TPS3836-EP [TI]
增强型产品毫微功耗监控电路;
| 型号： | TPS3836-EP |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 增强型产品毫微功耗监控电路 监控 电源管理电路 电源电路 |
| 文件： | 总15页 (文件大小：401K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP
TPS3837E18-EP / J25-EP / L30-EP / K33-EP
TPS3838E18-EP / J25-EP / L30-EP / K33-EP
www.ti.com.................................................................................................................................................... SGLS322D–MAY 2006–REVISED NOVEMBER 2008
NANOPOWER SUPERVISORY CIRCUITS
1
FEATURES
TPS3836, TPS3838
DBV PACKAGE
(TOP VIEW)
•
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
1
2
3
5
4
VDD
CT
•
•
Supply Current of 220 nA (Typ)
Precision Supply Voltage Supervision Range:
1.8 V, 2.5 V, 3 V, 3.3 V
GND
RESET
MR
•
•
Power-On Reset Generator With Selectable
Delay Time of 10 ms or 200 ms
Push/Pull RESET Output (TPS3836), RESET
Output (TPS3837), or
Open-Drain RESET Output (TPS3838)
TPS3837
DBV PACKAGE
(TOP VIEW)
•
•
Manual Reset
1
2
3
VDD
5
CT
5-Pin SOT-23 Package
GND
SUPPORTS DEFENSE, AEROSPACE,
AND MEDICAL APPLICATIONS
4
RESET
MR
•
•
•
•
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Available in Military (–55°C/125°C)
Temperature Range(1)
•
•
•
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
APPLICATIONS
•
Applications Using Automotive Low-Power
DSPs, Microcontrollers, or Microprocessors
•
•
•
•
Battery-Powered Equipment
Intelligent Instruments
Wireless Communication Systems
Automotive Systems
(1) Custom temperature ranges available
DESCRIPTION
The TPS3836, TPS3837, TPS3838 families of supervisory circuits provide circuit initialization and timing
supervision, primarily for digital signal processing (DSP) and processor-based systems.
During power on, RESET is asserted when the supply voltage VDD becomes higher than 1.1 V. Thereafter, the
supervisory circuit monitors VDD and keeps RESET output active as long as VDD remains below the threshold
voltage (VIT). An internal timer delays the return of the output to the inactive state (high) to ensure proper system
reset. The delay time starts after VDD has risen above VIT.
When CT is connected to GND, a fixed delay time of typical 10 ms is asserted. When connected to VDD, the
delay time is typically 200 ms.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006–2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP
TPS3837E18-EP / J25-EP / L30-EP / K33-EP
TPS3838E18-EP / J25-EP / L30-EP / K33-EP
SGLS322D–MAY 2006–REVISED NOVEMBER 2008.................................................................................................................................................... www.ti.com
When the supply voltage drops below VIT, the output becomes active (low) again.
All the devices of this family have a fixed-sense VIT set by an internal voltage divider.
The TPS3836 has an active-low push-pull RESET output. The TPS3837 has active-high push-pull RESET, and
the TPS3838 integrates an active-low open-drain RESET output.
TPS3836K33
MSP430
V
DD
V
CC
CT
Xin
Lithium
Battery
3.6 V
RST
RESET
MR
Xout
Quartz
32 kHz
T
V
SS
GND
Figure 1. Typical Operating Circuit
The product spectrum is designed for supply voltages of 1.8 V, 2.5 V, 3 V, and 3.3 V. The circuits are available in
a 5-pin SOT-23 package. The TPS3836, TPS3837, and TPS3838 families are characterized for operation over a
temperature range of –55°C to 125°C.
2
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Copyright © 2006–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP TPS3837E18-EP / J25-EP / L30-EP /
K33-EP TPS3838E18-EP / J25-EP / L30-EP / K33-EP
TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP
TPS3837E18-EP / J25-EP / L30-EP / K33-EP
TPS3838E18-EP / J25-EP / L30-EP / K33-EP
www.ti.com.................................................................................................................................................... SGLS322D–MAY 2006–REVISED NOVEMBER 2008
ORDERING INFORMATION
ORDERABLE PART
TA
THRESHOLD VOLTAGE
SYMBOL
NUMBER(1)
TPS3836J25MDBVTEP
TPS3836L30MDBVREP
TPS3837K33MDBVREP
2.25 V
2.64 V
2.93 V
PKRM
BTX
–55°C to 125°C
PKZM
(1) DBVR indicates reel of 3000 parts, DBVT indicates tape of 250 parts.
ORDERING INFORMATION
TPS383 6 E 18 M DBV R/T EP
EP Designator
Reel/Tape
Package
M-Temperature Designator
Nominal Supply Voltage
Typical Reset Threshold Voltage
Functionality
Family
FUNCTION TABLE
(1)
MR
L
VDD > VIT
RESET
RESET(2)
0
1
0
1
L
L
H
H
H
L
L
H
L
H
H
(1) TPS3836 and TPS3838
(2) TPS3837
Copyright © 2006–2008, Texas Instruments Incorporated
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3
Product Folder Link(s): TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP TPS3837E18-EP / J25-EP / L30-EP /
K33-EP TPS3838E18-EP / J25-EP / L30-EP / K33-EP
TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP
TPS3837E18-EP / J25-EP / L30-EP / K33-EP
TPS3838E18-EP / J25-EP / L30-EP / K33-EP
SGLS322D–MAY 2006–REVISED NOVEMBER 2008.................................................................................................................................................... www.ti.com
FUNCTIONAL BLOCK DIAGRAM
V
DD
R3
C
T
MR
C1
C2
RESET (TPS3837-Push-Pull)
R1
Reset Logic
and Timer
+
−
RESET (TPS3836-Push-Pull
TPS3838-Open-Drain)
S1
R2
S2
S3
Band-Gap
Reference
C3
Refresh
Timer
GND
4
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Copyright © 2006–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP TPS3837E18-EP / J25-EP / L30-EP /
K33-EP TPS3838E18-EP / J25-EP / L30-EP / K33-EP
TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP
TPS3837E18-EP / J25-EP / L30-EP / K33-EP
TPS3838E18-EP / J25-EP / L30-EP / K33-EP
www.ti.com.................................................................................................................................................... SGLS322D–MAY 2006–REVISED NOVEMBER 2008
TIMING DIAGRAM
A
B
C
D
E
F
G
V
DD
V
IT
< 1.1 V
MR
t
t
RESET
t
t
d
t
d
t
d
Undefined
Output
Undefined
Output
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
VDD
Supply voltage(2)
7 V
All other pins(2)
–0.3 V to 7 V
5 mA
IOL
IOH
IIK
Maximum low output current
Maximum high output current
Input clamp current (VI < 0 or VI > VDD
–5 mA
)
±10 mA
IOK
TA
Output clamp current (VO < 0 or VO > VDD
Operating free-air temperature range
Storage temperature range
)
±10 mA
–55°C to 125°C
–65°C to 150°C
150°C
Tstg
TJ
Maximum junction temperature
Soldering temperature
260°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND. For reliable operation, the device must not be continuously operated at 7 V for more than
t = 1000 h.
Copyright © 2006–2008, Texas Instruments Incorporated
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5
Product Folder Link(s): TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP TPS3837E18-EP / J25-EP / L30-EP /
K33-EP TPS3838E18-EP / J25-EP / L30-EP / K33-EP
TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP
TPS3837E18-EP / J25-EP / L30-EP / K33-EP
TPS3838E18-EP / J25-EP / L30-EP / K33-EP
SGLS322D–MAY 2006–REVISED NOVEMBER 2008.................................................................................................................................................... www.ti.com
Thermal Resistance Table
RESISTANCE
θJC (°C/W)
HIGH
130.9
205.6
LOW
148.1
347
θJA (°C/W)
Recommended Operating Conditions
MIN
1.6
MAX
6
UNIT
V
VDD
VI
Supply voltage
Input voltage
0
VDD + 0.3
V
VIH
VIL
High-level input voltage
Low-level input voltage
0.7 × VDD
V
0.3 × VDD
100
V
Δt/Δv
TA
Input transition rise and fall rate at MR
Operating free-air temperature
ns/V
°C
–55
125
Electrical Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
VDD = 3.3 V, IOH = –2 mA
VDD = 6 V, IOH = –3 mA
VDD = 2 V, IOH = –1 mA
VDD = 3.3 V, IOH = –2 mA
VDD = 2 V, IOL = 1 mA
VDD = 3.3 V, IOL = 2 mA
VDD = 3.3 V, IOL = 2 mA
VDD = 6 V, IOL = 3 mA
RESET
(TPS3836)
High-level output
voltage
VOH
0.8 × VDD
V
RESET
(TPS3837)
RESET
(TPS3836/8)
Low-level output
voltage
VOL
0.4
0.2
V
V
RESET
(TPS3837)
TPS3836/8
TPS3837
VDD ≥ 1.1 V, IOL = 50 µA
Power-up reset
voltage(1)
TA = 25°C
0.8 × VDD
0.6 × VDD
1.64
VDD ≥ 1.1 V, IOH = –50 µA
TA = Full range
TPS383xE18
TPS383xJ25
TPS383xH30
TPS383xL30
1.71
2.25
2.79
2.64
2.93
2.93
30
1.73
2.31
2.85
2.71
3.1
2.16
Negative-going
input threshold
voltage(2)
2.7
VIT
V
2.54
TA = 25°C
2.82
TPS383xK33
TA = Full range
1.7 V < VIT < 2.5 V
2.5 V < VIT < 3.5 V
3.5 V < VIT < 5 V
2.72
3.2
Vhys Hysteresis at VDD input
40
mV
50
TA = 25°C
–30
–20
–60
–60
–90
–120
25
(3)
(3)
MR
MR = 0.7 × VDD, VDD = 6 V
CT = VDD = 6 V
µA
nA
µA
High-level input
current
IIH
TA = Full range
CT
MR
CT
–25
TA = 25°C
–130
–90
–200
–200
–340
–350
25
MR = 0 V, VDD = 6 V
Low-level input
current
IIL
TA = Full range
CT = 0 V, VDD = 6 V
–25
nA
nA
High-level output
current
IOH
TPS3838
VDD = VIT + 0.2 V, VOH = VDD
25
(1) The lowest voltage at which RESET output becomes active, tr, VDD ≥ 15 µs/V
(2) To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 µF) should be placed near the supply terminal.
(3) If manual reset is unused, MR should be connected to VDD to minimize current consumption.
6
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Copyright © 2006–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP TPS3837E18-EP / J25-EP / L30-EP /
K33-EP TPS3838E18-EP / J25-EP / L30-EP / K33-EP
TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP
TPS3837E18-EP / J25-EP / L30-EP / K33-EP
TPS3838E18-EP / J25-EP / L30-EP / K33-EP
www.ti.com.................................................................................................................................................... SGLS322D–MAY 2006–REVISED NOVEMBER 2008
Electrical Characteristics (continued)
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA = 25°C
MIN
TYP
MAX UNIT
220
500
VDD > VIT, VDD < 3 V
VDD > VIT, VDD > 3 V
VDD < VIT
TA = Full range
TA = 25°C
600
nA
250
10
550
IDD
Supply current
TA = Full range
TA = 25°C
650
25
µA
30
TA = Full range
Internal pullup resistor at MR
Input capacitance at MR, CT
33
5
kΩ
CI
VI = 0 V to VDD
pF
Timing Requirements
RL = 1 MΩ, CL = 50 pF, TA = 25°C
PARAMETER
TEST CONDITIONS
TYP UNIT
At VDD
VIH = VIT + 0.2 V, VIL = VIT – 0.2 V
6
1
µs
µs
tw
Pulse width
At MR
VDD ≥ VIT + 0.2 V, VIL = 0.3 × VDD, VIH = 0.7 × VDD
Switching Characteristics
RL = 1 MΩ, CL = 50 pF, TA = 25°C
PARAMETER
TEST CONDITIONS
MIN
TYP MAX UNIT
CT = GND
CT = VDD
5
10
200
10
15
V
DD ≥ VIT + 0.2 V, MR = 0.7 × VDD
,
td
Delay time
ms
See timing diagram
Propagation (delay)
VDD to RESET delay VIL = VIT – 0.2 V, VIH = VIT + 0.2 V
tPHL time, high- to low-level (TPS3836,
µs
VIL = 1.6 V
50
10
50
output
TPS3838)
Propagation (delay)
tPLH time, low- to high-level
output
VIL = VIT – 0.2 V, VIH = VIT + 0.2 V
VIL = 1.6 V
VDD to RESET delay
(TPS3837)
µs
µs
µs
Propagation (delay)
MR to RESET delay
tPHL time, high- to low-level (TPS3836,
V
DD ≥ VIT + 0.2 V, VIL = 0.3 × VDD, VIH = 0.7 × VDD
DD ≥ VIT + 0.2 V, VIL = 0.3 × VDD, VIH = 0.7 × VDD
0.3
0.3
output
TPS3838)
Propagation (delay)
tPLH time, low- to high-level
output
MR to RESET delay
(TPS3837)
V
Copyright © 2006–2008, Texas Instruments Incorporated
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Product Folder Link(s): TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP TPS3837E18-EP / J25-EP / L30-EP /
K33-EP TPS3838E18-EP / J25-EP / L30-EP / K33-EP
TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP
TPS3837E18-EP / J25-EP / L30-EP / K33-EP
TPS3838E18-EP / J25-EP / L30-EP / K33-EP
SGLS322D–MAY 2006–REVISED NOVEMBER 2008.................................................................................................................................................... www.ti.com
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
IDD
Supply current
vs Supply voltage
2
3
4
5
6
7
IMR
VOL
VOH
Manual reset current
vs Manual reset voltage
vs Low-level output current
vs High-level output current
vs Free-air temperature
vs VDD threshold overdrive
Low-level output voltage
High-level output voltage
Normalized reset threshold voltage
Minimum pulse duration at VDD
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
MANUAL RESET CURRENT
vs
MANUAL RESET VOLTAGE
100
10
8
V
= 6 V
DD
MR = Open
CT = GND
CT = GND
T
= 85°C
= 25°C
A
0
−100
−200
−300
−400
−500
T
A
= −40°C
T
= 0°C
T
A
A
6
T
= 0°C
A
T
A
= 25°C
4
T
A
= 85°C
T
A
= −40°C
2
0
−2
0
2
4
6
0
2
4
6
V
MR
− Manual Reset Voltage − V
V
DD
− Supply Voltage − V
Figure 2.
Figure 3.
8
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Copyright © 2006–2008, Texas Instruments Incorporated
Product Folder Link(s): TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP TPS3837E18-EP / J25-EP / L30-EP /
K33-EP TPS3838E18-EP / J25-EP / L30-EP / K33-EP
TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP
TPS3837E18-EP / J25-EP / L30-EP / K33-EP
TPS3838E18-EP / J25-EP / L30-EP / K33-EP
www.ti.com.................................................................................................................................................... SGLS322D–MAY 2006–REVISED NOVEMBER 2008
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
2.0
1.5
1.0
0.5
0.0
2.0
1.5
1.0
0.5
0.0
V
= 2 V
DD
V
= 2 V
DD
MR = Open
CT = GND
MR = Open
CT = GND
T
= 85°C
A
T
= 25°C
A
T
= 25°C
A
T = 0°C
A
T
A
= 85°C
T
= 0°C
A
T
= −40°C
A
T
A
= −40°C
0
1
2
3
4
5
6
7
0
1
2
3
4
5
I
− Low-Level Output Current − mA
I
− High-Level Output Current − mA
OL
OH
Figure 4.
Figure 5.
NORMALIZED RESET THRESHOLD VOLTAGE
MINIMUM PULSE DURATION AT VDD
vs
vs
FREE-AIR TEMPERATURE
VDD THRESHOLD OVERDRIVE
1.001
1
22
20
18
16
14
12
10
8
MR = Open
CT = GND
T
= 25°C
A
0.999
0.998
0.997
CT = GND
MR = Open
6
4
0.996
0.995
2
0
−40
−15
10
35
60
85
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
T
A
− Free-Air Temperature − °C
V
DD
− Threshold Overdrive − V
Figure 6.
Figure 7.
Copyright © 2006–2008, Texas Instruments Incorporated
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Product Folder Link(s): TPS3836E18-EP / J25-EP / H30-EP / L30-EP / K33-EP TPS3837E18-EP / J25-EP / L30-EP /
K33-EP TPS3838E18-EP / J25-EP / L30-EP / K33-EP
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2008
PACKAGING INFORMATION
Orderable Device
2T36L30MDBVREPG4
TPS3836J25MDBVTEP
TPS3836L30MDBVREP
TPS3837K33MDBVREP
TPS3837K33QDBVREP
V62/06637-09XE
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
5
5
5
5
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
V62/06637-15XE
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
V62/06637-17XE
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
V62/06637-22XE
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS3836J25-EP, TPS3836L30-EP, TPS3837K33-EP :
Catalog: TPS3836J25, TPS3836L30, TPS3837K33
•
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2008
Automotive: TPS3836J25-Q1, TPS3836L30-Q1, TPS3837K33-Q1
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Dec-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TPS3836J25MDBVTEP SOT-23
TPS3836L30MDBVREP SOT-23
TPS3837K33MDBVREP SOT-23
TPS3837K33QDBVREP SOT-23
DBV
DBV
DBV
DBV
5
5
5
5
250
180.0
180.0
180.0
180.0
9.0
9.0
9.0
9.0
3.15
3.15
3.15
3.15
3.2
3.2
3.2
3.2
1.4
1.4
1.4
1.4
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
3000
3000
3000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Dec-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS3836J25MDBVTEP
TPS3836L30MDBVREP
TPS3837K33MDBVREP
TPS3837K33QDBVREP
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
5
5
5
5
250
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
20.0
20.0
20.0
20.0
3000
3000
3000
Pack Materials-Page 2
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