MEASURMENT INFORMATION
V
IN
V
OUT
ON(A)
C
R
L
L
+
–
OFF
TPS22924C
C
=1 µF
IN
GND
GND
GND
TEST CIRCUIT
1.8 V
V
ON
V
ON
V
/2
V
/2
ON
t
t
ON
r
f
0 V
0 V
t
t
OFF
ON
90%
10%
90%
10%
V
OUT
V
V
OH
OL
V
/2
V
/2
OUT
V
OUT
OUT
t
/t
WAVEFORMS
ON OFF
A. trise and tfall of the control signal is 100 ns.
Figure 1. Test Circuit and tON/tOFF Waveforms
6
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SLVSA52 –NOVEMBER 2009
TYPICAL CHARACTERISTICS
ON-STATE RESISTANCE
vs
ON-STATE RESISTANCE
vs
INPUT VOLTAGE
TEMPERATURE
12
12
10
8
10
VIN = 0.75 V
8
TA = 85°C
TA = 25°C
VIN = 3.3 V
6
6
TA = -40°C
4
4
2
2
0
0
0
-40
-15
10
35
60
85
0.5
1
1.5
2
2.5
3
3.5
4
Temperature (°C)
VIN (V)
INPUT CURRENT, QUIESCENT
INPUT CURRENT, QUIESCENT
vs
vs
INPUT VOLTAGE
TEMPERATURE
180
160
140
120
100
80
70
60
50
40
30
20
10
0
60
40
20
0
0
1
2
3
4
-40
-15
10
35
60
85
VIN (V)
Temperature (°C)
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SLVSA52 –NOVEMBER 2009
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TYPICAL CHARACTERISTICS (continued)
INPUT CURRENT, OFF
INPUT CURRENT, OFF
vs
vs
INPUT VOLTAGE
TEMPERATURE
180
160
140
120
100
80
700
600
500
400
300
200
100
0
60
40
20
0
0
1
2
3
4
-40
-15
10
35
60
85
VIN (V)
Temperature (°C)
ON INPUT THRESHOLD
4
3.5
3
VIN = 3.6 V
VIN = 2.5 V
2.5
2
VIN = 1.8 V
VIN = 1.2 V
1.5
1
VIN = 1.0 V
VIN = 0.75 V
0.5
0
0
0.2 0.4
0.6
0.8
1
1.2
1.4 1.6
1.8
VON (V)
8
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SLVSA52 –NOVEMBER 2009
TYPICAL CHARACTERISTICS (continued)
TURN-ON TIME
TURN-OFF TIME
vs
vs
TEMPERATURE
TEMPERATURE
VIN = 3.6 V, CLOAD = 0.1 µF, RLOAD = 10 Ω
VIN = 3.6 V, CLOAD = 0.1 µF, RLOAD = 10 Ω
1200
1000
800
3.1
3.05
3
2.95
2.9
600
2.85
2.8
400
200
2.75
0
2.7
-40
-15
10
35
60
85
-40
-15
10
35
60
85
Temperature (°C)
Temperature (°C)
RISE TIME
vs
FALL TIME
vs
TEMPERATURE
TEMPERATURE
VIN = 3.6 V, CLOAD = 0.1 µF, RLOAD = 10 Ω
VIN = 3.6 V, CLOAD = 0.1 µF, RLOAD = 10 Ω
1000
900
800
700
600
500
400
300
200
100
2.4
2.38
2.36
2.34
2.32
2.3
2.28
2.26
2.24
2.22
2.2
0
-40
-15
10
35
60
85
-40
-15
10
35
60
85
Temperature (°C)
Temperature (°C)
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TYPICAL CHARACTERISTICS (continued)
TURN-ON TIME
TURN-OFF TIME
vs
vs
TEMPERATURE
TEMPERATURE
VIN = 0.9 V, CLOAD = 0.1 µF, RLOAD = 10 Ω
VIN = 0.9 V, CLOAD = 0.1 µF, RLOAD = 10 Ω
1400
1200
1000
800
600
400
200
0
20
18
16
14
12
10
8
6
4
2
0
-40
-15
10
35
60
85
-40
-15
10
35
60
85
Temperature (°C)
Temperature (°C)
RISE TIME
vs
FALL TIME
vs
TEMPERATURE
TEMPERATURE
VIN = 0.9 V, CLOAD = 0.1 µF, RLOAD = 10 Ω
VIN = 0.9 V, CLOAD = 0.1 µF, RLOAD = 10 Ω
700
600
500
400
300
200
100
0
6
5
4
3
2
1
0
-40
-15
10
35
60
85
-40
-15
10
35
60
85
Temperature (°C)
Temperature (°C)
10
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SLVSA52 –NOVEMBER 2009
TYPICAL CHARACTERISTICS (continued)
RISE TIME
RISE TIME
vs
vs
INPUT VOLTAGE
INPUT VOLTAGE
CLOAD = 0.1 µF, RLOAD = 10 Ω, VON = 1.8 V
CLOAD = 20 µF, RLOAD = 10 Ω, VON = 1.8 V
1400
1200
1000
800
1200
1000
800
600
400
200
0
TA = -40°C
TA = 25°C
TA = -40°C
TA = 25°C
TA = 85°C
TA = 85°C
600
400
200
0
0
0.5
1
1.5
2
2.5
3
3.5
4
0
0.5
1
1.5
2
2.5
3
3.5
4
VIN (V)
VIN (V)
TURN-ON RESPONSE
CIN = 1 µF, CLOAD = 0.1 µF, RLOAD = 10 Ω, VIN = 0.9 V, TA = 25°C
TURN-OFF RESPONSE
CIN = 1 µF, CLOAD = 0.1 µF, RLOAD = 10 Ω, VIN = 0.9 V, TA = 25°C
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TYPICAL CHARACTERISTICS (continued)
TURN-ON RESPONSE
TURN-OFF RESPONSE
CIN = 1 µF, CLOAD = 20 µF, RLOAD = 10 Ω, VIN = 0.9 V, TA = 25°C
CIN = 1 µF, CLOAD = 20 µF, RLOAD = 10 Ω, VIN = 0.9 V, TA = 25°C
TURN-ON RESPONSE
TURN-OFF RESPONSE
CIN = 1 µF, CLOAD = 0.1 µF, RLOAD = 10 Ω, VIN = 3.6 V, TA = 25°C
CIN = 1 µF, CLOAD = 0.1 µF, RLOAD = 10 Ω, VIN = 3.6 V, TA = 25°C
12
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SLVSA52 –NOVEMBER 2009
TYPICAL CHARACTERISTICS (continued)
TURN-ON RESPONSE
TURN-OFF RESPONSE
CIN = 1 µF, CLOAD = 20 µF, RLOAD = 10 Ω, VIN = 3.6 V, TA = 25°C
CIN = 1 µF, CLOAD = 20 µF, RLOAD = 10 Ω, VIN = 3.6 V, TA = 25°C
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SLVSA52 –NOVEMBER 2009
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APPLICATION INFORMATION
ON/OFF Control
The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state so long
as there is no fault. ON is active high and has a low threshold, making it capable of interfacing with low-voltage
signals. The ON pin is compatible with standard GPIO logic threshold. It can be used with any microcontroller
with 1.2-V, 1.8-V, 2.5-V or 3.3-V GPIOs.
Input Capacitor
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-μF ceramic
capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce
the voltage drop.
Output Capacitor
Due to the integral body diode in the PMOS switch, a CIN greater than CL is highly recommended. A CL greater
than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow
through the body diode from VOUT to VIN.
Output Pulldown
The output pulldown is active when the user is turning off the main pass FET. The pulldown discharges the
output rail to approximately 10% of the rail, then the output pulldown is automatically disconnected to optimize
the shutdown current.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal and short-circuit operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic
electrical effects along with minimizing the case to ambient thermal impedance.
14
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PACKAGE OPTION ADDENDUM
www.ti.com
4-Dec-2009
PACKAGING INFORMATION
Orderable Device
TPS22924CYZPR
TPS22924CYZPT
Status (1)
PREVIEW
PREVIEW
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
DSBGA
YZP
6
Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
DSBGA
YZP
6
TBD
Call TI
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(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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Products
Amplifiers
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Logic
Power Mgmt
Microcontrollers
RFID
Telephony
Video & Imaging
Wireless
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
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