TPS3106K33 [TI]
Ultralow Supply-Current Voltage Monitor With Optional Watchdog;
| 型号： | TPS3106K33 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Ultralow Supply-Current Voltage Monitor With Optional Watchdog |
| 文件： | 总25页 (文件大小：755K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
UltraLow Supply-Current/Supply-Voltage Supervisory Circuits
1
FEATURES
DESCRIPTION
2
•
Precision Supply Voltage Supervision Range:
0.9 V, 1.2 V, 1.5 V, 1.6 V, 2 V, and 3.3 V
The TPS310x and TPS311x families of supervisory
circuits provide circuit initialization and timing
supervision, primarily for DSP and processor-based
systems.
•
•
•
High Trip-Point Accuracy: 0.75%
Supply Current of 1.2 μA (typical)
RESET Defined With Input Voltages as Low as
0.4 V
During power-on, RESET is asserted when the
supply voltage (VDD) becomes higher than 0.4 V.
Thereafter, the supervisory circuit monitors VDD and
keeps the RESET output active as long as VDD
remains below the threshold voltage (VIT). An internal
timer delays the return of the output to the inactive
state to ensure proper system reset. The delay time
starts after VDD has risen above VIT. When VDD drops
below VIT, the output becomes active again.
•
Power-On Reset Generator With a Delay Time
of 130 ms
•
•
•
Push/Pull or Open-Drain RESET Outputs
SOT23-6 Package
Package Temperature Range: –40°C to +85°C
APPLICATIONS
•
All the devices of this family have a fixed-sense
threshold voltage (VIT) set by an internal voltage
divider.
Applications Using Low-Power DSPs,
Microcontrollers, or Microprocessors
Portable- and Battery-Powered Equipment
Intelligent Instruments
Wireless Communication Systems
Industrial Equipment
•
•
•
•
•
The TPS3103 and TPS3106 have an active-low,
open-drain RESET output. The TPS3110 has an
active-low push/pull RESET.
The product spectrum is designed for supply voltages
of 0.9 V up to 3.3 V. The circuits are available in
SOT23-6 packages. The TPS31xx family is
characterized for operation over a temperature range
of –40°C to +85°C.
Notebook/Desktop Computers
TPS3106
DBV PACKAGE
(TOP VIEW)
TPS3103
DBV PACKAGE
(TOP VIEW)
3.3 V
1.6 V
1
2
3
1
2
3
VDD
6
5
VDD
6
5
RSTVDD
GND
RESET
GND
MR
VDD
VCORE
DSP
RESET
VIO
R3
RSTSENSE
SENSE
PFO
PFI
TPS3106K33DBV
R1
R2
4
4
MR
MR
RSTVDD
SENSE
TPS3110
DBV PACKAGE
(TOP VIEW)
RSTSENSE
GND
GND
GND
1
2
3
6
5
VDD
RESET
GND
WDI
Typical Application Circuit
4
SENSE
MR
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2007, Texas Instruments Incorporated
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
(2)
PRODUCT
NOMINAL SUPPLY VOLTAGE
THRESHOLD VOLTAGE, VIT
TPS3103E12DBVR
TPS3103E15DBVR
TPS3103H20DBVR
TPS3103K33DBVR
TPS3106E09DBVR
TPS3106E16DBVR
TPS3106K33DBVR
TPS3110E09DBVR
TPS3110E12DBVR
TPS3110E15DBVR
TPS3110K33DBVR
1.2 V
1.5 V
2.0 V
3.3 V
0.9 V
1.6 V
3.3 V
0.9 V
1.2 V
1.5 V
3.3 V
1.142 V
1.434 V
1.84 V
2.941 V
0.86 V
1.521 V
2.941 V
0.86 V
1.142 V
1.434 V
2.941 V
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Custom threshold voltages are available. Minimum order quantities apply. Contact factory for details and availability.
AVAILABLE OPTIONS
DEVICE
TPS3103
TPS3106
TPS3110
RESET OUTPUT
RSTSENSE, RSTVDD OUTPUT
SENSE INPUT
WDI INPUT
PFO OUTPUT
Open-drain
Open-drain
Open-drain
ü
ü
Push-pull
ü
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range, unless otherwise noted.
VALUE
UNIT
V
(2)
Supply voltage, VDD
–0.3 to +3.6
MR Pin, VMR
–0.3 to VDD + 0.3
V
All other pins(2)
–0.3 to +3.6
V
Maximum low output current, IOL
Maximum high output current, IOH
5
mA
mA
mA
mA
–5
Input clamp current, IIK (VI < 0 or VI > VDD
)
±10
±10
(3)
Output clamp current, IOK (VO < 0 or VO > VDD
Continuous total power dissipation
Operating temperature range, TA
Storage temperature range, TSTG
Soldering temperature
)
See Dissipation Rating Table
–40 to +85
–65 to +150
+260
°C
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND. For reliable operation, the device must not be operated at 3.6 V for more than t = 1000h
continuously.
(3) Output is clamped for push-pull outputs by the back gate diodes internal to the IC. No clamp exists for the open-drain outputs.
2
Submit Documentation Feedback
Copyright © 2001–2007, Texas Instruments Incorporated
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
DISSIPATION RATINGS
TA ≤ +25°C
DERATING FACTOR
TA = +70°C
TA = +85°C
PACKAGE
POWER RATING
ABOVE TA = +25°C
POWER RATING
POWER RATING
DBV
437 mW
3.5 mW/°C
280 mW
227 mW
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range, unless otherwise noted.
MIN
MAX
3.3
UNIT
V
(1)
Supply voltage, VDD
0.4
0
Input voltage, VI
VDD + 0.3
V
High-level input voltage, VIH at MR, WDI
Low-level input voltage, VIL at MR, WDI
Input transition rise and fall rate at Δt/ΔV at MR, WDI
Operating temperature range, TA
0.7 × VDD
V
0.3 × VDD
100
V
ns/V
°C
–40
+85
(1) For proper operation of SENSE, PFI, and WDI functions: VDD ≥ 0.8 V.
ELECTRICAL CHARACTERISTICS
Over operating free-air temperature range (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VDD = 3.3 V, IOH = –3 mA
VDD = 1.8 V, IOH = –2 mA
VDD = 1.5 V, IOH = –1 mA
VDD = 0.9 V, IOH = –0.4 mA
VDD = 0.5 V, IOH = –5 μA
VDD = 3.3 V, IOL = 3 mA
VDD = 1.5 V, IOL = 2 mA
VDD = 1.2 V, IOL = 1 mA
VDD = 0.9 V, IOL = 500 μA
VDD = 0.4 V, IOL = 5 μA
0.8 × VDD
V
V
V
V
VOH
High-level output voltage
0.7 × VDD
VOL
Low-level output voltage
Low-level output voltage
0.3
VOL
RESET only
TPS31xxE09
TPS31xxE12
TPS31xxE15
TPS31xxE16
TPS31xxH20
TPS31xxK33
0.1
0.866
1.151
1.445
1.534
1.857
2.963
0.854
1.133
1.423
1.512
1.829
2.919
0.860
1.142
1.434
1.523
1.843
2.941
Negative-going input
threshold voltage(1)
VIT–
TA = +25°C
V
Negative-going input
threshold voltage(1)
VIT – (S)
SENSE, PFI
VDD ≥ 0.8 V, TA = +25°C
0.542
0.551
0.559
V
0.8 V ≤ VIT < 1.5 V
1.6 V ≤ VIT < 2.4 V
2.5 V ≤ VIT < 3.3 V
20
30
50
VHYS
Hysteresis at VDD input
mV
Temperature coefficient of VIT−, PFI,
SENSE
T(K)
TA = –40°C to +85°C
–0.012
15
–0.019
%/K
mV
VHYS
Hysteresis at SENSE, PFI input
MR
VDD ≥ 0.8 V
MR = VDD, VDD = 3.3 V
–25
–25
25
25
IIH
High-level input current
nA
SENSE, PFI,
WDI
SENSE, PFI, WDI = VDD
VDD = 3.3 V
,
(1) To ensure the best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 μF) should be placed close to the supply
terminals.
Copyright © 2001–2007, Texas Instruments Incorporated
Submit Documentation Feedback
3
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
ELECTRICAL CHARACTERISTICS (continued)
Over operating free-air temperature range (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
MR
MR = 0 V, VDD = 3.3 V
–47
–33
–25
μA
IIL
Low-level input current
SENSE, PFI,
WDI
SENSE, PFI, WDI = 0 V,
VDD = 3.3 V
–25
25
nA
nA
High-level output current
at RESET(2)
IOH
Open-drain
VDD = VIT + 0.2 V, VOH = 3.3 V
200
3
VDD > VIT (average current),
VDD < 1.8 V
1.2
2
VDD > VIT (average current),
VDD > 1.8 V
4.5
IDD
Supply current
μA
VDD < VIT, VDD < 1.8 V
VDD < VIT, VDD > 1.8 V
22
27
Internal pull-up resistor at MR
Input capacitance at MR, SENSE, PFI, WDI VI = 0 V to VDD
70
100
1
130
kΩ
CI
pF
(2) Also refers to RSTVDD and RSTSENSE.
SWITCHING CHARACTERISTICS
At RL = 1 MΩ, CL = 50 pF, and TA = –40°C to +85°C, unless otherwise noted.
PARAMETER
TEST CONDITIONS
DD ≥ 1.1 × VIT, MR = 0.7 × VDD, See Timing Diagrams
MIN
TYP
MAX UNIT
tD
Delay time
V
65
130
195
40
ms
Propagation delay time,
high-to-low level output
VDD to RESET or
RSTVDD delay
tPHL
VIH = 1.1 × VIT, VIL = 0.9 × VIT
VIH = 1.1 × VIT, VIL = 0.9 × VIT
μs
Propagation delay time,
low-to-high level output
VDD to RESET or
RSTVDD delay
tPLH
tPHL
tPLH
tPHL
tPLH
40
40
μs
μs
μs
μs
μs
Propagation delay time,
high-to-low level output
SENSE to RESET or
RSTSENSE delay
VDD ≥ 0.8 V, VIH = 1.1 × VIT, VIL = 0.9 × VIT
VDD ≥ 0.8 V, VIH = 1.1 × VIT, VIL = 0.9 × VIT
VDD ≥ 0.8 V, VIH = 1.1 × VIT, VIL = 0.9 × VIT
VDD ≥ 0.8 V, VIH = 1.1 × VIT, VIL = 0.9 × VIT
Propagation delay time,
high-to-low level output
SENSE to RESET or
RSTSENSE delay
40
Propagation delay time,
high-to-low level output
PFI to PFO delay
PFI to PFO delay
40
Propagation delay time,
low-to-high level output
300
MR to RESET.
RSTVDD,
RSTSENSE delay
Propagation delay time,
low-to-high level output
tPHL
V
DD ≥ 1.1 × VIT, VIL = 0.3 × VDD, VIH = 0.7 × VDD
DD ≥ 1.1 × VIT, VIL = 0.3 × VDD, VIH = 0.7 × VDD
1
1
5
5
μs
μs
MR to RESET.
RSTVDD,
RSTSENSE delay
Propagation delay time,
low-to-high level output
tPLH
V
TIMING REQUIREMENTS
At RL = 1 MΩ, CL = 50 pF, and TA = –40°C to +85°C, unless otherwise noted.
PARAMETER
tT(OUT) Time-out period
TEST CONDITIONS
MIN
0.55
20
TYP
1.1
MAX UNIT
at WDI
at VDD
at MR
V
DD ≥ 0.85 V
1.65
s
VIH = 1.1 × VIT, VIL = 0.9 × VIT–, VIT– = 0.86 V
V
V
V
V
DD ≥ VIT + 0.2 V, VIL = 0.3 × VDD, VIH = 0.7 × VDD
DD ≥ VIT, VIH = 1.1 × VIT − (S), VIL = 0.9 × VIT − (S)
DD ≥ 0.85 V, VIH = 1.1 × VIT − (S),VIL = 0.9 × VIT − (S)
DD ≥ VIT, VIL = 0.3 × VDD, VIH = 0.7 × VDD
0.1
20
tW
Pulse width
at SENSE
at PFI
μs
20
at WDI
0.3
4
Submit Documentation Feedback
Copyright © 2001–2007, Texas Instruments Incorporated
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
FUNCTIONAL BLOCK DIAGRAMS
TPS3103
VDD
VIT-
+
_
MR
RESET
PFO
Reset Logic
and Timer
+
_
PFI
0.551 V
GND
TPS3106
VDD
VIT-
+
_
MR
RSTVDD
Reset Logic
and Timer
RSTSENSE
Reset Logic
and Timer
+
_
SENSE
GND
0.551 V
Copyright © 2001–2007, Texas Instruments Incorporated
Submit Documentation Feedback
5
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
TPS3110
VDD
VIT-
+
_
MR
RESET
Reset Logic
and Timer
+
_
SENSE
0.551 V
Watchdog
Logic and
Control
WDI
GND
Table 1. TPS3103 FUNCTION TABLE
MR
L
V(PFI) > 0.551 V
VDD > VIT
RESET
PFO
L
0
1
0
0
1
1
X(1)
L
L
L
X
H
H
H
H
H
0
L
L
1
H
L
L
0
H
1
H
H
(1) X = Don’t care.
Table 2. TPS3106 FUNCTION TABLE
MR
L
V(SENSE) > 0.551 V
VDD > VIT
RSTVDD
RSTSENSE
X(1)
X
0
1
0
1
L
L
L
L
H
0
H
0
H
L
L
H
1
H
H
H
1
H
(1) X = Don’t care.
Table 3. TPS3110 FUNCTION TABLE(1)
MR
L
V(SENSE) > 0.551 V
VDD > VIT
RESET
X(2)
X
0
1
0
1
L
L
L
L
H
H
0
H
0
H
1
H
1
(1) Function of watchdog-timer not shown.
(2) X = Don’t care.
6
Submit Documentation Feedback
Copyright © 2001–2007, Texas Instruments Incorporated
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
PIN DESCRIPTIONS
TPS3106
DBV PACKAGE
(TOP VIEW)
TPS3103
DBV PACKAGE
(TOP VIEW)
TPS3110
DBV PACKAGE
(TOP VIEW)
1
2
3
6
5
1
2
3
VDD
6
5
VDD
1
2
3
6
5
VDD
RSTVDD
GND
RESET
GND
MR
RESET
GND
WDI
RSTSENSE
SENSE
PFO
PFI
4
SENSE
4
MR
4
MR
TERMINAL FUNCTIONS
TERMINAL
DEVICE
ALL
DESCRIPTION
NAME
NO.
GND
2
GND
Manual-reset input. Pull low to force a reset. RESET remains low as long as MR is low and for
the timeout period after MR goes high. Leave unconnected or connect to VDD when unused.
MR
ALL
3
PFI
TPS3103
TPS3103
4
5
Power-fail input compares to 0.551 V with no additional delay. Connect to VDD if not used.
Power-fail output. Goes high when voltage at PFI rises above 0.551 V.
PFO
TPS3103,
TPS3110
RESET
1
5
1
Active-low reset output. Either push-pull or open-drain output stage.
Active-low reset output. Logic level at RSTSENSE only depends on the voltage at SENSE and
the status of MR.
RSTSENSE
RSTVDD
TPS3106
TPS3106
Active-low reset output. Logic level at RSTVDD only depends on the voltage at VDD and the
status of MR.
TPS3106,
TPS3110
A reset will be asserted if the voltage at SENSE is lower than 0.551 V. Connect to VDD if
unused.
SENSE
VDD
4
6
ALL
Supply voltage. Powers the device and monitors its own voltage.
Watchdog timer input. If WDI remains high or low longer than the time-out period, then reset is
triggered. The timer clears when reset is asserted or when WDI sees a rising edge or a falling
edge.
WDI
TPS3110
5
Copyright © 2001–2007, Texas Instruments Incorporated
Submit Documentation Feedback
7
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
TIMING DIAGRAMS
Timing Diagrams for TPS3103
VDD
VIT
0.4 V
t
tD
SENSE
VIT - (S) = 0.551 V
t
tD
tD
tD
tD
t
RESET
Output Condition
Undefined
Output Condition
Undefined
t
MR
t
PFI
VIT - (S) = 0.551 V
t
PFO
Output Condition
Undefined
Output Condition
Undefined
t
8
Submit Documentation Feedback
Copyright © 2001–2007, Texas Instruments Incorporated
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
Timing Diagram for TPS3106
VDD
VIT
0.4 V
tD
t
tD
RSTVDD
Output Condition
Undefined
Output Condition
Undefined
t
SENSE
VIT - (S) = 0.551 V
t
tD
RSTSENSE
Output Condition
Undefined
Output Condition
Undefined
t
tD
MR
t
Copyright © 2001–2007, Texas Instruments Incorporated
Submit Documentation Feedback
9
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
Timing Diagram for TPS3110
VDD
VIT
0.4 V
tD
t
t
SENSE
VIT - (S) = 0.551 V
tD
tD
tD
tD
tD
RESET
Output Condition
Undefined
Output Condition
Undefined
t(TOUT)
WDI
x = Don’t Care
MR
t
TYPICAL CHARACTERISTICS
TPS3110E09
SUPPLY CURRENT
vs
TPS3110E09
LOW-LEVEL OUTPUT VOLTAGE
vs
SUPPLY VOLTAGE
LOW-LEVEL OUTPUT CURRENT
20
18
16
14
12
10
8
0.30
TA = 85°C
SENSE = VDD
MR = Open
VDD = 0.9 V
SENSE = GND
MR = GND
WDI = GND
0.25
0.20
0.15
0.10
0.05
0
RESET = Open
WDI: Triggered
TA = 25°C
TA = 0°C
TA = 85°C
TA = 25°C
TA = 0°C
TA = -40°C
6
TA = -40°C
4
2
0
0
0.5
1.0
1.5
2.0
2.5
3.0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
VDD - Supply Voltage - V
IOL - Low-Level Output Current - mA
Figure 1.
Figure 2.
10
Submit Documentation Feedback
Copyright © 2001–2007, Texas Instruments Incorporated
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
TPS3110E09
LOW-LEVEL OUTPUT VOLTAGE
vs
TPS3110E09
HIGH-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
HIGH-LEVEL OUTPUT CURRENT
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.90
0.85
0.80
0.75
0.70
0.65
0.60
VDD = 3.3 V
SENSE = GND
MR = GND
WDI = GND
TA = 85°C
TA = 25°C
TA = 85°C
TA = 0°C
TA = -40°C
TA = 25°C
TA = 0°C
VDD = 0.9 V
TA = -40°C
SENSE = VDD
MR = VDD
WDI : Triggered
0
0
2
4
6
8
10 12 14 16 18 20
0
-0.1
-0.2
-0.3
-0.4
-0.5
IOL - Low-Level Output Current - mA
IOH - High-Level Output Current - mA
Figure 3.
Figure 4.
TPS3110K33
HIGH-LEVEL OUTPUT VOLTAGE
vs
MINIMUM PULSE DURATION AT VDD
vs
THRESHOLD OVERDRIVE VOLTAGE
HIGH-LEVEL OUTPUT CURRENT
3.4
3.2
50
VDD = 3.3 V
MR : Open
SENSE = VDD
45
40
35
30
25
20
15
10
SENSE = VDD
MR = VDD
WDI : Triggered
3.0
2.8
2.6
2.4
2.2
TA = -40°C
VDD = 3.3 V
TA = 0°C
TA = 25°C
TA = 85°C
VDD = 0.9 V
5
0
2.0
0
-5
-10
-15
-20
-25
0
0.1
0.2
0.3
0.4
0.5
VDD - Threshold Overdrive Voltage - V
IOH - Low-Level Output Current - mA
Figure 5.
Figure 6.
Copyright © 2001–2007, Texas Instruments Incorporated
Submit Documentation Feedback
11
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
TYPICAL CHARACTERISTICS (continued)
NORMALIZED THRESHOLD VOLTAGE
vs
FREE-AIR TEMPERATURE
1.008
1.006
1.004
1.002
1.000
0.998
0.996
0.994
0.992
-50
0
50
100
TA - Free-Air Temperature - °C
Figure 7.
12
Submit Documentation Feedback
Copyright © 2001–2007, Texas Instruments Incorporated
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
APPLICATION INFORMATION
The TPS31xx family has a quiescent current in the 1-μA to 2-μA range. When RESET is active, triggered by the
voltage monitored at VDD, the quiescent current increases to about 20 μA (see the Electrical Characteristics).
In some applications it is necessary to minimize the quiescent current even during the reset period. This is
especially true when the voltage of a battery is supervised and the RESET is used to shut down the system or
for an early warning. In this case the reset condition will last for a longer period of time. The current drawn from
the battery should almost be zero, especially when the battery is discharged.
For this kind of application, either the TPS3103 or TPS3106 is a good fit. To minimize current consumption,
select a version where the threshold voltage is lower than the voltage monitored at VDD. The TPS3106 has two
reset outputs. One output (RSTVDD) is triggered from the voltage monitored at VDD. The other output
(RSTSENSE) is triggered from the voltage monitored at SENSE. In the application shown in Figure 8, the
TPS3106E09 is used to monitor the input voltage of two NiCd or NiMH cells. The threshold voltage (V(TH) = 0.86
V) was chosen as low as possible to ensure that the supply voltage is always higher than the threshold voltage
at VDD. The voltage of the battery is monitored using the SENSE input. The voltage divider was calculated to
assert a reset using the RSTSENSE output at 2 × 0.8 V = 1.6 V.
VTRIP
ǒ Ǔ
R1 + R2
* 1
VIT S
(
)
(1)
where:
VTRIP is the voltage of the battery at which a reset is asserted and
VIT(S) is the threshold voltage at SENSE = 0.551 V.
R1 was chosen for a resistor current in the 1-μA range.
With VTRIP = 1.6 V:
R1 ≡ 1.9 × R2
R1 = 820 kΩ, R2 = 430 kΩ
VDD
R3
TPS3106E09DBV
R1
MR
2 Cell
NiMH
RSTVDD
SENSE
Reset Output
RSTSENSE
GND
R2
Figure 8. Battery Monitoring with 3-μA Supply Current for Device and Resistor Divider
Copyright © 2001–2007, Texas Instruments Incorporated
Submit Documentation Feedback
13
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
WATCHDOG
The TPS3110 device integrates a watchdog timer that must be periodically triggered by a positive or negative
transition of WDI. When the supervising system fails to retrigger the watchdog circuit within the time-out interval,
RESET becomes active for the time period (tD). This event also reinitializes the watchdog timer.
MANUAL RESET (MR)
Many μC-based products require manual-reset capability, allowing an operator or logic circuitry to initiate a reset.
Logic low at MR asserts reset. Reset remains asserted while MR is low and for a time period (tD) after MR
returns high. The input has an internal 100-kΩ pull-up resistor, so it can be left open if it is unused.
Connect a normally open momentary switch from MR to GND to create a manual reset function. External
debounce is not required. If MR is driven from long cables or if the device is used in noisy environments,
connecting a 0.1-μF capacitor from MR to GND provides additional noise immunity.
If there is a possibility of transient or DC conditions causing MR to rise above VDD, a diode should be used to
limit MR to a diode drop above VDD
.
PFI, PFO
The TPS3103 has an integrated power-fail (PFI) comparator with a separate open-drain (PFO) output. The PFI
and PFO can be used for low-battery detection, power-fail warning, or for monitoring a power supply other than
the main supply, and has no effect on RESET.
An additional comparator is provided to monitor voltages other than the nominal supply voltage. The power-fail
input (PFI) will be compared with an internal voltage reference of 0.551 V. If the input voltage falls below the
power-fail threshold (VIT – (S)), the power-fail output (PFO) goes low. If it goes above 0.551 V plus approximately
15-mV hysteresis, the output returns to high. By connecting two external resistors, it is possible to supervise any
voltage above 0.551 V. The sum of both resistors should be approximately 1 MΩ, to minimize power
consumption and to assure that the current into the PFI pin can be neglected, compared with the current through
the resistor network. The tolerance of the external resistors should be not more than 1% to ensure minimal
variation of sensed voltage. If the power-fail comparator is unused, connect PFI to GND and leave PFO
unconnected. For proper operation of the PFI-comparator, the supply voltage (VDD) must be higher than 0.8 V.
SENSE
The voltage at the SENSE input is compared with a reference voltage of 0.551 V. If the voltage at SENSE falls
below the sense-threshold (VIT (S)), reset is asserted. On the TPS3106, a dedicated RSTSENSE output is
−
available. On the TPS3110, the logic signal from SENSE is OR-wired with the logic signal from VDD or MR. An
internal timer delays the return of the output to the inactive state, once the voltage at SENSE goes above 0.551
V plus about 15 mV of hysteresis. For proper operation of the SENSE-comparator, the supply voltage must be
higher than 0.8 V.
14
Submit Documentation Feedback
Copyright © 2001–2007, Texas Instruments Incorporated
TPS3103xxx
TPS3106xxx
TPS3110xxx
www.ti.com
SLVS363E–AUGUST 2001–REVISED SEPTEMBER 2007
2 V
VDD
VDD
(1) (1)
MSP430
Low-Power mC
TPS3103H20
R1
R2
MR
PFI
Px.x
Analog
Circuit
RESET
PFO
RESET
Py.x
GND
GND
-2 V
R2
R1
V(NEG_TH) = 0.551 V -
(VDD - 0.551 V)
(1) Resistor may be integrated in mC.
Figure 9. TPS3103 Monitoring a Negative Voltage
3.3 V
1.5 V
VCORE
VIO
VDD
R1
R2
TPS3110K33
DSP
RESET
R1 + R2
R2
V(CORE_TH) = 0.551 V x
MR
RESET
SENSE
Px.y
WDI
GND
GND
GND
Figure 10. TPS3110 in a DSP-System Monitoring Both Supply Voltages
Copyright © 2001–2007, Texas Instruments Incorporated
Submit Documentation Feedback
15
PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
SN0402002DBVR
TPS3103E12DBVR
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
6
6
TBD
Call TI
Call TI
3000
3000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
TPS3103E12DBVRG4
TPS3103E12DBVT
TPS3103E12DBVTG4
TPS3103E15DBVR
TPS3103E15DBVRG4
TPS3103E15DBVT
TPS3103E15DBVTG4
TPS3103H20DBVR
TPS3103H20DBVRG4
TPS3103H20DBVT
TPS3103H20DBVTG4
TPS3103K33DBVR
TPS3103K33DBVRG4
TPS3103K33DBVT
TPS3103K33DBVTG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2012
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TPS3106E09DBVR
TPS3106E09DBVRG4
TPS3106E09DBVT
TPS3106E09DBVTG4
TPS3106E16DBVR
TPS3106E16DBVRG4
TPS3106E16DBVT
TPS3106E16DBVTG4
TPS3106K33DBVR
TPS3106K33DBVRG4
TPS3106K33DBVT
TPS3106K33DBVTG4
TPS3110E09DBVR
TPS3110E09DBVRG4
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
6
6
6
6
6
6
6
6
6
3000
3000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TPS3110E09DBVT
TPS3110E09DBVTG4
TPS3110E12DBVR
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
6
6
6
TBD
TBD
Call TI
Call TI
Call TI
Call TI
3000
3000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
TPS3110E12DBVRG4
TPS3110E12DBVT
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
6
6
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2012
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TPS3110E12DBVTG4
TPS3110E15DBVR
TPS3110E15DBVRG4
TPS3110E15DBVT
TPS3110E15DBVTG4
TPS3110K33DBVR
TPS3110K33DBVRG4
TPS3110K33DBVT
TPS3110K33DBVTG4
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
6
6
6
6
250
3000
3000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2012
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS3103E12DBVR
TPS3103E12DBVT
TPS3103E15DBVR
TPS3103E15DBVT
TPS3103H20DBVR
TPS3103H20DBVT
TPS3103K33DBVR
TPS3103K33DBVR
TPS3103K33DBVT
TPS3103K33DBVT
TPS3106E09DBVR
TPS3106E09DBVT
TPS3106E16DBVR
TPS3106E16DBVT
TPS3106K33DBVR
TPS3106K33DBVT
TPS3110E09DBVR
TPS3110E12DBVR
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
3000
250
179.0
179.0
179.0
179.0
179.0
179.0
180.0
179.0
180.0
179.0
180.0
180.0
180.0
180.0
178.0
178.0
180.0
180.0
8.4
8.4
8.4
8.4
8.4
8.4
9.0
8.4
9.0
8.4
9.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.17
3.17
3.2
3.2
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.37
1.37
1.4
1.4
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
3000
250
3.2
3.2
3000
250
3.2
3.2
3000
3000
250
3.15
3.2
3.15
3.2
250
3000
250
3.15
3.15
3.15
3.15
3.23
3.23
3.15
3.15
3000
250
3000
250
3000
3000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2012
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS3110E12DBVT
TPS3110E15DBVR
TPS3110E15DBVT
TPS3110K33DBVR
TPS3110K33DBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
250
3000
250
180.0
180.0
180.0
180.0
180.0
9.0
9.0
9.0
9.0
9.0
3.15
3.15
3.15
3.15
3.15
3.2
3.2
3.2
3.2
3.2
1.4
1.4
1.4
1.4
1.4
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
3000
250
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS3103E12DBVR
TPS3103E12DBVT
TPS3103E15DBVR
TPS3103E15DBVT
TPS3103H20DBVR
TPS3103H20DBVT
TPS3103K33DBVR
TPS3103K33DBVR
TPS3103K33DBVT
TPS3103K33DBVT
TPS3106E09DBVR
TPS3106E09DBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
6
6
6
6
6
6
6
3000
250
203.0
203.0
203.0
203.0
203.0
203.0
182.0
203.0
182.0
203.0
182.0
182.0
203.0
203.0
203.0
203.0
203.0
203.0
182.0
203.0
182.0
203.0
182.0
182.0
35.0
35.0
35.0
35.0
35.0
35.0
20.0
35.0
20.0
35.0
20.0
20.0
3000
250
3000
250
3000
3000
250
250
3000
250
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2012
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS3106E16DBVR
TPS3106E16DBVT
TPS3106K33DBVR
TPS3106K33DBVT
TPS3110E09DBVR
TPS3110E12DBVR
TPS3110E12DBVT
TPS3110E15DBVR
TPS3110E15DBVT
TPS3110K33DBVR
TPS3110K33DBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
6
6
6
6
6
6
6
6
6
6
6
3000
250
182.0
182.0
180.0
180.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
180.0
180.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
20.0
20.0
18.0
18.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
3000
250
3000
3000
250
3000
250
3000
250
Pack Materials-Page 3
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Medical
Logic
Security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense www.ti.com/space-avionics-defense
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明