TPS22948DCKR [TI]
具有反向电流阻断功能的 5.5V、0.24A、300mΩ 负载开关 | DCK | 6 | -40 to 105;
| 型号： | TPS22948DCKR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有反向电流阻断功能的 5.5V、0.24A、300mΩ 负载开关 | DCK | 6 | -40 to 105 开关 驱动 光电二极管 接口集成电路 |
| 文件： | 总20页 (文件大小：1758K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TPS22948
ZHCSKC2A –MARCH 2019–REVISED OCTOBER 2019
具有反向电流阻断功能的 TPS22948 5.5V、240mA 限流负载开关
1 特性
3 说明
1
•
输入工作电压范围 (VIN)：
2.5V 至 5.5V
TPS22948 器件是一款小型单通道负载开关，能够通
过输出电流限制、反向电流阻断和热关断来提供强大的
故障情况保护。
•
输出电流限制 (ILIMIT)：
240mA（典型值）
开关导通状态由数字输入控制，此输入可与低压控制信
号直接连接。首次加电时，此器件使用智能下拉电阻来
保持 ON 引脚不悬空，直到系统定序完成。故意将该
引脚驱动为高电平 (>VIH) 之后，便会断开智能下拉电
阻，以防止不必要的功率损耗。
•
•
热关断 (TSD)
导通电阻 (RON)：
300mΩ（典型值）
•
•
慢速开通时序可限制浪涌电流（典型值）：
–
开通时间 (tON)：
6.6mV/μs 时为 820us
TPS22948 采用标准 SC-70 封装，工作温度范围为
–40°C 至 125°C。
常开的反向电流阻断 (RCB)：
–
导通状态激活电流 (IRCB)：
–200mA（典型值）
器件信息(1)
器件型号
TPS22948
封装
SC-70 (6)
封装尺寸（标称值）
•
•
故障指示 (FLT)
2.1mm x 2.0mm
智能 ON 引脚下拉电阻 (RPD,ON)：
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
–
–
ON VIH (ION)：25nA（最大值）
ON VIL (RPD,ON)：500kΩ（典型值）
•
低功耗：
简化原理图
–
–
导通状态 (IQ)：50uA（典型值）
关断状态 (ISD)：0.3uA（典型值）
IN
+
RL
H
VIN
CIN
RFLT
œ
CL
2 应用
L
ON
Fault
•
•
•
•
•
个人电子产品
机顶盒
GND
TPS22948
HDMI 输出端口
笔记本电脑、台式计算机
扩展坞
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLVSEZ7
TPS22948
ZHCSKC2A –MARCH 2019–REVISED OCTOBER 2019
www.ti.com.cn
目录
8.2 Functional Block Diagram ......................................... 7
8.3 Feature Description................................................... 7
8.4 Device Functional Modes.......................................... 9
Application and Implementation ........................ 10
9.1 Application Information............................................ 10
9.2 Typical Application ................................................. 10
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics.......................................... 5
6.7 Typical Characteristics ............................................. 6
Parameter Measurement Information .................. 6
7.1 Timing Waveform Diagram ....................................... 6
Detailed Description .............................................. 7
8.1 Overview ................................................................... 7
9
10 Power Supply Recommendations ..................... 12
11 Layout................................................................... 13
11.1 Layout Guidelines ................................................. 13
11.2 Layout Example .................................................... 13
12 器件和文档支持 ..................................................... 14
12.1 接收文档更新通知 ................................................. 14
12.2 支持资源................................................................ 14
12.3 商标....................................................................... 14
12.4 静电放电警告......................................................... 14
12.5 Glossary................................................................ 14
13 机械、封装和可订购信息....................................... 14
7
8
4 修订历史记录
Changes from Original (March 2019) to Revision A
Page
•
•
将“预告信息”更改成了“生产数据” ............................................................................................................................................ 1
首次公开发布 .......................................................................................................................................................................... 1
2
Copyright © 2019, Texas Instruments Incorporated
TPS22948
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ZHCSKC2A –MARCH 2019–REVISED OCTOBER 2019
5 Pin Configuration and Functions
DCK Package
6-Pin SC-70
Top View
Pin Functions
PIN
I/O
DESCRIPTION
NO.
1
NAME
IN
I
–
I
Switch input
2
GND
ON
Device ground
3
Active high switch control input. Do not leave floating.
No connect pin, leave floating or GND
4
N/C
–
O
O
5
FLT
OUT
Open-drain output, pulled low during thermal shutdown or reverse current-conditions.
Switch output
6
Copyright © 2019, Texas Instruments Incorporated
3
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ZHCSKC2A –MARCH 2019–REVISED OCTOBER 2019
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
V
VIN
Maximum Input Voltage Range
Maximum Output Voltage Range
Maximum ON Pin Voltage Range
Maximum FLT Pin Voltage
–0.3
6
6
6
6
VOUT
VON
VFLT
IMAX
TJ
–0.3
V
–0.3
V
–0.3
V
Maximum Output Current
Internally Limited
Internally Limited
–65
A
Junction temperature
°C
°C
°C
TSTG
TLEAD
Storage temperature
150
300
Maximum Lead Temperature (10 s soldering time)
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per
±2000
ANSI/ESDA/JEDEC JS-001, allpins(1)
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC
specificationJESD22-C101, all pins(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less is possible with the necessary precautions. Pins listed may actually have higher performance.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
2.5
0
TYP
MAX
5.5
UNIT
V
VIN
Input Voltage Range
VOUT
VIH
Output Voltage Range
ON Pin High Voltage Range
ON Pin Low Voltage Range
Output Current Range
Output Capacitance
5.5
V
1
5.5
V
VIL
0
0.35
130
V
IOUT
COUT
TA
0
mA
nF
°C
(1)
18
Ambient temperature
–40
125
(1) The recommended output capacitance is the capacitance placed next to the output of the device that will provide optimal hard short
performance across different load cable lengths.
6.4 Thermal Information
TPS22948
THERMAL METRIC(1)
DCK (SC-70)
6 PINS
213.5
UNIT
RθJA
RθJC(top)
RθJB
ΨJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
148.8
66.9
Junction-to-top characterization parameter
Junction-to-board characterization parameter
50.0
ΨJB
66.7
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
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ZHCSKC2A –MARCH 2019–REVISED OCTOBER 2019
6.5 Electrical Characteristics
Unless otherwise noted, the characteristics in the following table applies at 5 V with a load of CL = 0.1 µF, RL = 100 Ω. Typical
Values are at 25°C.
PARAMETER
Input Supply (VIN)
TEST CONDITIONS
MIN TYP MAX UNIT
IQ, VIN
VIN Quiescent Current
VIN Shutdown Current
VON ≥ VIH, VOUT = Open
-40°C to 125°C
-40°C to 125°C
50
85 µA
µA
ISD, VIN
VON ≤ VIL, VOUT = GND
0.3
5
ON-Resistance (RON)
25°C
300 350
RON
ON-State Resistance
IOUT = -50 mA
-40°C to 85°C
-40°C to 125°C
450 mΩ
500
Output Current Limit (ILIM)
ILIM
Output Current Limit
-40°C to 125°C
-40°C to 125°C
130 240 350 mA
Current Limit Response
Time
tLIM
Output hard short (IOUT > ILIM
)
2
µs
Reverse Current Blocking (RCB)
Activation Threshold
VRCB
VOUT Rising; VOUT > VIN
VOUT Falling; VOUT > VIN
VOUT = VIN + 1V
-40°C to 125°C
-40°C to 125°C
-40°C to 125°C
60
44
3
mV
mV
µs
Release Threshold
tRCB
Response Time
VON ≤ VIL
VOUT - VIN = 1V
VON ≤ VIL
VOUT - VIN = 1V
RCB Quiescent Current
(VIN)
IQ, RCB
-40°C to 125°C
15 µA
Fault Indication (FLT)
VOL, FLT
tDG,FLT
IFLT
Output Low Voltage
IFLT = 1 mA
VON ≥ VIH
VON ≤ VIL
-40°C to 125°C
-40°C to 125°C
-40°C to 125°C
0.1
V
Fault Delay Time
Off State Leakage
10
µs
25 nA
Enable Pin (ON)
Smart Pull Down
Resistance
RPD, ON
ION
VON ≤ VIL
VON ≥ VIH
-40°C to 85°C
-40°C to 125°C
500
kΩ
ON Pin Leakage
25 nA
Thermal Shutdown (TSD)
Rising
N/A
N/A
130 150 170 °C
100 120 140 °C
TSD Thermal Shutdown
Falling (Hysteresis)
6.6 Switching Characteristics
Unless otherwise noted, the typical characteristics in the following table applies at 5 V and 25°C
PARAMETER
Turn ON Time
TEST CONDITIONS
CL = 18 nF, RL = 100 Ω
CL = 18 nF, RL = 100 Ω
CL = 18 nF, RL = 100 Ω
CL = 18 nF, RL = 100 Ω
CL = 18 nF, RL = 100 Ω
MIN
TYP
820
600
6.6
MAX
UNIT
µs
tON
tR
Output Rise Time
Turn ON Slew Rate
Turn OFF Time
µs
SRON
tOFF
tFALL
mV/µs
µs
15
Output Fall Time
6.9
µs
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ZHCSKC2A –MARCH 2019–REVISED OCTOBER 2019
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6.7 Typical Characteristics
VIN = 5 V
TA = 25 °C
VOUT = 0 V
VIN = 5 V
TA = 25 °C
COUT = 18 nF
图 1. Startup Into Short on VOUT
图 2. Hot Short on VOUT with a 1ft Cable
VIN = 5 V
TA = 25 °C
COUT = 18 nF
VIN = 5 V
TA = 25 °C
图 3. Hot Short on VOUT with a 3ft Cable
图 4. Reverse Current Blocking Behavior
7 Parameter Measurement Information
7.1 Timing Waveform Diagram
VIH
VII
tON
tOFF
VON
tRISE
tFALL
90%
tDELAY
90%
VOUT
10%
SRON
10%
Hi-Z
FLT
图 5. Timing Waveforms
6
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TPS22948
www.ti.com.cn
ZHCSKC2A –MARCH 2019–REVISED OCTOBER 2019
8 Detailed Description
8.1 Overview
The TPS22948 device is a 5.5-V, 240-mA current limited load switch in a 6-pin SC-70 package. The 300-mΩ P-
channel FET is used to switch power from input to output with minimal voltage drop across the device.
The TPS22948 device has a slow slew rate which helps reduce or eliminate power supply droop because of
large inrush currents. During shutdown, the device has very low leakage currents, thereby reducing unnecessary
leakages for downstream modules during standby. Integrated control logic, and driver eliminates the need for any
external components which reduces solution size and bill of materials (BOM) count.
The TPS22948 load switch also provides protection features such as reverse current blocking, output current
limiting and thermal shutdown.
8.2 Functional Block Diagram
Reverse
Current
Blocking
Current
Limiting
IN
OUT
Control
Logic
ON
Driver
Smart
Pull
Down
FLT
GND
8.3 Feature Description
8.3.1 On and Off Control
The ON pin controls the state of the switch. The ON pin is compatible with standard GPIO logic threshold so it
can be used in a wide variety of applications. When power is first applied to VIN, a smart pull down is used to
keep the ON pin from floating until system sequencing is complete. Once the ON pin is deliberately driven high
(≥VIH), the smart pull down is disconnected to prevent unnecessary power loss. See 表 1 when the ON pin smart
pull down is active.
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7
TPS22948
ZHCSKC2A –MARCH 2019–REVISED OCTOBER 2019
www.ti.com.cn
表 1. Smart-ON Pull Down
VON
Pull Down
Connected
≤ VIL
≥ VIH
Disconnected
8.3.2 Fault Indication (FLT)
The FLT pin is an open drain output that acts as a status indication for the device. It is pulled low during thermal
shutdown or reverse-current events. The behavior of the FLT pin is shown in 图 6.
8.3.3 Current Limiting (VSC
)
The TPS22948 responds to overcurrent conditions by limiting its output current to the ILIM level shown in 图 6.
1
ON
0
Auto Restart
Soft Short on VOUT
Into Short
ILIM
IOUT
0
tILM
VINx
OUT
0
VFLT
FLT
0
tDG,FLT
TSD
TSDHYS
TJ
TJ
Time
图 6. TPS22948 Current Limiting Behavior
When an overcurrent condition is detected, the device maintains a constant output current and reduces the
output voltage accordingly. Two possible overload conditions can occur.
The first condition is when a short circuit or partial short circuit is present on the output and the ON pin is toggled
high, turning the device on. The output voltage is held near zero potential with respect to ground and the
TPS22948 ramps the output current to ILIM. The TPS22948 device will limit the current to ILIM until the overload
condition is removed or the internal junction temperature of the device reaches thermal shutdown and the device
turns itself off. The device remains off until the junction temperature has lowered by TSDHYS, and the device will
turn itself back on. This will cycle until the overload condition is removed.
8
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TPS22948
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ZHCSKC2A –MARCH 2019–REVISED OCTOBER 2019
The second condition is when a short circuit, partial short circuit, or transient overload occurs after the device has
been fully powered on. The device responds to the overcurrent condition within time tLIM (see 图 7), and before
this time, the current is able to exceed ILIM. In the case of a fast transient, the current-sense amplifier is
overdriven and momentarily disables the internal power FET. The current-sense amplifier recovers and limits the
output current to ILIM. Similar to the previous case, the TPS22948 limits the current to ILIM until the overload
condition is removed or the internal junction temperature of the device reaches thermal shutdown and begins
thermally cycling on and off.
图 7. Transient Current Limit Waveform
8.3.4 Reverse Current Blocking (RCB)
In a scenario where the device is enabled and VOUT is greater than VIN, there is potential for reverse
current to flow through the pass FET or the body diode. When the reverse current threshold is exceeded
(about 200 mA), there is a delay time (tRCB) before the switch turns off to stop the current flow. The switch
will remain off and block reverse current as long as the reverse voltage condition exists. Once VOUT has
dropped below the release voltage threshold (VRCB) the device will turn back on. When the ON pin is pulled
low, the device will constantly block reverse current.
8.4 Device Functional Modes
表 2 describes the connection of the VOUT pin depending on the state of the ON pin.
表 2. VOUT Connection
ON
L
TPS22919 VOUT
Open
VIN
H
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9
TPS22948
ZHCSKC2A –MARCH 2019–REVISED OCTOBER 2019
www.ti.com.cn
9 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
This section highlights some of the design considerations when implementing this device in various applications.
9.2 Typical Application
This typical application demonstrates how the TPS22948 device can be used to power downstream modules.
IN
+
RL
H
VIN
CIN
RFLT
œ
CL
L
ON
Fault
GND
TPS22948
图 8. Typical Application Schematic
9.2.1 Design Requirements
For this design example, use the values listed in 表 3 as the design parameters:
表 3. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Input Voltage (VIN
)
5 V
1 kΩ
Load Current / Resistance (RL)
Load Capacitance (CL)
10 µF
100 mA
Maximum Inrush Current (IINRUSH
)
Although the load capacitance is 10 µF, this is assumed to be at the end of a cable or closer to the load. An
18nF capacitance close to the output of the device is recommended for optimal performance during short circuit
conditions.
9.2.2 Detailed Design Procedure
9.2.2.1 Limiting Inrush Current
Use 公式 1 to find the maximum output capacitance for a given inrush current requirement.
CL = IINRUSH × tR ÷ (0.8 × VIN)
where
•
•
•
CL = capacitance on VOUT (μF)
IINRUSH = maximum acceptable inrush current (A)
tR = rise time of the TPS22948 (μs)
10
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TPS22948
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ZHCSKC2A –MARCH 2019–REVISED OCTOBER 2019
•
VIN = input voltage (V)
(1)
Based on 公式 1, the maximum output capacitance that limits the inrush current to 100 mA is 12.5 μF. Therefore,
the desired 10-μF load capacitance will not exceed the inrush current design requirement during turn on.
9.2.3 Application Curves
The below scope shot shows the inrush current generated from a 10-μF capacitance on the output.
A.
VIN = 5 V
CL = 10 μF
图 9. TPS22948 Inrush Current Control with Slow Rise Time
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10 Power Supply Recommendations
The device is designed to operate with a VIN range of 2.5 V to 5.5 V. The VIN power supply must be well
regulated and placed as close to the device terminal as possible. The power supply must be able to withstand all
transient load current steps. In most situations, using an input capacitance (CIN) of 1 μF is sufficient to prevent
the supply voltage from dipping when the switch is turned on. In cases where the power supply is slow to
respond to a large transient current or large load current step, additional bulk capacitance may be required on
the input. A 18nF capacitance close to the output of the device is recommended for optimal performance during
short circuit conditions.
12
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TPS22948
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ZHCSKC2A –MARCH 2019–REVISED OCTOBER 2019
11 Layout
11.1 Layout Guidelines
For best performance, all traces must be as short as possible. To be most effective, the input and output
capacitors must be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects.
11.2 Layout Example
1
2
6
5
OUT
FLT
IN
GND Via
GND
To GPIO
ON
3
4
N/C
To GPIO
图 10. Recommended Board Layout
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12 器件和文档支持
12.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com. 上的器件产品文件夹。单击右上角的通知我进行注册，即可每周接收产品
信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
12.2 支持资源
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
14
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许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等，TI对此概不负责，并且您须赔偿由此对TI 及其代表造成的损害。
TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
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Copyright © 2020 德州仪器半导体技术（上海）有限公司
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS22948DCKR
SC70
DCK
6
3000
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2019
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SC70 DCK
SPQ
Length (mm) Width (mm) Height (mm)
180.0 180.0 18.0
TPS22948DCKR
6
3000
Pack Materials-Page 2
重要声明和免责声明
TI 均以“原样”提供技术性及可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资
源，不保证其中不含任何瑕疵，且不做任何明示或暗示的担保，包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示
担保。
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任：(1) 针对您的应用选择合适的TI 产品；(2) 设计、
验证并测试您的应用；(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更，恕不另行通知。TI 对您使用
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源，也不提供其它TI或任何第三方的知识产权授权
许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等，TI对此概不负责，并且您须赔偿由此对TI 及其代表造成的损害。
TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
邮寄地址：上海市浦东新区世纪大道 1568 号中建大厦 32 楼，邮政编码：200122
Copyright © 2020 德州仪器半导体技术（上海）有限公司
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