TPS25855-Q1 [TI]
具有甩负荷功能的 2.2MHz 单路 3A USB Type-C® 充电端口控制器;型号: | TPS25855-Q1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有甩负荷功能的 2.2MHz 单路 3A USB Type-C® 充电端口控制器 控制器 |
文件: | 总59页 (文件大小:3508K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TPS25855-Q1, TPS25854-Q1
ZHCSP14 –SEPTEMBER 2021
具有同步降压直流/直流转换器和可编程电流限制的TPS25854-Q1 和TPS25855-
Q1 单路3A USB Type-C® 充电端口
1 特性
2 应用
• 符合面向汽车应用的AEC-Q100 标准:
• 汽车USB 媒体中心
• 汽车USB 充电端口
• 售后市场USB 充电器
– 温度等级1:TA 范围–40°C 至+125°C
– HBM ESD 分类等级H2
– CDM ESD 分类等级C5
• 针对超低EMI 要求进行了优化:
3 说明
TPS2585x-Q1 是一款集成式 USB 充电端口解决方
案,其中包括一个同步高效直流/直流转换器,而且它
还集成了检测和控制功能,可充当 USB 电池充电 1.2
和Type-C 端口。
– 符合CISPR25 5 类标准
– HotRod™ 封装可更大限度地减少开关节点振铃
– 展频可降低峰值发射
• 同步降压稳压器
器件信息(1)
– 400 KHz 下的高效率:VIN = 12V、IBUS = 3A 时
为96%
器件型号
封装
封装尺寸(标称值)
3.50mm × 4.50mm
3.50mm × 4.50mm
– 18mΩ/10mΩ 低RDS(ON) 降压稳压器MOSFET
– 工作电压范围:5.5V 至26V,可承受36V 输入
– 频率可调节:200kHz 至3MHz (TPS25855-Q1)
– 频率可调节:200kHz 至800kHz (TPS25854-
Q1)
TPS25854-Q1
TPS25855-Q1
VQFN-HR (25)
VQFN-HR (25)
(1) 如需了解所有不同可用选件的详细器件型号,请参阅数据表末
尾的可订购产品附录。
– 具有展频频谱抖动的FPWM
– 5.1V 固定输出电压
• 内部电源路径:
– 7mΩ/7mΩ 低RDS(ON) 内部USB 功率MOSFET
– USB 端口的高精度可编程电流限制:3.4A 下为
±10%
– OUT:用于辅助负载的5.1V、200mA 电源
• USB 数据线压降补偿:可编程,最高400mV
• 符合USB-IF 标准
– Type-C 1.3 版
• 在CC 上具有3A 电流通告能力
• VBUS 应用和放电
• VCONN 拉电流:200mA
• USB 电缆极性保护(POL)
– 自动DCP 模式:
简化版原理图:TPS25845-Q1 和TPS25855-Q1
• 符合BC1.2 和YD/T 1591 2009 要求的短路
模式
• 1.2V 模式
• 2.7V 分压器3 模式
• 甩负荷和可编程TA
• 故障标志报告:USB 过流、热关断
• 用于实现可编程热过载保护的热警告标志
• 器件TJ 范围:–40°C 至+150°C
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLVSFJ9
TPS25855-Q1, TPS25854-Q1
ZHCSP14 –SEPTEMBER 2021
www.ti.com.cn
Table of Contents
10.2 Functional Block Diagram.......................................20
10.3 Feature Description.................................................21
10.4 Device Functional Modes........................................36
11 Application and Implementation................................ 37
11.1 Application Information............................................37
11.2 Typical Applications.................................................37
12 Power Supply Recommendations..............................46
13 Layout...........................................................................47
13.1 Layout Guidelines................................................... 47
13.2 Layout Example...................................................... 48
13.3 Ground Plane and Thermal Considerations............48
14 Device and Documentation Support..........................50
14.1 接收文档更新通知................................................... 50
14.2 支持资源..................................................................50
14.3 Trademarks.............................................................50
14.4 Electrostatic Discharge Caution..............................50
14.5 术语表..................................................................... 50
15 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 说明(续).........................................................................3
6 Device Comparison Table...............................................4
7 Pin Configuration and Functions...................................5
8 Specifications.................................................................. 7
8.1 Absolute Maximum Ratings ....................................... 7
8.2 ESD Ratings .............................................................. 7
8.3 Recommended Operating Conditions ........................7
8.4 Thermal Information ...................................................8
8.5 Electrical Characteristics ............................................8
8.6 Timing Requirements ............................................... 11
8.7 Switching Characteristics .........................................12
8.8 Typical Characteristics..............................................14
9 Parameter Measurement Information..........................18
10 Detailed Description....................................................19
10.1 Overview.................................................................19
Information.................................................................... 51
4 Revision History
DATE
REVISION
NOTES
September 2021
*
Initial release.
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5 说明(续)
TPS2585x-Q1 是一款高度集成的USB Type-C® 充电控制器,适用于单端口应用。
该器件集成了一个具有内部功率MOSFET 的单片、同步、整流、降压开关模式转换器和一个具有充电端口自动检
测功能的 USB 限流开关。TPS2585x-Q1 提供了一种紧凑型高效解决方案,可在宽输入电源电压范围内实现出色
的负载和线路调节。该同步降压稳压器具有峰值电流模式控制,而且采用了内部补偿,可简化设计。对于
TPS25854-Q1,FREQ 引脚上有一个电阻器,可用于在200kHz 和800KHz 之间设置开关频率。对于TPS25855-
Q1,FREQ 引脚上有一个电阻器,可用于在 200kHz 和 3MHz 之间设置开关频率。在低于 400kHz 的频率下运行
可实现更高的系统效率。在高于 2.1MHz 的频率下运行则可以避开 AM 无线电频带,并且能够使用较小的电感
器。
TPS2585x-Q1 集成了标准USB Type-C 端口控制器功能,包括用于3A 和1.5A 电流广播的配置通道(CC) 逻辑。
电池充电(1.2 版)集成提供了利用 USB 数据线信号来确定 USB 端口拉电流能力的传统非 Type-C USB 设备所
需的电气特性。
TPS2585x-Q1 支持智能热调节。输出电流可根据外部TS 阈值进行调节。此外,该器件还集成了 VCONN 电源,
可满足USB3.1 电源要求。由于系统集成度高且占用空间小,该器件特别适用于单端口应用。
TPS2585x-Q1 输出电压固定为 5.1V。该器件还集成了一个精密电流检测放大器,用于实现用户可编程电缆压降
补偿和电流限制调整,最大电缆补偿电压限制为 400mV。电缆补偿可使降压稳压器输出电压随负载电流线性改
变,以抵消由于汽车电缆布线中的导线电阻引起的压降,从而帮助便携式设备在重载下实现更理想的电流和电压
充电。无论负载电流如何,在连接的便携式器件上测得的总线电压都保持大致恒定,这样,便携式器件的电池充
电器就能够保持理想工作状态。
TPS2585x-Q1 提供针对 USB 充电和系统运行的多种安全特性,包括外部负热敏电阻监控、逐周期电流限制、断
续短路保护、欠压锁定、总线过流和裸片过热保护。
该器件系列采用25 引脚3.5mm x 4.5mm QFN 封装。
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6 Device Comparison Table
DEVICE NUMBER
TPS25854-Q1
TPS25855-Q1
Type-C ports number
Single
Single
DC/DC converter switching frequency range 200 kHz to approximately 800 kHz
200 kHz to approximately 3 MHz
Thermistor Input (TS)
Fault event indication
Thermal warning indication
External clock synchronization
BC1.2 DCP
Yes
Yes
Yes
Yes
Yes
Yes
Yes, range 200 kHz to 800 kHz
Yes, range 200 kHz to 3 MHz
Yes
Yes
Apple or Samsung charging scheme
Cable compensation
Yes
Yes
Yes, maximum 400 mV
Yes, maximum 400 mV
Selectable output voltage
Adjustable output short current limit
FPWM/PFM
No(1)
No(1)
Yes
Yes
FPWM
FPWM
DCDC always ON (EN pull High)
Spread spectrum
Yes
Yes
Yes
Yes
Package
QFN-25 3.5 mm × 4.5mm
QFN-25 3.5 mm × 4.5 mm
(1) Default 5.1-V output voltage
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7 Pin Configuration and Functions
图7-1. TPS2585x-Q1 RPQ Package 25-Pin (QFN) Top View
表7-1. Pin Functions for TPS25854/5 RPQ Package
PIN
TYPE (1)
DESCRIPTION
NAME
NC
NO
1, 12
2
A
A
No connection
TS
Temperature sense terminal. Connect the TS input to the NTC thermistor.
Input of internal bias supply, must connect to the SENSE pin directly, power the internal
circuit.
BIAS
3
P
DP
DM
4
5
6
7
8
A
A
P
A
A
D+ data line. Connect to the USB connector.
D–data line. Connect to the USB connector.
AGND
CC1
CC2
Analog ground terminal. Connect AGND to PGND.
Connect to Type-C CC1 pin. Analog input, output, or both.
Connect to Type-C CC2 pin. Analog input, output, or both.
Current limit program. Connect a resistor to set the current limit threshold. Short to GND to
set the default 3.55-A current limit.
ILIM
BUS
9
A
P
P
10
11
BUS Output
Output voltage sensing, external load on this pin is strictly prohibited. Connect to the other
side of the external inductor.
SENSE
Output pin, provide 5.1-V voltage to power external load with maximum 200-mA capability.
The voltage follows the VSENSE.
OUT
13
14
15
P
A
A
USB output current monitor. Connect a resistor to set the maximum cable comp voltage at
full load current.
IMON
Thermal warning indication. Active LOW open-drain output. Asserted when voltage at the
TS pin increases above the thermal warning threshold.
THERM_WARN
PGND
Power ground terminal, connected to the source of LS FET internally. Connect to system
ground, AGND, and the ground side of CIN and COUT capacitors. Path to CIN must be as
short as possible.
16, 24, 25
17
P
A
Cable polarity indication. Active low open-drain logic output, signals which Type-C CC pin
is connected to the CC line. This gives the information needed to mux the super speed
lines. Asserted when the CC2 pin is connected to the CC line in cable.
POL
Fault indication. Active low open-drain logic output, Asserted during overcurrent or
overtemperature conditions.
FAULT
18
19
A
A
Switching frequency program and external clock input. Connect a resistor from FREQ to
GND to set the switching frequency.
FREQ/ SYNC
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表7-1. Pin Functions for TPS25854/5 RPQ Package (continued)
PIN
TYPE (1)
DESCRIPTION
NAME
NO
Enable pin. Precision enable controls the regulator switching action and type-C. Do not
float. High = on, Low = off. Can be tied to SENSE directly. Precision enable input allows
adjustable UVLO by external resistor divider if tied to IN pin.
EN/UV
20
A
P
P
P
Bootstrap capacitor connection. Internally, the BOOT is connected to the cathode of the
booststrap diode. Connect the 0.1-μF bootstrap capacitor from SW to BOOT.
BOOT
IN
21
22
23
Input power. Connected to external DC supply. Expected range of bypass capacitors is 1
μF to 10 μF. Connect from IN to PGND. Withstand up to 36 V without damage, but
operating is suspended if VIN is above the 26-V OVP threshold.
Switching output of the regulator. Internally connected to source of the HS FET and drain
of the LS FET. Connect to output inductor.
SW
(1) A = Analog, P = Power, G = Ground.
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8 Specifications
8.1 Absolute Maximum Ratings
Over the recommended operating junction temperature range of -40°C to +150°C and AGND = PGND (unless otherwise
noted)(1)
PARAMETER
IN to PGND
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–3.5
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
MAX
40(2)
35
6
UNIT
IN to SW
BIAS, SENSE to PGND
EN to AGND
V
Input voltage
11
6
FREQ/SYNC to AGND
ILIM, IMON to AGND
AGND to PGND
6
0.3
35
35
6
V
V
SW to PGND
SW to PGND (less than 10 ns transients)
BOOT to SW
Output voltage
Voltage range
BUS, OUT to PGND
CC1, CC2 to AGND
DP, DM to AGND
6
6
6
V
TS to AGND
6
FAULT, POL, THERM_WARN to AGND
6
V
A
Pin positive sink current, ISNK CC1, CC2 (while applying VCONN)
1
I/O current
DP to DM in BC1.2 DCP Mode
Junction temperature
35
150
150
mA
°C
°C
–35
-40
TJ
Tstg
Storage temperature
–65
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If
used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) VIN rising slew rate below 20 V/ms if in 0-V to 40-V transient, room temperature, maximum 500 uF cap at SENSE.
8.2 ESD Ratings
VALUE
±2000(2)
±750(3)
±750(3)
UNIT
Human body model (HBM), per AEC Q100-002(1)
V(ESD) Electrostatic discharge
Corner pins
V
Charged device model (CDM), per
AEC Q100-011
Other pins
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
(2) The passing level per AEC-Q100 Classification H2.
(3) The passing level per AEC-Q100 Classification C5
8.3 Recommended Operating Conditions
Over the recommended operating junction temperature range of -40°C to 150°C. Voltages are with respect to GND (unless
otherwise noted)
MIN
5.5
0
NOM
MAX UNIT
IN to PGND
26
EN
VSENSE
VI
Input voltage
V
TS
0
VSENSE
3.3
FREQ/SYNC when driven by external clock
0
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8.3 Recommended Operating Conditions (continued)
Over the recommended operating junction temperature range of -40°C to 150°C. Voltages are with respect to GND (unless
otherwise noted)
MIN
NOM
MAX UNIT
VPU
VO
Pull up voltage
Output voltage
FAULT, POL, THERM_WARN
0
5
VSENSE
V
V
A
A
BUS, OUT
5.5
3
BUS
0
OUT
0
0.2
15
IO
Output current
Source current
DP to DM Continuous current in BC1.2 DCP Mode
–15
mA
CC1 or CC2 source current when supplying
VCONN
ISRC
250
RILIM
0
0
100
100
kΩ
kΩ
uF
REXT
External resistnace
External capacitance
RFREQ
CEXT
TJ
CBOOT
0.1
Operating junction temperature
150
°C
–40
8.4 Thermal Information
TPS2585x-Q1
RPQ (VQFN)
25 PINS
37.7
THERMAL METRIC(1) (2)
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
17.2
8.8
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.3
ΨJT
8.8
ΨJB
RθJC(bot)
20.3
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) Power rating at a specific ambient temperature TA should be determined with a maximum junction temperature of 150 °C.
8.5 Electrical Characteristics
Limits apply over the recommended operating junction temperature (TJ) range of -40°C to +150°C; VIN = 13.5 V, fSW = 400
kHz unless otherwise stated. Minimum and maximum limits are specified through test, design or statistical correlation. Typical
values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
SUPPLY VOLTAGE (IN PIN)
Shutdown quiescent current;
measured at IN pin.
ISD
IQ
34
63
200
uA
µA
VEN/UV = 0, –40℃≤TJ ≤85℃
Operating quiescent current (DCDC
disable)
VEN = VSENSE, CCx = open, –40℃≤
TJ ≤85℃
Voltage on VIN pin when buck
regulator stops switching
VOVLO_R
26.6
1.26
27.5
0.5
28.4
V
V
VOVLO_HYS
Hysteresis
ENABLE AND UVLO (EN/UVLO PIN)
Rising threshold for not in External
UVLO
VEN/UVLO_R
VEN/UV rising threshold
VEN/UVLO falling
1.3
1.34
V
VEN/UVLO_HYS
BOOTSTRAP
VBTST_UVLO
Hysteresis
100
mV
Bootstrap voltage UVLO threshold
2.2
V
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8.5 Electrical Characteristics (continued)
Limits apply over the recommended operating junction temperature (TJ) range of -40°C to +150°C; VIN = 13.5 V, fSW = 400
kHz unless otherwise stated. Minimum and maximum limits are specified through test, design or statistical correlation. Typical
values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
RBOOT
Bootstrap pull-up resistence
VSENSE - BOOT = 0.1 V
7.7
Ω
BUCK REGULATOR
IL-SC-HS
IL-SC-LS
IL-NEG-LS
IZC
High-side current limit
BOOT - SW = 5 V
SENSE = 5 V
10.2
8.5
11.4
10
12.6
11.5
-3
A
A
A
A
Low-side current limit
Low-side negative current limit
Zero current detector threshold
SENSE = 5 V
-5
–7
0.01
CC1 or CC2 pulldown resistance = Rd,
TJ = 25℃
VSENSE
BUCK Output voltage
5.1
+1%
2
V
%
V
–1%
–2
CC1 or CC2 pulldown resistance = Rd,
-40℃≤TJ ≤150℃
VSENSE
BUCK Output voltage accuracy
SENSE input level to enable DCDC
switching
VSENSE rising, CC1 or CC2 pull down
resistance = Rd
VDCDC_UVLO_R
VDCDC_UVLO_HYS
VDROP
3.85
4
0.4
300
18
4.15
VSENSE falling, CC1 or CC2 pull down
resistance = Rd
Hysteresis
V
VIN = VSENSE + VDROP, VSENS = 5.1 V,
IPA_BUS = 3 A, IPB_BUS = 3 A
Dropout voltage ( VIN - VSENSE
)
mV
IBUS = 3 A, BOOT - SW = 5 V, -40℃≤
TJ ≤150℃
RDS-ON-HS
High-side MOSFET ON-resistance
Low-side MOSFET ON-resistance
34
mΩ
mΩ
IBUS = 3 A, VSENSE = 5 V, –40℃≤
TJ ≤150℃
RDS-ON-LS
9.5
18.5
POWER SWITCH AND CURRENT LIMIT
USB Load Switch MOSFET ON-
RDS-ON_USB
6.8
11.73
I_BUS = 3 A; –40℃≤TJ≤150℃
mΩ
mΩ
resistance
OUT Load Switch MOSFET ON-
resistance
RDS-ON_OUT
IOUT = 0.3 A
230
RDS-ON_VCONN
RDS-ON_VCONN
On-state resistance
On-state resistance
TJ = 25°C, ICCn = 0.25 A
410
410
550
740
mΩ
mΩ
–40°C ≤TJ ≤150°C, ICCn = 0.25 A
Voltage on SENSE pin that will enable
the USB Load Switch
VUSBLS_UVLO_R
3.95
4.1
200
500
4.25
V
VUSBLS_UVLO_HYS Hysteresis
mV
Ω
Discharge resistance for Port A or Port Apply 5 V on PA_BUS or PB_BUS,
B BUS
RBUS_DCHG
250
670
750
730
CC1 or CC2 = Rd
Rising threshold voltage for BUS not
discharged
VTH_R_BUS_DCHGb
700
100
150
mV
mV
KΩ
VTH_HYS_BUS_DCHG Hysteresis
VPx_BUS = 4 V, No sink termination on
CC lines, Time>tW_BUS_DCHG
VBUS_DCHG_BLEED BUS bleed resistance
100
200
849
2434
3018
3748
4040
4876
4828
4265
1061
2704
3354
4165
4490
5418
5680
4490
1273
2974
3689
4581
4938
5960
6532
4714
mA
mA
mA
mA
mA
mA
mA
mA
RILIM = 48.7 KΩ
RILIM = 19.1 KΩ
RILIM = 15.4 KΩ
RILIM = 12.4 KΩ
BUS output short-circuit secondary
current limit
IOS_HI
RILIM = 11.5 KΩ
RILIM = 9.53 KΩ
RILIM = 0 Ω(short to GND)
RILIM = 11.5 KΩ, TJ =25℃
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8.5 Electrical Characteristics (continued)
Limits apply over the recommended operating junction temperature (TJ) range of -40°C to +150°C; VIN = 13.5 V, fSW = 400
kHz unless otherwise stated. Minimum and maximum limits are specified through test, design or statistical correlation. Typical
values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
PARAMETER
TEST CONDITIONS
MIN
530.4
1521
TYP
MAX UNIT
663
800
mA
mA
mA
mA
mA
mA
mA
mA
mA
RILIM = 48.7 KΩ
1690
1859
RILIM = 19.1 KΩ
1886.4
2342.7
2525.4
3047.4
3017.5
2666
2096 2305.6
2603 2863.3
2806 3086.6
3386 3724.6
3550 4082.5
RILIM = 15.4 KΩ
RILIM = 12.4 KΩ
IOS_BUS
BUS output short-circuit current limit
RILIM = 11.5 KΩ
RILIM = 9.53 KΩ
RILIM = 0 Ω(short to GND)
RILIM =11.5 KΩ, TJ =25℃
Short circuit current limit
2806
450
2946
495
IOS_OUT
OUT output short-circuit current limit
390
VCONN output short-circuit current
limit
IOS_VCONN
Short circuit current limit
240
300
360
mA
CABLE COMPENSATION VOLTAGE
0
39.5
mV
mV
mV
mV
mV
mV
mV
IBUS=2.4A, RIMON=0Ω
IBUS=2.4A, RIMON=0.976KΩ
IBUS=2.4A, RIMON=2.94KΩ
IBUS=2.4A, RIMON=4.99KΩ
IBUS=2.4A, RIMON=6.98KΩ
IBUS=2.4A, RIMON=8.87KΩ
IBUS=2.4A, RIMON=9.76KΩ
119.2
202.4
283.1
360
VDROP_COM
Cable compensation voltage
396
CC CONNECT MANAGEMENT
ISRC_CC_3A
Sourcing current
304
167
330
180
356
194
µA
µA
CC pin voltage: 0 V ≤VCCn ≤2.45 V
Sourcing current in thermal
management(Temp warm)
CC pin voltage: 0 V ≤VCCn ≤1.5 V ,
TA> 85℃
ISRC_CC_1.5A
Sourcing current in thermal
management(Temp hot)
CC pin voltage: 0 V ≤VCCn ≤1.5 V ,
TA> 85℃
ISRC_CC_DFLT
64
80
105
10
µA
µA
CCx is the CC pin under test, CCy is
the other CC pin. CC pin voltage
VCCx = 5.5 V, CCy floating, VEN_UV
0 V or VSENSE, 0 V ≤VIN ≤26 V
IREV is current into CCx pin
=
IREV
Reverse leakage current
2.75
Rising threshold voltage for VCONN
not discharged
CC pin that was providing VCONN in
previous SINK state
VTH_R
670
700
100
730
mV
mV
VTH_HYS
Hysteresis
FAULT, POL, THERM_WARN
VOL
IOFF
VOL
IOFF
VOL
IOFF
FAULT Output low voltage
ISNK_PIN = 1 mA
VPIN = 5.5 V
250
2.2
250
1.8
250
10
mV
µA
FAULT Off-state leakage
POL Output low voltage
ISNK_PIN = 1 mA
VPIN = 5.5 V
mV
µA
POL Off-state leakage
THERM_WARN Output low voltage
THERM_WARN Off-state leakage
ISNK_PIN = 1 mA
VPIN = 5.5 V
mV
µA
BC 1.2 DOWNSTREAM CHARGING PORT
RDPM_SHORT
DIVIDER 3 MODE
VDP_DIV3
DP and DM shorting resistance
70
200
Ω
DP output voltage
2.57
2.7
2.84
V
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8.5 Electrical Characteristics (continued)
Limits apply over the recommended operating junction temperature (TJ) range of -40°C to +150°C; VIN = 13.5 V, fSW = 400
kHz unless otherwise stated. Minimum and maximum limits are specified through test, design or statistical correlation. Typical
values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
PARAMETER
TEST CONDITIONS
MIN
2.57
24
TYP
2.7
30
MAX UNIT
VDM_DIV3
RDP_DIV3
RDM_DIV3
1.2-V MODE
VDP_1.2V
DM output voltage
DP output impedance
DM output impedance
2.84
36
V
IDP_IN = –5 µA
kΩ
kΩ
24
30
36
IDM_IN = –5 µA
DP output voltage
1.12
1.12
84
1.2
1.2
1.26
1.26
126
126
V
V
VDM_1.2V
RDP_1.2V
RDM_1.2V
DM output voltage
DP output impedance
DM output impedance
100
100
IDP_IN = –5 µA
IDM_IN = –5 µA
kΩ
kΩ
84
FREQ/SYNC THRESHOLD
FREQ/SYNC high threshold for
Amplitude of SYNC clock AC signal
(measured at FREQ/SYNC pin)
VIH_FREQ/SYNC
2
V
V
external clock synchronization
FREQ/SYNC low threshold for
external clock synchronization
Amplitude of SYNC clock AC signal
(measured at FREQ/SYNC pin)
VIL_FREQ/SYNC
0.8
0.525
0.683
TEMPERATURE SENSING
VWARN_HIGH Temperature warning threshold rising As percentage to VSENSE
VWARN_HYS
0.475
0.618
0.5
0.1
V/V
V/V
Hysteresis
As percentage to VSENSE
As percentage to VSENSE
As percentage to VSENSE
Temperature Hot assert threshold
rising to reduce SENS voltage
VHOT_HIGH
VHOT_HYS
VR_VSENS
0.65
0.1
V/V
V/V
V
Hysteresis
VSENSE voltage decay when
Temperature Hot assert
TS pin voltage rise above 0.65 *
VSENSE
4.77
THERMAL SHUTDOWN
TLS_SD USB Load Switch Over Temperature
Shutdown threshold
Recovery threshold
Shutdown threshold
Recovery threshold
160
150
166
154
°C
°C
°C
°C
TSD
Thermal shutdown
8.6 Timing Requirements
Over the recommended operating junction temperature range of -40 °C to 150 °C (unless otherwise noted)
MIN NOM MAX UNIT
2.94 4.1 5.42 ms
11.09 16.38 23.03 ms
(Thermal SD Fault assertion is
instantaneous, not subject to this timing)
tDEGLA_FAULT Asserting deglitch time
tDEGLD_FAULT De-asserting deglitch time
BUS DISCHARGE
tDEGA_BUS_DC
Discharge asserting deglitch
5.6
12.3 21.2 ms
260 360 ms
HG
VBUS discharge time after sink termination
removed from CC lines
VBUS = 1 V, time ISNK_OUT > 1 mA after sink
termination removed from CC lines
tW_BUS_DCHG
170
POWER SWITCH TIMING
Deglitch time for USB power switch current
limit enable
tIOS_HI_DEG
tIOS_HI_RST
tr_USB
USB port enter overcurrent (per ILIM setting) 1.228 2.048 2.867 ms
9.6 16 22.4 ms
1.67 ms
MFI OCP reset timing
CL = 1 µF, RL = 100 Ω(measured from 10%
to 90% of final value)
PA_BUS, PB_BUS voltage rise time
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8.6 Timing Requirements (continued)
Over the recommended operating junction temperature range of -40 °C to 150 °C (unless otherwise noted)
MIN NOM MAX UNIT
CL = 1 µF, RL = 100 Ω(measured from 90%
to 10% of final value)
tf_USB
PA_BUS, PB_BUS voltage fall time
0.49
ms
ton_USB
toff_USB
PA_BUS, PB_BUS voltage turnon-time
PA_BUS, PB_BUS voltage turnoff-time
2.59
2.07
ms
ms
CL = 1 µF, RL = 100 Ω
CL = 1 µF, RL = 100 Ω
PA_BUS, PB_BUS short-circuit response
time
tIOS_USB
tr_OUT
1
us
CL = 1 µF, RL = 1 Ω
CL = 1 µF, RL = 100 Ω(measured from 10%
to 90% of final value)
OUT voltage rise time
OUT voltage fall time
0.12
0.16
0.2 0.28 ms
0.22 0.28 ms
CL = 1 µF, RL = 100 Ω(measured from 90%
to 10% of final value)
tf_OUT
ton_OUT
OUT voltage turnon-time
0.6
1.1 1.65 ms
0.54 0.62 ms
CL = 1 µF, RL = 100 Ω
CL = 1 µF, RL = 100 Ω
CL = 1 µF, RL = 1 Ω
CL = 1 µF, RL = 1 Ω
toff_OUT
OUT voltage turnoff-time
0.45
tIOS_OUT
tIOS_VCONN
OUT short-circuit response time
CC-VCONN short circuit response time
1.4
1
4
us
3.5 µs
CL = 1 µF, RL = 100 Ω(measured from 10%
to 90% of final value); 5.1KΩ on CC1 and
1KΩ on CC2
tr_VCONN
VCONN output voltage rise time
VCONN output voltage fall time
0.2
0.28 0.36 ms
0.23 0.28 ms
CL = 1 µF, RL = 100 Ω(measured from 90%
to 10% of final value); 5.1KΩ on CC1 and
1KΩ on CC2
tf_VCONN
0.18
CL = 1 µF, RL = 100 Ω; 5.1KΩ on CC1 and
1KΩ on CC2
ton_VCONN
VCONN output voltage turnon time
VCONN output voltage turnoff time
0.7
1.2
1.7 ms
CL = 1 µF, RL = 100 Ω; 5.1KΩ on CC1 and
1KΩ on CC2
toff_VCONN
0.37
0.44 0.51 ms
HICCUP MODE
THICP_ON
OUT, PA_BUS, PB_BUS output hiccup mode
ON time
OC, VOUT, VPA_BUS, VPB_BUS drop 10%
2.94
367
4.1 5.42 ms
OUT, PA_BUS, PB_BUS output hiccup mode OC, OUT, PA_BUS, PB_BUS connect to
OFF time GND
THICP_OFF
524
715 ms
8.7 Switching Characteristics
Over the recommended operating junction temperature range of -40 °C to 150 °C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
SW (SW PIN)
TON_MIN
Minimum turnon-time
84
6
ns
µs
Maximum turnon-time, HS timeout in
dropout
TON_MAX
TOFF_MIN
Dmax
Minimum turnoff time
81
98
ns
%
Maximum switch duty cycle
TIMING RESISTOR AND INTERNAL CLOCK
Switching frequency range using
fSW_RANGE
200
200
800
kHz
kHz
9 kΩ≤RFREQ≤99 kΩ
FREQ mode (TPS25854-Q1)
Switching frequency range using
fSW_RANGE
3000
9 kΩ≤RFREQ≤99 kΩ
FREQ mode (TPS25855-Q1)
228
360
253
400
278
440
kHz
kHz
kHz
RFREQ = 80.6 kΩ
RFREQ = 49.9 kΩ
RFREQ = 8.45 kΩ
fSW
fSW
Switching frequency
Switching frequency (TPS25855-Q1)
1980
2200
2420
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8.7 Switching Characteristics (continued)
Over the recommended operating junction temperature range of -40 °C to 150 °C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Frequency span of spread spectrum
operation
FSSS
±6
%
EXTERNAL CLOCK(SYNC)
Switching frequency using external
fFREQ/SYNC
clock on FREQ/SYNC pin (TPS25854-
Q1)
200
200
800
kHz
kHz
Switching frequency using external
clock on FREQ/SYNC pin (TPS25855-
Q1)
fFREQ/SYNC
3000
fSYNC = 400kHz, VFREQ/SYNC
>
TSYNC_MIN
TLOCK_IN
Minimum SYNC input pulse width
PLL lock time
VIH_FREQ/SYNC, VFREQ/SYNC < VIL_FREQ/
100
100
ns
µs
SYNC
CC - CONNECT MANAGEMENT - ATTACH AND DETACH DEGLITCH
Attach asserting deglitch in the
tDEGA_CC_ATT_DETM
1.29
8.2
2.05
128
3.05
18
ms
µs
Detached Mode
Attach asserting deglitch in the
Detached Mode
Fast clock test mode
tDEGA_CC_DETACH_S Detach asserting deglitch for exiting
12.5
0.96
ms
ms
SINK Mode
INKM
Detach asserting deglitch for exiting
SINK Mode
Fast clock test mode
Fast clock test mode
tDEGA_CC_SHORT
tDEGA_CC_LONG
Detach, Rd and Ra asserting deglitch
Long deglitch
92
192
148
288
339
200
µs
ms
us
103
Long deglitch
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8.8 Typical Characteristics
Unless otherwise specified the following conditions apply: VIN = 13.5 V, fSW = 2.1 MHz, L = 2.2 µH, CSENSE = 66 µF, C_BUS
1 µF, TA = 25 °C.
=
70
60
50
40
30
20
200
180
160
140
120
100
-40C
25C
150C
-40C
25C
150C
4
8
12
16 20
Input Voltage (V)
24
28
32
4
8
12
16 20
Input Voltage (V)
24
28
32
VEN/EULVO = 0 V
图8-1. Shutdown Quiescent Current
CC1 = Rd
VEN/UVLO = VSENSE
图8-2. Standby Quiescent Current
CC1/2 = OPEN
1.36
1.34
1.32
1.3
5.13
5.12
5.11
5.1
Vin = 5.5V
Vin = 13.5V
Vin = 26V
Vin = 5.5V
Vin = 13.5V
Vin = 26V
5.09
5.08
5.07
1.28
1.26
-50
-25
0
25
50
75
100
125
150
-50
-25
0
25
50
75
Temperature (C)
100
125
150
Temperature (C)
图8-4. VSENSE Voltage vs Junction Temperature
图8-3. Precision Device Enable Threshold
3.94
11.7
-40C
25C
Vin = 5.5V
Vin = 13.5V
Vin = 26V
3.96
3.98
4
150C
11.6
11.5
11.4
11.3
11.2
4.02
4.04
4.06
-50
-25
0
25
Temperature (C)
50
75
100
125
150
4
8
12
16
Input Voltage (V)
20
24
28
图8-6. High-side Current Limit vs Input Voltage
VEN/EULVO = VSENSE
图8-5. DCDC UVLO Threshold
CC1= Rd
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8.8 Typical Characteristics (continued)
Unless otherwise specified the following conditions apply: VIN = 13.5 V, fSW = 2.1 MHz, L = 2.2 µH, CSENSE = 66 µF, C_BUS
=
1 µF, TA = 25 °C.
10.3
40
35
30
25
20
15
-40C
25C
150C
Vin = 5.5V
Vin = 13.5V
Vin = 26V
10.2
10.1
10
9.9
9.8
4
8
12
16
Input Voltage (V)
20
24
28
-50
-25
0
25
50
75
Temperature (C)
100
125
150
图8-7. Low-side Current Limit vs Input Voltage
I_BUS = 3 A
图8-8. High-side MOSFET on Resistance vs Junction
Temperature
18
16
14
12
3640
Vin = 5.5V
Vin = 13.5V
Vin = 26V
3600
3560
3520
3480
3440
3400
10
Vin = 5.5V
Vin = 13.5V
Vin = 26V
8
-50
-25
0
25
Temperature (C)
50
75
100
125
150
-50
-25
0
25
Temperature (C)
50
75
100
125
150
IBUS = 3 A
ILIM = GND
图8-9. Low-side MOSFET on Resistance vs Junction
图8-10. USB Power Switch Current Limit vs Junction
Temperature
Temperature
3520
2200
Vin = 5.5V
Vin = 13.5V
Vin = 26V
Vin = 5.5V
Vin = 13.5V
Vin = 26V
3480
3440
3400
3360
3320
3280
2160
2120
2080
2040
2000
1960
-50
-25
0
25
Temperature (C)
50
75
100
125
150
-50
-25
0
25
Temperature (C)
50
75
100
125
150
RILIM = 9.53 kΩ
RILIM = 15.4 kΩ
图8-11. USB Power Switch Current Limit vs Junction
图8-12. USB Power Switch Current Limit vs Junction
Temperature
Temperature
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8.8 Typical Characteristics (continued)
Unless otherwise specified the following conditions apply: VIN = 13.5 V, fSW = 2.1 MHz, L = 2.2 µH, CSENSE = 66 µF, C_BUS
1 µF, TA = 25 °C.
=
520
500
480
460
440
420
400
328
320
312
304
296
288
280
Vin = 5.5V
Vin = 13.5V
Vin = 26V
Vin = 5.5V
Vin = 13.5V
Vin = 26V
-50
-25
0
25
Temperature (C)
50
75
100
125
150
-50
-25
0
25
Temperature (C)
50
75
100
125
150
图8-13. OUT Power Switch Current Limit vs Junction
图8-14. VCONN Power Switch Current Limit vs Junction
Temperature
Temperature
100
96
92
88
84
80
9.6
8.8
8
7.2
6.4
Vin = 5.5V
Vin = 13.5V
Vin = 26V
5.6
4.8
-50
-25
0
25
Temperature (C)
50
75
100
125
150
-50
-25
0
25
Temperature (C)
50
75
100
125
150
图8-16. USB Power Switch On Resistance vs Junction
IBUS = 2.4 A
RIMON=2.21 kΩ
Temperature
图8-15. Cable Compensation Voltage vs Junction Temperature
400
600
550
500
450
400
Vin = 5.5V
Vin = 13.5V
Vin = 26V
360
320
280
240
200
160
Vin = 5.5V
Vin = 13.5V
Vin = 26V
350
300
-50
-25
0
25
Temperature (C)
50
75
100
125
150
-50
-25
0
25
Temperature (C)
50
75
100
125
150
图8-17. OUT Power Switch On Resistance vs Junction
图8-18. VCONN Power Switch On Resistance vs Junction
Temperature
Temperature
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8.8 Typical Characteristics (continued)
Unless otherwise specified the following conditions apply: VIN = 13.5 V, fSW = 2.1 MHz, L = 2.2 µH, CSENSE = 66 µF, C_BUS
=
1 µF, TA = 25 °C.
424
416
408
400
392
384
2280
2240
2200
2160
2120
2080
2040
Vin = 5.5V
Vin = 13.5V
Vin = 26V
Vin = 5.5V
Vin = 13.5V
Vin = 26V
376
-50
-25
0
25
Temperature (C)
50
75
100
125
150
-50
-25
0
25
Temperature (C)
50
75
100
125
150
RFREQ = 49.9 kΩ
RFREQ = 8.45 kΩ
图8-19. Switching Frequency vs Junction Temperature
图8-20. Switching Frequency vs Junction Temperature
450
0.56
UFP 1.5A
UFP 3A
400
0.54
0.52
0.5
350
300
250
200
150
0.48
0.46
0.44
-50
-25
0
25
Temperature (C)
50
75
100
125
150
-50
-25
0
25
Temperature (C)
50
75
100
125
150
图8-21. CC Sourcing Current vs Junction Temperature
图8-22. TS Temperature Wam Threshold vs Junction
Temperature
0.72
0.7
4.82
4.8
0.68
0.66
0.64
0.62
0.6
4.78
4.76
4.74
4.72
4.7
-50
-25
0
25
Temperature (C)
50
75
100
125
150
-50
-25
0
25
Temperature (C)
50
75
100
125
150
图8-23. TS Temperature Hot Threshold vs Junction
图8-24. SENSE Voltage in Temperature Hot vs Junction
Temperature
Temperature
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9 Parameter Measurement Information
OUT
90%
R(L)
tr
C(L)
tf
V(OUT)
10%
图9-1. OUT Rise-Fall Test Load Figure
图9-2. Power-On and -Off Timing
V(EN)
50%
50%
5 V
ton
toff
t(DCHG)
V(OUT)
90%
V(OUT)
0 V
10%
图9-3. OUT Discharge During Mode Change
图9-4. Enable Timing, Active-High Enable
IOS
I(OUT)
t(IOS)
图9-5. Output Short-Circuit Parameters
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10 Detailed Description
10.1 Overview
The TPS2585x-Q1 is full-featured solution for implementing a compact USB charging port with support for both
Type-C and BC1.2 standards. Both devices contain an efficient buck regulator power source. For single Type-C
port, the TPS2585x-Q1 is capable of providing 3.4 A of output current at 5.1 V (nominal), which is 3 A for Type-C
port, 200 mA for OUT pin, and 200 mA for VCONN power. The TPS2585x-Q1 is an automotive-focused USB
charging controller, to offer a robust solution, TI recommends to add adequate protection (TVS3300 equivalent
or better but auto quality) on IN pin to protect systems from high power transients or lightning strikes.
System designers can optimize efficiency or solution size through careful selection of switching frequency in the
range of 200 kHz–2400 kHz with sufficient margin to operate above or below the AM radio frequency band.
TPS2585x-Q1 protects itself with internal thermal sensing circuits that monitor the operating temperature of the
junction and disables operation if the temperature exceeds the Thermal Shutdown threshold, so in high ambient
temperature application, the 3.4-A output current capability is not assured. In the TPS2585x-Q1, the buck
regulator operates in forced PWM mode, ensuring fixed switching frequency regardless of load current. Spread-
spectrum frequency dithering reduces harmonic peaks of the switching frequency, potentially simplifying EMI
filter design and easing compliance.
Current sensing through a precision FET current sense amplifier on USB port enables an accurate, user
programmable over-current limit setting, and programmable linear cable compensation to overcome IR losses
when powering remote USB ports.
TPS2585x-Q1 includes a TS input for user programmable thermal protection using a negative temperature
coefficient (NTC) resistor. The TPS25855-Q1 has THERM_WARN flag to indicate the NTC temperature is warm
before it enters the temperature hot range.
Both devices can support the USB Type-C protocol, and also support the legacy Battery Charging Specification
Rev 1.2 (BC1.2) DCP mode with auto-detect feature to charge not only BC1.2 compliant hand-held devices but
also popular phones and tablets that incorporate their own propriety charging algorithm. The TPS2585x-Q1 also
supports USB cable polarity detection and fault condition detection.
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10.2 Functional Block Diagram
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10.3 Feature Description
10.3.1 Power Down or Undervoltage Lockout
The device is in power down mode if the IN terminal voltage is less than VUVLO. The part is considered dead
and all the terminals are high impedance. Once the IN voltage rises above the VUVLO threshold, the IC enters
sleep mode or active mode depending on the EN/UVLO voltage.
The voltage on the EN/UVLO pin controls the ON/OFF operation of TPS2585x-Q1. An EN/UVLO pin voltage
higher than VEN/UVLO-H is required to start the internal regulator and begin monitoring the CCn lines for a valid
Type-C connection. The internal USB monitoring circuitry is on when VIN is within the operation range and the
EN/UVLO threshold is cleared. The buck regulator starts to operate, however, the USB ports load switch remain
OFF until a valid Type-C detection has been made. This feature ensures the cold socket (0 V) USB Type-C VBUS
requirement is met.
The EN/UVLO pin is an input and cannot be left open or floating. The simplest way to enable the operation of the
TPS2585x-Q1 is to connect the EN to SENSE. This connection allows self-start-up of the TPS2585x-Q1 when
VIN is within the operation range. Note that cannot connect the EN to IN pin directly for self-start-up.
Many applications benefit from the employment of an enable divider RENT and RENB to establish a precision
system UVLO level for the TPS2585x-Q1, shown in 图 10-1. The system UVLO can be used for sequencing,
ensuring reliable operation, or supply protection, such as a battery discharge level. To ensure the USB ports
VBUS is within the 5-V operating range as required for USB compliance (for the latest USB specifications and
requirements, refer to USB.org), TI suggests that the RENT and RENB resistors be chosen such that the
TPS2585x-Q1 enables when VIN is approximately 6 V. Considering the drop out voltage of the buck regulator
and IR loses in the system, 6 V provides adequate margin to maintain VBUS within USB specifications. If system
requirements such as a warm crank (start) automotive scenario require operation with VIN < 6 V, the values of
RENT and RENB can be calculated assuming a lower VIN. An external logic signal can also be used to drive EN/
UVLO input when a microcontroller is present and it is desirable to enable or disable the USB port remotely for
other reasons.
IN
RENT
EN
RENB
图10-1. System UVLO by Enable Divider
UVLO configuration using external resistors is governed by the following equations:
(1)
(2)
Example:
VIN(ON) = 6V
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RENT = 20 kΩ
RENB = [(VEN-VOUT-H) / (VIN(ON) –VEN)] × RENT
(3)
RENB = 5 kΩ
Therefore VIN(OFF) = 5.5 V
10.3.2 Input Overvoltage Protection (OVP) - Continuously Monitored
The operation voltage range for TPS2585x-Q1 is up to 26 V. If the input source applies an overvoltage, the buck
regulator HSFET/LSFET turns off immediately. Thus, the USB ports and OUT pin loses their power as well.
Once the overvoltage returns to a normal voltage, the buck regulator continues switching and provide power on
the USB ports and OUT pin.
During the overvoltage condition, the internal regulator regulates the SENSE voltage at 5 V, so the SENSE
always has power for internal bias circuit and external NTC pull-up reference.
10.3.3 Buck Converter
The following operating description of the TPS2585x-Q1 refers to the Functional Block Diagram. The TPS2585x-
Q1 integrates a monolithic, synchronous, rectified, step-down, switch-mode converter with internal power
MOSFETs and USB current-limit switches with charging ports auto-detection. The TPS2585x-Q1 offers a
compact and high efficiency solution with excellent load and line regulation over a wide input supply range. The
TPS2585x-Q1 supplies a regulated output voltage by turning on the high-side (HS) and low-side (LS) NMOS
switches with controlled duty cycle. During high-side switch ON time, the SW pin voltage swings up to
approximately VIN, and the inductor current, iL, increase with linear slope (VIN – VOUT ) / L. When the HS switch
is turned off by the control logic, the LS switch is turned on after an anti-shoot-through dead time. Inductor
current discharges through the LS switch with a slope of –VOUT / L. The control parameter of a buck converter
is defined as Duty Cycle D = tON / TSW, where tON is the high-side switch ON time and TSW is the switching
period, shown in 图 10-2. The regulator control loop maintains a constant output voltage by adjusting the duty
cycle D. In an ideal buck converter, where losses are ignored, D is proportional to the output voltage and
inversely proportional to the input voltage: D = VOUT / VIN.
VSW
D = tON/ TSW
VIN
tON
tOFF
t
0
-VD
TSW
iL
ILPK
IOUT
DiL
t
0
图10-2. SW Node and Inductor Current Waveforms in Continuous Conduction Mode (CCM)
The TPS2585x-Q1 operates in a fixed-frequency, peak-current-mode control to regulate the output voltage. A
voltage feedback loop is used to get accurate DC voltage regulation by adjusting the peak current command
based on voltage offset. The peak inductor current is sensed from the high-side switch and compared to the
peak current threshold to control the ON time of the high-side switch. The voltage feedback loop is internally
compensated, which allows for fewer external components, makes it easy to design, and provides stable
operation with a reasonable combination of output capacitors. TPS2585x-Q1 operates in FPWM mode for low
output voltage ripple, tight output voltage regulation, and constant switching frequency.
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10.3.4 FREQ/SYNC
The switching frequency of the TPS2585x-Q1 can be programmed by the resistor RFREQ from the FREQ/SYNC
pin and AGND pin. Use 方程式4 to determine the FREQ resistance, for a given switching frequency.
-1.0483
RFREQ kW = 26660ì ƒ
kHz
SW
(4)
70
65
60
55
50
45
40
35
30
25
20
15
10
5
200 400 600 800 1000 1200 1400 1600 1800 2000 2200
Switching Frequency (kHz)
D024
图10-3. FREQ Set Resistor vs Switching Frequency
The normal method of setting the buck regulator switching frequency is by selecting an appropriate value FREQ
resistor. 表10-1 lists the typical FREQ resistors value.
表10-1. Setting the Switching Frequency with FREQ
SWITCHING FREQUENCY (KHz)
FREQ (KΩ)
80.6
253
400
49.9
19.1
1000
2100
2200
8.87
8.45
The FREQ/SYNC pin can be used to synchronize the internal oscillator to an external clock. The internal
oscillator can be synchronized by AC coupling a positive edge into the FREQ/SYNC pin. When using a low
impedance signal source, the frequency setting resistor FREQ is connected in parallel with an AC coupling
capacitor, CCOUP, to a termination resistor, RTERM (for example, 50 Ω). The two resistors in series provide the
default frequency setting resistance when the signal source is turned off. A 10-pF ceramic capacitor can be used
for CCOUP. The AC coupled peak-to-peak voltage at the FREQ/SYNC pin must exceed the SYNC amplitude
threshold of 1.2 V (typical) to trip the internal synchronization pulse detector, and the minimum SYNC clock
HIGH and LOW time must be longer than 100 ns (typical). A 2.5-V or higher amplitude pulse signal coupled
through a 1-nF capacitor, CSYNC, is a good starting point. 图 10-4 shows the device synchronized to an external
system clock. The external clock must be off before start-up to allow proper start-up sequencing.
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CCOUP
RT
PLL
PLL
Lo-Z
Clock
Hi-Z
Clock
Source
FREQ/
SYNC
FREQ/
SYNC
RTERM
RT
Source
图10-4. Synchronize to External Clock
The TPS25854-Q1 switching action can be synchronized to an external clock from 200 KHz to 800 KHz, and the
TPS25855-Q1 switching action can be synchronized to an external clock from 200 KHz to 3 MHz. Even the
switching frequency can be set to higher than 2.4 MHz, but TI recommends to set the switching frequency below
2.4 MHz due to the power dissipation, the higher switching frequency results in more power loss on IC, causing
the junction temperature and also the board temperature rising, then the device can enter load shedding under
high ambient temperature.
10.3.5 Bootstrap Voltage (BOOT)
The TPS2585x-Q1 provides an integrated bootstrap voltage regulator. A small capacitor between the BOOT and
SW pins provides the gate drive voltage for the high-side MOSFET. The BOOT capacitor is refreshed when the
high-side MOSFET is off and the low-side switch conducts. The recommended value of the BOOT capacitor is
100 nF. A ceramic capacitor with an X7R or X5R grade dielectric with a voltage rating of 10 V or higher is
recommended for stable performance over temperature and voltage. The BOOT rail has a UVLO to protect the
chip from operation with too little bias, and is typically 2.2 V. If the BOOT capacitor voltage drops below UVLO
threshold, then the device initiates a charging sequence using the low-side FET before attempting to turn on the
high-side device.
10.3.6 Minimum ON-time, Minimum OFF-time
Minimum ON-time, TON_MIN, is the smallest duration of time that the HS switch can be on. TON_MIN is typically 84
ns in the TPS2585x-Q1. Minimum OFF-time, TOFF_MIN, is the smallest duration that the HS switch can be off.
TOFF_MIN is typically 81 ns in the TPS2585x-Q1. In CCM (FPWM) operation, TON_MIN and TOFF_MIN limit the
voltage conversion range given a selected switching frequency.
The minimum duty cycle allowed is:
DMIN = TON_MIN × fSW
(5)
And the maximum duty cycle allowed is:
DMAX = 1 –TOFF_MIN × fSW
(6)
Given fixed TON_MIN and TOFF_MIN, the higher the switching frequency the narrower the range of the allowed duty
cycle.
Given an output voltage, the choice of the switching frequency affects the allowed input voltage range, solution
size and efficiency. The maximum operation supply voltage can be found by:
VOUT
V
=
IN_MAX
f
ì TON_MIN
SW
(7)
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At lower supply voltage, the switching frequency is limited by TOFF_MIN. The minimum VIN can be approximated
by:
VOUT
V
=
IN_MIN
1- f
ì TOFF _MIN
SW
(8)
Taking considerations of power losses in the system with heavy load operation, VIN_MAX is higher than the result
calculated in 方程式7.
If minimum ON-time or minimum OFF-time do not support the desired conversion ratio, frequency is reduced
automatically allowing regulation to maintain during load dump and with very low dropout during cold crank even
with high operating-frequency setting.
10.3.7 Internal Compensation
The TPS2585x-Q1 is internally compensated. The internal compensation is designed such that the loop
response is stable over the specified operating frequency and output voltage range. The TPS25854-Q1 is
optimized for transient response over the range 200 kHz ≤ fsw ≤ 800 kHz, and the TPS25855-Q1 is optimized
for transient response over the range 200 kHz ≤fsw ≤3000 kHz.
10.3.8 Current Limit and Short Circuit Protection
For maximum versatility, TPS2585x-Q1 includes both a precision, programmable current limit as well as cycle-
by-cycle current limit to protect the USB port from extreme overload conditions. The RILIM resistor determines the
overload threshold on the USB ports in the event ILIM is shorted to ground to set the default USB current limit.
The cycle-by-cycle current limit serves as a backup means of protection.
10.3.8.1 USB Switch Programmable Current Limit (ILIM)
Because the TPS2585x-Q1 integrates an USB current-limit switches, it provides adjustable current limit to
prevent USB port overheating. The device engages the two-level current limit scheme, which has one typical
current limit, IOS_BUS, and the secondary current limit, IOS_HI. The secondary current limit, IOS_HI, is 1.6 times the
primary current limit, IOS_BUS. The secondary current limit acts as the current limit threshold for a deglitch time,
t
IOS_HI_DEG, then the USB power switch current limit threshold is set back to IOS_BUS. 方程式 9 calculates the
value of resistor for adjusting the typical current limit.
32273
RILIM Kꢀ =
(
)
IOS _BUS (mA)
(9)
This equation assumes an ideal-no variation-external adjusting resistor. To take resistor tolerance into account,
first determine the minimum and maximum resistor values based on its tolerance specifications and use these
values in the equations. Because of the inverse relationship between the current limit and the adjusting resistor,
use the maximum resistor value in the IOS(min) equation and the minimum resistor value in the IOS(max) equation.
表10-2 lists the typical RILIM resistor value.
表10-2. Setting the Current Limit with RILIM
IOS_BUS - Current Limit Threshold (mA)
RILIM (KΩ)
19.1
1690
2096
2806
3386
3550
15.4
11.5
9.53
Short to GND
For the normal application, it can short the ILIM pin to GND directly, which sets a default 3.55-A current limit with
a maximum ±15% variation on each USB port to follow the Type-C specification. The TPS2585x-Q1 provides
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built-in soft-start circuitry that controls the rising slew rate of the output voltage to limit inrush current and voltage
surges.
The secondary current limit, IOS_HI, allows the USB port pull out a larger current for a short time during transient
overload conditions, which can bring benefits for USB port special overload testing like MFi OCP. In a normal
application, once the device is powered on and USB port is not in UVLO, the USB port current limit threshold is
overridden by the secondary current limit, IOS_HI, so the USB port can output as high as a 1.6 × IOS_BUS current
for typically 2 ms. After the deglitch time, tIOS_HI_DEG, the current limit threshold is set back to the typical current
with IOS_BUS. The secondary current limit threshold does not resume until after the tIOS_HI_RST deglitch time,
which is typically 16 ms. If there is an inrush current higher than the IOS_HI threshold, the current limit is set back
to IOS_BUS immediately, without waiting for a tIOS_HI_DEG
.
The TPS2585x-Q1 responds to overcurrent conditions by limiting output current to IOS_BUS as shown in previous
equation. When an overload condition occurs, the device maintains a constant output current and the output
voltage reduces accordingly. Three possible overload conditions can occur:
• The first condition is when a short circuit or overload is applied to the USB output when the device is powered
up or enabled. There can be inrush current and once it triggers the approximate 8-A threshold, a fast turnoff
circuit is activated to turn off the USB power switch within tIOS_USB before the current limit control loop is able
to respond (shown in 图10-5). After the fast turnoff is triggered, the USB power switch current-sense
amplifier is over-driven during this time and momentarily disables the internal N-channel MOSFET to turn off
USB port. The current-sense amplifier then recovers and ramps the output current with a soft start. If the USB
port is still in overcurrent condition, the short circuit and overload hold the output near zero potential with
respect to ground and the power switch ramps the output current to IOS_BUS. If the overcurrent limit condition
lasts longer than 4.1 ms, the corresponding USB channel enters hiccup mode with 524 ms of off-time and 4.1
ms of on-time.
IBUS
IOS_BUS
t
hiccup OFF
hiccup ON
tIOS
图10-5. Response Time to BUS Short-Circuit
• The second condition is the load current increases above IOS_BUS but below the IOS_HI setting. The device
allows the USB port to output this large current for tIOS_HI_DEG, without limiting the USB port current to
IOS_BUS. After the tIOS_HI_DEG deglitch time, the device limits the output current to IOS_BUS and works in a
constant current-limit mode. If the load demands a current greater than IOS_BUS, the USB output voltage
decreases to IOS_BUS × RLOAD for a resistive load, which is shown in 图10-6. If the overcurrent limit condition
lasts longer than 4.1 ms, the corresponding USB channel enters hiccup mode with 524 ms of off-time and 4.1
ms of on-time. Another USB channel still works normally.
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I
BUS(A)
V
BUS(V)
5
IOS_HI
IOS_BUS
0
hiccup OFF
hiccup OFF
hiccup ON
hiccup ON
tIOS_HI_DEG
t
图10-6. BUS Overcurrent Protection
• The third condition is the load current increases just over the IOS_HI setting. In this case, the load current does
not trigger the fast turnoff. The USB power switch current limit threshold is set back to the primary current
limit, IOS_BUS, immediately. If the load still demands a current greater than IOS_BUS, the USB output voltage
decreases to IOS_BUS × RLOAD for a resistive load, which is shown in 图10-7. If the overcurrent limit condition
lasts longer than 4.1 ms, the corresponding USB channel enters hiccup mode with 524 ms of off-time and 4.1
ms of on-time. Another USB channel still works normally.
I
BUS(A)
V
BUS(V)
5
IOS_HI
IOS_BUS
0
hiccup OFF
hiccup OFF
hiccup ON
hiccup ON
t
图10-7. BUS Overcurrent Protection: Two-Level Current Limit
The TPS2585x-Q1 thermal cycles if an overload condition is present long enough to activate thermal limiting in
any of the previously mentioned cases. Thermal limiting turns off the internal NFET and starts when the NFET
junction temperature exceeds 160°C (typical). The device remains off until the NFET junction temperature cools
10°C (typical) and then restarts. This extra thermal protection mechanism can help prevent further junction
temperature rise, which can cause the device to turn off due to junction temperature exceeding the main thermal
shutdown threshold, TSD
.
10.3.8.2 Cycle-by-Cycle Buck Current Limit
The buck regulator cycle-by-cycle current limit on both the peak and valley of the inductor current.
High-side MOSFET overcurrent protection is implemented by the nature of the peak current mode control. The
HS switch current is sensed when the HS is turned on after a set blanking time. The HS switch current is
compared to the output of the Error Amplifier (EA) minus slope compensation every switching cycle. The peak
current of HS switch is limited by a clamped maximum peak current threshold IHS_LIMIT which is constant. So the
peak current limit of the high-side switch is not affected by the slope compensation and remains constant over
the full duty cycle range.
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The current going through LS MOSFET is also sensed and monitored. When the LS switch turns on, the inductor
current begins to ramp down. The LS switch does not turn OFF at the end of a switching cycle if its current is
above the LS current limit ILS_LIMIT. The LS switch is be kept ON so that inductor current keeps ramping down,
until the inductor current ramps below the LS current limit ILS_LIMIT. Then the LS switch turns OFF and the HS
switch turns on after a dead time. This action is somewhat different than the more typical peak current limit, and
results in 方程式10 for the maximum load current.
V
IN - VOUT
(
)
ì
VOUT
IOUT _MAX = ILS _LIMIT
+
2ì fSW ìL
V
IN
(10)
10.3.8.3 OUT Current Limit
TPS2585x-Q1 can provide 200mA current at OUT pin, to power the external load such as the HUB. The OUT
regulator input comes from the buck output, so the voltage is the same with the SNESE pin.
If the OUT current reaches the current limit level, the OUT pin MOSFET works in a constant current-limit mode.
If the over-current limit condition lasts longer than 4.1 ms (VOUT does not drop too low), it enters hiccup mode
with 4.1 ms of on-time and 524 ms of off-time.
10.3.9 Cable Compensation
When a load draws current through a long or thin wire, there is an IR drop that reduces the voltage delivered to
the load. In the vehicle from the voltage regulator output VOUT to VBUS (input voltage of portable device), the total
resistance of PCB trace, connector, and cable resistances causes an IR drop at the portable device input, so the
charging current of most portable devices is less than their expected maximum charging current. The voltage
drop shows in 图10-8.
5.x
V(DROP)
VOUT with compensation
VBUS with compensation
VBUS without compensation
3
1
2
Output Current (A)
图10-8. Voltage Drop
To handle this case, TPS2585x-Q1 builds in the cable compensation function, which increases the voltage at the
SENSE pin to compensate the IR drop in the charging path according to the gain set by RIMON, to maintain a
fairly constant output voltage at the load-side voltage.
TPS2585x-Q1 use the switch current-sense output voltage to compensate for the line drop voltage. The cable
compensation amplitude increases linearly as the load current increases. It also has an upper limit that the
maximum cable compensation voltage is 400 mV, the voltage at USB port clamps below 5.5 V. The cable
compensation voltage is programmable through an external resistor at IMON pin. RIMON is then chosen by RIMON
= ΔVIMON × 1000 / (IBUS × 0.0169), where ΔVOUT is the desired cable droop compensation voltage at full load.
See below 表10-3 and 图10-9.
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表10-3. TPS2585x-Q1 Cable Compensation Setting
Resistor at IMON pin
Cable Compensation Voltage at 2.4 A
0
RIMON = 0 Ω
39.5 mV
119 mV
202 mV
283 mV
360 mV
396 mV
RIMON = 0.976 KΩ
RIMON = 2.94 KΩ
RIMON = 4.99 KΩ
RIMON = 6.98 KΩ
RIMON = 8.87 KΩ
RIMON = 9.76 KΩ
图10-9. TPS2585x-Q1 Cable Compensation
10.3.10 Thermal Management With Temperature Sensing (TS) and OTSD
The TS input pin allows for user-programmable thermal protection (for the TS pin thresholds, see the Electrical
Characteristics). The TS input pin threshold is ratiometric with VSENSE. The external resistor divider setting, VTS,
must be connected to the TPS2585x-Q1 SENSE pin to achieve accurate results (refer to the 图 10-10). When
VTS = 0.5 × VSENSE, the TPS2585x-Q1 performs below action:
• If operating with 3-A Type-C advertisement, the Px_CC1, Px_CC2 pin automatically reduces advertisement to
the 1.5-A level.
VSENSE
RSER
VSENSE
RPARA
RNTC
RB
TS
CC override
(3A -> 1.5A)
Vth9 ≈ 0.5 x VSENSE
Vhys ≈ 500mV
TS_TEMP_HOT
Vth9 ≈ 0.65 x VSENSE
Vhys ≈ 500mV
图10-10. TS Input
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If the overtemperature condition persists, causing VTS = 0.65 × VSENSE, the TPS2585x-Q1 performs below
actions:
• Broadcasts the default USB power mode, in default USB power, the charging is ideally reduced further per
the USB2.0 and USB3.0 specification.
• Buck regulator output voltage at the SENS pin is reduced to 4.77 V.
If the overtemperature condition persists, causing TJ to reach the OTSD threshold, then the device thermal shuts
down. 图 10-11 shows the TPS2585x-Q1 behavior when TS pin voltage trigger the Temp Warm and Temp Hot
threshold.
ICCx (uA)
VBUS (V)
BUS Voltage
5.1
4.77
330
CC Broad Current
180
80
T1(Temp Warm)
T2(Temp Hot)
OTSD
图10-11. TPS2585x-Q1 Behavior When Trigger Temp Warm/Hot Threshold
The NTC thermistor must be placed near the hottest point on the PCB. In most cases, this placement is close to
the SW node of the TPS2585x-Q1, near the buck inductor.
Tuning the VNTC threshold levels of VTEMP_WARM and VTEMP_HOT is achieved by adding RSER, RPARA, or both
RSER and RPARA in conjunction with RNTC. 图 10-12 is an example illustrating how to set the VTEMP_WARM
threshold between 81°C and 90°C with a ΔT between TEMP_WARM assertion and TEMP_HOT assertion of
18°C to 29°C. Consult the chosen NTC manufacturer's specification for the value of β. Establishing the desired
warning and shutdown thresholds can take some iteration.
Below is NTC spec and resistor value used in 图10-12 example.
• R0 = 470 kΩ. β= 4750. RNTC = R0 × exp β× (1/T –1/T0).
• RPARA = 100 kΩ.
• RSER = 5.1 kΩ.
• RB = RNTC(at TEMP_WARM) = 27 kΩ.
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5
4.5
4
3.5
3
VTS (V)
VTS w/ top ser (V)
VTS w/ top || (V)
VTS w/ para + ser (V)
TEMP_WARM
TEMP_HOT
2.5
2
1.5
1
0.5
0
0
20
40
60
80
100
120
140
NTC Temperature (°C)
T NTC (°C)
90
Rising Thresholds
Temp Warm
Temp Hot
V (V)
T NTC || (°C) T NTC ser (°C) T NTC || + ser (°C)
=VSENSE * 0.5
=VSENSE * 0.65
2.55
3.315
81
103
22
95
121
26
89
108
118
TEMP_HOT - TEMP_WARM
18
29
图10-12. VTS Threshold Design Examples
10.3.11 Thermal Shutdown
The device has an internal over temperature shutdown threshold, TSD to protect the device from damage and
overall safety of the system. When device temperature exceeds TSD, the device is turned off when thermal
shutdown activates. Once the die temperature falls below 154°C (typical), the device re initiates the power up
sequence controlled by the internal soft-start circuitry.
10.3.12 FAULT Indication
For the TPS25854-Q1 and TPS25855-Q1, FAULT is the fault indication pins for USB port. FAULT is in an open-
drain state during shutdown, start-up, or normal condition. When the USB switch enters hiccup mode, or over-
temperature thermal shutdown (OTSD) is triggered, FAULT is pulled low. FAULT asserts (logic low) on an
individual USB switch during an over-current or over-temperature condition. FAULT switches high after the fault
condition is removed, and the USB output voltage goes high again.
The device features an active-low, open-drain fault output. Connect a 100-kΩ pull-up resistor from FAULT to
SENSE or other suitable I/O voltage. FAULT can be left open or tied to GND when not used.
表10-4 summarizes the conditions that generate a fault and actions taken by the device.
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表10-4. Fault Conditions
EVENT
CONDITION
ACTION
BUS load switch enter hiccup mode. The fault indicator
asserts with a 4.1-ms deglitch and de-asserts with a 16.4-ms
deglitch. The fault indicator remains asserted during the BUS
overload condition.
Overcurrent on BUS
IBUS > Programmed IILIM
The device immediately disables and asserts fault indicator
with no deglitch. The device attempts to power up once the
die temperature decreases below the thermal hysteresis
threshold as specified.
TPS2585x-Q1
overtemperature
TJ > TSD
10.3.13 USB Specification Overview
All USB ports are capable of providing a 5-V output making them a convenient power source for operating and
charging portable devices. USB specification documents outline specific power requirements to ensure
interoperability. In general, a USB 2.0 port host port is required to provide up to 500 mA; a USB 3.0 or USB 3.1
port is required to provide up to 900 mA; Ports adhering to the USB Battery Charging 1.2 Specification provide
up to 1500 mA; And newer Type-C ports can provide up to 3000 mA. Though USB standards governing power
requirements exist, some manufacturers of popular portable devices created their own proprietary mechanisms
to extend allowed available current beyond the 1500-mA maximum per BC 1.2. While not officially part of the
standards maintained by the USB-IF, these proprietary mechanisms are recognized and implemented by
manufacturers of USB charging ports.
The TPS2585x-Q1 device supports five of the most-common USB-charging schemes found in popular handheld
media and cellular devices.
• USB Type-C (1.5-A and 3-A advertisement)
• USB Battery Charging Specification BC1.2 DCP mode
• Chinese Telecommunications Industry Standard YD/T 1591-2009
• Divider 3 mode
• 1.2-V mode
10.3.14 USB Type-C® Basics
For a detailed description of the Type-C specification, refer to the USB-IF website to download the latest
released version. Some of the basic concepts of the Type-C spec that pertains to understanding the operation of
the TPS2585x-Q1 (a DFP device) are described as follows.
USB Type-C removes the need for different plug and receptacle types for host and device functionality. The
Type-C receptacle replaces both the Type-A and Type-B receptacles because the Type-C cable is plug-able in
either direction between the host and device. A host-to-device logical relationship is maintained by the
configuration channel (CC). Optionally, hosts and devices can be either providers or consumers of power when
USB PD communication is used to swap roles.
All USB Type-C ports operate in one of following data modes:
• Host mode: the port can only be a host (provider of power).
• Device mode: the port can only be a device (consumer of power).
• Dual-Role mode: the port can be either a host or device.
Port types:
• DFP (Downstream Facing Port): host
• UFP (Upstream Facing Port): device
• DRP (Dual-Role Port): host or device
Valid DFP-to-UFP connections:
• 表10-5 describes valid DFP-to-UFP connections.
• Host-to-Host or Device-to-Device have no functions.
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表10-5. DFP-to-UFP Connections
DEVICE-MODE
HOST-MODE PORT
DUAL-ROLE PORT
PORT
Host-Mode port
No function
Works
Works
Works
Works
Device-Mode port
Dual-Role port
No function
Works
Works
Works(1)
(1) This port can be automatic or manually driven.
10.3.14.1 Configuration Channel
The function of the configuration channel is to detect connections and configure the interface across the USB
Type-C cables and connectors.
Functionally the Configuration Channel (CC) is used to serve the following purposes:
• Detect connect to the USB ports
• Resolve cable orientation and twist connections to establish USB data bus routing
• Establish DFP and UFP roles between two connected ports
• Discover and configure power: USB Type-C current modes or USB Power Delivery
• Discovery and configure optional Alternate and Accessory modes
• Enhance flexibility and ease of use
Typical flow of DFP to UFP configuration is shown in 图10-13:
图10-13. Flow of DFP to UFP Configuration
10.3.14.2 Detecting a Connection
DFPs and DRPs fulfill the role of detecting a valid connection over USB Type-C. 图 10-14 shows a DFP-to-UFP
connection made with a Type-C cable. As shown in 图 10-14, the detection concept is based on being able to
detect terminations in the product that have been attached. A pull-up and pull-down termination model is used. A
pull-up termination can be replaced by a current source.
• In the DFP-UFP connection, the DFP monitors both CC pins for a voltage lower than the unterminated
voltage.
• An UFP advertises Rd on both its CC pins (CC1 and CC2).
• A powered cable advertises Ra on only one of the CC pins of the plug. Ra is used to inform the source to
apply VCONN.
• An analog audio device advertises Ra on both CC pins of the plug, which identifies it as an analog audio
device. VCONN is not applied on either CC pin in this case.
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UFP monitors for
connection
DFP monitors for
connection
Cable
CC
Rp
Rp
Rds
Rds
Ra
Ra
DFP monitors for
connection
UFP monitors for
connection
图10-14. DFP-UFP Connection
For USB Type-C solutions, two pins (CC1, CC2) on the connector are used to establish and manage the source-
to-sink connection. The general concept for setting up a valid connection between a source and a sink is based
on being able to detect terminations residing in the product being attached. To aid in defining the functional
behavior of CC, a pull-up (Rp) and pull-down (Rd 5.1 kΩ) termination model is used based on a pull-up resistor
and pull-down resistor.
Initially, a source exposes independent Rp terminations on its CC1 and CC2 pins, and a sink exposes
independent Rd terminations on its CC1 and CC2 pins. The source-to-sink combination of this circuit
configuration represents a valid connection. To detect this connection, the source monitors CC1 and CC2 for a
voltage lower than its unterminated voltage. The choice of Rp is a function of the pull-up termination voltage and
the detection circuit of the source. This choice indicates that either a sink, a powered cable, or a sink connected
by a powered cable has been attached. Prior to the application of VCONN, a powered cable exposes Ra
(typically 1 kΩ) on its VCONN pin. Ra represents the load on VCONN plus any resistive elements to ground. In
some cable plugs, this can be a pure resistance, and in others, it can simply be the load.
The source must be able to differentiate between the presence of Rd and Ra to know whether there is a sink
attached and where to apply VCONN. The source is not required to source VCONN unless Ra is detected. Two
special termination combinations on the CC pins as seen by a source are defined for directly attached accessory
modes: Ra/Ra for audio adapter accessory mode and Rd/Rd for debug accessory mode.
10.3.14.3 Plug Polarity Detection
Reversible Type-C plug orientation is reported by the POL pin when a UFP is connected. However when no UFP
is attached, POL remains de-asserted irrespective of cable plug orientation. 表 10-6 describes the POL state
based on which device CC pin detects VRD from an attached UFP pull-down.
表10-6. Plug Polarity Detection
CC1
Rd
CC2
Open
Rd
POL
STATE
Hi-Z
UFP connected
Open
Asserted (pulled low)
UFP connected with reverse plug orientation
10.3.15 USB Port Operating Modes
10.3.15.1 USB Type-C® Mode
The TPS2585x-Q1 is a Type-C controller that supports all Type-C functions in a downstream facing port. The
TPS2585x-Q1 is also used to manage current advertisement and protection to a connected UFP and active
cable. When VSENSE exceeds the undervoltage lockout threshold, the device samples the EN pin. A high level on
this pin enables the device and normal operation begins. Having successfully completed its start-up sequence,
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the device now actively monitors its CC1 and CC2 pins for attachment to a UFP. When a UFP is detected on
either the CC1 or CC2 pin the USB power switch turn-ons. If Ra is detected on the other CC pin (not connected
to UFP), VCONN is applied to allow current to flow to the CC pin connected to Ra.
10.3.15.2 Dedicated Charging Port (DCP) Mode
A DCP only provides power and does not support data connection to an upstream port. As shown in the
following sections, a DCP is identified by the electrical characteristics of the data lines. The TPS2585x-Q1 only
emulates one state, DCP-auto state. In the DCP-auto state, the device charge-detection state machine is
activated to selectively implement charging schemes involved with the shorted, Divider 3 and 1.2-V modes. The
shorted DCP mode complies with BC1.2 and Chinese Telecommunications Industry Standard YD/T 1591-2009,
whereas the Divider 3 and 1.2-V modes are employed to charge devices that do not comply with the BC1.2 DCP
standard.
10.3.15.2.1 DCP BC1.2 and YD/T 1591-2009
Both standards specify that the D+ and D– data lines must be connected together with a maximum series
impedance of 200 Ω, as shown in 图10-15.
VBUS
5 V
D–
200 Ω
(ma x.)
D+
GND
图10-15. DCP Supporting BC1.2 and YD/T 1591-2009
10.3.15.2.2 DCP Divider-Charging Scheme
The device supports Divider 3, as shown in 图10-16. In the Divider 3 charging scheme, the device applies 2.7 V
and 2.7 V to D+ and D–data lines.
VBUS
5 V
D–
D+
2.7 V
2.7 V
GND
图10-16. Divider 3 Mode
10.3.15.2.3 DCP 1.2-V Charging Scheme
The DCP 1.2-V charging scheme is used by some handheld devices to enable fast charging at 2 A. The
TPS2585x-Q1 device supports this scheme in DCP-auto state before the device enters BC1.2 shorted mode. To
simulate this charging scheme, the D+ and D– lines are shorted and pulled up to 1.2 V for a fixed duration.
Then the device moves to DCP shorted mode as defined in the BC1.2 specification and as shown in 图10-17.
VBUS
5 V
200 Ω (ma x.) D–
D+
1.2 V
GND
图10-17. 1.2-V Mode
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10.3.15.3 DCP Auto Mode
The TPS2585x-Q1 device integrates an auto-detect state machine that supports all the DCP charging schemes
as shown in 图 10-18. The auto-detect state machine starts in the Divider 3 scheme. If a BC1.2 or YD/T
1591-2009 compliant device is attached, the TPS2585x-Q1 device responds by turning the power switch back
on without output discharge and operating in 1.2-V mode briefly before entering BC1.2 DCP mode. Then, the
auto-detect state machine stays in that mode until the device releases the data line, in which case, the auto-
detect state machine goes back to the Divider 3 scheme. When a Divider 3-compliant device is attached, the
TPS2585x-Q1 device stays in the Divider 3 state.
5 V
S1
Divider 3 Mode
VBUS
S1, S2: ON
S3, S4: OFF
DM_IN
DP_IN
GND
D–
D+
S2
S3
S4
Shorted Mode
S4 ON
S1, S2, S3: OFF
GND
1.2-V Mode
S1, S2: OFF
S3, S4: ON
2.7 V 2.7 V 1.2 V
图10-18. DCP Auto Mode
10.4 Device Functional Modes
10.4.1 Shutdown Mode
The EN pin provides electrical ON and OFF control for the TPS2585x-Q1. When VEN is below 1.2 V (typical), the
device is in shutdown mode. The TPS2585x also employs VIN overvoltage lock out protection and VSENSE
undervoltage lock out protection. If VIN voltage is above its respective OVLO level VOVLO, or VSENSE voltage is
below its respective UVLO level VDCDC_UVLO, the DC/DC converter turns off.
10.4.2 Active Mode
The TPS2585x-Q1 is in active mode when VEN is above the precision enable threshold, VSENSE is above its
respective UVLO levels and a valid detection has been made on the CC lines. The simplest way to enable the
TPS2585x-Q1 is to connect the EN pin to SENSE pin. This connection allows self startup when the input voltage
is in the operating range (5.5 V to 26 V) and a UFP detection is made.
In active mode, the TPS2585x-Q1 buck regulator operates even though Rd is not inserted. Then the buck
regulator operates with Forced Pulse Width Modulation (FPWM), also referred to as Forced Continuous
Conduction Mode (FCCM). This action ensures the buck regulator switching frequency remains constant under
all load conditions. FPWM operation provides low output voltage ripple, tight output voltage regulation, and
constant switching frequency. Built-in spread-spectrum modulation aids in distributing spectral energy across a
narrow band around the switching frequency programmed by the FREQ/SYNC pin. Under light load conditions
the inductor current is allowed to go negative. A negative current limit of IL-NEG-LS is imposed to prevent damage
to the regulator's low side FET. During operation, the TPS2585x-Q1 synchronizes to any valid clock signal on the
FREQ/SYNC input.
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11 Application and Implementation
Note
以下应用部分中的信息不属于TI 器件规格的范围,TI 不担保其准确性和完整性。TI 的客 户应负责确定
器件是否适用于其应用。客户应验证并测试其设计,以确保系统功能。
11.1 Application Information
The TPS2585x-Q1 is a step down DC-to-DC regulator and USB charge port controller. The device is typically
used in automotive systems to convert a DC voltage from the vehicle battery to 5-V DC with a maximum output
current of 3.4-A in Single Type-C port applications. The TPS2585x-Q1 engages a high efficiency buck converter,
letting the device operate as high as 85°C ambient temperature with full load. The following design procedure
can be used to select components for the TPS2585x-Q1.
11.2 Typical Applications
The TPS2585x-Q1 only requires a few external components to convert from a wide voltage range supply to a 5-
V output for powering USB devices. 图 11-1 shows the TPS25855-Q1 typical application schematic for Media
HUB.
图11-1. TPS2585x-Q1 Typical Application Circuit for 400-KHz fSW
As a quick start guide, 表 11-1 provides typical component values for some of the most common configurations.
The values given in the table are typical. Other values can be used to enhance certain performance criterion as
required by the application. The integrated buck regulator of TPS2585x-Q1 is internally compensated and
optimized for a reasonable selection of external inductance and capacitance. The external components have to
fulfill the needs of the application, but also the stability criteria of the control loop of the device.
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表11-1. L and COUT Typical Values
VOUT Without Cable
Compensation
fSW
L
CHF + CIN
CBOOT
Rated COUT
400 KHZ
2.1 MHz
5.1 V
10 uH
1 × 100 nF + 1 × 22 uF
1 × 100 nF + 1 × 10 uF
1 × 100 nF
1 × 100 nF
3 × 47 uF
3 × 22 uF
5.1 V
2.2 uH
1. Inductance value is calculated based on max VIN = 18 V.
2. All the COUT values are after derating and use low ESR ceramic capacitors.
3. The COUT is the buck regulator output capacitors at the SENSE pin.
11.2.1 Design Requirements
The detailed design procedure is described based on a design example. For this design example, use the
parameters listed in 表11-2 as the input parameters.
表11-2. Design Example Parameters
Input voltage, VIN
13.5-V typical, range from 8 V to 18 V
Output voltage, VSENSE
Maximum output current
Switching frequency, fSW
5.1 V
3.4 A
400 KHz
11.2.2 Detailed Design Procedure
11.2.2.1 Output Voltage Setting
In TPS2585x-Q1, the output voltage is internally fixed at 5.1 V. Cable compensation can be used to increase the
voltage on the SENSE pin linearly with increasing load current. Refer to 表 10-3 for more details on cable
compensation setting, and if cable compensation is not desired, use a 0-ΩRIMON resistor.
11.2.2.2 Switching Frequency
The recommended switching frequency of the TPS25854-Q1 is in the range of 250–400 KHz for high efficiency
while for TPS25855-Q1, it is capable of operating at 2.2 MHz with high efficiency. Choose RFREQ = 49.9 kΩ for
400-KHz operation. To choose a different switching frequency, refer to 表10-1.
The choice of switching frequency is a compromise between conversion efficiency and overall solution size.
Lower switching frequency implies reduced switching losses and usually results in higher system efficiency.
However, higher switching frequency allows the use of smaller inductors and output capacitors, and hence a
more compact design. In automotive USB charging applications, it tends to operate at either 400 kHz, below the
AM band or 2.1 MHz, above the AM band. In this example, 400 KHz is chosen.
11.2.2.3 Inductor Selection
The most critical parameters for the inductor are the inductance, saturation current and the rated current. The
inductance is based on the desired peak-to-peak ripple current ΔiL. Because the ripple current increases with
the input voltage, the maximum input voltage is always used to calculate the minimum inductance LMIN. Use 方
程式 12 to calculate the minimum value of the output inductor. KIND is a coefficient that represents the amount of
inductor ripple current relative to the maximum output current of the device. A reasonable value of KIND must be
20% to 40%. Note that selecting the ripple current for applications with much smaller maximum load than the
maximum available from device, the maximum device current must still be used. During an instantaneous short
or over current operation event, the RMS and peak inductor current can be high. The inductor current rating
must be higher than the current limit of the device.
VOUT ì V
- VOUT
(
)
IN_MAX
DiL =
VIN_MAX ìL ì fSW
(11)
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V
- VOUT
VOUT
IN_MAX ì fSW
IN_MAX
LMIN
=
ì
IOUT ìKIND
V
(12)
In general, choose lower inductance in switching power supplies because it usually corresponds to faster
transient response, smaller DCR, and reduced size for more compact designs. Too low of an inductance can
generate too large of an inductor current ripple such that overcurrent protection at the full load can be falsely
triggered. Too low of an inductance also generates more conduction loss and inductor core loss. Larger inductor
current ripple also implies larger output voltage ripple with the same output capacitors. With peak current mode
control, TI does not recommend to have too small of an inductor current ripple. A larger peak current ripple
improves the comparator signal to noise ratio.
For this design example, choose KIND = 0.3, and find an inductance of approximately 8.95 µH. Select the next
standard value of 10 μH.
11.2.2.4 Output Capacitor Selection
The output capacitor(s), COUT, must be chosen with care because it directly affects the steady state output
voltage ripple, loop stability and the voltage overshoot or undershoot during load current transients.
The value of the output capacitor, and its ESR, determine the output voltage ripple and load transient
performance. The output capacitor is usually limited by the load transient requirements rather than the output
voltage ripple if the system requires tight voltage regulation with presence of large current steps and fast slew
rate. When a fast large load increase happens, output capacitors provide the required charge before the inductor
current can slew up to the appropriate level. The control loop of the regulator usually needs four or more clock
cycles to respond to the output voltage droop. The output capacitance must be large enough to supply the
current difference for four clock cycles to maintain the output voltage within the specified range. 表 11-3 can be
used to find output capacitors for a few common applications. In this example, good transient performance is
desired giving 3 x 47 µF ceramic as the output capacitor.
表11-3. Selected Output Capacitor
FREQUENCY
2.1 MHz
COUT
SIZE and COST
TRANSIENT PERFORMANCE
3 × 22-uF ceramic
Small size
Good
Better
2.1 MHz
2 × 47-uF ceramic
Small size
2.1 MHz
2 × 22-uF ceramic
Smallest size
Small size
Minimum
Better
400 KHz
400 KHz
400 KHz
3 × 47-uF ceramic
2 × 47-uF ceramic
Small size
Good
Larger size, low cost
Better
4 × 22 uF + 1 × 260 uF, < 50-mΩ electrolytic
1 × 4.7uF + 2 × 10 uF + 1 × 260 uF, < 50-mΩ
400 KHz
Lowest cost
Minimum
electrolytic
11.2.2.5 Input Capacitor Selection
The TPS2585x-Q1 device requires a high frequency input decoupling capacitor or capacitors, depending on the
application. TI recommends a high-quality ceramic capacitor type X5R or X7R with sufficient voltage rating. The
ceramic input capacitors provide a low impedance source to the converter in addition to supplying the ripple
current and isolating switching noise from other circuits. The typical recommended value for the high frequency
decoupling capacitor is 10 μF of ceramic capacitance. This value must be rated for at least the maximum input
voltage that the application requires; preferably twice the maximum input voltage. This capacitance can be
increased to help reduce input voltage ripple, maintain the input voltage during load transients, or both. In
addition, a small case size 100-nF ceramic capacitor must be used at IN and PGND, immediately adjacent to the
converter. This action provides a high frequency bypass for the control circuits internal to the device. For this
example a 10-μF, 50-V, X7R (or better) ceramic capacitor is chosen, and the 100-nF ceramic capacitor must
also be rated at 50 V with an X7R or better dielectric.
Additionally, an electrolytic capacitor on the input in parallel with the ceramics can be required, especially if long
leads from the automotive battery to the IN pin of the TPS2585x-Q1, cold or warm engine crank requirements,
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and so forth. The moderate ESR of this capacitor is used to provide damping to the voltage spike due to the lead
inductance of the cable or the trace.
11.2.2.6 Bootstrap Capacitor Selection
The TPS2585x-Q1 design requires a bootstrap capacitor (CBOOT). The recommended capacitor is 100 nF and
rated 16 V or higher. The bootstrap capacitor is located between the SW pin and the BOOT pin. The bootstrap
capacitor stores energy that is used to supply the gate drivers for the power MOSFETs. The bootstrap capacitor
must be a high-quality ceramic type with an X7R or X5R grade dielectric for temperature stability.
11.2.2.7 Undervoltage Lockout Set-Point
The system undervoltage lockout (UVLO) is adjusted using the external voltage divider network of RENT and
RENB. The UVLO has two thresholds, one for power up when the input voltage is rising and one for power down
or brownouts when the input voltage is falling. 方程式13 can be used to determine the VIN UVLO level.
RENT + RENB
RENB
V
= VENH ì
IN_RISING
(13)
The EN rising threshold (VENH) for the TPS2585x-Q1 is set to be 1.3 V (typical). Choose 10 kΩ for RENB to
minimize input current from the supply. If the desired VIN UVLO level is at 6.0 V, then the value of RENT can be
calculated using 方程式14:
V
≈
’
IN_RISING
RENT
=
-1 ìR
∆
∆
÷
ENB
÷
VENH
«
◊
(14)
方程式 14 yields a value of 36.1 kΩ. The resulting falling UVLO threshold equals 5.5 V and can be calculated by
方程式15, where EN hysteresis (VEN_HYS) is 0.1 V (typical).
RENT + RENB
RENB
V
= VENH - VEN_HYS
(
ì
)
IN_FALLING
(15)
Note that it cannot connect EN to IN pin directly for self-start up. Because the voltage rating of EN pin is 11 V,
tying it to VIN directly damages the device. The simplest way to enable the operation of the TPS2585x-Q1 is to
connect the EN to VSENSE. This connection allows the automatic start up when VIN is within the operation range.
11.2.2.8 Cable Compensation Set-Point
For TPS2585x-Q1, it needs connect a resistor at the IMON pin to set the cable compensation voltage, the
voltage increases linearly as the load current increases. For example, choose a 4.99-K resistor at IMON pin, this
can give an approximate 202-mV voltage compensation when USB port loading is 2.4 A and 252-mV voltage
compensation when USB port loading is 3 A. To choose a different cable compensation rating, refer to 节 10.3.9
section.
11.2.2.9 FAULT, POL, and THERM_WARN Resistor Selection
The FAULT, POL and THERM_WARN pins are open-drain output flags. The pins can be connected to the
TPS2585x-Q1 VSENSE with 100-kΩ resistors or connected to another suitable I/O voltage supply if actively
monitored by a USB HUB or MCU. The pins can be left floating if unused.
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ZHCSP14 –SEPTEMBER 2021
11.2.3 Application Curves
Unless otherwise specified the following conditions apply: VIN = 13.5 V, fSW = 2100 kHz, L = 2.2 µH, CSENSE = 66 µF, CBUS
1 µF, ILIM = GND, TA = 25 °C.
=
100
95
90
85
80
75
70
65
60
VIN = 6 V
VIN = 13.5 V
VIN = 18 V
0.1
0.2
0.3 0.4 0.5 0.7
1
2
3
Load Current (A)
fSW = 400 kHz
L = 10 uH
fSW = 2100 kHz
L = 2.2 uH
图11-2. Buck Only Efficiency
图11-3. Buck Only Efficiency
IBUS = 3A
fSW = 2100 kHz
L = 2.2 uH
IBUS = 3A
fSW = 400 kHz
L = 10 uH
图11-4. 2.1-MHz EMI Results (Without CM Filter)
图11-5. 400-KHz EMI Results (Without CM Filter)
0.4
0.2
0
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
-0.2
-0.4
-0.6
-0.8
-1.2
-1
Load = 1 A
Load = 2 A
Load = 3 A
VIN = 6 V
VIN = 13.5 V
VIN = 18 V
-1.4
-1.6
-1.2
-1.4
5
10
15
VIN (V)
20
25
0
1
2
3
Load Current (A)
fSW = 2100 kHz
fSW = 2100 kHz
图11-7. Line Regulation
图11-6. Load Regulation
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IBUS = 0 A to 3 A
fSW = 2100
kHZ
IBUS = 0.75 A to
2.25 A
fSW = 400
kHZ
图11-8. Load Transient Without Cable
Compensation
图11-9. Load Transient Without Cable
Compensation
IBUS = 0 A to 3 A
fSW = 2100
kHZ
IBUS = 0.75 A to 2.25 A
fSW = 400
kHZ
图11-10. Load Transient With Cable Compensation 图11-11. Load Transient With Cable Compensation
5.2
5.15
5.1
5.05
5
Load = 1 A
Load = 2 A
Load = 3 A
4.95
4.9
5.5
10.5
15.5
VIN (V)
20.5
25.5
IBUS = 3 A
fSW = 2100
kHZ
图11-12. Dropout Characteristic
图11-13. 6-A Output Ripple
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IBUS = 0 A
fSW = 2100
kHZ
IBUS = 0.1 A
fSW = 2100
kHZ
图11-15. No Load Output Ripple
图11-14. 100-mA Output Ripple
VIN = 0 V to 13.5 V CC1 = Rd
IBUS = 3 A
VIN = 13.5 V to 0 V CC1 = Rd
IBUS = 3 A
图11-16. Startup Relate to VIN
图11-17. Shutdown Relate to VIN
EN = 0 V to 5 V
CC1 = Rd
IBUS = 3 A
EN = 5 V to 0 V
CC1 = Rd
IBUS = 3 A
图11-18. Startup Relate to EN
图11-19. Shutdown Relate to EN
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CC1 = Rd to Open CC2 = Open
IBUS = 3 A
CC1 = Open to Rd
CC2 = Open
IBUS = 3 A
图11-21. Rd Desert
图11-20. Rd Assert
EN to High
BUS = GND
A.
EN is High BUS removed from
GND
图11-22. Enable Into Short
图11-23. Short Circuit Recovery
CC1 = Rd
CC2 = Ra
图11-24. VBUS Hot Short to GND
图11-25. CC2 Hot Short to GND
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CC1 = Rd
BUS NO LOAD
CC1 = Rd
OUT = GND
BUS NO LOAD
OUT = 5.1 Ω
图11-27. OUT Hot Short to GND
图11-26. OUT short to 5.1-ΩLoad
VTS = 0 V to 4 V
CC1 = Rd
CC2 = OPEN
VTS = 0 V to 2.6 V CC1 = Rd
CC2 = OPEN
图11-29. Thermal Sensing - NTC Temperature HOT
图11-28. Thermal Sensing - NTC Temperature
Behavior
WARM Behavior
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12 Power Supply Recommendations
The input supply must be able to withstand the maximum input current and maintain a stable voltage. The
resistance of the input supply rail must be low enough that an input current transient does not cause a high
enough drop at the TPS2585x-Q1 supply voltage that it causes a false UVLO fault triggering and system reset. If
the TPS2585x-Q1 is connected to the input supply through long wires or PCB traces, special care is required to
achieve good performance. An additional bulk capacitance can be required in addition to the ceramic input
capacitors. The amount of bulk capacitance is not critical, but a 100-μF electrolytic capacitor is a typical choice.
The input voltage must not be allowed to fall below the output voltage. In this scenario, such as a shorted input
test, the output capacitors discharge through the internal parasitic diode found between the VIN and SW pins of
the device. During this condition, the current can become uncontrolled, possibly causing damage to the device. If
this scenario is considered likely, then a Schottky diode between the input supply and the output must be used.
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13 Layout
13.1 Layout Guidelines
The PCB layout of any bulk converter is critical to the optimal performance of the design. Bad PCB layout can
disrupt the operation of an otherwise good schematic design. Even if the converter regulates correctly, bad PCB
layout can mean the difference between a robust design and one that cannot be mass produced. Furthermore,
the EMI performance of the converter is dependent on the PCB layout to a great extent. The following guidelines
will help users design a PCB with the best power conversion performance, thermal performance, and minimized
generation of unwanted EMI.
1. The input bypass capacitor, CIN, must be placed as close as possible to the IN and PGND pins. The high
frequency ceramic bypass capacitors at the input side provide a primary path for the high di/dt components
of the pulsing current. Use a wide VIN plane on a lower layer to connect both of the VIN pairs together to the
input supply. Grounding for both the input and output capacitors must consist of localized top-side planes
that connect to the PGND pin and PAD.
2. Use ground plane in one of the middle layers as noise shielding and heat dissipation path.
3. Use wide traces for the CBOOT capacitor. Place the CBOOT capacitor as close to the device with short, wide
traces to the BOOT and SW pins.
4. The SW pin connecting to the inductor must be as short as possible, and just wide enough to carry the load
current without excessive heating. Short, thick traces or copper pours (shapes) must be used for a high
current conduction path to minimize parasitic resistance. The output capacitors must be placed close to the
V
SENSE end of the inductor and closely grounded to PGND pin and exposed PAD.
5. RILIM and RFREQ resistors must be placed as close as possible to the ILIM and FREQ pins and connected to
AGND. If needed, these components can be placed on the bottom side of the PCB with signals routed
through small vias, and the traces need far away from noisy nets like SW, BOOT.
6. Make VIN, VSENSE, and ground bus connections as wide as possible. This action reduces any voltage drops
on the input or output paths of the converter and maximizes efficiency.
7. Provide enough PCB area for proper heat sinking. Enough copper area must be used to ensure a low RθJA
commensurate with the maximum load current and ambient temperature. Make the top and bottom PCB
layers with two-ounce copper; and no less than one ounce. If the PCB design uses multiple copper layers
(recommended), thermal vias can also be connected to the inner layer heat-spreading ground planes. Note
that the package of this device dissipates heat through all pins. Wide traces must be used for all pins except
where noise considerations dictate minimization of area.
,
8. Use an array of heat-sinking vias to connect the exposed pad to the ground plane on the bottom PCB layer.
If the PCB has multiple copper layers, these thermal vias can also be connected to inner layer heat-
spreading ground planes. Ensure enough copper area is used for heat-sinking to keep the junction
temperature below 150°C.
9. Keep the CC lines close to the same length. Do not create stubs or test points on the CC lines.
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13.2 Layout Example
图13-1. Layout Example
13.3 Ground Plane and Thermal Considerations
TI recommends to use one of the middle layers as a solid ground plane. Ground plane provides shielding for
sensitive circuits and traces. Ground plane also provides a quiet reference potential for the control circuitry. The
AGND and PGND pins must be connected to the ground plane using vias right next to the bypass capacitors.
The PGND pin is connected to the source of the internal low-side MOSFET switch, and also connected directly
to the grounds of the input and output capacitors. The PGND net contains noise at the switching frequency and
can bounce due to load variations. The PGND trace, as well as VIN and SW traces, must be constrained to one
side of the ground plane. The other side of the ground plane contains much less noise and must be used for
sensitive routes.
TI recommends to provide adequate device heat sinking by using the PAD of the IC as the primary thermal path.
Use a minimum 4 × 2 array of 12-mil thermal vias to connect the PAD to the system ground plane heat sink. The
vias must be evenly distributed under the PAD. Use as much copper as possible, for system ground plane, on
the top and bottom layers for the best heat dissipation. Use a four-layer board with the copper thickness for the
four layers, starting from the top of 2 oz / 1 oz / 1 oz / 2 oz. Four layer boards with enough copper thickness
provide low current conduction impedance, proper shielding, and lower thermal resistance.
The thermal characteristics of the TPS2585x-Q1 are specified using the parameter θJA, which characterizes the
junction temperature of silicon to the ambient temperature in a specific system. Although the value of θJA is
dependent on many variables, it still can be used to approximate the operating junction temperature of the
device. To obtain an estimate of the device junction temperature, one can use the following relationship:
TJ = PD × θJA + TA
(16)
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ZHCSP14 –SEPTEMBER 2021
where
• TJ = Junction temperature in °C
• PD = VIN × IIN × (1 –Efficiency) –1.1 × IOUT 2 × DCR in Watt
• DCR = Inductor DC parasitic resistance in Ω
• θJA = Junction-to-ambient thermal resistance of the device in °C/W
• TA = Ambient temperature in °C
The maximum operating junction temperature of the TPS2585x-Q1 is 150°C. θJA is highly related to PCB size
and layout, as well as environmental factors such as heat sinking and air flow.
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14 Device and Documentation Support
14.1 接收文档更新通知
要接收文档更新通知,请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册,即可每周接收产品信息更
改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
14.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
14.3 Trademarks
HotRod™ and TI E2E™ are trademarks of Texas Instruments.
USB Type-C® is a registered trademark of USB Implementers Forum.
所有商标均为其各自所有者的财产。
14.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
14.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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15 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
23-Jun-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS25854QRPQRQ1
TPS25855QRPQRQ1
ACTIVE
ACTIVE
VQFN-HR
VQFN-HR
RPQ
RPQ
25
25
3000 RoHS & Green
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-45 to 125
-45 to 125
T25854
T25855
Samples
Samples
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Jun-2023
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS25854QRPQRQ1
TPS25855QRPQRQ1
VQFN-
HR
RPQ
RPQ
25
25
3000
3000
330.0
12.4
3.8
4.8
1.18
8.0
12.0
Q1
VQFN-
HR
330.0
12.4
3.8
4.8
1.18
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS25854QRPQRQ1
TPS25855QRPQRQ1
VQFN-HR
VQFN-HR
RPQ
RPQ
25
25
3000
3000
367.0
367.0
367.0
367.0
38.0
38.0
Pack Materials-Page 2
PACKAGE OUTLINE
RPQ0025A
VQFN - 1 mm max height
S
C
A
L
E
3
.
0
0
0
PLASTIC QUAD FLATPACK - NO LEAD
3.6
3.4
A
B
PIN 1 INDEX AREA
4.6
4.4
SIDE WALL
METAL THICKNESS
DIM A
OPTION 1
0.1
OPTION 2
0.2
C
1.0
0.8
SEATING PLANE
0.08 C
0.05
0.00
1.325 0.1
0.75
0.55
PINS 7,8,14 & 15
0.975
0.775
4X
2X 1
8X (0.25)
10
EXPOSED
THERMAL PAD
SYMM
(DIM A) TYP
12
9
13
1.45
1.25
3X
0.65 0.1
PKG
25
2X 4
0.7
0.5
PINS 3 &19
PIN 1 ID
20X 0.5
0.3
24X
0.2
1
21
24
22
0.1
C A B
1.8
1.6
0.725
0.525
PINS 2 & 20
3X
0.05
0.9
0.7
PINS 4-6 & 16-18
4224966/B 08/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RPQ0025A
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(3.1)
(3.05)
(1.325)
4X (1.075)
4X (0.675)
3X
(1.9)
SYMM
24
22
4X (0.575)
21
2X (0.825)
1
4X (0.25)
2X (0.8)
20X (0.5)
6X (1)
(1.5)
PKG
25
(0.65)
(R0.05) TYP
(1.675)
20X (0.25)
4X (0.85)
SEE SOLDER MASK
DETAIL
13
9
10
12
3X
(1.55)
(2.9)
(3.075)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
SOLDER MASK DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4224966/B 08/2022
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RPQ0025A
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(3.1)
(3.05)
4X (1.075)
4X (0.675)
SYMM
6X (0.85)
22
24
4X (0.575)
21
1
2X (0.825)
4X (0.25)
20X (0.5)
2X (0.8)
(2.025)
6X (1)
(0.975)
2X
(0.563)
PKG
25
2X (0.325)
(1.237)
2X (0.65)
26X (0.25)
(2.112)
4X (0.85)
13
9
(R0.05) TYP
10
12
6X
(0.675)
EXPOSED METAL
TYP
(0.763)
(2.9)
(3.075)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 20X
EXPOSED PAD 25
85% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
4224966/B 08/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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相关型号:
TPS25855QRPQRQ1
具有甩负荷功能的 2.2MHz 单路 3A USB Type-C® 充电端口控制器 | RPQ | 25 | -45 to 125Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TPS25858-Q1
TPS25858-Q1 and TPS25859-Q1 Low EMI Dual 3-A USB Type-C® Charging Ports Converter With Programmable Current Limit and Thermal ManagementWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TPS25858-Q1_V01
TPS25858-Q1 and TPS25859-Q1 Low EMI Dual 3-A USB Type-C® Charging Ports Converter With Programmable Current Limit and Thermal ManagementWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TPS25858QRPQRQ1
TPS25858-Q1 and TPS25859-Q1 Low EMI Dual 3-A USB Type-C® Charging Ports Converter With Programmable Current Limit and Thermal ManagementWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TPS25859-Q1
TPS25858-Q1 and TPS25859-Q1 Low EMI Dual 3-A USB Type-C® Charging Ports Converter With Programmable Current Limit and Thermal ManagementWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TPS25859QRPQRQ1
TPS25858-Q1 and TPS25859-Q1 Low EMI Dual 3-A USB Type-C® Charging Ports Converter With Programmable Current Limit and Thermal ManagementWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TPS25860-Q1
TPS2586x-Q1 2.2-MHz, Low EMI Dual USB Type-A and Type-C® Charging Ports Controller With Sync DC/DC Converter and Programmable Current LimitWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TPS25860QRPQRQ1
TPS2586x-Q1 2.2-MHz, Low EMI Dual USB Type-A and Type-C® Charging Ports Controller With Sync DC/DC Converter and Programmable Current LimitWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TPS25862-Q1
TPS2586x-Q1 2.2-MHz, Low EMI Dual USB Type-A and Type-C® Charging Ports Controller With Sync DC/DC Converter and Programmable Current LimitWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TPS25862QRPQRQ1
TPS2586x-Q1 2.2-MHz, Low EMI Dual USB Type-A and Type-C® Charging Ports Controller With Sync DC/DC Converter and Programmable Current LimitWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TPS25864-Q1
具有甩负荷功能和 2.2MHz 频率的汽车双路 2.4A USB Type-A 充电端口控制器Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TPS25864QRPQRQ1
具有甩负荷功能和 2.2MHz 频率的汽车双路 2.4A USB Type-A 充电端口控制器 | RPQ | 25 | -45 to 125Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
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