TPS22998 [TI]

5.5V、10A、导通电阻为 4mΩ 的负载开关;


型号：	TPS22998
厂家：	TEXAS INSTRUMENTS
描述：	5.5V、10A、导通电阻为 4mΩ 的负载开关开关
文件：	总22页 (文件大小：1650K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TPS22998

ZHCSMV6A –OCTOBER 2021 –REVISED DECEMBER 2021

TPS22998 5.5V、10A、导通电阻为4mΩ 的负载开关

1 特性

3 说明

• 输入电压范围(V_IN)：0.2 V 至5.5V

• 偏置电压范围：2.2 V 至5.5V

• 最大持续电流：10A

• 导通电阻(R_ON)：4mΩ（典型值）

• 带三态引脚的可调压摆率

• 快速输出放电(QOD)：50Ω

• 热关断

TPS22998 是一款单通道负载开关，具有可配置上升时

间，从而可更大限度地降低浪涌电流。此器件包含一个

可在 0.2V 至 5.5V 输入电压范围内运行的 N 沟道

MOSFET，并且支持10A 的最大连续电流。

开关可由一个打开和关闭输入 (ON) 控制，此输入可与

低压控制信号 (V_IH= 0.9V) 直接连接。TPS22998 在开

关关闭时具有固定快速输出放电，将输出下拉至接地。

• 低功耗：

TPS22998 采用 10 引脚 WQFN 封装 (RYZ)（1.5mm

× 2mm，间距为 0.5mm）并可在自然通风条件下的 –

40°C 至+105°C 温度范围运行。

– 导通状态(I_Q)：15μA（典型值）

– 关闭状态(I_SD)：3μA（典型值）

2 应用

器件信息

封装⁽¹⁾

• 固态硬盘

器件型号

TPS22998

封装尺寸（标称值）

• PC 和笔记本电脑

• 工业PC

• 光学模块

WQFN (10)

1.5mm × 2.0mm

(1) 要了解所有可用封装，请参见产品说明书末尾的可订购产品附

录。

TPS22998 典型应用

TPS22998 方框图

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLVSG05

TPS22998

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ZHCSMV6A –OCTOBER 2021 –REVISED DECEMBER 2021

Table of Contents

7.2 Functional Block Diagram......................................... 11

7.3 Feature Description...................................................11

7.4 Device Functional Modes..........................................12

8 Application and Implementation..................................13

8.1 Application Information............................................. 13

8.2 Typical Application.................................................... 13

9 Power Supply Recommendations................................15

10 Layout...........................................................................15

10.1 Layout Guidelines................................................... 15

10.2 Layout Example...................................................... 15

11 Device and Documentation Support..........................16

11.1 接收文档更新通知................................................... 16

11.2 支持资源..................................................................16

11.3 Trademarks............................................................. 16

11.4 Electrostatic Discharge Caution..............................16

11.5 术语表..................................................................... 16

12 Mechanical, Packaging, and Orderable

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 4

6.1 Absolute Maximum Ratings........................................ 4

6.2 ESD Ratings............................................................... 4

6.3 Recommended Operating Conditions.........................4

6.4 Thermal Information....................................................4

6.5 Electrical Characteristics (VBIAS = 5 V)..................... 5

6.6 Electrical Characteristics (VBIAS = 3.3 V).................. 5

6.7 Electrical Characteristics (VBIAS = 2.2 V).................. 6

6.8 Switching Characteristics (VBIAS = 2.2 V to 5 V).......7

6.9 Timing Diagram...........................................................8

6.10 Typical Characteristics..............................................9

7 Detailed Description......................................................11

7.1 Overview................................................................... 11

Information.................................................................... 17

4 Revision History

注：以前版本的页码可能与当前版本的页码不同

Changes from Revision * (October 2021) to Revision A (December 2021)

Page

• 将数据表状态从“预告信息”更改为“量产数据”.............................................................................................1

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5 Pin Configuration and Functions

图5-1. TPS22998 RYZ Package, 10-Pin WQFN (Top View)

表5-1. Pin Functions

I/O⁽¹⁾

DESCRIPTION

NAME

NO.

VBIAS

Device bias supply

VIN

GND

VOUT

2, 3, 4

Switch input

6, 7, 8

Device ground

Switch output

Slew rate control –can be pulled up, left floating, or tie to ground

Enable pin

(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

MIN

–0.3

MAX

UNIT

V_IN

Input Voltage

V_BIAS

V_ON, VCT

I_MAX

Bias Voltage

Control Pin Voltage

Maximum Current

Internally

Limited

T_J

Junction temperature

Storage temperature

°C

T_stg

150

–65

(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If

used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001⁽¹⁾

±2000

V_(ESD)

Electrostatic discharge

Charged device model (CDM), per ANSI/ESDA/

JEDEC JS-002⁽²⁾

±1000

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

0.2

2.2

NOM

MAX

5.5

UNIT

V_IN

Input Voltage

V_BIAS

V_CT

T_A

Bias Voltage

5.5

Control Pin Voltage

Ambient Temperature

5.5

105

°C

–40

6.4 Thermal Information

TPS22998

THERMAL METRIC ⁽¹⁾

RYZ (WQFN)

10 PINS

84.1

UNIT

R_θJA

R_θJC(top)

R_θJB

Ψ_JT

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W

77.5

16.6

Junction-to-top characterization parameter

Junction-to-board characterization parameter

4.0

Y_JB

16.0

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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6.5 Electrical Characteristics (VBIAS = 5 V)

Over operating free-air temperature range (unless otherwise noted). Typical values are at T_A= 25°C.

PARAMETER

TEST CONDITIONS

T_A

MIN

TYP

MAX UNIT

Power Consumption

25°C

I_SD,VBIA

VBIAS Shutdown Current

ON = 0 V

–40°C to 85°C

–40°C to 105°C

25°C

I_Q,VBIASVBIAS Quiescent Current

I_SD,VINVIN Shutdown Current

ON > V_IH

–40°C to 85°C

–40°C to 105°C

25°C

0.1

ON = 0 V

–40°C to 85°C

–40°C to 105°C

I_ON

ON pin leakage

ON = VBIAS

0.1

Performance

25°C

mΩ

R_ON

On-Resistance

VIN = 0.2 V to 5 V

–40°C to 85°C

–40°C to 105°C

V_IH

V_IL

Turn on threshold, rising

Turn off threshold, falling

0.765

0.595

0.9

0.7

1.035

0.805

V_ON,

ON pin hysteresis

0.2

–40°C to 105°C

HYST

t_ON,DEG

On pin deglitch time

LITCH

25°C

R_QOD

QOD Resistance

VOUT = VIN

–40°C to 105°C

Protection

TSD

Thermal Shutdown

130

150

180

°C

TSD_HYSThermal Shutdown Hysteresis

6.6 Electrical Characteristics (VBIAS = 3.3 V)

Over operating free-air temperature range (unless otherwise noted). Typical values are at T_A= 25°C.

PARAMETER

TEST CONDITIONS

T_A

MIN

TYP

MAX UNIT

Power Consumption

25°C

I_SD,VBIA

VBIAS Shutdown Current

ON = 0 V

–40°C to 85°C

–40°C to 105°C

25°C

0.1

I_Q,VBIASVBIAS Quiescent Current

I_SD,VINVIN Shutdown Current

ON > V_IH

–40°C to 85°C

–40°C to 105°C

25°C

ON = 0 V

–40°C to 85°C

–40°C to 105°C

I_ON

ON pin leakage

ON = VBIAS

Performance

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6.6 Electrical Characteristics (VBIAS = 3.3 V) (continued)

Over operating free-air temperature range (unless otherwise noted). Typical values are at T_A= 25°C.

PARAMETER

TEST CONDITIONS

T_A

MIN

TYP

MAX UNIT

25°C

mΩ

R_ON

On-Resistance

VIN = 0.2 V to 3.3 V

–40°C to 85°C

–40°C to 105°C

mΩ

V_IH

V_IL

ON pin turn on threshold, rising

ON pin turn off threshold, falling

0.765

0.595

0.9

0.7

1.035

0.805

V_ON,

ON pin hysteresis

0.2

–40°C to 105°C

HYST

t_ON,DEG

On pin deglitch time

6.5

LITCH

25°C

R_QOD

QOD Resistance

VOUT = VIN

–40°C to 105°C

Protection

TSD

Thermal Shutdown

130

150

180

°C

TSD_HYSThermal Shutdown Hysteresis

6.7 Electrical Characteristics (VBIAS = 2.2 V)

Over operating free-air temperature range (unless otherwise noted). Typical values are at T_A= 25°C.

PARAMETER

TEST CONDITIONS

T_A

MIN

TYP

MAX UNIT

Power Consumption

25°C

I_SD,VBIA

VBIAS Shutdown Current

ON = 0 V

–40°C to 85°C

–40°C to 105°C

25°C

I_Q,VBIASVBIAS Quiescent Current

I_SD,VINVIN Shutdown Current

ON > V_IH

–40°C to 85°C

–40°C to 105°C

25°C

0.1

ON = 0 V

–40°C to 85°C

–40°C to 105°C

I_ON

ON pin leakage

ON = VBIAS

0.1

4.3

Performance

25°C

mΩ

R_ON

On-Resistance

VIN = 0.2 V to 2.2 V

–40°C to 85°C

–40°C to 105°C

V_IH

V_IL

ON pin turn on threshold, rising

ON pin turn off threshold, falling

0.765

0.595

0.9

0.7

1.035

0.805

V_ON,

ON pin hysteresis

0.2

–40°C to 105°C

HYST

t_ON,DEG

On pin deglitch time

4.5

6.5

LITCH

25°C

R_QOD

QOD Resistance

VOUT = VIN

–40°C to 105°C

Protection

TSD Thermal Shutdown

130

150

180

°C

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Over operating free-air temperature range (unless otherwise noted). Typical values are at T_A= 25°C.

PARAMETER

TEST CONDITIONS

T_A

MIN

TYP

MAX UNIT

TSD_HYSThermal Shutdown Hysteresis

°C

6.8 Switching Characteristics (VBIAS = 2.2 V to 5 V)

Over operating free-air temperature range (unless otherwise noted), CIN=47uF. Typical values are at T_A= 25°C, C_L= 0.1μF,

and a current load of 1mA.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VIN = 5 V

t_ON

Turn ON time

CT = Open

CT = V_BIAS

CT = GND

CT = Open

CT = V_BIAS

CT = GND

CT = Open

CT = V_BIAS

CT = GND

CT = Open

250

1870

3728

225

1838

3697

t_ON

Turn ON time

Rise time

t_ON

t_RISE

t_D

Rise time

Delay time

Fall time

t_D

t_FALL

t_OFF

Turn OFF time

VIN = 3.3 V

t_ON

t_RISE

t_D

Turn ON time

CT = Open

CT = V_BIAS

CT = GND

CT = Open

CT = V_BIAS

CT = GND

CT = Open

CT = V_BIAS

CT = GND

CT = Open

175

1261

3586

150

1232

2478

Turn ON time

Rise time

Delay time

Fall time

t_D

t_FALL

t_OFF

Turn OFF time

VIN = 1.8 V

t_ON

t_RISE

t_D

Turn ON time

CT = Open

CT = V_BIAS

CT = GND

CT = Open

CT = V_BIAS

CT = GND

CT = Open

CT = V_BIAS

CT = GND

CT = Open

102

664

1302

Turn ON time

Rise time

634

1272

Rise time

Delay time

Fall time

t_D

t_FALL

t_OFF

Turn OFF time

VIN = 0.6 V

t_ONTurn ON time

CT = Open

CT = V_BIAS

213

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6.8 Switching Characteristics (VBIAS = 2.2 V to 5 V) (continued)

Over operating free-air temperature range (unless otherwise noted), CIN=47uF. Typical values are at T_A= 25°C, C_L= 0.1μF,

and a current load of 1mA.

PARAMETER

TEST CONDITIONS

MIN

TYP

393

MAX

UNIT

t_ON

t_RISE

t_D

Turn ON time

CT = GND

CT = Open

CT = V_BIAS

CT = GND

CT = Open

CT = V_BIAS

CT = GND

CT = Open

Rise time

183

365

Rise time

Delay time

Fall time

t_D

t_FALL

t_OFF

Turn OFF time

VIN = 0.285 V

t_ON

t_RISE

t_D

Turn ON time

CT = Open

CT = V_BIAS

CT = GND

CT = Open

CT = V_BIAS

CT = GND

CT = Open

CT = V_BIAS

CT = GND

CT = Open

158

Turn ON time

Rise time

128

Rise time

Delay time

Fall time

t_D

t_FALL

t_OFF

Turn OFF time

6.9 Timing Diagram

图6-1. TPS22998 Timing Diagram

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6.10 Typical Characteristics

–40C

25C

–40C

25C

85C

105C

2.5

3.5

4.5

5.5

0.5

1.5

2.5

3.5

4.5

Bias Voltage (V)

Input Voltage (V)

VIN = VBIAS

VOUT = Open

VBIAS = 5 V

VOUT = Open

图6-3. Quiescent Current vs Bias Voltage

图6-2. Quiescent Current vs Input Voltage

4.5

3.6

3.2

2.8

2.4

3.5

2.5

1.6

1.2

0.8

0.4

1.5

–40C

25C

–40C

25C

85C

105C

85C

0.5

105C

0.5

1.5

2.5

3.5

4.5

2.5

3.5

4.5

5.5

Input Voltage (V)

Bias Voltage (V)

VBIAS = 5 V

VOUT = 0 V

VIN = VBIAS

VOUT = 0 V

图6-4. VBIAS Shutdown Current vs Input Voltage

图6-5. VBIAS Shutdown Current vs Bias Voltage

–40C

5.4

4.8

4.2

3.6

25C

85C

105C

2.4

1.8

1.2

0.6

–40C

25C

85C

105C

2.5

3.5

4.5

5.5

0.5

1.5

2.5

3.5

4.5

Bias Voltage (V)

Input Voltage (V)

VIN = VBIAS

图6-7. QOD Resistance vs Bias Voltage

VBIAS = 5 V

I_LOAD= 200 mA

图6-6. On-Resistance vs Input Voltage

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6.10 Typical Characteristics (continued)

250

225

200

175

150

125

100

–40C

25C

–40C

25C

85C

105C

85C

105C

0.5

1.5

2.5

3.5

4.5

0.5

1.5

2.5

3.5

4.5

Input Voltage (V)

VBIAS = 5 V

C_L= 0.1 µF

CT = Floating

VBIAS = 5 V

C_L= 0.1 µF

CT = Floating

图6-8. Rise Time vs Input Voltage

图6-9. Delay Time vs Input Voltage

275

250

225

200

175

150

125

100

–40C

25C

–40C

25C

85C

105C

0.5

1.5

2.5

3.5

4.5

0.5

1.5

2.5

3.5

4.5

Input Volage (V)

Input Voltage (V)

VBIAS = 5 V

C_L= 0.1 µF

CT = Floating

VBIAS = 5 V

C_L= 0.1 µF

CT = Floating

图6-10. Turn-On Time vs Input Voltage

图6-11. Fall Time vs Input Voltage

5.4

4.8

4.2

3.6

–40C

25C

85C

105C

2.4

1.8

1.2

0.6

0.5

1.5

2.5

3.5

4.5

Input Voltage (V)

VBIAS = 5 V

C_L= 0.1 µF

图6-12. Off Time vs Input Voltage

CT = Floating

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7 Detailed Description

7.1 Overview

The TPS22998 device is a single-channel load switch with a 4-mΩ power MOSFET designed to operate up to 10

A. The voltage range is 0.2 V to 5.5 V. A configurable rise time provides flexibility for power sequencing and

minimizes inrush current for high capacitance loads.

An enable pin (ON) controls the switch, which is capable of interfacing directly with low voltage GPIO signals.

The TPS22998 device uses quick output discharge when switch turns off, pulling the output down to 0 V through

an internal 50-Ω resistor.

7.2 Functional Block Diagram

7.3 Feature Description

7.3.1 ON and OFF Control

The ON pin controls the state of the switch. The ON pin is compatible with standard GPIO logic threshold so it

can be used in a wide variety of applications. When the pin pull high, the device enables, and when it is low, the

device disables.

7.3.2 Adjustable Slew Rate

The CT pin is a tri-state pin, meaning that it has three different slew rates depending on the connection to the

pin. The CT pin can be grounded, pulled high, or left floating. Floating defines as an effective resistance to GND

or other pins greater than 10 MΩ.

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7.3.3 Thermal Shutdown

When the device temperature reaches 150°C (typical), the device shuts itself off to prevent thermal damage.

After it cools off by about 20°C, the device turns back on. If the device is kept in a thermally stressful

environment, then the device oscillates between these two states until it can keep its temperature below the

thermal shutdown point.

7.4 Device Functional Modes

The below table summarizes the device functional modes:

Fault Condition

VOUT State

None

QOD to GND

Connected to VIN

QOD to GND

Thermal shutdown

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8 Application and Implementation

备注

Information in the following applications sections is not part of the TI component specification, and TI

does not warrant its accuracy or completeness. TI’s customers are responsible for determining

suitability of components for their purposes, as well as validating and testing their design

implementation to confirm system functionality.

8.1 Application Information

This section highlights some of the design considerations when implementing this device in various applications.

8.2 Typical Application

This typical application demonstrates how to use the TPS22998 device to limit startup inrush current.

图8-1. TPS22998 Basic Application

8.2.1 Design Requirements

For this example, the values below are used as the design parameters.

表8-1. Design Parameters

PARAMETER

V_BIAS

VALUE

3.3 V

V_IN

1.8 V

Load capacitance

470 μF

Maximum inrush current

1 A

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8.2.2 Detailed Design Procedure

When the switch enables, the charge up the output capacitance from 0 V to the set value (1.8 V in this example).

This charge arrives in the form of inrush current. Calculate inrush current using 方程式1.

Inrush Current = C_L× dVOUT/dt

(1)

Where:

• C_Lis the output capacitance.

• dVOUT is the change in VOUT during the ramp up of the output voltage when device is enabled. Because

rise time is 10% of VOUT to 90% of VOUT, this is 80% of the VIN value.

• dt is the rise time in VOUT during the ramp up of the output voltage when the device is enabled.

The TPS22998 offers an adjustable rise time for VOUT, allowing the user to control the inrush current during turn

on. Calculate the appropriate rise time using the design requirements and the inrush current equation as shown

below.

1A = 470 µF × (1.8 V × 80%) / dt

dt = 677µs

(2)

(3)

To ensure an inrush current of less than 1 A, a C_Tsetting that yields a rise time of more than 677 µs must be

chosen. By pulling the CT pin high, a rise time of 900 μs is selected, limiting the inrush current to below 1 A.

8.2.3 Application Performance Plots

The below scope shot shows the TPS22998 turning on into a 470-μF load with the CT pin tied to VBIAS.

图8-2. TPS22998 Turn-On into 470 μF (CT = V_BIAS

)

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9 Power Supply Recommendations

The TPS22998 device is designed to operate with a VIN range of 0.2 V to 5.5 V. Regulate the VIN power supply

well and place as close to the device terminal as possible. The power supply must be able to withstand all

transient load current steps. In most situations, using an input capacitance (C_IN) of 1 μF is sufficient to prevent

the supply voltage from dipping when the switch is turned on. In cases where the power supply is slow to

respond to a large transient current or large load current step, additional bulk capacitance can be required on the

input.

10 Layout

10.1 Layout Guidelines

For best performance, all traces must be as short as possible. To be most effective, place the input and output

capacitors close to the device to minimize the effects that parasitic trace inductances can have on normal

operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects.

10.2 Layout Example

图10-1. TPS22998 Layout Example

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TPS22998

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ZHCSMV6A –OCTOBER 2021 –REVISED DECEMBER 2021

11 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,

generate code, and develop solutions are listed below.

11.1 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新进行注册，即可每周接收产品信息更

改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

11.2 支持资源

TI E2E^™支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解

答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅

TI 的《使用条款》。

11.3 Trademarks

TI E2E^™is a trademark of Texas Instruments.

所有商标均为其各自所有者的财产。

11.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

11.5 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

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TPS22998

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ZHCSMV6A –OCTOBER 2021 –REVISED DECEMBER 2021

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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Product Folder Links: TPS22998

PACKAGE OPTION ADDENDUM

www.ti.com

24-Feb-2022

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

TPS22998RYZR

ACTIVE

WQFN-HR

RYZ

3000 RoHS & Green

NIPDAU

Level-2-260C-1 YEAR

-40 to 105

1LF

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OUTLINE

RYZ0010A

WQFN-HR - 0.8 mm max height

SCALE 7.000

PLASTIC QUAD FLATPACK - NO LEAD

1.6

1.4

2.1

1.9

PIN 1 INDEX AREA

0.8

0.7

SEATING PLANE

0.08 C

0.05

0.00

(0.12)

TYP

0.475

0.275

0.1

C A B

0.05

SYMM

1.5

0.3

0.2

10X

6X 0.5

0.725

0.525

PIN 1 ID

(45 X 0.1)

SYMM

0.1

C A B

0.05

4226834/B 06/2021

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

www.ti.com

EXAMPLE BOARD LAYOUT

RYZ0010A

WQFN-HR - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

SYMM

4X (0.825)

6X (0.575)

10X (0.25)

SYMM

(1.825)

6X (0.5)

(R0.05) TYP

(1.075)

(1.325)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:30X

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

SOLDER MASK

OPENING

METAL

EXPOSED

METAL

SOLDER MASK

EXPOSED

OPENING

METAL

UNDER

SOLDER MASK

NON SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE

4226834/B 06/2021

NOTES: (continued)

3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).

www.ti.com

EXAMPLE STENCIL DESIGN

RYZ0010A

WQFN-HR - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

SYMM

4X (0.825)

6X (0.575)

10X (0.25)

SYMM

(1.825)

6X (0.5)

(R0.05) TYP

(1.075)

(1.325)

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICKNESS

SCALE: 30X

4226834/B 06/2021

NOTES: (continued)

5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

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TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

TPS22998 [TI]

相关型号：

TPS22998RYZR

TPS2300

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TPS2300IPWG4

TPS2300IPWR

TPS2300IPWRG4

TPS2300PW

TPS2301

TPS2301IPW

TPS2301IPWG4

TPS2301IPWR

TPS2301IPWRG4